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WO2025094057A1 - Dispositif à semi-conducteur en couches comprenant un revêtement de formation de motifs mince et matériau de formation de motifs pour former le revêtement de formation de motifs - Google Patents

Dispositif à semi-conducteur en couches comprenant un revêtement de formation de motifs mince et matériau de formation de motifs pour former le revêtement de formation de motifs Download PDF

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Publication number
WO2025094057A1
WO2025094057A1 PCT/IB2024/060664 IB2024060664W WO2025094057A1 WO 2025094057 A1 WO2025094057 A1 WO 2025094057A1 IB 2024060664 W IB2024060664 W IB 2024060664W WO 2025094057 A1 WO2025094057 A1 WO 2025094057A1
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WIPO (PCT)
Prior art keywords
patterning
limiting examples
coating
deposited
limitation
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PCT/IB2024/060664
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English (en)
Inventor
Michael HELANDER
Zhibin Wang
Yi-Lu CHANG
Qi Wang
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OTI Lumionics Inc
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OTI Lumionics Inc
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Publication of WO2025094057A1 publication Critical patent/WO2025094057A1/fr
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present disclosure relates to layered semiconductor devices, and in some nonlimiting examples, to a patterning coating in a layered opto-electronic device having a plurality of sub-pixel emissive regions, each sub-pixel comprising first and second electrodes separated by a semiconductor layer, in which at least one of the electrodes, at least one particle structure, and a conductive coating electrically coupled thereto, may be formed by at least one conductive deposited material, patterned by depositing such a patterning coating that may at least one of act as, and be, a nucleation inhibiting coating.
  • At least one semiconducting layer comprising an emissive layer may be disposed between a pair of electrodes, such as an anode and a cathode.
  • the anode and cathode may be electrically coupled with a power source and respectively generate holes and electrons that migrate toward each other through the at least one semiconducting layer.
  • EM radiation in the form of a photon, may be emitted by the emissive layer.
  • OLED display panels such as an active-matrix OLED (AMOLED) panel, may comprise a plurality of pixels, each pixel further comprising a plurality of (including without limitation, one of three, and four) sub-pixels.
  • the various sub-pixels of a pixel may be characterized by one of three, and four, different colors, including without limitation, R(ed), G(reen), and B(lue).
  • Each (sub-) pixel may have an associated emissive region, comprising a stack of an associated pair of electrodes and at least one semiconducting layer between them.
  • each sub-pixel of a pixel may emit EM radiation, including without limitation, photons, that have an associated wavelength spectrum characterized by a given color, including without limitation, one of, R(ed), G(reen), B(lue), and W(hite).
  • the (sub-) pixels may be selectively driven by a driving circuit comprising at least one thin-film transistor (TFT) structure electrically coupled with conductive metal lines, in some nonlimiting examples, within a substrate upon which the electrodes and the at least one semiconducting layer are deposited.
  • TFT thin-film transistor
  • Various coatings (layers) of such panels may, in some non-limiting examples, be formed by vacuum-based deposition processes.
  • EM radiation may be emitted by a sub-pixel when a voltage is applied across an anode and a cathode of the sub-pixel.
  • the voltage applied across the anode and the cathode it may be possible to control the emission of EM radiation from each sub-pixel of such panel.
  • the voltage across the anode and the cathode in each sub-pixel may be controlled by modulating the voltage of the anode.
  • the adjacent anodes may be spaced apart in a lateral aspect, and at least one non-emissive region may be provided therebetween.
  • a deposited layer whether as at least one of a: closed conductive coating, and thin disperse layer of at least one particle structure(s), in a pattern for each (sub-) pixel of the panel across at least one of a: cross-sectional, and lateral, aspect thereof, by selective deposition of a conductive deposited material to form a device feature, such as, without limitation, at least one of: an electrode, a conductive element electrically coupled therewith, and an EM-radiation absorbing layer, during the OLED manufacturing process.
  • a device feature such as, without limitation, at least one of: an electrode, a conductive element electrically coupled therewith, and an EM-radiation absorbing layer, during the OLED manufacturing process.
  • One method for doing so involves the interposition of a fine metal mask (FMM) during deposition of the conductive deposited material.
  • FMM fine metal mask
  • such material may have substantially high evaporation temperatures, which may impact at least one of: the ability to re-use the FMM, and the accuracy of the pattern that may be achieved, with attendant increases in cost, effort, and complexity.
  • One method for doing so involves depositing the conductive deposited material and thereafter removing, including by a laser drilling process, unwanted regions thereof to form the pattern. However, the removal process often involves the creation / presence of debris, which may affect the yield of the manufacturing process. [0009] In some non-limiting examples, such methods may have reduced applicability in certain applications. In some non-limiting examples, such methods may have reduced applicability with devices having certain topographical features.
  • FIG. 1 is a simplified block diagram from a longitudinal aspect, of an example device having a plurality of layers in a lateral aspect, formed by selective deposition of a patterning coating in a first portion of the lateral aspect, followed by deposition of a closed coating of deposited material in a second portion thereof, according to an example in the present disclosure;
  • FIG. 2 is a simplified diagram, from a longitudinal aspect, of an example version of the device of FIG. 1, in which the closed coating of deposited material in the second portion forms a second electrode of an opto-electronic device, according to an example in the present disclosure;
  • FIG. 3 is a schematic diagram illustrating an example cross-sectional view of an example display panel having a plurality of layers, comprising at least one aperture therewithin, through which at least one electromagnetic signal may be exchanged according to an example in the present disclosure
  • FIG. 4 is a schematic diagram showing an example process for depositing a patterning coating in a pattern on an exposed layer surface of an underlying layer in an example version of the device of FIG. 1, according to an example in the present disclosure
  • FIG. 5 is a schematic diagram showing an example process for depositing a deposited material in the second portion on an exposed layer surface that comprises the deposited pattern of the patterning coating of FIG. 4, where the patterning coating is a nucleation-inhibiting coating (NIC);
  • FIG. 6A is a schematic diagram illustrating an example version of the device of FIG. 1 in a cross-sectional view;
  • FIG. 6B is a schematic diagram illustrating the device of FIG. 6A in a complementary plan view
  • FIGs. 7A-7B are schematic diagrams that show various potential behaviours of a patterning coating at a deposition interface with a deposited layer in an example version of the device of FIG. 1 according to various examples in the present disclosure
  • FIGs. 8A-8H are simplified block diagrams from a cross-sectional aspect, of example versions of the device of FIG. 1, showing various examples of possible interactions between the particle structure patterning coating and the particle structures according to examples in the present disclosure;
  • FIG. 9 is a schematic diagram illustrating an example cross-sectional view of an example version of the device of FIG. 2 with additional example deposition steps according to an example in the present disclosure
  • FIG. 10 is a schematic diagram that may show example stages of an example process for manufacturing an example version of an OLED device having sub-pixel regions having a second electrode of different thickness according to an example in the present disclosure
  • FIG. 11 is a schematic diagram illustrating an example cross-sectional view of an example version of an OLED device in which a second electrode is coupled with an auxiliary electrode according to an example in the present disclosure
  • FIG. 12 is a schematic diagram illustrating an example cross-sectional view of an example version of an OLED device having a partition and a sheltered region, such as a recess, in a non-emissive region thereof according to an example in the present disclosure
  • FIGs. 13A-13B are schematic diagrams that show example cross-sectional views of an example OLED device having a partition and a sheltered region, such as an aperture, in a non-emissive region, according to various examples in the present disclosure
  • FIG. 14 is an example energy profile illustrating energy states of an adatom absorbed onto a surface according to an example in the present disclosure
  • FIG. 15 is a schematic diagram illustrating the formation of a film nucleus according to an example in the present disclosure.
  • FIG. 16 is a block diagram of an example computer device within a computing and communications environment that may be used for implementing devices and methods in accordance with representative examples of the present disclosure.
  • a reference numeral having at least one of: at least one numeric value (including without limitation, in at least one of: superscript, and subscript), and at least one alphabetic character (including without limitation, in lower-case) appended thereto may be considered to refer to at least one of: a particular instance, and subset thereof, of the feature (element) described by the reference numeral.
  • Reference to the reference numeral without reference to the at least one of: the appended value(s), and the character(s), may, as the context dictates, refer generally to the feature(s) described by at least one of: the reference numeral, and the set of all instances described thereby.
  • a reference numeral may have the letter “x” in the place of a numeric digit.
  • Reference to such reference numeral may, as the context dictates, refer generally to feature(s) described by the reference numeral, where the character “x” is replaced by at least one of: a numeric digit, and the set of all instances described thereby.
  • the present disclosure discloses a patterning material and a layered semiconductor device comprising a patterning coating comprising the patterning material and a deposited layer.
  • the patterning coating may be disposed on an exposed layer surface of an underlying layer in a first portion of a lateral aspect of the layered semiconductor device.
  • the patterning material may have a bulk melting point, and may be used, in a layer having a film melting point that is greater than the bulk melting point, as the patterning coating.
  • the patterning coating may be adapted to impact a propensity of an evaporated flux of a deposited material to be deposited thereon, such that the deposited layer comprising the deposited material may be deposited in a second portion of the lateral aspect, while an exposed layer surface of the patterning coating may be substantially devoid of a closed coating of the deposited material.
  • a layered semiconductor device comprising a plurality of layers deposited on a substrate and extending in a lateral aspect defined by a lateral axis thereof, comprising: a patterning coating adapted to impact a propensity of an evaporated flux of a deposited material to be deposited thereon, and disposed on an exposed layer surface of an underlying layer of the device, in a first portion of the lateral aspect, the patterning coating comprising a patterning material having a bulk melting point; and a deposited layer disposed in a second portion of the lateral aspect, the deposited layer comprising the deposited material; wherein: an exposed layer surface of the patterning coating is substantially devoid of a closed coating of the deposited material, and the patterning coating has a film melting point that is greater than the bulk melting point.
  • a thickness of the patterning coating may be no more than a threshold thickness, above which the film melting point of the patterning coating may be substantially the same as the bulking melting point of the patterning material.
  • the thickness of the patterning coating may be an average layer thickness thereof.
  • the threshold thickness of the patterning coating may be one of at least about: 5, 6, 7, 8, 9, and 10, monolayers.
  • the thickness of the patterning coating may be one of between about: 1-5, 1-4, 1-3, and 1-2, monolayers.
  • the thickness of the patterning coating may be one of between about: 2-8, 2-7, 2-6, 3-6, and 3-5, nm.
  • a difference between the film melting point and the bulk melting point may be one of at least about: 5°C, 8°C, 10°C, 12°C, 15°C, 18°C, 20°C, 25°C, and 30°C.
  • the film melting point of the patterning coating may be one of at least about: 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 120°C, and 130°C.
  • the bulk melting point of the patterning material may be one of no more than about: 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, and 70°C.
  • the patterning material may comprise a polymeric material.
  • the patterning material may comprise an oligomeric material.
  • a molecule of the patterning material may have a molecular size of one of at least about: 4, 5, 6, 8, 10, 12, 15, and 18, angstroms.
  • a majority of molecules of the patterning material in the patterning coating may align in an ordered orientation.
  • a molecule of the patterning material may comprise a first moiety and a second moiety, and the majority of molecules of the patterning material may be oriented such that one of the first, and second, moieties, may be oriented toward an exposed layer surface of the patterning coating.
  • the first moiety of the molecule may have a critical surface tension that is at least that of a critical surface tension of the second moiety thereof and coupled thereto, such that the first moiety may comprise a high(er) critical surface tension component and the second moiety may comprise a low(er) critical surface tension component.
  • a majority of the second moi eties of the patterning material may be oriented toward an exposed layer surface of the patterning coating, such that the exposed layer surface of the patterning coating may present a low(er) surface energy surface to the deposited material.
  • the underlying layer may be an orientation layer that comprises an orientation material.
  • the orientation material may have a substantially high characteristic surface energy, and a majority of the first moi eties of the patterning material may be oriented toward an exposed layer surface of the orientation layer.
  • At least one of the orientation layer, and the orientation material may have a surface energy of one of at least about: 30, 35, 50, 60, 70, 80, 100, 200, and 500, dynes/cm.
  • the orientation material may comprise at least one of a metal, a metallic material, a non-metallic material, a semiconducting material, an insulating material, an organic material, and an inorganic material.
  • the device may further comprise an emissive region comprising: a first electrode, a second electrode, and at least one semiconducting layer disposed between the first electrode and the second electrode; wherein the first electrode is disposed between the substrate and the at least one semiconducting layer.
  • the first portion may exclude a lateral aspect of the emissive region.
  • the first portion may comprise a transmissive region configured to allow light to pass therethrough.
  • the second electrode may comprise at least a part of the deposited layer as a layer thereof.
  • the first portion may include a lateral aspect of the emissive region.
  • the device may further comprise an auxiliary electrode comprising the deposited layer as a layer thereof.
  • the device may further comprise at least one island comprising the deposited material disposed on the exposed layer surface of the patterning coating in the first portion of the lateral aspect.
  • a patterning material having a bulk melting point for use, in a layer having a film melting point that may be greater than the bulk melting point, as a patterning coating adapted to impact a propensity of an evaporated flux of a deposited material to be deposited thereon, the patterning coating for disposition on an exposed layer surface of an underlying layer in a first portion of a lateral aspect of a layered semiconductor device, such that a deposited layer comprising the deposited material may be deposited in a second portion of the lateral aspect, while an exposed layer surface of the patterning coating may be substantially devoid of a closed coating of the deposited material.
  • a thickness of the patterning coating may be no more than a threshold thickness, above which the film melting point of the patterning coating may be substantially the same as the bulking melting point of the patterning material.
  • the thickness of the patterning coating may be an average layer thickness thereof.
  • the threshold thickness of the patterning coating may be one of at least about: 5, 6, 7, 8, 9, and 10, monolayers.
  • the thickness of the patterning coating may be one of between about: 1-5, 1-4, 1-3, and 1-2, monolayers.
  • the thickness of the patterning coating may be one of between about: 2-8, 2-7, 2-6, 3-6, and 3-5, nm.
  • a difference between the film melting point and the bulk melting point may be one of at least about: 5°C, 8°C, 10°C, 12°C, 15°C, 18°C, 20°C, 25°C, and 30°C.
  • the film melting point of the patterning coating may be one of at least about: 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 120°C, and 130°C.
  • the bulk melting point of the patterning material may be one of no more than about: 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, and 70°C.
  • the patterning material may comprise a polymeric material.
  • the patterning material may comprise an oligomeric material.
  • a molecule of the patterning material may have a molecular size of one of at least about: 4, 5, 6, 8, 10, 12, 15, and 18, angstroms.
  • the patterning material may comprise a phosphazene group.
  • the patterning material may comprise a cyclophosphazene group.
  • the patterning material may comprise at least one of a: F-containing, and Si-containing, group.
  • the patterning material may comprise a siloxane group.
  • a majority of molecules of the patterning material in the patterning coating may align in an ordered orientation.
  • a molecule of the patterning material may comprise a first moiety and a second moiety, and the majority of molecules of the patterning material may be oriented such that one of the first, and second, moieties, may be oriented toward an exposed layer surface of the patterning coating.
  • the first moiety of the molecule may have a critical surface tension that is at least that of a critical surface tension of the second moiety thereof and coupled thereto, such that the first moiety comprises a high(er) critical surface tension component and the second moiety may comprise a low(er) critical surface tension component.
  • a majority of the second moi eties of the patterning material may be oriented toward an exposed layer surface of the patterning coating, such that the exposed layer surface of the patterning coating may present a low(er) surface energy surface to the deposited material.
  • At least one island comprising the deposited material may be disposed on the exposed layer surface of the patterning coating in the first portion of the lateral aspect.
  • the present disclosure relates generally to layered semiconductor devices 100, and more specifically, to opto-electronic devices 200.
  • An opto-electronic device 200 may generally encompass any device 100 that converts electrical signals into EM radiation in the form of photons and vice versa.
  • an opto-electronic device 200 may comprise an organic light-emitting diode (OLED).
  • OLED organic light-emitting diode
  • FIG. 1 there may be shown a cross-sectional view of an example layered semiconductor device 100.
  • the device 100 may comprise a plurality of layers deposited upon a substrate 10.
  • a first lateral axis may be shown, together with a longitudinal axis, identified as the Z-axis.
  • a second lateral axis, identified as the Y-axis may be shown as being substantially transverse to both the X-axis and the Z-axis. At least one of the lateral axes may define a lateral aspect of the device 100.
  • the longitudinal axis may define a longitudinal aspect of the device 100.
  • the layers of the device 100 may extend, in the lateral aspect, substantially parallel to a plane defined by the lateral axes.
  • the substantially planar representation shown in FIG. 1 may be, in some non-limiting examples, an abstraction for purposes of illustration.
  • the device 100 may be shown in its longitudinal aspect as a substantially stratified structure of substantially parallel planar layers, such device 100 may illustrate locally, a diverse topography to define features, each of which may substantially exhibit the stratified profile discussed in the longitudinal aspect.
  • a lateral aspect of an exposed layer surface 11 of the device 100 may comprise a first portion 101 and a second portion 102.
  • the second portion 102 may comprise that part of the exposed layer surface 11 of the device 100 that lies beyond the first portion 101.
  • the layers of the device 100 may comprise a substrate 10, and a patterning coating 110 disposed on an exposed layer surface 11 of at least a portion of the lateral aspect thereof.
  • the patterning coating 110 may be limited in its lateral extent to the first portion 101 and a deposited layer 130 may be disposed as a closed coating 140 on an exposed layer surface 11 of the device 100 in a second portion 102 of its lateral aspect.
  • At least one particle structure 150 may be disposed as a discontinuous layer 160 on the exposed layer surface 11 of the patterning coating 110.
  • at least one of: the patterning coating 110, the deposited layer 130, and at least one particle structure 150 may be deposited on a layer (underlying layer 710 (FIG. 7 A)) other than the substrate 10 including without limitation, an intervening layer between the substrate 10 and at least one of: the patterning coating 110, deposited layer 130, and the at least one particle structure 150.
  • the underlying layer 710 may comprise at least one of: an orientation layer, and an organic supporting layer.
  • At least one of: the patterning coating 110, the deposited layer 130, and the at least one particle structure 150 may be covered by at least one overlying layer 170.
  • such overlying layer 170 may comprise at least one of: an encapsulation layer, including without limitation, at least one of: a glass cap, a barrier film, a barrier adhesive, a barrier coating, an encapsulation layer, and a thin film encapsulation (TFE) layer, provided to encapsulate the device 100, and an optical coating, including without limitation, at least one of: an optical, and structural, coating, and at least one component thereof, including without limitation, a polarizer, a color filter, an antireflection coating, an anti-glare coating, cover glass, and an optically clear adhesive (OCA).
  • an encapsulation layer including without limitation, at least one of: a glass cap, a barrier film, a barrier adhesive, a barrier coating, an encapsulation layer, and a thin film encapsulation (TFE) layer, provided to encapsulate the device 100
  • an optical coating including without limitation, at least one of: an optical, and structural, coating, and at least one component thereof, including without limitation,
  • At least one of a: substantially thin patterning coating 110 in the first portion 101, and deposited layer 130 in the second portion 102 may provide a substantially planar surface on which the overlying layer 170 may be deposited.
  • providing such a substantially planar surface for application of such overlying layer 170 may increase adhesion thereof to such surface.
  • the optical coating may be used to modulate optical properties of EM radiation being at least one of: transmitted, emitted, and absorbed, by the device 100, including without limitation, plasmon modes.
  • the optical coating may be used as at least one of: an optical filter, index-matching coating, optical outcoupling coating, scattering layer, diffraction grating, and parts thereof.
  • the optical coating may be used to modulate at least one optical microcavity effect in the device 100 by, without limitation, tuning at least one of the: total optical path length, and refractive index thereof. At least one optical property of the device 100 may be affected by modulating at least one optical microcavity effect including without limitation, the output EM radiation, including without limitation, at least one of: an angular dependence of an intensity thereof, and a wavelength shift thereof.
  • the optical coating may be a non-electrical component, that is, the optical coating may not be configured to at least one of: conduct, and transmit, electrical current during normal device operations.
  • the optical coating may be formed of any deposited material 531, and in some non-limiting examples, may employ any mechanism of depositing a deposited layer 130 as described herein.
  • FIG. 2 is a simplified block diagram from a longitudinal aspect, of an example opto-electronic device 200, which may be, in some non-limiting examples, an electroluminescent device 200, according to the present disclosure.
  • the device 200 may be an OLED.
  • the device 200 may comprise a substrate 10, upon which a frontplane 201, comprising a plurality of layers, respectively, a first electrode 220, at least one semiconducting layer 230, and a second electrode 240, may be disposed.
  • the frontplane 201 may provide mechanisms for at least one of: emission of EM radiation, including without limitation, photons, and manipulation of emitted EM radiation.
  • various coatings of such devices 200 may be formed by vacuum-based deposition processes.
  • the second electrode 240 may extend partially over the patterning coating 110 in a transition region 245.
  • At least one particle structure 150d of a discontinuous layer 160 of a material of which the deposited layer 130 may be comprised may extend partially over the patterning coating 110, which may act as a particle structure patterning coating 110 p in the transition region 245.
  • such discontinuous layer 160 may form at least a part of the second electrode 240.
  • the device 200 may be electrically coupled with a power source 204. When so coupled, the device 200 may emit EM radiation, including without limitation, photons, as described herein.
  • the substrate 10 may comprise a base substrate 215.
  • the base substrate 215 may be formed of material suitable for use thereof, including without limitation, at least one of: an inorganic material, including without limitation, at least one of: Si, glass, metal (including without limitation, a metal foil), sapphire, and other inorganic material, and an organic material, including without limitation, a polymer, including without limitation, at least one of: a polyimide, and an Si-based polymer.
  • the base substrate 215 may be one of: rigid, and flexible.
  • the substrate 10 may be defined by at least one planar surface.
  • the substrate 10 may have at least one exposed layer surface 11 that supports the remaining frontplane 201 components of the device 200, including without limitation, at least one of: the first electrode 220, the at least one semiconducting layer 230, and the second electrode 240.
  • such surface may be at least one of an: organic, and inorganic, surface.
  • the substrate 10 may comprise, in addition to the base substrate 215, at least one additional at least one of: organic, and inorganic, layer (not shown nor specifically described herein) supported on an exposed layer surface 11 of the base substrate 215.
  • such additional layers may comprise, at least one organic layer, which may at least one of: comprise, replace, and supplement, at least one of the semiconducting layers 230.
  • such additional layers may comprise at least one inorganic layer, which may comprise, at least one electrode, which in some nonlimiting examples, may at least one of: comprise, replace, and supplement, at least one of: the first electrode 220, and the second electrode 240.
  • such additional layers may comprise a backplane 202.
  • the backplane 202 may comprise at least one of: power circuitry, and switching elements, for driving the device 200, including without limitation, at least one of: at least one electronic TFT structure 206, and at least one component thereof, that may be formed by a photolithography process.
  • the backplane 202 of the substrate 10 may comprise at least one electronic, including without limitation, an opto-electronic, component, including without limitation, one of: transistors, resistors, and capacitors, such as which may support the device 200 acting as one of: an active-matrix, and a passive matrix, device 200.
  • such structures may be a thin-film transistor (TFT) structure 206, including without limitation, one of a: top-gate, bottom-gate, n-type, and p-type, TFT structure 206.
  • the TFT structure 206 may incorporate one of: amorphous Si (a-Si), indium gallium zinc oxide (IGZO), and low-temperature polycrystalline Si (LTPS).
  • the first electrode 220 may be deposited over the substrate 10.
  • the first electrode 220 may be electrically coupled with at least one of: a terminal of the power source 204, and ground.
  • the first electrode 220 may be so coupled through at least one driving circuit which in some nonlimiting examples, may incorporate at least one TFT structure 206 in the backplane 202 of the substrate 10.
  • the first electrode 220 may comprise one of: an anode, and cathode. In some non-limiting examples, the first electrode 220 may be an anode.
  • the first electrode 220 may be formed by depositing at least one thin conductive film, over (a part of) the substrate 10. In some nonlimiting examples, there may be a plurality of first electrodes 220, disposed in a spatial arrangement over a lateral aspect of the substrate 10. In some non-limiting examples, at least one of such at least one first electrodes 220 may be deposited over (a part of) a TFT insulating layer 207 disposed in a lateral aspect in a spatial arrangement. If so, in some non-limiting examples, at least one of such at least one first electrodes 220 may extend through an opening of the corresponding TFT insulating layer 207 to be electrically coupled with an electrode of the TFT structures 206 in the backplane 202.
  • At least one of: the at least one first electrode 220, and at least one thin film thereof may comprise various materials, including without limitation, at least one metallic material, including without limitation, at least one of: magnesium (Mg), aluminum (Al), calcium (Ca), zinc (Zn), silver (Ag), cadmium (Cd), barium (Ba), and ytterbium (Yb), including without limitation, alloys comprising any of such materials, at least one metal oxide, including without limitation, a TCO, including without limitation, ternary compositions such as, without limitation, at least one of: FTO, IZO, and ITO, in varying proportions, including without limitation, combinations of any plurality thereof in at least one layer, any at least one of which may be, without limitation, a thin film.
  • at least one metallic material including without limitation, at least one of: magnesium (Mg), aluminum (Al), calcium (Ca), zinc (Zn), silver (Ag), cadmium (Cd), barium (Ba), and ytterb
  • the second electrode 240 may be deposited over the at least one semiconducting layer 230.
  • the second electrode 240 may be electrically coupled with at least one of: a terminal of the power source, and ground.
  • the second electrode 240 may be so coupled through at least one driving circuit, which in some non-limiting examples, may incorporate at least one TFT structure 206 in the backplane 202 of the substrate 10.
  • the second electrode 240 may comprise one of: an anode, and a cathode. In some non-limiting examples, the second electrode 240 may be a cathode.
  • the second electrode 240 may be formed by depositing a deposited layer 130, in some non-limiting examples, as at least one thin film, over (a part of) the at least one semiconducting layer 230.
  • the deposited layer 130 may be deposited in a second portion 102, by exposing the exposed layer surface 11 of the device 200, which may, in some non-limiting examples, comprise the at least one semiconducting layer 230, to a vapor flux 412 (FIG. 4) of a patterning material 411 (FIG. 4), including without limitation, using a shadow mask 415 (FIG. 4), to form a patterning coating 110 in the first portion 101.
  • a shadow mask 415 is employed, in some non-limiting examples, as shown in FIG. 2, the patterning material 110 may be restricted, in its lateral aspect, substantially to an emissive region 210 to a non-emissive region 211, including without limitation, at least one transmissive region 212 located therein.
  • the at least one second electrode 240 may comprise various materials, including without limitation, at least one metallic material, including without limitation, at least one of: Mg, Al, Ca, Zn, Ag, Cd, Ba, and Yb, including without limitation, alloys comprising at least one of: any of such materials, at least one metal oxide, including without limitation, a TCO, including without limitation, ternary compositions such as, without limitation, at least one of: FTO, IZO, and ITO, including without limitation, in varying proportions, zinc oxide (ZnO), and other oxides comprising at least one of: In, and Zn, in at least one layer, and at least one non-metallic material, any of which may be, without limitation, a thin conductive film.
  • at least one metallic material including without limitation, at least one of: Mg, Al, Ca, Zn, Ag, Cd, Ba, and Yb
  • alloys comprising at least one of: any of such materials
  • at least one metal oxide including without limitation, a TCO, including without
  • the deposition of the second electrode 240 may be performed using one of: an open mask, and a mask-free, deposition process.
  • the second electrode 240 may comprise a plurality of such coatings.
  • such coatings may be distinct coatings disposed on top of one another.
  • the second electrode 240 may comprise a Yb/Ag bi-layer coating.
  • such bi-layer coating may be formed by depositing a Yb coating, followed by an Ag coating.
  • a thickness of such Ag coating may be at least that of a thickness of the Yb coating.
  • the second electrode 240 may be a multicoating electrode 240 comprising a plurality of one of: a metallic, and an oxide, coating.
  • the second electrode 240 may comprise a fullerene and Mg.
  • such coating may be formed by depositing a fullerene coating followed by an Mg coating.
  • a fullerene may be dispersed within the Mg coating to form a fullerene-containing Mg alloy coating.
  • Non-limiting examples of such coatings are described in at least one of: United States Patent Application Publication No. 2015/0287846 published 8 October 2015, and in PCT International Application No. PCT/IB2017/054970 filed 15 August 2017 and published as W02018/033860 on 22 February 2018.
  • the at least one semiconducting layer 230 may comprise a plurality of layers 231, 233, 235, 237, 239, any of which may be disposed, in some non-limiting examples, in a thin film, in a stacked configuration, which may include, without limitation, at least one of: a hole injection layer (HIL) 231, a hole transport layer (HTL) 233, an emissive layer (EML) 235, an electron transport layer (ETL) 237, and an electron injection layer (EIL) 239.
  • HIL hole injection layer
  • HTL hole transport layer
  • EML emissive layer
  • ETL electron transport layer
  • EIL electron injection layer
  • the at least one semiconducting layer 230 may form a “tandem” structure comprising a plurality of EMLs 235.
  • tandem structure may also comprise at least one charge generation layer (CGL) (not shown).
  • the structure of the device 200 may be varied by one of: omitting, and combining, at least one of the semiconductor layers 231, 233, 235, 237, 239.
  • any of the layers 231, 233, 235, 237, 239 of the at least one semiconducting layer 230 may comprise any number of sub-layers.
  • any of such layers 231, 233, 235, 237, 239, including without limitation, sub-layer(s) thereof, may comprise various ones of a: mixture, and composition gradient.
  • the device 200 may comprise at least one layer comprising one of an: inorganic, and organometallic, material, and may not be necessarily limited to devices 200 comprised solely of organic materials.
  • the device 200 may comprise at least one quantum dot (QD).
  • the HIL 231 may be formed using a hole injection material, which may, in some non-limiting examples, facilitate injection of holes by the anode.
  • the HTL 233 may be formed using a hole transport material, which may, in some non-limiting examples, exhibit high hole mobility.
  • the ETL 237 may be formed using an electron transport material, which may, in some non-limiting examples, exhibit high electron mobility.
  • the EIL 239 may be formed using an electron injection material, which may, in some non-limiting examples, facilitate injection of electrons by the cathode.
  • the at least one EML 235 may be formed, in some non-limiting examples, by doping a host material with at least one emitter material.
  • the emitter material may be at least one of a: fluorescent, phosphorescent, and thermally activated delayed fluorescence (TADF), emitter material.
  • the emitter material may be one of a: R(ed), G(reen), and B(lue), emitter material, that is, an emitter material that facilitates the emission of, respectively, R(ed), G(reen), and B(lue), EM radiation.
  • the device 200 may be an OLED in which the at least one semiconducting layer 230 may comprise at least one EML 235 interposed between conductive thin film electrodes 220, 240, whereby, when a potential difference is applied across them, holes may be injected into the at least one semiconducting layer 230 through the anode, and electrons may be injected into the at least one semiconducting layer 230 through the cathode, to migrate toward the at least one EML 235 and combine to emit EM radiation in the form of photons.
  • the at least one semiconducting layer 230 may comprise at least one EML 235 interposed between conductive thin film electrodes 220, 240, whereby, when a potential difference is applied across them, holes may be injected into the at least one semiconducting layer 230 through the anode, and electrons may be injected into the at least one semiconducting layer 230 through the cathode, to migrate toward the at least one EML 235 and combine to emit EM radiation in the form of
  • the device 200 may be an electroluminescent QD device 200 in which the at least one semiconducting layer 230 may comprise an active layer comprising at least one QD.
  • EM radiation including without limitation, in the form of photons, may be emitted from the active layer comprising the at least one semiconducting layer 230 between them.
  • an entire lateral aspect of the device 200 may correspond to a single emissive element.
  • the substantially planar cross-sectional profile shown in FIG. 2 may extend substantially along the entire lateral aspect of the device 200, such that EM radiation is emitted from the device 200 substantially along the entirety of the lateral extent thereof.
  • such single emissive element may be driven by a single driving circuit of the device 200.
  • the lateral aspect of the device 200 may be sub-divided into a plurality of emissive regions 210 of the device 200, in which the longitudinal aspect of the structure thereof, within each of the emissive region(s) 210, may cause EM radiation to be emitted therefrom when energized.
  • the structure of the device 200 may be varied by the introduction of at least one additional layer (not shown) at appropriate position(s) within the at least one semiconducting layer 230 stack, including without limitation, at least one of: a hole blocking layer (HBL) (not shown), an electron blocking layer (EBL) (not shown), a charge transport layer (CTL) (not shown), and a charge injection layer (CIL) (not shown).
  • HBL hole blocking layer
  • EBL electron blocking layer
  • CTL charge transport layer
  • CIL charge injection layer
  • the patterning coating 110 may be formed concurrently with the at least one semiconducting layer(s) 230.
  • at least one material used to form the patterning coating 110 may also be used to form the at least one semiconducting layer(s) 230.
  • the ETL 237 of the at least one semiconducting layer 230 may be a patterning coating 110 that may be deposited in the first portion 101 and the second portion 102 during the deposition of the at least one semiconducting layer 230.
  • the EIL 239 may then be selectively deposited in the emissive region 210 of the second portion 102 over the ETL 237, such that the exposed layer surface 11 of the ETL 237 in the first portion 101 may be substantially devoid of the EIL 239.
  • the exposed layer surface 11 of the EIL 239 in the emissive region 210 and the exposed layer surface of the ETL 237, which acts as the patterning coating 110, may then be exposed to a vapor flux 532 (FIG. 5) of the deposited material 531 to form a closed coating 140 of the deposited layer 130 on the EIL 239 in the second portion 102, and a discontinuous layer 160 of the deposited material 531 on the ETL 237 in the first portion 101.
  • a vapor flux 532 FIG. 532
  • the lateral aspect of the device 200 may be sub-divided into a plurality of emissive regions 210 of the device 200, in which the longitudinal aspect of the device 200 structure, within each of the emissive region(s) 210, may cause EM radiation to be emitted therefrom when energized.
  • an individual emissive region 210 may have an associated pair of electrodes 220, 240, one of which may act as an anode and the other of which may act as a cathode, and at least one semiconducting layer 230 between them.
  • Such an emissive region 210 may emit EM radiation at a given wavelength spectrum and may correspond to one of: a pixel 1015 (FIG. 10), and a sub-pixel 216 thereof ((sub-) pixel 1015/216).
  • a plurality of sub-pixels 216, each corresponding to and emitting EM radiation of a different wavelength (range) may collectively form a pixel 1015.
  • the wavelength spectrum may correspond to a colour in, without limitation, the visible spectrum.
  • the EM radiation at a first wavelength (range) emitted by a first sub-pixel 216 of a pixel 1015 may perform differently than the EM radiation at a second wavelength (range) emitted by a second sub-pixel 216 thereof because of the different wavelength (range) involved.
  • an active region 208 of an individual emissive region 210 may be defined to be bounded, in the longitudinal aspect, by the first electrode 220 and the second electrode 240, and to be confined, in the lateral aspect, to an emissive region 210, defined by presence of each of the first electrode 220, the second electrode 240, and the at least one semiconducting layer 230 therebetween (“emissive region layers”), that is, the first electrode 220, the second electrode 240, and the at least one semiconducting layer 230 therebetween, overlap laterally.
  • emissive region layers that is, the first electrode 220, the second electrode 240, and the at least one semiconducting layer 230 therebetween, overlap laterally.
  • the lateral aspect of the emissive region 210 may not correspond to the entire lateral aspect of at least one of: the first electrode 220, and the second electrode 240. Rather, the lateral aspect of the emissive region 210 may be substantially no more than the lateral extent of either of the: first electrode 220, and second electrode 240.
  • At least one of: parts of the first electrode 220 may be covered by at least one pixel definition layer (PDL) 209, and parts of the second electrode 240 may not be disposed on the at least one semiconducting layer 230, with the result, in at least one scenario, that the emissive region 210 may be laterally constrained thereby.
  • at least one of the various emissive region layers may be deposited by deposition of a corresponding constituent emissive region layer material.
  • some of the at least one semiconducting layers 230 may be laid out in a desired pattern by vapor deposition of the corresponding emissive region layer material through an FMM having apertures corresponding to the desired locations where the emissive region layer material is to be deposited.
  • a plurality of the emissive region layers may be laid out in a similar pattern, including without limitation, by depositing the respective emissive region layer material thereof in their respective deposition stages using an FMM.
  • the emissive region layer material corresponding to at least one of the: first electrode 220, and second electrode 240, including without limitation, the second electrode 240, may be deposited by prior deposition of a patterning coating 110 by vapor deposition of a patterning material 411 through an FMM having apertures corresponding to the desired locations where the patterning coating 110 is to be deposited and thereafter depositing the emissive region layer material using one of: an open mask, and mask-free, deposition process.
  • the patterning coating 110 may be adapted to impact a propensity of a vapor flux 532 of a deposited material 531 of which the emissive region layer material may be comprised, to be deposited thereon, including without limitation, an initial sticking probability against the deposition of the deposited material 531 that is no more than an initial sticking probability against the deposition of the deposited material 531 of the exposed layer surface 11 of the at least one semiconducting layer 230.
  • the first electrode 220 may be disposed over an exposed layer surface 11 of the device 200, in some non-limiting examples, within at least a part of the lateral aspect of the emissive region 210. In some non-limiting examples, at least within the lateral aspect of the emissive region 210 of the (sub-) pixel(s) 1015/216, the exposed layer surface 11, may, at the time of deposition of the first electrode 220, comprise the TFT insulating layer 207 of the various TFT structures 206 that make up the driving circuit for the emissive region 210 corresponding to a single display (sub-) pixel 1015/216. [00155] In some non-limiting examples, the TFT insulating layer 207 may be formed with an opening extending therethrough to permit the first electrode 220 to be electrically coupled with a TFT electrode including, without limitation, a TFT drain electrode.
  • the driving circuit may comprise a plurality of TFT structures 206.
  • TFT structure 206 may be representative of at least one of: such plurality thereof, and at least one component thereof, that comprise the driving circuit.
  • an extremity of the first electrode 220 may be covered by at least one PDL 209 such that a part of the at least one PDL 209 may be interposed between the first electrode 220 and the at least one semiconducting layer 230, such that such extremity of the first electrode 220 may lie beyond the active region 208 of the associated emissive region 210.
  • the at least one semiconducting layer 230 may be deposited over the exposed layer surface 11 of the device 200, including at least a part of the lateral aspect of such emissive region 210 of the (sub-) pixel(s) 1015/216.
  • at least within the lateral aspect of the emissive region 210 of the (sub-) pixel(s) 1015/216, such exposed layer surface 11, may, at the time of deposition of such at least one semiconducting layer 230 comprise the first electrode 220.
  • the at least one semiconducting layer 230 may also extend beyond the lateral aspect of the emissive region 210 of the (sub-) pixel(s) 1015/216 and at least partially within the lateral aspects of the surrounding non-emissive region(s) 211.
  • such exposed layer surface 11 of such surrounding non-emissive region(s) 211 may, at the time of deposition of the at least one semiconducting layer 230, comprise the PDL(s) 209.
  • the second electrode 240 may be disposed over an exposed layer surface 11 of the device 200, including at least a part of the lateral aspect of the emissive region 210 of the (sub-) pixel(s) 1015/216. In some non-limiting examples, at least within the lateral aspect of the emissive region 210 of the (sub-) pixel(s) 1015/216, such exposed layer surface 11, may, at the time of deposition of the second electrode 220, comprise the at least one semiconducting layer 230.
  • the second electrode 240 may also extend beyond the lateral aspect of the emissive region 210 of the (sub-) pixel(s) 1015/216 and at least partially within the lateral aspects of the surrounding non-emissive region(s) 211.
  • an exposed layer surface 11 of such surrounding non-emissive region(s) 211 may, at the time of deposition of the second electrode 240, comprise the PDL(s) 209.
  • the second electrode 240 may extend throughout a substantial part, including without limitation, substantially all, of the lateral aspects of the surrounding non-emissive region(s) 211.
  • individual emissive regions 210 of the device 200 may be laid out in a lateral pattern.
  • the pattern may extend along a first lateral direction.
  • the pattern may also extend along a second lateral direction, which in some non-limiting examples, may extend at an angle relative to the first lateral direction.
  • the second lateral direction may be substantially normal to the first lateral direction.
  • the pattern may have a number of elements in such pattern, each element being characterized by at least one feature thereof, including without limitation, at least one of a wavelength of EM radiation emitted by the emissive region 210 thereof, a shape of such emissive region 210, a dimension (along at least one of the first, and second, lateral directi on(s)), an orientation (relative to at least one of the first, and second, lateral directi on(s)), and a spacing (relative to at least one of the first, and second, lateral direction(s)) from a previous element in the pattern.
  • the pattern may repeat in at least one of the: first, and second, lateral direction(s).
  • each individual emissive region 210 of the device 200 may be associated with, and driven by, a corresponding driving circuit within the backplane 202 of the device 200, for driving an OLED structure for the associated emissive region 210.
  • a driving circuit within the backplane 202 of the device 200, for driving an OLED structure for the associated emissive region 210.
  • the emissive regions 210 may be laid out in a regular pattern extending in both the first (row) lateral direction and the second (column) lateral direction, there may be a signal line in the backplane 202, corresponding to each row of emissive regions 210 extending in the first lateral direction and a signal line, corresponding to each column of emissive regions 210 extending in the second lateral direction.
  • a signal on a row selection line may energize the respective gates of the switching TFT structure(s) 206 electrically coupled therewith and a signal on a data line may energize the respective sources of the switching TFT structure(s) 206 electrically coupled therewith, such that a signal on a row selection line / data line pair may electrically couple and energise, by the positive terminal of the power source, the anode of the OLED structure of the emissive region 210 associated with such pair, causing the emission of a photon therefrom, the cathode thereof being electrically coupled with the negative terminal of the power source.
  • a single display pixel 1015 may comprise three sub-pixels 216, which in some non-limiting examples, may correspond respectively to a single sub-pixel 216 of each of three colours, including without limitation, at least one of a: R(ed) sub-pixel 216R, G(reen) sub-pixel 216G, and B(lue) sub-pixel 216B.
  • a single display pixel 1015 may comprise four sub-pixels 216, each corresponding respectively to a single sub-pixel 216 of each of two colours, including without limitation, a R(ed) sub-pixel 216R, and a B(lue) sub-pixel 216B, and two sub-pixels 216 of a third colour, including without limitation, a G(reen) sub-pixel 216G.
  • a single display pixel 1015 may comprise four sub-pixels 216, which in some non-limiting examples, may correspond respectively to a single sub-pixel 216 of each of three colours, including without limitation, at least one of a: R(ed) sub-pixel 216R, G(reen) sub-pixel 216G, and B(lue) sub-pixel 216B, and a fourth, W(hite) sub-pixel 216w.
  • the emission spectrum of the EM radiation emitted by a given (sub-) pixel 1015/216 may correspond to the colour by which the (sub-) pixel 1015/216 may be denoted.
  • the wavelength of the EM radiation may not correspond to such colour, but further processing may be performed, in a manner apparent to those having ordinary skill in the relevant art, to transform the wavelength to one that does so correspond.
  • the emission spectrum of the EM radiation emitted by a given (sub-) pixel 1015/216, corresponding to the colour by which the (sub-) pixel 1015/216 may be denoted may be related to at least one of the: structure, and composition, of the at least one semiconducting layer 230 extending between the first electrode 220 and the second electrode 240 thereof, including without limitation, the at least one EML 235.
  • the at least one EML 235 of the at least one semiconducting layer 230 may be tuned to facilitate the emission of EM radiation having an emission spectrum corresponding to the colour by which the (sub-) pixel 1015/216 may be denoted.
  • the EML 235 of a R(ed) sub-pixel 216R may comprise a R(ed) EML material, including without limitation, a host material doped with a R(ed) emitter material.
  • the EML 235 of a G(reen) subpixel 216G may comprise a G(reen) EML material, including without limitation, a host material doped with a G(reen) emitter material.
  • the EML 235 of a B(lue) sub-pixel 216B may comprise B(lue) EML material, including without limitation, a host material doped with a B(lue) emitter material.
  • At least one characteristic of at least one of the at least one semiconducting layer 230 may be selected to facilitate emission therefrom of EM radiation having a wavelength spectrum corresponding to the colour by which a given sub-pixel 216 may be denoted, including without limitation, at least one of: R(ed), G(reen), and B(lue).
  • emission of EM radiation having a wavelength spectrum corresponding to a plurality of colours selected from: R(ed), G(reen), and B(lue) may facilitate emission of EM radiation having a wavelength spectrum corresponding to a different colour, including without limitation, W(hite) (R+G+B), Y(ellow) (R+G), C(yan) (G+B), and M(agenta) (B+R), according to the additive colour model.
  • the exposed layer surface 11 of the device 100 may be exposed to a vapor flux 532 of a deposited material 531, including without limitation, in one of: an open mask, and mask-free, deposition process.
  • the at least one semiconducting layer 230 may be deposited over the exposed layer surface 11 of the device 200, which may, in some non-limiting examples, comprise the first electrode 220.
  • the exposed layer surface 11 of the device 200 which may, in some non-limiting examples, comprise the at least one semiconducting layer 230, may be exposed to a vapor flux 412 of the patterning material 411, including without limitation, using a shadow mask 415, to form a patterning coating 110 in the first portion 101. Whether a shadow mask 415 is employed, the patterning coating 110 may be restricted, in its lateral aspect, substantially to a transmissive region 212.
  • a lateral aspect of at least one emissive region 210 may extend across and include at least one TFT structure 206 associated therewith, for driving the emissive region 210 along data and scan lines (not shown), which, in some non-limiting examples, may be formed of at least one of: Cu, and a TCO.
  • the (sub-) pixels 1015/216 may be disposed in a side-by-side arrangement.
  • a (colour) order of the subpixels 216 of a first pixel 1015 may be the same as a (colour) order of the sub-pixels 216 of a second pixel 1015.
  • a (colour) order of the sub-pixels 216 of a first pixel 1015 may be different from a (colour) order of the sub-pixels 216 of a second pixel 1015.
  • the sub-pixels 216 of adjacent pixels 1015 may be aligned in at least one of a: row, column, and array, arrangement.
  • a first at least one of a: row, and column, of aligned sub-pixels 216 of adjacent pixels 1015 may comprise sub-pixels 216 of one of a: same, and different, colour.
  • a first at least one of a: row, and column, of aligned sub-pixels 216 of adjacent pixels 1015 may be aligned with at least one of a: second, and third, at least one of a: row, and column, of aligned sub-pixels 216 of adjacent pixels 1015.
  • a first at least one of a: row, and column, of aligned sub-pixels 216 of adjacent pixels 1015 may be one of: offset from, and mis-aligned with, at least one of a: second, and third, at least one of a: row, and column, of aligned subpixels 216 of adjacent pixels 1015.
  • the sub-pixels 216 of adjacent pixels 1015 of such at least one of a: first, second, and third, at least one of a: row, and column may be arranged such that corresponding sub-pixels 216 of each of the at least one of: first, second, and third, at least one of a: row, and column, may be of a same colour.
  • the sub-pixels 216 of adjacent pixels 1015 of such at least one of a: first, second, and third, at least one of a: row, and column may be arranged such that corresponding sub-pixels 216 of each of the at least one of: first, second and third, at least one of a: row, and column, may be of different colours.
  • the at least one transmissive region 212 may be disposed between a plurality of emissive regions 210. In some non-limiting examples, the at least one transmissive region 212 may be disposed between adjacent (sub-) pixels 1015/216. In some non-limiting examples, the adjacent sub-pixels 216 surrounding the at least one transmissive region 212 may form part of a same pixel 1015. In some nonlimiting examples, the adjacent sub-pixels 216 surrounding the at least one transmissive region 212 may be associated with different pixels 1015.
  • a region that may be substantially devoid of a closed coating 140 of a second electrode material (“cathode-free region”), including without limitation, the at least one transmissive region 212, in some non-limiting examples, may exhibit different opto-electronic characteristics from other regions, including without limitation, the at least one emissive region 210.
  • cathode-free regions may nevertheless comprise some second electrode material, including without limitation, in the form of a discontinuous layer 160 of one of: at least one particle structure 150, and at least one instance of such particle structures 150.
  • this may be achieved by laser ablation of the second electrode material.
  • laser ablation may create a debris cloud, which may impact the vapour deposition process.
  • this may be achieved by disposing a patterning coating 110, which may, in some non-limiting examples, be a nucleation inhibiting coating (NIC), using an FMM, in a pattern on an exposed layer surface 11 of the at least one semiconducting layer 230 prior to depositing a deposited material 531 for forming the second electrode 240 thereon.
  • a patterning coating 110 which may, in some non-limiting examples, be a nucleation inhibiting coating (NIC), using an FMM
  • the patterning coating 110 may be adapted to impact a propensity of a vapor flux 532 of the deposited material 531 to be deposited thereon, including without limitation, an initial sticking probability against the deposition of the deposited material 531 that is no more than an initial sticking probability against the deposition of the deposited material 531 of the exposed layer surface 11 of the at least one semiconducting layer 230.
  • the patterning coating 110 may be deposited in a pattern that may correspond to the first portion 101 of a lateral aspect, including without limitation, of at least some of the transmissive regions 212.
  • the patterning coating 110 may be deposited in a plurality of stages, each using a different FMM defining a different pattern within the first portion 101, that respectively correspond to a different subset of the transmissive regions 212.
  • the display panel 300 may, subsequent to (all of the stages of) the deposition of the patterning coating 110, be subjected to a vapor flux 532 of the deposited material 531, in one of: an open mask, and mask-free, deposition process, to form the second electrode 240 for each of the emissive regions 210 corresponding to a (sub-) pixel 1015/216 in at least the second portion 102 of the lateral aspect, but not in the first portion 101 of the lateral aspect.
  • the overlying layer 170 may be arranged above at least one of: the second electrode 240, and the patterning coating 110. In some non-limiting examples, although not shown, the overlying layer 170 may be deposited at least partially across the lateral extent of the opto-electronic device 200, in some non-limiting examples, covering the second electrode 240 in the second portion 102, and, in some non-limiting examples, at least partially covering the at least one particle structure 150 and forming an interface with the patterning coating 110 at the exposed layer surface 11 thereof in the first portion 101.
  • the various emissive regions 210 of the device 200 may be substantially surrounded and separated by, in at least one lateral direction, at least one non-emissive region 211, in which at least one of: the structure, and configuration, along the longitudinal aspect, of the device 200 shown, without limitation, may be varied, to substantially inhibit EM radiation to be emitted therefrom.
  • the non-emissive regions 211 may comprise those regions in the lateral aspect, that are substantially devoid of an emissive region 210.
  • the longitudinal topology of the various layers of the at least one semiconducting layer 230 may be varied to define at least one emissive region 210, surrounded (at least in one lateral direction) by at least one non- emissive region 211.
  • the lateral aspects of the surrounding non- emissive region(s) 211 may be characterized by the presence of a corresponding PDL 209.
  • a thickness of the PDL 209 may increase from a minimum, where it covers the extremity of the first electrode 220, to a maximum beyond the lateral extent of the first electrode 220.
  • a change in thickness of the at least one PDL 209 may define a valley shape centered about the emissive region 210.
  • the valley shape may constrain a field of view (FOV) of the EM radiation emitted by the emissive region 210.
  • FOV field of view
  • PDL(s) 209 have been generally illustrated herein as having a linearly-sloped surface to form a valley-shaped configuration that define the emissive region(s) 210 surrounded thereby, those having ordinary skill in the relevant art will appreciate that in some non-limiting examples, at least one of the: shape, aspect ratio, thickness, width, and configuration, of such PDL(s) 209 may be varied.
  • a PDL 209 may be formed with one of a: substantially steep, and more gradually sloped, part.
  • such PDL(s) 209 may be configured to extend substantially normally away from a surface on which it is deposited, that may cover at least one edge of the first electrode 220.
  • such PDL(s) 209 may be configured to have deposited thereon at least one semiconducting layer 230 by a solution-processing technology, including without limitation, by printing, including without limitation, ink-jet printing.
  • the PDLs 209 may be deposited substantially over the TFT insulating layer 207, although, as shown, in some non-limiting examples, the PDLs 209 may also extend over at least a part of the deposited first electrode 220, including without limitation, its outer edges.
  • the lateral extent of at least one of the non- emissive regions 211 may be at least, and in some non-limiting examples, exceed, including without limitation, be a multiple of, the lateral extent of the emissive region 210 interposed therebetween.
  • a thickness of at least one PDL 209 in at least one transmissive region 212, in some non-limiting examples, of at least one non- emissive region 211, interposed between adjacent emissive regions 210, in some nonlimiting examples, at least in a region laterally spaced apart therefrom, and in some nonlimiting examples, although not shown, of the TFT insulating layer 207, may be reduced in order to enhance at least one of a: transmittivity, and transmittivity angle, relative to, and through, the layers of a display panel 300, to facilitate transmission of EM radiation therethrough.
  • a patterning coating 110 comprising a patterning material 411, which in some non-limiting examples, may be an NIC material, may be disposed, in some nonlimiting examples, as a closed coating 140, on an exposed layer surface 11 of an underlying layer 710, including without limitation, a substrate 10, of the device 100, in some nonlimiting examples, restricted in lateral extent by selective deposition, including without limitation, using a shadow mask 415 such as, without limitation, an FMM, including without limitation, to the first portion 101.
  • a shadow mask 415 such as, without limitation, an FMM, including without limitation, to the first portion 101.
  • the exposed layer surface 11 of the underlying layer 710 of the device 100 may be substantially devoid of a closed coating 140 of the patterning coating 110.
  • the patterning coating 110 may comprise a patterning material 411.
  • the patterning material 411 may comprise an NIC material.
  • the patterning coating 110 may comprise a closed coating 140 of the patterning material 411.
  • the patterning coating 110 may provide an exposed layer surface 11 with a substantially low propensity (including without limitation, a substantially low initial sticking probability) (in some non-limiting examples, under the conditions identified in the dual QCM technique described by Walker et al.) against the deposition of a deposited material 531 to be deposited thereon upon exposing such surface to a vapor flux 532 of the deposited material 531, which, in some non-limiting examples, may be substantially no more than a propensity against the deposition of the deposited material 531 to be deposited on the exposed layer surface 11 of the underlying layer 710 of the device 100, upon which the patterning coating 110 has been deposited.
  • a substantially low propensity including without limitation, a substantially low initial sticking probability
  • the exposed layer surface 11 of the first portion 101 comprising the patterning coating 110 may be substantially devoid of a closed coating 140 of the deposited material 531.
  • exposure of the device 100 to a vapor flux 532 of the deposited material 531 may, in some non-limiting examples, result in the formation of a closed coating 140 of a deposited layer 130 of the deposited material 531 in the second portion 102, where the exposed layer surface 11 of the underlying layer 710 may be substantially devoid of a closed coating 140 of the patterning coating 110.
  • the patterning coating 110 may be an NIC that provides high deposition (patterning) contrast against subsequent deposition of the deposited material 531, such that the deposited material 531 tends not to be deposited, in some non-limiting examples, as a closed coating 140, where the patterning coating 110 has been deposited.
  • the attributes of the patterning coating 110 may be such that a closed coating 140 of the deposited material 531 may be formed in the second portion 102, which may be substantially devoid of the patterning coating 110, while only a discontinuous layer 160 of at least one particle structure 150 having at least one characteristic may be formed in the first portion 101 on the patterning coating 110.
  • a patterning coating 110 may be designated as a particle structure patterning coating 110 p .
  • a patterning coating 110 may be deposited in a first portion 101 to substantially preclude formation in such first portion 101 of a closed coating 140 of the deposited layer 130, thus restricting the deposition of a closed coating 140 of the deposited layer 130 to a second portion 102.
  • a patterning coating 110 may act as both a particle structure patterning coating 110 p and a non-particle structure patterning coating 110n.
  • a discontinuous layer 160 of at least one particle structure 150 of a deposited material 531 which may be, in some non-limiting examples, of one of a: metal, and metal alloy (metal/alloy), including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, in the second portion 102, while depositing a closed coating 140 of the deposited material 531 having a thickness of, without limitation, one of no more than about: 100, 50, 25, and 15, nm.
  • an amount of the deposited material 531 deposited as a discontinuous layer 160 of at least one particle structure 150 in the first portion 101 may correspond to one of between about: 1- 50%, 2-25%, 5-20%, and 7-10%, of the amount of, the deposited material 531 deposited as a closed coating 140 in the second portion 102, which, in some non-limiting examples may correspond to a thickness of one of no more than about: 100, 75, 50, 25, and 15, nm.
  • the patterning coating 110 may be disposed in a pattern that may be defined by at least one region therein that may be substantially devoid of a closed coating 140 of the patterning coating 110.
  • the at least one region may separate the patterning coating 110 into a plurality of discrete fragments thereof.
  • the plurality of discrete fragments of the patterning coating 110 may be physically spaced apart from one another in the lateral aspect thereof.
  • the plurality of the discrete fragments of the patterning coating 110 may be arranged in a regular structure, including without limitation, an array (matrix), such that in some non-limiting examples, the discrete fragments of the patterning coating 110 may be configured in a repeating pattern.
  • At least one of the plurality of the discrete fragments of the patterning coating 110 may each correspond to an emissive region 210.
  • an aperture ratio of the emissive regions 210 may be one of no more than about: 50%, 40%, 30%, and 20%.
  • the patterning coating 110 may be formed as a single monolithic coating.
  • a material including without limitation, the patterning material 411, of which a coating may be comprised, may exhibit a bulk melting point in a bulk form of a substantially large at least one of quantity, size, and mass.
  • a patterning coating 110 comprising at least one patterning material 411 having a substantially low bulk melting point, may have increased applicability in certain scenarios calling for at least one of a: substantially high deposition contrast, and substantially low initial sticking probability, including without limitation, scenarios calling for at least one of a substantial absence of a closed coating 140, and at least one of a: substantially low density, and substantially small size, of particle structures 150 in the first portion 101, following exposure of the patterning coating 110 to an evaporated flux 532 of the deposited material 531.
  • a material including without limitation, a patterning material 411, with a substantially low surface energy, may tend to exhibit a substantially low bulk melting point.
  • a material including without limitation, a patterning material 411, with substantially low inter-molecular forces, may tend to exhibit a substantially low bulk melting point.
  • a patterning material 411 of which a patterning coating 110 may be comprised, may have a bulk melting point that is no more than one of about: 100°C, 95°C, 90°C, 85°C, 80°C, 75°C, and 70°C.
  • a material including without limitation, the patterning material 411, when deposited as a film, may exhibit a film melting point.
  • a film melting point of a coating including without limitation, a patterning coating 110, may be comparable, including without limitation, close, and substantially equal, to the bulk melting point of the material of which the coating may be comprised.
  • such patterning coating 110 comprising a patterning material 411 having a substantially low bulk melting point may have reduced at least one of: thermal stability, and substantial reliability, in some non-limiting examples, due to low inter-molecular forces, when heated to substantially high temperature close to, including without limitation, one of: at, and above, a bulk melting point of the patterning material 411, during at least one of the: manufacture, including without limitation, a deposition process, and operation of the device 100, including without limitation, a display panel 300.
  • the patterning material 411 in the patterning coating 110 may exhibit at least one of: changes in physical properties, and phase transformations, including without limitation, at least one of: melting at such substantially high temperature, and solidifying, upon cooling from such substantially high temperature, which may have an impact on at least one of the: long-term performance, stability, reliability, and lifetime, of the device 100.
  • the patterning coating 110 may initially be deposited as a substantially non-crystalline, including without limitation, substantially amorphous, coating. In some non-limiting examples, melting the patterning material 411, and concomitantly, the patterning coating 110, may cause at least one of: the patterning coating 110 itself, and a layer disposed adjacent thereto in the longitudinal aspect, including without limitation, at least one of: the overlying layer 170, and at least one semiconducting layer 230, to undergo crystallization upon cooling.
  • crystallization of such at least one of the: patterning coating 110 itself, and layer disposed adjacent thereto may lead to at least one of: changes of the properties thereof, including without limitation, optical properties (including without limitation, increased scattering, and reduced transparency), and concomitantly, degradation of device performance, due to an amorphous layer becoming crystallized.
  • melting the patterning material 411, and concomitantly, the patterning coating 110 may cause failures in the device 100, which in some non-limiting examples, may be in a form of delamination thereof.
  • the delamination may occur as a result of adhesive failure, where in some non-limiting examples, a fracture may be formed between the delaminated coating, including without limitation, the patterning coating 110, and a layer disposed adjacent thereto in the longitudinal aspect.
  • the delamination may occur as a result of cohesive failure, where a fracture may be formed within a coating, including without limitation, the patterning coating 110 itself, and the layer disposed adjacent thereto, such that the coating may be split apart, and part of the coating may still remain on a layer disposed adjacent thereto in the longitudinal aspect.
  • a likelihood of delamination may be increased since the crystallization may introduce irregularities to the patterning coating 110, and accordingly form a stress point to trigger the delamination.
  • a material including without limitation, a patterning material 411, having a substantially low bulk melting point and a substantially high film melting point when formed as a film, may have increased applicability in some scenarios calling for a substantially high deposition contrast and a substantially high thermal stability.
  • a material including without limitation, a patterning material 411
  • a threshold thickness (“very thin thickness regime”)
  • molecules of the material may tend to deposit in an ordered manner, such that in some non-limiting examples, they may align in a well-ordered orientation (“ordered orientation”).
  • ordered orientation may impart a different characteristic, including without limitation, a melting point, to the film compared to the characteristic that the material thereof may exhibit in a bulk form (cf. Macromol. Chem. Phys.
  • the material including without limitation, the patterning material 411, when formed as a coating in the very thin thickness regime, may exhibit a film melting point, which may be elevated (“elevated melting point”) relative to the bulk melting point that the material, of which the coating may be comprised, exhibits in a bulk form, resulting in a substantially high thermal stability even at temperatures above the bulk melting point of the material.
  • elevated melting point relative to the bulk melting point that the material, of which the coating may be comprised
  • phase transformation including without limitation, melting, and solidifying, of a material, including without limitation, a patterning material 411, deposited as a film, may initiate at an interface with a layer disposed adjacent thereto in the longitudinal aspect, including without limitation, an underlying layer 710.
  • interactions of the interfacial energies at an interface between the patterning coating 110 and the underlying layer 710 may affect an energy barrier for nucleation in a solidifying process.
  • a(n) (average layer) thickness of the patterning coating 110 is at least that of the threshold thickness
  • a film melting point of the patterning coating 110 may be substantially the same as a bulk melting point of the patterning material 411 as the bulk properties of the patterning material 411 may dominate the solidifying process.
  • the thickness of the patterning coating 110 decreases below, including without limitation, to, the threshold thickness, which may be in a range of a single monolayer to a few monolayers
  • interfacial interactions of the patterning material 411 with a material of an adjacent layer, including without limitation, the underlying layer 710, at the interface (including without limitation, at least one of a: morphology, and property, thereof) therewith may have a significant impact on an interfacial phase transformation compared to the bulk properties of the patterning material 411.
  • such interfacial interactions of the patterning material 411 with the underlying layer 710 may promote an ordered alignment of the molecules of the patterning materials 411 at, including without limitation, near, the interface, forming ordered (mono) layer(s).
  • the ordered orientation of the molecules may facilitate the formation of stable nuclei due to favourable thermodynamic and kinetic properties of nucleation, leading to a substantially high film melting point of the patterning coating 110. Accordingly, at least one of: the solidifying may, and the melting may not, take place at a temperature above the bulk melting point of the patterning material 411.
  • such effect of a substantially high film melting point due to the ordered orientation of molecules may be readily observed in at least one of: polymeric, and oligomeric, materials.
  • the bulk melting point of a material may be determined using various methods apparent to those having ordinary skill in the relevant art, including without limitation, differential scanning calorimetry (DSC) and a melting-point apparatus.
  • DSC differential scanning calorimetry
  • a film melting point of a substantially thin coating may not be readily determined by methods, including without limitation, DSC, that may be used to measure a bulk melting point.
  • the film melting point may be determined by various techniques known in the art, including without limitation, optical analysis methods for studying optical responses of thin films, including without limitation, ellipsometry, and thermal analysis methods for microstructures, including without limitation, hot stage microscopy (HSM).
  • HSM hot stage microscopy
  • a molecule of a patterning material 411 may comprise a first moiety and a second moiety coupled, including without limitation, bonded, thereto.
  • the first moiety may be spaced apart from the second moiety.
  • a patterning material 411 having such a molecular structure is deposited as a patterning coating 110 having a thickness that may be no more than the threshold thickness, one of the: first, and second, moieties, including without limitation, a terminal group thereof, of a majority of the molecules of the patterning material 411 may tend to be oriented toward an exposed layer surface 11 of the patterning coating 110.
  • the other one of the: first, and second, moieties, including without limitation, a terminal group thereof, of the majority of the molecules of the patterning material 411 in the patterning coating 110 may be oriented toward an exposed layer surface 11 of the underlying layer 710.
  • an ability of the molecules of a material including without limitation, a patterning material 411, to be oriented in a well-ordered manner in a thin film, resulting in an increase in the film melting point thereof, that may have increased applicability in some scenarios, may appear at a threshold (average layer) thickness of the film.
  • a threshold average layer
  • such effect may be observed if the patterning coating 110 is in the very thin thickness regime, and in some non-limiting examples, may be facilitated, including without limitation, maximized, within a range thereof.
  • (a range of) the (average layer) thickness of the patterning coating 110, in which such substantially high film melting point may be observed may be in a range of a single monolayer to a few monolayers of the patterning material 411, and accordingly, may, in some non-limiting examples, be correlated to a characteristic size of a molecular structure of the patterning material 411.
  • the patterning coating 110 is unduly thin, including without limitation, having a(n) (average layer) thickness no more than a minimum value
  • the patterning material 411 may not provide a substantial, including without limitation, complete, surface coverage over a target area of the underlying layer 710 in the device 100, such that a deposition contrast thereof may be impacted.
  • such minimum value may be one of at least about: 1, and 2, monolayers.
  • a(n) (average layer) thickness of the patterning coating 110 is at least that of a maximum value, which in some non-limiting examples, may be the threshold thickness discussed herein, the elevation of the film melting point may become substantially unobservable, as the patterning coating 110 may exhibit increasingly more bulk properties of the patterning material 411, and the likelihood of the molecules of the patterning material 411 maintaining an ordered orientation may be substantially reduced. In some non-limiting examples, this may be caused, at least in part, due to the molecule orientation becoming increasingly disordered as additional molecules may be deposited to form a substantially thick patterning coating 110. In some non-limiting examples, such maximum value may be one of at least about: 5, 6, 7, 8, 9, and 10, monolayers.
  • substantially high film melting point as a result of the ordered orientation, may be substantially restricted to a range of the thickness, including without limitation, the average layer thickness, of the patterning coating 110.
  • the average layer thickness of the patterning coating 110 for having a film melting point that is greater than the bulk melting point of the patterning material 411 may be one of between about: 1-5, 1-4, 1-3, and 1-2, monolayers.
  • the molecules of the patterning material 411 may have a molecular size of one of at least about: 4, 5, 6, 8, 10, 12, 15, 18, angstroms.
  • a range of the average layer thickness of the patterning coating 110 may be one of between about: 2-8, 2-7, 2-6, 3-6, and 3-5, nm.
  • an average layer thickness thereof may be between about 1.2-6 nm. In some non-limiting examples where the patterning coating 110 comprises substantially only tri ethoxy- 1H,1H,2H,2H- perfluorodecylsilane, an average layer thickness thereof may be between about 1.5-8.5 nm. In some non-limiting examples where the patterning coating 110 comprises substantially only (triethylsilyl)trifluoromethane, an average layer thickness thereof may be between about 0.5-3.5 nm.
  • an average layer thickness thereof may be between about 0.5-3.2 nm. In some non-limiting examples where the patterning coating 110 comprises substantially only dimethoxy(methyl)(3,3,3- trifluoropropyl)silane, an average layer thickness thereof may be between about 0.5-3.2 nm. In some non-limiting examples where the patterning coating 110 comprises substantially only dichloro(methyl)(3,3,3-trifluoropropyl)silane, an average layer thickness thereof may be between about 0.5-3.5 nm.
  • a difference between a film melting point of the patterning coating 110 and a bulk melting point of the patterning material 411, of which the patterning coating 110 may be comprised may be one of at least about: 5°C, 8°C, 10°C, 12°C, 15°C, 18°C, 20°C, 25°C, and 30°C.
  • a film melting point of the patterning coating 110 may be one of at least about: 80°C, 85°C, 90°C, 95°C, 100°C, 105°C, 110°C, 120°C, and 130°C.
  • a material at the interface with the patterning coating 110 may impact an ability of the molecules of the patterning material 411 to take on an ordered orientation, and accordingly the extent to which the film melting point of the patterning coating 110 may be elevated compared to the bulk melting point of the patterning material 411.
  • a microstructure of an underlying material, of which the underlying layer 710 may be comprised may facilitate an ordered orientation of the patterning material 411.
  • characteristics of the lattice of such underlying material including without limitation, lattice parameters, including without limitation, at least one of: a lattice constant, orientation, and a crystal symmetry, thereof, may correspond to, including without limitation, match, those of the patterning material 411, and may promote an ordered orientation of the molecules of the patterning coating 110.
  • a property of the underlying material may facilitate an ordered orientation of the patterning material 411.
  • the underlying material may comprise an orientation material, and accordingly, the underlying layer 710 may be an orientation layer.
  • the orientation material may have a substantially high characteristic surface energy, in some non-limiting examples, relative to other materials, including without limitation, a patterning material 411, and the orientation layer may present a high surface energy at the exposed layer surface 11 thereof.
  • a surface energy of the orientation layer may be at least that of a surface energy of the patterning coating 110.
  • the first moiety of the molecule of the patterning material 411 may have a critical surface tension that is at least that of a critical surface tension of the second moiety thereof and coupled thereto, such that the first moiety may comprise a high(er) critical surface tension component and the second moiety may comprise a low(er) critical surface tension component.
  • the first moiety of the patterning material 411 that may comprise a high(er) surface tension component may tend to be oriented toward an exposed layer surface 11 of the orientation layer having a high surface energy, because of various inter-molecular interactions with the orientation material upon being deposited on the orientation layer, such that in some non-limiting examples, the second moiety of the patterning material 411 that may comprise a low(er) surface tension component may tend to be oriented toward the exposed layer surface 11 of the patterning coating 110, thus presenting a low(er) surface energy surface to the deposited material 531.
  • an orientation of the second moiety that may comprise a low(er) surface tension component toward the exposed layer surface 11 of the patterning coating 110 may, in some non-limiting examples, provide increased deposition contrast against the deposition of the deposited material 531 on an exposed layer surface 11 of the device 100, so as to substantially preclude deposition of the deposited material 531 on the exposed layer surface 11 of the patterning coating 110, including without limitation, as at least one of a closed coating 140, and at least one particle structure 150.
  • At least one of the: orientation layer, and orientation material when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the orientation layer within the device 100, may have a surface energy of one of at least about: 30, 35, 50, 60, 70, 80, 100, 200, and 500, dynes/cm.
  • a compound of the patterning material 411 comprising the first moiety having a substantially high critical surface tension of one of at least about: 50, 70, 80, 100, 150, 180, 200, 250, and 300, dynes/cm, and a molecular weight of the first moiety of one of between about: 50-500, 60-400, 70-300, 80-250, and 80-200, g/mol, may have applicability for providing the patterning coating 110 that may exhibit an enhanced deposition contrast when deposited in conjunction with the orientation layer.
  • a size of the moiety (reflected by one of a: molecular weight thereof, and characteristic length attributable thereto) that may be at least that of these ranges may increase a likelihood of such moiety becoming exposed to, including without limitation, interacting with, a vapor flux 532 of the deposited material 531, which may, in some nonlimiting examples, reduce a resulting deposition contrast.
  • a size of the moiety within at least one of the above ranges may allow the first moiety to at least one of: exhibit a degree of interm olecular interaction with the orientation material, possess a degree of rigidity, and accommodate bonding of a plurality of second moieties therewith, and therefore may have applicability as a patterning coating 110 in at least some applications.
  • the orientation material may be one of a: metal, and metallic material.
  • the metallic material may comprise a pure metal.
  • the metallic material may comprise an alloy.
  • the metallic material may comprise oxygen (O).
  • the metallic material may comprise at least one metal and O.
  • the metallic material may comprise a metal oxide.
  • the metal oxide may comprise at least one of: Zn, indium (In), Sn, antimony (Sb), and gallium (Ga).
  • the metal oxide may be a transparent conducting oxide (TCO).
  • TCO transparent conducting oxide
  • the TCO may comprise at least one of: indium titanium oxide (ITO), ZnO, indium zinc oxide (IZO), fluorine tin oxide (FTO) and indium gallium zinc oxide (IGZO).
  • ITO indium titanium oxide
  • IZO indium zinc oxide
  • FTO fluorine tin oxide
  • IGZO indium gallium zinc oxide
  • the TCO may be electrically doped with other elements.
  • the metallic material may comprise at least one metal (alloy) and at least one metal oxide.
  • At least one of the: orientation layer, and orientation material in some non-limiting examples, when deposited as at least one of: a film, and a coating in a form, and under similar circumstances to the deposition of the orientation layer within the device 100, may be electrically conductive.
  • the metallic material may comprise an element selected from potassium (K), sodium (Na), lithium (Li), barium (Ba), cesium (Cs), Yb, Ag, gold (Au), Cu, aluminum (Al), magnesium (Mg), zinc (Zn), cadmium (Cd), tin (Sn), yttrium (Y), nickel (Ni), titanium (Ti), palladium (Pd), chromium (Cr), iron (Fe), cobalt (Co), zirconium (Zr), platinum (Pt), vanadium (V), niobium (Nb), iridium (Ir), osmium (Os), tantalum (Ta), molybdenum (Mo), and tungsten (W).
  • the orientation material may be a non- metallic material. In some non-limiting examples, the orientation material may be a semiconducting material. In some non-limiting examples, the orientation material may be an insulating material. In some non-limiting examples, the orientation material may be an organic material. In some non-limiting examples, the orientation material may be an inorganic material.
  • the orientation material may be silver (Ag), ytterbium (Yb), a magnesium-Ag alloy (MgAg), including without limitation, in a composition of about 1 :9 by volume, copper (Cu), fullerene, including without limitation Ceo, aluminum fluoride (AIF3), and molybdenum tri oxide (MoOs).
  • the metallic material may comprise other metals in place of / in combination with, Ag.
  • the metallic material may comprise an alloy of Ag with at least one other metal.
  • the metallic material may comprise an alloy of Ag with at least one of: Mg, and Yb.
  • such alloy may be a binary alloy having a composition from about 5 vol.% Ag to about 95 vol.% Ag, with the remainder being the other metal.
  • the metallic material may comprise Ag and Mg.
  • the metallic material may comprise an Ag:Mg alloy having a composition from about 1 : 10 to about 10: 1 by volume.
  • the metallic material may comprise Ag and Yb. In some non-limiting examples, the metallic material may comprise a Yb:Ag alloy having a composition from about 1 :20 to about 1-10: 1 by volume. In some non-limiting examples, the metallic material may comprise Mg and Yb. In some non-limiting examples, the metallic material may comprise an Mg: Yb alloy. In some non-limiting examples, the metallic material may comprise Ag, Mg, and Yb. In some non-limiting examples, the metallic material may comprise an Ag:Mg: Yb alloy. [00261] In some non-limiting examples, the orientation layer may comprise a plurality of layers of the metallic material.
  • the metallic material of a first one of the plurality of layers may be different from the metallic material of a second one of the plurality of layers.
  • the metallic material of the first one of the plurality of layers may comprise a metal and the metallic material of the second one of the plurality of layers may comprise a metal oxide.
  • the metallic material of at least one of the plurality of layers may comprise Yb.
  • the metallic material of one of the plurality of layers may comprise one of: an Ag-containing, an AgMg-containing, alloy, pure Ag, substantially pure Ag, pure Mg, and substantially pure Mg.
  • the orientation layer may be a bilayer Yb/AgMg coating.
  • a first one of the plurality of layers that is proximate to the patterning coating 110 may comprise an element selected from one of: Ag, Au, Cu, Al, Sn, Ni, Ti, Pd, Cr, Fe, Co, Zr, Pt, V, Nb, Ir, Os, Ta, Mo, and W.
  • the metallic material of at least one of the plurality of layers may comprise a metal having a work function that is no more than about 4 eV.
  • the orientation layer may comprise at least one additional element.
  • such additional element may be a non-metallic element, including without limitation, at least one of: O, sulfur (S), nitrogen (N), and carbon (C).
  • S sulfur
  • N nitrogen
  • C carbon
  • such additional element(s) may be incorporated into the orientation layer as a contaminant, due to the presence of such additional element(s) in at least one of: the source material, equipment used for deposition, and the vacuum chamber environment.
  • the concentration of such additional element(s) may be limited to be below a threshold concentration.
  • a concentration of the non-metallic element in the metallic material may be one of no more than about: 1%, 0.1%, 0.01%, 0.001%, 0.0001%, 0.00001%, 0.000001%, and 0.0000001%.
  • an interface between the patterning coating and the orientation layer may be substantially devoid of chemisorption.
  • At least one of the: patterning coating 110, and patterning material 411 may comprise at least one of: a fluorine (F) atom, and a silicon (Si) atom.
  • the patterning material 411 for forming the patterning coating 110 may be a compound that comprises at least one of: F and Si.
  • the patterning material 411 may comprise a compound that comprises F. In some non-limiting examples, the patterning material 411 may comprise a compound that comprises F and a carbon (C) atom. In some non-limiting examples, the patterning material 411 may comprise a compound that comprises F and C in an atomic ratio corresponding to a quotient of F/C of one of at least about: 0.5, 0.7, 1, 1.5, 2, and 2.5.
  • an atomic ratio of F to C may be determined by counting the F atoms present in the compound structure, and for C atoms, only counting the sp 3 hybridized C atoms present in the compound structure.
  • the patterning material 411 may comprise a compound that comprises, as part of its molecular sub-structure, a moiety comprising F and C in an atomic ratio corresponding to a quotient of F/C of one of at least about: 1, 1.5, and 2.
  • the patterning material 411 may comprise an organic-inorganic hybrid material.
  • the patterning material 411 may comprise an oligomer.
  • the patterning material 411 may comprise a compound having a molecular structure comprising a backbone and at least one functional group bonded to the backbone.
  • the backbone may be an inorganic moiety
  • the at least one functional group may be an organic moiety.
  • such compound may have a molecular structure comprising a siloxane group.
  • the siloxane group may be one of a: linear , branched, and cyclic, siloxane group.
  • the backbone may comprise a siloxane group.
  • the backbone may comprise a siloxane group and at least one functional group comprising F.
  • the at least one functional group comprising F may be a fluoroalkyl group.
  • such compound may comprise fluoro- siloxanes, including without limitation, Example Material 6 and Example Material 9 (discussed below).
  • the compound may have a molecular structure comprising a silsesquioxane group.
  • the silsesquioxane group may be a POSS.
  • the backbone may comprise a silsesquioxane group.
  • the backbone may comprise a silsesquioxane group and at least one functional group comprising F.
  • the at least one functional group comprising F may be a fluoroalkyl group.
  • such compound may comprise fluoro- silsesquioxane and fluoro-POSS, including without limitation, Example Material 8 (discussed below).
  • the compound may have a molecular structure comprising at least one of: a substituted aryl, an unsubstituted aryl, a substituted heteroaryl, and an unsubstituted heteroaryl, group.
  • the aryl group may be at least one of: phenyl, and naphthyl.
  • at least one C atom of an aryl group may be substituted by a heteroatom, which in some nonlimiting examples may be at least one of: O, N, and S, to derive a heteroaryl group.
  • the backbone may comprise at least one of: a substituted aryl, an unsubstituted aryl, a substituted heteroaryl, and an unsubstituted heteroaryl, group.
  • the backbone may comprise at least one of: a substituted aryl, an unsubstituted aryl, a substituted heteroaryl, and an unsubstituted heteroaryl, group and at least one functional group comprising F.
  • the at least one functional group comprising F may be a fluoroalkyl group.
  • the compound may have a molecular structure comprising at least one of: a substituted , an unsubstituted , a linear , a branched , and a cyclic, hydrocarbon group.
  • at least one C atom of the hydrocarbon group may be substituted by a heteroatom, including without limitation, at least one of: O, N, and S.
  • the compound may have a molecular structure comprising a phosphazene group.
  • the phosphazene group may be at least one of a: linear, branched, and cyclic, phosphazene group.
  • the backbone may comprise a phosphazene group.
  • the backbone may comprise a phosphazene group and at least one functional group comprising F.
  • the at least one functional group comprising F may be a fluoroalkyl group, including without limitation, a fluoro-phosphazene, including without limitation, Example Material 4 (discussed below).
  • the compound may be a fluoropolymer. In some non-limiting examples, the compound may be a block copolymer comprising F. In some non-limiting examples, the compound may be an oligomer. In some non-limiting examples, the oligomer may be a fluorooligomer. In some non-limiting examples, the compound may be a block oligomer comprising F. In some non-limiting examples, at least one of a: fluoropolymer, and fluorooligomer, may include those having the molecular structure of at least one of: Example Material 3, Example Material 5, and Example Material 7 (discussed herein).
  • the compound may be a metal complex.
  • the metal complex may be an organo-metal complex.
  • the organo-metal complex may comprise F.
  • the organo-metal complex may comprise at least one ligand comprising F.
  • the at least one ligand comprising F may comprise a fluoroalkyl group.
  • the patterning material 411 may comprise a plurality of different materials.
  • the initial sticking probability of the patterning material 411 may be determined by depositing such material as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, having sufficient thickness so as to mitigate / reduce any effects on the degree of inter-molecular interaction with the underlying layer 710 upon deposition on a surface thereof.
  • the initial sticking probability may be measured on a film / coating having a thickness of one of at least about: 20, 25, 30, 50, 60, and 100, nm.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, may have an initial sticking probability against the deposition of the deposited material 531, that is one of no more than about: 0.3, 0.2, 0.15, 0.1, 0.08, 0.05, 0.03, 0.02, 0.01, 0.008, 0.005, 0.003, 0.001, 0.0008, 0.0005, 0.0003, and 0.0001.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, may have an initial sticking probability against the deposition of at least one of: Ag, and Mg that is one of no more than about: 0.3, 0.2, 0.15, 0.1, 0.08, 0.05, 0.03, 0.02, 0.01, 0.008, 0.005, 0.003, 0.001, 0.0008, 0.0005, 0.0003, and 0.0001.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, may have an initial sticking probability against the deposition of a deposited material 531 of one of between about: 0.15-0.0001, 0.1-0.0003, 0.08-0.0005, 0.08-0.0008, 0.05-0.001, 0.03-0.0001, 0.03-0.0003, 0.03-0.0005, 0.03-0.0008, 0.03-0.001, 0.03-0.005, 0.03-0.008, 0.03-0.01, 0.02-0.0001, 0.02-0.0003, 0.02- 0.0005, 0.02-0.0008, 0.02-0.001, 0.02-0.005, 0.02-0.008, 0.02-0.01, 0.01-0.0001, 0.01- 0.0003, 0.01-0.0005, 0.01-0.0008, 0.01-0.001, 0.01-0.005, 0.01-0.008, 0.008-0.0001,
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, may have an initial sticking probability against the deposition of a plurality of deposited materials 531 that is no more than a threshold value.
  • a threshold value may be one of about: 0.3, 0.2, 0.18, 0.15, 0.13, 0.1, 0.08, 0.05, 0.03, 0.02, 0.01, 0.008, 0.005, 0.003, and 0.001.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, may have an initial sticking probability that is no more than such threshold value against the deposition of a plurality of deposited materials 531 selected from at least one of: Ag, Mg, Yb, Cd, and Zn.
  • the patterning coating 110 may exhibit an initial sticking probability of no more than such threshold value against the deposition of a plurality of deposited materials 531 selected from at least one of: Ag, Mg, and Yb.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, may exhibit an initial sticking probability against the deposition of a first deposited material 531 of, including without limitation, below, a first threshold value, and an initial sticking probability against the deposition of a second deposited material 531 of, including without limitation, below, a second threshold value.
  • the first deposited material 531 may be Ag
  • the second deposited material 531 may be Mg.
  • the first deposited material 531 may be Ag, and the second deposited material may be Yb. In some non-limiting examples, the first deposited material 531 may be Yb, and the second deposited material 531 may be Mg. In some non-limiting examples, the first threshold value may be at least that of the second threshold value.
  • the patterning coating 110 may exhibit a substantially low initial sticking probability such that a closed coating 140 of the deposited material 531 may be formed in the second portion 102, which may be substantially devoid of the patterning coating 110, while the discontinuous layer 160 of at least one particle structure 150 having at least one characteristic may be formed in the first portion 101 on the patterning coating 110.
  • a discontinuous layer 160 of at least one particle structure 150 of a deposited material 531 which may be, in some non-limiting examples, of a metal (alloy), in the first portion 101, while depositing a closed coating 140 of the deposited material 531 having a thickness of, without limitation, one of no more than about: 100, 50, 25, and 15, nm, in the second portion 102.
  • an amount of the deposited material 531 deposited as a discontinuous layer 160 of at least one particle structure 150 in the first portion 101 may correspond to one of between about: 1-50%, 2- 25%, 5-20%, and 7-10% of the amount of the deposited material 531 deposited as a closed coating 140 in the second portion 102, which in some non-limiting examples may correspond to a thickness of one of no more than about: 100, 75, 50, 25, and 15, nm.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may have a transmittance for EM radiation of at least a threshold transmittance value, after being subjected to a vapor flux 532 of the deposited material 531, including without limitation, Ag.
  • such transmittance may be measured after exposing the exposed layer surface 11 of at least one of: the patterning coating 110 and the patterning material 411, formed as a thin film, to a vapor flux 532 of the deposited material 531, including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, under typical conditions that may be used for depositing an electrode of an opto-electronic device 200, which in some non-limiting examples, may be a cathode of an organic light-emitting diode (OLED) device 200.
  • OLED organic light-emitting diode
  • the conditions for subjecting the exposed layer surface 11 to the vapor flux 532 of the deposited material 531 may comprise: maintaining a vacuum pressure at a reference pressure, including without limitation, of one of about: 10' 4 , and 10' 5 , Torr; the vapor flux 532 of the deposited material 531, including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, being substantially consistent with a reference deposition rate, including without limitation, of about 1 angstrom (A)/ sec, which in some non-limiting examples, may be monitored using a QCM; the vapor flux 532 of the deposited material 531 being directed toward the exposed layer surface 11 at an
  • the exposed layer surface 11 being subjected to the vapor flux 532 of the deposited material 531 including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, may be substantially at room temperature (e.g. about 25°C).
  • the exposed layer surface 11 being subjected to the vapor flux 532 of the deposited material 531 including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, may be positioned about 65 cm away from an evaporation source by which the deposited material 531, including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, is evaporated.
  • the threshold transmittance value may be measured at a wavelength in the visible spectrum, which may be one of at least about: 460, 500, 550, and 600, nm. In some non-limiting examples, the threshold transmittance value may be measured at a wavelength in at least one of the: IR, and NIR, spectrum. In some non-limiting examples, the threshold transmittance value may be measured at a wavelength of one of about: 700, 900, and 1,000, nm. In some non-limiting examples, the threshold transmittance value may be expressed as a percentage of incident EM power that may be transmitted through a sample. In some non-limiting examples, the threshold transmittance value may be one of at least about: 60%, 65%, 70%, 75%, 80%, 85%, and 90%.
  • high transmittance may generally indicate an absence of a closed coating 140 of the deposited material 531, including without limitation, at least one of: Yb, Ag, Mg, and Ag- containing materials, including without limitation, MgAg.
  • low transmittance may generally indicate presence of a closed coating 140 of the deposited material 531, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, since metallic thin films, particularly when formed as a closed coating 140, may exhibit a high degree of absorption of EM radiation.
  • a series of samples was fabricated to measure the transmittance of an example material, as well as to visually observe whether a closed coating 140 of Ag was formed on the exposed layer surface 11 of such example material.
  • Each sample was prepared by depositing, on a glass substrate 10, an approximately 50 nm thick coating of an example material, then subjecting the exposed layer surface 11 of the coating to a vapor flux 532 of Ag at a rate of about 1 A/sec until a reference layer thickness of about 15 nm was reached.
  • Each sample was then visually analyzed and the transmittance through each sample was measured.
  • samples having little to no deposited material 531 including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag- containing materials, including without limitation, MgAg, present thereon may be substantially transparent, while samples with substantial amounts of at least one of: a metal, and an alloy, deposited thereon, including without limitation, as a closed coating 140, may in some non-limiting examples, exhibit a substantially reduced transmittance.
  • the performance of various example coatings as a patterning coating 110 may be assessed by measuring transmittance through the samples, which may be inversely correlated to at least one of: an amount, and an average layer thickness, of the deposited material 531, including without limitation, at least one of: a metal, and an alloy, including without limitation, in the form of at least one of Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, being deposited thereon, since metallic thin films, including without limitation, when formed as a closed coating 140, may exhibit a high degree of absorption of EM radiation.
  • the materials used in the first 7 samples (HT211 to EM-2) and EM-9 in Tables 1 and 2 may have reduced applicability in some scenarios for inhibiting the deposition of the deposited material 531 thereon, including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg.
  • EM-3 to EM-8 may have applicability in some scenarios, to act as a patterning coating 110 for inhibiting the deposition of the deposited material 531 including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, thereon.
  • a material including without limitation, a patterning material 411, that may function as an NIC for a given at least one of: a metal, and an alloy, including without limitation, at least one of: Mg, Ag, and MgAg, may have a substantially high deposition contrast when deposited on a substrate 10.
  • a substrate 10 tends to act as a nucleationpromoting coating (NPC) 720 (FIG. 7A), and a portion thereof is coated with a material, including without limitation, a patterning material 411, that may tend to function as an NIC against deposition of a deposited material 531, including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag- containing materials, including without limitation, MgAg, a coated portion (first portion 101) and an uncoated portion (second portion 102) may tend to have different at least one of: initial sticking probabilities, and nucleation rates, such that the deposited material 531 deposited thereon may tend to have different average film thicknesses.
  • NPC nucleationpromoting coating
  • a quotient of an average film thickness of the deposited material 531 deposited in the second portion 102 divided by the average film thickness of the deposited material in the first portion 101 in such scenario may be generally referred to as a deposition contrast.
  • the average film thickness of the deposited material 531 in the second portion 102 may be substantially at least that of the average film thickness of the deposited material 531 in the first portion 101.
  • a material including without limitation, a patterning material 411, that may function as an NIC for a given deposited material 531, may have a substantially high deposition contrast when deposited on a substrate 10.
  • the deposition contrast is substantially high, there may be little to no deposited material 531 deposited in the first portion 101, when there is sufficient deposition of the deposited material 531 to form a closed coating 140 thereof in the second portion 102.
  • the deposition contrast is substantially low, there may be a discontinuous layer 160 of at least one particle structure 150 of the deposited material 531 deposited in the first portion 101, when there is sufficient deposition of the deposited material 531 to form a closed coating 140 in the second portion 102.
  • a discontinuous layer 160 of at least one particle structure 150 of the deposited material 531, in the first portion 101, when an average layer thickness of a closed coating 140 of the deposited material 531 in the second portion 102 is substantially small including without limitation, one of no more than about: 100, 50, 25, and 15, nm, including without limitation, the formation of nanoparticles (NPs) in the first portion 101, where absorption of EM radiation by such NPs is called for, including without limitation, to protect an underlying layer 710 from EM radiation having a wavelength of no more than about 460 nm.
  • NPs nanoparticles
  • a material including without limitation, a patterning material 411, having a substantially low deposition contrast against deposition of a deposited material 531, may have reduced applicability in some scenarios calling for substantially high deposition contrast, including without limitation, where the average layer thickness of the deposited material 531 in the first portion 101 is large, including without limitation, one of at least about: 95, 45, 20, 10, and 8, nm.
  • a material including without limitation, a patterning material 411, having a substantially low deposition contrast against deposition of a deposited material 531, may have reduced applicability in some scenarios calling for substantially high deposition contrast, including without limitation, scenarios calling for at least one of a: substantial absence of a closed coating 140, and high density of, particle structures 150 in the first portion 101, including without limitation, when an average layer thickness of the deposited material 531 in the second portion 102 is large, including without limitation, one of at least about: 95, 45, 20, 10, and 8, nm, including without limitation, in some scenarios calling for the substantial absence of absorption of EM radiation in at least one of the visible spectrum and the NIR spectrum, including without limitation, scenarios calling for an increased transparency to EM radiation having a wavelength that is at least about 460 nm.
  • a material including without limitation, a patterning material 411, having a substantially low deposition contrast against the deposition of a deposited material 531, may have applicability in some scenarios calling for at least one of: a discontinuous layer 160 of, and a low density of, particle structures 150 of the deposited material 531 in the first portion 101, when an average layer thickness of a closed coating 140 of the deposited material 531 in the second portion 102 is substantially high, including without limitation, one of at least about: 95, 45, 20, 10, and 8, nm.
  • a deposition contrast of one of between about: 2-100, 4-50, 5-20, and 10-15 may have applicability in some scenarios when an average layer thickness of the deposited material 531 in the second portion 102 is substantially high, including without limitation, one of at least about: 95, 45, 20, 10, and 8, nm.
  • a material including without limitation, a patterning material 411, may tend to have a substantially low deposition contrast if the initial sticking probability of such material against deposition of at least one of: a metal, and an alloy, including without limitation, at least one of: Mg, Ag, and MgAg, is substantially high.
  • a characteristic surface energy as used herein, in some non-limiting examples, with respect to a material, may generally refer to a surface energy determined from such material.
  • a characteristic surface energy may be measured from a surface formed by the material deposited (coated) in a thin film form.
  • a surface energy may be calculated (derived) based on a series of contact angle measurements, in which various liquids may be brought into contact with a surface of a solid to measure the contact angle between the liquid-vapor interface and the surface.
  • a surface energy of a solid surface may be equal to the surface tension of a liquid with the highest surface tension that completely wets the surface.
  • the critical surface tension of a surface may be determined according to the Zisman method, as further detailed in W. A. Zisman, Advances in Chemistry 43 (1964), pp. 1-51.
  • a characteristic surface energy of a material including without limitation, a patterning material 411, in a coating, including without limitation, a patterning coating 110, may be determined by depositing the material as a substantially pure coating (e.g. a coating formed by a substantially pure material) on a substrate 10 and measuring a contact angle thereof with an applicable series of probe liquids.
  • a substantially pure coating e.g. a coating formed by a substantially pure material
  • a Zisman plot may be used to determine a maximum value of surface tension that would result in complete wetting (i.e. a contact angle 0c of 0°) of the surface.
  • a material which has applicability for use in providing the patterning coating 110 may generally have a low surface energy when deposited as a thin film (coating) on a surface.
  • a material with a low surface energy may exhibit low intermolecular forces.
  • a material with a substantially high surface energy may have applicability at least in some applications that call for a high temperature reliability.
  • a patterning coating 110 comprising a material which, when deposited as a thin film, exhibits a substantially high surface energy, may, in some non-limiting examples, form a discontinuous layer 160 of at least one particle structure 150 of a deposited material 531 in the first portion 101, and a closed coating 140 of the deposited material 531 in the second portion 102, including without limitation, in cases where the thickness of the closed coating is, in some non-limiting examples, one of no more than about: 100, 75, 50, 25, and 15, nm.
  • a patterning coating 110 which in some non-limiting examples, may be those having a critical surface tension of one of between about: 13-20, and 13-19, dynes/cm, may have applicability for forming the patterning coating 110 to inhibit deposition of a deposited material 531 thereon, including without limitation, at least one of Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg.
  • materials that form a surface having a surface energy lower than, in some non-limiting examples, about 13 dynes/cm may have reduced applicability as a patterning material 411 in some scenarios, as such materials may exhibit at least one of: substantially poor adhesion to layer(s) surrounding such materials, a low melting point, and a low sublimation temperature.
  • a material including without limitation, a patterning material 411, may tend to exhibit a substantially low surface energy when deposited as a thin film (coating) on an exposed layer surface 11.
  • a material, including without limitation, a patterning material 411, with a substantially low surface energy may tend to exhibit substantially low inter-molecular forces.
  • a material including without limitation, a patterning material 411, with a substantially high surface energy may have applicability for some scenarios to detect a film of such material using optical techniques.
  • a material including without limitation, a patterning material 411, having a substantially high surface energy may have applicability for some scenarios that call for substantially high temperature reliability.
  • a material including without limitation, a patterning material 411, that may function as an NIC for at least one of a metal, and an alloy, including without limitation, at least one of Mg, Ag, and Ag-containing materials, including without limitation, MgAg, having a substantially high surface energy may have applicability in some scenarios calling for a discontinuous layer 160 of particle structures 150 of at least one of the metal, and the alloy, in the first portion 101, when an average layer thickness of a continuous coating 140 of at least one of the metal, and the alloy, in the second portion 102 is substantially low, including without limitation, one of no more than about: 100, 50, 25, and 15, nm.
  • a material including without limitation, a patterning material 411, that may function as an NIC for a deposited material 531, including without limitation, at least one of a metal, and an alloy, including without limitation, at least one of Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, having a substantially low surface energy may have applicability in some scenarios calling for one of a discontinuous layer 160 of, and a low density of, particle structures 150 of the deposited material 531 in the first portion 101, when an average layer thickness of a closed coating 140 of the deposited material 531 in the second portion 102 is substantially high, including without limitation, one of at least about: 95, 45, 20, 10, and 8, nm.
  • the surface of at least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, comprising the compounds described herein, may exhibit a surface energy of one of no more than about: 24, 22, 20, 18, 16, 15, 13, 12, and 11, dynes/cm.
  • the surface energy values in various nonlimiting examples herein may correspond to such values measured at around normal temperature and pressure (NTP), which may correspond to a temperature of 20°C, and an absolute pressure of 1 atm.
  • NTP normal temperature and pressure
  • the surface energy may be one of at least about: 6, 7, and 8, dynes/cm.
  • the surface energy may be one of between about: 10-20, and 13-19, dynes/cm.
  • a material including without limitation, a patterning material 411, having substantially low inter-molecular forces may tend to exhibit a substantially low sublimation temperature.
  • a material including without limitation, a patterning material 411, having a substantially low sublimation temperature, may have reduced applicability for manufacturing processes that may call for substantially precise control of an average layer thickness in a deposited film of the material.
  • a material including without limitation, a patterning material 411, having a substantially high sublimation temperature may have applicability in some scenarios calling for substantially high precision in the control of the average layer thickness of a film comprising such material.
  • the patterning material may have a sublimation temperature of one of between about: 100-320°C, 120-300°C, 140-280°C, and 150-250°C. In some non-limiting examples, such sublimation temperature may allow the patterning material 411 to be substantially readily deposited as a coating using PVD.
  • a material with substantially low intermolecular forces may exhibit a substantially low sublimation temperature.
  • a material including without limitation, a patterning material 411, having a substantially low sublimation temperature, may have reduced applicability for manufacturing processes that may call for substantially precise control of an average layer thickness of a closed coating 140 of the material.
  • a material including without limitation, a patterning material 411, having a sublimation temperature that is one of no more than about: 140°C, 120°C, 110°C, 100°C and 90°C, may tend to encounter constraints on at least one of: the deposition rate and the average layer thickness, of a film comprising such material that may be deposited using known deposition methods, including without limitation, vacuum thermal evaporation.
  • a material including without limitation, a patterning material 411, having a substantially high sublimation temperature may have applicability in some scenarios calling for substantially high precision in the control of the average layer thickness of a film comprising such material.
  • the sublimation temperature of a material may be determined using various methods apparent to those having ordinary skill in the relevant art, including without limitation, by heating the material in an evaporation source under a substantially high vacuum environment, in some non-limiting examples, about 10' 4 Torr, and including without limitation, in a crucible and by determining a temperature that may be attained, to at least one of:
  • the QCM may be mounted about 65 cm away from the crucible for the purpose of determining the sublimation temperature.
  • the patterning material 411 may have a sublimation temperature of one of between about: 100-320°C, 100-300°C, 120-300°C, 100- 250°C, 140-280°C, 120-230°C, 130-220°C, 140-210°C, 140- 200°C, 150-250°C, and 140- 190°C.
  • a material including without limitation, a patterning material 411, with substantially low inter-molecular forces may tend to exhibit a substantially low melting point.
  • a material including without limitation, a patterning material 411, having a substantially low melting point may have reduced applicability in some scenarios calling for substantial temperature reliability for temperatures of one of no more than about: 60°C, 80°C, and 100°C, in some non-limiting examples, because of changes in physical properties of such material at operating temperatures that approach the melting point.
  • a material with a melting point of about 120°C may have increased applicability in some scenarios calling for substantially high temperature reliability, including without limitation, of at least about: 100 °C.
  • a material including without limitation, a patterning material 411, having a substantially high melting point may have applicability in some scenarios calling for substantially high temperature reliability.
  • at least one of: the patterning coating 110 and the compound thereof may have a melting temperature that is one of at least about: 90°C, 100°C, 110°C, 120°C, 140°C, 150°C, and 180°C.
  • the cohesion energy of a material may tend to be proportional to its melting temperature (cf. Nanda, K.K., Sahu, S.N, and Behera, S.N (2002), “Liquid-drop model for the size-dependent melting of low-dimensional systems” Phys. Rev. A. 66 (1): 013208).
  • a material including without limitation, a patterning material 411, having substantially low inter-molecular forces may tend to exhibit a substantially low cohesion energy.
  • a material, including without limitation, a patterning material 411, having a substantially low cohesion energy may have reduced applicability in some scenarios that call for substantial fracture toughness, including without limitation, in a device 100 that may tend to undergo at least one of: sheer, and bending, stress during at least one of: manufacture, and use, as such material may tend to crack (fracture) in such scenarios.
  • a material, including without limitation, a patterning material 411, having a cohesion energy of no more than about 30 dynes/cm may have reduced applicability in some scenarios in a device 100 manufactured on a flexible substrate 10.
  • a material including without limitation, a patterning material 411, that has a substantially high cohesion energy, may have applicability in some scenarios calling for substantially high reliability under at least one of: sheer, and bending, stress, including without limitation, a device 100 manufactured on a flexible substrate 10.
  • a material including without limitation, a patterning material 411, having a surface energy that is substantially low but is not unduly low may have applicability in some scenarios that call for substantial reliability under at least one of: sheer, and bending, stress, including without limitation, a device 100 manufactured on a flexible substrate 10.
  • a semiconductor material may be described as a material that generally exhibits a band gap.
  • the band gap may be formed between a highest occupied molecular orbital (HOMO) and a lowest unoccupied molecular orbital (LUMO) of the semiconductor material.
  • Semiconductor materials may thus tend to exhibit electrical conductivity that is substantially no more than that of a conductive material (including without limitation, at least one of: a metal, and an alloy), but that is substantially at least as great as an insulating material (including without limitation, glass).
  • the semiconductor material may comprise an organic semiconductor material.
  • the semiconductor material may comprise an inorganic semiconductor material.
  • an optical gap of a material may tend to correspond to the H0M0-LUM0 gap of the material.
  • a material including without limitation, a patterning material 411, having a substantially large / wide optical (H0M0-LUM0 gap) may tend to exhibit substantially weak, including without limitation, substantially no, photoluminescence in at least one of: the deep B(lue) region of the visible spectrum, the near UV spectrum, the visible spectrum, and the NIR spectrum.
  • a material having a substantially small H0M0-LUM0 gap may have applicability in some scenarios to detect a film of the material using optical techniques.
  • an optical gap of the patterning material 411 may be wider than a photon energy of the EM radiation emitted by the source, such that the patterning material 411 does not undergo photoexcitation when subjected to such EM radiation.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may have a low refractive index.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may have a refractive index for EM radiation at a wavelength of 550 nm that may be one of no more than about: 1.55, 1.5, 1.45, 1.43, 1.4, 1.39, 1.37, 1.35, 1.32, and 1.3.
  • the refractive index, of the patterning coating 110 may be no more than about 1.7. In some non-limiting examples, the refractive index of the patterning coating 110 may be one of no more than about: 1.6, 1.5, 1.4, and 1.3. In some non-limiting examples, the refractive index of the patterning coating 110 may be one of between about: 1.2-1.6, 1.2-1.5, and 1.25-1.45.
  • the patterning coating 110 exhibiting a substantially low refractive index may have application in some scenarios, to enhance at least one of: the optical properties, and performance, of the device 100, including without limitation, by enhancing outcoupling of EM radiation emitted by the opto-electronic device 200.
  • providing the patterning coating 110 having a substantially low refractive index may, at least in some devices 100, enhance transmission of external EM radiation through the second portion 102 thereof.
  • devices 100 including an air gap therein, which may be arranged near to the patterning coating 110 may exhibit a substantially high transmittance when the patterning coating 110 has a substantially low refractive index relative to a similarly configured device 100 in which such low-index patterning coating 110 was not provided.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may have a low refractive index.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may have a refractive index for EM radiation at a wavelength of 550 nm that may be one of no more than about: 1.55, 1.5, 1.45, 1.43, 1.4, 1.39, 1.37, 1.35, 1.32, and 1.3.
  • the patterning coating 110 may be at least one of: substantially transparent, and EM radiation-transmissive.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under similar circumstances to the deposition of the patterning coating 110 within the device 100, may have an extinction coefficient that may be no more than about 0.01 for photons at a wavelength that is one of at least about: 600, 500, 460, 420, and 410, nm.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may have an extinction coefficient that may be one of at least about: 0.05, 0.1, 0.2, and 0.5 for EM radiation at a wavelength that is one of no more than about: 400, 390, 380, and 370, nm.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may absorb EM radiation in the UVA spectrum incident upon the device 100, thereby reducing a likelihood that EM radiation in the UVA spectrum may impart constraints in terms of at least one of: device performance, device stability, device reliability, and device lifetime.
  • the patterning coating 110 may exhibit an extinction coefficient of one of no more than about: 0.1, 0.08, 0.05, 0.03, and 0.01 in the visible light spectrum.
  • photoluminescence of at least one of: a coating, and a material may be observed through a photoexcitation process.
  • a photoexcitation process at least one of: the coating, and the material, may be subjected to EM radiation emitted by a source, including without limitation, a UV lamp.
  • the electrons thereof may be temporarily excited.
  • at least one relaxation process may occur, including without limitation, at least one of: fluorescence and phosphorescence, in which EM radiation may be emitted from at least one of: the coating, and the material.
  • the EM radiation emitted from at least one of: the coating, and the material, during such process may be detected, for example, by a photodetector, to characterize the photoluminescence properties of at least one of: the coating, and the material.
  • a wavelength of photoluminescence in relation to at least one of: the coating, and the material, may generally refer to a wavelength of EM radiation emitted by such at least one of: the coating, and the material, as a result of relaxation of electrons from an excited state.
  • a wavelength of light emitted by at least one of: the coating, and the material, as a result of the photoexcitation process may, in some non-limiting examples, be longer than a wavelength of radiation used to initiate photoexcitation.
  • Photoluminescence may be detected using various techniques known in the art, including, without limitation, fluorescence microscopy.
  • the optical gap of the various coatings / materials may correspond to an energy gap of the coating / material from which EM radiation is one of: absorbed, and emitted, during the photoexcitation process.
  • photoluminescence may be detected by subjecting the coating / material to EM radiation having a wavelength corresponding to the UV spectrum, such as in some non-limiting examples, one of: UVA, and UVB.
  • EM radiation for causing photoexcitation may have a wavelength of about 365 nm.
  • the patterning material 411 may not substantially exhibit photoluminescence at any wavelength corresponding to the visible spectrum. [00388] In some non-limiting examples, the patterning material 411 may not exhibit photoluminescence upon being subjected to EM radiation having a wavelength of one of at least about: 300, 320, 350, and 365, nm.
  • At least one of: the coating, and the material, that is photolumine scent may be one that exhibits photoluminescence at a wavelength when irradiated with an excitation radiation at a certain wavelength.
  • at least one of: the coating, and the material, that is photoluminescent may exhibit photoluminescence at a wavelength that is at least about 365 nm, which is a wavelength of the radiation source frequently used in fluorescence microscopy, upon being irradiated with an excitation radiation having a wavelength of 365 nm.
  • At least one of: the coating, and the material, that is photoluminescent may be detected on a substrate 10 using standard optical techniques including without limitation, fluorescence microscopy, which may establish the presence of such at least one of the: coating, and material.
  • a coating including without limitation, a patterning coating 110, may exhibit photoluminescence, including without limitation, by comprising a material that exhibits photoluminescence.
  • the presence of such patterning coating 110 may be detected (observed) using routine characterization techniques such as fluorescence microscopy upon deposition of the patterning coating 110.
  • a coating including without limitation, a patterning coating 110, may exhibit photoluminescence at a wavelength corresponding to at least one of the: UV, and visible, spectrum, including without limitation, by comprising a material that exhibits photoluminescence.
  • photoluminescence may occur at a wavelength (range) corresponding to the UV spectrum, including, without limitation, one of the: UVA, and UVB, spectrum.
  • photoluminescence may occur at a wavelength (range) corresponding to the visible spectrum.
  • photoluminescence may occur at a wavelength (range) corresponding to one of: deep B(lue) and near UV.
  • At least one of the materials of the patterning coating 110 that may exhibit photoluminescence may comprise at least one of: a conjugated bond, an aryl moiety, a donor-acceptor group, and a heavy metal complex.
  • a coating including without limitation, a patterning coating 110, comprised of a material, including without limitation, a patterning material 411, having substantially weak to no photoluminescence (absorption) in a wavelength range of one of at least about: 365, and 460, nm, may tend to not act as one of: a photolumine scent, and an absorbing, coating and may have applicability in some scenarios calling for substantially high transparency in at least one of the: visible, and NIR, spectrum.
  • such material may tend to exhibit substantially low photoluminescence upon being subjected to EM radiation having a wavelength of about 365 nm, which is a wavelength of the radiation source frequently used in fluorescence microscopy.
  • EM radiation having a wavelength of about 365 nm, which is a wavelength of the radiation source frequently used in fluorescence microscopy.
  • the presence of such materials, including without limitation, a patterning material 411, especially when deposited, in some non-limiting examples, as a thin film, may have reduced applicability in some scenarios calling for typical optical detection techniques, including without limitation, fluorescence microscopy.
  • a material with substantially low to no absorption at a wavelength that is one of at least about: 365, and 460, nm may have applicability in some scenarios calling for substantially high transparency in at least one of the: visible, and NIR, spectrum.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may not substantially attenuate EM radiation passing therethrough, in at least the visible spectrum.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may not substantially attenuate EM radiation passing therethrough, in at least one of: the IR spectrum, and the NIR spectrum.
  • At least one of the: patterning coating 110, and patterning material 411 when deposited as at least one of a: film, and coating, in a form, and under circumstances similar to the deposition of the patterning coating 110 within the device 100, may absorb EM radiation in the UVA spectrum incident upon the device 100, thereby reducing a likelihood that EM radiation in the UVA spectrum may impart constraints in terms of at least one of: device performance, device stability, device reliability, and device lifetime.
  • the patterning coating 110 may act as an optical coating.
  • the patterning coating 110 may modify at least one of: at least one property, and at least one characteristic, of EM radiation (including without limitation, in the form of photons) emitted by the device 100.
  • the patterning coating 110 may exhibit a degree of haze, causing emitted EM radiation to be scattered.
  • the patterning coating 110 may comprise a crystalline material for causing EM radiation transmitted therethrough to be scattered. Such scattering of EM radiation may facilitate enhancement of the outcoupling of EM radiation from the device 100 in some non-limiting examples.
  • the patterning coating 110 may initially be deposited as a substantially noncrystalline, including without limitation, substantially amorphous, coating, whereupon, after deposition thereof, the patterning coating 110 may become crystallized and thereafter serve as an optical coupling.
  • the patterning material 411 may exhibit insignificant, including without limitation, no detectable, absorption when subjected to EM radiation having a wavelength of one of at least about: 300, 320, 350, and 365, nm.
  • the patterning coating 110 may not exhibit any substantial EM radiation absorption at any wavelength corresponding to the visible spectrum.
  • an average layer thickness of the patterning coating 110 may be one of no more than about: 10, 8, 7, 6, and 5, nm.
  • the molecular weight of such compounds may be one of between about: 800-3,000, 900-2,000, 900-1,800, and 900- 1,600, g/mol.
  • the molecular weight of the compound of the at least one patterning material 411 may be no more than about 5,000 g/mol. In some nonlimiting examples, the molecular weight of the compound may be one of no more than about: 4,500, 4,000, 3,800, and 3,500, g/mol.
  • the molecular weight of the compound of the at least one patterning material 411 may be at least about 800 g/mol. In some non-limiting examples, the molecular weight of the compound may be one of at least about: 1,500, 1,700, 2,000, 2,200, and 2,500, g/mol.
  • the molecular weight of the compound of the at least one patterning material 411 may be one of between about: 800-3,000, 900-2,000, 900-1,800, and 900-1,600, g/mol.
  • a percentage of the molar weight of such compound including without limitation, of the at least one patterning material 411, that may be attributable to the presence of F atoms, may be one of between about: 40-90%, 45- 85%, 50-80%, 55-75%, and 60-75%. In some non-limiting examples, F atoms may constitute a majority of the molar weight of such compound.
  • exposed layer surfaces 11 exhibiting low initial sticking probability with respect to the deposited material 531 including without limitation, at least one of: a metal, and an alloy, including without limitation, Yb, Ag, Mg, and an Ag-containing material, including without limitation, MgAg, may exhibit high transmittance.
  • exposed layer surfaces 11 exhibiting high sticking probability with respect to the deposited material 531 including without limitation, at least one of: a metal, and an alloy, including without limitation, Yb, Ag, Mg, and an Ag- containing material, including without limitation, MgAg, may exhibit low transmittance.
  • a material including without limitation, a patterning material 411, may tend to have a substantially high initial sticking probability against deposition of a deposited material, including without limitation, at least one of: a metal, and an alloy, including without limitation, at least one of: Yb, Ag, Mg, and an Ag- containing material, including without limitation, MgAg, if the material has a substantially high surface energy.
  • a patterning material 411 that has a substantially low surface tension that is not unduly low may have applicability in some scenarios calling for a substantially high melting point, including without limitation, between about 15-22 dynes/cm.
  • a material including without limitation, a patterning material 411, having a surface tension that is substantially low, but not unduly low, may have applicability in some scenarios that call for a substantially high sublimation temperature.
  • a coating including without limitation, a patterning coating 110, comprised of a material, including without limitation, a patterning material 411, having a substantially low surface energy and a substantially high sublimation temperature may have application in some scenarios calling for substantially high precision in the control of the average layer thickness of a film comprising such material.
  • materials that form an exposed layer surface 11 having a surface energy of no more than, in some non-limiting examples, about 13 dynes/cm may have reduced applicability as a patterning material 411 in some scenarios, as such materials may exhibit at least one of: substantially low adhesion to layer(s) surrounding such materials, a substantially low melting point, and a substantially low sublimation temperature.
  • a patterning coating 110 having a substantially low surface energy and a substantially high melting point may have applicability in some scenarios calling for high temperature reliability.
  • there may be challenges in achieving such a combination from a single material given that in some non-limiting examples, a single material having a low surface energy may tend to exhibit a low melting point.
  • such compounds may exhibit at least one property that may have applicability in some scenarios for forming at least one of a coating, and layer, having at least one of a substantially high melting point, in some non-limiting examples, of at least 100°C, a substantially low surface energy, and a substantially amorphous structure, when deposited, in some non-limiting examples, using vacuum-based thermal evaporation processes.
  • a coating including without limitation, a patterning coating 110, having a substantially low surface energy, a substantially high cohesion energy, and a substantially high melting point may have applicability in some scenarios that call for substantially high reliability under various conditions.
  • there may be challenges in achieving such a combination from a single material given that, in some non-limiting examples, a unitary material having a substantially low surface energy may tend to exhibit a substantially low cohesion energy and a substantially low melting point.
  • a material including without limitation, a patterning material 411, having a substantially low surface energy and a substantially high cohesion energy may have applicability in some scenarios that call for substantially high reliability under at least one of sheer, and bending, stress.
  • there may be challenges in achieving such a combination from a single material given that, in some non-limiting examples, a thin film formed substantially of a single material having a substantially low surface energy may tend to exhibit a substantially low cohesion energy.
  • a material including without limitation, a patterning material 411, having a substantially low surface energy may tend to exhibit at least one of a substantially large, and substantially wide, optical gap.
  • the optical gap of a material including without limitation, a patterning material 411, may tend to correspond to the H0M0-LUM0 gap of the material.
  • a material with a low surface energy may exhibit at least one of a large, and wide, optical gap which, in some non-limiting examples, may correspond to the H0M0-LUM0 gap of the material.
  • a patterning coating 110 formed by a compound exhibiting a substantially low surface energy may also exhibit a substantially low refractive index.
  • At least one of the: patterning coating 110, and patterning material 411 may exhibit a surface energy of no more than about 25 dynes/cm and a refractive index of no more than about 1.45. In some non-limiting examples, at least one of the: patterning coating 110, and patterning material 411, may comprise a material exhibiting a surface energy of no more than about 20 dynes/cm and a refractive index of no more than about 1.4.
  • a material including without limitation, a patterning material 411, having a substantially low surface energy may have applicability in some scenarios calling for substantially weak to no, at least one of: photoluminescence, and absorption, in a wavelength range that is one of at least about: 365, and 460, nm.
  • a material including without limitation, a patterning material 411, having at least one of a substantially: large, and wide, optical (and H0M0-LUM0) gap may tend to exhibit a substantially weak to no photoluminescence in at least one of the: deep B(lue) region of the visible, near UV, visible, and NIR, spectrum.
  • the molecular weight of such compounds may be one of between about: 1,500-5,000, 1,500-4,500, 1,700-4,500, 2,000- 4,000, 2,200-4,000, and 2,500-3,800, g/mol.
  • At least some materials with at least one of: one of a: large, and wide, optical, and H0M0-LUM0, gap may exhibit substantially weak to no photoluminescence in at least one of the: visible (including without limitation, the deep B(lue) region thereof), and near UV, spectrum.
  • a material with a substantially small H0M0-LUM0 gap may have applicability in applications to detect a film of the material using optical techniques.
  • a material with a substantially high surface energy may have applicability for applications to detect of a film of the material using optical techniques.
  • a material having a substantially large HOMO-LUMO gap may have applicability in some scenarios calling for weak to no at least one of: photoluminescence, and absorption, in a wavelength range of one of at least about: 365, and 460, nm.
  • the patterning coating 110 may exhibit, including without limitation, because of at least one of the: patterning material 411 used, and deposition environment, at least one nucleation site for the deposited material 531.
  • such other material may comprise an organic material, in some non-limiting examples, at least one of a: polycyclic aromatic compound, and material comprising a non-metallic element, including without limitation, at least one of: O, S, N, and C, whose presence might otherwise be a contaminant in at least one of the: source material, equipment used for deposition, and vacuum chamber environment.
  • such other material may be deposited in a layer thickness that is a fraction of a monolayer, to avoid forming a closed coating 140 thereof. Rather, the monomers of such other material may tend to be spaced apart in the lateral aspect so as form discrete nucleation sites for the deposited material.
  • forming a patterning coating 110 of a single patterning material 411 against the deposition of a deposited material 531 including without limitation, at least one of a given: metal, and alloy, including without limitation, at least one of: Yb, Ag, Mg, and Ag-containing materials, including without limitation, MgAg, that satisfied constraints of at least one material property selected from at least one of: initial sticking probability, transmittance, deposition contrast, surface energy, glass transition temperature, melting point, sublimation temperature, evaporation temperature, cohesion energy, optical gap, photoluminescence, refractive index, extinction coefficient, absorption, other optical effect, average layer thickness, molecular weight, and composition, for a given scenario, may impose challenges, given the substantially complex interrelationships between the various material properties.
  • the patterning coating 110 may comprise a plurality of materials. In some non-limiting examples, the patterning coating 110 may comprise a first material and a second material.
  • At least one of the plurality of materials of the patterning coating 110 may serve as an NIC when deposited as a thin film.
  • At least one of the plurality of materials of the patterning coating 110 may serve as an NIC when deposited as a thin film, and another material thereof may form an NPC 720 when deposited as a thin film.
  • the first material may form an NPC 720 when deposited as a thin film
  • the second material may form an NIC when deposited as a thin film.
  • the presence of the first material in the patterning coating 110 may result in an increased initial sticking probability thereof compared to cases in which the patterning coating 110 is formed of the second material and is substantially devoid of the first material.
  • At least one of the materials of the patterning coating 110 may be adapted to form a surface having a low surface energy when deposited as a thin film.
  • the first material, when deposited as a thin film may be adapted to form a surface having a lower surface energy than a surface provided by a thin film comprising the second material.
  • the patterning coating 110 may exhibit photoluminescence, including without limitation, by comprising a material which exhibits photoluminescence.
  • the first material may exhibit photoluminescence at a wavelength corresponding to the visible spectrum
  • the second material may not exhibit substantial photoluminescence at any wavelength corresponding to the visible spectrum
  • the second material may not substantially exhibit photoluminescence at any wavelength corresponding to the visible spectrum. In some non-limiting examples, the second material may not exhibit photoluminescence upon being subjected to EM radiation having a wavelength of one of at least about: 300, 320, 350, and 365, nm. In some non-limiting examples, the second material may exhibit insignificant to no detectable absorption when subjected to such EM radiation.
  • the second optical gap of the second material may be wider than the photon energy of the EM radiation emitted by the source, such that the second material does not undergo photoexcitation when subjected to such EM radiation.
  • the patterning coating 110 comprising such second material may nevertheless exhibit photoluminescence upon being subjected to EM radiation due to the first material exhibiting photoluminescence.
  • the presence of the patterning coating 110 may be detected using routine characterization techniques such as fluorescence microscopy upon deposition of the patterning coating 110.
  • the first material may have a first optical gap
  • the second material may have a second optical gap.
  • the second optical gap may be at least that of the first optical gap.
  • a difference between the first optical gap and the second optical gap may be one of at least about: 0.3, 0.5, 0.7, 1, 1.3, 1.5, 1.7, 2, 2.5, and 3, eV.
  • the first optical gap may be one of no more than about: 4.1, 3.5, and 3.4, eV.
  • the second optical gap may be one of at least about: 3.4, 3.5, 4.1, 5, and 6.2, eV.
  • At least one of the: first, and second, optical gap may correspond to the H0M0-LUM0 gap.
  • an optical gap of at least one of: the various coatings, and materials may correspond to an energy gap of at least one of the: coating, and material, from which EM radiation is at least one of: absorbed, and emitted, during the photoexcitation process.
  • a concentration, including without limitation by weight, of the first material in the patterning coating 110 may be no more than that of the second material in the patterning coating 110.
  • the patterning coating 110 may comprise one of at least about: 0.1 0.2, 0.5, 0.8, 1, 3, 5, 8, 10, 15, and 20, wt.%, of the first material.
  • the patterning coating 110 may comprise one of no more than about: 50, 40, 30, 25, 20, 15, 10, 8, 5, 3, and 1, wt.%, of the first material.
  • a remainder of the patterning coating 110 may be substantially comprised of the second material.
  • the patterning coating 110 may comprise additional materials, including without limitation, at least one of a: third, and fourth, material.
  • At least one of the materials of the patterning coating 110 may comprise at least one of: F, and Si.
  • at least one of the: first, and second, material may comprise at least one of: F, and Si.
  • the first material may comprise at least one of: F, and Si
  • the second material may comprise at least one of: F, and Si.
  • the first material and the second material both may comprise F.
  • the first material and the second material both may comprise Si.
  • each of the: first and second, material may comprise at least one of: F, and Si.
  • At least one of the: first and second, material may comprise both F and Si. In some non-limiting examples, one of the: first and second, material, may not comprise at least one of: F, and Si. In some non-limiting examples, the second material may comprise at least one of: F, and Si, and the first material may not comprise at least one of: F, and Si.
  • At least one of the materials of the patterning coating 110 may comprise F, and at least one of the other materials of the patterning coating 110 may comprise a sp 2 C.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise F, and at least one of the other materials of the patterning coating 110 may comprise a sp 3 C.
  • At least one of the materials of the patterning coating 110 may comprise F and a sp 3 C, and at least one of the other materials of the patterning coating 110 may comprise a sp 2 C.
  • at least one of the materials of the patterning coating 110 may comprise F and a sp 3 C wherein all F bonded to a C may be bonded to a sp 3 C, and at least one of the other materials of the patterning coating 110 may comprise a sp 2 C.
  • At least one of the materials of the patterning coating 110 may comprise F and a sp 3 C wherein all F bonded to C may be bonded to an sp 3 C, and at least one of the other materials of the patterning coating 110 may comprise a sp 2 C and may not comprise F.
  • “at least one of the materials of the patterning coating 110” may correspond to the second material, and the “at least one of the other materials of the patterning coating 110” may correspond to the first material.
  • XPS X-ray Photoelectron Spectroscopy
  • At least one of the materials of the patterning coating 110 may comprise F, and at least one of the other materials of the patterning coating 110 may comprise an aromatic hydrocarbon moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise F, and at least one of the materials of the patterning coating 110 may not comprise an aromatic hydrocarbon moiety.
  • At least one of the materials of the patterning coating 110 may comprise F and may not comprise an aromatic hydrocarbon moiety, and at least one of the other materials of the patterning coating 110 may comprise an aromatic hydrocarbon moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise F and may not comprise an aromatic hydrocarbon moiety, and at least one of the other materials of the patterning coating 110 may comprise an aromatic hydrocarbon moiety and may not comprise F.
  • the aromatic hydrocarbon moiety may include at least one of: a substituted polycyclic aromatic hydrocarbon, an unsubstituted polycyclic aromatic hydrocarbon, a substituted phenyl, and an unsubstituted phenyl, moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise F, and at least one of the other materials of the patterning coating 110 may comprise a polycyclic aromatic hydrocarbon moiety.
  • At least one of the materials of the patterning coating 110 may comprise F, and at least one of the materials of the patterning coating 110 may not comprise a polycyclic aromatic hydrocarbon moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise F and may not comprise a polycyclic aromatic hydrocarbon moiety, and at least one of the other materials of the patterning coating 110 may comprise a polycyclic aromatic hydrocarbon moiety.
  • At least one of the materials of the patterning coating 110 may comprise F and may not comprise a polycyclic aromatic hydrocarbon moiety, and at least one of the other materials of the patterning coating 110 may comprise a polycyclic aromatic hydrocarbon moiety and may not comprise F.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety, and at least one of the other materials of the patterning coating 110 may comprise a polycyclic aromatic hydrocarbon moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise at least one of a: fluorocarbon, and siloxane, moiety, and at least one of the materials of the patterning coating 110 may not comprise a polycyclic aromatic hydrocarbon moiety.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety, and may not comprise a polycyclic aromatic hydrocarbon moiety, and at least one of the other materials of the patterning coating 110 may comprise a polycyclic aromatic hydrocarbon moiety.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety, and may not comprise a polycyclic aromatic hydrocarbon moiety, and at least one of the other materials of the patterning coating 110 may comprise a polycyclic aromatic hydrocarbon moiety and may not comprise at least one of a: fluorocarbon, and siloxane, moiety.
  • At least one of the materials of the patterning coating 110 may comprise F, and at least one of the other materials of the patterning coating 110 may comprise a phenyl moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise F, and at least one of the materials of the patterning coating 110 may not comprise a phenyl moiety.
  • At least one of the materials of the patterning coating 110 may comprise F and may not comprise a phenyl moiety, and at least one of the other materials of the patterning coating 110 may comprise a phenyl moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise F and may not comprise a phenyl moiety, and at least one of the other materials of the patterning coating 110 may comprise a phenyl moiety and may not comprise F.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety, and at least one of the other materials of the patterning coating 110 may comprise a phenyl moiety.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise at least one of a: fluorocarbon, and siloxane, moiety, and at least one of the materials of the patterning coating 110 may not comprise a phenyl moiety.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety and may not comprise a phenyl moiety, and at least one of the other materials of the patterning coating 110 may comprise a phenyl moiety.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety and may not comprise a phenyl moiety, and at least one of the other materials of the patterning coating 110 may comprise a phenyl moiety and may not comprise either of a: fluorocarbon, and siloxane, moiety.
  • At least one of the: molecular structures, and molecular compositions, of the materials of the patterning coating 110 may be different.
  • the materials may be selected such that they possess at least one property which is one of substantially: similar to, and different from, one another, including without limitation, at least one of: at least one of a: molecular structure of a monomer, monomer backbone, and functional group; presence of a element in common; similarity in molecular structure; characteristic surface energy; refractive index; molecular weight; and thermal property, including without limitation, at least one of a: melting, sublimation, glass transition, and thermal decomposition, temperature.
  • a characteristic surface energy may generally refer to a surface energy determined from such material.
  • a characteristic surface energy may be measured from a surface formed by the material deposited in a thin film form.
  • Various methods and theories for determining the surface energy of a solid are known.
  • a surface energy may be determined based on a series of contact angle measurements, in which various liquids may be brought into contact with a surface of a solid to measure a contact angle between the liquid-vapor interface and the surface.
  • a surface energy of a solid surface may be equal to the surface tension of a liquid with the highest surface tension that completely wets the surface.
  • a Zisman plot may be used to determine a highest surface tension value that would result in complete wetting (i.e. contact angle of 0°) of the surface.
  • At least one of the: first, and second, material, of the patterning coating 110 may be an oligomer.
  • the first material may comprise a first oligomer
  • the second material may comprise a second oligomer.
  • Each of the first oligomer and the second oligomer may comprise a plurality of monomers.
  • At least a fragment of the molecular structure of the at least one of the materials of the patterning coating 110 may be represented by Formula (I):
  • Mon represents a monomer, and n is an integer of at least 2.
  • n may be an integer of one of between about: 2-100, 2-50, 3-20, 3-15, 3-10, and 3-7.
  • the molecular structure of the first material and the second material of the patterning coating 110 may each be independently represented by Formula (I).
  • at least one of: the monomer, and //, of the first material may be different from that of the second material.
  • n of the first material may be the same as n of the second material.
  • n of the first material may be different from n of the second material.
  • the first material and the second material may be oligomers.
  • the monomer may comprise at least one of: F, and Si.
  • the patterning coating may further include at least one additional material, and descriptions regarding at least one of the: molecular structures, and properties, of at least one of the: first material, second material, first oligomer, and second oligomer, may be applicable with respect to additional materials which may be contained in the patterning coating 110.
  • the surface tension attributable to a fragment of a molecular structure including without limitation, at least one of a: monomer, monomer backbone unit, linker, and functional group, may be determined using various known methods in the art, including without limitation, the use of a Parachor, such as may be further described, in some nonlimiting examples, in “Conception and Significance of the Parachor”, Nature 196: 890-891.
  • at least one functional group of the monomer may have a surface tension of one of no more than about: 25, 21, 20, 19, 18, 17, 16, 15, 14 m, 13 , 12, 11, and 10, dynes/cm.
  • the monomer may comprise at least one of a: CF2, and CF2H, moiety. In some non-limiting examples, the monomer may comprise at least one of a: CF2, and CF3, moiety. In some non-limiting examples, the monomer may comprise a CH2CF3 moiety. In some non-limiting examples, the monomer may comprise at least one of: C, and O. In some non-limiting examples, the monomer may comprise a fluorocarbon monomer.
  • the monomer may comprise at least one of a: vinyl fluoride, vinylidene fluoride, tetrafluoroethylene, chlorotrifluoroethylene, hexafluoropropylene, and fluorinated 1,3-dioxole, moiety.
  • the monomer may comprise a monomer backbone and a functional group.
  • the functional group may be bonded, one of: directly, and via a linker group, to the monomer backbone.
  • the monomer may comprise the linker group, and the linker group may be bonded to the monomer backbone and to the functional group.
  • the monomer may comprise a plurality of functional groups, which may be one of: the same, and different, from one another. In such examples, each functional group may be bonded, one of: directly, and via a linker group, to the monomer backbone. In some nonlimiting examples, where a plurality of functional groups is present, a plurality of linker groups may also be present.
  • the molecular structure of at least one of the materials of the patterning coating 110 may comprise a plurality of different monomers.
  • such molecular structure may comprise monomer species that have different at least one of: molecular composition, and molecular structure.
  • Non-limiting examples of such molecular structure include those represented by Formulae (II) and (III): (Mon A )k(Mon B ) m (II)
  • Mon Morfl, and Mon c each represent a monomer specie, and k, m, and o each represent an integer of at least 2.
  • k, m, and o each represent an integer of one of between about: 2-100, 2-50, 3-20, 3-15, 3-10, and 3-7.
  • monomer, Mon may be applicable with respect to each of Mon Morfl, and Mon c .
  • the monomer may be represented by Formula (IV):
  • AT represents the monomer backbone unit
  • L represents the linker group
  • R represents the functional group, x is an integer between 1-4, and y is an integer between 1-3.
  • the linker group may be represented by at least one of: a single bond, O, N, NH, C, CH, CH2, and S.
  • the functional group R may comprise an oligomer unit, and the oligomer unit may further comprise a plurality of functional group monomer units.
  • a functional group monomer unit may be at least one of: CH2, and CF2.
  • a functional group may comprise a CH2CF3 moiety.
  • such functional group monomer units may be bonded together to form at least one of: an alkyl, and a fluoroalkyl, oligomer unit.
  • the oligomer unit may further comprise a functional group terminal unit.
  • the functional group terminal unit may be arranged at a terminal end of the oligomer unit and bonded to a functional group monomer unit.
  • the terminal end at which the functional group terminal unit may be arranged may correspond to a fragment of the functional group that may be distal to the monomer backbone unit.
  • the functional group terminal unit may comprise at least one of: CF2H, and CF3.
  • the monomer backbone unit M may have a high surface tension. In some non-limiting examples, the monomer backbone unit may have a surface tension that is at least that of at least one of the functional group(s) R bonded thereto. In some non-limiting examples, the monomer backbone unit may have a surface tension that is at least that of any functional group R bonded thereto.
  • the monomer backbone unit may have a surface tension of one of at least about: 25, 30, 40, 50, 75, 100, 150, 200, 250, 500, 1,000, 1,500, and 2,000, dynes/cm.
  • the monomer backbone unit may comprise Si and O, including without limitation, silsesquioxane, which may be represented as SiO3/2.
  • At least a part of the molecular structure of the at least one of the materials of the patterning coating 110 is represented by Formula (V):
  • NP represents the phosphazene monomer backbone unit
  • L represents the linker group
  • R represents the functional group, x is an integer between 1-4, y is an integer between 1-3, and n is an integer of at least 2.
  • the molecular structure of at least one of the: first, and second, material may be represented by Formula (V).
  • at least one of the: first, and second, material may be a cyclophosphazene.
  • the molecular structure of the cyclophosphazene may be represented by Formula (V).
  • L may represent oxygen (O)
  • x may be 1
  • R may represent a fluoroalkyl group.
  • at least a fragment of the molecular structure of the at least one material of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may be represented by Formula (VI):
  • ⁇ represents the fluoroalkyl group
  • n is an integer between 3-7.
  • the fluoroalkyl group may comprise at least one of a: CF2, CF2H, CH2CF3, and CF3, group.
  • the fluoroalkyl group may be represented by Formula (VII): where: p is an integer between 1-5; q is an integer between 6-20; and
  • Z represents one of: hydrogen, and F.
  • p may be 1.
  • the fluoroalkyl group Rf in Formula (VI) may be represented by Formula (VII).
  • at least a fragment of the molecular structure of at least one of the materials of the patterning coating 110, including without limitation, at least one of the: first, and second, material may be represented by Formula (VIII):
  • L represents the linker group
  • R represents the functional group, and n is an integer between 6-12.
  • L may represent the presence of at least one of: a single bond, O, substituted alkyl, and unsubstituted alkyl.
  • n may be one of: 8, 10, and 12.
  • R may comprise a functional group with low surface tension.
  • R may comprise at least one of: an F-containing, and a Si-containing, group.
  • R may comprise at least one of a: fluorocarbon, and siloxane-containing, group.
  • R may comprise at least one of a: CF2, and CF2H, group.
  • R may comprise at least one of a: CF2, and CF3, group. In some nonlimiting examples, R may comprise a CH2CF3 group. In some non-limiting examples, the material represented by Formula (VIII) may be a poly octahedral silsesqui oxane.
  • At least a fragment of the molecular structure of at least one of the materials of the patterning coating 110 may be represented by Formula (IX):
  • n is an integer between 6-12
  • ⁇ represents a fluoroalkyl group.
  • n may be one of: 8, 10, and 12.
  • ’/ may comprise a functional group with low surface tension.
  • ’/ may comprise at least one of: a CF2 moiety, and a CF2H moiety.
  • A’/ may comprise at least one of: a CF2, and a CF3 moiety.
  • ’/ may comprise a CH2CF3 moiety.
  • the material represented by Formula (IX) may be a polyoctahedral silsesquioxane.
  • the fluoroalkyl group, Rf in Formula (IX) may be represented by Formula (VII).
  • At least a fragment of the molecular structure of at least one of the materials of the patterning coating 110 may be represented by Formula (X):
  • n may be one of: 8, 10, and 12.
  • the compound represented by Formula (X) may be a polyoctahedral silsesquioxane.
  • At least one of: the functional group R, and the fluoroalkyl group Rf may be selected independently upon each occurrence of such group in any of the foregoing formulae.
  • any of the foregoing formulae may represent a sub-structure of the compound, and at least one of additional: groups, and moi eties, may be present, which are not explicitly shown in the above formulae.
  • various formulae provided in the present application may represent at least one of: linear, branched, cyclic, cyclo-linear, and cross-linked, structures.
  • the patterning coating 110 may comprise at least one material represented by at least one of the following Formulae: (I), (II), (III), (IV), (V), (VI), (VIII), (IX), and (X), and at least one material exhibiting at least one of the following characteristics: includes an aromatic hydrocarbon moiety, includes an sp 2 carbon, includes a phenyl moiety, has a characteristic surface energy of at least about 20 dynes/cm, and exhibits photoluminescence, including without limitation, exhibiting photoluminescence at a wavelength of at least about 365 nm upon being irradiated by an excitation radiation having a wavelength of about 365 nm.
  • the patterning coating may comprise a third material that is different from the first material and the second material.
  • the third material may comprise a monomer in common with at least one of the: first, and second, material.
  • a difference in the sublimation temperature of the plurality of materials of the patterning coating 110 may be one of no more than about: 5°C, 10°C, 15°C, 20°C, 30°C, 40°C, and 50°C.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may comprise at least one of: F, and Si, and the sublimation temperatures of the materials of the patterning coating 110 may differ by no more than one of about: 5°C, 10°C, 15°C, 20°C, 25°C, 40°C, and 50°C.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety, and the sublimation temperatures of the materials of the patterning coating 110 may differ by one of no more than about: 5°C, 10°C, 15°C, 20°C, 25°C, 40°C, and 50°C.
  • a difference in a melting temperature of the plurality of materials of the patterning coating 110 may be one of no more than about: 5°C, 10°C, 15°C, 20°C, 30°C, 40°C, and 50°C.
  • at least one of the materials of the patterning coating 110 including without limitation, the first, and the second, material, may comprise at least one of: F, and Si, and the melting temperatures of the materials of the patterning coating 110 may differ by one of no more than about: 5°C, 10°C, 15°C, 20°C, 25°C, 40°C, and 50°C.
  • At least one of the materials of the patterning coating 110 may comprise at least one of a: fluorocarbon, and siloxane, moiety, and the melting temperatures of the materials of the patterning coating 110 may differ by one of no more than about: 5°C, 10°C, 15°C, 20°C, 25°C, 40°C, and 50°C. [00495] In some non-limiting examples, at least one of the materials of the patterning coating 110, including without limitation, at least one of the: first, and second, material, may have a low characteristic surface energy.
  • At least one of the materials of the patterning coating 110 may have a low characteristic surface energy, and at least one of the materials of the patterning coating 110 may comprise at least one of: F, and Si.
  • at least one of the materials of the patterning coating 110 including without limitation, at least one of the: first, and second, material, may have a low characteristic surface energy, may comprise at least one of: F, and Si, and at least one other material of the patterning coating 110 may have a high characteristic surface energy.
  • the presence of F and Si may be accounted for by the presence of a fluorocarbon, and a siloxane, moiety, respectively.
  • At least one of the materials may have a low characteristic surface energy of one of between about: 10-20, 12-20, 15-20, and 17-19, dynes/cm, and another material, including without limitation, the first material, may have a high characteristic surface energy of one of between about: 20-100, 20-50, and 25-45, dynes/cm.
  • at least one of the materials may comprise at least one of: F, and Si.
  • the second material may comprise at least one of: F, and Si.
  • At least one of the materials of the patterning coating 110 may have a low characteristic surface energy of no more than about 20 dynes/cm and may comprise at least one of: at least one of: F, and Si, and another material, including without limitation, the first material, may have a characteristic surface energy of at least about 20 dynes/cm.
  • At least one of the materials of the patterning coating 110 may have a low characteristic surface energy of no more than about 20 dynes/cm and may comprise at least one of a: fluorocarbon, and siloxane, moiety, and another material of the patterning coating 110, including without limitation, the first material, may have a characteristic surface energy of at least about 20 dynes/cm.
  • the surface energy of each of the at least two materials of the patterning coating 110 is one of no more about: 25, 21, 20, 19, 18, 17, 16 , 15, 14, 13 m, 12, 11, and 10, dynes/cm.
  • a refractive index at a wavelength at least one of: 500, and 460, nm, of at least one of the materials of the patterning coating 110 may be one of no more than about: 1.5, 1.45, 1.44, 1.43, 1.42, and 1.41.
  • the patterning coating 110 may comprise at least one material that exhibits photoluminescence, and the patterning coating 110 may have a refractive index, at a wavelength of at least one of: 500, and 460, nm, of one of no more than about: 1.5, 1.45, 1.44, 1.43, 1.42, and 1.41.
  • a molecular weight of at least one of the materials of the patterning coating 110 may be one of at least about: 750, 1,000, 1,500, 2,000, 2,500, and 3,000, g/mol.
  • a molecular weight of at least one of the materials of the patterning coating 110 may be one of no more than about: 10,000, 7,500, and 5,000, g/mol.
  • the patterning coating 110 may comprise a plurality of materials exhibiting similar thermal properties, wherein at least one of the materials may exhibit photoluminescence. In some non-limiting examples, the patterning coating 110 may comprise a plurality of materials with similar thermal properties, wherein at least one of the materials may photoluminescence, and wherein at least one of the materials, may comprise at least one of: F, and Si.
  • the patterning coating 110 may comprise a plurality of materials with similar thermal properties, including without limitation, at least one of: a melting temperature, and a sublimation temperature, of the materials, wherein at least one of the materials may exhibit photoluminescence at a wavelength of at least about 365 nm when excited by a radiation having an excitation wavelength of about 365 nm, and wherein at least one of the materials may comprise at least one of: F, and Si.
  • the patterning coating 110 may comprise a plurality of having at least one of: at least one element in common, and at least one substructure in common, wherein at least one of the materials may exhibit photoluminescence.
  • At least one of the materials may comprise F and Si.
  • the patterning coating 110 may comprise a plurality of materials with similar thermal properties, wherein at least one of the materials may exhibit photoluminescence at a wavelength that is at least about 365 nm when excited by a radiation having an excitation wavelength of about 365 nm, and wherein at least one of the materials may comprise at least one of: F, and Si.
  • the at least one element in common may comprise at least one of: F, and Si.
  • the at least one sub-structure in common may comprise at least one of: fluorocarbon, fluoroalkyl, and siloxyl.
  • a method for manufacturing a layered semiconductor device 100 may comprise actions of: depositing a patterning coating on a first exposed layer surface 11 of the device 100 in a first portion 101 of a lateral aspect thereof; and depositing a deposited material 531 on a second exposed layer surface 11 of the device 100 in a second portion 102 of the lateral aspect thereof.
  • An initial sticking probability against deposition of the deposited material 531 onto an exposed layer surface 11 of the patterning coating 110 in the first portion 101 may be substantially less than the initial sticking probability against deposition of the deposited material 531 onto an exposed layer surface 11 in the second portion 102, such that the exposed layer surface 11 of the patterning coating 110 in the first portion 101 may be substantially devoid of a closed coating 140 of the deposited material 531.
  • the patterning coating 110 deposited on the first exposed layer surface 11 of the device 100 may comprises a first material and a second material.
  • depositing the patterning coating 110 on the first exposed layer surface 11 of the device 100 may comprise providing a mixture comprising a plurality of materials, and causing the mixture to be deposited onto the first exposed layer surface 11 of the device 100 to form the patterning coating 110 thereon.
  • the mixture may comprise the first material and the second material.
  • the first material and the second material may both be deposited onto the first exposed layer surface 11 to form the patterning coating 110 thereon.
  • the mixture comprising the plurality of materials may be deposited onto the first exposed layer surface 11 of the device 100 by a PVD process, including without limitation, thermal evaporation.
  • the patterning coating 110 may be formed by evaporating the mixture from a single evaporation source and causing the mixture to be deposited on the first exposed layer surface 11 of the device 100.
  • the mixture comprising, in some non-limiting examples, the first, and the second, material may be placed in a single evaporation source (crucible) to be heated under vacuum. Once the evaporation temperature of the materials is reached, a vapor flux generated therefrom may be directed towards the first exposed layer surface 11 of the device 100 to cause the deposition of the patterning coating 110 thereon.
  • the patterning coating 110 may be deposited by co-evaporation of the first material and the second material.
  • the first material may be evaporated from a first evaporation source
  • the second material may be concurrently evaporated from a second evaporation source such that the mixture may be formed in the vapor phase and may be co-deposited onto the first exposed layer surface 11 to provide the patterning coating 110 thereon.
  • the patterning material was selected such that, for example when deposited as a thin film, the patterning material exhibits a low initial sticking probability against deposition of the deposited material(s) 531, including without limitation, at least one of: Ag, and Yb.
  • PL Material 1 and PL Material 2 were selected such that, in some non-limiting examples, when deposited as a thin film, each of PL Material 1 and PL Material 2 may exhibit photoluminescence detectable by standard optical measurement techniques including without limitation, fluorescence microscopy.
  • Sample l is a comparison sample in which the nucleation modifying coating was provided by depositing the Patterning Material.
  • Sample 2 is an example sample in which the nucleation modifying coating was provided by co-depositing the Patterning Material and PL Material 1 together to form a coating comprising PL Material 1 in a concentration of 0.5 vol.%.
  • Sample 3 is an example sample in which the nucleation modifying coating was provided by co-depositing the Patterning Material and PL Material 2 to form a coating comprising PL Material 2 in a concentration of 0.5 vol.%.
  • Sample 4 is a comparison sample in which the nucleation modifying coating was provided by depositing PL Material 1.
  • Sample 5 is a comparison sample in which the nucleation modifying coating was provided by depositing PL Material 2.
  • Sample 6 is a comparison sample in which no nucleation modifying coating was provided over the organic material layer.
  • each sample was subjected to a Yb vapor flux until a reference thickness of about 1 nm was reached, followed by an Ag vapor flux until a reference thickness of about 12 nm was reached.
  • optical transmission measurements were taken to determine the amount of at least one of: Yb, and Ag, deposited on the exposed layer surface 11 of the nucleation modifying coatings.
  • samples having little to no metal present thereon may be substantially transparent, while samples with metal deposited thereon, particularly as a closed coating 140, may generally exhibit a substantially lower light transmittance.
  • the performance of various example coatings as a patterning coating 110 may be assessed by measuring the EM radiation transmission, which may directly correlate to an amount (thickness) of metallic deposited material deposited thereon from deposition of either of both of Yb and Ag.
  • the transmittance reduction (%) for each sample in Table 6 was determined by measuring the light transmission through the sample before and after the exposure to the Yb and Ag vapor flux and expressing the reduction in the EM radiation transmittance as a percentage.
  • Sample 1 Sample 2, and Sample 3 exhibited a substantially low transmittance reduction of less than 2%, and in the case of Samples 1 and 3, less than 1%. Accordingly, it may be observed that the nucleation modifying coatings provided for these samples acted as an NIC.
  • Sample 4, Sample 5, and Sample 6 each exhibited a transmittance reduction of 43%, 47%, and 45%, respectively. Accordingly, the nucleation modifying coatings provided for these samples did not act as an NIC but may have indeed acted as an NPC 720.
  • Sample 1 in which the patterning coating 110 was comprised of substantially only the NIC Material, did not exhibit photoluminescence.
  • a deposited layer 130 comprising a deposited material 531 may be disposed as a closed coating 140 on an exposed layer surface 11 of the underlying layer 710.
  • the deposited layer 130 may comprise a deposited material 531.
  • the deposited material 531 may comprise an element selected from at least one of: potassium (K), sodium (Na), lithium (Li), Ba, cesium (Cs), Yb, Ag, gold (Au), Cu, Al, Mg, Zn, Cd, tin (Sn), and yttrium (Y).
  • the element may comprise at least one of: K, Na, Li, Ba, Cs, Yb, Ag, Au, Cu, Al, and Mg.
  • the element may comprise at least one of: Cu, Ag, and Au.
  • the element may be Cu.
  • the element may be Al.
  • the element may comprise at least one of: Mg, Zn, Cd, and Yb. In some non-limiting examples, the element may comprise at least one of: Mg, Ag, Al, Yb, and Li. In some non-limiting examples, the element may comprise at least one of: Mg, Ag, and Yb. In some non-limiting examples, the element may comprise at least one of: Mg, and Ag. In some non-limiting examples, the element may be Ag.
  • the deposited material 531 may comprise a pure metal.
  • the deposited material 531 may be (substantially) pure Ag.
  • the substantially pure Ag may have a purity of one of at least about: 95%, 99%, 99.9%, 99.99%, 99.999%, and 99.9995%.
  • the deposited material 531 may be (substantially) pure Mg.
  • the substantially pure Mg may have a purity of one of at least about: 95%, 99%, 99.9%, 99.99%, 99.999%, and 99.9995%.
  • the deposited material 531 may comprise an alloy.
  • the alloy may be one of: an Ag-containing alloy, an Mg-containing alloy, and an AgMg-containing alloy.
  • the AgMg-containing alloy may have an alloy composition that may range from about 1 : 10 (Ag:Mg) to about 10: 1 by volume.
  • the deposited material 531 may comprise other metals in one of: in place of, and in combination with, Ag.
  • the deposited material 531 may comprise an alloy of Ag with at least one other metal.
  • the deposited material 531 may comprise an alloy of Ag with at least one of: Mg, and Yb.
  • such alloy may be a binary alloy having a composition between about 5-95 vol.% Ag, with the remainder being the other metal.
  • the deposited material 531 may comprise Ag and Mg.
  • the deposited material 531 may comprise an Ag:Mg alloy having a composition between about 1 : 10-10: 1 by volume.
  • the deposited material 531 may comprise Ag and Yb. In some nonlimiting examples, the deposited material 531 may comprise a Yb:Ag alloy having a composition between about 1 :20-10: 1 by volume. In some non-limiting examples, the deposited material 531 may comprise Mg and Yb. In some non-limiting examples, the deposited material 531 may comprise an Mg:Yb alloy. In some non-limiting examples, the deposited material 531 may comprise Ag, Mg, and Yb. In some non-limiting examples, the deposited layer 130 may comprise an Ag:Mg:Yb alloy.
  • the deposited layer 130 may comprise at least one additional element.
  • such additional element may be a non-metallic element.
  • the non-metallic element may be at least one of: O, S, N, and C. It will be appreciated by those having ordinary skill in the relevant art that, in some non-limiting examples, such additional element(s) may be incorporated into the deposited layer 130 as a contaminant, due to the presence of such additional element(s) in at least one of: the source material, equipment used for deposition, and the vacuum chamber environment. In some non-limiting examples, the concentration of such additional element(s) may be limited to be below a threshold concentration.
  • such additional element(s) may form a compound together with other element(s) of the deposited layer 130.
  • a concentration of the non-metallic element in the deposited material 531 may be one of no more than about: 1%, 0.1%, 0.01%, 0.001%, 0.0001%, 0.00001%, 0.000001%, and 0.0000001%.
  • the deposited layer 130 may have a composition in which a combined amount of O and C therein may be one of no more than about: 10%, 5%, 1%, 0.1%, 0.01%, 0.001%, 0.0001%, 0.00001%, 0.000001%, and 0.0000001%.
  • reducing a concentration of certain non-metallic elements in the deposited layer 130 may facilitate selective deposition of the deposited layer 130.
  • certain non-metallic elements such as, in some non-limiting examples, at least one of: O, and C, when present in the vapor flux 532 of at least one of: the deposited layer 130, in the deposition chamber, and the environment, may be deposited onto the surface of the patterning coating 110 to act as nucleation sites for the metallic element(s) of the deposited layer 130.
  • the deposited material 531 may be deposited on a metal-containing underlying layer 710.
  • the deposited material 531 and the underlying layer 710 thereunder may comprise a metal in common.
  • the deposited layer 130 may comprise a plurality of layers of the deposited material 531.
  • the deposited material 531 of a first one of the plurality of layers may be different from the deposited material 531 of a second one of the plurality of layers.
  • the deposited layer 130 may comprise a multilayer coating.
  • such multilayer coating may be one of: Yb/Ag, Yb/Mg, Yb/Mg:Ag, Yb/Yb:Ag, Yb/Ag/Mg, and Yb/Mg/ Ag.
  • the deposited material 531 may comprise a metal having a bond dissociation energy, of one of no more than about: 300, 200, 165, 150, 100, 50, and 20, kJ/mol.
  • the deposited material 531 may comprise a metal having an electronegativity that is one of no more than about: 1.4, 1.3, and 1.2.
  • a sheet resistance of the deposited layer 130 may generally correspond to a sheet resistance of the deposited layer 130, measured in isolation from other components, layers, and parts of the device 100.
  • the deposited layer 130 may be formed as a thin film.
  • the characteristic sheet resistance for the deposited layer 130 may be determined based on at least one of: the composition, thickness, and morphology, of such thin film.
  • the sheet resistance may be one of no more than about: 10, 5, 1, 0.5, 0.2, and 0.1, / ⁇ .
  • the deposited layer 130 may be disposed in a pattern that may be defined by at least one region therein that is substantially devoid of a closed coating 140 of the deposited layer 130. In some non-limiting examples, the at least one region may separate the deposited layer 130 into a plurality of discrete fragments thereof. In some non-limiting examples, each discrete fragment of the deposited layer 130 may be a distinct second portion 102. In some non-limiting examples, the plurality of discrete fragments of the deposited layer 130 may be physically spaced apart from one another in the lateral aspect thereof. In some non-limiting examples, at least two of such plurality of discrete fragments of the deposited layer 130 may be electrically coupled.
  • At least two of such plurality of discrete fragments of the deposited layer 130 may be each electrically coupled with a common conductive coating, including without limitation, the underlying layer 710, to allow the flow of electrical current between them. In some non-limiting examples, at least two of such plurality of discrete fragments of the deposited layer 130 may be electrically insulated from one another.
  • FIG. 3 there is shown a cross-sectional view of an example layered opto-electronic device 200, such as a display panel 300.
  • the display panel 300 may comprise a plurality of layers deposited on a substrate 10, culminating with an outermost layer that forms a face 301 thereof.
  • the display panel 300 may be a version of the device 200.
  • the face 301 of the display panel 300 may extend across a lateral aspect thereof, substantially along a plane defined by the lateral axes.
  • the face 301 may act as a face of a user device 310 through which at least one EM signal 331 may be exchanged therethrough at a non-zero angle relative to the plane of the face 301.
  • the user device 310 may be a computing device 310, such as, without limitation, a smartphone, a tablet, a laptop, an e-reader, and some other electronic device 310, such as a monitor, a television set, and a smart device 310, including without limitation, an automotive display, windshield, a household appliance, and a medical, commercial, and industrial device 310.
  • the face 301 may correspond to, and in some non-limiting examples, mate with, at least one of: a body 320, and an opening 321 therewithin, within which at least one under-display component 330 may be housed.
  • the at least one under-display component 330 may be formed, including without limitation, at least one of: integrally, and as an assembled module, with the display panel 300 on a surface thereof opposite to the face 301.
  • At least one aperture 322 may be formed in the display panel 300 to allow for the exchange of at least one EM signal 331 through the face 301 of the display panel 300, at a non-zero angle to the plane defined by the lateral axes, including without limitation, concomitantly, the layers of the display panel 300, including without limitation, the face 301 of the display panel 300.
  • the at least one aperture 322 may be understood to comprise one of: the absence, and reduction in at least one of: thickness, and capacity, of a substantially opaque coating otherwise disposed across the display panel 300.
  • the at least one aperture 322 may be embodied as a transmissive region 212 as described herein.
  • the at least one aperture 322 is embodied, the at least one EM signal 331 may pass therethrough such that it passes through the face 301.
  • the at least one EM signal 331 may be considered to exclude any EM radiation that may extend along the plane defined by the lateral axes, including without limitation, any electric current that may be conducted across at least one particle structure 150 laterally across the display panel 300.
  • the at least one EM signal 331 may be differentiated from EM radiation per se, including without limitation, one of: electric current, and an electric field generated thereby, in that the at least one EM signal 331 may convey, either one of: alone, and in conjunction with other EM signals 331, some information content, including without limitation, an identifier by which the at least one EM signal 331 may be distinguished from other EM signals 331.
  • the information content may be conveyed by at least one of: specifying, altering, and modulating, at least one of: the wavelength, frequency, phase, timing, bandwidth, resistance, capacitance, impedance, conductance, and other characteristic of the at least one EM signal 331.
  • the at least one EM signal 331 passing through the at least one aperture 322 of the display panel 300 may comprise at least one photon and, in some non-limiting examples, may have a wavelength spectrum that lies, without limitation, within at least one of: the visible spectrum, the IR spectrum, and the NIR spectrum. In some non-limiting examples, the at least one EM signal 331 passing through the at least one aperture 322 of the display panel 300 may have a wavelength that lies, without limitation, within at least one of: the IR, and NIR spectrum. [00542] In some non-limiting examples, the at least one EM signal 331 passing through the at least one aperture 322 of the display panel 300 may comprise ambient light incident thereon.
  • the at least one EM signal 331 exchanged through the at least one aperture 322 of the display panel 300 may be at least one of: transmitted, and received, by the at least one under-display component 330.
  • the at least one under-display component 330 may have a size that is at least a single transmissive region 212, but may underlie not only a plurality thereof, but also at least one emissive region 210 extending therebetween. Similarly, in some non-limiting examples, the at least one under-display component 330 may have a size that is at least a single one of the at least one apertures 322.
  • the at least one under-display component 330 may comprise a receiver 330r, adapted to receive and process at least one received EM signal 33 lr, passing through the at least one aperture 322 from beyond the user device 310.
  • receiver 330r include an under-display camera (UDC), and a sensor, including without limitation, IR sensor / detector, an NIR sensor / detector, a LIDAR sensing module, a fingerprint sensing module, an optical sensing module, an IR (proximity) sensing module, an iris recognition sensing module, and a facial recognition sensing module, including without limitation, a part thereof.
  • UDC under-display camera
  • a sensor including without limitation, IR sensor / detector, an NIR sensor / detector, a LIDAR sensing module, a fingerprint sensing module, an optical sensing module, an IR (proximity) sensing module, an iris recognition sensing module, and a facial recognition sensing module, including without limitation, a part thereof.
  • the at least one under-display component 330 may comprise a transmitter 330t adapted to emit at least one transmitted EM signal 33 It passing through the at least one aperture 322 beyond the user device 310.
  • transmitter 330t include a source of EM radiation, including without limitation, a built-in flash, a flashlight, an IR emitter, a NIR emitter, a LIDAR sensing module, a fingerprint sensing module, an optical sensing module, an IR (proximity) sensing module, an iris recognition sensing module, and a facial recognition sensing module, including without limitation, a part thereof.
  • the at least one received EM signal 33 lr may include at least a fragment of the at least one transmitted EM signal 33 It which is one of: reflected off, and otherwise returned by, an external surface to the user device 310, including without limitation, a user 30.
  • the at least one EM signal 331 passing through the at least one aperture 322 of the display panel 300 beyond the user device 310 including without limitation, those transmitted EM signals 33 It emitted by the at least one under-display component 330 that may comprise a transmitter 330t, may emanate from the display panel 300, and pass back as received EM signals 33 lr through the at least aperture 322 of the display panel 300 to at least one under-display component 330 that may comprise a receiver 33 Or.
  • the under-display component 330 may comprise an IR emitter and an IR sensor.
  • such underdisplay component 330 may comprise, as one of: a part, component, and module, thereof: at least one of: a dot-matrix projector, a time-of-flight (ToF) sensor module, which may operate as one of: a direct ToF, and an indirect ToF, sensor, a vertical cavity surfaceemitting laser (VCSEL), flood illuminator, NIR imager, folded optics, and a diffractive grating.
  • a dot-matrix projector e.g., a time-of-flight (ToF) sensor module
  • ToF time-of-flight
  • under-display components 330 within the user device 310, a first one of which may comprise a transmitter 330t for emitting at least one transmitted EM signal 33 It to pass through the at least one aperture 322, beyond the user device 310, and a second one of which may comprise a receiver 33 Or, for receiving at least one received EM signal 33 lr.
  • transmitter 330t and receiver 33 Or may be embodied in a single underdisplay component 330.
  • the display panel 300 may comprise at least one signal-exchanging part 303 and at least one display part 307.
  • the at least one display part 307 may comprise a plurality of emissive regions 210, in some non-limiting examples, laid out in a lateral pattern.
  • the emissive regions 210 in the at least one display part 307 may correspond to (sub-) pixels 1015/216 of the display panel 300.
  • the at least one signal-exchanging part 303 may comprise at least one emissive region 210 and at least one transmissive region 212.
  • the at least one emissive region 210 in the at least one signalexchanging part 303 may correspond to (sub-) pixel(s) 1015/216 of the display panel 300, and in some non-limiting examples, may be substantially laid out in a similar, including without limitation, identical, lateral pattern as in the at least one display part 307.
  • the at least one display part 307 may be adjacent to, and in some non-limiting examples, separated by, at least one signalexchanging part 303.
  • the at least one signal-exchanging part 303 may be positioned proximate to an extremity of the display panel 300, including without limitation, at least one of: an edge, and a corner, thereof. In some non-limiting examples, the at least one signal-exchanging part 303 may be positioned substantially centrally within the lateral aspect of the display panel 300.
  • the at least one display part 307 may substantially surround, including without limitation, in conjunction with at least one other display part 307, the at least one signal-exchanging part 303.
  • the at least one signal-exchanging part 303 may be positioned proximate to an extremity and configured such that the at least one display part(s) 307 do(es) not completely surround the at least one signal-exchanging part 303.
  • a pixel density of the at least one emissive region 210 of the at least one signal-exchanging part 303 may be substantially the same as a pixel density of the at least one emissive region 210 of the at least one display part 307 proximate thereto, at least in an area thereof that is substantially proximate to the at least one signal-exchanging part 303.
  • the pixel density of the display panel 300 may be substantially uniform thereacross.
  • the at least one signal-exchanging part 303 and the at least one display part 307 may have substantially the same pixel density, including without limitation, so that a resolution of the display panel 300 may be substantially the same across both the at least one signal-exchanging part 303 and the at least one display part 307 thereof.
  • examples in the present disclosure may have applicability in scenarios in which the layout of (sub-) pixels 1015/216 in the signal-exchanging part 303 may be substantially different than the layout thereof in the display part 307 of the display panel 300.
  • the display panel 300 may further comprise at least one transition region (not shown) between the at least one signal-exchanging part 303 and the at least one display part 307, wherein the configuration of at least one of: the emissive regions 210, and the transmissive regions 212 therein, may differ from those of at least one of: the at least one signal-exchanging part 303, and the at least one display part 307.
  • such transition region may be omitted such that the emissive regions 210 may be provided in a substantially continuous repeating pattern across both the at least one signal-exchanging part 303 and the at least one display part 307.
  • the at least one signal-exchanging part 303 may have a polygonal contour, including without limitation, at least one of a: substantially square, and rectangular, configuration.
  • the at least one signal-exchanging part 303 may have a curved contour, including without limitation, at least one of a: substantially circular, oval, and elliptical, configuration.
  • the transmissive regions 212 in the at least one signal-exchanging part 303 may be configured to allow EM signals having a wavelength (range) corresponding to the IR spectrum to pass through the entirety of a cross- sectional aspect thereof.
  • the at least one signal-exchanging part 303 may have a reduced number of, including without limitation, be substantially devoid of, backplane components, including without limitation, TFT structures 206, including without limitation, metal trace lines, capacitors, and other EM radiation-absorbing element, including without limitation, opaque elements, the presence of which may otherwise interfere with the capture of the EM signals by the at least one under-display component 330, including without limitation, the capture of an image by a camera.
  • backplane components including without limitation, TFT structures 206, including without limitation, metal trace lines, capacitors, and other EM radiation-absorbing element, including without limitation, opaque elements, the presence of which may otherwise interfere with the capture of the EM signals by the at least one under-display component 330, including without limitation, the capture of an image by a camera.
  • the user device 310 may house at least one transmitter 330t for transmitting at least one transmitted EM signal 33 It through at least one first transmissive region 212 in, and in some non-limiting examples, substantially corresponding to, a first signal-exchanging part 303, beyond the face 301.
  • the user device 310 may house at least one receiver 33 Or for receiving at least one received EM signal 33 lr through at least one second transmissive region 212 in, and in some non-limiting examples, substantially corresponding to, a second signalexchanging part 303, from beyond the face 301.
  • the at least one received EM signal 33 lr may be the same as the at least one transmitted EM signal 33 It, reflected off an external surface, including without limitation, a user 30, including without limitation, for biometric authentication thereof.
  • At least one of: the at least one transmitter 330t, and the at least one receiver 330t may be arranged behind the corresponding at least one signal-exchanging part 303, such that EM signals, including without limitation, IR signals, may be at least one of: emitted, and received, respectively, by passing through the at least one signal-exchanging part 303 of the display panel 300.
  • the at least one transmitter 330t and the at least one receiver 33 Or may both be arranged behind a single signal-exchanging part 303, which in some non-limiting examples, may be elongated along at least one configuration axis, such that it extends across both the at least one transmitter 330t and the at least one receiver 330r.
  • the display panel 300 may further comprise a non-display part (not shown), which in some non-limiting examples, may be substantially devoid of any emissive regions 210.
  • the user device 310 may house an under-display component 330, including without limitation, a camera, arranged within the non-display part.
  • the non-display part may be arranged adjacent to, and in some non-limiting examples, between a plurality of signal-exchanging parts 303 corresponding to a plurality of under-display components 330, including without limitation, a transmitter 330t and a receiver 33 Or.
  • the non-display part may comprise a through-hole part (not shown), which in some non-limiting examples, may be arranged to overlap the camera.
  • the display panel 300 may, in the through-hole part, be substantially devoid of any of at least one of a: layer, coating, and component, that may otherwise be present in at least one of: the at least one signalexchanging part 303, and the at least one display part 307, including without limitation, a component of at least one of the: backplane 202, and frontplane 201, the presence of which may otherwise interfere with the capture of an image by the camera.
  • an overlying layer 170 including without limitation, at least one of: a polarizer, and one of a: cover glass, and glass cap, of the display panel 300, may extend substantially across the at least one signal-exchanging part 303, the at least one display part 307, and the non-display part, such that it may extend substantially across the display panel 300.
  • the through-hole part may be substantially devoid of a polarizer in order to enhance the transmission of EM radiation therethrough.
  • the non-display part may comprise a non- through-hole part, which in some non-limiting examples, may be arranged between the through-hole part and an adjacent signal-exchanging part 303 in a lateral aspect.
  • the non-through-hole part may surround at least a part of a perimeter of the through-hole part.
  • the user device 310 may comprise additional ones of at least one of a: module, component, and sensor, in a part of the user device 310 corresponding to the non-through-hole part of the display panel 300.
  • the emissive regions 210 in the at least one signal-exchanging part 303 may be electrically coupled with at least one TFT structure located in the non-through-hole part of the non-display part. That is, in some non-limiting examples, the TFT structures 206 for actuating the (sub-) pixels 1015/216 in the at least one signal-exchanging part 303 may be relocated outside the at least one signal-exchanging part 303 and within the non-through-hole part of the display panel 300, such that a substantially high transmission of EM radiation, in at least one of the: IR, and NIR, spectrum, may be directed through the non-emissive regions 211 within the at least one signal-exchanging part 303.
  • the TFT structures 206 in the non-through-hold part may be electrically coupled with (sub-) pixels 1015/216 in the at least one signal- exchanging part 303 via conductive trace(s).
  • at least one of the: transmitter 330t, and receiver 330r may be arranged to be proximate to the non-through- hole part in the lateral aspect, such that a distance over which electrical current travels between the TFT structures 206 and the (sub-) pixels 1015/216 associated therewith, may be reduced.
  • FIG. 4 is an example schematic diagram illustrating a non-limiting example of an evaporative deposition process, shown generally at 400, in a chamber 420, for selectively depositing a patterning coating 110 onto a first portion 101 of an exposed layer surface 11 of the underlying layer 710.
  • a quantity of a patterning material 411 may be heated under vacuum, to evaporate (sublime) the patterning material 411.
  • the patterning material 411 may comprise substantially (including without limitation, entirely), a material used to form the patterning coating 110. In some nonlimiting examples, such material may comprise an organic material.
  • An evaporated flux 412 of the patterning material 411 may flow through the chamber 420, including in a direction indicated by arrow 41, toward the exposed layer surface 11.
  • the patterning coating 110 may be formed thereon.
  • the patterning coating 110 may be selectively deposited only onto a portion, in the example illustrated, the first portion 101, of the exposed layer surface 11 of the underlying layer 710, by the interposition, between the vapor flux 412 and the exposed layer surface 11 of the underlying layer 710, of a shadow mask 415, which in some non-limiting examples, may be an FMM.
  • a shadow mask 415 may, in some nonlimiting examples, be used to form substantially small features, with a feature size on the order of (smaller than) tens of microns.
  • the shadow mask 415 may have at least one aperture 416 extending therethrough such that a part of the evaporated flux 412 passes through the aperture 416 and may be incident on the exposed layer surface 11 to form the patterning coating 110. Where the evaporated flux 412 does not pass through the aperture 416 but is incident on a surface 417 of the shadow mask 415, it is precluded from being disposed on the exposed layer surface 11 to form the patterning coating 110.
  • the shadow mask 415 may be configured such that the evaporated flux 412 that passes through the aperture 416 may be incident on the first portion 101 but not the second portion 102. The second portion 102 of the exposed layer surface 11 may thus be substantially devoid of the patterning coating 110.
  • the patterning material 411 that is incident on the shadow mask 415 may be deposited on the surface 417 thereof.
  • a patterned surface may be produced upon completion of the deposition of the patterning coating 110.
  • FIG. 5 is an example schematic diagram illustrating a non-limiting example of a result of an evaporative process, shown generally at 500 a , in a chamber 420, for selectively depositing a closed coating 140 of a deposited layer 130 onto the second portion 102 of an exposed layer surface 11 of the underlying layer 710 that is substantially devoid of the patterning coating 110 that was selectively deposited onto the first portion 101, including without limitation, by the evaporative process 400 of FIG. 4.
  • the deposited layer 130 may be comprised of a deposited material 531, in some non-limiting examples, comprising at least one metal. It will be appreciated by those having ordinary skill in the relevant art that, in some nonlimiting examples, a vaporization temperature of an organic material is low relative to the vaporization temperature of metals, such as may be employed as a deposited material 531.
  • a shadow mask 415 to selectively deposit a patterning coating 110 in a pattern, relative to directly patterning the deposited layer 130 using such shadow mask 415.
  • a closed coating 140 of the deposited material 531 may be deposited, on the second portion 102 of the exposed layer surface 11 that is substantially devoid of the patterning coating 110, as the deposited layer 130.
  • a quantity of the deposited material 531 may be heated under vacuum, to sublime the deposited material 531.
  • the deposited material 531 may be comprised of substantially, including without limitation, entirely, a material used to form the deposited layer 130.
  • An evaporated flux 532 of the deposited material 531 may be directed inside the chamber 420, including in a direction indicated by arrow 51, toward the exposed layer surface 11 of the first portion 101 and of the second portion 102.
  • a closed coating 140 of the deposited material 531 may be formed thereon as the deposited layer 130.
  • deposition of the deposited material 531 may be performed using one of: an open mask, and a mask-free, deposition process.
  • the feature size of an open mask may be generally comparable to the size of a device 100 being manufactured.
  • an open mask may be omitted.
  • an open mask deposition process described herein may alternatively be conducted without the use of an open mask, such that an entire target exposed layer surface 11 may be exposed.
  • the evaporated flux 532 may be incident both on an exposed layer surface 11 of the patterning coating 110 across the first portion 101 as well as the exposed layer surface 11 of the underlying layer 710 across the second portion 102 that is substantially devoid of the patterning coating 110.
  • the exposed layer surface 11 of the patterning coating 110 in the first portion 101 may exhibit a substantially low initial sticking probability against the deposition of the deposited material 531 relative to the exposed layer surface 11 of the underlying layer 710 in the second portion 102
  • the deposited layer 130 may be selectively deposited substantially only on the exposed layer surface 11, of the underlying layer 710 in the second portion 102, that is substantially devoid of the patterning coating 110.
  • the evaporated flux 532 incident on the exposed layer surface 11 of the patterning coating 110 across the first portion 101 may tend to not be deposited (as shown 533), and the exposed layer surface 11 of the patterning coating 110 across the first portion 101 may be substantially devoid of a closed coating 140 of the deposited layer 130.
  • an initial deposition rate, of the evaporated flux 532 on the exposed layer surface 11 of the underlying layer 710 in the second portion 102 may be one of at least about: 200, 550, 900, 1,000, 1,500, 1,900, and 2,000, times an initial deposition rate of the evaporated flux 532 on the exposed layer surface 11 of the patterning coating 110 in the first portion 101.
  • the combination of the selective deposition of a patterning coating 110 in Fig- 4 using a shadow mask 415 and at least one of: an open mask, and a mask-free, deposition of the deposited material 531 may result in a version 500 a of the device 100 shown in FIG. 5.
  • a closed coating 140 of the deposited material 531 may be deposited over the device 500 a as the deposited layer 130, in some non-limiting examples, using one of: an open mask, and a mask-free, deposition process, but may remain substantially only within the second portion 102, which is substantially devoid of the patterning coating 110.
  • the patterning coating 110 may provide, within the first portion 101, an exposed layer surface 11 with a substantially low initial sticking probability, against the deposition of the deposited material 531, and that is substantially less than the initial sticking probability, against the deposition of the deposited material 531, of the exposed layer surface 11 of the underlying layer 710 of the device 500 a within the second portion 102.
  • the first portion 101 may be substantially devoid of a closed coating 140 of the deposited material 531.
  • the present disclosure contemplates the patterned deposition of the patterning coating 110 by an evaporative deposition process, involving a shadow mask 415, those having ordinary skill in the relevant art will appreciate that, in some non-limiting examples, this may be achieved by any applicable deposition process, including without limitation, a micro-contact printing process.
  • the patterning coating 110 may be an NPC 720.
  • the portion (such as, without limitation, the first portion 101) in which the NPC 720 has been deposited may, in some non-limiting examples, have a closed coating 140 of the deposited material 531, while the other portion (such as, without limitation, the second portion 102) may be substantially devoid of a closed coating 140 of the deposited material 531.
  • an average layer thickness of the patterning coating 110 and of the deposited layer 130 deposited thereafter may be varied according to a variety of parameters, including without limitation, a given application and given performance characteristics.
  • the average layer thickness of the patterning coating 110 may be comparable to, including without limitation, substantially no more than, an average layer thickness of the deposited layer 130 deposited thereafter.
  • Use of a substantially thin patterning coating 110 to achieve selective patterning of a deposited layer 130 may have applicability to provide flexible devices 100.
  • the device 200 may further comprise an NPC 720 disposed between the patterning coating 110 and the second electrode 240.
  • the patterning coating 110 may be formed concurrently with the at least one semiconducting layer(s) 230. In some non-limiting examples, at least one material used to form the patterning coating 110 may also be used to form the at least one semiconducting layer(s) 230 to reduce a number of stages for fabricating the device 200.
  • FIG. 6A there may be shown a version 600 a of the device 100 of FIG. 1 that may show in exaggerated form, an interface between the patterning coating 110 in the first portion 101 and the deposited layer 130 in the second portion 102.
  • FIG. 6B may show the device 600 a in plan.
  • the patterning coating 110 in the first portion 101 may be surrounded on all sides by the deposited layer 130 in the second portion 102, such that the first portion 101 may have a boundary that is defined by the further edge 615 of the patterning coating 110 in the lateral aspect along each lateral axis.
  • the patterning coating edge 615 in the lateral aspect may be defined by a perimeter of the first portion 101 in such aspect.
  • the first portion 101 may comprise at least one patterning coating transition region 10 It, in the lateral aspect, in which a thickness of the patterning coating 110 may transition from a maximum, to a reduced, thickness.
  • the extent of the first portion 101 that does not exhibit such a transition may be identified as a patterning coating non-transition part 101n of the first portion 101.
  • the patterning coating 110 may form a substantially closed coating 140 in the patterning coating non-transition part 10 In of the first portion 101.
  • the patterning coating transition region 10 It may extend, in the lateral aspect, between the patterning coating non-transition part 10 In of the first portion 101 and the patterning coating edge 615.
  • the patterning coating transition region 10 in plan, may extend along a perimeter of the patterning coating non-transition part 101n of the first portion 101.
  • the patterning coating non-transition part 10 In may occupy the entirety of the first portion 101, such that there is no patterning coating transition region 10 It between it and the second portion 102.
  • the patterning coating 110 may have an average film thickness d in the patterning coating non-transition part 10 In of the first portion 101 that may be in a range of one of between about: 1-100, 2- 50, 3-30, 4-20, 5-15, 5-10, and 1-10, nm.
  • the average film thickness d of the patterning coating 110 in the patterning coating non-transition part 10 In of the first portion 101 may be substantially the same (constant) thereacross.
  • an average film thickness d of the patterning coating 110 may remain, within the patterning coating non-transition part 10 In, within one of about: 95%, and 90%, of the average film thickness d of the patterning coating 110.
  • the average film thickness d2 may be between about 1-100 nm. In some non-limiting examples, the average film thickness di may be one of no more than about: 80, 60, 50, 40, 30, 20, 15, and 10, nm. In some nonlimiting examples, the average film thickness di of the patterning coating 110 may be one of at least about: 3, 5, and 8, nm. [00608] In some non-limiting examples, the average film thickness (b of the patterning coating 110 in the patterning coating non-transition part 10 In of the first portion 101 may be no more than about 10 nm.
  • a non-zero average film thickness ch of the patterning coating 110 that is no more than about 10 nm may, at least in some non-limiting examples, provide certain advantages for achieving, in some non-limiting examples, enhanced patterning contrast of the deposited layer 130, relative to a patterning coating 110 having an average film thickness ch in the patterning coating non-transition part 10 In of the first portion 101 of at least about 10 nm.
  • the patterning coating 110 may have a patterning coating thickness that decreases from a maximum to a minimum within the patterning coating transition region 10 It.
  • the maximum may be proximate to a boundary between the patterning coating transition region 10 It and the patterning coating non-transition part 101n of the first portion 101.
  • the minimum may be proximate to the patterning coating edge 615.
  • the maximum may be the average film thickness ch in the patterning coating non-transition part 101n of the first portion 101.
  • the maximum may be no more than one of about: 95%, and 90%, of the average film thickness ch in the patterning coating non-transition part 10 In of the first portion 101.
  • the minimum may be in a range of between about 0-0.1 nm.
  • a profile of the patterning coating thickness in the patterning coating transition region 10 It may be sloped. In some non-limiting examples, such profile may be tapered. In some non-limiting examples, the taper may follow one of a: linear, non-linear, parabolic, and exponential decaying, profile.
  • the patterning coating 110 may completely cover the underlying layer 710 in the patterning coating transition region 10 It. In some non-limiting examples, at least a part of the underlying layer 710 may be left uncovered by the patterning coating 110 in the patterning coating transition region 10 It. In some nonlimiting examples, the patterning coating 110 may comprise a substantially closed coating 140 in at least one of at least a part of the patterning coating transition region 10 It, and at least a part of the patterning coating non-transition part 10 In.
  • the patterning coating 110 may comprise a discontinuous layer 160 in at least one of: at least a part of the patterning coating transition region 10 It, and at least a part of the patterning coating non-transition part 101n.
  • At least a part of the patterning coating 110 in the first portion 101 may be substantially devoid of a closed coating 140 of the deposited layer 130.
  • at least a part of the exposed layer surface 11 of the first portion 101 may be substantially devoid of a closed coating 140 of one of the: deposited layer 130, and deposited material 531.
  • the patterning coating non-transition part 101n may have a width of wi, and the patterning coating transition region 10 It may have a width of W2.
  • the patterning coating non-transition part 101n may have a cross-sectional area that, in some non-limiting examples, may be approximated by multiplying the average film thickness ch by the width wi.
  • the patterning coating transition region 10 It may have a cross-sectional area that, in some non-limiting examples, may be approximated by multiplying an average film thickness across the patterning coating transition region 10 It by the width W2.
  • wi may be at least that of W2.
  • a quotient of wi/w2 may be one of at least about: 5, 10, 20, 50, 100, 500, 1,000, 1,500, 5,000, 10,000, 50,000, and 100,000.
  • At least one of wl and w2 may be at least that of the average film thickness di of the underlying layer 710.
  • At least one of wi and W2 may be at least that of d2. In some non-limiting examples, both wi and W2 may be at least that of d2. In some non-limiting examples, wi and W2 both may be at least that of di, and di may be at least that of d2.
  • the patterning coating 110 in the first portion 101 may be surrounded by the deposited layer 130 in the second portion 102 such that the second portion 102 has a boundary that is defined by the further edge 635 of the deposited layer 130 in the lateral aspect along each lateral axis.
  • the deposited layer edge 635 in the lateral aspect may be defined by a perimeter of the second portion 102 in such aspect.
  • the second portion 102 may comprise at least one deposited layer transition region 102t, in the lateral aspect, in which a thickness of the deposited layer 130 may transition from a maximum, to a reduced, thickness.
  • the extent of the second portion 102 that does not exhibit such a transition may be identified as a deposited layer non-transition part 102n of the second portion 102.
  • the deposited layer 130 may form a substantially closed coating 140 in the deposited layer non-transition part 102n of the second portion 102.
  • the deposited layer transition region 102t may extend, in the lateral aspect, between the deposited layer non-transition part 102 n of the second portion 102 and the deposited layer edge 635.
  • the deposited layer transition region 102t may extend along a perimeter of the deposited layer non-transition part 102n of the second portion 102.
  • the deposited layer non-transition part 102n of the second portion 102 may occupy the entirety of the second portion 102, such that there is no deposited layer transition region 102t between it and the first portion 101.
  • the deposited layer 130 may have an average film thickness ds in the deposited layer non-transition part 102n of the second portion 102 that may be in a range of one of between about: 1-500, 5- 200, 5-40, 10-30, and 10-100, nm. In some non-limiting examples, ds may be one of at least about: 10, 50, and 100, nm. In some non-limiting examples, the average film thickness ds of the deposited layer 130 in the deposited layer non-transition part 102t of the second portion 102 may be substantially the same (constant) thereacross.
  • ds may be at least that of the average film thickness di of the underlying layer 710.
  • a quotient dsldi may be one of at least about: 1.5, 2, 5, 10, 20, 50, and 100. In some non-limiting examples, the quotient dsldi may be in a range of one of between about: 0.1-10, and 0.2-40. [00626] In some non-limiting examples, ds may be at least that of an average film thickness ds of the patterning coating 110.
  • a quotient dslds may be one of at least about: 1.5, 2, 5, 10, 20, 50, and 100. In some non-limiting examples, the quotient dslds may be in a range of one of between about: 0.2-10, and 0.5-40.
  • ds may be at least that of ds and ds may be at least that of di. In some non-limiting examples, ds may be at least that of di and di may be at least that of ds.
  • a quotient dsldi may be between one of about: 0.2-3, and 0.1-5.
  • the deposited layer non-transition part 102n of the second portion 102 may have a width of ws.
  • the deposited layer non-transition part 102n of the second portion 102 may have a cross-sectional area as that, in some non-limiting examples, may be approximated by multiplying the average film thickness ds by the width ws.
  • ws may be at least that of the width ws of the patterning coating non-transition part 101n. In some non-limiting examples, ws may be at least that of ws.
  • a quotient wdws may be in a range of one of between about: 0.1-10, 0.2-5, 0.3-3, and 0.4-2. In some non-limiting examples, a quotient ws/ws may be one of at least about: 1, 2, 3, and 4.
  • ws may be at least that of the average film thickness ds of the deposited layer 130.
  • a quotient wslds may be one of at least about: 10, 50, 100, and 500. In some non-limiting examples, the quotient wslds may be no more than about 100,000.
  • the deposited layer 130 may have a thickness that decreases from a maximum to a minimum within the deposited layer transition region 102t.
  • the maximum may be proximate to the boundary between the deposited layer transition region 102t and the deposited layer nontransition part 102n of the second portion 102.
  • the minimum may be proximate to the deposited layer edge 635.
  • the maximum may be the average film thickness ds in the deposited layer nontransition part 102n of the second portion 102.
  • the minimum may be in a range of between about 0-0.1 nm.
  • the minimum may be the average film thickness ds in the deposited layer non-transition part 102n of the second portion 102.
  • a profile of the thickness in the deposited layer transition region 102t may be sloped. In some non-limiting examples, such profile may be tapered. In some non-limiting examples, the taper may follow one of a: linear, nonlinear, parabolic, and exponential decaying, profile.
  • the deposited layer 130 may completely cover the underlying layer 710 in the deposited layer transition region 102t.
  • the deposited layer 130 may comprise a substantially closed coating 140 in at least a part of the deposited layer transition region 102t.
  • at least a part of the underlying layer 710 may be uncovered by the deposited layer 130 in the deposited layer transition region 102t.
  • the deposited layer 130 may comprise a discontinuous layer 160 in at least a part of the deposited layer transition region 102t.
  • the patterning material 411 may also be present to some extent at an interface between the deposited layer 130 and an underlying layer 710. Such material may be deposited as a result of a shadowing effect, in which a deposited pattern is not identical to a pattern of a mask and may, in some non-limiting examples, result in some evaporated patterning material 411 being deposited on a masked part of a target exposed layer surface 11. In some non-limiting examples, such material may form as at least one of: particle structures 150, and as a thin film having a thickness that may be substantially no more than an average thickness of the patterning coating 110.
  • the deposited layer edge 635 may be spaced apart, in the lateral aspect from the patterning coating transition region 10 It of the first portion 101, such that there is no overlap between the first portion 101 and the second portion 102 in the lateral aspect.
  • At least a part of the first portion 101 and at least a part of the second portion 102 may overlap in the lateral aspect. Such overlap may be identified by an overlap portion 603, such as may be shown in some non-limiting examples in FIG. 6A, in which at least a part of the second portion 102 overlaps at least a part of the first portion 101.
  • At least a part of the deposited layer transition region 102t may be disposed over at least a part of the patterning coating transition region 10 It.
  • at least a part of the patterning coating transition region 10 It may be substantially devoid of at least one of: the deposited layer 130, and the deposited material 531.
  • the deposited material 531 may form a discontinuous layer 160 on an exposed layer surface 11 of at least a part of the patterning coating transition region 10 It.
  • At least a part of the deposited layer transition region 102t may be disposed over at least a part of the patterning coating non-transition part 101n of the first portion 101.
  • the overlap portion 603 may reflect a scenario in which at least a part of the first portion 101 overlaps at least a part of the second portion 102.
  • At least a part of the patterning coating transition region 10 It may be disposed over at least a part of the deposited layer transition region 102t.
  • at least a part of the deposited layer transition region 102t may be substantially devoid of at least one of the: patterning coating 110, and patterning material 411.
  • the patterning material 411 may form a discontinuous layer 160 on an exposed layer surface of at least a part of the deposited layer transition region 102t.
  • at least a part of the patterning coating transition region 10 It may be disposed over at least a part of the deposited layer nontransition part 102n of the second portion 102.
  • the patterning coating edge 615 may be spaced apart, in the lateral aspect, from the deposited layer non-transition part 102 n of the second portion 102.
  • the deposited layer 130 may be formed as a single monolithic coating across both the deposited layer non-transition part 102n and the deposited layer transition region 102t of the second portion 102.
  • At least one deposited layer 130 may provide, at least in part, the functionality of an EIL 239, in the emissive region 210.
  • Non-limiting examples, of the deposited material 531 for forming such initial deposited layer 130 include Yb, which for example, may be about 1-3 nm in thickness.
  • FIGs. 7A-7B describe various potential behaviours of patterning coatings 130 at a deposition interface with deposited layers 140.
  • FIG. 7A there may be shown a first example of a part of an example version 700 a of the device 100 at a patterning coating deposition boundary.
  • the device 700 a may comprise a substrate 10 having an exposed layer surface 11.
  • a patterning coating 110 may be deposited over a first portion 101 of the exposed layer surface 11 of the underlying layer 710.
  • a deposited layer 130 may be deposited over a second portion 102 of the exposed layer surface 11 of the underlying layer 710.
  • the first portion 101 and the second portion 102 may be distinct and nonoverlapping parts of the exposed layer surface 11.
  • the deposited layer 130 may comprise a first part 130i and a second part 1302. As shown, in some non-limiting examples, the first part 130i of the deposited layer 130 may substantially cover the second portion 102 and the second part 1302 of the deposited layer 130 may partially overlap (project over) a first part of the patterning coating 110. [00653] In some non-limiting examples, since the patterning coating 110 may be formed such that its exposed layer surface 11 exhibits a substantially low initial sticking probability against deposition of the deposited material 531, there may be a gap 729 formed between the projecting second part 1302 of the deposited layer 130 and the exposed layer surface 11 of the patterning coating 110.
  • the second part 1302 may not be in physical contact with the patterning coating 110 but may be spaced-apart therefrom by the gap 729 in a cross-sectional aspect.
  • the first part 130i of the deposited layer 130 may be in physical contact with the patterning coating 110 at an interface (boundary) between the first portion 101 and the second portion 102.
  • the projecting second part 1302 of the deposited layer 130 may extend laterally over the patterning coating 110 by a comparable extent as an average layer thickness d a of the first part 130i of the deposited layer 130.
  • a width Wb of the second part 1302 may be comparable to the average layer thickness d a of the first part 130i.
  • a ratio of a width wb of the second part 1302 by an average layer thickness d a of the first part 130i may be in a range of one of between about: 1 : 1-1 :3, 1 : 1-1 : 1.5, andl : 1-1 :2.
  • the average layer thickness cf may in some non-limiting examples be substantially uniform across the first part 130i, in some non-limiting examples, the extent to which the second part 1302 may project over the patterning coating 110 (namely M A) may vary to some extent across different parts of the exposed layer surface 11.
  • the deposited layer 130 may be shown to include a third part 1303 disposed between the second part 1302 and the patterning coating 110. As shown, the second part 1302 of the deposited layer 130 may extend laterally over and may be longitudinally spaced apart from the third part 1303 of the deposited layer 130 and the third part 1303 may be in physical contact with the exposed layer surface 11 of the patterning coating 110.
  • An average layer thickness d c of the third part 1303 of the deposited layer 130 may be no more than, and in some non-limiting examples, substantially less than, the average layer thickness d a of the first part 130i thereof.
  • a width Wc of the third part 1303 may be at least that of the width wb of the second part 1302. In some non-limiting examples, the third part 1303 may extend laterally to overlap the patterning coating 110 to a greater extent than the second part 1302. In some non-limiting examples, a ratio of a width w c of the third part 1303 by an average layer thickness d a of the first part 130i may be in a range of one of between about: 1 :2-3 : 1, and 1 : 1.2-2.5: 1.
  • the average layer thickness d a may in some non-limiting examples be substantially uniform across the first part 130i, in some non-limiting examples, the extent to which the third part 1303 may project (overlap) with the patterning coating 110 (namely w c ) may vary to some extent across different parts of the exposed layer surface 11.
  • the average layer thickness d c of the third part 1303 may be no more than about 5% of the average layer thickness d a of the first part 130i. In some non-limiting examples, d c may be one of no more than about: 4%, 3%, 2%, 1%, and 0.5% of da.
  • the deposited material 531 of the deposited layer 130 may form as particle structures 150 (not shown) on a part of the patterning coating 110. In some non-limiting examples, such particle structures 150 may comprise features that are physically separated from one another, such that they do not form a continuous layer.
  • an NPC 720 may be disposed between the substrate 10 and the deposited layer 130.
  • the NPC 720 may be disposed between the first part 130i of the deposited layer 130 and the second portion 102 of the exposed layer surface 11 of the underlying layer 710.
  • the NPC 720 is illustrated as being disposed on the second portion 102 and not on the first portion 101, where the patterning coating 110 has been deposited.
  • the NPC 720 may be formed such that, at an interface (boundary) between the NPC 720 and the deposited layer 130, a surface of the NPC 720 may exhibit a substantially high initial sticking probability against deposition of the deposited material 531. As such, the presence of the NPC 720 may promote the formation (growth) of the deposited layer 130 during deposition.
  • the NPC 720 may be disposed on both the first portion 101 and the second portion 102 of the substrate 10 and the underlying layer 710 may cover a part of the NPC 720 disposed on the first portion 101, and another part of the NPC 720 may be substantially devoid of the underlying layer 710 and of the patterning coating 110, and the deposited layer 130 may cover such part of the NPC 720.
  • the first portion 101 of the substrate 10 may be coated with the patterning coating 110 and the second portion may be coated with the deposited layer 130.
  • the deposited layer 130 may partially overlap a part of the patterning coating 110 in a third portion 703 of the substrate 10.
  • the deposited layer 130 may further comprise a fourth part 1304 that may be disposed between the first part 130i and the second part 1302 of the deposited layer 130 and in physical contact with the exposed layer surface 11 of the patterning coating 110.
  • the fourth part 1304 of the deposited layer 130 overlapping a subset of the patterning coating in the third portion 703 may be in physical contact with the exposed layer surface 11 thereof.
  • the overlap in the third portion 703 may be formed as a result of lateral growth of the deposited layer 130 during one of: an open mask, and mask-free, deposition process.
  • the exposed layer surface 11 of the patterning coating 110 may exhibit a substantially low initial sticking probability against deposition of the deposited material 531, and thus a probability of the material nucleating on the exposed layer surface 11 may be low, as the deposited layer 130 grows in thickness, the deposited layer 130 may also grow laterally and may cover a subset of the patterning coating 110 as shown.
  • an average layer thickness of the deposited layer 130 proximate to the interface may be less than an average film thickness ds of the deposited layer 130. While such tapered profile may be shown as being at least one of: curved, and arched, in some non-limiting examples, the profile may, in some non-limiting examples be substantially one of: linear, and non-linear. In some non-limiting examples, an average film thickness ds of the deposited layer 130 may decrease, without limitation, in a substantially at least one of: linear, exponential, and quadratic, fashion in a region proximate to the interface.
  • a contact angle 0c of the deposited layer 130 proximate to the interface between the deposited layer 130 and the patterning coating 110 may vary, depending on properties of the patterning coating 110, such as an initial sticking probability. It may be further postulated that the contact angle 0 (FIG. 15) of the nuclei may, in some non-limiting examples, dictate the thin film contact angle 0c of the deposited layer 130 formed by deposition. Referring to FIG. 7B in some non-limiting examples, the contact angle 0c may be determined by measuring a slope of a tangent of the deposited layer 130 proximate to the interface between the deposited layer 130 and the patterning coating 110.
  • the contact angle 0c may be determined by measuring the slope of the deposited layer 130 proximate to the interface. As will be appreciated by those having ordinary skill in the relevant art, the contact angle 0c may be generally measured relative to a non-zero angle of the underlying layer 710.
  • the patterning coating 110 and the deposited layer 130 may be shown deposited on a planar surface. However, those having ordinary skill in the relevant art will appreciate that the patterning coating 110 and the deposited layer 130 may be deposited on non-planar surfaces.
  • the contact angle 0c of the deposited layer 130 may be at least that of about 90° and, in some non-limiting examples, the deposited layer 130 may be shown as including a part 1302 extending past the interface between the patterning coating 110 and the deposited layer 130 and may be spaced apart from the patterning coating 110 (and, in some non-limiting examples, the third part 1303 of the deposited layer 130) by the gap 729. In such non-limiting scenario, the contact angle 0c may, in some non-limiting examples, be at least that of 90°.
  • a deposited layer 140 exhibiting a substantially high contact angle 0c there may be scenarios calling for a deposited layer 140 exhibiting a substantially high contact angle 0c.
  • the contact angle 0 C may be one of at least about: 10°, 15°, 20°, 25°, 30°, 35°, 40°, 50°, 70°, 75°, and 80°.
  • a deposited layer 130 having a substantially high contact angle 0c may allow for creation of finely patterned features while maintaining a substantially high aspect ratio.
  • the contact angle 0 C may be one of at least about: 90°, 95°, 100°, 105°, 110° 120°, 130°, 135°, 140°, 145°, 150°, and 170°.
  • the contact angle 0 C of the deposited layer 130 may be measured at an edge thereof near the interface between it and the patterning coating 110, as shown.
  • the contact angle 0 C may be at least about 90°, which may in some non-limiting examples result in a subset, namely the second part 1302, of the deposited layer 130 being spaced apart from the patterning coating 110 (and, in some nonlimiting examples, the third part 1303 of the deposited layer 130) by the gap 729.
  • An NP is a particle of matter whose predominant characteristic size is of nanometer (nm) scale, generally understood to be between about: 1-300 nm. At nm scale, NPs of a given material may possess unique properties (including without limitation, optical, chemical, physical, and electrical) relative to the same material in bulk form, including without limitation, an amount of absorption of EM radiation exhibited by such NPs at different wavelengths (ranges).
  • such NPs may be formed into at least one of: a close-packed layer, and dispersed into a matrix material, of such device 100. Consequently, in some non-limiting examples, the thickness of such an NP layer may be much thicker than the characteristic size of the NPs themselves. The thickness of such NP layer may impart undesirable characteristics in terms of at least one of: device performance, device stability, device reliability, and device lifetime that may reduce, including without limitation, obviate, any perceived advantages provided by the unique properties of NPs.
  • wet chemical methods may be used to introduce NPs that have a precisely controlled at least one of: characteristic size, length, width, diameter, height, size distribution, shape, surface coverage, configuration, deposited density, dispersity, and composition into an opto-electronic device 200.
  • such methods may, in some non-limiting examples, employ an organic capping group (such as the synthesis of citrate-capped Ag NPs) to stabilize the NPs, but such organic capping groups introduce at least one of: C, O, and S into the synthesized NPs.
  • an NP layer deposited from solution may comprise at least one of: C, O, and S, because of the solvents used in deposition.
  • these elements may be introduced as contaminants during at least one of: the wet chemical process, and the deposition of the NP layer.
  • the NP layer(s) when depositing an NP layer from solution, as the employed solvents dry, the NP layer(s) may tend to have non-uniform properties at least one of: across the NP layer, and between different patterned regions of such layer.
  • an edge of a given layer may be considerably at least one of: thicker, and thinner, than an internal region of such layer, which disparities may adversely impact at least one of the device: performance, stability, reliability, and lifetime.
  • the poor control of at least one of the: characteristic size, length, width, diameter, height, size distribution, shape, surface coverage, configuration, deposited density, dispersity, and composition, imparted by such methods may result in poor at least one of device: performance, stability, reliability, and lifetime.
  • there may be at least one particle including without limitation, at least one of: a nanoparticle (NP), an island, a plate, a disconnected cluster, and a network (collectively particle structure 150) disposed on an exposed layer surface 11 of an underlying layer 710.
  • the underlying layer 710 may be the patterning coating 110 in the first portion 101.
  • the at least one particle structure 150 may be disposed on an exposed layer surface 11 of the patterning coating 110.
  • the at least one particle structure 150 may comprise a particle material.
  • the particle material may be the same as the deposited material 531 in the deposited layer.
  • the particle material in the discontinuous layer 160 in the first portion 101, at least one of: the deposited material 531 in the deposited layer 130, and a material of which the underlying layer 710 thereunder may be comprised may comprise a metal in common.
  • the particle material may comprise an element selected from at least one of: K, Na, Li, Ba, Cs, Yb, Ag, Au, Cu, Al, Mg, Zn, Cd, Sn, and Y.
  • the element may comprise at least one of: K, Na, Li, Ba, Cs, Yb, Ag, Au, Cu, Al, and Mg.
  • the element may comprise at least one of: Cu, Ag, and Au.
  • the element may be Cu.
  • the element may be Al.
  • the element may comprise at least one of: Mg, Zn, Cd, and Yb.
  • the element may comprise at least one of: Mg, Ag, Al, Yb, and Li. In some non-limiting examples, the element may comprise at least one of: Mg, Ag, and Yb. In some non-limiting examples, the element may comprise at least one of: Mg, and Ag. In some non-limiting examples, the element may be Ag.
  • the particle material may comprise a pure metal.
  • the at least one particle structure 150 may be a pure metal.
  • the at least one particle structure 150 may be (substantially) pure Ag.
  • the substantially pure Ag may have a purity of one of about: 95%, 99%, 99.9%, 99.99%, 99.999%, and 99.9995%.
  • the at least one particle structure 150 may be (substantially) pure Mg.
  • the substantially pure Mg may have a purity of one of at least about: 95%, 99%, 99.9%, 99.99%, 99.999%, and 99.9995%.
  • the at least one particle structure 150 may comprise an alloy.
  • the alloy may be at least one of an: Ag- containing, Mg-containing, and AgMg-containing, alloy.
  • the AgMg-containing alloy may have an alloy composition that may range from about 1 : 10 (Ag:Mg) to about 10: 1 by volume.
  • the particle material may comprise other metals one of: in place of, and in combination with, Ag.
  • the particle material may comprise an alloy of Ag with at least one other metal.
  • the particle material may comprise an alloy of Ag with at least one of: Mg, and Yb.
  • such alloy may be a binary alloy having a composition of between about: 5-95 vol.% Ag, with the remainder being the other metal.
  • the particle material may comprise Ag and Mg.
  • the particle material may comprise an Ag:Mg alloy having a composition of between about 1 : 10-10: 1 by volume.
  • the particle material may comprise Ag and Yb. In some non-limiting examples, the particle material may comprise a Yb:Ag alloy having a composition of between about 1 :20-10: 1 by volume. In some non-limiting examples, the particle material may comprise Mg and Yb. In some non-limiting examples, the particle material may comprise an Mg: Yb alloy. In some non-limiting examples, the particle material may comprise an Ag:Mg:Yb alloy.
  • the at least one particle structure 150 may comprise at least one additional element.
  • such additional element may be a non-metallic element.
  • the non-metallic material may be at least one of: O, S, N, and C. It will be appreciated by those having ordinary skill in the relevant art that, in some non-limiting examples, such additional element(s) may be incorporated into the at least one particle structure 150 as a contaminant, due to the presence of such additional element(s) in at least one of: the source material, equipment used for deposition, and the vacuum chamber environment. In some nonlimiting examples, such additional element(s) may form a compound together with other element(s) of the at least one particle structure 150.
  • a concentration of the non-metallic element in the particle material may be one of no more than about: 1%, 0.1%, 0.01%, 0.001%, 0.0001%, 0.00001%, 0.000001%, and 0.0000001%.
  • the at least one particle structure 150 may have a composition in which a combined amount of O and C therein is one of no more than about: 10%, 5%, 1%, 0.1%, 0.01%, 0.001%, 0.0001%, 0.00001%, 0.000001%, and 0.0000001%.
  • the at least one particle structure 150 takes advantage of plasmonics, a branch of nanophotonics, which studies the resonant interaction of EM radiation with metals.
  • metal NPs may exhibit at least one of: localized surface plasmon (LSP) excitations, and coherent oscillations of free electrons, whose optical response may be tailored by varying at least one of a: characteristic size, size distribution, shape, surface coverage, configuration, deposited density, and composition, of the nanostructures.
  • LSP localized surface plasmon
  • Such optical response in respect of particle structures 150, may include absorption of EM radiation incident thereon, thereby reducing at least one of: reflection thereof, and shifting to one of a: lower, and higher, wavelength ((sub-) range) of the EM spectrum, including without limitation, (a sub-range of) the visible spectrum.
  • disposing particle material, in some non-limiting examples, as a discontinuous layer 160 of at least one particle structure 150 on an exposed layer surface 11 of an underlying layer 710, such that the at least one particle structure 150 is in physical contact with the underlying layer 710 may, in some non-limiting examples, favorably shift the absorption spectrum of the particle material, including without limitation, blue-shift, such that it does not substantially overlap with a wavelength range of the EM spectrum of EM radiation being at least one of: emitted by, and transmitted at least partially through, the device 100.
  • a peak absorption wavelength of the at least one particle structure 150 may be less than a peak wavelength of the EM radiation being at least one of: emitted by, and transmitted, at least partially through the device 100.
  • the particle material may exhibit a peak absorption at a wavelength (range) that is one of no more than about: 470, 460, 455, 450, 445, 440, 430, 420, and 400, nm.
  • providing particle material including without limitation, in the form of at least one particle structure 150, including without limitation, those comprised of a metal, proximate to, including without limitation, within, a at least one low(er)-index coating, may further impact at least one of the: absorption, and transmittance, of EM radiation passing through the device 100, including without limitation, in the first direction, in at least a wavelength (sub-) range of the EM spectrum, including without limitation, (a sub-range of) the visible spectrum, passing in the first direction from, including without limitation, through, the at least one low(er)-index layer(s) and the at least one particle structure(s) 150.
  • the absorption may be concentrated in an absorption spectrum that is a wavelength (sub-) range of the EM spectrum, including without limitation, (a sub-range of) the visible spectrum.
  • the absorption spectrum may be one of: blue-shifted, and shifted to a higher wavelength (sub-) range (red-shifted), including without limitation, to a wavelength (sub-) range of the EM spectrum, including without limitation, (a sub-range of) the visible spectrum, and to a wavelength (sub-) range of the EM spectrum that lies, at least in part, beyond the visible spectrum.
  • a plurality of layers of at least one particle structure 150 may be disposed on one another, whether separated by additional layers, with varying lateral aspects and having different absorption spectra. In this fashion, the absorption of certain regions of the device 100 may be tuned according to at least one desired absorption spectra.
  • the presence of the at least one particle structure 150, including without limitation, NPs, including without limitation, in a discontinuous layer 160, on an exposed layer surface 11 of the patterning coating 110 may affect some optical properties of the device 100.
  • such plurality of particle structures 150 may form a discontinuous layer 160.
  • the discontinuous layer 160 may comprise features, including particle structures 150, that may be physically separated from one another, such that the particle structures 150 do not form a closed coating 140. Accordingly, such discontinuous layer 160 may, in some non-limiting examples, thus comprise a thin disperse layer of deposited material 531 formed as particle structures 150, inserted at, including without limitation, substantially across, the lateral extent of, an interface between the patterning coating 110 and at least one overlying layer in the device 100.
  • At least one of the particle structures 150 of particle material may be in physical contact with an exposed layer surface 11 of the patterning coating 110. In some non-limiting examples, substantially all of the particle structures 150 of particle material may be in physical contact with the exposed layer surface 11 of the patterning coating 110.
  • the presence of such a thin, disperse discontinuous layer 160 of particle material, including without limitation, at least one particle structure 150, including without limitation, metal particle structures 150, on an exposed layer surface 11 of the patterning coating 110 may exhibit at least one varied characteristic and concomitantly, varied behaviour, including without limitation, optical effects and properties of the device 100, as discussed herein.
  • such effects and properties may be controlled to some extent by judicious selection of at least one of the: characteristic size, size distribution, shape, surface coverage, configuration, deposited density, and dispersity, of the particle structures 150 on the patterning coating 110.
  • the particle structures 150 may be controllably selected so as to have at least one of a: characteristic size, length, width, diameter, height, size distribution, shape, surface coverage, configuration, deposited density, dispersity, and composition, to achieve an effect related to an optical response exhibited by the particle structures 150.
  • At least one of an actual: size, height, weight, thickness, shape, profile, and spacing, of the at least one particle structure 150 may be, in some non-limiting examples, substantially non- uniform.
  • the at least one particle structure 150 are illustrated as having a given profile, this is intended to be illustrative only, and not determinative of at least one of a: size, height, weight, thickness, shape, profile, and spacing, thereof.
  • the at least one particle structure 150 may have a characteristic dimension of no more than about 200 nm. In some non-limiting examples, the at least one particle structure 150 may have a characteristic diameter that may be one of between about: 1-200, 1-160, 1-100, 1-50, and 1-30, nm.
  • the at least one particle structure 150 may comprise discrete metal plasmonic islands (clusters).
  • the at least one particle structure 150 may comprise a particle material.
  • such particle structures 150 may be formed by depositing a scant amount, in some non-limiting examples, having an average layer thickness that may be on the order of one of: a few, and a fraction of one, angstrom(s), of a particle material on an exposed layer surface 11 of the underlying layer 710.
  • the exposed layer surface 11 may be of an NPC 720.
  • the particle material may comprise at least one of: Ag, Yb, and Mg.
  • the formation of at least one of: the characteristic size, size distribution, shape, surface coverage, configuration, deposited density, and dispersity, of such discontinuous layer 160 may be controlled, in some nonlimiting examples, by judicious selection of at least one of: at least one characteristic of the patterning material 411, an average film thickness d of the patterning coating 110, the introduction of heterogeneities in at least one of: the patterning coating 110, and a deposition environment, including without limitation, a temperature, pressure, duration, deposition rate, and deposition process, for the patterning coating 110.
  • the formation of at least one of the characteristic size, size distribution, shape, surface coverage, configuration, deposited density, and dispersity, of such discontinuous layer 160 may be controlled, in some nonlimiting examples, by judicious selection of at least one of: at least one characteristic of the particle material (which may be the deposited material 531), an extent to which the patterning coating 110 may be exposed to deposition of the particle material (which, in some non-limiting examples may be specified in terms of a thickness of the corresponding discontinuous layer 160), and a deposition environment, including without limitation, at least one of a: temperature, pressure, duration, deposition rate, and method of deposition, for the particle material.
  • the discontinuous layer 160 may be deposited in a pattern across the lateral extent of the patterning coating 110.
  • the discontinuous layer 160 may be disposed in a pattern that may be defined by at least one region therein that is substantially devoid of the at least one particle structure 150.
  • the characteristics of such discontinuous layer 160 may be assessed, in some non-limiting examples, somewhat arbitrarily, according to at least one of several criteria, including without limitation, at least one of a: characteristic size, size distribution, shape, configuration, surface coverage, deposited distribution, dispersity, and a presence, and an extent of aggregation instances, of the particle material, formed on a part of the exposed layer surface 11 of the underlying layer 710.
  • an assessment of the discontinuous layer 160 according to such at least one criterion may be performed on, including without limitation, by at least one of: measuring, and calculating, at least one attribute of the discontinuous layer 160, using a variety of imaging techniques, including without limitation, at least one of: transmission electron microscopy (TEM), atomic force microscopy (AFM), and scanning electron microscopy (SEM).
  • TEM transmission electron microscopy
  • AFM atomic force microscopy
  • SEM scanning electron microscopy
  • the discontinuous layer 160 may be assessed across the entire extent, in at least one of a: first, and second, lateral aspect that is substantially transverse thereto, of the exposed layer surface 11. In some non-limiting examples, the discontinuous layer 160 may be assessed across an extent that comprises at least one observation window applied against (a part of) the discontinuous layer 160.
  • the at least one observation window may be located at at least one of: a perimeter, an interior location, and a grid coordinate, of the lateral aspect of the exposed layer surface 11.
  • a plurality of the at least one observation windows may be used in assessing the discontinuous layer 160.
  • the observation window may correspond to a field of view of an imaging technique applied to assess the discontinuous layer 160, including without limitation, at least one of: TEM, AFM, and SEM.
  • the observation window may correspond to a given level of magnification, including without limitation, one of: 2.00, and 1.00, pm, and 500, and 200, nm.
  • the assessment of the discontinuous layer 160 may involve at least one of: calculating, and measuring, by any number of mechanisms, including without limitation, at least one of: manual counting, and known estimation techniques, which may, in some non-limiting examples, comprise at least one of: curve, polygon, and shape, fitting techniques.
  • the assessment of the discontinuous layer 160 may involve at least one of: calculating, and measuring, at least one of: an average, a median, a mode, a maximum, a minimum, and other at least one of: probabilistic, statistical, and data, manipulation, of a value of the at least one of: calculation, and measurement.
  • one of the at least one criterion by which such discontinuous layer 160 may be assessed may be a surface coverage of the particle material on such (part of the) discontinuous layer 160.
  • the surface coverage may be represented by a (non-zero) percentage coverage by such particle material of such (part of the) discontinuous layer 160.
  • the percentage coverage may be compared to a maximum threshold percentage coverage.
  • a (part of a) discontinuous layer 160 having a surface coverage that may be substantially no more than the maximum threshold percentage coverage may result in a manifestation of different optical characteristics that may be imparted by such part of the discontinuous layer 160, to EM radiation passing therethrough, whether at least one of: transmitted entirely through the device 100, and emitted thereby, relative to EM radiation passing through a part of the discontinuous layer 160 having a surface coverage that may be substantially at least the maximum threshold percentage coverage.
  • one measure of a surface coverage of an amount of an electrically conductive material on a surface may be a (EM radiation) transmittance, since in some non-limiting examples, electrically conductive materials, including without limitation, metals, including without limitation: Ag, Mg, and Yb, may at least one of: attenuate, and absorb, EM radiation.
  • electrically conductive materials including without limitation, metals, including without limitation: Ag, Mg, and Yb, may at least one of: attenuate, and absorb, EM radiation.
  • surface coverage may be understood to encompass at least one of: particle size, and deposited density.
  • a plurality of these three criteria may be positively correlated.
  • a criterion of low surface coverage may comprise some combination of a criterion of low deposited density with a criterion of low particle size.
  • one of the at least one criterion by which such discontinuous layer 160 may be assessed may be a characteristic size of the constituent particle structures 150.
  • the at least one particle structure 150 of the discontinuous layer 160 may have a characteristic size that is no more than a maximum threshold size.
  • the characteristic size may include at least one of: height, width, length, and diameter.
  • substantially all of the particle structures 150 of the discontinuous layer 160 may have a characteristic size that lies within a specified range.
  • such characteristic size may be characterized by a characteristic length, which in some non-limiting examples, may be considered a maximum value of the characteristic size. In some non-limiting examples, such maximum value may extend along a major axis of the particle structure 150. In some non-limiting examples, the major axis may be understood to be a first dimension extending in a plane defined by the plurality of lateral axes. In some non-limiting examples, a characteristic width may be identified as a value of the characteristic size of the particle structure 150 that may extend along a minor axis of the particle structure 150. In some non-limiting examples, the minor axis may be understood to be a second dimension extending in the same plane but substantially transverse to the major axis.
  • the characteristic length of the at least one particle structure 150, along the first dimension may be no more than the maximum threshold size.
  • the characteristic width of the at least one particle structure 150, along the second dimension may be no more than the maximum threshold size.
  • a size of the constituent particle structures 150, in the (part of the) discontinuous layer 160 may be assessed by at least one of: calculating, and measuring a characteristic size of such at least one particle structure 150, including without limitation, at least one of a: mass, volume, length of a diameter, perimeter, major, and minor axis, thereof.
  • one of the at least one criterion by which such discontinuous layer 160 may be assessed may be a deposited density thereof.
  • the characteristic size of the particle structure 150 may be compared to a maximum threshold size.
  • the deposited density of the particle structures 150 may be compared to a maximum threshold deposited density.
  • At least one of such criteria may be quantified by a numerical metric.
  • a numerical metric may be a calculation of a dispersity D that describes the distribution of particle (area) sizes in a deposited layer 130 of particle structures 150, in which, pursuant to Equations (l)-(2): where: n is the number of particle structures 150 in a sample area,
  • Si is the (area) size of the / th particle structure 150
  • S n is the number average of the particle (area) sizes
  • S s is the (area) size average of the particle (area) sizes.
  • dispersity is roughly analogous to a poly dispersity index (PDI) and that these averages are roughly analogous to the concepts of number average molecular weight and weight average molecular weight familiar in organic chemistry, but applied to an (area) size, as opposed to a molecular weight of a sample particle structure 150.
  • PDI poly dispersity index
  • dispersity may, in some non-limiting examples, be considered a three- dimensional volumetric concept, in some non-limiting examples, the dispersity may be considered to be a two-dimensional concept.
  • the concept of dispersity may be used in connection with viewing and analyzing two-dimensional images of the deposited layer 130, such as may be obtained by using a variety of imaging techniques, including without limitation, at least one of: TEM, AFM, and SEM. It is in such a two-dimensional context, that the equations set out above are defined.
  • At least one of: the dispersity, and the number average, of the particle (area) size and the (area) size average of the particle (area) size may involve a calculation of at least one of: the number average of the particle diameters and the (area) size average of the particle diameters, pursuant to Equation (3):
  • the particle material including without limitation as particle structures 150, of the at least one deposited layer 130, may be deposited by one of: an open mask, and mask-free, deposition process.
  • the particle structures 150 may have a substantially round shape. In some non-limiting examples, the particle structures 150 may have a substantially spherical shape.
  • each particle structure 150 may be substantially the same (and, in any event, may not be directly measured from a plan view SEM image) so that the (area) size of the particle structure 150 may be represented as a two-dimensional area coverage along the pair of lateral axes.
  • a reference to an (area) size may be understood to refer to such two-dimensional concept, and to be differentiated from a size (without the prefix “area”) that may be understood to refer to a one-dimensional concept, such as a linear dimension.
  • the longitudinal extent, along the longitudinal axis, of such particle structures 150 may tend to be small relative to the lateral extent (along at least one of the lateral axes), such that the volumetric contribution of the longitudinal extent thereof may be much less than that of such lateral extent.
  • this may be expressed by an aspect ratio (a ratio of a longitudinal extent to a lateral extent) that may be no more than 1.
  • such aspect ratio may be one of about: 1 : 10, 1 :20, 1 :50, 1 :75, and 1 :300.
  • certain metal NPs may exhibit at least one of: surface plasmon (SP) excitations, and coherent oscillations of free electrons, with the result that such NPs may one of: absorb, and scatter, light in a range of the EM spectrum, including without limitation, (a sub-range of) the visible spectrum.
  • SP surface plasmon
  • the optical response including without limitation, at least one of: the (sub-) range of the EM spectrum over which absorption may be concentrated (absorption spectrum), refractive index, and extinction coefficient, of such one of: LSP excitations, and coherent oscillations, may be tailored by varying properties of such NPs, including without limitation, at least one of a: characteristic size, size distribution, shape, surface coverage, configuration, deposition density, dispersity, and property, including without limitation, at least one of: material, and degree of aggregation, of at least one of: the nanostructures, and a medium proximate thereto.
  • Such optical response, in respect of photon-absorbing coatings, may include absorption of photons incident thereon, thereby reducing reflection.
  • the absorption may be concentrated in a range of the EM spectrum, including without limitation, (a sub-range of) the visible spectrum.
  • the at least one particle structure 150 may absorb EM radiation incident thereon from beyond the layered semiconductor device 100, thus reducing reflection, those having ordinary skill in the relevant art will appreciate that, in some non-limiting examples, the at least one particle structure 150 may absorb EM radiation incident thereon that is emitted by the device 100.
  • employing a photon-absorbing layer as part of an optoelectronic device 200 may reduce reliance on a polarizer therein.
  • NP-based outcoupling layer above the cathode may be fabricated in vacuum (and thus, may have applicability for use in a commercial OLED fabrication process), by depositing a metal particle material in a discontinuous layer 160 onto a patterning coating 110, which in some non-limiting examples, may at least one of: be, and be deposited on, the cathode.
  • a patterning coating 110 which in some non-limiting examples, may at least one of: be, and be deposited on, the cathode.
  • Such process may avoid the use of one of: solvents, and other wet chemicals, that may at least one of: cause damage to the OLED device 200 and may adversely impact device reliability.
  • the presence of such a discontinuous layer 160 of particle material may contribute to enhanced extraction of at least one of: EM radiation, performance, stability, reliability, and lifetime of the device 100.
  • the existence, in a layered device 100, of at least one discontinuous layer 160, proximate to at least one of: the exposed layer surface 11 of a patterning coating 110, and, in some non-limiting examples, proximate to the interface of such patterning 110 with at least one overlying layer 170, may impart optical effects to EM signals, including without limitation, photons, that are one of: emitted by the device 100, and transmitted therethrough.
  • optical effects to EM signals including without limitation, photons, that are one of: emitted by the device 100, and transmitted therethrough.
  • the presence of such a discontinuous layer 160 of the particle material, including without limitation, at least one particle structure 150 may reduce (mitigate) crystallization of thin film coatings disposed adjacent in the longitudinal aspect, including without limitation, at least one of the patterning coating 110, and at least one overlying layer 170, thereby stabilizing the property of the thin film(s) disposed adjacent thereto, and, in some non-limiting examples, reducing scattering.
  • such thin film may comprise at least one layer of at least one of an outcoupling, and an encapsulating coating (not shown) of the device 100, including without limitation, a capping layer (CPL).
  • the presence of such a discontinuous layer 160 of particle material, including without limitation, at least one particle structure 150 may provide an enhanced absorption in at least a part of the UV spectrum.
  • controlling the characteristics of such particle structures 150 including without limitation, at least one of characteristic size, size distribution, shape, surface coverage, configuration, deposited density, dispersity, particle material, and refractive index, of the particle structures 150, may facilitate controlling the degree of absorption, wavelength range and peak wavelength of the absorption spectrum, including in the UV spectrum.
  • Enhanced absorption of EM radiation in at least a part of the UV spectrum may have applicability in some scenarios, for improving at least one of device performance, stability, reliability, and lifetime.
  • the optical effects may be described in terms of its impact on at least one of the transmission, and absorption wavelength spectrum, including at least one of a: wavelength range, and peak intensity thereof.
  • FIGs. 8A-8H illustrate non-limiting examples of possible interactions between the particle structure patterning coating 110 p and the at least one particle structure 150t in contact therewith.
  • the particle material may be in physical contact with the patterning material 411, including without limitation, as shown in the various figures, being one of: deposited thereon, and being substantially surrounded thereby.
  • the particle material may be in physical contact with the particle structure patterning coating 110 p in that it is deposited thereon.
  • the particle material may be substantially surrounded by the particle structure patterning coating 110 p .
  • the at least one particle structure 150 may be distributed throughout at least one of: the lateral, and longitudinal, extent of the particle structure patterning coating 110 p .
  • the distribution of the at least one particle structure 150 throughout the particle structure patterning coating 110 p may be achieved by causing the particle structure patterning coating 110 p to be at least one of: deposited, and to remain, in a substantially viscous state at the time of deposition of the particle material thereon, such that the at least one particle structure 150t may tend to penetrate (settle) within the particle structure patterning coating 110 p .
  • the viscous state of the particle structure patterning coating 110 p may be achieved in a number of manners, including without limitation, conditions during deposition of the patterning material 411, including without limitation, at least one of: a time, temperature, and pressure, of the deposition environment thereof, a composition of the patterning material 411, a characteristic of the patterning material 411, including without limitation, a melting point, a freezing temperature, a sublimation temperature, a viscosity, and a surface energy, thereof, conditions during deposition of the particle material, including without limitation, at least one of: a time, temperature, and pressure, of the deposition environment thereof, a composition of the particle material, and a characteristic of the particle material, including without limitation, a melting point, a freezing temperature, a sublimation temperature, a viscosity, and a surface energy thereof.
  • the distribution of the at least one particle structure 150 throughout the particle structure patterning coating 110 p may be achieved through the presence of small apertures, including without limitation, at least one of: pinholes, tears, and cracks, therein.
  • small apertures including without limitation, at least one of: pinholes, tears, and cracks, therein.
  • apertures may be formed during the deposition of a thin film of the patterning structure patterning coating 110 p , using various techniques and processes, including without limitation, those described herein, due to inherent variability in the deposition process, and in some non-limiting examples, to the existence of impurities in at least one of the particle material and the exposed layer surface 11 of the patterning material 411.
  • the particle material of which the at least one particle structure 150 may be comprised may settle at a bottom of the particle structure patterning coating 110 p such that it is effectively disposed on the exposed layer surface 11 of the underlying layer 710.
  • the distribution of the at least one particle structure 150 at a bottom of the particle structure patterning coating 110 p may be achieved by causing the particle structure patterning coating 110 p to be at least one of: deposited, and to remain, in a substantially viscous state at the time of deposition of the particle material thereon, such that the at least one particle structure 150 may tend to settle to the bottom of the particle structure patterning coating 110 p .
  • the viscosity of the patterning material 411 used in FIG. 8C may be no more than the viscosity of the patterning material 411 used in FIG. 8B, allowing the at least one particle structure 150 to settle further within the particle structure patterning coating 110 p , eventually descending to the bottom thereof.
  • FIGs. 8D-8F a shape of the at least one particle structure 150 is shown as being longitudinally elongated relative to a shape of the at least one particle structure 150 of FIG. 8B
  • the longitudinally elongated shape of the at least one particle structure 150 may be achieved in a number of manners, including without limitation, conditions during deposition of the patterning material 411, including without limitation, at least one of: a time, temperature, and pressure, of the deposition environment thereof, a composition of the patterning material 411, a characteristic of the patterning material 411, including without limitation, a melting point, a freezing temperature, a sublimation temperature, a viscosity, and a surface energy thereof, conditions during deposition of the particle material, including without limitation, a time, temperature, and pressure, of the deposition environment thereof, a composition of the particle material, and a characteristic of the particle material, including without limitation, a melting point, a freezing temperature, a sublimation temperature, a viscosity, and a surface energy thereof, that may tend to facilitate the deposition of such longitudinally elongated particle structures 150.
  • the longitudinally elongated particle structures 150 are shown to remain substantially entirely within the particle structure patterning coating 110 p .
  • at least one of the longitudinally elongated particle structures 150 may be shown to protrude at least partially beyond the exposed layer surface 11 of the particle structure patterning coating 110 p .
  • at least one of the longitudinally elongated particle structures 150 may be shown to protrude substantially beyond the exposed layer surface 11 of the particle structure patterning coating 110 p , to the extent that such protruding particle structures 150 may begin to be considered to be substantially deposited on the exposed layer surface 11 of the particle structure patterning coating 110 p .
  • FIG. 8G there may be a scenario in which at least one particle structure 150 may be deposited on the exposed layer surface 11 of the particle structure patterning coating 110 p and at least one particle structure 150 may settle within the particle structure patterning coating 110 p .
  • the at least one particle structure 150 shown within the particle structure patterning coating 110 p is shown as having a shape such as is shown in FIG. 8B, those having ordinary skill in the relevant art will appreciate that, although not shown, such particle structures 150 may have a longitudinally elongated shape such as is shown in FIGs. 8D-8F.
  • FIG. 8H shows a scenario in which at least one particle structure 150 may be deposited on the exposed layer surface 11 of the particle structure patterning coating 110 p , at least one particle structure 150 may penetrate (settle within) the particle structure patterning coating 110 p , and at least one particle structure 150 may settle to the bottom of the particle structure patterning coating 110 p .
  • auxiliary electrode 950 FOG. 9
  • the second electrode 240 may be formed by depositing a substantially thin conductive film layer in order, in some non-limiting examples, to reduce optical interference (including, without limitation, at least one of: attenuation, reflections, and diffusion) related to the presence of the second electrode 240.
  • the second electrode 240 may be formed as a substantially thick conductive layer without substantially affecting optical characteristics of such a device 200. Nevertheless, even in such scenarios, the second electrode 240 may nevertheless be formed as a substantially thin conductive film layer, in some non-limiting examples, so that the device 200 may be substantially transmissive relative to EM radiation incident on an external surface thereof, such that a substantial part of such externally-incident EM radiation may be transmitted through the device 200, in addition to the emission of EM radiation generated internally within the device 200 as disclosed herein.
  • a device 200 having at least one electrode 220, 240 with a high sheet resistance may create a large current resistance (IR) drop when coupled with the power source 204, in operation.
  • IR current resistance
  • such an IR drop may be compensated for, to some extent, by increasing a level of the power source 204.
  • increasing the level of the power source 204 to compensate for the IR drop due to high sheet resistance, for at least one (sub-) pixel 1015/216 may call for increasing the level of a voltage to be supplied to other components to maintain effective operation of the device 200.
  • a reduced thickness of the second electrode 240 may generally increase a sheet resistance of the second electrode 240, which may, in some non-limiting examples, reduce at least one of: the performance, and efficiency, of the device 200.
  • the auxiliary electrode 950 that may be electrically coupled with the second electrode 240, the sheet resistance and thus, the IR drop associated with the second electrode 240, may, in some non-limiting examples, be decreased.
  • an auxiliary electrode 950 may be formed on the device 200 to allow current to be carried more effectively to various emissive region(s) 210 of the device 200, while at the same time, reducing the sheet resistance and its associated IR drop of the transmissive electrode 220, 240.
  • a sheet resistance specification for a common electrode 220, 240 of a display device 200, may vary according to several parameters, including without limitation, at least one of: a (panel) size of the device 200, and a tolerance for voltage variation across the device 200.
  • the sheet resistance specification may increase (that is, a lower sheet resistance is specified) as the panel size increases.
  • the sheet resistance specification may increase as the tolerance for voltage variation decreases.
  • a sheet resistance specification may be used to derive an example thickness of an auxiliary electrode 950 to comply with such specification for various panel sizes.
  • the auxiliary electrode 950 may be electrically coupled with the second electrode 240 to reduce a sheet resistance thereof.
  • the auxiliary electrode 950 may be in physical contact, including without limitation, being deposited over at least a part thereof, with the second electrode 240 to reduce a sheet resistance thereof.
  • the auxiliary electrode 950 may not be in physical contact with the second electrode 240 but may be electrically coupled with the second electrode 240 by several well -understood mechanisms.
  • the presence of a substantially thin film (in some non-limiting examples, of up to about 50 nm) of a patterning coating 110 extending between and separating the auxiliary electrode 950 and the second electrode 240, may still allow a current to pass therethrough, thus allowing a sheet resistance of the second electrode 240 to be reduced.
  • the auxiliary electrode 950 may be electrically conductive.
  • the auxiliary electrode 950 may be formed by at least one of: a metal, and a metal oxide. Non-limiting examples of such metals include Cu, Al, molybdenum (Mo), and Ag.
  • the auxiliary electrode 950 may comprise a multi-layer metallic structure, including without limitation, one formed by Mo/Al/Mo.
  • metal oxides include ITO, ZnO, IZO, and other oxides comprising In, and Zn.
  • the auxiliary electrode 950 may comprise a multi-layer structure formed by a combination of at least one metal and at least one metal oxide, including without limitation, Ag/ITO, Mo/ITO, ITO/Ag/ITO, and ITO/Mo/ITO.
  • the auxiliary electrode 950 comprises a plurality of such electrically conductive materials.
  • the deposited material 531 disposed in the first portion 101 may tend to not remain, resulting in a pattern of selective deposition of the deposited layer 130, that may correspond substantially to at least one second portion 102, leaving the first portion 101 substantially devoid of a closed coating 140 of the deposited layer 130.
  • the deposited layer 130 that may form the auxiliary electrode 950 may be selectively deposited substantially only on a second portion 102 comprising those regions of the at least one semiconducting layer 230, that surround but do not occupy the first portion 101.
  • selectively depositing the auxiliary electrode 950 to cover only certain portions 102 of the lateral aspect of the device 200, while other portions 101 thereof remain uncovered, may one of: control, and reduce, optical interference related to the presence of the auxiliary electrode 950.
  • the auxiliary electrode 950 may be selectively deposited in a pattern that may not be readily detected by the naked eye from a typical viewing distance.
  • the auxiliary electrode 950 may be formed in devices 100 other than OLED devices 200, including for decreasing an effective resistance of the electrodes of such devices 200.
  • FIG. 9 there may be shown an example version 900 of the device 200, which may encompass the device 200 shown in cross-sectional view in FIG. 2, but with additional deposition steps that are described herein.
  • the device 900 may show a patterning coating 110 deposited over the exposed layer surface 11 of the underlying layer 710, in the figure, the second electrode 240.
  • the patterning coating 110 may provide an exposed layer surface 11 with a substantially low initial sticking probability against deposition of a deposited material 531 to be thereafter deposited as a deposited layer 130 to form an auxiliary electrode 950.
  • an NPC 720 may be selectively deposited over the exposed layer surface 11 of the underlying layer 710, in the figure, the patterning coating 110.
  • the NPC 720 may be disposed between the auxiliary electrode 950 and the second electrode 240.
  • the NPC 720 may be selectively deposited using a shadow mask 415, in a second portion 102 of the lateral aspect of the device 900.
  • the NPC 720 may provide an exposed layer surface 11 with a substantially high initial sticking probability against deposition of a deposited material 531 to be thereafter deposited as a deposited layer 130 to form an auxiliary electrode 950.
  • the deposited material 531 may be deposited over the device 900 but may remain substantially where the patterning coating 110 has been overlaid with the NPC 720, to form the auxiliary electrode 950, that is, substantially only the second portion 102.
  • the deposited layer 130 may be deposited using one of: an open mask, and a mask-free, deposition process.
  • the OLED device 200 may emit EM radiation through at least one of: the first electrode 220 (in the case of one of a: bottom-emission, and double-sided emission, device 200), as well as the substrate 10, and the second electrode 240 (in the case of one of: a top-emission, and double-sided emission, device 200), there may be an aim to make at least one of the: first electrode 220, and second electrode 240, substantially EM radiation- (light-)transmissive (“transmissive”), in some non-limiting examples, at least across a substantial part of the lateral aspect of the emissive region(s) 210 of the device 200.
  • substantially EM radiation- (light-)transmissive (“transmissive”)
  • such a transmissive element including without limitation, an electrode 220, 240, at least one of: a material from which such element may be formed, and a property thereof, may comprise at least one of: an element, material, and property thereof, that is one of: substantially transmissive (“transparent”), and, in some non-limiting examples, partially transmissive (“semi-transparent”), in some non-limiting examples, in at least one wavelength range.
  • a variety of mechanisms may be adopted to impart transmissive properties to the device 200, at least across a substantial part of the lateral aspect of the emissive region(s) 210 thereof.
  • the TFT structure(s) 206 of the driving circuit associated with an emissive region 210 of a (sub- ) pixel 1015/216 which may at least partially reduce the transmissivity of the surrounding substrate 10, may be located within the lateral aspect of the surrounding non-emissive region(s) 211 to avoid impacting the transmissive properties of the substrate 10 within the lateral aspect of the emissive region 210.
  • a first one of the electrodes 220, 240 may be made substantially transmissive, including without limitation, by at least one of the mechanisms disclosed herein, in respect of the lateral aspect of neighbouring (sub-) pixel(s) 1015/216, a second one of the electrodes 220, 240 may be made substantially transmissive, including without limitation, by at least one of the mechanisms disclosed herein.
  • the lateral aspect of a first emissive region 210 of a (sub-) pixel 1015/216 may be made substantially top-emitting while the lateral aspect of a second emissive region 210 of a neighbouring (sub-) pixel 1015/216 may be made substantially bottom-emitting, such that a subset of the (sub-) pixel(s) 1015/216 may be substantially top-emitting and a subset of the (sub-) pixel(s) 1015/216 may be substantially bottom-emitting, in an alternating (sub-) pixel 1015/216 sequence, while only a single electrode 220, 240 of each (sub-) pixel 1015/216 may be made substantially transmissive.
  • a mechanism to make an electrode 220, 240, in the case of at least one of a: bottom-emission, and double-sided emission, device 200, the first electrode 220, and in the case of at least one of a: top-emission, and a double-sided emission, device 200, the second electrode 240, transmissive may be to form such electrode 220, 240 of a transmissive thin film.
  • an electrically conductive deposited layer 130, in a thin film including without limitation, those formed by depositing a thin conductive film layer of at least one of: a metal, including without limitation, Ag, Al, and a metallic alloy, including without limitation, at least one of: an Mg:Ag alloy, and a Yb:Ag alloy, may exhibit transmissive characteristics.
  • the alloy may comprise a composition ranging from between about 1 :9-9: 1 by volume.
  • the electrode 220, 240 may be formed of a plurality of thin conductive film layers of any combination of deposited layers 130, any at least one of which may be comprised of at least one of: TCOs, thin metal films, and thin metallic alloy films.
  • a substantially thin layer thickness may be up to substantially a few tens of nm to contribute to enhanced transmissive qualities but also favorable optical properties (including without limitation, reduced microcavity effects) for use in an OLED device 200.
  • an average layer thickness of the second electrode 240 may be no more than about 40 nm, including without limitation, one of between about: 5-30, 10-25, and 15-25, nm.
  • a reduction in the thickness of an electrode 220, 240 to promote transmissive qualities may be accompanied by an increase in the sheet resistance of the electrode 220, 240.
  • the auxiliary electrode 950 may be electrically coupled with the second electrode 240 to reduce a sheet resistance of thin, and concomitantly, (substantially) transmissive, second electrode 240.
  • the auxiliary electrode 950 may not be substantially transmissive but may be electrically coupled with the second electrode 240, including without limitation, by deposition of a conductive deposited layer 130 therebetween, to reduce an effective sheet resistance of the second electrode 240.
  • such auxiliary electrode 950 may be one of: positioned, and shaped, in at least one of a: lateral, and longitudinal, aspect, to not interfere with the emission of photons from the lateral aspect of the emissive region 210 of a (sub-) pixel 1015/216.
  • a mechanism to make at least one of the: first electrode 220, and second electrode 240 may be to form such electrode 220, 240 in a pattern across at least one of: at least a part of the lateral aspect of the emissive region(s) 210 thereof, and in some non-limiting examples, across at least a part of the lateral aspect of the non-emissive region(s) 211 surrounding them.
  • such mechanism may be employed to form the auxiliary electrode 950 in one of a: position, and shape, in at least one of a: lateral, and longitudinal, aspect to not interfere with the emission of photons from the lateral aspect of the emissive region 210 of a (sub-) pixel 1015/216, as discussed above.
  • the device 200 may be configured such that it may be substantially devoid of a conductive oxide material in an optical path of EM radiation emitted by the device 200.
  • at least one of the coatings deposited after the at least one semiconducting layer 230 including without limitation, at least one of the: second electrode 240, patterning coating 110, and any other coatings deposited thereon, may be substantially devoid of any conductive oxide material.
  • being substantially devoid of any conductive oxide material may reduce at least one of: absorption, and reflection, of EM radiation emitted by the device 200.
  • conductive oxide materials including without limitation, at least one of: ITO, and IZO, may absorb EM radiation in at least the B(lue) region of the visible spectrum, which may, in generally, reduce at least one of: efficiency, and performance, of the device 200.
  • the transmissive region 212 of the device 200 may remain substantially devoid of any materials that may substantially affect the transmission of EM radiation therethrough, including without limitation, EM signals, including without limitation, in at least one of the: IR, and NIR, spectrum.
  • the TFT structure(s) 206 and the first electrode 220 may be positioned, in a longitudinal aspect, below the (sub-) pixel 1015/216 corresponding thereto, and together with the auxiliary electrode 950, may lie beyond the transmissive region 212. As a result, these components may not impede, including without limitation, attenuate EM radiation, including without limitation, light, from being transmitted through the transmissive region 212.
  • such arrangement may allow a viewer viewing the device 200 from a typical viewing distance to see through the device 200, in some non-limiting examples, when all the (sub-) pixel(s) 1015/216 may not be emitting, thus creating a transparent device 900.
  • a patterning coating 110 may be selectively deposited over first portion(s) 101 of the device 200, comprising a transmissive region 212.
  • At least one particle structure 150 may be disposed on an exposed layer surface 11 within the transmissive region 212, to facilitate absorption of EM radiation therein in at least a part of the visible spectrum, while allowing EM signals having a wavelength in at least a part of at least one of the: IR, and NIR, spectrum to be exchanged through the device 200 in the transmissive region 212.
  • various other coatings including without limitation those forming at least one of: the at least one semiconducting layer(s) 230, and the second electrode 240, may cover a part of the transmissive region 212, especially if such coatings are substantially transparent.
  • the PDL(s) 209 may have a reduced thickness, including without limitation, by forming a well therein, which in some non-limiting examples may be similar to the well defined for emissive region(s) 210, to further facilitate transmission of EM radiation through the transmissive region 212.
  • the transmissive region 212 of the device 200 may remain substantially devoid of any materials that may substantially inhibit the transmission of EM radiation, including without limitation, EM signals, including without limitation, in at least one of the: IR, and the NIR, spectrum, therethrough.
  • at least one of the: TFT structure 206, and first electrode 220 may be positioned, in a longitudinal aspect below the (sub-) pixel 1015/216 corresponding thereto and beyond the transmissive region 212. As a result, these components may not impede, including without limitation, attenuate, EM radiation from being transmitted through the transmissive region 212.
  • such arrangement may allow a viewer viewing the device 200 from a typical viewing distance to see through the device 200, in some non-limiting examples, when the (sub-) pixel(s) 1015/216 are not emitting, thus creating a transparent AMOLED device 200.
  • such arrangement may also allow at least one of: an IR emitter 330 e , and an IR detector 330a, to be arranged behind the device 200 such that EM signals, including without limitation, in at least one of the: IR, and NIR, spectrum, to be exchanged through the device 200 by such under-display components 330.
  • the patterning coating 110 may be formed concurrently with the at least one semiconducting layer(s) 230.
  • at least one material used to form the patterning coating 110 may also be used to form the at least one semiconducting layer(s) 230.
  • several stages for fabricating the device 200 may be reduced, which may, in some non-limiting examples, facilitate making the transmissive region 212 (substantially) transmissive.
  • FIG. 10 there is shown an example cross-sectional view of a fragment of an example version 1000 of the opto-electronic device 200 according to the present disclosure.
  • emissive regions 210 corresponding to each of three sub-pixels 216, of a single pixel 1015 are shown, which in some non-limiting examples, may correspond to a B(lue) sub-pixel 216B, a G(reen) sub-pixel 216G, and a R(ed) sub-pixel 216R.
  • each sub-pixel 216 may have a first electrode 220, with which an associated TFT structure 206 may be electrically coupled, a second electrode 240, and at least one semiconducting layer 230 deposited between the first electrode 220 and the second electrode 240.
  • At least one characteristic of at least one of the at least one semiconducting layer 230 may be varied within at least a lateral aspect of one of the (sub-) pixels 216, to facilitate emission therefrom of EM radiation having a wavelength spectrum corresponding to the colour by which such sub-pixel 216 may be denoted, including without limitation, at least one of: R(ed), G(reen), and B(lue), such that such at least one characteristic may be varied across substantially its entire lateral extent.
  • neighboring sub-pixels 216 may be separated by a non-emissive region 211 having a corresponding PDL 209, that covers at least a part of an extremity of the corresponding first electrodes 220.
  • the PDL 209 may be truncated in at least one of: a lateral aspect, and a longitudinal aspect.
  • truncation of the PDL 209 in the lateral aspect may cause the lateral extent of the neighboring emissive regions 210 to be at least, and in some non-limiting examples, exceed, including without limitation, be a multiple of, the lateral extent of the non-emissive region 211 interposed therebetween.
  • neighboring emissive regions 210 may not have a PDL 209 interposed therebetween, although, in such scenario, alternative measures may be called for to electrically isolate a first electrode 220 corresponding to a first emissive region 210 from a first electrode 220 corresponding to a second emissive region 210 immediately adjacent thereto.
  • a separation distance between the pair of electrodes 220, 240 within an emissive region 210 corresponding to a (sub-) pixel 1015/216 may be varied to reflect a (half-) integer multiple of a wavelength range associated with an emitted colour of the (sub-) pixel 1015/216.
  • such tuning may be achieved, at least in part, by varying the thickness of the at least one semiconducting layer 230 extending between the electrodes 220, 240.
  • the at least one semiconducting layer 230 comprise(s) a common layer extending across all of the (sub-) pixels 1015/216, such measures may be incomplete.
  • a thickness of the at least one semiconducting layer 230 may be varied, at least one of: across the device 200, and as between (sub-) pixels 1015/216 thereof, the separation distance between the pair of electrodes 220, 240 within an emissive region 210 corresponding to a (sub-) pixel 1015/216 may be further varied by modulating the thickness of an electrode 220, 240 in, and across a lateral aspect of emissive region(s) 210 of such (sub-) pixel 1015/216.
  • the second electrode 240 used in such devices 200 may in some nonlimiting examples, be a common electrode 220, 240 coating a plurality of (sub-) pixels 1015/216.
  • such common electrode 220, 240 may be a substantially thin conductive film having a substantially uniform thickness across the device 200.
  • a common electrode 220, 240 having a substantially uniform thickness may be provided as the second electrode 240 in a device 200, the optical performance of the device 200 may not be readily be fine-tuned according to an emission spectrum associated with each (sub-) pixel 1015/216.
  • modulating a thickness of an electrode 220, 240 in and across a lateral aspect of emissive region(s) 210 of a (sub-) pixel 1015/216 may impact the microcavity effect observable. In some non-limiting examples, such impact may be attributable to a change in the total optical path length.
  • modulating a thickness of an electrode 220, 240 in and across a lateral aspect of emissive region(s) 210 of a (sub-) pixel 1015/216 may impact the microcavity effect observable. In some non-limiting examples, such impact may be attributable to a change in the total optical path length.
  • a change in a thickness of the electrode 220, 240 may also change the refractive index of EM radiation passing therethrough, in some non-limiting examples, in addition to a change in the total optical path length. In some nonlimiting examples, this may be particularly the case where the electrode 220, 240 may be formed of at least one deposited layer 130.
  • the presence of optical interfaces created by a plurality of thin-film coatings with different refractive indices may create different optical microcavity effects for (sub-) pixels 1015/216 of different colours.
  • selective deposition of at least one deposited layer 130 through deposition of at least one patterning coating 110 may allow the thickness of at least one electrode 220, 240, of each (sub-) pixel 1015/216 to be varied, and concomitantly, for the optical microcavity effect in each emissive region 210 corresponding thereto, to be at least one of: controlled, and modulated, to optimize desirable optical microcavity effects on a (sub-) pixel 1015/216 basis.
  • the thickness of the at least one electrode 220, 240 may be varied by independently modulating at least one of: an average layer thickness, and a number, of the deposited layer(s) 130, disposed in each emissive region 210 of the (sub-) pixel(s) 1015/216.
  • the average layer thickness of a second electrode 240 disposed over, and corresponding to, a B(lue) sub-pixel 216B may be no more than the average layer thickness of a second electrode 240 disposed over, and corresponding to, a G(reen) sub-pixel 216G
  • the average layer thickness of a second electrode 240 disposed over, and corresponding to, a G(reen) sub-pixel 216G may be no more than the average layer thickness of a second electrode 240 disposed over, and corresponding to, a R(ed) sub-pixel 216R.
  • a first emissive region 210 a may correspond to a (sub-) pixel 1015/216 configured to emit EM radiation of a first at least one of: a wavelength, and an emission spectrum.
  • a device 1000 may comprise a second emissive region 210b that may correspond to a (sub-) pixel 1015/216 configured to emit EM radiation of a second at least one of: a wavelength, and an emission spectrum.
  • a device 1000 may comprise a third emissive region 210 c that may correspond to a (sub-) pixel 1015/216 configured to emit EM radiation of a third at least one of: a wavelength, and an emission spectrum.
  • the first wavelength may be one of: no more than, and at least that of, at least one of: the second wavelength, and the third wavelength.
  • the second wavelength may be one of: no more than, and at least that of, at least one of: the first wavelength, and the third wavelength.
  • the third wavelength may be at least one of: no more than, and at least that of, at least one of: the first wavelength, and the second wavelength.
  • the device 1000 may comprise a first emissive region 210 a corresponding to a sub-pixel 216B configured to emit EM radiation of at least one of: a first wavelength, and emission spectrum, which in some non-limiting examples, may be associated with a B(lue) emitted colour.
  • the device 1000 may comprise a second emissive region 210b corresponding to a sub-pixel 216G configured to emit EM radiation of at least one of: a second wavelength, and emission spectrum, which in some non-limiting examples, may be associated with a G(reen) emitted colour.
  • the device 1000 may comprise a third emissive region 210 c corresponding to a sub-pixel 216R configured to emit EM radiation of at least one of a third wavelength, and emission spectrum, which in some non-limiting examples, may be associated with a R(ed) emitted colour.
  • the first wavelength may be one of equal to, at least, and no more than, at least one of the: second, and third, wavelength.
  • the second wavelength may be one : at least that of, and no more than, at least one of the first wavelength, and the third wavelength.
  • the third wavelength may be one of at least one of, and no more than, at least one of the first wavelength, and the second wavelength.
  • the device 1000 may comprise at least one additional emissive region 210 that may in some non-limiting examples be configured to emit EM radiation having at least one of a wavelength, and emission spectrum, that may be substantially identical to at least one of the first emissive region 210 a , the second emissive region 210b, and the third emissive region 210 c , including without limitation, the second emissive region 210b.
  • the device 1000 may also comprise any number of emissive regions 210, and (sub-) pixel(s) 1015/216 thereof.
  • the plurality of sub-pixels 216 may correspond to a single pixel 1015.
  • the device 1000 may comprise a plurality of pixels 1015, wherein each pixel 1015 comprises a plurality of subpixels) 216.
  • (sub-) pixel(s) 1015/216 may be varied depending on the device design.
  • the sub-pixel(s) 216 may be arranged according to known arrangement schemes, including without limitation, RGB side-by-side, diamond, and PenTile®.
  • the device 1000 may be shown as comprising a substrate 10, and a plurality of emissive regions 210, each having a corresponding at least one TFT structure 206, covered by at least one TFT insulating layer 207, and a corresponding first electrode 220, formed on an exposed layer surface 11 of the TFT insulating layer 207.
  • the substrate 10 may comprise the base substrate 215.
  • each at least one TFT structure 206 may be longitudinally aligned below and within the lateral extent of its corresponding emissive region 210, for driving the corresponding (sub-) pixel 1015/216 and electrically coupled with its associated first electrode 220.
  • neighboring first electrodes 220 may be separated by a non-emissive region 211 having a corresponding PDL 209, formed over the TFT insulating layer 207, that may, in some non-limiting examples, cover at least a part of an extremity of the corresponding first electrodes 200.
  • each of the various emissive region layers of the device 200 may be formed by depositing a respective constituent emissive region layer material in a desired pattern in a manufacturing process.
  • such deposition may take place in a deposition process, in combination with a shadow mask 415, which, in some non-limiting examples, may be one of an open mask, and a fine metal mask (FMM), having apertures to achieve such desired pattern by at least one of masking, and precluding deposition of, the emissive region layer material on certain parts of an exposed layer surface of an underlying material exposed thereto.
  • a shadow mask 415 which, in some non-limiting examples, may be one of an open mask, and a fine metal mask (FMM), having apertures to achieve such desired pattern by at least one of masking, and precluding deposition of, the emissive region layer material on certain parts of an exposed layer surface of an underlying material exposed thereto.
  • FMM fine metal mask
  • the device 1000 may be shown as comprising a substrate 10, a TFT insulating layer 207 and a plurality of first electrodes 220, formed on an exposed layer surface 11 of the TFT insulating layer 207.
  • the substrate 10 may comprise the base substrate 215s (not shown for purposes of simplicity of illustration), and in some nonlimiting examples, at least one TFT structure 206 corresponding to, and for driving, a corresponding emissive region 210, each having a corresponding (sub-) pixel 1015/216, positioned substantially thereunder and electrically coupled with its associated first electrode 220.
  • PDL(s) 209 may be formed over the substrate 10, to define emissive region(s) 210. In some non-limiting examples, the PDL(s) 209 may cover edges of their respective first electrode 220.
  • At least one semiconducting layer 230 may be deposited over exposed region(s) of the first electrodes 210 corresponding to the emissive region 210 of each (sub-) pixel 1015/216 and, in some non-limiting examples, at least parts of corresponding at least one of: non-emissive regions 211, and corresponding PDLs 209, interposed therebetween.
  • a first deposited layer 130 a may be deposited over the exposed layer surface 11 of the at least one semiconducting layer(s) 230.
  • such deposition may be effected by exposing the entire exposed layer surface 11 of the device 1000 to a vapor flux 532 of deposited material 531, using one of: an open mask, and a mask-free, deposition process, to deposit the first deposited layer 130a over the at least one semiconducting layer(s) 230 to form a first layer of a second electrode 240 for a first emissive region 210 a so that such second electrode 240 is designated as a second electrode 240 a .
  • Such second electrode 240 a may have a first thickness td in the first emissive region 210 a .
  • the first thickness tci may correspond to a thickness of the first deposited layer 130 a .
  • a first patterning coating 1101 may be selectively deposited over first portions 101 of the device 1000, comprising the first emissive region 210 a .
  • the patterning coating 1101 may be selectively deposited using a shadow mask 415 that may also have been used to deposit the at least one semiconducting layer 230 a of the first emissive region 210 a to reduce a number of stages for fabricating the device 1000.
  • a second deposited layer 130b may be deposited over an exposed layer surface 11 of the device 1000 that is substantially devoid of the patterning coating 110, namely the exposed layer surface 11 of the first deposited layer 130 a in both of the second emissive region 210b, and the third emissive region 210 c and, in some non-limiting examples, at least part(s) of the non-emissive region(s) 211 interposed therebetween, in which the PDLs 209 (if any) may lie.
  • Such second electrode 240b may have a second thickness tc in the second emissive region 210b.
  • the second thickness t C 2 may correspond to a combined average layer thickness of the first deposited layer 130 a and of the second deposited layer 130b and may, in some non-limiting examples, be at least the first thickness tel.
  • a second patterning coating 1 IO2 may be selectively deposited over further first portions 101 of the device 1000, comprising the second emissive region 210b.
  • a third deposited layer 130 c may be deposited over an exposed layer surface 11 of the device 1000, namely the exposed layer surface 11 of the second deposited layer 130b in the third emissive region 210 c .
  • such deposition may be effected by exposing the entire exposed layer surface 11 of the device 1000 to a vapor flux 532 of deposited material 531
  • the third deposited layer 130 c may be deposited using one of: an open mask, and a mask-free, deposition process, to deposit the third deposited layer 130 c over the second deposited layer 130b to the extent that it is substantially devoid of any of the: first patterning coating 1101, and second patterning coating 1 IO2, to form a third layer of a second electrode 240 for the third emissive region 210 c , so that such second electrode 240 may be designated as a second electrode 240 c .
  • Such second electrode 240 c may have a third thickness t C 3 in the third emissive region 210 c .
  • the third thickness t C 3 may correspond to a combined average layer thickness of the: first deposited layer 130 a , second deposited layer 130b, and third deposited layer 130 c and may, in some non-limiting examples, be at least one of the: first thickness t c i, and second thickness t C 2.
  • a third patterning coating 1103 may be selectively deposited over additional first portions 101 of the device 1000, comprising the third emissive region 210 c .
  • At least one auxiliary electrode 950 may be disposed in the non-emissive region(s) 211 of the device 1000 between neighbouring emissive regions 210 thereof and in some non-limiting examples, over the PDLs 209.
  • the deposited layer 130 used to deposit the at least one auxiliary electrode 950 may be deposited using one of an open mask, and a mask-free, deposition process, to deposit a deposited material 531 over the first deposited layer 130 a , the second deposited layer 130b, and the third deposited layer 130 c , to the extent that it is substantially devoid of any of the: first patterning coating, 1101, second patterning coating 1 IO2, and third patterning coating 1103, to form the at least one auxiliary electrode 950.
  • each of the at least one auxiliary electrodes 950 may be electrically coupled with a respective at least one of the second electrodes 240.
  • At least one of the: first deposited layer 130 a , second deposited layer 130b, and third deposited layer 130 c may be at least one of: transmissive, and substantially transparent, in at least a part of the visible spectrum.
  • at least one of the: second deposited layer 130b, and third deposited layer 130 c (and any additional deposited layer(s) 130 (not shown)) may be disposed on top of the first deposited layer 130 a to form a multi-coating electrode 220, 240 that may also be at least one of: transmissive, and substantially transparent, in at least a part of the visible spectrum.
  • the transmittance of at least one of: at least one of the: first deposited layer 130 a , second deposited layer 130b, and third deposited layer 130 c , (and any additional deposited layer(s) 130), and the multi-coating electrode 220, 240 formed thereby may be one of at least about: 30%, 40% 45%, 50%, 60%, 70%, 75%, and 80% in at least a part of the visible spectrum.
  • an average layer thickness of the third deposited layer 130 c may be one of between about: 1-25, 1-20, 1-15, 1-10, and 3-6, nm.
  • a thickness of a multi-coating electrode formed by a combination of the first deposited layer 130 a , the second deposited layer 130b, and the third deposited layer 130 c , (and any additional deposited layer(s) 130) may be one of between about: 6-35, 10-30, 10-25, and 12-18, nm.
  • the thickness of the at least one electrode 220, 240 may be varied to an even greater extent by independently modulating the average layer thickness, and a number, of at least one of: the patterning coating 110, and an NPC 720, deposited in part(s) of each emissive region 210 of the (sub-) pixel(s) 216.
  • an average layer thickness of at least one of the: first patterning coating 1101, second patterning coating 1 IO2, and third patterning coating 1103, disposed in at least one of the: first emissive region 210a, second emissive region 210b, and third emissive region 210 c , respectively, may be varied according to at least one of a: colour, and emission spectrum of EM radiation, emitted by each emissive region 210.
  • the first patterning coating 1101 may have a first patterning coating thickness tni.
  • the second patterning coating 1 IO2 may have a second patterning coating thickness t n 2.
  • the third patterning coating 1103 may have a third patterning coating thickness tn3.
  • at least one of the: first patterning coating thickness tni, second patterning coating thickness tn2, and third patterning coating thickness t n s may be substantially the same.
  • at least one of the: first patterning coating thickness tni, second patterning coating thickness t n 2, and third patterning coating thickness tni may be different from one another.
  • an average layer thickness of the first deposited layer 130 a may be at least that of an average layer thickness of at least one of the: second deposited layer 130b, and third deposited layer 130 c .
  • the average layer thickness of the second deposited layer 130b may be at least that of the average layer thickness of at least one of the: first deposited layer 130 a , and third deposited layer 130 c .
  • the average layer thickness of the third deposited layer 130 c may be at least that of the average layer thickness of at least one of the: first deposited layer 130 a , and second deposited layer 130b.
  • the average layer thickness of the: first deposited layer 130 a , second deposited layer 130b, and third deposited layer 130 c may be substantially the same.
  • At least one deposited material 531 used to form the first deposited layer 130 a may be substantially the same as at least one deposited material 531 used to form at least one of the: second deposited layer 130b, and third deposited layer 130 c .
  • such at least one deposited material 531 may be substantially as described herein in respect of at least one of: the first electrode 220, the second electrode 240, the auxiliary electrode 950, and a deposited layer 130 thereof.
  • At least one of the: first emissive region 210 a , second emissive region 210b, and third emissive region 210 c may be substantially devoid of a closed coating 140 of the deposited material 531 used to form the at least one auxiliary electrode 950.
  • At least one of the: first deposited layer 130 a , second deposited layer 130b, and third deposited layer 130 c may be at least one of: transmissive, and substantially transparent, in at least a part of the visible spectrum.
  • at least one of the: second deposited layer 130b, and third deposited layer 130 c (and any additional deposited layer(s) 130) may be disposed on top of the first deposited layer 130 a to form a multi-coating electrode 220, 240, 950 that may also be at least one of: transmissive, and substantially transparent, in at least a part of the visible spectrum.
  • the transmittance of any of the at least one of: the first deposited layer 130 a , the second deposited layer 130b, the third deposited layer 130c, any additional deposited layer(s) 130, and the multi-coating electrode 220, 240, 950 may be one of at least about: 30%, 40% 45%, 50%, 60%, 70%, 75%, and 80% in at least a part of the visible spectrum.
  • an average layer thickness of at least one of the: first deposited layer 130 a , second deposited layer 130b, and third deposited layer 130 c may be made substantially thin to maintain a substantially high transmittance.
  • an average layer thickness of the first deposited layer 130 a may be one of between about: 5-30, 8-25, and 10-20, nm.
  • an average layer thickness of the second deposited layer 130b may be one of between about: 1-25, 1-20, 1-15, 1-10, and 3-6, nm.
  • an average layer thickness of the third deposited layer 130 c may be one of between about: 1-25, 1-20, 1-15, 1-10, and 3-6, nm.
  • a thickness of a multi-coating electrode formed by a combination of a plurality of: the first deposited layer 130 a , the second deposited layer 130b, the third deposited layer 130 c , and any additional deposited layer(s) 130 may be one of between about: 6-35, 10-30, 10-25, and 12-18, nm.
  • a thickness of the at least one auxiliary electrode 950 may be at least that of an average layer thickness of at least one of: the first deposited layer 130 a , the second deposited layer 130b, the third deposited layer 130 c , and a common electrode.
  • the thickness of the at least one auxiliary electrode 950 may be one of about: 50, 80, 100, 150, 200, 300, 400, 500, 700, and 800, nm, and 1, 1.2, 1.5, 2, 2.5, and 3, pm.
  • the at least one auxiliary electrode 950 may be substantially at least one of: non-transparent, and opaque. However, since the at least one auxiliary electrode 950 may be, in some non-limiting examples, provided in a non- emissive region 211 of the device 1000, the at least one auxiliary electrode 950 may not contribute to significant optical interference. In some non-limiting examples, the transmittance of the at least one auxiliary electrode 950 may be one of no more than about: 50%, 70%, 80%, 85%, 90%, and 95% in at least a part of the visible spectrum.
  • the at least one auxiliary electrode 950 may absorb EM radiation in at least a part of the visible spectrum.
  • FIG. 11 there may be shown a cross-sectional view of an example version 1100 of an OLED device 200.
  • the device 1100 may comprise in a lateral aspect, an emissive region 210 and an adjacent non-emissive region 211.
  • the emissive region 210 may correspond to a (sub-) pixel 1015/216 of the device 1100.
  • the emissive region 210 may have a substrate 10, a first electrode 220, a second electrode 240 and at least one semiconducting layer 230 arranged therebetween.
  • the first electrode 220 may be disposed on an exposed layer surface 11 of the substrate 10.
  • the substrate 10 may comprise a TFT structure 206, that may be electrically coupled with the first electrode 220. At least one of the: edges, and perimeter, of the first electrode 220 may generally be covered by at least one PDL 209.
  • the non-emissive region 211 may have an auxiliary electrode 950 and a first part of the non-emissive region 211 may have a projection 1160 arranged to project over a lateral aspect of the auxiliary electrode 950.
  • the projection 1160 may extend laterally to provide a shaded region 1165.
  • the projection 1160 may be recessed proximate to the auxiliary electrode 950 on at least one side to provide the shaded region 1165.
  • the shaded region 1165 may in some non-limiting examples, correspond to a region on a surface of the PDL 209 that may overlap with a lateral projection of the projection 1160.
  • the non-emissive region 211 may further comprise a deposited layer 130 disposed in the shaded region 1165. The deposited layer 130 may electrically couple the auxiliary electrode 950 with the second electrode 240.
  • a patterning coating 110 a may be disposed in the emissive region 210 over the exposed layer surface 11 of the second electrode 240.
  • an exposed layer surface 11 of the projection 1160 may be coated with a residual thin conductive film from deposition of a thin conductive film to form a second electrode 240.
  • an exposed layer surface 11 of the residual thin conductive film may be coated with a residual patterning coating 110b from deposition of the patterning coating 110.
  • the shaded region 1165 may be substantially devoid of patterning coating 110.
  • the deposited layer 130 may at least one of be deposited on, and migrate to, the shaded region 1165 to couple the auxiliary electrode 950 with the second electrode 240.
  • the projection 1160 may provide a shaded region 1165 along at least two of its sides.
  • the projection 1160 may be omitted and the auxiliary electrode 950 may comprise a recessed portion that may define the shaded region 1165.
  • the auxiliary electrode 950 and the deposited layer 130 may be disposed directly on a surface of the substrate 10, instead of the PDL 209.
  • FIG. 12 there may be shown a cross-sectional view of an example version 1200 of an OLED device 200.
  • the device 1200 may comprise a substrate 10 having an exposed layer surface 11.
  • the substrate 10 may comprise at least one TFT structure 206.
  • the at least one TFT structure 206 may be formed by depositing and patterning a series of thin films when fabricating the substrate 10, in some non-limiting examples, as described herein.
  • the device 1200 may comprise, in a lateral aspect, an emissive region 210 having an associated lateral aspect and at least one adjacent non-emissive region 211, each having an associated lateral aspect.
  • the exposed layer surface 11 of the substrate 10 in the emissive region 210 may be provided with a first electrode 220, that may be electrically coupled with the at least one TFT structure 206.
  • a PDL 209 may be provided on the exposed layer surface 11, such that the PDL 209 covers the exposed layer surface 11 as well as at least one of an edge, and a perimeter, of the first electrode 220.
  • the PDL 209 may, in some non-limiting examples, be provided in the lateral aspect of the non-emissive region 211.
  • the PDL 209 may define a valley-shaped configuration that may provide an opening that generally may correspond to the lateral aspect of the emissive region 210 through which a layer surface of the first electrode 220 may be exposed.
  • the device 1200 may comprise a plurality of such openings defined by the PDLs 209, each of which may correspond to a (sub-) pixel 1015/216 region of the device 1200.
  • a partition 1221 may be provided on the exposed layer surface 11 in the lateral aspect of a non-emissive region 211 and, as described herein, may define a shaded region 1165, such as a recessed region 1222.
  • the recessed region 1222 may be formed by an edge of a lower section of the partition 1221 being at least one of recessed, staggered, and offset, with respect to an edge of an upper section of the partition 1221 that may project beyond the recessed region 1222.
  • the lateral aspect of the emissive region 210 may comprise at least one semiconducting layer 230 disposed over the first electrode 220, a second electrode 240, disposed over the at least one semiconducting layer 230, and a patterning coating 110 disposed over the second electrode 240.
  • the at least one semiconducting layer 230, the second electrode 240 and the patterning coating 110 may extend laterally to cover at least the lateral aspect of a part of at least one adjacent non-emissive region 211.
  • the at least one semiconducting layer 230, the second electrode 240 and the patterning coating 110 may be disposed on at least a part of at least one PDL 209 and at least a part of the partition 1221.
  • the lateral aspect of the emissive region 210, the lateral aspect of a part of at least one adjacent non-emissive region 211, a part of at least one PDL 209, and at least a part of the partition 1221, together may make up a first portion 101, in which the second electrode 240 may lie between the patterning coating 110 and the at least one semiconducting layer 230.
  • An auxiliary electrode 950 may be disposed proximate to, including without limitation, within, the recessed region 1222 and a deposited layer 130 may be arranged to electrically couple the auxiliary electrode 950 with the second electrode 240.
  • the recessed region 1222 may comprise a second portion 102, in which the deposited layer 130 is disposed on the exposed layer surface 11.
  • At least a part of the evaporated flux 532 of the deposited material 531 may be directed at a non-normal angle relative to a lateral plane of the exposed layer surface 11.
  • at least a part of the evaporated flux 532 may be incident on the device 1200 at a non-zero angle of incidence that is, relative to such lateral plane of the exposed layer surface 11, one of no more than about: 90°, 85°, 80°, 75°, 70°, 60°, and 50°.
  • At least one exposed layer surface 11 of, including without limitation, in, the recessed region 1222 may be exposed to such evaporated flux 532.
  • a likelihood of such evaporated flux 532 being precluded from being incident onto at least one exposed layer surface 11 of, including without limitation, in, the recessed region 1222 due to the presence of the partition 1221, may be reduced since at least a part of such evaporated flux 532 may be flowed at a non- normal angle of incidence.
  • at least a part of such evaporated flux 532 may be non-collimated.
  • at least a part of such evaporated flux 532 may be generated by an evaporation source that is at least one of a: point, linear, and surface, source.
  • the device 1200 may be displaced during deposition of the deposited layer 130.
  • at least one of the: device 1200, and substrate 10 thereof, including without limitation, any layer(s) deposited thereon may be subjected to a displacement that is angular, in an aspect that is at least one of: lateral, and substantially parallel, to the longitudinal aspect.
  • the device 1200 may be rotated about an axis that substantially normal to the lateral plane of the exposed layer surface 11 while being subjected to the evaporated flux 532.
  • the deposited material 531 may nevertheless be deposited within the recessed region 1222 due to at least one of: lateral migration, and desorption, of adatoms adsorbed onto the exposed layer surface 11 of the patterning coating 110.
  • any adatoms adsorbed onto the exposed layer surface 11 of the patterning coating 110 may tend to at least one of: migrate, and desorb, from such exposed layer surface 11 due to thermodynamic properties of the exposed layer surface 11 that may not have applicability for forming a stable nucleus.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention concerne un matériau de formation de motifs et un dispositif à semi-conducteur en couches comprenant un revêtement de formation de motifs comprenant le matériau de formation de motifs et une couche déposée. Le revêtement de formation de motifs est disposé sur une surface de couche exposée d'une couche sous-jacente dans une première partie d'un aspect latéral du dispositif à semi-conducteur en couches. Le matériau de formation de motifs présente un point de fusion en masse, et est utilisé, dans une couche ayant un point de fusion de film qui est supérieur au point de fusion en masse, en tant que revêtement de formation de motifs. Le revêtement de formation de motifs est conçu pour impacter une propension d'un flux évaporé d'un matériau déposé à être déposé sur celui-ci, de telle sorte que la couche déposée comprenant le matériau déposé est déposée dans une seconde partie de l'aspect latéral, tandis qu'une surface de couche exposée du revêtement de formation de motifs est sensiblement dépourvue d'un revêtement fermé du matériau déposé.
PCT/IB2024/060664 2023-10-30 2024-10-30 Dispositif à semi-conducteur en couches comprenant un revêtement de formation de motifs mince et matériau de formation de motifs pour former le revêtement de formation de motifs Pending WO2025094057A1 (fr)

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US63/594,293 2023-10-30

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211460A1 (fr) * 2017-05-17 2018-11-22 Oti Lumionics Inc. Procédé de dépôt sélectif d'un revêtement conducteur sur un revêtement de formation de motifs et dispositif comprenant un revêtement conducteur
WO2022123431A1 (fr) * 2020-12-07 2022-06-16 Oti Lumionics Inc. Formation de motifs sur une couche conductrice déposée à l'aide de revêtement inhibiteur de nucléation et revêtement métallique sous-jacent
WO2022167868A1 (fr) * 2021-02-08 2022-08-11 Oti Lumionics Inc. Dispositif semi-conducteur en couches comprenant un revêtement de formation de motif comprenant un hôte et un dopant
WO2023156923A1 (fr) * 2022-02-16 2023-08-24 Oti Lumionics Inc. Dispositif à semi-conducteur stratifié ayant un revêtement conducteur commun sur des discontinuités longitudinales
WO2023187690A1 (fr) * 2022-03-30 2023-10-05 Oti Lumionics Inc. Composés hétérocycliques contenant de l'azote permettant de former un revêtement de formation de motifs et dispositifs les incorporant

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018211460A1 (fr) * 2017-05-17 2018-11-22 Oti Lumionics Inc. Procédé de dépôt sélectif d'un revêtement conducteur sur un revêtement de formation de motifs et dispositif comprenant un revêtement conducteur
WO2022123431A1 (fr) * 2020-12-07 2022-06-16 Oti Lumionics Inc. Formation de motifs sur une couche conductrice déposée à l'aide de revêtement inhibiteur de nucléation et revêtement métallique sous-jacent
WO2022167868A1 (fr) * 2021-02-08 2022-08-11 Oti Lumionics Inc. Dispositif semi-conducteur en couches comprenant un revêtement de formation de motif comprenant un hôte et un dopant
WO2023156923A1 (fr) * 2022-02-16 2023-08-24 Oti Lumionics Inc. Dispositif à semi-conducteur stratifié ayant un revêtement conducteur commun sur des discontinuités longitudinales
WO2023187690A1 (fr) * 2022-03-30 2023-10-05 Oti Lumionics Inc. Composés hétérocycliques contenant de l'azote permettant de former un revêtement de formation de motifs et dispositifs les incorporant

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