WO2024209793A1 - Coil component, method for manufacturing coil component, and electronic/electric device - Google Patents

Abstract

As a method for manufacturing a coil component that can exhibit excellent electrical characteristics even when miniaturized, the present invention provides, in an embodiment, a method for manufacturing a coil component 100 comprising a coil part 10 which includes: a first conductive part 201 having a first spiral conductive part 11 that defines a spiral around an axis along a first direction (Z1-Z2 direction); and a first insulation part 90 in contact with at least a part of a first end 11F which is one end in the first direction of the first conductive part 201. The manufacturing method comprises: a first step for forming the first conductive part 201 on one surface of a sheet base material 91 including the first insulating part 90; and a second step for removing at least a part of the sheet base material 91 to remove the first insulating part 90 positioned in a first region R1 which is a region surrounded by an inner edge Lp of the first spiral conductive part 11 in the sheet base material 91. In the second step, a non-contact part EP may be formed by removing a part of the first insulating part 90 that is in contact with the first end 11F.

Description

Coil component, manufacturing method of coil component, and electronic/electrical device

The present invention relates to a coil component, a manufacturing method thereof, and an electronic/electrical device in which the coil component is mounted.

Patent Document 1 discloses an inductor including a main body including a support member, a coil supported by the support member, and a sealing material that seals the support member and the coil, and an external electrode disposed on the outer surface of the main body, the coil including a plurality of coil patterns, each of the plurality of coil patterns including a first coil layer and a second coil layer disposed on the first coil layer, the sealing material including magnetic powder and filling the spaces between adjacent ones of the plurality of coil patterns, the sealing material being disposed between the first coil layer so as to extend in a direction toward the support member, and the surfaces of the plurality of coil patterns being coated with an insulating layer.

Patent Document 1 discloses that, with regard to this inductor, the support member can be an insulating base material made of insulating resin, and gives examples of insulating resins such as "thermosetting resins such as epoxy resins, thermoplastic resins such as polyimide, or resins impregnated with reinforcing materials such as glass fiber or inorganic fillers, for example, prepreg, ABF (Ajinomoto Build-up Film), FR-4, BT (Bismaleimide Triazine) resin, and PID (Photo Imageable Dielectric) resin."

JP 2018-113434 A

The supporting substrate of the inductor disclosed in Patent Document 1 has a considerable rigidity in order to support the coil, and therefore occupies a certain amount of volume within the inductor. The insulating resin shown in the above example has a low relative permeability and therefore does not function in terms of improving the electrical characteristics of the inductor. Therefore, the presence of this supporting substrate can be an obstacle to improving the functionality of the inductor. And when inductors try to meet the demand for miniaturization, the impact of this obstacle becomes greater.

The present invention aims to provide a coil component that can have excellent electrical properties even when miniaturized. It also aims to provide a method for manufacturing the coil component, and an electronic/electrical device in which the coil component is mounted.

The inventors conducted research to solve the above-mentioned newly discovered problem, and came to the new knowledge that a coil component with excellent electrical properties can be provided by reducing the volume of the substrate supporting the coil pattern, specifically by positioning the inner edge of the substrate used to manufacture the coil pattern closer to the outer periphery of the spiral than the inner edge of the spiral portion of the coil pattern.

The present invention, which is provided based on such findings, is, in one aspect, a method for manufacturing a coil component including a coil portion including a first conductive portion having a first spiral conductive portion that describes a spiral around an axis along a first direction, and a first insulating portion that contacts at least a portion of a first end, which is one of the ends of the first conductive portion on the first direction side, and is characterized in that the method for manufacturing a coil component includes a first step of forming the first conductive portion on one side of a sheet substrate that includes the first insulating portion, and a second step of removing at least a portion of the sheet substrate to remove the first insulating portion located in a first region of the sheet substrate that is a region surrounded by the inner edge of the first spiral conductive portion when viewed in the first direction.

In the above manufacturing method, in the second step, a portion of the first insulating portion that contacts the first end may be removed to form a non-contact portion at the first end that does not contact the first insulating portion.

In the above manufacturing method, in the second step, when viewed in the first direction, the envelope of the inner edge of the first insulating portion that contacts the turn that constitutes the inner edge of the first spiral conductive portion may incorporate the inner edge of the first spiral conductive portion.

The above manufacturing method may include a third step, after the second step, of forming a second insulating portion so as to contact at least the exposed surface of the first spiral conductive portion.

In the above manufacturing method, the first region may be removed using a process that includes a wet process or a dry process. The first region may be removed chemically. The first insulating portion may include a polyimide resin.

In the above manufacturing method, the first spiral conductive portion may have two turns aligned in a direction intersecting the first direction, and the first insulating portion may have a portion contacting one of the two turns, a portion contacting the other of the two turns, and a connecting portion connected to these portions and extending in a direction intersecting the first direction, in which case the connecting portion may have a thin portion that is thinner in the first direction than the portion of the first insulating portion that contacts either of the two turns.

In the above manufacturing method, it may be preferable that the ratio of the thickness of the thin portion in the first direction to the thickness of the portion of the first insulating portion that contacts either of the two turns in the first direction is 0.60 or more.

In the above manufacturing method, the first insulating portion may contain a thermoplastic resin and may be thermoplastic. In this case, the thermoplastic resin may contain a paraxylylene-based polymer.

In the above manufacturing method, in the first step, a first dummy conductive portion having a non-spiral shape may also be formed on the one surface of the sheet base material, and in this case, in the second step, at least a portion of the portion of the sheet base material located between the first dummy conductive portion and the first spiral conductive portion may be removed.

In the above manufacturing method, the first region may be isotropically removed in the second step.

In another aspect, the present invention provides a coil component including a coil section including a first conductive section having a first spiral conductive section that describes a spiral around an axis along a first direction, and a first insulating section that contacts at least a part of a first end section that is one of the ends of the first conductive section on the first direction side,
The present invention provides a coil component characterized in that the first end has a non-contact portion at a corner connected to a side portion of the first conductive portion along the first direction, where the first insulating portion is not provided.

When viewed in the first direction, the coil component may have an envelope of the inner edge of the first insulating portion that contacts the turn that constitutes the inner edge of the first spiral conductive portion, the envelope of the inner edge of the first spiral conductive portion.

The coil component may have a second insulating portion in contact with the surface of the first spiral conductive portion.

In the coil component described above, the first insulating portion may include polyimide resin.

In the above coil component, the first spiral conductive portion may have two turns aligned in a direction intersecting the first direction, in which case the first insulating portion has a portion contacting one of the two turns, a portion contacting the other of the two turns, and a connecting portion connected to these portions and extending in a direction intersecting the first direction, and the connecting portion may have a thin portion that is thinner in the first direction than the portion of the first insulating portion that contacts either of the two turns.

In the above coil component, the ratio of the thickness in the first direction of the recess formed by the thin portion to the thickness in the first direction of the portion of the first insulating portion that contacts either of the two turns may be 0.60 or more.

In the coil component described above, the second insulating portion may be thermoplastic, including a thermoplastic resin. The thermoplastic resin may include a paraxylylene-based polymer.

In the above coil component, the coil portion may further include a second conductive portion and a via portion electrically connecting the first conductive portion and the second conductive portion. In this case, the first conductive portion is electrically connected to the via portion at one end of the first spiral conductive portion and has a first lead-out portion electrically connected to the other end of the first spiral conductive portion, the second conductive portion is aligned with the first spiral conductive portion along the first direction and has a second spiral conductive portion electrically connected to the via portion at one end and a second lead-out portion electrically connected to the other end of the second spiral conductive portion, and when the connection portion to the via portion is taken as a starting point, the first spiral conductive portion and the second spiral conductive portion spiral in opposite directions to each other, and the portion of the first insulating portion that contacts one of the ends of the first spiral conductive portion on the first direction side may contact one of the ends of the second spiral conductive portion on the first direction side on the opposite side to the side that contacts the first spiral conductive portion.

In the above coil component, the coil portion may be provided with a first dummy conductive portion that faces the first pull-out portion in the first direction across the first insulating portion, has a portion that contacts the first insulating portion, and is spaced apart from the second conductive portion in a direction that intersects with the first direction.

In the above coil component, the coil portion may include a dummy via portion that electrically connects the first pull-out portion and the first dummy conductive portion.

In the above coil component, the first dummy conductive portion may be electrically insulated from the first lead-out portion.

In the coil component described above, the first conductive portion may include a plating layer, i.e., a portion made of a plating deposit.

In the above coil component, the average thickness of the first insulating portion in the first direction may be 1 μm or more and 20 μm or less.

The coil component may further include a main body portion that contains magnetic powder and covers at least a portion of the coil portion, and when viewed in the first direction, the main body portion has a diameter that is half the average longitudinal dimension of the main body portion when viewed in the first direction, and the inner edge of the first spiral conductive portion and the inner edge of the second spiral conductive portion may overlap outside a circular region centered on the center of the via portion.

The coil component may further include a main body portion that contains magnetic powder and covers at least a portion of the coil portion. In this case, the first insulating portion may be embedded inside the main body portion and spaced apart from the surface of the main body portion.

As another aspect of the present invention, there is provided an electronic/electrical device in which the above-mentioned coil component is mounted, the coil component being connected to a substrate at terminal portions provided on the first and second drawers, respectively. Examples of such electronic/electrical devices include power supplies and small portable communication devices that include a power switching circuit, a voltage step-up circuit, a smoothing circuit, etc. The electronic/electrical device according to the present invention is excellent in terms of performance and dimensions because it includes the above-mentioned coil component.

The present invention provides a coil component that is easily adapted to miniaturization and has excellent magnetic properties, and a method for manufacturing the same. When this coil component is mounted in an electronic or electric device, the performance of the electronic or electric device can be improved and the dimensions of the electronic or electric device can be reduced. The present invention also provides an electronic or electric device in which the coil component is mounted.

FIG. 1 is a perspective view conceptually illustrating the shape of a coil component according to an embodiment of the present invention. 3A to 3C are diagrams illustrating the structure of a coil conductive portion included in a coil component according to an embodiment of the present invention. 4 is an XY plan view illustrating the structure of a first spiral conductive portion provided in the coil component according to the embodiment of the present invention. FIG. 10 is an XY plan view illustrating a structure of a second spiral conductive portion provided in a coil component according to an embodiment of the present invention. FIG. 2A and 2B are an XY plan view and a cross-sectional view in an XZ plane illustrating a structure of a coil portion included in a coil component according to an embodiment of the present invention. 2 is an XY plan view illustrating a structure of a coil portion included in a coil component according to an embodiment of the present invention. FIG. 4 is an XZ cross-sectional view for explaining an example of a first insulating portion provided in the coil component according to the embodiment of the present invention. FIG. 5A to 5C are explanatory diagrams illustrating an example of a non-contact portion of a coil conductive portion included in the coil component according to the embodiment of the present invention. 11A and 11B are explanatory diagrams of other examples of non-contact portions of the coil conductive portions included in the coil component according to the embodiment of the present invention. 13A and 13B are explanatory diagrams of modified examples of other examples of non-contact portions of the coil conductive portions included in the coil component according to the embodiment of the present invention. 11 is an XZ cross-sectional view for explaining another example of a first insulating portion provided in the coil component according to one embodiment of the present invention. FIG. 5 is an explanatory diagram of a continuous portion of a first insulating portion included in the coil component according to the embodiment of the present invention. FIG. 4 is an explanatory diagram of an example of a first dummy conductive portion provided in a coil component according to an embodiment of the present invention; FIG. FIG. 11 is an XY plan view of FIG. This is a diagram based on the B-B' cross-sectional view of Figure 11. 11 is an explanatory diagram of another example of a first dummy conductive portion provided in the coil component according to the embodiment of the present invention. FIG. FIG. 14 is an XY plan view of FIG. 13. This is a diagram based on the C-C' cross-sectional view of Figure 14. 11 is an explanatory diagram of another example of a first dummy conductive portion provided in the coil component according to the embodiment of the present invention. FIG. FIG. 17 is an XY plan view of FIG. 16 . This is a diagram based on the D-D' cross-sectional view of Figure 17. 5A to 5C are explanatory diagrams (first half) of an example of a manufacturing method for a coil component according to an embodiment of the present invention. 5A to 5C are explanatory diagrams (second half) of an example of a manufacturing method for a coil component according to an embodiment of the present invention. 7A to 7C are explanatory diagrams of another example of a manufacturing method for a coil component according to an embodiment of the present invention. 11A to 11C are diagrams illustrating the structure of a modified example of a coil conductive portion included in a coil component according to an embodiment of the present invention. 2 is a diagram obtained by projecting a first conductive portion 201 onto an XY plane along a first direction. 2 is a diagram obtained by projecting a non-contact portion EP of a first conductive portion 201 onto an XY plane along a first direction.

Below, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view conceptually showing the shape of a coil component according to one embodiment of the present invention. FIG. 2 is a diagram explaining the structure of a coil conductive part included in a coil component according to one embodiment of the present invention. For convenience of explanation, in FIG. 2, the coil conductive part is drawn with a solid line, the main body part is drawn with a dashed line, and other components are omitted. FIG. 3 is an XY plan view explaining the structure of a first spiral conductive part included in a coil component according to one embodiment of the present invention. FIG. 4 is an XY plan view explaining the structure of a second spiral conductive part included in a coil component according to one embodiment of the present invention. Note that FIG. 3 illustrates the coil conductive part as viewed from the Z1 side in the Z1-Z2 direction, and FIG. 4 illustrates the coil conductive part as viewed from the Z2 side in the Z1-Z2 direction.

(Overall composition)
A coil component 100 according to one embodiment of the present invention includes a coil portion 10 having a coil conductive portion 20 , a main body portion 30 , a first terminal portion 41 , a second terminal portion 42 , and exterior coats 50 and 60 .

(coil)
2 and 3, the coil portion 10 has a coil conductive portion 20 including a first conductive portion 201 having a spiral-shaped first spiral conductive portion 11 that moves away from the axis O from one end 12, which is an end on the inner periphery side of the first spiral conductive portion 11, toward the other end 13, which is an end on the outer periphery side of the first spiral conductive portion 11, around an axis O along a first direction (Z1-Z2 direction). In FIG. 2, the first spiral conductive portion 11 has a conductor arranged in a spiral shape that moves away from the axis O in a clockwise direction from one end 12 to the other end 13, as viewed from the Z1 side in the Z1-Z2 direction. In this specification, the "spiral direction" of the spiral portion means the direction from the end on the inner periphery side to the end on the outer periphery side.

The conductor (conductive material) constituting the coil conductive part 20 is not limited as long as it has appropriate conductivity. Specific examples of the conductor constituting the coil conductive part 20 include metals such as copper, copper alloys, aluminum, and aluminum alloys, and the coil conductive part 20 can be manufactured using a film forming technique such as plating. The coil part 10 has an insulating coil insulation part (not shown in Figures 1 to 4) on the surface of the coil conductive part 20. This coil insulation part ensures insulation between adjacent conductors (between the surfaces of the conductors facing each other) in the coil conductive part 20. The coil insulation part is made of, for example, a resin material. No coil insulation part is provided at the ends of the two ends (first lead part 14, second lead part 24) of the coil conductive part 20, and the coil part 10 can be electrically connected to other members at these ends.

2 and 4, the coil conductive portion 20 includes a second conductive portion 202 having a second spiral conductive portion 21 arranged alongside the first spiral conductive portion 11 in the first direction. The second spiral conductive portion 21 has a spiral shape around an axis O along the first direction (Z1-Z2 direction) that moves away from the axis O from one end 22, which is the inner end of the second spiral conductive portion 21, towards the other end 23, which is the outer end of the second spiral conductive portion 21. In the second spiral conductive portion 21, a conductor is arranged in a spiral shape that moves away from the axis O in the opposite direction (counterclockwise in FIG. 2) to the first spiral conductive portion 11 when viewed from the Z1 side in the Z1-Z2 direction. The average value of the separation distance in the first direction (Z1-Z2 direction) between the first spiral conductive portion 11 and the second spiral conductive portion 21 is not particularly limited. The smaller this separation distance, the easier it is to reduce the height (dimension in the Z1-Z2 direction) of the coil component 100, but if it is too small, the insulation between the first spiral conductive portion 11 and the second spiral conductive portion 21 is likely to decrease. From the viewpoint of achieving both a low profile (low height) of the coil component 100 and high insulation between the first spiral conductive portion 11 and the second spiral conductive portion 21, it may be preferable for the separation distance to be 0.4 μm or more and 20 μm or less. In order to reduce variation in the separation distance and more reliably support the coil in the same plane in terms of manufacturing, it is more preferable for this separation distance to be 1.0 μm or more, and even more preferable for it to be 5.0 μm or more.

One end 12 of the first spiral conductive portion 11 and one end 22 of the second spiral conductive portion 21 are electrically connected by a via portion VP. Starting from the connection portion to the via portion VP, the first spiral conductive portion 11 and the second spiral conductive portion 21 spiral in opposite directions. The via portion VP may be made of the same conductor as the coil conductive portion 20. In a specific example, the via portion VP is made of the same material as the first spiral conductive portion 11 and the second spiral conductive portion 21, and is manufactured simultaneously with the first spiral conductive portion 11 and the second spiral conductive portion 21. In this case, the via portion VP is integrated with one end 12 of the first spiral conductive portion 11 and one end 22 of the second spiral conductive portion 21.

The first lead-out portion 14 is connected to the other end 13 of the first spiral conductive portion 11 as a part of the first conductive portion 201, and the second lead-out portion 24 is connected to the other end 23 of the second spiral conductive portion 21 as a part of the second conductive portion 202. Therefore, the other end 13 of the first spiral conductive portion 11 is essentially an interface with the first lead-out portion 14, and the other end 23 of the second spiral conductive portion 21 is essentially an interface with the second lead-out portion 24. In a specific example, the first lead-out portion 14 and the second lead-out portion 24 are made of the same material as the first spiral conductive portion 11 and the second spiral conductive portion 21, and are manufactured simultaneously with the first spiral conductive portion 11 and the second spiral conductive portion 21. That is, the first conductive portion 201 is manufactured as a single unit, and the second conductive portion 202 is also manufactured as a single unit. In this case, the first lead-out portion 14 is seamlessly integrated with the other end 13 of the first spiral conductive portion 11, and the second lead-out portion 24 is seamlessly integrated with the other end 23 of the second spiral conductive portion 21.

In other words, in this embodiment, the coil conductive portion 20 has a first conductive portion 201 having a first spiral conductive portion 11 and a first pull-out portion 14, a second conductive portion 202 having a second spiral conductive portion 21 and a second pull-out portion 24, and a via portion VP, which are formed from a common conductive material.

FIG. 5A is an XY plan view and a cross-sectional view in the XZ plane (XZ cross-sectional view) explaining the structure of a coil portion provided in a coil component according to one embodiment of the present invention. Only the coil conductive portion 20 is depicted in the XY plan view of FIG. 5A, and a cross section taken along line A-A' in this XY plan view is shown as the XZ cross-sectional view. Note that in this XZ cross-sectional view, elements other than the coil conductive portion 20 are seen through.

As shown in the XZ cross-sectional view of FIG. 5A, each turn of the first spiral conductive portion 11 and each turn of the second spiral conductive portion 21 are positioned so as to be aligned in the first direction. The first spiral conductive portion 11 has a first inner circumference side turn 111 which is a turn located on the innermost circumference, a first outer circumference side turn 113 which is a turn located on the outermost circumference, and a first central turn 112 which is a turn located between them, and the second spiral conductive portion 21 has a second inner circumference side turn 211 which is a turn located on the innermost circumference, a second outer circumference side turn 213 which is a turn located on the outermost circumference, and a second central turn 212 which is a turn located between them.

The second inner circumferential turn 211 is located on the Z2 side of the first inner circumferential turn 111 in the Z1-Z2 direction, the second outer circumferential turn 213 is located on the Z2 side of the first outer circumferential turn 113 in the Z1-Z2 direction, and the second central turn 212 is located on the Z2 side of the first central turn 112 in the Z1-Z2 direction. In the coil section 10 shown in FIG. 5A, the second pull-out section 24 is not present on the Z2 side of the other end 13 of the first spiral conductive section 11 in the Z1-Z2 direction, and the first pull-out section 14 is not present on the Z1 side of the other end 23 of the second spiral conductive section 21 in the Z1-Z2 direction.

(First insulating portion)
As shown in the XZ cross-sectional view of Fig. 5A, the coil insulating portion includes a first insulating portion 90 that contacts at least a part of a first end 11F, which is one of the ends on the first direction side of the first spiral conductive portion 11, specifically, the end on the side (Z2 side in the Z1-Z2 direction) facing the second spiral conductive portion 21. The first insulating portion 90 shown in the XZ cross-sectional view of Fig. 5A contacts at least a part of a second end 21F, which is one of the ends on the first direction side of the second spiral conductive portion 21, specifically, the end on the side (Z1 side in the Z1-Z2 direction) facing the first spiral conductive portion 11, on the side (Z2 side in the Z1-Z2 direction) opposite to the side (Z1 side in the Z1-Z2 direction) contacting the first spiral conductive portion 11. That is, the first insulating portion 90 is interposed between the first spiral conductive portion 11 and the second spiral conductive portion 21 arranged in the first direction and is in contact with both. In this manner, the first insulating portion 90 contacts the first spiral conductive portion 11, thereby reliably insulating the first spiral conductive portion 11. Also, as shown in the XZ cross-sectional view of Fig. 5A, the first insulating portion 90 contacts both the first spiral conductive portion 11 and the second spiral conductive portion 21, thereby reliably avoiding a short circuit between the first spiral conductive portion 11 and the second spiral conductive portion 21.

The material constituting the first insulating portion 90 is not limited as long as it has appropriate insulating properties. In some cases, it is preferable that the first insulating portion 90 has a volume resistivity of 1.0×10 ¹⁴ Ωcm or more obtained by ASTM D257. This volume resistivity is more preferably 1.0×10 ¹⁵ Ωcm or more, and even more preferably 1.0×10 ¹⁶ Ωcm or more. The upper limit of the volume resistivity is not particularly limited. The volume resistivity may be 1.0×10 ²⁰ Ωcm or less. In addition, it is preferable that the first insulating portion 90 has excellent dielectric properties, and specifically, it is preferable that the relative dielectric constant at 60 Hz obtained by ASTM D150 is 4.0 or less. This relative dielectric constant is more preferably 3.5 or less, and even more preferably 3.0 or less. The lower limit of this relative dielectric constant is not particularly limited. The relative dielectric constant may be 1.0 or more. There are no limitations on the method for measuring the volume resistivity and dielectric constant of the first insulating portion 90, so long as the results are expected to be equivalent to those obtained by the above-mentioned ASTM D257 and D150. For example, a method may be used in which a measurement sample is separately prepared by preparing a material corresponding to the first insulating portion 90 to a size required for measurement, and the constituent materials are identified using this measurement sample through an analysis method such as component analysis or FT-IR, and the characteristics of the material, such as the volume resistivity, are evaluated.

The material constituting the first insulating section 90 may be made of an organic material, may be made of an inorganic material, or may be a composite material of an organic material and an inorganic material. When the first insulating section 90 is made of a composite material, the inorganic material may have a particulate shape and may be dispersed in a matrix made of an organic material. Specific examples of organic materials include polyimide resin, polyethylene resin, polypropylene resin, polyamide resin, polyester resin, polyamideimide resin, polysulfone resin, polycarbonate resin, liquid crystal polymer resin, polyvinylidene fluoride resin, and polytetrafluoroethylene resin. Specific examples of inorganic materials, particularly inorganic materials in composite materials, include inorganic materials such as oxides, carbides, nitrides, and inorganic salts. Examples of oxides include silica, alumina, and zirconia. Examples of carbides and nitrides include silicon carbide and boron nitride, respectively. Examples of inorganic salts include minerals such as wollastonite, kaolin, and mica. Of these, oxide-based materials such as oxides, silicates, and phosphates are preferred in terms of cost and insulation. For example, it is preferable that the inorganic material contains at least one selected from the group consisting of silicon (Si), phosphorus (P), boron (B), and calcium (Ca).

As shown in the XY plan view of FIG. 5A, when viewed in the first direction (Z1-Z2 direction), the turn constituting the inner edge Lp (shown by a two-dot chain line in FIG. 5A) of the first spiral conductive portion 11, i.e., the envelope line Le (shown by a dashed line in FIG. 5A) of the inner edge of the first insulating portion 90 that contacts the first inner circumference side turn 111 located on the innermost circumference, encompasses the inner edge Lp of the first spiral conductive portion 11 except for a circular area (corresponding to the via portion VP and the area nearby) described below. Note that the position of the envelope line Le of the inner edge of the first insulating portion 90 shown by the dashed line in FIG. 5A is defined as the average position across the thickness dimension of the first insulating portion 90.

Figure 23A is a diagram (projection drawing) obtained by projecting the first conductive portion 201 onto the XY plane along the first direction (Z1-Z2 direction). Figure 23B is a diagram (projection drawing) obtained by projecting the non-contact portion EP of the first conductive portion 201 onto the XY plane along the first direction (Z1-Z2 direction). In the projection drawing of Figure 23B, the width of the non-contact portion EP is set to 5 μm. In this case, the provision of the non-contact portion EP increases the area of the portion of the first conductive portion 201 exposed from the first insulating portion 90. Specifically, this is calculated to be a 3.4% increase in area compared to when the non-contact portion EP is not provided. Since the second insulating portion 80 described later is provided in the portion of the first conductive portion 201 exposed from the first insulating portion 90, the contact area between the first conductive portion 201 and the second insulating portion 80 increases by 3.4% compared to when the non-contact portion EP is not provided. This contributes to improving the adhesion between the first conductive portion 201 and the second insulating portion 80. In addition, since the non-contact portion EP is provided, the second insulating portion 80 is provided not only on the side portion (the portion facing the direction perpendicular to the first direction) of the first conductive portion 201 but also on the first end portion 11F, and therefore the adhesion of the second insulating portion 80 to the first conductive portion 201 is improved by the anchor effect.

As shown in the XZ cross-sectional view of FIG. 5A, the thickness t1 of the first insulating portion 90 located in the portion of the second spiral conductive portion 21 that does not overlap with the first spiral conductive portion 11 near the via portion VP when viewed from the Z1 side in the Z1-Z2 direction, and the thickness t2 of the first insulating portion 90 located in the portion of the first spiral conductive portion 11 that does not overlap with the second spiral conductive portion 21 near the via portion VP when viewed from the Z2 side in the Z1-Z2 direction, are thinner than the thickness t3 of the first insulating portion 90 located in the portion that overlaps with the first spiral conductive portion 11 and the second spiral conductive portion 21 when viewed in the Z1-Z2 direction. For example, the thicknesses t1 and t2 are less than half the thickness t3.

Figure 5B is an XY plan view illustrating the structure of a coil portion provided in a coil component according to one embodiment of the present invention. Considering the symmetry (linear symmetry) about the line in the Y1-Y2 direction between the first spiral conductive portion 11 and the second spiral conductive portion 21, when viewed in the first direction (Z1-Z2 direction), the turns constituting the inner edge Lp (shown by a two-dot chain line in Figure 5B) of the first spiral conductive portion 11 and the second spiral conductive portion 21, i.e., the envelope line Le (shown by a dashed dot line in Figure 5B) of the inner edge of the first insulating portion 90 that contacts the first inner circumference side turn 111 and the second inner circumference side turn 211 located on the innermost circumference, incorporates the inner edge Lp of the first spiral conductive portion 11 and the second spiral conductive portion 21. The position of the envelope Le of the inner edge of the first insulating part 90 is defined as the average position across the thickness dimension of the first insulating part 90. The envelope Le of the inner edge of the first insulating part 90 shown by the dashed line passes through the outer periphery of the via part VP, and the inner edge Lp of the first spiral conductive part 11 and the second spiral conductive part 21 shown by the dashed line passes through the inner periphery of the via part VP.

Also, as shown in the XY plan view of FIG. 5A, when viewed in the first direction (Z1-Z2 direction), the inner edge Lp of the first spiral conductive portion 11 and the inner edge Lp of the second spiral conductive portion 21 overlap in the outer region (i.e., the region excluding the via portion VP and its vicinity) of a circular region (shown by a dotted line in the XY plan view of FIG. 5) that is centered at the center of the via portion VP and has a diameter Dc that is half the average dimension Wx in the longitudinal direction (X1-X2 direction) of the main body portion 30.

The coil insulating portion of the coil component 100 will be described in detail using FIG. 6, which is an enlarged view of the area surrounded by a dashed line shown on the X2 side in the X1-X2 direction of the XZ cross-sectional view of FIG. 5A. FIG. 6 is an XZ cross-sectional view for explaining an example of a first insulating portion of a coil component according to one embodiment of the present invention. FIG. 7A is an explanatory diagram of an example of a non-contact portion of a coil conductive portion of a coil component according to one embodiment of the present invention, and is an enlarged view of the area including the non-contact portion shown in the dashed circle in FIG. 6. FIG. 7B is an explanatory diagram of another example of a non-contact portion of a coil conductive portion of a coil component according to one embodiment of the present invention. FIG. 7C is an explanatory diagram of a modified example of another example of a non-contact portion of a coil conductive portion of a coil component according to one embodiment of the present invention. In FIG. 7B and FIG. 7C, an area corresponding to the area shown in FIG. 7A is shown. In Figures 7A to 7C, in order to make it easier to understand the relative positional relationship in the X1-X2 direction between the envelope line Le of the inner edge of the first insulating part 90 and the inner edge Lp of the first spiral conductive part 11 and the second spiral conductive part 21, the lines that pass through the position of the envelope line Le or the position of the inner edge Lp and extend in the Z1-Z2 direction perpendicular to the X1-X2 direction are shown as dashed line Le1 and dashed line Lp1, respectively.

In one example, the first insulating portion 90 exists independently in three parts in the XZ cross section shown in FIG. 6: a first insulating portion 901 located between the first inner circumferential turn 111 and the second inner circumferential turn 211, a first insulating portion 902 located between the first central turn 112 and the second central turn 212, and a first insulating portion 903 located between the first outer circumferential turn 113 and the second outer circumferential turn 213. The X1-X2 direction end of each of the first insulating portions 901, 902, 903 is located further back than the X1-X2 direction end of the turn it contacts, and there is a part at the end of the turn that is not in contact with the first insulating portion 90.

Specifically, the end of the first insulating portion 901 on the X1 side in the X1-X2 direction is located further back (X2 side in the X1-X2 direction) than the end of the first inner turn 111 on the X1 side in the X1-X2 direction. Therefore, the portion of the first inner turn 111 facing the second inner turn 211 (first end 11F) has a portion (non-contact portion EP) that is not in contact with the first insulating portion 901. Specifically, the first end 11F has a non-contact portion EP where the first insulating portion 901 is not provided, at a corner portion Cp (see FIG. 7A) that is connected to a side portion Sp (see FIG. 7A) along the first direction (Z1-Z2 direction) of the first inner turn 111, which is part of the first conductive portion 201. Based on this non-contact portion EP, as shown in FIG. 5A, when viewed in the first direction (Z1-Z2 direction), the envelope Le of the inner edge of the first insulating portion 90 that contacts the turn that constitutes the inner edge of the first spiral conductive portion 11, i.e., the first inner circumference side turn 111 located on the innermost circumference, takes in the inner edge Lp of the first spiral conductive portion 11. In FIG. 7A, the dashed line Le1 corresponding to the envelope Le is located on the outer side (X2 side in the X1-X2 direction) of the dashed two-dot line Lp1 corresponding to the inner edge Lp. Similarly, the non-contact portion EP exists on the X1 side in the X1-X2 direction in the portion (second end portion 21F) of the second inner circumference side turn 211 that faces the first inner circumference side turn 111.

In addition, since the first insulating portion 902 is independent of the adjacent first insulating portions 901, 903 in the XZ cross section, the portion of the first central turn 112 facing the second central turn 212 (first end 11F) has non-contact portions EP at both ends in the X1-X2 direction, and the portion of the second central turn 212 facing the first central turn 112 (second end 21F) has non-contact portions EP at both ends in the X1-X2 direction. Furthermore, since the first insulating portion 903 exists independently of the first insulating portion 902 in the XZ cross section, the portion (first end 11F) of the first outer periphery turn 113 facing the second outer periphery turn 213 has non-contact portions EP at both ends in the X1-X2 direction, and the portion (second end 21F) of the second outer periphery turn 213 facing the first outer periphery turn 113 has non-contact portions EP at both ends in the X1-X2 direction. Note that the first insulating portion 90 does not contact the end (first extension portion 14P) of the first drawn portion 14 on the X1 side in the X1-X2 direction, and is a non-contact portion EP.

7B, in comparison with FIG. 7A, a non-contact portion EP that is not in contact with the first insulating portions 901, 902 is provided at the corner of the first end 11F in the first direction, and a non-contact portion EP is also provided in the first insulating portion 902, but the shapes of the first insulating portions 901, 902 are different. Specifically, in the example shown in FIG. 7A, the first insulating portions 901, 902 have a shape in which the center portion in the first direction (Z1-Z2 direction) (the position most distant from both the first end 11F and the second end 21F) is recessed in the X1-X2 direction, but in the example shown in FIG. 7B, the shape of the first insulating portions 901, 902 has a shape in which the center portion in the first direction (Z1-Z2 direction) bulges in the X1-X2 direction. The first insulating parts 901 and 902 in the example shown in FIG. 7B are different in shape as described above, but the relative positional relationship between the envelope Le and the inner edge Lp is the same as in FIG. 7A, and the dashed dotted line Le1 corresponding to the envelope Le is located on the outer periphery side (X2 side in the X1-X2 direction) of the dashed two-dotted line Lp1 corresponding to the inner edge Lp.

In the example shown in Figure 7C, in comparison with Figure 7B, the central portion in the first direction (Z1-Z2 direction) has a shape that bulges in the X1-X2 direction, similar to the example in Figure 7B, but the relative positional relationship between the envelope Le and the inner edge Lp is different. Specifically, a non-contact portion EP that is not in contact with the first insulating portions 901, 902 is provided, but the shapes of the first insulating portions 901, 902 are different. Specifically, in the example shown in Figure 7C, the central portions of the first insulating portions 901, 902 bulge to a greater extent, and the tips of the bulges are located outside the side portions Sp. For this reason, in the example of FIG. 7B, the dashed dotted line Le1 corresponding to the envelope Le is located on the outer periphery side (X2 side in the X1-X2 direction) of the dashed two-dotted line Lp1 corresponding to the inner edge Lp, but in the example shown in FIG. 7C, the dashed dotted line Le1 corresponding to the envelope Le is located on the inner periphery side (X1 side in the X1-X2 direction) of the dashed two-dotted line Lp1 corresponding to the inner edge Lp.

The difference in shape of the first insulating parts 901, 902 as shown in Figures 7A to 7C can be achieved, for example, by appropriately setting the removal processing process of the member that provides the first insulating parts 901, 902 (such as the sheet base material 91 described below). The structure shown in Figure 7A is easily obtained by isotropically etching the sheet base material 91, and the structures shown in Figures 7B and 7C can be obtained by performing anisotropic (anisotropic) etching on the sheet base material 91.

(Second insulating part)
The coil insulating portion has a second insulating portion 80, and as shown in FIG. 6, the second insulating portion 80 is provided on at least a portion of the surface of the first spiral conductive portion 11 and the surface of the second spiral conductive portion 21.

In this embodiment, the second insulating section 80 is thermoplastic and contains a thermoplastic resin including a paraxylylene-based polymer. Other examples of thermoplastic resins include polyethylene, polypropylene, polyamide, polyester, polyamideimide, polyimide, polysulfone, polycarbonate, liquid crystal polymer, polyvinylidene fluoride, polytetrafluoroethylene, etc. The second insulating section 80 as a whole only needs to have thermoplastic properties, and may contain, in addition to the above-mentioned thermoplastic resins, for example, inorganic insulating particles.

The second insulating part 80 is preferably excellent in insulation properties, and specifically, in some cases, the volume resistivity obtained by ASTM D257 is preferably 1.0×10 ¹⁴ Ωcm or more. This volume resistivity is more preferably 1.0×10 ¹⁵ Ωcm or more, and even more preferably 1.0×10 ¹⁶ Ωcm or more. The upper limit of the volume resistivity is not particularly limited. The volume resistivity may be 1.0×10 ²⁰ Ωcm or less. In addition, the second insulating part 80 is preferably excellent in dielectric properties, and specifically, in some cases, the relative dielectric constant at 60 Hz obtained by ASTM D150 is preferably 4.0 or less. This relative dielectric constant is more preferably 3.5 or less, and even more preferably 3.0 or less. The lower limit of this relative dielectric constant is not particularly limited. The relative dielectric constant may be 1.0 or more. For the measurement of the volume resistivity and the relative dielectric constant, a material corresponding to the second insulating part 80 prepared separately is prepared to a size required for the measurement and used. The material corresponding to the second insulating section 80 can be identified, as in the case of the first insulating section 90, by an analysis method such as component analysis or FT-IR.

The second insulating portion 80 has a portion that contacts the portion of the first spiral conductive portion 11 opposite the side facing the second spiral conductive portion 21, i.e., the portion of the first spiral conductive portion 11 opposite the second spiral conductive portion 21 (first opposite portion 11FA). In FIG. 6, the first inner circumferential turn 111, the first central turn 112, and the first outer circumferential turn 113, as well as the end of the first pull-out portion 14 connected to the first outer circumferential turn 113 on the Z1-Z2 direction Z1 side, are the first opposite portion 11FA, and the second insulating portion 80 provided on this first opposite portion 11FA is the above-mentioned portion.

The second insulating portion 80 has a portion that contacts the opposite portion (second opposite portion 21FA) of the second spiral conductive portion 21 relative to the first spiral conductive portion 11. In FIG. 6, the ends of the second inner turn 211, the second central turn 212, and the second outer turn 213 on the Z2 side in the Z1-Z2 direction are the second opposite portion 21FA, and the second insulating portion 80 has a portion that contacts this second opposite portion 21FA.

The second insulating portion 80 has a portion that contacts the side portion along the spiral direction of the first spiral conductive portion 11. To explain the side portion specifically using the first inner circumferential turn 111, the first inner circumferential turn 111 has a side portion facing the inner circumferential side (X1 side in the X1-X2 direction) and a side portion facing the outer circumferential side (X2 side in the X1-X2 direction) and facing the first central turn 112. The second insulating portion 80 has a portion that contacts these side portions. Note that the second insulating portion 80 is not provided on the side portion on the outer circumferential side (X2 side in the X1-X2 direction) of the other end portion 13 of the first spiral conductive portion 11 so that it can be electrically connected to another member (first terminal portion 41).

The second insulating portion 80 has a portion that contacts the side portion along the spiral direction of the second spiral conductive portion 21. To explain the side portion specifically using the second inner circumferential turn 211, the second inner circumferential turn 211 has a side portion facing the inner circumferential side (X1 side in the X1-X2 direction) and a side portion facing the outer circumferential side (X2 side in the X1-X2 direction) and facing the second central turn 212. The second insulating portion 80 has a portion that contacts these side portions. Although not shown, the second insulating portion 80 is not provided on the side portion on the outer circumferential side (X1 side in the X1-X2 direction) of the other end portion 23 of the second spiral conductive portion 21 so that it can be electrically connected to another member (second terminal portion 42).

From the viewpoint of stably realizing the provision of the second insulating portion 80 on the side portion, it may be preferable that the average width of the gap between two turns aligned in a direction (XY in-plane direction) intersecting the first direction (Z1-Z2 direction) is 0.025 to 0.25 times the average width of the two turns aligned in the alignment direction.

In the second insulating portion 80, the average thickness of the portion contacting the first opposite facing portion 11FA (the portion of the first spiral conductive portion 11 opposite to the second spiral conductive portion 21), the thickness of the portion contacting the second opposite facing portion 21FA (the portion of the second spiral conductive portion 21 opposite to the first spiral conductive portion 11), the thickness of the portion contacting the side of the first spiral conductive portion 11, and the thickness of the portion contacting the side of the second spiral conductive portion 21 may preferably be 0.2 μm or more and 10 μm or less, from the viewpoint of the second insulating portion 80 having good insulation properties. From the viewpoint of ensuring insulation properties more stably, this average value is more preferably 1.0 μm or more.

The second insulating portion 80 has a portion that contacts the opposing portion (first end 11F) of the first spiral conductive portion 11 to the second spiral conductive portion 21, and a portion that contacts the opposing portion (second end 21F) of the second spiral conductive portion 21 to the first spiral conductive portion 11. As described above, the first end 11F and the second end 21F have a non-contact portion EP that does not contact the first insulating portion 90, and at this non-contact portion EP, the first end 11F and the second end 21F contact the second insulating portion 80. This increases the contact area between the coil conductive portion 20, including the first spiral conductive portion 11 and the second spiral conductive portion 21, and the second insulating portion 80, improving the adhesion between the coil conductive portion 20 and the second insulating portion 80. In addition, by providing the non-contact portion EP, the second insulating portion 80 is provided not only on the side portion (the portion facing in a direction perpendicular to the first direction) of the first conductive portion 201, but also on the first end portion 11F and the second end portion 21F, so that the adhesion of the second insulating portion 80 to the coil conductive portion 20 is improved by the anchor effect.

The second insulating portion 80 has a first connection portion 801 located so as to connect a portion contacting a side portion of a first turn, which is at least one of the turns (in this embodiment, the first inner circumferential turn 111, the first central turn 112, and the first outer circumferential turn 113) of the first spiral conductive portion 11, and a portion contacting a side portion of a second turn in the second spiral conductive portion 21 that is closest to the side portion of the first turn. By having the first connection portion 801, it becomes easy to improve the insulation between the first spiral conductive portion 11 and the second spiral conductive portion 21. From the viewpoint of stably forming the first connection portion 801, it may be preferable that the average value of the separation distance in the first direction (Z1-Z2 direction) between the first spiral conductive portion 11 and the second spiral conductive portion 21 is 0.4 μm or more and 20 μm or less.

Taking the case where the first turn is the first inner turn 111 as a specific example, the second turn that is closest to the side of the first turn (first inner turn 111) in the second spiral conductive portion 21 becomes the second inner turn 211. The second insulating portion 80 that contacts the side of the inner side (X1 side in the X1-X2 direction) of the first inner turn 111 also contacts the non-contact portion EP that is located at the end of the inner side (X1 side in the X1-X2 direction) of the first end 11F and is a portion where the first insulating portion 90 does not contact the first end 11F. On the other hand, the second insulating portion 80 that contacts the side of the inner circumference side (X1 side in the X1-X2 direction) of the second inner circumference side turn 211 also contacts a non-contact portion EP that is located at the end of the inner circumference side (X1 side in the X1-X2 direction) of the second end portion 21F and is a portion where the first insulating portion 90 does not contact the second end portion 21F. The second insulating portion 80 that is located so as to connect the second insulating portion 80 that contacts the inner circumference side (X1 side in the X1-X2 direction) of the first inner circumference side turn 111 and the second insulating portion 80 that contacts the inner circumference side (X1 side in the X1-X2 direction) of the second inner circumference side turn 211 is the first connecting portion 801.

6 further includes a first connection portion 801 connecting a second insulating portion 80 in contact with the side portion and first end 11F of the outer circumferential side (X2 side in the X1-X2 direction) of the first inner turn 111 to a second insulating portion 80 in contact with the side portion and second end 21F of the outer circumferential side (X2 side in the X1-X2 direction) of the second inner turn 211, a first connection portion 801 connecting a second insulating portion 80 in contact with the side portion and first end 11F of the inner circumferential side (X1 side in the X1-X2 direction) of the first central turn 112 to a second insulating portion 80 in contact with the side portion and first end 21F of the inner circumferential side (X1 side in the X1-X2 direction) of the second central turn 212, A first connecting portion 801 is shown connecting the second insulating portion 80 that contacts the side portion and first end 11F of the outer periphery (X2 side in the X1-X2 direction) of the first central turn 112 to the second insulating portion 80 that contacts the side portion and second end 21F of the outer periphery (X2 side in the X1-X2 direction) of the second central turn 212, and a first connecting portion 801 that connects the second insulating portion 80 that contacts the side portion and first end 11F of the inner periphery (X1 side in the X1-X2 direction) of the first outer periphery turn 113 to the second insulating portion 80 that contacts the side portion and second end 21F of the inner periphery (X1 side in the X1-X2 direction) of the second outer periphery turn 213.

In this way, by having the first connection portion 801, it is possible to reduce the volume of the coil insulation portion, making it easier to improve the electrical characteristics of the coil component 100 and to meet the demand for miniaturization of the coil component 100.

The second insulating portion 80 that contacts the side of the outer periphery (X2 side in the X1-X2 direction) of the second outer periphery turn 213 has a second connecting portion 802 that connects the second insulating portion 80 that is in contact with the first extension portion 14P that is on the Z2 side of the Z1-Z2 direction of the first pull-out portion 14 and extends from the first end 11F of the first outer periphery turn 113, and the second insulating portion 80 that contacts the side of the outer periphery (X2 side in the X1-X2 direction) of the second outer periphery turn 213 and the second end 21F.

6 contacts a portion of the coil conductive portion 20 located inside the main body portion 30. Specifically, the second insulating portion 80 is provided so as to contact a portion of the coil conductive portion 20 other than the end (first draw-out portion end face 14E) on the outer circumferential side (X2 side in the X1-X2 direction) of the first draw-out portion 14 and the end (second draw-out portion end face 24E, not shown in FIG. 6) on the outer circumferential side (X1 side in the X1-X2 direction) of the second draw-out portion 24. This reliably prevents the coil conductive portion 20 from coming into contact with the magnetic powder, which may result in an unexpected short circuit within the coil conductive portion 20, even if the surface of the magnetic powder contained in the main body portion 30 is conductive. As described below, a first terminal portion 41 is provided so as to be in electrical contact with the first drawn-out portion end surface 14E, and a second terminal portion 42 is provided so as to be in electrical contact with the second drawn-out portion end surface 24E.

From the viewpoint of realizing a more stable prevention of short circuits in the coil conductive portion 20, it is preferable that the second insulating portion 80 in contact with the first spiral conductive portion 11 contacts the turn in a continuous manner without a connection boundary at the portion contacting the facing portion (first end portion 11F) to the second spiral conductive portion 21, the portion contacting the opposite facing portion (first opposite facing portion 11FA) to the second spiral conductive portion 21, and the portion contacting the side portion for all turns of the first spiral conductive portion 11. Similarly, it is preferable that the second insulating portion 80 in contact with the second spiral conductive portion 21 contacts the turn in a continuous manner without a connection boundary at the portion contacting the facing portion (second end portion 21F) to the first spiral conductive portion 11, the portion contacting the opposite facing portion (second opposite facing portion 21FA) to the second spiral conductive portion 21, and the portion contacting the side portion for all turns of the second spiral conductive portion 21.

(Another example of the first insulating portion)
8 is an XZ cross-sectional view for explaining another example of the first insulating portion provided in the coil component according to the embodiment of the present invention. In the example shown in FIG. 6, the first insulating portion 90 has three parts (first insulating portions 901, 902, 903) that are independent of each other in the XZ cross-sectional view, but in this embodiment, the first insulating portion 90 that contacts the first central turn 112 and the second central turn 212 and the first insulating portion 90 that contacts the first outer periphery turn 113 and the second outer periphery turn 213 are integrated (first insulating portion 904). As a result, the first insulating portion 904 has a portion that contacts the first central turn 112, a portion that contacts the first outer periphery turn 113, and a connecting portion 90c that is connected to these portions and extends in the X1-X2 direction.

FIG. 9 is an explanatory diagram of the connecting portion, and is an enlarged view of the area including the connecting portion 90c, which is indicated by the dashed circle in FIG. 8. In FIG. 9, the area in which the connecting portion 90c is located is indicated by a dotted rectangle with rounded corners. As shown in FIG. 9, the connecting portion 90c has a thin portion 90t that is thinner in the first direction (X1-X2 direction) than the portion that contacts either of the two turns in the first insulating portion 904 (in FIG. 9, the first central turn 112 and the first outer periphery turn 113, or the second central turn 212 and the second outer periphery turn 213).

The thin portion 90t forms a recess 90d in the first insulating portion 904 between the first inner circumferential turn 111 and the first central turn 112, and between the second inner circumferential turn 211 and the second central turn 212. It may be preferable that the ratio (first ratio) of the thickness Dt of the thin portion 90t in the first direction (Z1-Z2 direction) to the thickness in the first direction of the portion in contact with either of the two turns in the first insulating portion 90 is 0.60 or more. In this case, it is easy to realize that the ratio (second ratio) of the depth of the recess 90d to the thickness in the first direction (Z1-Z2 direction) of the other portion of the connecting portion 90c is 0.20 or less. The upper limit of the first ratio may be less than 1.00. The lower limit of the second ratio may be 0.010 or more. In the diagram shown in FIG. 9, the second insulating portion 80 is also provided on the surface of the thin portion 90t. Therefore, the thickness of the insulating portion consisting of the first insulating portion 90 and the second insulating portion 80 in the first direction (Z1-Z2 direction) is thicker than the thickness Dt of the thin portion 90t.

(First dummy conductive portion)
FIG. 10 is a diagram for explaining an example of a first dummy conductive portion included in a coil component according to an embodiment of the present invention. FIG. 11 is an XY plan view of FIG. 10. FIG. 12 is a diagram based on the B-B' cross section of FIG. 11. In FIG. 12, only the coil portion 10 located in the cross section of the B-B' cross section is depicted. The coil component 100 according to this embodiment may include first dummy conductive portions 71 and 72 having a non-spiral shape, as shown in FIG. 10 to FIG. 12. In this case, the first dummy conductive portion 72 faces the first lead portion 14 in the first direction (Z1-Z2 direction) with the first insulating portion 905 interposed therebetween, and has a portion in contact with the first insulating portion 905. In addition, the first dummy conductive portion 72 is spaced apart from the second conductive portion 202 (specifically, the second outer periphery turn 213) in a direction intersecting the first direction (specifically, the X1-X2 direction).

The presence of the first dummy conductive portion 72 positions a member made of a conductor in the first direction of the first pull-out portion 14, similar to the first spiral conductive portion 11. Therefore, when applying an external force along the first direction to place magnetic powder around the coil portion 10, pressure variations are unlikely to occur, and therefore deformation of the coil portion 10 is unlikely to occur. The first dummy conductive portions 71, 72 may be made of the same material as the material constituting the coil conductive portion 20, or may be made of a different material.

In addition, in this example, since there is no conductive material between the first dummy conductive portion 72 and the first pull-out portion 14, when the coil portion 10 is viewed alone, the first dummy conductive portion 72 and the first pull-out portion 14 are electrically insulated. Therefore, the first dummy conductive portion 72 is electrically insulated from both the first conductive portion 201 and the second conductive portion 202.

In FIG. 12, the end (dummy end surface portion 72E) on the outer periphery (X2 side in the X1-X2 direction) of the first dummy conductive portion 72 is exposed, but this is not limited thereto. For example, the second insulating portion 80 may be provided so as to come into contact with the dummy end surface portion 72E.

The configuration of the first dummy conductive portion 71 is the same as that of the first dummy conductive portion 72. That is, although not shown, the first dummy conductive portion 71 faces the second pull-out portion 24 in the first direction (Z1-Z2 direction) across the first insulating portion 90, has a portion in contact with the first insulating portion 90, and is spaced apart from the first conductive portion 201 (specifically, the first outer periphery turn 113) in a direction intersecting the first direction (specifically, the X1-X2 direction). By being arranged in this manner, the first dummy conductive portion 71 is also electrically insulated from both the first conductive portion 201 and the second conductive portion 202.

FIG. 13 is a diagram illustrating another example of a first dummy conductive portion provided in a coil component according to one embodiment of the present invention. FIG. 14 is an XY plan view of FIG. 13. FIG. 15 is a diagram based on the C-C' cross-sectional view of FIG. 14. In FIG. 15, only the coil portion 10 located in the cross-section of the C-C' cross-sectional view is depicted. The first dummy conductive portions 71 and 72 shown in FIGS. 13 to 15 have a basic configuration in common with the first dummy conductive portions 71 and 72 shown in FIGS. 10 to 12, but the coil portion 10 includes a dummy via portion DV1 that electrically connects the first lead-out portion 14 and the first dummy conductive portion 72, and a dummy via portion DV2 that electrically connects the second lead-out portion 24 and the first dummy conductive portion 71. As a result, the first lead-out portion 14 and the first dummy conductive portion 72 are electrically connected, and the second lead-out portion 24 and the first dummy conductive portion 71 are electrically connected. Note that in this example, the first lead-out portion 14 and the first dummy conductive portion 72 are made of a common material, and the second lead-out portion 24 and the first dummy conductive portion 71 are made of a common material, but this is not limited to the example.

In Figures 13 to 15, no insulating portion is provided at the ends (dummy end surface portions 71E, 72E) on the outer periphery side of the first dummy conductive portions 71, 72 (the X2 side in the X1-X2 direction for the first dummy conductive portion 72, and the X1 side in the X1-X2 direction for the first dummy conductive portion 71). In this case, by providing a first terminal portion 41 on the dummy end surface portion 72E in the same manner as the first drawn-out portion end surface 14E, the contact resistance between the first terminal portion 41 and the first conductive portion 201 is reduced. Also, by providing a second terminal portion 42 on the dummy end surface portion 71E in the same manner as the second drawn-out portion end surface 24E, the contact resistance between the second terminal portion 42 and the second conductive portion 202 is reduced.

FIG. 16 is a diagram illustrating another example of a first dummy conductive portion provided in a coil component according to one embodiment of the present invention. FIG. 17 is an XY plan view of FIG. 16. FIG. 18 is a diagram based on the D-D' cross-sectional view of FIG. 17. In FIG. 18, only the coil portion 10 located in the cross-section of the D-D' cross-sectional view is depicted. The first dummy conductive portions 73 and 74 shown in FIGS. 16 to 18 have a basic configuration in common with the first dummy conductive portions 71 and 72 shown in FIGS. 10 to 15, but as shown in FIGS. 16 and 17, the first dummy conductive portions 73 and 74 extend in a direction intersecting the first direction (specifically, the Y1-Y2 direction). As a result, the exposed area of the dummy end surface portion 74E is larger than the exposed area of the dummy end surface portion 72E. Therefore, in this example, the contact resistance between the first terminal portion 41 and the first conductive portion 201 is reduced more than in the previous example. Similarly, the exposed area of the dummy end surface portion 73E is larger than the exposed area of the dummy end surface portion 71E, which further reduces the contact resistance between the second terminal portion 42 and the second conductive portion 202.

(Main body)
The main body 30 contains magnetic powder and contains a part of the coil 10. In this embodiment, the main body 30 has a substantially rectangular parallelepiped shape and contains the coil 10 except for the end face of the first lead 14 on the outermost side (X2 side in the X1-X2 direction) and the end face of the second lead 24 on the outermost side (X1 side in the X1-X2 direction), which are located at the ends of the coil 10. That is, the main body 30 covers at least a part of the coil 10, and the first insulating portion 90 is embedded inside the main body 30 and is spaced apart from the surface of the main body 30, specifically, from the six side faces of the rectangular parallelepiped that forms the main body 30.

The structure of the magnetic powder is not limited. This structure may include a crystalline phase or an amorphous phase. Here, a crystalline material is defined as a material consisting of a crystalline phase, an amorphous material as a material consisting of an amorphous phase, and a composite material as a material consisting of a crystalline phase and an amorphous material. If the diffraction spectrum obtained by a general X-ray diffraction method includes a sharp diffraction peak that can identify the type of crystalline phase, the material includes a crystalline phase. If the diffraction spectrum obtained by a general X-ray diffraction method includes a broad peak indicating an amorphous phase, the material includes an amorphous phase. If the DSC curve obtained by differential thermal analysis includes a peak indicating crystallization, i.e., heat generation associated with a phase change from an amorphous phase to a crystalline phase, the material includes an amorphous phase.

The material system of the magnetic powder is not limited. Specific examples of crystalline materials include Fe-Si-Cr alloys, Fe-Ni alloys, Fe-Co alloys, Fe-V alloys, Fe-Al alloys, Fe-Si alloys, Fe-Si-Al alloys, pure iron, and ferrite. Carbonyl iron powder is preferable as pure iron powder. Specific examples of amorphous materials include Fe-Si-B alloys, Fe-P-C alloys, and Co-Fe-Si-B alloys. Specific examples of composite materials include Fe-Zr alloys, Fe-Zr-B alloys, Fe-Si-B-Nb-Cu alloys, and Fe-Si-B-P-Cu alloys. If the magnetic powder is a metal powder containing Fe, the synergistic effect of improving the magnetic properties is particularly large.

The chemical composition of the magnetic powder is not limited. For example, an Fe-Si-Cr alloy may be composed of 1.0-10.0 mass% Si, 1.0-10.0 mass% Cr, and the remainder composed of Fe and impurities. Also, for example, an Fe-Ni alloy may be composed of 1.0-99.0 mass% Ni, and the remainder composed of Fe and impurities. Furthermore, for example, an Fe-P-C alloy may be composed of 1.0-13.0 atomic% P, 1.0-13.0 atomic% C, Fe, and impurities. This Fe-P-C alloy may contain one or more optional elements selected from the group consisting of Ni, Sn, Cr, B, and Si. In this case, for example, the amount of Ni may be 0 to 10.0 atomic %, the amount of Sn may be 0 to 3.0 atomic %, the amount of Cr may be 0 to 6.0 atomic %, the amount of B may be 0 to 9.0 atomic %, and the amount of Si may be 0 to 7.0 atomic %. The amount of Fe is preferably 65 atomic % or more. Also, for example, the Fe-Si-B-Nb-Cu alloy may be composed of 1.0 to 16.0 atomic % Si, 1.0 to 15.0 atomic % B, 0.50 to 5.0 atomic % Nb, 0.50 to 5.0 atomic % Cu, and the balance consisting of Fe and impurities. In this case, the amount of Fe is preferably 65 atomic % or more.

The shape of the magnetic powder is not limited. The magnetic powder may be spherical, elliptical, scaly, or of an irregular shape. The manufacturing method for obtaining these shapes is also not limited.

The particle size distribution of the magnetic powder is not limited. The particle size distribution of the magnetic powder can be obtained, for example, by analyzing an image (secondary electron image) obtained by capturing an image of a cut surface of the main body 30 with a scanning electron microscope. For example, the average equivalent circle diameter of the magnetic powder may be 0.50 to 50.0 μm. The distribution of the equivalent circle diameter may include multiple peaks.

The magnetic powder may be subjected to a surface insulating treatment. When the magnetic powder is subjected to a surface insulating treatment, the insulation resistance of the main body 30 is improved. There is no limitation on the type of surface insulating treatment applied to the magnetic powder. Examples include phosphoric acid treatment, phosphate treatment, and oxidation treatment. The magnetic powder may have an insulating coating on the surface of the magnetic particles. This insulating coating may contain at least one selected from the group consisting of Si, P, and B, and O (oxygen).

The magnetic powder may be a mixed material in which multiple powder materials are mixed. This magnetic powder is preferably a ferromagnetic material, and more preferably a soft magnetic material.

The main body 30 may further include an optional auxiliary material. The optional auxiliary material is, for example, a binder material or a modifier. The binder material bonds particles such as magnetic powder contained in the main body 30 together. This binder material is preferably an insulating material to impart insulation resistance to the main body 30.

The binding material may be an organic material or an inorganic material. The organic material may be a resin material. Examples of the resin material include acrylic resin, silicone resin, epoxy resin, phenol resin, urea resin, melamine resin, and polyester resin. The inorganic material may be a glass-based material such as water glass. The binding material may be a product of a reaction such as thermal decomposition, or may be a mixture of multiple materials.

The modifier, for example, improves the fluidity of the powder or adjusts the hardening speed of the binder material. The modifier may be a glass-based material.

The dimensions of the main body 30 are not limited. For example, the maximum dimension of the main body 30 may be 3.2 mm or less.

(External terminal)
1 and 2, the outermost end face (X2 side in the X1-X2 direction) of first lead portion 14 (first lead portion end face 14E, see FIG. 3, etc.) and the outermost end face (X1 side in the X1-X2 direction) of second lead portion 24 (second lead portion end face 24E, see FIG. 3, etc.), which are located at the end of coil portion 10, are exposed from main body portion 30 at side faces of main body portion 30 aligned in the X1-X2 direction. A first terminal portion 41 is provided so as to be in electrical contact with first lead portion end face 14E, and a second terminal portion 42 is provided so as to be in electrical contact with second lead portion end face 24E.

The first terminal portion 41 has a side portion 41a that covers the side surface of the main body portion 30 on the X2 side in the X1-X2 direction, and a bottom portion 41b that is provided so as to cover part of the bottom surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body portion 30. The bottom portion 41b is the part that faces the board when in use. The second terminal portion 42 has a side portion 42a that covers the side surface of the main body portion 30 on the X1 side in the X1-X2 direction, and a bottom portion 42b that is provided on the bottom surface of the main body portion 30, spaced apart from the bottom portion 41b, so as to cover part of the bottom surface. The bottom portion 42b is also the part that faces the board when in use.

The positions of the first terminal portion 41 and the second terminal portion 42 are not limited to the above positions. The first terminal portion 41 and the second terminal portion 42 may be formed so as to cover a part of the upper surface (the surface on the Z1 side in the Z1-Z2 direction) of the main body portion 30. The first terminal portion 41 and the second terminal portion 42 may be provided only on a part of the bottom surface (the surface on the Z2 side in the Z1-Z2 direction) of the main body portion 30. In this case, the coil conductive portion 20 may have a connection conductive portion (not shown) that connects the two ends of the coil portion 10 (the first drawn-out portion 14, the second drawn-out portion 24) to the bottom surface of the main body portion 30 through the inside of the main body portion 30. In this case, the two ends of the coil portion 10 (the first drawn-out portion end surface 14E, the second drawn-out portion end surface 24E) may not be exposed to the side surface of the main body portion 30, and the connection conductive portion may be exposed to the bottom surface of the main body portion 30.

The material and configuration of the first terminal portion 41 and the second terminal portion 42 are not limited as long as they have appropriate conductivity. One non-limiting example of the first terminal portion 41 and the second terminal portion 42 is a layer having a structure of Cu plating/Ni plating/Sn plating from the side proximal to the surface of the main body portion 30. The first terminal portion 41 and the second terminal portion 42 may be composed of a coated electrode in which a conductive material such as silver is dispersed in a resin or the like. The first terminal portion 41 and the second terminal portion 42 may also be a combination of plating and a coated electrode.

(Exterior coat)
1, the upper surface (the surface on the Z1 side in the Z1-Z2 direction) of the main body 30 and the side surfaces aligned in the Y1-Y2 direction are each provided with an insulating exterior coating 50, 60. An insulating exterior coating may also be provided on a portion of the bottom surface of the main body 30 where the bottom surface portions 41b, 42b are not provided. Moreover, the coil component 100 may not include the exterior coating 50, 60. The exterior coatings 50, 60 can be formed at any position on the surface of the main body 30 depending on the purpose.

(Production method)
There is no particular limitation on the method for manufacturing the coil component according to the present embodiment. A non-limiting example of the manufacturing method is as follows.

FIG. 19 is an explanatory diagram (first half) of an example of a method for manufacturing a coil component according to one embodiment of the present invention, and FIG. 20 is an explanatory diagram (second half) of an example of a method for manufacturing a coil component according to one embodiment of the present invention. The method for manufacturing the coil component 100 according to this embodiment comprises the first and second steps described below, and as a more preferred specific example, further comprises the third to fifth steps.

In the first step, a first spiral conductive portion 11 is formed on one surface (specifically, the surface on the Z1 side in the Z1-Z2 direction) of an insulating sheet substrate 91 shown in FIG. 19(a), and a second spiral conductive portion 21 is formed on the other surface (specifically, the surface on the Z2 side in the Z1-Z2 direction) of the sheet substrate 91 (FIG. 19(b)). The formation process of the first spiral conductive portion 11 and the second spiral conductive portion 21 is not particularly limited. For example, they can be formed by a plating process. In this embodiment, in this formation process, the via portion VP and the first lead-out portion 14 and the second lead-out portion 24 are also formed at the same time. In this way, when the first step includes a plating process, the coil conductive portion 20 including the first conductive portion 201 includes a plating layer, i.e., a portion made of a plating deposit.

If the coil component 100 includes first dummy conductive portions 71, 72, 73, and 74 as shown in Figures 10 to 18, the first dummy conductive portions 71, 72, 73, and 74 are formed by a plating process in this first step. If the coil component 100 further includes dummy via portions DV1 and DV2 as shown in Figures 13 to 18, the dummy via portions DV1 and DV2 are formed by a plating process in this first step.

The sheet substrate 91 is not particularly limited as long as it has mechanical properties to function as a support when forming the first spiral conductive portion 11 and the second spiral conductive portion 21, and is suitable (removable) for the second step described below. Examples of materials constituting the sheet substrate 91 include organic materials, inorganic materials, and composite materials thereof. Specific examples of organic materials include thermoplastic resins such as polyimide resin and polyethylene resin, thermosetting resins such as epoxy resin and phenolic resin, and cellulose. Specific examples of inorganic materials include oxide-based materials such as glass and alumina, metal-based materials such as aluminum and magnesium, and inorganic salt-based materials such as calcium carbonate. Specific examples of composite materials include a structure in which an inorganic material is dispersed in a matrix of an organic material.

In the second step, as shown in Figure 19(c), at least a portion of the sheet substrate 91 is removed. Specifically, the sheet substrate 91 is removed so as to include a first region R1 (see Figure 19(b)), which is a region of the sheet substrate 91 that is surrounded by the inner edge of the first spiral conductive portion 11 when viewed in the first direction (Z1-Z2 direction). Figure 19(c) shows a case in which the region of the sheet substrate 91 that includes the first region R1, specifically, the region other than the portion of the coil portion 10 that is located between the portions that are aligned in the first direction (Z1-Z2 direction), has been removed. In this case, as shown in FIG. 19(b) and FIG. 19(c), the remaining portions of the sheet base material 91 between the first inner circumferential turn 111 and the second inner circumferential turn 211, between the first central turn 112 and the second central turn 212, and between the first outer circumferential turn 113 and the second outer circumferential turn 213 are the first insulating portions 901, 902, and 903, respectively. In this manufacturing example, the first insulating portion 901 is surrounded by a non-contact portion EP where the first spiral conductive portion 11 is exposed, and a non-contact portion EP where the second spiral conductive portion 21 is exposed. The non-contact portion EP is also formed in the first lead-out portion 14 and the second lead-out portion 24 due to the removal of the sheet base material 91.

If the coil component 100 includes first dummy conductive portions 71, 72, 73, and 74 as shown in Figures 10 to 18, in this second step, part or all of the sheet substrate 91 located between the first dummy conductive portions 71, 72, 73, and 74 and the first pull-out portion 14 or the second pull-out portion 24 is removed. If the coil component 100 further includes dummy via portions DV1 and DV2 as shown in Figures 13 to 18, in this second step, part or all of the sheet substrate 91 located around the dummy via portions DV1 and DV2 is removed.

The specific removal process of the sheet substrate 91 is appropriately set according to the constituent material of the sheet substrate 91. The removal process is broadly divided into dry processes such as plasma etching and wet processes such as wet etching. From the viewpoint of appropriately forming the non-contact portion EP shown in FIG. 6 to FIG. 8, wet etching capable of an isotropic removal process may be preferable. Even with wet etching, anisotropic removal processing may be possible by optimizing the composition of the etchant, and such wet etching may obtain the first insulating portions 901 and 902 having the shapes shown in FIG. 7B and FIG. 7C. The shape shown in FIG. 7B and the shape shown in FIG. 7C can be created by adjusting, for example, the degree of anisotropy (anisotropy) of the anisotropic etching and the etching time. From the viewpoint of increasing the removal efficiency of the sheet substrate 91, a wet process may be preferable. In the removal process, a part of the sheet substrate 91 may be removed, and a remaining part may not be removed. For example, the sheet substrate 91 may be made of a composite material of an organic material and an inorganic material, and only the organic material may be removed in the removal process.

In addition, by appropriately managing the amount of etching of the sheet base material 91, the entire sheet base material 91 is etched in the both-side exposed portion where both sides (Z1 side and Z2 side) in the first direction (Z1-Z2 direction) are exposed, but the sheet base material 91 can be left in the one-side exposed portion where only one side (Z1 side or Z2 side) in the first direction (Z1-Z2 direction) is exposed. Specifically, the sheet base material 91 located in the first region R1 is a both-side exposed portion, so it is entirely etched, and a through hole filled with magnetic powder is formed in the first region R1. On the other hand, the sheet base material 91 located in the portion that does not overlap with the first spiral conductive portion 11 near the via portion VP when viewed from the Z1 side in the Z1-Z2 direction in the second spiral conductive portion 21 is a one-side exposed portion, so only about half of the thickness of the sheet base material 91 is etched, and the first insulating portion 90 based on the sheet base material 91 is located in this portion (see the XZ cross-sectional view in FIG. 5A). Alternatively, the entire sheet base material 91 in one exposed area may be removed.

In the third step, as shown in Figure 20 (d), the second insulating portion 80 is formed so as to contact the exposed surfaces of the first spiral conductive portion 11 and the second spiral conductive portion 21. In this manufacturing example, as described above, non-contact portions EP are formed in each portion of the coil conductive portion 20 (first spiral conductive portion 11, second spiral conductive portion 21, first pull-out portion 14, second pull-out portion 24) in the second step, and therefore the second insulating portion 80 is formed so as to cover these non-contact portions EP. This increases the contact area between the coil conductive portion 20 and the second insulating portion 80, improving the adhesion between the coil conductive portion 20 and the second insulating portion 80. In addition, by providing the non-contact portion EP, the second insulating portion 80 is provided not only on the side portions (portions facing a direction perpendicular to the first direction) of the first conductive portion 201, etc., but also on the first end 11F and the second end 21F, so that the adhesion of the second insulating portion 80 to the coil conductive portion 20 is improved by the anchor effect.

The process for forming the second insulating section 80 is set appropriately depending on the constituent material of the second insulating section 80. For example, if the second insulating section 80 is made of a paraxylylene-based polymer, it is formed by a dry process (CVD). If the second insulating section 80 contains a curable resin material such as an epoxy resin, it can be formed by attaching a powder or liquid containing the constituent material of the second insulating section 80 to the exposed surface, and then solidifying the attached material by heating or the like.

In this example, as shown in FIG. 20(d), the second insulating portion 80 is not provided on a part of the first draw-out portion 14 in the coil portion 10, specifically the end face (first draw-out portion end face 14E) on the outermost side (X2 side in the X1-X2 direction) in this embodiment, and on a part of the second draw-out portion 24, specifically the end face (second draw-out portion end face 24E) on the outermost side (X1 side in the X1-X2 direction) in this embodiment. The part (exposed end face) on which the second insulating portion 80 is not provided can be formed, for example, by masking. Alternatively, the exposed end faces can also be formed by providing a dummy member in series to cover the first draw-out portion end face 14E and the second draw-out portion end face 24E, forming the second insulating portion 80 on the surface of the dummy member, and then cutting the dummy member to expose the first draw-out portion end face 14E and the second draw-out portion end face 24E.

In the fourth step, as shown in FIG. 20(e), a portion of the first draw-out portion 14 and the second draw-out portion 24 in the coil portion 10 (in this embodiment, as a specific example, the portions other than the first draw-out portion end face 14E and the second draw-out portion end face 24E) is sealed with a material containing magnetic powder to form the main body portion 30. The method for forming the main body portion 30 is not limited, and a molding process is exemplified. Specific examples of the molding process include placing the product of the third step in a mold and forming it by compression molding a material containing magnetic powder, or transfer molding a material containing magnetic powder or a component that is a raw material for that material.

The method of forming the main body 30 so that the first drawer end face 14E and the second drawer end face 24E are exposed from the main body 30 is not limited. For example, the first drawer end face 14E and the second drawer end face 24E may be masked before forming the main body 30. Alternatively, a dummy member may be provided in advance to cover the first drawer end face 14E and the second drawer end face 24E, the second insulating portion 80 may be formed on the surface of the dummy member, and then the main body 30 may be formed and the dummy member may be cut to expose the first drawer end face 14E and the second drawer end face 24E.

In the fifth step, as shown in FIG. 20(f), one of the two terminals (first terminal 41) is electrically connected to a part of the first draw-out portion 14 (first draw-out portion end surface 14E) that was not sealed with the material containing magnetic powder in the fourth step, and the other of the two terminals (second terminal 42) is electrically connected to a part of the second draw-out portion 24 (second draw-out portion end surface 24E). The method of forming the first terminal 41 and the second terminal 42 is not limited, and examples include a plating process and a printing process.

FIG. 21 is an explanatory diagram of another example of a manufacturing method for a coil component according to one embodiment of the present invention. In this example, the coil conductive portion 20 of the coil portion 10 is composed of a first spiral conductive portion 11 and a first pull-out portion 14. That is, in comparison with the previous example, the coil conductive portion 20 does not have a second spiral conductive portion 21 and a second pull-out portion 24, and a via portion VP. Therefore, in the first step, the first spiral conductive portion 11 and the first pull-out portion 14 are formed on one surface of the sheet base material 91 shown in FIG. 21(a), specifically, on the surface on the Z1 side in the Z1-Z2 direction (FIG. 21(b)).

In the second step, a region including the first region R1 in the sheet substrate 91 is removed. In this step, if an isotropic removal process such as wet etching is used from the viewpoint of efficiently forming the non-contact portion EP, as shown in FIG. 21(b), the entire sheet substrate 91 will be removed if the removal process is performed with one side of the sheet substrate 91, specifically the Z2 side in the Z1-Z2 direction, exposed. Therefore, as shown in FIG. 21(c), the support substrate SB is disposed so as to cover the entire surface of the Z2 side in the Z1-Z2 direction of the sheet substrate 91. It may be preferable for the surface of the support substrate SB facing the sheet substrate 91 (the Z1 side in the Z1-Z2 direction) to have a suitable adhesiveness (TAC) from the viewpoint of increasing the adhesion between the support substrate SB and the sheet substrate 91. Furthermore, if the infiltration of the etching solution between the support substrate SB and the sheet base material 91 is particularly problematic, it may be preferable to particularly increase the adhesion between the support substrate SB and the sheet base material 91, for example by applying a peelable adhesive to the surface of the support substrate SB facing the sheet base material 91 (the Z1 side in the Z1-Z2 direction).

In this way, by performing the removal process while preventing etching from proceeding from the Z2 side of the sheet base material 91 in the Z1-Z2 direction, the first region R1 is properly removed and the non-contact portion EP is properly formed (FIG. 21(d)). Next, the support substrate SB is peeled off to expose the first insulating portion 90, and thereafter, the third to fifth steps are performed in the same manner as in the previous example.

(Electronic and Electrical Equipment)
The electronic/electrical device according to one embodiment of the present invention is an electronic/electrical device in which the coil component 100 according to one embodiment of the present invention is mounted, and the coil component 100 is connected to a substrate at the first terminal portion 41 and the second terminal portion 42. The electronic/electrical device according to one embodiment of the present invention is easily miniaturized because it is mounted with the coil component 100 according to one embodiment of the present invention. Furthermore, even if a large current is passed through the device or a high frequency is applied, malfunctions caused by deterioration of the function of the coil component 100 or heat generation are unlikely to occur.

The above-described embodiments and examples are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

For example, in the above description, the coil conductive portion 20 is composed of one type of conductive material, but this is not limited to this. It may be composed of multiple materials. Figure 22 is a diagram illustrating the structure of a modified coil conductive portion provided in a coil component according to one embodiment of the present invention. In Figure 18, similar to Figure 6, only a cross section in the XZ cross section of the coil component 100 taken along line A-A' is shown. As shown in Figure 22, the first spiral conductive portion 11 constituting the coil conductive portion 20 is composed of a main conductive portion 11a and a sub-conductive portion 11b arranged to include the side of the main conductive portion 11a facing the second spiral conductive portion 21 (the Z2 side in the Z1-Z2 direction), i.e., the first end portion 11F. In FIG. 22, the first inner turn 111 consists of a main conductive portion 111a and a sub-conductive portion 111b, the first central turn 112 consists of a main conductive portion 112a and a sub-conductive portion 112b, and the first outer turn 113 consists of a main conductive portion 113a and a sub-conductive portion 113b.

Similarly, the second spiral conductive portion 21 constituting the coil conductive portion 20 is composed of a main conductive portion 21a and a sub-conductive portion 21b arranged on the side of the main conductive portion 21a facing the first spiral conductive portion 11 (the Z1 side in the Z1-Z2 direction), i.e., including the second end portion 21F. In Figure 22, the second inner turn 211 is composed of a main conductive portion 211a and a sub-conductive portion 211b, the second central turn 212 is composed of a main conductive portion 212a and a sub-conductive portion 212b, and the second outer turn 213 is composed of a main conductive portion 213a and a sub-conductive portion 213b. Furthermore, the first lead-out portion 14 constituting the coil conductive portion 20 is composed of a main conductive portion 14a and a sub-conductive portion 14b provided on the side of the main conductive portion 14a that is closer to the second spiral conductive portion 21 in the first direction (the Z2 side in the Z1-Z2 direction). Although not shown, the second lead-out portion 24 also consists of a main conductive portion and a sub-conductive portion.

Examples of the constituent materials of the main conductive portions 11a, 21a, 14a include conductive materials such as copper, copper alloys, aluminum, and aluminum alloys, and examples of the constituent materials of the sub-conductive portions 11b, 21b, 14b include conductive materials such as materials containing Ni and Cr. By having the sub-conductive portions 11b, 21b, 14b, the smoothness of the first end 11F of the first spiral conductive portion 11 and the smoothness of the second end 21F of the second spiral conductive portion 21 may be improved.

When at least a portion of the main conductive portions 11a, 21a, 14a is formed by an electroplating process, the sub-conductive portions 11b, 21b, 14b may function as a seed layer for performing the electroplating process. That is, a conductive layer including the sub-conductive portions 11b, 21b, 14b is provided on the main surface of the sheet substrate 91, and a pattern in which the sub-conductive portions 11b, 21b, 14b are exposed is formed by providing a negative pattern on this conductive layer, for example. At least a portion of the main conductive portions 11a, 21a, 14a can be formed by performing an electroplating process in which electricity is passed through this exposed pattern and depositing a plating deposit on the exposed pattern.

The main conductive portions 11a, 21a, 14a may be formed by multiple film formation processes. For example, a plating deposit may be formed on the exposed pattern of the sub-conductive portions 11b, 21b, 14b formed by providing a negative pattern as described above, and then the negative pattern and the conductive layer covered by the negative pattern may be removed to expose the plating deposit except for the portions in contact with the sub-conductive portions 11b, 21b, 14b. An electric current may be passed through this plating deposit to perform an electroplating process, and further plating deposits may be deposited on the exposed portions of the plating deposit to form the main conductive portions 11a, 21a, 14a.

100: coil component 10: coil portion 11: first spiral conductive portion 11a, 14a, 21a, 111a, 112a, 113a, 211a, 212a, 213a: main conductive portion 11b, 14b, 21b, 111b, 112b, 113b, 211b, 212b, 213b: sub-conductive portion 11FA: first opposite portion 11F: first end portion 12, 13, 22, 23: end portion 14: first lead-out portion 14E: first lead-out portion end surface 14P: first extension portion 20: coil conductive portion 21: second spiral conductive portion 21FA: second opposite portion 21F: second end portion 24: second lead-out portion 24E : second lead-out portion end face 30 : main body portion 41 : first terminal portion 41a, 42a : side portion 41b, 42b : bottom surface portion 42 : second terminal portion 50, 60 : exterior coating 71, 72, 73, 74 : first dummy conductive portion 71E, 72E, 73E, 74E : dummy end face portion 80 : second insulating portion 801 : first connecting portion 802 : second connecting portion 90 : first insulating portion 90c : connecting portion 90d : recess 90t : thin portion 91 : sheet substrate 111 : first inner periphery side turn 112 : first central turn 113 : first outer periphery side turn 201 : first conductive portion 202 : second conductive portion 211 : second inner periphery side turn 212 : second central turn 213 : second outer circumferential turn 901, 902, 903, 904, 905 : first insulating portion DV1, DV2 : dummy via portion Cp : corner portion Dc : diameter Dt : thickness of thin portion EP : non-contact portion Le : envelope Le1 : dashed line Lp : inner edge Lp1 : dashed line O : axis R1 : first region SB : supporting substrate Sp : side portions t1 to t3 : thickness VP : via portion Wx : average dimension

Claims (19)

A method for manufacturing a coil component including a coil section including: a first conductive section having a first spiral conductive section that describes a spiral around an axis along a first direction; and a first insulating section in contact with at least a part of a first end section that is one of ends of the first conductive section on the first direction side, the method comprising:
A first step of forming the first conductive portion on one surface of a sheet base material including the first insulating portion;
a second step of removing at least a portion of the sheet base material to remove the first insulating portion located in a first region of the sheet base material that is a region surrounded by an inner edge of the first spiral conductive portion when viewed in the first direction;
A method for manufacturing a coil component, comprising: The method for manufacturing a coil component according to claim 1, wherein in the second step, a portion of the first insulating portion that contacts the first end is removed to form a non-contact portion at the first end that does not contact the first insulating portion. The method for manufacturing a coil component according to claim 1, wherein in the second step, when viewed in the first direction, the envelope of the inner edge of the first insulating portion that contacts the turn that constitutes the inner edge of the first spiral conductive portion incorporates the inner edge of the first spiral conductive portion. The method for manufacturing a coil component according to claim 2 or 3, further comprising a third step of forming a second insulating portion after the second step so as to contact at least the exposed surface of the first spiral conductive portion. the first spiral conductive portion has two turns aligned in a direction intersecting the first direction,
The first insulating portion is
a portion that contacts one of the two turns;
a portion of the two turns that contacts the other of the two turns;
A connecting portion connected to these portions and extending in a direction intersecting the first direction;
having
4. The method for manufacturing a coil component according to claim 2, wherein the connecting portion has a thin portion having a thickness in the first direction smaller than a portion of the first insulating portion that contacts either of the two turns. The method for manufacturing a coil component according to claim 5, wherein the ratio of the thickness of the thin portion in the first direction to the thickness of the portion of the first insulating portion that contacts one of the two turns in the first direction is 0.60 or more. In the first step, a first dummy conductive portion having a non-spiral shape is also formed on the one surface of the sheet base material,
4. The method for manufacturing a coil component according to claim 2, wherein in the second step, at least a portion of the sheet base material located between the first dummy conductive portion and the first conductive portion is removed. A coil component including a coil section including: a first conductive section having a first spiral conductive section that describes a spiral around an axis along a first direction; and a first insulating section that contacts at least a part of a first end section that is one of the ends of the first conductive section on the first direction side,
A coil component characterized in that the first end has a non-contact portion at a corner connected to a side portion of the first conductive portion along the first direction, where the first insulating portion is not provided. The coil component according to claim 8, wherein, when viewed in the first direction, the envelope of the inner edge of the portion of the first insulating portion that contacts the turn that constitutes the inner edge of the first spiral conductive portion encompasses the inner edge of the first spiral conductive portion. The coil component according to claim 8 or claim 9, having a second insulating portion in contact with the surface of the first spiral conductive portion. the first spiral conductive portion has two turns aligned in a direction intersecting the first direction,
The first insulating portion is
a portion that contacts one of the two turns;
a portion of the two turns that contacts the other of the two turns;
A connecting portion connected to these portions and extending in a direction intersecting the first direction;
having
10. The coil component according to claim 8, wherein the connecting portion has a thin portion having a thickness in the first direction smaller than a portion of the first insulating portion that contacts either of the two turns. The coil component according to claim 11, wherein the ratio of the thickness in the first direction of the recess formed by the thin portion to the thickness in the first direction of the portion of the first insulating portion that contacts either of the two turns is 0.60 or more. the coil portion further includes a second conductive portion and a via portion electrically connecting the first conductive portion and the second conductive portion,
the first conductive portion has a first lead-out portion electrically connected to the via portion at one end of the first spiral conductive portion and electrically connected to the other end of the first spiral conductive portion;
The second conductive portion is
a second spiral conductive portion aligned with the first spiral conductive portion along the first direction and electrically connected at one end to the via portion;
a second lead portion electrically connected to the other end of the second spiral conductive portion;
having
When a connection portion to the via portion is used as a starting point, the first spiral conductive portion and the second spiral conductive portion spiral in opposite directions to each other,
10. The coil component according to claim 8, wherein a portion of the first insulating portion that contacts one of the ends of the first spiral conductive portion on the first direction side contacts one of the ends of the second spiral conductive portion on the first direction side on an opposite side to the side that contacts the first spiral conductive portion. The coil component according to claim 13, wherein the coil portion has a portion that faces the first lead-out portion in the first direction across the first insulating portion, that contacts the first insulating portion, and that is provided with a first dummy conductive portion that is spaced apart from the second conductive portion in a direction that intersects with the first direction. The coil component according to claim 14, wherein the coil portion includes a dummy via portion that electrically connects the first lead-out portion and the first dummy conductive portion. The coil component according to claim 14, wherein the first dummy conductive portion is electrically insulated from the first lead-out portion. The magnetic coil further includes a main body portion that contains magnetic powder and covers at least a portion of the coil portion.
14. The coil component according to claim 13, wherein when viewed in the first direction, the coil component has a diameter that is half the average longitudinal dimension of the main body portion when viewed in the first direction, and an inner edge of the first spiral conductive portion and an inner edge of the second spiral conductive portion overlap outside a circular region centered on the center of the via portion. The magnetic coil further includes a main body portion that contains magnetic powder and covers at least a portion of the coil portion.
The coil component according to claim 8 or 9, wherein the first insulating portion is embedded inside the main body portion and spaced apart from a surface of the main body portion. An electronic/electrical device in which the coil component according to claim 13 is mounted, the coil component being connected to a substrate at terminals provided on the first draw-out portion and the second draw-out portion, respectively.

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