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WO2024247397A1 - Module de condensateur - Google Patents

Module de condensateur Download PDF

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Publication number
WO2024247397A1
WO2024247397A1 PCT/JP2024/005992 JP2024005992W WO2024247397A1 WO 2024247397 A1 WO2024247397 A1 WO 2024247397A1 JP 2024005992 W JP2024005992 W JP 2024005992W WO 2024247397 A1 WO2024247397 A1 WO 2024247397A1
Authority
WO
WIPO (PCT)
Prior art keywords
capacitor
capacitor element
case
heat
capacitor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/005992
Other languages
English (en)
Japanese (ja)
Inventor
和明 三野
遼太郎 畑
要 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of WO2024247397A1 publication Critical patent/WO2024247397A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors

Definitions

  • This disclosure relates to a capacitor module.
  • a capacitor module is known in which multiple capacitor elements are housed in a case and sealed with resin.
  • the cooling structure of the capacitor in Patent Document 1 includes a cooling member sandwiched between two adjacent parallel capacitor elements and arranged so as to be capable of transferring heat to the capacitor elements.
  • This disclosure provides a capacitor module with improved reliability.
  • a capacitor module includes: a case having an opening formed at a position facing a bottom surface; one or more first capacitor elements housed in the case along the bottom surface; one or more second capacitor elements that are accommodated in the case along the bottom surface alongside the first capacitor element and have a lower heat resistance than the first capacitor element; a sealing resin filled in the case to seal the first capacitor element and the second capacitor element; Equipped with A heat insulating portion having a lower thermal conductivity than the sealing resin is disposed between the first capacitor element and the second capacitor element.
  • This disclosure makes it possible to provide a capacitor module with improved reliability.
  • FIG. 1 is a plan view showing a capacitor module according to a first embodiment of the present invention
  • FIG. 11 is a plan view showing a capacitor module 1A according to a second embodiment of the present invention
  • 3C-C cross-sectional view of FIG. FIG. 11 is a plan view showing a capacitor module 1B according to a third embodiment of the present invention;
  • a capacitor module is known in which a plurality of capacitors are housed in a case and sealed with resin. Such a capacitor module is used, for example, in an in-vehicle inverter.
  • a smoothing capacitor X capacitor
  • Y capacitor capacitor
  • X capacitors tend to generate heat because a large current flows through them to operate the circuit.
  • the current that flows through Y capacitors is a common mode noise component, so the loss and heat generated are smaller than in X capacitors. For this reason, X capacitors are often made with a relatively high heat resistance, while Y capacitors are often made with a lower heat resistance than X capacitors.
  • the heat generated by the X capacitor is transferred to the Y capacitor, which has a lower heat resistance temperature than the X capacitor, causing damage to the Y capacitor and reducing the reliability of the capacitor module.
  • the inventors therefore investigated capacitor modules with improved reliability and came up with the following invention.
  • FIG. 1A is a plan view showing a schematic configuration of a capacitor module 1 according to a first embodiment.
  • Fig. 1B is an enlarged view of a region R1 in Fig. 1A.
  • Fig. 2A is a cross-sectional view taken along line AA of the capacitor module 1 in Fig. 1A.
  • Fig. 2B is a cross-sectional view taken along line BB of the capacitor module 1 in Fig. 1A.
  • the capacitor module 1 comprises a case 10, eight first capacitor elements 20, two second capacitor elements 30, and sealing resin 40.
  • the capacitor module 1 is a module in which a plurality of capacitor elements 20, 30 are housed in the case 10 and sealed with sealing resin 40.
  • a heat insulating section 50 having a lower thermal conductivity than the sealing resin 40 is disposed between the first capacitor elements 20 and the second capacitor elements 30.
  • the capacitor module 1 is electrically connected to a power conversion device, for example, an on-board inverter, via a bus bar (not shown).
  • the capacitor module 1 is formed by housing eight first capacitor elements 20 and two second capacitor elements 30 inside a case 10 formed of synthetic resin or the like.
  • the inside of the case 10 is filled with a sealing resin 40 as shown in Figs. 2A and 2B.
  • the case 10 has a bottom surface 10a, and an opening 10b is formed at a position opposite to the bottom surface 10a.
  • the case 10 is formed in a rectangular shape in a plan view. Therefore, the case 10 is formed in a rectangular box shape having a bottom surface 10a and four side walls 10c.
  • the shape of the case 10 is not limited to this and can be any shape.
  • the case 10 is provided with three protrusions 11 that protrude from the bottom surface 10a of the case 10 toward the opening 10b.
  • each of the three protrusions 11 is formed in a rectangular shape in a plan view, and a cavity 11a is formed inside.
  • a heat insulating section 50 is disposed in the cavity 11a inside the protrusions 11.
  • the dielectric film constituting the first capacitor element 20 for example, a dielectric film formed from a mixed resin solution containing phenoxy resin and MDI (diphenylmethane diisocyanate) can be used. Alternatively, a dielectric film formed from a mixed resin solution containing polyvinyl acetoacetal (PVAA) and ethyl acetate can be used.
  • PVAA polyvinyl acetoacetal
  • the heat resistance temperature of the first capacitor element 20 can be 125°C or higher.
  • the heat resistance temperature of the first capacitor element is, for example, a temperature at which a reliability test is cleared, and refers to a temperature at which the first capacitor element 20 does not break even if it is used continuously for a predetermined period of time.
  • metals such as Al and Zn can be used as the metal vapor deposition film formed on the surface of the dielectric film.
  • the first capacitor element 20 is housed in the case 10 along the bottom surface 10a of the case 10.
  • the first capacitor element 20 is, for example, a smoothing capacitor or an X-capacitor, and is a capacitor element through which a relatively large current flows compared to the second capacitor element 30 for circuit operation.
  • the second capacitor element 30 is a film capacitor formed of a laminate of dielectric films, similar to the first capacitor element 20. More specifically, the second capacitor element 30 is formed by stacking dielectric films having metal deposition films formed on their surfaces, and then rolling or laminating the stack. End electrodes for electrical connection to bus bars (not shown) are formed on both ends of the laminate of dielectric films of the second capacitor element 30. One end electrode of the second capacitor element 30 is connected to a bus bar (not shown), and the other end electrode is connected to a ground electrode (not shown).
  • the dielectric film constituting the second capacitor element 30 may be, for example, a plastic film such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate. Due to differences in the dielectric film, the heat resistance temperature of the second capacitor element 30 is lower than the heat resistance temperature of the first capacitor element 20.
  • the heat resistance temperature is, for example, a temperature that has passed a reliability test, and is a temperature at which the second capacitor element 30 will not be damaged even if it is used continuously for a specified period of time. In this embodiment, the heat resistance temperature of the second capacitor element 30 is, for example, 100°C or higher and 110°C or lower.
  • the second capacitor element 30 is housed in the case 10 alongside the first capacitor element 20 and along the bottom surface 10a of the case 10.
  • the second capacitor element 30 is also arranged along the side wall 10c of the case 10.
  • the second capacitor element 30 is, for example, a Y capacitor that reduces common mode noise.
  • the second capacitor element 30 has a smaller current flowing therethrough than the first capacitor element 20.
  • the sealing resin 40 is filled into the case 10 to seal the first capacitor element 20 and the second capacitor element 30 housed in the case 10.
  • the sealing resin 40 is made of a thermosetting resin such as an epoxy resin or a urethane resin. It is preferable to use a material with high fluidity and adhesiveness as the material for the sealing resin 40.
  • the heat insulating section 50 is disposed between the first capacitor element 20 and the second capacitor element 30 to suppress the transfer of heat from the first capacitor element 20 to the second capacitor element 30.
  • a relatively large current flows through the first capacitor element 20, so that the first capacitor element 20 is likely to generate heat.
  • the current flowing through the second capacitor element 30 is smaller than that of the first capacitor element 20, and the amount of heat generated by the second capacitor element 30 is smaller than that of the first capacitor element 20.
  • the heat resistance temperature of the second capacitor element 30 is lower than that of the first capacitor element 20.
  • the heat insulating section 50 can suppress damage caused by heat to the second capacitor element 30, and improve the reliability of the capacitor module 1.
  • three heat insulating sections 50 are arranged around the two second capacitor elements 30.
  • the number of heat insulating sections 50 is not limited to this, and it is sufficient that the heat insulating sections 50 are arranged so as to suppress the transfer of heat from the first capacitor element 20 to the second capacitor element 30.
  • the heat insulating section 50 is configured so that air is contained in the portion surrounded by the protruding portion 11 of the case 10. In other words, an air layer is formed in the portion surrounded by the protruding portion 11. Since air has a lower thermal conductivity than the sealing resin 40, it is possible to suppress the transfer of heat generated in the first capacitor element 20 to the second capacitor element 30. Note that in this embodiment, the entire heat insulating section 50 is configured from air.
  • the protrusion 11 is provided on the bottom surface 10a of the case 10, so that when the sealing resin 40 is filled into the case 10, the cavity 11a surrounded by the protrusion 11 is not filled with resin. As a result, the cavity 11a surrounded by the protrusion 11 contains air.
  • the capacitor module 1 includes a case 10, a first capacitor element 20, a second capacitor element 30, and a sealing resin 40, and a heat insulating section 50 is disposed between the first capacitor element 20 and the second capacitor element 30.
  • the case 10 has a bottom surface 10a and an opening 10b formed at a position opposite the bottom surface 10a.
  • the first capacitor element 20 is accommodated in the case 10 along the bottom surface 10a of the case 10.
  • the second capacitor element 30 is accommodated in the case 10 along the bottom surface 10a of the case 10, alongside the first capacitor element 20.
  • the heat resistance temperature of the second capacitor element 30 is lower than that of the first capacitor element 20.
  • the heat insulating section 50 has a lower thermal conductivity than the sealing resin 40.
  • This configuration suppresses the transfer of heat from the first capacitor element 20 to the second capacitor element 30, improving the reliability of the capacitor module 1.
  • the heat insulating section is composed of a protrusion 11 that protrudes from the bottom surface 10a of the case 10 toward the opening 10b.
  • This configuration makes it easy to form the insulating section.
  • a cavity 11a is formed inside the protrusion 11, and the insulating section 50 is disposed in the cavity 11a.
  • This configuration makes it easy to form the insulating section.
  • the first capacitor element 20 is an X capacitor
  • the second capacitor element 30 is a Y capacitor.
  • This configuration makes it possible to suppress the transfer of heat between the first capacitor element 20 and the second capacitor element 30, which have different amounts of heat generation.
  • the second capacitor element 30 is arranged along the side wall 10c of the case 10.
  • This configuration makes it possible to easily connect the second capacitor element 30 to an external ground electrode while avoiding interference with the first capacitor element 20 or the bus bar, etc.
  • first capacitor elements 20 and two second capacitor elements 30 have been described, but this is not limited to this.
  • the number of first capacitor elements 20 and second capacitor elements 30 may each be one or more.
  • the number of heat insulating sections 50 may be one, or two or more.
  • the insulating section 50 may contain a material with a lower thermal conductivity than the sealing resin 40.
  • the insulating section 50 may contain a material with a low thermal conductivity, the physical strength of the capacitor module 1 can be improved, and the reliability of the capacitor module 1 can be further improved.
  • the protrusion 11 is not a required configuration, and does not have to be provided on the case 10.
  • a hole may be made in the sealing resin 40 and the insulating section 50 may be placed inside the hole.
  • the insulating section 50 may be configured to include the protruding section 11.
  • the protruding section 11 may be solid, without a cavity 11a being formed therein.
  • the insulating section 50 is exposed to the outside of the capacitor module 1 through the opening 10b of the case 10, but this is not limited thereto.
  • a lid may be placed on the insulating section 50. In this case, it is possible to prevent foreign matter from entering the insulating section 50.
  • first capacitor element 20 and the second capacitor element 30 are film capacitors, but this is not limiting.
  • the first capacitor element 20 and the second capacitor element 30 may be capacitors other than film capacitors, such as aluminum electrolytic capacitors and ceramic capacitors.
  • the first capacitor element 20 is an X capacitor and the second capacitor element 30 is a Y capacitor, but this is not limiting.
  • the first capacitor element 20 may be a capacitor that has a high heat resistance temperature and through which a relatively large current flows
  • the second capacitor element 30 may be a capacitor that has a smaller current flow and a lower heat resistance temperature compared to the first capacitor element 20.
  • FIG. 3 is a plan view that shows a schematic of a capacitor module 1A according to a second embodiment.
  • FIG. 4 is a cross-sectional view taken along line C-C of FIG. 3.
  • the second embodiment differs from the first embodiment in that a heat transfer section 70 is disposed between the first capacitor element 20 and the heat insulating section 51.
  • the second embodiment also differs from the first embodiment in that the capacitor module 1A further includes a cooling body 80 that is directly or indirectly connected to the heat transfer section 70 and disposed outside the case 12.
  • a heat transfer section 70 having a higher thermal conductivity than the sealing resin 40 is disposed between the first capacitor element 20 and the insulating section 51.
  • the heat transfer section 70 is made of a material such as a metal having a higher thermal conductivity than the sealing resin 40.
  • the heat transfer section 70 is disposed in the cavity 13a inside the protruding section 13 of the case 12.
  • the portion of the inner wall of the cavity 13a that comes into contact with the heat transfer section 70 may be coated with a material that reduces contact thermal resistance, such as thermal grease.
  • the heat transfer section 70 By arranging the heat transfer section 70 between the first capacitor element 20 and the insulating section 51, the heat generated in the first capacitor element 20 can be easily released to the outside of the case 12.
  • the insulating section 51 is arranged between the heat transfer section 70 and the second capacitor element 30, the heat generated in the first capacitor element 20 can be prevented from being transferred to the second capacitor element 30. Therefore, the heat of the first capacitor element 20 can be released to the outside of the capacitor module 1A while preventing heat transfer to the second capacitor element 30.
  • a through hole 12d is formed in the bottom surface 12a of the case 12.
  • a protrusion 13 is provided to surround the through hole 12d.
  • a heat transfer part 70 is inserted into the through hole 12d in the bottom surface 12a of the case 12, so that the heat transfer part 70 and the cooling body 80 arranged on the outside of the bottom surface 12a of the case 12 can be thermally connected. Therefore, the heat of the first capacitor element 20 can be dissipated to the cooling body 80 via the heat transfer part 70.
  • the cooling body 80 can be cooled, for example, by water cooling or air cooling, so that the heat of the first capacitor element 20 can be efficiently dissipated to the outside of the capacitor module 1A.
  • the cooling body 80 is composed of, for example, a metal housing 81 and a heat transfer section 70.
  • the metal housing 81 and heat transfer section 70 constituting the cooling body 80 are integrally formed. Specifically, a portion of the cooling body 80 protrudes to form the heat transfer section 70. By inserting the protruding portion of the cooling body 80 into the through hole 12d of the case 12, the heat transfer section 70 can be positioned inside the protruding section 13.
  • a heat transfer section 70 with a higher thermal conductivity than the sealing resin 40 is disposed between the first capacitor element 20 and the insulating section 51.
  • This configuration makes it possible to suppress thermal conduction between the first capacitor element 20 and the second capacitor element 30 while allowing the heat generated in the first capacitor element 20 to escape to the outside of the capacitor module 1A.
  • cooling body 80 that is directly or indirectly connected to the heat transfer section 70 and is disposed outside the case 12.
  • This configuration allows heat from the capacitor module 1A to be dissipated to the outside via the cooling body 80.
  • the cooling body 80 is composed of a metal housing 81, and the heat transfer section 70 is integral with the metal housing 81.
  • This configuration allows the heat generated in the first capacitor element 20 to be efficiently dissipated to the outside of the capacitor module 1A.
  • the through hole 12d is provided in the bottom surface 12a of the case 12
  • the through hole 12d does not have to be provided in the bottom surface 12a of the case 12.
  • a protrusion 13 is formed from the bottom surface 12a of the case 12 toward the opening 12b (see FIG. 4), and the heat transfer portion 70 is disposed in the cavity 13a inside the protrusion 13. The heat of the first capacitor element 20 is transferred to the cooling body 80 via the heat transfer portion 70 and the bottom surface 12a of the case 12.
  • the heat transfer section 70 and the cooling body 80 are integrally formed has been described, but this is not limiting.
  • the heat transfer section 70 does not have to be integral with the cooling body 80. In this case, when the cooling body 80 and the heat transfer section 70 are in contact with each other, the heat of the first capacitor element 20 can be efficiently released to the outside of the capacitor module 1A.
  • FIG. 3 A capacitor module 1A according to a third embodiment of the present disclosure will be described.
  • differences from the first embodiment will be mainly described.
  • configurations that are the same as or equivalent to those in the first embodiment will be described with the same reference numerals.
  • descriptions that overlap with those in the first embodiment will be omitted.
  • FIG. 5 is a plan view that shows a schematic diagram of a capacitor module 1B according to embodiment 3. As shown in FIG. 5, embodiment 3 differs from embodiment 1 in that eight first capacitor elements 20 are arranged side by side along the side wall 14c of the case 14, and two second capacitor elements 30 are arranged surrounded by the eight first capacitor elements 20.
  • the first capacitor element 20 is arranged along the side wall 14c of the case 14.
  • the first capacitor element 20 is arranged along the four sides of the rectangular case 14 in a plan view.
  • the second capacitor element 30 is surrounded by the first capacitor element 20 and arranged in the center of the case 14 in a plan view.
  • the center of the case tends to generate heat because it is difficult for heat to escape to the outside.
  • the second capacitor element 30, which generates less heat than the first capacitor element 20 is arranged in the center of the case 14, so that heat generation in the capacitor module 1B as a whole can be suppressed.
  • each heat insulating section 52 is arranged to surround the two second capacitor elements 30.
  • the six heat insulating sections are each arranged in a cavity inside six protrusions 15 provided on the case 14. Since the two second capacitor elements 30 are surrounded by the heat insulating sections 52, heat transfer from the first capacitor element 20 to the second capacitor element 30 can be suppressed. Therefore, it is possible to suppress a temperature rise in the center of the case 14 where the second capacitor elements 30 are arranged.
  • the multiple first capacitor elements 20 are arranged side by side along the side wall 14c of the case 14, and one or more second capacitor elements 30 are arranged surrounded by the multiple first capacitor elements 20.
  • This configuration makes it possible to suppress temperature rise in the center of the capacitor module 1B and reduce heat generation throughout the capacitor module 1B.
  • the capacitor module of the present disclosure comprises a case having an opening formed at a position facing a bottom surface, one or more first capacitor elements housed in the case along the bottom surface, one or more second capacitor elements housed in the case along the bottom surface alongside the first capacitor elements and having a lower heat resistance temperature than the first capacitor elements, and a sealing resin that is filled in the case and seals the first capacitor elements and the second capacitor elements, and an insulating portion having a lower thermal conductivity than the sealing resin is disposed between the first capacitor elements and the second capacitor elements.
  • the insulating portion may be formed by a protrusion that protrudes from the bottom surface of the case toward the opening.
  • a cavity may be formed inside the protrusion, and the insulating portion may be disposed in the cavity.
  • the insulating portion may include air.
  • a heat transfer section having a higher thermal conductivity than the sealing resin may be disposed between the first capacitor element and the insulating section.
  • the capacitor module of (5) may further include a cooling body that is directly or indirectly connected to the heat transfer section and is disposed outside the case.
  • the cooling body may be formed of a metal housing, and the heat transfer section may be integral with the metal housing.
  • the cooling body and the heat transfer part may be in contact.
  • the first capacitor element may be an X capacitor and the second capacitor element may be a Y capacitor.
  • the one or more second capacitor elements may be arranged along a side wall of the case.
  • the multiple first capacitor elements may be arranged side by side along a side wall of the case, and the one or more second capacitor elements may be arranged surrounded by the multiple first capacitor elements.
  • This disclosure is useful for capacitor modules used in various electronic devices, electrical devices, industrial equipment, vehicle devices, etc.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Un module de condensateur 1 selon la présente divulgation comprend : un boîtier 10 dans lequel une ouverture 10b est formée à une position faisant face à une surface inférieure 10a ; un ou plusieurs premiers éléments de condensateur 20 qui sont logés dans le boîtier 10 le long de la surface inférieure 10a ; un ou plusieurs seconds éléments de condensateur 30 qui sont logés dans le boîtier 10 le long de la surface inférieure 10a de façon à être côte à côte avec le premier élément de condensateur 20, et qui ont une température de résistance à la chaleur inférieure à celle du premier élément de condensateur 20 ; et une résine d'étanchéité 40 qui est remplie dans le boîtier 10 et scelle le premier élément de condensateur 20 et le second élément de condensateur 30. Une partie d'isolation thermique 50 ayant une conductivité thermique inférieure à celle de la résine d'étanchéité 40 est disposée entre le premier élément de condensateur 20 et le second élément de condensateur 30.
PCT/JP2024/005992 2023-05-29 2024-02-20 Module de condensateur Pending WO2024247397A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-088141 2023-05-29
JP2023088141 2023-05-29

Publications (1)

Publication Number Publication Date
WO2024247397A1 true WO2024247397A1 (fr) 2024-12-05

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PCT/JP2024/005992 Pending WO2024247397A1 (fr) 2023-05-29 2024-02-20 Module de condensateur

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WO (1) WO2024247397A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0579906U (ja) * 1992-04-02 1993-10-29 岡谷電機産業株式会社 複合電子部品
JP2009044920A (ja) * 2007-08-10 2009-02-26 Toyota Motor Corp 電力変換ユニット
JP2009188158A (ja) * 2008-02-06 2009-08-20 Panasonic Corp ケースモールド型コンデンサ
JP2017147107A (ja) * 2016-02-17 2017-08-24 株式会社豊田自動織機 蓄電装置モジュールの製造方法及び装置
JP2023501826A (ja) * 2020-09-14 2023-01-19 エルジー エナジー ソリューション リミテッド バッテリーモジュールの熱拡散防止構造を適用したバッテリーパック

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0579906U (ja) * 1992-04-02 1993-10-29 岡谷電機産業株式会社 複合電子部品
JP2009044920A (ja) * 2007-08-10 2009-02-26 Toyota Motor Corp 電力変換ユニット
JP2009188158A (ja) * 2008-02-06 2009-08-20 Panasonic Corp ケースモールド型コンデンサ
JP2017147107A (ja) * 2016-02-17 2017-08-24 株式会社豊田自動織機 蓄電装置モジュールの製造方法及び装置
JP2023501826A (ja) * 2020-09-14 2023-01-19 エルジー エナジー ソリューション リミテッド バッテリーモジュールの熱拡散防止構造を適用したバッテリーパック

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