WO2024262823A1 - Exterior cover, electronic device comprising same, and manufacturing method therefor - Google Patents

Abstract

Disclosed are an exterior cover, an electronic device comprising same, and a manufacturing method therefor according to one embodiment. The exterior cover comprises: a first material including recycled aluminum; and a second material coupled to the first material and including a metal having a higher strength than the recycled aluminum, wherein at least one pattern structure may be formed on a surface on which the first material and the second material are coupled. Various other embodiments may be possible.

Description

Outer cover, electronic device including same and method for manufacturing same

Various embodiments disclosed in this document relate to an outer cover, an electronic device including the same, and a method of manufacturing the same.

An electronic device may refer to a device that performs a specific function according to the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio/video devices, desktop/laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, large-capacity wireless communications become widespread, various functions can be installed on a single electronic device, such as a mobile communication terminal, in recent years. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized so that users can conveniently carry them.

Since these electronic devices are susceptible to damage from external physical impact, they can be used with an external cover (or case) that covers the exterior of the electronic device. An external cover that covers the exterior of the electronic device not only provides the function of protecting the electronic device, but can also have the effect of evoking aesthetic appeal to the user.

The above information may be provided as related art for the purpose of assisting in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

According to one embodiment of the present disclosure, the outer cover may include a first material or a second material. The first material may include recycled aluminum. The second material may be combined with the first material. The second material may include a metal having a relatively higher strength than the recycled aluminum. At least one pattern structure may be formed on a surface where the first material and the second material are combined.

According to one embodiment of the present disclosure, an electronic device may include a housing, or a display. The housing may include an outer cover. The display may be disposed in the housing. The outer cover may include a first material or a second material. The first material may include recycled aluminum. The second material may be combined with the first material. The second material may include a metal having a relatively higher strength than the recycled aluminum. At least one pattern structure may be formed on a surface where the first material and the second material are combined.

According to one embodiment of the present disclosure, a method for manufacturing an outer cover may include a process of preparing recycled aluminum, a process of applying metal powder to one surface of the recycled aluminum, or a process of bonding the metal powder and the recycled aluminum through 3D printing.

FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

FIG. 2 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

FIG. 3 is a perspective view showing an outer cover according to one embodiment of the present disclosure.

FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

FIG. 6 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

FIG. 7 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

FIG. 8 is a flowchart illustrating a manufacturing process of an outer cover according to one embodiment of the present disclosure.

FIG. 9 is a flowchart illustrating a process for preparing a regenerated aluminum chip according to one embodiment of the present disclosure.

FIG. 10 is a flowchart illustrating a process for removing foreign substances from regenerated aluminum chips according to one embodiment of the present disclosure.

Figure 11 is a drawing showing the outer surface of an outer cover according to a comparative example.

FIG. 12 is a drawing showing an outer surface of an outer cover according to one embodiment of the present disclosure.

FIGS. 13, 14, 15, 16, and 17 are drawings showing an outer surface of an outer cover according to one embodiment of the present disclosure.

FIGS. 18a, 18b, 18c, and 18d are cross-sectional views of an outer cover according to one embodiment of the present disclosure.

FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

The processor (120) may control at least one other component (e.g., a hardware or software component) of an electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store result data in a nonvolatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

The auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) itself on which the artificial intelligence model is executed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or nonvolatile memory (134).

The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (155) can output an audio signal to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.

The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can obtain sound through an input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the electronic device (101).

The sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electric signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery (189) can power at least one component of the electronic device (101). In one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).

The wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support various requirements specified in an electronic device (101), an external electronic device (e.g., an electronic device (104)), or a network system (e.g., a second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

The antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module (197) can include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) can include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), can be selected from the plurality of antennas by, for example, the communication module (190). A signal or power can be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) can be additionally formed as a part of the antenna module (197).

According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC positioned on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

At least some of the above components may be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

In one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). In one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to perform at least a part of the function or service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide an ultra-low latency service by using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an IoT (Internet of Things) device. The server (108) may be an intelligent server using machine learning and/or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

The electronic devices according to various embodiments disclosed in this document may be devices of various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliance devices. The electronic devices according to embodiments of this document are not limited to the above-described devices.

It should be understood that the various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the called at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or an intermediary server.

According to various embodiments, each component (e.g., a module or a program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately arranged in other components. According to various embodiments, one or more components or operations of the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, the multiple components (e.g., a module or a program) may be integrated into one component. In such a case, the integrated component may perform one or more functions of each of the multiple components identically or similarly to those performed by the corresponding component of the multiple components before the integration. According to various embodiments, the operations performed by the module, program, or other component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

FIG. 2 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

The embodiment of FIG. 2 may be combined with the embodiment of FIG. 1, or the embodiments of FIGS. 3 to 18d.

Referring to FIG. 2, the electronic device (200) (e.g., the electronic device (101) of FIG. 1) may include at least one of a front plate (222), a display (220), a bracket (232) (e.g., a front support member), a printed circuit board (240), a battery (250), a rear case (260), an antenna (270), and a rear plate (280). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., the rear case (260)) or may additionally include other components.

According to one embodiment, the electronic device (200) may include a housing (210) including a front plate (222), a side bezel structure (231), and a back plate (280). The front plate (222) may form at least a portion of a front surface of the electronic device (200). The back plate (280) may form at least a portion of a back surface of the electronic device (200). The side bezel structure (231) may form at least a portion of a side surface connecting the front and back surfaces of the electronic device (200). The housing (210) of the electronic device (200) may form at least a portion of an exterior surface of the electronic device (200). The front plate (222) may include a substantially transparent material (e.g., a glass plate including various coating layers, or a polymer plate). The back plate (280) may be formed of glass, ceramic, polymer, metal (e.g., titanium (Ti), stainless steel (STS), aluminum (Al), and/or magnesium (Mg)), or a combination of at least two of the above materials.

According to one embodiment, the bracket (232) may be disposed inside the electronic device (200) and connected to the side bezel structure (231), or may be formed integrally with the side bezel structure (231). The bracket (232) may be formed of, for example, a metal material and/or a non-metallic (e.g., a polymer) material. The bracket (232) may accommodate a display (220) (e.g., a display module (160) of FIG. 1) on one side and a printed circuit board (240) on the other side. The printed circuit board (240) may be equipped with a processor (e.g., a processor (120) of FIG. 1), a memory (e.g., a memory (130) of FIG. 1), and/or an interface (e.g., an interface (177) of FIG. 1).

According to one embodiment, the battery (250) (e.g., battery (189) of FIG. 1) is a device for supplying power to at least one component (e.g., camera module (212)) of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

In one embodiment, the display (220) may be positioned inside the housing. The display (220) may provide a visual image to the user through the front plate (222).

In one embodiment, the rear case (260) may be positioned between the printed circuit board (240) and the antenna (270) (e.g., the antenna module (197) of FIG. 1). For example, the rear case (260) may include one surface to which at least one of the printed circuit board (240) or the battery (250) is coupled, and the other surface to which the antenna (270) is coupled.

In one embodiment, the antenna (270) may be positioned between the back plate (280) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. For example, the antenna (270) may include a coil for wireless charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (231) and/or the bracket (232).

According to one embodiment, the electronic device (200) may include a camera module (212) disposed within the housing (210). According to one embodiment, the camera module (212) may be a rear camera module (212) disposed on the bracket (232) and capable of acquiring an image of a subject positioned at the rear (e.g., in the -Z direction) of the electronic device (200). According to one embodiment, at least a portion of the camera module (212) (e.g., the camera module (180) of FIG. 1) may be exposed to the outside of the electronic device (200) through an opening (283) formed in the rear plate (280).

FIG. 3 is a perspective view showing an outer cover according to one embodiment of the present disclosure.

FIG. 4 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

FIG. 5 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

FIG. 6 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

FIG. 7 is a cross-sectional view taken along line A-A' of FIG. 3 according to one embodiment of the present disclosure.

The embodiments of FIGS. 3 to 7 may be combined with the embodiments of FIGS. 1 to 2, or the embodiments of FIGS. 8 to 18d.

Referring to FIGS. 3 to 7, a rear plate (280) (e.g., the rear plate (280) of FIG. 2) may be defined and/or referred to as an exterior cover (280) of an electronic device (e.g., the electronic device (200) of FIG. 2).

In one embodiment, the back plate (280) (or, the outer cover (280)) may form at least a portion of a housing (e.g., the housing (210) of FIG. 2) formed to surround at least a portion of the display (220) of FIG. 2). The opening (283) of the back plate (280) (e.g., the opening (283) of FIG. 2) may be omitted.

According to one embodiment, the outer cover (280) may include a first material (281) and a second material (282) joined to the first material (281).

In one embodiment, the first material (281) of the outer cover (280) can face the interior of the electronic device and form at least a portion of the inner surface of the outer cover (280). The second material (282) of the outer cover (280) can face the exterior of the electronic device and form at least a portion of the outer surface of the outer cover (280). In one embodiment, the first material (281) of the outer cover (280) can face the exterior of the electronic device and form at least a portion of the outer surface of the outer cover (280). The second material (282) of the outer cover (280) can face the interior of the electronic device and form at least a portion of the inner surface of the outer cover (280).

According to one embodiment, the first material (281) may include aluminum (Al). For example, the first material (281) may include regenerated aluminum (or recycled aluminum). For example, the first material (281) may include recycled aluminum obtained by regenerating an aluminum 6xxx series alloy. The first material (281) may include recycled aluminum obtained by regenerating an aluminum 7xxx series alloy.

According to one embodiment, the first material (281) may include at least one of stainless steel (STS), titanium (Ti), or magnesium (Mg). For example, the first material (281) may include at least one of recycled stainless steel (or recycled stainless steel), recycled titanium (or recycled titanium), or recycled magnesium (or recycled magnesium).

In one embodiment, the second material (282) can be bonded to one surface of the first material (281) (e.g., the surface facing the -Z direction of FIGS. 3 to 7). The second material (282) can be laminated to one surface of the first material (281). The second material (282) can be bonded to one surface of the first material (281).

In one embodiment, the second material (282) may include a metal having relatively higher strength than the recycled aluminum. For example, the second material (282) may include one of titanium (Ti) or stainless steel (STS).

According to one embodiment, the second material (282) may be formed by melting metal powder applied to one surface of the first material (281) through 3D printing. For example, the second material (282) may be melted and bonded to one surface of the first material (281). The 3D printing may include at least one of selective laser sintering (SLS) printing, directed energy deposition (DED) printing, electron beam melting (EBM) printing, or selective laser melting (SLM) printing.

In one embodiment, the strength of the second material (282) may be greater than the strength of the first material (281). For example, the tensile strength of the second material (282) may be greater than the tensile strength of the first material (281). For example, the yield strength of the second material (282) may be greater than the yield strength of the first material (281).

According to one embodiment, the outer cover (280) may further include at least one pattern structure (285). The at least one pattern structure (285) may be formed on a portion (or a surface) where the first material (281) and the second material (282) are combined. The at least one pattern structure (285) may be formed by melting a portion of the first material (281) and a portion of the second material (282). The at least one pattern structure (285) may be formed by a 3D printing process.

According to one embodiment, at least one pattern structure (285) can increase the bonding area (or, joining area) of the first material (281) and the second material (282).

According to one embodiment, at least one pattern structure (285) may be formed generally (or entirely) between one side of the first material (281) and one side of the second material (282).

According to one embodiment, at least one pattern structure (285) may be formed of any one of a decorative pattern, a three-dimensional pattern formed by fine hair-lines, or a repetitive pattern. For example, the at least one pattern structure (285) may be provided in a countless fine uneven shape. For example, the at least one pattern structure (285) may be provided in a protruding cross-sectional shape.

Referring to FIG. 4, at least one pattern structure (285) may include a structure in which a plurality of square pyramid shapes (e.g., pyramid shapes) are repeatedly arranged.

Referring to FIG. 5, at least one pattern structure (285) may include a flat portion (2851) substantially parallel to an inner surface (e.g., a surface facing the +Z direction of FIG. 5) of the outer cover (280) and/or an outer surface (e.g., a surface facing the -Z direction of FIG. 5) of the outer cover (280), and an inclined portion (2852) inclined with respect to the flat portion (2851). The inclined portion (2852) and the flat portion (2851) may form an obtuse angle. The flat portion (2851) may be arranged substantially parallel to an outer surface (e.g., a surface facing the -Z direction of FIG. 5) of the second material (282).

Referring to FIG. 6, at least one pattern structure (285) may include a flat portion (2853) substantially parallel to an inner surface (e.g., a surface facing the +Z direction of FIG. 6) of the outer cover (280) and/or an outer surface (e.g., a surface facing the -Z direction of FIG. 6) of the outer cover (280), and a curvature portion (2854) formed concavely (or convexly) with respect to the flat portion (2853). A cross-section of the curvature portion (2854) may have a curved shape.

Referring to FIG. 7, at least one pattern structure (280) may include a first flat portion (2855) that is substantially parallel to an inner surface of the outer cover (280) (e.g., a surface facing the +Z direction of FIG. 7) and/or an outer surface of the outer cover (280) (e.g., a surface facing the -Z direction of FIG. 7). The first flat portion (2855) may be arranged to be substantially parallel to an outer surface of the second material (282) (e.g., a surface facing the -Z direction of FIG. 7). At least one pattern structure (280) may include a second flat portion (2857) that is substantially parallel to an inner surface of the outer cover (280) (e.g., a surface facing the +Z direction of FIG. 7) and/or an outer surface of the outer cover (280) (e.g., a surface facing the -Z direction of FIG. 7). The second flat portion (2857) can be spaced apart from the first flat portion (2855) and can be arranged parallel to the first flat portion (2855). At least one pattern structure (285) can include an inclined portion (2856) connected to the first flat portion (2855) and the second flat portion (2857). The inclined portion (2856) and the first flat portion (2855) can form an acute angle. The inclined portion (2856) and the second flat portion (2857) can form an acute angle. The acute angle formed by the inclined portion (2856) and the first flat portion (2855) can be substantially the same as the acute angle formed by the inclined portion (2856) and the second flat portion (2857).

The shapes of at least one pattern structure (285) described with reference to FIGS. 4 to 7 as examples are exemplary, and at least one pattern structure (285) of the outer cover (280) may have various cross-sectional shapes.

The outer cover (280) described with reference to FIGS. 4 to 7 as an example is described with reference to an outer cover (280) of a bar type electronic device (e.g., the electronic device (200) of FIG. 2) (e.g., a smartphone), but the outer cover (280) of the present disclosure is not limited thereto, and may be applied to a housing of various electronic devices, such as a foldable electronic device in which at least a portion of the display is folded or unfolded, a rollable electronic device in which an area of a display exposed to the outside of the electronic device can be expanded and/or reduced, a tablet PC, or a wearable electronic device (e.g., a smart ring or an HMD (Head mounted Display) device).

FIG. 8 is a flowchart illustrating a manufacturing process of an outer cover according to one embodiment of the present disclosure.

FIG. 9 is a flowchart illustrating a process for preparing a regenerated aluminum chip according to one embodiment of the present disclosure.

FIG. 10 is a flowchart illustrating a process for removing foreign substances from regenerated aluminum chips according to one embodiment of the present disclosure.

The embodiments of FIGS. 8 to 10 may be combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 11 to 16.

Hereinafter, a manufacturing process (or manufacturing method) of an outer cover (e.g., an outer cover (280) of FIGS. 2 to 7) will be described with reference to FIGS. 8 to 10 as examples.

Referring to FIGS. 8 to 10, the manufacturing process of the outer cover (280) may include a process of preparing recycled aluminum (1010), a process of applying metal powder to one surface of the recycled aluminum (1030), or a process of joining the metal powder and the recycled aluminum through 3D printing (1050).

According to one embodiment, the process (1010) for preparing recycled aluminum may be a process for preparing recycled aluminum obtained by recycling an aluminum 6xxx series alloy or recycled aluminum obtained by recycling an aluminum 7xxx series alloy.

According to one embodiment, the process (1010) for preparing recycled aluminum may include a process (1011) for preparing recycled aluminum chips, a process (1013) for removing foreign substances, or a process for melting virgin aluminum and recycled aluminum.

According to one embodiment, the process (1011) for preparing a recycled aluminum chip may include a process for preparing a waste aluminum chip. For example, the recycled aluminum chip may include aluminum dross (or scrap) discharged during a process for producing an outer material of a product. For example, the recycled aluminum chip may be aluminum waste produced (or discharged) during a production process (or manufacturing process) of a product including an aluminum 6xxx series alloy. Additionally, the recycled aluminum chip may be aluminum waste produced (or discharged) during a production process (or manufacturing process) of a product including an aluminum 7xxx series alloy.

According to one embodiment, the process of removing foreign substances (1013) may be a process of removing foreign substances contained in the regenerated aluminum chips. For example, the foreign substances may include foreign substances such as dust, foreign substances such as detergents, or foreign substances such as organic compounds.

According to one embodiment, the process (1013) for removing foreign substances may include a process (1111) for removing impurities using distilled water. For example, the process (1111) may be a process in which regenerated aluminum chips are introduced into distilled water, so that impurities (e.g., washing oil, scrap, or foreign substances) included in the regenerated aluminum chips float due to the buoyancy of the distilled water. In the process (1111), the aluminum ratio of the regenerated aluminum chips may increase as the impurities floated by the distilled water are separated (or removed). In the process (1111), the ratio of the volume of the distilled water to the volume of the regenerated aluminum chips may be 1:1 or 2:1, but is not limited thereto.

According to one embodiment, the process (1013) for removing foreign substances may include a process (1113) for removing organic substances through ultrasonic cleaning. For example, the process (1113) may be a process of removing organic substances (e.g., oil organic substances) contained in the regenerated aluminum chips by placing the regenerated aluminum chips in a cleaning solution (e.g., acetone solution) through ultrasonic cleaning. The ultrasonic cleaning may be performed for, for example, about 4 minutes to about 6 minutes or more. For example, the ultrasonic cleaning may be performed for about 5 minutes or more. In the process (1113), the ratio of the volume of the cleaning solution to the volume of the regenerated aluminum chips may be 1:1, but is not limited thereto. The process (1113) may be performed after the process (1111), but is not limited thereto and may be performed before the process (1111).

According to one embodiment, the process (1013) for removing foreign substances may include a process (1115) for drying the regenerated aluminum chips. The process (1115) for drying the regenerated aluminum chips may be a process for removing distilled water contained in the process (1111), a washing liquid contained in the process (1113), or other moisture contained in the regenerated aluminum chips. For example, the process (1115) for drying the regenerated aluminum chips may be a process for putting the regenerated aluminum chips into a dryer (e.g., a convection oven) and drying them at a temperature range of about 60 degrees to about 70 degrees and for a time range of about 4 hours or more. The temperature range may be, for example, about 50 degrees, and the time range may be about 5 hours or more.

According to one embodiment, the process (1013) for removing foreign substances may include a process (1117) for removing metallic foreign substances using a magnet. The process (1117) for removing metallic foreign substances using a magnet may be a process for magnetically separating (or removing) metallic foreign substances included in regenerated aluminum chips using a magnet (e.g., a neodymium magnet).

According to one embodiment, the process (1013) for removing foreign substances may include a process (1118) for heat treating the regenerated aluminum chips. The process (1118) for heat treating the regenerated aluminum chips may include a process for removing byproducts included in the regenerated aluminum chips by injecting a purge gas (e.g., an inert gas such as Ar, He, or Ne) onto the regenerated aluminum chips for about 10 hours. The process (1118) for heat treating the regenerated aluminum chips may include a process (or a heat treating process) for putting the regenerated aluminum chips, which have been subjected to the purge gas treatment, into a heater and heating the regenerated aluminum chips at a temperature range of about 300 degrees to about 500 degrees and for a time range of about 4 hours or more. The temperature range may be, for example, about 400 degrees, and the time range may be about 5 hours. In the process (1118), the regenerated aluminum chips may be provided with an antioxidant atmosphere.

According to one embodiment, the process of removing foreign substances (1013) may include a process of compressing recycled aluminum chips (1119). The process of compressing recycled aluminum chips (1119) may be a process of introducing recycled aluminum chips into a compressor and compressing the recycled aluminum chips to form a recycled aluminum block. The process (1119) may be a thermal compression process.

In one embodiment, the process (1010) for preparing recycled aluminum may include a process (1015) for melting virgin aluminum and recycled aluminum. The process (1015) may be performed after the process (1013) for removing foreign substances. The virgin aluminum may be, but is not limited to, a 1xxx series aluminum alloy, a 3xxx series aluminum alloy, or a 5xxx series aluminum alloy. The process (1015) for melting virgin aluminum and recycled aluminum may be a process for melting virgin aluminum and a recycled aluminum block produced by the process (1119). For example, the process for melting virgin aluminum and recycled aluminum may be a process for melting virgin aluminum by introducing virgin aluminum into a melter and melting it, and then introducing a recycled aluminum block into the virgin aluminum melt and stirring it to melt it. In the process (1015), the weight ratio of the virgin aluminum and the recycled aluminum block may be about 1:1, but is not limited thereto. For example, the weight ratio of the recycled aluminum block to the total weight of the virgin aluminum and recycled aluminum blocks may be about 50% to about 70%. When the molten liquid of the virgin aluminum and recycled aluminum blocks is cooled, recycled aluminum may be formed. The process (1015) may be a casting process of melting the virgin aluminum and recycled aluminum blocks in a meting furnace and then cooling them. The virgin aluminum may be defined and/or interpreted as casting preparations. In the melting process (1015), a separate additive (e.g., a metal additive) may be added to adjust the mechanical properties of the outer cover (280), but is not limited thereto.

In one embodiment, the recycled aluminum manufactured by mixing virgin aluminum and recycled aluminum blocks can have a relatively high silicon (Si) content and a relatively low zinc (Zn) content when compared to a typical aluminum 6xxx series alloy or a typical aluminum 7xxx series alloy at the same mass. Table 1 below is a table comparing the composition ratio according to a comparative example with the composition ratios according to Examples 1 and 2 of the present disclosure.

Silicon (Si) Iron (Fe) Copper (Cu) Manganese (Mn) Magnesium (Mg) Chromium (Cr) Zinc (Zn) Comparative example 0.07 0.12 0.35 0.24 2.3 0.007 6.15 Example 1 0.1457 0.1620 0.2516 0.0769 0.6250 0.0013 1.9315 Example 2 0.1730 0.1514 0.3415 0.1017 0.9342 0.0023 2.7867

Example 1 of Table 1 shows a case where, when manufacturing recycled aluminum, the weight ratio of recycled aluminum blocks is 50% with respect to the total weight of recycled aluminum. Example 2 of Table 1 shows a case where, when manufacturing recycled aluminum, the weight ratio of recycled aluminum blocks is 70% with respect to the total weight of recycled aluminum. The composition ratios of the components described in Table 1 are the composition ratios of the remaining components excluding aluminum, based on a composition ratio of 100% of each of the aluminum of the comparative example, the recycled aluminum of Example 1, and the recycled aluminum of Example 2. Referring to Table 1, it can be confirmed that, in the case of Examples 1 and 2, the silicon (Si) component has a composition ratio of about 0.14% or more. It can be confirmed that, in the case of Examples 1 and 2, the silicon (Si) component is relatively high compared to the comparative example. For example, recycled aluminum may have a relatively high silicon (Si) component due to the addition of glass impurities during the processing of aluminum waste. In the case of Examples 1 and 2, it can be confirmed that the zinc (Zn) component has a composition ratio of about 2.7% or less. In the case of Examples 1 and 2, it can be confirmed that the zinc (Zn) component is relatively low compared to the comparative example. For example, since virgin aluminum is added during the manufacture of the recycled aluminum, the zinc (Zn) component may appear relatively low. According to one embodiment, a process for manufacturing an outer cover (e.g., an outer cover (280) of FIGS. 4 to 7) may further include a process (1030) of applying a metal powder to one surface of the recycled aluminum, which is performed after the process (1010) of preparing the recycled aluminum. The recycled aluminum may be the recycled aluminum manufactured by the process (1015). The metal powder may include one of a titanium powder and a stainless steel powder. The particle size (e.g., diameter) of the metal powder may be about 15 um to about 43 um (micrometer). For example, the metal powder may include titanium powder, and the titanium powder may be applied to one surface of the recycled aluminum. For example, the metal powder may include stainless steel powder, and the stainless steel powder may be applied to one surface of the recycled aluminum. Hereinafter, for convenience of explanation, an example in which the metal powder is titanium powder will be described, but the explanation thereof may be equally applied and/or understood even in the case in which the metal powder is stainless steel powder. According to one embodiment, the manufacturing process of the outer cover (280) may include a process (1050) of bonding the metal powder and the recycled aluminum through 3D printing, which is performed after the process of applying the metal powder. The 3D printing may include at least one of SLS (selective laser sintering) printing, DED (directed energy deposition) printing, EBM (electron beam melting) printing, or SLM (selective laser melting) printing. In one embodiment, by melting the metal powder using a 3D printing laser, the metal powder can be bonded (or combined) to one surface of the recycled aluminum. When the metal powder is melted by 3D printing, the metal powder can form a second material (e.g., the second material (282) of FIGS. 4 to 7) of the outer cover (280). In addition, since the melting point of the titanium powder is relatively higher than the melting point of the recycled aluminum, one surface of the recycled aluminum can also be melted together with the metal powder including the titanium powder. Accordingly, the metal powder can be melted to form the second material (282), and one surface of the recycled aluminum can be melted to form at least one pattern structure (e.g., at least one pattern structure (285) of FIGS. 4 to 7) together with the second material (282). When one surface of the recycled aluminum is melted, the recycled aluminum can form a first material (e.g., the first material (281) of FIGS. 4 to 7). Accordingly, the outer cover (280) can be manufactured by combining the recycled aluminum and the metal powder. Since the outer cover (280) includes at least one pattern structure (285), the bonding area (or bonding area) of the first material (281) and the second material (282) can be increased, and the bonding force (or bonding force) of the first material (281) and the second material (282) can be improved. Through 3D printing, as the metal powder and the recycled aluminum are combined, the first material (281) and the second material (282) can be bonded through physical bonding and/or chemical bonding. For example, since the first material (281) and the second material (282) are bonded through 3D printing, at least one pattern structure (285) can be formed. For example, when a first material and a second material are combined through a rolling process (e.g., a thermocompression process) by a rolling mill, it may be difficult to form at least one pattern structure on the combined surface of the first material and the second material.

According to one embodiment, the outer cover (280) manufactured by the above processes may include a first material (281), a second material (282) (e.g., a second material formed by melting titanium powder), and at least one pattern structure (285). The strength of the second material (282) may be greater than the strength of the first material (281). For example, since the second material (282) is formed using titanium powder or stainless steel powder having relatively high strength with respect to recycled aluminum, the strength of the second material (282) may be greater than the strength of the first material (281). For example, the tensile strength of the second material (282) may be about 1200 MPa to about 1300 MPa, and the tensile strength of the first material (281) may be about 230 MPa to about 250 MPa. For example, the yield strength of the second material (282) may be greater than the yield strength of the first material (281). For example, the yield strength of the second material (282) may be about 1100 MPa to about 1200 MPa, and the yield strength of the first material (281) may be about 200 MPa to about 220 MPa. In addition, the elongation rate of the second material (282) may be greater than the elongation rate of the first material (281). For example, the elongation rate of the second material (282) may be about 7% to about 9%, and the elongation rate of the first material (281) may be about 3.5% to about 6%. The elongation rate of the second material (282) may be about 8%.

According to one embodiment, the outer cover (280) manufactured by the above processes may be improved in terms of environmental friendliness and/or economic efficiency by including recycled aluminum. In addition, the outer cover (280) manufactured by the above processes may be improved in terms of overall rigidity of the outer cover (280) by including the first material (281) formed of recycled aluminum and the second material (282) having greater strength than the first material (281).

According to one embodiment, the outer cover (280) manufactured by the above processes may be defined and/or interpreted as a clad bonding of a first material (281) including recycled aluminum and a second material (282) including titanium (or stainless steel). For example, the outer cover (280) may be defined and/or interpreted as a bonding of dissimilar materials.

According to one embodiment, the outer cover (280) manufactured by the above processes may have improved wear resistance characteristics compared to a general aluminum alloy because it includes recycled aluminum.

Figure 11 is a drawing showing the outer surface of an outer cover according to a comparative example.

FIG. 12 is a drawing showing an outer surface of an outer cover according to one embodiment of the present disclosure.

The embodiments of FIGS. 11 to 12 may be combined with the embodiments of FIGS. 1 to 10, or the embodiments of FIGS. 13 to 18d.

Fig. 11 shows the outer surface of general stainless steel, and Fig. 12 shows the outer surface of an outer cover (e.g., the outer cover (280) of Figs. 4 to 7). The outer surface of the outer cover illustrated in Fig. 12 is the outer surface of a second material (e.g., the second material (282) of Figs. 4 to 7), and shows the outer surface of the second material (282) formed by melting titanium powder through 3D printing.

According to one embodiment, the outer surface of the second material (282) formed by melting titanium powder through 3D printing (e.g., see FIG. 12) can be confirmed to have a relatively large number of wave patterns or beading patterns formed compared to the outer surface of general stainless steel (e.g., see FIG. 11).

FIGS. 13, 14, 15, 16, and 17 are drawings showing an outer surface of an outer cover according to one embodiment of the present disclosure.

The embodiments of FIGS. 13 to 17 may be combined with the embodiments of FIGS. 1 to 16, or the embodiments of FIGS. 18a to 18d.

The outer cover of FIGS. 13 to 17 (e.g., the outer cover (280) of FIGS. 4 to 7) may be an outer cover (280) that has undergone a post-processing process in order to provide various designs. For example, the post-processing process may include at least one of a PVD (physical vapor deposition) process, a double anodizing process, a tool press process, or an anodic oxidation process. For example, the outer cover (280) may be subjected to the post-processing process in order to provide a visual appearance effect of color, glitter, or a boundary line of a pattern to the outer surface of the outer cover (280).

FIGS. 18a, 18b, 18c, and 18d are cross-sectional views of an outer cover according to one embodiment of the present disclosure.

The embodiments of FIGS. 18a to 18d may be combined with the embodiments of FIGS. 1 to 17.

Referring to FIGS. 18A to 18D , the outer cover (280) (e.g., the outer cover (280) of FIGS. 4 to 7 ) may include a first material (281) (e.g., the first material (281) of FIGS. 4 to 7 ), a second material (282) (e.g., the second material (282) of FIGS. 4 to 7 ), or at least one pattern structure (285) (e.g., at least one pattern structure (285) of FIGS. 4 to 7 ).

According to one embodiment, as the second material (282) is bonded to one surface of the first material (281) through 3D printing, at least one pattern structure (285) can increase the bonding area (or bonding area) of the first material (281) and the second material (282). Accordingly, the bonding strength of the first material (281) and the second material (282) can be improved. In addition, as the second material (282) is formed by melting metal powder through 3D printing, the at least one pattern structure (285) can have various cross-sectional shapes, as illustrated in FIGS. 18A to 18D. The cross-sectional shape of the at least one pattern structure (285) of the outer cover (280) is not limited to the illustrated embodiments, and can have various shapes depending on design changes.

Since electronic devices are susceptible to damage due to external physical impact, they may include an external cover that forms the exterior of the electronic device. The external cover can be manufactured in various ways.

The outer cover may be made of a metal material such as aluminum, stainless steel, titanium and/or magnesium to provide the user with an attractive, high-gloss design.

In response to recent climate change, as the use of ESG (Environmental, Social and Governance) products increases, research is also increasing on using ESG products for the external covers of electronic devices.

In general, the outer cover containing aluminum may use aluminum 6xxx series alloy or aluminum 7xxx series alloy to provide high strength to the electronic device. At this time, aluminum waste is generated, but a method for recycling the aluminum waste has not been suggested.

According to one embodiment of the present disclosure, an outer cover including recycled aluminum formed by recycling aluminum waste, an electronic device including the same, and a method for manufacturing the same can be provided.

According to one embodiment of the present disclosure, an outer cover including recycled aluminum capable of implementing various CMF (color, material, finishing) designs, an electronic device including the same, and a method of manufacturing the same can be provided.

However, the problems to be solved in the present disclosure are not limited to the problems mentioned above, and may be determined in various ways without departing from the spirit and scope of the present disclosure.

According to one embodiment of the present disclosure, by providing an outer cover manufactured using recycled aluminum, environmental friendliness and/or economic efficiency can be improved.

According to one embodiment of the present disclosure, an outer cover capable of implementing various CMFs, an electronic device including the same, and a method of manufacturing the same are provided, thereby providing a sense of beauty to a user.

The effects obtainable from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by a person skilled in the art to which the present disclosure belongs from the description below.

According to one embodiment of the present disclosure, the outer cover (280) may include a first material (281) or a second material (282). The first material (281) may include recycled aluminum. The second material (282) may be combined with the first material (281). The second material (282) may include a metal having a relatively higher strength than the recycled aluminum. At least one pattern structure (285) may be formed on a surface where the first material (281) and the second material (282) are combined.

In one embodiment, the second material (282) may include one of titanium or stainless steel.

In one embodiment, the recycled aluminum may include at least one of an aluminum 6xxx series alloy or an aluminum 7xxx series alloy.

In one embodiment, the yield strength of the second material (282) may be greater than the yield strength of the first material (281).

In one embodiment, the yield strength of the first material (281) may be 200 MPa to 220 MPa. The yield strength of the second material (282) may be 1100 MPa to 1200 MPa.

In one embodiment, the tensile strength of the second material (282) may be greater than the tensile strength of the first material (281).

According to one embodiment, the tensile strength of the first material (281) may be 230 MPa to 250 MPa. The tensile strength of the second material (282) may be 1200 MPa to 1300 MPa.

In one embodiment, the elongation of the first material (281) may be less than the elongation of the second material (282).

According to one embodiment, the elongation of the first material (281) may be 3.5% to 6%. The elongation of the second material (282) may be 7% to 9%.

According to one embodiment, the at least one pattern structure (285) may be formed by melting a portion of the first material (281) and a portion of the second material (282).

According to one embodiment, the at least one pattern structure (285) can be formed by a 3D printing process.

According to one embodiment, the at least one pattern structure (285) may include a flat portion (2851) or an inclined portion (2852). The flat portion (2851) may be arranged parallel to the outer surface of the second material (282). The inclined portion (2852) may be inclined with respect to the flat portion (2851).

According to one embodiment, the at least one pattern structure (285) may include a first flat portion (2855), a second flat portion (2857), or an inclined portion (2856). The first flat portion (2855) may be arranged parallel to an outer surface of the second material (282). The second flat portion (2857) may be spaced apart from the first flat portion (2855). The second flat portion (2857) may be arranged parallel to the first flat portion (2855). The inclined portion (2856) may be connected to the first flat portion (2855) and the second flat portion (2857).

In one embodiment, the inclined portion (2856) can form an acute angle with respect to the first flat portion (2855). The inclined portion (2856) can form an acute angle with respect to the second flat portion (2857).

According to one embodiment of the present disclosure, the electronic device (200) may include a housing (210) or a display (220). The housing (210) may include an outer cover (280). The display (220) may be disposed in the housing (210). The outer cover (280) may include a first material (281) or a second material (282). The first material (281) may include recycled aluminum. The second material (282) may be combined with the first material (281). The second material (282) may include a metal having a relatively higher strength than the recycled aluminum. At least one pattern structure (285) may be formed on a surface where the first material (281) and the second material (282) are combined.

According to one embodiment of the present disclosure, a method for manufacturing an outer cover (280) may include a process of preparing recycled aluminum, a process of applying metal powder to one surface of the recycled aluminum, or a process of bonding the metal powder and the recycled aluminum through 3D printing.

In one embodiment, the recycled aluminum may include at least one of an aluminum 6xxx series alloy or an aluminum 7xxx series alloy.

In one embodiment, the metal powder may include one of titanium powder or stainless steel powder.

In one embodiment, the process for preparing the recycled aluminum may include a process for preparing recycled aluminum chips, a process for removing foreign substances, or a process for melting virgin aluminum and recycled aluminum.

According to one embodiment, the process for removing the foreign matter may include a process for removing impurities through distilled water, a process for removing organic matter through ultrasonic washing, a process for drying the regenerated aluminum chips, a process for removing metallic foreign matters through a magnet, a process for heat-treating the regenerated aluminum chips, or a process for compressing the regenerated aluminum chips.

Although the detailed description of this document has described specific embodiments, it will be apparent to those skilled in the art that various modifications may be made without departing from the scope of this document.

Claims (15)

In the outer cover (280), A first material (281) comprising recycled aluminum; and A second material (282) is combined with the first material (281) and includes a metal having a relatively higher strength than the recycled aluminum. An outer cover having at least one pattern structure (285) formed on the surface where the first material (281) and the second material (282) are combined. In the first paragraph, The above second material (282) is, An outer cover comprising either titanium or stainless steel. In any one of paragraphs 1 and 2, The above recycled aluminum is, An outer cover comprising at least one of an aluminum 6xxx series alloy or an aluminum 7xxx series alloy. In any one of paragraphs 1 to 3, An outer cover in which the yield strength of the second material (282) is greater than the yield strength of the first material (281). In any one of paragraphs 1 to 4, The yield strength of the above first material (281) is 200 MPa to 220 MPa, The outer cover has a yield strength of the second material (282) of 1100 MPa to 1200 MPa. In any one of paragraphs 1 to 5, An outer cover in which the tensile strength of the second material (282) is greater than the tensile strength of the first material (281). In any one of paragraphs 1 to 6, The tensile strength of the first material (281) is 230 MPa to 250 MPa, The tensile strength of the second material (282) is 1200 MPa to 1300 MPa. In any one of paragraphs 1 to 7, An outer cover in which the elongation of the first material (281) is smaller than that of the second material (282). In any one of paragraphs 1 to 8, The elongation of the above first material (281) is 3.5% to 6%, An outer cover having an elongation of the second material (282) of 7% to 9%. In any one of paragraphs 1 to 9, The above at least one pattern structure (285) is an outer cover formed by melting a part of the first material (281) and a part of the second material (282). In any one of paragraphs 1 to 10, The above at least one pattern structure (285) is an outer cover formed by a 3D printing process. In any one of paragraphs 1 to 11, At least one pattern structure (285) above, An outer cover including a flat portion (2851) arranged parallel to the outer surface of the second material (282) and an inclined portion (2852) inclined with respect to the flat portion (2851). In any one of paragraphs 1 to 12, At least one pattern structure (285) above, A first flat portion (2855) arranged parallel to the outer surface of the second material (282); A second flat portion (2857) spaced apart from the first flat portion (2855) and arranged parallel to the first flat portion (2855); and An outer cover including an inclined portion (2856) connected to the first flat portion (2855) and the second flat portion (2857). In any one of paragraphs 1 to 13, The above-mentioned inclined portion (2856) is an outer cover that forms an acute angle with respect to the first flat portion (2855) and forms an acute angle with respect to the second flat portion (2857). In an electronic device (200), A housing (210) including an outer cover (280); and Includes a display (220) placed in the above housing (210), The above outer cover (280) is A first material (281) comprising recycled aluminum; and A second material (282) is combined on one side of the first material (281) and includes a metal having a relatively higher strength than the recycled aluminum. The surface where the first material (281) and the second material (282) are combined is An electronic device having at least one pattern structure (285) formed thereon.

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