WO2025058520A1

WO2025058520A1 - Compact and versatile system arrangements for manufacturing of foil based electronic devices

Info

Publication number: WO2025058520A1
Application number: PCT/NL2024/050503
Authority: WO
Inventors: Ashok Sridhar; Cornelis Hermanus Arnoldus Rentrop; Cornelius Hendrik Kant
Original assignee: Tracxon BV
Current assignee: Tracxon BV
Priority date: 2023-09-14
Filing date: 2024-09-13
Publication date: 2025-03-20
Anticipated expiration: 2026-03-14
Also published as: NL2035799B1

Abstract

A system (100) for manufacturing a foil based electronic device (10) comprises a first and second processing stages (110,120) configured to sequentially apply respective circuit parts (11,12) onto a continuous foil (13). A foil guidance (115) is configured to guide the continuous foil (13) between the first processing stage (110) and the second processing stage (120). The second processing stage (120) is raised vertically above and horizontally adjacent the first processing stage (110). The first processing stage (110) is user-accessible (A) for an operator standing on a first floor (F1), wherein the first floor (F1) is horizontally adjacent the first processing stage (110), and vertically below the second processing stage (120). A second floor (F2) may be formed above the first processing stage (110), also allowing user access to the second processing stage (120).

Description

Title: COMPACT AND VERSATILE SYSTEM ARRANGEMENTS FOR MANUFACTURING OF FOIL BASED ELECTRONIC DEVICES

TECHNICAL FIELD AND BACKGROUND

The present disclosure relates to systems for manufacturing foil based electronic devices, e.g. in roll-to-roll or roll-to-sheet processing. The disclosure also relates to methods of using such systems, and electronic devices resulting from such methods and systems.

In the field of electronic devices, roll-to-roll processing, also known as web processing, reel-to-reel processing or R2R, is the process of creating electronic devices from a roll of flexible foil, also referred to a “web”. Typically, the foil comprises a flexible plastic substrate onto which materials, such as electrically conductive and/or dielectric materials, can be coated, laminated, printed, or otherwise transferred to form one or more layers of conductive tracks. Optionally, electronic components such as surface mounted devices can be added to the tracks. Also other or further processes can be applied, e.g. forming of vias between circuit layers, curing of previously deposited layers, cutting or etching of layers, et cetera. In this way one or more circuit layers may be formed onto the flexible foil. After the various application processes, the foil may be rewound onto another roll. Alternatively, or additionally, the foil may be cut into sheets, e.g. in roll-to- sheet processing. Accordingly, an electronic device may be formed from a piece of the foil with a respective one or more circuit layers.

Typically, a system for manufacturing a foil based electronic device, may include various processing stages to sequentially apply respective layers, materials, components, et cetera. Accordingly, a long queue of subsequent processing stages may be required. Furthermore, each of the processing stages typically requires user access around the machines, e.g. for (re)placing the foil, maintenance and adjustment of equipment and processing components, et cetera. So, foil based manufacturing systems typically require a large footprint in a factory. Furthermore, large, heavy, and/or sensitive machines in the various processing stages may be difficult to rearrange and/or replace. So, foil based manufacturing systems are typically limited in the possible sequences of processes and/or types of devices which can be manufactured.

There remains a need for alleviating the shortcomings of existing foil based manufacturing systems while maintaining at least some of their advantages. For example, there is a need for more compact system arrangements while maintaining adequate user access. Furthermore, there is a need for improving versatility of the manufacturing process, e.g. allowing the manufacturing of various different devices while avoiding excess rearrangement of equipment.

SUMMARY

The present disclosure relates to systems for manufacturing foil based electronic devices, and use of such systems. As described herein, the system comprises a first processing stage configured to apply first circuit parts of the electronic device onto a continuous foil; and a second processing stage configured to apply second circuit parts of the electronic device onto the continuous foil. A foil guidance is configured to guide the continuous foil between the first processing stage and the second processing stage.

According to one aspect of the present disclosure, the second processing stage is raised vertically above and horizontally adjacent the first processing stage. Accordingly, the first processing stage is user-accessible for an operator standing on a first floor which is horizontally adjacent the first processing stage, and vertically below the second processing stage. Also further access areas may be formed. For example, a second floor can be formed by a support structure arranged above the first processing stage, wherein the second floor is raised at a second floor level above the first floor. Accordingly, the second processing stage is user- accessible for an operator standing on the second floor horizontally adjacent the second processing stage and vertically above the first processing stage. Also further processing stages may be added, preferably arranged according to a so-called ‘checkerboard’ pattern, wherein the processing stages are stacked diagonally, leaving user- accessible spacing there between. As will be appreciated this configuration may occupy a relatively small footprint compared to a long line of processing stages and/or compared to adjacent processing stages arranged on the same level. For example, user accessible space adjacent respective processing stages may be provided above or below other processing stages, instead of requiring additional space on the same floor. Furthermore, the relative compactness of this arrangement may enable relatively short path ways between each of the stages, e.g. allowing different options for interconnecting the stage.

According to another or further aspect of the present disclosure, the foil guidance is configured to controllably switch between different configurations. When the foil guidance is arranged in a so-called ‘flip-side configuration’ the continuous foil is passed to the second processing stage such that the second processing stage applies the second circuit parts onto a second side of the continuous foil, opposite a first side where the first processing stage applies the first circuit parts. When the foil guidance is arranged in a so-called ‘same-side configuration’ the continuous foil is passed to the second processing stage such that the second processing stage applies the second circuit parts onto the first side of the continuous foil, i.e. on the same side as the first circuit parts. By combining these and other aspects, the system may facilitate easily switching between various configurations, e.g. using different sequences and/or applying circuit parts onto one or both sides of a flexible foil, thus resulting in a wide variety of possible electronic devices which can be manufactures using the system with minimal adaptation. BRIEF DESCRIPTION OF DRAWINGS

These and other features, aspects, and advantages of the apparatus, systems and methods of the present disclosure will become better understood from the following description, appended claims, and accompanying drawing wherein:

FIGs 1A and IB illustrates a cross-section and perspective view, respectively, of a system for processing a foil;

FIG 2 illustrates a perspective view of a foil processing system, wherein each processing stage comprising respective processing modules;

FIGs 3A - 3C illustrate a side, front, and backside view, respectively, of the foil processing system with respective processing modules;

FIG 4A illustrates a perspective view of the system shown in FIG 3A, having the foil guidance configured in a flip-side configuration;

FIG 4B illustrates the same system, but having the foil guidance configured in a same-side configuration;

FIGs 5A and 5B illustrate further details of the foil guidance arranged in the flip-side configuration and same-side configuration, respectively;

FIGs 6A and 6B illustrate a perspective and front side view, respectively, of a processing system comprising five processing stages;

FIGs 7 A and 7B illustrate an alternative foil guidance.

FIGs 8A and 8b illustrate another alternative foil guidance;

FIGs 9A and 9B illustrate versatile use of a system comprising two processing stages;

FIGs 10A and 10B illustrate versatile use of a system comprising three processing stages;

FIGs 11A and 1 IB illustrate versatile use of a system comprising five processing stages; FIGs 12A and 12B illustrate further expansion of the system with an third layer of processing stages;

FIGs 13A and 13B illustrate various aspects of a foil based electronic device.

DESCRIPTION OF EMBODIMENTS

Terminology used for describing particular embodiments is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The term "and/or" includes any and all combinations of one or more of the associated listed items. It will be understood that the terms "comprises" and/or "comprising" specify the presence of stated features but do not preclude the presence or addition of one or more other features. It will be further understood that when a particular step of a method is referred to as subsequent to another step, it can directly follow said other step or one or more intermediate steps may be carried out before carrying out the particular step, unless specified otherwise. Likewise it will be understood that when a connection between structures or components is described, this connection may be established directly or through intermediate structures or components unless specified otherwise.

The invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. In the drawings, the absolute and relative sizes of systems, components, layers, and regions may be exaggerated for clarity. Embodiments may be described with reference to schematic and/or crosssection illustrations of possibly idealized embodiments and intermediate structures of the invention. In the description and drawings, like numbers refer to like elements throughout. Relative terms as well as derivatives thereof should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description and do not require that the system be constructed or operated in a particular orientation unless stated otherwise.

FIGs 1A and IB illustrates a cross-section and perspective view, respectively, of a system 100 for processing a foil 13, in particular for manufacturing a foil based electronic device. The system 100 comprises at least a first processing stage 110 configured to apply first circuit parts 11 of the electronic device 10 onto a continuous foil 13; and a second processing stage 120 configured to apply second circuit parts 12 of the electronic device 10 onto the continuous foil 13. As described herein, application of circuit parts may, for example, include one or more of application of electrically conductive tracks; application of electronic components, e.g. connected via the tracks; application of one or more circuit layers having electrically conductive tracks and/or components; application of dielectric patterns or layers between circuit lanes, components, and/or circuit layers; application of electrically conductive vias interconnecting different circuit layers; et cetera, a foil guidance 115 arranged to guide the continuous foil 13 between the first processing stage 110 and the second processing stage 120.

A foil guidance 115 is configured to guide the continuous foil 13 between the first processing stage 110 and the second processing stage 120. In a preferred embodiment, e.g. as shown, the second processing stage 120 is raised vertically above and horizontally adjacent the first processing stage 110. Most preferably, the first processing stage 110 is user-accessible (A) for an operator standing on a first floor Fl. In one embodiment, e.g. as shown, the first floor Fl is horizontally adjacent the first processing stage 110, and vertically below the second processing stage 120. For example, in the coordinate system shown, a bottom side or ‘footprint’ of the second processing stage 120 is offset along the vertical direction Z above the first floor Fl; and the first floor Fl is offset along a first horizontal direction Y adjacent a footprint of the first processing stage 110. For example, the first floor Fl may be a ground floor in a factory, or the first floor Fl may be raised above the ground floor, with possible further structures or another processing stage below the first floor Fl (not shown). The first horizontal direction Y is typically perpendicular to a second horizontal direction X which may be a direction in which the continuous foil 13 is processed. For example, one or more processing stages performing consecutive processing operations on the continuous foil 13 may be arranged along the second horizontal direction +X or -X.

The term “vertical”, as used herein, is generally understood as a line or vector substantially arranged along a direction of gravitational force. The term “horizontal”, as used herein, is generally understood as a line or vector in direction substantially lying in a plane perpendicular to the vertical direction. While the present figures illustrate a Cartesian coordinate system, for easy of reference, of course also other coordinate systems can be used. Furthermore, it will be understood that the terms “first” and “second” do not necessarily indicate a sequence of processing the continuous foil 13. So, the first processing stage 110 can be arranged in a processing path before or after the second processing stage 120; and the first circuit parts 11 can be applied before or after the second circuit parts 12. In one embodiment, the foil guidance 115 is configured to guide the continuous foil 13 from the first processing stage 110 to the second processing stage 120. In another or further embodiment, the foil guidance 115 is configured to guide the continuous foil 13 from the second processing stage 120 to the first processing stage 110. In some embodiments, the system is bidirectional, wherein a foil can be guided in either direction, e.g. depending on an adjustable sequence, as desired. For example, foil guiding means such as rollers may be configured to rotate in either direction. The system may also comprise one or more intermediate processing stages, e.g. for curing materials, or acting as a buffer stage. For example, the first processing stage 110 may be used for deposition of materials, wherein these materials are at least partially cured before entering the second processing stage 120 (or vice versa). For example, the first processing stage 110 and the second processing stage 120 may process the continuous foil 13 with different foil speed, wherein a buffer stage there between is used to buffer the different speed (and the fastest stage may be intermittently halted). Of course, the curing and/or buffering can also be implemented as part of the respective processing stage.

In some embodiments, e.g. as shown, a second floor F2 is formed by a support structure arranged above the first processing stage 110. In one embodiment, the second floor F2 is raised at a second floor level DF above the first floor Fl. In another or further embodiment, the second processing stage 120 is user- accessible (A) for an operator standing on the second floor F2 horizontally adjacent the second processing stage 120 and vertically above the first processing stage 110. For example, the second floor level DF is determined by a height of the first processing stage 110. Typically, the second floor level DF may be at least as high as the highest piece of equipment in the first processing stage 110, or higher. In this way, a second floor F2 floor may be formed horizontally entirely above the whole first processing stage 110. Of course, it can also be envisaged that parts of the first processing stage 110 may stick through the second floor F2 (not shown), or the second floor F2 may have a slope.

The term “user-accessible”, as used herein, is generally understood as the ability of a user, e.g. operator, being able to (directly) access respective processing stages, e.g. for replacing the foil, maintenance and adjustment of equipment and processing components, et etcetera. Typically, the means that there needs to be sufficient space for an operator to reside directly adjacent each of the processing stages, at least on one side, preferably on both sides. Furthermore, user-accessibility may be associated with a certain minimum comfort and/or safety standard. For example, cramped spaces and hazardous circumstances are preferably avoided. Of course, the extra space below, above, and between processing stages, could also be used for other or further purposes. For example, the checkerboard arrangement may allow, the operator access as well as provide material and consumable storage and logistics, associated with the foil based manufacturing system, fully confined within the footprint of the manufacturing system. For example, with an appropriate rack system integrated within the footprint on the first floor or the second floor, even finished products produced by the manufacturing system can be stored until further shipment. So, the system may in essence provide a set of one or more quasi-autonomous manufacturing cells for foil-based manufacturing.

In some embodiments, a ceiling Cl is formed by a support structure arranged below the second processing stage 120, wherein the ceiling Cl is arranged at a ceiling level DC of at least two meter above the first floor Fl. This may allow a relatively comfortable operating space to easily access the adjacent first processing stage 110. Alternatively, the ceiling Cl may be lower, but preferably still at least one meter. This may at least provide an adequate crawl space adjacent the first processing stage 110. As illustrated in the figure, the ceiling level DC between the first floor Fl and ceiling Cl may be similar to the second floor level DF of the second floor F2 above the first floor Fl. For example, a height difference between the second floor F2 and first floor Fl may be at least one meter, preferably at least two meter.

In some embodiments, each processing stage is arranged as part of a respective modular structure. Advantageously, the modular structures can be easily stacked and/or re-arranged. Preferably, the modular structures are stacked in a staggered arrangement, e.g. as shown. For example, this arrangement may resemble a ‘checkerboard’ pattern, wherein processing stages are stacked diagonally and access spaces are arranged diagonally between the stages. For example, see also FIGs 2, 6B, and 9 - 12. In one embodiment, e.g. as shown in FIGs 1A and IB, the ceiling Cl and second floor F2 may be part of different structures, e.g. separate modular support structures. In another embodiment, as illustrated in FIG 6B, the ceiling Cl and second floor F2 may be part of the same support structure, e.g. opposite sides of a continuous floor structure, between respective processing stages. Also in the layout using a continuous floor structure, the processing stages are preferably arranged in a staggered or checkerboard pattern.

In one embodiment, e.g. as shown in FIGs 1A and IB, the processing stages 110, 120 are provided in a respective enclosure. Providing an at least partial enclosure, may facilitate keeping a controlled environment around the respective processing stages. For example, a relatively dust free and/or controlled temperature environment may be maintained inside the enclosure of a respective processing stage. The enclosure may include one or more access doors or windows for the operator to access the respective processing stage. In another embodiment, e.g. as illustrated in FIG 6B, the enclosure may also be omitted. Accordingly, the processing stages may also be completely freely accessible from all sides.

In some embodiments, the second processing stage 120 is supported onto a horizontally extending floor structure 120f. In one embodiment, a vertically extending support means 120s, e.g. one or more support beams or a supporting wall, is arranged vertically extending between the floor structure 120f, beneath the second processing stage 120, and the first floor Fl. One or more support walls may also be formed by parts of an enclosure or frame around the first processing stage 110.

In some embodiments, the system comprises one or more of a ladder 1101, stairs, ramp, and/or lift mechanism extending between the first floor Fl and the second floor F2. This may allow easy user-access between the floors. Also other or further structures and/or mechanisms for facilitating an operator to move between the first floor Fl and second floor F2 may be envisaged. In other or further embodiments, the system comprises a guard rail 110g extending around at least part of a circumference of the second floor F2. For example, the guard rail 110g may be configured to prevent a user from falling down from the second floor F2. Typically, the guard rail 110g is arranged at a height of at least half a meter above the second floor F2. For example, the guard rail 110g comprises a beam or wall extending around any exposed edges of the second floor F2. Accordingly, the guard rail 110g may improve user safety especially when the second floor F2 is raised at a significant level above the first floor Fl.

In some embodiments, the continuous foil 13 is configured to simultaneously move through the first processing stage 110 in first direction +X, and through the second processing stage 120 in a second direction -X. Preferably, the second direction -X is (substantially) opposite to the first direction. By having the continuous foil move back and forth, a relatively compact layout may be achieved. Preferably, the second direction -X is (substantially) parallel to the first direction +X. Most preferably, each of the first direction +X and second direction -X is (substantially) horizontal but in opposite directions. For example, a slope of the foil between and entrance and exit of the respective processing stage 110 is less than 10%. By having the continuous foil move along a substantially horizontal path in each processing stage, an operator may easily access the foil standing on a parallel floor adjacent the processing stage. Of course there may be relatively small height differences along a path of the foil through a respective processing stage 110, 120, e.g. less than two meter, preferably less than one meter, more preferably less than half a meter, most preferable less than thirty centimeter. The smaller the height differences, the easier an operator can access different parts of the foil from an adjacent floor.

FIG 2 illustrates a perspective view of a foil processing system 100. In some embodiments, e.g. as shown, each processing stage 110, 120 comprises a respective set of multiple different processing modules. Preferably, the system 100 comprises, or may be coupled to, a foil supply 110 configured to supply the continuous foil 13 from a roll 13r. As illustrated, the processing of the continuous foil 13 may result in a foil based electronic device 10. The resulting electronic device 10 may remain part of a continuous foil, e.g. stored on another roll (not shown here), or be cut into sheets. For example, the system is configured to process the continuous foil 13 by roll-to-roll (R2R) or roll-to-sheet (R2S) processing. Alternatively, or additionally, some parts of the system (e.g. individual processing stages) may also be used for processing sheets (sheet-to-sheet). The resulting foil or sheet be also be processed in further processing stages, e.g. as illustrated in FIGs 6A and 6B. Typically, wherein the foil guidance 115 comprises one or more rollers (not shown here) configured along a foil path between an exit of the first processing stage 110 and an entrance of the second processing stage 120, or vice versa. For example, the foil guidance 115 comprises one or more turn bars.

FIGs 3A - 3C illustrate a side, front, and backside view, respectively, of the foil processing system 100 with respective processing modules. As illustrated, e.g., in FIG 3A, one or both of the processing stages 110, 120 may comprises a respective set of processing modules 111 - 114 and 121 -124.

In some embodiments, one or more of the processing modules are configured to deposit a conductive material onto the foil 13, e.g. forming one or more electrical tracks on the foil 13. In other or further embodiments, one or more of the processing modules is configured to deposit dielectric and/or insulating materials onto the foil 13, e.g. forming barriers and/or layers between conductive materials. In one embodiment, the processing modules of a respective processing stage comprise a Laser Induced Forward Transfer (LIFT) module, configured to contactlessly transfer electrically conductive and/or dielectric patterns and/or layers onto the foil 13. In another or further embodiment, the processing modules of a respective processing stage comprise a screen printing module, configured to apply respective conductive and/or dielectric patterns and/or layers onto the foil 13. In another or further embodiment, the processing modules of a respective processing stage comprise an applicator module for applying one or more electronic components (e.g. SMD) onto the foil, e.g. electrically connected to electrical tracks formed by a pattern of electrically conductive material. In another or further embodiment, the processing modules of a respective processing stage comprise a via applicator, e.g. including one or more of a via drilling means and/or via filling means, configured to electrically interconnect respective circuit layers, e.g. disposed one opposite sides of the foil 13. Also other types of applicator modules can be envisaged, or combination of said modules, in each processing stage 110, 120. As part of a respective processing stage, or between processing stages, a curing module or curing stage can be arranged. For example, this may be used to cure material on the foil, e.g. deposited by a preceding module or stage. It will be understood, that each of the processing stages 110, 120 may comprise the same set of one or more processing modules, or a different set of processing modules.

In preferred embodiments, as described herein, the second processing stage 120 is raised vertically above the first processing stage 110. For example, the continuous foil 13 is processed through the first processing stage 110 at a (constant or average) first height Zl; and processed through the second processing stage 120 at a (constant or average) second height Z2, which is different from the first height Zl. Preferably, a height difference DZ between the second height Z2 and the first height Zl is at least one meter, more preferably at least two meter. For example, the height difference DZ between the continuous foil 13 in different processing stage 110, 120 may be similar or the same as the height difference DF between the floor levels Fl and F2, as shown in FIG 1A. In other or further preferred embodiments, as described herein, the second processing stage 120 is arranged horizontally adjacent the first processing stage 110. For example, as shown, a center of the continuous foil 13 being processed in the second processing stage 120 is offset by a horizontal distance DY with respect to a center of the continuous foil 13 being processed in the first processing stage 110. Preferably, the horizontal distance DY is at least one meter, more preferably two meter. Typically, the horizontal distance DY may be similar to, or larger than, a respective width of the processing stages 110,120. Having sufficient horizontal distance DY may improve a work space adjacent and/or between the respective processing stages 110,120, especially when one or more processing stages 130, 140, 150 are added, e.g. as shown in FIGs 6B.

FIG 4A illustrates a perspective view of the system 100 shown in FIG 3A, having the foil guidance 115 configured in a flip-side configuration Of. FIG 4B illustrates the same system 100, but having the foil guidance 115 configured in same-side configuration Os. In some embodiments, the first processing stage 110 configured to apply the first circuit parts 11 onto a first side Si of the continuous foil 13. Preferably, the foil guidance 115 is configured to controllably switch between a flip-side configuration Of and a same-side configuration (Os). In the flip-side configuration Of, the continuous foil 13 is passed to the second processing stage 120 such that the second processing stage 120 applies the second circuit parts 12 onto a second side S2 of the continuous foil 13, opposite the first side Si. In the same-side configuration Os, the continuous foil 13 is passed to the second processing stage 120 such that the second processing stage 120 applies the second circuit parts 12 onto the first side Si of the continuous foil 13. The switchable configuration can be advantageously combined with the different processing stages 110, 120 being arranged at different heights, e.g. as illustrated in the following figure. In some embodiments, the first processing stage 110 and/or second processing stage 120 is configured to apply one or more vias 14 through the continuous foil 13 based on the foil guidance 115 being switched to the flip-side configuration Cf. For example, the one or more vias 14 are configured to electrically interconnect, in the electronic device 10, the first circuit parts 11 applied to the first side Si of the foil 13 with the second circuit parts 12 applied to the second side S2 of the foil 13. As will be understood, the application of vias may be disabled when the system operates in the same-side configuration Cs. In one embodiment, the first processing stage 110 and/or second processing stage 120 comprises a LIFT module (Laser Induced Forward Transfer). Advantageously, a laser of the same LIFT module may be used either for drilling vias through the foil and/or applying material using LIFT. For example, in the same-side configuration Cs the LIFT module can be used to apply dielectric material acting as bridges for the application subsequent circuit lanes.

FIGs 5A and 5B illustrates a preferred embodiment of a foil guidance 115 arranged in the flip-side configuration Cf and same-side configuration Cs, respectively. In some embodiments, the foil guidance 115 comprises a first roller 115a configured to rotate around a first rotation axis Rl, and a second roller 115b configured to rotate around a second rotation axis R2. In one embodiment, e.g. as shown, the second rotation axis R2 is arranged parallel (//) to the first rotation axis Rl when operated in the in the flip-side configuration Cf; and arranged at an angle a perpendicular to first rotation axis Rl when operated in the same-side configuration (Cs).

In some embodiments, e.g. as shown, the first roller 115a and/or second roller 115b is configured to receive the continuous foil 13 at an angle with respect to their respective rotation axis Rl and/or R2. Typically, the continuous foil 13 is transmitted, e.g. onto the next roller, at the same angle as at which the foil is received. In other words, the respective rotation axis R1,R2 may bisect the angles along which the foil is received and transmitted respectively. For example, in a preferred embodiment, e.g. as shown, where an angle between the incoming and outgoing directions of the foil passing each of the first roller 115a and/or second roller 115b is ninety degrees, the respective roller 115a and/or 115b may be arranged with their respective rotation axis R1,R2 at an angle of forty five degrees with respect to the incoming and/or outgoing directions. The arrangement of the perpendicularly incoming and outgoing foil directions has various advantage. For example, the arrangement can be easily switched between the different configuration Cf, Cs. Furthermore the various distances, e.g. DY and/or DZ can be easily changed. Furthermore, twisting of the foil may be largely avoided. In principle, also other incoming and outgoing directions could be used.

In some embodiments, the foil guidance 115 is configured to controllably switch between the flip -side configuration Cf and the same-side configuration Cs by rotating the second rotation axis R2 with respect to the first rotation axis Rl, between a parallel configuration and a perpendicular configuration. In one embodiment, the foil guidance 115 comprises a first actuator (not shown) configured to rotate the second rotation axis R2 (or the first rotation axis Rl) between a parallel configuration and a perpendicular configuration. For example, the first actuator is configured to rotate the second roller 115b (or the first roller 115a) around a flipping axis, e.g. rotate the roller by one hundred and eighty degrees around one of the X-axis, the Y-axis, and Z-axis. In one embodiment, a respective flipping axis around which a respective roller is flipped between configurations can be arranged through a center of the roller. In another embodiment, a respective axis around which a respective roller is flipped between configurations can be arranged with an offset with respect to a center of the roller. Preferably, the flip-axis is offset with respect to a center of the roller to keep the foil at the same position after rotation. This may depend on a thickness of the roller. For example, the flip axis may be centered on a center of the foil on the roller, e.g. offset by a radius of the roller (half the diameter of the roller). In other or further embodiments, the first actuator (and/or a second actuator) is configured to rotate a respective roller around multiple axes. For example, this can be additionally used to control and/or adjust tension in the web.

In some embodiments, the foil guidance 115 comprises a third roller 115c between the first processing stage 110 and the first roller 115a, and a fourth roller 115d between the second roller 115b and the second processing stage 120. In one embodiment, the third roller 115c is configured to receive (or transmit) the continuous foil 13 along a first horizontal direction +X from (or to) the first processing stage 110 and transmit (or receive) the continuous foil 13 along a vertical direction Z to (or from) the first roller 115a. In another or further embodiment, the fourth roller 115d is configured to receive (or transmit) the continuous foil 13 along a vertical direction Z from (or to) the second roller 115b and transmit (or receive) the continuous foil 13 along a second horizontal direction -X, opposite the first horizontal direction +X, to (or from) the second processing stage 120. Advantageously, by using the third roller 115c and/or fourth roller 115d, a height at which the continuous foil 13 is received from, or transmitted into, a respective processing stage can be easily controlled. In particular, these can be arrange at the different heights Zl, Z2 of the respective processing stages 110,120. In principle, the third roller 115c and/or fourth roller 115d may also be considered part of, e.g. fixedly arrange to, the respective processing stage 110 and/or 120

In some embodiments, in the flip-side configuration Cf, the fourth roller 115d is configured to receive (or transmit) the continuous foil 13 from (or to) the same vertical direction +Z as in which the third roller 115c receives (or transmits) the continuous foil 13. In other or further embodiments, in the same-side configuration Cs, the fourth roller 115d is configured to receive (or transmit) the continuous foil 13 from (or to) the an opposite vertical direction -Z compared to a vertical direction +Z in which the third roller 115c receives (or transmits) the continuous foil 13;

In some embodiments, switching the foil guidance 115 between the flip-side configuration Cf and the same-side configuration Cs comprises adjusting a guidance height position Zg of the first and second rollers 115a, 115b. In one embodiment, in the flip-side configuration Cf, the guidance height position Zg is arranged between a first height Z1 of the continuous foil 13 exiting the first processing stage 110 and a second height Z2 of the continuous foil 13 entering the second processing stage 120 (or vice versa). In another or further embodiment, in the same-side configuration Cs, the second height Z2 is between the first height Z 1 and the guidance height position Zg (as shown in FIG 5B), or the first height Z1 is between the second height Z2 and the guidance height position Zg (e.g. the upside down version of FIG 5B, with the rollers 115a, 115b below the first height Zl). In other words, in the flip-side configuration Cf the rollers 115a, 115b of the foil guidance 115 are between the different heights of the processing stages 110,120; and in the same-side configuration Cs, the rollers 115a, 115b of the foil guidance 115 are above the highest of the processing stages 110,120, or below the lowest of the processing stages 110,120. Preferably, the foil guidance 115 comprises a second actuator (not shown) configured to adjust the guidance height position Zg when switching between the sameside configuration Cs and flip-side configuration Cf. For example, the system 100 comprises a controller configured to control the first actuator and/or second actuator to switch between the same-side configuration Cs and the flip-side configuration Cf. Alternatively, or additionally, the second rotation axis R2 of the second roller 115b and/or the guidance height position Zg of the first and second rollers 115a, 115b may also be adjusted manually. FIGs 6A and 6B illustrate a perspective and front side view, respectively, of a processing system 100 comprising five processing stages 110 - 150. In some embodiments, the system 100 comprises a third processing stage 130 configured to apply third circuit parts of the electronic device 10 onto the continuous foil 13; and a second foil guidance 125 configured to guide the continuous foil 13 between the second processing stage 120 and the third processing stage 130 (or between the first processing stage 110 and the third processing stage 130, not shown here).

In some embodiments, e.g. as shown, the third processing stage 130 is raised vertically above and horizontally adjacent the first processing stage 110 on an opposite side of the first processing stage 110 with respect to the second processing stage 120. Accordingly, the third processing stage 130 is user- accessible (A) for an operator standing on the second floor F2 horizontally adjacent and between the second processing stage 120 and the third processing stage 130, and vertically above the first processing stage 110.

In other or further embodiments (not specifically shown here), the third processing stage, or a fourth processing stage, is arranged horizontally adjacent the first processing stage 110 at the same level as the first processing stage 110, on an opposite side of the second processing stage 120 with respect to the first processing stage 110. Accordingly, the third or fourth processing stage is user-accessible (A) for an operator standing on the first floor Fl horizontally adjacent and between the first processing stage 110 and the third or fourth processing stage, and vertically below the second processing stage 120. For example, this is the case for the combination of processing stages 110, 130, 140.

In some embodiments, the system comprises at least three, four, or five processing stages 110,120,130,140,150 with respective foil guidances 115,125,135,145, to guide the continuous foil 13 there between. Preferably, each of the processing stages is stacked diagonally with respect to each other forming a checkerboard pattern. Accordingly, respective user- accessible areas may be arranged complementary to the checkerboard pattern, for accessing each of the processing stages. It will be understood that the term “checkerboard pattern”, is used herein to indicate a pattern of diagonally arranged block spaces (e.g. as viewed from the front) wherein each block space may be either occupied by a respective processing stage (e.g. corresponding to the black squares of a checkerboard), or correspond to an unoccupied user accessible area, space, or corridor (e.g. corresponding to the whited squares of a checkerboard).

FIGs 7 A and 7B illustrate an alternative foil guidance 115. In some embodiments, one or more of the foil guidances between respective processing stages (e.g. the foil guidance 125 illustrated in FIG 6A), may be arranged to receive and transmit the continuous foil 13 to and from the respective processing stages at the same height. For example, the foil guidance is arranged in a same-side configuration Os as illustrated in FIG 7 A. Alternatively, the foil guidance may also be arranged in a flip-side configuration Of, e.g. by adding an additional roller 115e. For example, switching between the different configurations may comprises rotating the second rotation axis R2 of the second roller 115b, and winding the foil around the additional roller 115e. As will be appreciated, the configuration of FIGs 5A and 5B has the advantage, e.g., that the additional roller 115e may be avoided.

FIGs 8A and 8b illustrate another alternative foil guidance 115. In some embodiments, e.g. as shown, the foil guidance may require only two rollers 115a, 115b. For example, as shown in FIG 8A, the two rollers 115a, 115b may easily form a same-side configuration Os. However, as shown in FIG 8B, it may be more challenging to form a flip-side configuration Of. For example, this may require twisting of the foil, which may be undesired in some instances.

FIGs 9A and 9B illustrate versatile use of a system 100 comprising two processing stage 110,120. In some embodiments, the system 100 is configured to selectively process the continuous foil 13 either with first processing stage 110 processing the continuous foil 13 before or after the second processing stage 120. For example, the foil guidance 115 can be moved from the backside to the front side, or another foil guidance 115’ can be provided. Also the supply and receiving rolls 101 and 199, can be moved, as desired. Advantageously, the processing stages 110 and 120 can remain in place, while being utilized in different sequences. Alternatively, or in addition to the first processing stage 110 processing the continuous foil 13 before or after the second processing stage 120, some embodiments may also allow reversing a direction of the continuous foil 13. This may result in a different sequence of processing within each stage. By using combinations of different sequences, both between stages and within stages, an even more versatile range of processing possibilities becomes available. Furthermore, by selectively switching the foil guidance 115 between same-side configuration Cs and flip -side configuration Cf even more possibilities for manufacturing various configurations of electronic devices can be available.

FIGs 10A and 10B illustrate versatile use of a system 100 comprising three processing stage 110,120,130. In some embodiments, the system comprises at least three processing stages 110,120,130, wherein the system 100 is configured to selectively process the continuous foil 13 starting with any one of the at least three processing stages, and/or in any sequences of the processing stages. Advantageously, the processing stages 110, 120, 130 can each remain in place, while being utilized in different sequences. For example, the different sequences can be achieved by changing the initial stage and/or switching the subsequent stages. Furthermore, a direction of one or more stages may be reversed and/or the foil guidance 115 between each stage may be switched between same-side configuration Cs and flip -side configuration Cf.

FIGs 11A and 11B illustrate versatile use of a system 100 comprising five processing stage 110 - 150. In some embodiments, the system comprises a plurality of processing stages 110 -150, wherein the system 100 is configured to selectively process one continuous foil 13 through each of the plurality of processing stages 110 -150, or use a respective subsets 110,120; 140,150 of the processing stages 110 -150 to simultaneously process two different foils. In other or further embodiments, the system is configured to combine a first foil received from a first set of processing stages 110,120 and a second foil, receive from a second set of processing staged 140,150. For example, the processing stage 130 may be configured to laminate the first foil onto the second foil to form an electronic device from a combination of foils. Also more than two foils may be combined. For example, a third foil may be introduced between the first foil and second foil. For example, each of the first and second foils may be provided with circuit parts on both sides, and the third foil may be introduced there between to separate the circuit part. Optionally, also vias or other electrically connecting structures may be provide, e.g. through the third foil, to interconnect respective electric parts on the first and second foils.

FIGs 12A and 12B illustrate further expansion of the system with an third layer of processing stages 160,170. In some embodiments, a third floor F3 is formed on top of the second processing stage 120, wherein the system comprises one or more further processing stages 160,170 accessible via the third floor F3. Advantageously, various connections can be easily made between each of the processing stages to form almost endless possible configurations. As will be appreciated, the arrangement of a plurality of processing stages in a checkerboard patterns may allow easy access to each of the stages, while occupying a minimum footprint, as well as minimizing distances between different stages in various configurations and sequences. Aspect of the present disclosure can accordingly be embodied as various possible uses of the systems described herein.

In some embodiments, use the systems described herein (e.g. any of FI s 1 -12), comprises manufacturing a first electronic device 10 by first using the first processing stage 110 to apply first circuit parts 11 of the first electronic device 10 onto a first continuous foil 13, and by subsequently using the second processing stage 120 to apply second circuit parts 12 of the first electronic device 10 onto the first continuous foil 13. In other or further embodiments, the use comprises manufacturing a second electronic device 10 by first using the second processing stage 120 to apply second circuit parts 12 of the second electronic device 10 onto a second continuous foil 13, and subsequently using the first processing stage 110 to apply first circuit parts 11 of the first electronic device 10 onto a second continuous foil 13. In other words, the first and second processing stages, as well as any of the other or further processing stages, can be used in any sequence. In addition to using different sequences of stages, also each stage may be used in different directions (e.g. +X or -X)

In other or further embodiments, only one of the first processing stage 110 and the second processing stage 120 is used to apply respective circuit parts 11,12 of the second electronic device 10 onto a second continuous foil 13, without using the other of the first processing stage 110 and the second processing stage 120 in any processing of the second continuous foil 13. In other words, each of the processing stages may also be used as a standalone processing stage for manufacturing a respective product without using any other processing stage. Alternatively, it can also be envisaged that one of the first and second processing stages (or any other of the processing stages 130 - 170) is skipped for the manufacturing of a particular electronic device, while one or more other processing stages (e.g. any of the one or more processing stages 130 - 170), are still used. Advantageously, it may be relatively easy, e.g. due to the relative proximity between different processing stage, to skip any one or more processing stages, as desired, by rerouting the foil, e.g. using adaptable one or more foil guidances.

FIGs 13A and 13B illustrate various aspects of a foil based electronic device 10, e.g. manufactured using the systems and/or methods as described herein. In some embodiments, e.g. as illustrated in FIGs 13A and 13B, the first circuit parts 11 and/or second circuit parts 12 comprises a respective set of electrical tracks 1 It, 12t. In one embodiment, the system 100, e.g. as illustrated in FIG 1A, comprises a first processing stage 110 and/or second processing stage 120 configured to apply the first circuit parts 11 and/or second circuit parts 12 including a set of electrical tracks (not specifically shown in FIG 1). In another or further embodiment, the first processing stage 110 and/or second processing stage 120 comprises a printing device configured to print the electrical tracks 1 It, 12t and/or other components (directly) onto the first side Si and/or second side S2 of the foil 13. Typically, the tracks have a line width between hundred micrometer up to one, two, or three millimeters. Possibly, also thinner and/or thicker lines could be printed.

In another or further embodiment, the electrical tracks 1 It, 12t and/or printed components, are initially applied as uncured material, e.g. “wet” material, wherein the uncured material is subsequently cured, e.g. in a respective curing station 135, 155, e.g. as illustrated in FIG 6A. For example, the curing station 112,122 comprises an oven or lamp to cure the uncured material. In other or further embodiments, e.g. as illustrated in FIGs 13A and 13B, the first circuit parts 11 and/or second circuit parts 12 comprises a respective set of electrical junctions 1 Ij, 12j. For example, the electrical junctions 1 Ij, 12j may be part of the electrical tracks 1 It, 12t and/or electrically connected thereto. In one embodiment, e.g. as illustrated in FIGs 13A and 13B the via 14 is created to coincide, in the electronic device 10, with respective electrical junctions 1 Ij, 12j on either side of the foil 13. While the present figures illustrate only one via 14, of course a plurality of vias can be provided through the foil 13 to electrically interconnect respective parts of the first circuit parts 11 and the second circuit parts 12. While the present figures illustrate the first circuit parts 11 and second circuit parts 12 being applied on opposite sides of the continuous foil 13, the circuit layers 11, 12 may also be applied on the same side of the foil, e.g. depending on a configuration of any of the one or more foil guidance between respective processing stages.

In some embodiments, e.g. as illustrated in FIGs 13A and 13B, the first circuit parts 11 and/or second circuit parts 12 comprises a respective set of electrical components 11c, 12c. For example, the electrical components 11c, 12c may include one or more surface mounted devices (SMD) and/or printed components. In one embodiment, the system 100, e.g. as illustrated in FIG 1, comprises a first processing stage 110 and/or second processing stage 120 configured to apply the first circuit parts 11 and/or second circuit parts 12 including a set of electrical components (not specifically shown in FIG 1). In another or further embodiment, the first processing stage 110 and/or second processing stage 120 comprises a component placement device, e.g. pick and place and/or contactless transfer, configured to print the electrical tracks 1 It, 12t and/or other components (directly) onto the first side Si and/or second side S2 of the foil 13. While FIG 1 illustrates only one processing stage 110,120 for each side S1,S2, it will be understood that multiple processing stages can be arranged in sequence to apply different features on each side S1,S2. For example, component placement device can be arranged in sequence after applying the electrical tracks Ils, 12s, to place the components onto the respective electrical tracks lit, 12t.

In some embodiments, e.g. as illustrated in FIGs 13A and 13B, an electronic device 10 is provided comprising a foil 13, with a first circuit parts 11 disposed on a first side Si of the foil 13, and a second circuit parts 12 disposed on a second side S2 of the foil 13, opposite the first side Si. In one embodiment, the first circuit parts 11 comprises a first set of electrical tracks lit disposed on the first side Si of the foil 13. In another or further embodiment, the second circuit parts 12 comprises a second set of electrical tracks 12t disposed on the second side S2 of the foil 13. In one embodiment, the first circuit parts 11 comprises a first electrical component 11c disposed on the first side Si of the foil 13 and electrically connected to the first set of electrical tracks 1 It. In another or further embodiment, the second circuit parts 12 comprise a second electrical component 12c disposed on the second side S2 of the foil 13 and electrically connected to the second set of electrical tracks 12t. In some embodiments, the first electrical component 11c on the first side Si of the foil 13 is electrically connected to the second electrical component 12c by a via 14 through the foil 13. In one embodiment, the via 14 coincides a first electrical junction 11 j of a first set of electrical tracks lit on the first side Si of the foil 13 and a second electrical junction 12j on the second side S2 of the foil 13. Advantageously, the electronic device 10 can be manufactured using the methods and systems as described herein.

Processes for depositing conductive material for one or more of the conductive tracks 1 It, 12t, electrical junctions 1 Ij, 12j and/or via 14 may include dispensing, jetting, laser-induced forward transfer (LIFT) printing. Examples of such conductive materials and/or via-filling materials may also include conductive adhesives and screen printing conductive pastes (typically: high-viscous conductive pastes). In other or further embodiments, the conductive tracks and/or via may be “relatively inflexible”, e.g. due to minimal or no polymeric content in the via filling material (almost fully metal in addition to solvent content). Processes for deposition may include inkjet printing and aerosol jetting. Examples of such conductive materials may include inkjet and aerosol jet printing conductive inks (typically: low- viscous conductive inks). Processes for depositing the conductive material for one or more of the conductive tracks 1 It, 12t, electrical junctions 1 Ij, 12j and/or via 14, may also include printing processes such as screen printing and stencil printing. Examples of such via conductive materials may include conductive adhesives and screen printing conductive pastes (typically: high- viscous conductive pastes). In other or further embodiments, the conductive tracks and/or via may be “inflexible”, e.g. due to no polymeric content in the via filling material (almost fully metal). Processes for deposition may include dispensing. Preferably, the via 14 as described herein, is created by a mask-less technology, e.g. LIFT. In some embodiments, the via 14 is relatively flexible. For example, the via filling conductive material comprises a polymeric matrix in addition to conductive particles.

In interpreting the appended claims, it should be understood that the word "comprising" does not exclude the presence of other elements or acts than those listed in a given claim; the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements; any reference signs in the claims do not limit their scope; several "means" may be represented by the same or different item(s) or implemented structure or function; any of the disclosed devices or portions thereof may be combined together or separated into further portions unless specifically stated otherwise. Where one claim refers to another claim, this may indicate synergetic advantage achieved by the combination of their respective features. But the mere fact that certain measures are recited in mutually different claims does not indicate that a combination of these measures cannot also be used to advantage.

Claims

1. A system (100) for manufacturing a foil based electronic device (10), the system (100) comprising a first processing stage (110) configured to apply first circuit parts (11) of the electronic device (10) onto a continuous foil (13); a second processing stage (120) configured to apply second circuit parts (12) of the electronic device (10) onto the continuous foil (13); and a foil guidance (115) configured to guide the continuous foil (13) between the first processing stage (110) and the second processing stage (120); wherein the second processing stage (120) is raised vertically above and horizontally adjacent the first processing stage (110); wherein the first processing stage (110) is user- accessible (A) for an operator standing on a first floor (Fl), wherein the first floor (Fl) is horizontally adjacent the first processing stage (110), and vertically below the second processing stage (120).

2. The system according to claim 1, wherein the first processing stage (110) is configured to apply the first circuit parts (11) onto a first side (Si) of the continuous foil (13); wherein the foil guidance (115) is configured to controllably switch between a flip-side configuration (Cl) wherein the continuous foil (13) is passed to the second processing stage (120) such that the second processing stage (120) applies the second circuit parts (12) onto a second side (S2) of the continuous foil (13), opposite the first side (S 1); and a same-side configuration (Cs) wherein the continuous foil (13) is passed to the second processing stage (120) such that the second processing stage (120) applies the second circuit parts (12) onto the first side (Si) of the continuous foil (13).

3. The system according to claim 2, wherein the foil guidance (115) comprises a first roller (115a) configured to rotate around a first rotation axis (Rl), and a second roller (115b) configured to rotate around a second rotation axis (R2), wherein, in the flip -side configuration (Cf), the second rotation axis (R2) is arranged parallel (//) to the first rotation axis (Rl); wherein, in the same-side configuration (Cs), the second rotation axis (R2) is arranged at an angle (a) perpendicular to first rotation axis (RD-

4. The system according to claim 2 or 3, wherein the foil guidance (115) is configured to controllably switch between the flip-side configuration (Cf) and the same-side configuration (Cs) by rotating, by means of a first actuator, the second rotation axis (R2) with respect to the first rotation axis (Rl), between a parallel configuration and a perpendicular configuration.

5. The system according to claim 3 or 4, wherein the foil guidance (115) comprises a third roller (115c) between the first processing stage (110) and the first roller (115a), and a fourth roller (115d) between the second roller (115b) and the second processing stage (120); wherein the third roller (115c) is configured to receive the continuous foil (13) along a first horizontal direction (+X) from the first processing stage (110) and transmit the continuous foil (13) along a vertical direction (Z) to the first roller (115a); wherein the fourth roller (115d) is configured to receive the continuous foil (13) along a vertical direction (Z) from the second roller (115b) and transmit the continuous foil (13) along a second horizontal direction (-X), opposite the first horizontal direction (+X), to the second processing stage (120). wherein in the flip-side configuration (Cl) the fourth roller (115d) is configured to receive the continuous foil (13) from the same vertical direction (+Z) as in which the third roller (115c) receives the continuous foil (13); wherein in the same-side configuration (Cs) the fourth roller (115d) is configured to receive the continuous foil (13) from the an opposite vertical direction (-Z) compared to a vertical direction (+Z) in which the third roller (115c) receives the continuous foil (13).

6. The system according to claim 4 or 5, wherein switching the foil guidance (115) between the flip-side configuration (Cl) and the same-side configuration (Cs) comprises adjusting a guidance height position (Zg) of the first and second rollers (115a, 115b), wherein in the flip -side configuration (Cf) the guidance height position (Zg) is arranged between a first height (Zl) of the continuous foil (13) exiting the first processing stage (110) and a second height (Z2) of the continuous foil (13) entering the second processing stage (120); wherein in the same-side configuration (Cs), the second height (Z2) is between the first height (Zl) and the guidance height position (Zg), or the first height (Z 1) is between the second height (Z2) and the guidance height position (Zg). wherein the foil guidance (115) comprises a second actuator configured to adjust the guidance height position (Zg) when switching between the same-side configuration (Cs) and flip-side configuration (Cf).

7. The system according to claim 2, or any claim dependent thereon, wherein the first processing stage (110) is configured to apply one or more vias (14) through the continuous foil (13) based on the foil guidance (115) being switched to the flip-side configuration (Cl), wherein the one or more vias (14) are configured to electrically interconnect, in the electronic device (10), the first circuit parts (11) applied to the first side (Si) of the continuous foil (13) with the second circuit parts (12) applied to the second side (S2) of the substrate (13).

8. The system according to any of the preceding claims, wherein the continuous foil (13) is configured to simultaneously move through the first processing stage (110) in first direction (+X), and through the second processing stage (120) in a second direction (-X), wherein the second direction (-X) is opposite to the first direction.

9. The system according to any of the preceding claims, wherein a second floor (F2) is formed by a support structure arranged above the first processing stage (110), wherein the second floor (F2) is raised at a second floor level (DF) above the first floor (F 1); wherein the second processing stage (120) is user- accessible (A) for an operator standing on the second floor (F2) horizontally adjacent the second processing stage (120) and vertically above the first processing stage (110).

10. The system according to any of the preceding claims, wherein a ceiling (C 1) is formed by a support structure arranged below the second processing stage (120), wherein the ceiling (Cl) is arranged at a ceiling level (DC) of at least two meter above the first floor (Fl).

11. The system according to any of the preceding claims, wherein the second processing stage (120) is supported onto a horizontally extending floor structure (120f), wherein a vertically extending support means (120s) is arranged vertically extending between the floor structure (120f), beneath the second processing stage (120), and the first floor (Fl); wherein the system further comprises one or more of a ladder (1101), stairs, ramp, and/or lift mechanism extending between the first floor (F 1) and the second floor (F2), and preferably comprising a guard rail (110g) extending around at least part of a circumference of the second floor (F2).

12. The system according to any of the preceding claims, comprising a third processing stage (130) configured to apply third circuit parts of the electronic device (10) onto the continuous foil (13); and a second foil guidance (125) configured to guide the continuous foil (13) between the second processing stage (120) and the third processing stage (130) and/or between the first processing stage (110) and the third processing stage (130). wherein the third processing stage (130) is raised vertically above and horizontally adjacent the first processing stage (110) on an opposite side of the first processing stage (110) with respect to the second processing stage (120); and the third processing stage (130) is user- accessible (A) for an operator standing on the second floor (F2) horizontally adjacent and between the second processing stage (120) and the third processing stage (130), and vertically above the first processing stage (110); and/or wherein, the third processing stage, or a fourth processing stage, is arranged horizontally adjacent the first processing stage (110) at the same level as the first processing stage (110), on an opposite side of the second processing stage (120) with respect to the first processing stage (110); and the third or fourth processing stage is user-accessible (A) for an operator standing on the first floor (Fl) horizontally adjacent and between the first processing stage (110) and the third or fourth processing stage, and vertically below the second processing stage (120).

13. The system according to any of the preceding claims, comprising at least three, four, or five processing stages (110,120,130,140,150) with respective foil guidances (115,125,135,145), to guide the continuous foil (13) there between, wherein the processing stages are stacked diagonally with respect to each other forming a checkerboard pattern, wherein respective user-accessible areas are arranged complementary to the checkerboard pattern, for accessing each of the processing stages.

14. The system according to any of the preceding claims, wherein the system (100) is configured to selectively process the continuous foil (13) either with the first processing stage (110) processing the continuous foil (13) before or after the second processing stage (120).

15. Use of the system (100) according to any of the preceding claims for manufacturing a foil based electronic device.