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WO2024225084A1 - Produit d'étanchéité sous forme de film et dispositif de circuit - Google Patents

Produit d'étanchéité sous forme de film et dispositif de circuit Download PDF

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Publication number
WO2024225084A1
WO2024225084A1 PCT/JP2024/014893 JP2024014893W WO2024225084A1 WO 2024225084 A1 WO2024225084 A1 WO 2024225084A1 JP 2024014893 W JP2024014893 W JP 2024014893W WO 2024225084 A1 WO2024225084 A1 WO 2024225084A1
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WO
WIPO (PCT)
Prior art keywords
film
sealant
resin layer
mounting
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/014893
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English (en)
Japanese (ja)
Inventor
渓杜 大津
敏和 沼尾
康剛 森
将史 菊池
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Dexerials Corp
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Dexerials Corp
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Filing date
Publication date
Priority claimed from JP2024063029A external-priority patent/JP2024157525A/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Publication of WO2024225084A1 publication Critical patent/WO2024225084A1/fr
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • This technology relates to a film-like sealant and a circuit device.
  • This application claims priority based on Japanese Patent Application No. 2023-71296, filed in Japan on April 25, 2023, and Japanese Patent Application No. 2024-63029, filed in Japan on April 9, 2024, and these applications are incorporated by reference into this application.
  • the chip e.g., semiconductor element
  • the chip is sealed after the reflow soldering to prevent solder corrosion and to improve the soldering strength, vibration resistance, and thermal shock resistance.
  • the bottom of the chip is sealed, and sometimes the entire chip, including the bottom, is also sealed.
  • Patent Documents 1 and 2 simultaneously perform solder mounting and seal the bottom of the chip, but do not seal the entire chip, so if the entire chip is to be sealed, a separate sealing process is required. Furthermore, the techniques described in Patent Documents 3 and 4 can seal the entire chip, but they do so after solder mounting, so a sealing process is required in addition to the reflow process.
  • This technology was proposed in light of the current situation, and provides a film-like sealant that can simultaneously seal the entire electronic component, such as a chip, on a substrate at the same time as mounting the electronic component during the reflow step of the reflow solder mounting process.
  • the inventors of the present application focused on the viscosity of the film sealant at the melting point of the bonding material that bonds the substrate and electronic components, and discovered that the above-mentioned problems can be solved by using a film sealant whose melt viscosity at the melting point of the bonding material that bonds the substrate and electronic components (e.g., the liquidus temperature of the solder) is in a predetermined range.
  • the film-like sealant of this technology contains a film-forming component, a thermosetting monomer, and a curing agent or polymerization initiator, and has a melt viscosity of 25 to 70 Pa ⁇ s at 220°C.
  • the film-like sealant of this technology contains a film-forming component, a thermosetting monomer, and a curing agent or a polymerization initiator, and is made up of a first resin layer made of a film-like sealant having a melt viscosity of 25 to 70 Pa ⁇ s at 220°C, with a second resin layer laminated on top of it.
  • This technology is a film-like sealant for sealing electronic components mounted on a substrate, which contains a film-forming component, a thermosetting monomer, and a curing agent or a polymerization initiator, and has a melt viscosity of 25 to 70 Pa ⁇ s at the melting point of the bonding material that bonds the substrate and the electronic components.
  • This technology is a film-like sealant for sealing electronic components mounted on a substrate, which includes a film-forming component, a thermosetting monomer, and a curing agent or a polymerization initiator, and has a first resin layer made of a film-like sealant having a melt viscosity of 25 to 70 Pa ⁇ s at the melting point of a bonding material that bonds the substrate and the electronic components, and a second resin layer laminated on the surface of the first resin layer opposite the surface that contacts the electronic components.
  • the electronic components mounted on the substrate are sealed with the cured film sealant described above.
  • This technology makes it possible to provide a film-type sealant that can simultaneously seal the entire electronic component, such as a chip, on a substrate during the reflow step of the reflow solder mounting process.
  • a film-like sealant is formed by laminating a first resin layer and a second resin layer, even if a substrate is mounted with multiple components of different sizes, such as chips (semiconductor elements) and electronic components (chip resistors, etc.) that are smaller than chips, these components can be mounted and sealed at the same time during reflow.
  • FIG. 1 is a cross-sectional view showing an example of a circuit device in which electronic components mounted on a substrate are encapsulated with a cured product of the film sealant according to the present technology.
  • FIG. 2 is a graph showing the relationship between time and temperature for explaining an example of a reflow condition.
  • FIG. 3 is a cross-sectional view showing an example of a film sealant according to the second embodiment.
  • FIG. 4 is a cross-sectional view for explaining a method of placing mounting components on a circuit board in an example of a method for manufacturing a circuit device.
  • FIG. 5 is a cross-sectional view illustrating a method of applying a film sealant to the periphery of a mounting component in an example of a method for manufacturing a circuit device.
  • FIG. 1 is a cross-sectional view showing an example of a circuit device in which electronic components mounted on a substrate are encapsulated with a cured product of the film sealant according to the present technology.
  • FIG. 2
  • FIG. 6 is a cross-sectional view illustrating a method of applying a film sealant to the periphery of a mounting component in an example of a method for manufacturing a circuit device in which mounting components of different sizes are mixed and mounted on a circuit board.
  • FIG. 7 is a cross-sectional view for explaining a method of performing a reflow process on a circuit board on which mounting components of different sizes are mounted, in an example of a method for manufacturing a circuit device in which mounting components of different sizes are mixed and mounted on a circuit board.
  • FIG. 8 is a cross-sectional view for explaining a method of performing a reflow process on a circuit board on which mounting components of different sizes are placed.
  • FIG. 10(A) is a cross-sectional view illustrating a method of applying a film sealant having a first resin layer and a second resin layer laminated to the periphery of a plurality of mounting components of different sizes in an example of a manufacturing method for a circuit device in which mounting components of different sizes are mixed on a circuit board.
  • FIG. 10(B) is a cross-sectional view illustrating a method of performing a reflow process on a circuit board on which mounting components of different sizes are placed.
  • FIG. 10(B) is a cross-sectional view illustrating a method of performing a reflow process on a circuit board on which mounting components of different sizes are placed.
  • FIG. 10(C) is a cross-sectional view showing a state in which the mounting components are all sealed together at the same time as the mounting of the plurality of mounting components on the circuit board.
  • FIG. 11 is a plan view showing an example of the configuration of a test mounting component used in the sealing performance evaluation (2).
  • FIG. 12 is a cross-sectional view showing an example of a state in which a film sealant is placed on a test mounting component used in the sealing property evaluation (2).
  • FIG. 13(A) is a plan view showing an example of a test circuit device after a sealing evaluation (2) was performed using a film sealant (1)
  • FIG. 13(B) is a cross-sectional view along A-A' in FIG. 13(A).
  • a film sealant according to the present technology is a film sealant for sealing electronic components mounted on a substrate, which contains a film-forming component, a thermosetting monomer, and a curing agent or a polymerization initiator, and has a melt viscosity of 25 to 70 Pa ⁇ s at the melting point of a bonding material that bonds the substrate and the electronic components.
  • a film sealant By using such a film sealant, the entire electronic components can be collectively sealed at the same time as the electronic components such as chips are mounted on the substrate in the reflow step of a solder mounting process by reflow.
  • a second resin layer may be laminated on a first resin layer made of a film-like sealant containing a film-forming component, a thermosetting monomer, and a curing agent or a polymerization initiator, and having a melt viscosity of 25 to 70 Pa ⁇ s at 220°C.
  • the second resin layer may be laminated on the surface of the first resin layer opposite the surface that contacts the electronic component.
  • FIG. 1 is a cross-sectional view showing an example of a circuit device in which an electronic component mounted on a substrate is sealed with a cured product of the film-like sealant according to the present technology.
  • a circuit board 1 as a substrate and a mounting component 2 as an electronic component are joined by a solder joint 3A derived from a solder paste 3.
  • the solder joint 3A is provided between an electrode pad 1a of the circuit board 1 and an electrode bump 2a of the mounting component 2.
  • the periphery of the mounting component 2 is sealed with a sealing part 4A formed by curing the film-like sealant 4 according to the present technology.
  • the periphery of the mounting component 2 includes the periphery of the solder joint 3A (including the side of the solder joint 3A, and the space S surrounded by the space between the solder joints 3A and the mounting component 2 and the circuit board 1), the periphery (side) of the electrode bump 2a, and the periphery of the mounting component 2 (upper surface 2b, side surface 2c, lower surface 2d).
  • the periphery of the mounting component 2 is covered with the sealing portion 4 A so that there is substantially no gap between the circuit board 1 and the mounting component 2 .
  • reflow conditions recommended for each joining material there are reflow conditions recommended for each joining material. For example, there are methods of adjusting the reflow conditions according to the melting point of the joining material, and methods of not changing the reflow conditions regardless of the melting point of the joining material.
  • the reflow conditions according to the melting point of the joining material if the melting point of the joining material is too low, the reflow conditions will be lower, so that the film sealant 4 will not melt easily and sealing may not be sufficient.
  • the reflow conditions will be higher, and the film sealant 4 with a lower viscosity may push the joining material (for example, the solder particles of the solder paste 3) away, which may hinder joining or cause the solder particles to scatter.
  • the reflow conditions are not changed regardless of the melting point of the joining material, if the melting point of the joining material is too low, more heat than necessary will be applied, which may reduce the thermal fatigue resistance of the joining material and reduce the long-term durability of the joint.
  • the melting point of the joining material is too high, joining tends to be difficult.
  • the temperature at which the film sealant 4 exhibits a melt viscosity of 25 to 70 Pa ⁇ s preferably coincides with the melting point of the joining material (e.g., the solder in the solder paste 3) that joins the circuit board 1 and the mounting component 2.
  • the joining material e.g., the solder in the solder paste 3
  • a solder paste 3 using a solder with a liquid phase temperature of 220°C e.g., SAC-305 (Ag 3.0%-Cu 0.5%-Sn (balance)
  • a film sealant 4 that contains a film-forming component, a thermosetting monomer, and a curing agent or polymerization initiator, and has a melt viscosity of 25 to 70 Pa ⁇ s at 220°C.
  • a film-like sealant 4 which contains a film-forming component, a thermosetting monomer, and a curing agent or polymerization initiator, and has a melt viscosity of 25 to 70 Pa ⁇ s at 220°C.
  • FIG. 2 is a graph showing the relationship between time and temperature to explain an example of reflow conditions.
  • the area within the frame indicated by P in FIG. 2 represents the preheat area (hereinafter referred to as the preheat area P).
  • Solder paste 3 usually contains a solvent and flux as volatile components.
  • the preheat area P refers to the process in which the solvent in the solder paste 3 is volatilized and the flux cleans the oxide film on the solder surface and the member to be joined.
  • the area within the frame indicated by R in FIG. 2 represents the reflow area (hereinafter referred to as the reflow area R).
  • the reflow area R refers to the process in which the flux removes the oxide film on the solder particle surface, the solder paste 3 melts, and the electrode pad 1a of the circuit board 1 and the electrode pad 2a of the mounting component 2 are self-aligned and joined.
  • a in FIG. 2 represents the preheat start point (e.g., 150 to 180°C).
  • B in FIG. 2 represents the preheat end point (e.g., 170 to 200°C).
  • the time between A and B in FIG. 2 is preferably 90 ⁇ 30 seconds.
  • C in FIG. 2 represents the peak temperature (e.g., 230 to 250°C).
  • D in FIG. 2 represents the holding time at 220°C or higher, and this holding time is preferably 30 to 60 seconds.
  • the horizontal dashed line between 220°C and 250°C in FIG. 2 represents the heat resistance temperature of general circuit boards and electronic components.
  • the solvent in the solder paste 3 begins to volatilize.
  • the film sealant 4 has a melt viscosity of 25 to 70 Pa ⁇ s at 220°C, in the preheat region P it remains in a film form, or it becomes liquid but maintains its film form.
  • the film sealant 4 does not melt and remains in a film form, so most of the volatilized solvent escapes through the gaps in the film sealant 4, but it can also escape through the film sealant 4.
  • the solvent in the solder paste 3 volatilizes, and the volatilized solvent is discharged through the gap between the circuit board 1 and the film sealant 4, or from the inside of the film sealant 4 to the outside through the film sealant 4.
  • the solder in the solder paste 3 starts to melt, and the circuit board 1 and the mounting component 2 are self-aligned. Also, in the reflow region R, the flux in the solder paste 3 starts to volatilize, and the volatilized flux is discharged from the inside of the liquid film-like sealant 4 to the outside. Then, in the reflow region R, the film-like sealant 4 starts to melt, and the periphery of the mounting component 2 is covered with the sealing portion 4A as shown in FIG. 1.
  • the film-like sealant 4 has a melt viscosity of 25 to 70 Pa ⁇ s at 220°C, the melting of the solder paste 3 and the alignment of the circuit board 1 and the mounting components 2 occur first, followed by the melting of the film-like sealant 4, so that the alignment of the circuit board 1 and the mounting components 2 is less likely to be hindered by the film-like sealant 4. Therefore, by using the film-like sealant 4 according to the present technology, the entire mounting components 2 can be sealed at the same time as the mounting components 2 are mounted in the reflow step of the solder mounting process by reflow.
  • the film sealant 4 has a melt viscosity of 70 Pa ⁇ s or less at 220°C, which sufficiently reduces the viscosity of the film sealant 4 and prevents the film sealant 4 from clinging to the circuit board 1 or the mounting component 2 and making it difficult to penetrate into the lower part of the mounting component 2 (space S shown in Figure 1). As a result, the periphery of the mounting component 2 can be sealed at the same time as the mounting component 2 is mounted.
  • the film sealant 4 has a melt viscosity of 25 Pa ⁇ s or more at 220°C, it is possible to, for example, prevent the particulate solder that constitutes the solder paste 3 from being washed away before the solder paste 3 melts, and to prevent a shortage of solder particles necessary for connecting the circuit board 1 and the mounting component 2. As a result, the periphery of the mounting component 2 can be sealed at the same time as the mounting component 2 is mounted.
  • the film-like sealant 4 has a melt viscosity at 220°C of 25 to 70 Pa ⁇ s, and may be 26 Pa ⁇ s or more, 31 Pa ⁇ s or more, 41 Pa ⁇ s or more, 43 Pa ⁇ s or more, 44 Pa ⁇ s or more, 56 Pa ⁇ s or more, 64 Pa ⁇ s or more, or may be 26 to 64 Pa ⁇ s.
  • the melt viscosity of the film-like sealant at 220°C can be adjusted, for example, by the content of the film-forming component and the thermosetting monomer.
  • the film-forming component is appropriately selected so that the film-shaped sealant 4 melts and becomes liquid at around 220°C, and has a melt viscosity of 25 to 70 Pa ⁇ s at 220°C.
  • the film-forming component may have a melt viscosity of 30 Pa ⁇ s or more, 40 Pa ⁇ s or more, or 45 Pa ⁇ s or more at 220°C.
  • the film-forming component may have a melt viscosity of 300 Pa ⁇ s or less, 200 Pa ⁇ s or less, 100 Pa ⁇ s or less, 80 Pa ⁇ s or less, or 70 Pa ⁇ s or less at 220°C.
  • the film-forming component may have a melt viscosity of 25 to 70 Pa ⁇ s, or 30 to 50 Pa ⁇ s at 220°C.
  • the film-forming component can be, for example, a thermoplastic elastomer having a styrene-ethylene-propylene-styrene structure, a thermoplastic elastomer having a styrene-ethylene-ethylene-propylene-styrene structure, a thermoplastic elastomer having a styrene-ethylene-butylene-styrene structure, an acrylic polymer, a phenoxy resin, an epoxy resin, a urethane resin, or other various resins.
  • Clarity LA2250, LA4285 methyl methacrylate-polybutyl acrylate-methyl methacrylate block copolymer, manufactured by Kuraray
  • Nanostrength M51 methyl methacrylate-polybutyl acrylate-methyl methacrylate block copolymer, manufactured by Arkema
  • Nanostrength D51N modified methyl methacrylate-polybutyl acrylate block copolymer, manufactured by Arkema
  • Septon 2000 series elastomer with styrene-ethylene-propylene-styrene structure
  • Septon 4000 series elastomer with styrene-ethylene-ethylene-propylene-styrene structure, manufactured by Kuraray
  • the content of the film-forming component in the film-shaped sealant 4 can be appropriately selected within a range in which the melt viscosity of the film-shaped sealant 4 is 25 to 70 Pa ⁇ s at 220°C, and can be, for example, 40% by weight or more, 50% by weight or more, 60% by weight or more, 70% by weight or more, or 75% by weight or more.
  • the content of the film-forming component in the film-shaped sealant 4 can be 90% by weight or less, 85% by weight or less, or 80% by weight or less.
  • the content of the film-forming component in the film-shaped sealant 4 can be, for example, in the range of 65 to 85% by weight, or in the range of 70 to 80% by weight.
  • the film-forming component may be used alone or in combination of two or more. When two or more film-forming components are used in combination, it is preferable that the total amount thereof satisfies the above range. When two or more film-forming components are used in combination, it is preferable that the film-forming component has a melt viscosity of 30 to 50 Pa ⁇ s at 220°C.
  • the content of the film-forming component having a melt viscosity of 30 to 50 Pa ⁇ s at 220°C relative to the total amount of the film-forming components in the film-like sealant is preferably 50% by weight or more, may be 60% by weight or more, may be 70% by weight or more, may be 80% by weight or more, may be 90% by weight or more, may be 95% by weight or more, may be 99% by weight or more, or may be 100% by weight.
  • thermosetting monomer is appropriately selected so that the film sealant 4 melts and becomes liquid at around 220°C, and has a melt viscosity of 25 to 70 Pa ⁇ s at 220°C.
  • thermosetting monomer various thermosetting monomers such as acrylic resin and epoxy resin can be used.
  • thermosetting monomer a (meth)acrylate-based monomer is preferable from the viewpoint that the viscosity reduction effect is large when a small amount is added, and the crosslinking density can be increased by increasing the number of functional groups, thereby improving the heat resistance.
  • the solder paste 3 using the solder having a liquidus temperature of 220°C is used as the joining material, if the curing temperature is too low, the viscosity of the resin when the solder paste 3 is melted becomes higher, making the mounting component 2 more difficult to move, and the alignment between the circuit board 1 and the mounting component 2 tends to be difficult, so it is preferable to use an acrylic resin, which has a higher curing temperature than the epoxy resin.
  • the (meth)acrylate monomer it is preferable to use at least one of a bifunctional (meth)acrylate monomer and a polyfunctional (meth)acrylate monomer, because even a small amount of the monomer tends to promote dense crosslinking.
  • Specific examples of (meth)acrylate monomers include 1,6-hexanediol diacrylate and trimethylolpropane triacrylate.
  • the content of the (meth)acrylate monomer in the film-shaped sealant 4 can be appropriately selected within a range in which the melt viscosity of the film-shaped sealant 4 is 25 to 70 Pa ⁇ s at 220°C, and can be, for example, 1 weight% or more, 2 weight% or more, 3 weight% or more, 4 weight% or more, or 5 weight% or more.
  • the content of the (meth)acrylate monomer in the film-shaped sealant can be, for example, 10 weight% or less, 8 weight% or less, 7 weight% or less, or 6 weight% or less.
  • the content of the (meth)acrylate monomer in the film-shaped sealant can be, for example, in the range of 1 to 10 weight%, or in the range of 3 to 6 weight%.
  • the (meth)acrylate monomer may be used alone or in combination of two or more. When two or more (meth)acrylate monomers are used in combination, it is preferable that the total amount thereof falls within the above range.
  • the film-like sealant 4 includes a curing agent for a thermosetting monomer or a polymerization initiator for initiating a reaction between thermosetting monomers.
  • the curing agent or polymerization initiator can be appropriately selected according to the type of thermosetting monomer.
  • an acrylic resin is used as the thermosetting monomer, it is preferable to use a thermal radical polymerization initiator as the polymerization initiator.
  • an epoxy resin is used as the thermosetting monomer, it is preferable to use, for example, a phenolic resin or an acid anhydride as the curing agent.
  • an imidazole compound or a tertiary amine compound that mainly acts as a curing catalyst can also be used as the curing agent for the epoxy resin.
  • Thermal radical polymerization initiators generate radicals by heating and initiate polymerization of (meth)acrylate monomers.
  • the thermosetting monomer does not start hardening as much as possible while the temperature is raised from room temperature to about 200-220°C at a rate of 2-3°C/min, and that the hardening reaction of the thermosetting monomer then starts at 250-260°C.
  • the viscosity of the molten film-like sealant 4 will increase, making it difficult for the mounting component 2 to move, preventing self-alignment, and possibly hindering the solder connection between the circuit board 1 and the mounting component 2.
  • the thermal radical polymerization initiator has a reaction initiation temperature as high as possible, for example, a 10-hour half-life temperature of 140°C to 170°C.
  • thermal radical polymerization initiators include peroxides with a 10-hour half-life temperature of 140°C to 170°C.
  • Specific examples include aromatic hydroperoxides and aliphatic hydroperoxides with a 10-hour half-life temperature of 140°C to 170°C.
  • product thermal radical polymerization initiators include Perbutyl H (10-hour half-life temperature: 166.5°C), Percumyl H (10-hour half-life temperature: 157.9°C), Perocta H (10-hour half-life temperature: 152.9°C), and Percumyl P (10-hour half-life temperature: 145.1°C, all manufactured by NOF Corporation).
  • the curing agent or polymerization initiator may be used alone or in combination of two or more kinds.
  • the film-like sealant 4 contains an acrylic resin as a thermosetting monomer
  • the content of the curing agent or polymerization initiator in the film-shaped sealant 4 can be, for example, 0.01% by weight or more relative to the total amount of the film-forming components and thermosetting monomer in the film-shaped sealant 4.
  • the content of the curing agent or polymerization initiator in the film-shaped sealant 4 can be, for example, 2% by weight or less relative to the total amount of the film-forming components and thermosetting monomer in the film-shaped sealant 4.
  • the content of the polymerization initiator relative to the total amount of the film-forming components and thermosetting monomer can be in the range of 0.1 to 1% by weight.
  • the film-shaped sealant 4 may further contain other components than the above-mentioned components within a range that does not impair the effect of the present technology.
  • the film-shaped sealant 4 may further contain a surfactant in order to more efficiently break bubbles generated by outgassing due to the solvent in the solder paste 3 during reflow, to adjust the permeability of the film-shaped sealant 4 around the mounting component 2, particularly to the lower part of the mounting component 2 (space S shown in FIG. 1), and to further increase the adhesive strength.
  • the surfactant can be appropriately selected in consideration of heat resistance, reactivity with the thermosetting monomer, defoaming property, and the like.
  • the surfactant for example, BYK354 and BYK322 (both manufactured by BYK Japan) can be used.
  • the content of the surfactant in the film-shaped sealant 4 can be, for example, 1% by weight or more, and may be 10% by weight or more.
  • the content of the surfactant in the film-shaped sealant 4 can be, for example, 30% by weight or less, and may be 20% by weight or less.
  • the surfactant may be used alone or in combination of two or more types. When two or more types of surfactants are used in combination, it is preferable that the total amount satisfies the above range.
  • the film-shaped sealant 4 may further contain a resin (hereinafter also referred to as other resin) different from the film-forming component and the thermosetting monomer, depending on the purpose of adjusting the viscosity of the film-forming component, adjusting the elastic modulus of the film-shaped sealant 4, and further increasing the adhesive strength of the film-shaped sealant 4.
  • the other resin can be used without being particularly limited in structure, as long as the film-shaped sealant 4 melts and becomes liquid at around 220°C and the melt viscosity of the film-shaped sealant 4 is 25 to 70 Pa ⁇ s at 220°C.
  • a styrene-based or terpene phenol-based resin can be used.
  • An example of a product of the other resin is YS Polystar T160 (terpene phenol resin, softening point: 160°C, manufactured by Yasuhara Chemical Co., Ltd.).
  • the content of the other resins in the film-shaped sealant 4 can be, for example, 1% by weight or more, and may be 20% by weight or more.
  • the content of the other resins in the film-shaped sealant 4 can be, for example, 50% by weight or less, and may be 40% by weight or less.
  • the other resins may be used alone or in combination of two or more types. When two or more types of other resins are used in combination, it is preferable that the total amount satisfies the above range.
  • the film sealant 4 may further contain fillers, lubricants, antioxidants, etc., to the extent that the effect of the present technology is not impaired.
  • the thickness of the film-like sealant 4 is not particularly limited and can be selected appropriately depending on the purpose, and can be in the range of, for example, 50 to 200 ⁇ m.
  • the thickness of the film-like sealant 4 can also be in the range of, for example, 50 to 300 ⁇ m, or 200 to 300 ⁇ m.
  • an example of the film-like sealant 4 when using a solder paste 3 with a solder having a liquidus temperature of 220°C has been described, but this is not limited to the example, and various modifications can be made depending on the liquidus temperature of the solder paste 3.
  • an epoxy resin may be used as the thermosetting monomer, or a thermal radical polymerization initiator with a low reaction initiation temperature (for example, a 10-hour half-life temperature lower than 140°C to 170°C) may be used.
  • [Second embodiment] 3 is a cross-sectional view showing an example of a film-like sealant according to the second embodiment.
  • a second resin layer 22 is laminated on a first resin layer 21 made of the film-like sealant according to the first embodiment described above, and as described in detail later, it is preferable that the product of the rigidity of the first resin layer 21 and a predetermined coefficient is smaller than the rigidity of the second resin layer 22.
  • the components to be mounted that need to be sealed can be sealed together without the small components such as chip resistors being displaced due to the shape change of the film-like sealant during reflow.
  • the first resin layer 21 has the same preferred ranges as the film sealant 4 described above, except for the shear modulus G' at 150°C and film thickness, which will be described later.
  • the resin constituting the second resin layer 22 can be selected from any resin, and examples of such resins include epoxy resin, acrylic resin, polyimide resin, etc.
  • epoxy resin or acrylic resin is used as the resin constituting the second resin layer 22, a resin composition containing monomers of each resin, etc., can be cured by irradiating it with ultraviolet light or cured by heat.
  • Epoxy resins include, for example, epoxy resins having a naphthalene skeleton, bisphenol A type epoxy resins, bisphenol F type epoxy resins, phenol novolac type epoxy resins, alicyclic epoxy resins (for example, dicyclopentadiene type epoxy resins, 3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexane carboxylate), siloxane type epoxy resins, biphenyl type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, etc., which may be used alone or in combination of two or more types.
  • monofunctional (meth)acrylate monomers for example, monofunctional (meth)acrylate monomers, polyfunctional (meth)acrylate monomers, and (meth)acrylate resins may be used alone or in combination of two or more of them.
  • a monofunctional (meth)acrylate monomer refers to a (meth)acrylate monomer having one (meth)acryloyl group.
  • a polyfunctional (meth)acrylate monomer refers to a (meth)acrylate monomer having two or more (meth)acryloyl groups.
  • the (meth)acrylate resin may be a polymer or an oligomer. Specific examples of monofunctional (meth)acrylate monomers include isobornyl (meth)acrylate and 2-hydroxypropyl (meth)acrylate.
  • polyfunctional (meth)acrylate monomers include tricyclodecane dimethanol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and trimethylolpropane tri(meth)acrylate.
  • polyfunctional (meth)acrylate monomers include tricyclodecane dimethanol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and trimethylolpropane tri(meth)acrylate.
  • (meth)acrylate resins include (meth)acrylates with a polyurethane skeleton and (meth)acrylates with a polyisoprene skeleton.
  • the second resin layer 22 may further contain other components as necessary in addition to the epoxy resin, acrylic resin, and polyimide resin.
  • other components include plasticizers and rubbers that are not directly involved in the reaction.
  • the first resin layer 21 and the second resin layer 22 constituting the film sealant 20 preferably satisfy the following formula 1. Equation 1: (shear modulus G' (Pa) of the first resin layer 21 at 150° C.) ⁇ (film thickness ( ⁇ m) of the first resin layer 21) ⁇ 9 ⁇ (tensile modulus E' (Pa) of the second resin layer 22 at 150° C.) ⁇ (film thickness ( ⁇ m) of the second resin layer 22)
  • the film sealant 20 satisfies formula 1; in other words, the product of the rigidity of the first resin layer 21 and a predetermined coefficient is smaller than the rigidity of the second resin 22. Therefore, in mounting and sealing using the film sealant 20, even in a circuit board that has a mixture of relatively large components such as chips and relatively small components such as chip resistors, the tiny components such as chip resistors do not shift position due to changes in shape of the film sealant during reflow, and the mounting components that require sealing can be sealed together.
  • the reason for focusing on the shear modulus G' of the first resin layer 21 and the tensile modulus E' of the second resin layer 22 at a specific temperature (150°C) in formula 1 is as follows.
  • minute components (components for mounting that are relatively small in size) mixed on a circuit board are displaced due to the flow of the film-like sealant during reflow is thought to be caused, for example, by a change in the modulus of elasticity of the film-like sealant up to the preheat region P in FIG. 2, particularly near the preheat start point A (for example, 150 to 180°C). For this reason, attention was focused on 150°C, which corresponds to the preheat start point.
  • the tensile modulus E' is difficult to measure when the measurement target has low elasticity (approximately 1.0E+04 Pa or less), whereas the shear modulus G' can be measured at low elasticity but is difficult to measure at high elasticity. Therefore, the shear modulus G' of the first resin layer 21, which can be measured at 150°C, was compared with the tensile modulus E' of the second resin layer 22.
  • the shear modulus G' of the first resin layer 21 at 150°C depends on the thickness of the first resin layer 21 or the second resin layer 22, but is not particularly limited as long as it satisfies formula 1, and can be, for example, 3.8E+03 Pa or more and 2.9+04 Pa or less.
  • the shear modulus G' of the first resin layer 21 at 150°C can be measured by the method described in the examples below.
  • the film thickness of the first resin layer 21 is not particularly limited as long as it satisfies formula 1, and can be, for example, in the range of 200 to 300 ⁇ m.
  • the tensile modulus E' of the second resin layer 22 at 150°C depends on the thickness of the first resin layer 21 or the second resin layer 22, but is not particularly limited as long as it satisfies formula 1, and can be, for example, 6.0E+05 Pa or more and 4.0E+09 Pa or less, from the viewpoint of more effectively suppressing the fluidity of the first resin layer 21 during reflow.
  • the tensile modulus E' of the second resin layer 22 can be measured by the method described in the examples below.
  • the film thickness of the second resin layer 22 is not particularly limited as long as it satisfies formula 1, and can be, for example, in the range of 50 to 100 ⁇ m.
  • the method for producing the film-like sealant 4 is not particularly limited, and for example, the film-like sealant 4 can be obtained by weighing out predetermined components (e.g., the above-mentioned film-forming components, a thermosetting monomer, a curing agent or a polymerization initiator, and an organic solvent), dissolving or dispersing them by stirring, mixing, kneading, or the like to prepare a resin varnish, applying the resin varnish to a base film that has been subjected to a release treatment, and removing the organic solvent by heating.
  • predetermined components e.g., the above-mentioned film-forming components, a thermosetting monomer, a curing agent or a polymerization initiator, and an organic solvent
  • the organic solvent is preferably one that has the property of being able to uniformly dissolve or disperse each component.
  • Examples include dimethylformamide, dimethylacetamide, N-methyl-2-pyrrolidone, dimethyl sulfoxide, diethylene glycol dimethyl ether, toluene, benzene, xylene, methyl ethyl ketone, tetrahydrofuran, ethyl cellosolve, ethyl cellosolve acetate, butyl cellosolve, dioxane, cyclohexanone, and ethyl acetate.
  • the organic solvent may be used alone or in combination of two or more types.
  • the stirring, mixing or kneading for preparing the resin varnish can be carried out using, for example, a stirrer, a grinding machine, a three-roll mill, a ball mill, a bead mill or a homodisper.
  • the application of the resin varnish onto the substrate film can be carried out using, for example, a knife coater, a roll coater, an applicator, etc.
  • the substrate film to which the resin varnish is applied is not particularly limited as long as it has heat resistance sufficient to withstand the heating conditions when volatilizing the organic solvent.
  • the substrate film may be a polyolefin film such as a polypropylene film or a polymethylpentene film, a polyester film such as a polyethylene terephthalate film or a polyethylene naphthalate film, a polyimide film, or a polyetherimide film.
  • the substrate film may be a single layer film or a multilayer film. When the substrate film is a multilayer film, the layers may be made of different materials or the same material.
  • the drying conditions for volatilizing the organic solvent from the resin varnish applied to the substrate film are preferably conditions that allow the organic solvent to volatilize sufficiently, for example, at 50 to 200°C for 0.1 to 90 minutes.
  • the manufacturing method of the film-shaped sealant 20 includes, for example, a step of preparing a first resin layer 21, a step of preparing a second resin layer 22, and a step of bonding the first resin layer 21 and the second resin layer 22 to obtain the film-shaped sealant 20.
  • a film-like sealant 4 (first resin layer 21) is obtained in a manner similar to that of the first embodiment described above.
  • a resin composition for the second resin layer 22 is prepared, the prepared resin composition is applied to a base film that has been subjected to a release treatment, and cured with light (ultraviolet light) to obtain the second resin layer 22.
  • a commercially available resin film may be used as is as the second resin layer 22. Note that when a commercially available resin film is used as the second resin layer 22, the step of preparing the second resin layer 22 can be omitted.
  • the resin composition for the second resin layer 22 contains, for example, the above-mentioned epoxy resin or acrylic resin precursor, a photopolymerization initiator, and a plasticizer.
  • Specific examples of the resin composition for the second resin layer 22 mainly composed of acrylic resin include a resin composition containing a (meth)acrylate resin having a polyurethane skeleton, isobornyl (meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, and a photopolymerization initiator, and a resin composition containing a (meth)acrylate resin having a polyisoprene skeleton, isobornyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and a photopolymerization initiator.
  • the resin composition for the second resin layer 22 mainly composed of epoxy resin include a resin composition containing a bisphenol A type epoxy resin and a photoacid generator, and a resin composition containing a bisphenol A type epoxy resin, an alicyclic epoxy resin, and a photoacid generator.
  • the resin composition can be applied to the substrate film, for example, using a bar coater.
  • the substrate film can be one of those described in the first embodiment above.
  • the first resin layer 21 and the second resin layer 22 can be laminated together using, for example, a laminator. Note that the step of preparing the first resin layer 21 and the step of preparing the second resin layer 22 may be performed in either order, or may be performed in parallel.
  • a circuit device 10 includes a circuit board 1 as a substrate and a mounting component 2 as an electronic component, which are joined at a solder joint 3A derived from a solder paste.
  • the mounting component 2 is surrounded by a sealing portion 4A formed by hardening a film sealant 4.
  • the circuit board 1 may be a known board such as a semiconductor board, a flexible circuit board, a rigid wiring board, or a printed wiring board.
  • the electrode pads 1a of the circuit board 1 may be known electrode pads such as copper pads or aluminum pads.
  • the electrode pads 1a may be replaced by electrodes of other shapes, such as electrode bumps.
  • the mounting component 2 can be any of a variety of known surface mounting components, including, for example, a semiconductor chip, a light-emitting diode, a capacitor chip, and a resistor element.
  • the electrode bump 2a of the mounting component 2 can be a known electrode bump such as a gold bump or a solder bump.
  • the electrode bump 2a can also be replaced with an electrode of another form, such as an electrode pad.
  • the solder joint 3A is formed by reflow processing the solder paste 3, and provides electrical continuity between the electrode bump 2a of the mounting component 2 and the electrode pad 1a of the circuit board 1.
  • the sealing portion 4A is formed by hardening the film-like sealant 4. As described above, the sealing portion 4A covers the periphery of the mounting component 2, the periphery of the electrode bump 2a, and the periphery of the solder joint portion 3A, and also covers part of the surface of the circuit board 1.
  • circuit device may have electronic components mounted on the substrate sealed with the cured film sealant 20.
  • solder paste 3 is applied to the electrode pads 1a of the circuit board 1.
  • the solder paste can be applied to the electrode pads 1a by a known method, and can be applied using, for example, a precision dispenser or a screen printer.
  • FIG. 4 is a cross-sectional view illustrating a method of placing a mounting component 2 on a circuit board 1 in one example of a manufacturing method for a circuit device 10.
  • the mounting component 2 After applying solder paste 3 to the electrode pads 1a of the circuit board 1, the mounting component 2 is placed on the circuit board 1 as shown in FIG. 4.
  • the electrode bumps 2a of the mounting component 2 are aligned with the electrode pads 1a of the circuit board 1, and may be lightly pressed as necessary. This brings the electrode bumps 2a of the mounting component 2 into contact with the solder paste 3.
  • the height of the gap between the electrode pads 1a and the electrode bumps 2a is not particularly limited, and may be, for example, about 10 to 100 ⁇ m, or about 80 ⁇ m.
  • FIG. 5 is a cross-sectional view for explaining a method of applying a film-shaped sealant 4 to the periphery of a mounting component 2 in an example of a manufacturing method of a circuit device 10.
  • a method of placing the film-shaped sealant 4 on the mounting component 2 so as to cover the mounting component 2 can be given.
  • the film-shaped sealant 4 placed on the mounting component 2 does not follow the shape of the mounting component 2, etc., so there are spaces, for example, between the film-shaped sealant 4 and the upper surface 2b of the mounting component 2, between the film-shaped sealant 4 and the side surface 2c, and between the film-shaped sealant 4 and the surface of the circuit board 1. Therefore, as described above, the volatilized solvent easily escapes from the inside of the film-shaped sealant 4 to the outside in the preheat region P.
  • solder paste 3 sandwiched between the electrode pad 1a of the circuit board 1 and the electrode bump 2a of the mounting component 2.
  • the solder paste 3 is heated to a temperature higher than the melting temperature of the solder particles, the oxide film on the surface of the solder particles is removed by flux, and the solder spreads between the electrode pad 1a and the electrode bump 2a to form the solder joint 3A, and the film sealant 4 is hardened by heating during the reflow process to form the sealing portion 4A.
  • the reflow process of the solder paste 3 it does not spread beyond the periphery of the electrode pad 1a but tends to remain on the surface of the electrode pad 1a, making it possible to self-align the mounting component 2 with respect to the circuit board 1.
  • the reflow process can be performed at normal pressure.
  • the reflow process includes the steps of volatilizing the solvent in the solder paste 3 and discharging the volatilized solvent from inside the liquefied film-like sealant 4 to the outside, melting the solder in the solder paste 3 to self-align the circuit board 1 and the mounting component 2, volatilizing the flux in the solder paste 3 and discharging the volatilized flux from inside the liquefied film-like sealant 4 to the outside, and melting the film-like sealant 4 to seal the periphery of the mounting component 2 with the sealing portion 4A.
  • the mounting components 2 can be mounted on the circuit board 1 during the reflow step of the solder mounting process by reflow, and the entire mounting components 2 can be sealed at the same time.
  • a circuit device 10 is obtained in which the mounting components 2 are sealed by the sealing portion 4A.
  • the reflow process of the solder paste 3 and the hardening process of the film-like sealant 4 can be performed simultaneously.
  • the mounting component 2 in the reflow step of the solder mounting process by reflow, the mounting component 2 can be mounted and the entire mounting component 2 can be sealed at the same time without the need for pressure with a tool. Furthermore, in the manufacturing method of the circuit device 10 according to the present technology, in the solder mounting process by reflow, scattering of solder balls can be suppressed and the solvent (volatile components) of the solder paste 3 can be discharged.
  • FIG. 6 is a cross-sectional view illustrating a method of applying a film sealant to the periphery of a mounting component in an example of a method for manufacturing a circuit device in which mounting components of different sizes are mixed and mounted on a circuit board.
  • mounting part 30 a relatively large mounting part 30
  • mounting part 31 a relatively small mounting part 31
  • mounting part 31 a relatively small mounting part 31
  • the parts 35 that are not sealed are parts that may affect their original function or performance if sealed. Examples of the parts 35 that are not sealed include protective elements that cut off elements when heated, and electrodes and light-emitting elements provided on a substrate.
  • FIG. 7 is a cross-sectional view for explaining a method of performing a reflow process on a circuit board on which mounting components of different sizes are placed, in an example of a manufacturing method of a circuit device in which mounting components of different sizes are mixed on the circuit board. As shown in FIG.
  • Such misalignment of tiny components can be particularly noticeable when tiny components are mounted on the edge of a circuit board, or even if not on the edge of the circuit board, when the mounting area of the tiny components hits the edge of the film sealant, or when there are no parts on the edge of the film sealant where no parts are mounted, and the components are mounted at a very narrow pitch.
  • Figures 8 and 9 are cross-sectional views for explaining a method of performing a reflow process on a circuit board on which mounting components of different sizes are placed.
  • the elastic modulus of the film sealant 4 changes due to the temperature rise during the reflow process, causing the film sealant 4 to curve, and the mounting component 31 is moved by the curved film sealant 4, which may cause a component misalignment (misalignment of the mounting component 31) in the direction of the arrow shown in Figure 8.
  • Figure 10 (A) is a cross-sectional view illustrating a method for applying a film sealant having a first resin layer and a second resin layer laminated to the periphery of multiple mounting components of different sizes in an example of a method for manufacturing a circuit device in which mounting components of different sizes are mixed and mounted on a circuit board.
  • solder paste 34a, 34b is applied to electrode pads 32a, 32b of circuit board 32, and then mounting components 30, 31 are placed on circuit board 32. Specifically, electrode bumps 30a (not shown) of mounting component 30 are aligned with electrode pads 32a of circuit board 32, and electrode bumps 31a (not shown) of mounting component 31 are aligned, and may be lightly pressed as necessary.
  • film-like sealant 20 is placed on mounting components 30, 31 so as to cover mounting components 30, 31, as shown in FIG. 10(A). Film-like sealant 20 is placed on mounting components 30, 31 so that first resin layer 21 faces mounting components 30, 31.
  • FIG. 10(B) is a cross-sectional view illustrating a method of performing a reflow process on a circuit board on which mounting components of different sizes are placed, in an example of a method of manufacturing a circuit device in which mounting components of different sizes are mixed on the circuit board.
  • FIG. 10(C) is a cross-sectional view showing a state in which the mounting components are all sealed together at the same time as multiple mounting components are mounted on the circuit board, in an example of a method of manufacturing a circuit device in which mounting components of different sizes are mixed on the circuit board.
  • the solder paste 34a, 34b sandwiched between the electrode pad 32a of the circuit board 32 and the electrode bumps 30a, 31a of the mounting components 30, 31 is subjected to a reflow process.
  • the reflow process heats the solder paste 34a, 34b to a temperature higher than the melting temperature of the solder particles, removes the oxide film on the surface of the solder particles with flux, and causes the solder paste to wet and spread between the electrode pads 32a, 32b and the electrode bumps 30a, 31a to form the solder joints 34a, 34b.
  • the film sealant 20 is hardened by the heat during the reflow process to form a sealing portion.
  • the movement of the first resin layer 21 in the film-like sealant 20 is suppressed by the second resin layer 22, and the curvature of the first resin layer 21 in the film-like sealant 20 is suppressed due to the temperature rise during the reflow process, so that the occurrence of misalignment of the mounting components 30, 31 (particularly the mounting component 31) due to the curvature of the first resin layer 21 is suppressed.
  • the first resin layer 21 flows after it has a sufficiently low viscosity, and the entire mounting components 30, 31 are sealed by the flowing first resin layer 21.
  • the reflow process can be performed in the same manner as in the first embodiment of the method for manufacturing a circuit device.
  • the solvent in the solder pastes 34a and 34b volatilizes in the preheat region P shown in FIG. 2, and the volatilized solvent is discharged from the inside of the film sealant 20 to the outside through the gap between the circuit board 32 and the film sealant 20, or through the film sealant 20.
  • the mounting components 30, 31 can be mounted on the circuit board 32 during the reflow step of the solder mounting process by reflow, and the entire mounting components 30, 31 can be sealed at the same time.
  • a circuit device 33 is obtained in which the mounting components 30, 31 are sealed at the sealing portion.
  • the reflow process of the solder paste 34 and the hardening process of the film sealant 20 can be performed simultaneously.
  • the components on the entire surface of the circuit board 32 can be sealed without the minute components (mounting components 31) being misaligned.
  • NK Ester A-TMPT Trimethylolpropane triacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.
  • HDDA 1,6-Hexanediol diacrylate, manufactured by Daicel Allnex Corporation
  • BYK354 Polyacrylate-based surfactant, manufactured by BYK Japan
  • BYK322 Silicone-based surfactant, manufactured by BYK Japan
  • CN9014NS bifunctional urethane acrylate, manufactured by Arkema Acrylate IBX: isobornyl methacrylate, manufactured by Mitsubishi Chemical NK Ester DCP: tricyclodecane dimethanol dimethacrylate, manufactured by Shin-Nakamura Chemical Co., Ltd.
  • UC-203M isoprene methacrylate, manufactured by Kuraray LBR-307: polybutadiene, manufactured by Kuraray Alcon M-100: alicyclic saturated hydrocarbon resin, manufactured by Arakawa Chemical Industries Co., Ltd.
  • PI-184 manufactured by Aal Chem EXA-850CRP: bisphenol A type epoxy resin, manufactured by DIC Celloxide 2021P: 3,4-epoxycyclohexylmethyl (3,4-epoxy) cyclohexane carboxylate, manufactured by Daicel EPICLON HP7200L: dicyclopentadiene type epoxy resin, manufactured by DIC CPI-200K: San-Apro Kapton 200H: Toray DuPont (polyimide resin film)
  • compositions for Film-like Sealant The components shown in Table 1 were uniformly mixed in the blending ratios (parts by weight) shown in Table 1 to prepare compositions for film-like sealants (first resin layer).
  • composition for second resin layer was prepared by uniformly mixing each component shown in Table 2 in the blending ratio (parts by weight) shown in Table 2.
  • a commercially available film was used as it was.
  • a resin varnish was prepared by mixing a composition for a film-like sealant (first resin layer) with an organic solvent (a mixed solvent of 80% toluene and 20% methyl ethyl ketone), and the resin varnish was applied to a base film (polyethylene terephthalate film) that had been subjected to a release treatment using a bar coater.
  • the resin varnish was then heated at 100° C. for 5 minutes to remove the organic solvent, thereby obtaining a primary film-like sealant having a thickness of 50 ⁇ m.
  • the resin varnish was then applied and dried again from the film-like sealant to obtain a film-like sealant having a thickness of 100 ⁇ m.
  • this film-like sealant is referred to as film-like sealant (1).
  • the film-like sealant (1) was used in the sealing property evaluation (1) described below.
  • the first resin layer was obtained in the same manner as in the preparation of the film-like sealant (1) described above.
  • a resin composition for the second resin layer containing each component shown in Table 2 was applied onto a peel-treated film using a bar coater and cured with ultraviolet light.
  • a commercially available polyimide resin film was used as is.
  • the obtained first resin layer and second resin layer were bonded together with a laminator to obtain a film-like sealant in which the second resin layer was laminated on the first resin layer.
  • the thickness of each layer is as shown in Table 1.
  • this film-like sealant is referred to as film-like sealant (2).
  • the film-like sealant (2) was used in the sealability evaluation (2) described later.
  • the film-like sealant (1) was also used in the sealability evaluation (2).
  • Shear Modulus G′ of First Resin Layer The shear modulus G' of the first resin layer at 150° C. was measured using a rheometer (AR-G2 (manufactured by TA instruments) at a frequency of 1 Hz and a temperature increase rate of 10° C./min. The results are shown in Table 1.
  • ⁇ Tensile Modulus E′ of Second Resin Layer> The tensile modulus E' of the second resin layer at 150° C. was measured using a viscoelasticity measuring device (DMA7100, manufactured by Hitachi High-Tech Science Corporation) at a frequency of 1 Hz and a temperature increase rate of 10° C./min. The results are shown in Table 1.
  • a test circuit device was produced using the following FR-4 grade circuit board as the test circuit board and the following semiconductor element as the test mounting component. Specifically, a solder paste ("M705-GRN360-K2-V" (solder particles: Ag3.0%-Cu0.5%-Sn (balance)) manufactured by Senju Metal Industry Co., Ltd. was applied to the electrode pads of the test circuit board with a precision dispenser to a thickness of 150 ⁇ m, and the electrode bumps of the test mounting component were aligned with the electrode pads of the test circuit board to which the solder paste was applied, and the test mounting component was placed on the test circuit board by lightly pressing it.
  • a solder paste (“M705-GRN360-K2-V" (solder particles: Ag3.0%-Cu0.5%-Sn (balance) manufactured by Senju Metal Industry Co., Ltd. was applied to the electrode pads of the test circuit board with a precision dispenser to a thickness of 150 ⁇ m, and the electrode bumps of the test mounting component were aligned with the electrode pads of the
  • the above-mentioned film sealant (1) was applied to the test mounting component on which the test mounting component was placed.
  • the test circuit board was placed on a test circuit board, heated from room temperature to 170°C at 3°C/sec under atmospheric pressure, and held at 170°C for 90 seconds. After that, the temperature was raised to 250°C at 2°C/sec, and then cooled to room temperature at 2°C/sec, in a reflow process under normal pressure. This resulted in soldering the test mounting component and the test circuit board, and sealing the upper, side, and lower parts of the test mounting component. As a result, a circuit device 10 sealed with a cured product 4A of the film-like sealant 4 was obtained, as shown in FIG. 1.
  • a UNI-5016A manufactured by Antom Co., Ltd. was used as the reflow furnace.
  • the test circuit board used was an FR-4 grade circuit board (20 x 40 x 0.6 (mm)) with gold-plated copper wiring (1.0 x 7.2 (mm)) on the surface.
  • the test mounting component used was a semiconductor element (5 x 9.5 x 1 (mm)) with electrode bumps (1.0 x 7.2 (mm)).
  • the film sealant was cut to a size of 22 mm x 42 mm.
  • FIG. 11 is a plan view showing an example of the configuration of the test mounting component and the test circuit board used in the sealability evaluation (2).
  • FIG. 12 is a cross-sectional view showing an example of the state in which the film sealant is placed on the test mounting component used in the sealability evaluation (2).
  • As the test circuit board 41 an FR-4 grade circuit board (5 mm ⁇ 20 mm ⁇ 0.6 mm) having copper wiring 41a, 41b with gold plating on the surface was used.
  • the mounting portion of the component on the test circuit board 41 has a copper wiring (semiconductor element 43 mounting portion) of 2 mm ⁇ 1 mm and a copper wiring (chip component 42 mounting portion) of 0.1 mm ⁇ 0.2 mm.
  • a chip resistor 42 of 0402 (0.4 mm ⁇ 0.2 mm ⁇ 0.2 mm) size was arranged at the end of the board 41 as shown in FIG. 11.
  • the distance from the end of the test circuit board 41 to the chip resistor 42 on the end side of the test circuit board 41 was 1 mm
  • the distance between the chip resistors 42 was 0.5 mm
  • the distance from the chip resistor 42 on the semiconductor element 43 side to the end of the semiconductor element 43 was 6.1 mm.
  • the method of mounting the test mounting components on the test circuit board 41 was the same as in the sealing evaluation (1).
  • the solder paste and its application method were also the same as in the sealing evaluation (1).
  • the film sealant was placed on the test circuit board 41 on which the test mounting components were placed. After that, the test mounting components and the test circuit board 41 were soldered together under the same reflow conditions as in sealing evaluation (1), and the top, sides, and bottom of the test mounting components were sealed. The film sealant was cut to a size of 7 mm x 22 mm.
  • Figure 13 (A) is a plan view showing an example of a test circuit device after performing a sealing evaluation (2) using a film-like sealant (1)
  • Figure 13 (B) is a cross-sectional view of A-A' in Figure 13 (A).
  • the elastic modulus of the film-like sealant 4 changes due to the temperature rise during the reflow process, causing the film-like sealant 4 to curve, and the curved film-like sealant 4 causes a shift in the chip resistor 42.
  • a sealability rating (2) of ⁇ (NG) means, for example, that the chip resistor 42 is misaligned, the chip resistor 42 is not connected to the test circuit board 41, and the hardened film sealant (sealing portion 4B) covers the periphery of the test mounting component.
  • test circuit board 41 and the semiconductor element 43 are joined by the solder joint 44A derived from the solder paste 44a, but the chip resistor 42 is misaligned from position 42P (the position of the chip resistor 42 when connected correctly), and the test circuit board 41 and the chip resistor 42 are not sufficiently joined by the solder joint 44B derived from the solder paste 44b, so the chip resistor 42 does not function on the test circuit board 41.
  • Comparative Examples 1 to 4 show that even if the film-like sealant (1) contains a film-forming component, a thermosetting monomer, and a curing agent or a polymerization initiator, if the melt viscosity at 220°C does not satisfy 25 to 70 Pa ⁇ s, the sealability evaluation is not good. In other words, in Comparative Examples 1 to 4, it was found that it is difficult to simultaneously seal the entire electronic component, such as a chip, at the same time as mounting the electronic component on the board during the reflow step of the reflow solder mounting process.
  • a film-like sealant (1) with a melt viscosity of 102 Pa ⁇ s at 220°C was used. Although the film-like sealant (1) melted during the reflow process, the viscosity did not decrease sufficiently, and the film-like sealant (1) clung to the components (the test circuit board and the test mounting components) and was difficult to penetrate to the bottom of the test mounting components.
  • Example 9 the thickness of the first resin layer in Example 8 was increased, so that formula 1 was not satisfied, and the chip resistor 42 was misaligned, but the semiconductor element 43 could be mounted.
  • Example 11 the tensile modulus E' of the second resin layer was reduced, so Equation 1 was not satisfied, and the chip resistor 42 was misaligned, but the semiconductor element 43 could be mounted.
  • Example 16 the shear modulus G' of the first resin layer was increased, so Equation 1 was not satisfied, and the chip resistor 42 was misaligned, but the semiconductor element 43 could be mounted.
  • the sealability evaluation (2) was performed using a film-like sealant (1) that contained a film-forming component, a thermosetting monomer, and a curing agent or a polymerization initiator and had a melt viscosity of 25 to 70 Pa ⁇ s at 220°C. This resulted in misalignment of the chip resistor 42, but made it possible to mount the semiconductor element 43.
  • the sealability evaluation (2) was performed using a film-like sealant (1) that did not satisfy the melt viscosity of 25 to 70 Pa ⁇ s at 220°C. This meant that the film-like sealant did not spread, and there were unsealed areas on the test circuit board 41 and around the test mounting components.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)

Abstract

L'invention concerne un produit d'étanchéité sous forme de film permettant de mettre en oeuvre le montage d'un composant électronique, par exemple, une puce, sur un substrat simultanément avec l'étanchéification en bloc du composant électronique entier dans une étape de refusion d'un processus de montage à refusion de soudure. Le produit d'étanchéité sous forme de film (4) comprend un composant filmogène, un monomère thermodurcissable et un agent de durcissement ou un initiateur de polymérisation, et présente une viscosité à l'état fondu à 220°C comprise entre 25 et 70 Pa·s. Le dispositif de circuit (10) selon l'invention comprend un composant (2) pour montage, qui a été monté sur une carte de circuit imprimé (1) et est étanchéifié à l'ade d'un objet durci (4A) formé à partir du produit d'étanchéité sous forme de film (4).
PCT/JP2024/014893 2023-04-25 2024-04-12 Produit d'étanchéité sous forme de film et dispositif de circuit Pending WO2024225084A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2023-071296 2023-04-25
JP2023071296 2023-04-25
JP2024-063029 2024-04-09
JP2024063029A JP2024157525A (ja) 2023-04-25 2024-04-09 フィルム状封止剤および回路装置

Publications (1)

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WO2024225084A1 true WO2024225084A1 (fr) 2024-10-31

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WO (1) WO2024225084A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008177432A (ja) * 2007-01-19 2008-07-31 Kyocera Chemical Corp 封止用熱硬化型樹脂シート、電子部品装置及び電子部品装置の製造方法
WO2011033743A1 (fr) * 2009-09-16 2011-03-24 住友ベークライト株式会社 Film adhésif, carte de circuit imprimé multicouche, composant électronique et dispositif à semi-conducteur
JP2012129326A (ja) * 2010-12-14 2012-07-05 Sumitomo Bakelite Co Ltd 電子装置の製造方法および電子装置パッケージの製造方法
JP2013065835A (ja) * 2011-08-24 2013-04-11 Sumitomo Bakelite Co Ltd 半導体装置の製造方法、ブロック積層体及び逐次積層体
JP2013153012A (ja) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd 電子部品モジュールの製造方法
WO2014185325A1 (fr) * 2013-05-16 2014-11-20 東洋紡株式会社 Procédé d'encapsulation d'un composant électrique/électronique ainsi que corps encapsulé
JP2016213391A (ja) * 2015-05-13 2016-12-15 日東電工株式会社 封止樹脂シート
JP2021034666A (ja) * 2019-08-28 2021-03-01 デクセリアルズ株式会社 半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008177432A (ja) * 2007-01-19 2008-07-31 Kyocera Chemical Corp 封止用熱硬化型樹脂シート、電子部品装置及び電子部品装置の製造方法
WO2011033743A1 (fr) * 2009-09-16 2011-03-24 住友ベークライト株式会社 Film adhésif, carte de circuit imprimé multicouche, composant électronique et dispositif à semi-conducteur
JP2012129326A (ja) * 2010-12-14 2012-07-05 Sumitomo Bakelite Co Ltd 電子装置の製造方法および電子装置パッケージの製造方法
JP2013065835A (ja) * 2011-08-24 2013-04-11 Sumitomo Bakelite Co Ltd 半導体装置の製造方法、ブロック積層体及び逐次積層体
JP2013153012A (ja) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd 電子部品モジュールの製造方法
WO2014185325A1 (fr) * 2013-05-16 2014-11-20 東洋紡株式会社 Procédé d'encapsulation d'un composant électrique/électronique ainsi que corps encapsulé
JP2016213391A (ja) * 2015-05-13 2016-12-15 日東電工株式会社 封止樹脂シート
JP2021034666A (ja) * 2019-08-28 2021-03-01 デクセリアルズ株式会社 半導体装置の製造方法

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