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WO2024245624A1 - Procédé et système de séparation d'un ensemble - Google Patents

Procédé et système de séparation d'un ensemble Download PDF

Info

Publication number
WO2024245624A1
WO2024245624A1 PCT/EP2024/058943 EP2024058943W WO2024245624A1 WO 2024245624 A1 WO2024245624 A1 WO 2024245624A1 EP 2024058943 W EP2024058943 W EP 2024058943W WO 2024245624 A1 WO2024245624 A1 WO 2024245624A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
solder connection
component
separating
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2024/058943
Other languages
German (de)
English (en)
Inventor
Dietmar Birgel
Alexander Bannwarth
Joachim ERHARD
Paul Wild
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Endress and Hauser SE and Co KG
Rehm Thermal Systems GmbH
Original Assignee
Endress and Hauser SE and Co KG
Rehm Thermal Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress and Hauser SE and Co KG, Rehm Thermal Systems GmbH filed Critical Endress and Hauser SE and Co KG
Priority to CN202480030465.3A priority Critical patent/CN121100591A/zh
Publication of WO2024245624A1 publication Critical patent/WO2024245624A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder

Definitions

  • the invention relates to a method for separating an assembly, wherein the assembly comprises at least one component and a circuit board, wherein the at least one component is connected to the circuit board by means of at least one solder connection.
  • the invention further relates to a system for separating an assembly.
  • a solder joint is obtained by a soldering process, which creates a material-locking connection by means of a thermal process.
  • Field devices are used to determine and/or monitor process variables.
  • field devices are all devices that are used close to the process and provide or process process-relevant information. These include, for example, level measuring devices, flow measuring devices, pressure and temperature measuring devices, pH redox potential measuring devices, conductivity measuring devices, etc., which record the corresponding process variables of level, flow, pressure, temperature, pH value or conductivity.
  • Field devices often have a sensor unit that is in contact with a process medium, in particular at least temporarily and/or at least in sections, which serves to generate a signal that depends on the process variable. They also often have an electronic unit arranged in a housing, whereby the electronic unit serves to process and/or forward signals generated by the sensor unit, in particular electrical and/or electronic signals.
  • Electronic units often comprise at least one circuit board with components soldered onto it using one or more soldering processes.
  • soldering processes are known from the prior art, the selection of which is determined by the application, in particular the components to be soldered and/or the solder.
  • a soldering process that is widely used in industrial production lines for the manufacture of printed circuit boards is reflow soldering, in which surface-mounted components, so-called 'Surface Mounted Devices' (SMD components for short), are soldered directly onto the intended contact surfaces.
  • SMD components are placed mechanically on the contact surface on the circuit board, which is coated with solder paste, using automatic placement machines and are soldered together with a reflow soldering process in a reflow soldering oven. This creates a large number of solder connections at the same time.
  • THT components are typically soldered using a wave soldering process. The circuit board is moved over a so-called solder wave, which is created by pumping liquid solder through a narrow gap.
  • solder or the item to be soldered
  • the temperature profile typically includes preheating the solder and/or the item to be soldered, reaching a maximum temperature that is above the liquidus temperature of the solder, and then cooling.
  • efforts are made to achieve low cooling rates in order to produce solder joints of sufficiently high quality, i.e., for example, high-strength solder joints with sufficiently high mechanical resistance.
  • solder connections have the disadvantage that in order to remove the component from the contact surface, the solder connection(s) must be melted again. This is energy-intensive and can also produce toxic fumes. To protect the environment and improve the recycling of circuit boards, it is desirable to provide an easier way to remove the components. This applies in particular to circuit boards that are used in devices with comparatively short lifespan, such as between 2 and 10 years.
  • the invention is based on the object of specifying a method and a system for separating a component from the circuit board.
  • the object is achieved according to the invention by a method for separating an assembly, wherein the assembly comprises at least one component and a circuit board, wherein the at least one component is connected to the circuit board by means of at least one solder connection, wherein the method comprises at least the following steps:
  • a thermal conditioning of the at least one solder connection comprising the steps: o Heating the at least one solder connection, o After heating, cooling the at least one solder connection at a cooling rate such that the at least one solder connection solidifies, wherein the cooling rate is greater than 6°C/s,
  • an existing solder joint of an assembly is thermally conditioned in such a way that it becomes brittle.
  • the thermal conditioning ie the heating and rapid cooling of the solder joint, leads to a change in the mechanical properties, in particular the plastic properties, of the at least one solder joint.
  • soldering processes are designed in such a way that a solder joint that is stable over a longer period of time is obtained.
  • the solder joint produced in the soldering process is therefore typically non-brittle or ductile, whereby non-brittle and ductile in the sense of this application mean that the solder joint cannot be separated by a brittle fracture.
  • brittle fracture is the term used to describe a sudden material failure. Brittle materials or solder joints are characterized in the stress-strain diagram by a steep rise in the Hooke's line, at the end of which the fracture occurs without plastic deformation.
  • the existing solder connection can be subsequently thermally conditioned.
  • Heating up the at least one solder connection can lead to a liquidus temperature of the at least one solder connection being exceeded.
  • heating up can also mean heating the at least one solder connection to temperatures below a liquidus temperature of the at least one solder connection, in particular of, for example, at least 20 °C, in particular at least 40 °C, below the liquidus temperature of the at least one solder connection.
  • the decisive factor in conditioning is the rapid cooling of the at least one solder connection at a cooling rate of at least 6 °C/s.
  • the properties of the at least one solder connection change in such a way that a brittle-breaking solder connection is produced. This is then brittle-broken under the action of a force, so that the at least one component is separated from the circuit board.
  • the process step of separating the at least one component from the circuit board can be carried out in particular at room temperature. By means of the thermal conditioning of the at least one solder connection, it is thus achieved that the at least one component can be easily separated from the circuit board.
  • the at least one component has several solder connections or that the circuit board is connected to several components
  • a large proportion of the components can advantageously be separated from the circuit board essentially simultaneously by means of brittle fracture under the action of a force on the respective solder connection.
  • a cooling rate of greater than 8°C/s, in particular greater than 10°C/s is used as the cooling rate.
  • the cooling rate can be less than 507s.
  • the cooling rate is set by supplying a liquid medium to the at least one solder connection.
  • the liquid medium can in particular be liquid nitrogen, but other liquid media are also possible, such as water or oil or media that contain water or oil.
  • the liquid medium serves in particular as a coolant.
  • a force of less than 40 N, in particular less than 30 N, in particular less than 20 N, in particular less than 10 N, is used to separate the at least one component from the circuit board.
  • the at least one component is separated from the circuit board by means of twisting, vacuum, ultrasound, dry ice, an air blade, free fall, sudden mechanical stress and/or a brush. Twisting refers in particular to deforming or bending the circuit board.
  • An air blade is a nozzle from which an air jet emerges at high speed.
  • free fall a falling device can be used, into which the assembly is inserted and allowed to fall over a defined distance under the influence of gravity until the assembly hits an impact surface.
  • the at least one component can be sheared off the circuit board using the brush.
  • the object underlying the present application is further achieved by a system for separating an assembly, wherein the assembly comprises at least one component and a circuit board, wherein the at least one component is connected to the circuit board by means of at least one solder connection, with
  • a heating area which is designed to heat the at least one solder connection
  • a cooling region which is designed to cool the at least one solder joint after the heating process at a cooling rate so that the at least one solder joint solidifies, wherein the cooling rate is greater than 6°C/s
  • a separation region which is designed to separate the at least one component from the circuit board by applying a force, so that a brittle fracture of the at least one solder connection occurs.
  • an assembly is thermally conditioned and then separated into its components, i.e. circuit board and component(s), by means of a brittle fracture.
  • the system is designed in such a way that the assembly first passes through the heating area, then the cooling area and finally the separation area.
  • the system according to the invention is particularly suitable for carrying out the method according to the invention.
  • the heating region has at least one heating element.
  • the cooling region has at least one heat exchanger.
  • the cooling area has an opening by means of which a liquid medium can be fed into the cooling area.
  • the liquid medium can in particular be liquid nitrogen, but other liquid media are also possible, such as water or oil or media that contain water or oil.
  • the system further comprises a transport means for receiving the circuit board, wherein the transport means is designed to transport the assembly through the heating area, the cooling area and the separation area.
  • the transport means can be designed in the form of a conveyor belt.
  • the conveyor belt can be designed in one piece or in the form of several modular sections.
  • the transport means can be designed to transport the circuit board and the at least one component separately in the separation area after the at least one component has been separated from the circuit board.
  • the transport means can have two areas, one of which is designed to transport the circuit board and the other to transport the at least one component.
  • a further embodiment provides that the separating region has a separating agent which is designed to act on the force on the at least one solder connection.
  • the separating means is a brush, an air blade, an ultrasonic device, a dropping device, a means for generating a negative pressure and/or a means for twisting the circuit board.
  • Fig. 1a-b schematic representation of the assembly before and after separating at least one component from the circuit board.
  • Fig. 2 an embodiment of a system according to the invention.
  • the method according to the invention and the system according to the invention are applicable to assemblies comprising at least one component and a circuit board, which are connected by means of at least one solder connection.
  • An assembly 1 is manufactured by a soldering process, e.g. reflow soldering.
  • a solder e.g. in the form of a solder paste
  • the at least one component 2 is then placed on the circuit board 3 and soldered to the circuit board 3 in a thermal process.
  • Such an assembly 1 is shown schematically in Fig. 1a.
  • the assembly 1 can be used in a wide variety of electrical or electronic devices. such as field devices, measuring devices, laboratory devices or consumer devices. At the end of the device's life cycle, it is usually disposed of. In order to recycle the assembly 1, it must be removed from the device and separated into its individual components, for which at least one solder connection 4 must be separated.
  • the method according to the invention provides that the at least one solder connection 4 of the assembly 1 is thermally conditioned by first heating it up and then cooling it at a cooling rate of at least 6°C/s. Due to the high cooling rate, the mechanical properties of the at least one solder connection 4 change, so that it acquires brittle-breaking properties. After the thermal conditioning, the at least one component 2 is separated from the circuit board 3 under the action of a force F, so that a brittle fracture occurs at the at least one solder connection 4. In this separation step, a force F of less than 40 N, in particular less than 30 N, in particular less than 20 N, in particular less than 10 N, is used.
  • Fig. 1 b shows a schematic representation of the assembly 1 after the separation step.
  • the solder connection 4 is brittle-broken; the at least one component 2 and the circuit board 3 are separate.
  • FIG. 2 An embodiment of the system 5 according to the invention, in which the method according to the invention can be used, is shown in Fig. 2.
  • the system 5 has three areas: a heating area 6 for heating the at least one solder connection 4, a cooling area 7 for cooling the at least one solder connection 4 and a separation area 8 for separating the at least one component 2 from the circuit board 3.
  • the assembly 1 is placed on an optional transport means 12, which is designed to transport the assembly 1 through the heating area 6, the cooling area 7 and the separation area 8.
  • the assembly 1 first passes through the heating area 6, which optionally has two heating elements 9 for heating the at least one solder connection 4.
  • the assembly 1 is then transported to the cooling area 7, which has two optional heat exchangers 10.
  • the heat exchangers 10 are designed to cool the at least one solder connection 4 with a cooling rate of at least 6°C/s.
  • the cooling region 7 can also have an opening 11 by means of which a liquid medium can be fed into the cooling region 7.
  • the liquid medium is designed to support the cooling process.
  • the assembly 1 is introduced into the separation area 8.
  • a separating agent 13 is arranged, which is designed to exert or act on a force F on the at least one solder connection 4, so that the at least one solder connection 4 breaks brittlely and the at least one component 2 is separated from the circuit board 3.
  • the separating agent 13 can be a brush, which is designed to shear the at least one component 2 from the circuit board 3.
  • the separating agent 13 can be an air blade for generating an air flow at a high speed, an ultrasonic device for generating ultrasonic waves, a means for generating a negative pressure, such as a pump, a dropping device for letting the assembly fall in a defined manner and impacting the assembly on an impact surface and/or a means for twisting the assembly.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un procédé de séparation d'un ensemble (1), l'ensemble (1) comprenant au moins un composant (2) et une carte de circuit imprimé (3), le ou les composants (2) étant connectés à la carte de circuit imprimé (3) au moyen d'au moins une connexion de soudure (4), le procédé comprenant au moins les étapes suivantes : - conditionner thermiquement l'au moins une connexion de soudure (4), comprenant les étapes consistant à : • chauffer l'au moins une connexion de soudure (4), • après chauffage, refroidir l'au moins une connexion de soudure (4) à une vitesse de refroidissement de telle sorte que l'au moins une connexion de soudure (4) devient rigide, la vitesse de refroidissement étant supérieure à 6°C/s, - séparer l'au moins un composant (2) de la carte de circuit imprimé (3) au moyen de l'application d'une force (F) de telle sorte qu'il y a une fracture fragile de l'au moins une connexion de soudure (4). L'invention concerne également un système (5) de séparation d'un ensemble (1).
PCT/EP2024/058943 2023-05-31 2024-04-02 Procédé et système de séparation d'un ensemble Pending WO2024245624A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202480030465.3A CN121100591A (zh) 2023-05-31 2024-04-02 用于分离组件的方法和系统

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102023114319.0 2023-05-31
DE102023114319.0A DE102023114319A1 (de) 2023-05-31 2023-05-31 Verfahren und Anlage zum Trennen einer Baugruppe

Publications (1)

Publication Number Publication Date
WO2024245624A1 true WO2024245624A1 (fr) 2024-12-05

Family

ID=90719615

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2024/058943 Pending WO2024245624A1 (fr) 2023-05-31 2024-04-02 Procédé et système de séparation d'un ensemble

Country Status (3)

Country Link
CN (1) CN121100591A (fr)
DE (1) DE102023114319A1 (fr)
WO (1) WO2024245624A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120090195A1 (en) * 2010-10-15 2012-04-19 Fujitsu Limited Apparatus and method for heating electronic component
US20210114126A1 (en) * 2019-10-22 2021-04-22 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
DE102020105180A1 (de) * 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4274576A (en) * 1979-11-13 1981-06-23 International Business Machines Corporation Cryogenic chip removal technique
DE3720912A1 (de) * 1986-07-03 1988-01-07 Licentia Gmbh Verfahren und anordnung zum reflow-loeten und reflow-entloeten von leiterplatten
DE4330677A1 (de) * 1993-09-10 1995-03-16 Schenck Eng Gmbh Verfahren und Vorrichtung zum Entstücken von Leiterplatten mit darauf angeordneten elektrischen und/oder elektronischen Bauteilen
CA2259043A1 (fr) * 1999-01-18 2000-07-18 Ibm Canada Limited-Ibm Canada Limitee Appareillage et methode pour la depose non destructive a contraintes de faible intensite de composants electroniques soudes
JP6614583B2 (ja) * 2017-01-30 2019-12-04 株式会社アステック入江 電子部品分離方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120090195A1 (en) * 2010-10-15 2012-04-19 Fujitsu Limited Apparatus and method for heating electronic component
US20210114126A1 (en) * 2019-10-22 2021-04-22 International Business Machines Corporation Liquid metal infiltration rework of electronic assembly
DE102020105180A1 (de) * 2020-02-27 2021-09-02 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer Lotverbindung, Verfahren zum Trennen zumindest eines Bauelements von einer Kontaktfläche, Leiterplatte und Feldgerät

Also Published As

Publication number Publication date
CN121100591A (zh) 2025-12-09
DE102023114319A1 (de) 2024-12-05

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