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WO2024220034A1 - Système électronique et procédé de production de celui-ci - Google Patents

Système électronique et procédé de production de celui-ci Download PDF

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Publication number
WO2024220034A1
WO2024220034A1 PCT/SG2024/050250 SG2024050250W WO2024220034A1 WO 2024220034 A1 WO2024220034 A1 WO 2024220034A1 SG 2024050250 W SG2024050250 W SG 2024050250W WO 2024220034 A1 WO2024220034 A1 WO 2024220034A1
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WO
WIPO (PCT)
Prior art keywords
inductor
trace
bonding
die paddle
segment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/SG2024/050250
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English (en)
Inventor
Sun Yang TAY
Victor ADRIAN
Joseph Sylvester Chang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanyang Technological University
Original Assignee
Nanyang Technological University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of WO2024220034A1 publication Critical patent/WO2024220034A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements

Definitions

  • the present disclosure generally relates to an electronic system and a method for producing the same. More particularly, the present disclosure describes various embodiments of an electronic system comprising an inductor, such as a semiconductor package, as well as a method for producing the electronic system.
  • an inductor such as a semiconductor package
  • loT devices Internet-of-Things
  • loT devices generally employ various systems, including power management and wireless communication. Both of these systems typically require inductors with relatively high inductance values and high quality factor values (Q). Q is the ratio of the reactive energy stored to the resistive energy loss, and a high Q value is largely equivalent to low loss.
  • the inductor is used as a temporary energy storage element of the power converter circuit, whereas in the wireless communication system, it is typically used as an inductive load and as part of the matching network or the bandpass filter of the wireless power amplifier and the mixer circuits.
  • inductors are large and less suitable for loT devices, which typically have small form factors.
  • one prevailing way to provide the inductors is to use external discrete inductors placed outside of the semiconductor package.
  • the external inductors result in relatively high cost and large form factor due to realization on the printed circuit board (PCB) where the semiconductor package and the inductors are assembled on.
  • PCB printed circuit board
  • an electronic system comprising: a lead frame comprising a die paddle region having a first side, a second side adjacent to the first side, and at least one die paddle bounded by the first and second sides for receiving at least one device, each device comprising at least one bonding terminal; and at least one inductor formed on areas of the lead frame around the die paddle region, each inductor electrically connectable to the at least one bonding terminal.
  • Each inductor comprises: at least one inductor segment arranged in series, each inductor segment comprising a trace and at least one bonding element electrically connecting the trace to the at least one bonding terminal or a trace of another inductor segment, wherein the series of least one inductor segment collectively turns at least partially around the die paddle region, such that the series of at least one inductor segment is adjacent to at least part of the first side and at least part of the second side of the die paddle region.
  • a method for producing an electronic system comprises: forming a lead frame comprising a die paddle region having a first side, a second side adjacent to the first side, and at least one die paddle bounded by the first and second sides for receiving at least one device, each device comprising at least one bonding terminal; and forming at least one inductor on areas of the lead frame around the die paddle region, each inductor electrically connectable to the at least one bonding terminal.
  • Forming each inductor comprises: forming at least one inductor segment, each inductor segment comprising a trace and at least one bonding element electrically connecting the trace to the at least one bonding terminal or a trace of another inductor segment; and arranging the at least one inductor segment in series, such that the series of at least one inductor segment collectively turns at least partially around the die paddle region and is adjacent to at least part of the first side and at least part of the second side of the die paddle region.
  • FIG. 1 is a top view of a lead frame of an electronic system and having a die paddle region, according to one embodiment of the present disclosure.
  • FIG. 2 is a top view of the lead frame of FIG. 1 with an inductor turning around the die paddle region.
  • FIG. 3A is a top view of the lead frame of FIG. 2 with the inductor and a device mounted at the die paddle region.
  • FIG. 3B is a top perspective view of the lead frame of FIG. 3A.
  • FIG. 4 is a top perspective view of the lead frame with a variation of the inductor having bonding ribbons, according to one embodiment of the present disclosure.
  • FIG. 5 is a top perspective view of the lead frame with a variation of the inductor having intertwined turns, according to one embodiment of the present disclosure.
  • FIG. 6 is a top perspective view of the lead frame with a variation of the inductor having longer traces, according to one embodiment of the present disclosure.
  • FIG. 7 is a top perspective view of the lead frame with a variation of the inductor having longer leads, according to one embodiment of the present disclosure.
  • FIG. 8 is a top perspective view of the lead frame with a variation of the inductor in a hexagonal geometric shape, according to one embodiment of the present disclosure.
  • FIG. 9 is a top perspective view of the lead frame with a variation of the inductor with three turns in a square geometric shape, according to one embodiment of the present disclosure.
  • FIG. 10 is a top perspective view of the lead frame with a variation of the inductor consisting of a sole inductor segment, according to one embodiment of the present disclosure.
  • FIG. 11A is a top perspective view of the lead frame with two inductors that are electrically isolated from each other, according to one embodiment of the present disclosure.
  • FIG. 11 B is an electrical circuit diagram of mutual coupling between the two inductors of FIG. 11 A.
  • FIG. 12A is a top perspective view of the lead frame of FIG. 11A with a variant of the two inductors being connected with a shared terminating trace, according to one embodiment of the present disclosure.
  • FIG. 12B is an electrical circuit diagram of the inductor of FIG. 12A.
  • FIG. 13A is a top perspective and partially exposed view of the electronic system being a semiconductor package comprising the lead frame and inductor, according to one embodiment of the present disclosure.
  • FIG. 13B is a bottom perspective view of the semiconductor package of FIG. 13A. Detailed Description
  • depiction of a given element or consideration or use of a particular element number in a particular figure or a reference thereto in corresponding descriptive material can encompass the same, an equivalent, or an analogous element or element number identified in another figure or descriptive material associated therewith.
  • a set as defined herein can correspond to a unit, singlet, or single-element set, or a multiple-element set), in accordance with known mathematical definitions.
  • the terms “first”, “second”, etc. are used merely as labels or identifiers and are not intended to impose numerical requirements on their associated terms.
  • the system includes a lead frame 100 comprising a die paddle region 102 having a first side and a second side adjacent to the first side.
  • the die paddle region 102 further includes at least one die paddle bounded by the first and second sides for mounting at least one device thereon.
  • Lead frames such as the lead frame 100 may be manufactured according to techniques known to skilled person.
  • the lead frame 100 is formed by stamping and/or etching a planar sheet of electrically conductive material, such as copper, nickel, plated copper, copper-alloy, or other metals or metal alloys.
  • the die paddle region 102 includes at least one paddle, wherein each paddle is configured for a corresponding device to be mounted thereon.
  • the system may include at least one device mounted on the at least one die paddle.
  • the at least one device includes at least one semiconductor die and/or at least one energy storage system.
  • devices such as semiconductor IC die, micro- electromechanical systems (MEMS) devices, energy storage systems (e g. solid-state micro-batteries), and discrete passive components can be mounted and attached on the die paddle region 102.
  • MEMS micro- electromechanical systems
  • energy storage systems e g. solid-state micro-batteries
  • discrete passive components can be mounted and attached on the die paddle region 102.
  • the lead frame 100 may include a number of tie bars 104 arranged to provide mechanical support from corners of the lead frame 100 to the die paddle region 102.
  • the lead frame 100 may include a number of leads 106 arranged around the periphery of the lead frame 100.
  • the leads 106 may be exposed on the sides of the electronic system.
  • the leads 106 and die paddle region 102 preferably have the same thickness, and their bottom surfaces may be exposed as pads (not shown).
  • the exposed portion of the leads 106 and die paddle region 102 are generally used for electrical contacts with components outside the system.
  • the lead frame 100 further includes traces 108,110.
  • a trace 108 that is fitted between a tie bar 104 and another trace 110 can be constructed to extend the leads 106 inwards to the die paddle region 102. This would facilitate bonding connection to the devices mounted on die paddle region 102.
  • traces 108a,108h extend the leads 106a,106h, respectively, inwards to the die paddle region 102.
  • the traces 110 are shown as shaded portions of the lead frame 100.
  • the traces 110 are formed between the edges of the lead frame 100 and the die paddle region 102.
  • Each trace 110 includes multiple smaller parts.
  • the trace 110a includes parts ai-as.
  • the traces 110 and die paddle region 102 are preferably formed on the same lead frame 100, i.e., without using separate or multiple lead frames.
  • the bottom surface of the traces 110 is partially etched such that the thickness of the traces 110 is less than the thickness of the leads 106 and die paddle region 102.
  • the system includes at least one inductor 112 formed on areas of the lead frame 100 around the die paddle region 102.
  • the inductor 112 may also be referred to be an inductor with a turning or coiled profile, preferably spiral or spiral-like.
  • Inductors 112 are magnetic devices that store energy in the form of magnetic fields based on the amount of electrical current.
  • the inductors 112 may include baluns, coupled inductors, transformers, autotransformers, chokes, etc.
  • the traces 110 form part of the inductor 112 formed on the lead frame 100 and integrated with the system.
  • the inductor 112 which is demarcated within the two dashed lines for illustration purpose, includes at least one inductor segment arranged in series. Each inductor segment includes a trace 110 and at least one bonding element 114.
  • the series of at least one inductor segment is disposed in the areas of the lead frame 100 outside the sides of the die paddle region 102 to form the turning profile of the inductor 112 at these areas of the lead frame 100.
  • the series of at least one inductor segment turns at least partially around the die paddle region 102, and the series of at least one inductor segment is adjacent to at least part of the first side and at least part of the second side of the die paddle region 102.
  • the series of at least one inductor segment forms at least half a turn around the die paddle region 102. More preferably, the series of at least one inductor segment forms at least one turn around the die paddle 102.
  • the embodiment shown in FIG. 2 includes multiple inductor segments that form two turns around the die paddle region 102.
  • a 'turn’ around the die paddle region 102 may also be referred to as a ‘coil’ around the die paddle region 102.
  • the inductor 112 may also be referred to as having a turning profile or coiled profile formed by the series of at least one inductor segment, and the inductor 112 may be referred to as a coiled inductor. It will be appreciated that this particular number of turns of the turning profile of the inductor 112 shown in FIG. 2 is provided merely for illustrative purposes of the inductor 112.
  • the turning profile may form any number of turns around the die paddle region 102, such as one turn, three turns, or more. It will also be appreciated that each turn may be partial or completely around the die paddle region 102.
  • the turning profile may form one-and- a-quarter turns, two-and-a-half turns, etc.
  • One complete turn or coil is defined as about 360° around the die paddle region 102.
  • the turning profile may have one- quarter turn (about 90°) or half a turn (about 180°) around the die paddle region 102, and the inductor segments are adjacent to part of the first side and part of the second side of the die paddle region 102.
  • the embodiment of FIG. 2 shows each inductor segment having a trace 110 and at least one bonding element 114.
  • the bonding element 114 may connect the trace 110 of the respective inductor segment to the trace 110 of another inductor segment in the construction of the coiled inductor 112.
  • the trace 110a and bonding element 114a form a first inductor segment
  • the trace 110b and bonding element 114b form a second inductor segment
  • the bonding element 114b of the second inductor segment is electrically connected to the trace 110a of the first inductor segment.
  • the trace 110c and bonding element 114c form a third inductor segment, and the bonding element 114c of the third inductor segment is electrically connected to the trace 110b of the second inductor segment.
  • the trace 110d and bonding element 114d form a fourth inductor segment, and the bonding element 114d of the fourth inductor segment is electrically connected to the trace 110c of the third inductor segment.
  • the trace 110e and bonding element 114e form a fifth inductor segment, and the bonding element 114e of the fifth inductor segment is electrically connected to the trace 110d of the fourth inductor segment.
  • the trace 110f and bonding element 114f form a sixth inductor segment, and the bonding element 114f of the sixth inductor segment is electrically connected to the trace 110e of the fifth inductor segment.
  • the trace 110g and bonding element 114g form a seventh inductor segment, and the bonding element 114g of the seventh inductor segment is electrically connected to the trace 11 Of of the sixth inductor segment.
  • the trace 11 Oh and bonding element 114h form an eighth inductor segment, and the bonding element 114h of the eighth inductor segment is electrically connected to the trace 110g of the seventh inductor segment.
  • the respective inductor segments are thus formed by the respective traces 110a-110h and the respective bonding elements 114a-114h.
  • the respective bonding element 114 of the respective inductor segment is electrically connected to the respective trace 110 of the preceding inductor segment.
  • the traces 110a- 110d and the traces 110e-110h form the inner inductor segments and outer inductor segments, respectively, relative to the die paddle region 102.
  • one or both ending parts of the inductor 112 are preferably the terminating trace(s) 110.
  • the ending parts of the inductor 112 are the terminating traces 110a, 110h.
  • the terminating trace 110a is electrically connected to the trace 108a via the bonding element 114a, while the terminating trace 11 Oh is electrically connected to the trace 108h via another bonding element 114i.
  • the at least one bonding element 114 of each inductor segment may include at least one bonding wire and/or at least one bonding ribbon.
  • the bonding elements 114 are made of an electrically conductive material, such as copper, plated copper, gold, silver, aluminium alloy, or other metals or metal alloys.
  • the bonding elements 114 may include multiple bonding wires I ribbons arranged in parallel to decrease conduction losses and to attain higher current capabilities. For example as shown in FIG. 2, two bonding wires 114 are used in parallel for coupling the traces 110 in pairs, but one bonding wire 114 would be feasible too.
  • the contact points for the bonding elements 114 are preferably at the terminating parts of the traces 110 to maximize the overall size of the inductor 112 and to minimize stray inductance. There would be more stray inductance if the contact points were not at or near the terminating parts of the traces 110. However, it will be appreciated that the contact points may be located elsewhere on the traces 110, especially in cases where the terminating parts of the traces are inconvenient for the contact points. For example, trace parts 110ai,110a4 of the trace 110a are used for the contact points for the bonding elements 114 to couple with the lead 106a and the trace 110b, respectively. By incorporating the bonding elements 114, traces 110 that are otherwise isolated by the tie bars 104 or other traces 108, 110 are now electrically coupled to form the coiled inductor 112.
  • the first and second turns of the coiled inductor 112 run anticlockwise around the die paddle region 102.
  • the first turn which is the inner turn nearer to the die paddle region 102, runs through the traces 110a-110d and bonding elements 114a-114d.
  • the second turn which is the outer turn further from the die paddle region 102, runs through the traces 110e-110h and bonding elements 114e-114i.
  • the bonding element 114e of the respective inductor segment in the second turn is electrically connected to the trace 110d of the preceding inductor segment which is in the first turn.
  • the terminating traces 110a, 110h and the bonding elements 114a, 114i form the respective ending parts of the inductor 112.
  • the turns of the inductor 112 may alternatively run clockwise, or in a combination of clockwise and anticlockwise directions.
  • the coiled inductor 112 can be constructed using other number of turns, or at least half a turn.
  • the inductor segments of the inductor 112 in the embodiment shown in FIG. 2 are arranged in an octagonal geometric shape. It will be appreciated that the inductor segments may be arranged in other geometric shapes, such as hexagonal, square, rectangular, triangular, etc.
  • the performance of the inductor 112 may be controlled by the size, geometric shape, number of turns, as well as physical properties of the traces 110 and the bonding elements 114.
  • the traces 110 are arranged in the areas of the lead frame 100 between the leads 106 and the die paddle region 102 in such manner to maximize area utilization and to allow the construction of a large coiled inductor 112 around the periphery of die paddle region 102.
  • the large coiled inductor 112 is able to achieve high inductance.
  • integrating the inductor 112 with the lead frame 100 in this manner allows the system to have an overall compact size.
  • the die paddle region 102 and the inductor 112 may be substantially coplanar. This allows the system to have a thinner profile.
  • the die paddle region 102 may be formed on top of the inductor 112, though this would result in a thicker system.
  • the traces 110 may include multiple smaller parts, such as the trace parts 110ai-5.
  • the smaller trace parts allow circumnavigation of the leads 106 strategically without obstructing the traces 108 so that the traces 108 do not extend out from the sides of the lead frame 100.
  • the smaller trace parts also extend the length of each trace 110, which improves the inductance of the inductor 112. Both compact size of the system and high inductance of the inductor 112 are typically desirable for power management and wireless communication systems in many loT devices and other portable or miniature applications.
  • At least one device 118 is mounted on the at least one die paddle of the die paddle region 102.
  • the device 118 such as a semiconductor IC die, includes at least one bonding terminal or pad 122.
  • the number of bonding terminals of the device 118 shown in FIG. 3A is provided merely for illustrative purposes of the device 118.
  • the device 118 such as an antenna in a wireless communication system, may comprise only a single bonding terminal.
  • the inductor 112 is directly or indirectly electrically connected to the bonding terminals 122.
  • the bonding elements 114 electrically connect the traces 110 of the inductor 112, as well as the bonding terminals 122 of the device 118, to the leads 106 in order to make the device 122 operable.
  • the bonding terminal 122a is electrically connected to the trace 108a via the bonding element 114k, and the trace 110a is electrically connected to the trace 108a via the bonding element 114a. Accordingly, the trace 110a is indirectly connected to the bonding terminal 122a via the trace 108a and bonding elements 114a, 114k.
  • the bonding terminal 122b is electrically connected to the trace 108h via the bonding element 114j
  • the trace 110h is electrically connected to the trace 108h via the bonding element 114i.
  • the trace 11 Oh is indirectly connected to the bonding terminal 122b via the trace 108h and bonding elements 114i,114j.
  • the leads 106a,106h are in turn directly connected to the traces 108a,108h, respectively, and the leads 106a, 106h serve as the ending parts of the coiled inductor 112.
  • the other bonding terminals 122 of the device 118 are correspondingly connected by respective bonding elements 114 to the respective leads 106.
  • one or both ending parts of the inductor 112 are preferably the terminating trace(s) 110, which can be connected to any leads 106, traces 108, or bonding terminals 122 via the bonding elements 114.
  • the ending parts of the inductor 112 are the traces 110a, 110h that are coupled to the traces 108a, 108h via the bonding elements 114a, 114i, respectively.
  • the inductor 112 may be designed as an independent inductor for use with components outside the electronic system instead of the device 118.
  • both ending parts of the inductor 112 are directly or indirectly connected to the leads 106.
  • At least one bonding element 114 of the inductor 112 may include at least one bonding wire and/or at least one bonding ribbon.
  • the bonding elements 114 include bonding wires.
  • a pair of bonding wires 114b connect between a pair of traces 110a, 110b.
  • Another embodiment of the inductor 112 is shown in FIG. 4 as an inductor 412. Bonding wires 434 electrically connect the traces 436, which are at or connected to the ending parts of the inductor 412, to the bonding terminals 432.
  • each inductor segment of the inductor 412 includes a trace 410 and a bonding ribbon 424 electrically connecting the trace 410 of the respective inductor segment to a trace 410 of another inductor segment.
  • a single bonding ribbon 424 connect between a pair of traces 410.
  • bonding ribbons 424 have a higher surface-area-to- volume ratio than bonding wires, bonding ribbons 424 can provide high frequency performance advantages that include lower effective resistance and the consequent lower conduction losses for inductor 412.
  • the intertwining of the turns are such that the traces 510 of the inductor segments in the first turn are nearer to the die paddle region than the traces 510 of the inductor segments in the second turn are, and bonding elements 516 of the inductor segments in the first turn are further from the die paddle region than the bonding elements 516 of the inductor segments in the second turn are.
  • a pair of bonding elements 516i connect between a pair of traces 510a, 510b. If the turns were not intertwined, the bonding elements 516i would instead be formed at the location shown with dotted lines 516i’. This would have resulted in undesirable long stubs at the traces 510a, 510b.
  • the traces 510a, 510b can be coupled at their respective terminating parts.
  • the trace 510a and bonding element 516h form a first inductor segment
  • the trace 510b and bonding element 516i form a second inductor segment
  • the bonding element 516i of the second inductor segment is electrically connected to the trace 510a of the first inductor segment.
  • the trace 510c and bonding element 516j form a third inductor segment
  • the bonding element 516j of the third inductor segment is electrically connected to the trace 510b of the second inductor segment.
  • the trace 51 Od and bonding element 516k form a fourth inductor segment, and the bonding element 516k of the fourth inductor segment is electrically connected to the trace 510c of the third inductor segment.
  • the trace 51 Oe and bonding element 5161 form a fifth inductor segment, and the bonding element 5161 of the fifth inductor segment is electrically connected to the trace 51 Od of the fourth inductor segment.
  • the trace 51 Of and bonding element 516m form a sixth inductor segment, and the bonding element 516m of the sixth inductor segment is electrically connected to the trace 51 Oe of the fifth inductor segment.
  • the trace 510g and bonding element 516n form a seventh inductor segment, and the bonding element 516n of the seventh inductor segment is electrically connected to the trace 51 Of of the sixth inductor segment.
  • the trace 51 Oh and bonding element 516o form an eighth inductor segment, and the bonding element 516o of the eighth inductor segment is electrically connected to the trace 510g of the seventh inductor segment.
  • the first turn runs through the traces 510a-510d and bonding elements 516h-516k
  • the second turn runs through the traces 510e-510h and bonding elements 5161-516o, wherein the first and second turns are intertwined with each other.
  • the traces 51 Oa-51 Od are nearer to the die paddle region 102 than the traces 51 Oe-51 Oh, but the bonding elements 516h-516k are further from the die paddle region 102 than the bonding elements 516l-516o.
  • the ending parts of the inductor 512 are the terminating traces 510a, 510h.
  • the terminating trace 510a is electrically connected to a trace 536 via the bonding element 516h, while the terminating trace 51 Oh is electrically connected to another trace 536 via another bonding element 516p.
  • the overall length of the inductor 512 should be maximized and the stray inductance should be minimized. Intertwining the turns of the inductor 512 would move the contact points of the bonding elements 516 closer to the terminating parts of the traces 510, thereby increasing the overall length of the inductor 512.
  • the contact points may be located elsewhere on the traces 510, especially in cases where the terminating parts of the traces are inconvenient for the contact points.
  • FIG. 6 Another embodiment of the inductor 112 is shown in FIG. 6 as an inductor 612.
  • the inductor 612 has a first turn and a second turn, which may be intertwined with each other as shown.
  • Each inductor segment of the inductor 612 includes a trace 610 and at least one bonding element 616 electrically connecting the trace 610 of the respective inductor segment to a trace 610 of another inductor segment.
  • Bonding elements 634 electrically connect some of the traces 610 to the bonding terminals 632 of the device mounted at the die paddle region 602.
  • the traces 610 of the inductor 612 in FIG. 6 are longer than the traces 110 of the inductor 112 in FIG. 2.
  • the leads 606 are arranged around the periphery of the lead frame and are preferably enclosed within the traces 610.
  • the leads 606a- 606f are enclosed within the traces 610a,61 Oe.
  • Longer traces 610 are preferrable because the cross-sectional area of the traces 610 is generally thicker than the bonding elements 616, thereby resulting in lower conduction losses. Therefore, the combination of longer traces 610 and shorter bonding elements 616 may decrease the conduction losses of the inductor 612.
  • FIG. 7 Another embodiment of the inductor 112 is shown in FIG. 7 as an inductor 712.
  • the inductor 712 has a first turn and a second turn, which may be intertwined with each other as shown.
  • Each inductor segment of the inductor 712 includes a trace 710 and at least one bonding element 716 electrically connecting the trace 710 of the respective inductor segment to a trace 710 of another inductor segment.
  • Bonding elements 734 electrically connect some of the traces 710 to the bonding terminals 732 of the device mounted at the die paddle region 702.
  • the traces 710a, 71 Oh which are at or connected to the terminating parts of the inductor 712, are connected to the respective bonding terminals 732 by respective bonding wires 734.
  • the leads 706 of the inductor 712 in FIG. 7 are longer than the leads 106 of the inductor 112 in FIG. 2. This decreases the distance between the leads 706 and the die paddle region 702, thereby shortening the bonding elements 734 used for coupling the leads 706 to the bonding terminals 732 of the device mounted at the die paddle region 702. The shorter bonding elements 734 would result in better electrical performance.
  • the traces 710 are arranged on both sides of each set of leads 706 and the traces 710 are coupled by bonding elements 716. While more leads 706 may be arranged between the traces 710, longer bonding elements 716 would be needed to connect the traces 710 across the leads 706. This could lead to reliability problems such as wire sweep and wire sag. To shorten the required length of the bonding elements 716, stubs may be placed in between the leads 706 so that the bonding elements 716 can be connected first to these stubs before continuing to the next stubs or traces 710.
  • FIG. 8 Another embodiment of the inductor 112 is shown in FIG. 8 as an inductor 812.
  • the inductor 812 has a first turn and a second turn.
  • Each inductor segment of the inductor 812 includes a trace 810,820,824 and at least one bonding element 816 electrically connecting the trace 810,820,824 of the respective inductor segment to a trace 810,820,824 of another inductor segment.
  • Bonding elements 834 electrically connect the traces 824a, 824b, which are at or connected to the terminating parts of the inductor 812, to the bonding terminals 832.
  • the inductor segments of the inductor 812 in FIG. 8 are arranged in hexagonal geometric shape, as opposed to the octagonal geometric shape of the inductor 112 in FIG. 2.
  • the traces 820,824 on two opposing sides of the lead frame have a Y-shaped form and the leads 808 are arranged in the areas around the traces 820,824.
  • the leads 806 are enclosed within the traces 810 on the other two opposing sides of the lead frame.
  • the first or outer turn starts from the trace 824a and runs through the traces 810,824 and the bonding elements 816.
  • the second or inner turn runs through the traces 820,810 and the bonding elements 816 and ends at the trace 824b.
  • each inductor segment of the inductor 912 includes a trace 904 and at least one bonding element 906 electrically connecting the trace 904 of the respective inductor segment to a trace 904 of another inductor segment.
  • Bonding elements 934 electrically connect some of the traces 902 to the bonding terminals 932 of the device mounted at the die paddle region 901.
  • the trace parts 902 denote the terminating parts of the inductor 912 and are connected to the respective bonding terminals 932 by respective bonding wires 934.
  • the inductor segments of the inductor 912 in FIG. 9 are arranged in square or rectangular geometric shape, as opposed to the octagonal geometric shape of the inductor 112 in FIG. 2. Further, in the inductor 112, the inductor segments of the inductor 912 form a first turn and a second turn around the die paddle region 102, wherein the second turn is further from the die paddle region 102 than the first turn is. In the inductor 912, the inductor segments further form a third turn around the die paddle region 901 , wherein the third turn is further from the die paddle region 901 than the second turn is. Although the third turn is the outermost turn of the inductor 912, it will be appreciated that the first turn may instead be the outermost turn.
  • the inductor 112 in FIG. 2 includes a series of plural inductor segments that collectively form the turning profile.
  • the inductor 1012 in FIG. 10 includes a series that consists of a sole or single inductor segment that turns around the die paddle region 1010. Notably, the inductor segment forms a single turn around the die paddle 1010, on which a plurality of devices 1020 are mounted.
  • the sole inductor segment of the inductor 1012 includes a trace 1022 and at least one bonding element 1034 electrically connecting the trace 1022 to the bonding terminals 1032 of one or more devices mounted to the die paddles 1020.
  • the trace parts 1036 denote the terminating parts of the inductor 1012 and are connected to the respective bonding terminals 1032 by respective bonding wires 1034.
  • the trace 1022 is preferably a continuous strip along the periphery of the lead frame. A long continuous strip of a trace 1022 is advantageous as it results in lower effective resistance, thereby improving the quality factor of the inductor 1012.
  • FIG. 11 A Another embodiment of the inductor 112 is shown in FIG. 11 A.
  • the system includes one coiled inductor 112.
  • the system includes two coupled coiled inductors 1112,1122, as demarcated by the dotted and dashed lines, respectively. It will be appreciated that this number of inductors 1112,1122 is merely exemplary and the electronic system may have any number of inductors.
  • the die paddle region includes two die paddles 1110,1120.
  • the die paddles 1110,1120 are arranged for mounting separate devices, such as two different semiconductor IC dies. By having multiple die paddles 1110, 1120, the devices mounted on both die paddles 1110,1120 can be electrically isolated from each other. It will be appreciated that this number of die paddles 1110,1120 is merely exemplary and the electronic system may have any number of die paddles.
  • the first inductor 1112 is formed on an inner area of the lead frame around the die paddle region, and the second inductor 1122 is formed on an outer area of the lead frame around the inner area.
  • the first or inner inductor 1112 is nearer to the die paddles 1110, 1120, and the second or outer inductor 1122 is further from the die paddles 1110,1120.
  • the first inductor 1112 may instead be further from the die paddle region and the second inductor 1122 may instead be nearer to the die paddle region.
  • Each inductor segment of the inner inductor 1112 includes a trace 1114 and at least one bonding element 1116 electrically connecting the trace 1114 of the respective inductor segment to a trace 1114 of another inductor segment.
  • the traces 1114a,1114b denote the terminating parts of the inner inductor 1112 and are connected to the respective bonding terminals 1132 of the device mounted to the die paddle 1110 by respective bonding wires 1136.
  • Each inductor segment of the outer inductor 1122 includes a trace 1124 and at least one bonding element 1126 electrically connecting the trace 1124 of the respective inductor segment to a trace 1124 of another inductor segment.
  • the traces 1124a, 1124b denote the terminating parts of the outer inductor 1122 and are connected to the respective bonding terminals 1142 of the device mounted to the die paddle 1120 by respective bonding wires 1146.
  • Both inductors 1112,1122 are electrically isolated from each other because of the separate die paddles 1110,1120. Further, both inductors 1112,1122 are proximate to each other, and preferably arranged parallel to each other, to enhance mutual coupling or mutual inductance between the inductors 1112,1122. An illustration of this mutual coupling M is shown in FIG. 11 B.
  • FIG. 11A and FIG. 11 B Another embodiment of the inductors 1112,1122 in FIG. 11A and FIG. 11 B is shown as an inductor 1212 in FIG. 12A and FIG. 12B.
  • the inductors 1112,1122 are electrically connected to form a single inductor 1212 as shown in FIG. 12A and FIG. 12B.
  • the turning profile of the inductor 1212 has two turns - an inner turn from the original inner inductor 1112 and an outer turn from the original outer inductor 1122. Further, the inductor 1212 is formed around the die paddle region having two die paddles 1210,1220.
  • Each inductor segment of the inductor 1212 includes a trace 1214 and at least one bonding element 1216 electrically connecting the trace 1214 of the respective inductor segment to a trace 1214 of another inductor segment.
  • the traces 1214a, 1214b denote the terminating parts of the inner turn of the inductor 1212 and are connected to the respective bonding terminals 1232 of the device mounted to the die paddle 1210 by respective bonding wires 1236.
  • the traces 1214b, 1214c denote the terminating parts of the outer turn of the inductor 1212 and are connected to the respective bonding terminals 1242 of the device mounted to the die paddle 1220 by respective bonding wires 1246.
  • the inner and outer turns of the inductor 1212 thus share the terminating trace 1214b.
  • the terminating trace 1214b is formed by amalgamating the terminating trace 1114b of the first inductor 1122 (which forms the inner turn of the inductor 1212) and the terminating trace 1124a of the second inductor 1122 (which forms the outer turn of the inductor 1212).
  • the inductors 1112,1122 thus share the terminating trace 1214b such that the inductors 1112,1122 are electrically connected to each other via the terminating trace 1214b.
  • the location of the shared terminating trace 1214b allows it to serve as a centre tap so that the electronic system may be used for systems requiring inductors with multiple terminals, such as a Hartley oscillator or autotransformer. It will be appreciated that the tap may be relocated to other parts of the inductor 1212 instead of at or near the centre.
  • the inductor 1212 may also be formed from any number of smaller inductors of various sizes, and may be configured with any number of taps at various locations of the inductor 1212.
  • the inductors 1112,1122 may be intertwined with each other.
  • the first and second inductors 1112,1122 may share a bonding terminal 1132 of the device such that both inductors 1112,1122 are electrically connected to each other via the shared bonding terminal 1132.
  • the electronic system is a semiconductor package 1360 that includes a lead frame 1300 having a die paddle region 1302 with a die paddle.
  • a device such as a semiconductor IC die is mounted at the die paddle region 1302.
  • the semiconductor package 1360 further includes a coiled inductor 1312 similar to the coiled inductor 112 in FIG. 2.
  • Each inductor segment of the inductor 1312 includes a trace 1310 and at least one bonding element 1316 electrically connecting the trace 1310 of the respective inductor segment to a trace 1310 of another inductor segment.
  • the semiconductor package 1360 further includes leads 1306 arranged around the periphery of the lead frame 1300 and exposed on the sides of the semiconductor package 1360.
  • the semiconductor package 1360 further includes a package body 1362 that encapsulates the inductor 1312 and the device mounted at the die paddle region 1302.
  • the package body 1362 is made from an electrically insulating material, such as epoxy and ceramic.
  • the inductor 1312 and device may be overmoulded with the electrically insulating material.
  • the semiconductor package 1360 may be of various semiconductor types that may be hermetically sealed or non-hermetically sealed.
  • the semiconductor package 1360 is a Quad-Flat No-Lead (QFN) package type with the package body 1362 formed using an epoxy moulding compound.
  • QFN Quad-Flat No-Lead
  • semiconductor packages such as the semiconductor package 1360 may be manufactured according to known techniques to integrate lead frame 1300 and various other components or devices such as semiconductor IC dies.
  • the lead frame 1300 and the integrated components on the lead frame 1300, including the inductor 1312 and device, are encapsulated within the package body 1362.
  • the semiconductor package 1360 may include one or more inductors and one or more devices, such that they are all encapsulated within the package body 1362.
  • at least a portion of the leads 1306 are encapsulated, wherein at least the contact area of one or more of the leads 1306 are exposed to form electrical contacts.
  • the leads 1306 are exposed at the sides and bottom surface of the semiconductor package 1360 to facilitate electrical contacts or connections with traces or pads of a substrate, such as a PCB.
  • the die paddle in the die paddle region 1302 is also exposed at the bottom surface of the semiconductor package 1360.
  • the traces 1310 of the inductor 1312 may be partially etched at the bottom surface to encapsulate the traces 1310 within the package body 1362, thereby preventing any exposure at the bottom of the semiconductor package 1360 that would otherwise contact with traces or pads of a substrate or PCB.
  • the leads 1306 and die paddle region 1302 may be trimmed along the sides of the package body 1362, such that the leads 1306 and die paddle region 1302 are substantially coplanar along the sides of the package body 1362. Alternatively or additionally, portions of the lead frame 1300 may extend outside the package body 1362.
  • coiled inductors having the turning profiles including the inductors 112,412,512,612,712,812,912,1012,1112,1122,1212,1312 are described above. It will be appreciated that various aspects of the inductors 112,412,512,612,712,812,912,1012,1112,1122,1212,1312 may apply equally to each other and are not further elaborated for purpose of brevity.
  • Various embodiments of the present disclosure also describe a method for producing an electronic system, such as the semiconductor package 1360.
  • the method includes a step of forming a lead frame comprising a die paddle region having a first side, a second side adjacent to the first side, and at least one die paddle bounded by the first and second sides for mounting at least one device thereon, each device comprising at least one bonding terminal.
  • the method includes a step of forming at least one inductor on areas of the lead frame around the die paddle region, each inductor electrically connectable to the at least one bonding terminal.
  • Forming each inductor includes a step of forming at least one inductor segment, each inductor segment comprising a trace and at least one bonding element electrically connecting the trace to the at least one bonding terminal or to a trace of another inductor segment.
  • Forming each inductor further includes a step of arranging the at least one inductor segment in series, such that the series of at least one inductor segment turns at least partially around the die paddle region and is adjacent to at least part of the first side and at least part of the second side of the die paddle region.
  • the series of at least one inductor segment makes half a turn, one turn, two turn, or three turns around the die paddle region.
  • the method for producing the electronic system may further include steps of mounting the at least one device on the at least one die paddle, and electrically connecting each inductor to the bonding terminals of the at least one device.
  • the method may include steps of forming at least one lead on the lead frame, and electrically connecting the at least one lead to the at least one inductor.
  • the method may include steps of forming a first inductor on an inner area of the lead frame around the die paddle region, forming a second inductor on an outer area of the lead frame around the inner area, electrically isolating the first and second inductors from each other and arranging them, and arranging the first and second inductors to be proximate to each other to enhance mutual coupling between them.
  • the electronic system may be a semiconductor package and the method may include a step of forming a package body encapsulating the at least one inductor and the at least one device, the encapsulation layer comprising an electrically insulating material.
  • the coiled inductor is able to achieve efficient area utilization of the lead frame, resulting in a thinner and smaller form factor.
  • the inductor is also able to achieve better electrical performance, including high quality factor, high inductance, and/or low losses, which together with the compact size of the electronic system, would be desirable for various applications, such as semiconductor applications as well as power management and wireless communication systems in many loT devices and other portable or miniature applications.
  • the performance of the inductor may be controlled by the size, geometric shape, number of turns, as well as physical properties of the traces and the bonding elements.
  • the inductance can be customized accurately to the desired specifications of the application by configuring the utilization of the space within the electronic system.
  • the various embodiments of the present disclosure may also be directed to electronic systems such as but not limited to power management and wireless communication systems.
  • the electronic system may be a semiconductor package described in various embodiments herein.
  • the coiled inductor can be manufactured and integrated readily within the electronic system or semiconductor package together with other components including the lead frame, bonding elements, and devices such as semiconductor IC dies.
  • This integration reduces the number of components and devices to form the electronic system or the semiconductor package, and provides one or more advantages including a simpler design process, reduced manufacturing and assembly complexity and costs, smaller footprint on a substrate or PCB area, and a more compact overall size.
  • the overall functionality and performance of the devices integrated with the inductor within the electronic system or the semiconductor package are also enhanced.
  • the electronic system or the semiconductor package incorporating one or more coiled inductors may be used for various applications, including but not limited to, power converters with integrated inductors, smart batteries with integrated chokes, and RF (radio frequency) circuits with integrated baluns.
  • one or more coiled inductors may be used to form a transformer.
  • one or more coiled inductors may be formed on a substrate or PCB, wherein the traces of the inductor may be formed using microstrips on the substrate or PCB.
  • the inductor may be coupled to other components or devices attached on the substrate or PCB.
  • the electronic system integrated with the coiled inductor is able to achieve higher performance, smaller form factor, and lower cost due to lower manufacturing complexity, making the electronic system suitable for various portable or miniature applications such as in loT devices.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

La présente invention concerne de manière générale un système électronique et un procédé de production de celui-ci. Le système comprend : une grille de connexion (100) comprenant un premier côté, un deuxième côté adjacent, et une région de plaquette de puce (102) destinée au montage d'au moins un dispositif (118) sur celle-ci, chaque dispositif (118) comprenant au moins une borne de liaison (122) ; et au moins une bobine d'induction (112) formée sur la grille de connexion (100) autour de la région de plaquette à puce (102). Chaque bobine d'induction (112) comprend : une série d'au moins un segment de bobine d'induction, chaque segment de bobine d'induction comprenant une trace (110) et au moins un élément de liaison (114) qui relie électriquement la trace (110) à ladite borne de liaison (122) ou à une trace (110) d'un autre segment de bobine d'induction. La série d'au moins un segment de bobine d'induction tourne collectivement au moins partiellement autour de la région de plaquette à puce (102) et est adjacente à au moins une partie du premier côté et au moins une partie du deuxième côté de la région de plaquette à puce (102).
PCT/SG2024/050250 2023-04-17 2024-04-17 Système électronique et procédé de production de celui-ci Pending WO2024220034A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104372A (ja) * 1992-09-22 1994-04-15 Matsushita Electric Ind Co Ltd 半導体装置
US20030160306A1 (en) * 2002-02-25 2003-08-28 Gibson Joel Robert Leadframe inductors
US20100127361A1 (en) * 2008-11-21 2010-05-27 Heap Hoe Kuan Encapsulant interposer system with integrated passive devices and manufacturing method therefor

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104372A (ja) * 1992-09-22 1994-04-15 Matsushita Electric Ind Co Ltd 半導体装置
US20030160306A1 (en) * 2002-02-25 2003-08-28 Gibson Joel Robert Leadframe inductors
US20100127361A1 (en) * 2008-11-21 2010-05-27 Heap Hoe Kuan Encapsulant interposer system with integrated passive devices and manufacturing method therefor

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