WO2024204593A1 - Liquid-crystalline resin composition - Google Patents
Liquid-crystalline resin composition Download PDFInfo
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- WO2024204593A1 WO2024204593A1 PCT/JP2024/012765 JP2024012765W WO2024204593A1 WO 2024204593 A1 WO2024204593 A1 WO 2024204593A1 JP 2024012765 W JP2024012765 W JP 2024012765W WO 2024204593 A1 WO2024204593 A1 WO 2024204593A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones
Definitions
- the present invention relates to a liquid crystalline resin composition.
- Liquid crystal resins have a good balance of excellent mechanical strength, heat resistance, chemical resistance, and electrical properties, as well as excellent dimensional stability, and are therefore widely used as high-performance engineering plastics.
- information and communications including mobile phones; wireless LANs; and ITS technologies such as GPS, VICS (registered trademark), and ETC.
- ITS technologies such as GPS, VICS (registered trademark), and ETC.
- high-performance electronic components that can be used in high-frequency ranges such as microwaves and millimeter waves.
- the materials that make up such electronic components are required to have appropriate dielectric properties according to the design of each electronic component.
- Patent Document 1 discloses a molded article of a wholly aromatic liquid crystal polyester resin composition having a relative dielectric constant of 3.0 or less and a dielectric dissipation factor of 0.04 or less, which is obtained by injection molding a composition containing 90 to 45% by weight of a wholly aromatic liquid crystal polyester with a melting point of 320°C or more, 10 to 40% by weight of inorganic hollow spheres with an aspect ratio of 2 or less, and 0 to 15% by weight of an inorganic filler with an aspect ratio of 4 or more.
- the molded article has heat resistance such as resistance to solder reflow, excellent dielectric properties, and is used as a fixing or holding member for transmitting and receiving parts of information and communication devices used in high frequency bands such as microwaves and millimeter waves.
- Packages for electronic components are often colored black so that discoloration due to aging is less noticeable.
- a liquid crystalline resin composition containing carbon black is preferably used.
- conventional liquid crystalline resin compositions containing carbon black have a significantly high dielectric tangent, and there is room for improvement in the dielectric properties.
- the present invention has been made to solve the above problems, and its purpose is to provide a liquid crystalline resin composition that has a low dielectric constant, a low dielectric tangent, and excellent blackness.
- a liquid crystalline resin composition containing a liquid crystalline resin, hollow filler, and carbon black in a specified content in which the carbon black has a number average particle size of 20 to 100 nm, has a low dielectric constant and a low dielectric tangent, and is excellent in blackness, leading to the completion of the present invention. More specifically, the present invention provides the following.
- a liquid crystal resin composition containing (A) a liquid crystal resin, (B) a hollow filler, and (C) carbon black, in which the content of the (B) hollow filler is 5 to 85 parts by mass, the content of the (C) carbon black is 0.1 to 7 parts by mass, and the number average particle diameter of the (C) carbon black is 20 to 100 nm, relative to 100 parts by mass of the (A) liquid crystal resin.
- liquid crystal resin composition according to (1) wherein the (A) liquid crystal resin is an aromatic polyester or aromatic polyester amide having as a constituent a structural unit derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof.
- the present invention provides a liquid crystal resin composition that has a low dielectric constant, a low dielectric tangent, and excellent blackness.
- FIG. 1 is a top view showing the cutting positions of test pieces for evaluating dielectric characteristics used in the examples and comparative examples.
- the liquid crystal resin composition according to the present invention contains (A) a liquid crystal resin, (B) a hollow filler, and (C) carbon black, and the number average particle diameter of the carbon black is 20 to 100 nm. It is.
- the liquid crystal resin (A) used in the present invention refers to a melt-processable polymer having a property capable of forming an optically anisotropic molten phase. More specifically, the anisotropic molten phase can be confirmed by a polarized light inspection method using a Leitz polarizing microscope, and a molten sample placed on a Leitz hot stage is observed at a magnification of 40 times under a nitrogen atmosphere. When the liquid crystal polymer applicable to the present invention is examined between crossed polarizers, it usually transmits polarized light even in a molten and stationary state, and exhibits optical anisotropy. .
- the type of liquid crystal resin (A) as described above is not particularly limited, but is preferably an aromatic polyester and/or an aromatic polyester amide. Polyesters that partially contain aromatic polyesters and/or aromatic polyester amides in the same molecular chain are also included in this range.
- the liquid crystal resin (A) one that has an inherent viscosity (I.V.) of preferably at least about 2.0 dl/g, and more preferably 2.0 to 10.0 dl/g when dissolved in pentafluorophenol at a concentration of 0.1% by mass at 60°C is preferably used.
- the aromatic polyester or aromatic polyesteramide as the liquid crystal resin (A) applicable to the present invention is particularly preferably an aromatic polyester or aromatic polyesteramide having as a constituent component a constituent unit derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof.
- the content of the constituent units derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and their derivatives is preferably 45 mol% or more, more preferably 50 mol% or more, even more preferably 55 mol% or more, even more preferably 60 mol% or more, and particularly preferably 62 mol% or more, based on all the constituent units, from the viewpoint of suppressing fluctuations in the molecular structure of (A) liquid crystal resin.
- the upper limit of the content is not particularly limited, and may be 100 mol% or less, 90 mol% or less, 80 mol% or less, 75 mol% or less, or 70 mol% or less, based on all the constituent units.
- aromatic hydroxycarboxylic acids such as 4-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid
- aromatic diols such as 2,6-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 4,4'-dihydroxybiphenyl, hydroquinone, resorcin, compounds represented by the following general formula (I) and compounds represented by the following general formula (II)
- aromatic dicarboxylic acids such as 1,4-phenylenedicarboxylic acid, 1,3-phenylenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 2,6-naphthalenedicarboxylic acid and compounds represented by the following general formula (III); aromatic amines such as p-aminophenol, p-phenylenediamine and N-acetyl-p-aminophenol.
- aromatic hydroxycarboxylic acid and its derivatives 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, or a combination thereof are preferred from the viewpoints of reactivity and stability of the molecular structure of the liquid crystal resin (A).
- X is a group selected from alkylene (C 1 to C 4 ), alkylidene, —O—, —SO—, —SO 2 —, —S—, and —CO—.
- the liquid crystal resin (A) used in the present invention can be prepared by a known method using direct polymerization or transesterification from the above monomer compound (or mixture of monomers). Usually, melt polymerization, solution polymerization, slurry polymerization, solid-phase polymerization, or a combination of two or more of these methods is used, and melt polymerization or a combination of melt polymerization and solid-phase polymerization is preferably used.
- melt polymerization, solution polymerization, slurry polymerization, solid-phase polymerization, or a combination of two or more of these methods is used, and melt polymerization or a combination of melt polymerization and solid-phase polymerization is preferably used.
- the above compounds capable of forming esters may be used in the polymerization in their original form, or may be modified from a precursor to a derivative capable of forming the ester at a stage prior to polymerization.
- catalysts can be used in these polymerizations, and representative examples include metal salt catalysts such as potassium acetate, magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, antimony trioxide, and tris(2,4-pentanedionato)cobalt(III), and organic compound catalysts such as 1-methylimidazole and 4-dimethylaminopyridine.
- the amount of catalyst used is generally about 0.001 to 1% by mass, and preferably about 0.01 to 0.2% by mass, based on the total mass of the monomers. If necessary, the molecular weight of the polymer produced by these polymerization methods can be further increased by solid-phase polymerization, in which the polymer is heated under reduced pressure or in an inert gas.
- the melt viscosity of the liquid crystal resin (A) obtained by the above method is not particularly limited.
- a resin having a melt viscosity at the molding temperature of 3 Pa ⁇ s to 500 Pa ⁇ s at a shear rate of 1000 sec -1 can be used.
- a resin having a viscosity that is too high is not preferred because it significantly deteriorates the flowability.
- the liquid crystal resin (A) may be a mixture of two or more kinds of liquid crystal resins.
- (B) Hollow filler is generally called balloon, and examples of the material of the hollow filler include inorganic materials such as alumina, silica, glass, and shirasu. Among them, glass and silica are preferred from the viewpoint of heat resistance and strength, and glass is more preferred. That is, glass balloons and silica balloons are preferably used as the hollow filler, and glass balloons are more preferably used.
- (B) component may be used alone or in combination of two or more kinds.
- the aspect ratio of the hollow filler is preferably 1.15 or more, more preferably 1.20 to 2.00, even more preferably 1.22 to 1.50, and even more preferably 1.25 to less than 1.30.
- the aspect ratio is determined by measuring the maximum length L, which is the length of the longest part on the particle projection plane, and the maximum perpendicular length S, which is the length of the longest part in the direction perpendicular to the maximum length L on the particle projection plane, for 3,000 particles using a dynamic image analysis method/particle state analyzer, and repeating the measurement several times to obtain the average value of the ratio L/S calculated for each particle.
- the median diameter of component (B) is preferably 5 ⁇ m or more, more preferably 10 ⁇ m or more, from the viewpoint of moldability, and is preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less, and even more preferably 50 ⁇ m or less, from the viewpoint of suppressing breakage of component (B) and moldability.
- the median diameter refers to the volume-based median value measured by a laser diffraction/scattering particle size distribution measurement method.
- the content of the (B) component is 5 to 85 parts by mass, preferably 7 to 65 parts by mass, and more preferably 10 to 45 parts by mass, per 100 parts by mass of the (A) liquid crystal resin.
- the content of the (B) component is 20 parts by mass or more, it is easy to obtain a liquid crystal resin composition with excellent dielectric properties.
- the content of the (B) component is 75 parts by mass or less, it is easy to obtain a liquid crystal resin composition with good fluidity.
- the carbon black (C) used in the present invention may be any commonly available carbon black used for resin coloring, as long as it has a number average particle diameter of 20 to 100 nm, without any particular restrictions.
- the (C) component may be used alone or in combination of two or more types.
- the number average particle diameter is determined by observing the carbon black with a transmission electron microscope in accordance with ASTM D3849-14a and measuring the particle diameter of 100 carbon black particles, and averaging the measured values.
- the number average particle diameter of component (C) is 20 to 100 nm, preferably 22 to 92 nm, more preferably 24 to 84 nm, even more preferably 26 to 76 nm, even more preferably 28 to 68 nm, and particularly preferably 30 to 60 nm.
- the number average particle diameter of component (C) is 20 nm or more, it is easy to obtain a liquid crystal resin composition having a low dielectric tangent.
- the number average particle diameter of component (C) is 100 nm or less, it is easy to obtain a liquid crystal resin composition with good fluidity.
- the content of the (C) component is 0.1 to 7 parts by mass, preferably 0.3 to 6.5 parts by mass, and more preferably 0.5 to 6 parts by mass, relative to 100 parts by mass of the (A) liquid crystal resin.
- the content of the (C) component is 0.1 parts by mass or more, the blackness of the resulting resin composition is less likely to decrease.
- the content of the (C) component is 7 parts by mass or less, it is easy to obtain a liquid crystal resin composition with good fluidity.
- the liquid crystal resin composition according to the present invention may optionally contain (D) a filler other than (C) hollow filler and (C) carbon black.
- the (D) component may be used alone or in combination of two or more kinds.
- the (D) component may be an inorganic filler or an organic filler. Examples of the (D) component include a plate-like filler, a fibrous filler, and a granular filler.
- the molded article made of the liquid crystalline resin composition is likely to have improved mechanical strength such as flexural modulus and is likely to be suppressed from warping.
- the plate-like filler may be used alone or in combination of two or more kinds.
- the plate-like filler preferably has a median diameter of 15 to 50 ⁇ m. If the median diameter is 15 ⁇ m or more, the necessary mechanical strength is more likely to be ensured, and the molded body is more likely to have a high warping suppression effect. If the median diameter is 50 ⁇ m or less, the fluidity of the composition when melted is more likely to be improved. The preferred median diameter is 20 to 30 ⁇ m.
- the plate-like filler is not particularly limited, and examples thereof include mica, talc, glass flakes, graphite, various metal foils (e.g., aluminum foil, iron foil, copper foil), etc. In the present invention, it is preferable to use mica as the plate-like filler.
- the molded article made of the liquid crystalline resin composition is likely to have improved mechanical strength such as flexural modulus.
- the fibrous filler can be used alone or in combination of two or more.
- the average fiber length of the fibrous filler is not particularly limited, and may be, for example, 250 ⁇ m or more, preferably 350 to 600 ⁇ m, and more preferably 450 to 500 ⁇ m.
- the molded body made of the liquid crystal resin composition of the present invention is likely to have improved mechanical strength and heat resistance.
- the liquid crystal resin composition is likely to have sufficient fluidity.
- the average fiber length of the fibrous filler is determined by importing 10 stereomicroscope images of the fibrous filler from a CCD camera into a PC, and measuring the fiber length of 100 fibrous fillers per stereomicroscope image, i.e., a total of 1,000 fibrous fillers, using an image processing method with an image measuring device.
- the average fiber length of the fibrous filler in the liquid crystal resin composition is measured by applying the above method to the fibrous filler remaining after heating the liquid crystal resin composition at 600° C. for 2 hours to incinerate it.
- the fiber diameter of the fibrous filler is not particularly limited, and may be, for example, 20 ⁇ m or less, or 5 to 15 ⁇ m.
- the fiber diameter of the fibrous filler is determined by observing the fibrous filler with a scanning electron microscope and measuring the fiber diameter of 30 fibrous fillers.
- the fiber diameter of the fibrous filler in the liquid crystalline resin composition is measured by applying the above method to the fibrous filler remaining after the liquid crystalline resin composition is heated at 600°C for 2 hours to incinerate it.
- any fiber can be used as long as it satisfies the above shape requirements, but examples of fibrous fillers include inorganic fibrous materials such as glass fiber, milled fiber, carbon fiber, asbestos fiber, silica fiber, silica-alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, potassium titanate fiber, and fibrous materials made of metals such as stainless steel, aluminum, titanium, copper, and brass.
- glass fiber it is preferable to use glass fiber as the fibrous filler from the viewpoint of mechanical strength.
- the molded article made of the liquid crystalline resin composition is likely to have improved mechanical strength such as flexural modulus and is likely to be inhibited from surface whitening.
- the granular filler may be used alone or in combination of two or more kinds.
- the median diameter of the granular filler is preferably 0.3 to 5.0 ⁇ m. If the median diameter is 0.3 ⁇ m or more, the impact resistance of the molded body is likely to be maintained. If the median diameter is 5.0 ⁇ m or less, the effect of suppressing surface whitening of the molded body is likely to be enhanced. The median diameter is more preferably 0.5 to 5.0 ⁇ m, and even more preferably 0.5 to 4.0 ⁇ m.
- the median diameter of the granular filler in the liquid crystalline resin composition is a value measured for the granular filler remaining after the liquid crystalline resin composition is incinerated by heating at 600°C for 2 hours.
- Granular fillers include, for example, metal oxides such as silica, quartz powder, glass beads, glass powder, potassium aluminum silicate, diatomaceous earth, iron oxide, titanium oxide, zinc oxide, and alumina; metal carbonates such as calcium carbonate and magnesium carbonate; metal sulfates such as calcium sulfate and barium sulfate; phosphates such as calcium pyrophosphate and anhydrous dicalcium phosphate; silicon carbide; silicon nitride; and boron nitride.
- metal oxides such as silica, quartz powder, glass beads, glass powder, potassium aluminum silicate, diatomaceous earth, iron oxide, titanium oxide, zinc oxide, and alumina
- metal carbonates such as calcium carbonate and magnesium carbonate
- metal sulfates such as calcium sulfate and barium sulfate
- phosphates such as calcium pyrophosphate and anhydrous dicalcium phosphate
- silicon carbide silicon nitride
- the present invention from the viewpoints of suppressing surface whitening of the molded body and reducing dust generation of the molded body, it is preferable to use one or more types selected from the group consisting of silica and barium sulfate as the granular filler, and it is more preferable to use silica.
- the content of the (D) component is preferably 2 to 15 parts by mass, more preferably 5 to 12 parts by mass, and even more preferably 7 to 10 parts by mass, relative to 100 parts by mass of the (A) liquid crystal resin.
- the content of the (D) component is within the above range, the flowability of the liquid crystal resin composition is sufficiently ensured, and the mechanical strength of the molded article made of the liquid crystal resin composition is likely to be improved.
- liquid crystal resin composition according to the present invention, other polymers and known substances generally added to synthetic resins, i.e., stabilizers such as antioxidants and ultraviolet absorbers, antistatic agents, flame retardants, colorants such as dyes and pigments, lubricants, release agents, crystallization accelerators, crystal nucleating agents, etc., can be appropriately added according to the required performance, within the scope not impairing the effects of the present invention.
- stabilizers such as antioxidants and ultraviolet absorbers, antistatic agents, flame retardants, colorants such as dyes and pigments, lubricants, release agents, crystallization accelerators, crystal nucleating agents, etc.
- colorants such as dyes and pigments
- lubricants lubricants
- release agents such as crystallization accelerators, crystal nucleating agents, etc.
- the preparation of the liquid crystal resin composition according to the present invention is not particularly limited.
- the liquid crystal resin composition is prepared by blending the (A) component, the (B) component, the (C) component, optionally the (D) component, and optionally other components, and melt-kneading the mixture using a single-screw or twin-screw extruder.
- the melt viscosity of the liquid crystalline resin composition according to the present invention obtained as described above is preferably 100 Pa ⁇ sec or less, more preferably 90 Pa ⁇ sec or less, and further preferably 100 Pa ⁇ sec or less, from the viewpoint of flowability.
- the lower limit of the melt viscosity is not particularly limited, and may be 5 Pa ⁇ sec or more, 10 Pa ⁇ sec or more, or 20 Pa ⁇ sec or more.
- the value is measured at a cylinder temperature 10 to 30° C. higher than the melting point of the resin and at a shear rate of 1000 sec ⁇ 1 in accordance with a measurement method in accordance with ISO 11443.
- the relative dielectric constant of the liquid crystal resin composition according to the present invention at a measurement frequency of 5 GHz is preferably 4.0 or less, more preferably 3.9 or less, and even more preferably 3.8 or less, from the viewpoint of dielectric properties.
- the lower limit of the above relative dielectric constant is not particularly limited, and may be more than 1.0, 1.5 or more, or 2.0 or more.
- the dielectric loss tangent of the liquid crystal resin composition according to the present invention at a measurement frequency of 5 GHz is preferably 0.0067 or less, more preferably 0.0065 or less, and even more preferably 0.0063 or less, from the viewpoint of dielectric properties.
- the lower limit of the dielectric loss tangent is not particularly limited, and may be 0.001 or more, 0.0015 or more, or 0.0017 or more.
- the L value of the liquid crystal resin composition according to the present invention is preferably 60 or less, more preferably 50 or less, and even more preferably 45 or less, from the viewpoint of blackness.
- the lower limit of the L value is not particularly limited, and may be 0 or more, 5 or more, or 10 or more.
- the obtained pellets were subjected to heat treatment at 300°C for 3 hours under a nitrogen stream to obtain the target polymer.
- the melting point of the obtained polymer was 348°C, and the melt viscosity at 370°C was 9 Pa ⁇ s.
- the melting point of the above polymer was measured according to the melting point measurement method described later, and the melt viscosity of the above polymer was measured in the same manner as the melt viscosity measurement method described later.
- HNA 6-Hydroxy-2-naphthoic acid
- HBA 4-Hydroxybenzoic acid
- TA 1,4-Phenylenedicarboxylic acid
- BP 4,4'-dihydroxybiphenyl
- Metal catalyst potassium acetate catalyst: 165 mg Acylating agent (acetic anhydride): 1432 g
- Aromatic polyester amide The following raw materials were charged into a polymerization vessel, and the temperature of the reaction system was raised to 140°C and reacted at 140°C for 1 hour. Thereafter, the temperature was further raised to 340°C over 4.5 hours, and the pressure was reduced to 10 Torr (i.e., 1330 Pa) over 15 minutes, and melt polymerization was carried out while distilling out acetic acid, excess acetic anhydride, and other low boiling points. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure state and then to a pressurized state, and the polymer was discharged from the bottom of the polymerization vessel, and the strands were pelletized to obtain pellets.
- 10 Torr i.e. 1330 Pa
- the obtained pellets were subjected to heat treatment at 300°C for 2 hours under a nitrogen stream to obtain the target polymer.
- the melting point of the obtained polymer was 336°C, and the melt viscosity at 350°C was 19.0 Pa ⁇ s.
- the melting point of the above polymer was measured according to the melting point measurement method described later, and the melt viscosity of the above polymer was measured in the same manner as the melt viscosity measurement method described later.
- HBA 4-Hydroxybenzoic acid
- HNA 6-Hydroxy-2-naphthoic acid
- TA 1,4-phenylenedicarboxylic acid
- BP 4,4'-dihydroxybiphenyl
- APAP N-acetyl-p-aminophenol
- Metal catalyst potassium acetate catalyst: 110 mg Acylating agent (acetic anhydride): 1659 g
- Tm1 endothermic peak temperature observed when the liquid crystalline resin was heated from room temperature at a temperature increase rate of 20°C/min was measured, and then the resin was held at a temperature of (Tm1+40)°C for 2 minutes, cooled to room temperature at a temperature decrease rate of 20°C/min, and then heated again at a temperature increase rate of 20°C/min to measure the endothermic peak temperature (Tm2), which was determined as the melting point of the polymer.
- melt viscosity of the liquid crystal resin was measured in accordance with ISO 11443 using a Capillograph 1B model manufactured by Toyo Seiki Seisakusho Co., Ltd. at a temperature 10 to 30° C. higher than the melting point of the liquid crystal resin, using an orifice with an inner diameter of 1 mm and a length of 20 mm, at a shear rate of 1000/sec.
- the specific measurement temperatures were 370° C. for aromatic polyester and 350° C. for aromatic polyesteramide.
- ⁇ Dielectric properties> The pellets of the examples and comparative examples were molded under the following molding conditions using a molding machine ("SE-100DU” manufactured by Sumitomo Heavy Industries, Ltd.) to prepare flat test pieces of 80 mm x 80 mm x 1 mm. As shown in FIG. 1, a test piece of 80 mm x 1 mm x 1 mm was cut out from the center of the flat test piece in the flow direction, and this was used as a test piece for evaluating dielectric properties. The relative dielectric constant and dielectric loss tangent of this test piece at a measurement frequency of 5 GHz were measured using a cavity resonator perturbation method complex dielectric constant evaluation device manufactured by Kanto Electronics Application Development Co., Ltd. and having the following configuration.
- the liquid crystal resin composition of the example had a low dielectric constant and a low dielectric tangent, and was excellent in blackness.
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Abstract
Description
本発明は、液晶性樹脂組成物に関する。 The present invention relates to a liquid crystalline resin composition.
液晶性樹脂は、優れた機械的強度、耐熱性、耐薬品性、電気的性質等をバランス良く有し、優れた寸法安定性も有するため高機能エンジニアリングプラスチックとして広く利用されている。一方、近年、携帯電話;無線LAN;GPS、VICS(登録商標)、ETC等のITS技術等の情報通信分野において著しい技術発達がなされている。これに応じて、マイクロ波、ミリ波等の高周波領域において適用できる高性能な高周波対応電子部品のニーズが強くなっている。このような電子部品を構成する材料は、個々の電子部品の設計に応じて、適切な誘電特性を有することが求められている。 Liquid crystal resins have a good balance of excellent mechanical strength, heat resistance, chemical resistance, and electrical properties, as well as excellent dimensional stability, and are therefore widely used as high-performance engineering plastics. Meanwhile, in recent years, there has been remarkable technological development in the field of information and communications, including mobile phones; wireless LANs; and ITS technologies such as GPS, VICS (registered trademark), and ETC. In response to this, there is a growing need for high-performance electronic components that can be used in high-frequency ranges such as microwaves and millimeter waves. The materials that make up such electronic components are required to have appropriate dielectric properties according to the design of each electronic component.
例えば、特許文献1には、融点320℃以上の全芳香族液晶ポリエステル90~45重量%、アスペクト比が2以下の無機球状中空体10~40重量%、アスペクト比が4以上の無機充填剤0~15重量%を配合した組成物を射出成形して得られる、比誘電率が3.0以下、誘電正接が0.04以下の全芳香族液晶ポリエステル樹脂組成物成形体が、耐ハンダリフロー等の耐熱性を有し、誘電特性に優れ、マイクロ波、ミリ波等の高周波帯域で用いられる情報通信機器の送受信部品の固定あるいは保持部材に用いられる成形体が開示されている。 For example, Patent Document 1 discloses a molded article of a wholly aromatic liquid crystal polyester resin composition having a relative dielectric constant of 3.0 or less and a dielectric dissipation factor of 0.04 or less, which is obtained by injection molding a composition containing 90 to 45% by weight of a wholly aromatic liquid crystal polyester with a melting point of 320°C or more, 10 to 40% by weight of inorganic hollow spheres with an aspect ratio of 2 or less, and 0 to 15% by weight of an inorganic filler with an aspect ratio of 4 or more. The molded article has heat resistance such as resistance to solder reflow, excellent dielectric properties, and is used as a fixing or holding member for transmitting and receiving parts of information and communication devices used in high frequency bands such as microwaves and millimeter waves.
上述のような高周波対応電子部品を含め、電子部品のパッケージは、例えば、経年劣化に伴う変色が目立ちにくいよう、黒く着色されることが多い。黒く着色された上記パッケージを作製するためには、例えば、カーボンブラックを含有する液晶性樹脂組成物が好適に用いられる。しかし、本発明者らの検討によれば、カーボンブラックを含有する従来の液晶性樹脂組成物は、誘電正接が著しく高く、誘電特性に改善の余地があることが判明した。 Packages for electronic components, including the above-mentioned high-frequency compatible electronic components, are often colored black so that discoloration due to aging is less noticeable. To produce the above-mentioned packages colored black, for example, a liquid crystalline resin composition containing carbon black is preferably used. However, according to the studies of the present inventors, it was found that conventional liquid crystalline resin compositions containing carbon black have a significantly high dielectric tangent, and there is room for improvement in the dielectric properties.
本発明は、上記課題を解決するためになされたものであり、その目的は、低誘電率及び低誘電正接を有し、黒色度に優れる液晶性樹脂組成物を提供することにある。 The present invention has been made to solve the above problems, and its purpose is to provide a liquid crystalline resin composition that has a low dielectric constant, a low dielectric tangent, and excellent blackness.
本発明者らは、上記課題を解決するために鋭意研究を重ねた。その結果、液晶性樹脂と、中空フィラーと、カーボンブラックとを所定の含有量で含有し、カーボンブラックの数平均粒子径が20~100nmである液晶性樹脂組成物は、低誘電率及び低誘電正接を有し、黒色度に優れることを見出し、本発明を完成するに至った。より具体的には本発明は以下のものを提供する。 The inventors have conducted extensive research to solve the above problems. As a result, they have discovered that a liquid crystalline resin composition containing a liquid crystalline resin, hollow filler, and carbon black in a specified content, in which the carbon black has a number average particle size of 20 to 100 nm, has a low dielectric constant and a low dielectric tangent, and is excellent in blackness, leading to the completion of the present invention. More specifically, the present invention provides the following.
(1) (A)液晶性樹脂、(B)中空フィラー、及び(C)カーボンブラックを含有し、前記(A)液晶性樹脂100質量部に対して、前記(B)中空フィラーの含有量は、5~85質量部、前記(C)カーボンブラックの含有量は、0.1~7質量部であり、前記(C)カーボンブラックの数平均粒子径は、20~100nmである液晶性樹脂組成物。 (1) A liquid crystal resin composition containing (A) a liquid crystal resin, (B) a hollow filler, and (C) carbon black, in which the content of the (B) hollow filler is 5 to 85 parts by mass, the content of the (C) carbon black is 0.1 to 7 parts by mass, and the number average particle diameter of the (C) carbon black is 20 to 100 nm, relative to 100 parts by mass of the (A) liquid crystal resin.
(2) 前記(A)液晶性樹脂は、芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位を構成成分として有する芳香族ポリエステル又は芳香族ポリエステルアミドである(1)に記載の液晶性樹脂組成物。 (2) The liquid crystal resin composition according to (1), wherein the (A) liquid crystal resin is an aromatic polyester or aromatic polyester amide having as a constituent a structural unit derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof.
(3) 前記(B)中空フィラーは、ガラスバルーンを含む(1)又は(2)に記載の液晶性樹脂組成物。 (3) The liquid crystal resin composition according to (1) or (2), wherein the hollow filler (B) contains glass balloons.
(4) 測定周波数5GHzにおける誘電正接は、0.0067以下である(1)~(3)のいずれかに記載の液晶性樹脂組成物。 (4) A liquid crystal resin composition according to any one of (1) to (3), in which the dielectric tangent at a measurement frequency of 5 GHz is 0.0067 or less.
本発明によれば、低誘電率及び低誘電正接を有し、黒色度に優れる液晶性樹脂組成物を提供することができる。 The present invention provides a liquid crystal resin composition that has a low dielectric constant, a low dielectric tangent, and excellent blackness.
以下、本発明の実施形態について説明する。なお、本発明は以下の実施形態に限定されない。 The following describes an embodiment of the present invention. Note that the present invention is not limited to the following embodiment.
<液晶性樹脂組成物>
本発明に係る液晶性樹脂組成物は、(A)液晶性樹脂、(B))中空フィラー、及び(C)カーボンブラックを含有し、(C)カーボンブラックの数平均粒子径は、20~100nmである。
<Liquid crystal resin composition>
The liquid crystal resin composition according to the present invention contains (A) a liquid crystal resin, (B) a hollow filler, and (C) carbon black, and the number average particle diameter of the carbon black is 20 to 100 nm. It is.
[(A)液晶性樹脂]
本発明で使用する(A)液晶性樹脂とは、光学異方性溶融相を形成し得る性質を有する溶融加工性ポリマーを指す。異方性溶融相の性質は、直交偏光子を利用した慣用の偏光検査法により確認することが出来る。より具体的には、異方性溶融相の確認は、Leitz偏光顕微鏡を使用し、Leitzホットステージに載せた溶融試料を窒素雰囲気下で40倍の倍率で観察することにより実施できる。本発明に適用できる液晶性ポリマーは直交偏光子の間で検査したときに、たとえ溶融静止状態であっても偏光は通常透過し、光学的に異方性を示す。
[(A) Liquid crystalline resin]
The liquid crystal resin (A) used in the present invention refers to a melt-processable polymer having a property capable of forming an optically anisotropic molten phase. More specifically, the anisotropic molten phase can be confirmed by a polarized light inspection method using a Leitz polarizing microscope, and a molten sample placed on a Leitz hot stage is observed at a magnification of 40 times under a nitrogen atmosphere. When the liquid crystal polymer applicable to the present invention is examined between crossed polarizers, it usually transmits polarized light even in a molten and stationary state, and exhibits optical anisotropy. .
上記のような(A)液晶性樹脂の種類としては特に限定されず、芳香族ポリエステル及び/又は芳香族ポリエステルアミドであることが好ましい。また、芳香族ポリエステル及び/又は芳香族ポリエステルアミドを同一分子鎖中に部分的に含むポリエステルもその範囲にある。(A)液晶性樹脂としては、60℃でペンタフルオロフェノールに濃度0.1質量%で溶解したときに、好ましくは少なくとも約2.0dl/g、更に好ましくは2.0~10.0dl/gの対数粘度(I.V.)を有するものが好ましく使用される。 The type of liquid crystal resin (A) as described above is not particularly limited, but is preferably an aromatic polyester and/or an aromatic polyester amide. Polyesters that partially contain aromatic polyesters and/or aromatic polyester amides in the same molecular chain are also included in this range. As the liquid crystal resin (A), one that has an inherent viscosity (I.V.) of preferably at least about 2.0 dl/g, and more preferably 2.0 to 10.0 dl/g when dissolved in pentafluorophenol at a concentration of 0.1% by mass at 60°C is preferably used.
本発明に適用できる(A)液晶性樹脂としての芳香族ポリエステル又は芳香族ポリエステルアミドは、特に好ましくは、芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位を構成成分として有する芳香族ポリエステル又は芳香族ポリエステルアミドである。 The aromatic polyester or aromatic polyesteramide as the liquid crystal resin (A) applicable to the present invention is particularly preferably an aromatic polyester or aromatic polyesteramide having as a constituent component a constituent unit derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof.
より具体的には、
(1)主として芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位からなるポリエステル;
(2)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(b)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、からなるポリエステル;
(3)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(b)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(c)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、からなるポリエステル;
(4)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、からなるポリエステルアミド;
(5)主として(a)芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(b)芳香族ヒドロキシアミン、芳香族ジアミン、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(c)芳香族ジカルボン酸、脂環族ジカルボン酸、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、(d)芳香族ジオール、脂環族ジオール、脂肪族ジオール、及びそれらの誘導体からなる群より選ばれる少なくとも1種に由来する構成単位と、からなるポリエステルアミド等が挙げられる。更に上記の構成成分に必要に応じ分子量調整剤を併用してもよい。
More specifically,
(1) A polyester mainly composed of structural units derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof;
(2) A polyester mainly composed of (a) a structural unit derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof, and (b) a structural unit derived from at least one selected from the group consisting of aromatic dicarboxylic acids, alicyclic dicarboxylic acids, and derivatives thereof;
(3) A polyester mainly composed of (a) a structural unit derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof, (b) a structural unit derived from at least one selected from the group consisting of aromatic dicarboxylic acids, alicyclic dicarboxylic acids, and derivatives thereof, and (c) a structural unit derived from at least one selected from the group consisting of aromatic diols, alicyclic diols, aliphatic diols, and derivatives thereof;
(4) A polyesteramide mainly composed of (a) a structural unit derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and derivatives thereof, (b) a structural unit derived from at least one selected from the group consisting of aromatic hydroxyamines, aromatic diamines, and derivatives thereof, and (c) a structural unit derived from at least one selected from the group consisting of aromatic dicarboxylic acids, alicyclic dicarboxylic acids, and derivatives thereof;
(5) polyesteramides mainly composed of (a) at least one constituent unit selected from the group consisting of aromatic hydroxycarboxylic acids and their derivatives, (b) at least one constituent unit selected from the group consisting of aromatic hydroxyamines, aromatic diamines and their derivatives, (c) at least one constituent unit selected from the group consisting of aromatic dicarboxylic acids, alicyclic dicarboxylic acids and their derivatives, and (d) at least one constituent unit selected from the group consisting of aromatic diols, alicyclic diols, aliphatic diols and their derivatives. If necessary, a molecular weight modifier may be used in combination with the above constituents.
(A)液晶性樹脂において、芳香族ヒドロキシカルボン酸及びその誘導体からなる群より選ばれる少なくとも1種に由来する構成単位の含有量は、(A)液晶性樹脂の分子構造が変動するのを低く抑える観点から、全構成単位に対し、好ましくは45モル%以上であり、より好ましくは50モル%以上であり、更により好ましくは55モル%以上であり、一層更により好ましくは60モル%以上であり、特に好ましくは62モル%以上である。上記含有量の上限は、特に限定されず、全構成単位に対し、100モル%以下でよく、90モル%以下、80モル%以下、75モル%以下、又は70モル%以下でもよい。 In (A) liquid crystal resin, the content of the constituent units derived from at least one selected from the group consisting of aromatic hydroxycarboxylic acids and their derivatives is preferably 45 mol% or more, more preferably 50 mol% or more, even more preferably 55 mol% or more, even more preferably 60 mol% or more, and particularly preferably 62 mol% or more, based on all the constituent units, from the viewpoint of suppressing fluctuations in the molecular structure of (A) liquid crystal resin. The upper limit of the content is not particularly limited, and may be 100 mol% or less, 90 mol% or less, 80 mol% or less, 75 mol% or less, or 70 mol% or less, based on all the constituent units.
本発明に適用できる(A)液晶性樹脂を構成する具体的化合物の好ましい例としては、4-ヒドロキシ安息香酸、6-ヒドロキシ-2-ナフトエ酸等の芳香族ヒドロキシカルボン酸;2,6-ジヒドロキシナフタレン、1,4-ジヒドロキシナフタレン、4,4’-ジヒドロキシビフェニル、ハイドロキノン、レゾルシン、下記一般式(I)で表される化合物、及び下記一般式(II)で表される化合物等の芳香族ジオール;1,4-フェニレンジカルボン酸、1,3-フェニレンジカルボン酸、4,4’-ジフェニルジカルボン酸、2,6-ナフタレンジカルボン酸、及び下記一般式(III)で表される化合物等の芳香族ジカルボン酸;p-アミノフェノール、p-フェニレンジアミン、N-アセチル-p-アミノフェノール等の芳香族アミン類が挙げられる。前述の芳香族ヒドロキシカルボン酸及びその誘導体としては、反応性や(A)液晶性樹脂の分子構造の安定性等の観点から、4-ヒドロキシ安息香酸、6-ヒドロキシ-2-ナフトエ酸、又はこれらの組み合わせが好ましい。
本発明に用いられる(A)液晶性樹脂の調製は、上記のモノマー化合物(又はモノマーの混合物)から直接重合法やエステル交換法を用いて公知の方法で行うことができ、通常は溶融重合法、溶液重合法、スラリー重合法、固相重合法等、又はこれらの2種以上の組み合わせが用いられ、溶融重合法、又は溶融重合法と固相重合法との組み合わせが好ましく用いられる。エステル形成能を有する上記化合物類はそのままの形で重合に用いてもよく、また、重合の前段階で前駆体から該エステル形成能を有する誘導体に変性されたものでもよい。これらの重合に際しては種々の触媒の使用が可能であり、代表的なものとしては、酢酸カリウム、酢酸マグネシウム、酢酸第一錫、テトラブチルチタネート、酢酸鉛、酢酸ナトリウム、三酸化アンチモン、トリス(2,4-ペンタンジオナト)コバルト(III)等の金属塩系触媒、1-メチルイミダゾール、4-ジメチルアミノピリジン等の有機化合物系触媒が挙げられる。触媒の使用量は一般にはモノマーの全質量に対して約0.001~1質量%、特に約0.01~0.2質量%が好ましい。これらの重合方法により製造されたポリマーは更に必要があれば、減圧又は不活性ガス中で加熱する固相重合法により分子量の増加を図ることができる。 The liquid crystal resin (A) used in the present invention can be prepared by a known method using direct polymerization or transesterification from the above monomer compound (or mixture of monomers). Usually, melt polymerization, solution polymerization, slurry polymerization, solid-phase polymerization, or a combination of two or more of these methods is used, and melt polymerization or a combination of melt polymerization and solid-phase polymerization is preferably used. The above compounds capable of forming esters may be used in the polymerization in their original form, or may be modified from a precursor to a derivative capable of forming the ester at a stage prior to polymerization. Various catalysts can be used in these polymerizations, and representative examples include metal salt catalysts such as potassium acetate, magnesium acetate, stannous acetate, tetrabutyl titanate, lead acetate, sodium acetate, antimony trioxide, and tris(2,4-pentanedionato)cobalt(III), and organic compound catalysts such as 1-methylimidazole and 4-dimethylaminopyridine. The amount of catalyst used is generally about 0.001 to 1% by mass, and preferably about 0.01 to 0.2% by mass, based on the total mass of the monomers. If necessary, the molecular weight of the polymer produced by these polymerization methods can be further increased by solid-phase polymerization, in which the polymer is heated under reduced pressure or in an inert gas.
上記のような方法で得られた(A)液晶性樹脂の溶融粘度は特に限定されない。一般には成形温度での溶融粘度が剪断速度1000sec-1で3Pa・s以上500Pa・s以下のものが使用可能である。しかし、それ自体あまり高粘度のものは流動性が非常に悪化するため好ましくない。なお、上記(A)液晶性樹脂は2種以上の液晶性樹脂の混合物であってもよい。 The melt viscosity of the liquid crystal resin (A) obtained by the above method is not particularly limited. In general, a resin having a melt viscosity at the molding temperature of 3 Pa·s to 500 Pa·s at a shear rate of 1000 sec -1 can be used. However, a resin having a viscosity that is too high is not preferred because it significantly deteriorates the flowability. The liquid crystal resin (A) may be a mixture of two or more kinds of liquid crystal resins.
[(B)中空フィラー]
(B)中空フィラーは、一般にバルーンと呼ばれているものであり、中空フィラーの材料としては、例えば、アルミナ、シリカ、ガラス、シラス等の無機材料が挙げられる。中でも、耐熱性や強度の観点からガラス及びシリカが好ましく、ガラスがより好ましい。即ち、中空フィラーとしては、ガラスバルーン及びシリカバルーンが好適に用いられ、ガラスバルーンがより好適に用いられる。(B)成分は、単独で用いても、2種以上を併用してもよい。
[(B) Hollow filler]
(B) hollow filler is generally called balloon, and examples of the material of the hollow filler include inorganic materials such as alumina, silica, glass, and shirasu. Among them, glass and silica are preferred from the viewpoint of heat resistance and strength, and glass is more preferred. That is, glass balloons and silica balloons are preferably used as the hollow filler, and glass balloons are more preferably used. (B) component may be used alone or in combination of two or more kinds.
(B)中空フィラーのアスペクト比は、溶融粘度上昇及び流動性悪化の抑制並びに成形性等の観点から、好ましくは1.15以上であり、より好ましくは1.20以上2.00以下であり、更により好ましくは1.22以上1.50以下であり、一層更により好ましくは1.25以上1.30未満である。本明細書において、アスペクト比としては、動的画像解析法/粒子状態分析計を用いて、粒子投影面において最も長い部分の長さである最大長Lと、粒子投影面において最大長Lに対し垂直な方向で最も長い部分の長さである最大垂直長Sとを3000個の粒子について測定し、その測定を数回繰り返して、各粒子について計算された比L/Sの平均の値を採用する。 (B) From the viewpoint of suppressing an increase in melt viscosity and deterioration of fluidity, as well as moldability, the aspect ratio of the hollow filler is preferably 1.15 or more, more preferably 1.20 to 2.00, even more preferably 1.22 to 1.50, and even more preferably 1.25 to less than 1.30. In this specification, the aspect ratio is determined by measuring the maximum length L, which is the length of the longest part on the particle projection plane, and the maximum perpendicular length S, which is the length of the longest part in the direction perpendicular to the maximum length L on the particle projection plane, for 3,000 particles using a dynamic image analysis method/particle state analyzer, and repeating the measurement several times to obtain the average value of the ratio L/S calculated for each particle.
(B)成分のメディアン径は、成形性の観点から、5μm以上であることが好ましく、より好ましくは10μm以上であり、(B)成分の破壊抑制や成形性の観点から、好ましくは200μm以下、より好ましくは100μm以下、更により好ましくは50μm以下である。なお、本明細書において、メディアン径とは、レーザー回折/散乱式粒度分布測定法で測定した体積基準の中央値をいう。 The median diameter of component (B) is preferably 5 μm or more, more preferably 10 μm or more, from the viewpoint of moldability, and is preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less, from the viewpoint of suppressing breakage of component (B) and moldability. In this specification, the median diameter refers to the volume-based median value measured by a laser diffraction/scattering particle size distribution measurement method.
(B)成分の含有量は、(A)液晶性樹脂100質量部に対して、5~85質量部であり、好ましくは7~65質量部であり、より好ましくは10~45質量部である。(B)成分の含有量が20質量部以上であると、誘電特性に優れた液晶性樹脂組成物を得やすい。(B)成分の含有量が75質量部以下であると、流動性の良好な液晶性樹脂組成物を得やすい。 The content of the (B) component is 5 to 85 parts by mass, preferably 7 to 65 parts by mass, and more preferably 10 to 45 parts by mass, per 100 parts by mass of the (A) liquid crystal resin. When the content of the (B) component is 20 parts by mass or more, it is easy to obtain a liquid crystal resin composition with excellent dielectric properties. When the content of the (B) component is 75 parts by mass or less, it is easy to obtain a liquid crystal resin composition with good fluidity.
[(C)カーボンブラック] [(C) Carbon black]
本発明に用いる(C)カーボンブラックは、数平均粒子径が20~100nmである限り、樹脂着色に用いられる一般的に入手可能なものを、特に制限なく、使用することができる。(C)成分は、単独で用いても、2種以上を併用してもよい。なお、本明細書において、数平均粒子径としては、ASTM D3849-14aに準拠して、カーボンブラックを透過型電子顕微鏡で観察し、100個のカーボンブラックについて粒子径を測定した値の平均を採用する。 The carbon black (C) used in the present invention may be any commonly available carbon black used for resin coloring, as long as it has a number average particle diameter of 20 to 100 nm, without any particular restrictions. The (C) component may be used alone or in combination of two or more types. In this specification, the number average particle diameter is determined by observing the carbon black with a transmission electron microscope in accordance with ASTM D3849-14a and measuring the particle diameter of 100 carbon black particles, and averaging the measured values.
(C)成分の数平均粒子径は、20~100nmであり、好ましくは22~92nm、より好ましくは24~84nm、更により好ましくは26~76nm、一層更により好ましくは28~68nm、特に好ましくは30~60nmである。(C)成分の数平均粒子径が20nm以上であると、低誘電正接を有する液晶性樹脂組成物を得やすい。(C)成分の数平均粒子径が100nm以下であると、流動性の良好な液晶性樹脂組成物を得やすい。 The number average particle diameter of component (C) is 20 to 100 nm, preferably 22 to 92 nm, more preferably 24 to 84 nm, even more preferably 26 to 76 nm, even more preferably 28 to 68 nm, and particularly preferably 30 to 60 nm. When the number average particle diameter of component (C) is 20 nm or more, it is easy to obtain a liquid crystal resin composition having a low dielectric tangent. When the number average particle diameter of component (C) is 100 nm or less, it is easy to obtain a liquid crystal resin composition with good fluidity.
(C)成分の含有量としては、(A)液晶性樹脂100質量部に対して、0.1~7質量部であり、好ましくは0.3~6.5質量部であり、より好ましくは0.5~6質量部である。(C)成分の含有量が0.1質量部以上であると、得られる樹脂組成物の黒色度が低下しにくい。(C)成分の含有量が7質量部以下であると、流動性の良好な液晶性樹脂組成物を得やすい。 The content of the (C) component is 0.1 to 7 parts by mass, preferably 0.3 to 6.5 parts by mass, and more preferably 0.5 to 6 parts by mass, relative to 100 parts by mass of the (A) liquid crystal resin. When the content of the (C) component is 0.1 parts by mass or more, the blackness of the resulting resin composition is less likely to decrease. When the content of the (C) component is 7 parts by mass or less, it is easy to obtain a liquid crystal resin composition with good fluidity.
[(D)(B)中空フィラー及び(C)カーボンブラックを除くフィラー]
本発明に係る液晶性樹脂組成物は、任意に(D)(C)中空フィラー及び(C)カーボンブラックを除くフィラーを含有してもよい。該液晶性樹脂組成物が(D)成分を含有すると、該液晶性樹脂組成物の成形体は曲げ弾性率等の機械的強度が向上しやすい。(D)成分は、単独で用いても、2種以上を併用してもよい。(D)成分は、無機フィラーでも有機フィラーでもよい。(D)成分としては、例えば、板状充填剤、繊維状充填剤、粒状充填剤等が挙げられる。
[(D) Fillers other than (B) hollow filler and (C) carbon black]
The liquid crystal resin composition according to the present invention may optionally contain (D) a filler other than (C) hollow filler and (C) carbon black. When the liquid crystal resin composition contains the (D) component, the molded article of the liquid crystal resin composition is likely to have improved mechanical strength such as bending modulus. The (D) component may be used alone or in combination of two or more kinds. The (D) component may be an inorganic filler or an organic filler. Examples of the (D) component include a plate-like filler, a fibrous filler, and a granular filler.
(板状充填剤)
本発明に係る液晶性樹脂組成物が板状充填剤を含有すると、該液晶性樹脂組成物からなる成形体は、曲げ弾性率等の機械的強度が向上しやすく、反りが抑制されやすい。板状充填剤は、単独で用いても、2種以上を併用してもよい。
(Plate-like filler)
When the liquid crystalline resin composition according to the present invention contains a plate-like filler, the molded article made of the liquid crystalline resin composition is likely to have improved mechanical strength such as flexural modulus and is likely to be suppressed from warping. The plate-like filler may be used alone or in combination of two or more kinds.
板状充填剤は、メディアン径が15~50μmであることが好ましい。上記メディアン径が15μm以上であると、必要な機械的強度が確保されやすく、成形体の反り抑制効果が高くなりやすい。上記メディアン径が50μm以下であると、組成物の溶融時の流動性が向上しやすい。好ましい上記メディアン径は20~30μmである。 The plate-like filler preferably has a median diameter of 15 to 50 μm. If the median diameter is 15 μm or more, the necessary mechanical strength is more likely to be ensured, and the molded body is more likely to have a high warping suppression effect. If the median diameter is 50 μm or less, the fluidity of the composition when melted is more likely to be improved. The preferred median diameter is 20 to 30 μm.
板状充填剤としては、特に限定されず、例えば、マイカ、タルク、ガラスフレーク、黒鉛、各種の金属箔(例えば、アルミ箔、鉄箔、銅箔)等が挙げられる。本発明においては板状充填剤として、マイカを使用することが好ましい。 The plate-like filler is not particularly limited, and examples thereof include mica, talc, glass flakes, graphite, various metal foils (e.g., aluminum foil, iron foil, copper foil), etc. In the present invention, it is preferable to use mica as the plate-like filler.
(繊維状充填剤)
本発明に係る液晶性樹脂組成物が繊維状充填剤を含有すると、該液晶性樹脂組成物からなる成形体は、曲げ弾性率等の機械的強度が向上しやすい。繊維状充填剤は、1種単独で又は2種以上組み合わせて使用することができる。
(Fibrous filler)
When the liquid crystalline resin composition according to the present invention contains a fibrous filler, the molded article made of the liquid crystalline resin composition is likely to have improved mechanical strength such as flexural modulus. The fibrous filler can be used alone or in combination of two or more.
繊維状充填剤の平均繊維長は、特に限定されず、例えば、250μm以上でよく、好ましくは350~600μmであり、より好ましくは450~500μmである。上記平均繊維長が250μm以上であると、本発明の液晶性樹脂組成物からなる成形体は、機械的強度及び耐熱性が向上しやすい。上記平均繊維長が600μm以下であると、液晶性樹脂組成物の流動性が十分となりやすい。なお、本明細書において、繊維状充填剤の平均繊維長としては、繊維状充填剤の実体顕微鏡画像10枚をCCDカメラからPCに取り込み、画像測定機によって画像処理手法により、実体顕微鏡画像1枚ごとに100本の繊維状充填剤、即ち、合計1000本の繊維状充填剤について繊維長を測定した値の平均を採用する。液晶性樹脂組成物中の繊維状充填剤の平均繊維長は、液晶性樹脂組成物を600℃で2時間の加熱により灰化して残存した繊維状充填剤について、上記方法を適用することで測定される。 The average fiber length of the fibrous filler is not particularly limited, and may be, for example, 250 μm or more, preferably 350 to 600 μm, and more preferably 450 to 500 μm. When the average fiber length is 250 μm or more, the molded body made of the liquid crystal resin composition of the present invention is likely to have improved mechanical strength and heat resistance. When the average fiber length is 600 μm or less, the liquid crystal resin composition is likely to have sufficient fluidity. In this specification, the average fiber length of the fibrous filler is determined by importing 10 stereomicroscope images of the fibrous filler from a CCD camera into a PC, and measuring the fiber length of 100 fibrous fillers per stereomicroscope image, i.e., a total of 1,000 fibrous fillers, using an image processing method with an image measuring device. The average fiber length of the fibrous filler in the liquid crystal resin composition is measured by applying the above method to the fibrous filler remaining after heating the liquid crystal resin composition at 600° C. for 2 hours to incinerate it.
繊維状充填剤の繊維径としては、特に限定されず、例えば、20μm以下でよく、5~15μmでもよい。なお、本明細書において、繊維状充填剤の繊維径としては、繊維状充填剤を走査型電子顕微鏡で観察し、30本の繊維状充填剤について繊維径を測定した値の平均を採用する。液晶性樹脂組成物中の繊維状充填剤の繊維径は、液晶性樹脂組成物を600℃で2時間の加熱により灰化して残存した繊維状充填剤について、上記方法を適用することで測定される。 The fiber diameter of the fibrous filler is not particularly limited, and may be, for example, 20 μm or less, or 5 to 15 μm. In this specification, the fiber diameter of the fibrous filler is determined by observing the fibrous filler with a scanning electron microscope and measuring the fiber diameter of 30 fibrous fillers. The fiber diameter of the fibrous filler in the liquid crystalline resin composition is measured by applying the above method to the fibrous filler remaining after the liquid crystalline resin composition is heated at 600°C for 2 hours to incinerate it.
以上の形状を満足する繊維状充填剤であれば、何れの繊維も用いることができるが、繊維状充填剤としては、例えば、ガラス繊維、ミルドファイバー、カーボン繊維、アスベスト繊維、シリカ繊維、シリカ・アルミナ繊維、ジルコニア繊維、窒化硼素繊維、窒化硅素繊維、硼素繊維、チタン酸カリウム繊維、更にステンレス、アルミニウム、チタン、銅、真鍮等の金属の繊維状物等の無機質繊維状物質が挙げられる。本発明においては、機械的強度の観点から、繊維状充填剤として、ガラス繊維を使用することが好ましい。 Any fiber can be used as long as it satisfies the above shape requirements, but examples of fibrous fillers include inorganic fibrous materials such as glass fiber, milled fiber, carbon fiber, asbestos fiber, silica fiber, silica-alumina fiber, zirconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, potassium titanate fiber, and fibrous materials made of metals such as stainless steel, aluminum, titanium, copper, and brass. In the present invention, it is preferable to use glass fiber as the fibrous filler from the viewpoint of mechanical strength.
(粒状充填剤)
本発明に係る液晶性樹脂組成物が粒状充填剤を含有すると、該液晶性樹脂組成物からなる成形体は、曲げ弾性率等の機械的強度が向上しやすく、表面白化が抑制されやすい。粒状充填剤は、1種単独で又は2種以上組み合わせて使用することができる。
(Granular filler)
When the liquid crystalline resin composition according to the present invention contains a granular filler, the molded article made of the liquid crystalline resin composition is likely to have improved mechanical strength such as flexural modulus and is likely to be inhibited from surface whitening. The granular filler may be used alone or in combination of two or more kinds.
粒状充填剤のメディアン径は、好ましくは0.3~5.0μmである。上記メディアン径が0.3μm以上であると、成形体の耐衝撃性が維持されやすい。上記メディアン径が5.0μm以下であると、成形体の表面白化抑制効果が高くなりやすい。上記メディアン径は、より好ましくは0.5~5.0μmであり、更により好ましくは0.5~4.0μmである。液晶性樹脂組成物中の粒状充填剤のメディアン径は、液晶性樹脂組成物を600℃で2時間の加熱により灰化して残存した粒状充填剤について測定した値である。 The median diameter of the granular filler is preferably 0.3 to 5.0 μm. If the median diameter is 0.3 μm or more, the impact resistance of the molded body is likely to be maintained. If the median diameter is 5.0 μm or less, the effect of suppressing surface whitening of the molded body is likely to be enhanced. The median diameter is more preferably 0.5 to 5.0 μm, and even more preferably 0.5 to 4.0 μm. The median diameter of the granular filler in the liquid crystalline resin composition is a value measured for the granular filler remaining after the liquid crystalline resin composition is incinerated by heating at 600°C for 2 hours.
粒状充填剤としては、例えば、シリカ、石英粉末、ガラスビーズ、ガラス粉、硅酸カリウムアルミニウム、珪藻土、酸化鉄、酸化チタン、酸化亜鉛、アルミナ等の金属酸化物;炭酸カルシウム、炭酸マグネシウム等の金属炭酸塩;硫酸カルシウム、硫酸バリウム等の金属硫酸塩;ピロリン酸カルシウム、無水リン酸二カルシウム等のリン酸塩;炭化硅素;窒化硅素;窒化硼素等が挙げられる。本発明においては、成形体の表面白化抑制及び成形体の低発塵性の観点から、粒状充填剤として、シリカ及び硫酸バリウムからなる群より選択される1種以上を使用することが好ましく、シリカを使用することがより好ましい。 Granular fillers include, for example, metal oxides such as silica, quartz powder, glass beads, glass powder, potassium aluminum silicate, diatomaceous earth, iron oxide, titanium oxide, zinc oxide, and alumina; metal carbonates such as calcium carbonate and magnesium carbonate; metal sulfates such as calcium sulfate and barium sulfate; phosphates such as calcium pyrophosphate and anhydrous dicalcium phosphate; silicon carbide; silicon nitride; and boron nitride. In the present invention, from the viewpoints of suppressing surface whitening of the molded body and reducing dust generation of the molded body, it is preferable to use one or more types selected from the group consisting of silica and barium sulfate as the granular filler, and it is more preferable to use silica.
(D)成分の含有量は、(A)液晶性樹脂100質量部に対して、好ましくは2~15質量部であり、より好ましくは5~12質量部であり、更により好ましくは7~10質量部である。(D)成分の含有量が上記範囲内であると、液晶性樹脂組成物の流動性が十分に確保されつつ、液晶性樹脂組成物からなる成形体の機械的強度が向上しやすい。 The content of the (D) component is preferably 2 to 15 parts by mass, more preferably 5 to 12 parts by mass, and even more preferably 7 to 10 parts by mass, relative to 100 parts by mass of the (A) liquid crystal resin. When the content of the (D) component is within the above range, the flowability of the liquid crystal resin composition is sufficiently ensured, and the mechanical strength of the molded article made of the liquid crystal resin composition is likely to be improved.
[その他の成分]
本発明に係る液晶性樹脂組成物には、本発明の効果を害さない範囲で、その他の重合体、一般に合成樹脂に添加される公知の物質、即ち、酸化防止剤や紫外線吸収剤等の安定剤、帯電防止剤、難燃剤、染料や顔料等の着色剤、潤滑剤、離型剤、結晶化促進剤、結晶核剤等も要求性能に応じ適宜添加することができる。その他の重合体とは、(A)液晶性樹脂以外の重合体をいい、例えば、エポキシ基含有共重合体が挙げられる。
[Other ingredients]
To the liquid crystal resin composition according to the present invention, other polymers and known substances generally added to synthetic resins, i.e., stabilizers such as antioxidants and ultraviolet absorbers, antistatic agents, flame retardants, colorants such as dyes and pigments, lubricants, release agents, crystallization accelerators, crystal nucleating agents, etc., can be appropriately added according to the required performance, within the scope not impairing the effects of the present invention. The other polymers refer to polymers other than the (A) liquid crystal resin, and examples thereof include epoxy group-containing copolymers.
[液晶性樹脂組成物の調製]
本発明に係る液晶性樹脂組成物の調製は特に限定されない。例えば、(A)成分、(B)成分、(C)成分、任意に(D)成分、及び任意にその他の成分を配合して、これらを1軸又は2軸押出機を用いて溶融混練処理することで、液晶性樹脂組成物の調製が行われる。
[Preparation of Liquid Crystalline Resin Composition]
The preparation of the liquid crystal resin composition according to the present invention is not particularly limited. For example, the liquid crystal resin composition is prepared by blending the (A) component, the (B) component, the (C) component, optionally the (D) component, and optionally other components, and melt-kneading the mixture using a single-screw or twin-screw extruder.
[液晶性樹脂組成物]
上記のようにして得られた本発明に係る液晶性樹脂組成物の溶融粘度は、流動性の観点から、好ましくは100Pa・sec以下であり、より好ましくは90Pa・sec以下であり、更により好ましくは85Pa・sec以下である。上記溶融粘度の下限は、特に限定されず、5Pa・sec以上でよく、10Pa・sec以上でも20Pa・sec以上でもよい。本明細書において、溶融粘度としては、液晶性樹脂の融点よりも10~30℃高いシリンダー温度、剪断速度1000sec-1の条件で、ISO 11443に準拠した測定方法で得られた値を採用する。
[Liquid crystal resin composition]
The melt viscosity of the liquid crystalline resin composition according to the present invention obtained as described above is preferably 100 Pa·sec or less, more preferably 90 Pa·sec or less, and further preferably 100 Pa·sec or less, from the viewpoint of flowability. The lower limit of the melt viscosity is not particularly limited, and may be 5 Pa·sec or more, 10 Pa·sec or more, or 20 Pa·sec or more. The value is measured at a cylinder temperature 10 to 30° C. higher than the melting point of the resin and at a shear rate of 1000 sec −1 in accordance with a measurement method in accordance with ISO 11443.
本発明に係る液晶性樹脂組成物の測定周波数5GHzにおける比誘電率は、誘電特性の観点から、好ましくは4.0以下、より好ましくは3.9以下、更により好ましくは3.8以下である。上記比誘電率の下限は、特に限定されず、1.0超でよく、1.5以上でも2.0以上でもよい。 The relative dielectric constant of the liquid crystal resin composition according to the present invention at a measurement frequency of 5 GHz is preferably 4.0 or less, more preferably 3.9 or less, and even more preferably 3.8 or less, from the viewpoint of dielectric properties. The lower limit of the above relative dielectric constant is not particularly limited, and may be more than 1.0, 1.5 or more, or 2.0 or more.
本発明に係る液晶性樹脂組成物の測定周波数5GHzにおける誘電正接は、誘電特性の観点から、好ましくは0.0067以下、より好ましくは0.0065以下、更により好ましくは0.0063以下である。上記誘電正接の下限は、特に限定されず、0.001以上でよく、0.0015以上でも0.0017以上でもよい。 The dielectric loss tangent of the liquid crystal resin composition according to the present invention at a measurement frequency of 5 GHz is preferably 0.0067 or less, more preferably 0.0065 or less, and even more preferably 0.0063 or less, from the viewpoint of dielectric properties. The lower limit of the dielectric loss tangent is not particularly limited, and may be 0.001 or more, 0.0015 or more, or 0.0017 or more.
本発明に係る液晶性樹脂組成物のL値は、黒色度の観点から、好ましくは60以下、より好ましくは50以下、更により好ましくは45以下である。上記L値の下限は、特に限定されず、0以上でよく、5以上でも10以上でもよい。 The L value of the liquid crystal resin composition according to the present invention is preferably 60 or less, more preferably 50 or less, and even more preferably 45 or less, from the viewpoint of blackness. The lower limit of the L value is not particularly limited, and may be 0 or more, 5 or more, or 10 or more.
以下に実施例を挙げて、本発明を更に詳しく説明するが、本発明はこれら実施例のみに限定されるものではない。 The present invention will be explained in more detail below with reference to examples, but the present invention is not limited to these examples.
<液晶性樹脂>
・芳香族ポリエステル
重合容器に下記の原料を仕込んだ後、反応系の温度を140℃に上げ、140℃で1時間反応させた。その後、更に360℃まで5.5時間かけて昇温し、そこから30分かけて5Torr(即ち、667Pa)まで減圧して、酢酸、過剰の無水酢酸、及びその他の低沸分を留出させながら溶融重合を行った。撹拌トルクが所定の値に達した後、窒素を導入して減圧状態から常圧を経て加圧状態にして、重合容器の下部からポリマーを排出し、ストランドをペレタイズしてペレットを得た。得られたペレットについて、窒素気流下、300℃で3時間の熱処理を行って、目的のポリマーを得た。得られたポリマーの融点は348℃、370℃における溶融粘度は9Pa・sであった。なお、上記ポリマーの融点は、後述する融点の測定方法の通りに測定し、上記ポリマーの溶融粘度は、後述する溶融粘度の測定方法と同様にして測定した。
6-ヒドロキシ-2-ナフトエ酸(HNA);1218g(48モル%)
4-ヒドロキシ安息香酸(HBA);37g(2モル%)
1,4-フェニレンジカルボン酸:560g(TA);(25モル%)
4,4’-ジヒドロキシビフェニル(BP);628g(25モル%)
金属触媒(酢酸カリウム触媒);165mg
アシル化剤(無水酢酸);1432g
<Liquid Crystalline Resin>
Aromatic polyester After the following raw materials were charged into a polymerization vessel, the temperature of the reaction system was raised to 140°C and reacted at 140°C for 1 hour. Thereafter, the temperature was further raised to 360°C over 5.5 hours, and the pressure was reduced to 5 Torr (i.e., 667 Pa) over 30 minutes, and melt polymerization was carried out while distilling out acetic acid, excess acetic anhydride, and other low boiling points. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a pressurized state via normal pressure, and the polymer was discharged from the bottom of the polymerization vessel, and the strands were pelletized to obtain pellets. The obtained pellets were subjected to heat treatment at 300°C for 3 hours under a nitrogen stream to obtain the target polymer. The melting point of the obtained polymer was 348°C, and the melt viscosity at 370°C was 9 Pa·s. The melting point of the above polymer was measured according to the melting point measurement method described later, and the melt viscosity of the above polymer was measured in the same manner as the melt viscosity measurement method described later.
6-Hydroxy-2-naphthoic acid (HNA): 1218 g (48 mol%)
4-Hydroxybenzoic acid (HBA): 37 g (2 mol %)
1,4-Phenylenedicarboxylic acid: 560 g (TA); (25 mol%)
4,4'-dihydroxybiphenyl (BP): 628 g (25 mol%)
Metal catalyst (potassium acetate catalyst): 165 mg
Acylating agent (acetic anhydride): 1432 g
・芳香族ポリエステルアミド
重合容器に下記の原料を仕込んだ後、反応系の温度を140℃に上げ、140℃で1時間反応させた。その後、更に340℃まで4.5時間かけて昇温し、そこから15分かけて10Torr(即ち1330Pa)まで減圧して、酢酸、過剰の無水酢酸、及びその他の低沸分を留出させながら溶融重合を行った。撹拌トルクが所定の値に達した後、窒素を導入して減圧状態から常圧を経て加圧状態にして、重合容器の下部からポリマーを排出し、ストランドをペレタイズしてペレットを得た。得られたペレットについて、窒素気流下、300℃で2時間の熱処理を行って、目的のポリマーを得た。得られたポリマーの融点は336℃、350℃における溶融粘度は19.0Pa・sであった。なお、上記ポリマーの融点は、後述する融点の測定方法の通りに測定し、上記ポリマーの溶融粘度は、後述する溶融粘度の測定方法と同様にして測定した。
4-ヒドロキシ安息香酸(HBA);1380g(60モル%)
6-ヒドロキシ-2-ナフトエ酸(HNA);157g(5モル%)
1,4-フェニレンジカルボン酸(TA);484g(17.5モル%)
4,4’-ジヒドロキシビフェニル(BP);388g(12.5モル%)
N-アセチル-p-アミノフェノール(APAP);126g(5モル%)
金属触媒(酢酸カリウム触媒);110mg
アシル化剤(無水酢酸);1659g
Aromatic polyester amide The following raw materials were charged into a polymerization vessel, and the temperature of the reaction system was raised to 140°C and reacted at 140°C for 1 hour. Thereafter, the temperature was further raised to 340°C over 4.5 hours, and the pressure was reduced to 10 Torr (i.e., 1330 Pa) over 15 minutes, and melt polymerization was carried out while distilling out acetic acid, excess acetic anhydride, and other low boiling points. After the stirring torque reached a predetermined value, nitrogen was introduced to change from a reduced pressure state to a normal pressure state and then to a pressurized state, and the polymer was discharged from the bottom of the polymerization vessel, and the strands were pelletized to obtain pellets. The obtained pellets were subjected to heat treatment at 300°C for 2 hours under a nitrogen stream to obtain the target polymer. The melting point of the obtained polymer was 336°C, and the melt viscosity at 350°C was 19.0 Pa·s. The melting point of the above polymer was measured according to the melting point measurement method described later, and the melt viscosity of the above polymer was measured in the same manner as the melt viscosity measurement method described later.
4-Hydroxybenzoic acid (HBA): 1380 g (60 mol%)
6-Hydroxy-2-naphthoic acid (HNA): 157 g (5 mol%)
1,4-phenylenedicarboxylic acid (TA): 484 g (17.5 mol%)
4,4'-dihydroxybiphenyl (BP): 388 g (12.5 mol%)
N-acetyl-p-aminophenol (APAP): 126 g (5 mol%)
Metal catalyst (potassium acetate catalyst): 110 mg
Acylating agent (acetic anhydride): 1659 g
[融点の測定方法]
TAインスツルメント社製DSCにて、液晶性樹脂を室温から20℃/分の昇温条件で加熱した際に観測される吸熱ピーク温度(Tm1)の測定後、(Tm1+40)℃の温度で2分間保持した後、20℃/分の降温条件で室温まで一旦冷却した後、再度、20℃/分の昇温条件で加熱した際に観測される吸熱ピークの温度(Tm2)を測定し、ポリマーの融点とした。
[Method of measuring melting point]
Using a DSC manufactured by TA Instruments, the endothermic peak temperature (Tm1) observed when the liquid crystalline resin was heated from room temperature at a temperature increase rate of 20°C/min was measured, and then the resin was held at a temperature of (Tm1+40)°C for 2 minutes, cooled to room temperature at a temperature decrease rate of 20°C/min, and then heated again at a temperature increase rate of 20°C/min to measure the endothermic peak temperature (Tm2), which was determined as the melting point of the polymer.
[溶融粘度の測定方法]
(株)東洋精機製作所製キャピログラフ1B型を使用し、液晶性樹脂の融点よりも10~30℃高い温度で、内径1mm、長さ20mmのオリフィスを用いて、剪断速度1000/秒で、ISO11443に準拠して、液晶性樹脂の溶融粘度を測定した。なお、具体的な測定温度は、芳香族ポリエステルについては370℃、芳香族ポリエステルアミドについては350℃であった。
[Method of measuring melt viscosity]
The melt viscosity of the liquid crystal resin was measured in accordance with ISO 11443 using a Capillograph 1B model manufactured by Toyo Seiki Seisakusho Co., Ltd. at a temperature 10 to 30° C. higher than the melting point of the liquid crystal resin, using an orifice with an inner diameter of 1 mm and a length of 20 mm, at a shear rate of 1000/sec. The specific measurement temperatures were 370° C. for aromatic polyester and 350° C. for aromatic polyesteramide.
<液晶性樹脂以外の材料>
・ガラスバルーン:Y12000((株)セイシン企業製、アスペクト比(平均)1.264、メディアン径35μm、真比重0.6)
・カーボンブラックC1:Conductex 7054 Ultra(Birla Carbon Korea Co., Ltd製、数平均粒子径54nm)
・カーボンブラックC2:BLACK PEARLS 4350(キャボットジャパン(株)製、数平均粒子径25nm)
・カーボンブラックC3:MONARCH 4750(キャボットジャパン(株)製、数平均粒子径18nm)
<Materials other than liquid crystal resin>
Glass balloon: Y12000 (manufactured by Seishin Enterprise Co., Ltd., aspect ratio (average) 1.264, median diameter 35 μm, true specific gravity 0.6)
Carbon black C1: Conductex 7054 Ultra (manufactured by Birla Carbon Korea Co., Ltd., number average particle size 54 nm)
Carbon black C2: BLACK PEARLS 4350 (manufactured by Cabot Japan Co., Ltd., number average particle size 25 nm)
Carbon black C3: MONARCH 4750 (manufactured by Cabot Japan Co., Ltd., number average particle size 18 nm)
<液晶性樹脂組成物の製造>
上記成分を、表1に示す割合で二軸押出機((株)日本製鋼所製TEX30α型)を用いて、下記のシリンダー温度で溶融混練し、液晶性樹脂組成物ペレットを得た。
〔製造条件〕
シリンダー温度:
370℃:芳香族ポリエステルを含有する液晶性樹脂組成物の場合
350℃:芳香族ポリエステルアミドを含有する液晶性樹脂組成物の場合
<Production of Liquid Crystalline Resin Composition>
The above components were melt-kneaded in the ratio shown in Table 1 using a twin-screw extruder (TEX30α type, manufactured by The Japan Steel Works, Ltd.) at the cylinder temperature shown below to obtain liquid crystal resin composition pellets.
[Production conditions]
Cylinder Temperature:
370°C: In the case of a liquid crystal resin composition containing an aromatic polyester 350°C: In the case of a liquid crystal resin composition containing an aromatic polyester amide
<L値>
実施例及び比較例のペレットを、成形機(住友重機械工業(株)製 「SE-100DU」)を用いて、以下の成形条件で成形し、80mm×80mm×1mmの平板状試験片を作製した。この試験片について、分光色差計(日本電色工業株式会社製「SE6000」)を用いて、L値を測定した。
〔成形条件〕
シリンダー温度:
370℃(実施例1~5及び比較例1~4)
350℃(実施例6)
金型温度:80℃
射出速度:33mm/sec
保圧:60MPa
<L value>
The pellets of the examples and comparative examples were molded under the following molding conditions using a molding machine ("SE-100DU" manufactured by Sumitomo Heavy Industries, Ltd.) to prepare flat test pieces of 80 mm x 80 mm x 1 mm. The L value of these test pieces was measured using a spectrophotometer ("SE6000" manufactured by Nippon Denshoku Industries Co., Ltd.).
[Molding conditions]
Cylinder Temperature:
370°C (Examples 1 to 5 and Comparative Examples 1 to 4)
350° C. (Example 6)
Mold temperature: 80°C
Injection speed: 33mm/sec
Holding pressure: 60 MPa
<誘電特性>
実施例及び比較例のペレットを、成形機(住友重機械工業(株)製 「SE-100DU」)を用いて、以下の成形条件で成形し、80mm×80mm×1mmの平板状試験片を作製した。図1に示す通り、平板状試験片の中央から流動方向に80mm×1mm×1mmの試験片を切り出し、これを誘電特性評価用試験片とした。この試験片について、(株)関東電子応用開発製の以下の構成の空洞共振器摂動法複素誘電率評価装置を用いて、測定周波数5GHzでの比誘電率及び誘電正接を測定した。
スカラーネットワークアナライザー:アジレントテクノロジー8757D
周波数シンセサイザー:アジレントテクノロジー 83650LスイープCWジェネレータ
固定減衰器:アジレントテクノロジー85025Dディテクター
空洞共振器:関東電子応用開発CP431
測定プログラム:関東電子応用開発CPMA-S2/V2
〔成形条件〕
シリンダー温度:
370℃(実施例1~5及び比較例1~4)
350℃(実施例6)
金型温度:80℃
射出速度:33mm/sec
保圧:60MPa
<Dielectric properties>
The pellets of the examples and comparative examples were molded under the following molding conditions using a molding machine ("SE-100DU" manufactured by Sumitomo Heavy Industries, Ltd.) to prepare flat test pieces of 80 mm x 80 mm x 1 mm. As shown in FIG. 1, a test piece of 80 mm x 1 mm x 1 mm was cut out from the center of the flat test piece in the flow direction, and this was used as a test piece for evaluating dielectric properties. The relative dielectric constant and dielectric loss tangent of this test piece at a measurement frequency of 5 GHz were measured using a cavity resonator perturbation method complex dielectric constant evaluation device manufactured by Kanto Electronics Application Development Co., Ltd. and having the following configuration.
Scalar network analyzer: Agilent Technology 8757D
Frequency synthesizer: Agilent Technology 83650L Sweep CW Generator Fixed attenuator: Agilent Technology 85025D Detector Cavity resonator: Kanto Electronics Application Development CP431
Measurement program: Kanto Electronics Application Development CPMA-S2/V2
[Molding conditions]
Cylinder Temperature:
370°C (Examples 1 to 5 and Comparative Examples 1 to 4)
350° C. (Example 6)
Mold temperature: 80°C
Injection speed: 33mm/sec
Holding pressure: 60 MPa
表1に記載の結果から明らかなように、実施例の液晶性樹脂組成物は、低誘電率及び低誘電正接を有し、黒色度に優れていた。 As is clear from the results shown in Table 1, the liquid crystal resin composition of the example had a low dielectric constant and a low dielectric tangent, and was excellent in blackness.
Claims (4)
(B)中空フィラー、及び
(C)カーボンブラック
を含有し、
前記(A)液晶性樹脂100質量部に対して、
前記(B)中空フィラーの含有量は、5~85質量部、
前記(C)カーボンブラックの含有量は、0.1~7質量部
であり、
前記(C)カーボンブラックの数平均粒子径は、20~100nmである液晶性樹脂組成物。 (A) a liquid crystalline resin,
(B) a hollow filler; and (C) carbon black,
Relative to 100 parts by mass of the (A) liquid crystalline resin,
The content of the hollow filler (B) is 5 to 85 parts by mass,
The content of the (C) carbon black is 0.1 to 7 parts by mass,
The liquid crystalline resin composition, wherein the carbon black (C) has a number average particle size of 20 to 100 nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202480022991.5A CN121039234A (en) | 2023-03-30 | 2024-03-28 | Liquid crystalline resin composition |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2023-055689 | 2023-03-30 | ||
| JP2023055689 | 2023-03-30 |
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| Publication Number | Publication Date |
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| WO2024204593A1 true WO2024204593A1 (en) | 2024-10-03 |
Family
ID=92906776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2024/012765 Pending WO2024204593A1 (en) | 2023-03-30 | 2024-03-28 | Liquid-crystalline resin composition |
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| Country | Link |
|---|---|
| CN (1) | CN121039234A (en) |
| TW (1) | TW202500669A (en) |
| WO (1) | WO2024204593A1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04295031A (en) * | 1991-03-22 | 1992-10-20 | Asahi Glass Co Ltd | Glass balloon product and its composition |
| JP2004169049A (en) * | 2002-11-15 | 2004-06-17 | Polyplastics Co | Metal composite method on the surface of a cyclic olefin resin molded article and metal composite cycloolefin resin molded article |
| WO2006123824A1 (en) * | 2005-05-18 | 2006-11-23 | Polyplastics Co., Ltd. | Process for producing resin composition containing fibrous filler in high concentration and resin composition pellet |
| JP2008034724A (en) * | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | Manufacturing method of low dielectric wiring board |
| WO2018105624A1 (en) * | 2016-12-05 | 2018-06-14 | 株式会社村田製作所 | Black liquid crystal polymer film and multilayer substrate |
| JP2022545340A (en) * | 2019-08-21 | 2022-10-27 | ティコナ・エルエルシー | Polymer composition for use in antenna system |
| JP2022546959A (en) * | 2019-09-10 | 2022-11-10 | ティコナ・エルエルシー | liquid crystal polymer composition |
-
2024
- 2024-03-28 WO PCT/JP2024/012765 patent/WO2024204593A1/en active Pending
- 2024-03-28 CN CN202480022991.5A patent/CN121039234A/en active Pending
- 2024-03-29 TW TW113112003A patent/TW202500669A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04295031A (en) * | 1991-03-22 | 1992-10-20 | Asahi Glass Co Ltd | Glass balloon product and its composition |
| JP2004169049A (en) * | 2002-11-15 | 2004-06-17 | Polyplastics Co | Metal composite method on the surface of a cyclic olefin resin molded article and metal composite cycloolefin resin molded article |
| WO2006123824A1 (en) * | 2005-05-18 | 2006-11-23 | Polyplastics Co., Ltd. | Process for producing resin composition containing fibrous filler in high concentration and resin composition pellet |
| JP2008034724A (en) * | 2006-07-31 | 2008-02-14 | Shin Etsu Polymer Co Ltd | Manufacturing method of low dielectric wiring board |
| WO2018105624A1 (en) * | 2016-12-05 | 2018-06-14 | 株式会社村田製作所 | Black liquid crystal polymer film and multilayer substrate |
| JP2022545340A (en) * | 2019-08-21 | 2022-10-27 | ティコナ・エルエルシー | Polymer composition for use in antenna system |
| JP2022546959A (en) * | 2019-09-10 | 2022-11-10 | ティコナ・エルエルシー | liquid crystal polymer composition |
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| Publication number | Publication date |
|---|---|
| TW202500669A (en) | 2025-01-01 |
| CN121039234A (en) | 2025-11-28 |
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