WO2025091189A1 - Light-crosstalk-prevention micro led display screen using light-absorbing material, and preparation method therefor - Google Patents

Abstract

A light-crosstalk-prevention Micro LED display screen using a light-absorbing material, and a preparation method therefor. The Micro LED display screen comprises: a display screen substrate (1), a plurality of Micro LED pixel units (2) and a light-absorbing material (3), wherein the Micro LED pixel units (2) are periodically arranged on an upper surface of the display screen substrate (1); and the light-absorbing material (3) is attached to an area located on the upper surface of the display screen substrate (1) and located between side walls of the Micro LED pixel units (2). The problem of light crosstalk on a Micro LED display screen substrate (1) is ameliorated.

Description

A light-crosstalk-proof Micro LED display using light-absorbing material and a preparation method thereof Technical Field

The present invention relates to the field of semiconductor manufacturing technology, and in particular to a light-crosstalk-proof Micro LED display using light-absorbing materials and a method for preparing the same.

Background Art

With the rapid development of light-emitting diode (LED) related technologies in the semiconductor industry, the miniaturization and integration trend of LED is obvious, and micro-LED has emerged. Micro-LED can easily obtain high-resolution, high-intensity and high-purity display products by integrating multiple smaller LED pixel units on a large-area wafer.

In most Micro LED structures, due to their flatness and ductility, the light of each pixel unit is mainly emitted from the surface and the side. Since the light emitted from the side will propagate in each pixel unit, serious light crosstalk will occur, affecting the resolution and color purity of the display screen, and seriously affecting the actual display effect. In the case of multi-color Micro LED pixel units, since the crosstalk of different-color light beams is more difficult to control, it causes more obvious problems in the manufacturing and application of Micro LED. In summary, the proposal and practice of some methods to reduce light crosstalk are very necessary and are one of the most critical issues in the development of Micro LED.

Summary of the invention

The purpose of the present invention is to provide a light-crosstalk-proof Micro LED display using light-absorbing materials and a preparation method thereof, thereby improving the light crosstalk problem existing on the Micro LED display substrate.

To achieve the above object, the present invention provides the following solutions:

A light-crosstalk-proof Micro LED display screen using a light-absorbing material, the Micro LED display screen comprising: a display screen substrate, a plurality of Micro LED pixel units and a light-absorbing material;

The Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate; the light absorbing material is attached to the area located on the upper surface of the display screen substrate and between the side walls of the Micro LED pixel units.

Optionally, the Micro LED display further includes: a substrate;

The display screen substrate is arranged on the upper surface of the substrate.

Optionally, the light absorbing material includes: black ink.

Optionally, the upper surface of the Micro LED pixel unit is a 5um×5um square.

A method for preparing a light-crosstalk-proof Micro LED display screen using a light-absorbing material, which is used to prepare a light-crosstalk-proof Micro LED display screen using a light-absorbing material as described in any one of the above, the method comprising:

A display screen substrate is manufactured on the upper surface of the substrate; the substrate is composed of a plurality of Micro LED pixel units arranged periodically; a plurality of Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate;

Making a stencil; the size of the stencil is the same as the size of the display screen substrate, and the stencil is provided with openings having the same shape as the upper surface of each of the Micro LED pixel units;

Based on each of the openings and the corresponding Micro LED pixel units, the stencil is aligned and fixed to the display substrate to expose the upper surface of each of the Micro LED pixel units, and metal is evaporated on the upper surface of each of the Micro LED pixel units;

The screen is removed, and a light absorbing material is attached to the upper surface of the display screen substrate by a spraying process;

Physical and chemical methods are used to remove the metal and light-absorbing materials attached to the upper surface of each Micro LED pixel unit.

Optionally, after removing the metal and light-absorbing material attached to the upper surface of each Micro LED pixel unit by a physical and chemical method, the method further includes:

The light absorbing material is cured by a curing process.

Optionally, the mesh plate is made of stainless steel.

Optionally, the metal is iron.

Optionally, the physicochemical method includes: a hydrochloric acid iron removal method.

Optionally, the curing process includes: UV curing method.

According to the specific embodiments provided by the present invention, the present invention discloses the following technical effects:

The present invention discloses a light crosstalk-proof Micro LED display screen using light-absorbing materials and a preparation method thereof. The light-absorbing materials that are easy to obtain and transfer are relatively In order to firmly attach the display screen substrate between each Micro LED pixel unit and avoid contamination of the upper surface of each Micro LED pixel unit, the obtained structure has the effect of suppressing the light emission from the side wall, thereby greatly reducing the optical crosstalk, and improving the optical crosstalk problem existing on the Micro LED display screen substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

Figure 1 is a top view of a Micro LED display screen that uses light-absorbing materials to prevent light crosstalk;

FIG2 is a top view of a structure after a display screen substrate is manufactured on a substrate;

FIG3 is a top view of the screen;

FIG4 is a top view of the structure after metal deposition;

FIG5 is a top view of the structure after the screen is removed;

FIG. 6 is a top view of the structure after the light absorbing material is sprayed.

Explanation of symbols:

Display substrate—1, Micro LED pixel unit—2, light absorbing material—3, screen—4, opening—5, metal—6.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

The purpose of the present invention is to provide a light-crosstalk-proof Micro LED display using light-absorbing materials and a preparation method thereof, aiming to improve the light crosstalk problem existing on the Micro LED display substrate.

In order to make the above-mentioned objects, features and advantages of the present invention more clearly understood, the following is a summary of the present invention. The present invention is further described in detail with reference to the accompanying drawings and specific embodiments.

Example 1

FIG1 is a top view of a light-absorbing material-based anti-light-crosstalk Micro LED display. As shown in FIG1 , the light-absorbing material-based anti-light-crosstalk Micro LED display in this embodiment includes: a display substrate 1, a plurality of Micro LED pixel units 2, and a light-absorbing material 3.

The Micro LED pixel units 2 are periodically arranged on the upper surface of the display screen substrate 1; the light absorbing material 3 is attached to the area located on the upper surface of the display screen substrate 1 and between the side walls of the Micro LED pixel units 2.

As an optional implementation, the Micro LED display also includes: a substrate.

The display screen substrate 1 is arranged on the upper surface of the substrate.

As an optional implementation, the light absorbing material 3 includes: black ink.

As an optional embodiment, the upper surface of the Micro LED pixel unit 2 is a 5um×5um square.

Example 2

The method for preparing the light-crosstalk-proof Micro LED display screen using light-absorbing materials in this embodiment is used to prepare the light-crosstalk-proof Micro LED display screen using light-absorbing materials in Example 1, and the method includes:

Step 101: Make a display screen substrate 1 on the upper surface of a substrate; the display screen substrate 1 is composed of a plurality of periodically arranged Micro LED pixel units 2; a plurality of Micro LED pixel units 2 are periodically arranged on the upper surface of the display screen substrate 1.

Specifically, a display screen substrate 1 composed of Micro LED pixel units 2 that are evenly distributed and periodically arranged is manufactured using a specified substrate. A top view of the structure after manufacturing the display screen substrate 1 on the substrate is shown in FIG2. Each Micro LED pixel unit 2 has the same shape and size parameters, and is a square of 5um×5um. A large number of Micro LED pixel units 2 are evenly distributed on the rectangular display screen substrate 1.

Step 102: Make a stencil 4; the size of the stencil 4 is the same as the size of the display substrate 1, and the stencil 4 is provided with an opening 5 with the same shape as the upper surface of each Micro LED pixel unit 2.

As an optional implementation, the mesh plate 4 is made of stainless steel.

Specifically, the screen plate 4 can cover the entire display screen substrate 1, and the screen plate 4 The screen substrate 1 has openings 5 corresponding to the upper surface shape of each Micro LED pixel unit 2, and the single shape of the openings 5 is a 5um×5um square. The entire screen 4 is composed of a solid part of the screen 4 and a large number of openings 5 of the screen 4. The top view of the screen 4 is shown in FIG3.

The screen plate 4 is made of a metal 6 with stable physical and chemical properties, so that it can cover the display substrate 1 well and the opening 5 just exposes the upper surface of each Micro LED pixel unit 2.

Step 103: Based on each opening 5 and the corresponding Micro LED pixel unit 2, align and fix the screen plate 4 to the display substrate 1 to expose the upper surface of each Micro LED pixel unit 2, and evaporate metal 6 on the upper surface of each Micro LED pixel unit 2.

As an optional embodiment, the metal 6 is iron, so that it can be easily removed by an acidic solution in the subsequent steps.

Specifically, the stencil 4 is aligned and fixed with the display substrate 1 to facilitate evaporation. The upper surface of the combination of the stencil 4 and the display substrate 1 exposes the upper surface of the Micro LED pixel unit 2. The common method in the evaporation process can be adopted, and the two ends or four sides of the combination can be adhered with adhesive tape to make the display substrate 1 and the stencil 4 in close contact. After that, the metal 6 can be evaporated on the upper surface of each Micro LED pixel unit 2 through a special evaporation equipment. The top view of the structure after the metal 6 is evaporated is shown in Figure 4.

Step 104: remove the screen plate 4 and attach the light absorbing material 3 to the upper surface of the display screen substrate 1 by using a spraying process.

Specifically, as shown in Figure 5, after removing the screen plate 4, it can be observed that the upper surface of each Micro LED pixel unit 2 is covered with metal 6.

The light absorbing material 3 is made of black ink. Preferably, black anti-corrosion ink having excellent light absorbing and anti-corrosion effects is used.

The light absorbing material 3, for example black anti-etching ink, is attached by spraying and other processes. The top view of the structure after spraying the light absorbing material 3 is shown in FIG6 . At this time, the light absorbing material 3 has been initially transferred to the upper surface of the entire display substrate 1 , but has not yet been completely fixed.

Step 105: Use physical and chemical methods to remove the metal 6 and light-absorbing material 3 attached to the upper surface of each Micro LED pixel unit 2.

Specifically, although the light absorbing material 3 has been attached to the display substrate 1, it has not been completely Firm. When the metal 6 is corroded, a portion of the light-absorbing material 3 blocked by the metal 6 will be taken away from the upper surface of the display substrate 1. As an example, the method of removing iron with hydrochloric acid is adopted here, and the entire display substrate 1 is simply corroded with an acidic solution to remove the metal 6 evaporated in the previous step. Hydrochloric acid will not react physically and chemically with other parts of the display substrate 1, so the light-absorbing material 3 between the side walls of each Micro LED pixel unit 2 is preserved, and the metal 6 on the upper surface of each Micro LED pixel unit 2 is removed, so that the surface is exposed again.

As an optional implementation, the physical and chemical method includes: a hydrochloric acid iron removal method.

As an optional implementation manner, after step 105, the method further includes:

Step 106: curing the light absorbing material 3 using a curing process.

As an optional implementation, the curing process includes: UV curing method.

Specifically, after the above steps of preparation, the top view of the light-crosstalk-proof Micro LED display using the light-absorbing material 3 is shown in FIG1 . At this time, the anti-crosstalk material, i.e., the light-absorbing material 3, for absorbing light is evenly distributed on the display substrate 1 . The required light is emitted from the upper surface of each Micro LED pixel unit 2 , so that the display has a good luminous effect.

In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the method disclosed in the embodiment, since it corresponds to the device disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the device part description.

This article uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the device, method and core idea of the present invention. At the same time, for those skilled in the art, according to the idea of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims (10)

A light-crosstalk-proof Micro LED display screen using a light-absorbing material, characterized in that the Micro LED display screen comprises: a display screen substrate, a plurality of Micro LED pixel units and a light-absorbing material; The Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate; the light absorbing material is attached to the area located on the upper surface of the display screen substrate and between the side walls of the Micro LED pixel units. The light-crosstalk-proof Micro LED display using light-absorbing materials according to claim 1, characterized in that the Micro LED display further comprises: a substrate; The display screen substrate is arranged on the upper surface of the substrate. According to claim 2, the light-absorbing material used to prevent light crosstalk in a Micro LED display is characterized in that the light-absorbing material includes: black ink. According to claim 2, the light-crosstalk-proof Micro LED display using light-absorbing materials is characterized in that the upper surface of the Micro LED pixel unit is a square of 5um×5um. A method for preparing a light-crosstalk-proof Micro LED display screen using a light-absorbing material, for preparing the light-crosstalk-proof Micro LED display screen using a light-absorbing material as claimed in any one of claims 1 to 4, characterized in that the method comprises: A display screen substrate is manufactured on the upper surface of the substrate; the substrate is composed of a plurality of Micro LED pixel units arranged periodically; a plurality of Micro LED pixel units are periodically arranged on the upper surface of the display screen substrate; Making a stencil; the size of the stencil is the same as the size of the display screen substrate, and the stencil is provided with openings having the same shape as the upper surface of each of the Micro LED pixel units; Based on each of the openings and the corresponding Micro LED pixel units, the stencil is aligned and fixed to the display substrate to expose the upper surface of each of the Micro LED pixel units, and metal is evaporated on the upper surface of each of the Micro LED pixel units; The screen is removed, and a light absorbing material is attached to the upper surface of the display screen substrate by a spraying process; Physical and chemical methods are used to remove metal and light-absorbing materials attached to the upper surface of each Micro LED pixel unit. The method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material according to claim 5 is characterized in that after removing the metal and light-absorbing material attached to the upper surface of each Micro LED pixel unit by a physical and chemical method, it also includes: The light absorbing material is cured by a curing process. According to the method for preparing a light-crosstalk-proof Micro LED display using light-absorbing materials as described in claim 5, it is characterized in that the mesh plate is made of stainless steel. According to the method for preparing a light-crosstalk-proof Micro LED display using light-absorbing materials as described in claim 5, it is characterized in that the metal is iron. According to the method for preparing a light-crosstalk-proof Micro LED display using light-absorbing materials as described in claim 5, it is characterized in that the physical and chemical method includes: a hydrochloric acid iron removal method. The method for preparing a light-crosstalk-proof Micro LED display using a light-absorbing material according to claim 6, wherein the curing process comprises: a UV curing method.