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WO2025048367A1 - Structure d'antenne - Google Patents

Structure d'antenne Download PDF

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Publication number
WO2025048367A1
WO2025048367A1 PCT/KR2024/012360 KR2024012360W WO2025048367A1 WO 2025048367 A1 WO2025048367 A1 WO 2025048367A1 KR 2024012360 W KR2024012360 W KR 2024012360W WO 2025048367 A1 WO2025048367 A1 WO 2025048367A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
circuit board
conductive layer
layer
ground
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2024/012360
Other languages
English (en)
Korean (ko)
Inventor
김성회
김대규
김지연
박희준
조영대
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongwoo Fine Chem Co Ltd
Original Assignee
Dongwoo Fine Chem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongwoo Fine Chem Co Ltd filed Critical Dongwoo Fine Chem Co Ltd
Publication of WO2025048367A1 publication Critical patent/WO2025048367A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/48—Earthing means; Earth screens; Counterpoises
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas

Definitions

  • the present invention relates to an antenna structure. More specifically, it relates to an antenna structure including an antenna element and a circuit board.
  • Wi-Fi and Bluetooth are being applied or built into display devices, electronic devices, buildings, etc.
  • antennas for performing high-frequency or ultra-high-frequency communication are being applied to public transportation such as buses and subways, building structures, and various mobile devices.
  • repeater antennas may be applied to public transportation such as buses and subways, building structures, windows, etc., to facilitate signal transmission and reception in display devices, electronic devices, etc. having high-frequency or ultra-high-frequency communication bands such as 3G, 4G, 5G, or higher.
  • a film-shaped antenna can be attached to a target object, and the antenna can be connected to an external power source through a circuit board and a connector.
  • signal loss and power loss may occur in the circuit board, and signal loss and power loss may also occur at the connection portion of the circuit board and the connector.
  • the directivity of the antenna may be disturbed depending on the material, structure, etc. of the target object.
  • Korean Patent Publication No. 2019-0009232 discloses an antenna module integrated into a display panel.
  • An object of the present invention is to provide an antenna structure having improved operational reliability and signal efficiency.
  • An antenna structure comprising: an antenna element including an antenna conductive layer and an antenna ground layer; a first circuit board electrically connected to the antenna conductive layer; a second circuit board electrically connected to the antenna ground layer; and a connector coupled together to ends of the first circuit board and the second circuit board.
  • the first circuit board comprises: a first core layer; a first inner conductive layer formed on one surface of the first core layer adjacent to the antenna conductive layer and including a signal wiring electrically connected to the antenna conductive layer; and a first outer conductive layer formed on the other surface of the first core layer opposite to the one surface and facing the first inner conductive layer, an antenna structure.
  • the first inner conductive layer further includes a co-planar ground arranged around the signal wiring on the one surface of the first core layer.
  • the first circuit board further includes a via structure penetrating the first core layer and electrically connecting the first outer conductive layer and the co-planar ground.
  • the second circuit board comprises a second core layer; and a second inner conductive layer formed on one surface of the second core layer adjacent to the antenna ground layer.
  • the second circuit board further includes a second outer conductive layer formed on the other side opposite to the first side of the second core layer and facing the second inner conductive layer.
  • the connector includes a ground pin connected to the second inner conductive layer or the second outer conductive layer of the second circuit board; and a signal/power supply pin connected to the signal wiring of the first circuit board.
  • An antenna structure according to 7 above further comprising a penetration fixing mechanism that penetrates the first circuit board and the second circuit board and is fastened to the ground pin of the connector.
  • antenna dielectric layer comprises at least two dielectric layers and at least two point-adhesive layers.
  • antenna unit further includes a ground pad disposed around the signal pad and electrically and physically separated from the signal pad
  • first circuit board further includes a co-planar ground extending along the signal wiring around the signal wiring and bonded to the ground pad of the antenna unit.
  • An antenna structure may include a first circuit board connected to an antenna unit and a second circuit board connected to an antenna ground layer.
  • the first circuit board and the second circuit board may be connected together to a connector.
  • the ground efficiency through the antenna ground layer is increased, and the directivity of the antenna unit can be enhanced.
  • the connection of the antenna element and the connector can be stably implemented without folding of the circuit board.
  • the above connector can be connected to the first circuit board and the second circuit board through a fixing mechanism (connection pin) penetrating the first circuit board and the second circuit board. Therefore, soldering or welding can be omitted, and physical and thermal damage in the connection area of the circuit board can be prevented.
  • a blocking structure may be inserted between the first circuit board and the second circuit board in the connection area.
  • the blocking structure may prevent short-circuiting between the first circuit board and the second circuit board and stably implement a connector connection.
  • FIG. 1 is a schematic cross-sectional view showing an antenna structure according to exemplary embodiments.
  • FIG. 2 is a partially enlarged cross-sectional view showing an antenna structure in a connection area according to exemplary embodiments.
  • FIG. 3 is a plan view in the first surface direction of the first circuit board of the antenna structure according to exemplary embodiments.
  • FIG. 4 is a plan view in the second surface direction of the first circuit board of the antenna structure according to exemplary embodiments.
  • FIG. 5 is a plan view in the first surface direction of the second circuit board of the antenna structure according to exemplary embodiments.
  • FIG. 6 is a plan view in the second surface direction of the second circuit board of the antenna structure according to exemplary embodiments.
  • FIG. 7 is a schematic plan view showing an antenna unit included in an antenna structure according to exemplary embodiments.
  • FIG. 8 is a schematic cross-sectional view showing an antenna element of an antenna structure according to some exemplary embodiments.
  • Embodiments of the present invention provide an antenna structure including an antenna element and a plurality of circuit boards.
  • FIG. 1 is a schematic cross-sectional view showing an antenna structure according to exemplary embodiments.
  • the antenna structure may include an antenna element (100), a first circuit board (210), a second circuit board (250), and a connector (300).
  • the antenna element (100) may include an antenna conductive layer (120), a dielectric layer (antenna dielectric layer) (110), and an antenna ground layer (130).
  • the antenna conductive layer (120) and the antenna ground layer (130) may be formed on the upper and lower surfaces of the dielectric layer (110), respectively.
  • the antenna conductive layer (120) and the antenna ground layer (130) may include a metal or an alloy.
  • the antenna conductive layer (120) and the antenna ground layer (130) may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these. These may be used alone or in combination of two or more thereof.
  • the antenna conductive layer (120) and the antenna ground layer (130) may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy), or copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy) for low resistance implementation and fine linewidth patterning.
  • a silver alloy e.g., a silver-palladium-copper (APC) alloy
  • Cu copper
  • CuCa copper-calcium
  • the antenna conductive layer (120) may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), or zinc oxide (ZnOx).
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • ITZO indium zinc tin oxide
  • ZnOx zinc oxide
  • the antenna conductive layer (120) may include a laminated structure of a transparent conductive oxide layer and a metal layer, and may have, for example, a two-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer.
  • the flexible characteristic may be improved by the metal layer, while the resistance may be lowered, thereby improving the signal transmission speed, and the corrosion resistance and transparency may be improved by the transparent conductive oxide layer.
  • the antenna conductive layer (120) may include a blackening treatment portion. Accordingly, the reflectivity on the surface of the antenna unit may be reduced, thereby reducing pattern visibility due to light reflection.
  • the surface of the metal layer included in the antenna unit may be converted into a metal oxide or a metal sulfide to form a blackening layer.
  • a blackening layer such as a black material coating layer or a plating layer may be formed on the antenna unit or the metal layer.
  • the black material or plating layer may include an oxide, sulfide, alloy, or the like containing silicon, carbon, copper, molybdenum, tin, chromium, molybdenum, nickel, cobalt, or at least one of these.
  • composition and thickness of the blackening layer can be adjusted considering the reflectivity reduction effect and antenna radiation characteristics.
  • the dielectric layer (110) may include, for example, a transparent resin material.
  • the dielectric layer (110) may include, for example, a polyester resin such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, or polybutylene terephthalate; a cellulose resin such as diacetyl cellulose or triacetyl cellulose; a polycarbonate resin; an acrylic resin such as polymethyl (meth) acrylate or polyethyl (meth) acrylate; a styrene resin such as polystyrene or an acrylonitrile-styrene copolymer; a polyolefin resin such as polyethylene, polypropylene, a polyolefin having a cyclo- or norbornene structure, or an ethylene-propylene copolymer; a vinyl chloride resin; an amide resin such as nylon or an aromatic polyamide; an imide resin; a polyethersulfone resin; a
  • an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like, may also be included in the dielectric layer (110).
  • OCA optically clear adhesive
  • OCR optically clear resin
  • the dielectric layer (110) may include an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, glass, or the like.
  • An impedance or inductance for the antenna unit is formed by the dielectric layer (110), so that a frequency band that the antenna element (100) can drive or sense can be adjusted.
  • the dielectric constant of the dielectric layer (110) can be adjusted to a range of about 1.5 to 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, so that driving in a high-frequency band may not be implemented.
  • the first circuit board (210) may be electrically connected to the antenna conductive layer (120) or the antenna unit.
  • the second circuit board (250) may be electrically connected to the antenna ground layer (130).
  • One end of the first circuit board (210) and the second circuit board (250) can be electrically connected to the antenna element (100) in the bonding area (BR).
  • the antenna unit and the first circuit board (210) may be electrically connected to each other using a first conductive bonding film (160) in the bonding area (BR).
  • the antenna ground layer (130) and the second circuit board (250) may be electrically connected to each other using a second conductive bonding film (170) in the bonding area (BR).
  • the first conductive bonding film (160) and the second conductive bonding film (170) can each be formed from an anisotropic conductive film (ACF).
  • the other ends of the first circuit board (210) and the second circuit board (250) can be electrically connected to the connector (300) at the connection area (CR).
  • the connection area (CR) can be an area where an external power source and an antenna structure are connected via the connector (300).
  • the antenna ground layer (130) may be connected to the second circuit board (250), so that the grounding efficiency through the antenna ground layer (130) may be improved.
  • the radiation directivity of the antenna conductive layer (120) may be enhanced in a direction opposite to the antenna ground layer (130).
  • the antenna element (100) may be provided as a vertical radiating antenna having a radiation directivity above the upper surface of the antenna conductive layer (120).
  • the first circuit board (210) connected to the antenna unit and the second circuit board (250) connected to the antenna ground layer (130) can be used as independent circuit boards that are physically separated from each other. Accordingly, the directivity enhancement through the antenna ground layer (130) and the power supply/signal transmission efficiency to the antenna conductive layer (120) can be implemented independently without mutual interference.
  • the first circuit board (210) and the second circuit board (250) can be connected to the connector (300) while being separated from each other. Therefore, damage to the circuit board caused by bending stress when using one circuit board can be prevented. Therefore, power supply/signal loss through the circuit boards (210, 250) can be prevented and radiation efficiency through the antenna conductive layer (120) can be increased.
  • a barrier structure (290) may be arranged between the other ends of the first circuit board (210) and the second circuit board (250) in the connection area (CR).
  • the barrier structure (290) includes an insulating material, such as a resin material, and may prevent the first circuit board (210) and the second circuit board (250) from contacting each other or short-circuiting each other in the connection area (CR).
  • the blocking structure (290) may be formed in the form of an insulating printed pattern, an adhesive film, or a tape.
  • FIG. 2 is a partially enlarged cross-sectional view showing an antenna structure in a connection area according to exemplary embodiments.
  • the first circuit board (210) may include a first core layer (215), a first inner conductive layer (220), and a first outer conductive layer (230).
  • the first inner conductive layer (220) and the first outer conductive layer (230) may be disposed on the lower surface and the upper surface of the first core layer (215), respectively.
  • the lower surface of the first core layer (215) may be a surface adjacent to the antenna conductive layer (120), and the upper surface of the first core layer (215) may be an opposing surface of the lower surface and the antenna conductive layer (120).
  • the first inner conductive layer (220) of the first circuit board (210) can be electrically connected to the antenna conductive layer (120) by bonding.
  • the second circuit board (250) may include a second core layer (255), a second inner conductive layer (260), and a second outer conductive layer (270).
  • the second inner conductive layer (260) and the second outer conductive layer (270) may be disposed on the upper surface and the lower surface of the second core layer (255), respectively.
  • the upper surface of the second core layer (255) may be a surface adjacent to the antenna ground layer (130), and the lower surface of the second core layer (255) may be an opposite surface of the upper surface and the antenna ground layer (130).
  • the second inner conductive layer (260) of the second circuit board (250) can be electrically connected by bonding to the antenna ground layer (130).
  • the first and second core layers (215, 255) may include a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc.
  • a flexible resin such as a polyimide resin, a modified polyimide (MPI), an epoxy resin, a polyester, a cycloolefin polymer (COP), a liquid crystal polymer (LCP), etc.
  • the first and second core layers (215, 255) may include a polyimide resin or an MPI.
  • the conductive layers (220, 230, 260, 270) of the circuit board may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), tin (Sn), zinc (Zn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals.
  • the conductive layers (220, 230, 260, 270) may include copper or a copper alloy in consideration of signal efficiency and ground efficiency.
  • the first and second circuit boards (210, 250) may be manufactured from a copper clad laminate (CCL).
  • the first and second circuit boards (210, 250) may be provided as a flexible printed circuit board (FPCB).
  • the other ends of the circuit boards (210, 250) can be connected to the connector (300).
  • the connector (300) may include a signal/power supply pin (310) and a ground pin (320a, 320b).
  • the signal/power supply pin (310) may be in contact with or connected to a first inner conductive layer (220) of a first circuit board (210).
  • the connector (300) includes an external connection terminal (330), and a power cable may be connected through the external connection terminal (330). Accordingly, power supply and signal transmission may be performed to the antenna conductive layer (120) through the power cable, the external connection terminal (330), the signal/power supply pin (310), and the first inner conductive layer (220).
  • the above ground pin may include a first ground pin (320a) that contacts or is connected to a first outer conductive layer (230) of a first circuit board (210) and a second ground pin (320b) that contacts or is connected to a conductive layer of a second circuit board (250).
  • the second ground pin (320b) may contact or be connected to a second inner conductive layer (260) and/or a second outer conductive layer (270) of the second circuit board (250).
  • the penetration fixing mechanism (340) may penetrate the connector (300) and the circuit boards (210, 250) to fix/connect the connector (300) to the circuit boards (210, 250). Accordingly, the connector (300) may be fixed without a thermal process such as soldering or welding. Accordingly, damage to the circuit board (210, 250) due to the thermal process may be prevented, and the signal transmission efficiency and grounding efficiency of the circuit board (210, 250) may be improved.
  • the connector (300) can be separated and recycled in case of a defective product.
  • the penetrating fixing mechanism (340) may have the form of a screw, nail, pin, or the like.
  • FIG. 3 is a plan view in the first surface direction of the first circuit board of the antenna structure according to exemplary embodiments.
  • the first surface (210a) of the first circuit board (210) may correspond to an inner surface facing the antenna element (100).
  • a first inner conductive layer (220) may be arranged on the lower surface of the first core layer (215) toward the inner surface.
  • the first inner conductive layer (220) may include a signal wire (222).
  • One end of the signal wire (222) may be bonded or electrically connected to the antenna conductive layer (120) or the antenna unit in a bonding region (BR).
  • the first inner conductive layer (220) may further include a co-planar ground (224) extending together with the signal wire (222) at the same level as the signal wire (222).
  • the co-planar ground (224) may be physically spaced from the signal wire (222) by a predetermined distance.
  • a pair of co-planar grounds (224) can be arranged facing each other with a signal wire (222) between them.
  • the noise around the signal wire (222) can be blocked by the co-planar ground (224), and the power supply concentration through the signal wire (222) can be improved.
  • FIG. 4 is a plan view in the second surface direction of the first circuit board of the antenna structure according to exemplary embodiments.
  • the second surface (210b) of the first circuit board (210) may correspond to an outer surface facing the antenna element (100).
  • a first outer conductive layer (230) may be arranged on the upper surface of the first core layer (215) toward the outer surface.
  • the first outer conductive layer (230) faces the signal wire (222) with the first core layer (215) interposed therebetween and can be provided as a vertical ground for the signal wire (222).
  • An electric field is formed in the first core layer (215) between the first outer conductive layer (230) and the signal wire (222), and power supply efficiency through the signal wire (222) can be increased.
  • the co-planar ground (224) and the first outer conductive layer (230) may be connected to each other through a via structure (240).
  • the via structure (240) may penetrate the first core layer (215) and connect the co-planar ground (224) and the first outer conductive layer (230) to each other. Accordingly, absorption and discharge of noise around the signal wire (222) may be promoted.
  • a plurality of via structures (240) may be arranged along a signal wiring (222) to form a via row.
  • the via structure (240) may be formed by forming a via hole penetrating the first core layer (215) and then filling the via hole through a copper plating process.
  • FIG. 5 is a plan view in the first surface direction of a second circuit board of an antenna structure according to exemplary embodiments.
  • FIG. 6 is a plan view in the second surface direction of a second circuit board of an antenna structure according to exemplary embodiments.
  • the first surface (250a) of the second circuit board (250) may correspond to an inner surface facing the antenna element (100).
  • the second surface (250b) of the second circuit board (250) may correspond to an outer surface facing the antenna element (100).
  • a second inner conductive layer (260) may be arranged toward the inner surface on the upper surface of the second core layer (255).
  • a second outer conductive layer (270) may be arranged toward the outer surface on the lower surface of the second core layer (255).
  • the second inner conductive layer (260) and the second outer conductive layer (270) may face each other with the second core layer (255) interposed therebetween.
  • One end of the second inner conductive layer (260) may be bonded or electrically connected to the antenna ground layer (130) in a bonding region (BR). Accordingly, noise absorption/emission through the antenna ground layer (130) is promoted, and vertical radiation above the upper surface of the antenna element (100) may be promoted by the antenna ground layer (130).
  • the above-described function of the second inner conductive layer (260) may be additionally enhanced by the second outer conductive layer (270).
  • the second outer conductive layer (270) may be omitted.
  • through ports (TP1, TP2) may be formed at the other end of the connection area (CR) of the circuit boards (210, 250) or at the other end of the conductive layers (220, 230, 260, 270).
  • the through ports (TP1, TP2) have a through hole shape, and a through fixing mechanism (340) may be inserted to fix the connector (300).
  • the through port includes a first through port (TP1) and a second through port (TP2), and a pair of through ports (TP1, TP2) may be formed respectively on a pair of co-planar grounds (224) with a signal wire (222) therebetween.
  • a penetration fixing mechanism (340) is inserted into each of the first penetration port (TP1) and the second penetration port (TP2) to secure the connector (300) to the circuit boards (210, 250).
  • a pair of penetration fasteners (340) may be inserted into the connector (300) through the circuit boards (210, 250) with the signal/power supply pins (310) of the connector (300) interposed therebetween. Accordingly, the connector (300) may be more stably fastened to the circuit boards (210, 250).
  • FIG. 7 is a schematic plan view showing an antenna unit included in an antenna structure according to exemplary embodiments.
  • the antenna unit may include a radiator (122), a transmission line (124), and a signal pad (126).
  • the radiator (122) may have a polygonal plate shape
  • the transmission line (124) may have a width smaller than that of the radiator (122) and may be connected to one end or one side of the radiator (122).
  • the radiator (122) and the transmission line (124) may be formed as a single member integrally connected to each other.
  • the target resonance frequency of the antenna element (100) can be adjusted depending on the shape/size of the radiator (122).
  • the radiator (122) can be designed to be capable of radiating in a high frequency/ultra-high frequency band of 3G, 4G, 5G or higher.
  • a radiation band of a frequency band of 0.5 GHz or higher, 1 GHz or higher, 10 GHz or higher, 20 GHz or higher, 30 GHz or higher, or 40 GHz or higher can be implemented through the radiator (122).
  • the signal pad (126) may be positioned in the bonding region (BR) and connected to the end of the transmission line (124).
  • the signal pad (126) may be a single member substantially integral with the transmission line (124).
  • the end of the transmission line (124) may be provided as the signal pad (126).
  • the radiator (122) can be placed in the visible area of the target object.
  • the radiator (122) can be formed in a mesh structure to prevent the radiator (122) from being visually recognized.
  • the transmission line (124) can also be formed at least partially in the mesh structure.
  • a dummy mesh layer (125) may be formed around the radiator (122) and the transmission line (124).
  • the dummy mesh layer (125) may include a mesh structure that is substantially the same as the mesh structure included in the radiator (122) and the transmission line (124). Accordingly, the spatial distribution of the conductive pattern around the radiator (122) and the transmission line (124) may be uniformized, thereby preventing the radiator (122) and the transmission line (124) from being visually recognized.
  • the dummy mesh layer (125) can be formed together with the radiator (122) and the transmission line (124) by etching the same mesh layer.
  • the dummy mesh layer (125) can be physically separated/separated from the radiator (122) and the transmission line (124) through a separation region (SR).
  • the signal pad (126) placed in the bonding area (BR) may be a solid metal or alloy pattern. Accordingly, an increase in resistance due to bonding with the first circuit board (210) can be suppressed and power supply efficiency can be improved.
  • a ground pad (128) may be placed around a signal pad (126) in a bonding region (BR).
  • a pair of ground pads (128) may be placed facing each other with the signal pad (126) therebetween.
  • the ground pad (128) may be formed of a solid metal or alloy pattern.
  • the ground pad (128) may be physically and electrically separated/separated from the signal pad (126).
  • an anisotropic conductive film can be attached together to the signal pad (126) and the ground pad (128) in the bonding region (BR). Thereafter, one end of the signal wire (222) and the co-planar ground (224) can be bonded onto the signal pad (126) and the ground pad (128), respectively, through a heating/pressure process.
  • the signal pad (126) is electrically connected to the signal wiring (222), and the ground pad (128) can be electrically connected to the co-planar ground (224).
  • the ground pad (128) is provided as a bonding pad to enhance bonding stability, and can absorb noise around the signal pad (126) and discharge it through the co-planar ground (224).
  • FIG. 8 is a schematic cross-sectional view illustrating an antenna element of an antenna structure according to some exemplary embodiments.
  • the dielectric layer included in the antenna element may have a multi-layer structure.
  • a first dielectric layer (115) may be laminated on the upper surface of a substrate layer (111), and the first dielectric layer (115) may be laminated on the substrate layer (111) through a first point-adhesive layer (117).
  • a second dielectric layer (113) is laminated beneath the bottom surface of the substrate layer (111), and the second dielectric layer (113) can be combined with the antenna ground layer (130) through the second point-adhesive layer (119).
  • the substrate layer (111), the first dielectric layer (115), and the second dielectric layer (113) may include the transparent resin material described above.
  • the dielectric constant and impedance suitable for the desired target frequency can be finely adjusted.
  • the thickness of the antenna element can be increased (e.g., 1 mm or more, 1.5 mm or more, or 2 mm or more).
  • the first circuit board (210) and the second circuit board (250) which are respectively connected to the antenna conductive layer (120) and the antenna ground layer (130), even if the thickness of the antenna element is increased, a stable connection to the connector (300) can be provided.
  • Antenna structures according to the embodiments described above can be attached or fixed to building structures, windows, vehicles, signs, etc., such as windows, walls or ceilings of public transportation, for example.
  • the antenna cable may be buried in objects such as public transportation such as buses and subways, building interior walls, windows, and signs, and connected or inserted into an external connection terminal (330) of a connector (300). Accordingly, power may be supplied to the antenna unit, and antenna radiation may be performed.
  • the antenna element (100) can be electrically connected to a public Wi-Fi repeater in a public transportation or building via the antenna cable and used as a repeater antenna.
  • the application of the above-described antenna structure is not limited to a repeater antenna, and can also be applied to an antenna of an image display device combined with a communication function, such as a smartphone.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Details Of Aerials (AREA)

Abstract

La structure d'antenne comprend : un élément d'antenne comprenant une couche conductrice d'antenne et une couche de masse d'antenne ; une première carte de circuit imprimé connectée électriquement à la couche conductrice d'antenne ; une deuxième carte de circuit imprimé connectée électriquement à la couche de masse d'antenne ; et un connecteur couplé à la fois à l'extrémité de la première carte de circuit imprimé et à l'extrémité de la deuxième carte de circuit imprimé. La deuxième carte de circuit imprimé peut être utilisée pour améliorer la directivité de rayonnement, et peut être connectée à la première carte de circuit imprimé par l'intermédiaire du connecteur.
PCT/KR2024/012360 2023-08-29 2024-08-20 Structure d'antenne Pending WO2025048367A1 (fr)

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KR1020230113272A KR20250031599A (ko) 2023-08-29 2023-08-29 안테나 구조체
KR10-2023-0113272 2023-08-29

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WO2025048367A1 true WO2025048367A1 (fr) 2025-03-06

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CN102522618A (zh) * 2011-12-29 2012-06-27 北京理工大学 由集总元件和二极管构成的有源左手传输线
KR101940798B1 (ko) * 2018-03-06 2019-01-21 동우 화인켐 주식회사 필름 안테나 및 이를 포함하는 디스플레이 장치
KR20220053861A (ko) * 2020-10-23 2022-05-02 동우 화인켐 주식회사 안테나 소자 및 이를 포함하는 화상 표시 장치
KR20230011005A (ko) * 2021-07-13 2023-01-20 동우 화인켐 주식회사 안테나 패키지 및 이를 포함하는 화상 표시 장치
KR20230020700A (ko) * 2021-08-04 2023-02-13 동우 화인켐 주식회사 패키지 기판, 안테나 패키지 및 이를 포함하는 화상 표시 장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102019952B1 (ko) 2017-07-18 2019-09-11 삼성전기주식회사 안테나 모듈 및 안테나 모듈 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102522618A (zh) * 2011-12-29 2012-06-27 北京理工大学 由集总元件和二极管构成的有源左手传输线
KR101940798B1 (ko) * 2018-03-06 2019-01-21 동우 화인켐 주식회사 필름 안테나 및 이를 포함하는 디스플레이 장치
KR20220053861A (ko) * 2020-10-23 2022-05-02 동우 화인켐 주식회사 안테나 소자 및 이를 포함하는 화상 표시 장치
KR20230011005A (ko) * 2021-07-13 2023-01-20 동우 화인켐 주식회사 안테나 패키지 및 이를 포함하는 화상 표시 장치
KR20230020700A (ko) * 2021-08-04 2023-02-13 동우 화인켐 주식회사 패키지 기판, 안테나 패키지 및 이를 포함하는 화상 표시 장치

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