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WO2025057999A1 - Structure adhésive, procédé de production de celle-ci et kit - Google Patents

Structure adhésive, procédé de production de celle-ci et kit Download PDF

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Publication number
WO2025057999A1
WO2025057999A1 PCT/JP2024/032622 JP2024032622W WO2025057999A1 WO 2025057999 A1 WO2025057999 A1 WO 2025057999A1 JP 2024032622 W JP2024032622 W JP 2024032622W WO 2025057999 A1 WO2025057999 A1 WO 2025057999A1
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Prior art keywords
group
polymer
adherend
host
guest
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English (en)
Japanese (ja)
Inventor
明香音 千賀
智大 鈴木
和也 高橋
基史 大▲崎▼
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Yushiro Inc
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Yushiro Chemical Industry Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined

Definitions

  • the present invention relates to an adhesive structure, a method for producing the same, and a kit.
  • Adhesion is a technique used in a variety of fields, including materials engineering, and extensive research is being conducted with the aim of improving adhesive strength and durability.
  • the most widely known adhesive technique is to apply an adhesive to the material surface (joint surface) and then harden it to bond the materials together.
  • Patent Document 1 discloses an adhesive that can be used to bond IC chips and substrates, and that can impart appropriate flexibility and adhesiveness while also suppressing warping of electrical components such as semiconductor chips.
  • the present invention has been made in consideration of the above, and aims to provide an adhesive structure that can be formed by bonding at low temperatures, has excellent toughness, and can be easily manufactured, as well as a manufacturing method and kit for the same.
  • the present invention includes, for example, the subject matter described in the following sections.
  • Item 1 An adhesive structure in which a first adherend and a second adherend are bonded together with an adhesive layer,
  • the adhesive layer comprises a polymer, the first adherend and the polymer form a host-guest interaction; the second adherend and the polymer form a host-guest interaction;
  • the host-guest interaction is based on an inclusion complex formed between a host group and a guest group,
  • the adhesive structure wherein the polymer is a polymer H having the host group or a polymer G having the guest group.
  • the guest group is present on the surface of the first adherend that faces the adhesive layer, the guest group is present on the surface of the second adherend that faces the adhesive layer, Item 2.
  • the host group is present on the adhesive layer side of the first adherend, the host group is present on the surface of the second adherend that faces the adhesive layer, Item 2.
  • the polymer is polymer G.
  • Item 4 An adhesive structure in which a first adherend and a second adherend are bonded together with an adhesive layer,
  • the adhesive layer comprises a polymer, One of the first adherend and the second adherend forms a covalent bond with the polymer, and the other adherend forms a host-guest interaction with the polymer;
  • the host-guest interaction is based on an inclusion complex formed between a host group and a guest group,
  • the adhesive structure wherein the polymer is a polymer H having the host group or a polymer G having the guest group.
  • Item 5 A method for producing an adhesive structure according to any one of items 1 to 3, A method for manufacturing a bonded structure, comprising the steps of placing the polymer solution between the first adherend and the second adherend, and forming an adhesive layer containing the polymer at 100° C. or lower.
  • Item 6 Item 5.
  • a method for producing an adhesive structure according to item 4 A method for manufacturing a bonded structure, comprising a step of forming an adhesive layer on either the first adherend or the second adherend, and then superimposing the other adherend on the adhesive layer at 100°C or lower.
  • Item 7 A kit containing an adhesive and a dressing material, The adhesive comprises a polymer H having a host group, The coating material comprises a compound having a guest group.
  • Item 8 A kit containing an adhesive and a dressing material, The adhesive comprises a polymer G having a guest group, The coating material comprises a compound having a host group.
  • the adhesive structure of the present invention can be formed by bonding at low temperatures and can be easily manufactured.
  • FIG. 1 is a schematic diagram showing an example of an embodiment of a bonded structure of the present invention.
  • FIG. 2 is a schematic diagram showing another embodiment of the bonded structure of the present invention.
  • the adhesive structure of the present invention is a structure in which a first adherend and a second adherend are bonded with an adhesive layer.
  • the adhesive layer contains a polymer, and the first adherend and the polymer form a host-guest interaction, and the second adherend and the polymer form a host-guest interaction.
  • the host-guest interaction is based on an inclusion complex formed by a host group and a guest group, and the polymer is a polymer H having the host group, or a polymer G having the guest group.
  • the adhesive structure of the present invention can be formed by bonding at low temperatures and can be easily manufactured. More specifically, the adhesive structure of the present invention is formed, for example, by bonding a first adherend and a second adherend under conditions of 100°C or less. This makes it difficult to damage the adherends, and even if the adherends have different linear expansion coefficients and volume expansion coefficients, it is possible to form an adhesive structure while suppressing warping, deformation, etc. of the adherends.
  • the host group means a group capable of forming a host-guest interaction.
  • the host group is a group capable of including a guest group, which will be described later. Therefore, in the present invention, the host-guest interaction can mean that the host group and the guest group form an inclusion complex, that is, the host-guest interaction means that it is based on an inclusion complex formed by the host group and the guest group.
  • Such an inclusion complex is a complex in which one guest group is included within the ring of one host group. The host group and the guest group will be described in detail below.
  • the type of host group is not particularly limited as long as it can form an inclusion complex with the guest group.
  • a preferred host group is a group in which one hydrogen atom or hydroxyl group has been removed from cyclodextrin or a cyclodextrin derivative.
  • the host group is not limited to a monovalent group, and may be, for example, a divalent group.
  • the cyclodextrin derivative preferably has a structure in which, for example, the hydrogen atom of at least one of the hydroxyl groups of cyclodextrin is replaced with a hydrophobic group.
  • a cyclodextrin derivative is a molecule having a structure in which a cyclodextrin molecule is replaced with another organic group having hydrophobicity.
  • the cyclodextrin derivative has at least one hydrogen atom or at least one hydroxyl group, and preferably has at least one hydroxyl group.
  • the hydrophobic group preferably has a structure substituted with at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group).
  • R is a methyl group or an ethyl group
  • the aforementioned "at least one group selected from the group consisting of a hydrocarbon group, an acyl group, and -CONHR (R is a methyl group or an ethyl group)" may be referred to as "hydrocarbon group, etc.” for convenience.
  • cyclodextrin refers to at least one selected from the group consisting of ⁇ -cyclodextrin, ⁇ -cyclodextrin, and ⁇ -cyclodextrin. Therefore, a "cyclodextrin derivative” is at least one selected from the group consisting of ⁇ -cyclodextrin derivatives, ⁇ -cyclodextrin derivatives, and ⁇ -cyclodextrin derivatives.
  • the host group is a group of one or more valences in which one hydrogen atom or hydroxyl group has been removed from cyclodextrin or a derivative thereof, but the hydrogen atom or hydroxyl group removed may be from any position in the cyclodextrin or derivative thereof.
  • the total number of hydroxyl groups in one cyclodextrin molecule is N, then for ⁇ -cyclodextrin, N is 18, for ⁇ -cyclodextrin, N is 21, and for ⁇ -cyclodextrin, N is 24.
  • the host group is a monovalent group resulting from the removal of one "hydroxyl group" from a cyclodextrin derivative, the cyclodextrin derivative is formed by replacing the hydrogen atoms of up to N-1 hydroxyl groups per cyclodextrin molecule with hydrocarbon groups or the like.
  • the cyclodextrin derivative can have the hydrogen atoms of up to N hydroxyl groups per cyclodextrin molecule replaced with hydrocarbon groups or the like.
  • the host group preferably has a structure in which the hydrogen atoms of 70% or more of the total number of hydroxyl groups present in one cyclodextrin molecule are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 80% or more of the total number of hydroxyl groups present in one cyclodextrin molecule are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 90% or more of the total number of hydroxyl groups are substituted with the hydrocarbon group or the like.
  • the host group preferably has a structure in which the hydrogen atoms of 13 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 15 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 17 of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
  • the host group preferably has a structure in which the hydrogen atoms of 15 or more of the total hydroxyl groups present in one ⁇ -cyclodextrin molecule are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 17 or more of the total hydroxyl groups present in one ⁇ -cyclodextrin molecule are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 19 or more of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
  • the host group preferably has a structure in which the hydrogen atoms of 17 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like. It is more preferable that the hydrogen atoms of 19 or more of the total hydroxyl groups present in one molecule of ⁇ -cyclodextrin are substituted with the hydrocarbon group or the like, and it is particularly preferable that the hydrogen atoms of 21 or more of the total hydroxyl groups are substituted with the hydrocarbon group or the like.
  • the type of the hydrocarbon group is not particularly limited.
  • the hydrocarbon group include an alkyl group, an alkenyl group, and an alkynyl group.
  • the number of carbon atoms in the hydrocarbon group is not particularly limited, but for example, it is preferable that the number of carbon atoms in the hydrocarbon group is 1 to 4.
  • hydrocarbon groups having 1 to 4 carbon atoms include methyl, ethyl, n-propyl, isopropyl, and butyl groups.
  • hydrocarbon group When the hydrocarbon group is a propyl or butyl group, it may be either linear or branched.
  • examples of the acyl group include an acetyl group, a propionyl group, and a formyl group.
  • the acyl group is preferably an acetyl group because it is more likely to form a host-guest interaction.
  • -CONHR (R is a methyl group or an ethyl group) is a methyl carbamate group or an ethyl carbamate group. In terms of the ease with which host-guest interactions can be formed, -CONHR is preferably an ethyl carbamate group.
  • the hydrocarbon group is preferably an alkyl group or an acyl group having 1 to 4 carbon atoms, more preferably a methyl group or an acyl group, further preferably a methyl group, an acetyl group, or a propionyl group, and particularly preferably a methyl group or an acetyl group.
  • the guest group means a group that can be included in the host group. That is, the guest group is a group that can form an inclusion complex with the host group. In particular, the guest group is preferably a group that can form an inclusion complex with the above-mentioned cyclodextrin or a derivative thereof.
  • the guest group is not limited to a monovalent group, and may be, for example, a divalent group.
  • Guest groups include linear or branched hydrocarbon groups having 3 to 30 carbon atoms, cycloalkyl groups, heteroaryl groups, and organometallic complexes, which may have one or more substituents.
  • the substituents are the same as those described above, and examples of the substituents include halogen atoms (e.g., fluorine, chlorine, bromine, etc.), hydroxyl groups, carboxyl groups, ester groups, amide groups, and hydroxyl groups that may be protected.
  • More specific guest groups include linear or cyclic alkyl groups having 4 to 18 carbon atoms, and groups derived from polycyclic aromatic hydrocarbons.
  • the linear alkyl groups having 4 to 18 carbon atoms may be either linear or branched.
  • the cyclic alkyl groups may have a cage structure.
  • Examples of polycyclic aromatic hydrocarbons include ⁇ -conjugated compounds formed of at least two or more aromatic rings, and specific examples include naphthalene, anthracene, tetracene, pentacene, benzopyrene, chrysene, pyrene, triphenylene, etc.
  • the guest group include monovalent groups formed by removing one atom (e.g., a hydrogen atom) from a guest molecule, such as at least one selected from the group consisting of alcohol derivatives; aryl compounds; carboxylic acid derivatives; amino derivatives; azobenzene derivatives having a cyclic alkyl group or a phenyl group; cinnamic acid derivatives; aromatic compounds and their alcohol derivatives; amine derivatives; ferrocene derivatives; azobenzene; naphthalene derivatives; anthracene derivatives; pyrene derivatives; perylene derivatives; clusters composed of carbon atoms such as fullerene; and dansyl compounds.
  • a guest molecule such as at least one selected from the group consisting of alcohol derivatives; aryl compounds; carboxylic acid derivatives; amino derivatives; azobenzene derivatives having a cyclic alkyl group or a phenyl group; cinnamic acid derivatives;
  • guest groups include t-butyl groups, n-octyl groups, n-dodecyl groups, isobornyl groups, adamantyl groups, groups derived from pyrene, and groups to which the above-mentioned substituents are bonded.
  • the guest group when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group consisting of an octyl group and a dodecyl group; when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group consisting of an adamantyl group and an isobornyl group; and when the host group is derived from ⁇ -cyclodextrin or a derivative thereof, the guest group is preferably at least one selected from the group consisting of an octyl group, a dodecyl group, a cyclododecyl group, and an adamantyl group.
  • the adhesive structure of the present invention includes an adhesive layer containing a polymer.
  • the polymer is the polymer H having the host group or the polymer G having the guest group. Polymer H and polymer G will be described in detail below.
  • polymer H The type of polymer H is not particularly limited as long as it has the host group, and for example, a polymer containing a known host group can be used as polymer H. It is preferable that polymer H has the host group and does not have the guest group. In addition, in polymer H, it is preferable that the host group is bonded to a side chain of the polymer by a covalent bond.
  • Polymer H can be, for example, a vinyl polymer having a host group, specifically a polymer having a host group-containing vinyl monomer unit in its structural unit.
  • a host group-containing vinyl monomer unit is a structural unit formed by a host group-containing vinyl monomer.
  • the host group-containing vinyl monomer is not particularly limited as long as it is a vinyl compound having the host group, and can be exemplified by a wide variety of known host group-containing vinyl monomers.
  • the host group-containing vinyl monomer is a compound having any one of an acryloyl group (CH 2 ⁇ CH(CO)—), a methacryloyl group (CH 2 ⁇ CCH 3 (CO)—), a styryl group, a vinyl group, an allyl group, etc.
  • a specific example of a host group-containing vinyl monomer is a compound represented by the following general formula (h1):
  • Ra represents a hydrogen atom or a methyl group
  • R H represents the host group
  • R 1 represents a divalent group formed by removing one hydrogen atom from a monovalent group selected from the group consisting of a hydroxyl group, a thiol group, an alkoxy group which may have one or more substituents, a thioalkoxy group which may have one or more substituents, an alkyl group which may have one or more substituents, an amino group which may have one substituent, an amide group which may have one substituent, an aldehyde group, and a carboxyl group.
  • substituents examples include an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, a halogen atom, a carboxyl group, a carbonyl group, a sulfonyl group, a sulfone group, and a cyano group.
  • the host group-containing vinyl monomer can be a compound represented by the following general formula (h2):
  • Ra, R H and R 1 have the same definitions as Ra, R H and R 1 in formula (h1), respectively.
  • examples of the host group-containing vinyl monomer include compounds represented by the following general formula (h3):
  • Ra, R H and R 1 are respectively defined as Ra, R H and R 1 in formula (h1).
  • n is an integer of 1 to 20, preferably 1 to 10, more preferably 1 to 5.
  • Rb represents a hydrogen atom or an alkyl group having 1 to 20 carbon atoms (preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms).
  • the host group R H in the host group-containing vinyl monomers represented by the formulae (h1), (h2) and (h3) is an example of a monovalent group obtained by removing one hydroxyl group from cyclodextrin or a derivative thereof.
  • the substituents are not particularly limited, and examples of the substituents include an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, a halogen atom, a carboxyl group, a carbonyl group, a sulfonyl group, a sulfone group, and a cyano group.
  • the compounds represented by formulae (h1) to (h3) are preferably, for example, (meth)acrylic acid ester derivatives (i.e., R1 is -COO-) or (meth)acrylamide derivatives (i.e., R1 is -CONH- or -CONR-, and R has the same meaning as the above-mentioned substituents).
  • R in -CONR- for example, an alkyl group having 1 to 20 carbon atoms is preferable, an alkyl group having 1 to 10 carbon atoms is more preferable, and an alkyl group having 1 to 6 carbon atoms is particularly preferable.
  • (meth)acrylic means “acrylic” or “methacrylic
  • (meth)acrylate means “acrylate” or “methacrylate”
  • (meth)allyl means “allyl” or “methallyl”.
  • the host group-containing vinyl monomer can be produced by known methods, and is also available commercially.
  • polymer H is the aforementioned host group-containing vinyl polymer
  • such a host group-containing vinyl polymer may have another vinyl monomer unit in addition to the host group-containing vinyl monomer unit.
  • the other monomer unit is referred to as a third monomer unit.
  • the third monomer unit is a structural unit formed by a third monomer.
  • the third monomer can be a wide range of polymerizable monomers that are copolymerizable with the host group-containing vinyl monomer.
  • the third monomer may be any of various known vinyl polymerizable monomers. Specific examples of the third monomer include the compound represented by the following general formula (a1).
  • Ra represents a hydrogen atom or a methyl group
  • R3 represents a halogen atom, a hydroxyl group, a thiol group, an amino group or a salt thereof which may have one substituent, a carboxyl group or a salt thereof which may have one substituent, an amide group or a salt thereof which may have one or more substituents, or a phenyl group which may have one or more substituents.
  • R 3 when R 3 is a carboxyl group having one substituent, examples of the carboxyl group include a carboxyl group (i.e., an ester) in which the hydrogen atom of the carboxyl group is substituted with a hydrocarbon group having 1 to 20 carbon atoms, a hydroxyalkyl group (e.g., a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group), a methoxypolyethylene glycol (the number of ethylene glycol units is 1 to 20, preferably 1 to 10, particularly preferably 2 to 5), an ethoxypolyethylene glycol (the number of ethylene glycol units is 1 to 20, preferably 1 to 10, particularly preferably 2 to 5), or the like.
  • the hydrocarbon group having 1 to 20 carbon atoms preferably has 1 to 15 carbon atoms, more preferably 1 to 10 carbon atoms, and particularly preferably 1 to 3 carbon atoms.
  • the hydrocarbon group may be either linear or branched.
  • R3 is an amide group having one or more substituents, i.e., a secondary amide or a tertiary amide
  • examples of such a group include amide groups in which one hydrogen atom or two hydrogen atoms of the primary amide are independently substituted with a hydrocarbon group or a hydroxyalkyl group having 1 to 20 carbon atoms (e.g., a hydroxymethyl group, a 1-hydroxyethyl group, a 2-hydroxyethyl group).
  • the hydrocarbon group having 1 to 20 carbon atoms preferably has 1 to 15 carbon atoms, and more preferably has 2 to 10 carbon atoms.
  • the hydrocarbon group may be either linear or branched.
  • the compound represented by formula (a1) include (meth)acrylic acid, allylamine, maleic anhydride, styrene, etc., as well as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, t-butyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, cyclohexyl (meth)acrylate, n-octyl (meth)acrylate, 2-methoxy (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2-phenylethyl (meth)acrylate, 4-hydroxybutyl ...
  • Examples of such compounds include (meth)acrylic esters such as acrylate, hydroxymethyl (meth)acrylate, phenoxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, ethoxy-diethylene glycol (meth)acrylate, methoxy-triethylene glycol (meth)acrylate, and methoxy-polyethylene glycol (meth)acrylate; and (meth)acrylamide compounds such as (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethylacrylamide, N-isopropyl (meth)acrylamide, 2-hydroxyethyl (meth)acrylamide, and N-hydroxymethyl (meth)acrylamide. These compounds can be used alone or in combination of two or more.
  • More preferred examples of the compound represented by formula (a1) include (meth)acrylamide compounds such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethylacrylamide, N-isopropyl(meth)acrylamide, 2-hydroxyethyl(meth)acrylamide, and N-hydroxymethyl(meth)acrylamide, as well as methyl(meth)acrylate, ethyl(meth)acrylate, n-propyl(meth)acrylate, isopropyl(meth)acrylate, n-butyl(meth)acrylate, isobutyl(meth)acrylate, t-butyl(meth)acrylate, hexyl(meth)acrylate, and 2-ethylhexyl(meth)acrylate, of which N,N-dimethyl(meth)acrylamide, N,N-diethylacrylamide, N-isopropyl(meth)acrylamide, 2-hydroxyeth
  • the third monomer unit contained in polymer H preferably does not form an inclusion complex with the host group.
  • Particularly preferred compounds represented by formula (a1) include (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethylacrylamide, 2-hydroxyethyl(meth)acrylamide, methyl(meth)acrylate, ethyl(meth)acrylate, and n-propyl(meth)acrylate.
  • the content of the host group in the host group-containing vinyl polymer is not particularly limited.
  • the content of the host group-containing vinyl monomer unit in the total structural units of the host group-containing vinyl polymer is, for example, 0.1 mol% or more and 50 mol% or less.
  • the content of the host group-containing vinyl monomer unit in the total structural units of the host group-containing vinyl polymer is preferably 0.5 mol% or more, more preferably 1 mol% or more, even more preferably 1.5 mol% or more, particularly preferably 2 mol% or more, and preferably 40 mol% or less, more preferably 35 mol% or less, even more preferably 30 mol% or less, particularly preferably 25 mol% or less.
  • the content ratio of the host group-containing vinyl monomer units in the host group-containing vinyl polymer can be considered to be the same as the content ratio of the host group-containing vinyl monomer in the monomers used to produce the host group-containing vinyl polymer.
  • the structural units contained in the host group-containing vinyl polymer may contain other monomer units in addition to the host group-containing vinyl monomer units and the third monomer units, or may consist only of the host group-containing vinyl monomer units and the third monomer units.
  • the method for producing the host group-containing vinyl polymer is not particularly limited, and the host group-containing vinyl polymer can be produced, for example, by a known radical polymerization method.
  • the weight average molecular weight of polymer H is preferably 5,000 or more, more preferably 8,000 or more, even more preferably 10,000 or more, and is preferably 500,000 or less, more preferably 100,000 or less, even more preferably 50,000 or less, in order to improve the adhesive force and strength of the adhesive layer and to make the adhesive layer easier to form at a lower temperature.
  • the weight average molecular weight of polymer H can be adjusted, for example, by known methods.
  • the weight average molecular weight of polymer H can be adjusted to a desired range by using a molecular weight regulator such as a chain transfer agent.
  • a molecular weight regulator such as a chain transfer agent.
  • the weight average molecular weight of the host group-containing vinyl polymer can be easily adjusted by using a chain transfer agent in a radical polymerization reaction.
  • polymer G The type of polymer G is not particularly limited as long as it has the guest group, and for example, a polymer containing a known guest group can be used as polymer G. It is preferable that polymer G has the guest group and does not have the host group. In addition, in polymer G, it is preferable that the guest group is bonded to a side chain of the polymer by a covalent bond.
  • Polymer G can be, for example, a vinyl polymer having a guest group, specifically, a polymer having a guest group-containing vinyl monomer unit in its structural unit.
  • a guest group-containing vinyl monomer unit is a structural unit formed by a guest group-containing vinyl monomer.
  • the guest group-containing vinyl monomer is not particularly limited as long as it is a vinyl compound having the host group, and can be exemplified by a wide variety of known guest group-containing vinyl monomers.
  • the guest group-containing vinyl monomer is a compound having an acryloyl group (CH 2 ⁇ CH(CO)—), a methacryloyl group (CH 2 ⁇ CCH 3 (CO)—), or any other group such as a styryl group, a vinyl group, or an allyl group.
  • a specific example of a guest group-containing vinyl monomer is a compound represented by the following general formula (g1):
  • Ra represents a hydrogen atom or a methyl group
  • R G represents the guest group
  • R 2 has the same meaning as R 1 in formula (h1).
  • (meth)acrylic acid ester or a derivative thereof i.e., R2 is -COO-
  • (meth)acrylamide or a derivative thereof i.e., R2 is -CONH- or -CONR-, where R has the same meaning as the above-mentioned substituent
  • the polymerization reaction is likely to proceed, and therefore the production of polymer G is facilitated.
  • guest group-containing vinyl monomers include n-hexyl (meth)acrylate, n-octyl (meth)acrylate, n-dodecyl (meth)acrylate, adamantyl (meth)acrylate, hydroxyadamantyl (meth)acrylate, 1-(meth)acrylamidoadamantane, 2-ethyl-2-adamantyl (meth)acrylate, N-dodecyl (meth)acrylamide, t-butyl (meth)acrylate, 1-acrylamidoadamantane, N-(1-adamantyl)(meth)acrylamide, N-benzyl (meth)acrylamide, N-1-naphthylmethyl (meth)acrylamide, ethoxylated o-phenylphenol acrylate, phenoxy polyethylene glycol acrylate, isostearyl acrylate, nonylphenol EO adduct acrylate
  • polymer G is the guest group-containing vinyl polymer described above
  • such guest group-containing vinyl polymer may have other vinyl monomer units in addition to the guest group-containing vinyl monomer units.
  • the other vinyl monomer units may be the same as the third monomer units described above.
  • the third monomer units contained in polymer G may be monomer units based on the compound represented by general formula (a1) described above.
  • preferred compounds represented by formula (a1) include (meth)acrylamide compounds such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethylacrylamide, N-isopropyl(meth)acrylamide, 2-hydroxyethyl(meth)acrylamide, and N-hydroxymethyl(meth)acrylamide, as well as methyl(meth)acrylate, ethyl(meth)acrylate, n-propyl(meth)acrylate, isopropyl(meth)acrylate, n-butyl(meth)acrylate, isobutyl(meth)acrylate, t-butyl(meth)acrylate, hexyl(meth)acrylate, and 2-ethylhexyl(meth)acrylate, among which N,N-dimethyl(meth)acrylamide, N,N-diethylacrylamide, N-isopropyl(meth)acrylamide, 2-hydroxyeth)acrylamide,
  • the third monomer unit contained in polymer G preferably does not form an inclusion complex with the host group.
  • Particularly preferred compounds represented by formula (a1) in polymer G include (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethylacrylamide, 2-hydroxyethyl(meth)acrylamide, methyl(meth)acrylate, ethyl(meth)acrylate, and n-propyl(meth)acrylate.
  • the content of guest groups in the guest group-containing vinyl polymer is not particularly limited.
  • the content of guest group-containing vinyl monomer units in all structural units of the guest group-containing vinyl polymer is, for example, 0.1 mol% or more and 50 mol% or less.
  • the content of guest group-containing vinyl monomer units in all structural units of the guest group-containing vinyl polymer is preferably 0.5 mol% or more, more preferably 1 mol% or more, even more preferably 1.5 mol% or more, particularly preferably 2 mol% or more, and preferably 40 mol% or less, more preferably 30 mol% or less, even more preferably 25 mol% or less, particularly preferably 20 mol% or less.
  • the content ratio of guest group-containing vinyl monomer units in the guest group-containing vinyl polymer can be considered to be the same as the content ratio of guest group-containing vinyl monomer in the monomers used to produce the guest group-containing vinyl polymer.
  • the structural units contained in the guest group-containing vinyl polymer may contain other monomer units in addition to the guest group-containing vinyl monomer units and the third monomer units, or may consist only of the guest group-containing vinyl monomer units and the third monomer units.
  • the method for producing the guest group-containing vinyl polymer is not particularly limited, and the guest group-containing vinyl polymer can be produced, for example, by a known radical polymerization method.
  • the weight average molecular weight of polymer G is preferably 5,000 or more, more preferably 8,000 or more, and even more preferably 10,000 or more, and is preferably 500,000 or less, more preferably 100,000 or less, and even more preferably 50,000 or less, in order to improve the adhesive force and strength of the adhesive layer and to make the adhesive layer easier to form at a lower temperature.
  • the weight average molecular weight of polymer G can be adjusted, for example, by known methods.
  • the weight average molecular weight of polymer G can be adjusted to a desired range by using a molecular weight regulator such as a chain transfer agent.
  • a molecular weight regulator such as a chain transfer agent.
  • the weight average molecular weight of the guest group-containing vinyl polymer can be easily adjusted by using a chain transfer agent in a radical polymerization reaction.
  • the adhesive layer comprises the aforementioned polymer H or polymer G.
  • the adhesive layer comprises the aforementioned polymer G
  • the adhesive layer comprises the aforementioned polymer H.
  • the adhesive layer may contain other components in addition to polymer H and polymer G, for example, polymers other than polymer H and polymer G, as well as tackifiers, colorants, silane coupling agents, curing accelerators, light stabilizers, etc.
  • the adhesive layer preferably contains 80% by mass or more of polymer H and polymer G, more preferably 90% by mass or more, and even more preferably 95% by mass or more.
  • the adhesive layer may consist of only polymer H or polymer G.
  • the method for forming the adhesive layer is not particularly limited, and for example, known methods for forming adhesives can be widely applied to the present invention.
  • One example of a method for forming an adhesive layer is a method in which a solution of a polymer for forming the adhesive layer is prepared, the polymer solution is applied to a substrate, and then the volatile components are removed to form an adhesive layer on the substrate, or a method in which the polymer solution is placed between a pair of adherends, and the volatile components in the polymer solution are removed to form an adhesive layer containing the polymer.
  • the bonded structure of the present invention includes a first adherend and a second adherend.
  • both the first adherend and the second adherend are modified with the host group or guest group.
  • the type of adherend is not particularly limited, and an appropriate material can be selected depending on the application and purpose.
  • the adherend include plates, films, sheets, and other members formed from various materials such as resin, glass, metal, and inorganic materials, and may also be electronic components (silicon substrates) such as IC chips.
  • the first adherend and the second adherend may be of the same type or different types.
  • the adherend is preferably a metal, glass, ceramic, silicon substrate, or the like. In this case, it is easy to modify the surface of the adherend with a host group or a guest group.
  • the shape and size of the adherend are not particularly limited and can be selected appropriately depending on the application.
  • the adherend may be flat, curved, or bent.
  • both the first adherend and the second adherend are modified with the host group or guest group.
  • a host group is bonded to at least one surface of the first adherend and the second adherend via a covalent bond.
  • a guest group is bonded to at least one surface of the first adherend and the second adherend via a covalent bond.
  • the host group is bonded to the first adherend and one of the second adherends via a covalent bond, and the guest group is bonded to the other adherend via a covalent bond.
  • the method for modifying the first and second adherends with host groups or guest groups is not particularly limited, and for example, the host groups or guest groups can be modified by employing a known surface treatment method. Among these, a method for modifying the host groups or guest groups using a silane coupling agent is preferably used.
  • first and second adherends are treated with a silane coupling agent or hydrophilized to bond (e.g., covalently bond) reactive functional groups to the surfaces of the first and second adherends.
  • the reactive functional groups are reacted with a compound having a host group or a compound having a guest group to modify the first and second adherends with host groups or guest groups.
  • the reactive functional group may be any of a variety of functional groups capable of providing radical functional groups such as oxy radicals and hydroperoxy radicals, as well as hydroxyl groups, vinyl groups, (meth)acrylic groups, amino groups, mercapto groups, isocyanate groups, etc.
  • silane coupling agent is not particularly limited, and examples include a wide range of known silane coupling agents.
  • silane coupling agents include vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyl
  • the type of the compound having the host group is not particularly limited, so long as it is a compound capable of reacting with the reactive functional group.
  • the compound having the host group include cyclodextrin compounds modified with (meth)acrylamide, cyclodextrin compounds modified with an amino group, and cyclodextrin compounds modified with a tosyl group. Specific examples include cyclodextrin acrylamide, aminocyclodextrin, and mono-6-O-(p-toluenesulfonyl)cyclodextrin. In these compounds, the cyclodextrin may be any of the ⁇ , ⁇ , and ⁇ forms.
  • the type of compound having the guest group is not particularly limited, so long as it is a compound that can react with the reactive functional group.
  • Examples of compounds having the guest group include compounds in which the guest group is modified with "carbonyl chloride, bromine atoms, iodine atoms, amino groups, hydroxyl groups, or epoxy groups.” Specific examples include 1-adamantanecarbonyl chloride, 2-1-adamantanecarbonyl chloride, etc.
  • the bonded structure of the present invention has a structure in which a first adherend and a second adherend are bonded together with an adhesive layer containing the polymer.
  • Examples of the embodiment of such a bonded structure include the following bonded structure 1 and bonded structure 2.
  • Adhesive structure 1 An adhesive structure in which a first adherend and the polymer form a host-guest interaction, and a second adherend and the polymer form a host-guest interaction, and the polymer is the polymer H or the polymer G.
  • Adhesive structure 2 One of the first adherend and the second adherend forms a covalent bond with the polymer, and the other adherend forms a host-guest interaction with the polymer, and the polymer is polymer H or polymer G.
  • Adhesive structure 1 An example of the adhesive structure 1 is an adhesive structure in which both the first adherend and the second adherend are modified with guest groups, and the polymer is polymer H.
  • adhesive structure 1A an adhesive structure in which the guest group is present on the surface of the first adherend facing the adhesive layer, the guest group is present on the surface of the second adherend facing the adhesive layer, and the polymer is polymer H.
  • adhesive structure 1 is an adhesive structure in which both the first adherend and the second adherend are modified with a host group, and the polymer is polymer G.
  • adhesive structure 1B such an adhesive structure will be referred to as adhesive structure 1B. That is, in adhesive structure 1B, the host group is present on the surface of the first adherend facing the adhesive layer, the host group is present on the surface of the second adherend facing the adhesive layer, and the polymer is polymer G.
  • Fig. 1 is a cross-sectional view for explaining an outline of the bonded structure 1A.
  • the bonded structure 1A in the bonded structure 1A, at least one of the host groups contained in the polymer H forms an inclusion complex with the guest groups g modified on the pair of adherends 10, 11, forming a host-guest interaction, and the adherends 10, 11 are bonded to each other by the adhesive layer 20.
  • the guest groups modified on the adherends 10, 11 are bonded to the adherends by covalent bonds, and in Fig. 1, they are bonded via a coupling agent.
  • the bonded structure 1B at least one of the guest groups contained in the polymer G forms an inclusion complex with the host groups modified on both adherends, forming a host-guest interaction, and the adherends are bonded to each other by the adhesive layer.
  • the host group modified on the adherend is bonded to the adherend by, for example, a covalent bond.
  • the method for manufacturing the adhesive structure 1 is not particularly limited, and various methods can be adopted.
  • the adhesive structure 1 can be manufactured by a manufacturing method including a step of disposing the polymer solution between the first adherend and the second adherend, and forming an adhesive layer containing the polymer at 100°C or less.
  • a manufacturing method for the adhesive structure 1 is referred to as "manufacturing method 1.”
  • the polymer solution sandwiched between the first and second adherends is dried at 100°C or less to remove volatile components. This forms a polymer layer between the first and second adherends, and this polymer layer becomes the adhesive layer.
  • the polymer solution used in manufacturing method 1 is a solution in which a polymer is dissolved in a solvent.
  • the type of solvent is not particularly limited, and examples include aqueous solvents such as water, alcohol compounds, and mixed solvents of these. Examples of alcohol compounds include alcohol compounds with 1 to 3 carbon atoms.
  • the aqueous solvent is preferably water.
  • the concentration of the polymer solution used in manufacturing method 1 is not particularly limited.
  • the polymer content is preferably 0.1 to 100 parts by mass, more preferably 1 to 50 parts by mass, and even more preferably 5 to 20 parts by mass, per 100 parts by mass of the solvent.
  • the method of the drying treatment described above is not particularly limited.
  • the temperature of the drying treatment is preferably 100°C or less.
  • the temperature of the drying treatment is preferably 80°C or less, more preferably 60°C or less, even more preferably 50°C or less, and particularly preferably 40°C or less.
  • the lower limit of the drying treatment temperature is not particularly limited, and can be set appropriately within the range in which the solvent of the polymer solution volatilizes, for example, 10°C or more.
  • the time of the drying treatment can be selected appropriately depending on the temperature, and can be, for example, 30 minutes to 24 hours.
  • the adhesive structure 1 is the adhesive structure 1A described above, in manufacturing method 1, a first adherend and a second adherend modified with a guest group are used, and a solution of polymer H is used as the polymer solution.
  • a solution of polymer H is used as the polymer solution.
  • a first adherend and a second adherend modified with a host group are used, and a solution of polymer G is used as the polymer solution.
  • the adhesive structure 1 is easily formed because the adhesive layer is formed by processing at a low temperature of 100°C or less. In particular, since it can be manufactured at a low temperature, even if the linear expansion coefficient and volume expansion coefficient of a pair of adherends are different, warping and deformation of the adherends are significantly less likely to occur compared to when the adhesive processing is performed at high temperatures, and this allows the formation of a high-quality adhesive structure.
  • techniques for forming an adhesive layer by in-situ polymerization i.e., techniques that use an adhesive or techniques that form an adhesive layer by polymerizing a monomer in situ
  • the present invention is less likely to cause such problems.
  • the adhesive structure 1 is bonded by forming a host-guest interaction between the adherend and the polymer contained in the adhesive layer, so the adhesive layer has excellent adhesive force and strength, and can be made extremely thin compared to conventional adhesives (e.g., heat-curing epoxy adhesives).
  • the thickness of the adhesive layer can be 5 nm to 1 ⁇ m or less. In the present invention, it is possible to achieve an adhesive layer thickness of 500 nm or less, even 300 nm or less, and especially 100 nm or less.
  • the host-guest interaction is reversible, it also has excellent re-adhesion properties, and for example, the first adherend and the second adherend can be peeled off from the adhesive layer and then re-adhered.
  • One embodiment of the adhesive structure 2 is an adhesive structure in which one of the first and second adherends forms a covalent bond with the polymer H, and the other adherend forms a host-guest interaction with the polymer H.
  • an adhesive structure 2A such an adhesive structure is referred to as an adhesive structure 2A.
  • FIG. 2 is a cross-sectional view for explaining an outline of the adhesive structure 2A.
  • the polymer H forms a covalent bond with the surface of one of the adherends 10.
  • the method for covalently bonding the polymer H to the surface of the adherend 10 there are no particular limitations on the method for covalently bonding the polymer H to the surface of the adherend 10, and various known methods can be adopted.
  • the polymer H can be covalently bonded to the surface of the adherend by a method similar to the method for modifying the adherend with a host group or a guest group.
  • the other adherend 11 is modified (covalently bonded) with a guest group g, which forms a host-guest interaction with the host group in the polymer H.
  • the guest group modified on the adherend 11 is covalently bonded to the adherend bonded via a coupling agent.
  • the reactive functional groups are bonded to the surfaces of the first and second adherends, and the reactive functional groups are reacted with polymer H, thereby modifying (covalently bonding) the adherends with polymer H.
  • a functional group capable of reacting with the reactive functional group is introduced into polymer H by a known method or the like. Examples include polymer H modified with (meth)acrylamide, polymer H modified with an amino group, and polymer H modified with a tosyl group.
  • adhesive structure 2 is an adhesive structure in which one of the first and second adherends forms a covalent bond with the polymer G, and the other adherend forms a host-guest interaction with the polymer G.
  • adhesive structure 2B such an adhesive structure will be referred to as adhesive structure 2B (not shown).
  • the other adherend is modified with a host group, and the host group forms a host-guest interaction with the guest group in polymer G.
  • the polymer G forms a covalent bond with the surface of one of the adherends.
  • the method for covalently bonding the polymer G to the surface of the adherend is not particularly limited, and various known methods can be adopted.
  • the polymer G can be covalently bonded to the surface of the adherend by a method similar to the method for modifying the adherend with a host group or a guest group.
  • the reactive functional groups are bonded to the surfaces of the first and second adherends, and the reactive functional groups are reacted with polymer G, thereby modifying (covalently bonding) the adherends with polymer G.
  • a functional group capable of reacting with the reactive functional group has been introduced into polymer G by a known method or the like.
  • the method for manufacturing the adhesive structure 2 is not particularly limited, and various methods can be adopted.
  • the adhesive structure 2 can be manufactured by a manufacturing method including a step of forming an adhesive layer on either the first adherend or the second adherend, and then superimposing the other adherend on the adhesive layer at 100°C or less.
  • Such a manufacturing method for the adhesive structure 2 is referred to as "manufacturing method 2".
  • an example of a method for forming an adhesive layer on an adherend is to modify the adherend with polymer H or polymer G. This causes polymer H or polymer G to be formed as an adhesive layer on the surface of the adherend, forming an adherend coated with the adhesive layer.
  • the temperature when the adhesive layer and the adherend are laminated is preferably 50°C or lower, and preferably 10°C or higher.
  • the laminated time can be appropriately selected depending on the temperature, and can be, for example, 30 minutes to 24 hours.
  • the bonded structure 2 can be formed by overlapping the adherends at a temperature of 100°C or less, so that the bonded structure 2 can be easily formed.
  • the bonded structure 2 can be manufactured at a low temperature, even if the linear expansion coefficient and volume expansion coefficient of a pair of adherends are different, warping and deformation of the adherends are significantly less likely to occur compared to when the bonding process is performed at a high temperature, and a good quality bonded structure is formed.
  • a technique for forming an adhesive layer by in-situ polymerization i.e., a technique using an adhesive or a technique for forming an adhesive layer by polymerizing a monomer in situ
  • a technique for forming an adhesive layer by in-situ polymerization has a problem that the adherends are exposed to high temperatures during the formation of the adhesive layer, which makes them prone to warping and deformation, whereas the present invention is less likely to cause such problems.
  • kit The present invention includes a kit containing an adhesive and a coating material.
  • the adhesive contains a polymer H having a host group
  • the coating material contains a compound having a guest group.
  • this kit will be referred to as "Kit 1A.”
  • Kit 1A the compound having a guest group is the same as described above.
  • the adhesive is, for example, a solution of the aforementioned polymer H.
  • the adhesive structure 1A of the present invention can be manufactured. Specifically, a pair of substrates to be bonded and kit 1A are prepared. Here, the pair of substrates used have surfaces that are not modified with host groups or guest groups. Such substrates are treated with a coating material to obtain a first adherend modified with guest groups. Specifically, the pair of substrates are treated with a silane coupling agent or hydrophilized, and then the surfaces of the pair of substrates are modified with guest groups using a coating material, thereby obtaining a pair of adherends modified with guest groups. Thereafter, the adhesive of kit 1A is placed between the surfaces of the pair of adherends modified with guest groups, and a drying process is performed. In this way, the adhesive structure 1 is manufactured.
  • Kit 1B Another embodiment of the kit is a kit in which the adhesive contains a polymer G having a guest group, and the coating material contains a compound having a host group.
  • this kit will be referred to as "Kit 1B."
  • Kit 1B the compound having a host group is the same as described above.
  • the adhesive is, for example, a solution of the aforementioned polymer G.
  • the adhesive structure 1B of the present invention can be manufactured. Specifically, a pair of substrates to be bonded and kit 1B are prepared. Here, the pair of substrates used have surfaces that are not modified with host groups or guest groups. Such substrates are treated with a coating material to obtain a first adherend modified with a host group. Specifically, the pair of substrates are treated with a silane coupling agent or hydrophilized, and then the surfaces of the pair of substrates are modified with host groups using a coating material, thereby obtaining a pair of adherends modified with host groups. Thereafter, the adhesive of kit 1B is placed between the host group-modified surfaces of the pair of adherends, and a drying process is performed. In this way, the adhesive structure 1B is manufactured.
  • the polymerized product after the photopolymerization was placed in a dryer at 80 ° C. and dried for 16 hours or more, and further dried at 105 ° C. for 4 hours or more to remove the solvent, etc., to obtain a polymer H having a host group in the side chain.
  • the weight average molecular weight of such polymer H was 10,000.
  • Example 1a A pair of adherends obtained in Production Example 2a was prepared, and was designated as the first adherend and the second adherend, respectively. Meanwhile, the polymer H obtained in Production Example 1a was dissolved in pure water to prepare an aqueous solution of polymer H with a concentration of 10% by mass. The aqueous solution was placed between the first adherend and the second adherend, and dried at 25°C for 24 hours to form an adhesive layer made of polymer H between the first adherend and the second adherend, and an adhesive structure in which the first adherend and the second adherend were bonded by the adhesive layer was obtained.
  • Example 1b A bonded structure was obtained in the same manner as in Example 1a, except that the adherend was changed to the adherend obtained in Production Example 2b.
  • Example 1c An adhesive structure was obtained in the same manner as in Example 1a, except that Polymer H was changed to Polymer H obtained in Production Example 1b.
  • Example 1d An adhered structure was obtained in the same manner as in Example 1b, except that Polymer H was changed to Polymer H obtained in Production Example 1b.
  • the tensile strength test was performed using an AUTOGRAPH AGS-J10kN (Shimadzu) with a pneumatic flat gripper (adhesion area: 40 mm x 25 mm, distance between pneumatic flat grippers: 70 mm, tensile speed: 10 mm/min). Specifically, only one adherend of the bonded structure and only the other adherend were pulled in opposite directions, and the tensile strength was measured when the adherend peeled off from the adhesive layer.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

L'invention concerne une structure adhésive qui peut être formée par adhérence à basse température (par exemple, température ambiante) et qui peut être produite facilement, un procédé de production de la structure adhésive, et un kit.　La présente invention concerne une structure adhésive dans laquelle un premier support et un second support sont liés par une couche adhésive, la couche adhésive contenant un polymère, le premier support et le polymère formant une interaction hôte-invité, le second support et le polymère formant une interaction hôte-invité, l'interaction hôte-invité étant basée sur un complexe d'inclusion formé par un groupe hôte et un groupe invité, et le polymère étant un polymère H ayant le groupe hôte ou un polymère G ayant le groupe invité.
PCT/JP2024/032622 2023-09-15 2024-09-12 Structure adhésive, procédé de production de celle-ci et kit Pending WO2025057999A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018038186A1 (fr) * 2016-08-23 2018-03-01 ダイキン工業株式会社 Matériau polymère
JP2018111788A (ja) * 2017-01-13 2018-07-19 国立大学法人大阪大学 接着構造体及びその製造方法
WO2020175678A1 (fr) * 2019-02-28 2020-09-03 国立大学法人 東京大学 Procédé de production d'un corps de support solide, procédé de formation d'un revêtement sur la surface d'un corps de support solide, et corps de support solide
WO2020179908A1 (fr) * 2019-03-06 2020-09-10 国立大学法人大阪大学 Matériau polymère, et procédé de fabrication de celui-ci
CN115322605A (zh) * 2022-07-20 2022-11-11 吉林大学 一种主-客体自修复防雾涂层及其制备方法
CN118421043A (zh) * 2024-04-29 2024-08-02 北京化工大学 一种基于聚合物分子刷实现超分子自组装的材料及其制备方法和应用

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018038186A1 (fr) * 2016-08-23 2018-03-01 ダイキン工業株式会社 Matériau polymère
JP2018111788A (ja) * 2017-01-13 2018-07-19 国立大学法人大阪大学 接着構造体及びその製造方法
WO2020175678A1 (fr) * 2019-02-28 2020-09-03 国立大学法人 東京大学 Procédé de production d'un corps de support solide, procédé de formation d'un revêtement sur la surface d'un corps de support solide, et corps de support solide
WO2020179908A1 (fr) * 2019-03-06 2020-09-10 国立大学法人大阪大学 Matériau polymère, et procédé de fabrication de celui-ci
CN115322605A (zh) * 2022-07-20 2022-11-11 吉林大学 一种主-客体自修复防雾涂层及其制备方法
CN118421043A (zh) * 2024-04-29 2024-08-02 北京化工大学 一种基于聚合物分子刷实现超分子自组装的材料及其制备方法和应用

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