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WO2024223547A1 - Empilement de cos comprenant une plaque de liaison - Google Patents

Empilement de cos comprenant une plaque de liaison Download PDF

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Publication number
WO2024223547A1
WO2024223547A1 PCT/EP2024/061057 EP2024061057W WO2024223547A1 WO 2024223547 A1 WO2024223547 A1 WO 2024223547A1 EP 2024061057 W EP2024061057 W EP 2024061057W WO 2024223547 A1 WO2024223547 A1 WO 2024223547A1
Authority
WO
WIPO (PCT)
Prior art keywords
solid oxide
cell stack
oxide cell
gasket
connection plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2024/061057
Other languages
English (en)
Inventor
Thomas Heiredal-Clausen
Jeppe Rass-Hansen
Martin Refslund Nielsen
Bengt Peter Gustav BLENNOW
Tobias Holt NØRBY
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Topsoe AS
Original Assignee
Haldor Topsoe AS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Haldor Topsoe AS filed Critical Haldor Topsoe AS
Priority to AU2024262077A priority Critical patent/AU2024262077A1/en
Priority to CN202480028115.3A priority patent/CN121039328A/zh
Publication of WO2024223547A1 publication Critical patent/WO2024223547A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0271—Sealing or supporting means around electrodes, matrices or membranes
    • H01M8/0276—Sealing means characterised by their form
    • H01M8/0278—O-rings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C25B1/02—Hydrogen or oxygen
    • C25B1/04—Hydrogen or oxygen by electrolysis of water
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B9/00—Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
    • C25B9/60—Constructional parts of cells
    • C25B9/65—Means for supplying current; Electrode connections; Electric inter-cell connections
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B9/00—Cells or assemblies of cells; Constructional parts of cells; Assemblies of constructional parts, e.g. electrode-diaphragm assemblies; Process-related cell features
    • C25B9/70—Assemblies comprising two or more cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/002—Shape, form of a fuel cell
    • H01M8/006—Flat
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/02—Details
    • H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
    • H01M8/0204—Non-porous and characterised by the material
    • H01M8/0206—Metals or alloys
    • H01M8/0208—Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/24—Grouping of fuel cells, e.g. stacking of fuel cells
    • H01M8/241—Grouping of fuel cells, e.g. stacking of fuel cells with solid or matrix-supported electrolytes
    • H01M8/2425—High-temperature cells with solid electrolytes
    • H01M8/2432—Grouping of unit cells of planar configuration
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M8/00—Fuel cells; Manufacture thereof
    • H01M8/10—Fuel cells with solid electrolytes
    • H01M8/12—Fuel cells with solid electrolytes operating at high temperature, e.g. with stabilised ZrO2 electrolyte
    • H01M2008/1293—Fuel cells with solid oxide electrolytes

Definitions

  • the invention relates to a Solid Oxide Cell (SOC) stack, in particular a Solid Oxide Electrolysis Cell (SOEC) stack or a Solid Oxide Fuel Cell (SOEC) stack, comprising a connection plate between the SOC stack and a current collector and/or between SOC sub-stacks.
  • SOC Solid Oxide Cell
  • SOEC Solid Oxide Electrolysis Cell
  • SOEC Solid Oxide Fuel Cell
  • This invention can generally be used in a SOC stack - thus both in SOEC and SOEC mode even though for simplicity some parts of the description below relates to SOEC mode.
  • Interconnects serve as a gas barrier to separate the anode and cathode sides of adjacent cell units, and at the same time they enable current conduction between the adjacent cells, i.e., between an anode of one cell and a cathode of a neighbouring cell.
  • interconnects are normally provided with a plurality of flow paths for the passage of process gas on both sides of the interconnect.
  • the flow paths on the interconnect should be designed to seek an equal amount of process gas to each cell in a stack, i.e., there should be no flow- "short-cuts" through the stack.
  • the interconnect leads current between the anode and the cathode layer of neighbouring cells.
  • the electrically conducting contact points hereafter merely called “contact points”
  • the contact points should be designed to establish good electrical contact to the electrodes (anode and cathode) and the contact points should nowhere be far apart, which would force the current to run through a longer distance of the electrode with resulting higher internal resistance.
  • an SOC stack it is desirable that the lifetime of an SOC stack is maximized, i.e. that in SOFC mode it can be used to produce as much electricity as possible and that in SOEC mode the amount of electrolysis product (e.g. H2 and/or CO) is maximized.
  • Stack lifetime depends on a number of factors, including the choice of the interconnect and spacer, on flow distribution on both process gas sides of the interconnect, evenly distributed protective coating on the materials, on the operating conditions (temperature, current density, voltage, etc) , on cell design and materials, edge re-oxida- tion which lowers the lifetime and many other factors.
  • the cost contribution of the interconnects (and spacers) can be reduced by not using noble materials, by reducing the production time of the interconnect and spacer, minimizing the number of components and by minimizing the material loss (the amount of material discarded during the production process) .
  • the overall dimensions of a fuel stack are reduced when the interconnect design ensures a high utili zation of the active cell area . Dead-areas with low process gas flow should be reduced and inactive zones for sealing surfaces should be minimi zed .
  • interconnect and spacer production methods and materials should permit a low interconnect fail rate (such as unwanted holes in the interconnect gas barrier, uneven material thickness or characteristics ) . Further the fail-rate of the assembled cell stack can be reduced when the interconnect design reduces the total number of components to be assembl ed and reduces the l ength and number of seal surfaces .
  • the way the anode and cathode gas flows are distributed in a SOC stack is by having a common mani fold for each of the two process gasses .
  • the mani folds can either be internal or external .
  • the mani folds supply process gasses to the individual layers in the SOC stack by the means of channels to each layer .
  • the channels are normally situated in one layer of the repeating elements which are comprised in the SOC stack, i . e . in the spacers or in the interconnect .
  • Solid oxide electrolysis cells can be used to convert H20 to H2 , C02 to CO, or a combination of H20 and C02 to syngas (H2 and CO) . This conversion occurs on the cathode side ( fuel side ) of the SOEC, where the cell comprises of Nickel containing layers in their reduced state . On the oxy side of the SOEC ( the anode ) , oxygen is produced and is normally flushed with air .
  • the cells When stacking the Solid Oxide Cells to an SOC stack, the cells are connected in series - separated by interconnects in an assembly known as a Single Repeat Unit ( SRU) .
  • SRU Single Repeat Unit
  • the serial connected layers are heated and compressed together to form a tight stack .
  • the mechanical load used to compress the stack components together will induce stress in the ceramic cells .
  • a common failure mode is cell cracking, where the ceramic cell fractures because of the applied stress .
  • I f a single cell cracks in a stack the entire stack has to be discarded, as a cracked cell will cause internal combustion in the stack during operation which will damage the remaining stack .
  • i f 1 cell fails during production in a 100- cell stack, the entire stack is discarded regardless that the remaining 99 cells are ok .
  • the substacks When combining sub-stacks to a full-size stack, the substacks are stacked on top of each other to form one serial connected stack. There are two demands for the connection of the sub-stacks; 1) the connection needs to be able to transfer current from one sub-stack to the next, as the sub-stacks are connected in serial. This current transfer needs to be uniform across the stack footprint not to cause misdistribution in the sub-stacks. 2) the connection between the sub-stacks needs to be gas tight.
  • the invention aims to accomplish this in a simple , robust design with few components and without need for a sealing step before the assembled stack ( consisting of sub-stacks and/or connected adj acent current collectors ) can be put into operation .
  • a further problem solved by the invention is to accomplish the above described with elements with thermal expansion coef ficients (TEC ) approaching the TEC of the sub-stacks and thereby the full-si ze stack .
  • TEC thermal expansion coef ficients
  • US2005016729 discloses a ceramic fuel cell ( s ) which is supported in a heat conductive interconnect plate , and a plurality of plates form a conductive heater named a stack . Connecting a plurality of stacks forms a stick of fuel cells . By connecting a plurality of stacks end to end, a string of fuel cells is formed . The length of the string can be one thousand feet or more , si zed to penetrate an underground resource layer, for example of oil . A pre-heater brings the string to an operating temperature exceeding 700 DEG C . , and then the fuel cells maintain that temperature via a plurality of conduits feeding the fuel cells fuel and an oxidant , and trans ferring exhaust gases to a planetary surface . A mani fold can be used between the string and the planetary surface to continue the plurality of conduits and act as a heat exchanger between exhaust gases and oxidants/ fuel .
  • the solution for sub-stack assembly or a connection between a full-size stack and an adjacent current collector is a simple and robust connection made of 1) a thin plate made of electrically conducting material to conduct the current between the sub-stacks and/or between a full-size stack and an adjacent current collector, and 2) axial gaskets to ensure the leak tightness between the sub-stacks or between a full-size stack and an adjacent current collector.
  • the thin plate is made of electrically conducting material fit for operational conditions, for instance high temperature steel (Crofer) .
  • the plate is quite thin, for instance here 0.5mm in order, as described above, to reduce thermomechanical forces arising from difference in TEC (Thermal Expansion Coefficient) between the sub-stacks and the connection plate or between a full-size stack and an adjacent current collector.
  • TEC Thermal Expansion Coefficient
  • connection plate has holes at the manifolds that needs to be sealed that is slightly larger than the manifold holes in the sub-stacks or full-size stack. These slightly larger holes are made to accommodate space for axial gaskets (which may for instance be circular ) that are placed in the connection plates . By inserting a single gasket in a hole rather than two gaskets from each side in grooves ( for each gas connection) a much thinner connection plate can be made .
  • the axial type gaskets are made of a high temperature gasket material for instance Flexitallic .
  • the gaskets are originally thicker than the connection plate , for instance 1mm gasket in a 0 . 5mm connection plate .
  • the reason for the thicker gasket than the connection plate is to be able to compress the gasket to acquire a tight interface to each sub-stack and tightness of the gasket itsel f , or a full-si ze stack and an adj acent current collector .
  • the gaskets between the substacks or between the full-si ze stack and an adj acent current collector are compressed to the thickness of the connection plate . This compression ensures compression of the gasket AND creating electrical contact between the sub-stacks or between the full-si ze stack and an adj acent current collector on the entire footprint of the stack as the connection plate is compressed .
  • an inner metallic ring can be inserted on the inside of the gasket inserted in the connection plate .
  • This inner ring has the same height ( or slightly less than) of the connection plate and is made of the same material ( or similar ) as the connection plate .
  • the idea of the inner ring is to support the gasket to avoid blow-in when the gasket is subj ected to a high external pressure for instance in the order of 1-20 bar .
  • the inner ring can thus be regarded as a way of reinforcing the gasket solution of the sub-stack connection or the full-si ze stack and an adj acent current collector connection to be able to accommodate large pressure di f ferences across the gasket .
  • An ef fect of the invention is the possibility to disassemble the sub-stacks or the full-si ze stack and an adj acent current collector after operation, as the sub-stacks or the full-si ze stack and an adj acent current collector are connected/ tightened by a compressible gasket and not glued, braced, glassed or welded together .
  • solution of the sealing/gasket problem to compress a gasket to get tightness in connection with an electrical contact on the remaining surface is to insert the gasket in a recess of the connection plate .
  • the recess can be positioned on either side of the connection plate , where gas tightness is required, the recess may also be on both sides of the connection plate to achieve tightness towards both sub-stacks or between a full-si ze stack and an adj acent current collector .
  • Producing sub-stacks and combining them to full si ze stacks has the mentioned ef fect of increasing yield in production as mentioned in background of invention .
  • the proposed substack connection or full-si ze stack and an adj acent current collector connection minimi zes the thermal gradients at the sub-stack or full-si ze stack ends due to its small thermal mass actually approaching the mass of the components e . g . , the interconnects of the SRU . This ensures optimal operating conditions can be achieved and mechanical stresses are minimi zed at the sub-stack or/and full-si ze stack ends minimi zing the risk of failure .
  • the proposed sub-stack or full-si ze stack and an adj acent current collector connection is a simple and robust solution with only a few parts .
  • the solution is easy to assemble and does not require a production step to assemble the sub-stacks and/or or full-si ze stack and an adj acent current collector - they are simply stacked and put into operation .
  • connection plate ensures a well distributed contact and current to the sub-stacks and/or or full-si ze stack and the small axial gasket minimi zes the sealing area and thus increases tightness of the connection .
  • Inserting a thicker gasket in the connection plate and compressing the gasket to the thickness of the connection plates is a simple and robust way to ensure good uniform electrical contact between the sub-stacks and/or or between a full-si ze stack and an adj acent current collector and ensure adequate compression of the compressible gasket to ensure tightness .
  • a solid oxide cell stack comprises a plurality of stacked single repeat units , each single repeat unit comprises a solid oxide cell and an interconnect , one interconnect separates one cell from the adj acent cell in the cell stack as also described in the above .
  • the solid oxide cell stack further comprises at least one connection plate .
  • the connection plate is enabled to provide uni form electrical connection across the cross-sectional area of the solid oxide cell stack between said solid oxide cell stack and an adj acent end plate (for instance a current collector end plate as described in the above ) .
  • connection plate is further enabled to provide gas sealing around at least one mani fold hole (which provides a passage for process fluid ( s ) in said solid oxide cell stack .
  • the connection plate comprises at least one gasket zone .
  • the gasket zone comprises a hole in the connection plate corresponding a mani fold hole of the solid oxide cell stack, and the gasket zone also comprises at least one gasket .
  • the at least one gasket zone is surrounding said at least one mani fold hole , i . e . one gasket zone is surrounding one manifold hole .
  • the thickness of the gasket zone during compression of the solid oxide cell stack is equal to the thickness of the connection plate .
  • the one or more gasket zone ( s ) when the solid oxide cell stack is compressed, for instance during operation, the one or more gasket zone ( s ) will have a thickness which is equal to the thickness of the connection plate and the solid oxide cell stack and the adj acent end plate thus faces an even surface of the connection plate . It is to be understood of f course that the thickness of the gasket zones during compression is not necessarily exactly mathematical equal to the thickness of the connection plate as all the components of the solid oxide cell stack including the SRU and the connection plates are manufactured within certain tolerances as is normal in the field and in the industry .
  • each of the above-described gasket zones comprises one single gasket only .
  • the one gasket of each gasket zones is arranged within a gasket hole in the connection plate .
  • Only one gasket in each gasket zone has the advantage of simplicity and a minimum of parts .
  • the thickness of said gasket when the gasket is not compressed is larger than the thickness of the connection plate .
  • each gasket zone comprises not only one , but two gaskets .
  • the two gaskets of each gasket zone are arranged opposite each other on either side of the connection plate and around a hole in the connection plate which corresponds to an adj acent mani fold hole . It is to be understood that corresponds may mean that the holes have the same or nearly the same centres , but also other meanings are possible .
  • connection plate comprises a recess on either side in each gasket zone , each recess op-posing the other, and each recess is adapted to contain a gasket , thus the position of the gaskets relative to the connection plate is to an extent provided by the recesses .
  • the thickness of the connection plate within the opposing recesses plus the thickness of the two gaskets is larger than the thickness of the remaining connection plate when the gaskets are not compressed, which provides for the wished sealing in the same way as described in the above when the solid oxide cell stack is compressed e . g . during operation .
  • each gasket zone further comprises an inner stabili zation ring, adapted to support the inner circumference of the at least one gasket .
  • the inner stabili zation ring provides for a well-defined free cross-sectional area for the process fluid to flow through, thus avoiding this area to be compromised by the gasket when it is compressed and/or deformed . Even more important , the stabili zation ring provides for securing the at least one gasket against blow-in-out in cases where the solid oxide cell stack is operated with pressure di f ferences between layers in the stack (such as anode and cathode or between the SRU and an adj acent end plate where the connection plate is arranged in-between) .
  • the inner stabilization ring has an inner circumference equal to or larger than a corresponding mani fold hole of the solid oxide cell stack, hence the process fluid flow through the mani fold hole is not restricted by the connection plate .
  • the inner stabili zation ring has an outer circumference smaller than the inner circumference of the at least one gasket , and a thickness equal to or smaller than the thick-ness of the connection plate , such that the stabili zation ring does not restrict the compression of the solid oxide cell stack .
  • each hole in the connection plate corresponding a mani fold hole has a larger circumference than the corresponding mani fold hole , large enough to provide an area for the at least one gasket without restricting flow in the mani fold .
  • the hole in the connection plate and the corresponding mani fold hole have the same centre (within tolerances ) as also discussed in the above .
  • each gasket and each mani fold hole and each hole in the connection plate is circular . This provides advantages such as ease of production, enhanced process fluid flow and good sealing in the gasket zone .
  • the force for compression of said solid oxide cell stack is larger than the compression force for the total number of gaskets on the connection plate , large enough to provide uni form electrical connection across the cross-sectional area of the solid oxide cell stack between said solid oxide cell stack, the connection plate , and an adj acent end plate .
  • the force for compression of said solid oxide cell stack is larger than the compression force for the total number of gaskets on the connection plate , large enough to provide uni form electrical connection across the cross-sectional area of the solid oxide cell stack between said solid oxide cell stack, the connection plate , and an adj acent end plate .
  • the thickness of the contact plate is small enough to enable the contact plate to adapt to the surface and unevenness of the adj acent solid oxide cell stack and the adj acent end plate and large enough to be sel f-supporting during production . It is to be understood that this thickness is dependant of the material of the connection plate and the si ze/area of the connection plate among other .
  • the thickness of the contact plate is between 0 . 2 and 1 . 6 mm; and in a further embodiment of the invention, the contact plate is made of steel , or other suited material .
  • the thickness of the contact plate is equal to (within production and/or feasible tolerances ) the thickness of the interconnect ; and in a further embodiment the contact plate is made of the same material as the interconnect .
  • the connection plate is coated; in a speci fic embodiment , the coating comprises Ni or Cu, or both Ni and CU .
  • the surface area of the one or more single repeat units facing the at least one gasket is an even surface area which is large enough to provide gas sealing to the gasket around a mani fold hole , thus the surface of the areas facing the at least one gasket is adapted to be best suited for ef fective sealing against process fluid leakage .
  • the solid oxide cell stack is a solid oxide electrolysis cell stack; and in a further embodiment , the solid oxide cell stack is a solid oxide electrolysis cell stack, and the contact plate comprises gaskets around one or more mani fold holes .
  • the contact plate may comprise gaskets around all the mani fold holes of the solid oxide electrolysis cell stack, but in a speci fic embodiment , the contact plate comprises gaskets around the one or more oxy side mani fold holes , but no sealing around the at least one fuel side mani fold hole . This may be advantageous i f a certain amount of process fluid flush is desirable around the fuel side mani fold hole according to the process .
  • connection plate may both be used between the entire solid oxide cell stack and adj acent end plate ( s ) but also between solid oxide cell sub-stacks .
  • the at least one connection plate is further enabled to provide uni form electrical connection across the cross sectional area of the solid oxide cell stack between one sub-stack of said solid oxide cell stack and an adj acent sub-stack of said solid oxide cell stack and the connection plate is further enabled to provide gas sealing around at least one mani fold hole in said sub-stacks of said solid oxide cell stack .
  • Solid oxide cell stack comprising a plurality of stacked single repeat units , each single repeat unit comprises a solid oxide cell and an interconnect , one interconnect separates one cell from the adj acent cell in the cell stack, wherein the solid oxide cell stack further comprises at least one connection plate enabled to provide uni form electrical connection across the cross sectional area of the solid oxide cell stack between said solid oxide cell stack and an adj acent end plate and the connection plate is further enabled to provide gas sealing around at least one mani fold hole in said solid oxide cell stack, wherein said connection plate comprises at least one gasket zone , comprising a hole in the connection plate corresponding a mani fold hole , and comprising at least one gasket and surrounding said at least one mani fold hole , the thickness of said gasket zone during compression of the solid oxide cell stack is equal to the thickness of the connection plate .
  • each gasket zone comprises one gasket arranged within a gasket hole in the connection plate , the thickness of said gasket when the gasket is not compressed is larger than the thickness of the connection plate .
  • each gasket zone comprises two gaskets arranged opposite each other on either side of the connection plate and around a hole in the connection plate which corresponds to an adj acent mani fold hole
  • the connection plate comprises a recess on either side in each gasket zone , each recess opposing the other, each recess is adapted to contain a gasket
  • the thickness of the connection plate within the opposing recesses plus the thickness of the two gaskets is larger than the thickness of the remaining connection plate , when the gaskets are not compressed .
  • Solid oxide cell stack according to feature 4 wherein the outer circumference of said recess is larger than the circumference of the gasket .
  • each gasket zone further comprises an inner stabili zation ring, adapted to support the inner circumference of the at least one gasket .
  • Solid oxide cell stack according to feature 6 wherein said inner stabili zation ring has an inner circumference equal to or larger than a corresponding mani fold hole of the solid oxide cell stack, an outer circumference smaller than the inner circumference of the at least one gasket , and a thickness equal to or smaller than the thick-ness of the connection plate .
  • each hole in the connection plate corresponding a mani fold hole has a larger circumference than the corresponding mani fold hole , large enough to provide an area for the at least one gasket without restricting flow in the manifold.
  • Solid oxide cell stack according to any of the preceding features, wherein the force for compression of said solid oxide cell stack is larger than the compression force for the total number of gaskets on the connection plate, large enough to provide uniform electrical connection across the cross-sectional area of the solid oxide cell stack between said solid oxide cell stack, the connection plate, and an adjacent end plate.
  • Solid oxide cell stack according to any of the preceding features, wherein the thickness of the contact plate is between 0.2 and 1.6 mm.
  • Solid oxide cell stack according to any of the preceding features wherein the contact plate is made of steel, or other suited material. 14 . Solid oxide cell stack according to any of the preceding features , wherein the connection plate is coated .
  • connection plate is coated with Ni or Cu, or both Ni and CU .
  • Solid oxide cell stack according to any of the preceding features , wherein the thickness of the contact plate is equal to the thickness of the interconnect .
  • Solid oxide cell stack according to any of the preceding features , wherein the contact plate is made of the same material as the interconnect .
  • Solid oxide cell stack according to any of the preceding features , wherein the surface area of the one or more single repeat units facing the at least one gasket , is an even surface area which is large enough to provide gas sealing to the gasket around a mani fold hole .
  • Solid oxide cell stack according to any of the preceding features , wherein the solid oxide cell stack is a solid oxide electrolysis cell stack .
  • Solid oxide cell stack according to any of the preceding features wherein the solid oxide cell stack is a solid oxide electrolysis cell stack, and the contact plate comprises gaskets around one or more mani fold holes .
  • the contact plate comprises gaskets around the one or more oxy side mani fold holes , but no sealing around the at least one fuel side mani fold hole .
  • connection plate is further enabled to provide uni form electrical connection across the cross sectional area of the solid oxide cell stack between one sub-stack of said solid oxide cell stack and an adj acent sub-stack of said solid oxide cell stack and the connection plate is further enabled to provide gas sealing around at least one mani fold hole in said substacks of said solid oxide cell stack .
  • Fig. 1 shows an isometric top view of a connection plate.
  • Fig. 2 shows an isometric top detail view of the connection plate of Fig . 1.
  • Fig. 3 shows a top view of a connection plate.
  • Fig. 4 shows a side cut detail view of the connection plate of Fig. 3.
  • Fig. 5 shows a top view of a schematic single repeat unit SRU (with a connection plate and a further SRU underneath hidden from view.
  • Fig. 6 shows side cut detail view of the SRU of Fig. 5 and further a connection plate and a further SRU.
  • connection plate 01 shows an isometric top view of a connection plate 01 according to an embodiment of the invention.
  • the connection plate is adapted to be arranged between a solid oxide cell stack and an end plate (such as a current collector) and/or between solid oxide cell sub-stacks.
  • the sub-stacks and the end plates are not shown on the figures however, as they are known in the art.
  • the connection plate in this embodiment comprises four manifold holes 03 located adjacent to the periphery of the connection plate and a central manifold hole 02 located in the centre of the connection plate within tolerances as discussed already.
  • FIG. 2 A detailed isometric top view (G)of one of the manifold holes is seen in Fig 2.
  • a gasket 04 is located within each of the manifold holes.
  • the thickness of the gasket is larger than the thickness of the connection plate.
  • the inner stabili zation ring 05 arranged within the gasket . As discussed, this ring stabilises the gasket against blow-in when subj ected to pressure di f ferences on either sides of the sealing gasket and furthermore provides a well-defined inner diameter of the resulting cross-sectional area providing free process fluid flow of the mani fold hole .
  • Fig . 3 almost the same picture of the connection plate as in Fig . 1 is shown, now in top view .
  • the detailed side-cut view B-B in Fig 4 here in more detail shows how the gasket is actually thicker (when not subj ected to a compression force ) than the connection plate as well as the inner stabili zation ring .
  • the gap, the free space between the inner circumference of the mani fold hole in the connection plate and the outer diameter of the gasket is clearly visible .
  • Fig . 5 and its detailed side-cut view in Fig . 6 shows an embodiment of the invention where the connection plate is arranged between two solid oxide cell sub-stacks . Not the whole of the solid oxide sub-stacks are shown, only the first SRU's 06 of each solid oxide sub-stacks are shown, the SRU's which are adjacent on each side of the connection plate. It is to be understood, as also discussed in the above that instead of two SRU's, the connection plate could also be arranged between one SRU (on one side) and an end plate (on the other side) according to another embodiment of the invention and as previously discussed.
  • Fig 6 shows how the gasket thickness is reduced to the same as the thickness of the connection plate, when the whole, the solid oxide cell stack and possibly also end plate (s) is subjected to a compression force, thus providing sealing around the manifold hole without the need for a more cumbersome glass sealing. It is also visible how the stabilization ring provides inner stabilization of the gasket, thus preventing the gasket to blow-out, or rather blow-in into the manifold hole when subjected to pressure differences between the two sides of the gasket.
  • the stabilization ring does not need to be as thick as the connection plate to provide for necessary stabilization; therefore, in an embodiment of the invention the stabilization ring thickness may be slightly smaller than the connection plate thickness to prevent the stabilization ring from interfering when the whole solid oxide cell stack and possibly end plate (s) are subjected to a compression force. It is namely, as also discussed in the above also an important feature of the connection plate to provide for electrical contact between the elements on either side of the connection plate, be it two SRU's or an SRU and an endplate, throughout the whole cross-sectional area of the connection plate, as this is essential for the operation of the solid oxide cell stack . Therefore , it may also be advantageous as discussed in the above that the compression force on the solid oxide cell stack and possibly the end plate ( s ) is larger than the force needed to compress the total number of gaskets arranged in the one or more connection plates .

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  • Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Fuel Cell (AREA)
  • Inorganic Chemistry (AREA)

Abstract

Un empilement de COS comporte au moins une plaque de liaison entre l'empilement de cellules à oxyde solide et une plaque d'extrémité adjacente, deux plaques d'extrémité adjacentes et/ou entre des sous-empilements de cellules à oxyde solide adjacents.
PCT/EP2024/061057 2023-04-25 2024-04-23 Empilement de cos comprenant une plaque de liaison Pending WO2024223547A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2024262077A AU2024262077A1 (en) 2023-04-25 2024-04-23 Soc stack comprising connection plate
CN202480028115.3A CN121039328A (zh) 2023-04-25 2024-04-23 包括连接板的soc堆

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP23169705 2023-04-25
EP23169705.3 2023-04-25

Publications (1)

Publication Number Publication Date
WO2024223547A1 true WO2024223547A1 (fr) 2024-10-31

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PCT/EP2024/061057 Pending WO2024223547A1 (fr) 2023-04-25 2024-04-23 Empilement de cos comprenant une plaque de liaison

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CN (1) CN121039328A (fr)
AU (1) AU2024262077A1 (fr)
WO (1) WO2024223547A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998057384A1 (fr) * 1997-06-10 1998-12-17 Ceramic Fuel Cells Limited Ensemble cellule electrochimique
US20050016729A1 (en) 2002-01-15 2005-01-27 Savage Marshall T. Linearly scalable geothermic fuel cells
EP1998395A1 (fr) * 2007-05-28 2008-12-03 Samsung SDI Co., Ltd. Bloc pour pile à combustible
EP3324475A1 (fr) * 2016-11-18 2018-05-23 Siemens Aktiengesellschaft Module de pile à combustible, système de pile à combustible et procédé de fonctionnement
WO2019034855A1 (fr) * 2017-08-16 2019-02-21 Ceres Intellectual Property Company Limited Unité de pile à combustible à oxyde solide à support métallique et son procédé de fabrication
WO2020126486A1 (fr) * 2018-12-20 2020-06-25 Ceres Intellectual Property Company Limited Unité de pile à combustible et empilement de piles à combustible
US20220367889A1 (en) * 2021-05-14 2022-11-17 Toyota Jidosha Kabushiki Kaisha Fuel cell

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998057384A1 (fr) * 1997-06-10 1998-12-17 Ceramic Fuel Cells Limited Ensemble cellule electrochimique
US20050016729A1 (en) 2002-01-15 2005-01-27 Savage Marshall T. Linearly scalable geothermic fuel cells
EP1998395A1 (fr) * 2007-05-28 2008-12-03 Samsung SDI Co., Ltd. Bloc pour pile à combustible
EP3324475A1 (fr) * 2016-11-18 2018-05-23 Siemens Aktiengesellschaft Module de pile à combustible, système de pile à combustible et procédé de fonctionnement
WO2019034855A1 (fr) * 2017-08-16 2019-02-21 Ceres Intellectual Property Company Limited Unité de pile à combustible à oxyde solide à support métallique et son procédé de fabrication
WO2020126486A1 (fr) * 2018-12-20 2020-06-25 Ceres Intellectual Property Company Limited Unité de pile à combustible et empilement de piles à combustible
US20220367889A1 (en) * 2021-05-14 2022-11-17 Toyota Jidosha Kabushiki Kaisha Fuel cell

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AU2024262077A1 (en) 2025-11-06

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