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WO2025058564A1 - Composite de gestion thermique imprimable en 3d pour dispositifs électroniques de communication sans fil flexibles - Google Patents

Composite de gestion thermique imprimable en 3d pour dispositifs électroniques de communication sans fil flexibles Download PDF

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Publication number
WO2025058564A1
WO2025058564A1 PCT/SG2024/050579 SG2024050579W WO2025058564A1 WO 2025058564 A1 WO2025058564 A1 WO 2025058564A1 SG 2024050579 W SG2024050579 W SG 2024050579W WO 2025058564 A1 WO2025058564 A1 WO 2025058564A1
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Prior art keywords
fillers
amount
ink formulation
present
photocurable
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English (en)
Inventor
Hyunwoo Bark
Pooi See Lee
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Nanyang Technological University
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Nanyang Technological University
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Publication of WO2025058564A1 publication Critical patent/WO2025058564A1/fr
Pending legal-status Critical Current
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/102—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions other than those only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/12—Printing inks based on waxes or bitumen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/34—Hot-melt inks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing

Definitions

  • the current invention relates to an ink formulation for additive manufacture, a resin composition comprising the cured ink formulation, and a method of providing a product using additive manufacture.
  • Electronic devices such as power electronic devices, highly integrated devices, and wireless communication devices, consume immense electrical power. Most of the power consumption is converted into heat energy, leading to thermal stress in the electronic devices. Efficient heat dissipation from the electronic devices is crucial to maintain the reliability of the devices.
  • Metal filler/polymer composite has been adopted to overcome this issue.
  • These conventional thermal management composites such as thermal paste or pad, are composed of metal oxide-based particle and silicone-based polymer.
  • Typical thermal conductivity (-10° W/mK) and low dielectric properties (dielectric constant: ⁇ 5, tangent loss: ⁇ 10' 3 ) of metal filler/polymer composites makes it suitable to use in flexible electronic devices.
  • the conventional materials have lower thermal conductivity ( ⁇ 7 W/mK).
  • leakage occurred in the paste-like composite and lower thermal conductivity of the pad-like composite limiting its utilisation on high power electronic devices.
  • resin compositions formed from an ink formulation that can be printed into any suitable shape and design by additive manufacture can be useful as a thermal management solution in an electronic device that suffers from heat management issues.
  • These resin compositions may be formed from a polymeric material that has flexibiilty and may contain phase change material particles and provide improved heat-management performance.
  • These resin composites may also contain 2D MXenes.
  • photo-curable PDMS is a good polymer matrix for thermal management materials. This is especially so because thermal management materials with specific designs can be obtained by employing selective photo-curing. In other words, photo-assisted 3D printing technique can be practical with the material fabrication.
  • the PCM-SiO2 (core-shell)/2D material filler composites are good thermal conductive materials.
  • the solid PCM is converted into liquid PCM, which implies that the thermal energy is stored in the PCM.
  • the stored thermal energy will be transported out of the composites through the 2D materials, thus achieving the desired heat dissipation.
  • the current invention relates to 3D printable and thermally conductive composite with low dielectric properties.
  • the photo-curable polymer matrix (photo-curable PDMS) enabled the fabrication of specifically designed features via 3D printing technique.
  • An ink formulation for additive manufacture comprising: a photocurable siloxane polymer; a photocurable silane; and one or more fillers, wherein the one or more fillers comprises particles of a core-shell material, where the core is formed from a phase change material and the shell is formed from a silane, and optionally a 2D MXene. 2.
  • the ink formulation according to Clause 1 wherein: the photocurable siloxane polymer is present in an amount of from 80 to 95 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 2 to 10 wt%, of the total weight of the ink formulation.
  • R is H or CH3.
  • the ink formulation according to any one of the preceding clauses when subjected to additive manufacture using a digital light processing printer and subsequent photocuring, has one or more of the following properties:
  • a resin composition comprising a cured ink formulation according to any one of
  • the resin composition has one or more of the following properties: (bi) a through plane thermal conductivity of from 4 to 10 W/mK, such as about 6.2 W/mK; (bii) an in-plane thermal conductivity of from 10 to 32 W/mK, such as about 16 W/mK;
  • a method of providing a product using additive manufacture comprising the steps of:
  • FIG. 2 depicts the scanning electrode microscopy (SEM) images of the synthesized paraffin wax-SiC>2 (core-shell) particles.
  • phase change material means a material that can change from one state of matter (i.e. a “phase”) to a different state of matter when an environment undergoes a change.
  • a phase change material may be a material capable of changing from a solid phase to a liquid phase in response to an external stimulus (e.g. heat) and may then return to a solid phase when the external stimulus is removed.
  • the phase change material will be selected so that it undergoes a phase change at a sufficiently different stimulus value (e.g. temperature) compared to the silane shell.
  • Any suitable phase change material with suitable properties may be used herein.
  • phase change materials that may be used herein include, but are not limited to, a hydrocarbon-based phase change material (e.g. (C n H 2 n + 2)), such as a paraffin wax. It will be appreciated that the phase change material may be selected to be a material that will convert from a solid to a liquid at a temperature greater than room temperature.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 80 to 95 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 2 to 10 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 85 to 93 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 4 to 5 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of about 91 wt%; the photocurable silane is present in an amount of about 5 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of about 4 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 80 to 95 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 4 to 5 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 80 to 95 wt%; the photocurable silane is present in an amount of about 5 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 2 to 10 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 80 to 95 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of about 4 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 80 to 95 wt%; the photocurable silane is present in an amount of about 5 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of about 4 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 85 to 93 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 2 to 10 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 85 to 93 wt%; the photocurable silane is present in an amount of about 5 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 4 to 5 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 85 to 93 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of about 4 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of from 85 to 93 wt%; the photocurable silane is present in an amount of about 5 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of about 4 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of about 91 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of about 4 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of about 91 wt%; the photocurable silane is present in an amount of about 5 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 2 to 10 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of about 91 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 2 to 10 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of about 91 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of about 4 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of about 91 wt%; the photocurable silane is present in an amount of about 5 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 4 to 5 wt%, of the total weight of the ink formulation.
  • the ink formulation may be one in which: the photocurable siloxane polymer is present in an amount of about 91 wt%; the photocurable silane is present in an amount of from 3 to 10 wt%; and the one or more fillers are present, and as a combined amount if two or more fillers are present, in an amount of from 4 to 5 wt%, of the total weight of the ink formulation.
  • the photocurable siloxane polymer may be a photocurable polydimethylsiloxane or any similar kind of material.
  • the photocurable aspect may be achieved through the addition of a suitable photocurable group to the termini of the polysiloxane chains.
  • An example of such a material includes, but is not limited to a photocurable siloxane polymer has of formula I: where each R is independently H or CH3. In particular embodiments of the invention R may be CH 3 .
  • the photocurable silane may be a photocurable polydimethylsiloxane or any similar kind of material.
  • the photocurable aspect may be a silane of formula II:
  • R is H or CHg. In embodiments of the invention, R may be CHg.
  • the one or more fillers may include a 2D MXene.
  • Any suitable 2D MXene may be used herein.
  • 2D MXenes are a class of two-dimensional inorganic compounds that are formed from atomically thin layers of transition metal carbides, nitrides or carbonitrides, and which have a variety of hydrophilic terminations.
  • An example of an MXene that may be used herein includes, but is not limited to, Ti 3 C2T x , where T is at least one functional group selected from F, O or OH and x is the number of terminal groups (as will be appreciated the number of terminal groups.
  • the one or more fillers may consist of:
  • the ink formulation disclosed herein may have particularly good properties that are realised upon use of the ink formulation to make a composite material.
  • the resulting material may have one or more of the following properties:
  • the ink formulation may be suited for use in additive manufacture so as to provide a resin composition with a particular shape and size.
  • a method of providing a product using additive manufacture comprising the steps of:
  • conventional thermal management composites tend to be composed of silicone-based polymer/metal oxide particles.
  • the conventional materials have lower thermal conductivity ( ⁇ 7 W/mK).
  • phase change particles as a filler material (e.g. a paraffin wax-SiO2 (core-shell structure)) in a photocurable ink formulation, which, when cured, has improved properties due to the presence of the phase change particles.
  • these properties may be enhanced further by the inclusion of a second filler material (a 2D MXene).
  • the filler(s) are dispersed within a photocurable siloxane polymer (e.g. a photocurable PDMS) and a photocurable silane to provide an ink that can be readily used by an additive manufacture device (e.g. a commercial 3D printer). Owing to the flexibility of the resulting cured material (e.g.
  • the resulting resin composite can be flexible, with superior thermal conductivity (e.g. approximately 16 W/mK of thermal conductivity), which provides the resin composite with good heat dissipation performance.
  • the dielectric properties of the resin composite may also be good (e.g. -5 of dielectric constant and -0.01 of tangent loss at 10 MHz, in certain embodiments).
  • the resin composite can be used for heat dissipation in high-power wireless communication electric devices. Further aspects and embodiments of the invention will now be described by reference to the following non-limiting examples.
  • methacrylate terminated PDMS and silane was used as the photo-curable polymer matrix
  • fillers comprising paraffin wax-SiOz (core-shell) and/or 2D MXene were employed as the thermally conductive matter.
  • the fillers were dispersed in the photo-curable PDMS matrix, and the prepared composite was successfully printed via commercial 3D printer.
  • the contents of the present invention are not limited thereto.
  • Aminopropyl terminated polydimethylsiloxane (NH2-PDMS-NH2, DMS-A21 , Mw 5000 g/mol) was purchased from Gelest. 2-lsocyanatoethyl methacrylate was purchased from Tokyo Chemical Industry.
  • 3-Aminopropyltrimethoxysilane, paraffin wax, tetraethyl orthosilicate (TEOS), cetyltrimethylammonium bromide (CTAB), ammonium hydroxide solution (30-33% NH3 in H2O), lithium fluoride, hydrochloric acid (37% HCI, ACS reagent), and diphenyl(2,4,6- trimethylbenzoyl)phosphine oxide (TPO) were purchased from Sigma-Aldrich. Titanium aluminium carbide (TisAICz) powder was purchased from Carbon-Ukraine, whereas commercial silver (Ag) paste was purchased from TED Pella.
  • FIG. 1 (a) The synthesis procedure of the photo-curable PDMS is illustrated in FIG. 1 (a). 100 g of aminopropyl terminated polydimethylsiloxane (NH2-PDMS-NH2, DMS-A21 , Mw 5000 g/mol, Gelest) was dissolved in 300 mL chloroform, followed by inert gas (Ar or N2) purging for 10 min at room temperature. Then, 5 mL of the 4-methoxyphenol solution (10 mg/mL in chloroform) was added dropwise to the solution. Next, 6.206 g of 2-isocyanatoethyl methacrylate (155.15 g/mol, Tokyo Chemical Industry) was added slowly (dropwise), followed by stirring for 1 hour at room temperature. Lastly, the resulting precipitates were collected by filtration, and the residual chloroform was removed by rotary evaporation. Synthesis of Photo-Curable Silane
  • FIG. 1 (b) The synthesis procedure of the photo-curable silane is illustrated in FIG. 1 (b).
  • 3-aminopropyltrimethoxysilane 179.29 g/mol, Sigma-Aldrich
  • 5 g of 3-aminopropyltrimethoxysilane was dissolved in 150 mL chloroform, followed by inert gas (Ar or N 2 ) purging for 10 min at room temperature.
  • 250 pL of 4-methoxyphenol solution (10 mg/mL in chloroform) was added dropwise to the solution.
  • FTIR spectroscopy Frontier, Perkin Elmer
  • Viscous sample was dropped on a KBr pallet and the spectrum was obtained by transmittance mode.
  • FIG. 8 depicts the Fourier Transform Infrared (FTIR) spectra of (a) NH2PDMS-NH2; (b) monosubstituted photo-curable PDMS; and (c) di-substituted photo-curable PDMS.
  • FTIR Fourier Transform Infrared
  • paraffin wax (Sigma-Aldrich) was melted at 348 K, followed by addition of 5 g of tetraethyl orthosilicate (TEOS, Sigma-Aldrich) to the melted paraffin wax.
  • TEOS tetraethyl orthosilicate
  • the mixture was then added to a solution of CTAB, which has the composition of 0.82g CTAB, 140 mL H2O, and 70 mL of absolute ethanol, followed by high-speed shear mixing at 10000 rpm for 10 min at 338 K.
  • 1 mL of ammonium hydroxide solution (30-33% NH3 in H2O, from Sigma- Aldrich) was added dropwise to the solution and stirred for 12 hours at 338 K.
  • LiF lithium fluoride
  • HCI aqueous solution HCI - hydrochloric acid, ACS reagent, Sigma-Aldrich
  • Ti 3 AIC 2 powder was slowly added to the solution. Then, the mixture was stirred for 24 hours at 313 K. The resulting precipitate was washed by water (H 2 O) with centrifuge. After centrifuge, supernatants were disposed and precipitate was dried at 353 K for 24 hours in vacuum oven.
  • Prepared core-shell particles were dispersed in ethanol, and the dispersion was dropped on an aluminum oxide membrane to distinguish the particles readily.
  • FIG. 2 show the SEM images of the synthesised paraffin wax-SiO 2 (core-shell) particles.
  • Composites comprising photo-curable polymer matrix and fillers were prepared to demonstrate their 3D printability.
  • the photo-curable polymer matrix and fillers used herein were prepared by following the protocols disclosed in Examples 1 and 2.
  • Several examples of such 3D-printable composites have been prepared, such as those shown in Table 1 .
  • photo-curable PDMS/paraffin wax-SiO 2 (core-shell)/2D MXene composite was prepared.
  • the composition of the composite was 91 wt% of photo-curable PDMS/5 wt% of photo-curable silane/4 wt% of fillers.
  • fillers 4 wt% core-shell, 3 wt% core-shell/1 wt% MXene, 2 wt% core-shell/2 wt% MXene, 1 wt% core-shell/3 wt% MXene were prepared for 3D printing (Table 1 ).
  • 91 wt% photo-curable PDMS/5 wt% photo-curable silane/2 wt% core-shell/2 wt% MXene is prepared as below.
  • the commercial digital light processing (DLP) based 3D printer was employed for 3D printing of the prepared composite. (FIG. 3)
  • Thermal conductivity of the 3D printed samples was characterized by ASTM 5470-06 (through- plane thermal conductivity) and Angstrom method (in-plane thermal conductivity).
  • ASTM 5470-06 through- plane thermal conductivity
  • Angstrom method in-plane thermal conductivity
  • the thermal conductivity of the composite was characterized depending on the ratio between core-shell particles and 2D MXene.
  • thermocouples were used. Angstrom Method (In-Plane Thermal Conductivity)
  • thermocouples were used.
  • thermal conductivity of through-plane and inplane with 2 wt% core-shell/2 wt% MXene showed 8.07 and 14.44 W/mK, respectively.
  • Metal-insulator-metal (MIM) structure was prepared for the dielectric properties characterization of the 3D printed composites.
  • the commercial Ag paste was employed as a metal layer. Briefly, a printed composite was prepared. Then, the Ag paste was pasted on top and bottom faces of the printed composition (1 x 1 cm 2 ).
  • the dielectric properties of the 3D printed composite were characterized by impedance analyzer (Agilent 4294A). As a function of frequency, the capacitance and tangent loss of the samples were measured. And, the capacitance was converted into a dielectric constant.
  • Printed composites with dimensions of 30 mm x 30 mm x 0.25 mm (widthxlengthxthickness) were prepared for the determination of their heat dissipation performance.
  • Joule heating device with 200 nm of Au was deposited on the samples using a thermal evaporator in order to generate heat on the samples. Then, 200 mW of power was applied to the device, and the temperature information was characterized by IR camera (Ti200, Fluke). The temperature at the reference point, located 2 mm from the heater, was recorded.

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Abstract

La présente invention concerne une formulation d'encre pour la fabrication additive, la formulation d'encre comprenant un polymère de siloxane photodurcissable, un silane photodurcissable et une ou plusieurs charges, la ou les charges comprenant des particules d'un matériau noyau-enveloppe, le noyau étant formé à partir d'un matériau à changement de phase et l'enveloppe étant formée à partir d'un silane, et éventuellement d'un MXène en 2D.
PCT/SG2024/050579 2023-09-12 2024-09-12 Composite de gestion thermique imprimable en 3d pour dispositifs électroniques de communication sans fil flexibles Pending WO2025058564A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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