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WO2024253098A1 - Substrat de verre et composant de connexion optique - Google Patents

Substrat de verre et composant de connexion optique Download PDF

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Publication number
WO2024253098A1
WO2024253098A1 PCT/JP2024/020393 JP2024020393W WO2024253098A1 WO 2024253098 A1 WO2024253098 A1 WO 2024253098A1 JP 2024020393 W JP2024020393 W JP 2024020393W WO 2024253098 A1 WO2024253098 A1 WO 2024253098A1
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WO
WIPO (PCT)
Prior art keywords
hole
glass fiber
glass
glass substrate
diameter
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Pending
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PCT/JP2024/020393
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English (en)
Japanese (ja)
Inventor
拓也 石田
哲也 中西
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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Filing date
Publication date
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Publication of WO2024253098A1 publication Critical patent/WO2024253098A1/fr
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/02—Optical fibres with cladding with or without a coating
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means

Definitions

  • the present disclosure relates to a glass substrate and an optical connecting component.
  • Patent Document 1 discloses a porous glass plate that holds a plurality of glass fibers.
  • This porous glass plate has a glass plate body in which a plurality of through holes are formed, into which the glass fibers are respectively inserted.
  • the glass plate body is formed, for example, by a process that combines laser modification and etching, or by using a hole-drilling technique that uses a laser.
  • a glass substrate includes a first surface and a second surface located opposite the first surface, and comprises a substrate body formed of a glass material.
  • the substrate body is formed with at least one through hole penetrating from the first surface to the second surface and into which at least one glass fiber can be inserted.
  • the outer diameter of the glass fiber is 125 ⁇ m or less.
  • the inner diameter of the through hole is larger than the outer diameter of the glass fiber, and the surface roughness Rz of the inner surface of the through hole is 1 ⁇ m or less.
  • the ratio of the inner diameter of the through hole to the surface roughness Rz is 127 or less.
  • FIG. 1 is a perspective view showing a state in which an optical connecting part according to the present embodiment is connected to an electronic part.
  • FIG. 2A is a perspective view showing the optical connecting part of FIG.
  • FIG. 2B is a plan view of the optical connecting part in FIG. 2A as viewed from the electronic part side.
  • FIG. 3 is a perspective view showing a glass substrate provided in the optical connecting part of FIG.
  • FIG. 4 is an enlarged perspective view of a portion of the glass substrate shown in FIG.
  • FIG. 5 is a graph for explaining a method of calculating the surface roughness Rz.
  • FIG. 6A is a perspective view showing a state in which glass fibers are inserted into the through-holes of the glass substrate of FIG.
  • FIG. 6A is a perspective view showing a state in which glass fibers are inserted into the through-holes of the glass substrate of FIG.
  • FIG. 6B is a cross-sectional view of the glass substrate taken along line A1-A1 in FIG. 6A.
  • FIG. 7A is an enlarged perspective view showing another example of a glass substrate.
  • FIG. 7B is a cross-sectional view of the glass substrate taken along line A2-A2 in FIG. 7A.
  • FIG. 8 is a plan view showing another example of the shape of the through hole in the glass substrate.
  • the manufacturing method tends to cause surface roughness on the inner surface of the through hole.
  • the unevenness causes stress concentration on the glass fiber, which may cause damage such as breakage of the glass fiber.
  • the inner diameter of the through hole is increased in this way, the positional accuracy of the glass fiber inserted into the through hole may be reduced.
  • the present disclosure provides a glass substrate and optical connection components that can increase the positional accuracy of the glass fiber while reducing damage to the glass fiber.
  • a glass substrate includes a first surface and a second surface opposite to the first surface, and includes a substrate body formed of a glass material.
  • the substrate body is formed with at least one through hole penetrating from the first surface to the second surface and into which at least one glass fiber can be inserted.
  • the outer diameter of the glass fiber is 125 ⁇ m or less.
  • the inner diameter of the through hole is larger than the outer diameter of the glass fiber.
  • the surface roughness Rz of the inner surface of the through hole is 1 ⁇ m or less.
  • the ratio of the inner diameter of the through hole to the surface roughness Rz is 127 or less.
  • the above glass substrate holds the glass fiber so that the glass fiber is maintained at a predetermined connection position relative to the electronic component to which it is connected.
  • the optical coupling efficiency of the glass fiber to such an electronic substrate depends greatly on the positional accuracy of the glass fiber. For example, a positional deviation of the glass fiber on the order of ⁇ m can cause a large optical connection loss of the glass fiber. From the viewpoint of reducing such optical connection loss, it is desirable that the position of the glass fiber is precisely maintained on the order of ⁇ m.
  • the surface roughness Rz of the inner surface of the through hole into which the glass fiber is inserted is set to 1 ⁇ or less, and further, assuming that a glass fiber having a standard outer diameter of 125 ⁇ m or less is inserted into the through hole, the ratio of the inner diameter of the through hole to the surface roughness Rz is set to 127 or less.
  • the inner diameter of the through hole can be made as small as possible to a degree that does not cause damage to the glass fiber due to stress concentration on the glass fiber due to unevenness that may be formed on the inner surface of the through hole, and to a degree that allows adhesive between the inner surface of the through hole and the glass fiber.
  • the maximum height of the convex portion that can be formed on the inner surface and the minimum space that can accommodate the adhesive injected into the through hole can be maintained between the inner surface of the through hole and the glass fiber, while minimizing the positional deviation of the glass fiber inserted into the through hole on the order of ⁇ m.
  • the substrate body may be formed with a plurality of through holes into which a plurality of glass fibers can be inserted, respectively.
  • the substrate body may be formed with a plurality of through holes into which a plurality of glass fibers can be inserted, respectively.
  • a plurality of convex portions may be formed on the inner surface of the through hole along the extending direction of the through hole and the circumferential direction of the through hole.
  • the arrangement pitch of two adjacent convex portions in the extending direction may be larger than the arrangement pitch of two adjacent convex portions in the circumferential direction.
  • the number of convex portions formed along the extending direction can be reduced compared to the case where the arrangement pitch of each convex portion in the extending direction is equal to the arrangement pitch of each convex portion in the circumferential direction.
  • the through hole may include an expanded portion connected to the first surface and expanding in diameter as it approaches the first surface.
  • the inner surface of the expanded portion may be curved so as to move away from the central axis as it approaches the first surface.
  • the through hole includes an expanded portion that expands in diameter as it approaches the first surface, and the inner surface of the expanded portion is curved so as to move away from the central axis as it approaches the first surface.
  • the through hole includes an expanded portion that expands in diameter as it approaches the first surface, and the inner surface of the expanded portion is curved so as to move away from the central axis as it approaches the first surface.
  • the inner surface of the enlarged diameter portion may be bent at the cut surface so that the curvature of the inner surface increases as it approaches the first surface. In this case, it is possible to more reliably reduce the occurrence of stress concentration on the glass fiber due to unevenness that may be formed on the inner surface of the enlarged diameter portion, and therefore it is possible to more reliably reduce damage to the glass fiber due to stress concentration.
  • a groove extending from the first surface to the second surface may be formed.
  • the groove formed on the inner surface of the through hole can be used as an escape groove to allow excess adhesive injected into the through hole to escape in order to fix the glass fiber to the substrate body.
  • this escape groove it is not necessary to make adjustments such as designing the through hole to be large in advance in consideration of the amount of adhesive injected into the through hole, and it is possible to make the inner diameter of the through hole as small as possible while maintaining the shape of the inner surface of the through hole in a shape corresponding to the shape of the glass fiber. This makes it possible to more reliably obtain the above-mentioned effect of increasing the positional accuracy of the glass fiber inserted into the through hole.
  • An optical connection part may include a glass substrate as described in any one of (1) to (6) above, and a glass fiber inserted into the through hole and fixed to the substrate body with an adhesive. Since this optical connection part includes any one of the glass substrates described above, as described above, it is possible to increase the positional accuracy of the glass fiber while reducing the occurrence of damage to the glass fiber.
  • the glass fiber may include a first straight portion that extends along the extension direction of the through hole and is inserted into the through hole, a second straight portion that extends along a cross direction that crosses the extension direction, and a curved portion that extends between the first straight portion and the second straight portion while curving to connect the first straight portion and the second straight portion.
  • FIG. 1 is a perspective view showing an optical connection part 1 according to this embodiment connected to an electronic board 2.
  • FIG. 2A is a perspective view showing the optical connection part 1 of FIG. 1.
  • FIG. 2B is a plan view of the optical connection part 1 of FIG. 2A as seen from the electronic board 2 side.
  • the optical connection part 1 includes, for example, a fiber ribbon 10 and a fiber fixing part 20.
  • the fiber ribbon 10 has a curved portion in the middle, and a first end of the fiber ribbon 10 is connected to the electronic board 2 via the fiber fixing part 20.
  • a second end of the fiber ribbon 10 is connected to on-site wiring, for example, via a connector.
  • the electronic board 2 may be, for example, a chip board such as a silicon photonics chip (SPC) that inputs and outputs light.
  • SPC silicon photonics chip
  • the fiber ribbon 10 includes, for example, a plurality of optical fibers 13 arranged in a row along the Y-axis direction, and a coating resin layer 15 that collectively coats the plurality of optical fibers 13 with a ribbon resin.
  • Each of the plurality of optical fibers 13 may be, for example, a single-core optical fiber having a single core, or a multi-core optical fiber having multiple cores.
  • Each optical fiber 13 includes at least a glass fiber 11.
  • the glass fiber 11 includes, for example, a straight portion P1 (an example of a "second straight portion” in the present disclosure), a curved portion P2, and a straight portion P3 (an example of a "first straight portion” in the present disclosure).
  • the straight portion P1 extends from the coating resin layer 15 in the X-axis direction (an example of a "crossing direction” in the present disclosure).
  • the curved portion P2 is bent from the straight portion P1 in the Z-axis direction (an example of an "extending direction” in the present disclosure).
  • the straight portion P3 extends from the curved portion P2 in the Z-axis direction and is connected to the fiber fixing component 20.
  • the curved portion P2 extends between the straight portion P1 and the straight portion P3 while curving to connect the straight portion P1 and the straight portion P3.
  • the curved portion P2 is formed, for example, by heating the glass fiber 11.
  • the fiber fixing part 20 includes at least a glass substrate 25.
  • the glass substrate 25 is placed on the electronic substrate 2 and holds each glass fiber 11 connected to the electronic substrate 2.
  • the fiber fixing part 20 may further include a ferrule that is placed on the glass substrate 25 and supports each glass fiber 11.
  • the glass substrate 25 is fixed to the electronic substrate 2 by, for example, an ultraviolet-curing adhesive.
  • the glass substrate 25 is formed of a glass material that is capable of transmitting ultraviolet light. Examples of materials for the glass substrate 25 include fused quartz glass and borosilicate glass. Being capable of transmitting ultraviolet light means, for example, that a transmittance of 10% or more is achieved when a material with a thickness of 1 mm is irradiated with ultraviolet light having a wavelength of 350 nm or more and 400 nm or less.
  • the glass substrate 25 includes, for example, a rectangular plate-shaped substrate body 26.
  • the substrate body 26 includes a rectangular front surface 26a (an example of the "first surface” of the present disclosure) and a rectangular back surface 26b (an example of the "second surface” of the present disclosure) disposed on the opposite side to the front surface 26a.
  • the front surface 26a and the back surface 26b extend along the X-axis direction and the Y-axis direction, respectively, and are aligned along the Z-axis direction.
  • the back surface 26b faces the electronic substrate 2 (see FIG. 1) in the Z-axis direction.
  • the back surface 26b is fixed to the electronic substrate 2 with, for example, the above-mentioned ultraviolet-curing adhesive.
  • the thickness of the substrate body 26 between the front surface 26a and the back surface 26b may be, for example, about 1 mm.
  • the substrate body 26 has a plurality of through holes 27 formed therein, penetrating in the Z-axis direction from the rear surface 26b to the front surface 26a.
  • the plurality of through holes 27 are arranged in a line along the Y-axis direction so as to correspond to the plurality of glass fibers 11 (see FIG. 1) arranged along the Y-axis direction.
  • the shape of each through hole 27 as viewed along the Z-axis direction is, for example, circular.
  • the inner diameter D27 (see FIG. 4) of each through hole 27 may be constant at each position along the Z-axis direction. That is, each through hole 27 may have a constant inner diameter D27 from the front surface 26a to the rear surface 26b.
  • Each through hole 27 can be made, for example, by using a laser-based hole-making technique.
  • a process that combines photolithography and dry etching such as reactive ion etching (RIE) may be used.
  • RIE reactive ion etching
  • each through hole 27 is formed by laser irradiation and etching.
  • a part of the substrate body 26 is modified by laser irradiation, and the modified part is removed by etching.
  • each through hole 27 is formed in the substrate body 26.
  • the inner surface 27a has surface roughness due to the formation method, such as laser irradiation and etching. As a result, fine irregularities are formed on the inner surface 27a.
  • FIG. 4 shows multiple protrusions 27b formed on the inner surface 27a, but in reality, multiple recesses are also formed on the inner surface 27a.
  • the multiple protrusions 27b are arranged side by side on the inner surface 27a, for example, along the Z-axis direction in which the central axis CL of the through hole 27 extends, and along the circumferential direction D centered on the central axis CL.
  • Each protrusion 27b has a shape that extends in the Z-axis direction, for example.
  • the arrangement pitch W1 of two adjacent convex portions 27b in the Z-axis direction is larger than the arrangement pitch W2 of two adjacent convex portions 27b in the circumferential direction D.
  • the arrangement pitches W1, W2 of two adjacent convex portions 27b may be, for example, the distance between the centers of the two convex portions 27b when viewed along the normal direction of the inner surface 27a.
  • the degree of unevenness of the inner surface 27a can be evaluated, for example, by the surface roughness Rz.
  • the surface roughness Rz is calculated as the sum of the maximum peak height and the maximum valley depth of the profile curve over the reference length.
  • Surface roughness Rz refers to the maximum height roughness defined in JIS B 0601:2013 "Geometric characteristics of products (GPS) - Surface quality: Profile curve method - Terms, definitions and surface quality parameters".
  • Surface roughness Rz is a value measured in accordance with the description in JIS B 0601:2013.
  • FIG. 5 is a graph for explaining a method for calculating surface roughness Rz.
  • the horizontal axis of FIG. 5 indicates the position of the inner surface 27a along the circumferential direction D of the through hole 27.
  • the vertical axis of FIG. 5 indicates the height of the unevenness of the inner surface 27a.
  • the height of the highest convex portion 27b (maximum peak height) is represented as Zp
  • the depth of the lowest concave portion maximum valley depth
  • the surface roughness Rz is defined as the difference between the maximum peak height Zp and the maximum valley depth Zv (Zp-Zv).
  • the glass fiber 11 inserted into the through hole 27 may come into contact with the convex portions 27b of the inner surface 27a, causing stress concentration at the contact points between the glass fiber 11 and the convex portions 27b.
  • stress concentration may cause damage to the glass fiber 11, such as breakage. Therefore, from the perspective of reducing damage to the glass fiber 11, it is desirable for the surface roughness Rz of the inner surface 27a to be small.
  • the surface roughness Rz of the inner surface 27a is set to 0 ⁇ m or more and 1 ⁇ m or less.
  • the upper limit of the surface roughness Rz is not limited to 1 ⁇ m or less, and may be a value of 0.8 ⁇ m or less, 0.6 ⁇ m or less, or 0.4 ⁇ m or less.
  • the inner diameter D27 of the through hole 27 is set to be smaller according to the surface roughness Rz.
  • the inner diameter D27 is set so that the ratio of the inner diameter D27 to the surface roughness Rz is 127 or less. For example, when the surface roughness Rz is 1 ⁇ m, the inner diameter D27 of the through hole 27 may be 127 ⁇ m.
  • the surface roughness Rz of the inner surface 27a can be adjusted by changing the laser irradiation conditions and etching conditions when forming the through-holes 27 in the substrate body 26. For example, by changing the irradiation pitch when irradiating the substrate body 26 with a laser and changing the etching process time, it is possible to obtain an inner surface 27a with a surface roughness Rz of 1 ⁇ m or less.
  • FIG. 6A is a perspective view showing a state in which glass fibers 11 are inserted into each through hole 27 of the glass substrate 25 of FIG. 4.
  • FIG. 6B is a cross-sectional view of the glass substrate 25 taken along line A1-A1 of FIG. 6A.
  • each glass fiber 11 includes a core 11a and a cladding 11b surrounding the core 11a.
  • the core 11a and the cladding 11b include, for example, silica-based glass.
  • the outer diameter D11 of each glass fiber 11 may be, for example, 125 ⁇ m.
  • the outer diameter D11 of each glass fiber 11 may be, for example, 80 ⁇ m or more and 125 ⁇ m or less.
  • each glass fiber 11 is inserted into each through-hole 27 from the surface 26a of the substrate body 26, and an ultraviolet-curing adhesive A is injected into each through-hole 27.
  • an ultraviolet-curing adhesive A is injected into each through-hole 27.
  • each glass fiber 11 is fixed to the substrate body 26.
  • the core 11a of each glass fiber 11 fixed to the substrate body 26 is optically connected to each input/output unit of the electronic board 2 (see FIG. 1) on which the substrate body 26 is mounted.
  • the outer diameter D11 of the glass fiber 11 is 125 ⁇ m
  • the inner diameter D27 of the through hole 27 is 127 ⁇ m
  • the surface roughness Rz is 1 ⁇ m or less.
  • the gap G1 between the glass fiber 11 and the inner surface 27a is 2 ⁇ m.
  • the maximum height H of the convex portion 27b from the inner surface 27a is 1 ⁇ m, so that a gap G2 of at least 1 ⁇ m is maintained between the convex portion 27b and the glass fiber 11. In this case, it is possible to insert the glass fiber 11 into the through hole 27 while reducing the occurrence of damage to the glass fiber 11 caused by the stress concentration on the glass fiber 11 by the convex portion 27b.
  • the glass fiber 11 is fixed to the substrate body 26 by adhesive A, so a space capable of injecting adhesive A is required between the glass fiber 11 and the inner surface 27a.
  • a gap G2 of at least 1 ⁇ m is maintained between the glass fiber 11 and the convex portion 27b, so a space capable of injecting adhesive A is maintained between the glass fiber 11 and the inner surface 27a. Therefore, in this embodiment, it is possible to insert the glass fiber 11 into the through hole 27 without damaging the glass fiber 11, while maintaining a space capable of accepting adhesive A between the glass fiber 11 and the inner surface 27a.
  • the glass substrate 25 holds the glass fiber 11 so that the glass fiber 11 is maintained at a predetermined connection position relative to the electronic substrate 2.
  • the optical coupling efficiency of the glass fiber 11 relative to the electronic substrate 2 depends heavily on the positional accuracy of the glass fiber 11.
  • a positional deviation of the glass fiber 11 on the order of ⁇ m can cause a large optical connection loss of the glass fiber 11. From the viewpoint of reducing such optical connection loss, it is desirable that the position of the glass fiber 11 is precisely maintained on the order of ⁇ m.
  • the surface roughness Rz of the inner surface 27a into which the glass fiber 11 is inserted is set to 1 ⁇ or less, and furthermore, assuming that a glass fiber 11 having a standard outer diameter D11 of 125 ⁇ m or less is inserted into the through hole 27, the ratio of the inner diameter D27 of the through hole 27 to the surface roughness Rz is set to 127 or less.
  • the inner diameter D27 of the through hole 27 can be made as small as possible to prevent damage to the glass fiber 11 due to stress concentration on the glass fiber 11 by the convex portion 27b of the inner surface 27a, and to a degree that allows adhesive A to be applied between the inner surface 27a and the glass fiber 11.
  • the substrate body 26 is formed with a plurality of through holes 27 into which the plurality of glass fibers 11 can be inserted.
  • the substrate body 26 is formed with a plurality of through holes 27 into which the plurality of glass fibers 11 can be inserted.
  • the arrangement pitch W1 of two adjacent convex portions 27b in the Z-axis direction is larger than the arrangement pitch W2 of two adjacent convex portions 27b in the circumferential direction D.
  • the number of convex portions 27b formed along the Z-axis direction can be reduced compared to the case where the arrangement pitch W1 of each convex portion 27b in the Z-axis direction is equal to the arrangement pitch W2 of each convex portion 27b in the circumferential direction D.
  • the number of convex portions 27b that the glass fiber 11 comes into contact with while inserting the glass fiber 11 into the through hole 27 along the Z-axis direction from the front surface 26a to the back surface 26b can be reduced.
  • the opportunity for stress concentration to occur in the glass fiber 11 due to contact of the glass fiber 11 with the convex portions 27b can be reduced, and damage to the glass fiber 11 caused by stress concentration can be more reliably reduced.
  • the optical connection part 1 includes a glass substrate 25 and a glass fiber 11 that is inserted into the through hole 27 and fixed to the substrate body 26 with adhesive A. Because the optical connection part 1 includes the above-mentioned glass substrate 25, as described above, it is possible to increase the positional accuracy of the glass fiber 11 while reducing the occurrence of damage to the glass fiber 11.
  • the glass fiber 11 includes a straight portion P1 that extends along the Z-axis direction and is inserted into the through hole 27, a straight portion P3 that extends along the X-axis direction, and a curved portion P2 that extends between the straight portion P1 and the straight portion P3 while curving to connect the straight portion P1 and the straight portion P3.
  • a straight portion P1 that extends along the Z-axis direction and is inserted into the through hole 27, a straight portion P3 that extends along the X-axis direction, and a curved portion P2 that extends between the straight portion P1 and the straight portion P3 while curving to connect the straight portion P1 and the straight portion P3.
  • FIG. 7A is an enlarged perspective view of glass substrate 25A, which is another example of glass substrate 25.
  • FIG. 7B is a cross-sectional view of glass substrate 25A taken along line A2-A2 in FIG. 7A.
  • the difference between glass substrate 25A in FIG. 7A and glass substrate 25 in the embodiment described above is the shape of each of the through holes formed in the substrate body.
  • each through hole 27A of the substrate body 26A includes a constant diameter portion P21 and an expanding diameter portion P22.
  • the constant diameter portion P21 extends in the Z-axis direction from the back surface 26b to the front surface 26a and has a constant inner diameter.
  • the expanding diameter portion P22 extends in the Z-axis direction from the constant diameter portion P21 to the front surface 26a and expands in diameter as it approaches the front surface 26a.
  • the inner diameter D21 of the constant diameter portion P21 is set to be, for example, larger than the outer diameter D11 of the glass fiber 11 (see FIG. 6A) and the inner diameter D21 relative to the surface roughness Rz is 127 ⁇ m or less. For example, if the outer diameter D11 of the glass fiber 11 is 125 ⁇ m and the surface roughness Rz is 1 ⁇ m or less, the inner diameter D21 of the constant diameter portion P21 may be 127 ⁇ m.
  • the inner diameter D22 of the expanded diameter portion P22 gradually increases as it approaches the surface 26a from the constant diameter portion P21.
  • the inner surface 27a of the expanded diameter portion P22 is curved so as to move away from the central axis CL of the through hole 27A as it approaches the surface 26a.
  • the closer the inner surface 27a of the expanded diameter portion P22 is to the surface 26a the larger the distance d22 in the X-axis direction between the inner surface 27a and the central axis CL of the through hole 27A becomes.
  • the cross section of FIG. 7B is a cut surface of the substrate body 26 cut along the central axis CL of the through hole 27A, i.e., a cut surface of the substrate body 26 taken on a plane passing through the central axis CL of the through hole 27A.
  • the inner surface 27a of the expanded diameter portion P22 is bent so that the curvature of the inner surface 27a increases as it approaches the surface 26a.
  • the curvature of the inner surface 27a is minimum at the connection portion P23 between the expanded diameter portion P22 and the constant diameter portion P21, and is maximum at the surface 26a.
  • the inner diameter D22 of the expanded diameter portion P22 at the surface 26a is larger than the inner diameter D21 of the constant diameter portion P21.
  • the inner diameter D22 of the expanded diameter portion P22 at the surface 26a may be 250 ⁇ m or less.
  • the unevenness that may be formed on the inner surface 27a is omitted, but in reality, unevenness may be formed on the inner surface 27a as in the above-mentioned embodiment.
  • through hole 27A includes expanding portion P22 whose diameter expands as it approaches surface 26a, and inner surface 27a of expanding portion P22 is curved so as to bend away from central axis CL as it approaches surface 26a.
  • expanding portion P22 whose diameter expands as it approaches surface 26a
  • inner surface 27a of expanding portion P22 is curved so as to bend away from central axis CL as it approaches surface 26a.
  • inner surface 27a of enlarged portion P22 is bent so that the curvature of inner surface 27a increases as it approaches surface 26a. In this case, it is possible to more reliably reduce the occurrence of stress concentration on glass fiber 11 due to unevenness on inner surface 27a of enlarged portion P22, and therefore more reliably reduce damage to glass fiber 11 caused by stress concentration.
  • FIG. 8 are plan views showing other examples of the shape of the through hole 27.
  • the outer shape of the glass fiber 11 is also shown by a two-dot chain line.
  • the shape of the through hole 27 seen along the Z-axis direction may be rectangular like the through hole 27B in (a) of FIG. 8, elliptical like the through hole 27C in (b) of FIG. 8, triangular like the through hole 27D in (c) of FIG. 8, or rhombus like the through hole 27E in (d) of FIG. 8.
  • the shape of the through hole 27 seen along the Z-axis direction may be another polygon.
  • two grooves 28a, 28b may be formed in a circular through-hole 27F.
  • the two grooves 28a, 28b may extend along the Z-axis direction from the front surface 26a to the back surface 26b.
  • Each groove 28a, 28b may be formed, for example, at a pair of positions in the through-hole 27F that face each other across the central axis CL.
  • the shape of each groove 28a, 28b when viewed along the Z-axis direction may be, for example, rectangular.
  • These grooves 28a, 28b can be used as escape grooves to allow excess adhesive A for fixing the glass fiber 11 to escape.
  • escape grooves it is not necessary to make adjustments such as designing the through hole 27F to be large in advance in consideration of the amount of adhesive A injected into the through hole 27F, so the inner diameter of the through hole 27F can be made as small as possible while maintaining the shape of the through hole 27F to match the shape of the glass fiber 11. This makes it possible to more reliably obtain the above-mentioned effect of increasing the positional accuracy of the glass fiber 11 inserted into the through hole 27F.
  • three grooves 29a, 29b, 29c may be formed in the through hole 27G. The number of grooves formed in the through hole in this way can be changed as appropriate.
  • the glass substrate 25 holds one fiber ribbon 10.
  • the glass substrate of the present disclosure may hold multiple fiber ribbons.
  • the number of through holes formed in the glass substrate of the present disclosure can be changed as appropriate depending on the number of glass fibers to be inserted into the through holes.
  • the glass substrate may be formed with one through hole for holding one glass fiber.

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  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Coupling Of Light Guides (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

Un substrat de verre (25) selon la présente divulgation comprend un corps de substrat qui a une première surface (26a) et une seconde surface (26b) qui est positionnée sur le côté opposé à la première surface (26a), et qui est formée d'un matériau de verre. Le corps de substrat est pourvu d'au moins un trou traversant (27) qui pénètre dans le corps de substrat de la première surface (26a) à la seconde surface (26b), et dans lequel au moins une fibre de verre (11) peut être insérée. Le diamètre externe de la fibre de verre (11) est inférieur ou égal à 125 µm. Le diamètre interne du trou traversant (27) est supérieur au diamètre externe de la fibre de verre (11). La rugosité de surface Rz de la surface interne du trou traversant (27) est inférieure ou égale à 1 µm. Le rapport du diamètre interne du trou traversant (27) à la rugosité de surface Rz est inférieur ou égal à 127.
PCT/JP2024/020393 2023-06-09 2024-06-04 Substrat de verre et composant de connexion optique Pending WO2024253098A1 (fr)

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