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WO2024234842A1 - 发热组件、雾化器及电子雾化装置 - Google Patents

发热组件、雾化器及电子雾化装置 Download PDF

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Publication number
WO2024234842A1
WO2024234842A1 PCT/CN2024/084546 CN2024084546W WO2024234842A1 WO 2024234842 A1 WO2024234842 A1 WO 2024234842A1 CN 2024084546 W CN2024084546 W CN 2024084546W WO 2024234842 A1 WO2024234842 A1 WO 2024234842A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid guide
guide holes
liquid
holes
heating component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/084546
Other languages
English (en)
French (fr)
Inventor
王宇
傅显钧
陈智超
孟路钱
谭翔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Smoore Technology Ltd
Smoore International Holdings Ltd
Original Assignee
Shenzhen Smoore Technology Ltd
Smoore International Holdings Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Smoore Technology Ltd, Smoore International Holdings Ltd filed Critical Shenzhen Smoore Technology Ltd
Publication of WO2024234842A1 publication Critical patent/WO2024234842A1/zh
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/42—Cartridges or containers for inhalable precursors
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/48—Fluid transfer means, e.g. pumps
    • A24F40/485—Valves; Apertures

Definitions

  • the present application relates to the technical field of electronic atomization, and in particular to a heating component, an atomizer and an electronic atomization device.
  • the electronic atomization device is composed of a heating component, a battery, a control circuit and other parts.
  • the heating component is the core component of the electronic atomization device, and its characteristics determine the atomization effect and user experience of the electronic atomization device.
  • the more common atomization method of existing heating components is resistive heating.
  • the heating component includes a substrate and a heating film arranged on the surface of the substrate; wherein the substrate is provided with through holes, and the through holes are used to guide the aerosol to generate the matrix.
  • increasing the density of the through holes is one of the most direct methods.
  • the existing uniform pore-making method increases the pore density, the spacing between the holes also decreases, which increases the resistance of the heating film, reduces the stability of the heating film, and greatly increases the failure of the heating component during operation.
  • the heating component, atomizer and electronic atomization device provided in the present application can improve the stability of the heating film while increasing the hole density.
  • the first technical solution provided by the present application is: to provide a heating component, which is applied to an electronic atomization device and is used to atomize an aerosol to generate a matrix, wherein the heating component includes a substrate and a heating film; the substrate includes a liquid absorption surface and an atomization surface which are arranged opposite to each other; the substrate is provided with a plurality of liquid guide holes which penetrate the liquid absorption surface and the atomization surface; the heating film is arranged on the atomization surface; the liquid guide holes extend to the heating film and penetrate the atomization surface; The heating film; wherein the current flow direction of the heating film is defined as a first direction, and the current flow direction perpendicular to the heating film is defined as a second direction; the arrangement density of the plurality of liquid guide holes in the first direction is greater than the arrangement density of the plurality of liquid guide holes in the second direction.
  • the heating film includes a heating portion, a first electrode and a second electrode; the heating portion is in a strip shape and extends linearly along the first direction; the first electrode and the second electrode are respectively arranged at opposite ends of the heating portion along the first direction.
  • the plurality of liquid conducting holes are arranged in multiple rows and columns, the row direction is parallel to the first direction, and the column direction is parallel to the second direction; the plurality of liquid conducting holes in each row are spaced apart, and the plurality of liquid conducting holes in each column are spaced apart.
  • the pore diameter of the liquid conducting holes is greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m; the center distance between adjacent liquid conducting holes in each row is less than or equal to 100 ⁇ m; and/or the center distance between adjacent liquid conducting holes in each column is greater than or equal to 40 ⁇ m and less than or equal to 100 ⁇ m.
  • the plurality of liquid conducting holes are arranged in multiple rows and columns, the row direction is parallel to the first direction, and the column direction is parallel to the second direction; at least two of the plurality of liquid conducting holes in each row are interconnected; and the plurality of liquid conducting holes in each column are spaced apart.
  • ports of at least two of the plurality of liquid-conducting holes in each row located on the atomization surface overlap with each other.
  • the plurality of liquid conducting holes in each row are divided into a plurality of groups of liquid conducting holes; each group of liquid conducting holes includes at least two liquid conducting holes, and all the liquid conducting holes in each group of liquid conducting holes are interconnected.
  • the number of the liquid conducting holes in each group of the liquid conducting holes is the same; and/or the hole center distances between adjacent liquid conducting holes in each group of the liquid conducting holes are the same; and/or the multiple liquid conducting holes in each row are divided into multiple groups of liquid conducting holes, and the spacing between two adjacent groups of liquid conducting holes is the same.
  • the diameter of the liquid-conducting holes is greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m; the plurality of liquid-conducting holes in each row are divided into a plurality of groups of liquid-conducting holes, and the hole center distance between adjacent liquid-conducting holes is less than or equal to 100 ⁇ m; and/or the adjacent liquid-conducting holes in each column are The hole center distance between the liquid holes is greater than or equal to 40 ⁇ m and less than or equal to 100 ⁇ m.
  • the matrix is a dense matrix or a porous matrix.
  • the substrate is a dense substrate, and the material of the substrate is at least one of glass and dense ceramic; or,
  • the substrate is a porous substrate, and the material of the substrate is porous ceramic.
  • the thickness of the substrate is 0.2 mm-2.5 mm.
  • the second technical solution provided in the present application is: to provide a nebulizer, comprising a liquid storage chamber and a heating component; the liquid storage chamber is used to store an aerosol generating matrix; the heating component is fluidly connected to the liquid storage chamber, and the heating component is used to atomize the aerosol generating matrix; the heating component is a heating component described in any one of the above.
  • the third technical solution provided in this application is: to provide an electronic atomization device, comprising: the atomizer and the host as described above; the host is used to provide electrical energy for the heating component of the atomizer and control the heating component of the atomizer to atomize the aerosol generating matrix.
  • the present application discloses a heating component, an atomizer and an electronic atomization device;
  • the heating component includes a substrate and a heating film;
  • the substrate includes a liquid absorption surface and an atomization surface arranged opposite to each other, and a plurality of liquid guide holes penetrating the liquid absorption surface and the atomization surface are provided on the substrate;
  • the heating film is arranged on the atomization surface, and the liquid guide holes extend to the heating film and penetrate the heating film; wherein, the current flow direction of the heating film is defined as a first direction, and the current flow direction perpendicular to the heating film is defined as a second direction, and the arrangement density of the plurality of liquid guide holes in the first direction is greater than the arrangement density of the plurality of liquid guide holes in the second direction, thereby increasing the porosity of the substrate and ensuring the stability of the heating film.
  • FIG1 is a schematic structural diagram of an embodiment of an electronic atomization device provided by the present application.
  • FIG2 is a schematic diagram of the structure of an atomizer provided in one embodiment of the present application.
  • FIG3 is a schematic diagram of the structure of a heating component provided in an embodiment of the present application.
  • FIG4 is a schematic cross-sectional view of the heating component shown in FIG3 along line A-A;
  • FIG5a is a schematic diagram of a partial structure of an embodiment of a base of the heating component shown in FIG3 ;
  • Fig. 5b is a schematic cross-sectional view of the substrate shown in Fig. 5a along line B-B;
  • FIG6a is a schematic diagram of a partial structure of another embodiment of the base of the heating component shown in FIG3 ;
  • Fig. 6b is a schematic cross-sectional view of the substrate shown in Fig. 6a along line C-C;
  • FIG7a is a schematic diagram of a partial structure of another embodiment of the base of the heating component shown in FIG3 ;
  • Fig. 7b is a schematic cross-sectional view of the substrate shown in Fig. 7a along line D-D;
  • FIG8a is a schematic diagram of a partial structure of another embodiment of the base of the heating component shown in FIG3;
  • Fig. 8b is a schematic cross-sectional view of the substrate shown in Fig. 8a along line E-E;
  • FIG9 is a comparison diagram of current density distribution of the first experimental piece, the second experimental piece and the third experimental piece;
  • FIG. 10 is a comparison diagram of Joule heat distribution of the first experimental piece, the second experimental piece, and the third experimental piece.
  • first”, “second” and “third” in this application are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the technical features indicated. Quantity. Thus, the features defined as “first”, “second” and “third” may include at least one of the features explicitly or implicitly. In the description of the present application, the meaning of “multiple” is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back %) are only used to explain the relative positional relationship, movement, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly.
  • FIG. 1 is a schematic structural diagram of an embodiment of an electronic atomization device provided in the present application.
  • an electronic atomization device 100 is provided.
  • the electronic atomization device 100 can be used for atomization of an aerosol-generating substrate.
  • the electronic atomization device 100 includes an atomizer 1 and a host 2 that are electrically connected to each other.
  • the atomizer 1 is used to store the aerosol generating substrate and atomize the aerosol generating substrate to form an aerosol for the user to inhale.
  • the atomizer 1 can be used in different fields, such as medical treatment, beauty, leisure smoking, etc.
  • the atomizer 1 can be used in an electronic aerosolization device to atomize the aerosol generating substrate and generate an aerosol for the smoker to inhale. The following embodiments all take this leisure smoking as an example.
  • the specific structure and function of the atomizer 1 may refer to the specific structure and function of the atomizer 1 involved in the following embodiments, and the same or similar technical effects can be achieved, which will not be repeated here.
  • the host 2 includes a battery (not shown) and a controller (not shown).
  • the battery is used to power the fog
  • the operation of the atomizer 1 provides electrical energy so that the atomizer 1 can atomize the aerosol-generating substrate to form an aerosol; the controller is used to control the operation of the atomizer 1, that is, to control the atomizer 1 to atomize the aerosol-generating substrate.
  • the host 2 also includes other components such as a battery holder and an airflow sensor.
  • the atomizer 1 and the host 2 can be integrally arranged or detachably connected, and can be designed according to specific needs.
  • FIG. 2 is a schematic diagram of the structure of an atomizer provided in an embodiment of the present application.
  • the atomizer 1 includes a housing 10, a heating component 11, and an atomizer seat 12.
  • the atomizer seat 12 has an installation cavity (not shown), and the heating component 11 is arranged in the installation cavity; the heating component 11 and the atomizer seat 12 are arranged in the housing 10 together.
  • the housing 10 is formed with a mist outlet channel 13, and the inner surface of the housing 10, the outer surface of the mist outlet channel 13 and the top surface of the atomizer seat 12 cooperate to form a liquid storage cavity 14, which is used to store liquid aerosol generating matrix.
  • the heating component 11 is electrically connected to the host 2 to generate aerosol by atomizing the aerosol generating matrix.
  • the atomizing seat 12 includes an upper seat 121 and a lower seat 122, and the upper seat 121 and the lower seat 122 cooperate to form an installation cavity; the surface of the heating component 11 away from the liquid storage cavity 14 cooperates with the cavity wall of the installation cavity to form an atomizing cavity 120.
  • a lower liquid channel 1211 is provided on the upper seat 121; the aerosol generating matrix channel in the liquid storage cavity 14 flows into the heating component 11 through the lower liquid channel 1211, that is, the heating component 11 is in fluid communication with the liquid storage cavity 14.
  • An air inlet channel 15 is provided on the lower seat 122, and external gas enters the atomizing cavity 120 through the air inlet channel 15, carrying the aerosol atomized by the heating component 11 to flow to the mist outlet channel 13, and the user inhales the aerosol through the port of the mist outlet channel 13.
  • Figure 3 is a structural schematic diagram of the heating component provided in an embodiment of the present application
  • Figure 4 is a cross-sectional schematic diagram of the heating component shown in Figure 3 along the A-A line
  • Figure 5a is a partial structural schematic diagram of an embodiment of the substrate of the heating component shown in Figure 3
  • Figure 5b is a cross-sectional schematic diagram of the substrate shown in Figure 5a along the B-B line
  • Figure 6a is a partial structural schematic diagram of another embodiment of the substrate of the heating component shown in Figure 3
  • Figure 6b is a cross-sectional schematic diagram of the substrate shown in Figure 6a along the C-C line
  • Figure 7a is a partial structural schematic diagram of another embodiment of the substrate of the heating component shown in Figure 3
  • Figure 7b is a cross-sectional schematic diagram of the substrate shown in Figure 7a along the D-D line
  • Figure 8a is a partial structural schematic diagram of another embodiment of the substrate of the heating component shown in Figure 3
  • Figure 8b is a cross-sectional schematic diagram of the substrate shown in
  • the heating component 11 includes a substrate 111 and a heating film 112.
  • the substrate 111 includes a liquid absorption surface 1111 and an atomization surface 1112 that are arranged opposite to each other.
  • the atomizing surface 1112 has a plurality of liquid guide holes 1113, the liquid guide holes 1113 have a capillary force, and the liquid guide holes 1113 are used to guide the aerosol generating matrix from the liquid absorption surface 1111 to the atomizing surface 1112.
  • the heating film 112 is arranged on the atomizing surface 1112, and the liquid guide holes 1113 extend to the heating film 112 and penetrate the heating film 112.
  • the heating film 112 is used to heat the atomized aerosol generating matrix.
  • the current flow direction of the heating film 112 is defined as a first direction X, and the current flow direction perpendicular to the heating film 112 is defined as a second direction Y.
  • the arrangement density of the plurality of liquid guide holes 1113 in the first direction X is greater than the arrangement density of the plurality of liquid guide holes 1113 in the second direction Y.
  • the arrangement density of the plurality of liquid guide holes in the first direction is the same as the arrangement density of the plurality of liquid guide holes in the second direction.
  • the present application increases the porosity of the substrate 111 by making the arrangement density of the plurality of liquid guide holes 1113 in the first direction X greater than the arrangement density of the plurality of liquid guide holes 1113 in the second direction Y, while ensuring the spacing between the liquid guide holes 1113 in the second direction Y, which is beneficial to improving the stability of the heating film 112.
  • the arrangement density of the liquid conducting holes 1113 is increased only along the direction of current flow; that is, only the arrangement density of the plurality of liquid conducting holes 1113 in the first direction X is increased, and the arrangement density of the plurality of liquid conducting holes 1113 in the second direction Y is the same as that in the prior art.
  • the length is proportional to the resistance
  • the cross-sectional area is inversely proportional to the resistance.
  • the spacing between the holes in the column direction will decrease, which will lead to a decrease in the cross-sectional area through which the current flows, and then an increase in resistance; while the cross-sectional area decreases, the volume of the local heating film will also decrease.
  • the local heat flux density will further increase, causing the local temperature of the heating film to be too high, and then uneven stress will occur.
  • the heating film breaks or melts due to over-high temperature.
  • the present application increases the arrangement density of the liquid guide holes 1113 only along the direction of current flow, so that the arrangement density of the liquid guide holes 1113 perpendicular to the current flow direction is the same as the arrangement density of the liquid guide holes in the column direction in the prior art, thereby keeping the cross-sectional area through which the current flows unchanged, increasing the porosity while ensuring that the resistance of the heating film 112 remains unchanged, and the current distribution density is almost the same as the original, avoiding the problem of the heating film 112 breaking or melting due to excessive local heat flux density.
  • the arrangement density of the liquid-conducting holes 1113 is increased along the direction of current flow, and the arrangement density of the liquid-conducting holes 1113 is also increased perpendicular to the current flow direction.
  • the spacing between adjacent liquid-conducting holes 1113 in the direction of current flow is reduced, and at the same time, the spacing between adjacent liquid-conducting holes 1113 perpendicular to the direction of current flow is reduced, and the reduced spacing in the direction of current flow is greater than the reduced spacing perpendicular to the direction of current flow; wherein, the reduced spacing perpendicular to the direction of current flow is designed to maintain a safe value between adjacent liquid-conducting holes 1113 perpendicular to the direction of current flow so that the heating film 112 is not easily failed.
  • a plurality of liquid-conducting holes 1113 are arranged in a plurality of rows and columns, the row direction is parallel to the first direction X, and the column direction is parallel to the second direction Y.
  • the plurality of liquid-conducting holes 1113 in each row are arranged at intervals, and the plurality of liquid-conducting holes 1113 in each column are arranged at intervals (as shown in FIG. 5a and FIG. 5b ).
  • the arrangement density of the liquid-conducting holes 1113 in the row direction is increased by reducing the spacing between adjacent liquid-conducting holes 1113 in each row; and/or the arrangement density of the liquid-conducting holes 1113 in the column direction is increased by reducing the spacing between adjacent liquid-conducting holes 1113 in each column.
  • the hole center distance D1 between adjacent liquid conducting holes 1113 in each column is greater than or equal to 40 ⁇ m and less than or equal to 100 ⁇ m. It can be understood that the hole center distance D1 between adjacent liquid conducting holes 1113 in each column is related to the aperture of the liquid conducting holes 1113, and the aperture of the liquid conducting holes 1113 is approximately greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m.
  • the hole center distance D1 between adjacent liquid conducting holes 1113 in each column is set to be greater than or equal to 40 ⁇ m and less than or equal to 100 ⁇ m, ensuring that adjacent liquid conducting holes 1113 in each column are independent of each other and ensuring the effective width of the partial heating film 112 between two adjacent rows of liquid conducting holes 1113 to achieve conductivity.
  • the hole center distance D1 between adjacent liquid conducting holes 1113 in each column is greater than or equal to 40 ⁇ m and less than or equal to 80 ⁇ m.
  • the hole center distance D1 between adjacent liquid conducting holes 1113 in each column Exemplarily, the hole center distance D1 between adjacent liquid guide holes 1113 in each column is 90 ⁇ m.
  • the hole center distance D2 between adjacent liquid conducting holes 1113 in each row is less than or equal to 100 ⁇ m. It can be understood that the hole center distance D2 between adjacent liquid conducting holes 1113 in each row is related to the aperture of the liquid conducting holes 1113, and the aperture of the liquid conducting holes 1113 is generally greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m. The hole center distance D2 between adjacent liquid conducting holes 1113 in each row is set to be less than or equal to 100 ⁇ m to ensure that the adjacent liquid conducting holes 1113 in each row are independent of each other. The spacing between adjacent liquid guide holes 1113 in each row has almost no effect on the cross-sectional area through which the current of the heating film 112 flows.
  • the spacing between adjacent liquid guide holes 1113 in each row can be as small as possible under the condition that the process conditions can be achieved; if the hole center distance D2 between adjacent liquid guide holes 1113 in each row is too large, it is not conducive to improving the porosity of the substrate 111, and reduces the liquid supply of the substrate 111, and there may be a problem of not being able to meet the atomization requirements of the heating film 112.
  • the hole center distance D2 between adjacent liquid guide holes 1113 in each row is greater than or equal to 30 ⁇ m and less than or equal to 90 ⁇ m.
  • the hole center distance D2 between adjacent liquid guide holes 1113 in each row is 50 ⁇ m.
  • the hole center distance D2 between adjacent liquid guide holes 1113 in each row is 40 ⁇ m.
  • a plurality of liquid-conducting holes 1113 are arranged in a plurality of rows and columns, the row direction is parallel to the first direction X, and the column direction is parallel to the second direction Y. At least two of the plurality of liquid-conducting holes 1113 in each row are interconnected; wherein, interconnected means that the liquid-conducting holes 1113 are directly connected.
  • the plurality of liquid-conducting holes 1113 in each column are arranged at intervals (as shown in FIG. 6a-FIG. 8b).
  • the arrangement density of the liquid-conducting holes 1113 in the row direction is increased by making at least two of the plurality of liquid-conducting holes 1113 in each row interconnected; and/or the arrangement density of the liquid-conducting holes 1113 in the column direction is increased by reducing the spacing between adjacent liquid-conducting holes 1113 in each column.
  • At least two of the multiple liquid guide holes 1113 in each row overlap at their ports located on the atomizing surface 1112, so as to achieve mutual communication between at least two liquid guide holes 1113.
  • the ports of two liquid guide holes 1113 located on the atomizing surface 1112 overlap, which means that the ports of the two liquid guide holes 1113 located on the atomizing surface 1112 partially overlap, so that the hole sections of the two liquid guide holes 1113 close to the atomizing surface 1112 are partially connected.
  • two Portions of the liquid-conducting holes 1113 located above the dotted line L are interconnected, and portions of the two liquid-conducting holes 1113 located below the dotted line L are independent of each other.
  • the multiple liquid guide holes 1113 in each row are divided into multiple groups of liquid guide holes 1113; each group of liquid guide holes 1113 includes at least two liquid guide holes 1113, and all the liquid guide holes 1113 in each group of liquid guide holes 1113 are interconnected.
  • the number of liquid guide holes 1113 in each group of liquid guide holes 1113 is the same; and/or the hole center distances between adjacent liquid guide holes 1113 in each group of liquid guide holes 1113 are the same; and/or the multiple liquid guide holes 1113 in each row are divided into multiple groups of liquid guide holes 1113, and the spacing between two adjacent groups of liquid guide holes 1113 is the same, which is convenient for processing and ensures the consistency of liquid supply at various locations of the substrate 111. It should be noted that the number of liquid conducting holes 1113 in each group of liquid conducting holes 1113 may be different, the hole center distance between adjacent liquid conducting holes 1113 in each group of liquid conducting holes 1113 may be different, and the spacing between two adjacent groups of liquid conducting holes 1113 may be different, which is specifically designed according to needs.
  • the hole center distance D1 between adjacent liquid guide holes 1113 in each column is greater than or equal to 40 ⁇ m and less than or equal to 100 ⁇ m. It can be understood that the hole center distance D1 between adjacent liquid guide holes 1113 in each column is related to the aperture of the liquid guide hole 1113, and the aperture of the liquid guide hole 1113 is approximately greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m.
  • the hole center distance D1 between adjacent liquid guide holes 1113 in each column is set to be greater than or equal to 40 ⁇ m and less than or equal to 100 ⁇ m, ensuring that the adjacent liquid guide holes 1113 in each column are independent of each other, ensuring the effective width of the part of the heating film 112 between two adjacent rows of liquid guide holes 1113, and realizing conductivity.
  • the hole center distance D1 between adjacent liquid guide holes 1113 in each column is greater than or equal to 40 ⁇ m and less than or equal to 80 ⁇ m.
  • the hole center distance D1 between adjacent liquid guide holes 1113 in each column is 50 ⁇ m.
  • the hole center distance D1 between adjacent liquid guiding holes 1113 in each column is 90 ⁇ m.
  • the multiple liquid guide holes 1113 in each row are divided into multiple groups of liquid guide holes 1113, and the hole center distance between adjacent liquid guide holes 1113 is less than or equal to 100 ⁇ m; the hole center distance between adjacent liquid guide holes 1113 is greater than or equal to 10 ⁇ m. It can be understood that the hole center distance between adjacent liquid guide holes 1113 in each row is related to the aperture of the liquid guide hole 1113, and the aperture of the liquid guide hole 1113 is generally greater than or equal to 20 ⁇ m and less than or equal to 50 ⁇ m.
  • the hole center distance between adjacent liquid guide holes 1113 in each row is set to be less than or equal to 100 ⁇ m, so as to ensure that the hole center distance between adjacent liquid guide holes 1113 in each row is less than or equal to 100 ⁇ m.
  • the liquid holes 1113 can be independent of each other or overlapped, that is, each row of multiple liquid conducting holes 1113 can be divided into multiple groups of liquid conducting holes 1113, with intervals between two adjacent groups of liquid conducting holes 1113, and multiple liquid conducting holes 1113 in each group of liquid conducting holes 1113 overlapped; the hole center distance between adjacent liquid conducting holes 1113 is set to be greater than or equal to 10 ⁇ m, so that when adjacent liquid conducting holes 1113 overlap, the adjacent liquid conducting holes 1113 overlap at most half.
  • the spacing D3 between two adjacent groups of liquid conducting holes 1113 is the spacing between two adjacent liquid conducting holes 1113 between the two groups of liquid conducting holes 1113, and the spacing between two adjacent groups of liquid conducting holes 1113 is greater than or equal to 30 ⁇ m. If the spacing D3 between two adjacent groups of liquid conducting holes 1113 is less than 30 ⁇ m, there may be a problem that the liquid supply is too large and the heating film 112 cannot be atomized in time, causing leakage and reducing the atomization taste. Exemplarily, the spacing D3 between two adjacent groups of liquid conducting holes 1113 is greater than or equal to 30 ⁇ m and less than or equal to 90 ⁇ m. Exemplarily, the spacing D3 between two adjacent groups of liquid conducting holes 1113 is 50 ⁇ m. Exemplarily, the spacing D3 between two adjacent groups of liquid conducting holes 1113 is 40 ⁇ m.
  • the plurality of liquid guide holes 1113 in each row are divided into a plurality of groups of liquid guide holes 113; in each group of liquid guide holes 1113, the hole center distance between adjacent liquid guide holes 1113 is greater than or equal to 20 ⁇ m and less than or equal to 60 ⁇ m. It can be understood that the hole center distance between adjacent liquid guide holes 1113 in each group of liquid guide holes 1113 affects the porosity of the substrate 111, thereby affecting the liquid supply capacity. Setting the hole center distance to be greater than or equal to 20 ⁇ m and less than or equal to 60 ⁇ m enables the substrate 111 to have a better liquid supply capacity and can ensure the strength of the substrate 111.
  • the cross-sectional shape of each part of the liquid guide hole 1113 is the same; along the direction from the atomizing surface 1112 to the liquid suction surface 1111, the cross-sectional area of the liquid guide hole 1113 gradually decreases.
  • the cross-sectional area refers to the cross-sectional area along the direction parallel to the atomizing surface 1112.
  • the cross-sectional shape of the liquid guide hole 1113 is circular, and the longitudinal cross-sectional shape of the liquid guide hole 1113 is an isosceles trapezoid; the longitudinal cross-sectional area refers to the cross-sectional area along the thickness direction parallel to the substrate 111.
  • the aperture of the liquid guide hole 1113 is the aperture of the port of the liquid guide hole 1113 located at the atomizing surface 1112.
  • the hole center distance D1 between adjacent liquid guide holes 1113 in each column is the hole center distance between the ports of adjacent liquid guide holes 1113 in each column located on the atomization surface 1112;
  • the hole center distance D2 between adjacent liquid guide holes 1113 in each row is the hole center distance between the ports of adjacent liquid guide holes 1113 in each row located on the atomization surface 1112.
  • the cross-sectional shape of each part of the liquid guiding hole 1113 is the same; along the direction from the atomizing surface 1112 to the liquid absorbing surface 1111, the cross-sectional area of the liquid guiding hole 1113 is the same; wherein the cross-sectional area refers to the cross-sectional area along the direction parallel to the atomizing surface 1112.
  • the cross-sectional shape of the liquid guiding hole 1113 is circular, and the longitudinal cross-sectional shape of the liquid guiding hole 1113 is rectangular; wherein the longitudinal cross-sectional area refers to the cross-sectional area along the direction parallel to the thickness of the substrate 111.
  • liquid absorption surface 1111 and the atomization surface 1112 are arranged in parallel to facilitate processing and assembly.
  • the substrate 111 is a dense substrate.
  • the material of the substrate 111 is at least one of glass and dense ceramics. It is understandable that the material of the substrate 111 includes but is not limited to glass and dense ceramics, and is specifically designed according to needs.
  • the substrate 111 made of dense materials such as glass has a smooth surface, so a continuous and stable metal heating film 112 can be deposited on the surface of the substrate 111 by physical vapor deposition or chemical vapor deposition.
  • the thickness of the heating film 112 is in the range of a few microns or nanometers, which can not only miniaturize the heating component 11, but also save the material of the heating film 112.
  • the substrate 111 is a porous substrate.
  • the material of the substrate 111 is porous ceramics; porous ceramics are porous ceramic materials with open pore diameters and high open porosity prepared by molding and special high-temperature sintering processes of raw materials, and the porous ceramics form multiple disordered pores during the preparation process.
  • the thickness of the substrate 111 is 0.2mm-2.5mm.
  • the thickness of the substrate 111 is greater than 2.5mm, the liquid supply demand cannot be met, resulting in a decrease in the amount of aerosol, and a large amount of heat loss is caused. It is not easy to penetrate when forming the liquid guide hole 1113, and the cost of setting the liquid guide hole 1113 is high; when the thickness of the substrate 111 is less than 0.2mm, the strength of the substrate 111 cannot be guaranteed, which is not conducive to improving the performance of the electronic atomization device.
  • the thickness of the substrate 111 is 0.2mm-0.5mm.
  • the thickness of the substrate 111 is 0.2mm-1mm.
  • the heating film 112 includes a heating portion 1121, a first electrode 1122, and a second electrode 1123.
  • the heating portion 1121 is in a long strip shape, and the heating portion 1121 extends linearly along the first direction X.
  • the first electrode 1122 and the second electrode 1123 are respectively disposed at opposite ends of the heating portion 1121 along the first direction X.
  • the first electrode 1122 is a positive electrode
  • the second electrode 1123 is a negative electrode
  • the current flow direction of the heating portion 1121 is from the first electrode 1122 to the second electrode 1123.
  • a plurality of liquid-conducting holes 1113 are arranged in a plurality of rows and columns, the row direction is parallel to the first direction X, and the column direction is parallel to the second direction Y. Two adjacent rows of liquid-conducting holes 1113 are arranged at intervals.
  • the plurality of liquid-conducting holes 1113 in each row are divided into a plurality of groups of liquid-conducting holes 1113.
  • Each group of liquid-conducting holes 1113 includes two liquid-conducting holes 1113, and the two liquid-conducting holes 1113 in each group of liquid-conducting holes 1113 are interconnected.
  • the number of liquid-conducting holes 1113 in each group of liquid-conducting holes 1113 is two; the hole center distances between adjacent liquid-conducting holes 1113 in each group of liquid-conducting holes 1113 are the same; the plurality of liquid-conducting holes 1113 in each row are divided into a plurality of groups of liquid-conducting holes 1113, and the spacings between two adjacent groups of liquid-conducting holes 1113 are the same.
  • the cross-sectional shape of the liquid guide hole 1113 is circular, and the longitudinal cross-sectional shape of the liquid guide hole 1113 is an isosceles trapezoid.
  • a plurality of liquid-conducting holes 1113 are arranged in a plurality of rows and columns, the row direction is parallel to the first direction X, and the column direction is parallel to the second direction Y. Two adjacent rows of liquid-conducting holes 1113 are arranged at intervals.
  • the plurality of liquid-conducting holes 1113 in each row are divided into a plurality of groups of liquid-conducting holes 1113.
  • Each group of liquid-conducting holes 1113 includes five liquid-conducting holes 1113, and the adjacent liquid-conducting holes 1113 in each group of liquid-conducting holes 1113 are interconnected.
  • the number of liquid-conducting holes 1113 in each group of liquid-conducting holes 1113 is five; the hole center distances between the adjacent liquid-conducting holes 1113 in each group of liquid-conducting holes 1113 are the same; the plurality of liquid-conducting holes 1113 in each row are divided into a plurality of groups of liquid-conducting holes 1113, and the spacing between the adjacent two groups of liquid-conducting holes 1113 is the same.
  • the cross-sectional shape of the liquid guide hole 1113 is circular, and the longitudinal cross-sectional shape of the liquid guide hole 1113 is an isosceles trapezoid.
  • a plurality of liquid guide holes 1113 are arranged in a plurality of rows and columns, the row direction is parallel to the first direction X, and the column direction is parallel to the second direction Y. Two adjacent rows of liquid guide holes 1113 are arranged at intervals.
  • the plurality of liquid guide holes 1113 in each row are divided into a plurality of groups of liquid guide holes 1113.
  • Each group of liquid guide holes 1113 includes twelve liquid guide holes 1113, and each group of liquid guide holes Adjacent liquid guide holes 1113 in 1113 are interconnected.
  • the number of liquid guide holes 1113 in each group of liquid guide holes 1113 is twelve; the hole center distances between adjacent liquid guide holes 1113 in each group of liquid guide holes 1113 are the same; the multiple liquid guide holes 1113 in each row are divided into multiple groups of liquid guide holes 1113, and the spacing between two adjacent groups of liquid guide holes 1113 is the same.
  • the cross-sectional shape of the liquid guiding hole 1113 is circular, and the longitudinal cross-sectional shape of the liquid guiding hole 1113 is an isosceles trapezoid.
  • FIG. 9 is a comparison diagram of current density distribution of the first experimental piece, the second experimental piece and the third experimental piece.
  • FIG. 10 is a comparison diagram of Joule heat distribution of the first experimental piece, the second experimental piece and the third experimental piece.
  • the substrate of the prior art is defined as the first experimental piece.
  • the substrate of the prior art has a plurality of liquid-conducting holes, and the plurality of liquid-conducting holes are arranged in a plurality of rows and columns; the liquid-conducting holes in any two adjacent rows are arranged at intervals, and the liquid-conducting holes in any two adjacent columns are arranged at intervals; the spacing between the liquid-conducting holes in any two adjacent rows is consistent, and the spacing between the liquid-conducting holes in any two adjacent columns is consistent, and the spacing between the liquid-conducting holes in two adjacent rows is consistent with the spacing between the liquid-conducting holes in two adjacent columns.
  • the porosity of the substrate of the prior art is increased by a conventional method, and the substrate with the porosity increased by the conventional method is defined as the second experimental piece. Specifically, the spacing between two adjacent rows of liquid guide holes is reduced, and the spacing between two adjacent columns of liquid guide holes is reduced, while other parameters such as pore diameter and opening shape are kept unchanged.
  • the porosity of the substrate of the prior art is increased by the method of the present application, which is defined as the third experimental piece.
  • the multiple liquid guide holes 1113 in each row are divided into multiple groups of liquid guide holes 1113, each group of liquid guide holes 1113 includes five liquid guide holes 1113, and the adjacent liquid guide holes 1113 in each group of liquid guide holes 1113 are interconnected; at the same time, the spacing between two adjacent rows of liquid guide holes is not changed, and other parameters such as pore size, opening shape, etc. are kept unchanged.
  • the porosity is increased by the method provided by the present application, the porosity is increased, the cross-sectional area of the conductive channel between two adjacent rows of liquid guide holes 1113 remains unchanged, and the heat flux density is increased. The degree remains unchanged, showing that the current distribution density is almost consistent with that of the first experimental piece, and excessive local heat flux density can be avoided.

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Abstract

本申请公开了一种发热组件、雾化器及电子雾化装置，发热组件包括基体和发热膜；基体包括相对设置的吸液面和雾化面，基体上设有贯穿吸液面和雾化面的多个导液孔；发热膜设于雾化面，导液孔延伸至发热膜并贯穿发热膜；其中，发热膜的电流流动方向定义为第一方向，垂直于发热膜的电流流动方向定义为第二方向，多个导液孔在第一方向上的排布密度大于多个导液孔在第二方向上的排布密度，在增大基体孔隙率的同时保证发热膜的稳定性。

Description

发热组件、雾化器及电子雾化装置
相关申请的交叉引用
本申请基于2023年05月17日提交的中国专利申请202321202509.5主张其优先权，此处通过参照引入其全部的记载内容。
技术领域
本申请涉及电子雾化技术领域，具体涉及一种发热组件、雾化器及电子雾化装置。
背景技术
电子雾化装置由发热组件、电池和控制电路等部分组成，发热组件作为电子雾化装置的核心元件，其特性决定了电子雾化装置的雾化效果和使用体验。
现有的发热组件较为常见的雾化方式为电阻加热。具体地，发热组件包括基体和设于基体的表面的发热膜；其中，基体上设有贯穿孔，贯穿孔用于导引气溶胶生成基质。为了提高发热组件的孔隙率，增加贯穿孔的密度是最直接的方法之一。但现有的均匀造孔方法在增加孔密度的同时，孔与孔之间的间距也随之减小，增加了发热膜电阻，降低了发热膜的稳定性，导致发热组件工作过程中失效的情况大大增加。
发明内容
本申请提供的发热组件、雾化器及电子雾化装置，以在提高孔密度的同时提高发热膜的稳定性。
为了解决上述技术问题，本申请提供的第一个技术方案为：提供一种发热组件，应用于电子雾化装置，用于雾化气溶胶生成基质，所述发热组件包括基体和发热膜；所述基体包括相对设置的吸液面和雾化面；所述基体上设有贯穿所述吸液面和所述雾化面的多个导液孔；所述发热膜设于所述雾化面；所述导液孔延伸至所述发热膜并贯穿所 述发热膜；其中，所述发热膜的电流流动方向定义为第一方向，垂直于所述发热膜的电流流动方向定义为第二方向；多个所述导液孔在所述第一方向上的排布密度大于多个所述导液孔在所述第二方向上的排布密度。
在一实施方式中，所述发热膜包括发热部、第一电极和第二电极；所述发热部呈长条状，所述发热部沿所述第一方向直线延伸；所述第一电极和所述第二电极沿所述第一方向分别设于所述发热部相对的两端。
在一实施方式中，多个所述导液孔排列成多行多列，行方向与所述第一方向平行，列方向与所述第二方向平行；每行的多个所述导液孔间隔设置，每列的多个所述导液孔间隔设置。
在一实施方式中，所述导液孔的孔径为大于等于20μm且小于等于50μm；每行中相邻的所述导液孔之间的孔中心距小于等于100μm；和/或每列中相邻的所述导液孔之间的孔中心距大于等于40μm且小于等于100μm。
在一实施方式中，多个所述导液孔排列成多行多列，行方向与所述第一方向平行，列方向与所述第二方向平行；每行的多个所述导液孔中的至少两个相互连通；每列的多个所述导液孔之间间隔设置。
在一实施方式中，每行的多个所述导液孔中的至少两个所述导液孔位于所述雾化面的端口相互交叠。
在一实施方式中，每行的多个所述导液孔分为多组导液孔；每组所述导液孔包括至少两个所述导液孔，且每组所述导液孔中所有所述导液孔相互连通。
在一实施方式中，每组所述导液孔中的所述导液孔的数量相同；和/或每组所述导液孔中相邻的所述导液孔之间的孔中心距相同；和/或每行的多个所述导液孔分为多组导液孔中，相邻的两组所述导液孔之间的间距相同。
在一实施方式中，所述导液孔的孔径为大于等于20μm且小于等于50μm；每行的多个所述导液孔分为多组导液孔中，相邻的所述导液孔之间的孔中心距小于等于100μm；和/或每列中相邻的所述导 液孔之间的孔中心距大于等于40μm且小于等于100μm。
在一实施方式中，所述基体为致密基体或多孔基体。
在一实施方式中，所述基体为致密基体，所述基体的材料为玻璃、致密陶瓷中的至少一种；或，
所述基体为多孔基体，所述基体的材料为多孔陶瓷。
在一实施方式中，所述基体的厚度为0.2mm-2.5mm。
为了解决上述技术问题，本申请提供的第二个技术方案为：提供一种雾化器，包括储液腔和发热组件；所述储液腔用于储存气溶胶生成基质；所述发热组件与所述储液腔流体连通，所述发热组件用于雾化所述气溶胶生成基质；所述发热组件为上述任意一项所述的发热组件。
为了解决上述技术问题，本申请提供的第三个技术方案为：提供一种电子雾化装置，包括：上述所述的雾化器和主机；所述主机用于为所述雾化器的发热组件工作提供电能和控制所述雾化器的发热组件雾化所述气溶胶生成基质。
本申请的有益效果：区别于现有技术，本申请公开了一种发热组件、雾化器及电子雾化装置；发热组件包括基体和发热膜；基体包括相对设置的吸液面和雾化面，基体上设有贯穿吸液面和雾化面的多个导液孔；发热膜设于雾化面，导液孔延伸至发热膜并贯穿发热膜；其中，发热膜的电流流动方向定义为第一方向，垂直于发热膜的电流流动方向定义为第二方向，多个导液孔在第一方向上的排布密度大于多个导液孔在第二方向上的排布密度，在增大基体孔隙率的同时保证发热膜的稳定性。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图。
图1是本申请提供的电子雾化装置的一实施例的结构示意图；
图2是本申请一实施例提供的雾化器的结构示意图；
图3是本申请实施例提供的发热组件的结构示意图；
图4是图3所示的发热组件沿A-A线的截面示意图；
图5a是图3所示的发热组件的基体一实施方式的局部结构示意图；
图5b是图5a所示的基体沿B-B线的截面示意图；
图6a是图3所示的发热组件的基体另一实施方式的局部结构示意图；
图6b是图6a所示的基体沿C-C线的截面示意图；
图7a是图3所示的发热组件的基体又一实施方式的局部结构示意图；
图7b是图7a所示的基体沿D-D线的截面示意图；
图8a是图3所示的发热组件的基体又一实施方式的局部结构示意图；
图8b是图8a所示的基体沿E-E线的截面示意图；
图9是第一实验件、第二实验件和第三实验件的电流密度分布比较图；
图10是第一实验件、第二实验件和第三实验件的焦耳热分布比较图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
以下描述中，为了说明而不是为了限定，提出了诸如特定系统结构、接口、技术之类的具体细节，以便透彻理解本申请。
本申请中的术语“第一”、“第二”、“第三”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的 数量。由此，限定有“第一”、“第二”、“第三”的特征可以明示或者隐含地包括至少一个所述特征。本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。本申请实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果所述特定姿态发生改变时，则所述方向性指示也相应地随之改变。本申请实施例中的术语“包括”和“具有”以及它们任何变形，意图在于覆盖不排他的包含。例如包含了一系列步骤或单元的过程、方法、系统、产品或设备没有限定于已列出的步骤或单元，而是可选地还包括没有列出的步骤或单元，或可选地还包括对于这些过程、方法、产品或设备固有的其它步骤或组件。
在本文中提及“实施例”意味着，结合实施例描述的特定特征、结构或特性可以包含在本申请的至少一个实施例中。在说明书中的各个位置出现所述短语并不一定均是指相同的实施例，也不是与其它实施例互斥的独立的或备选的实施例。本领域技术人员显式地和隐式地理解的是，本文所描述的实施例可以与其它实施例相结合。
下面结合附图和实施例对本申请进行详细的说明。
请参阅图1，图1是本申请提供的电子雾化装置的一实施例的结构示意图。
在本实施例中，提供一种电子雾化装置100。该电子雾化装置100可用于气溶胶生成基质的雾化。电子雾化装置100包括相互电连接的雾化器1和主机2。
其中，雾化器1用于存储气溶胶生成基质并雾化气溶胶生成基质以形成可供用户吸食的气溶胶。该雾化器1具体可用于不同的领域，比如，医疗、美容、休闲吸食等。在一具体实施例中，该雾化器1可用于电子气溶胶化装置，用于雾化气溶胶生成基质并产生气溶胶，以供抽吸者抽吸，以下实施例均以此休闲吸食为例。
雾化器1的具体结构与功能可参见以下实施例所涉及的雾化器1的具体结构与功能，且可实现相同或相似的技术效果，在此不再赘述。
主机2包括电池(图未示)和控制器(图未示)。电池用于为雾 化器1的工作提供电能，以使得雾化器1能够雾化气溶胶生成基质形成气溶胶；控制器用于控制雾化器1工作，即，控制雾化器1雾化气溶胶生成基质。主机2还包括电池支架、气流传感器等其他元件。
雾化器1与主机2可以是一体设置，也可以是可拆卸连接，可以根据具体需要进行设计。
请参阅图2，图2是本申请一实施例提供的雾化器的结构示意图。
雾化器1包括壳体10、发热组件11、雾化座12。雾化座12具有安装腔(图未标)，发热组件11设于该安装腔内；发热组件11同雾化座12一起设于壳体10内。壳体10形成有出雾通道13，壳体10的内表面、出雾通道13的外表面与雾化座12的顶面配合形成储液腔14，储液腔14用于存储液态气溶胶生成基质。其中，发热组件11与主机2电连接，以雾化气溶胶生成基质生成气溶胶。
雾化座12包括上座121和下座122，上座121与下座122配合形成安装腔；发热组件11背离储液腔14的表面与安装腔的腔壁配合形成雾化腔120。上座121上设有下液通道1211；储液腔14内的气溶胶生成基质通道下液通道1211流入发热组件11，即，发热组件11与储液腔14流体连通。下座122上设有进气通道15，外界气体经进气通道15进入雾化腔120，携带发热组件11雾化好的气溶胶流至出雾通道13，用户通过出雾通道13的端口吸食气溶胶。
请参阅图3-图8b，图3是本申请实施例提供的发热组件的结构示意图，图4是图3所示的发热组件沿A-A线的截面示意图，图5a是图3所示的发热组件的基体一实施方式的局部结构示意图，图5b是图5a所示的基体沿B-B线的截面示意图，图6a是图3所示的发热组件的基体另一实施方式的局部结构示意图，图6b是图6a所示的基体沿C-C线的截面示意图，图7a是图3所示的发热组件的基体又一实施方式的局部结构示意图，图7b是图7a所示的基体沿D-D线的截面示意图，图8a是图3所示的发热组件的基体又一实施方式的局部结构示意图，图8b是图8a所示的基体沿E-E线的截面示意图。
发热组件11包括基体111和发热膜112。基体111包括相对设置的吸液面1111和雾化面1112。基体111上设有贯穿吸液面1111 和雾化面1112的多个导液孔1113，导液孔1113具有毛细作用力，导液孔1113用于将气溶胶生成基质从吸液面1111导引至雾化面1112。发热膜112设于雾化面1112，导液孔1113延伸至发热膜112并贯穿发热膜112。发热膜112用于加热雾化气溶胶生成基质。
发热膜112的电流流动方向定义为第一方向X，垂直于发热膜112的电流流动方向定义为第二方向Y。多个导液孔1113在第一方向X上的排布密度大于多个导液孔1113在第二方向Y上的排布密度。
现有技术中多个导液孔在第一方向上的排布密度与多个导液孔在第二方向上的排布密度相同。相对于现有技术，本申请通过使多个导液孔1113在第一方向X上的排布密度大于多个导液孔1113在第二方向Y上的排布密度，增大了基体111的孔隙率，同时保证了第二方向Y上的导液孔1113之间的间距，利于提高发热膜112的稳定性。
在一实施方式中，相对于现有技术，仅沿电流流动的方向增加导液孔1113的排布密度；也就是说，仅增大多个导液孔1113在第一方向X上的排布密度，多个导液孔1113在第二方向Y上的排布密度与现有技术中的排布密度相同。
需要说明的是，依据电阻定律，对于同种材料，长度与电阻大小成正比，横截面积与电阻大小成反比。使用传统的整列方式增加孔密度(传统增加孔密度的方式为：多个导液孔排列成多行多列，行方向上的多个导液孔之间间隔设置，列方向上的多个导液孔之间间隔设置，同时缩小行方向上的相邻导液孔之间的间距和列方向上的相邻导液孔之间的间距，且行方向上缩小的间距与列方向上缩小的间距相同)，会直接导致行方向上孔与孔之间的间距减小(即，行方向上的孔排布密度增大)，列方向上的孔与孔之间的间距减小(即，列方向上的孔排布密度增大)。若行方向为电流的流动方向，列方向为垂直于电流流动的方向，列方向上的孔与孔之间的间距减小，会导致电流流过的横截面积减小，继而电阻增大；横截面积减小的同时，也会带来局部发热膜体积的减小，在使用恒定功率电源雾化时，局部的热流密度将进一步增大，从而引发发热膜的局部温度过高，继而产生应力不均的 发热膜断裂，或是温度过高的熔断问题。本申请通过仅沿电流流动的方向增加导液孔1113的排布密度，使得垂直于电流流动方向的导液孔1113的排布密度与现有技术中的列方向上的导液孔的排布密度相同，进而使得电流流过的横截面积不变，在增大孔隙率的同时保证发热膜112的电阻不变，电流分布密度几乎与原本一致，避免了局部热流密度过高导致的发热膜112断裂或熔断的问题。
在一实施方式中，相对于现有技术，沿电流流动的方向增加导液孔1113的排布密度，沿垂直于电流流动方向也增加导液孔1113的排布密度。示例性的，缩小电流流动方向上相邻导液孔1113之间的间距，同时缩小垂直于电流流动方向上的相邻导液孔1113之间的间距，电流流动方向上的缩小的间距大于垂直于电流流动方向上缩小的间距；其中，垂直于电流流动方向上缩小的间距设计为垂直于电流流动方向上的相邻导液孔1113之间的间距维持一个发热膜112不易失效的安全值。
在一实施方式中，多个导液孔1113排列成多行多列，行方向与第一方向X平行，列方向与第二方向Y平行。每行的多个导液孔1113间隔设置，每列的多个导液孔1113间隔设置(如图5a和图5b所示)。需要说明的是，通过缩小每行的相邻导液孔1113之间的间距实现增大行方向上导液孔1113的排布密度；和/或通过缩小每列的相邻导液孔1113之间的间距实现增大列方向上导液孔1113的排布密度。
可选的，每列中相邻的导液孔1113之间的孔中心距D1大于等于40μm且小于等于100μm。可以理解，每列中相邻的导液孔1113之间的孔中心距D1与导液孔1113的孔径相关，导液孔1113的孔径大致为大于等于20μm且小于等于50μm，将每列中相邻的导液孔1113之间的孔中心距D1设置为大于等于40μm且小于等于100μm，保证每列中相邻的导液孔1113之间相互独立，保证相邻两行导液孔1113之间的部分发热膜112的有效宽度，实现导电。示例性的，每列中相邻的导液孔1113之间的孔中心距D1大于等于40μm且小于等于80μm。示例性的，每列中相邻的导液孔1113之间的孔中心距D1 为50μm。示例性的，每列中相邻的导液孔1113之间的孔中心距D1为90μm。
可选的，每行中相邻的导液孔1113之间的孔中心距D2小于等于100μm。可以理解，每行中相邻的导液孔1113之间的孔中心距D2与导液孔1113的孔径相关，导液孔1113的孔径大致为大于等于20μm且小于等于50μm，将每行中相邻的导液孔1113之间的孔中心距D2设置为小于等于100μm，保证每行中相邻的导液孔1113之间相互独立。每行中相邻的导液孔1113之间间距对发热膜112的电流流过的横截面积几乎不会产生影响，因此，每行中相邻的导液孔1113之间的间距可以在工艺条件能够实现的情况下尽可能的小；每行中相邻的导液孔1113之间的孔中心距D2太大，不利于提高基体111的孔隙率，降低了基体111的供液量，可能存在无法满足发热膜112雾化需求的问题。示例性的，每行中相邻的导液孔1113之间的孔中心距D2大于等于30μm且小于等于90μm。示例性的，每行中相邻的导液孔1113之间的孔中心距D2为50μm。示例性的，每行中相邻的导液孔1113之间的孔中心距D2为40μm。
在一实施方式中，多个导液孔1113排列成多行多列，行方向与第一方向X平行，列方向与第二方向Y平行。每行的多个导液孔1113中至少两个相互连通；其中，相互连通指的是导液孔1113之间直接连通。每列的多个导液孔1113之间间隔设置(如图6a-图8b所示)。需要说明的是，通过使每行的多个导液孔1113中至少两个相互连通来实现增大行方向上导液孔1113的排布密度；和/或通过缩小每列的相邻导液孔1113之间的间距实现增大列方向上导液孔1113的排布密度。
可选的，每行的多个导液孔1113中的至少两个导液孔1113位于雾化面1112的端口相互交叠，以实现至少两个导液孔1113之间的相互连通。两个导液孔1113位于雾化面1112的端口相互交叠，指的是两个导液孔1113位于雾化面1112的端口部分重叠，从而使得两个导液孔1113靠近雾化面1112的孔段部分连通。例如，参见图6b，两个 导液孔1113位于虚线L以上的部分相互连通，两个导液孔1113位于虚线L以下的部分相互独立。
可选的，每行的多个导液孔1113分为多组导液孔1113；每组导液孔1113包括至少两个导液孔1113，且每组导液孔1113中所有导液孔1113相互连通。每组导液孔1113中相邻的两个导液孔1113位于雾化面1112的端口相互交叠。每组导液孔1113中的导液孔1113的数量相同；和/或每组导液孔1113中相邻的导液孔1113之间的孔中心距相同；和/或每行的多个导液孔1113分为多组导液孔1113中，相邻的两组导液孔1113之间的间距相同，便于加工，且保证基体111各处供液量的一致性。需要说明的是，每组导液孔1113中的导液孔1113的数量可以不同，每组导液孔1113中相邻的导液孔1113之间的孔中心距可以不同，相邻的两组导液孔1113之间的间距可以不同，具体根据需要进行设计。
可选的，每列中相邻的导液孔1113之间的孔中心距D1大于等于40μm且小于等于100μm。可以理解，每列中相邻的导液孔1113之间的孔中心距D1与导液孔1113的孔径相关，导液孔1113的孔径大致为大于等于20μm且小于等于50μm，将每列中相邻的导液孔1113之间的孔中心距D1设置为大于等于40μm且小于等于100μm，保证每列中相邻的导液孔1113之间相互独立，保证相邻两行导液孔1113之间的部分发热膜112的有效宽度，实现导电。示例性的，每列中相邻的导液孔1113之间的孔中心距D1大于等于40μm且小于等于80μm。示例性的，每列中相邻的导液孔1113之间的孔中心距D1为50μm。示例性的，每列中相邻的导液孔1113之间的孔中心距D1为90μm。
可选的，每行的多个导液孔1113分为多组导液孔1113中，相邻的导液孔1113之间的孔中心距小于等于100μm；相邻的导液孔1113之间的孔中心距大于等于10μm。可以理解，每行中相邻的导液孔1113之间的孔中心距与导液孔1113的孔径相关，导液孔1113的孔径大致为大于等于20μm且小于等于50μm，将每行中相邻的导液孔1113之间的孔中心距设置为小于等于100μm，保证每行中相邻的导 液孔1113之间可以相互独立，也可以交叠，即，使得每行多个导液孔1113可以分为多组导液孔1113，相邻的两组导液孔1113之间间隔，每组导液孔1113内的多个导液孔1113之间交叠；将相邻的导液孔1113之间的孔中心距设置为大于等于10μm，使得相邻的导液孔1113交叠时，相邻的导液孔1113至多交叠一半。
相邻的两组导液孔1113之间的间距D3为两组导液孔1113之间相邻的两个导液孔1113之间的间距，相邻的两组导液孔1113之间的间距大于等于30μm。相邻的两组导液孔1113之间的间距D3小于30μm，可能存在供液量太大，发热膜112无法及时雾化的问题，造成漏液，降低雾化口感。示例性的，相邻的两组导液孔1113之间的间距D3大于等于30μm且小于等于90μm。示例性的，相邻的两组导液孔1113之间的间距D3为50μm。示例性的，相邻的两组导液孔1113之间的间距D3为40μm。
可选的，每行的多个导液孔1113分为多组导液孔113；每组导液孔1113中，相邻的导液孔1113之间孔中心距大于等于20μm且小于等于60μm。可以理解，每组导液孔1113中的相邻的导液孔1113之间孔中心距影响着基体111的孔隙率，从而影响供液能力，将孔中心距设置为大于等于20μm且小于等于60μm，使得基体111具有较好的供液能力，且能够保证基体111的强度。
在一实施方式中，导液孔1113各处的横截面形状相同；沿着雾化面1112指向吸液面1111的方向，导液孔1113的横截面面积逐渐减小。其中，横截面指的是沿着平行于雾化面1112的方向的截面。可选的，导液孔1113的横截面形状为圆形，导液孔1113的纵截面形状为等腰梯形；其中，纵截面指的是沿着平行于基体111的厚度方向的截面。需要说明的是，此时，导液孔1113的孔径为导液孔1113位于雾化面1112的端口的孔径。每列中相邻的导液孔1113之间的孔中心距D1为每列中相邻的导液孔1113位于雾化面1112的端口之间的孔中心距；每行中相邻的导液孔1113之间的孔中心距D2为每行中相邻的导液孔1113位于雾化面1112的端口之间的孔中心距。
在一实施方式中，导液孔1113各处的横截面形状相同；沿着雾化面1112指向吸液面1111的方向，导液孔1113的横截面面积一致；其中，横截面指的是沿着平行于雾化面1112的方向的截面。可选的，导液孔1113的横截面形状为圆形，导液孔1113的纵截面形状为矩形；其中，纵截面指的是沿着平行于基体111的厚度方向的截面。
在一实施方式中，吸液面1111与雾化面1112平行设置，便于加工以及便于装配。
在一实施方式中，基体111为致密基体。可选的，基体111的材料为玻璃、致密陶瓷中的至少一种。可以理解，基体111的材料包括但不限于玻璃、致密陶瓷，具体根据需要进行设计。采用玻璃等致密材料制得的基体111，由于基体111的表面光滑，因此可以采用物理气相沉积或化学气相沉积的方式，在基体111的表面沉积连续稳定的金属发热膜112，发热膜112的厚度在几微米或纳米级厚度范围内，不仅可以使得发热组件11小型化，而且可以节省发热膜112材料。
在一实施方式中，基体111为多孔基体。可选的，基体111的材料为多孔陶瓷；多孔陶瓷是对原料经过成型和特殊高温烧结工艺制备的一种具有开孔孔径、高开口气孔率的一种多孔性陶瓷材料，多孔陶瓷在制备过程中形成多个无序孔。
在一实施方式中，基体111的厚度为0.2mm-2.5mm。基体111的厚度大于2.5mm时，无法满足供液需求，导致气溶胶量下降，且造成的热损失多，形成导液孔1113时不易穿透，设置导液孔1113的成本高；基体111的厚度小于0.2mm时，无法保证基体111的强度，不利于提高电子雾化装置的性能。可选的，基体111的厚度为0.2mm-0.5mm。可选的，基体111的厚度为0.2mm-1mm。
在一实施方式中，发热膜112包括发热部1121、第一电极1122和第二电极1123。发热部1121呈长条状，发热部1121沿第一方向X直线延伸。第一电极1122和第二电极1123沿第一方向X分别设于发热部1121相对的两端。示例性的，第一电极1122为正电极，第二电极1123为负电极，发热部1121的电流流动方向为第一电极1122指向第二电极1123。
示例性的，如图6a和图6b所示，多个导液孔1113排列成多行多列，行方向与第一方向X平行，列方向与第二方向Y平行。相邻两行导液孔1113之间间隔设置。每行的多个导液孔1113分为多组导液孔1113。每组导液孔1113包括两个导液孔1113，且每组导液孔1113中两个导液孔1113相互连通。每组导液孔1113中的导液孔1113的数量均为两个；每组导液孔1113中相邻的导液孔1113之间的孔中心距相同；每行的多个导液孔1113分为多组导液孔1113中，相邻的两组导液孔1113之间的间距相同。其中，每组导液孔1113中两个导液孔1113位于雾化面1112的端口相互交叠，增加体积孔隙率，提升供液效果，有利于雾化量提升，同时不影响雾化面1112上发热膜112内电流通过；每组导液孔1113中的两个导液孔1113位于吸液面1111的端口相互间隔，有助于加热雾化时减少返气。导液孔1113的横截面形状为圆形，导液孔1113的纵截面形状为等腰梯形。
示例性的，如图7a和图7b所示，多个导液孔1113排列成多行多列，行方向与第一方向X平行，列方向与第二方向Y平行。相邻两行导液孔1113之间间隔设置。每行的多个导液孔1113分为多组导液孔1113。每组导液孔1113包括五个导液孔1113，且每组导液孔1113中相邻的导液孔1113之间相互连通。每组导液孔1113中的导液孔1113的数量均为五个；每组导液孔1113中相邻的导液孔1113之间的孔中心距相同；每行的多个导液孔1113分为多组导液孔1113中，相邻的两组导液孔1113之间的间距相同。其中，每组导液孔1113中五个导液孔1113位于雾化面1112的端口相互交叠，增加体积孔隙率，提升供液效果，有利于雾化量提升，同时不影响雾化面1112上发热膜112内电流通过；每组导液孔1113中的五个导液孔1113位于吸液面1111的端口相互间隔，有助于加热雾化时减少返气。导液孔1113的横截面形状为圆形，导液孔1113的纵截面形状为等腰梯形。
示例性的，如图8a和图8b所示，多个导液孔1113排列成多行多列，行方向与第一方向X平行，列方向与第二方向Y平行。相邻两行导液孔1113之间间隔设置。每行的多个导液孔1113分为多组导液孔1113。每组导液孔1113包括十二个导液孔1113，且每组导液孔 1113中相邻的导液孔1113之间相互连通。每组导液孔1113中的导液孔1113的数量均为十二个；每组导液孔1113中相邻的导液孔1113之间的孔中心距相同；每行的多个导液孔1113分为多组导液孔1113中，相邻的两组导液孔1113之间的间距相同。其中，每组导液孔1113中十二个导液孔1113位于雾化面1112的端口相互交叠，增加体积孔隙率，提升供液效果，有利于雾化量提升，同时不影响雾化面1112上发热膜112内电流通过；每组导液孔1113中的十二个导液孔1113位于吸液面1111的端口相互间隔，有助于加热雾化时减少返气。导液孔1113的横截面形状为圆形，导液孔1113的纵截面形状为等腰梯形。
请参阅图9和图10，图9是第一实验件、第二实验件和第三实验件的电流密度分布比较图，图10是第一实验件、第二实验件和第三实验件的焦耳热分布比较图。
将现有技术的基体定义为第一实验件。现有技术的基体上具有多个导液孔，多个导液孔排布呈多行多列；任意相邻两行导液孔之间间隔设置，任意相邻两列导液孔之间间隔设置；任意相邻两行导液孔之间的间距一致，任意相邻两列导液孔之间的间距一致，相邻两行导液孔之间的间距与相邻两列导液孔之间的间距一致。
对现有技术的基体使用传统方式增加孔隙率，将使用传统方式增加孔隙率的基体定义为第二实验件。具体地，缩小相邻两行导液孔之间的间距，同时缩小相邻两列导液孔之间的间距，保持其他参数不变，例如孔径，开孔形状等。
对现有技术的基体使用本申请的方式增加孔隙率，定义为第三实验件。具体地，每行的多个导液孔1113分为多组导液孔1113，每组导液孔1113包括五个导液孔1113，且每组导液孔1113中相邻的导液孔1113之间相互连通；同时，不改变相邻两行导液孔之间的间距，保持其他参数不变，例如孔径，开孔形状等。
通过对第一实验件、第二实验件、第三实验件的电流分布密度和焦耳热分布进行比较可知，采用本申请提供的方式增加孔隙率，孔隙率增加，相邻两行导液孔1113之间的导电通道截面积不变，热流密 度不变，表现出电流分布密度几乎与第一实验件基本一致，且可以避免了局部热流密度过高。
以上仅为本申请的实施方式，并非因此限制本申请的专利范围，凡是利用本申请说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本申请的专利保护范围内。

Claims (14)

  1. 一种发热组件，应用于电子雾化装置，用于雾化气溶胶生成基质，其中，包括：
    基体，包括相对设置的吸液面和雾化面；所述基体上设有贯穿所述吸液面和所述雾化面的多个导液孔；
    发热膜，设于所述雾化面；所述导液孔延伸至所述发热膜并贯穿所述发热膜；
    其中，所述发热膜的电流流动方向定义为第一方向，垂直于所述发热膜的电流流动方向定义为第二方向；多个所述导液孔在所述第一方向上的排布密度大于多个所述导液孔在所述第二方向上的排布密度。
  2. 根据权利要求1所述的发热组件，其中，所述发热膜包括发热部、第一电极和第二电极；所述发热部呈长条状，所述发热部沿所述第一方向直线延伸；所述第一电极和所述第二电极沿所述第一方向分别设于所述发热部相对的两端。
  3. 根据权利要求1所述的发热组件，其中，多个所述导液孔排列成多行多列，行方向与所述第一方向平行，列方向与所述第二方向平行；每行的多个所述导液孔间隔设置，每列的多个所述导液孔间隔设置。
  4. 根据权利要求3所述的发热组件，其中，所述导液孔的孔径为大于等于20μm且小于等于50μm；每行中相邻的所述导液孔之间的孔中心距小于等于100μm；和/或每列中相邻的所述导液孔之间的孔中心距大于等于40μm且小于等于100μm。
  5. 根据权利要求1所述的发热组件，其中，多个所述导液孔排列成多行多列，行方向与所述第一方向平行，列方向与所述第二方向平行；每行的多个所述导液孔中的至少两个相互连通；每列的多个所述导液孔之间间隔设置。
  6. 根据权利要求5所述的发热组件，其中，每行的多个所述导液孔中的至少两个所述导液孔位于所述雾化面的端口相互交叠。
  7. 根据权利要求5所述的发热组件，其中，每行的多个所述导液孔分为多组导液孔；每组所述导液孔包括至少两个所述导液孔，且每组所述导液孔中所有所述导液孔相互连通。
  8. 根据权利要求7所述的发热组件，其中，每组所述导液孔中的所述导液孔的数量相同；和/或每组所述导液孔中相邻的所述导液孔之间的孔中心距相同；和/或每行的多个所述导液孔分为多组导液孔中，相邻的两组所述导液孔之间的间距相同。
  9. 根据权利要求7所述的发热组件，其中，所述导液孔的孔径为大于等于20μm且小于等于50μm；每行的多个所述导液孔分为多组导液孔中，相邻的所述导液孔之间的孔中心距小于等于100μm；和/或每列中相邻的所述导液孔之间的孔中心距大于等于40μm且小于等于100μm。
  10. 根据权利要求1所述的发热组件，其中，所述基体为致密基体或多孔基体。
  11. 根据权利要求10所述的发热组件，其中，所述基体为致密基体，所述基体的材料为玻璃、致密陶瓷中的至少一种；或，
    所述基体为多孔基体，所述基体的材料为多孔陶瓷。
  12. 根据权利要求1所述的发热组件，其中，所述基体的厚度为0.2mm-2.5mm。
  13. 一种雾化器，其中，包括：
    储液腔，用于储存气溶胶生成基质；
    发热组件，所述发热组件与所述储液腔流体连通，所述发热组件用于雾化所述气溶胶生成基质；所述发热组件为权利要求1-12任意一项所述的发热组件。
  14. 一种电子雾化装置，其中，包括：
    权利要求13所述的雾化器；
    主机，用于为所述雾化器的发热组件工作提供电能和控制所述雾化器的发热组件雾化所述气溶胶生成基质。
PCT/CN2024/084546 2023-05-17 2024-03-28 发热组件、雾化器及电子雾化装置 Pending WO2024234842A1 (zh)

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