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WO2024249942A3 - Machine learning-based rapid optical metrology system and method - Google Patents

Machine learning-based rapid optical metrology system and method Download PDF

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Publication number
WO2024249942A3
WO2024249942A3 PCT/US2024/032117 US2024032117W WO2024249942A3 WO 2024249942 A3 WO2024249942 A3 WO 2024249942A3 US 2024032117 W US2024032117 W US 2024032117W WO 2024249942 A3 WO2024249942 A3 WO 2024249942A3
Authority
WO
WIPO (PCT)
Prior art keywords
fabricated
metrology system
classifier
critical dimensions
machine learning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/US2024/032117
Other languages
French (fr)
Other versions
WO2024249942A2 (en
Inventor
Dragan Djurdjanovic
Ramin SABBAGH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Texas System
University of Texas at Austin
Original Assignee
University of Texas System
University of Texas at Austin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by University of Texas System, University of Texas at Austin filed Critical University of Texas System
Publication of WO2024249942A2 publication Critical patent/WO2024249942A2/en
Publication of WO2024249942A3 publication Critical patent/WO2024249942A3/en
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/60—Extraction of image or video features relating to illumination properties, e.g. using a reflectance or lighting model
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning
    • G06N20/10—Machine learning using kernel methods, e.g. support vector machines [SVM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/774—Generating sets of training patterns; Bootstrap methods, e.g. bagging or boosting
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/77—Processing image or video features in feature spaces; using data integration or data reduction, e.g. principal component analysis [PCA] or independent component analysis [ICA] or self-organising maps [SOM]; Blind source separation
    • G06V10/778—Active pattern-learning, e.g. online learning of image or video features
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/70—Arrangements for image or video recognition or understanding using pattern recognition or machine learning
    • G06V10/82—Arrangements for image or video recognition or understanding using pattern recognition or machine learning using neural networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V2201/00—Indexing scheme relating to image or video recognition or understanding
    • G06V2201/06—Recognition of objects for industrial automation

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Software Systems (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • Computing Systems (AREA)
  • Artificial Intelligence (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Multimedia (AREA)
  • Databases & Information Systems (AREA)
  • Mathematical Physics (AREA)
  • General Engineering & Computer Science (AREA)
  • Data Mining & Analysis (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Computational Linguistics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)

Abstract

An exemplary scatterometry-based metrology system and method are disclosed that can perform high-throughput inspection, using AI classifier, of geometric characteristics of large-area micro or nanopatterned surfaces in a fabricated or partially fabricated devices to identify an anomaly in a fabricated workpiece, its batch, or its associated processing or equipment. The exemplary metrology system and method utilize physics-based dependencies between reflectance of light scattered from micro or nanopatterned surfaces for a pre-defined set of wavelengths and the geometric characteristics of the nanopatterns to train an AI classifier for a device design using variations in critical dimensions of that device design. The trained AI classifier can then be used to predict/estimate critical dimensions of critical dimensions of a fabricated or partially fabricated device.
PCT/US2024/032117 2023-06-01 2024-05-31 Machine learning-based rapid optical metrology system and method Pending WO2024249942A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202363505635P 2023-06-01 2023-06-01
US63/505,635 2023-06-01
US202363584969P 2023-09-25 2023-09-25
US63/584,969 2023-09-25

Publications (2)

Publication Number Publication Date
WO2024249942A2 WO2024249942A2 (en) 2024-12-05
WO2024249942A3 true WO2024249942A3 (en) 2025-02-13

Family

ID=93658543

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2024/032117 Pending WO2024249942A2 (en) 2023-06-01 2024-05-31 Machine learning-based rapid optical metrology system and method

Country Status (1)

Country Link
WO (1) WO2024249942A2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022128373A1 (en) * 2020-12-15 2022-06-23 Asml Netherlands B.V. Apparatus and method for determining three dimensional data based on an image of a patterned substrate
US20230113207A1 (en) * 2021-10-13 2023-04-13 Samsung Electronics Co., Ltd. Method of predicting characteristic of semiconductor device and computing device performing the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022128373A1 (en) * 2020-12-15 2022-06-23 Asml Netherlands B.V. Apparatus and method for determining three dimensional data based on an image of a patterned substrate
US20230113207A1 (en) * 2021-10-13 2023-04-13 Samsung Electronics Co., Ltd. Method of predicting characteristic of semiconductor device and computing device performing the same

Also Published As

Publication number Publication date
WO2024249942A2 (en) 2024-12-05

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