WO2024234852A1 - Heating assembly, atomizer, and electronic atomization apparatus - Google Patents

Abstract

The present application discloses a heating assembly, an atomizer, and an electronic atomization apparatus. The heating assembly comprises: a base; the base comprises a liquid absorption face and an atomization face which are disposed opposite to one another, and the base has disposed thereon at least one liquid guide channel which passes through the liquid absorption face and the atomization face; wherein each liquid guide channel comprises at least two liquid guide holes, the liquid guide holes passing through the liquid absorption face and the atomization face; openings of two neighboring liquid guide holes of a liquid guide channel overlap one another on the atomization face, but are spaced apart from one another on the liquid absorption face. Having the openings of two neighboring liquid guide holes of a liquid guide channel overlap one another on the atomization face increases the volume porosity on the atomization face, thereby improving the liquid supply effect and ensuring sufficient liquid supply; and having the openings of two neighboring liquid guide holes of a liquid guide channel be spaced apart from one another on the liquid absorption face avoids excess liquid supply to the atomization face, thereby avoiding burnt liquid and helping to reduce air return during heating and atomization.

Description

Heating components, atomizers and electronic atomization devices

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority based on Chinese patent application 202321201643.3 filed on May 17, 2023, and all its contents are incorporated herein by reference.

Technical Field

The present application relates to the technical field of electronic atomization, and in particular to a heating component, an atomizer and an electronic atomization device.

Background Art

The electronic atomization device is composed of a heating component, a battery, a control circuit and other parts. The heating component is the core component of the electronic atomization device, and its characteristics determine the atomization effect and user experience of the electronic atomization device.

The more common atomization method of existing heating components is resistive heating. Specifically, the heating component includes a substrate and a heating film arranged on the surface of the substrate; wherein, the substrate is provided with a plurality of through holes, and the through holes are used to guide the aerosol to generate the matrix. The multiple through holes are distributed independently of each other. When the aperture of the through hole is small, the liquid conduction resistance is large, and it is easy to have insufficient liquid supply or gas return, causing the heating film to burn out; when the aperture of the through hole is large, the liquid supply is sufficient, and it is easy to have liquid explosion accompanied by noise.

Summary of the invention

The heating component, atomizer and electronic atomization device provided in the present application can reduce the return air and avoid the explosion of liquid while ensuring sufficient liquid supply.

In order to solve the above-mentioned technical problems, the first technical solution provided in the present application is: to provide a heating component, applied to an electronic atomization device, for atomizing an aerosol to generate a matrix, the heating component includes a substrate, the substrate includes a liquid absorption surface and an atomization surface arranged opposite to each other; the substrate is provided with at least one liquid conduction channel passing through the liquid absorption surface and the atomization surface; wherein the liquid conduction channel includes at least two liquid conduction holes, the liquid conduction holes passing through the liquid absorption surface and the atomization surface; the ports of two adjacent liquid conduction holes in the liquid conduction channel located on the atomization surface overlap with each other, and the ports located on the liquid absorption surface are arranged at intervals from each other.

In one embodiment, the cross-sectional shape of the liquid guiding hole is the same at all locations; and the cross-sectional area of the liquid guiding hole gradually decreases along the direction from the atomization surface to the liquid absorption surface.

In one embodiment, the longitudinal section of the liquid guiding hole is an isosceles trapezoid, and the cross-sectional shape of the liquid guiding hole is a circle.

In one embodiment, the substrate is provided with a plurality of the liquid conducting channels. The fluid conducting channels are arranged in multiple rows and columns.

In one embodiment, the spacing between any two adjacent rows of the liquid-conducting channels is the same, and the spacing between any two adjacent columns of the liquid-conducting channels is the same.

In one embodiment, the number of the liquid conducting holes in each of the liquid conducting channels is the same.

In one embodiment, all of the liquid conducting holes in each of the liquid conducting channels in the same row are arranged in a one-dimensional array.

In one embodiment, the center distance between adjacent liquid conducting holes in the liquid conducting channel is greater than or equal to 20 μm and less than or equal to 60 μm; and/or the center distance between two adjacent rows of liquid conducting channels is greater than or equal to 60 μm and less than or equal to 140 μm.

In one embodiment, the equivalent diameter of the liquid guide hole located at the atomization surface is greater than or equal to 30 μm and less than or equal to 70 μm; and/or the equivalent diameter of the liquid guide hole located at the liquid absorption surface is greater than or equal to 10 μm and less than or equal to 50 μm.

In one embodiment, the matrix is a dense matrix or a porous matrix.

In one embodiment, the substrate is a dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or,

The substrate is a porous substrate, and the material of the substrate is porous ceramic.

In one embodiment, the thickness of the substrate is 0.5 mm-2.5 mm.

In one embodiment, the heating component also includes a heating layer, a pin conductive layer and a protective layer; the heating layer is arranged on the atomized surface; a pin conductive layer is respectively provided at two opposite ends of the heating layer, and the pin conductive layer is connected to the heating layer; the protective layer is arranged on the surface of the heating layer away from the substrate, and the protective layer is used to protect the heating layer.

In one embodiment, the substrate includes a microporous area and a blank area adjacent to the microporous area; the microporous area is provided with a plurality of the liquid conduction holes; the blank area is not provided with the liquid conduction holes; the heat generating layer is at least partially provided in the microporous area, and the pin conductive layer is at least partially provided in the blank area.

In order to solve the above technical problems, the second technical solution provided in the present application is: to provide a nebulizer, comprising a liquid storage chamber and a heating component; the liquid storage chamber is used to store an aerosol generating matrix; the heating component is fluidly connected to the liquid storage chamber, and the heating component is used to atomize the aerosol generating matrix; the heating component is a heating component described in any one of the above.

In order to solve the above technical problems, the third technical solution provided in this application is: to provide an electronic atomization device, comprising: the atomizer and the host as described above; the host is used to provide electrical energy for the heating component of the atomizer and control the heating component of the atomizer to atomize the aerosol generating matrix.

Beneficial effects of the present application: Different from the prior art, the present application discloses a heating component, an atomizer and an electronic atomization device; the heating component comprises a substrate; the substrate comprises a liquid absorbing surface and an atomizing surface arranged opposite to each other, and the substrate is provided with at least one liquid guide penetrating the liquid absorbing surface and the atomizing surface Channel; wherein the liquid guiding channel includes at least two liquid guiding holes, which penetrate the liquid suction surface and the atomization surface; the ports of two adjacent liquid guiding holes in the liquid guiding channel located on the atomization surface overlap each other, and the ports located on the liquid suction surface are arranged at intervals. By making the ports of two adjacent liquid guiding holes in the liquid guiding channel located on the atomization surface overlap each other, the volume porosity on the atomization surface is increased, the liquid supply effect is improved, and sufficient liquid supply is ensured; by making the ports of two adjacent liquid guiding holes in the liquid guiding channel located on the liquid suction surface be arranged at intervals, the liquid supply on the atomization surface is avoided to be too large, thereby avoiding liquid explosion, and helping to reduce return air during heating atomization.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

FIG1 is a schematic structural diagram of an embodiment of an electronic atomization device provided by the present application;

FIG2 is a schematic diagram of the structure of an atomizer provided in one embodiment of the present application;

FIG3 is a schematic diagram of the structure of a heating component provided in an embodiment of the present application;

FIG4 is a schematic cross-sectional view of the heating component shown in FIG3 along line A-A;

FIG5a is a schematic diagram of a partial structure of an embodiment of a base of the heating component shown in FIG3 ;

Fig. 5b is a schematic cross-sectional view of the substrate shown in Fig. 5a along line B-B;

FIG6a is a schematic diagram of a partial structure of another embodiment of the base of the heating component shown in FIG3 ;

Fig. 6b is a schematic cross-sectional view of the substrate shown in Fig. 6a along line C-C;

FIG7a is a schematic diagram of a partial structure of another embodiment of the base of the heating component shown in FIG3 ;

Fig. 7b is a schematic cross-sectional view of the substrate shown in Fig. 7a along line D-D;

FIG8a is a schematic top view of another embodiment of the base of the heating component shown in FIG3 ;

Fig. 8b is a schematic cross-sectional view of the substrate shown in Fig. 8a along line E-E;

FIG9 is a schematic top view of another embodiment of the base of the heating component shown in FIG3 ;

FIG10 is a schematic top view of another embodiment of the base of the heating component shown in FIG3 ;

FIG11 is a schematic top view of another embodiment of the base of the heating component shown in FIG3 ;

FIG12 is a schematic top view of another embodiment of the base of the heating component shown in FIG3 ;

FIG. 13 is a top view of another embodiment of the base of the heating component shown in FIG. 3 intention;

FIG. 14 is a comparison diagram of the atomization amount of different embodiments of the substrate.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures, interfaces, and technologies are provided to facilitate a thorough understanding of the present application.

The terms "first", "second", and "third" in this application are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first", "second", and "third" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. All directional indications in the embodiments of this application (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. The terms "including" and "having" in the embodiments of this application and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or components inherent to these processes, methods, products, or devices.

Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

The present application is described in detail below with reference to the accompanying drawings and embodiments.

Please refer to FIG. 1 , which is a schematic structural diagram of an embodiment of an electronic atomization device provided in the present application.

In this embodiment, an electronic atomization device 100 is provided. The electronic atomization device 100 can be used for atomization of an aerosol-generating substrate. The electronic atomization device 100 includes an atomizer 1 and a host 2 that are electrically connected to each other.

The atomizer 1 is used to store the aerosol-generating substrate and atomize the aerosol-generating substrate to form an aerosol that can be inhaled by the user. The atomizer 1 can be used in different fields, such as medical treatment, beauty, leisure inhalation, etc. In a specific embodiment, the atomizer 1 can be It is used in an electronic aerosolization device to atomize an aerosol-generating matrix and generate an aerosol for a smoker to inhale. The following embodiments all take this leisure smoking as an example.

The specific structure and function of the atomizer 1 may refer to the specific structure and function of the atomizer 1 involved in the following embodiments, and the same or similar technical effects can be achieved, which will not be repeated here.

The host 2 includes a battery (not shown) and a controller (not shown). The battery is used to provide electrical energy for the operation of the atomizer 1, so that the atomizer 1 can atomize the aerosol-generating substrate to form an aerosol; the controller is used to control the operation of the atomizer 1, that is, to control the atomizer 1 to atomize the aerosol-generating substrate. The host 2 also includes other components such as a battery holder and an airflow sensor.

The atomizer 1 and the host 2 can be integrally arranged or detachably connected, and can be designed according to specific needs.

Please refer to FIG. 2 , which is a schematic diagram of the structure of an atomizer provided in an embodiment of the present application.

The atomizer 1 includes a housing 10, a heating component 11, and an atomizer seat 12. The atomizer seat 12 has an installation cavity (not shown), and the heating component 11 is arranged in the installation cavity; the heating component 11 and the atomizer seat 12 are arranged in the housing 10 together. The housing 10 is formed with a mist outlet channel 13, and the inner surface of the housing 10, the outer surface of the mist outlet channel 13 and the top surface of the atomizer seat 12 cooperate to form a liquid storage cavity 14, which is used to store liquid aerosol generating matrix. Among them, the heating component 11 is electrically connected to the host 2 to generate aerosol by atomizing the aerosol generating matrix.

The atomizing seat 12 includes an upper seat 121 and a lower seat 122, and the upper seat 121 and the lower seat 122 cooperate to form an installation cavity; the surface of the heating component 11 away from the liquid storage cavity 14 cooperates with the cavity wall of the installation cavity to form an atomizing cavity 120. A lower liquid channel 1211 is provided on the upper seat 121; the aerosol generating matrix channel in the liquid storage cavity 14 flows into the heating component 11 through the lower liquid channel 1211, that is, the heating component 11 is in fluid communication with the liquid storage cavity 14. An air inlet channel 15 is provided on the lower seat 122, and external gas enters the atomizing cavity 120 through the air inlet channel 15, carrying the aerosol atomized by the heating component 11 to flow to the mist outlet channel 13, and the user inhales the aerosol through the port of the mist outlet channel 13.

Please refer to Figures 3 to 13. Figure 3 is a schematic diagram of the structure of a heating component provided in an embodiment of the present application. Figure 4 is a schematic diagram of a cross-section of the heating component shown in Figure 3 along the A-A line. Figure 5a is a schematic diagram of a partial structure of an embodiment of a substrate of the heating component shown in Figure 3. Figure 5b is a schematic diagram of a cross-section of the substrate shown in Figure 5a along the B-B line. Figure 6a is a schematic diagram of a partial structure of another embodiment of the substrate of the heating component shown in Figure 3. Figure 6b is a schematic diagram of a cross-section of the substrate shown in Figure 6a along the C-C line. Figure 7a is a schematic diagram of a partial structure of another embodiment of the substrate of the heating component shown in Figure 3. Figure 7b is a schematic diagram of a cross-section of the substrate shown in Figure 7a along the D-D line. Figure 8a is a schematic diagram of a partial structure of another embodiment of the substrate of the heating component shown in Figure 3. Figure 8b is a schematic diagram of a cross-section of the substrate shown in Figure 8a along the E-E line. Figure 9 is a schematic diagram of a top view of the structure of another embodiment of the substrate of the heating component shown in Figure 3. Figure 10 is a schematic diagram of a top view of the structure of another embodiment of the substrate of the heating component shown in Figure 3.

Figure 11 is a top view structural schematic diagram of another embodiment of the base of the heating component shown in Figure 3, Figure 12 is a top view structural schematic diagram of another embodiment of the base of the heating component shown in Figure 3, and Figure 13 is a top view structural schematic diagram of another embodiment of the base of the heating component shown in Figure 3.

The heating component 11 includes a substrate 111. The substrate 111 includes a liquid absorption surface 1111 and an atomization surface 1112 that are arranged opposite to each other. The substrate 111 is provided with at least one liquid guide channel 1113 that penetrates the liquid absorption surface 1111 and the atomization surface 1112. The liquid guide channel 1113 includes at least two liquid guide holes 1113a, and the liquid guide holes 1113a penetrate the liquid absorption surface 1111 and the atomization surface 1112. The liquid guide holes 1113a have capillary force, and the liquid guide holes 1113a are used to guide the aerosol generation matrix from the liquid absorption surface 1111 to the atomization surface 1112; that is, the liquid guide channel 1113 is used to guide the aerosol generation matrix from the liquid absorption surface 1111 to the atomization surface 1112. Among them, the liquid guide hole 1113a extends along a straight line.

In this embodiment, the ports of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 on the atomizing surface 1112 overlap each other, and the ports of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 on the liquid suction surface 1111 are arranged at intervals. Since the ports of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 on the atomizing surface 1112 overlap each other, the two adjacent liquid guide holes 1113a in the liquid guide channel 1113 are connected to each other. The ports of the two liquid guide holes 1113a on the atomizing surface 1112 overlap each other, which means that the ports of the two liquid guide holes 1113a on the atomizing surface 1112 overlap partially, so that the hole sections of the two liquid guide holes 1113a close to the atomizing surface 1112 are partially connected. For example, referring to Figure 5b, the parts of the two liquid guide holes 1113a above the dotted line L are connected to each other, and the parts of the two liquid guide holes 1113a below the dotted line L are independent of each other.

By making the ports of two adjacent liquid guide holes 1113a in the liquid guide channel 1113 on the atomizing surface 1112 overlap with each other, and providing at least one liquid guide channel 1113 on the substrate 111, the volume porosity on the atomizing surface 1112 is increased, the liquid supply effect is improved, and sufficient liquid supply is ensured, which is beneficial to the increase of the atomization amount; in addition, it does not affect the passage of current in the heating layer 112 (introduced in subsequent content) on the atomizing surface 1112. The liquid guiding hole 1113a extends in a straight line, and the ports of two adjacent liquid guiding holes 1113a in the liquid guiding channel 1113 located on the atomizing surface 1112 overlap with each other, and the ports located on the liquid suction surface 1111 are arranged at intervals from each other. It can be seen that the equivalent diameter of the port of the liquid guiding hole 1113a located on the liquid suction surface 1111 is smaller than the equivalent diameter of the port of the liquid guiding hole 1113a located on the atomizing surface 1112, which increases the resistance of the return gas bubble and helps to reduce the return gas; the equivalent diameter of the port of the liquid guiding hole 1113a located on the liquid suction surface 1111 is set to be smaller than the equivalent diameter of the port of the liquid guiding hole 1113a located on the atomizing surface 1112, and the capillary pressure of the liquid guiding hole 1113a increases along the direction of the atomizing surface 1112 pointing to the liquid suction surface 1111, which can avoid the phenomenon of liquid explosion on the atomizing surface 1112 caused by excessive liquid supply.

The equivalent diameter of the port of the liquid-conducting hole 1113a located on the atomizing surface 1112 is greater than or equal to 30 μm and less than or equal to 70 μm; and/or the equivalent diameter of the port of the liquid-conducting hole 1113a located on the liquid-absorbing surface 1111 is greater than or equal to 10 μm and less than or equal to 50 μm. It should be noted that the equivalent diameter of the port of the liquid-conducting hole 1113a located on the atomizing surface 1112 affects the aerosol particle size distribution range, and the smaller the equivalent diameter, the smaller the particle size; the equivalent diameter of the port of the liquid-conducting hole 1113a located on the atomizing surface 1112 is set to be greater than or equal to 30 μm and less than or equal to 70 μm, so that the aerosol particle size distribution is within a more optimal range and maintains a better taste. The equivalent diameter of the port of the liquid-conducting hole 1113a located on the liquid-absorbing surface 1111 affects the flow resistance of the aerosol generating matrix, The smaller the equivalent diameter, the more favorable it is to reduce the return air and avoid the generation of bubbles on the liquid suction surface 1111; the equivalent diameter of the port of the liquid guide hole 1113a located on the liquid suction surface 1111 is set to be greater than or equal to 10μm and less than or equal to 50μm, which reduces the return air and ensures smooth and sufficient liquid supply.

Exemplarily, a laser etching process is used to form a tapered liquid conducting hole 1113a (the cross-sectional shape of the liquid conducting hole 1113a is circular, and the longitudinal cross-sectional shape of the liquid conducting hole 1113a is an isosceles trapezoid), the aperture of the port of the liquid conducting hole 1113a located on the atomizing surface 1112 is larger than the aperture of the port of the liquid conducting hole 1113a located on the liquid absorbing surface 1111, and the difference between the aperture of the port of the liquid conducting hole 1113a located on the atomizing surface 1112 and the aperture of the port of the liquid conducting hole 1113a located on the liquid absorbing surface 1111 can be controlled within 20μm. The aperture of the port of the liquid guiding hole 1113a located on the atomizing surface 1112 is less than 30 μm, and the aperture of the port of the liquid guiding hole 1113a located on the liquid absorbing surface 1111 is less than 10 μm, which is prone to insufficient liquid supply; the aperture of the port of the liquid guiding hole 1113a located on the atomizing surface 1112 is greater than 70 μm, and the aperture of the port of the liquid guiding hole 1113a located on the liquid absorbing surface 1111 is greater than 50 μm, which is prone to leakage.

Continuing to refer to Figures 3 and 4, the heating component 11 also includes a heating layer 112, a pin conductive layer 113 and a protective layer 114. The heating layer 112 is used to electrically heat the atomized aerosol to generate the matrix. The heating layer 112 is arranged on the atomizing surface 1112 of the substrate 111. A pin conductive layer 113 is respectively provided at the opposite ends of the heating layer 112, and the pin conductive layer 113 is connected to the heating layer 112; the pin conductive layer 113 is used to be electrically connected to the host 2, and the heating layer 112 is electrically connected to the host 2 through the pin conductive layer 113. By providing the pin conductive layer 113, the contact resistance of the heating layer 112 to achieve electrical connection is reduced; for example, the heating component 11 is electrically connected to the host 2 through the elastic pin, and the elastic pin is in contact with the pin conductive layer 113. The pin conductive layer 113 has a large contact area, which reduces the contact resistance between the heating layer 112 and the elastic pin. The protective layer 114 is disposed on the surface of the heating layer 112 away from the substrate 111 . The protective layer 114 is used to prevent or reduce the risk of corrosion and oxidation of the heating layer 112 after heating, thereby extending the service life of the heating layer 112 .

In one embodiment, the heating layer 112 is formed by a physical vapor deposition process (for example, a magnetron sputtering process) or a chemical vapor deposition process or by a screen printing process; the thickness of the heating layer 112 formed by the physical vapor deposition process or the chemical vapor deposition process is smaller than the thickness of the heating layer 112 formed by the screen printing process.

In one embodiment, the heating layer 112 is in the shape of a long strip and extends in a straight line. Two pin conductive layers 113 are respectively disposed at opposite ends of the heating layer 112, and the current flow direction of the heating layer 112 is the direction from one pin conductive layer 113 to the other pin conductive layer 113. The pin conductive layer 113 covers a portion of the heating layer 112. The remaining portion of the heating layer 112 not covered by the pin conductive layer 113 is covered by the protective layer 114.

In one embodiment, the substrate 111 includes a microporous area 1114 and a blank area 1115 adjacent to the microporous area 1114. The microporous area 1114 is provided with a plurality of liquid conducting holes 1113a, and the plurality of liquid conducting holes 1113a may be liquid conducting channels 1113 or independent liquid conducting holes 1113a; specifically, the plurality of liquid conducting holes 1113a of the microporous area 1114 may be formed by laser, etching or other processes. The blank area 1115 is not provided with liquid conducting holes 1113a. The blank area 1115 in the present application is a liquid conducting hole that can be formed. 1113a is an area where no liquid conducting hole 1113a is formed, and the area around the non-microporous area 1114 where the liquid conducting hole 1113a cannot be formed. The blank area 1115 is not provided with liquid conducting holes 1113a, which reduces the number of liquid conducting holes 1113a on the substrate 111, thereby improving the strength of the substrate 111 and reducing the production cost of providing liquid conducting holes 1113a on the substrate 111. The heating layer 112 is at least partially provided in the microporous area 1114; the heating layer 112 is used to atomize the aerosol generating matrix on the atomizing surface 1112. The pin conductive layer 113 is at least partially provided in the blank area 1115 to ensure the continuity and stability of the pin conductive layer 113.

Exemplarily, the blank area 1115 is arranged around the microporous area 1114. A portion of the heating layer 112 is arranged in the microporous area 1114, and another portion extends to the blank area 1115. A portion of the pin conductive layer 113 is arranged in the blank area 1115, and another portion extends to the microporous area 1114. The heating layer 112 and the pin conductive layer 113 have overlapping portions in the blank area 1115 and the microporous area 1114.

It should be noted that the liquid-conducting channel 1113 is provided in the microporous area 1114. In one embodiment, a part of the area in the microporous area 1114 is provided with a liquid-conducting channel 1113, and the remaining area in the microporous area 1114 where the liquid-conducting channel 1113 is not provided is provided with a plurality of mutually independent liquid-conducting holes 1113a (as shown in FIG. 3); wherein, when the number of liquid-conducting channels 1113 provided in the microporous area 1114 is multiple, the plurality of liquid-conducting channels 1113 can be arranged regularly (for example, in an array) or in an irregular arrangement. In one embodiment, all areas in the microporous area 1114 are used to set the liquid-conducting channel 1113, that is, the microporous area 1114 is provided with a plurality of liquid-conducting channels 1113, and no mutually independent liquid-conducting holes 1113a are provided; wherein, the plurality of liquid-conducting channels 1113 can be arranged regularly (for example, in an array) or in an irregular arrangement, and the specific design is based on the needs. The following is a detailed introduction to the plurality of liquid-conducting channels 1113 provided on the substrate 111.

In one embodiment, a plurality of liquid conducting channels 1113 are provided on the substrate 111, and the plurality of liquid conducting channels 1113 are arranged in multiple rows and columns (as shown in FIG. 5a to FIG. 13). That is, in the specific embodiment of the present application, isolated liquid conducting holes 1113a are not included.

Optionally, the spacing between any two adjacent rows of liquid-conducting channels 1113 is the same, and the spacing between any two adjacent columns of liquid-conducting channels 1113 is the same, which is convenient for processing and helps to reduce the difficulty of processing. It can be understood that the spacing between any two adjacent rows of liquid-conducting channels 1113 can be different, and the spacing between any two adjacent columns of liquid-conducting channels 1113 can be the same or different, which is specifically designed according to needs.

Optionally, the number of the liquid conducting holes 1113a in each liquid conducting channel 1113 is the same, which is convenient for processing and helps to reduce the processing difficulty. It is understandable that the number of the liquid conducting holes 1113a in each liquid conducting channel 1113 can also be different, and it is specifically designed according to needs.

Optionally, all the liquid guide holes 1113a in each liquid guide channel 1113 in the same row are arranged in a one-dimensional array, which is convenient for processing and helps to reduce the difficulty of processing. The multiple liquid guide holes 1113a of each liquid guide channel 1113 are arranged in a one-dimensional array along the current flow direction of the heating layer 112. This arrangement does not affect the current flow in the heating layer 112 on the atomization surface 1112. It is understood that the arrangement of the multiple liquid conducting holes 1113a in each liquid conducting channel 1113 is not limited to a one-dimensional array arrangement, and can be designed specifically according to needs.

In one embodiment, the cross-sectional shape of each part of the liquid-guiding hole 1113a is the same; along the direction from the atomizing surface 1112 to the liquid-absorbing surface 1111, the cross-sectional area of the liquid-guiding hole 1113a gradually decreases. Optionally, the cross-sectional shape of the liquid-guiding hole 1113a is circular, and the longitudinal cross-sectional shape of the liquid-guiding hole 1113a is an isosceles trapezoid (as shown in Figures 3-7b). Optionally, the cross-sectional shape of the liquid-guiding hole 1113a is circular, and the longitudinal cross-sectional shape of the liquid-guiding hole 1113a is a right-angled trapezoid (as shown in Figures 8a and 8b), wherein the cross-sectional shape refers to the cross-sectional shape along the direction parallel to the atomizing surface 1112, and the longitudinal cross-sectional shape refers to the cross-sectional shape along the thickness direction parallel to the substrate 111.

Exemplarily, as shown in Fig. 5a and Fig. 5b, and as shown in Fig. 8a and Fig. 8b, a plurality of liquid conducting channels 1113 are provided on the substrate 111, and the plurality of liquid conducting channels 1113 are arranged in a plurality of rows and columns, the row direction is the same as the current flow direction of the heating layer 112, the spacing between two adjacent rows of liquid conducting channels 1113 is the same, the spacing between two adjacent columns of liquid conducting channels 1113 is the same, and each liquid conducting channel 1113 includes two liquid conducting holes 1113a, and the two liquid conducting holes 1113a are arranged in one dimension along the current flow direction of the heating layer 112. The ports of the two liquid conducting holes 1113a of each liquid conducting channel 1113 on the atomizing surface 1112 overlap with each other, and the ports on the liquid absorbing surface 1111 are arranged at intervals from each other. Along the direction from the atomizing surface 1112 to the liquid absorbing surface 1111, the cross-sectional shape of the liquid guiding hole 1113a is an isosceles trapezoid (as shown in FIGS. 5a and 5b), or the cross-sectional shape of the liquid guiding hole 1113a is a right-angled trapezoid (as shown in FIGS. 8a and 8b).

Exemplarily, as shown in FIG. 6a and FIG. 6b, a plurality of liquid conducting channels 1113 are provided on the substrate 111, and the plurality of liquid conducting channels 1113 are arranged in a plurality of rows and columns, and the row direction is the same as the current flow direction of the heating layer 112, and the spacing between two adjacent rows of liquid conducting channels 1113 is the same, and the spacing between two adjacent columns of liquid conducting channels 1113 is the same, and each liquid conducting channel 1113 includes five liquid conducting holes 1113a, and the five liquid conducting holes 1113a are arranged in one dimension along the current flow direction of the heating layer 112. The ports of two adjacent liquid conducting holes 1113a on the atomizing surface 1112 overlap with each other, and the ports on the liquid absorbing surface 1111 are arranged at intervals from each other. Along the direction from the atomizing surface 1112 to the liquid absorbing surface 1111, the cross-sectional shape of the liquid conducting hole 1113a is an isosceles trapezoid.

Exemplarily, as shown in FIG. 7a and FIG. 7b, a plurality of liquid conducting channels 1113 are provided on the substrate 111, and the plurality of liquid conducting channels 1113 are arranged in a plurality of rows and columns, and the row direction is the same as the current flow direction of the heating layer 112, and the spacing between two adjacent rows of liquid conducting channels 1113 is the same, and the spacing between two adjacent columns of liquid conducting channels 1113 is the same, and each liquid conducting channel 1113 includes twelve liquid conducting holes 1113a, and the twelve liquid conducting holes 1113a are arranged in one dimension along the current flow direction of the heating layer 112. The ports of two adjacent liquid conducting holes 1113a in the twelve liquid conducting holes 1113a of each liquid conducting channel 1113 overlap with each other on the atomizing surface 1112, and the ports on the liquid absorbing surface 1111 are arranged at intervals from each other. Along the direction from the atomizing surface 1112 to the liquid absorbing surface 1111, the cross-sectional shape of the liquid conducting hole 1113a is an isosceles trapezoid.

Exemplarily, as shown in Figure 9, a plurality of liquid conducting channels 1113 are provided on the base body 111, and the plurality of liquid conducting channels 1113 are arranged into a plurality of rows and columns, the row direction is the same as the current flow direction of the heating layer 112, the spacing between two adjacent rows of liquid conducting channels 1113 is the same, the spacing between two adjacent columns of liquid conducting channels 1113 is the same, each liquid conducting channel 1113 includes two liquid conducting holes 1113a, and an acute angle is formed between the arrangement direction of the two liquid conducting holes 1113a and the current flow direction of the heating layer 112, the angle formed between the arrangement direction of the two liquid conducting holes 1113a of each liquid conducting channel 1113 and the current flow direction of the heating layer 112 is the same, and the ports of the two liquid conducting holes 1113a of each liquid conducting channel 1113 on the atomizing surface 1112 overlap with each other, and the ports on the liquid absorption surface 1111 are spaced apart from each other.

Exemplarily, as shown in FIG10 , a plurality of liquid-conducting channels 1113 are provided on the substrate 111, and the plurality of liquid-conducting channels 1113 are arranged in a plurality of rows and columns, the row direction is the same as the current flow direction of the heating layer 112, the spacing between two adjacent rows of liquid-conducting channels 1113 is the same, the spacing between two adjacent columns of liquid-conducting channels 1113 is the same, each liquid-conducting channel 1113 includes two liquid-conducting holes 1113a, and an acute angle is formed between the arrangement direction of the two liquid-conducting holes 1113a and the current flow direction of the heating layer 112, and the liquid-conducting channels 1113 in odd-numbered columns are arranged axially symmetrically with the liquid-conducting channels 1113 in even-numbered columns. The ports of the two liquid-conducting holes 1113a of each liquid-conducting channel 1113 on the atomizing surface 1112 overlap each other, and the ports on the liquid-absorbing surface 1111 are arranged at intervals from each other.

Exemplarily, as shown in FIG. 11 , a plurality of liquid-conducting channels 1113 are provided on the substrate 111, and the plurality of liquid-conducting channels 1113 are arranged in a plurality of rows and columns, the row direction is the same as the current flow direction of the heating layer 112, the spacing between two adjacent rows of liquid-conducting channels 1113 is the same, the spacing between two adjacent columns of liquid-conducting channels 1113 is the same, and each liquid-conducting channel 1113 includes two liquid-conducting holes 1113a, the arrangement direction of the two liquid-conducting holes 1113a in the liquid-conducting channels 1113 in the odd-numbered columns is parallel to the current flow direction of the heating layer 112, and the arrangement direction of the two liquid-conducting holes 1113a in the liquid-conducting channels 1113 in the even-numbered columns is perpendicular to the current flow direction of the heating layer 112. The ports of the two liquid-conducting holes 1113a of each liquid-conducting channel 1113 on the atomizing surface 1112 overlap with each other, and the ports on the liquid-absorbing surface 1111 are arranged at intervals from each other.

Exemplarily, as shown in FIG. 12 , a plurality of liquid-conducting channels 1113 are provided on the substrate 111, and the plurality of liquid-conducting channels 1113 are arranged in a plurality of rows and columns, the row direction is the same as the current flow direction of the heating layer 112, the spacing between two adjacent rows of liquid-conducting channels 1113 is the same, the spacing between two adjacent columns of liquid-conducting channels 1113 is the same, and each liquid-conducting channel 1113 includes three liquid-conducting holes 1113a, and the ports of any two adjacent liquid-conducting holes 1113a among the three liquid-conducting holes 1113a overlap each other on the atomizing surface 1112, and the ports on the liquid-absorbing surface 1111 are arranged at intervals from each other. The lines connecting the centers of the three liquid-conducting holes 1113a form an equilateral triangle.

Exemplarily, as shown in FIG13 , a plurality of liquid conducting channels 1113 are provided on the substrate 111 , and the plurality of liquid conducting channels 1113 are arranged in a plurality of rows and columns, and the row direction is the same as the current flow direction of the heating layer 112 , and the spacing between two adjacent rows of liquid conducting channels 1113 is the same, and the spacing between two adjacent columns of liquid conducting channels 1113 is the same, and each liquid conducting channel 1113 includes four liquid conducting holes 1113a, the lines connecting the centers of the four liquid-conducting holes 1113a form a square, the four liquid-conducting holes 1113a are arranged in a two-dimensional array, and the two liquid-conducting holes 1113a on the diagonal line do not overlap.

It should be noted that when all the liquid conducting holes 1113a in each liquid conducting channel 1113 in the same row are arranged in a one-dimensional array (for example, the embodiments shown in Figures 5a to 7b), the hole center distance L1 between adjacent liquid conducting holes 1113a in the liquid conducting channel 1113 is greater than or equal to 20μm and less than or equal to 60μm; it can be understood that the hole center distance L1 between adjacent liquid conducting holes 1113a in each group of liquid conducting holes 1113a affects the porosity of the substrate 111, thereby affecting the liquid supply capacity. Setting the hole center distance L1 to be greater than or equal to 20μm and less than or equal to 60μm allows the substrate 111 to have a better liquid supply capacity and can ensure the strength of the substrate 111. And/or the hole center distance L2 between two adjacent rows of liquid conducting channels 1113 is greater than or equal to 60μm and less than or equal to 140μm; it can be understood that the hole center distance L2 between two adjacent rows of liquid conducting channels 1113 affects the current flow area on the heating layer 112, and thus affects the resistance of the heating layer 112. The hole center distance L2 is set to be greater than or equal to 60μm and less than or equal to 140μm, which is used to ensure the effective width of part of the heating layer 112 between two adjacent rows of liquid conducting channels 1113. While the substrate 111 has a large porosity, it avoids excessive resistance of the heating layer 112 and causes excessive local temperature, thereby avoiding problems such as breakage or melting of the heating layer 112.

The aperture of the liquid guiding hole 1113a is greater than or equal to 20 μm and less than or equal to 60 μm, and the hole center distance L1 between adjacent liquid guiding holes 1113a in the liquid guiding channel 1113 is greater than or equal to 20 μm and less than or equal to 60 μm. The aperture of the liquid guiding hole 1113a and the hole center distance L1 between adjacent liquid guiding holes 1113a in the liquid guiding channel 1113 are designed as above to facilitate controlling the overlapping area of adjacent liquid guiding holes 1113a in the liquid guiding channel 1113 on the atomizing surface 1112.

Exemplarily, the hole center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is greater than or equal to 20μm and less than or equal to 40μm. Exemplarily, the hole center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is 30μm. Exemplarily, the hole center distance L1 between adjacent liquid guide holes 1113a in the liquid guide channel 1113 is 50μm. Exemplarily, the hole center distance L2 between two adjacent rows of liquid guide channels 1113 is greater than or equal to 60μm and less than or equal to 100μm. Exemplarily, the hole center distance L2 between two adjacent rows of liquid guide channels 1113 is greater than or equal to 80μm and less than or equal to 120μm.

In one embodiment, the substrate 111 is a dense substrate. Optionally, the material of the substrate 111 is at least one of glass and dense ceramics. It is understandable that the material of the substrate 111 includes but is not limited to glass and dense ceramics, and is specifically designed according to needs. The substrate 111 made of dense materials such as glass has a smooth surface, so a continuous and stable metal film can be deposited on the surface of the substrate 111 by physical vapor deposition or chemical vapor deposition to form a heating layer 112. The thickness of the heating layer 112 is within the range of a few microns or nanometers, which can not only miniaturize the heating component 11, but also save the material of the heating layer 112.

In one embodiment, the substrate 111 is a porous substrate. Optionally, the material of the substrate 111 is porous ceramics; porous ceramics are prepared by molding and special high-temperature sintering processes of raw materials. A porous ceramic material with an open pore size and a high open porosity. The porous ceramic forms a plurality of disordered pores during the preparation process.

In one embodiment, the thickness of the substrate 111 is 0.5mm-2.5mm. When the thickness of the substrate 111 is greater than 2.5mm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol, and a large amount of heat loss is caused. It is not easy to penetrate when forming the liquid guide hole 1113a, and the cost of setting the liquid guide hole 1113a is high; when the thickness of the substrate 111 is less than 0.5mm, the strength of the substrate 111 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device. Optionally, the thickness of the substrate 111 is 0.5mm-1mm. Optionally, the thickness of the substrate 111 is 1.5mm-2.5mm.

In one embodiment, the liquid absorption surface 1111 and the atomization surface 1112 are arranged in parallel to facilitate processing and assembly.

Please refer to FIG. 14 , which is a comparison diagram of the atomization amount of different embodiments of the substrate.

The present application also conducts experimental comparisons on different implementations of the substrate 111, including a first experimental piece, a second experimental piece, a third experimental piece, and a fourth experimental piece. The first experimental piece is a substrate structure in the prior art, and the multiple liquid guide holes on the substrate are independent of each other, and the multiple liquid guide holes are arranged in multiple rows and columns. The second experimental piece is the substrate 111 shown in Figures 5a and 5b. The third experimental piece is the substrate 111 shown in Figures 6a and 6b. The fourth experimental piece is the substrate 111 shown in Figures 7a and 7b. The experimental results are shown in Table 1 and Figure 14 below.

Table 1

Wherein, D1 is the port aperture of the liquid guide hole 1113a on the atomizing surface 1112. D2 is the port aperture of the liquid guide hole 1113a on the liquid suction surface 1111. For the first experimental piece, L1 is the spacing between two adjacent columns of liquid guide holes, and L2 is the spacing between two adjacent rows of liquid guide holes. For the second to fourth experimental pieces, L1 is the hole center distance between adjacent liquid guide holes 1113a in each group of liquid guide channels 1113, and L2 is the hole center distance between two adjacent rows of liquid guide channels 1113.

It can be seen from Table 1 and FIG. 14 that the arrangement of the liquid-conducting holes 1113a of the substrate 111 provided in the present application increases the porosity and the atomization amount.

The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims (16)

A heating component is applied to an electronic atomization device for atomizing an aerosol to generate a matrix, including: The base body comprises a liquid absorption surface and an atomization surface which are arranged opposite to each other; the base body is provided with at least one liquid guide channel which passes through the liquid absorption surface and the atomization surface; Wherein, the liquid guiding channel includes at least two liquid guiding holes, and the liquid guiding holes pass through the liquid suction surface and the atomization surface; the ports of two adjacent liquid guiding holes in the liquid guiding channel located on the atomization surface overlap with each other, and the ports located on the liquid suction surface are arranged at intervals from each other. The heating component according to claim 1, wherein the cross-sectional shape of the liquid guide hole is the same at all locations; and the cross-sectional area of the liquid guide hole gradually decreases along the direction from the atomization surface to the liquid absorption surface. The heating component according to claim 2, wherein the longitudinal cross-sectional shape of the liquid guiding hole is an isosceles trapezoid, and the cross-sectional shape of the liquid guiding hole is a circle. The heating component according to claim 1, wherein a plurality of the liquid conducting channels are provided on the substrate, and the plurality of the liquid conducting channels are arranged in a plurality of rows and columns. The heating component according to claim 4, wherein the spacing between any two adjacent rows of the liquid conducting channels is the same, and the spacing between any two adjacent columns of the liquid conducting channels is the same. The heating component according to claim 4, wherein the number of the liquid conducting holes in each of the liquid conducting channels is the same. The heating component according to claim 4, wherein all of the liquid conducting holes in each of the liquid conducting channels in the same row are arranged in a one-dimensional array. The heating component according to claim 7, wherein the center distance between adjacent liquid guide holes in the liquid guide channel is greater than or equal to 20 μm and less than or equal to 60 μm; and/or the center distance between two adjacent rows of the liquid guide channels is greater than or equal to 60 μm and less than or equal to 140 μm. The heating component according to claim 1, wherein the equivalent diameter of the port of the liquid guide hole located on the atomization surface is greater than or equal to 30 μm and less than or equal to 70 μm; and/or the equivalent diameter of the port of the liquid guide hole located on the liquid absorption surface is greater than or equal to 10 μm and less than or equal to 50 μm. The heating component according to claim 1, wherein the substrate is a dense substrate or a porous substrate. The heating component according to claim 10, wherein the substrate is a dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or The substrate is a porous substrate, and the material of the substrate is porous ceramic. The heating component according to claim 1, wherein the thickness of the substrate is 0.5 mm-2.5 mm. The heating component according to claim 1, wherein the heating component further comprises a heating layer, a pin conductive layer and a protective layer; the heating layer is arranged on the atomized surface; one pin conductive layer is respectively provided at two opposite ends of the heating layer, and the pin conductive layer is connected to the heating layer; the protective layer is arranged on the surface of the heating layer away from the substrate, and the protective layer is used to protect the heating layer. The heating component according to claim 13, wherein the substrate includes a microporous area and a blank area adjacent to the microporous area; the microporous area is provided with a plurality of the liquid guide holes; the blank area is not provided with the liquid guide holes; the heating layer is at least partially provided in the microporous area, and the pin conductive layer is at least partially provided in the blank area. An atomizer, comprising: A liquid storage chamber, used for storing an aerosol-generating matrix; A heating component, the heating component is connected to the fluid of the liquid storage chamber, and the heating component is used to atomize the aerosol generating matrix; the heating component is the heating component according to any one of claims 1-14. An electronic atomization device, comprising: The atomizer according to claim 15; The host is used to provide electrical energy for the heating component of the atomizer and control the heating component of the atomizer to atomize the aerosol generating matrix.