[go: up one dir, main page]

WO2025041710A1 - Procédé de fabrication d'un substrat porteur de film antireflet, et substrat porteur de film antireflet - Google Patents

Procédé de fabrication d'un substrat porteur de film antireflet, et substrat porteur de film antireflet Download PDF

Info

Publication number
WO2025041710A1
WO2025041710A1 PCT/JP2024/029108 JP2024029108W WO2025041710A1 WO 2025041710 A1 WO2025041710 A1 WO 2025041710A1 JP 2024029108 W JP2024029108 W JP 2024029108W WO 2025041710 A1 WO2025041710 A1 WO 2025041710A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
coating
polysiloxane
film
coating liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/029108
Other languages
English (en)
Japanese (ja)
Inventor
和輝 江口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissan Chemical Corp
Original Assignee
Nissan Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Corp filed Critical Nissan Chemical Corp
Publication of WO2025041710A1 publication Critical patent/WO2025041710A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/06—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain multicolour or other optical effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
    • C03C17/30—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/32—Radiation-absorbing paints
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/111—Anti-reflection coatings using layers comprising organic materials

Definitions

  • the present invention relates to a method for producing a substrate with an anti-reflective coating using a coating liquid for film formation that contains primarily polysiloxane obtained by polycondensation of a specific alkoxysilane and has a specific liquid composition, and a substrate having a specific configuration, and to a substrate with an anti-reflective coating obtained by the method.
  • a wet process or a dry process is known as a method for forming a low refractive index film on a substrate, typically a glass substrate. Dry processes include vacuum deposition and CVD, but these methods have problems in terms of productivity and cost.
  • the wet process may be a known method such as spin coating, dip coating, or spray coating.
  • Patent Document 1 discloses a coating liquid for forming a coating for spray coating that contains a specific polysiloxane and a solvent component.
  • display elements to which low-reflection films are applied are mainly large-screen, high-definition display elements.
  • substrates with curved edges are sometimes used.
  • the inventors of the present invention have conducted research and have found that when a conventional coating liquid for forming a film is applied to a substrate having a curved surface, a liquid pool is formed on the outer peripheral edge of the substrate.
  • the object of the present invention is to provide a method for producing a substrate with an anti-reflective coating that can suppress liquid pooling at the outer edge of the substrate, and a substrate with an anti-reflective coating obtained by the method.
  • the present invention includes the following aspects.
  • Substrate (A) A substrate having a first edge formed between a main surface on which a coating film is formed and an end surface of the substrate and having a radius of 0.2 to 3.0 mm, the distance from the outermost periphery of the substrate to which the R-chamfering process has been performed is 0.1 to 2.0 mm; The substrate, wherein a contact point between the R-chamfered surface and a main surface of the substrate on which a coating film is formed does not have a corner due to a step.
  • halogen atoms include fluorine, chlorine, bromine, and iodine atoms, and in each case, * represents a bond.
  • the present invention makes it possible to obtain a substrate with an anti-reflection film that suppresses liquid pooling at the outer edge of the substrate, and also to obtain a display element with excellent design and display quality.
  • FIG. 2 is a local cross-sectional view of the outer periphery of a substrate according to one embodiment of the substrate (A).
  • FIG. 2 is a schematic perspective view of the substrate 11 according to FIG. 1 .
  • 1 is an optical microscope photograph of a cross-sectional shape of an end portion of a substrate I in Example 1.
  • 2 is a schematic cross-sectional view of an end portion of a substrate I in Example 1.
  • FIG. 1 is an optical microscope photograph of a cross-sectional shape of an end portion of a substrate II in Comparative Example 1.
  • 1 is a schematic cross-sectional view of an end portion of a substrate II in Comparative Example 1.
  • FIG. 11 is a schematic cross-sectional view of an end portion of a substrate III in Comparative Example 2.
  • FIG. 1 is an optical microscope photograph of the coating edge in Example 1.
  • 1 is an optical microscope photograph of the coating edge in Comparative Example 1.
  • the anti-reflective coated substrate of the present invention can be obtained by using a coating liquid containing polysiloxane (P) as a polymer component.
  • the structure of the polysiloxane (P) is not particularly limited.
  • the polysiloxane (P) can be obtained, for example, by polycondensation of an alkoxysilane compound component containing an alkoxysilane compound.
  • the polysiloxane (P) may consist of one or more types of polymers.
  • the polysiloxane (P) may be, for example, a polysiloxane having a ureido group and/or a urea bond. With this configuration, an effect is achieved in that a coating with high hardness can be obtained even when firing is performed at a relatively low temperature.
  • the polysiloxane having a ureido group and/or a urea bond can be obtained, for example, by polycondensing an alkoxysilane compound component containing an alkoxysilane compound represented by the following formula (1).
  • R 1 ⁇ Si(OR 1' ) 3 ⁇ p (1)
  • p represents an integer of 1 or 2.
  • R 1 is a p-valent organic group having 2 to 13 carbon atoms and containing a ureido group and/or a urea bond, more preferably a p-valent organic group having 2 to 7 carbon atoms.
  • R 1 is preferably a monovalent organic group in which any hydrogen atom of a hydrocarbon group having 1 to 12 carbon atoms is substituted with a ureido group, more preferably a monovalent organic group in which any hydrogen atom of a hydrocarbon group having 1 to 6 carbon atoms is substituted with a ureido group.
  • R 1 is preferably a divalent organic group in which a urea bond is inserted between any carbon-carbon bond of a hydrocarbon group having 2 to 12 carbon atoms, more preferably a divalent organic group in which a urea bond is inserted between any carbon-carbon bond of a hydrocarbon group having 2 to 6 carbon atoms.
  • R 1' is an alkyl group having 1 to 5 carbon atoms, preferably an alkyl group having 1 to 3 carbon atoms, and more preferably a methyl group or an ethyl group. Multiple R 1's may be the same or different. R 1 and R 1′ may have a linear or branched structure.
  • the alkoxysilane compound is represented by the formula (1-2). (R 1' O) 3 Si-R 1 -Si(OR 1' ) 3 (1-2)
  • alkoxysilane compound represented by formula (1-1) include, but are not limited to, ⁇ -ureidopropyltriethoxysilane, ⁇ -ureidopropyltrimethoxysilane, ⁇ -ureidopropyltripropoxysilane, (R)-N-1-phenylethyl-N'-triethoxysilylpropylurea, (R)-N-1-phenylethyl-N'-trimethoxysilylpropylurea, and the like.
  • ⁇ -ureidopropyltriethoxysilane and ⁇ -ureidopropyltrimethoxysilane are particularly preferred because they are readily available as commercial products.
  • alkoxysilane compounds represented by formula (1-2) are listed below, but are not limited to these.
  • 1,3-bis[3-(triethoxysilyl)propyl]urea, 1,3-bis[2-(triethoxysilyl)ethyl]urea, 1,3-bis[3-(trimethoxysilyl)propyl]urea, 1,3-bis[3-(tripropoxysilyl)propyl]urea, etc. are included.
  • 1,3-bis[3-(triethoxysilyl)propyl]urea is particularly preferred because it is readily available as a commercial product.
  • the amount of the alkoxysilane compound represented by formula (1) used in the total alkoxysilane used to obtain polysiloxane (P) is preferably 0.5 mol% or more, more preferably 1.0 mol% or more, and even more preferably 2.0 mol% or more, from the viewpoint of optimally obtaining the effects of the present invention. Also, from the viewpoint of optimally obtaining the effects of the present invention, it is preferably 60 mol% or less, more preferably 50 mol% or less, and even more preferably 40 mol% or less.
  • the polysiloxane (P) may be a polysiloxane having a fluorine-containing organic group.
  • a fluorine-containing organic group is an organic group in which some or all of the hydrogen atoms of an aliphatic group or aromatic group are substituted with fluorine atoms, specific examples of which include a trifluoropropyl group, a tridecafluorooctyl group, a heptadecafluorodecyl group, and a pentafluorophenyl group.
  • perfluoroalkyl groups are preferred because they are easy to use to obtain a highly transparent coating film, and more preferred are perfluoroalkyl groups having 3 to 15 carbon atoms. Specific examples include a perfluoropropyl group, a perfluorooctyl group, and a perfluorodecyl group.
  • a plurality of polysiloxanes having a fluorine-containing organic group on the side chain may be used in combination.
  • the method for obtaining the polysiloxane having the above-mentioned fluorine-containing organic group on the side chain but it is generally obtained by polycondensation of an alkoxysilane having the above-mentioned organic group on the side chain.
  • polysiloxanes obtained by polycondensation of an alkoxysilane component containing an alkoxysilane compound represented by formula (2a) are preferred.
  • the alkoxysilane compound represented by formula (2a) is an alkoxysilane having the above-mentioned fluorine-containing organic group on the side chain.
  • R2 in formula (2a) represents the above-mentioned fluorine-containing organic group, but the number of fluorine atoms contained in this organic group is not particularly limited.
  • R 2' in formula (2a) represents a hydrocarbon group having 1 to 5 carbon atoms, preferably a saturated hydrocarbon group having 1 to 5 carbon atoms, more preferably a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, a t-butyl group, or an s-butyl group.
  • n- means normal, i- means iso, s- means secondary, and t- means tertiary. Multiple R 2's may be the same or different.
  • alkoxysilane compounds represented by formula (2a) an alkoxysilane compound in which R 2 is a perfluoroalkyl group, or an alkoxysilane compound in which R 2 is an organic group represented by the following formula (2F) is more preferred.
  • k represents an integer of 0 to 12
  • k is preferably an integer of 0 to 8.
  • alkoxysilane compound represented by formula (2a) include 3,3,3-trifluoropropyltrimethoxysilane, 3,3,3-trifluoropropyltriethoxysilane, (1H,1H,2H,2H-tridecafluorooctyl)trimethoxysilane, (1H,1H,2H,2H-tridecafluorooctyl)triethoxysilane, (1H,1H,2H,2H-heptadecafluorodecyl)trimethoxysilane, and (1H,1H,2H,2H-heptadecafluorodecyl)triethoxysilane.
  • the alkoxysilane compounds represented by formula (2a) may be used, but multiple kinds may be used as necessary.
  • the total molar amount of the alkoxysilane compound represented by formula (2a) is preferably 5 mol% or more, more preferably 10 mol% or more, based on the total molar amount of silicon atoms contained in the alkoxysilane compound used in the synthesis of polysiloxane (P). From the viewpoint of obtaining a homogeneous coating solution, it is preferably 40 mol% or less, more preferably 30 mol% or less.
  • Polysiloxane (P) may be a polysiloxane having a fluorine-containing organic group in the direction of the main chain of polysiloxane.
  • an alkoxysilane compound having two trialkoxysilyl groups bonded to a divalent organic group having a fluorine atom may be used as a monomer component for synthesizing such polysiloxane (P).
  • Specific examples of the alkoxysilane compound include the alkoxysilane compound represented by the following formula (2b).
  • R 2b in formula (2b) represents the above-mentioned fluorine-containing organic group, but the number of fluorine atoms contained in this organic group is not particularly limited.
  • R 2b in formula (2b) is preferably a divalent perfluoroalkyl chain or a divalent organic group represented by *-CH 2 -CH 2 -(CF 2 ) p -CH 2 -CH 2 -* (p is an integer of 1 to 12).
  • R 2b' each independently represents a hydrocarbon group having 1 to 5 carbon atoms, preferably a saturated hydrocarbon group having 1 to 5 carbon atoms, more preferably a methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, t-butyl group, or s-butyl group. Multiple R 2b' may be the same or different. Specific examples of the compound of formula (2b) include 1,6-bis(2-trimethoxysilylethyl)dodecafluorohexane and 1,6-bis(2-triethoxysilylethyl)dodecafluorohexane.
  • polysiloxane (P) As a monomer component for obtaining polysiloxane (P), other alkoxysilane compounds may be used in addition to the alkoxysilane compounds represented by the above formula (1) and, if necessary, the above formula (2a) or (2b). Furthermore, the polysiloxane (P) may be a polymer obtained by polycondensation of an alkoxysilane compound component containing only other alkoxysilane compounds. The above other alkoxysilane compounds may be used alone or in combination of two or more kinds.
  • alkoxysilane compound examples include an alkoxysilane compound represented by the following formula (3), an alkoxysilane compound represented by the following formula (4), and an alkoxysilane compound represented by the following formula (5), but are not limited thereto.
  • R 3 n Si(OR 3' ) 4-n (3) (In formula (3), R3 represents a monovalent organic group having no ureido group, no urea bond, and no fluorine atom, R3 ' represents a hydrocarbon group having 1 to 5 carbon atoms, and n represents an integer of 1 to 3.) Si( OR4 ) 4 (4) ( R4 in formula (4) represents a hydrocarbon group.) (R 5' O) 3 Si-R 5 -Si(OR 5' ) 3 (5) (In formula (5), R5 represents a divalent organic group having 1 to 20 carbon atoms that does not contain a ureido group, a urea bond, or a fluorine atom, and R5 ' represents a hydrocarbon group having 1 to 5 carbon atoms.)
  • the number of carbon atoms in R 3 in the above formula (3) is preferably 1 to 20, more preferably 1 to 15. When n is 2 or 3, R 3 may be the same or different. In R 3 ' in formula (3), when n is 1 or 2, R 3 ' may be the same or different. Specific examples of the alkoxysilane represented by formula (3) are shown below, but the invention is not limited thereto.
  • the amount of the alkoxysilane compound represented by formula (3) used in the total alkoxysilane compounds used to obtain polysiloxane (P) is preferably 0.5 mol% or more, more preferably 1.0 mol% or more, and even more preferably 2.0 mol% or more, from the viewpoint of optimally obtaining the effects of the present invention. Also, from the viewpoint of optimally obtaining the effects of the present invention, it is preferably 60 mol% or less, more preferably 50 mol% or less, and even more preferably 40 mol% or less.
  • R 4 in formula (4) represents a hydrocarbon group, and from the viewpoint of increasing reactivity, a saturated hydrocarbon group having 1 to 5 carbon atoms is preferable, and a methyl group, an ethyl group, an n-propyl group, an i-propyl group, an n-butyl group, an i-butyl group, a t-butyl group, or an s-butyl group is more preferable.
  • R 4 may be the same or different.
  • tetraalkoxysilane compound of formula (4) examples include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetrabutoxysilane, etc., which are readily available as commercial products.
  • at least one of the alkoxysilane compounds represented by formula (4) may be used, but multiple types may be used as necessary.
  • the amount of the alkoxysilane compound of formula (4) used is preferably 40 mol % or more, more preferably 50 mol % or more, and more preferably 99 mol % or less, and more preferably 96 mol % or less, based on the total amount of all alkoxysilane compounds used in the synthesis of polysiloxane (P).
  • R 5' is a hydrocarbon group having 1 to 5 carbon atoms, preferably a saturated hydrocarbon group having 1 to 4 carbon atoms, and more preferably a saturated hydrocarbon group having 1 to 3 carbon atoms.
  • R 5' may be the same or different.
  • R5 is a divalent organic group having 1 to 20 carbon atoms that does not have a ureido group, a urea bond, or a fluorine atom, and the divalent organic group may contain a double bond, a triple bond, or a ring structure or a branched structure such as a phenyl group.
  • the divalent organic group may contain a heteroatom such as a nitrogen atom, an oxygen atom, or a fluorine atom.
  • a plurality of types of alkoxysilane compounds represented by formula (5) can be used as necessary.
  • Preferred examples of the alkoxysilane compound represented by formula (5) include dimethyldimethoxysilane and dimethyldiethoxysilane.
  • the amount of the alkoxysilane compound represented by formula (5) used is preferably 1 mol % or more, more preferably 2 mol % or more, based on the total amount of the alkoxysilane compounds used in the synthesis of the polysiloxane (P), and is preferably 30 mol % or less, more preferably 20 mol % or less.
  • the method for polycondensing the polysiloxane (P) used in the present invention is not particularly limited, but may be, for example, a method of hydrolyzing and condensing an alkoxysilane compound in an organic solvent such as alcohols or glycols.
  • the hydrolysis and condensation reaction may be either partial hydrolysis or complete hydrolysis.
  • water may be added in an amount of 0.5 times or more by mole of the total alkoxy groups in the alkoxysilane compound.
  • the amount of water used in the above reaction can be appropriately selected as desired, but is usually 0.1 to 2.5 times, and preferably 0.1 to 2.0 times the molar amount of all alkoxy groups in the alkoxysilane compound.
  • an acid or an alkali may be added as a catalyst.
  • the acid catalyst include inorganic acids such as hydrochloric acid, sulfuric acid, and nitric acid; and organic acids such as acetic acid, oxalic acid, and formic acid.
  • the alkali catalyst include inorganic salts such as sodium and potassium; and various amines (e.g., methylamine, ethylamine, ethanolamine, triethylamine, ammonia, etc.).
  • the amount of the catalyst used in the reaction is preferably 0.001 to 0.05 times by mole, more preferably 0.01 to 0.03 times by mole, based on the total alkoxy groups in the alkoxysilane compound.
  • the hydrolysis and condensation reaction may be accelerated by heating the solution in which the alkoxysilane compound is dissolved.
  • the heating temperature can be appropriately selected as desired, and the reaction system is preferably at 50° C. or higher, and preferably at 180° C. or lower.
  • the heating time can be appropriately selected as desired, and is preferably at least 10 minutes, and more preferably within 24 hours. More preferred reaction conditions include, for example, a method in which the mixture is stirred while being heated at 50° C. for 24 hours, and a method in which the mixture is stirred while being heated under reflux for 2 to 10 hours.
  • a method of heating a mixture of an alkoxysilane compound, a solvent, and an acid can be mentioned.
  • an acid is added to an alcoholic solvent in advance to prepare an alcoholic solution of the acid, and then the solution is mixed with an alkoxysilane and heated.
  • the amount of the acid is preferably 0.2 to 2 mol, and more preferably 0.5 to 2 mol, per mol of the total alkoxy groups in the alkoxysilane compound.
  • heating is preferably performed to a liquid temperature of 50° C. or higher and 180° C. or lower.
  • the reaction time is preferably 10 minutes or longer and 24 hours or shorter.
  • the multiple alkoxysilane compounds may be mixed in advance or may be added sequentially.
  • the concentration of the total amount of silicon atoms of the alkoxysilane compound used in the reaction converted into SiO2 is preferably 20 mass% or less, more preferably 15 mass% or less.
  • the solvent used in polycondensing the alkoxysilane compound is not particularly limited as long as it dissolves the alkoxysilane compound represented by formula (1), the alkoxysilane compound represented by formula (2a), the alkoxysilane compound represented by formula (2b), and the alkoxysilane compounds represented by formulas (3) to (5).
  • alcohols or organic solvents having good compatibility with alcohols are used.
  • organic solvent used when polycondensing the alkoxysilane compound examples include alcohols such as methanol, ethanol, propanol, butanol, and 2-methyl-2,4-pentanediol (also known as hexylene glycol); ethers such as ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monobutyl ether; and ketones such as acetone, methyl ethyl ketone, and methyl isobutyl ketone.
  • alcohols such as methanol, ethanol, propanol, butanol, and 2-methyl-2,4-pentanediol (also known as hexylene glycol)
  • ethers such as ethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monobutyl ether
  • ketones such as acetone, methyl ethyl ketone, and methyl iso
  • the polysiloxane (P) has a polystyrene-equivalent weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) of preferably 500 to 500,000, more preferably 1,000 to 300,000.
  • Mw/Mn polystyrene-equivalent weight average molecular weight measured by gel permeation chromatography
  • the coating liquid (P) of the present invention contains polysiloxane (P) as a polymer component, has a viscosity of 0.3 to 100 mPa ⁇ s, and has a surface tension of 20 to 40 mN/m.
  • the viscosity of the coating liquid is a value measured using an E-type viscometer at a temperature of 25° C.
  • the surface tension of the coating liquid is a value measured by a drop method at a temperature of 25° C.
  • the viscosity of the coating liquid (P) is preferably 0.5 mPa ⁇ s or more, more preferably 0.8 mPa ⁇ s or more, and more preferably 80 mPa ⁇ s or less, and even more preferably 50 mPa ⁇ s or less.
  • the surface tension of the coating liquid (P) is preferably 21 mN/m or more, more preferably 23 mN/m or more, and more preferably 37 mN/m or less, and even more preferably 35 mN/m or less.
  • the coating liquid (P) of the present invention is preferably a coating liquid containing polysiloxane (P) and a solvent.
  • the solvent that can be used in the coating liquid (P) include the following solvents.
  • Alcohols such as methanol, ethanol, 1-propanol, 2-propanol, 1-butanol, 2-butanol, 2-methyl-1-propanol, 2-methyl-2-propanol, hexanol, heptanol, octanol, nonanol, decanol, undecanol, dodecanol, and diacetone alcohol;
  • cyclic alcohols such as cyclopropanol, cyclobutanol, cyclopentanol, cyclohexanol, 2-methylcyclohexanol, cycloheptanol, cyclooctanol, cyclononanol, and cyclodecanol
  • glycols such as ethylene
  • the solvent that can be used in the coating liquid (P) preferably contains one or more solvents selected from the group consisting of cyclic alcohols having 3 to 10 carbon atoms and glycols having 3 to 10 carbon atoms (e.g., ethylene glycol, propanediol, 2-methyl-2,4-pentanediol, etc.).
  • the solvents that can be used in the coating liquid (P) it is preferable to contain one or more glycol ethers having 4 to 8 carbon atoms (for example, the above-mentioned ethers having 4 to 8 carbon atoms are preferable, such as ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monobutyl ether).
  • the above-mentioned ethers having 4 to 8 carbon atoms are preferable, such as ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, and propylene glycol monobutyl ether).
  • the method for preparing the coating liquid (P) is not particularly limited.
  • a simple method is to use the polymerization solution containing polysiloxane (P) (hereinafter referred to as polymerization solution (P)) as is and dilute it by mixing with a solvent.
  • the polymerization solution (P) may be concentrated and diluted by adding a solvent, or it may be replaced with another solvent and then diluted by mixing with a solvent.
  • the content of polysiloxane (P) in the coating liquid (P) is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, in terms of the concentration ( SiO2 equivalent concentration) of the total amount of silicon atoms contained in polysiloxane (P) converted into SiO2 . From the viewpoint of improving the storage stability of the solution, the content is preferably 15% by mass or less, more preferably 8% by mass or less.
  • the content of polysiloxane (P) in the coating liquid (P) is preferably 10 parts by mass or more, and more preferably 20 parts by mass or more, relative to 100 parts by mass of all components excluding the solvent in the coating liquid (P).
  • the content of the polysiloxane (P) is preferably 99.9 parts by mass or less, and more preferably 99 parts by mass or less, per 100 parts by mass of all components in the coating liquid (P) excluding the solvent.
  • the coating liquid (P) may contain other components in addition to the polysiloxane (P) and the solvent.
  • the other components include inorganic fine particles, a filler, a leveling agent, a surface modifier, a surfactant, and the like.
  • the content of the other components may be 0.1 parts by mass or more, or 1 part by mass or more, and may be 90 parts by mass or less, or 80 parts by mass or less, based on 100 parts by mass of all components in the coating liquid (P) excluding the solvent.
  • inorganic fine particles examples include metal oxide fine particles, metal complex oxide fine particles, and magnesium fluoride fine particles.
  • metal oxide fine particles examples include fine particles of silica, alumina, titanium oxide, zirconium oxide, tin oxide, zinc oxide, etc. These may be in the form of beads.
  • metal double oxide fine particles include fine particles of ITO (indium tin oxide), ATO (antimony trioxide), AZO (zinc aluminum oxide), zinc antimonate, and the like.
  • Other examples include hollow silica fine particles and porous silica fine particles. The hollow silica fine particles may be in the form of beads.
  • the inorganic fine particles may be either a powder or a colloidal solution, but a colloidal solution is preferred because it is easier to handle.
  • This colloidal solution may be a dispersion of inorganic fine particle powder in a dispersion medium, or a commercially available colloidal solution.
  • Commercially available inorganic fine particles include organosilica sol (methanol silica sol, MA-ST-S, MA-ST-M, MA-ST-L, MEK-ST-40, TOL-ST, MA-ST-UP, IPA-ST, IPA-ST-UP, MEK-ST-UP, EG-ST, NPC-ST-30, etc.) manufactured by Nissan Chemical Co., Ltd.
  • One type of inorganic fine particle may be used alone, or two or more types may be used in combination.
  • the inorganic fine particles preferably have an average particle size of 0.001 to 0.2 ⁇ m, more preferably 0.001 to 0.1 ⁇ m. If the average particle size of the inorganic fine particles exceeds 0.2 ⁇ m, the transparency of the cured coating film formed from the prepared coating liquid may decrease.
  • the "average particle size” refers to the average primary particle size of inorganic fine particles, and may be determined by a method using a converted particle size from a specific surface area by a nitrogen gas adsorption method (BET method) or a value measured by observation with a transmission electron microscope. In the present invention, however, the average particle size is indicated by the method using a converted particle size from a specific surface area by a nitrogen gas adsorption method (BET method).
  • dispersion media for inorganic fine particles examples include water and organic solvents. From the viewpoint of the stability of the coating solution for forming a film, it is preferable that the pH or pKa of the colloidal solution is adjusted to 2 to 10, and more preferably 3 to 7.
  • organic solvents used as the dispersion medium for the colloidal solution include alcohols such as methanol, ethanol, propanol, and butanol; glycols such as ethylene glycol; ketones such as methyl ethyl ketone and methyl isobutyl ketone; aromatic hydrocarbons such as toluene and xylene; amides such as dimethylformamide and dimethylacetamide; lactams such as N-methylpyrrolidone; esters such as ethyl acetate and butyl acetate; lactones such as ⁇ -butyrolactone; and ethers such as ethylene glycol monopropyl ether, tetrahydrofuran, and 1,4-dioxane.
  • alcohols such as methanol, ethanol, propanol, and butanol
  • glycols such as ethylene glycol
  • ketones such as methyl ethyl ketone and methyl isobutyl ketone
  • alcohols and ketones are preferred.
  • These organic solvents can be used as the dispersion medium either alone or in combination of two or more.
  • the filler, leveling agent, surface modifier, surfactant, and the like may be any known material, and commercial products are particularly preferred because they are easily available.
  • the anti-reflection film-coated substrate of the present invention includes an anti-reflection film.
  • the anti-reflection film of the present invention is formed using the above-mentioned coating liquid (P).
  • One embodiment of the antireflective film of the present invention is A step (1) of applying the coating liquid (P) to a substrate (A) to form a coating film; and (2) curing the coating film by baking.
  • Substrate (A) A substrate having a first edge formed between a main surface on which a coating film is formed and an end surface of the substrate and having a radius of 0.2 to 3.0 mm, The substrate, wherein the distance from the outermost periphery of the substrate where the R-chamfering is performed is 0.1 to 2.0 mm.
  • the substrate (A) in the present invention has the above-mentioned configuration. According to the above-mentioned configuration, by performing chamfering on the first edge angle formed by the main surface of the substrate on which the coating film is formed and the substrate end face, it is possible to obtain a substrate with an anti-reflection film capable of suppressing liquid pooling at the outer peripheral edge portion of the substrate. Furthermore, according to the above configuration, of the first and second edge angles formed by both main surfaces of the substrate and the substrate end faces, R-chamfering is performed on only one of the edge angles, which has the advantage of reducing the number of manufacturing processes for the substrate compared to the case where R-chamfering is performed on both of the two edge angles.
  • a first edge angle formed between one main surface of the substrate and the substrate end surface and a second edge angle formed between the other main surface of the substrate and the substrate end surface may be subjected to R-chamfering.
  • a first edge angle and a second edge angle formed between both main surfaces of the substrate and the substrate end surface may be subjected to R-chamfering with different radii.
  • R chamfering may be performed on a first edge angle formed between one main surface of the substrate and the substrate end face
  • C chamfering may be performed on a second edge angle formed between the other main surface of the substrate and the substrate end face.
  • Fig. 1 shows a local cross-sectional view of the outer periphery of a substrate according to one embodiment of the substrate (A).
  • the dotted line indicates the shape of the ridge 15a before the R-chamfering process.
  • the upper side of the substrate 11 (the surface including the ridge 15a) is the coating surface 11a side, and the lower side of the substrate 11 is the back surface 11b opposite to the coating surface 11a.
  • the coating surface 11a side the coating surface 11a side
  • the lower side of the substrate 11 is the back surface 11b opposite to the coating surface 11a.
  • the center of the R-chamfering process performed on the ridge 15a is positioned on the normal line of the coating surface 11a that passes through the contact point 17a.
  • the center of the R chamfering applied to the edge 15a is at position C1 on the imaginary dotted line T1-T1, which indicates a position in the cross section of the thickness direction of the substrate 11 that is greater than or equal to the thickness t of the substrate 11 and less than twice the thickness t.
  • the R-chamfering is performed within an area of distance L1 from the outermost periphery of the substrate.
  • the radius r1a is 0.2 to 3.0 mm, and from the viewpoint of suitably obtaining the effects of the present invention, it is preferably 0.3 to 2.8 mm, and more preferably 0.5 to 2.6 mm.
  • the distance L1 from the outermost periphery of the substrate is 0.1 to 2.0 mm, and from the viewpoint of suitably obtaining the effects of the present invention, it is preferably 0.1 to 1.8 mm, and more preferably 0.2 to 1.6 mm.
  • FIG. 2 shows a schematic perspective view of the substrate 11 shown in FIG. 1.
  • Some or all of the corners of the substrate may be subjected to R-chamfering. With this configuration, it is possible to form gently curved R-chamfered surfaces at each corner.
  • Materials for the substrate (A) include known or well-known materials such as plastics, glass, ceramics, etc.
  • plastics include polycarbonate, poly(meth)acrylate, polyethersulfone, polyarylate, polyurethane, polysulfone, polyether, polyetherketone, trimethylpentene, polyolefin, polyethylene terephthalate, (meth)acrylonitrile, triacetyl cellulose, diacetyl cellulose, triacetyl cellulose (TAC), acetate butyrate cellulose, etc.
  • glass, polycarbonate, poly(meth)acrylate, polyethylene terephthalate, and triacetyl cellulose are preferred, and glass, polycarbonate, and poly(meth)acrylate are more preferred.
  • the coating liquid (P) can be applied to form a coating film by applying a commonly used coating method.
  • coating methods include dip coating, spin coating, spray coating, slit coating, brush coating, roll transfer, screen printing, inkjet printing, and flexographic printing.
  • spray coating is used for coating a substrate with an anti-reflective film.
  • the spray coating method involves dropping fine droplets onto a substrate and forming a film by the liquid wetting and spreading, and has the advantages of being independent of the substrate and minimizing waste of coating liquid.
  • Spray coating methods include two-fluid spray method, electrostatic spray method, ultrasonic spray method, etc.
  • the two-fluid spray method is mainly used for the surface treatment of displays from the viewpoints of simplicity, large area coating, etc.
  • the thickness of the coating film can be adjusted by the liquid amount, gas pressure (gas flow rate), nozzle/stage distance (the distance between the nozzle and the stage), coating speed, etc.
  • the amount of liquid is a parameter that determines the film thickness; increasing the amount of liquid makes the film thicker, and decreasing the amount of liquid makes the film thinner.
  • the amount of liquid is, for example, 0.5 to 20 mL (milliliters)/min, and preferably 1 to 12 mL/min.
  • the gas pressure or gas flow rate is a parameter for forming fine droplets, and examples of the gas used include, but are not limited to, N2 and dry air.
  • the gas pressure is, for example, 50 to 800 kPa, and preferably 100 to 700 kPa.
  • the gas flow rate is, for example, 3 to 80 L (liters)/min, and preferably 8 to 70 L/min.
  • the gas pressure and gas flow rate vary depending on the diameter of the nozzle used, and therefore need to be managed according to the type of nozzle used.
  • the nozzle/stage distance is a parameter related to film thickness and applicability; the closer the distance, the thicker the film will be, and the farther the distance, the thinner the film will be. From the standpoint of film thickness and applicability, the nozzle/stage distance is, for example, 5 to 200 mm, and preferably 30 to 150 mm.
  • the coating speed is a parameter related to the film thickness; a faster speed results in a thinner film thickness, and a slower speed results in a thicker film thickness.
  • the coating speed is, for example, 10 to 2000 mm/s, and preferably 30 to 1500 mm/s.
  • the thickness of the coating formed on the substrate can be adjusted by the above-mentioned parameters during coating, but can also be easily adjusted by the SiO2 equivalent concentration of the coating solution.
  • the drying step for drying the solvent is not necessarily required, but it is preferable to include the drying step when the time from coating to baking is not constant for each substrate, or when baking is not performed immediately after coating. This drying is sufficient as long as the solvent is removed to an extent that the coating film shape is not deformed by transportation of the substrate, and the drying method is not particularly limited. For example, a method of drying for 0.5 to 30 minutes, preferably 1 to 5 minutes, on a hot plate at a drying temperature of 30 to 150°C, preferably 40 to 100°C, can be mentioned. The coating film formed by the above method can be baked to form a cured film.
  • the baking temperature can be any temperature between 90 and 400°C, but is preferably between 120 and 300°C, more preferably between 150 and 270°C, and even more preferably between 160 and 250°C. Heating can be performed by a conventional method, such as using a hot plate, a hot air circulation oven, a far-infrared heating furnace (IR oven), a belt furnace, or the like.
  • the coating thus obtained is characterized by good film-forming properties and high transmittance.
  • step (3) a step of exposing the coating film cured in the step (2) (hereinafter also referred to as step (3)) may be carried out.
  • the light to be irradiated may be, for example, ultraviolet light having a wavelength of 150 to 800 nm or visible light, with ultraviolet light having a wavelength of 300 to 400 nm being preferred.
  • Examples of light sources for the irradiation light include low-pressure mercury lamps, high-pressure mercury lamps, Deep UV lamps, deuterium lamps, metal halide lamps, argon resonance lamps, xenon lamps, mercury-xenon lamps, excimer lasers (e.g., KrF excimer lasers), fluorescent lamps, LED lamps, halogen lamps (e.g., sodium lamps), and microwave-excited electrodeless lamps.
  • the amount of light irradiation is preferably 1,000 to 200,000 J/ m2 , and more preferably 1,000 to 100,000 J/ m2 .
  • a substrate having a higher refractive index than that of the coating such as ordinary glass or a film
  • the coating is effective as a single coating on the substrate surface, but it is also effective to use the coating as an anti-reflective laminate in which a coating is formed on an underlayer coating having a high refractive index.
  • the antireflection film of the present invention preferably has an average luminous reflectance for visible light having a wavelength of 380 nm to 800 nm of 3.0% or less, and more preferably 2.0% or less.
  • the average luminous reflectance is obtained from the spectral reflectance curve.
  • the spectral reflectance curve is obtained after the surface of the anti-reflection substrate opposite to the low refractive index layer is matte-treated with black paint or a black film is attached, and the incident angle from the perpendicular direction to the surface of the low refractive index layer is set to 5 degrees, a C light source is used as the light source, and the average luminous reflectance is the reflectance value obtained by calibrating the reflectance of each wavelength of visible light by the relative luminous efficiency and averaging it.
  • the relative luminous efficiency is the standard relative luminous efficiency for photopic vision.
  • the width of the liquid pool at the outer edge of the substrate (the width of the liquid pool from the outermost periphery of the coating surface) a is preferably 0.7 mm or less, and even more preferably 0.4 mm or less.
  • the coating liquid (P) of the present invention can form an anti-reflection film having excellent film-forming properties. Therefore, the film can be suitably used in fields where anti-reflection of light is desired, such as glass cathode ray tubes; displays of televisions, computers, car navigation systems, mobile phones, etc.; mirrors having a glass surface; glass showcases, solar cells, etc.
  • it is useful for anti-reflection applications such as liquid crystal displays, plasma displays, projection displays, EL (Electro Luminescence) displays, SEDs (Surface-conduction Electron-emitter Displays), FETs (Field Emission Displays), CRTs (Cathode Ray Tubes), and solar cells.
  • TEOS Tetraethoxysilane F13: Tridecafluorooctyltrimethoxysilane UPS: ⁇ -ureidopropyltriethoxysilane MeOH: Methanol PG: Propylene glycol NMP: N-methyl-2-pyrrolidone
  • Example 1 The coating solution KL1 obtained in Preparation Example 1 was spray-coated on the substrate I described below under the conditions described below so that the film thickness after baking would be 100 nm, and then the substrate I was baked under the baking conditions described below to obtain a substrate S-1 with an anti-reflection film.
  • ⁇ Comparative Example 1> The same procedure as in Example 1 was carried out except that the substrate used was changed from Substrate I to Substrate II, thereby obtaining a substrate R-1 with an anti-reflection film.
  • ⁇ Comparative Example 2> The same procedure as in Example 1 was carried out except that the substrate used was changed from Substrate I to Substrate III, thereby obtaining a substrate R-2 with an anti-reflection film.
  • Spray coating was carried out using the following equipment and conditions.
  • Device name Spray coater API-240-3D manufactured by Apiros Co., Ltd. ⁇ Coating conditions> Nozzle type: LPVN45, nozzle height: 100 mm, Y-axis pitch: 7 mm, air pressure: 470 kPa, chemical flow rate: 4.9 mL/min, nozzle speed: 170 mm/sec
  • the coating was dried on a hot plate at 40° C. for 5 minutes and then baked in a hot air circulating oven at 200° C. for 30 minutes.
  • a soda lime glass manufactured by Matsunami Glass Industry Co., Ltd.
  • the edges of the substrate I were chamfered.
  • the chamfering was performed on the front surface in an area 1.5 mm from the outermost periphery of the substrate (R surface processing, radius 2.5 mm), and on the back surface in an area 0.1 mm from the outermost periphery of the substrate (R surface processing).
  • Fig. 3-1 shows an optical microscope photograph of the cross-sectional shape of the end portion of the substrate I.
  • 3-2 shows a schematic cross-sectional view of the end portion of the substrate I.
  • substrate II a soda lime glass (manufactured by Nippon Sheet Glass Co., Ltd.) having a size of 100 mm ⁇ 100 mm ⁇ thickness of 0.7 mm was used. Chamfering the edges (front and back surfaces are chamfered)
  • Fig. 4-1 An optical microscope photograph of the cross-sectional shape of the end portion of the substrate II is shown in Fig. 4-1, and a schematic cross-sectional view of the end portion of the substrate II is shown in Fig. 4-2.
  • Substrate III is a substrate having an edge that is R-chamfered, and the center c of the R-chamfering is not located on a normal line s passing through the contact point between the R-chamfered surface and the coating surface.
  • the cross-sectional shape of the edge of substrate III is shown in FIG.
  • a black film (Kukkiri Miel, manufactured by Tomoegawa Paper Co., Ltd.) was attached to the back surface (uncoated surface) of the anti-reflection film-coated substrate prepared in Example 1, and the reflectance was measured in the wavelength range of 380 nm to 800 nm at a light incidence angle of 5° using a UV-3600 ultraviolet-visible-near infrared spectrophotometer manufactured by Shimadzu Corporation, and the average luminous reflectance of one surface (coated surface) was calculated from the obtained spectral reflectance curve in accordance with JIS R 3106. The average luminous reflectance (coated surface) was 1.6%.
  • the present invention has excellent anti-reflection performance and improves the visibility of unevenness at the edge of the substrate, which is expected to improve quality, and is therefore expected to be used in display cover lenses, etc.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Paints Or Removers (AREA)

Abstract

L'invention propose : un procédé de fabrication d'un substrat porteur de film antireflet, le procédé pouvant fournir un substrat porteur de film antireflet qui peut supprimer l'accumulation de liquide au niveau d'un bord périphérique externe du substrat ; et un substrat porteur de film antireflet fourni par le présent procédé de fabrication.　Le procédé de fabrication d'un substrat porteur de film antireflet comprend : une étape (1) de formation d'un film de revêtement par l'application du liquide de revêtement (P) sur le substrat suivant (A) ; et une étape (2) de durcissement du film de revêtement par cuisson.　Liquide de revêtement (P) : un liquide de revêtement contenant un polysiloxane (P) en tant que composant polymère, le liquide de revêtement présentant une viscosité de 0,3 à 100 mPa·s et une tension superficielle de 20 à 40 mN/m.　Substrat (A) : le substrat présente un traitement de chanfreinage R exécuté à un premier angle de coin qui est formé entre une surface d'extrémité de substrat et une surface principale de substrat sur laquelle le film de revêtement est formé, le rayon du traitement de chanfreinage R étant de 0,2 à 3,0 mm, la distance à partir de la partie périphérique la plus à l'extérieur du substrat, où le traitement de chanfreinage R a été effectué, étant de 0,1 à 2,0 mm, et le point de contact entre la surface chanfreinée R et la surface principale de substrat sur laquelle le film de revêtement est formé ne présentant pas d'angle en raison d'une différence de niveau.
PCT/JP2024/029108 2023-08-22 2024-08-15 Procédé de fabrication d'un substrat porteur de film antireflet, et substrat porteur de film antireflet Pending WO2025041710A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-134905 2023-08-22
JP2023134905 2023-08-22

Publications (1)

Publication Number Publication Date
WO2025041710A1 true WO2025041710A1 (fr) 2025-02-27

Family

ID=94732172

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2024/029108 Pending WO2025041710A1 (fr) 2023-08-22 2024-08-15 Procédé de fabrication d'un substrat porteur de film antireflet, et substrat porteur de film antireflet

Country Status (1)

Country Link
WO (1) WO2025041710A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008096511A (ja) * 2006-10-06 2008-04-24 Seiko Epson Corp メガネレンズの製造方法
JP2009058640A (ja) * 2007-08-30 2009-03-19 Asahi Glass Co Ltd アンチグレア層を有する物品およびその製造方法
WO2011136370A1 (fr) * 2010-04-30 2011-11-03 日産化学工業株式会社 Solution d'application pour former un film de revêtement à appliquer par pulvérisation et film de revêtement
JP2015107453A (ja) * 2013-12-04 2015-06-11 旭化成株式会社 機能性膜の製造方法及び機能性膜
JP2017131857A (ja) * 2016-01-29 2017-08-03 ダイアモールディング株式会社 フロントパネルの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008096511A (ja) * 2006-10-06 2008-04-24 Seiko Epson Corp メガネレンズの製造方法
JP2009058640A (ja) * 2007-08-30 2009-03-19 Asahi Glass Co Ltd アンチグレア層を有する物品およびその製造方法
WO2011136370A1 (fr) * 2010-04-30 2011-11-03 日産化学工業株式会社 Solution d'application pour former un film de revêtement à appliquer par pulvérisation et film de revêtement
JP2015107453A (ja) * 2013-12-04 2015-06-11 旭化成株式会社 機能性膜の製造方法及び機能性膜
JP2017131857A (ja) * 2016-01-29 2017-08-03 ダイアモールディング株式会社 フロントパネルの製造方法

Similar Documents

Publication Publication Date Title
JP4107050B2 (ja) コーティング材組成物及びそれにより形成された被膜を有する物品
US9644113B2 (en) Composition for forming a thin layer with low refractive index, manufacturing method thereof, and manufacturing method of a thin layer with low refractive index
WO2017022638A1 (fr) Substrat de verre approprié en tant que verre de protection, etc., d'un dispositif d'affichage mobile
CN101535430B (zh) 低折射率被膜形成用涂布液及其制造方法以及防反射材料
JP7606163B2 (ja) 防眩層付基材及び画像表示装置並びに防眩層付基材の製造方法
CN101522839B (zh) 低折射率被膜形成用涂布液、其制造方法及防反射材料
JP5293180B2 (ja) リン酸エステル化合物を含有する被膜形成用塗布液及び反射防止膜
JP2020122809A (ja) 可視光散乱性被膜形成用塗布液、及び可視光散乱性被膜形成基材
JP5910494B2 (ja) スプレー塗布用の反射防止被膜形成用塗布液
WO2015166863A1 (fr) Composition liquide, et composant en verre
WO2025041710A1 (fr) Procédé de fabrication d'un substrat porteur de film antireflet, et substrat porteur de film antireflet
KR20150131499A (ko) 저굴절률막 형성용 조성물 및 그 제조 방법 그리고 저굴절률막의 형성 방법
WO2025041708A1 (fr) Procédé de fabrication de substrat à film antireflet, et substrat à film antireflet
JP5310549B2 (ja) 低屈折率被膜形成用塗布液、その製造方法及び反射防止材
JP5531614B2 (ja) メルカプト基で修飾したポリシロキサンを含有する反射防止被膜形成用塗布液
JP7583372B2 (ja) 防眩性被膜形成用塗布液、防眩性被膜及びそれを有する積層体
EP2937319B1 (fr) Procédé de fabrication d'une composition pour la formation d'une couche mince à faible indice de réfraction, et procédé de fabrication d'une couche mince à faible indice de réfraction

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24856400

Country of ref document: EP

Kind code of ref document: A1