WO2025047422A1

WO2025047422A1 - Wiring board, package for housing electronic component, and electronic module

Info

Publication number: WO2025047422A1
Application number: PCT/JP2024/028947
Authority: WO
Inventors: 芳規川頭
Original assignee: Kyocera Corp
Current assignee: Kyocera Corp
Priority date: 2023-08-30
Filing date: 2024-08-14
Publication date: 2025-03-06
Anticipated expiration: 2026-02-28

Abstract

Provided is a wiring board comprising a first insulating substrate and a signal conductor pair. The signal conductor pair has a first signal conductor and a second signal conductor. The first signal conductor has a first bent portion for which the distance from the second signal conductor changes, and a first straight line portion that is directly connected to the first end side of the first bent portion. The second signal conductor has a second bent portion for which the distance from the first signal conductor changes, and a second straight portion directly connected to the second end side of the second bent portion. The first straight line portion and the second straight line portion are positioned parallel to each other. When viewed from a third direction orthogonal to both the first straight line portion and the second straight line portion, at least a portion of the first straight line portion and at least a portion of the second straight line portion overlap.

Description

Wiring board, package for storing electronic components, and electronic module

　本開示は、配線基板、電子部品収納用パッケージ及び電子モジュールに関する。 This disclosure relates to wiring boards, packages for storing electronic components, and electronic modules.

　従来、高周波信号の伝送用である配線基板において、配線を差動配線とすることがある。差動配線は、通常の配線と比べて高周波伝送特性に優れている。　Conventionally, wiring boards used for transmitting high-frequency signals have sometimes used differential wiring. Differential wiring has superior high-frequency transmission characteristics compared to normal wiring.

　差動配線を配線基板の一方の側面側からこれに対向する他方の側面側に向かって設ける際に、設計の都合等により、該差動配線を単純な直線状にできない場合がある。例えば特許文献１で開示されている配線基板では、差動配線の一方の端と他方の端が方向Ｙにおいてずれて位置しており、それに伴い差動配線に非直線状の部分が存在している。 When differential wiring is provided from one side of a wiring board to the other opposing side, there are cases where the differential wiring cannot be simply linear due to design considerations, etc. For example, in the wiring board disclosed in Patent Document 1, one end of the differential wiring is offset from the other end in direction Y, resulting in the existence of non-linear portions in the differential wiring.

特開２０２１－１０８３５９号公報JP 2021-108359 A

　差動配線に非直線状の部分が存在する上記のような配線基板は、信号の位相ずれによるノイズ発生等の影響により、単純な直線状の差動配線と比べて高周波伝送特性が低くなりやすく、改善の余地があった。 In wiring boards like the one above, where the differential wiring has non-linear sections, the high-frequency transmission characteristics tend to be poorer than in simple linear differential wiring due to effects such as noise generation caused by signal phase shifts, leaving room for improvement.

　本開示は、より高周波伝送特性の高い配線基板、電子部品収納用パッケージ及び電子モジュールを提供することを目的とする。 The purpose of this disclosure is to provide a wiring board, an electronic component storage package, and an electronic module with improved high-frequency transmission characteristics.

（１）本開示に係る配線基板の一の態様は、
　第１端面と、該第１端面と第１方向において対向する第２端面と、を有する第１絶縁基体と、
　前記第１絶縁基体上において、前記第１端面側から前記第２端面側にかけて位置するとともに、第１信号導体及び第２信号導体を有する、信号導体対と、を備え、
　前記第１絶縁基体の前記第１端面側に位置する前記信号導体対の第１端と、前記第１絶縁基体の前記第２端面側に位置する前記信号導体対の第２端と、は、前記第１方向と交差する第２方向においてずれて位置しており、
　前記第１信号導体は、前記第２信号導体との距離が変化する第１屈曲部と、前記第１屈曲部の第１端側に直接接続する第１直線部と、を有しており、
　前記第２信号導体は、前記第１信号導体との距離が変化する第２屈曲部と、前記第２屈曲部の第２端側に直接接続する第２直線部と、を有しており、
　前記第１直線部と前記第２直線部は、相互に平行に位置しており、
　前記第１直線部及び前記第２直線部の両方に直交する第３方向から視たときに、前記第１直線部の少なくとも一部と前記第２直線部の少なくとも一部は、重なっている。 (1) One aspect of a wiring board according to the present disclosure is
a first insulating base having a first end surface and a second end surface opposed to the first end surface in a first direction;
a signal conductor pair located on the first insulating base from the first end surface side to the second end surface side, the signal conductor pair including a first signal conductor and a second signal conductor;
a first end of the signal conductor pair located on the first end surface side of the first insulating base and a second end of the signal conductor pair located on the second end surface side of the first insulating base are shifted from each other in a second direction intersecting with the first direction,
the first signal conductor has a first bent portion at which a distance between the first signal conductor and the second signal conductor changes, and a first straight portion directly connected to a first end side of the first bent portion,
the second signal conductor has a second bent portion at which a distance between the second signal conductor and the first signal conductor changes, and a second straight portion directly connected to a second end side of the second bent portion,
The first linear portion and the second linear portion are positioned parallel to each other,
When viewed from a third direction perpendicular to both the first straight portion and the second straight portion, at least a portion of the first straight portion and at least a portion of the second straight portion overlap with each other.

（２）本開示に係る配線基板の一の態様は、
　上記（１）の配線基板であって、
　前記第１信号導体の全長と前記第２信号導体の全長は、等しい。 (2) One aspect of the wiring board according to the present disclosure is
The wiring board according to (1),
The overall length of the first signal conductor is equal to the overall length of the second signal conductor.

（３）本開示に係る配線基板の一の態様は、
　上記（１）又は（２）の配線基板であって、
　前記第１直線部のうち前記第３方向から視て前記第２直線部と重なる部分を第１区間部とし、
　前記第２直線部のうち前記第３方向から視て前記第１直線部と重なる部分を第２区間部とし、
　前記第１区間部の前記第１端側の端を第１地点とし、
　前記第２区間部の前記第１端側の端を第２地点としたとき、
　前記第１信号導体の前記第１端から前記第１地点までの長さと前記第２信号導体の前記第１端から前記第２地点までの長さは、等しい。 (3) One aspect of the wiring board according to the present disclosure is
The wiring board according to (1) or (2),
a portion of the first straight line portion that overlaps with the second straight line portion when viewed from the third direction is defined as a first section portion;
a portion of the second straight line portion that overlaps with the first straight line portion when viewed from the third direction is defined as a second section portion;
An end of the first section on the first end side is defined as a first point,
When the end of the second section on the first end side is defined as a second point,
The length of the first signal conductor from the first end to the first point and the length of the second signal conductor from the first end to the second point are equal.

（４）本開示に係る配線基板の一の態様は、
　上記（１）～（３）のいずれかの配線基板であって、
　前記第１区間部の前記第２端側の端を第３地点とし、
　前記第２区間部の前記第２端側の端を第４地点としたとき、
　前記第１信号導体の前記第２端から前記第３地点までの長さと前記第２信号導体の前記第２端から前記第４地点までの長さは、等しい。 (4) One aspect of the wiring board according to the present disclosure is
Any one of the wiring boards according to (1) to (3),
An end of the first section on the second end side is defined as a third point,
When the end of the second section on the second end side is defined as a fourth point,
The length of the first signal conductor from the second end to the third point and the length of the second signal conductor from the second end to the fourth point are equal.

（５）本開示に係る配線基板の一の態様は、
　上記（１）又は（２）のいずれかの配線基板であって、
　前記第１直線部のうち前記第３方向から視て前記第２直線部と重なる部分を第１区間部とし、
　前記第２直線部のうち前記第３方向から視て前記第１直線部と重なる部分を第２区間部としたとき、
　前記第１区間部は、前記第１屈曲部よりも長く、
　前記第２区間部は、前記第２屈曲部よりも長い。 (5) One aspect of the wiring board according to the present disclosure is
The wiring board according to any one of (1) and (2),
a portion of the first straight line portion that overlaps with the second straight line portion when viewed from the third direction is defined as a first section portion;
When a portion of the second straight line portion that overlaps with the first straight line portion when viewed from the third direction is defined as a second section portion,
The first section is longer than the first bent portion,
The second section is longer than the second bent portion.

（６）本開示に係る配線基板の一の態様は、
　上記（３）又は（４）の配線基板であって、
　前記第１区間部は、前記第１屈曲部よりも長く、
　前記第２区間部は、前記第２屈曲部よりも長い。 (6) One aspect of the wiring board according to the present disclosure is
The wiring board according to (3) or (4),
The first section is longer than the first bent portion,
The second section is longer than the second bent portion.

（７）本開示に係る配線基板の一の態様は、
　上記（１）～（６）のいずれかの配線基板であって、
　前記第１屈曲部は、前記第２信号導体から遠ざかる方向に凸の第１円弧部を有しており、
　前記第２屈曲部は、前記第１信号導体から遠ざかる方向に凸の第２円弧部を有している。 (7) One aspect of the wiring board according to the present disclosure is
Any one of the wiring boards according to (1) to (6),
the first bend portion has a first arc portion that is convex in a direction away from the second signal conductor,
The second bent portion has a second arc portion that is convex in a direction away from the first signal conductor.

（８）本開示に係る配線基板の一の態様は、
　上記（７）の配線基板であって、
　前記第１屈曲部は、前記第１円弧部と直接接続するとともに前記第２信号導体から遠ざかる方向に凸の第３円弧部を有しており、
　前記第２屈曲部は、前記第２円弧部と直接接続するとともに前記第１信号導体から遠ざかる方向に凸の第４円弧部を有しており、
　前記第１円弧部の曲率半径と前記第３円弧部の曲率半径は、等しく、
　前記第２円弧部の曲率半径と前記第４円弧部の曲率半径は、等しい。 (8) One aspect of the wiring board according to the present disclosure is
The wiring board according to (7),
the first bend portion has a third arc portion that is directly connected to the first arc portion and that is convex in a direction away from the second signal conductor;
the second bend portion has a fourth arc portion that is directly connected to the second arc portion and that is convex in a direction away from the first signal conductor,
The radius of curvature of the first arcuate portion and the radius of curvature of the third arcuate portion are equal,
The second arcuate portion and the fourth arcuate portion have the same radius of curvature.

（９）本開示に係る配線基板の一の態様は、
　上記（１）～（８）のいずれかの配線基板であって、
　前記第１絶縁基体上に位置する、第１接地導体及び第２接地導体を更に備え、
　前記第１接地導体、前記第１信号導体、前記第２信号導体、及び前記第２接地導体は、この順に並んで位置しており、
　前記第１接地導体は、前記第１信号導体と間を空けて位置し、前記第１信号導体に沿う部分を前記第１信号導体の少なくとも一部に対して有しており、
　前記第２接地導体は、前記第２信号導体と間を空けて位置し、前記第２信号導体に沿う部分を前記第２信号導体の少なくとも一部に対して有している。 (9) One aspect of the wiring board according to the present disclosure is
Any one of the wiring boards according to (1) to (8),
a first ground conductor and a second ground conductor located on the first insulating base;
the first ground conductor, the first signal conductor, the second signal conductor, and the second ground conductor are arranged in this order;
the first ground conductor is spaced from the first signal conductor and has a portion along the first signal conductor with respect to at least a portion of the first signal conductor;
The second ground conductor is spaced apart from the second signal conductor and has a portion along the second signal conductor for at least a portion of the second signal conductor.

（１０）本開示に係る配線基板の一の態様は、
　上記（１）から（９）のいずれかの配線基板であって、
　前記第１絶縁基体上に位置するとともに、前記第１信号導体と前記第２信号導体との間に位置する第３接地導体を更に備え、
　前記第３接地導体は、前記第１信号導体及び前記第２信号導体と間を空けて位置し、前記第１信号導体に沿う部分を前記第１信号導体の少なくとも一部に対して有しており、前記第２信号導体に沿う部分を前記第２信号導体の少なくとも一部に対して有している。 (10) One aspect of the wiring board according to the present disclosure is
Any one of the wiring boards according to (1) to (9),
a third ground conductor located on the first insulating base and between the first signal conductor and the second signal conductor;
The third ground conductor is positioned at a distance from the first signal conductor and the second signal conductor, has a portion along the first signal conductor for at least a portion of the first signal conductor, and has a portion along the second signal conductor for at least a portion of the second signal conductor.

（１１）本開示に係る配線基板の一の態様は、
　上記（１）から（１０）のいずれかの配線基板であって、
　前記第１絶縁基体上に位置する第２絶縁基体を更に備える。 (11) One aspect of the wiring board according to the present disclosure is
Any one of the wiring boards according to (1) to (10),
The semiconductor device further includes a second insulating base positioned on the first insulating base.

（１２）本開示に係る配線基板の一の態様は、
　上記（１１）の配線基板であって、
　前記第１信号導体のうち前記第１直線部よりも前記第１端側の部分を第１延伸部とし、
　前記第２信号導体のうち前記第２屈曲部よりも前記第１端側の部分を第２延伸部としたとき、
　平面視において、前記第２絶縁基体は、前記第１延伸部の少なくとも一部及び前記第２延伸部の部分の少なくとも一部と重なっている。 (12) One aspect of the wiring board according to the present disclosure is
The wiring board according to (11),
a first extension portion is a portion of the first signal conductor that is closer to the first end than the first straight portion;
When a portion of the second signal conductor closer to the first end than the second bent portion is defined as a second extension portion,
In a plan view, the second insulating base overlaps at least a portion of the first extension portion and at least a portion of the second extension portion.

（１３）本開示に係る配線基板の一の態様は、
　上記（１）～（１２）のいずれかの配線基板であって、
　前記第１絶縁基体内に位置する内層導体を更に備え、
　前記内層導体は、複数の第１開口部と、複数の第２開口部と、を有しており、
　平面視において、複数の前記第１開口部は、前記第１信号導体に重なるとともに、前記第１信号導体に沿って並んで位置しており、
　平面視において、複数の前記第２開口部は、前記第２信号導体に重なるとともに、前記第２信号導体に沿って並んで位置している。 (13) One aspect of the wiring board according to the present disclosure is
Any one of the wiring boards according to (1) to (12),
Further comprising an inner layer conductor located within the first insulating base,
The inner layer conductor has a plurality of first openings and a plurality of second openings,
In a plan view, the first openings overlap the first signal conductor and are arranged along the first signal conductor,
In a plan view, the second openings overlap the second signal conductor and are positioned side by side along the second signal conductor.

（１４）本開示に係る電子部品収納用パッケージの一の態様は、
　基板と、
　前記基板の上に位置する枠体と、
　前記枠体に接合された上記（１）～（１３）のいずれかの配線基板と、を備える。 (14) One aspect of the electronic component storage package according to the present disclosure is
A substrate;
A frame body located on the substrate;
and a wiring board according to any one of (1) to (13) above, joined to the frame.

（１５）本開示に係る電子モジュールの一の態様は、
　上記（１４）に記載の電子部品収納用パッケージと、
　前記基板上に位置し、前記信号導体対と電気的に接続された電子部品と、
　前記枠体上に位置する蓋体と、を備える。 (15) One aspect of the electronic module according to the present disclosure is
The package for storing electronic components according to (14) above;
an electronic component located on the substrate and electrically connected to the signal conductor pair;
and a lid body located on the frame body.

　本開示によれば、配線基板、電子部品収納用パッケージ及び電子モジュールの高周波伝送特性をより高めることができる。 This disclosure makes it possible to further improve the high-frequency transmission characteristics of wiring boards, packages for storing electronic components, and electronic modules.

配線基板の平面図である。FIG. 配線基板の平面図である。FIG. 配線基板の平面図である。FIG. 配線基板の平面図である。FIG. 配線基板の平面図である。FIG. 配線基板が有する内層導体の平面図である。FIG. 2 is a plan view of an inner layer conductor of the wiring board. 配線基板の平面図である。FIG. 配線基板の斜視図である。FIG. シミュレーションに用いた配線基板の平面図である。FIG. 1 is a plan view of a wiring board used in a simulation. シミュレーションに用いた配線基板の平面図である。FIG. 1 is a plan view of a wiring board used in a simulation. シミュレーションに用いた配線基板の平面図である。FIG. 1 is a plan view of a wiring board used in a simulation. シミュレーションに用いた配線基板の平面図である。FIG. 1 is a plan view of a wiring board used in a simulation. シミュレーション結果を示すグラフである。13 is a graph showing a simulation result. シミュレーション結果を示すグラフである。13 is a graph showing a simulation result. 電子部品収納用パッケージの斜視図である。FIG. 2 is a perspective view of an electronic component storage package. 電子モジュールの分解斜視図である。FIG. 2 is an exploded perspective view of the electronic module.

　以下、本開示の実施形態を図面に基づいて説明する。ただし、以下で参照する各図は、説明の便宜上、実施形態を説明する上で必要な主要部材のみを簡略化して示したものである。したがって、本開示の配線基板、電子部品収納用パッケージ及び電子モジュールは、参照する各図に示されていない任意の構成部材を備え得る。また、各図中の部材の寸法は、実際の構成部材の寸法、寸法比率等を忠実に表したものではない。 Embodiments of the present disclosure are described below with reference to the drawings. However, for ease of explanation, each of the drawings referred to below shows a simplified version of only the main components necessary to explain the embodiments. Therefore, the wiring board, electronic component storage package, and electronic module of the present disclosure may include any components not shown in each of the drawings referred to. Furthermore, the dimensions of the components in each drawing do not faithfully represent the dimensions, dimensional ratios, etc. of the actual components.

　また、以下に示す実施形態では、「一定」、「直交」、「垂直」、「平行」又は「直線状」といった表現が用いられる場合があるが、これらの表現は、厳密に「一定」、「直交」、「垂直」、「平行」又は「直線状」であることを要しない。すなわち、上記した各表現は、例えば、製造精度、設置精度などのずれを許容するものとする。 In addition, in the embodiments described below, expressions such as "constant," "orthogonal," "vertical," "parallel," or "linear" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "vertical," "parallel," or "linear" in the strict sense. In other words, each of the above expressions allows for deviations due to, for example, manufacturing precision, installation precision, etc.

［配線基板］
　図１及び図２は、本開示の配線基板の一実施形態の、配線基板の上方から視た平面図である。本実施形態の配線基板１は、第１絶縁基体２と、信号導体対３と、を備える。 [Wiring Board]
1 and 2 are plan views of an embodiment of a wiring board according to the present disclosure, as viewed from above. The wiring board 1 of the present embodiment includes a first insulating base 2 and a signal conductor pair 3.

　第１絶縁基体２は、第１端面Ｓ１と、第１端面Ｓ１と対向する第２端面Ｓ２と、を有する。第１端面Ｓ１と第２端面Ｓ２が対向する方向を、第１方向Ｘとする。第１方向Ｘと交差する方向を、第２方向Ｙとする。図１及び図２の配線基板１において、第１端面Ｓ１と第２端面Ｓ２は平行に対向しており、第１方向Ｘと第２方向Ｙは直交している。 The first insulating base 2 has a first end surface S1 and a second end surface S2 opposing the first end surface S1. The direction in which the first end surface S1 and the second end surface S2 oppose each other is defined as a first direction X. The direction intersecting the first direction X is defined as a second direction Y. In the wiring board 1 of Figures 1 and 2, the first end surface S1 and the second end surface S2 oppose each other in parallel, and the first direction X and the second direction Y are perpendicular to each other.

　信号導体対３は、第１絶縁基体２の上において、第１端面Ｓ１の側から第２端面Ｓ２の側にかけて位置する。信号導体対３は、第１信号導体４及び第２信号導体５を有する。信号導体対３は、差動信号を伝送する差動配線である。 The signal conductor pair 3 is located on the first insulating base 2 from the first end face S1 side to the second end face S2 side. The signal conductor pair 3 has a first signal conductor 4 and a second signal conductor 5. The signal conductor pair 3 is a differential wiring that transmits a differential signal.

　信号導体対３の、第１絶縁基体２の第１端面Ｓ１の側に位置する端を第１端Ｅ１とし、第２端面Ｓ２の側に位置する端を第２端Ｅ２とする。第１端Ｅ１と第２端Ｅ２とは、第２方向Ｙにおいてずれて位置している。第１信号導体４及び第２信号導体５の幅及び厚さは、ほぼ同じである。ここで、第１端Ｅ１と第２端Ｅ２とが、第２方向Ｙにおいてずれて位置するとは、第１方向Ｘに平行な直線を引いたときに、第１端Ｅ１と第２端Ｅ２とが同一直線上にない、と言い換えることができる。第２方向Ｙにおける、第１端Ｅ１と第２端Ｅ２とがずれる範囲は、例えば１ｍｍ以上２０ｍｍ以下である。 The end of the signal conductor pair 3 located on the side of the first end face S1 of the first insulating base 2 is the first end E1, and the end located on the side of the second end face S2 is the second end E2. The first end E1 and the second end E2 are shifted in the second direction Y. The first signal conductor 4 and the second signal conductor 5 have approximately the same width and thickness. Here, the first end E1 and the second end E2 being shifted in the second direction Y can be rephrased as the first end E1 and the second end E2 not being on the same line when a straight line parallel to the first direction X is drawn. The range of shift between the first end E1 and the second end E2 in the second direction Y is, for example, 1 mm to 20 mm.

　第１信号導体４は、第１屈曲部４ｃと、第１直線部４ａと、を有している。第１屈曲部４ｃは、第２信号導体５との距離が変化している屈曲状の部分である。第１直線部４ａは、第１屈曲部４ｃの第１端Ｅ１の側に直接接続している直線状の部分である。ここで、本開示において、屈曲状とは、図１及び図２に示す実施形態のように円弧状である場合に限られず、直線同士が接続された折れ線状となっていてもよい。 The first signal conductor 4 has a first bent portion 4c and a first straight portion 4a. The first bent portion 4c is a bent portion whose distance to the second signal conductor 5 changes. The first straight portion 4a is a straight portion that is directly connected to the first end E1 side of the first bent portion 4c. Here, in this disclosure, the bent portion is not limited to an arc shape as in the embodiment shown in Figures 1 and 2, but may be a broken line shape in which straight lines are connected to each other.

　第２信号導体５は、第２屈曲部５ｃと、第２直線部５ａと、を有している。第２屈曲部５ｃは、第１信号導体４との距離が変化している屈曲状の部分である。第２直線部５ａは、第２屈曲部５ｃの第２端Ｅ２の側に直接接続している直線状の部分である。 The second signal conductor 5 has a second bent portion 5c and a second straight portion 5a. The second bent portion 5c is a bent portion whose distance to the first signal conductor 4 changes. The second straight portion 5a is a straight portion that is directly connected to the second end E2 side of the second bent portion 5c.

　第１直線部４ａと第２直線部５ａは、相互に平行に位置している。第１直線部４ａ及び第２直線部５ａの両方に直交する方向を、第３方向Ａとする。 The first straight portion 4a and the second straight portion 5a are positioned parallel to each other. The direction perpendicular to both the first straight portion 4a and the second straight portion 5a is defined as the third direction A.

　第３方向Ａから視たときに、第１直線部４ａの少なくとも一部と第２直線部５ａの少なくとも一部は、重なっている。すなわち、第１直線部４ａは、第３方向Ａから視て第２直線部５ａと重なる部分を有する。また、第２直線部５ａは、第３方向Ａから視て第１直線部４ａと重なる部分を有する。 When viewed from the third direction A, at least a portion of the first straight portion 4a and at least a portion of the second straight portion 5a overlap. That is, the first straight portion 4a has a portion that overlaps with the second straight portion 5a when viewed from the third direction A. Also, the second straight portion 5a has a portion that overlaps with the first straight portion 4a when viewed from the third direction A.

　第１直線部４ａのうち第３方向Ａから視て第２直線部５ａと重なる部分を、第１区間部４ｂとする。第１区間部４ｂの第１端Ｅ１の側の端を、第１地点Ｐ１とする。第１区間部４ｂの第２端Ｅ２の側の端を、第３地点Ｐ３とする。 The portion of the first straight section 4a that overlaps with the second straight section 5a when viewed from the third direction A is defined as the first section 4b. The end of the first section 4b on the side of the first end E1 is defined as the first point P1. The end of the first section 4b on the side of the second end E2 is defined as the third point P3.

　第２直線部５ａのうち第３方向Ａから視て第１直線部４ａと重なる部分を、第２区間部５ｂとする。第２区間部５ｂの第１端Ｅ１の側の端を、第２地点Ｐ２とする。第２区間部５ｂの第２端Ｅ２の側の端を、第４地点Ｐ４とする。 The portion of the second straight section 5a that overlaps with the first straight section 4a when viewed from the third direction A is the second section 5b. The end of the second section 5b on the side of the first end E1 is the second point P2. The end of the second section 5b on the side of the second end E2 is the fourth point P4.

　差動配線においては、対となる信号導体のうち伝送方向に対して隣り合う部分を進む信号の位相が反転し合っていることによって、信号により発生した磁束は打ち消しあうことができ、ノイズが発生する可能性が低減される。しかし、当該部分を進む信号の位相が反転状態からずれると、磁束が十分に打ち消されず、ノイズが発生する可能性がある。差動配線に非直線状の部分が存在する場合、対となる信号導体のうち伝送方向に対して隣り合う部分を進む信号の位相が反転状態からずれやすいため、ノイズが発生しやすかった。これに対して、本開示の配線基板１は、第１屈曲部４ｃ及び第２屈曲部５ｃによって、第１区間部４ｂ及び第２区間部５ｂに到達する時点における信号の位相が、反転状態又はこれに近い状態を維持しやすくなっている。信号がこの状態で直線状かつ互いに平行する第１区間部４ｂ及び第２区間部５ｂを進むことによって、ノイズの発生が低減される。これによって、本開示の配線基板１は、高周波伝送特性が良好となる。
　また、第１信号導体４に第１屈曲部４ｃを設け、第２信号導体５に第２屈曲部５ｃを設けることで、第１信号導体４及び第２信号導体５の長さの細かい調整ができる。 In differential wiring, the phases of signals traveling through adjacent parts of a pair of signal conductors in the transmission direction are inverted, so that magnetic fluxes generated by the signals can be cancelled out, reducing the possibility of noise generation. However, if the phase of the signal traveling through the part is deviated from the inverted state, the magnetic fluxes are not cancelled out sufficiently, and noise may occur. When a non-linear part is present in the differential wiring, the phase of the signal traveling through adjacent parts of the pair of signal conductors in the transmission direction is likely to deviate from the inverted state, so noise is likely to occur. In contrast, in the wiring board 1 of the present disclosure, the first bend 4c and the second bend 5c make it easier for the phase of the signal to remain in an inverted state or a state close to it when it reaches the first section 4b and the second section 5b. In this state, the signal travels through the first section 4b and the second section 5b, which are linear and parallel to each other, thereby reducing the generation of noise. As a result, the wiring board 1 of the present disclosure has good high-frequency transmission characteristics.
Furthermore, by providing the first bent portion 4c in the first signal conductor 4 and the second bent portion 5c in the second signal conductor 5, the lengths of the first signal conductor 4 and the second signal conductor 5 can be finely adjusted.

　図１及び図２に示す実施形態において、第１端Ｅ１は、第１端面Ｓ１と接しておらず、第２端Ｅ２は、第２端面Ｓ２と接している。なお、本開示の配線基板１において、第１端Ｅ１は、第１端面Ｓ１と接していてもよく、第２端Ｅ２は、第２端面Ｓ２と接していなくてもよい。 In the embodiment shown in Figures 1 and 2, the first end E1 does not contact the first end surface S1, and the second end E2 contacts the second end surface S2. Note that in the wiring board 1 of the present disclosure, the first end E1 may contact the first end surface S1, and the second end E2 may not contact the second end surface S2.

　図１及び図２に示す実施形態において、第１信号導体４の全長と第２信号導体５の全長は、等しい。すなわち、第１信号導体４の第１端Ｅ１から第２端Ｅ２までの長さと第２信号導体５の第１端Ｅ１から第２端Ｅ２までの長さは、等しい。これによって、受信側の端において信号の位相が反転状態で受信されやすくなり、高周波伝送特性がより良好となる。ここで、本開示における信号導体（第１信号導体４及び第２信号導体５）の長さとは、信号導体の幅方向の中心を通る中心線の長さのことを指す。 In the embodiment shown in Figures 1 and 2, the total length of the first signal conductor 4 and the total length of the second signal conductor 5 are equal. That is, the length from the first end E1 to the second end E2 of the first signal conductor 4 and the length from the first end E1 to the second end E2 of the second signal conductor 5 are equal. This makes it easier for the signal to be received in an inverted phase at the receiving end, resulting in better high-frequency transmission characteristics. Here, the length of the signal conductors (first signal conductor 4 and second signal conductor 5) in this disclosure refers to the length of the center line passing through the center of the signal conductor in the width direction.

　図１及び図２に示す実施形態において、第１信号導体４の第１端Ｅ１から第１地点Ｐ１までの長さと第２信号導体５の第１端Ｅ１から第２地点Ｐ２までの長さは、等しい。これによって、第１区間部４ｂ及び第２区間部５ｂにおける互いに反転した差動信号の位相状態を同相に近づけることができ、高周波伝送特性が向上する。 In the embodiment shown in Figures 1 and 2, the length from the first end E1 of the first signal conductor 4 to the first point P1 is equal to the length from the first end E1 to the second point P2 of the second signal conductor 5. This allows the phase states of the mutually inverted differential signals in the first section 4b and the second section 5b to approach the same phase, improving the high-frequency transmission characteristics.

　図１及び図２に示す実施形態において、第１信号導体４の第２端Ｅ２から第３地点Ｐ３までの長さと第２信号導体５の第２端Ｅ２から第４地点Ｐ４までの長さは、等しい。これによって、第１区間部４ｂ及び第２区間部５ｂにおける互いに反転した差動信号の位相状態を同相に近づけることができ、高周波伝送特性が向上する。 In the embodiment shown in Figures 1 and 2, the length from the second end E2 to the third point P3 of the first signal conductor 4 is equal to the length from the second end E2 to the fourth point P4 of the second signal conductor 5. This allows the phase states of the mutually inverted differential signals in the first section 4b and the second section 5b to approach the same phase, improving the high-frequency transmission characteristics.

　図１及び図２に示す実施形態において、第１区間部４ｂは、第１屈曲部４ｃよりも長い。また、第２区間部５ｂは、第２屈曲部５ｃよりも長い。これによって、信号の位相が反転状態又はこれに近い状態で信号が伝送される距離が長くなり、ノイズの発生がより低減される。 In the embodiment shown in Figures 1 and 2, the first section 4b is longer than the first bend 4c. Also, the second section 5b is longer than the second bend 5c. This increases the distance over which a signal is transmitted with its phase inverted or nearly inverted state, further reducing the generation of noise.

　図１及び図２に示す実施形態において、第１屈曲部４ｃは、第１円弧部４ｄ及び第３円弧部４ｅを有している。第１円弧部４ｄ及び第３円弧部４ｅは、いずれも、円弧状であり、第２信号導体５から遠ざかる方向に凸の部分である。また、第２屈曲部５ｃは、第２円弧部５ｄ及び第４円弧部５ｅを有している。第２円弧部５ｄ及び第４円弧部５ｅは、いずれも、第１信号導体４から遠ざかる方向に凸の部分である。このように第１屈曲部４ｃ及び第２屈曲部５ｃが円弧状の部分である円弧部を有する場合には、第１屈曲部４ｃ及び第２屈曲部５ｃが、折れ線状である場合に比べて、信号の反射が低減され、高周波伝送特性が向上する。また、各屈曲部が円弧部を複数有することによって、１つずつ有する場合と比べて、各円弧部の曲率半径を小さくしながら信号導体の長さを調整できる。 In the embodiment shown in FIG. 1 and FIG. 2, the first bend 4c has a first arc portion 4d and a third arc portion 4e. The first arc portion 4d and the third arc portion 4e are both arc-shaped and are convex portions in a direction away from the second signal conductor 5. The second bend 5c has a second arc portion 5d and a fourth arc portion 5e. The second arc portion 5d and the fourth arc portion 5e are both convex portions in a direction away from the first signal conductor 4. When the first bend 4c and the second bend 5c have arc portions that are arc-shaped portions, the reflection of the signal is reduced and the high-frequency transmission characteristics are improved compared to when the first bend 4c and the second bend 5c are in a broken line shape. In addition, by having multiple arc portions in each bend, the length of the signal conductor can be adjusted while reducing the radius of curvature of each arc portion compared to when each bend has only one arc portion.

　図１及び図２に示す実施形態において、第１円弧部４ｄと第３円弧部４ｅは、直接接続している。また、第２円弧部５ｄと第４円弧部５ｅは、直接接続している。 In the embodiment shown in Figures 1 and 2, the first arc portion 4d and the third arc portion 4e are directly connected. Also, the second arc portion 5d and the fourth arc portion 5e are directly connected.

　各円弧部の曲率半径は、例えば０．１ｍｍ以上０．５ｍｍ以下であるが、特に限定されない。曲率半径が０．１ｍｍ以上であることによって、信号の反射が低減され、高周波伝送特性がより向上する。曲率半径が０．５ｍｍ以下であることによって、配線の専有面積を狭くでき、配線基板１の小型化ができる。ここで、本開示における円弧部の曲率半径とは、円弧部の幅方向の中心を通る中心線の曲率半径のことを指す。 The radius of curvature of each arc portion is, for example, 0.1 mm or more and 0.5 mm or less, but is not particularly limited. A radius of curvature of 0.1 mm or more reduces signal reflection and improves high-frequency transmission characteristics. A radius of curvature of 0.5 mm or less can reduce the area occupied by the wiring, allowing the wiring board 1 to be made smaller. Here, the radius of curvature of the arc portion in this disclosure refers to the radius of curvature of the center line passing through the center of the arc portion in the width direction.

　図１及び図２に示す実施形態において、第１円弧部４ｄの曲率半径と第３円弧部４ｅの曲率半径は、等しい。また、第２円弧部５ｄの曲率半径と第４円弧部５ｅの曲率半径は、等しい。 In the embodiment shown in Figures 1 and 2, the radius of curvature of the first arc portion 4d is equal to the radius of curvature of the third arc portion 4e. Also, the radius of curvature of the second arc portion 5d is equal to the radius of curvature of the fourth arc portion 5e.

　図３は、本開示の配線基板１の他の実施形態の、配線基板１の上方から視た平面図である。図３に示すように、第１屈曲部４ｃは、第１円弧部４ｄを有するが第３円弧部４ｅを有しない形状でもよく、第２屈曲部５ｃは、第２円弧部５ｄを有するが第４円弧部５ｅを有しない形状であってもよい。図３に示す実施形態において、各円弧部の曲率半径は、いずれも０．１以上０．５ｍｍ以下であってもよい。 FIG. 3 is a plan view of another embodiment of the wiring board 1 of the present disclosure, viewed from above the wiring board 1. As shown in FIG. 3, the first bend 4c may have a first arc portion 4d but no third arc portion 4e, and the second bend 5c may have a second arc portion 5d but no fourth arc portion 5e. In the embodiment shown in FIG. 3, the radius of curvature of each arc portion may be 0.1 to 0.5 mm.

　図１及び図２に示す実施形態において、配線基板１は、第１絶縁基体２の上に位置する、第１接地導体６、第２接地導体７、及び第３接地導体８を更に備える。第１接地導体６、第１信号導体４、第３接地導体８、第２信号導体５、及び第２接地導体７は、この順に並んで位置している。第１接地導体６は、第１信号導体４と間を空けて位置している。第２接地導体７は、第２信号導体５と間を空けて位置している。第３接地導体８は、第１信号導体４及び第２信号導体５と間を空けて位置している。これによって、接地電位が強化され、クロストークノイズの発生が低減される。 In the embodiment shown in Figures 1 and 2, the wiring board 1 further includes a first ground conductor 6, a second ground conductor 7, and a third ground conductor 8 located on the first insulating base 2. The first ground conductor 6, the first signal conductor 4, the third ground conductor 8, the second signal conductor 5, and the second ground conductor 7 are located in line in this order. The first ground conductor 6 is located with a space between it and the first signal conductor 4. The second ground conductor 7 is located with a space between it and the second signal conductor 5. The third ground conductor 8 is located with a space between it and the first signal conductor 4 and the second signal conductor 5. This strengthens the ground potential and reduces the occurrence of crosstalk noise.

　図１及び図２に示す実施形態のように、第１接地導体６は、第１信号導体４に沿う部分を、第１信号導体４の第１端Ｅ１から第２端Ｅ２までの全てに対して有していてもよい。第２接地導体７は、第２信号導体５に沿う部分を、第２信号導体５の第１端Ｅ１から第２端Ｅ２までの全てに対して有していてもよい。 As in the embodiment shown in Figures 1 and 2, the first ground conductor 6 may have a portion that is aligned with the first signal conductor 4 over the entirety from the first end E1 to the second end E2 of the first signal conductor 4. The second ground conductor 7 may have a portion that is aligned with the second signal conductor 5 over the entirety from the first end E1 to the second end E2 of the second signal conductor 5.

　図１及び図２に示す実施形態において、第３接地導体８は、第１信号導体４に沿う部分を、第１信号導体４の一部のみに対して有しており、第２信号導体５に沿う部分を、第２信号導体５の一部のみに対して有している。 In the embodiment shown in Figures 1 and 2, the third ground conductor 8 has a portion that is aligned with the first signal conductor 4 only for a portion of the first signal conductor 4, and has a portion that is aligned with the second signal conductor 5 only for a portion of the second signal conductor 5.

　図４は、本開示の配線基板１の他の実施形態の、配線基板１の上方から視た平面図である。本開示の配線基板１は、図４に示すように、第１接地導体６及び第２接地導体７を備えており、第３接地導体８を備えていなくてもよい。このような実施形態によっても、第１接地導体６及び第２接地導体７を備えない実施形態と比べて接地電位が強化され、クロストークノイズの発生が低減される。また、第３接地導体８を有しない実施形態とすることによって、第３接地導体８を有する実施形態に比べて、第１信号導体４と第２信号導体５を伝送される信号の結合度を高めることができ、クロストークノイズが発生する可能性を低減できる。さらに、第３接地導体８を有しない実施形態とすることによって、第１信号導体４と第２信号導体５との距離を近づけることができるので、配線基板１を更に小型化することができる。 FIG. 4 is a plan view of the wiring board 1 of another embodiment of the present disclosure, viewed from above. As shown in FIG. 4, the wiring board 1 of the present disclosure includes a first ground conductor 6 and a second ground conductor 7, and may not include a third ground conductor 8. Even with this embodiment, the ground potential is strengthened and the occurrence of crosstalk noise is reduced compared to an embodiment that does not include the first ground conductor 6 and the second ground conductor 7. Furthermore, by using an embodiment that does not include the third ground conductor 8, the degree of coupling of the signals transmitted through the first signal conductor 4 and the second signal conductor 5 can be increased compared to an embodiment that includes the third ground conductor 8, and the possibility of crosstalk noise can be reduced. Furthermore, by using an embodiment that does not include the third ground conductor 8, the distance between the first signal conductor 4 and the second signal conductor 5 can be reduced, so that the wiring board 1 can be further miniaturized.

　図５は、本開示の配線基板１の他の実施形態の、配線基板１の上方から視た平面図である。本開示の配線基板１は、図４に示すように、信号導体対３を複数備えていてもよい。配線基板１が信号導体対３を複数備える場合、全ての信号導体対３が本開示に係る信号導体対３である必要はなく、少なくとも１対の信号導体対３が本開示に係る信号導体対３であればよい。 FIG. 5 is a plan view of another embodiment of the wiring board 1 of the present disclosure, viewed from above the wiring board 1. The wiring board 1 of the present disclosure may include a plurality of signal conductor pairs 3, as shown in FIG. 4. When the wiring board 1 includes a plurality of signal conductor pairs 3, it is not necessary that all of the signal conductor pairs 3 are the signal conductor pairs 3 according to the present disclosure, and it is sufficient that at least one of the signal conductor pairs 3 is the signal conductor pair 3 according to the present disclosure.

　本開示の配線基板１は、第１絶縁基体２の内に位置する内層導体１０を更に備えていてもよい。これによって、共振周波数が高周波数側にシフトし、高周波伝送特性が向上する。 The wiring board 1 of the present disclosure may further include an inner layer conductor 10 located inside the first insulating base 2. This shifts the resonant frequency to the higher frequency side, improving the high-frequency transmission characteristics.

　図６は、図５に示す実施形態である配線基板１が有する内層導体１０の、上方から視た平面図である。内層導体１０は、複数の第１開口部１２と、複数の第２開口部１３と、を有している。平面視において、複数の第１開口部１２は、第１信号導体４に重なるとともに、第１信号導体４に沿って並んで位置している。また、平面視において、複数の第２開口部１３は、第２信号導体５に重なるとともに、第２信号導体５に沿って並んで位置している。これによって、共振周波数が高周波数側で維持されつつ、インピーダンスの低下が低減される。なお、「平面視」には、「平面透視」も含まれる。第１開口部１２及び第２開口部１３の形状は、図６に示すような円形状である場合に限られず、楕円形状や多角形状であってもよい。また、複数の第１開口部１２と複数の第２開口部１３との全ての形状が同じである必要はない。 6 is a plan view of the inner layer conductor 10 of the wiring board 1 of the embodiment shown in FIG. 5, viewed from above. The inner layer conductor 10 has a plurality of first openings 12 and a plurality of second openings 13. In the plan view, the plurality of first openings 12 overlap the first signal conductor 4 and are positioned along the first signal conductor 4. In addition, in the plan view, the plurality of second openings 13 overlap the second signal conductor 5 and are positioned along the second signal conductor 5. This reduces the decrease in impedance while maintaining the resonance frequency on the high frequency side. Note that "plan view" also includes "plan view". The shapes of the first openings 12 and the second openings 13 are not limited to the circular shape shown in FIG. 6, but may be elliptical or polygonal. In addition, the shapes of all of the plurality of first openings 12 and the plurality of second openings 13 do not need to be the same.

　一実施形態において、配線基板１は、複数の内層導体１０を有していてもよい。ここで、各内層導体１０は、それぞれ異なる形状の第１開口部１２及び第２開口部１３を有していしてもよい。この場合、各内層導体１０に形成された第１開口部１２及び第２開口部１３は、平面視において、重なっていてもよい。より具体的には、同一形状の第１開口部１２及び第２開口部１３が、各内層導体１０に形成され、これらの第１開口部１２及び第２開口部１３は、平面視で一致するように重なりあっていてもよい。言い換えると、第１信号導体４及び第２信号導体５と重なる箇所において、複数の内層導体１０が、部分的に形成されていなくても良い。 In one embodiment, the wiring board 1 may have multiple inner layer conductors 10. Here, each inner layer conductor 10 may have a first opening 12 and a second opening 13 of different shapes. In this case, the first opening 12 and the second opening 13 formed in each inner layer conductor 10 may overlap in a planar view. More specifically, the first opening 12 and the second opening 13 of the same shape may be formed in each inner layer conductor 10, and these first openings 12 and second openings 13 may overlap so as to match in a planar view. In other words, the multiple inner layer conductors 10 may not be partially formed at the locations where they overlap with the first signal conductor 4 and the second signal conductor 5.

　なお、図５及び図６に示す黒点は、接地ビア導体９である。接地ビア導体９は、第１絶縁基体２の上に位置する接地導体（第１接地導体６、第２接地導体７、第３接地導体８等）と、内層導体１０と、を電気的に接続する。 The black dots shown in Figures 5 and 6 are ground via conductors 9. The ground via conductors 9 electrically connect the ground conductors (first ground conductor 6, second ground conductor 7, third ground conductor 8, etc.) located on the first insulating base 2 to the inner layer conductor 10.

　接地ビア導体９の数及び位置は、特に限定されず、信号導体対３の形状等によって適宜決められればよい。 The number and positions of the ground via conductors 9 are not particularly limited and may be determined appropriately depending on the shape of the signal conductor pairs 3, etc.

　図７は、本開示の配線基板１の他の実施形態の、配線基板１の上方から視た平面図である。本開示の配線基板１は、図７に示すように、第１絶縁基体２の上に位置する第２絶縁基体１１を更に備えていてもよい。第２絶縁基体１１は、配線基板１を電子部品収納用パッケージに用いた場合、枠体の一部を兼ねることができる。 FIG. 7 is a plan view of another embodiment of the wiring board 1 of the present disclosure, viewed from above the wiring board 1. As shown in FIG. 7, the wiring board 1 of the present disclosure may further include a second insulating base 11 located on the first insulating base 2. The second insulating base 11 can also serve as part of the frame when the wiring board 1 is used in a package for storing electronic components.

　また、第２絶縁基体１１は、図７に示すように、平面視において、第１延伸部４ｆの少なくとも一部及び第２延伸部５ｆの部分の少なくとも一部と重なっていてもよい。 Furthermore, as shown in FIG. 7, the second insulating base 11 may overlap at least a portion of the first extension portion 4f and at least a portion of the second extension portion 5f in a plan view.

　図８は、本開示の配線基板１の他の実施形態の、一部の斜視図である。図８に示す配線基板１は、第１絶縁基体２と、第１絶縁基体２の上に位置する第２絶縁基体１１を備える。第２絶縁基体１１の一部は、第１延伸部４ｆの一部及び第２延伸部５ｆの一部の上に位置する。 FIG. 8 is a perspective view of a portion of another embodiment of the wiring board 1 of the present disclosure. The wiring board 1 shown in FIG. 8 comprises a first insulating base 2 and a second insulating base 11 located on the first insulating base 2. A portion of the second insulating base 11 is located on a portion of the first extension portion 4f and a portion of the second extension portion 5f.

　図９Ａ～Ｄに示すように、本開示の配線基板１は、更に外部接続基板４０が接続されていてもよい。より具体的には、外部接続基板４０は、第１延伸部４ｆ及び第２延伸部５ｆに電気的に接続されていてもよい。外部接続基板４０は、例えばフレキシブルプリント回路基板（ＦＰＣ）、プリント回路基板（ＰＣＢ）等である。 As shown in Figures 9A to 9D, the wiring board 1 of the present disclosure may further be connected to an external connection board 40. More specifically, the external connection board 40 may be electrically connected to the first extension portion 4f and the second extension portion 5f. The external connection board 40 may be, for example, a flexible printed circuit board (FPC), a printed circuit board (PCB), etc.

　第１絶縁基体２の材料は、例えば酸化アルミニウム質焼結体、窒化アルミニウム質焼結体、炭化珪素質焼結体、ムライト質焼結体、ガラスセラミックス等のセラミック焼結体である。 The material of the first insulating base 2 is a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a mullite sintered body, or a glass ceramic.

　また、第１絶縁基体２の材料は、エポキシ樹脂、ポリイミド、液晶ポリマー等の樹脂であってもよい。第１絶縁基体２の材料を例えばポリイミド又は液晶ポリマーとすることで、配線基板１を、フレキシブルプリント回路基板（ＦＰＣ）やプリント回路基板（ＰＣＢ）に適用することもできる。 The material of the first insulating base 2 may be a resin such as an epoxy resin, polyimide, or liquid crystal polymer. By using, for example, a polyimide or liquid crystal polymer as the material of the first insulating base 2, the wiring board 1 can be used as a flexible printed circuit board (FPC) or a printed circuit board (PCB).

　第２絶縁基体１１の材料や形成方法は、第１絶縁基体２と同じであってもよいし、異なっていてもよい。第２絶縁基体１１は、第１絶縁基体２とは別で形成されてもよく、第１絶縁基体２と一体的に形成されてもよい。例えば、第１絶縁基体２の材料は、第２絶縁基体１１の材料よりも誘電率が低い材料を用いてもよい。 The material and method of formation of the second insulating base 11 may be the same as or different from those of the first insulating base 2. The second insulating base 11 may be formed separately from the first insulating base 2, or may be formed integrally with the first insulating base 2. For example, the material of the first insulating base 2 may have a lower dielectric constant than the material of the second insulating base 11.

　第１信号導体４、第２信号導体５、第１接地導体６、第２接地導体７、及び第３接地導体８の材料には、例えば、タングステン、モリブデン、マンガン、銅、金、銀等の金属又はこれらの合金を適用できる。 The first signal conductor 4, the second signal conductor 5, the first ground conductor 6, the second ground conductor 7, and the third ground conductor 8 may be made of a metal such as tungsten, molybdenum, manganese, copper, gold, or silver, or an alloy of these metals.

　配線基板１の作製方法の一例を説明する。第１絶縁基体２の材料を酸化アルミニウム質焼結体とし、第１信号導体４、第２信号導体５、第１接地導体６、第２接地導体７、及び第３接地導体８としてタングステンのメタライズ層を用いる場合、配線基板は例えば次のように作製できる。まず、第１絶縁基体２の原料粉末を、有機溶剤及び有機バインダと混練して、スラリーとする。第１絶縁基体２の原料粉末は、酸化アルミニウム粉末と、焼結助剤成分となる酸化ケイ素等の粉末と、を主成分とする。次に、当該スラリーをドクターブレード法、リップコータ法等の成形方法でシート状に成形してセラミックグリーンシートを形成する。また、タングステンの粉末を有機溶剤及び有機バインダと混合して金属ペーストを形成する。当該金属ペーストをセラミックグリーンシートの所定位置にスクリーン印刷法等で適宜印刷する。必要に応じて複数のセラミックグリーンシートを積層して積層体を形成する。その後、この積層体を約１３００℃～１６００℃程度の温度で焼成する。また、接地ビア導体９は、金属ペーストの印刷に先立ってセラミックグリーンシートの所定の位置に貫通孔を設け、上記と同様の金属ペーストをこの貫通孔に充填しておき、セラミックグリーンシートとともに焼成することで形成できる。第１信号導体４、第２信号導体５、第１接地導体６、第２接地導体７、及び第３接地導体８の表面には、１～１０μｍ程度のニッケル膜及び０．１～３μｍ程度の金膜を順に形成してもよい。これにより、当該表面を保護するとともに、ろう材、はんだ等との接合性を高めることができる。 An example of a method for manufacturing the wiring board 1 will be described. When the material of the first insulating base 2 is an aluminum oxide sintered body, and the first signal conductor 4, the second signal conductor 5, the first ground conductor 6, the second ground conductor 7, and the third ground conductor 8 are tungsten metallization layers, the wiring board can be manufactured, for example, as follows. First, the raw material powder of the first insulating base 2 is kneaded with an organic solvent and an organic binder to form a slurry. The raw material powder of the first insulating base 2 is mainly composed of aluminum oxide powder and powder such as silicon oxide that serves as a sintering aid component. Next, the slurry is formed into a sheet shape by a molding method such as a doctor blade method or a lip coater method to form a ceramic green sheet. In addition, tungsten powder is mixed with an organic solvent and an organic binder to form a metal paste. The metal paste is appropriately printed at a predetermined position on the ceramic green sheet by a screen printing method or the like. If necessary, a plurality of ceramic green sheets are stacked to form a laminate. Then, the laminate is fired at a temperature of about 1300°C to 1600°C. The ground via conductors 9 can be formed by providing through holes at predetermined positions in the ceramic green sheet prior to printing the metal paste, filling the through holes with the same metal paste as above, and firing the ceramic green sheet together with the sheet. A nickel film of about 1 to 10 μm and a gold film of about 0.1 to 3 μm may be formed in this order on the surfaces of the first signal conductor 4, the second signal conductor 5, the first ground conductor 6, the second ground conductor 7, and the third ground conductor 8. This protects the surfaces and improves the bondability with brazing materials, solder, etc.

　次に、図９Ａ～Ｄ及び図１０Ａ～Ｄを参照して、本開示の配線基板１の効果を示すシミュレーションの結果を説明する。 Next, the results of a simulation showing the effect of the wiring board 1 of the present disclosure will be described with reference to Figures 9A-D and Figures 10A-D.

　図９Ａ～Ｄは、シミュレーションに用いた配線形状の異なる４つの配線基板それぞれの、上方から視た平面図である。いずれの配線基板も、第１絶縁基体２の上に、第１接地導体６、第１信号導体４、第３接地導体８、第２信号導体５、第２接地導体７、及び第２絶縁基体１１を備えている。 Figures 9A to 9D are plan views from above of four wiring boards with different wiring shapes used in the simulation. Each wiring board has a first ground conductor 6, a first signal conductor 4, a third ground conductor 8, a second signal conductor 5, a second ground conductor 7, and a second insulating base 11 on a first insulating base 2.

　図９Ａに示す配線基板は、本開示の一実施形態の配線基板である。図９Ａに示す配線基板における第１信号導体４及び第２信号導体５からなる信号導体対を、Ｔｙｐｅ１とする。Ｔｙｐｅ１の信号導体対において、第１信号導体４は、第１区間部４ｂ及び第１屈曲部４ｃを有する。第１屈曲部４ｃは、第１円弧部４ｄを有し、第３円弧部４ｅを有しない。第２信号導体５は、第２区間部５ｂ及び第２屈曲部５ｃを有する。第２屈曲部５ｃは、第２円弧部５ｄを有し、第４円弧部５ｅを有しない。第１信号導体４の全長と第２信号導体５の全長は、等しい。第１信号導体４の第１端Ｅ１から第１地点Ｐ１までの長さと第２信号導体５の第１端Ｅ１から第２地点Ｐ２までの長さは、わずかに異なる。同様に、第１信号導体４の第２端Ｅ２から第３地点Ｐ３までの長さと第２信号導体５の第２端Ｅ２から第４地点Ｐ４までの長さは、わずかに異なる。第１区間部４ｂは、第１屈曲部４ｃよりも長く、第２区間部５ｂは、第２屈曲部５ｃよりも長い。 The wiring board shown in FIG. 9A is a wiring board according to one embodiment of the present disclosure. The signal conductor pair consisting of a first signal conductor 4 and a second signal conductor 5 in the wiring board shown in FIG. 9A is referred to as Type 1. In the signal conductor pair of Type 1, the first signal conductor 4 has a first section 4b and a first bent portion 4c. The first bent portion 4c has a first arc portion 4d and does not have a third arc portion 4e. The second signal conductor 5 has a second section 5b and a second bent portion 5c. The second bent portion 5c has a second arc portion 5d and does not have a fourth arc portion 5e. The total length of the first signal conductor 4 and the total length of the second signal conductor 5 are equal. The length from the first end E1 to the first point P1 of the first signal conductor 4 and the length from the first end E1 to the second point P2 of the second signal conductor 5 are slightly different. Similarly, the length of the first signal conductor 4 from the second end E2 to the third point P3 and the length of the second signal conductor 5 from the second end E2 to the fourth point P4 are slightly different. The first section 4b is longer than the first bend 4c, and the second section 5b is longer than the second bend 5c.

　図９Ｂに示す配線基板は、比較例である。図９Ｂに示す配線基板における第１信号導体４及び第２信号導体５からなる信号導体対を、Ｔｙｐｅ２とする。Ｔｙｐｅ２の信号導体対において、第１信号導体４は、第１区間部４ｂ及び第１屈曲部４ｃを有しない。同様に、第２信号導体５は、第２区間部５ｂ及び第２屈曲部５ｃを有しない。第１信号導体４の全長と第２信号導体５の全長は、等しい。 The wiring board shown in FIG. 9B is a comparative example. The signal conductor pair consisting of a first signal conductor 4 and a second signal conductor 5 in the wiring board shown in FIG. 9B is called Type 2. In the signal conductor pair of Type 2, the first signal conductor 4 does not have a first section 4b and a first bend 4c. Similarly, the second signal conductor 5 does not have a second section 5b and a second bend 5c. The total length of the first signal conductor 4 and the total length of the second signal conductor 5 are equal.

　図９Ｃに示す配線基板は、比較例である。図９Ｃに示す配線基板における第１信号導体４及び第２信号導体５からなる信号導体対を、Ｔｙｐｅ３とする。Ｔｙｐｅ３の信号導体対において、第１信号導体４は、第１区間部４ｂ及び第１屈曲部４ｃを有しない。同様に、第２信号導体５は、第２区間部５ｂ及び第２屈曲部５ｃを有しない。第１信号導体４の全長と第２信号導体５の全長は、等しい。Ｔｙｐｅ２の信号導体対とＴｙｐｅ３の信号導体対は、比較例である点は共通するが、形状が異なる。 The wiring board shown in FIG. 9C is a comparative example. The signal conductor pair consisting of a first signal conductor 4 and a second signal conductor 5 in the wiring board shown in FIG. 9C is called Type 3. In the signal conductor pair of Type 3, the first signal conductor 4 does not have a first section 4b and a first bend 4c. Similarly, the second signal conductor 5 does not have a second section 5b and a second bend 5c. The total length of the first signal conductor 4 and the total length of the second signal conductor 5 are equal. The signal conductor pair of Type 2 and the signal conductor pair of Type 3 have in common that they are comparative examples, but have different shapes.

　図９Ｄに示す配線基板は、本開示の配線基板である。図９Ｄに示す配線基板における第１信号導体４及び第２信号導体５からなる信号導体対を、Ｔｙｐｅ４とする。Ｔｙｐｅ４の信号導体対において、第１信号導体４は、第１区間部４ｂ及び第１屈曲部４ｃを有する。第１屈曲部４ｃは、第１円弧部４ｄ及び第３円弧部４ｅを有する。第２信号導体５は、第２区間部５ｂ及び第２屈曲部５ｃを有する。第２屈曲部５ｃは、第２円弧部５ｄ及び第４円弧部５ｅを有する。第１信号導体４の全長と第２信号導体５の全長は、等しい。第１信号導体４の第１端Ｅ１から第１地点Ｐ１までの長さと第２信号導体５の第１端Ｅ１から第２地点Ｐ２までの長さは、等しい。同様に、第１信号導体４の第２端Ｅ２から第３地点Ｐ３までの長さと第２信号導体５の第２端Ｅ２から第４地点Ｐ４までの長さは、等しい。第１区間部４ｂは、第１屈曲部４ｃよりも長く、第２区間部５ｂは、第２屈曲部５ｃよりも長い。 The wiring board shown in FIG. 9D is a wiring board of the present disclosure. The signal conductor pair consisting of a first signal conductor 4 and a second signal conductor 5 in the wiring board shown in FIG. 9D is referred to as Type 4. In the signal conductor pair of Type 4, the first signal conductor 4 has a first section 4b and a first bent portion 4c. The first bent portion 4c has a first arc portion 4d and a third arc portion 4e. The second signal conductor 5 has a second section 5b and a second bent portion 5c. The second bent portion 5c has a second arc portion 5d and a fourth arc portion 5e. The total length of the first signal conductor 4 and the total length of the second signal conductor 5 are equal. The length from the first end E1 to the first point P1 of the first signal conductor 4 and the length from the first end E1 to the second point P2 of the second signal conductor 5 are equal. Similarly, the length of the first signal conductor 4 from the second end E2 to the third point P3 is equal to the length of the second signal conductor 5 from the second end E2 to the fourth point P4. The first section 4b is longer than the first bend 4c, and the second section 5b is longer than the second bend 5c.

　図１０Ａ及び図１０Ｂは、シミュレーション結果を示すグラフである。図１０Ａのグラフの縦軸は、ＳＤＣ２１［ｄＢ］である。ＳＤＣ２１は、第１信号導体４及び第２信号導体５の第１端Ｅ１から第２端Ｅ２の間におけるディファレンシャルモードからコモンモードへのモード変換量である。図１０Ｂのグラフの縦軸は、ＳＣＤ２１［ｄＢ］である。ＳＣＤ２１は、第１信号導体４及び第２信号導体５の第１端Ｅ１から第２端Ｅ２の間におけるコモンモードからディファレンシャルモードへのモード変換量である。ＳＤＣ２１及びＳＣＤ２１の値は、絶対値が大きい程、モード変換量が小さいことを示す。図１０Ａ及び図１０Ｂのグラフの横軸は、いずれも伝送信号の周波数［ＧＨｚ］である。 10A and 10B are graphs showing the simulation results. The vertical axis of the graph in FIG. 10A is SDC21 [dB]. SDC21 is the amount of mode conversion from differential mode to common mode between the first end E1 and the second end E2 of the first signal conductor 4 and the second signal conductor 5. The vertical axis of the graph in FIG. 10B is SCD21 [dB]. SCD21 is the amount of mode conversion from common mode to differential mode between the first end E1 and the second end E2 of the first signal conductor 4 and the second signal conductor 5. The larger the absolute value of the SDC21 and SCD21 values, the smaller the amount of mode conversion. The horizontal axis of both the graphs in FIG. 10A and 10B is the frequency [GHz] of the transmission signal.

　図１０Ａ及び図１０Ｂに示すシミュレーション結果から、比較例であるＴｙｐｅ２及びＴｙｐｅ３の信号導体対と比べて、Ｔｙｐｅ１の信号導体対は、ＳＤＣ２１及びＳＣＤ２１のいずれのモード変換量も小さくなっており、高周波伝送特性が向上されていることが確認できる。また、Ｔｙｐｅ４の信号導体対は、ＳＤＣ２１及びＳＣＤ２１のいずれのモード変換量も更に小さくなっており、高周波伝送特性がより向上されていることが確認できる。差動配線において屈曲部（第１屈曲部４ｃ及び第２屈曲部５ｃ）を設けると、第１信号導体４と第２信号導体５間の伝送信号に位相差が発生しやすい。この位相差により差動配線の平衡状態が崩れることによりモード変換量が大きくなるが、本開示の配線基板１の構成を採用することで、平衡状態が崩れる領域（言い換えると、位相差が発生する領域）を小さくすることができる。したがって、本開示の配線基板１の構成は、比較例よりもモード変換量を小さくすることができる可能性を高めることができる。 10A and 10B, it can be seen that the signal conductor pair of Type 1 has a smaller amount of mode conversion for both SDC21 and SCD21 than the signal conductor pairs of Type 2 and Type 3, which are comparative examples, and that the high-frequency transmission characteristics are improved. In addition, the signal conductor pair of Type 4 has an even smaller amount of mode conversion for both SDC21 and SCD21, and that the high-frequency transmission characteristics are further improved. When a bent portion (first bent portion 4c and second bent portion 5c) is provided in the differential wiring, a phase difference is likely to occur in the transmission signal between the first signal conductor 4 and the second signal conductor 5. This phase difference causes the balance state of the differential wiring to be disrupted, and the amount of mode conversion increases, but by adopting the configuration of the wiring board 1 disclosed herein, the area where the balance state is disrupted (in other words, the area where a phase difference occurs) can be made smaller. Therefore, the configuration of the wiring board 1 disclosed herein can increase the possibility of reducing the amount of mode conversion compared to the comparative examples.

［電子部品収納用パッケージ］
　本開示の配線基板の用途は特に限定されないが、本開示の配線基板は例えば電子部品収納用パッケージに用いることができる。電子部品収納用パッケージは、電子部品を気密封止して収納できる。 [Electronic component storage package]
The use of the wiring board of the present disclosure is not particularly limited, but the wiring board of the present disclosure can be used, for example, as a package for storing electronic components. The package for storing electronic components can store electronic components in an airtight sealed state.

　図１１は、本開示に係る電子部品収納用パッケージの一実施形態の、斜視図である。本実施形態の電子部品収納用パッケージ２０は、基板２１と、枠体２２と、本開示の配線基板１と、を備える。 FIG. 11 is a perspective view of one embodiment of an electronic component storage package according to the present disclosure. The electronic component storage package 20 of this embodiment includes a substrate 21, a frame 22, and the wiring board 1 of the present disclosure.

　基板２１は、例えば矩形の板状の部材である。枠体２２は、平面視で電子部品の載置領域を囲む位置に設けられた枠状の部材である。図１１に示すように、枠体２２は、電子部品収納用パッケージ２０の内外において光の送受信を行うための透光部２３を有していてもよい。 The substrate 21 is, for example, a rectangular plate-like member. The frame body 22 is a frame-like member provided in a position surrounding the mounting area for the electronic components in a plan view. As shown in FIG. 11, the frame body 22 may have a light-transmitting portion 23 for transmitting and receiving light inside and outside the electronic component storage package 20.

　基板２１及び枠体２２は、例えば、複数の絶縁性基板が積層された構成とすることができる。絶縁性基板としては、例えば、酸化アルミニウム質焼結体、窒化アルミニウム質焼結体、炭化珪素質焼結体、ムライト質焼結体、ガラスセラミックス等のセラミック焼結体を用いることができる。基板２１及び枠体２２の材料は、金属であってもよい。金属の例としては、銅、タングステン、モリブデン、鉄、ニッケル、又はコバルト、若しくはこれらの合金が挙げられる。合金の具体例としては、銅－タングステン合金、銅－モリブデン合金、鉄－ニッケル－コバルト合金等が挙げられる。基板２１の材料と枠体２２の材料は、同じであってもよく、異なっていてもよい。 The substrate 21 and the frame 22 may be configured, for example, by stacking a plurality of insulating substrates. As the insulating substrate, for example, a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a mullite sintered body, or glass ceramics may be used. The material of the substrate 21 and the frame 22 may be a metal. Examples of metals include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include a copper-tungsten alloy, a copper-molybdenum alloy, and an iron-nickel-cobalt alloy. The materials of the substrate 21 and the frame 22 may be the same or different.

　図１１に示す電子部品収納用パッケージ２０は、シールリング２４を更に備える。シールリング２４は、枠体２２の上面に位置している。シールリング２４は、電子部品収納用パッケージ２０に電子部品３２を搭載後に蓋体３４を用いて気密封止する際のシール材として機能する。シールリング２４は、例えば、タングステン、モリブデン等の高融点金属を含む導体ペーストで形成した枠に、Ｆｅ－Ｎｉ系合金、Ｆｅ－Ｎｉ－Ｃｏ系合金等を含む枠状金属板をろう材等で接合したものであってもよい。 The electronic component storage package 20 shown in FIG. 11 further includes a seal ring 24. The seal ring 24 is located on the upper surface of the frame 22. The seal ring 24 functions as a sealant when the electronic component 32 is mounted on the electronic component storage package 20 and then hermetically sealed using the lid 34. The seal ring 24 may be, for example, a frame formed of a conductive paste containing a high melting point metal such as tungsten or molybdenum, to which a frame-shaped metal plate containing an Fe-Ni alloy, an Fe-Ni-Co alloy, or the like is joined with a brazing material or the like.

［電子モジュール］
　図１２は、本開示に係る電子モジュールの一実施形態の、分解斜視図である。本実施形態の電子モジュール３０は、本開示に係る電子部品収納用パッケージ２０と、電子部品３２と、蓋体３４と、を備える。 [Electronic Module]
12 is an exploded perspective view of an embodiment of an electronic module according to the present disclosure. The electronic module 30 of this embodiment includes the electronic component storage package 20 according to the present disclosure, an electronic component 32, and a lid 34.

　電子部品３２は、基板２１の上に設けられたマウント部材３１の上に位置する。電子部品３２は、例えばボンディングワイヤ３３等の接続部材で信号導体対３と電気的に接続される。電子部品３２は、例えば光通信に係る高周波信号（例えば、周波数帯が１０ＧＨｚ以上程度）が入力又は出力される電子部品である。電子部品３２の具体例としては、発光素子、受光素子等が挙げられる。ただし、これらは例示であり、電子部品３２は上記のものに限られない。 The electronic component 32 is located on a mounting member 31 provided on the substrate 21. The electronic component 32 is electrically connected to the signal conductor pair 3 by a connection member such as a bonding wire 33. The electronic component 32 is an electronic component that inputs or outputs high-frequency signals (e.g., a frequency band of about 10 GHz or higher) related to optical communication. Specific examples of the electronic component 32 include a light-emitting element and a light-receiving element. However, these are merely examples, and the electronic component 32 is not limited to the above.

　蓋体３４は、枠体２２の上に位置する。蓋体３４は、例えば板状の部材である。蓋体３４は、電子モジュール３０の内部（キャビティ）への水分、微粒子等の異物の侵入を低減できるものであればよい。蓋体３４は、例えば、シールリング２４と同じ金属材料、又は基板２１及び枠体２２と同じセラミックス材料等を板状に加工及び成形したものである。 The lid 34 is located on top of the frame 22. The lid 34 is, for example, a plate-shaped member. The lid 34 may be any material capable of reducing the intrusion of moisture, fine particles, and other foreign matter into the interior (cavity) of the electronic module 30. The lid 34 is, for example, made of the same metal material as the seal ring 24, or the same ceramic material as the substrate 21 and frame 22, which is processed and formed into a plate shape.

　以上のように、本開示に係る配線基板１は、第１絶縁基体２と、信号導体対３と、を備える。第１絶縁基体２は、第１端面Ｓ１と、第１端面Ｓ１と第１方向Ｘにおいて対向する第２端面Ｓ２と、を有する。信号導体対３は、第１絶縁基体２の上において、第１端面Ｓ１の側から第２端面Ｓ２の側にかけて位置するとともに、第１信号導体４及び第２信号導体５を有する。第１絶縁基体２の第１端面Ｓ１の側に位置する信号導体対３の第１端Ｅ１と、第１絶縁基体２の第２端面Ｓ２の側に位置する信号導体対３の第２端Ｅ２と、は、第１方向Ｘと交差する第２方向Ｙにおいてずれて位置している。第１信号導体４は、第２信号導体５との距離が変化する第１屈曲部４ｃと、第１屈曲部４ｃの第１端Ｅ１の側に直接接続する第１直線部４ａと、を有している。第２信号導体５は、第１信号導体４との距離が変化する第２屈曲部５ｃと、第２屈曲部５ｃの第２端Ｅ２の側に直接接続する第２直線部５ａと、を有している。第１直線部４ａと第２直線部５ａは、相互に平行に位置している。第１直線部４ａ及び第２直線部５ａの両方に直交する第３方向Ａから視たときに、第１直線部４ａの少なくとも一部と第２直線部５ａの少なくとも一部は、重なっている。
　本開示の配線基板１は、第１屈曲部４ｃ及び第２屈曲部５ｃによって、第１区間部４ｂ及び第２区間部５ｂに到達する時点における信号の位相が、反転状態又はこれに近い状態を維持しやすくなっている。信号がこの状態で直線状かつ互いに平行する第１区間部４ｂ及び第２区間部５ｂを進むことによって、ノイズの発生が低減される。これによって、本開示の配線基板１は、高周波伝送特性が良好となる。 As described above, the wiring board 1 according to the present disclosure includes a first insulating base 2 and a signal conductor pair 3. The first insulating base 2 has a first end surface S1 and a second end surface S2 that faces the first end surface S1 in the first direction X. The signal conductor pair 3 is located on the first insulating base 2 from the first end surface S1 side to the second end surface S2 side, and has a first signal conductor 4 and a second signal conductor 5. The first end E1 of the signal conductor pair 3 located on the first end surface S1 side of the first insulating base 2 and the second end E2 of the signal conductor pair 3 located on the second end surface S2 side of the first insulating base 2 are shifted in the second direction Y that intersects with the first direction X. The first signal conductor 4 has a first bent portion 4c whose distance from the second signal conductor 5 changes, and a first straight portion 4a that is directly connected to the first end E1 side of the first bent portion 4c. The second signal conductor 5 has a second bent portion 5c at which the distance from the first signal conductor 4 changes, and a second straight portion 5a directly connected to the second end E2 side of the second bent portion 5c. The first straight portion 4a and the second straight portion 5a are positioned parallel to each other. When viewed from a third direction A perpendicular to both the first straight portion 4a and the second straight portion 5a, at least a part of the first straight portion 4a and at least a part of the second straight portion 5a overlap each other.
In the wiring board 1 of the present disclosure, the first bend 4c and the second bend 5c make it easier for the phase of the signal to remain inverted or close to inverted when it reaches the first section 4b and the second section 5b. The signal travels in this state through the first section 4b and the second section 5b, which are linear and parallel to each other, thereby reducing noise generation. This provides the wiring board 1 of the present disclosure with good high-frequency transmission characteristics.

　また、第１信号導体４の全長と第２信号導体５の全長は、等しくてもよい。
　これによって、受信側の端において信号の位相が反転状態で受信されやすくなり、高周波伝送特性がより良好となる。 Furthermore, the total length of the first signal conductor 4 and the total length of the second signal conductor 5 may be equal.
This makes it easier for the signal to be received at the receiving end in an inverted phase, resulting in better high frequency transmission characteristics.

　また、第１直線部４ａのうち第３方向Ａから視て第２直線部５ａと重なる部分を第１区間部４ｂとし、第２直線部５ａのうち第３方向Ａから視て第１直線部４ａと重なる部分を第２区間部５ｂとし、第１区間部４ｂの第１端Ｅ１の側の端を第１地点Ｐ１とし、第２区間部５ｂの第１端Ｅ１の側の端を第２地点Ｐ２としたとき、第１信号導体４の第１端Ｅ１から第１地点Ｐ１までの長さと第２信号導体５の第１端Ｅ１から第２地点Ｐ２までの長さは、等しくてもよい。
　これによって、第１区間部４ｂ及び第２区間部５ｂにおける信号の位相が反転状態になりすくなり、高周波伝送特性が高くなる。 In addition, when the portion of the first straight portion 4a that overlaps with the second straight portion 5a when viewed from the third direction A is defined as the first section 4b, the portion of the second straight portion 5a that overlaps with the first straight portion 4a when viewed from the third direction A is defined as the second section 5b, the end of the first section 4b on the side of the first end E1 is defined as the first point P1, and the end of the second section 5b on the side of the first end E1 is defined as the second point P2, the length from the first end E1 of the first signal conductor 4 to the first point P1 and the length from the first end E1 of the second signal conductor 5 to the second point P2 may be equal.
This makes it easier for the phase of the signal in the first section 4b and the second section 5b to be inverted, improving the high frequency transmission characteristics.

　また、第１区間部４ｂの第２端Ｅ２の側の端を第３地点Ｐ３とし、第２区間部５ｂの第２端Ｅ２の側の端を第４地点Ｐ４としたとき、第１信号導体４の第２端Ｅ２から第３地点Ｐ３までの長さと第２信号導体５の第２端Ｅ２から第４地点Ｐ４までの長さは、等しくてもよい。
　これによって、第１区間部４ｂ及び第２区間部５ｂにおける信号の位相が反転状態になりすくなり、高周波伝送特性が高くなる。 Furthermore, when the end on the side of the second end E2 of the first section 4b is the third point P3 and the end on the side of the second end E2 of the second section 5b is the fourth point P4, the length from the second end E2 of the first signal conductor 4 to the third point P3 and the length from the second end E2 of the second signal conductor 5 to the fourth point P4 may be equal.
This makes it easier for the phase of the signal in the first section 4b and the second section 5b to be inverted, improving the high frequency transmission characteristics.

　また、第１区間部４ｂは、第１屈曲部４ｃよりも長く、第２区間部５ｂは、第２屈曲部５ｃよりも長くてもよい。
　これによって、信号の位相が反転状態又はこれに近い状態で信号が伝送される距離が長くなり、ノイズの発生がより低減される。 Furthermore, the first section 4b may be longer than the first bent section 4c, and the second section 5b may be longer than the second bent section 5c.
This increases the distance over which a signal can be transmitted with its phase inverted or nearly inverted state, further reducing the generation of noise.

　また、第１屈曲部４ｃは、第２信号導体５から遠ざかる方向に凸の第１円弧部４ｄを有しており、第２屈曲部５ｃは、第１信号導体４から遠ざかる方向に凸の第２円弧部５ｄを有していてもよい。
　このように第１屈曲部４ｃ及び第２屈曲部５ｃが円弧部を有することによって、信号の反射が低減され、高周波伝送特性が向上する。 In addition, the first bend 4c may have a first arc portion 4d that is convex in a direction away from the second signal conductor 5, and the second bend 5c may have a second arc portion 5d that is convex in a direction away from the first signal conductor 4.
In this manner, the first bent portion 4c and the second bent portion 5c each have an arcuate portion, so that signal reflection is reduced and high frequency transmission characteristics are improved.

　また、第１屈曲部４ｃは、第１円弧部４ｄと直接接続するとともに第２信号導体５から遠ざかる方向に凸の第３円弧部４ｅを有しており、第２屈曲部５ｃは、第２円弧部５ｄと直接接続するとともに第１信号導体４から遠ざかる方向に凸の第４円弧部５ｅを有しており、第１円弧部４ｄの曲率半径と第３円弧部４ｅの曲率半径は、等しく、第２円弧部５ｄの曲率半径と第４円弧部５ｅの曲率半径は、等しくてもよい。
　各屈曲部が円弧部を複数有することによって、１つずつ有する場合と比べて、各円弧部の曲率半径を小さくしながら信号導体の長さを調整できる。 In addition, the first bend portion 4c has a third arc portion 4e that is directly connected to the first arc portion 4d and is convex in a direction away from the second signal conductor 5, and the second bend portion 5c has a fourth arc portion 5e that is directly connected to the second arc portion 5d and is convex in a direction away from the first signal conductor 4, and the radius of curvature of the first arc portion 4d and the third arc portion 4e are equal, and the radius of curvature of the second arc portion 5d and the fourth arc portion 5e may be equal.
By having a plurality of arcuate portions in each bend, the length of the signal conductor can be adjusted while making the radius of curvature of each arcuate portion smaller than when each bend has only one arcuate portion.

　また、配線基板１は、第１絶縁基体２の上に位置する、第１接地導体６及び第２接地導体７を更に備え、第１接地導体６、第１信号導体４、第２信号導体５、及び第２接地導体７は、この順に並んで位置しており、第１接地導体６は、第１信号導体４と間を空けて位置し、第１信号導体４に沿う部分を第１信号導体４の少なくとも一部に対して有しており、第２接地導体７は、第２信号導体５と間を空けて位置し、第２信号導体５に沿う部分を第２信号導体５の少なくとも一部に対して有していてもよい。
　これによって、接地電位が強化され、クロストークノイズの発生が低減される。 The wiring board 1 may further include a first ground conductor 6 and a second ground conductor 7 located on the first insulating base 2, the first ground conductor 6, the first signal conductor 4, the second signal conductor 5, and the second ground conductor 7 being located in line in this order, the first ground conductor 6 being located away from the first signal conductor 4 and having a portion that runs along the first signal conductor 4 for at least a portion of the first signal conductor 4, and the second ground conductor 7 being located away from the second signal conductor 5 and having a portion that runs along the second signal conductor 5 for at least a portion of the second signal conductor 5.
This strengthens the ground potential and reduces the generation of crosstalk noise.

　また、配線基板１は、第１絶縁基体２の上に位置するとともに、第１信号導体４と第２信号導体５との間に位置する第３接地導体８を更に備え、第３接地導体８は、第１信号導体４及び第２信号導体５と間を空けて位置し、第１信号導体４に沿う部分を第１信号導体４の少なくとも一部に対して有しており、第２信号導体５に沿う部分を第２信号導体５の少なくとも一部に対して有していてもよい。
　これによって、接地電位が強化され、クロストークノイズの発生が低減される。 In addition, the wiring board 1 may further include a third ground conductor 8 located on the first insulating base 2 and between the first signal conductor 4 and the second signal conductor 5, and the third ground conductor 8 may be located with a space between the first signal conductor 4 and the second signal conductor 5, and may have a portion that runs along the first signal conductor 4 for at least a portion of the first signal conductor 4, and may have a portion that runs along the second signal conductor 5 for at least a portion of the second signal conductor 5.
This strengthens the ground potential and reduces the generation of crosstalk noise.

　また、配線基板１は、第１絶縁基体２の上に位置する第２絶縁基体１１を更に備えていてもよい。
　第２絶縁基体１１は、配線基板１を電子部品収納用パッケージ２０に用いた場合、枠体の一部を兼ねることができる。 Moreover, the wiring board 1 may further include a second insulating base 11 located on the first insulating base 2 .
When the wiring board 1 is used in an electronic component housing package 20, the second insulating base 11 can also serve as a part of the frame.

　また、第１信号導体４のうち第１直線部４ａよりも第１端Ｅ１の側の部分を第１延伸部４ｆとし、第２信号導体５のうち第２屈曲部５ｃよりも第１端Ｅ１の側の部分を第２延伸部５ｆとしたとき、平面視において、第２絶縁基体１１は、第１延伸部４ｆの少なくとも一部及び第２延伸部５ｆの部分の少なくとも一部と重なっていてもよい。 Furthermore, when the portion of the first signal conductor 4 closer to the first end E1 than the first straight portion 4a is defined as the first extension portion 4f, and the portion of the second signal conductor 5 closer to the first end E1 than the second bend portion 5c is defined as the second extension portion 5f, the second insulating base 11 may overlap at least a portion of the first extension portion 4f and at least a portion of the second extension portion 5f in a planar view.

　また、第１絶縁基体２の内に位置する内層導体１０を更に備え、内層導体１０は、複数の第１開口部１２と、複数の第２開口部１３と、を有しており、平面視において、複数の第１開口部１２は、第１信号導体４に重なるとともに、第１信号導体４に沿って並んで位置しており、平面視において、複数の第２開口部１３は、第２信号導体５に重なるとともに、第２信号導体５に沿って並んで位置していてもよい。
　これによって、共振周波数が高周波数側で維持されつつ、インピーダンスの低下が低減される。 The insulating substrate 2 may further include an inner layer conductor 10 located within the first insulating base 2, the inner layer conductor 10 having a plurality of first openings 12 and a plurality of second openings 13, and in a planar view, the plurality of first openings 12 may overlap the first signal conductor 4 and be positioned in a line along the first signal conductor 4, and in a planar view, the plurality of second openings 13 may overlap the second signal conductor 5 and be positioned in a line along the second signal conductor 5.
This reduces the drop in impedance while maintaining the resonant frequency on the high frequency side.

　本開示に係る電子部品収納用パッケージ２０は、基板２１と、基板２１の上に位置する枠体２２と、枠体２２に接合された上記の配線基板１と、を備える。本開示に係る電子モジュール３０は、上記の電子部品収納用パッケージ２０と、基板２１の上に位置し、信号導体対３と電気的に接続された電子部品３２と、枠体２２の上に位置する蓋体３４と、を備える。
　ノイズの発生が低減された配線基板１を備えることによって、本開示に係る電子部品収納用パッケージ２０及び電子モジュール３０は、高周波伝送特性が良好である。 An electronic component storage package 20 according to the present disclosure includes a substrate 21, a frame body 22 located on the substrate 21, and the above-mentioned wiring board 1 joined to the frame body 22. An electronic module 30 according to the present disclosure includes the above-mentioned electronic component storage package 20, an electronic component 32 located on the substrate 21 and electrically connected to the signal conductor pairs 3, and a lid body 34 located on the frame body 22.
By including the wiring board 1 with reduced noise generation, the electronic component storage package 20 and electronic module 30 according to the present disclosure have excellent high-frequency transmission characteristics.

　以上、本開示の各実施形態について説明したが、本開示の配線基板１、電子部品収納用パッケージ２０及び電子モジュール３０は、上記実施形態に限られるものでない。　Although each embodiment of the present disclosure has been described above, the wiring board 1, electronic component storage package 20, and electronic module 30 of the present disclosure are not limited to the above-described embodiments.

　例えば、第１信号導体４の全長と第２信号導体５の全長は、等しくなくてもよい。 For example, the total length of the first signal conductor 4 and the total length of the second signal conductor 5 do not have to be equal.

　第１信号導体４の第１端Ｅ１から第１地点Ｐ１までの長さと第２信号導体５の第１端Ｅ１から第２地点Ｐ２までの長さは、等しくなくてもよい。 The length from the first end E1 to the first point P1 of the first signal conductor 4 and the length from the first end E1 to the second point P2 of the second signal conductor 5 do not have to be equal.

　第１信号導体４の第２端Ｅ２から第３地点Ｐ３までの長さと第２信号導体５の第２端Ｅ２から第４地点Ｐ４までの長さは、等しくなくてもよい。 The length from the second end E2 to the third point P3 of the first signal conductor 4 and the length from the second end E2 to the fourth point P4 of the second signal conductor 5 do not have to be equal.

　第１区間部４ｂは、第１屈曲部４ｃよりも長くなくてもよく、第２区間部５ｂは、第２屈曲部５ｃよりも長くなくてもよい。 The first section 4b does not have to be longer than the first bent section 4c, and the second section 5b does not have to be longer than the second bent section 5c.

　第１屈曲部４ｃは、第１円弧部４ｄ及び第３円弧部４ｅを有していなくてもよく、第２屈曲部５ｃは、第２円弧部５ｄ及び第４円弧部５ｅを有していなくてもよい。この場合、第１屈曲部４ｃ及び第２屈曲部５ｃは、例えば直角に屈曲する。 The first bend 4c may not have the first arc portion 4d and the third arc portion 4e, and the second bend 5c may not have the second arc portion 5d and the fourth arc portion 5e. In this case, the first bend 4c and the second bend 5c are bent, for example, at a right angle.

　第１円弧部４ｄの曲率半径と第３円弧部４ｅの曲率半径は、等しくなくてもよく、第２円弧部５ｄの曲率半径と第４円弧部５ｅの曲率半径は、等しくなくてもよい。 The radius of curvature of the first arc portion 4d and the third arc portion 4e do not have to be equal, and the radius of curvature of the second arc portion 5d and the fourth arc portion 5e do not have to be equal.

　第１接地導体６は、第１信号導体４に沿う部分を、第１信号導体４の一部のみに対して有していてもよい。また、本開示の配線基板１は、第１接地導体６を備えていなくてもよい。 The first ground conductor 6 may have a portion that is aligned with the first signal conductor 4 only for a portion of the first signal conductor 4. Also, the wiring board 1 of the present disclosure may not have a first ground conductor 6.

　第２接地導体７は、第２信号導体５に沿う部分を、第２信号導体５の一部のみに対して有していてもよい。また、本開示の配線基板１は、第２接地導体７を備えていなくてもよい。 The second ground conductor 7 may have a portion that is aligned with the second signal conductor 5 only for a portion of the second signal conductor 5. Also, the wiring board 1 of the present disclosure may not have a second ground conductor 7.

　第３接地導体８は、第１信号導体４に沿う部分を、第１信号導体４の第１端Ｅ１から第２端Ｅ２までの全てに対して有していてもよく、第２信号導体５に沿う部分を、第２信号導体５の第１端Ｅ１から第２端Ｅ２までの全てに対して有していてもよい。また、本開示の配線基板１は、第３接地導体８を備えていなくてもよい。 The third ground conductor 8 may have a portion that runs along the first signal conductor 4 over the entirety from the first end E1 to the second end E2 of the first signal conductor 4, and may have a portion that runs along the second signal conductor 5 over the entirety from the first end E1 to the second end E2 of the second signal conductor 5. In addition, the wiring board 1 of the present disclosure may not have a third ground conductor 8.

　第１区間部４ｂ及び第２区間部５ｂの間に位置する第３接地導体８の第３方向Ａにおける幅は、第１区間部４ｂの第３方向Ａにおける幅及び第２区間部５ｂの第３方向Ａにおける幅よりも広くてもよい。 The width in the third direction A of the third ground conductor 8 located between the first section 4b and the second section 5b may be wider than the width in the third direction A of the first section 4b and the width in the third direction A of the second section 5b.

　第２端面Ｓ２の側において、第３接地導体８の第２端面Ｓ２の側の端と第２端面Ｓ２との距離は、信号導体対３の第２端Ｅ２と第２端面Ｓ２との距離よりも大きくてもよい。 On the side of the second end face S2, the distance between the end of the third ground conductor 8 on the side of the second end face S2 and the second end face S2 may be greater than the distance between the second end E2 of the signal conductor pair 3 and the second end face S2.

　第１延伸部４ｆの長さと第２延伸部５ｆの長さは、等しくてもよい。 The length of the first extension portion 4f and the length of the second extension portion 5f may be equal.

　第１信号導体４のうち第１屈曲部４ｃよりも第２端Ｅ２の側の部分を第３延伸部とし、第２信号導体５のうち第２直線部５ａよりも第２端Ｅ２の側の部分を第４延伸部としたとき、平面視において、第２絶縁基体１１は、第３延伸部の少なくとも一部及び第４延伸部の部分の少なくとも一部と重なっていてもよい。 When the portion of the first signal conductor 4 closer to the second end E2 than the first bend 4c is defined as the third extension portion, and the portion of the second signal conductor 5 closer to the second end E2 than the second straight portion 5a is defined as the fourth extension portion, the second insulating base 11 may overlap at least a portion of the third extension portion and at least a portion of the fourth extension portion in a planar view.

　第３延伸部の長さと第４延伸部の長さは、等しくてもよい。 The length of the third extension portion and the length of the fourth extension portion may be equal.

　電子部品収納用パッケージ２０又は電子モジュール３０において、配線基板１は、全体が電子部品収納用パッケージ２０又は電子モジュール３０の内部（キャビティ）に位置していてもよい。 In the electronic component storage package 20 or electronic module 30, the entire wiring board 1 may be located inside (in the cavity) of the electronic component storage package 20 or electronic module 30.

　電子部品収納用パッケージ２０において、基板２１、枠体２２、及び配線基板１は、別個の部材であってもよいし、一体型の部材であってもよい。 In the electronic component storage package 20, the substrate 21, the frame 22, and the wiring board 1 may be separate components or may be an integrated component.

　その他、上記実施形態で示した細部は、本開示の趣旨を逸脱しない範囲で適宜変更可能である。本発明の範囲は、特許請求の範囲に記載した発明の範囲とその均等の範囲を含む。各実施形態の種々の組み合わせは上述の実施形態の例に限定されない。また、各実施形態同士の組み合わせも可能である。 In addition, the details shown in the above embodiments can be modified as appropriate without departing from the spirit of this disclosure. The scope of the present invention includes the scope of the invention described in the claims and its equivalents. Various combinations of the embodiments are not limited to the examples of the above embodiments. In addition, combinations of the embodiments with each other are also possible.

　本開示は、配線基板、電子部品収納用パッケージ及び電子モジュールに利用することができる。 This disclosure can be used in wiring boards, packages for storing electronic components, and electronic modules.

１　　配線基板
２　　第１絶縁基体
３　　信号導体対
４　　第１信号導体
４ａ　第１直線部
４ｂ　第１区間部
４ｃ　第１屈曲部
４ｄ　第１円弧部
４ｅ　第３円弧部
４ｆ　第１延伸部
５　　第２信号導体
５ａ　第２直線部
５ｂ　第２区間部
５ｃ　第２屈曲部
５ｄ　第２円弧部
５ｅ　第４円弧部
５ｆ　第２延伸部
６　　第１接地導体
７　　第２接地導体
８　　第３接地導体
９　　接地ビア導体
１０　内層導体
１１　第２絶縁基体
１２　第１開口部
１３　第２開口部
２０　電子部品収納用パッケージ
２１　基板
２２　枠体
２３　透光部
２４　シールリング
３０　電子モジュール
３１　マウント部材
３２　電子部品
３３　ボンディングワイヤ
３４　蓋体
４０　外部接続基板
Ｓ１　第１端面
Ｓ２　第２端面
Ｅ１　第１端
Ｅ２　第２端
Ｐ１　第１地点
Ｐ２　第２地点
Ｐ３　第３地点
Ｐ４　第４地点
Ｘ　　第１方向
Ｙ　　第２方向
Ａ　　第３方向 1 Wiring board 2 First insulating base 3 Signal conductor pair 4 First signal conductor 4a First straight portion 4b First section 4c First bend portion 4d First arc portion 4e Third arc portion 4f First extension portion 5 Second signal conductor 5a Second straight portion 5b Second section 5c Second bend portion 5d Second arc portion 5e Fourth arc portion 5f Second extension portion 6 First ground conductor 7 Second ground conductor 8 Third ground conductor 9 Ground via conductor 10 Inner layer conductor 11 Second insulating base 12 First opening 13 Second opening 20 Electronic component storage package 21 Substrate 22 Frame 23 Light-transmitting portion 24 Seal ring 30 Electronic module 31 Mounting member 32 Electronic component 33 Bonding wire 34 Lid 40 External connection substrate S1 First end face S2 Second end face E1 First end E2 Second end P1 First point P2 Second point P3 Third point P4 4th point X 1st direction Y 2nd direction A 3rd direction

Claims

a first insulating base having a first end surface and a second end surface opposed to the first end surface in a first direction;
a signal conductor pair located on the first insulating base from the first end surface side to the second end surface side, the signal conductor pair including a first signal conductor and a second signal conductor;
a first end of the signal conductor pair located on the first end surface side of the first insulating base and a second end of the signal conductor pair located on the second end surface side of the first insulating base are shifted in a second direction intersecting the first direction,
the first signal conductor has a first bent portion at which a distance between the first signal conductor and the second signal conductor changes, and a first straight portion directly connected to a first end side of the first bent portion,
the second signal conductor has a second bent portion at which a distance between the second signal conductor and the first signal conductor changes, and a second straight portion directly connected to a second end side of the second bent portion,
The first linear portion and the second linear portion are positioned parallel to each other,
When viewed from a third direction perpendicular to both the first straight line portion and the second straight line portion, at least a portion of the first straight line portion and at least a portion of the second straight line portion overlap with each other.
Wiring board.

The total length of the first signal conductor is equal to the total length of the second signal conductor.
The wiring board according to claim 1 .

a portion of the first straight line portion that overlaps with the second straight line portion when viewed from the third direction is defined as a first section portion;
a portion of the second straight line portion that overlaps with the first straight line portion when viewed from the third direction is defined as a second section portion;
An end of the first section on the first end side is defined as a first point,
When the end of the second section on the first end side is defined as a second point,
a length of the first signal conductor from the first end to the first point and a length of the second signal conductor from the first end to the second point are equal;
The wiring board according to claim 1 .

An end of the first section on the second end side is defined as a third point,
When the end of the second section on the second end side is defined as a fourth point,
A length of the first signal conductor from the second end to the third point and a length of the second signal conductor from the second end to the fourth point are equal.
The wiring board according to claim 3 .

a portion of the first straight line portion that overlaps with the second straight line portion when viewed from the third direction is defined as a first section portion;
When a portion of the second straight line portion that overlaps with the first straight line portion when viewed from the third direction is defined as a second section portion,
The first section is longer than the first bent portion,
The second section is longer than the second bent portion.
The wiring board according to claim 1 .

The first section is longer than the first bent portion,
The second section is longer than the second bent portion.
The wiring board according to claim 4 .

the first bend portion has a first arc portion that is convex in a direction away from the second signal conductor,
the second bent portion has a second arc portion that is convex in a direction away from the first signal conductor;
The wiring board according to any one of claims 1 to 6.

the first bend portion has a third arc portion that is directly connected to the first arc portion and that is convex in a direction away from the second signal conductor;
the second bend portion has a fourth arc portion that is directly connected to the second arc portion and that is convex in a direction away from the first signal conductor,
The radius of curvature of the first arcuate portion and the radius of curvature of the third arcuate portion are equal,
The radius of curvature of the second arcuate portion and the radius of curvature of the fourth arcuate portion are equal.
The wiring board according to claim 7 .

a first ground conductor and a second ground conductor located on the first insulating base;
the first ground conductor, the first signal conductor, the second signal conductor, and the second ground conductor are arranged in this order;
the first ground conductor is spaced from the first signal conductor and has a portion along the first signal conductor with respect to at least a portion of the first signal conductor;
the second ground conductor is spaced from the second signal conductor and has a portion along the second signal conductor for at least a portion of the second signal conductor;
The wiring board according to any one of claims 1 to 8.

a third ground conductor located on the first insulating base and between the first signal conductor and the second signal conductor;
the third ground conductor is positioned with a gap between the first signal conductor and the second signal conductor, has a portion along the first signal conductor with respect to at least a portion of the first signal conductor, and has a portion along the second signal conductor with respect to at least a portion of the second signal conductor;
The wiring board according to claim 9 .

Further comprising a second insulating base located on the first insulating base.
The wiring board according to any one of claims 1 to 10.

a first extension portion is a portion of the first signal conductor that is closer to the first end than the first straight portion;
When a portion of the second signal conductor closer to the first end than the second bent portion is defined as a second extension portion,
In a plan view, the second insulating base overlaps at least a portion of the first extension portion and at least a portion of the second extension portion.
The wiring board according to claim 11 .

Further comprising an inner layer conductor located within the first insulating base,
The inner layer conductor has a plurality of first openings and a plurality of second openings,
In a plan view, the first openings overlap the first signal conductor and are arranged along the first signal conductor,
In a plan view, the second openings overlap the second signal conductor and are arranged side by side along the second signal conductor.
The wiring board according to any one of claims 1 to 12.

A substrate;
A frame body located on the substrate;
The wiring board according to any one of claims 1 to 13, which is joined to the frame body.
Package for storing electronic components.

The electronic component storage package according to claim 14 ;
an electronic component located on the substrate and electrically connected to the signal conductor pair;
A lid body positioned on the frame body,
Electronic module.