[go: up one dir, main page]

WO2024210775A1 - Dissipateur thermique - Google Patents

Dissipateur thermique Download PDF

Info

Publication number
WO2024210775A1
WO2024210775A1 PCT/SE2023/050296 SE2023050296W WO2024210775A1 WO 2024210775 A1 WO2024210775 A1 WO 2024210775A1 SE 2023050296 W SE2023050296 W SE 2023050296W WO 2024210775 A1 WO2024210775 A1 WO 2024210775A1
Authority
WO
WIPO (PCT)
Prior art keywords
fins
heat sink
heat
transfer type
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/SE2023/050296
Other languages
English (en)
Inventor
Yigit Akkus
Stevin VAN WYK
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Priority to CN202380094945.1A priority Critical patent/CN120693977A/zh
Priority to PCT/SE2023/050296 priority patent/WO2024210775A1/fr
Publication of WO2024210775A1 publication Critical patent/WO2024210775A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Definitions

  • Embodiments of the present disclosure relate to heat sinks, and particularly to heat sinks comprising one or more first fins comprising a first heat transfer type and one or more second fins comprising a second heat transfer type.
  • Two-phase passive heat spreading techniques attract the attention of thermal scientists in academia and researchers in industry because of their potential in thermal management.
  • the term “two-phase” refers to the existence of both liquid and vapor phases of a working fluid.
  • the term “passive heat spreading” refers to the fact that there is no external energy is used to drive the cooling system, meaning no fans or pumps are used to circulate the working fluid.
  • concurrent evaporation and condensation can take place near regions where heat is added to and removed from the system, respectively. These regions may be referred to as “evaporator” and “condenser”, respectively.
  • the fluid transfer between the evaporator and condenser may be driven by one or a combination of the following physical phenomena: gravity, buoyancy, diffusion, capillarity, fluid instability, liquid-vapor phase change dynamics.
  • thermosiphons also referred to as “thermosyphons”
  • natural convection which involves gravity and buoyancy accompanied by the liquid-vapor phase change dynamics
  • LTS loop thermosiphons
  • Another technique is the use of a heat pipe, as named by its inventor Grover (US3229759A), which utilizes capillarity as the origin of a major driving force to circulate the fluid.
  • Different heat pipe applications have been proposed over the years such as vapor chambers, variable conductance heat pipes, and pulsating heat pipes (PHP)/oscillating heat pipes etc. (Reay et al., Heat pipes: theory, design and applications, Butterworth-Heinemann, ISBN 0080982794, 9780080982793, 2013).
  • the loop thermosiphon 100 comprises a looped conduit 102, an evaporator 104, and a condenser 106.
  • the looped conduit 102 is partly filled with a working fluid.
  • the working fluid evaporates into a vapour 110.
  • the expanding vapor phase pushes batches of the working fluid towards a condenser 106.
  • This mechanism may be referred to as the “bubble lift” principle.
  • the condenser 106 the vapor 110 condenses into a liquid 108, and the conduit is filled by a liquid phase that is driven to return to the evaporator 104 by gravitational force.
  • pulsating heat pipes do not use a wick structure to circulate a working fluid.
  • An example pulsating heat pipe 200 design is illustrated in Fig. 2.
  • the pulsating heat pipe 200 comprises a serpentine channel 202 of capillary dimension, evaporation regions 204, and condensation regions 206.
  • the serpentine channel 202 is evacuated and partially filled with a working fluid (Reay et al., Heat pipes: theory, design and applications, Butterworth-Heinemann, ISBN 0080982794, 9780080982793, 2013).
  • Surface tension results in the formation of slugs of liquid 208 located between bubbles of vapor 210.
  • This mechanism is first described by Akachi in 1990 (US4921041A).
  • the efficiency of a pulsating heat pipe 200 at transferring energy from the evaporation regions 204 to the condensation regions 206 is determined, in part, by the number of turns of the serpentine channel 202.
  • Both loop thermosiphons and pulsating heat pipes can be embedded in flat plates (CN 106455431 A, KR20130111035A). These may be referred to as LTS-embedded fins and PHP-embedded fins, respectively. Doing so can produce fins with higher efficiency compared to solid fins made of typical engineering metals. Fins can be attached to a base metal with different methods (welding, brazing, press fitting etc.) to create a heat sink, such as a straight-fin heat sink or a V-fin heat sink.
  • Fig. 3 illustrates a straight-fin heat sink 300 design.
  • the straight-fin heat sink 300 comprises a base 302 and an array of fins 304 which are disposed on the base 302 and positioned parallel to a direction of gravitational force exerted on components of the straight-fin heat sink 300 (sometimes referred to as a “gravity vector”), g. If thermosiphons (e.g., the looped thermosiphon 100 of Fig.1 ) are embedded within these fins, the maximum driving force exerted on the working fluid (also referred to as the “gravitational head”, H g ) is proportional to the distance between the lowermost and uppermost levels of the fins.
  • H g the maximum driving force exerted on the working fluid
  • Fig.4 illustrates a V-fin heat sink design 400.
  • the V-fin heat sink 400 comprises a base 402 and two symmetrical tilted fin arrays 404, 406, wherein each fin of the two symmetrical fin arrays 404, 406 is tilted with respect to a gravity vector, g.
  • the two symmetrical fin arrays 404, 406 are separated by a mid-channel (e.g., an air channel). If thermosiphons are embedded within these fins (e.g., looped thermosiphons 100 of Fig. 1), the maximum driving force/gravitational head that could be generated is proportional to the distance between the lowermost and uppermost levels of the fins.
  • Heat-generating components used in M-MIMO systems can reach undesirable temperatures if not actively cooled, reducing their performance and/or life expectancy.
  • One such method of cooling is disposing heat sinks, such as those illustrated in Figs. 3 and 4, on a surface of the heat-generating component, such that heat energy is removed from the heat-generating component and transferred to the surrounding air via the heat sink. Improving the heat-transfer performance of heat sinks can therefore further improve the performance and/or life expectancy of heatgenerating components.
  • Embodiments of the present disclosure relate to heat sinks comprising a combination of heat transfer types/technologies such that they have enhanced performance (e.g., efficiency) for a given set of properties of (e.g., fin material, fin geometry, fin orientation with respect to a gravity vector, etc).
  • enhanced performance e.g., efficiency
  • properties of e.g., fin material, fin geometry, fin orientation with respect to a gravity vector, etc.
  • a heat sink comprises: a substantially planar base; and a first set of fins disposed on a first side of the base. Each fin has a length parallel to a plane of the base.
  • One or more first fins of the first set of fins comprise a first heat transfer type and one or more second fins of the first set of fins comprise a second heat transfer type different to the first heat transfer type.
  • the length of the one or more first fins is longer than the length of the one or more second fins.
  • a device comprises a processing apparatus and one or more heat sinks according to the first aspect of the present disclosure.
  • the one or more heat sinks interface with one or more components of the processing apparatus.
  • Embodiments of the present disclosure describe a heat sink which can efficiently transfer heat energy away from a heat-generating component with which it may interface, thus enabling the efficient cooling of the heat-generating component. Therefore, embodiments of the present disclosure enable improved thermal management of heatgenerating components (e.g., M-MIMO products) without the use of active cooling methods such as fan cooling.
  • heatgenerating components e.g., M-MIMO products
  • Figure 1 is a schematic diagram illustrating a loop thermosiphon
  • Figure 2 is a schematic diagram illustrating a pulsating heat pipe
  • Figure 3 is a schematic diagram illustrating a straight fin heat sink
  • Figure 5 is a schematic diagram illustrating a first heat sink design in accordance with some embodiments.
  • Figure 6 is a schematic diagram illustrating a second heat sink design in accordance with some embodiments
  • Figure 7 is a schematic diagram illustrating a device in accordance with some embodiments.
  • thermosiphons As the operation of a thermosiphon is dependent upon gravity, the efficiency of thermosiphons is dependent upon the positioning of the thermosiphons with respect to a gravity vector.
  • straight fin heat sink designs can be more suited to accommodating thermosiphon-embedded fins compared to V-fin heat sink designs, as straight fin heat sinks can have a higher gravitational head per fin for a given fin dimension
  • straight fin heat sinks can suffer from reduced heat removal efficiency at the uppermost levels of the fins. This is because air at the lowermost levels of the fins may be heated by the fins themselves. This heated air can rise to the uppermost levels of the fins where it transfers heat energy to the condensing regions of the fins, reducing the heat removal efficiency of these regions.
  • V-fin heat sink in comparison to the straight fin heat sink, air can circulate easily through the V- fin heat sink, providing a cooling effect.
  • using a V-fin heat sink design rather than a straight fin heat sink design results in lower temperatures of components located at the uppermost levels of the heat sink.
  • heat pipes can operate without the assistance of gravity (and can even operate against gravity).
  • PHP-embedded fins are suitable to be used in both straight-fin heat sink and V-fin heat sink designs.
  • thermosiphons Mantelli, Thermosyphons and heat pipes: theory and applications, Springer International Publishing, 2021
  • LTS- embedded fins are more efficient at transferring heat away form a base of a heat sink than PHP-embedded fins (even when the loop thermosiphons use a smaller number of loops/turns than the pulsating heat pipes).
  • LTS-embedded fins are less efficient at transferring heat away form a base of a heat sink than PHP-embedded fins.
  • Embodiments of the present disclosure utilize multiple two-phase heat spreading techniques simultaneously to create a hybrid heat sink design that has improved heat transfer performance compared to heat sinks that adopt a single two-phase heat spreading technique.
  • embodiments of the present disclosure may be used as part of a hybrid V-fin heat sink design, wherein each fin of the heat sink comprises one of three forms of flat plate structure (e.g., a plain solid fin, a PHP-embedded fin, or an LTS-embedded fin).
  • Fig. 5 illustrates a first heat sink design 500 according to embodiments of the present disclosure.
  • the heat sink may be a component of a M-MIMO system, a remote radio system, and/or any type of mast-mounted radio system.
  • the heat sink comprises a substantially planar base 502.
  • the base 502 may be made from a first thermally conductive material which is efficient at absorbing heat energy, such as a metal (e.g., aluminium, copper, etc).
  • the heat sink also comprises a first set of fins 504 disposed on a first side of the base 502.
  • a second side of the base (opposite the first side of the base) may be adapted to interface with a surface of a heat-generating component, such that heat energy may be transferred from the heat-generating component to the heat sink.
  • Each fin (of the first set of fins 504) has a length parallel to a plane of the base 502.
  • each fin may be considered to have a height perpendicular to the plane of the base and a thickness perpendicular to its height and perpendicular to its length.
  • the first set of fins 504 may be arranged such that they do not intersect one another (e.g., they may be substantially parallel to one another).
  • the first set of fins 504 may be substantially planar (e.g., each fin may be a plate which is substantially rectangular in shape). As such, in some embodiments, the length of each fin of the first set of fins 504 may parallel to both a plane of the base and a plane of the fin.
  • One or more first fins 506 of the first set of fins 504 comprise a first heat transfer type and one or more second fins 508 of the first set of fins comprise a second heat transfer type different to the first heat transfer type.
  • the length of the one or more first fins 506 is longer than the length of the one or more second fins 508. As such, the one or more first fins 506 are able to have a greater gravitational head per fin in comparison to the one or more second fins 508 when the heat sink is in use.
  • a heat transfer type may also be referred to as a heat transfer technology, and can be considered to describe the principal mechanism/technology by which heat energy is transferred through/across a fin comprising that heat transfer type.
  • the principal mechanism may utilise heat convection and/or heat conduction for transferring energy through/across the fin.
  • the first heat transfer type may comprise a loop thermosiphon and the second heat transfer type may comprise a solid plate (which may also be referred to as a “solid fin” or a “solid metal plate” in some examples).
  • the solid plate may be made of a second thermally conductive material which is efficient at absorbing heat energy, such as a metal (e.g., aluminium, copper, etc).
  • a metal e.g., aluminium, copper, etc.
  • the first thermally conductive material and the second thermally conductive material may be the same material (e.g., the base and the solid plates may be produced as a single part via die casting and/or machining).
  • the first thermally conductive material and the second thermally conductive material may be different materials.
  • the second thermally conductive material may have a higher thermal conductivity than the first thermally conductive material (e.g., the first thermally conductive material may be aluminium and the second thermally conductive material may be copper).
  • the shorter fins disposed on the base 502 of the heat sink may be solid plates as their gravitational head is too small for them to be efficient LTS-embedded fins. Similarly, their lengths are too short for them to accommodate an adequate number of PHP-channel turns for them to be efficient PHP- embedded fins.
  • longer fins disposed on the base 502 may be LTS- embedded fins since their gravitational head is sufficient for them to function efficiently as LTS-embedded fins and their predicted performance at transferring heat energy away from the heat sink base 502 is better in comparison to a PHP-embedded fin or a solid plate.
  • the first heat transfer type may comprise a pulsating heat pipe and the second heat transfer type may comprise a solid plate.
  • shorter fins disposed on the base 502 of the heat sink may be solid plates as their gravitational head is too small for them to be efficient LTS-embedded fins.
  • their lengths are too short for them to accommodate an adequate number of PHP- channel turns for them to be efficient PHP-embedded fins.
  • longer fins disposed on the base 502 may be PHP-embedded fins since their gravitational head is not sufficient for them to function efficiently as LTS-embedded fins and their predicted performance at transferring heat energy away from the heat sink base 502 is better in comparison to an LTS-embedded fin or a solid plate.
  • the first heat transfer type may comprise a loop thermosiphon and the second heat transfer type may comprise a pulsating heat pipe.
  • shorter fins disposed on the base 502 of the heat sink may be PHP- embedded fins as their gravitational head is too small for them to be efficient LTS- embedded fins and their predicted performance at transferring heat energy from the heat sink base 502 is better in comparison to an LTS-embedded fin or a solid plate.
  • longer fins disposed on the base 502 may be LTS-embedded fins since their gravitational head is sufficient for them to function efficiently as LTS-embedded fins and their predicted performance at transferring heat energy away from the heat sink base 502 is better in comparison to a PHP-embedded fin or a solid plates.
  • the one or more third fins 512 of the first set of fins 504 of Fig. 5 may comprise a third heat transfer type. The third heat transfer type is different to the first heat transfer type and the second heat transfer type, and the length of the one or more second fins 508 is longer than the length of the one or more third fins 512.
  • the first heat transfer type may comprise a loop thermosiphon
  • the second heat transfer type may comprise a pulsating heat pipe
  • the third heat transfer type may comprise a solid plate (e.g., the solid plate discussed above in relation to Fig. 5).
  • shorter fins disposed on the base 502 of the heat sink may be solid plates as their gravitational head is too small for them to be efficient LTS-embedded fins and/or their lengths are too short for them to accommodate an adequate number of PHP-channel turns for them to be efficient PHP-embedded fins.
  • longer fins disposed on the base 502 may be PHP-embedded fins since their gravitational head is not sufficient for them to function efficiently as LTS-embedded fins and their predicted performance at transferring heat energy from the heat sink base 502 is better in comparison to an LTS-embedded fin or a solid plate.
  • the longest fins disposed on the base 502 may be LTS-embedded fins since their gravitational head is sufficient for them to function efficiently as LTS-embedded fins and their predicted performance at transferring heat energy away from the heat sink base 502 is better in comparison to a PHP-embedded fin or a solid plate.
  • the first heat sink design 500 may further comprise a second set of fins 510 disposed on the first side of the base 502. A s with the first set of fins 504, each fin of the second set of fins 510 may have a length parallel to a plane of the base 502.
  • each fin of the second set of fins 510 may be considered to have a height perpendicular to the plane of the base and a thickness perpendicular to its height and perpendicular to its length.
  • the second set of fins 510 may be arranged such that they do not intersect one another (e.g., they may be substantially parallel to one another).
  • the second set of fins 510 may be substantially planar (e.g., each fin may be a plate which is substantially rectangular in shape). As such, in some embodiments, the length of each fin of the second set of fins 510 may be parallel to both a plane of the base and a plane of the fin.
  • one or more fourth fins 514 of the second set of fins 510 may comprise the first heat transfer type comprised in the one or more first fins 506, whilst one or more fifth fins 516 of the second set of fins 510 may comprise the second heat transfer type comprised in the one or more second fins 508.
  • the length of the one or more fourth fins 514 is longer than the length of the one or more fifth fins 516.
  • one or more sixth fins 518 of the second set of fins 510 may comprise the third heat transfer type.
  • the length of the one or more fifth fins 516 is longer than the length of the one or more sixth fins 518.
  • the first set of fins 504 and the second set of fins 510 may be arranged such that an air channel is formed between the first set of fins 504 and the second set of fins 510.
  • the first set of fins 504 may be confined to a first substantially rectangular region on the first side of the base 502
  • the second set of fins 510 may be confined to a second substantially rectangular region on the first side of the base 502, such that a gap exists between ends of the first set of fins 504 and ends of the second set of fins 510.
  • This configuration would allow cool air to flow over the base 502 and past the ends of the first set of fins 504 and ends of the second set of fins 510, improving the efficiency at which the fins of the heat may transfer heat energy away from the base 502.
  • the lengths of the first set of fins 504 may be at an angle of 5-85 degrees to a side of the first substantially rectangular region and/or the lengths of the second set of fins 510 may be at an angle of 5-85 degrees to a side of the second substantially rectangular region. In some embodiments, the lengths of the first set of fins are at an angle of 5-85 degrees to the lengths of the second set of fins. Such arrangements may in some examples result in a V-fin heat sink design.
  • the first heat sink design 500 may comprise one or more additional sets of fins corresponding to either one of the first set of fins 504 or the second set of fins 510, such that multiple sets of fins are disposed on the base 502 in a substantially parallel manner with an air channel being formed in between each set.
  • Fig. 6 illustrates a second heat sink design 600 according to embodiments of the present disclosure.
  • the second heat sink design 600 comprises a base 602 and a first set of fins 604 (comprising one or more first fins 606, one or more second fins 608, and one or more third fins 612).
  • the heat sink further comprises a second set of fins 610 (comprising one or more fourth fins, one or more fifth fins, and one or more sixth fins). As these features correspond to those discussed in relation to Fig. 5, a duplicate description of their functionality is omitted.
  • the shortest fins 612 are solid fins and the longest fins 606 comprise loop thermosiphons. Fins which are a length in between that of the shortest and longest fins (“medium length fins”) 608 comprise pulsating heat pipes.
  • the base When either of the first heat sink design 500 or the second heat sink design 600 are in use (i.e., interfacing with a heat-generating component), the base will be substantially parallel to a gravity vector. Therefore, it can be appreciated from Figs. 5 and 6 that the longest fins 506, 606 will have the greatest gravitational head per fin and are therefore suited to being LTS-embedded fins (whose efficiency is dependent upon gravity).
  • the medium length fins 508, 608 will have a smaller gravitational head per fin than the longest fins 506, 606 and are therefore suited to being PHP-embedded fins (whose efficiency is not dependent upon gravity but upon a number of turns in the PHP-channel).
  • the shortest length fins 512, 612 will have a smaller gravitational head than both the longest fins 506, 606 and the medium length fins 508, 608 and are therefore suited to being solid plates (whose efficiency is not dependent upon gravity or a number of turns in a PHP- channel).
  • Fig. 7 illustrates a device 700 according to embodiments of the present disclosure.
  • the device 700 comprises a processing apparatus 702 and one or more heat sinks 704.
  • the one or more heat sinks correspond to the heat sinks of the embodiments of Figs. 5 and 6 discussed above.
  • the one or more heat sinks 704 interface with one or more components 706 (e.g., one or more ASICs) of the processing apparatus 702.
  • the one or more components 706 comprise one or more processors (e.g., a M-MIMO radio transceivers, one or more remote radio transceivers, and/or one or more radio transceivers of a mast-mounted radio system).
  • the one or more heat sinks 704 can transfer heat energy away from the one or more components 706, improving their performance and increasing their operating life expectancy.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dissipateur thermique comprenant une base sensiblement plane et un premier ensemble d'ailettes disposées sur un premier côté de la base. Chaque ailette a une longueur parallèle à un plan de la base. Une ou plusieurs premières ailettes du premier ensemble d'ailettes comprennent un premier type de transfert de chaleur et une ou plusieurs secondes ailettes du premier ensemble d'ailettes comprennent un second type de transfert de chaleur différent du premier type de transfert de chaleur. La longueur de la ou des premières ailettes est plus longue que la longueur de la ou des secondes ailettes.
PCT/SE2023/050296 2023-04-03 2023-04-03 Dissipateur thermique Pending WO2024210775A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202380094945.1A CN120693977A (zh) 2023-04-03 2023-04-03 散热器
PCT/SE2023/050296 WO2024210775A1 (fr) 2023-04-03 2023-04-03 Dissipateur thermique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/SE2023/050296 WO2024210775A1 (fr) 2023-04-03 2023-04-03 Dissipateur thermique

Publications (1)

Publication Number Publication Date
WO2024210775A1 true WO2024210775A1 (fr) 2024-10-10

Family

ID=92972532

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/SE2023/050296 Pending WO2024210775A1 (fr) 2023-04-03 2023-04-03 Dissipateur thermique

Country Status (2)

Country Link
CN (1) CN120693977A (fr)
WO (1) WO2024210775A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3229759A (en) * 1963-12-02 1966-01-18 George M Grover Evaporation-condensation heat transfer device
US4921041A (en) * 1987-06-23 1990-05-01 Actronics Kabushiki Kaisha Structure of a heat pipe
US20080236795A1 (en) * 2007-03-26 2008-10-02 Seung Mun You Low-profile heat-spreading liquid chamber using boiling
US20120111553A1 (en) * 2009-05-18 2012-05-10 Vadim Tsoi Heat spreading device and method therefore
US20130223012A1 (en) * 2012-02-24 2013-08-29 Futurewei Technologies, Inc. Apparatus and Method for an Active Antenna Heat Sink
WO2015022032A1 (fr) * 2013-08-16 2015-02-19 Huawei Technologies Co., Ltd. Structure renforcée pour dissipateur thermique de refroidissement naturel
US20180283798A1 (en) * 2017-03-31 2018-10-04 Korea Advanced Institute Of Science And Technology Plate pulsating heat spreader with artificial cavities

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3229759A (en) * 1963-12-02 1966-01-18 George M Grover Evaporation-condensation heat transfer device
US4921041A (en) * 1987-06-23 1990-05-01 Actronics Kabushiki Kaisha Structure of a heat pipe
US20080236795A1 (en) * 2007-03-26 2008-10-02 Seung Mun You Low-profile heat-spreading liquid chamber using boiling
US20120111553A1 (en) * 2009-05-18 2012-05-10 Vadim Tsoi Heat spreading device and method therefore
US20130223012A1 (en) * 2012-02-24 2013-08-29 Futurewei Technologies, Inc. Apparatus and Method for an Active Antenna Heat Sink
WO2015022032A1 (fr) * 2013-08-16 2015-02-19 Huawei Technologies Co., Ltd. Structure renforcée pour dissipateur thermique de refroidissement naturel
US20180283798A1 (en) * 2017-03-31 2018-10-04 Korea Advanced Institute Of Science And Technology Plate pulsating heat spreader with artificial cavities

Also Published As

Publication number Publication date
CN120693977A (zh) 2025-09-23

Similar Documents

Publication Publication Date Title
US6658861B1 (en) Cooling of high power density devices by electrically conducting fluids
US7304842B2 (en) Apparatuses and methods for cooling electronic devices in computer systems
CN101573790B (zh) 气冷式热装置中的三维散热
US8934245B2 (en) Heat conveying structure for electronic device
EP1383170B1 (fr) Thermosiphon pour équipement électronique de refroidissement avec un flux d'air non uniforme
US6714413B1 (en) Compact thermosiphon with enhanced condenser for electronics cooling
US7106589B2 (en) Heat sink, assembly, and method of making
US8479805B2 (en) Heat-dissipating assembly
WO2015146110A1 (fr) Refroidisseur à changement de phase et procédé de refroidissement à changement de phase
EP3723463B1 (fr) Échangeur thermique avec dissipateur de chaleur à deux phases
US20180270993A1 (en) Cooling using a wick with varied thickness
JP5874935B2 (ja) 平板型冷却装置及びその使用方法
WO2005060370A2 (fr) Refroidissement de dispositifs de densite a haute puissance a l'aide de fluides electroconducteurs
US20050135061A1 (en) Heat sink, assembly, and method of making
JP4682859B2 (ja) 電子機器用の冷却システム
US6595270B2 (en) Using micro heat pipes as heat exchanger unit for notebook applications
JP4639850B2 (ja) 冷却方法及び装置
EP2661598B1 (fr) Système de refroidissement et procédé pour refroidir un élément générateur de chaleur
WO2024210775A1 (fr) Dissipateur thermique
JP2016133230A (ja) 放熱装置
US20080128109A1 (en) Two-phase cooling technology for electronic cooling applications
JP4682858B2 (ja) 電子機器用の冷却装置
TWI904968B (zh) 迴路式熱虹吸組件
CN215582430U (zh) 一种石墨烯用于逆变器的散热装置
EP2801781B1 (fr) Système de refroidissement

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23932242

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202380094945.1

Country of ref document: CN

WWP Wipo information: published in national office

Ref document number: 202380094945.1

Country of ref document: CN

NENP Non-entry into the national phase

Ref country code: DE