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WO2024218721A3 - Laser alignment and supporting fixture - Google Patents

Laser alignment and supporting fixture

Info

Publication number
WO2024218721A3
WO2024218721A3 PCT/IB2024/053813 IB2024053813W WO2024218721A3 WO 2024218721 A3 WO2024218721 A3 WO 2024218721A3 IB 2024053813 W IB2024053813 W IB 2024053813W WO 2024218721 A3 WO2024218721 A3 WO 2024218721A3
Authority
WO
WIPO (PCT)
Prior art keywords
pic
dfl
trench
adaptor
laser alignment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/IB2024/053813
Other languages
French (fr)
Other versions
WO2024218721A2 (en
Inventor
Jonathan ANKRI
Arie FAITELSON
Shmuel BORENSTAIN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dustphotonics
Original Assignee
Dustphotonics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dustphotonics filed Critical Dustphotonics
Publication of WO2024218721A2 publication Critical patent/WO2024218721A2/en
Publication of WO2024218721A3 publication Critical patent/WO2024218721A3/en
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Wire Bonding (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A device, that includes (a) a distributed feedback laser (DFL), (b) a photonics integrated circuit (PIC) that includes a PIC trench, the DFL is positioned within the PIC trench, (c) a PIC trench contact formed within the PIC trench, (d) an adaptor, wherein the adaptor is attached to a region of the PIC and to the DFL using one or more bonding elements, and (e) one or more traps for receiving excess bonding material formed during an attaching of the adaptor to at least one of the DFL and the region of the PIC, and to prevent the excess bonding material from electrically coupling the DFL distal contact to the DFL proximal contact.
PCT/IB2024/053813 2023-04-19 2024-04-19 Laser alignment and supporting fixture Pending WO2024218721A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202363497123P 2023-04-19 2023-04-19
US63/497,123 2023-04-19

Publications (2)

Publication Number Publication Date
WO2024218721A2 WO2024218721A2 (en) 2024-10-24
WO2024218721A3 true WO2024218721A3 (en) 2025-07-24

Family

ID=93153402

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2024/053813 Pending WO2024218721A2 (en) 2023-04-19 2024-04-19 Laser alignment and supporting fixture

Country Status (1)

Country Link
WO (1) WO2024218721A2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040218850A1 (en) * 2002-08-12 2004-11-04 Infinera Corporation Electrical isolation of optical components in photonic integrated circuits (PICs)
US20170237229A1 (en) * 2016-02-12 2017-08-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Photonic transmitter
US20180342851A1 (en) * 2016-02-19 2018-11-29 Macom Technology Solutions Holdings, Inc. Techniques for laser alignment in photonic integrated circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040218850A1 (en) * 2002-08-12 2004-11-04 Infinera Corporation Electrical isolation of optical components in photonic integrated circuits (PICs)
US20170237229A1 (en) * 2016-02-12 2017-08-17 Commissariat A L'energie Atomique Et Aux Energies Alternatives Photonic transmitter
US20180342851A1 (en) * 2016-02-19 2018-11-29 Macom Technology Solutions Holdings, Inc. Techniques for laser alignment in photonic integrated circuits

Also Published As

Publication number Publication date
WO2024218721A2 (en) 2024-10-24

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