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WO2025092154A1 - Puce d'encapsulation optique et son procédé de fabrication, et dispositif électronique - Google Patents

Puce d'encapsulation optique et son procédé de fabrication, et dispositif électronique Download PDF

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Publication number
WO2025092154A1
WO2025092154A1 PCT/CN2024/113757 CN2024113757W WO2025092154A1 WO 2025092154 A1 WO2025092154 A1 WO 2025092154A1 CN 2024113757 W CN2024113757 W CN 2024113757W WO 2025092154 A1 WO2025092154 A1 WO 2025092154A1
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WO
WIPO (PCT)
Prior art keywords
light
packaging
chip
packaging substrate
shielding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/113757
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English (en)
Chinese (zh)
Inventor
龙启博
刘凯
肖鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Goodix Technology Co Ltd
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Filing date
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Application filed by Shenzhen Goodix Technology Co Ltd filed Critical Shenzhen Goodix Technology Co Ltd
Publication of WO2025092154A1 publication Critical patent/WO2025092154A1/fr
Pending legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/165—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

Definitions

  • the present disclosure relates to the field of chip technology, and in particular to an optical packaging chip and a manufacturing method thereof, and an electronic device.
  • Packaging is the process of assembling integrated circuits into final chip products. Simply put, it is to fix the produced bare chips (also known as bare chips or dies, which refer to unpackaged chips) on a packaging substrate and lead out the pins, and then package them into a whole.
  • bare chips also known as bare chips or dies, which refer to unpackaged chips
  • the present disclosure provides an optical packaging chip and a manufacturing method thereof, and an electronic device, so as to improve the signal-to-noise ratio of the optical packaging chip.
  • an optical packaging chip comprising: a packaging substrate; a plurality of bare chips, arranged on one side of the packaging substrate, the plurality of bare chips including at least one photosensitive bare chip; a colloid structure, connected to the packaging substrate and a side of the plurality of bare chips facing away from the packaging substrate, the colloid structure including a light-transmitting portion covering at least one photosensitive bare chip; and a light-transmitting shielding plate, connected to a side of the colloid structure facing away from the packaging substrate and grounded.
  • the colloid structure includes a first glue layer and a second glue layer arranged in sequence along a direction away from the packaging substrate, wherein the first glue layer exposes at least one photosensitive bare chip; the second glue layer is a light-transmitting glue layer and serves as a light-transmitting part, and the transmittance of the second glue layer is greater than the transmittance of the first glue layer.
  • the first adhesive layer is a light shielding adhesive layer; and/or, the material of the first adhesive layer includes bottom filling adhesive.
  • the thickness of the light-transmitting shielding plate ranges from 180 micrometers to 220 micrometers, and the thickness of the second adhesive layer ranges from 40 micrometers to 60 micrometers.
  • At least two bare chips among the plurality of bare chips are stacked, wherein the packaging substrate and the bare chips adjacent to it among the plurality of bare chips, and the bare chips adjacent to at least two bare chips are connected via a third adhesive layer.
  • the transmittance of the third adhesive layer is less than the transmittance of the second adhesive layer; and/or, the materials of the second adhesive layer and the third adhesive layer include chip bonding adhesive.
  • the optical packaging chip further includes a supporting structure, which supports and connects between the packaging substrate and the light-transmitting shielding plate.
  • the packaging substrate is provided with a first grounding circuit;
  • the supporting structure is a conductive supporting structure, and the light-transmitting shielding plate is electrically connected to the first grounding circuit of the packaging substrate via the conductive supporting structure.
  • the conductive support structure includes a solder layer, a conductive support layer, and a conductive adhesive layer which are sequentially arranged in a direction away from the package substrate.
  • the conductive support layer is a printed circuit board; and/or the thickness of the conductive adhesive layer ranges from 95 microns to 105 microns.
  • the light-transmitting shielding plate includes a transparent substrate, a transparent conductive layer, and an insulating layer sequentially arranged in a direction close to the packaging substrate, wherein the insulating layer has no overlap with the orthographic projection of the conductive support structure on the packaging substrate.
  • the number of the support structures is at least two and they are distributed at the edge of the package substrate.
  • the packaging substrate is provided with a first grounding circuit; at least one bare chip among the multiple bare chips is provided with a second grounding circuit electrically connected to the first grounding circuit; the optical packaging chip also includes a conductive connection structure, which is provided between one of the at least one bare chip and a light-transmitting shielding plate and electrically connects the light-transmitting shielding plate to the second grounding circuit of one of the bare chips.
  • the material of the conductive connection structure includes at least one of conductive foam or conductive silver paste.
  • the optical packaging chip also includes: a plurality of connecting wires, which electrically connect the packaging substrate with at least one of the plurality of bare chips and/or electrically connect at least two of the plurality of bare chips, and the plurality of connecting wires are embedded in the colloid structure.
  • a method for manufacturing an optical packaging chip comprising:
  • a light-transmitting shielding plate is provided, and the light-transmitting shielding plate is bonded to the packaging substrate and the side of multiple bare chips away from the packaging substrate through a colloid structure, and the light-transmitting shielding plate is grounded, wherein the colloid structure includes a light-transmitting portion covering at least one photosensitive bare chip.
  • the colloid structure includes a first glue layer and a second glue layer, wherein the second glue layer is a light-transmitting glue layer and serves as a light-transmitting portion, and the transmittance of the second glue layer is greater than the transmittance of the first glue layer, and the light-transmitting shielding plate is bonded to the packaging substrate and the side of the plurality of bare chips away from the packaging substrate through the colloid structure, including:
  • the first adhesive layer and the second adhesive layer are cured.
  • the packaging substrate is provided with a first grounding circuit
  • the manufacturing method further includes: before bonding the light-transmitting shielding plate to the packaging substrate and the side of the plurality of bare chips facing away from the packaging substrate through a colloidal structure, forming a conductive support structure on one side of the packaging substrate for electrically connecting the light-transmitting shielding plate to the first grounding circuit.
  • forming a conductive support structure on one side of the packaging substrate includes: sequentially forming a solder layer, a conductive support layer, and a conductive adhesive layer on one side of the packaging substrate.
  • the light-transmitting shielding plate is manufactured by the following method:
  • the transparent conductive layer exposed in the window area is surface treated to improve its conductive property and/or anti-oxidation property.
  • an electronic device comprising the optical packaging chip of any one of the aforementioned embodiments.
  • the electronic device further includes a display screen, and the optical packaging chip is located on the back side of the display screen.
  • a light-transmitting shielding plate is bonded to one side of the packaging substrate and multiple bare chips through a colloidal structure.
  • the light-transmitting shielding plate is grounded and can effectively reduce electromagnetic interference caused by certain sources in the external environment to the optical packaging chip, thereby improving the signal-to-noise ratio of the optical packaging chip and further improving its performance.
  • FIG1B is a schematic diagram showing a cross-sectional structure of an optical packaging chip at the P-P position in FIG1A according to some embodiments of the present disclosure
  • FIG2 is a schematic diagram showing a top view of an optical packaging chip according to some embodiments of the present disclosure
  • FIG3A is a schematic diagram showing a top view of an optical packaging chip according to some embodiments of the present disclosure.
  • FIG3B is a schematic diagram showing a cross-sectional structure of an optical packaging chip at Q-Q in FIG3A according to some embodiments of the present disclosure
  • FIG4 is a schematic diagram showing a top view of an optical packaging chip according to some embodiments of the present disclosure.
  • FIG5 is a schematic diagram showing a process of a method for manufacturing an optical packaging chip according to some embodiments of the present disclosure.
  • FIG. 6 is a schematic diagram showing a prefabricated conductive support structure on a packaging substrate sheet in some embodiments of the present disclosure.
  • Reference numerals 100-optical package chip; 20-package substrate; 21-bare chip; 211-photosensitive bare chip; 22-colloid structure; 220-light-transmitting portion; 221-first glue layer; 21a-first bare chip; 21b - second bare chip; 21c - third bare chip; 222 - second adhesive layer; 23 - light-transmitting shielding plate; 231 - transparent substrate; 232 - transparent conductive layer; 201 - pad area; 233 - insulating layer; 230 - window area; 24-third adhesive layer; 25-support structure; 26-conductive connection structure; 250-prefabricated conductive support structure; 251- solder layer; 252- conductive support layer; 253- conductive adhesive layer; 27- connecting wire; 200-Packaging substrate sheet; 200c-Cutting track; 500-Manufacturing method.
  • first, second, etc. to describe various elements is not intended to limit the positional relationship, temporal relationship, or importance relationship of these elements, and such terms are only used to distinguish one element from another element.
  • first element and the second element may refer to the same instance of the element, and in some cases, based on the description of the context, they may also refer to different instances.
  • the optical packaging chips of some electronic devices have poor performance due to electromagnetic interference from the screen or the external environment.
  • the overall transmittance of the screen of electronic devices is designed to be lower and lower due to the needs of energy saving, the performance of optical packaging chips of electronic devices is facing severe challenges, and their design difficulty and manufacturing cost are increasing.
  • the signal-to-noise ratio refers to the ratio of signal to noise in an electronic device or electronic system.
  • the embodiments of the present disclosure provide an optical packaging chip and a manufacturing method thereof, and an electronic device to improve the signal-to-noise ratio of the optical packaging chip.
  • an optical packaging chip 100 provided in some embodiments of the present disclosure includes a packaging substrate 20, A plurality of bare chips 21, a colloid structure 22 and a light-transmitting shielding plate 23.
  • the aforementioned plurality of bare chips 21 are arranged on one side of the packaging substrate 20 and include at least one photosensitive bare chip 211.
  • the colloid structure 22 is connected to the packaging substrate 20 and the side of the aforementioned plurality of bare chips 21 away from the packaging substrate 20, and the colloid structure 22 includes a light-transmitting portion 220 covering the aforementioned at least one photosensitive bare chip 211.
  • the light-transmitting shielding plate 23 is connected to the side of the colloid structure 22 away from the packaging substrate 20 and is grounded.
  • the product function type of the optical packaging chip 100 is not limited.
  • the optical packaging chip 100 may have at least one function of distance sensing, light intensity sensing, and color temperature sensing, and may also have a logic operation function. Multiple bare chips 21 are used to support the optical packaging chip 100 to achieve corresponding functions.
  • the optical packaging chip 100 includes three bare chips 21, namely a first bare chip 21a with a logic operation function, a second bare chip 21b with a distance sensing function, and a third bare chip 21c with a light intensity sensing function and a color temperature sensing function, wherein the second bare chip 21b and the third bare chip 21c are photosensitive bare chips 211, and the first bare chip 21a and the second bare chip 21b are stacked, that is, they are arranged adjacent to each other along the thickness direction of the optical packaging chip 100.
  • the light-transmitting shielding plate 23 and the light-transmitting portion 220 of the colloid structure 22 are light-transmitting, light can pass through the light-transmitting shielding plate 23 and the light-transmitting portion 220 to be sensed by the photosensitive bare chip 211 .
  • the packaging substrate 20 can be a hard packaging substrate or a flexible packaging substrate, which is provided with a circuit structure for supporting the functional implementation of the optical packaging chip 100.
  • the packaging substrate 20 can also be provided with a first grounding circuit (the grounding circuit is also called a grounding network, not shown in the figure) for providing grounding protection for the optical packaging chip 100.
  • the optical packaging chip 100 of the embodiment of the present disclosure has a light-transmitting shielding plate 23 bonded to one side of the packaging substrate 20 and the plurality of bare chips 21 through a colloid structure 22.
  • the light-transmitting shielding plate 23 is grounded and can effectively reduce the electromagnetic interference caused by certain sources in the external environment to the optical packaging chip 100, thereby improving the signal-to-noise ratio of the optical packaging chip 100 and further improving its performance.
  • the light-transmitting shielding plate 23 of the optical packaging chip 100 can effectively reduce the electromagnetic interference caused by the display screen to the optical packaging chip 100, thereby improving the signal-to-noise ratio of the optical packaging chip 100.
  • the design scheme of the embodiment of the present disclosure is also conducive to reducing equipment costs and reducing the difficulty of product performance testing.
  • the transmittance of the light-transmitting shielding plate may be designed to be greater than 95%.
  • the structure of the light-transmitting shielding plate 23 may include a transparent substrate 231 , a transparent conductive layer 232 , and an insulating layer 233 that are sequentially arranged in a direction close to the package substrate 20 .
  • the material of the transparent substrate 231 may include, but is not limited to, glass or transparent resin.
  • the material of the transparent conductive layer 232 may include, but is not limited to, at least one of indium tin oxide, indium zinc oxide, or nanosilver.
  • the transparent conductive layer 232 may be formed on the surface of the transparent substrate 231 by a sputtering process.
  • the insulating layer 233 may reduce the occurrence of short circuits in the transparent conductive layer 232 on the one hand, and on the other hand, may effectively protect the transparent conductive layer 232, thereby improving the adhesion and dyne value (dyne value is dyne/cm, which is used to express the magnitude of surface tension) between the entire light-transmitting shielding plate 23 and the colloid structure 22.
  • the optical packaging chip 100 also includes a plurality of connecting wires 27, which electrically connect the packaging substrate 20 with at least one bare chip 21 among the plurality of bare chips 21, and/or electrically connect at least two bare chips 21 among the plurality of bare chips 21, and the plurality of connecting wires 27 are embedded in the above-mentioned colloid structure 22.
  • connection wires 27 are used to establish circuit connections between the package substrate 20 and the plurality of bare chips 21. As shown in FIG. 1A and FIG. 1B , the two ends of some connection wires 27 can be connected to the bare chip 21 and the package substrate 20 respectively through pads, and the two ends of some connection wires 27 can be connected to two bare chips 21 respectively through pads.
  • the plurality of connection wires 27 are embedded in the colloid structure 22 and can be protected by the colloid structure 22, thereby reducing the possibility of being damaged.
  • electrical connection between a bare chip and a packaging substrate, or between a bare chip and another stacked bare chip may be achieved through welding or surface mounting process instead of through connecting wires.
  • the specific structural form of the colloid structure 22 is not limited, and can be a single-layer or multi-layer structure. As shown in FIG. 1A and FIG. 1B , in some embodiments of the present disclosure, the colloid structure 22 includes a plurality of colloid structures 22 extending in a direction away from the packaging substrate 20.
  • a first adhesive layer 221 and a second adhesive layer 222 are sequentially arranged, wherein the first adhesive layer 221 exposes the at least one photosensitive bare chip 211, the second adhesive layer 222 is a light-transmitting adhesive layer and covers the at least one photosensitive bare chip 211, the second adhesive layer 222 is used as the light-transmitting part 220 of the adhesive structure 22, and the transmittance of the second adhesive layer 222 is greater than the transmittance of the first adhesive layer 221.
  • the second adhesive layer 222 is a light-transmitting adhesive layer and covers the photosensitive bare chip 211, and the second adhesive layer 222 has a higher transmittance than the first adhesive layer 221, thus improving the photosensitivity of the photosensitive bare chip 211 and thereby improving the performance of the optical packaging chip 100.
  • the first adhesive layer 221 can be designed as a light-shielding adhesive layer, such as a black light-shielding adhesive layer, so as to effectively block stray light, reduce the impact of stray light on the photosensitive bare chip 211, and further improve the photosensitivity of the photosensitive bare chip 211 in the optical packaging chip 100.
  • a light-shielding adhesive layer such as a black light-shielding adhesive layer
  • the material of the first adhesive layer 221 includes bottom filling glue (also called underfill glue), which can be formed by bottom filling technology.
  • Bottom filling technology is a technology that uses the principle of capillary action to infiltrate filling materials such as epoxy resin into the bottom of the package, fill the welding gap at the bottom of the package, and finally solidify it to form a complete bottom filling body.
  • the bottom filling glue can protect the solder joints and reduce the stress damage of the package, and has a prominent role in improving the mechanical strength of the solder joints and the service life of the package.
  • the material of the second adhesive layer 222 includes die attach film (DAF, also known as DAF glue).
  • Die attach film is a kind of adhesive material widely used in electronic packaging process, which can be softened and cured, and has good thermal conductivity, can quickly transfer heat to the surrounding environment and can be tightly adhered to the component or substrate.
  • the softened second adhesive layer 222 in the manufacturing process of the optical packaging chip 100, can be pre-bonded to the side surface of the light-transmitting shielding plate 23 facing the packaging substrate 20.
  • the coverage area of the second adhesive layer 222 can be determined in combination with its fitting tolerance on the light-transmitting shielding plate 23 and its processing tolerance, etc. Under the premise of ensuring that the second adhesive layer 222 can cover the at least one photosensitive bare chip 211, its coverage area can be minimized to maximize the distribution area of the first adhesive layer 221, which is conducive to further improving the reliability and performance of the optical packaging chip 100.
  • At least two bare chips 21 (such as the first bare chip 21a and the second bare chip 21b) among the multiple bare chips 21 are stacked, wherein the packaging substrate 20 and the adjacent bare chips 21, as well as the adjacent bare chips 21 stacked, are connected by a third adhesive layer 24.
  • the stacking arrangement of some bare chips 21 (such as the first bare chip 21a and the second bare chip 21b) among the multiple bare chips 21 is conducive to thinning the overall thickness of the optical packaging chip 100.
  • the photosensitive bare chip 211 (such as the second bare chip 21b) is stacked with the non-photosensitive bare chip (such as the first bare chip 21a), in order to support the functional realization of the photosensitive bare chip 211, the photosensitive bare chip 211 is usually arranged at the top layer of the stacking structure.
  • the thickness of the light-transmitting shielding plate 23 is designed to be in the range of 180 microns to 220 microns, and the thickness of the second adhesive layer 222 is designed to be in the range of 40 microns to 60 microns, or in the range of 45 microns to 55 microns.
  • the thickness of the second adhesive layer 222 is designed to be as small as possible, which is beneficial to improve its transmittance and also beneficial to reduce the overall thickness of the optical packaging chip 100.
  • the optical package chip 100 further includes a support structure 25, which supports and connects between the package substrate 20 and the light-transmitting shielding plate 23.
  • the support structure 25 is conducive to maintaining the spacing between the light-transmitting shielding plate 23 and the package substrate 20 within the target design range.
  • the number of the support structures 25 may be one or more. As shown in FIG2 , in some embodiments, the number of the support structures 25 is at least two (four as shown in the figure) and they are distributed at the edge of the package substrate 20, which can achieve a more stable spacing support effect.
  • the grounding scheme of the light-transmitting shielding plate 23 is designed as follows: the packaging substrate 20 is provided with a first grounding circuit (not shown in the figure), the support structure 25 is designed as a conductive support structure, and the light-transmitting shielding plate 23 and the packaging substrate 20 are grounded.
  • the first grounding circuit is electrically connected through the conductive support structure.
  • the conductive support structure not only has a spacing support effect, but also provides a circuit conduction path for the light-transmitting shielding plate 23 to be grounded.
  • the number of the conductive support structures is at least two, which not only has a more stable spacing support effect, but also enables the grounding of the light-transmitting shielding plate 23 to be more reliable, thereby making the performance of the optical packaging chip 100 more reliable.
  • the conductive support structure is not limited.
  • the conductive support structure can be made of metal.
  • the conductive support structure adopts a multi-layer structure design, including a solder layer 251 , a conductive support layer 252 , and a conductive adhesive layer 253 sequentially arranged in a direction away from the packaging substrate 20 .
  • the solder layer 251 may be made of solder paste, which is mainly formed by mixing solder powder, flux, surfactant, thixotropic agent and the like.
  • the conductive support layer 252 may be a printed circuit board, and may be formed on the package substrate 20 by using the solder layer 251 through the surface mounting technology (SMT).
  • SMT surface mounting technology
  • the conductive structure design of the printed circuit board itself e.g., the upper and lower surfaces of the printed circuit board are provided with copper layers, respectively, and the upper and lower copper layers are electrically connected through the via structure
  • the first adhesive layer 221 is a bottom filling adhesive
  • the conductive support layer 252 is a printed circuit board.
  • the conductive adhesive layer 253 may be made of conductive silver glue.
  • Conductive silver glue is an adhesive that has certain conductive properties after curing or drying, and is mainly composed of a resin matrix, conductive particles, dispersing additives, and auxiliary agents.
  • the thickness of the conductive adhesive layer 253 ranges from 95 microns to 105 microns, which can absorb the thickness tolerance of the light-transmitting shielding plate 23 and the conductive support layer 252 to a certain extent, thereby making it easier to meet the requirements of process accuracy.
  • a certain distance is provided between the conductive support structure and the adjacent bare chip 21, and between the conductive support structure and the adjacent pad area 201 on the packaging substrate 20. This facilitates the manufacture of the conductive support structure on the packaging substrate 20 and facilitates the binding of the connecting wire 27 to the pad.
  • the light-transmitting shielding plate 23 includes a transparent substrate 231, a transparent conductive layer 232 and an insulating layer 233 which are arranged in sequence along a direction close to the packaging substrate 20, wherein the insulating layer 233 has no overlap with the orthographic projection of the conductive support structure on the packaging substrate 20, that is, the insulating layer 233 has a window area 230 exposing the transparent conductive layer 232, so that the transparent conductive layer 232 can be electrically connected to the conductive support structure, and then electrically connected to the first ground circuit of the packaging substrate 20.
  • the transparent conductive layer 232 exposed in the window area 230 may be surface treated to improve its conductivity and/or antioxidant properties.
  • the surface treatment may be, for example, dry treatment, wet treatment, or coating. Dry treatment may be, for example, cleaning the surface of the transparent conductive layer 232 by ionized gas plasma to remove surface contamination and improve surface morphology. Wet treatment may be, for example, bonding new groups to the surface of the transparent conductive layer 232 by an organic solvent to achieve the purpose of modifying its surface. Coating treatment may be, for example, coating the surface of the transparent conductive layer 232 with a metal film layer having better conductivity.
  • the grounding scheme of the light-transmitting shielding plate 23 can also be designed as follows: the packaging substrate 20 is provided with a first grounding circuit (not shown in the figures), at least one bare chip 21 among the multiple bare chips 21 is provided with a second grounding circuit (not shown in the figures) electrically connected to the first grounding circuit, and the optical packaging chip 100 also includes a conductive connection structure 26, which is arranged between one of the at least one bare chip 21 and the light-transmitting shielding plate 23 and electrically connects the light-transmitting shielding plate 23 to the second grounding circuit of one of the bare chips 21.
  • the material of the conductive connection structure 26 is not limited, for example, it may include at least one of conductive foam or conductive silver paste.
  • the light-transmitting shielding plate 23 is electrically connected to the second grounding circuit of the bare chip 21 through the conductive connection structure 26, and further electrically connected to the first grounding circuit of the packaging substrate 20 through the second grounding circuit.
  • This embodiment provides another design scheme for achieving the grounding of the light-transmitting shielding plate 23.
  • the optical packaging chip 100 may or may not be provided with the aforementioned support structure 25 (such as a conductive support structure).
  • the grounding scheme design of the transparent shielding plate 23 of the present disclosure is not limited to the above embodiments.
  • the transparent shielding plate can also be grounded through a structure other than the packaging substrate, for example, the transparent shielding plate is directly electrically connected to a grounding circuit other than the packaging substrate through a wire.
  • the edge of the orthographic projection of the light-transmitting shielding plate 23 on the packaging substrate 20 is located inside the edge of the packaging substrate 20 and has a gap with the edge of the packaging substrate 20 .
  • each optical package chip 100 When the optical package chip 100 is produced, the structure of each optical package chip 100 is usually manufactured in batches on a package substrate sheet, and then cut to form individual optical package chips 100.
  • the light-transmitting shielding plate 23 is reduced by a certain size relative to the edge of the package substrate 20, it is possible to avoid cutting the light-transmitting shielding plate 23 during the cutting process, thereby reducing the difficulty of the cutting process and reducing the damage to the light-transmitting shielding plate 23.
  • the design of the optical packaging chip 100 of the above embodiment of the present disclosure can not only achieve the aforementioned effect of improving the signal-to-noise ratio, but also make the optical packaging chip 100 have a thinner thickness as a whole, so that the optical packaging chip 100 can be applied to more application scenarios.
  • some design parameters of the optical packaging chip 100 can be referred to as shown in the following Table 1.
  • Table 1 discloses some design parameters of optical packaging chips in some embodiments
  • the embodiment of the present disclosure further provides a method 500 for manufacturing an optical packaging chip.
  • the manufacturing method 500 includes the following steps S501 and S502 .
  • step S501 a packaging substrate is provided, and a plurality of bare chips are fixed on one side of the packaging substrate, wherein the plurality of bare chips include at least one photosensitive bare chip.
  • a light-transmitting shielding plate is provided, and the light-transmitting shielding plate is bonded to the packaging substrate and the side of the plurality of bare chips facing away from the packaging substrate through a colloid structure, and the light-transmitting shielding plate is grounded, wherein the colloid structure includes a light-transmitting portion covering at least one photosensitive bare chip.
  • the optical packaging chip manufactured by the method of the embodiment of the present disclosure whose light-transmitting shielding plate can effectively reduce the electromagnetic interference caused by certain sources in the external environment to the optical packaging chip, so that the optical packaging chip has a higher signal-to-noise ratio and better performance.
  • the colloid structure includes a first glue layer and a second glue layer, wherein the second glue layer is a light-transmitting glue layer and serves as a light-transmitting portion of the colloid structure, and the transmittance of the second glue layer is greater than the transmittance of the first glue layer.
  • the aforementioned step S502 may include the following sub-steps 1 to 4.
  • a softened second adhesive layer for covering at least one photosensitive bare chip is formed on a side of the light-transmitting shielding plate facing the packaging substrate.
  • the light-transmitting shielding plate is aligned with the packaging substrate, and the second adhesive layer is bonded to at least one photosensitive bare chip.
  • a first adhesive layer is filled between the light-transmitting shielding plate and the packaging substrate.
  • the first adhesive layer and the second adhesive layer are cured.
  • the curing method includes but is not limited to light curing or heat curing.
  • the material of the second adhesive layer includes chip adhesive
  • the material of the first adhesive layer includes bottom filling adhesive.
  • the softened second adhesive layer can be pre-bonded on the light-transmitting shielding plate, and then in sub-step two, the light-transmitting shielding plate and the packaging substrate are aligned so that the second adhesive layer is bonded to the at least one photosensitive bare chip. This can not only reduce the process difficulty, but also improve the alignment accuracy of the second adhesive layer and the at least one photosensitive bare chip. Since the second adhesive layer has a higher transmittance than the first adhesive layer, it is beneficial to improve the photosensitivity of the photosensitive bare chip, thereby improving the performance of the optical packaging chip.
  • the first adhesive layer adopts a light-shielding adhesive layer to block stray light, thereby reducing the impact of stray light on the photosensitive bare chip and improving the photosensitivity of the photosensitive bare chip.
  • the packaging substrate is provided with a first grounding circuit
  • the above-mentioned manufacturing method 500 may further include: before step S502, forming a conductive support structure on one side of the packaging substrate for electrically connecting the light-transmitting shielding plate to the first grounding circuit.
  • the conductive support structure not only has a spacing support effect between the package substrate and the light-transmitting shielding plate, but also can provide a circuit conduction path for grounding the light-transmitting shielding plate.
  • the number of the conductive support structures is at least two, which not only has a more stable spacing support effect, but also can make the grounding of the light-transmitting shielding plate more reliable, thereby making the performance of the optical package chip more reliable.
  • the conductive support structure is formed on one side of the package substrate, including: forming a solder layer, a conductive support layer and a conductive adhesive layer in sequence on one side of the package substrate.
  • the solder layer can be made of solder paste
  • the conductive support layer can be made of a printed circuit board
  • the conductive adhesive layer can be made of conductive silver glue.
  • the material of the first adhesive layer includes bottom filling glue. Since the difference in thermal expansion coefficients of the printed circuit board and the bottom filling glue is smaller, cracking caused by thermal expansion of the two can be reduced, thereby helping to improve the reliability of the structure.
  • the light-transmitting shielding plate may be prefabricated by the following method:
  • the transparent conductive layer exposed to the window area is surface treated to improve its conductivity and/or anti-oxidation performance.
  • the surface treatment may be, for example, dry treatment, wet treatment or coating.
  • the surface treatment of the transparent conductive layer exposed to the window area is beneficial to improving the reliability of the grounding of the light-transmitting shielding plate, thereby further improving the performance of the optical packaging chip.
  • optical packaging chips When producing optical packaging chips, a plurality of optical packaging chip layer structures are usually produced in batches on a packaging substrate sheet (as shown in FIG. 6 ), and then individual optical packaging chips are formed by cutting.
  • the production process of the optical packaging chip is as follows:
  • a packaging substrate sheet ⁇ make a solder layer and a conductive support layer of a conductive support structure corresponding to each optical packaging chip on the packaging substrate sheet ⁇ fix multiple bare chips corresponding to each optical packaging chip on the packaging substrate sheet ⁇ fix multiple connecting wires corresponding to each optical packaging chip on the packaging substrate sheet ⁇ make a conductive adhesive layer of a conductive support structure corresponding to each optical packaging chip on the packaging substrate sheet, and the conductive adhesive layer is in a softened state in this step ⁇ provide a light-transmitting shielding plate sheet, and attach a second adhesive layer corresponding to each optical packaging chip on the light-transmitting shielding plate sheet, and the second adhesive layer is in a softened state in this step ⁇ align the light-transmitting shielding plate sheet with the packaging substrate sheet, and bond the second adhesive layer to the corresponding photosensitive bare chip ⁇ fill the first adhesive layer between the light-transmitting shielding plate sheet and the packaging substrate sheet ⁇ cure the first adhesive layer and the second adhesive layer ⁇ cut the overall structure that
  • a prefabricated conductive support structure 250 may be firstly manufactured on the packaging substrate plate 200 for each manufacturing area S of the optical packaging chips.
  • the structure 250 exceeds the manufacturing area S of the optical packaging chip.
  • the overall structure including the packaging substrate plate material 200 and the transparent shielding plate plate material is cut, referring to the cutting track 200c shown in the figure, the part of the prefabricated conductive support structure 250 that exceeds the manufacturing area S of the optical packaging chip will be cut off at the same time, thereby obtaining the conductive support structure in the form of the final product.
  • This embodiment facilitates the manufacturing of the conductive support structure, helps to improve its manufacturing accuracy and reduce the difficulty of cutting.
  • the structure of the optical packaging chip is designed such that the orthographic projection edge of the light-transmitting shielding plate on the packaging substrate is located inside the edge of the packaging substrate and has a spacing with the edge of the packaging substrate. If the optical packaging chip adopts this design, the above-mentioned light-transmitting shielding plate material may not be used in mass production, but a light-transmitting shielding plate may be provided for each optical packaging chip, and the light-transmitting shielding plate is aligned and bonded to the corresponding area on the packaging substrate material, so that the light-transmitting shielding plate can be avoided from being cut during the cutting process, thereby reducing the difficulty of the cutting process and reducing the cutting damage of the light-transmitting shielding plate.
  • the present disclosure also provides an electronic device, including the optical packaging chip of any of the above embodiments.
  • the electronic device may be of any type, such as a mobile phone, a tablet computer, a display, a smart wearable device, etc.
  • Electronic devices also have better performance due to the improved signal-to-noise ratio and performance of optical packaged chips.
  • the electronic device includes a display screen, and the optical package chip is located on the back side of the display screen.
  • the shielding scheme design of the optical package chip can effectively reduce electromagnetic interference from the display screen or other interference sources, so the electronic device has better performance.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Light Receiving Elements (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne une structure d'encapsulation optique et son procédé de fabrication, ainsi qu'un dispositif électronique. La puce d'encapsulation optique comprend : un substrat d'encapsulation ; une pluralité de puces, disposées sur un côté du substrat d'encapsulation et comprenant au moins une puce photosensible ; une structure colloïdale, connectée au substrat d'encapsulation et aux côtés de la pluralité de puces nues à l'opposé du substrat d'encapsulation et comprenant une partie transmettant la lumière recouvrant ladite puce photosensible ; et une plaque de blindage transmettant la lumière, connectée au côté de la structure colloïdale à l'opposé du substrat d'encapsulation et mise à la terre. Selon la puce d'encapsulation optique et son procédé de fabrication, le rapport signal sur bruit de la puce d'encapsulation optique peut être amélioré.
PCT/CN2024/113757 2023-11-03 2024-08-21 Puce d'encapsulation optique et son procédé de fabrication, et dispositif électronique Pending WO2025092154A1 (fr)

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CN117497614A (zh) * 2023-11-03 2024-02-02 深圳市汇顶科技股份有限公司 光学封装芯片及其制作方法、电子设备
CN119230687B (zh) * 2024-11-06 2025-11-21 深圳市思坦科技有限公司 微型发光二极管器件封装结构、封装方法及显示装置

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