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WO2024257303A1 - Dispositif de fourniture de puce - Google Patents

Dispositif de fourniture de puce Download PDF

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Publication number
WO2024257303A1
WO2024257303A1 PCT/JP2023/022246 JP2023022246W WO2024257303A1 WO 2024257303 A1 WO2024257303 A1 WO 2024257303A1 JP 2023022246 W JP2023022246 W JP 2023022246W WO 2024257303 A1 WO2024257303 A1 WO 2024257303A1
Authority
WO
WIPO (PCT)
Prior art keywords
nozzle
die
suction nozzle
head
suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2023/022246
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English (en)
Japanese (ja)
Inventor
正樹 村井
路暁 服部
義史 大参
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to PCT/JP2023/022246 priority Critical patent/WO2024257303A1/fr
Publication of WO2024257303A1 publication Critical patent/WO2024257303A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

Definitions

  • This disclosure relates to a die supply device that supplies dies from a die assembly formed by dicing a wafer.
  • Patent Document 1 describes a die supplying device equipped with a removal head that removes dies from the die assembly.
  • the removal head uses a nozzle to remove the die attached to the dicing sheet, turns it over, and hands it over to the mounting head.
  • This disclosure has been made in consideration of such circumstances, and aims to provide a die supplying device that can reduce the burden of managing replacement nozzles in a die supplying device that replaces the suction nozzles of the flip head and the suction nozzles of the supplying head.
  • this specification discloses a die supply device comprising: a flip head having a first nozzle attachment part to which a first suction nozzle can be attached and detached, and which uses the first suction nozzle to pick up a die from a die assembly obtained by dicing a wafer; an inversion mechanism which inverts the flip head and switches the front and back of the die picked up by the first suction nozzle; a supply head having a second nozzle attachment part to which a second suction nozzle can be attached and which uses the second suction nozzle to pick up the die picked up by the flip head and supplies the die picked up by the second suction nozzle; and a nozzle station which houses both the first suction nozzle for replacement and the second suction nozzle for replacement.
  • the nozzle station accommodates both the first and second replacement suction nozzles.
  • the replacement of the suction nozzle is performed by different methods, so there is a risk that the management of the first and second suction nozzles will become cumbersome.
  • the two heads need to be moved to different locations for replacement, which complicates the mechanism for moving the heads and the control of the heads.
  • both the first replacement suction nozzle attached to the flip head and the second replacement suction nozzle attached to the supply head can be managed in one nozzle station.
  • by controlling each head it is possible to automatically replace both the first and second suction nozzles. It also reduces the workload of managing replacement suction nozzles, such as replacing replacement suction nozzles in the nozzle station and checking the suction nozzles stored in the nozzle station.
  • FIG. 2 is a perspective view of a die supply device according to an embodiment.
  • FIG. 2 is a block diagram of a die supply device.
  • FIG. 2 is a perspective view of a flip mechanism, a transfer mechanism, and a nozzle station mechanism.
  • FIG. 2 is a perspective view of a transfer mechanism, a shuttle mechanism, and a nozzle station mechanism.
  • FIG. 4 is a perspective view of the transfer mechanism as viewed from below.
  • FIG. 2 is a perspective view of the shuttle mechanism as seen from above.
  • FIG. 2 is a perspective view of a nozzle station.
  • FIG. 2 is an exploded perspective view of a first nozzle mounting portion and a first suction nozzle.
  • FIG. 11 is a perspective view of a first suction nozzle as viewed from a mounting surface side where the first suction nozzle is mounted to the first nozzle mounting portion.
  • FIG. 13 is a perspective view showing a state in which the first suction nozzle is accommodated in the nozzle station.
  • 13A and 13B are diagrams illustrating a first suction nozzle and a first nozzle mounting portion according to another example.
  • FIG. 1 shows a perspective view of the die supply device 10 of this embodiment.
  • FIG. 2 shows a block diagram of the die supply device 10.
  • the die supply device 10 includes an apparatus main body 11 and a wafer supply unit 12. Note that in FIG. 1, the apparatus cover of the apparatus main body 11 is illustrated by a dashed line, and the apparatus cover of the wafer supply unit 12 is omitted. In the following description, as shown in FIG.
  • the front-rear direction (or Y-axis direction), the left-right direction (or X-axis direction), and the up-down direction (or Z-axis direction) are described based on the viewpoint of a user looking at the die supply device 10 from the front.
  • the front-rear direction and the left-right direction are directions parallel to the plane of the substrate transported by the substrate transport unit 14 described later.
  • the wafer supply unit 12 is detachably attached to the front end of the device body 11.
  • the wafer supply unit 12 supplies dies (wafer parts) 22 from the die assembly 21 based on the control of the control device 19 (see FIG. 2) of the device body 11.
  • the wafer supply unit 12 is a device that supplies dies 22 to the flip mechanism 15 and the transfer mechanism 16 of the device body 11, and is equipped with a magazine 24 that can store multiple wafer frames 23.
  • the wafer frame 23 is, for example, a member that fixes a dicing sheet to which the die assembly 21 is attached in a flat plate shape, and multiple wafer frames 23 are stored in the magazine 24.
  • the die assembly 21 is formed, for example, by dicing a wafer to which a dicing sheet is attached.
  • the manufacturing process of the die assembly 21 is not limited to the above-mentioned method, and may be, for example, a wafer that is diced (half-cut) in only half of the thickness direction, a dicing sheet is attached to the wafer, the back surface is polished, and the dicing sheet is removed and separated by a laser or the like. That is, the die assembly 21 may be an assembly of dies 22 divided by dicing a wafer, and the manufacturing process and supply method are not limited. Also, the die assembly 21 may be peeled off from the dicing sheet when it is stored in the magazine 24, and may be in a state in which multiple dies 22 are lined up.
  • the wafer supply unit 12 is equipped with a wafer frame pull-out mechanism 31 (see FIG. 2) that removes a desired wafer frame 23 from the magazine 24.
  • the wafer frame pull-out mechanism 31 has, for example, an electromagnetic motor 31A (see FIG. 2) as a drive source, and drives the electromagnetic motor 31A under the control of the control device 19 to remove a desired wafer frame 23 from among the multiple wafer frames 23 stored in the magazine 24.
  • the wafer frame pull-out mechanism 31 moves the desired wafer frame 23 in the front-rear direction, and moves the wafer frame 23 between the storage position P1 and the die supply position P2.
  • the drive source of the wafer frame pull-out mechanism 31 is not limited to the electromagnetic motor 31A, and may be other motors such as a linear motor. Alternatively, the drive source may be a fluid pressure cylinder such as an air cylinder or a hydraulic cylinder. Therefore, the drive source is not limited to a motor. The same applies to the drive sources of other devices and mechanisms.
  • the storage position P1 is a position (position within the magazine 24) where the wafer frame 23 (die assembly 21) is stored in the magazine 24.
  • the die supply position P2 is a position where the die 22 is sucked from the die assembly 21 by the first suction nozzle 43 (see FIG. 4) of the flip mechanism 15.
  • the wafer frame pull-out mechanism 31 replaces the die 22 arranged below the first suction nozzle 43 of the flip mechanism 15 by moving the wafer frame 23 arranged at the die supply position P2 in the left-right direction.
  • the wafer frame pull-out mechanism 31 is equipped with, for example, a push-up mechanism (not shown) that drives a pin that pushes up from below the attached portion of the die 22 sucked by the first suction nozzle 43 of the die assembly 21, and a pot (not shown) that sucks the dicing sheet when pushing up, and peels off the desired die 22 from the dicing sheet and supplies it to the first suction nozzle 43.
  • a push-up mechanism (not shown) that drives a pin that pushes up from below the attached portion of the die 22 sucked by the first suction nozzle 43 of the die assembly 21, and a pot (not shown) that sucks the dicing sheet when pushing up, and peels off the desired die 22 from the dicing sheet and supplies it to the first suction nozzle 43.
  • the die supply device 10 also includes a part camera 29 that captures images of the dies 22 arranged in the die assembly 21 from above.
  • the part camera 29 outputs the captured image data to the control device 19 (see FIG. 2).
  • the control device 19 Based on the image data from the part camera 29, the control device 19 confirms the position of the die 22 that is attracted to the flip mechanism 15 or the transfer mechanism 16, and corrects any positional errors.
  • the device main body 11 is equipped with a substrate transport unit 14, a flip mechanism 15, a transfer mechanism 16, a shuttle mechanism 17, and a nozzle station mechanism 18.
  • the substrate transport unit 14 is a device that transports a substrate (not shown) on which a die 22 is mounted.
  • the substrate transport unit 14 has, for example, two lanes aligned in the front-to-rear direction, and transports substrates in each lane.
  • the die supply device 10 is connected to an upstream device and a downstream device in the substrate manufacturing line, and can link the lanes of the substrate transport unit 14.
  • the substrate transport unit 14 transports substrates transported from the upstream device to the downstream device in each lane.
  • FIG. 3 shows a perspective view of the flip mechanism 15, the transfer mechanism 16, and the nozzle station mechanism 18.
  • FIG. 4 shows an enlarged view of the flip mechanism 15. Note that FIG. 3 and FIG. 5, which will be described later, show the state in which the wafer frame 23 has been removed from the wafer frame pull-out mechanism 31.
  • FIG. 4 also shows a schematic diagram of the die 22 of the die assembly 21.
  • the flip mechanism 15 is disposed above the die assembly 21 disposed at the die supply position P2 and the nozzle station mechanism 18.
  • the flip mechanism 15 includes a Y-axis slide mechanism 33, a Z-axis slide mechanism 34, and a flip head 35.
  • the Y-axis slide mechanism 33 includes a Y-axis slide rail 33A and a Y-axis slider 33B.
  • the Y-axis slide rail 33A is a rail provided on the left side surface of the Y-axis slide mechanism 33 and extends in a direction parallel to the front-rear direction.
  • the Y-axis slider 33B is held by the Y-axis slide rail 33A so as to be slidable in the Y-axis direction (front-rear direction).
  • the Y-axis slide mechanism 33 includes an electromagnetic motor 33C (see FIG. 2), and drives the electromagnetic motor 33C based on the control of the control device 19 to move the Y-axis slider 33B to an arbitrary position in the front-rear direction.
  • the Z-axis slide mechanism 34 has a Z-axis slide rail 34A and a Z-axis slider 34B.
  • the Z-axis slide rail 34A is a rail that is provided on the left side surface of the Y-axis slider 33B and extends in a direction parallel to the vertical direction.
  • the Z-axis slider 34B is held by the Z-axis slide rail 34A so that it can slide in the Z-axis direction (vertical direction).
  • the Z-axis slide mechanism 34 has an electromagnetic motor 34C (see Figure 2), and drives the electromagnetic motor 33C under the control of the control device 19 to move the Z-axis slider 34B to any position in the vertical direction.
  • a rotation motor 38 that rotates the flip head 35 is attached to the left side of the Z-axis slider 34B.
  • the rotation motor 38 is, for example, an electromagnetic motor, and is driven under the control of the control device 19 to rotate the output shaft 38A.
  • the flip head 35 is attached to the tip of the output shaft 38A and rotates based on the drive of the rotation motor 38.
  • the rotation motor 38 rotates the flip head 35, for example, around an axis parallel to the front-rear direction (Y-axis direction).
  • the flip head 35 is provided with a pair of first nozzle mounting parts 41.
  • a first suction nozzle 43 can be mounted on each of the pair of first nozzle mounting parts 41. Therefore, two first suction nozzles 43 can be mounted on the flip head 35.
  • the number of first nozzle mounting parts 41 provided on the flip head 35 and the number of first suction nozzles 43 that can be mounted on the flip head 35 are not limited to two, but may be one, or three or more.
  • a configuration in which multiple first suction nozzles 43 can be mounted on one first nozzle mounting part 41 is also possible.
  • the first suction nozzle 43 is replaceable with a replacement first suction nozzle 43 stored in the nozzle station 61 of the nozzle station mechanism 18.
  • the first suction nozzle 43 mounted on the first nozzle mounting section 41 will be referred to as the first suction nozzle 43A
  • the replacement first suction nozzle 43 housed in the nozzle station 61 will be referred to as the first suction nozzle 43B.
  • the two first suction nozzles 43A and 43B collectively they will be referred to as the first suction nozzle 43.
  • the second suction nozzle 56 of the transfer head 54 which will be described later.
  • the die supply device 10 is equipped with a pressure supply device 27 (see FIG. 2) that supplies air at a predetermined pressure to each device.
  • Each of the pair of first nozzle mounting parts 41 is connected to the pressure supply device 27.
  • the first suction nozzle 43 for example, sucks the die 22 by being supplied with negative pressure from the pressure supply device 27 via the first nozzle mounting part 41, and releases the sucked die 22 by being supplied with positive pressure.
  • the flip head 35 is attached to the Z-axis slider 34B via the swivel motor 38. Therefore, the flip head 35 can be moved to any position in the front-rear direction and the up-down direction based on the drive of the Y-axis slide mechanism 33 and the Z-axis slide mechanism 34.
  • the wafer frame pull-out mechanism 31 can move the wafer frame 23 arranged at the die supply position P2 in the left-right direction. This allows the flip head 35 to suck the desired die 22 from the die assembly 21 using the first suction nozzle 43.
  • the first nozzle mounting portion 41 extends radially outward from the center of rotation of the flip head 35, and a first suction nozzle 43 is attached to the tip.
  • one first nozzle mounting portion 41 is, for example, point-symmetrical with the other first nozzle mounting portion 41 with respect to the center of rotation of the flip head 35. Therefore, each of the pair of first nozzle mounting portions 41 is provided at a rotational position shifted by 180 degrees in the rotation direction (circumferential direction) of the flip head 35.
  • the pair of first nozzle mounting portions 41 when one first nozzle mounting portion 41 has its tip facing upward, the other first nozzle mounting portion 41 has its tip facing downward.
  • the first nozzle mounting portion 41 suctions the die 22 from the die assembly 21 with its tip facing downward.
  • the die 22 adsorbed to the first nozzle mounting part 41 is reversed (flipped) by, for example, rotating the flip head 35 180 degrees so that the non-mounting surface faces upward.
  • the transfer mechanism 16 acquires the die 22 from the first nozzle mounting part 41 facing upward.
  • Fig. 5 shows a perspective view of the transfer mechanism 16, the shuttle mechanism 17, and the nozzle station mechanism 18.
  • Fig. 6 shows a perspective view of the transfer mechanism 16 seen from below. As shown in Figs. 3, 5, and 6, the transfer mechanism 16 is disposed on the rear side of the flip mechanism 15.
  • the transfer mechanism 16 includes an X-axis slide mechanism 51, a Y-axis slide mechanism 52, a Z-axis slide mechanism 53, and a transfer head 54.
  • the Y-axis slide mechanism 52 has a pair of Y-axis slide rails 52A and a Y-axis slider 52B.
  • the pair of Y-axis slide rails 52A are provided on the upper part of the device main body 11 in the left-right direction.
  • the pair of Y-axis slide rails 52A are arranged parallel to each other with a predetermined gap between them in the left-right direction, and each extends in a direction parallel to the front-rear direction.
  • the Y-axis slider 52B extends in the left-right direction so as to straddle both of the pair of Y-axis slide rails 52A.
  • the Y-axis slide mechanism 52 has an electromagnetic motor 52C (see FIG. 2), and drives the electromagnetic motor 52C based on the control of the control device 19 to move the Y-axis slider 52B to any position in the front-rear direction.
  • the X-axis slide mechanism 51 is attached to the Y-axis slider 52B and has an X-axis slide rail 51A and an X-axis slider 51B.
  • the X-axis slide rail 51A is a rail provided on the front surface of the Y-axis slider 52B and extends in a direction parallel to the left-right direction.
  • the X-axis slider 51B is held by the X-axis slide rail 51A so that it can slide in the X-axis direction (left-right direction).
  • the X-axis slide mechanism 51 has an electromagnetic motor 51C (see Figure 2), and drives the electromagnetic motor 51C under the control of the control device 19 to move the X-axis slider 51B to any position in the left-right direction.
  • the Z-axis slide mechanism 53 has a Z-axis slide rail 53A and a Z-axis slider 53B.
  • the Z-axis slide rail 53A is a rail that is provided on the front surface of the X-axis slider 51B and extends in a direction parallel to the vertical direction.
  • the Z-axis slider 53B is held slidably in the Z-axis direction by the Z-axis slide rail 53A, and can move to any position in the vertical direction based on the drive of the electromagnetic motor 53C (see Figure 2).
  • the transfer head 54 is attached to the front surface of the Z-axis slider 53B. Therefore, the transfer head 54 can be moved to any position in the front-rear direction, left-right direction, and up-down direction based on the driving of the X-axis slide mechanism 51, the Y-axis slide mechanism 52, and the Z-axis slide mechanism 53.
  • the transfer head 54 is provided with a plurality of second nozzle mounting parts 55. In the transfer head 54 of this embodiment, eight second nozzle mounting parts 55 are provided.
  • the eight second nozzle mounting parts 55 are, for example, four second nozzle mounting parts 55 arranged in two rows in the front-rear direction, arranged in the left-right direction at a predetermined pitch.
  • the second suction nozzle 56 is detachably attached to each of the eight second nozzle mounting parts 55.
  • the transfer head 54 uses the eight second suction nozzles 56 to suck the die 22 inverted by the flip head 35 from the first suction nozzle 43.
  • the transfer head 54 directly picks up the dies 22 from the die assembly 21 using the second suction nozzle 56.
  • the transfer head 54 supplies the dies 22 picked up by the second suction nozzle 56 to the shuttle mechanism 17.
  • the number of second nozzle mounting parts 55 provided on the transfer head 54, the arrangement of the second nozzle mounting parts 55, and the number of second suction nozzles 56 that can be mounted on the transfer head 54 are merely examples.
  • the transfer head 54 may be provided with only one second nozzle mounting part 55.
  • Each of the multiple second nozzle mounting parts 55 is connected to a pressure supply device 27 (see FIG. 2).
  • the second suction nozzle 56 is supplied with negative pressure via the second nozzle mounting part 55 to suction the die 22, and is supplied with positive pressure to release the adsorbed die 22.
  • the transfer head 54 is also provided with a nozzle switching mechanism 57 (see FIG. 2) that individually raises and lowers the multiple second nozzle mounting parts 55.
  • the nozzle switching mechanism 57 includes, for example, a ball screw mechanism, and individually changes the vertical positions of the multiple second nozzle mounting parts 55. This allows the vertical position of any second suction nozzle 56 to be changed, and the second suction nozzle 56 to be sucked or released can be switched.
  • the shuttle mechanism 17 is disposed above the wafer frame pull-out mechanism 31 and below the transfer mechanism 16 in the vertical direction.
  • the shuttle mechanism 17 has an X-axis slide rail 17A and an X-axis slider 17B.
  • the X-axis slide rail 17A is a rail extending in a direction parallel to the left-right direction.
  • the X-axis slider 17B is held by the X-axis slide rail 17A so as to be slidable in the left-right direction.
  • the shuttle mechanism 17 moves the X-axis slider 17B, for example, in the left-right direction based on the drive of the electromagnetic motor 17C, between a receiving position P5 and a delivery position P6.
  • the receiving position P5 is the left end of the X-axis slide rail 17A, and is the position where the die 22 is received from the second suction nozzle 56 of the transfer head 54.
  • the transfer position P6 is the right end of the X-axis slide rail 17A. As shown in FIG. 1, the right end of the X-axis slide rail 17A protrudes to the right from an opening formed on the right side of the device main body 11 and is disposed outside the device main body 11.
  • a component mounting device (not shown) is disposed on the right side of the die supply device 10. This component mounting device carries in a substrate from the substrate transport unit 14 of the die supply device 10, receives the die 22 supplied from the shuttle mechanism 17 of the die supply device 10 at the transfer position P6, and attaches it to the carried-in substrate.
  • a shuttle 17D is attached to the top surface of the X-axis slider 17B.
  • the shuttle 17D is, for example, a metal plate, and is attached to the X-axis slider 17B with its flat surface facing upward.
  • a plurality of intake ports 17E are formed in the shuttle 17D.
  • the plurality of intake ports 17E are formed at positions corresponding to the positions of the eight second suction nozzles 56 of the transfer head 54, and a total of eight intake ports 17E are provided.
  • the eight intake ports 17E are arranged in two rows in the front-rear direction, with four intake ports 17E arranged in the left-right direction to match the positions of the eight second suction nozzles 56.
  • Each of the eight intake ports 17E is connected to a pressure supply device 27 (see FIG. 2), and when receiving the die 22 from the second suction nozzle 56, negative pressure is supplied from the pressure supply device 27 to suck the die 22.
  • the nozzle station mechanism 18 has a nozzle station 61 attached to the upper end of a main body 18A.
  • the main body 18A is provided with a lifting unit 18B (see Figure 2).
  • the lifting unit 18B includes, for example, an electromagnetic motor or a ball screw mechanism, and slides the nozzle station 61 in a direction parallel to the up-down direction under the control of the control device 19 to change the height of the nozzle station 61.
  • Figure 8 shows an enlarged view of the nozzle station 61.
  • the nozzle station 61 includes a storage box 62 and a shutter 63.
  • the storage box 62 has, for example, a rectangular parallelepiped shape that has a predetermined thickness in the up-down direction and is long in the left-right and front-rear directions.
  • a plurality of nozzle storage sections 64 are formed in the storage box 62.
  • 20 nozzle storage sections 64 are formed in the storage box 62.
  • Each of the 20 nozzle storage sections 64 is capable of storing the first and second suction nozzles 43, 56.
  • the first nozzle mounting part 41 and the second nozzle mounting part 55 have a common structure for the part where the suction nozzle is attached. Therefore, the second suction nozzle 56 is compatible with the first suction nozzle 43.
  • the first and second suction nozzles 43, 56 are replaced with other suction nozzles having different diameters of the holes for suctioning air and sizes of the parts that come into contact with the die 22 depending on the size of the die 22 to be suctioned.
  • the same first and second suction nozzles 43, 56 can be used for the same type of die 22, and can also be interchangeable.
  • FIG. 9 shows an exploded perspective view of the first nozzle mounting portion 41 and the first suction nozzle 43A.
  • the structure of the portion of the second nozzle mounting portion 55 where the second suction nozzle 56 is mounted is the same as the structure of the portion of the first nozzle mounting portion 41 where the first suction nozzle 43 is mounted. For this reason, a description of the portion of the second nozzle mounting portion 55 where the second suction nozzle 56 is mounted and a detailed description of the second suction nozzle 56 will be omitted.
  • the structure of the mounting portion of the first nozzle mounting portion 41 may be different from the structure of the mounting portion of the second nozzle mounting portion 55. Therefore, the first suction nozzle 43 may be structured to employ a different mounting method from that of the second suction nozzle 56 (for example, see FIG. 12).
  • the first nozzle mounting portion 41 has a shaft portion 41A and a mounting portion 41B.
  • the shaft portion 41A is, for example, a member having a substantially cylindrical shape, and is a portion that rotates based on the drive of the rotation motor 38 (see FIG. 2).
  • the mounting portion 41B is provided at the tip of the shaft portion 41A and rotates together with the shaft portion 41A.
  • the mounting portion 41B is substantially plate-like with a thin thickness (width) in the axial direction (vertical direction in FIG. 9) of the shaft portion 41A.
  • the shape of the mounting portion 41B viewed from one side in the axial direction is substantially octagonal.
  • the tip of the shaft portion 41A is attached to the inner surface of the mounting portion 41B in the axial direction.
  • the outer peripheral surface which is the outer surface of the mounting portion 41B in the axial direction, serves as a mounting surface 41C for mounting the first suction nozzle 43A.
  • the mounting part 41B is provided with multiple magnets 41D (two in this embodiment) and multiple protrusions 41E (two in this embodiment).
  • the magnets 41D are, for example, disk-shaped and are attached to the mounting part 41B with their magnetic pole faces exposed from the mounting surface 41C.
  • the protrusions 41E are attached to the mounting part 41B in a state where they protrude outward in the axial direction from the mounting surface 41C, and are tapered from the base end to the tip end.
  • FIG. 10 shows a perspective view of the first suction nozzle 43 as seen from the mounting surface 66 side to which the mounting part 41B is attached.
  • the first suction nozzle 43 has a mounting part 67 and a suction part 68.
  • the mounting part 67 is thin and plate-like.
  • the outer shape of the mounting part 67 is a roughly octagonal shape of the same size as the mounting part 41B of the first nozzle mounting part 41.
  • the suction part 68 is provided on the surface on the tip side of the mounting part 67.
  • the suction part 68 is, for example, shaped like a thin square member with a roughly disk-shaped member attached to the tip side (outside) of the member.
  • the shapes of the mounting part 67 and the suction part 68 are changed depending on the size and shape of the die 22 to be suctioned.
  • a suction intake 69 is formed in the center of the mounting portion 67 and the suction portion 68.
  • the intake 69 is a hole with a circular cross section that penetrates the mounting portion 67 and the suction portion 68 in the thickness direction.
  • the mounting portion 67 also has a plurality of insertion holes 71 (two in this embodiment) that penetrate the mounting portion 67 in the thickness direction.
  • the insertion holes 71 are, for example, holes with a circular cross section, and are formed to match the position of the protrusion 41E provided on the mounting portion 41B.
  • a plurality of magnetic members 73 are attached to the mounting surface 66 of the mounting portion 67.
  • the two magnetic members 73 are, for example, cylindrical or disc-shaped metal members, and are fixed so as to be embedded in the mounting portion 67 with their end faces exposed from the mounting surface 66.
  • the two magnetic members 73 are provided to match the position of the magnet 41D of the first nozzle mounting portion 41.
  • the protrusion 41E is inserted into the insertion hole 71, so that the magnetic member 73 is aligned with the magnet 41D.
  • the two magnets 41D then magnetically attract the two magnetic members 73, respectively, thereby attracting and holding the first suction nozzle 43 to the mounting portion 41B.
  • the above-mentioned configuration of the magnet 41D and the magnetic member 73 is one example.
  • the number of magnets required can be reduced compared to a configuration in which a magnet is provided to the first suction nozzle 43 when an additional replacement first suction nozzle 43 is added, and costs can be reduced.
  • a configuration in which a magnetic member is provided to the first nozzle mounting part 41 and a magnet is provided to the first suction nozzle 43 may also be adopted.
  • magnets may be provided to both the first nozzle mounting part 41 and the first suction nozzle 43, and the magnets may be magnetically attracted to each other.
  • the method of holding the first suction nozzle 43 to the first nozzle mounting part 41 is not limited to a method using magnetic force using a magnet (see FIG. 12).
  • the twenty nozzle storage sections 64 are arranged in four rows in the front-rear direction, with five in the left-right direction.
  • the nozzle storage sections 64 are shaped to hold the first and second suction nozzles 43, 56 with the suction section 68 facing downward.
  • the nozzle storage section 64 is a hole with an open top, and a step section 64A for placing the mounting section 67 is formed on both left and right sides.
  • the first and second suction nozzles 43, 56 are stored with the suction section 68 inserted into the central recess and the ends of the mounting section 67 in the left-right direction placed on the pair of step sections 64A. In the state shown in FIG.
  • the ten on the front side store the first and second suction nozzles 43B, 56B for replacement, respectively.
  • the first and second suction nozzles 43B, 56B are stored in the nozzle storage sections 64 with the mounting surface 66 to which the magnetic member 73 is attached facing upward.
  • the ten replacement first and second suction nozzles 43B, 56B are, for example, of the same type and are used for the same type of die 22.
  • the shutter 63 is formed in a generally L-shape by bending a thin metal plate 90 degrees, and has a top surface portion 63A that covers the top surface of the storage box 62, and a side surface portion 63B that covers the left side surface of the storage box 62.
  • the top surface portion 63A is a generally rectangular plate that is long in the left-right direction.
  • the shutter 63 has a plurality of elongated holes 63C formed in the top surface portion 63A into which screws 75 that are screwed into the storage box 62 and protrusions 62A protruding upward from the storage box 62 are inserted, and the shutter 63 is held by the storage box 62 so that it can slide in the front-rear direction.
  • the upper end of the main body portion 18A is provided with a shutter drive portion 65 that slides the shutter 63 in the front-rear direction.
  • the shutter drive portion 65 has, for example, an air cylinder 65A and a link member 65B connected to the output rod of the air cylinder 65A.
  • the shutter drive unit 65 drives the air cylinder 65A under the control of the control device 19, and moves the shutter 63 in the forward and backward directions via the link member 65B.
  • the upper surface portion 63A is formed with a number of openings 63D and a number of engagement portions 63E.
  • the openings 63D are holes that penetrate the upper surface portion 63A, and 20 of them are formed to match the positions of the 20 nozzle accommodating portions 64.
  • the openings 63D are formed to match the sizes of the first and second suction nozzles 43, 56, and when the sliding position in the front-to-rear direction is aligned with the nozzle accommodating portions 64, the openings of the nozzle accommodating portions 64 are exposed upward. With this position aligned, the first and second suction nozzles 43, 56 can be inserted and removed from the nozzle accommodating portions 64 through the openings 63D.
  • Two openings 63D adjacent in the front-rear direction are connected to each other.
  • Two engagement portions 63E are formed on the front side of each opening 63D.
  • the pair of engagement portions 63E are shaped to protrude inward from both the left and right sides.
  • a pair of recesses 41F are formed in the mounting portion 41B.
  • the pair of recesses 41F are shaped by recessing the mounting surface 41C from the outside toward the inside in the axial direction, and are grooves that have no outer surfaces in the left-right direction and no front surface (the surface on the near side in FIG. 9).
  • the depth of the recesses 41F is formed to a depth that allows the engagement portions 63E to be inserted when the first suction nozzle 43 is attached to the mounting surface 41C.
  • the shutter 63 when the shutter 63 is moved to the front end by the shutter drive unit 65, the shutter 63 is in a state in which the opening 63D is positioned above the nozzle accommodating portion 64.
  • the shutter 63 is moved to the rear end by the shutter drive unit 65, the shutter 63 is in a state in which the pair of engagement portions 63E is positioned above the nozzle accommodating portion 64.
  • the first nozzle mounting portion 41 accommodates, for example, the first suction nozzle 43A
  • the first suction nozzle 43A is inserted into the nozzle accommodating portion 64 through the opening 63D.
  • the pair of engagement portions 63E are inserted into each of the pair of recesses 41F.
  • the pair of engagement portions 63E engage with the first suction nozzle 43A, and the first suction nozzle 43A is separated from the first nozzle mounting portion 41.
  • the separated first suction nozzle 43A is stored in the nozzle storage section 64.
  • FIG. 2 shows a block diagram of the control device 19.
  • the control device 19 is a processing device mainly composed of a computer, including a CPU 81 and a storage device 82.
  • the storage device 82 is configured by combining, for example, a RAM, a ROM, a hard disk, and the like.
  • a control program 83 for controlling the die supply device 10 is stored in the storage device 82.
  • the control device 19 is connected to each device such as the wafer supply unit 12, the flip mechanism 15, the transfer mechanism 16, the shuttle mechanism 17, the nozzle station mechanism 18, the substrate transport unit 14, the pressure supply device 27, and the part camera 29 via a plurality of drive circuits 84.
  • the control device 19 executes the control program 83 with the CPU 81, and controls the above-mentioned devices via the drive circuit 84 to control the operation of the die supply device 10.
  • the drive circuit 84 is, for example, a motor driver circuit for driving a motor, or an external interface for connecting an external device.
  • the control device 19 controls each device to supply the dies 22.
  • the devices controlled by the control device 19 may be described simply by their device names.
  • the description "The wafer frame pull-out mechanism 31 transports the desired wafer frame 23 from the magazine 24 to the die supply position P2" means that the control device 19 executes the control program 83 in the CPU 81, and controls the wafer frame pull-out mechanism 31 via the drive circuit 84 to transport the desired wafer frame 23 from the magazine 24 to the die supply position P2.”
  • the control device 19 controls the wafer supply unit 12 to place the wafer frame 23 corresponding to the type of die 22 to be supplied at the die supply position P2.
  • the wafer frame pull-out mechanism 31, under the control of the control device 19, transports the desired wafer frame 23 from the magazine 24 to the die supply position P2.
  • the flip mechanism 15 drives the Y-axis slide mechanism 33 to move above the die assembly 21 at the die supply position P2, and drives the Z-axis slide mechanism 34 to lower the first suction nozzle 43 to pick up the die 22.
  • the control device 19 drives the wafer frame pull-out mechanism 31 and the Y-axis slide mechanism 33 to move the flip head 35 above the next die 22 to be picked up.
  • the flip mechanism 15 drives the swivel motor 38 to switch the positions of the pair of first suction nozzles 43, and the remaining first suction nozzle 43 picks up the die 22.
  • the flip mechanism 15 When the flip mechanism 15 has adsorbed the die 22 with both of the pair of first suction nozzles 43, it moves the flip head 35 to a position where it will hand over the die 22 to the transfer head 54 of the transfer mechanism 16 (position shown in FIG. 3).
  • the transfer mechanism 16 drives the nozzle switching mechanism 57 to lower the second suction nozzle 56 that receives the die 22 from the flip head 35.
  • the flip mechanism 15 passes the die 22 from the first suction nozzle 43 facing upward to the second suction nozzle 56 of the transfer head 54.
  • the flip mechanism 15 rotates the flip head 35 to switch the positions of the pair of first suction nozzles 43.
  • the transfer mechanism 16 drives the X-axis slide mechanism 51 and the Y-axis slide mechanism 52 to change the second suction nozzle 56 that is positioned above the first suction nozzle 43, and drives the nozzle switching mechanism 57 to lower the second suction nozzle 56 that receives the die.
  • the flip mechanism 15 transfers the die 22 from the remaining first suction nozzle 43 to another second suction nozzle 56.
  • the flip mechanism 15 and the transfer mechanism 16 repeatedly perform the above-mentioned operations, causing all eight second suction nozzles 56 to suction the die 22.
  • the transfer mechanism 16 drives the X-axis slide mechanism 51 and the Y-axis slide mechanism 52 to move the transfer head 54 above the receiving position P5 of the shuttle mechanism 17. Meanwhile, the shuttle mechanism 17 drives the electromagnetic motor 17C to position the X-axis slider 17B at the receiving position P5. The transfer mechanism 16 drives the Z-axis slide mechanism 53 to lower the transfer head 54, and collectively places all eight dies 22 suctioned by the second suction nozzles 56 on the shuttle 17D. The shuttle mechanism 17 draws air from the intake port 17E to suction the dies 22 onto the shuttle 17D.
  • the shuttle mechanism 17 drives the electromagnetic motor 17C to move the X-axis slider 17B from the receiving position P5 to the transfer position P6.
  • the component mounting device located to the right of the die supply device 10 uses a mounting head (not shown) to pick up the die 22 from the shuttle 17D located at the transfer position P6 and mount it on the board.
  • the control device 19 replaces the first and second suction nozzles 43, 56 in accordance with the type of die 22.
  • the first and second suction nozzles 43, 56 are replaced in accordance with a so-called changeover in which the type of substrate to be produced and transported by the substrate transport unit 14 is changed.
  • the control device 19 controls the flip mechanism 15 to move the flip head 35 to the retracted position, and controls the transfer mechanism 16 to move the transfer head 54 to the retracted position.
  • FIG. 11 shows the state in which the first suction nozzle 43A is stored in the nozzle station 61.
  • the wafer frame pull-out mechanism 31 moves the wafer frame 23 from the die supply position P2 to the storage position P1, and stores the wafer frame 23 in the magazine 24.
  • the wafer frame 23 is not positioned between the flip mechanism 15 and the nozzle station mechanism 18 in the vertical direction.
  • the flip mechanism 15 drives the Y-axis slide mechanism 33, and moves in the front-rear direction to a position where the first suction nozzle 43A is above the nozzle station 61.
  • the nozzle station mechanism 18 drives the lifting section 18B to raise the nozzle station 61 to a position (the position in FIG. 11) where the first suction nozzle 43 is replaced.
  • the nozzle station 61 is set up so that the nozzle accommodating sections 64 that accommodate the first and second suction nozzles 43, 56 are pre-determined, and separate nozzle accommodating sections 64 are used. This allows the number of moving axes of the flip mechanism 15 to be reduced.
  • 20 nozzle accommodating sections 64 are provided, 10 on the front side and 10 on the rear side.
  • the first and second suction nozzles 43, 56 accommodated in the 10 on the front side are used for a first type of die 22, and the first and second suction nozzles 43, 56 accommodated in the 10 on the rear side are used for a second type of die 22 that is different from the first type.
  • first and second suction nozzles 43, 56 of the first type the left 8 are used as the second suction nozzles 56, and the right 2 are used as the first suction nozzles 43.
  • the eight on the left are used as second suction nozzles 56 and the two on the right are used as first suction nozzles 43.
  • the flip mechanism 15 using the first suction nozzle 43 can be replaced if the first suction nozzle 43 can be placed at the position of the four nozzle accommodating parts 64 arranged in the front-rear direction, so that left-right movement is not required during replacement work.
  • the flip mechanism 15 does not have a slide mechanism that moves in the left-right direction (X-axis direction), and its position in the left-right direction is fixed.
  • the nozzle station mechanism 18 does not have a mechanism that moves in the left-right direction or the front-rear direction, and the position of the nozzle station 61 (nozzle accommodating part 64) in the left-right direction and the front-rear direction is fixed. This makes it possible to reduce the number of movement axes required for the flip mechanism 15 and the nozzle station mechanism 18, thereby reducing manufacturing costs and making the device more compact.
  • the flip mechanism 15 accommodates the two first suction nozzles 43A mounted on the flip head 35 in the free nozzle accommodating section 64 of the four rightmost nozzle accommodating sections 64 described above, and mounts replacement first suction nozzles 43B in the remaining two nozzle accommodating sections 64.
  • the nozzle station mechanism 18 slides the shutter 63 to the front end in conjunction with the replacement operation of the first and second suction nozzles 43, 56, and aligns the opening 63D of the shutter 63 with a position above the nozzle accommodating section 64. Note that the position of the shutter 63 is not particularly limited when the replacement operation of the first and second suction nozzles 43, 56 is not being performed.
  • the nozzle station mechanism 18 may place the shutter 63 at the front end position and place the opening 63D above the nozzle storage section 64 while the replacement work of the first and second suction nozzles 43, 56 is not being performed, so that the operator can easily replace the first and second suction nozzles 43B, 56B for replacement of the nozzle station 61 with other nozzles.
  • the nozzle station mechanism 18 may place the shutter 63 at the rear end position and place the pair of engagement parts 63E above the nozzle storage section 64 while the replacement work of the first and second suction nozzles 43, 56 is not being performed, so that the first and second suction nozzles 43B, 56B are difficult to remove.
  • the nozzle station mechanism 18 may then move the shutter 63 in response to an operation instruction from the operator.
  • the nozzle station mechanism 18 drives the shutter drive section 65 to move the shutter 63 to the rear end, and inserts the engagement section 63E (see FIG. 8) into the recess 41F (see FIG. 9) of the first nozzle mounting section 41 being inserted.
  • the flip mechanism 15 drives the Z-axis slide mechanism 34 to raise the first nozzle mounting section 41.
  • the first suction nozzle 43A is separated from the first nozzle mounting section 41 by the engagement section 63E from the state where it is attracted by the magnetic member 73, and is stored in the nozzle storage section 64.
  • the flip mechanism 15 rotates the flip head 35 to store the first suction nozzle 43A in another nozzle storage section 64 for the remaining first nozzle mounting sections 41.
  • the nozzle station mechanism 18 drives the shutter drive unit 65 to move the shutter 63 to the front end, and moves the opening 63D to a position above the nozzle accommodating portion 64.
  • the flip mechanism 15 drives the Y-axis slide mechanism 33 to align the position of the first nozzle mounting portion 41 with the position of the nozzle accommodating portion 64 in which the first suction nozzle 43B is accommodated.
  • the flip mechanism 15 drives the Z-axis slide mechanism 34 to lower the first nozzle mounting portion 41.
  • the first suction nozzle 43B accommodated in the nozzle accommodating portion 64 has the magnetic member 73 (see FIG. 10) attracted by the magnet 41D (see FIG.
  • the protrusion 41E is inserted into the insertion hole 71, so that the position of the mounting portion 67 relative to the mounting portion 41B is aligned. That is, the first suction nozzle 43B is corrected for misalignment with respect to the first nozzle mounting portion 41 and is mounted in the correct position.
  • the flip mechanism 15 rotates the flip head 35 to mount the first suction nozzle 43B to the remaining first nozzle mounting portions 41.
  • the transfer mechanism 16 replaces the second suction nozzle 56A of the transfer head 54.
  • the same content as that of the first suction nozzle 43 will not be explained.
  • the flip mechanism 15 finishes replacing the first suction nozzle 43, it moves, for example, to the frontmost retracted position in its forward/rearward movable range.
  • the transfer mechanism 16 drives the X-axis slide mechanism 51 and the Y-axis slide mechanism 52 to move the transfer head 54 to a position above the nozzle station 61.
  • the left eight of the ten nozzle accommodating sections 64 at the front of the nozzle station 61 and the left eight of the ten nozzle accommodating sections 64 at the rear are used. These two sets of eight nozzle accommodating sections 64 are provided at positions that match the positions of the eight second nozzle mounting sections 55 of the transfer head 54. Therefore, by aligning the position of one of the eight second nozzle mounting sections 55 with the position of any one of the eight nozzle accommodating sections 64, the positions of all of the second nozzle mounting sections 55 will match the positions of the eight nozzle accommodating sections 64.
  • the transfer head 54 of this embodiment has four second nozzle mounting parts 55 arranged in two rows in the front-rear direction, with the four second nozzle mounting parts 55 arranged in the left-right direction at a predetermined pitch.
  • eight nozzle accommodating parts 64 for the second suction nozzle 56 are provided at the same positions and with the same pitch as the second nozzle mounting parts 55, and the four nozzle accommodating parts 64 arranged in the left-right direction are provided in two rows in the front-rear direction.
  • the transfer head 54 moves above, for example, eight vacant nozzle storage sections 64 (for example, the nozzle storage sections 64 at the rear in FIG. 8) and aligns the positions of the eight second nozzle mounting sections 55 with the positions of the eight nozzle storage sections 64.
  • the transfer head 54 drives the Z-axis slide mechanism 53 to lower all eight second nozzle mounting sections 55 together and insert all second suction nozzles 56A into the nozzle storage sections 64.
  • the nozzle station mechanism 18 drives the shutter drive section 65 to insert multiple (16 in total) engagement sections 63E into the recesses (same structure as the recesses 41F in FIG. 9) of each second nozzle mounting section 55.
  • the transfer head 54 drives the Z-axis slide mechanism 53 to raise the second nozzle mounting sections 55, thereby removing the second suction nozzles 56 from all second nozzle mounting sections 55.
  • the transfer head 54 moves above the eight nozzle storage sections 64 (for example, the nozzle storage sections 64 on the front side of FIG. 8) in which the replacement second suction nozzles 56B are stored, and aligns the positions of the eight second nozzle mounting sections 55 with the positions of the eight second suction nozzles 56B (nozzle storage sections 64).
  • the nozzle station mechanism 18 drives the shutter drive section 65 to align the position of the opening 63D with the position of the nozzle storage section 64.
  • the transfer head 54 drives the Z-axis slide mechanism 53 to lower the eight second nozzle mounting sections 55 together, and mounts the second suction nozzles 56B to all the second nozzle mounting sections 55.
  • the transfer head 54 raises the second nozzle mounting sections 55 and moves them to a predetermined initial position or the like. This completes the replacement of the first and second suction nozzles 43, 56.
  • the control device 19 drives the lifting section 18B of the nozzle station mechanism 18 to lower the nozzle station 61, and drives the wafer supply unit 12 to transport the wafer frame 23 to be used in the next production from the magazine 24 to the die supply position P2.
  • the control device 19 drives the flip mechanism 15, transfer mechanism 16, wafer frame pull-out mechanism 31, shuttle mechanism 17, etc., to start supplying the die 22 using the replaced first and second suction nozzles 43B, 56B.
  • the order and contents of the operations for supplying the die 22 and replacing the first and second suction nozzles 43, 56 described above are merely examples.
  • the replacement of the second suction nozzle 56 may be performed first, and the replacement of the first suction nozzle 43 may be performed later.
  • the replacement of the second suction nozzles 56 may not be performed all at once, but may be performed one by one.
  • the position of the nozzle accommodating section 64 for accommodating the first and second suction nozzles 43, 56 may not be determined in advance.
  • two nozzle accommodating sections 64 for the first suction nozzles 43 may be set between the nozzle accommodating sections 64 for the four second suction nozzles 56 in the left-right direction and the nozzle accommodating sections 64 for the remaining four second suction nozzles 56.
  • the nozzle accommodating sections 64 for the first and second nozzle mounting sections 41, 55 may not be set, and the removal position or mounting position may be changed depending on the conditions. For example, replacement may be performed on the nozzle housing 64, which is close by.
  • the control device 19 controls the flip mechanism 15 to replace the first suction nozzles 43A and 43B, and controls the transfer mechanism 16 to replace the second suction nozzles 56A and 56B.
  • the control device 19 can automatically replace the suction nozzles of the two heads in one nozzle station 61.
  • the nozzle station 61 is disposed below the die assembly 21 when the die assembly 21 is disposed at the die supply position P2. In this way, when replacing the first and second suction nozzles 43, 56, the die assembly 21 is retreated from the die supply position P2 to the storage position P1 to ensure space for replacement and perform the replacement. Therefore, the first and second suction nozzles 43, 56 can be replaced at the same position as the die assembly 21 in the front-rear and left-right directions. If the nozzle station 61 is disposed at a position away from the die supply position P2, it is necessary to expand the movable range of the flip head 35 and the transfer head 54 in the front-rear and left-right directions to enable operation up to the nozzle station 61. On the other hand, by disposing the nozzle station 61 below the die supply position P2, it is not necessary to expand the movable range of the flip head 35 and the transfer head 54. Therefore, the flip mechanism 15 and the transfer mechanism 16 can be made smaller.
  • the control device 19 moves the die assembly 21 to the storage position P1, and then controls the lifting unit 18B to raise the nozzle station 61 to a position where the first and second suction nozzles 43, 56 can be replaced.
  • the vertical movement range of the flip head 35 can be narrowed, and the Z-axis slide mechanism 34 can be made smaller.
  • the nozzle accommodating portion 64 that accommodates the replacement first suction nozzle 43B is positioned below the first nozzle attachment portion 41 of the flip head 35 (see FIG. 11).
  • the flip mechanism 15 moves the flip head 35 between a position where it adsorbs the die 22 and a position retreated from the transfer head 54 by sliding the flip head 35 in the front-rear direction.
  • the nozzle station 61 has a fixed position in the front-rear direction and the left-right direction.
  • the flip head 35 has a fixed position in the left-right direction. This not only eliminates the need for a mechanism to move the flip head 35 left-right, but also eliminates the need for a mechanism to move the nozzle station 61 left-rear direction and the left-right direction, making it possible to miniaturize the device and reduce manufacturing costs.
  • the first suction nozzle 43 is attached to the first nozzle mounting portion 41 by the magnetic force of the magnet 41D.
  • the control device 19 controls the shutter drive unit 65 to move the shutter 63 so that the opening 63D is at the position of the opening of the nozzle accommodating portion 64.
  • the control device 19 moves the flip head 35 to insert the first suction nozzle 43A into the nozzle accommodating portion 64.
  • the control device 19 controls the shutter drive unit 65 to move the shutter 63 to a position where the pair of engagement portions 63E engage with the first suction nozzle 43A.
  • the control device 19 moves the flip head 35 to engage the engagement portions 63E with the first suction nozzle 43A and remove the first suction nozzle 43A from the first nozzle mounting portion 41.
  • the structure of the first suction nozzle 43 and the first nozzle mounting part 41 can be simplified compared to the structure in which the engagement part 91 and the groove 93 are provided as shown in FIG. 12 described later, and the manufacturing cost can be reduced.
  • the operation of attaching and detaching the first suction nozzle 43 requires the operation of rotating the first nozzle mounting part 41, etc. Therefore, it is necessary to provide a motor for rotating the first nozzle mounting part 41 on the flip head 35, which complicates the structure of the flip head 35.
  • the first suction nozzle 43 can be attached to the second nozzle attachment portion 55, and the second suction nozzle 56 can be attached to the first nozzle attachment portion 41.
  • the worker does not need to be aware of which of the first and second suction nozzles 43, 56 they are, and they can be prepared in the nozzle station 61.
  • the burden of arranging the first and second suction nozzles 43B, 56B in the nozzle station 61 and the management of the first and second suction nozzles 43, 56 are reduced.
  • the manufacturing costs of the first and second suction nozzles 43, 56 and parts related to the first and second suction nozzles 43, 56 can be reduced.
  • the wafer frame pull-out mechanism 31 is an example of a die assembly moving mechanism.
  • the swivel motor 38 is an example of an inversion mechanism.
  • the transfer head 54 is an example of a supply head.
  • the Y-axis slide mechanism 33 and the Z-axis slide mechanism 34 are examples of flip head moving mechanisms.
  • the X-axis slide mechanism 51, the Y-axis slide mechanism 52, and the Z-axis slide mechanism 53 are examples of supply head moving mechanisms.
  • the front-back direction and the Y-axis direction are examples of slide directions in this disclosure.
  • the left-right direction and the X-axis direction are examples of orthogonal directions in this disclosure.
  • the nozzle station 61 contains both the first suction nozzle 43B for replacement and the second suction nozzle 56B for replacement.
  • both the first suction nozzle 43B for replacement attached to the flip head 35 and the second suction nozzle 56B for replacement attached to the transfer head 54 can be managed in one nozzle station 61.
  • the replacement suction nozzles of the two heads can be managed collectively in one nozzle station 61 and replaced in one place.
  • both the first and second suction nozzles 43 and 56 can be automatically replaced.
  • the workload of managing the replacement suction nozzles such as replacing the replacement suction nozzles of the nozzle station 61 and checking the suction nozzles stored in the nozzle station 61, can be reduced.
  • the contents of the present disclosure are not limited to the above-described embodiments, but can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art.
  • the first nozzle mounting portion 41 and the second nozzle mounting portion 55 have the same structure, but they may have different structures.
  • the first suction nozzle 43 is attached to the first nozzle mounting portion 41
  • the second suction nozzle 56 is attached to the second nozzle mounting portion 55 by magnetic force using the magnetic member 73 and the magnet 41D, but the present invention is not limited to this.
  • FIG. 12 shows a first suction nozzle 143 and a first nozzle mounting portion 141 in another example. As shown in FIG.
  • a pair of engagement portions 91 may be provided on the main body portion 90 of the first suction nozzle 143. Then, a groove 93 that engages with the engagement portions 91 may be provided on the first nozzle mounting portion 141 side.
  • the engagement portions 91 are inserted into the grooves 93 of the first nozzle mounting portion 141 from the axial direction, and the first nozzle mounting portion 141 is rotated to engage the engagement portions 91 with the grooves 93, and the first suction nozzle 143 is attached to the first nozzle mounting portion 141.
  • a spring 95 may be provided on the first suction nozzle 143 to bias the engagement portion 91 toward the first nozzle mounting portion 141, making it difficult for the nozzle 143 to come off the groove 93.
  • the first nozzle mounting portion 141 is lowered to contract the spring 95, and the first nozzle mounting portion 141 is rotated in the opposite direction to that at the time of mounting and then raised, thereby removing the first suction nozzle 143 from the first nozzle mounting portion 141.
  • a mechanism for rotating the suction nozzle around its axis may be provided in the transfer head 54, the flip head 35, or the nozzle station 61.
  • the flip mechanism 15 may be configured to include an X-axis slide mechanism, so that the flip head 35 can be moved in the left-right direction.
  • the transfer head 54 that transfers the die 22 received from the flip mechanism 15 to the shuttle mechanism 17 is used as the supply head of the present disclosure, but this is not limited to this.
  • the supply head of the present disclosure may be a mounting head that mounts the die 22 received from the flip mechanism 15 on a substrate. Therefore, the die supply device of the present disclosure is not limited to a device that supplies the die 22 to the shuttle mechanism 17, and may be a component mounting device that mounts the die on a substrate.
  • the turning motor 38 is used as the inversion mechanism of the present disclosure, but the present disclosure is not limited to this.
  • a mechanism that rotates the flip head 35 using an air cylinder may be used as the inversion mechanism.
  • the nozzle station 61 may be disposed at a position other than below the die supply position P2. In this case, the nozzle station mechanism 18 does not need to include the lifting unit 18B.
  • the nozzle station mechanism 18 may include a mechanism for moving the nozzle station 61 in the left-right direction and the front-rear direction.

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Abstract

La présente invention concerne un dispositif de fourniture de puce qui peut réduire une charge sur la gestion d'une buse pour un remplacement dans un dispositif de fourniture de puce dans lequel une buse d'aspiration d'une tête de retournement et une buse d'aspiration d'une tête de fourniture sont remplacées.　Le dispositif de fourniture de puce selon l'invention comprend : la tête de retournement qui est pourvue d'une première unité de montage de buse apte à monter et démonter une première buse d'aspiration et utilise la première buse d'aspiration pour aspirer une puce à partir d'un corps de puces obtenu par découpage en dés d'une tranche ; un mécanisme de retournement qui retourne la tête de retournement pour retourner le côté avant et le côté arrière de la puce aspirée par la première buse d'aspiration ; une tête de fourniture qui est pourvue d'une seconde unité de montage de buse apte à monter et démonter une seconde buse d'aspiration et utilise la seconde buse d'aspiration pour aspirer la puce retournée par la tête de retournement et fournir la puce aspirée par la seconde buse d'aspiration ; et une station de buses qui reçoit à la fois la première buse d'aspiration pour le remplacement et la seconde buse d'aspiration pour le remplacement.
PCT/JP2023/022246 2023-06-15 2023-06-15 Dispositif de fourniture de puce Pending WO2024257303A1 (fr)

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PCT/JP2023/022246 WO2024257303A1 (fr) 2023-06-15 2023-06-15 Dispositif de fourniture de puce

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