WO2025050232A1 - Fan module and electronic device - Google Patents
Fan module and electronic device Download PDFInfo
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- WO2025050232A1 WO2025050232A1 PCT/CN2023/116679 CN2023116679W WO2025050232A1 WO 2025050232 A1 WO2025050232 A1 WO 2025050232A1 CN 2023116679 W CN2023116679 W CN 2023116679W WO 2025050232 A1 WO2025050232 A1 WO 2025050232A1
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- cover plate
- air outlet
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- cover
- plate
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Definitions
- the invention relates to an air cooling unit and an electronic device comprising the same, in particular to a fan module and an electronic device comprising the same.
- laptops Compared to traditional desktop computers, laptops have the advantage of being thin and light and easy to carry, making them a widely used electronic device.
- most manufacturers will install fans inside the laptop. In this way, the fan can introduce cold air from the outside to cool the heat source and the laptop components such as the shell.
- the present invention provides a fan module and an electronic device to prevent a user from feeling uncomfortable due to contact with a high-temperature cover when operating a keyboard module.
- the electronic device disclosed in another embodiment of the present invention includes a base, a cover, a mainboard, a heat source, a keyboard module and a fan module.
- the cover is disposed on one side of the base and forms a storage space together with the base.
- the mainboard is disposed in the storage space.
- the heat source is disposed on the mainboard.
- the keyboard module and the cover are located on the same side of the mainboard.
- the fan module includes a shell and a fan blade assembly.
- the shell includes a first cover plate, a side plate and a second cover plate.
- the side plate is disposed on the first cover plate.
- the second cover plate is disposed on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet.
- the first air outlet and the second air outlet are respectively located
- the first cover plate has two different sides.
- the second cover plate has an air inlet connected to the first air outlet and the second air outlet.
- the fan blade assembly is rotatably arranged on the first cover plate.
- the first cover plate has a first notch. The first notch is recessed inward from a reference surface where the second air outlet is located and is connected to the side plate.
- the first notch is recessed inward from the reference plane where the second air outlet is located, and is connected to the side plate. Therefore, the heat dissipation airflow guided by the fan blade assembly will flow from the second air outlet through the first notch to between the cover body and the main board. In this way, the air volume flowing between the cover body and the main board can be increased, and the heat accumulated between the cover body and the main board can be effectively dissipated. In this way, the cover body can be effectively cooled, and the user is prevented from feeling uncomfortable due to contact with the high temperature cover body when operating the keyboard module.
- FIG1 is a schematic side cross-sectional view of an electronic device according to an embodiment of the present invention.
- FIG2 is a three-dimensional view of the electronic device in FIG1 omitting the base and the cover;
- FIG3 is a perspective view of a fan module of the electronic device in FIG1 ;
- FIG4 is a partially enlarged top view of the electronic device in FIG1 omitting the base and the cover;
- FIG. 5 is a partial enlarged view of the electronic device in FIG. 1 .
- FIG. 1 is a side cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention.
- FIG. 2 is a three-dimensional diagram of the electronic device in FIG. 1 omitting the base and the cover.
- the electronic device 10 is, for example, a main body of a notebook computer, and includes a base 100, a cover 200, a mainboard 300, two heat sources 400, a keyboard module 500, two fan modules 600, two first heat dissipation fin groups 650, two second heat dissipation fin groups 660, two air guides 700, and two air guides 800.
- the base 100 is, for example, commonly known as a “D piece”.
- the cover 200 is, for example, commonly known as a “C piece”.
- the cover 200 is disposed on one side of the base 100 and forms a receiving space 150 together with the base 100 .
- the motherboard 300 is disposed in the accommodation space 150.
- the motherboard 300 has a top surface 301 and a bottom surface 302 facing each other.
- the top surface 301 faces the cover 200.
- the two heat sources 400 are, for example, a central processing unit (CPU) or a graphics processing unit (GPU).
- the two heat sources 400 are electrically connected to the motherboard 300 and are disposed on the bottom surface 302.
- Keyboard module The keyboard module 500 is electrically connected to the main board 300.
- the keyboard module 500 and the cover 200 are located on the same side of the main board 300.
- the corresponding fan module 600, the first heat sink fin group 650, the second heat sink fin group 660, the air guide 700 and the air guide 800 constitute a heat sink assembly (not numbered).
- the two heat sink assemblies in this embodiment are respectively used to dissipate the heat generated by the two heat sources 400 to the outside of the electronic device 10. Since the structures of the two heat sink assemblies are similar, only one heat sink assembly is used as an example for description below.
- the fan module 600 includes a housing 610 and a fan blade assembly 620.
- the housing 610 includes a first cover plate 611, a side plate 612 and a second cover plate 613.
- the side plate 612 is disposed on the first cover plate 611.
- the second cover plate 613 is disposed on a side of the side plate 612 away from the first cover plate 611, so that the first cover plate 611, the side plate 612 and the second cover plate 613 together form a first air outlet 614 and a second air outlet 615.
- the first air outlet 614 and the second air outlet 615 are respectively located on different sides of the first cover plate 611.
- the first cover plate 611 has a first notch 617.
- the first notch 617 is recessed inward from a reference plane P where the second air outlet 615 is located, and is connected to the side plate 612.
- the second cover plate 613 has an air inlet 616 connected to the first air outlet 614 and the second air outlet 615.
- the fan assembly 620 is rotatably disposed on the first cover plate 611.
- a side edge 6111 defining the first notch 617 in the first cover plate 611 is in an arc shape to facilitate the manufacture of the first cover plate 611.
- the present invention is not limited to the shape of the side edge 6111. In other embodiments, the side edge may also be in a right angle shape.
- the first cover plate 611 further has a second notch 618.
- the second notch 618 is recessed inward from the reference plane P. Different sides of the first notch 617 are respectively connected to the side plate 612 and the second notch 618.
- the width W of the second notch 618 is, for example, 37 mm.
- the side plate 612 has a side edge 6120.
- the side edge 6120 is connected to the first notch 617.
- a side notch 6121 is formed between the side edge 6120 and the reference plane P.
- the second air outlet 615, the first notch 617, the second notch 618 and the side notch 6121 together form a large air outlet.
- the first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed on the mainboard 300.
- the first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed adjacent to the first air outlet 614 and the second air outlet 615 respectively.
- the air guide 700 is disposed on a side of the first cover plate 611 away from the second cover plate 613 , and covers at least a portion of the second notch 618 .
- the air guide 800 is disposed on the bottom surface 302 of the mainboard 300 and is located between the heat source 400 and the fan module 600 .
- Figure 4 is a partial enlarged view of the top view of the electronic device in Figure 1 with the base and the cover omitted.
- Figure 5 is a partial enlarged view of the electronic device in Figure 1.
- the fan blade assembly 620 is used to direct a heat dissipation airflow F through the first air outlet 614 and the second air outlet 614.
- the air outlet 615 is guided to the first heat dissipation fin set 650 and the second heat dissipation fin set 660.
- the air volume of the heat dissipation airflow F flowing to the second heat dissipation fin set 660 will increase, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin set 660.
- the heat dissipation airflow F will flow more concentratedly to the second heat dissipation fin set 660, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin set 660.
- the first plate body may not need to have the second notch 618, and the electronic device may not need to include the air guide 700.
- a side edge 6110 of the first cover plate 610 defining the second air outlet 615 contacts the second heat dissipation fin set 660. Therefore, the heat dissipation airflow F flowing to the second heat dissipation fin set 660 can be prevented from further flowing to the pivotal member (not shown), thereby preventing the lubricating oil on the pivotal member from being dried by the heat dissipation airflow F.
- the air guide 800 is used to guide the heat dissipation airflow F flowing out of the first notch 617 and the side notch 6121 to between the top surface 301 of the mainboard 300 and the cover 200.
- the air guide 800 allows the heat dissipation airflow F to flow more concentratedly to the top surface 301 of the mainboard 300 and the cover 200.
- the electronic device may not need to include the air guide 800.
- the first cover plate 611 is closer to the cover body 200 than the second cover plate 613. Therefore, the heat dissipation airflow F can more easily flow from the second air outlet 615 of the first cover plate 611 to between the top surface 301 of the mainboard 300 and the cover body 200.
- the first cover plate can also be farther away from the cover body than the second cover plate.
- the first notch is recessed inward from the reference plane where the second air outlet is located, and is connected to the side plate. Therefore, the heat dissipation airflow guided by the fan blade assembly will flow from the second air outlet through the first notch to between the cover body and the main board. In this way, the air volume flowing between the cover body and the main board can be increased, and the heat accumulated between the cover body and the main board can be effectively dissipated. In this way, the cover body can be effectively cooled, and the user is prevented from feeling uncomfortable due to contact with the high temperature cover body when operating the keyboard module.
- the temperature at the hottest point in the cover body 200 is reduced by about 7 degrees Celsius.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Mechanical Engineering (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本发明涉及一种风冷单元及包含其的电子装置，特别系一种风扇模组及包含其的电子装置。The invention relates to an air cooling unit and an electronic device comprising the same, in particular to a fan module and an electronic device comprising the same.
相较于传统桌面计算机来说，笔记本电脑有轻薄好携带的优势而成为了目前广泛使用的电子装置。一般来说，为了有效逸散热源所产生的热，大部分厂商会于笔记本电脑内部设置风扇。如此一来，便能通过风扇将外界冷风导入，以冷却热源及壳体等笔记本电脑的元件。Compared to traditional desktop computers, laptops have the advantage of being thin and light and easy to carry, making them a widely used electronic device. Generally speaking, in order to effectively dissipate the heat generated by the heat source, most manufacturers will install fans inside the laptop. In this way, the fan can introduce cold air from the outside to cool the heat source and the laptop components such as the shell.
然而，近年来为了追求好携带的特性，笔记本电脑逐渐变得越来越轻薄，这使得笔记本电脑的内部空间越来越小。因此，笔记本电脑中的风扇时常没有足够的空间来有效地冷却壳体。如此一来，用户在操作壳体上的键盘模组时，便会接触到高温的壳体而产生不适。However, in recent years, in pursuit of portability, laptop computers have gradually become thinner and lighter, which has reduced the internal space of the laptop computer. Therefore, the fan in the laptop computer often does not have enough space to effectively cool the housing. As a result, when the user operates the keyboard module on the housing, the user will come into contact with the hot housing and feel uncomfortable.
发明内容Summary of the invention
本发明在于提供一种风扇模组及电子装置，以防止用户在操作键盘模组时因接触到高温的盖体而产生不适。The present invention provides a fan module and an electronic device to prevent a user from feeling uncomfortable due to contact with a high-temperature cover when operating a keyboard module.
本发明一实施例所揭露的风扇模组包含一壳体以及一扇叶组件。壳体包含一第一盖板、一侧板及一第二盖板。侧板设置于第一盖板。第二盖板设置于侧板远离第一盖板的一侧，而使得第一盖板、侧板及第二盖板共同形成一第一出风口及一第二出风口。第一出风口及第二出风口分别位于第一盖板的相异两侧。第二盖板具有连通于第一出风口及第二出风口的一入风口。扇叶组件可转动地设置于第一盖板。第一盖板具有一第一缺口。第一缺口从第二出风口所位于的一基准面向内凹陷，并连接于侧板。A fan module disclosed in one embodiment of the present invention includes a housing and a blade assembly. The housing includes a first cover plate, a side plate and a second cover plate. The side plate is arranged on the first cover plate. The second cover plate is arranged on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet. The first air outlet and the second air outlet are respectively located on different sides of the first cover plate. The second cover plate has an air inlet connected to the first air outlet and the second air outlet. The blade assembly is rotatably arranged on the first cover plate. The first cover plate has a first notch. The first notch is recessed inward from a reference plane where the second air outlet is located, and is connected to the side plate.
本发明另一实施例所揭露的电子装置包含一基座、一盖体、一主板、一热源、一键盘模组以及一风扇模组。盖体设置于基座的一侧并与基座共同形成一容置空间。主板设置于容置空间中。热源设置于主板。键盘模组与盖体位于主板的同一侧。风扇模组包含一壳体以及一扇叶组件。壳体包含一第一盖板、一侧板及一第二盖板。侧板设置于第一盖板。第二盖板设置于侧板远离第一盖板的一侧，而使得第一盖板、侧板及第二盖板共同形成一第一出风口及一第二出风口。第一出风口及第二出风口分别位于 第一盖板的相异两侧。第二盖板具有连通于第一出风口及第二出风口的一入风口。扇叶组件可转动地设置于第一盖板。第一盖板具有一第一缺口。第一缺口从第二出风口所位于的一基准面向内凹陷，并连接于侧板。The electronic device disclosed in another embodiment of the present invention includes a base, a cover, a mainboard, a heat source, a keyboard module and a fan module. The cover is disposed on one side of the base and forms a storage space together with the base. The mainboard is disposed in the storage space. The heat source is disposed on the mainboard. The keyboard module and the cover are located on the same side of the mainboard. The fan module includes a shell and a fan blade assembly. The shell includes a first cover plate, a side plate and a second cover plate. The side plate is disposed on the first cover plate. The second cover plate is disposed on a side of the side plate away from the first cover plate, so that the first cover plate, the side plate and the second cover plate together form a first air outlet and a second air outlet. The first air outlet and the second air outlet are respectively located The first cover plate has two different sides. The second cover plate has an air inlet connected to the first air outlet and the second air outlet. The fan blade assembly is rotatably arranged on the first cover plate. The first cover plate has a first notch. The first notch is recessed inward from a reference surface where the second air outlet is located and is connected to the side plate.
根据上述实施例所揭露的风扇模组及电子装置，第一缺口从第二出风口所位于的基准面向内凹陷，并连接于侧板。因此，扇叶组件所导引的散热气流会从第二出风口通过第一缺口流动至盖体与主板之间。如此一来，便能增加流动至盖体与主板之间的风量，而有效地将累积在盖体与主板之间的热逸散。如此一来，便能有效地冷却盖体，而防止用户在操作键盘模组时因接触到高温的盖体而产生不适。According to the fan module and electronic device disclosed in the above embodiments, the first notch is recessed inward from the reference plane where the second air outlet is located, and is connected to the side plate. Therefore, the heat dissipation airflow guided by the fan blade assembly will flow from the second air outlet through the first notch to between the cover body and the main board. In this way, the air volume flowing between the cover body and the main board can be increased, and the heat accumulated between the cover body and the main board can be effectively dissipated. In this way, the cover body can be effectively cooled, and the user is prevented from feeling uncomfortable due to contact with the high temperature cover body when operating the keyboard module.
图1为根据本发明一实施例的电子装置的侧剖示意图；FIG1 is a schematic side cross-sectional view of an electronic device according to an embodiment of the present invention;
图2为图1中的电子装置省略基座及盖体的立体图；FIG2 is a three-dimensional view of the electronic device in FIG1 omitting the base and the cover;
图3为图1中的电子装置的风扇模组的立体图；FIG3 is a perspective view of a fan module of the electronic device in FIG1 ;
图4为图1中的电子装置省略基座及盖体的俯视图的局部放大图；FIG4 is a partially enlarged top view of the electronic device in FIG1 omitting the base and the cover;
图5为图1中的电子装置的局部放大图。FIG. 5 is a partial enlarged view of the electronic device in FIG. 1 .
【附图标记说明】
10：电子装置
100：基座
150：容置空间
200：盖体
300：主板
301：顶面
302：底面
400：热源
500：键盘模组
600：风扇模组
610：壳体
611：第一盖板
6110,6111：侧缘
612：侧板
6120：侧缘
6121：侧缺口
613：第二盖板
614：第一出风口
615：第二出风口
616：入风口
617：第一缺口
618：第二缺口
620：扇叶组件
650：第一散热鳍片组
660：第二散热鳍片组
700,800：导风件
F：散热气流
W：宽度
P：基准面[Description of Reference Numerals]
10: Electronic devices
100: Base
150: Accommodation space
200: Cover
300: Motherboard
301: Top surface
302: Bottom
400: Heat source
500: Keyboard module
600: Fan module
610: Shell
611: First cover
6110,6111: side edge
612: Side panels
6120: Side edge
6121: Side notch
613: Second cover
614: First air outlet
615: Second air outlet
616: Air inlet
617: The First Gap
618: Second Gap
620: Fan blade assembly
650: First heat sink fin group
660: Second heat sink fin group
700,800: air guide
F: Cooling airflow
W: Width
P: Reference plane
以下在实施方式中详细叙述本发明的实施例的详细特征以及优点，其内容足以使本领域普通技术人员了解本发明的实施例的技术内容并据以实施，且根据本说明书所揭露的内容、保护范围及附图，本领域普通技术人员可轻易地理解本发明相关的目的及优点。以下的实施例系进一步详细说明本发明的观点，但非以任何观点限制本发明的范畴。The detailed features and advantages of the embodiments of the present invention are described in detail in the following embodiments, and the contents are sufficient to enable ordinary technicians in the field to understand the technical contents of the embodiments of the present invention and implement them accordingly. According to the contents, protection scope and drawings disclosed in this specification, ordinary technicians in the field can easily understand the relevant purposes and advantages of the present invention. The following embodiments further illustrate the viewpoints of the present invention in detail, but do not limit the scope of the present invention in any viewpoint.
请参阅图1及图2，图1为根据本发明一实施例的电子装置的侧剖示意图。图2为图1中的电子装置省略基座及盖体的立体图。于本实施例中，电子装置10例如为笔记本电脑的主机座体，并包含一基座100、一盖体200、一主板300、二热源400、一键盘模组500、二风扇模组600、二第一散热鳍片组650、二第二散热鳍片组660、二导风件700及二导风件800。Please refer to FIG. 1 and FIG. 2 . FIG. 1 is a side cross-sectional schematic diagram of an electronic device according to an embodiment of the present invention. FIG. 2 is a three-dimensional diagram of the electronic device in FIG. 1 omitting the base and the cover. In this embodiment, the electronic device 10 is, for example, a main body of a notebook computer, and includes a base 100, a cover 200, a mainboard 300, two heat sources 400, a keyboard module 500, two fan modules 600, two first heat dissipation fin groups 650, two second heat dissipation fin groups 660, two air guides 700, and two air guides 800.
基座100例如为俗称的“D件”。盖体200例如为俗称的“C件”。盖体200设置于基座100的一侧并与基座100共同形成一容置空间150。The base 100 is, for example, commonly known as a “D piece”. The cover 200 is, for example, commonly known as a “C piece”. The cover 200 is disposed on one side of the base 100 and forms a receiving space 150 together with the base 100 .
主板300设置于容置空间150中。于本实施例中，主板300具有彼此背对的一顶面301及一底面302。顶面301面对盖体200。二热源400例如为中央处理器(CPU)或图形处理器(GPU)。二热源400电性连接于主板300，并设置于底面302。键盘模 组500电性连接于主板300。键盘模组500与盖体200位于主板300的同一侧。The motherboard 300 is disposed in the accommodation space 150. In this embodiment, the motherboard 300 has a top surface 301 and a bottom surface 302 facing each other. The top surface 301 faces the cover 200. The two heat sources 400 are, for example, a central processing unit (CPU) or a graphics processing unit (GPU). The two heat sources 400 are electrically connected to the motherboard 300 and are disposed on the bottom surface 302. Keyboard module The keyboard module 500 is electrically connected to the main board 300. The keyboard module 500 and the cover 200 are located on the same side of the main board 300.
相对应的风扇模组600、第一散热鳍片组650、第二散热鳍片组660、导风件700及导风件800构成一个散热组件(未标号)。本实施例中的二散热组件分别用以将二热源400所产生的热逸散至电子装置10之外。由于二散热组件的结构相似，因此以下仅一个散热组件为例进行说明。The corresponding fan module 600, the first heat sink fin group 650, the second heat sink fin group 660, the air guide 700 and the air guide 800 constitute a heat sink assembly (not numbered). The two heat sink assemblies in this embodiment are respectively used to dissipate the heat generated by the two heat sources 400 to the outside of the electronic device 10. Since the structures of the two heat sink assemblies are similar, only one heat sink assembly is used as an example for description below.
请参阅图2图3，图3为图1中的电子装置的风扇模组的立体图。风扇模组600包含一壳体610以及一扇叶组件620。壳体610包含一第一盖板611、一侧板612及一第二盖板613。侧板612设置于第一盖板611。第二盖板613设置于侧板612远离第一盖板611的一侧，而使得第一盖板611、侧板612及第二盖板613共同形成一第一出风口614及一第二出风口615。第一出风口614及第二出风口615分别位于第一盖板611的相异两侧。第一盖板611具有一第一缺口617。第一缺口617从第二出风口615所位于的一基准面P向内凹陷，并连接于侧板612。第二盖板613具有连通于第一出风口614及第二出风口615的一入风口616。扇叶组件620可转动地设置于第一盖板611。Please refer to FIG. 2 and FIG. 3, which are three-dimensional views of the fan module of the electronic device in FIG. 1. The fan module 600 includes a housing 610 and a fan blade assembly 620. The housing 610 includes a first cover plate 611, a side plate 612 and a second cover plate 613. The side plate 612 is disposed on the first cover plate 611. The second cover plate 613 is disposed on a side of the side plate 612 away from the first cover plate 611, so that the first cover plate 611, the side plate 612 and the second cover plate 613 together form a first air outlet 614 and a second air outlet 615. The first air outlet 614 and the second air outlet 615 are respectively located on different sides of the first cover plate 611. The first cover plate 611 has a first notch 617. The first notch 617 is recessed inward from a reference plane P where the second air outlet 615 is located, and is connected to the side plate 612. The second cover plate 613 has an air inlet 616 connected to the first air outlet 614 and the second air outlet 615. The fan assembly 620 is rotatably disposed on the first cover plate 611.
于本实施例中，第一盖板611中界定第一缺口617的一侧缘6111呈圆弧形，以方便第一盖板611的制造。然而，本发明并不以侧缘6111的形状为限。于其他实施例中，侧缘亦可呈直角状。In this embodiment, a side edge 6111 defining the first notch 617 in the first cover plate 611 is in an arc shape to facilitate the manufacture of the first cover plate 611. However, the present invention is not limited to the shape of the side edge 6111. In other embodiments, the side edge may also be in a right angle shape.
此外，于本实施例中，第一盖板611还具有一第二缺口618。第二缺口618从基准面P向内凹陷。第一缺口617的相异两侧分别连接于侧板612及第二缺口618。第二缺口618的宽度W例如为37毫米(mm)。In addition, in this embodiment, the first cover plate 611 further has a second notch 618. The second notch 618 is recessed inward from the reference plane P. Different sides of the first notch 617 are respectively connected to the side plate 612 and the second notch 618. The width W of the second notch 618 is, for example, 37 mm.
此外，于本实施例中，侧板612具有一侧缘6120。侧缘6120连接于第一缺口617。侧缘6120与基准面P之间形成一侧缺口6121。于本实施例中，第二出风口615、第一缺口617、第二缺口618及侧缺口6121例如共同构成一个大出风口。In addition, in this embodiment, the side plate 612 has a side edge 6120. The side edge 6120 is connected to the first notch 617. A side notch 6121 is formed between the side edge 6120 and the reference plane P. In this embodiment, the second air outlet 615, the first notch 617, the second notch 618 and the side notch 6121 together form a large air outlet.
第一散热鳍片组650及第二散热鳍片组660设置于主板300。第一散热鳍片组650及第二散热鳍片组660分别邻设于第一出风口614及第二出风口615。The first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed on the mainboard 300. The first heat dissipation fin set 650 and the second heat dissipation fin set 660 are disposed adjacent to the first air outlet 614 and the second air outlet 615 respectively.
导风件700设置于第一盖板611远离第二盖板613的一侧，并遮蔽至少部分的第二缺口618。The air guide 700 is disposed on a side of the first cover plate 611 away from the second cover plate 613 , and covers at least a portion of the second notch 618 .
导风件800设置于主板300的底面302，并介于热源400及风扇模组600之间。The air guide 800 is disposed on the bottom surface 302 of the mainboard 300 and is located between the heat source 400 and the fan module 600 .
请参阅图3至图5，图4为图1中的电子装置省略基座及盖体的俯视图的局部放大图。图5为图1中的电子装置的局部放大图。Please refer to Figures 3 to 5. Figure 4 is a partial enlarged view of the top view of the electronic device in Figure 1 with the base and the cover omitted. Figure 5 is a partial enlarged view of the electronic device in Figure 1.
如图4所示，扇叶组件620用以将一散热气流F分别通过第一出风口614及第二 出风口615导引至第一散热鳍片组650及第二散热鳍片组660。通过第二缺口618，流动至第二散热鳍片组660的散热气流F的风量会增加，进而使得热源400所产生的热更有效地传递至第二散热鳍片组660。此外，通过遮蔽至少部分的第二缺口618的导风件700，散热气流F会更加集中地流动至第二散热鳍片组660，进而使得热源400所产生的热更有效地传递至第二散热鳍片组660。须注意的是，在热源的发热量较低的其他实施例中，第一板体亦可无需具有第二缺口618，且电子装置亦可无需包含导风件700。As shown in FIG. 4 , the fan blade assembly 620 is used to direct a heat dissipation airflow F through the first air outlet 614 and the second air outlet 614. The air outlet 615 is guided to the first heat dissipation fin set 650 and the second heat dissipation fin set 660. Through the second notch 618, the air volume of the heat dissipation airflow F flowing to the second heat dissipation fin set 660 will increase, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin set 660. In addition, by shielding at least a portion of the second notch 618 with the air guide 700, the heat dissipation airflow F will flow more concentratedly to the second heat dissipation fin set 660, thereby allowing the heat generated by the heat source 400 to be more effectively transferred to the second heat dissipation fin set 660. It should be noted that in other embodiments where the heat source has a lower calorific value, the first plate body may not need to have the second notch 618, and the electronic device may not need to include the air guide 700.
此外，如图3及4所示，于本实施例中，第一盖板610中界定第二出风口615的一侧缘6110例如接触第二散热鳍片组660。因此，能避免流动至第二散热鳍片组660的散热气流F进一步流动到枢接件(未示出)，而避免枢接件上的润滑油被散热气流F吹干。3 and 4 , in this embodiment, a side edge 6110 of the first cover plate 610 defining the second air outlet 615, for example, contacts the second heat dissipation fin set 660. Therefore, the heat dissipation airflow F flowing to the second heat dissipation fin set 660 can be prevented from further flowing to the pivotal member (not shown), thereby preventing the lubricating oil on the pivotal member from being dried by the heat dissipation airflow F.
如图5所示，导风件800用以将从第一缺口617及侧缺口6121流出的散热气流F导引至主板300的顶面301及盖体200之间。也就是说，导风件800让散热气流F更集中地流动至主板300的顶面301及盖体200。然而，在热源的发热量较低的其他实施例中，电子装置亦可无需包含导风件800。As shown in FIG5 , the air guide 800 is used to guide the heat dissipation airflow F flowing out of the first notch 617 and the side notch 6121 to between the top surface 301 of the mainboard 300 and the cover 200. In other words, the air guide 800 allows the heat dissipation airflow F to flow more concentratedly to the top surface 301 of the mainboard 300 and the cover 200. However, in other embodiments where the heat generation of the heat source is lower, the electronic device may not need to include the air guide 800.
此外，如图5所示，于本实施例中，第一盖板611较第二盖板613靠近盖体200。因此，散热气流F会更容易从第一盖板611的第二出风口615流动到主板300的顶面301及盖体200之间。然而，在热源的发热量较低的其他实施例中，第一盖板亦可较第二盖板远离盖体。In addition, as shown in FIG5 , in this embodiment, the first cover plate 611 is closer to the cover body 200 than the second cover plate 613. Therefore, the heat dissipation airflow F can more easily flow from the second air outlet 615 of the first cover plate 611 to between the top surface 301 of the mainboard 300 and the cover body 200. However, in other embodiments where the heat generation of the heat source is lower, the first cover plate can also be farther away from the cover body than the second cover plate.
根据上述实施例所揭露的风扇模组及电子装置，第一缺口从第二出风口所位于的基准面向内凹陷，并连接于侧板。因此，扇叶组件所导引的散热气流会从第二出风口通过第一缺口流动至盖体与主板之间。如此一来，便能增加流动至盖体与主板之间的风量，而有效地将累积在盖体与主板之间的热逸散。如此一来，便能有效地冷却盖体，而防止用户在操作键盘模组时因接触到高温的盖体而产生不适。According to the fan module and electronic device disclosed in the above embodiments, the first notch is recessed inward from the reference plane where the second air outlet is located, and is connected to the side plate. Therefore, the heat dissipation airflow guided by the fan blade assembly will flow from the second air outlet through the first notch to between the cover body and the main board. In this way, the air volume flowing between the cover body and the main board can be increased, and the heat accumulated between the cover body and the main board can be effectively dissipated. In this way, the cover body can be effectively cooled, and the user is prevented from feeling uncomfortable due to contact with the high temperature cover body when operating the keyboard module.
此外，根据实验数据，通过第一缺口617、第二缺口618、侧缺口6121及导风件800的设计，盖体200中最高温处的温度约下降了7摄氏度左右。 In addition, according to experimental data, through the design of the first notch 617, the second notch 618, the side notch 6121 and the air guide 800, the temperature at the hottest point in the cover body 200 is reduced by about 7 degrees Celsius.
Claims (10)
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| PCT/CN2023/116679 WO2025050232A1 (en) | 2023-09-04 | 2023-09-04 | Fan module and electronic device |
| US18/376,354 US20250081386A1 (en) | 2023-09-04 | 2023-10-03 | Fan assembly and electronic device |
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| PCT/CN2023/116679 WO2025050232A1 (en) | 2023-09-04 | 2023-09-04 | Fan module and electronic device |
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| US18/376,354 Continuation US20250081386A1 (en) | 2023-09-04 | 2023-10-03 | Fan assembly and electronic device |
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| WO2025050232A1 true WO2025050232A1 (en) | 2025-03-13 |
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