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WO2024201864A1 - Élément de guide d'ondes optique, et dispositif de modulation optique et appareil de transmission optique l'utilisant - Google Patents

Élément de guide d'ondes optique, et dispositif de modulation optique et appareil de transmission optique l'utilisant Download PDF

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Publication number
WO2024201864A1
WO2024201864A1 PCT/JP2023/013083 JP2023013083W WO2024201864A1 WO 2024201864 A1 WO2024201864 A1 WO 2024201864A1 JP 2023013083 W JP2023013083 W JP 2023013083W WO 2024201864 A1 WO2024201864 A1 WO 2024201864A1
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WO
WIPO (PCT)
Prior art keywords
optical waveguide
optical
waveguide element
thin plate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2023/013083
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English (en)
Japanese (ja)
Inventor
淳司 新井
祐美 村田
宏佑 岡橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Osaka Cement Co Ltd
Original Assignee
Sumitomo Osaka Cement Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Osaka Cement Co Ltd filed Critical Sumitomo Osaka Cement Co Ltd
Priority to PCT/JP2023/013083 priority Critical patent/WO2024201864A1/fr
Publication of WO2024201864A1 publication Critical patent/WO2024201864A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 

Definitions

  • the present invention relates to an optical waveguide element and an optical modulation device and optical transmission device using the same, and in particular to an optical waveguide element having a composite substrate that includes a thin plate on which an optical waveguide is formed and a holding substrate to which the thin plate is bonded via an intermediate layer.
  • optical waveguide elements such as optical modulators are widely used, which form an optical waveguide on a substrate with electro-optical effects such as lithium niobate (LN) and have a modulation electrode that modulates the light waves propagating through the optical waveguide.
  • LN lithium niobate
  • driver-integrated modulators such as HB-CDM (High Bandwidth Coherent Driver Modulator)
  • HB-CDM High Bandwidth Coherent Driver Modulator
  • the optical waveguide element itself is also being made smaller, and thin plates on which rib-type optical waveguides with widths and heights of about 1 ⁇ m are being used.
  • a holding substrate is used to hold the thin plate, and furthermore, a composite substrate with an intermediate layer is used to increase the adhesion between the thin plate and the holding substrate.
  • functional layers such as electrodes are formed on the thin plate, it is cut from the wafer state into individual optical waveguide element chips.
  • the thin plate is a substrate with electro-optical effects such as LN with a thickness of 1 ⁇ m or less
  • the holding substrate is made of silicon (Si) or alpha quartz single crystal with a thickness of 0.2 to 1.0 mm to reinforce the mechanical strength.
  • the intermediate layer is made of a material that can increase the bonding strength and is 10 ⁇ m or less; for example, a Si oxide film is preferably used to bond an LN thin plate to a Si substrate.
  • a composite substrate of a thin plate 1, an intermediate layer 2, and a holding substrate 3 is cut using a blade C1.
  • frictional heat generated during processing, wear and tear of the blade abrasive grains, and the effects of cutting fluid used to suppress these can cause the thin plate or intermediate layer to peel off, chipping, or chipping, which can then progress to cracks, as shown in Figure 1(b).
  • Fig. 2 shows what is called the bevel cut or step cut method, in which two types of blades (C2, C3) are prepared for cutting.
  • the first cut in a single cutting process as in Fig. 1, in Fig. 2 the first cut (see Fig. 2(a)) can be made shallower. Therefore, by using different cutting blades suited to each layer, peeling and cracks in the thin plate and intermediate layers can be suppressed.
  • the time required for cutting increases, which is a problem.
  • Patent Document 1 also proposes a method of making a groove 4 on the upper inner surface of the cut surface of the chip, as shown in Figure 3.
  • the groove 4 acts as a breakwater, and when cut, as shown in Figure 3(b), it is possible to prevent peeling of the thin plate and intermediate layer and the progression of cracks into the substrate, but there is a problem in that the effective area of the chip is narrowed by the width of the groove 4.
  • Patent Document 2 discloses that the upper part of the composite substrate is first removed by dry etching (see FIG. 4(a)) and wet etching (see FIG. 4(b)), and then the removed part is cut along with laser irradiation or a crystal cleavage plane (see FIG. 4(c)). With this cutting method, the processed surface is of higher quality than blade cutting, and the cutting width is narrower, ensuring a larger effective area within the chip. However, as shown in FIG. 4(b), peeling of the thin plate and intermediate layers and under- (over-) etching occur during wet etching.
  • the problem that the present invention aims to solve is to provide an optical waveguide element that solves the problems described above, suppresses peeling and cracking of thin plates and intermediate layers in a composite substrate, suppresses increases in the time required for cutting, and makes it possible to ensure a large effective area within the chip. It is also to provide an optical modulation device and an optical transmission device that use this optical waveguide element.
  • An optical waveguide element having a composite substrate including a thin plate forming an optical waveguide and a holding substrate to which the thin plate is bonded via an intermediate layer, characterized in that a step is formed on a portion of a side of the composite substrate, and in the step, a position of a first side including the thin plate is retreated toward the inside of the composite substrate from a position of a second side including the holding substrate, and a protective film is disposed on the first side.
  • the protective film is formed so as to cover from the first side surface to a portion of the upper surface of the thin plate.
  • optical waveguide element described in (1) above is characterized in that an adhesive layer is disposed at a portion of the interface between the protective film and the composite substrate.
  • the optical waveguide element described in (1) above is characterized in that the composite substrate has a groove formed at a position further inward than the first side surface of the composite substrate.
  • the optical waveguide element described in (1) above is characterized in that the surface of the first side is formed with irregularities.
  • the first side surface is inclined so that the surface faces upward.
  • An optical modulation device comprising an optical waveguide element according to any one of (1) to (6) above, a housing for accommodating the optical waveguide element, and an optical fiber for inputting and outputting light waves to and from the optical waveguide element.
  • the optical modulation device described in (7) above is characterized in that a modulation electrode that modulates the light wave propagating through the optical waveguide is provided on the substrate, and an electronic circuit that amplifies the modulation signal input to the modulation electrode is provided inside or outside the housing.
  • An optical transmission device comprising the optical modulation device described in (8) above and an electronic circuit that outputs a modulation signal that causes the optical modulation device to perform a modulation operation.
  • the present invention provides an optical waveguide element having a composite substrate including a thin plate having an optical waveguide formed thereon and a holding substrate to which the thin plate is bonded via an intermediate layer, in which a step is formed on a portion of the side of the composite substrate, and in the step, the position of the first side including the thin plate is retreated toward the inside of the composite substrate from the position of the second side including the holding substrate, and a protective film is disposed on the first side, so that the first side is protected by the protective film, and damage to the first side during cutting at the second side is effectively suppressed.
  • 1A and 1B are diagrams for explaining an example of cutting in a single conventional cutting step, in which (a) shows the state of cutting with a blade, and (b) shows the state of the chip after cutting.
  • 1A to 1C are diagrams for explaining an example of a conventional cutting process performed in two cutting steps, where (a) shows the first cutting step, (b) shows the second cutting step, and (c) shows the state of the chip after cutting.
  • 1A and 1B are diagrams for explaining an example of arranging a groove near a cut portion as disclosed in Patent Document 1, in which (a) shows a state in which cutting is performed with a blade, and (b) shows the state of a chip after cutting.
  • FIG. 1A to 1C are diagrams illustrating the cutting method disclosed in Patent Document 2, in which (a) shows the state after dry etching, (b) shows the state after wet etching, and (c) shows the state after cutting with a laser or the like.
  • FIG. 1 is a plan view showing an example of an optical waveguide element of the present invention. A cross-sectional view taken along dashed line A-A' in FIG. 5 is shown.
  • 1A to 1D are diagrams showing an example of a method for forming an optical waveguide element of the present invention, showing the steps in the order of (a) to (d).
  • FIG. 7 is a cross-sectional view showing an application example of FIG. 6 .
  • FIG. 13 is a diagram showing an example in which a groove 4 is disposed in the vicinity of a first side surface B1.
  • FIG. 13A and 13B are diagrams showing an example of forming irregularities on the surface of the first side surface B1.
  • 13 is a diagram showing an example in which the first side surface B1 is configured as an inclined surface.
  • FIG. 1 is a plan view showing an optical modulation device and an optical transmission device according to the present invention.
  • the present invention is characterized in that in an optical waveguide element having a composite substrate comprising a thin plate 1 forming an optical waveguide 10 and a holding substrate 4 to which the thin plate is bonded via an intermediate layer 2, a step is formed on a part of a side of the composite substrate, and in the step, the position of a first side B1 including the thin plate 1 is retreated toward the inside of the composite substrate from the position of a second side B2 including the holding substrate 3, and a protective film PC is arranged on the first side B1.
  • substrates various materials can be used, including substrates with electro-optical effects such as LN, lithium tantalate, lead lanthanum zirconate titanate (PLZT), vapor-deposited films made from these materials, and even semiconductor materials and organic materials.
  • substrates with electro-optical effects such as LN, lithium tantalate, lead lanthanum zirconate titanate (PLZT), vapor-deposited films made from these materials, and even semiconductor materials and organic materials.
  • PZT lead lanthanum zirconate titanate
  • the optical waveguide As a method for forming the optical waveguide, it is possible to use a rib-type optical waveguide in which the part of the substrate corresponding to the optical waveguide is convex by etching the surface of the substrate other than the optical waveguide and forming grooves on both sides of the optical waveguide, and it is also possible to use a horizontal slot waveguide in which a slot waveguide structure is formed in the thickness direction by thinning the substrate, thereby reducing bending loss. It is also possible to form an optical waveguide by forming a high refractive index portion on the substrate surface using titanium (Ti) or the like by thermal diffusion or proton exchange. It is also possible to form a composite optical waveguide by diffusing a high refractive index material into a rib-type optical waveguide portion. In particular, when the optical waveguide element itself is made small or a folded optical waveguide is used, a convex waveguide with a width or height of about 1 ⁇ m that provides strong light confinement is used.
  • the substrate on which the optical waveguide is formed is thinned by grinding and polishing to a thickness of 10 ⁇ m or less, more preferably 5 ⁇ m or less, and even more preferably less than 1 ⁇ m (the lower limit of the thickness is preferably 0.3 ⁇ m or more), or a thinned substrate is produced using the smart cut method (a method of thinning by ion implantation peeling).
  • the height of the rib-type optical waveguide is preferably set to 1 ⁇ m or less. It is also possible to form a vapor-grown film on another substrate with a thickness of about the same as the above-mentioned substrate, and process the film into the shape of the above-mentioned optical waveguide.
  • a substrate (thin plate, thin film) 1 on which an optical waveguide is formed is adhesively fixed to a holding substrate 3 via an intermediate layer 2.
  • a substrate in which the thin plate 1, intermediate layer 2, and holding substrate 3 are integrated is called a "composite substrate.”
  • the support substrate 3 may be made of Si having a thickness of 0.2 to 1.0 mm, a glass material with a low dielectric constant, alpha quartz single crystal, quartz, sapphire, or the like.
  • the intermediate layer is made of a material having a lower refractive index than the thin plate 1.
  • the intermediate layer is preferably thicker than the optical waveguide substrate, 10 ⁇ m or less.
  • the optical waveguide element of the present invention is characterized in that a protective film PC is formed on the first side B1 including the thin plate 1, as shown in Figures 5 and 6.
  • Figure 5 is a plan view of the optical waveguide element, and to make the drawing easier to see, the optical waveguide is not shown, but as shown in Figure 6, a rib-type optical waveguide 10 is disposed between the signal electrode ES and the ground electrodes (EG1, EG2).
  • FIG. 6 is an example of a cross-sectional view taken along dashed line A-A' in FIG. 5, in which a protective film PC is disposed on the first side B1 including the thin plate 1 on which the optical waveguide 10 is formed.
  • the thin plate 1 and intermediate layer 2 in the portion to be cut are removed in advance by dry etching, and a protective film PC having a thickness of 1 ⁇ m or more is formed to cover the removed side B1 and to avoid contact with the blade used during cutting.
  • the lower end of the protective film PC can also be positioned midway through the intermediate layer 2 or inside the holding substrate 3.
  • the material used for the protective film PC can be a material used only for the protective film, but since functional layers such as electrodes and spot size converters are formed on the thin plate 1, it is also possible to use a material used for these functional layers.
  • a material used for these functional layers if it is an organic dielectric, a resist-like resin with a small Young's modulus and easy patterning is preferable, and materials such as polyamide-based resins, melamine-based resins, phenol-based resins, amino-based resins, and epoxy-based resins can be used.
  • the protective film is formed before forming functional layers such as electrodes, it is possible to prevent over-etching of the intermediate layer that can occur in the subsequent wet etching process.
  • a material that can withstand the chemicals used in wet etching such as tantalum, gold (Au), silver, aluminum, or Si, is selected.
  • an adhesion layer BL can be formed on part of the interface between the protective film PC and these substrates. This adhesion layer can also be formed on the bottom surface of the step between the first side B1 and the second side B2 to further improve adhesion.
  • the material used for the adhesion layer BL depends on the material used for the protective film PC, but for example, when Au is used for the protective film PC, Ti, niobium (Nb), nickel, chromium, etc. can be used for the adhesion layer. In particular, when Ti or Nb is used, not only does it improve adhesion to the protective film, but it also has excellent corrosion resistance to iodine, which is an etchant for Au.
  • FIG. 7A and 7B are diagrams showing an example of cutting a chip using a protective film PC.
  • the thin plate 1 and the intermediate layer 2 are removed by dry etching.
  • a protective film PC is formed on the first side B1.
  • FIG. 7(c) when cutting the holding substrate 3 with the blade C4, the position of the blade C4 is adjusted so as not to catch the protective film PC, and cutting is performed in one step, which can suppress peeling and cracking of the thin plate 1, the intermediate layer 2, and the functional layer (not shown) formed on the thin plate. It is also possible to shorten the processing time. As shown in FIG.
  • cutting can be performed at a position close to the protective film PC, and damage to the inside of the composite substrate can be suppressed by the cutting, so that the effective area of the chip can be secured widely.
  • cutting is performed with the blade C4, but a wider effective area can be secured by cutting using a laser.
  • the protective film PC can be formed to cover from the first side B1 to a portion of the top surface of the thin plate 1. This makes it possible to widen the area that can be protected by the protective film PC, and also to increase the adhesion between the protective film PC and the thin plate 1, etc.
  • the protective film PC can be formed over the entire first side B1 including the thin plate 1, but it is also possible to form the protective film PC continuously or discontinuously around the periphery of the chip. Forming it continuously enhances the protective effect.
  • a protective layer does not need to be formed because the end face is polished after cutting.
  • FIG. 8 is a cross-sectional view showing an application example of FIG. 6, in which the protective film PC is formed integrally with the electrode (particularly the ground electrode EG1).
  • the protective film can function as a ground electrode, ensuring a larger effective area within the chip.
  • FIG. 9 shows the formation of a groove 4 on the surface of the composite substrate (thin plate 1) near the first side B1 on which the protective film PC is formed.
  • This groove can suppress the progression of damage to the inside of the thin plate in the unlikely event that the thin plate 1 peels off. Furthermore, by positioning the protective film so that the protective film PC fits into the groove 4, the bonding strength of the protective film to the thin plate can be increased due to the anchor effect.
  • the surface of the first side B1 on which the protective film PC is disposed is uneven.
  • the first side B1 is inclined so that the surface faces upward.
  • the adhesion layer BL can be laminated thicker in proportion to the inclination, and the adhesion layer BL can be reliably formed on the first side B1.
  • the protective film PC can also be formed thick, improving the protective function of the thin plate and intermediate layer.
  • a compact optical modulation device MD can be provided by housing the optical waveguide element (substrate 1) of the present invention in a housing CA made of metal or the like and connecting the outside of the housing to the optical waveguide element with an optical fiber F.
  • a housing CA made of metal or the like
  • reference numeral 5 denotes a reinforcing member superimposed on substrate 1 along the end face of substrate 1, and is used when directly joining an optical component such as an optical fiber to the end face of substrate 1.
  • An electronic circuit that outputs a modulation signal S0 that causes the optical modulation device MD to perform a modulation operation can be connected to the optical modulation device MD to configure an optical transmission device OTA. Since the modulation signal S to be applied to the optical waveguide element needs to be amplified, a driver circuit DRV is used.
  • the driver circuit DRV and the digital signal processor DSP can be placed outside the housing CA, but can also be placed inside the housing CA. In particular, by placing the driver circuit DRV inside the housing, the propagation loss of the modulation signal from the driver circuit can be further reduced and a wider bandwidth can be achieved.
  • an optical waveguide element that suppresses peeling and cracking of thin plates and intermediate layers in a composite substrate, suppresses increases in the time required for cutting, and ensures a large effective area within the chip. It is also possible to provide an optical modulation device and an optical transmission device that use an optical waveguide element that has such excellent effects.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

Un élément de guide d'ondes optique selon la présente invention a un substrat composite pourvu : d'une plaque mince (1) dans laquelle un guide d'ondes optique (10) est formé ; et d'un substrat de maintien (4) auquel la plaque mince (1) est jointe à une couche intermédiaire (2) entre eux. L'élément de guide d'ondes optique est caractérisé en ce que : une différence de niveau est formée au niveau d'une partie de surfaces latérales du substrat composite ; à la différence de niveau, la position d'une première surface latérale (B1) comprenant la plaque mince (1) est retraitée vers l'intérieur du substrat composite à partir de la position d'une seconde surface latérale (B2) comprenant un substrat de maintien (3) ; et un film de protection (PC) est disposé sur la première surface latérale (B1).
PCT/JP2023/013083 2023-03-30 2023-03-30 Élément de guide d'ondes optique, et dispositif de modulation optique et appareil de transmission optique l'utilisant Pending WO2024201864A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/013083 WO2024201864A1 (fr) 2023-03-30 2023-03-30 Élément de guide d'ondes optique, et dispositif de modulation optique et appareil de transmission optique l'utilisant

Applications Claiming Priority (1)

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PCT/JP2023/013083 WO2024201864A1 (fr) 2023-03-30 2023-03-30 Élément de guide d'ondes optique, et dispositif de modulation optique et appareil de transmission optique l'utilisant

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040066250A1 (en) * 2000-08-25 2004-04-08 Hunt Andrew T Electronic and optical devices and methods of forming these devices
JP2004295118A (ja) * 2003-03-12 2004-10-21 Sanyo Electric Co Ltd 光導波路
JP2008140829A (ja) * 2006-11-30 2008-06-19 Sharp Corp 半導体装置およびその製造方法
US20150214077A1 (en) * 2014-01-24 2015-07-30 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of Packaging and Dicing Semiconductor Devices and Structures Thereof
JP2021105658A (ja) * 2019-12-26 2021-07-26 住友大阪セメント株式会社 光導波路デバイス
JP2022142650A (ja) * 2021-03-16 2022-09-30 富士通オプティカルコンポーネンツ株式会社 光デバイス、光通信装置及び光デバイスの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040066250A1 (en) * 2000-08-25 2004-04-08 Hunt Andrew T Electronic and optical devices and methods of forming these devices
JP2004295118A (ja) * 2003-03-12 2004-10-21 Sanyo Electric Co Ltd 光導波路
JP2008140829A (ja) * 2006-11-30 2008-06-19 Sharp Corp 半導体装置およびその製造方法
US20150214077A1 (en) * 2014-01-24 2015-07-30 Taiwan Semiconductor Manufacturing Company, Ltd. Methods of Packaging and Dicing Semiconductor Devices and Structures Thereof
JP2021105658A (ja) * 2019-12-26 2021-07-26 住友大阪セメント株式会社 光導波路デバイス
JP2022142650A (ja) * 2021-03-16 2022-09-30 富士通オプティカルコンポーネンツ株式会社 光デバイス、光通信装置及び光デバイスの製造方法

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