WO2024244263A1 - Copper embedding method for high-frequency copper-embedded circuit board, and high-frequency copper-embedded circuit board - Google Patents

Abstract

The present application provides a copper embedding method for a high-frequency copper-embedded circuit board, and a high-frequency copper-embedded circuit board. The copper embedding method for a high-frequency copper-embedded circuit board comprises: providing a multi-layer laminated board, a copper embedding slot being formed in the surface of the multi-layer laminated board; embedding a heat dissipation mechanism in the copper embedding slot; and carrying out a tin-spraying operation on the multi-layer laminated board, wherein the heat dissipation mechanism comprises a heat dissipation copper block and a plurality of elastic abutting assemblies, the plurality of elastic abutting assemblies are all connected to the heat dissipation copper block, the plurality of elastic abutting assemblies are evenly arranged at intervals in the circumferential direction of the heat dissipation copper block, and one end of each elastic abutting assembly protrudes out of the outer side of the heat dissipation copper block and abuts against the inner peripheral wall of the copper embedding slot, so that the heat dissipation copper block is embedded in the copper embedding slot. In this way, the step of manually selecting the heat dissipation copper block is omitted, and the efficiency of embedding the heat dissipation copper block is improved.

Description

Copper embedding method of high-frequency copper embedded circuit board and high-frequency copper embedded circuit board Technical Field

The invention relates to the technical field of circuit boards, and in particular to a copper embedding method of a high-frequency copper embedded circuit board and the high-frequency copper embedded circuit board.

Background Art

As electronic products become smaller and smaller, the size of printed circuit boards is also constantly shrinking, and the circuit design is becoming more and more dense. As the power density of components increases, the heat dissipation of printed circuit boards is too large, which affects the service life of components, aging, and even component failure.

For electronic components that generate a lot of heat, it is not enough to dissipate the heat simply through a single board carrier. Therefore, heat dissipation copper blocks are usually embedded on the printed circuit board to improve the heat dissipation efficiency of the printed circuit board.

Conventional heat dissipation copper blocks are of different sizes. When the heat dissipation copper block is small, it cannot be firmly embedded in the embedded hole; when the heat dissipation copper block is large, if the heat dissipation copper block is forcibly embedded in the embedded hole, it will cause problems such as hole explosion and internal resin cracks. In order to avoid the above problems, it is necessary to manually select suitable heat dissipation copper blocks and conduct trial plugging, but this will result in a low efficiency of embedded heat dissipation copper blocks.

Summary of the invention

The purpose of the present invention is to overcome the shortcomings of the prior art and provide a copper embedding method for a high-frequency copper embedded circuit board and a high-frequency copper embedded circuit board which avoids manual screening of heat dissipation copper blocks and thereby improves the efficiency of embedding heat dissipation copper blocks.

The objective of the present invention is achieved through the following technical solutions:

A copper embedding method for a high-frequency copper embedded circuit board, comprising:

Providing a multi-layer laminated board, wherein a buried copper groove is formed on the surface of the multi-layer laminated board;

Embedding the heat dissipation mechanism in the buried copper groove;

Performing tin spraying operation on the multi-layer laminate;

The heat dissipation mechanism includes a heat dissipation copper block and a plurality of elastic abutment components. The abutment components are all connected to the heat dissipation copper block, and a plurality of the elastic abutment components are evenly spaced along the circumference of the heat dissipation copper block. One end of each of the elastic abutment components protrudes from the outside of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the buried copper groove, so that the heat dissipation copper block is embedded in the buried copper groove.

In one embodiment, a plurality of mounting holes are provided on the outer side of the heat dissipation copper block, and the plurality of mounting holes are arranged in one-to-one correspondence with the plurality of elastic abutment components, and each of the elastic abutment components comprises:

A mounting sleeve, fixedly connected to the corresponding mounting hole, the mounting sleeve being formed with a receiving groove;

An elastic member, located in the corresponding receiving groove;

An abutment member is located in the corresponding receiving groove, and two ends of the elastic member of each elastic abutment assembly abut against the groove wall of the corresponding receiving groove and the corresponding abutment member respectively; and

A limiting sleeve is fixedly sleeved on one end of the corresponding mounting sleeve and is arranged corresponding to the opening of the corresponding receiving groove. The limiting sleeve of each elastic abutment assembly is provided with an extension hole connected to the corresponding receiving groove. The abutment piece of each elastic abutment assembly abuts against the corresponding limiting sleeve and is passed through the corresponding extension hole, so that the abutment piece of each elastic abutment assembly is also located outside the heat dissipating copper block and is used to abut against the inner circumferential wall of the buried copper groove.

In one embodiment, the elastic member of each elastic abutment assembly is a spring.

In one embodiment, a driving hole is provided on the upper side of the heat dissipation copper block, and the driving hole is connected to each of the mounting holes;

The heat dissipation mechanism also includes a pressing component, which is located in the driving hole and is slidably sleeved with the heat dissipation copper block. The pressing component and the heat dissipation copper block are interference fit, and a first end of the pressing component is formed with a plurality of push inclined surfaces connected in sequence, and an end of the mounting sleeve of each elastic abutment component facing away from the limit sleeve is formed with a force inclined surface, and the plurality of push inclined surfaces are correspondingly fitted to the force inclined surfaces of the mounting sleeves of the plurality of elastic abutment components, and each of the push inclined surfaces pushes the corresponding mounting sleeve to move toward the outside of the heat dissipation copper block when the pressing component is pressed.

In one embodiment, the pressing assembly includes a pushing rod and a pressing portion, the pushing rod is located in the driving hole and is slidably sleeved with the heat dissipation copper block, the pushing rod and the heat dissipation copper block are interference fit, a plurality of pushing inclined surfaces are arranged on the first end of the pushing rod, the pressing portion protrudes and is fixedly connected to the second end of the pushing rod, and the pressing portion abuts against the heat dissipation copper block when the abutting pieces of each of the elastic abutting assemblies abut against the inner wall of the buried copper groove.

In one of the embodiments, a sink groove is formed on the upper side of the heat dissipation copper block, and the driving hole is formed on the inner wall of the sink groove; the pressing portion is accommodated in the sink groove.

In one embodiment, the thickness of the pressing portion is smaller than the depth of the sinking groove.

In one of the embodiments, the mounting sleeve of each of the elastic abutment components is in transition fit with the heat dissipation copper block.

In one embodiment, the step of performing tin spraying operation on the multi-layer laminate comprises:

Performing a tin spraying process on the multi-layer laminate;

The multi-layer laminate is subjected to secondary tin spraying treatment.

A high-frequency copper embedded circuit board is prepared by the copper embedding method of the high-frequency copper embedded circuit board described in any of the above embodiments.

Compared with the prior art, the present invention has at least the following advantages:

In the process of embedding the heat dissipation mechanism into the buried copper groove, the part of each elastic abutment component protruding from the heat dissipation copper block abuts against the edge of the buried copper groove, so that the part of each elastic abutment component protruding from the heat dissipation copper block elastically deforms and shrinks, so as to avoid the elastic abutment component hindering the heat dissipation copper block from entering the buried copper groove; as the heat dissipation mechanism continues to be embedded into the buried copper groove, the part of each elastic abutment component protruding from the heat dissipation copper block slides and abuts against the inner peripheral wall of the buried copper groove. When the heat dissipation mechanism is completely embedded in the buried copper groove, the part of each elastic abutment component protruding from the heat dissipation copper block abuts against the inner peripheral wall of the buried through groove, so that The heat dissipation mechanism is embedded in the buried copper groove; since one end of each elastic abutting component protrudes from the outside of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the buried copper groove, the size of the heat dissipation copper block is smaller than that of the buried copper groove, that is, there is a gap between the heat dissipation copper block and the groove wall of the buried copper groove after the heat dissipation copper block is embedded in the buried copper groove; and since each elastic abutting component will elastically deform and shrink during the process of embedding the heat dissipation mechanism into the buried copper groove, the effect of the size of the heat dissipation copper block on embedding into the buried copper groove can be ignored, thereby eliminating the step of manually screening the heat dissipation copper blocks and improving the efficiency of embedding the heat dissipation copper blocks.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

FIG1 is a flow chart showing the steps of a method for embedding copper in a high-frequency copper embedded circuit board according to an embodiment;

FIG2 is a schematic structural diagram of a high-frequency copper embedded circuit board according to an embodiment;

FIG3 is a schematic structural diagram of a high-frequency copper-embedded circuit board according to another embodiment;

FIG4 is a schematic diagram of a partial structure of the high-frequency copper embedded circuit board shown in FIG3 ;

FIG. 5 is a schematic structural diagram of the high-frequency copper embedded circuit board shown in FIG. 3 in another state.

DETAILED DESCRIPTION

In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and/or" used herein includes any and all combinations of one or more related listed items.

The present application provides a copper embedding method for a high-frequency copper embedded circuit board, comprising: providing a multi-layer laminated board, a copper embedding groove formed on the surface of the multi-layer laminated board; embedding a heat dissipation mechanism in the copper embedding groove; and performing a tin spraying operation on the multi-layer laminated board; wherein the heat dissipation mechanism comprises a heat dissipation copper block and a plurality of elastic abutment components, the plurality of elastic abutment components are all connected to the heat dissipation copper block, the plurality of elastic abutment components are evenly spaced along the circumference of the heat dissipation copper block, one end of each of the elastic abutment components protrudes from the outside of the heat dissipation copper block and abuts against the inner peripheral wall of the copper embedding groove, so that the heat dissipation copper block is embedded in the copper embedding groove.

In the above copper embedding method of the high-frequency copper embedded circuit board, in the process of embedding the heat dissipation mechanism into the copper embedding groove, each The portion of the elastic abutment component protruding from the heat dissipation copper block abuts against the edge of the buried copper groove, so that the portion of each elastic abutment component protruding from the heat dissipation copper block elastically deforms and contracts, so as to avoid each elastic abutment component hindering the heat dissipation copper block from entering the buried copper groove; as the heat dissipation mechanism continues to be embedded in the buried copper groove, the portion of each elastic abutment component protruding from the heat dissipation copper block slides and abuts against the inner peripheral wall of the buried copper groove. When the heat dissipation mechanism is completely embedded in the buried copper groove, the portion of each elastic abutment component protruding from the heat dissipation copper block abuts against the inner peripheral wall of the buried through groove, so that the heat dissipation mechanism is embedded in buried copper groove; since one end of each elastic abutment component protrudes from the outside of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the buried copper groove, the size of the heat dissipation copper block is smaller than that of the buried copper groove, that is, there is a gap between the heat dissipation copper block and the groove wall of the buried copper groove after the heat dissipation copper block is embedded in the buried copper groove; and since each elastic abutment component will elastically deform and shrink during the process of the heat dissipation mechanism being embedded in the buried copper groove, the effect of the size of the heat dissipation copper block on the embedding of the buried copper groove can be ignored, thereby eliminating the step of manually screening the heat dissipation copper blocks and improving the efficiency of embedding the heat dissipation copper blocks.

In order to better understand the technical solutions and beneficial effects of the present application, the present application is further described in detail below in conjunction with specific embodiments:

As shown in FIGS. 1 to 3 , a copper embedding method for a high-frequency copper embedded circuit board includes:

S100: providing a multi-layer laminate 100 , wherein a buried copper groove 101 is formed on the surface of the multi-layer laminate 100 .

In this embodiment, the multi-layer laminated board 100 is a multi-layer laminated board 100 that has been sprayed with solder resist.

S300: embed the heat dissipation mechanism 200 into the buried copper groove 101, the heat dissipation mechanism 200 includes a heat dissipation copper block 210 and a plurality of elastic abutment components 220, the plurality of elastic abutment components 220 are all connected to the heat dissipation copper block 210, the plurality of elastic abutment components 220 are evenly spaced along the circumference of the heat dissipation copper block 210, one end of each elastic abutment component 220 protrudes from the outside of the heat dissipation copper block 210 and elastically abuts against the inner circumferential wall of the buried copper groove 101, so that the heat dissipation copper block 210 is embedded in the buried copper groove 101.

In this embodiment, the size of the heat dissipation copper block 210 is smaller than that of the buried copper groove 101, that is, after the heat dissipation copper block 210 is embedded in the buried copper groove 101, there is a gap between the heat dissipation copper block 210 and the groove wall of the buried copper groove 101. In the process of the heat dissipation mechanism 200 being embedded in the buried copper groove 101, the part of each elastic abutting component 220 protruding from the heat dissipation copper block 210 abuts against the edge of the buried copper groove 101, so that the part of each elastic abutting component 220 protruding from the heat dissipation copper block 210 elastically deforms and shrinks, so as to avoid the elastic abutting component 220 hindering the heat dissipation copper block 210 from entering the buried copper groove 101; as the heat dissipation mechanism 200 continues to be embedded in the buried copper groove 101, the part of each elastic abutting component 220 protruding from the heat dissipation copper block 210 slides and abuts on the inner peripheral wall of the buried copper groove 101, and when the heat dissipation mechanism 200 enters After the copper groove 101 is buried, the part of each elastic abutment component 220 protruding from the heat dissipation copper block 210 elastically abuts against the inner wall of the buried through groove, so that the heat dissipation copper block 210 is embedded in the buried copper groove 101, thereby improving the heat dissipation effect of the multilayer board, that is, improving the heat dissipation effect of the subsequently manufactured circuit board.

S500: performing tin spraying operation on the multi-layer laminate 100.

In this embodiment, after the multilayer laminate 100 is subjected to the tin spraying operation, the soldering pads on the surface of the multilayer laminate 100 will be attached with a tin layer, which can effectively isolate the soldering pads from the air and avoid oxidation of the soldering pads, so as to ensure the conductivity and solderability of the circuit board. In addition, after the heat dissipation mechanism 200 is embedded in the buried copper groove 101, there is a gap between the heat dissipation mechanism 200 and the groove wall of the buried copper groove 101. After the multilayer laminate 100 is subjected to the tin spraying operation, the tin layer will fill the gap between the heat dissipation mechanism 200 and the groove wall of the buried copper groove 101, so that the heat dissipation mechanism 200 is firmly embedded in the buried copper groove 101, avoiding the problem of the heat dissipation mechanism 200 falling off, and ensuring that the heat dissipation effect of the subsequently manufactured circuit board is better.

In the copper embedding method of the high-frequency copper embedded circuit board, when the heat dissipation mechanism 200 is embedded in the copper embedding groove 101, the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 abuts against the edge of the copper embedding groove 101, so that the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 elastically deforms and shrinks, so as to avoid the elastic abutting component 220 hindering the heat dissipation copper block 210 from entering the copper embedding groove 101; as the heat dissipation mechanism 200 continues to be embedded in the copper embedding groove 101, the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 slides and abuts on the inner peripheral wall of the copper embedding groove 101, and when the heat dissipation mechanism 200 is completely embedded in the copper embedding groove 101, the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 The elastic abutting components 220 are respectively abutted against the inner peripheral wall of the buried through groove, so that the heat dissipation mechanism 200 is embedded in the buried copper groove 101; since one end of each elastic abutting component 220 protrudes from the outside of the heat dissipation copper block 210 and elastically abuts against the inner peripheral wall of the buried copper groove 101, the size of the heat dissipation copper block 210 is smaller than the size of the buried copper groove 101, that is, after the heat dissipation copper block 210 is embedded in the buried copper groove 101, there is a gap between the groove wall of the buried copper groove 101; and since each elastic abutting component 220 will elastically deform and shrink during the process of the heat dissipation mechanism 200 being embedded in the buried copper groove 101, the effect of the size of the heat dissipation copper block 210 on the embedding of the buried copper groove can be ignored, thereby eliminating the step of manually screening the heat dissipation copper block 210 and improving the efficiency of embedding the heat dissipation copper block 210.

As shown in FIG. 3 and FIG. 4, in one embodiment, a plurality of mounting holes 211 are provided on the outer side of the heat dissipation copper block 210, and the plurality of mounting holes 211 are arranged one by one with a plurality of elastic abutment components 220, each elastic abutment component 220 includes a mounting sleeve 221, an elastic member 222, an abutment member 223 and a limiting sleeve 224. In the embodiment, the mounting sleeve 221 of each elastic abutment component 220 is fixedly connected in the corresponding mounting hole 211, the mounting sleeve 221 of each elastic abutment component 220 is formed with a receiving groove 2211, the elastic member 222 of each elastic abutment component 220 is located in the corresponding receiving groove 2211, the abutment member 223 of each elastic abutment component 220 is located in the corresponding receiving groove 2211, and the two ends of the elastic member 222 of each elastic abutment component 220 are respectively abutted against the groove wall of the corresponding receiving groove 2211 and the corresponding abutment member 223, so that the abutment member 223 of each elastic abutment component 220 is elastically connected to the mounting sleeve 221 through the corresponding elastic member 222.

As shown in Figures 3 and 4, further, the limiting sleeve 224 of each elastic abutment component 220 is fixedly sleeved on one end of the corresponding mounting sleeve 221 and is arranged corresponding to the opening of the corresponding receiving groove 2211, and the limiting sleeve 224 of each elastic abutment component 220 is provided with an extension hole 2241 connected to the corresponding receiving groove 2211, and the abutment piece 223 of each elastic abutment component 220 abuts against the corresponding limiting sleeve 224 and is passed through the corresponding extension hole 2241, so that the abutment piece 223 of each elastic abutment component 220 is also located outside the heat dissipation copper block 210 and is used to abut against the inner circumferential wall of the buried copper groove 101.

As shown in FIG3 , in this embodiment, when the abutting piece 223 of each elastic abutting assembly 220 abuts against the edge and inner peripheral wall of the buried copper groove 101, the abutting piece 223 of each elastic abutting assembly 220 compresses the corresponding elastic piece 222 and moves in the direction of the corresponding elastic piece 222. Since the abutting piece 223 of each elastic abutting assembly 220 abuts against the corresponding limiting sleeve 224, the abutting piece 223 of each elastic abutting assembly 220 is prevented from being ejected out of the corresponding mounting sleeve 221 by the corresponding elastic piece 222, ensuring that the abutting piece 223 of each elastic abutting assembly 220 can be used to abut against the inner peripheral wall of the buried copper groove 101.

As shown in FIG3 , in one embodiment, the elastic member 222 of each elastic abutting assembly 220 is a spring, so that the elastic member 222 of each elastic abutting assembly 220 has elasticity. Of course, in other embodiments, the elastic member 222 of each elastic abutting assembly 220 may also be a rubber member, a silicone member or other existing elastic members 222.

As shown in FIG. 4 , in one embodiment, a limiting portion 2231 is protruded from one end of the abutment member 223 of each elastic abutment assembly 220 adjacent to the corresponding elastic member 222, and the limiting portion 2231 of the abutment member 223 of each elastic abutment assembly 220 abuts against the corresponding limiting sleeve 224 to prevent the abutment member 223 of each elastic abutment assembly 220 from being separated from the corresponding mounting sleeve 221.

As shown in FIG. 3 , in one embodiment, a driving hole 212 is provided on the upper side of the heat dissipation copper block 210 , and the driving hole 212 is connected to each mounting hole 211 . Further, the heat dissipation mechanism 200 further includes a pressing component 230, the pressing component 230 is located in the driving hole 212 and is slidably sleeved with the heat dissipation copper block 210, the pressing component 230 and the heat dissipation copper block 210 are interference fit, a first end of the pressing component 230 is formed with a plurality of push inclined surfaces 2301 connected in sequence, and a force-bearing inclined surface 2211 is formed at one end of the mounting sleeve 221 of each elastic abutting component 220 away from the limiting sleeve 224, and the plurality of push inclined surfaces 2301 are correspondingly fitted to the force-bearing inclined surfaces 221 of the mounting sleeves 221 of the plurality of elastic abutting components 220. 11. When pressing the pressing component 230, each pushing inclined surface 2301 pushes the corresponding mounting sleeve 221 to move toward the outside of the heat dissipation copper block 210, so that the abutment force between the abutment member 223 of each elastic abutment component 220 and the inner wall of the buried copper groove 101 is increased, thereby improving the connection stability between the abutment member 223 of each elastic abutment component 220 and the multi-layer laminated board 100, thereby improving the position stability of the heat dissipation mechanism 200, and ensuring that the heat dissipation mechanism 200 can have a heat dissipation effect on the multi-layer laminated board 100.

As shown in FIG3 , in this embodiment, since the pressing component 230 and the heat dissipation copper block 210 are interference fit, the pressing component 230 will be subjected to the clamping force of the heat dissipation copper block 210. After the pressing component 230 is pressed, the pressing component 230 will not be reset due to the clamping force of the heat dissipation copper block 210, so that the pressing component 230 hinders the reset of the mounting sleeves 221 of each elastic abutment component 220, thereby enabling the heat dissipation mechanism 200 to continue to maintain a relatively stable state.

It should be noted that when the abutment force between the abutment member 223 of each elastic abutment assembly 220 and the inner peripheral wall of the buried copper groove 101 increases to a certain extent, problems of bursting and cracking will occur, so the pressing depth of the pressing assembly 230 needs to be maintained at a preset value to adjust the abutment force of the abutment member 223 of each elastic abutment assembly 220 to an appropriate value, thereby avoiding the problems of bursting and cracking. It can be understood that the preset value of the pressing depth can be obtained through a limited number of tests, which will not be described in detail again.

As shown in FIG3 , in one embodiment, the pressing assembly 230 includes a push rod 231 and a pressing portion 232. The push rod 231 is located in the driving hole 212 and is slidably sleeved with the heat dissipation copper block 210. The push rod 231 and the heat dissipation copper block 210 are interference fit. A plurality of push inclined surfaces 2301 are provided at the first end of the push rod 231. The pressing portion 232 protrudes and is fixedly connected to the second end of the push rod 231. The pressing portion 232 abuts against the heat dissipation copper block 210 when the abutting members 223 of each elastic abutting assembly 220 abut against the inner wall of the buried copper groove 101. In this embodiment, since the pressing portion 232 protrudes from the push rod 231, the pressing area of the pressing assembly 230 is increased, and the convenience of pressing is improved.

As shown in FIG. 5 , in one embodiment, a sinking groove 213 is provided on the upper side of the heat dissipation copper block 210, and the driving hole 212 is formed on the inner wall of the sinking groove 213. The pressing portion 232 is received in the sinking groove 213, thereby avoiding the pressing portion 232 from being pressed. The pressing portion 232 protrudes from the multi-layer laminated board 100 , thereby improving the flatness of the multi-layer laminated board 100 .

As shown in FIG. 5 , in one embodiment, the thickness of the pressing portion 232 is smaller than the depth of the sink 213 , so that the pressing portion 232 is completely accommodated in the heat dissipation copper block 210 .

As shown in FIG5 , in one embodiment, the mounting sleeve 221 of each elastic abutting component 220 and the heat dissipation copper block 210 are in transitional fit, so that the connection firmness between the mounting sleeve 221 of each elastic abutting component 220 and the heat dissipation copper block 210 is reduced, thereby making it easier for the pressing component 230 to push each mounting sleeve 221 to slide, that is, each pushing inclined surface 2301 is easier to push the corresponding mounting sleeve 221 to slide, thereby improving the convenience of pressing the pressing component 230. It can be understood that since the mounting sleeve 221 of each elastic abutting component 220 and the heat dissipation copper block 210 are in transitional fit, the mounting sleeve 221 of each elastic abutting component 220 will not move without external force.

In one embodiment, the step of performing tin spraying operation on the multi-layer laminated board 100 includes: performing a primary tin spraying process on the multi-layer laminated board 100; and performing a secondary tin spraying process on the multi-layer laminated board 100.

In one embodiment, the abutting member 223 of each elastic abutting member 223 , the corresponding elastic member 222 and the corresponding mounting sleeve 221 are all copper structures to improve the thermal conductivity of the heat dissipation mechanism 200 , thereby improving the heat dissipation effect of the heat dissipation mechanism 200 .

In one embodiment, after providing a multilayer laminate 100, forming a copper embedding groove 101 on the surface of the multilayer laminate 100, and before embedding the heat dissipation mechanism 200 in the copper embedding groove 101, the copper embedding method of the high-frequency copper embedded circuit board further includes: providing a die plate and stacking the multilayer laminate 100 on the die plate. In this embodiment, the surface of the die plate in contact with the multilayer laminate 100 is a plane, and when the heat dissipation copper block 210 is embedded in the position in contact with the die plate, the heat dissipation copper block 210 is stopped from moving, thereby preventing the heat dissipation copper block 210 from protruding from the side of the multilayer laminate 100 adjacent to the die plate, thereby improving the flatness of the multilayer laminate 100.

As shown in FIG5 , in one embodiment, a plurality of clamping grooves 214 are provided on the outer side of the heat dissipation copper block 210, and the plurality of clamping grooves 214 are evenly spaced along the outer side of the heat dissipation copper block 210. In this embodiment, when the heat dissipation mechanism 200 is embedded in the buried copper groove 101, firstly, the plurality of clamping claws of the clamp are extended into the plurality of clamping grooves 214 one by one, and then the clamp is closed and clamped to clamp the heat dissipation copper block 210, and then the heat dissipation mechanism 200 is moved by clamping to embed the heat dissipation mechanism 200 into the buried copper groove 101.

As shown in FIG5 , each clamping groove 214 further extends to the top surface and the outer side surface of the heat dissipation copper block 210. In this embodiment, when the clamping jaws abut against the inner wall of each clamping groove 214, the heat dissipation copper block 210 is pushed. The heat dissipation mechanism 200 enters the buried copper groove 101 , which improves the convenience and efficiency of embedding the heat dissipation mechanism 200 .

As shown in FIG. 4 and FIG. 5 , in one embodiment, a circular arc guide surface 2232 is formed at the lower edge of the abutment 223 of each elastic abutment assembly 220. In this embodiment, when the heat dissipation mechanism 200 is installed into the buried copper groove 101, the circular arc guide surface 2232 of the abutment 223 of each elastic abutment assembly 220 contacts the edge of the buried copper groove 101. Since the size of each abutment 223 at the circular arc guide surface 2232 is small, each abutment 223 is easier to enter the buried copper groove 101, and then the heat dissipation mechanism 200 is easier to enter the buried copper groove 101, thereby improving the embedding efficiency of the heat dissipation mechanism 200.

It is understandable that when the multi-layer laminate 100 is subjected to tin spraying, the powder absorption will generate an impact force on the heat dissipation mechanism 200 , causing the heat dissipation mechanism 200 to shift or even detach from the multi-layer laminate 100 .

Therefore, as shown in Figure 5, in one embodiment, the buried copper groove 101 includes a connected buried large hole 1011 and an buried small hole 1012, the inner diameter of the buried large hole 1011 is larger than the inner diameter of the buried small hole 1012, so that the inner wall of the buried large hole 1011 and the inner wall of the buried small hole 1012 together form a step surface, and the abutment 223 of each elastic abutment component 220 is located in the buried large hole 1011 and abuts against the two inner walls adjacent to the buried large hole 1011, that is, the abutment 223 of each elastic abutment component 220 is clamped on the two inner walls adjacent to the buried large hole 1011, so that the inner wall of the buried large hole 1011 blocks the heat dissipation mechanism 200 from shifting to one side of the multi-layer laminate 100.

As shown in FIG5, further, in the process of embedding the heat dissipation mechanism 200 into the buried copper groove 101, the abutment 223 of each elastic abutment component 220 abuts against the edge of the embedded large hole 1011, so that the abutment 223 of each elastic abutment component 220 compresses the elastic component 222 and shrinks, so as to avoid the abutment 223 of each elastic abutment component 220 hindering the heat dissipation copper block 210 from entering the buried copper groove 101; when the abutment 223 of each elastic abutment component 220 slides to the embedded large hole 1011, the abutment 223 of each elastic abutment component 220 compresses the elastic component 222 and shrinks, so as to avoid the abutment 223 of each elastic abutment component 220 from obstructing the heat dissipation copper block 210 from entering the buried copper groove 101; 1011, the abutment 223 of each elastic abutment assembly 220 moves outward under the push of the corresponding elastic member 222, so that the abutment 223 of each elastic abutment assembly 220 is located on the inner wall of the embedded small hole 1012 adjacent to the embedded large hole 1011, and then the step surface blocks the heat dissipation mechanism 200 from shifting to the side adjacent to the embedded small hole 1012. At this time, the installation of the heat dissipation mechanism 200 is completed, that is, the heat dissipation mechanism 200 is completely embedded in the buried copper groove 101.

As shown in FIG. 5 , when the multilayer laminate 100 is subjected to tin spraying, the tin spraying operation can be performed on the side adjacent to the embedded large hole 1011 first. At this time, due to the limiting effect of the step surface, the impact force of the tin spraying cannot cause the heat dissipation mechanism 200 to shift. After the tin spraying operation on this side is completed, the tin layer fixes the heat dissipation mechanism 200. The heat dissipation mechanism 200 is then tin-sprayed on the multi-layer laminate 100 on the other side. Since the tin layer has fixed the heat dissipation mechanism 200, the impact force of the tin spraying cannot displace the heat dissipation mechanism 200. In this way, by setting the embedded large hole 1011 and the embedded small hole 1012, the impact force of the tin spraying is prevented from having a bad effect on the heat dissipation mechanism 200.

Furthermore, in providing a multilayer laminated board 100, the step of forming a buried copper groove 101 on the surface of the multilayer laminated board 100 includes: providing a multilayer laminated board 100 and drilling a first side of the multilayer laminated board 100 to form a buried small hole 1012 on the first side of the multilayer laminated board 100; drilling a second side of the multilayer laminated board 100 to form a buried large hole 1011 on the second side of the multilayer laminated board 100, the inner diameter of the buried large hole 1011 is larger than the inner diameter of the buried small hole 1012, the inner wall of the buried large hole 1011 and the inner wall of the buried small hole 1012 jointly form the buried copper groove 101, and the inner wall of the buried large hole 1011 and the inner wall of the buried small hole 1012 jointly form a step surface.

Of course, since the abutment 223 of each elastic abutment assembly 220 is elastically connected to the corresponding mounting sleeve 221 through the corresponding elastic member 222, that is, the abutment 223 of each elastic abutment assembly 220 can shrink by compressing the corresponding elastic member 222, if the tin spraying rate of the side of the multi-layer laminate 100 adjacent to the embedded large hole 1011 is improperly adjusted, resulting in an excessively high tin spraying rate, or the abutment 223 of each elastic abutment assembly 220 shrinks, the impact force of the tin spraying will displace the heat dissipation mechanism 200.

In order to suppress the adverse effects caused by improper adjustment of the tin spraying rate, as shown in Figure 5, in one embodiment, the abutment 223 of each elastic abutment component 220 is in contact with the inner wall of the embedded small hole 1012 adjacent to the embedded large hole 1011, thereby increasing the contact area between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011, so as to increase the connection strength between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011, thereby suppressing the adverse effects caused by improper adjustment of the tin spraying rate.

As shown in Figure 5, further, the abutment 223 of each elastic abutment component 220 is also in contact with the inner wall of the embedded large hole 1011, thereby increasing the contact area between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011, and further increasing the connection strength between the abutment 223 of each elastic abutment component 220 and the inner wall of the embedded large hole 1011, thereby further suppressing the adverse effects caused by improper adjustment of the tin spraying rate, and at the same time dispersing the force on the inner wall of the embedded large hole 1011, thereby suppressing the problems of bursting holes and internal resin cracks in the multi-layer laminate 100.

As shown in FIG5 , further, the inner circumferential wall of the embedded small hole 1012 is parallel to the inner circumferential wall of the embedded large hole 1011. In this embodiment, when the heat dissipation mechanism 200 is embedded in the embedded small hole 1012, each elastic abutment The abutment member 223 of the component 220 fits with the embedding hole 1012 , dispersing the force on the inner wall of the embedding hole 1012 , thereby preventing the occurrence of explosion holes and internal resin cracks in the multilayer laminate 100 .

It can be understood that burrs are more likely to exist at the junction of the embedded large hole 1011 and the embedded small hole 1012. If the abutment 223 of each elastic abutment component 220 slides over the burr, since the abutment 223 of each elastic abutment component 220 is a rigid copper structure, there is a risk of tearing the burr with the abutment 223 of each elastic abutment component 220, which may cause the inner wall of the embedded small hole 1012 and the embedded large hole 1011 to be torn, that is, there may be a burst hole and internal resin cracks in the multi-layer laminate 100, which may lead to a decrease in the performance of the circuit board.

In order to avoid the risk of tearing the burrs, in one embodiment, the abutting piece 223 of each elastic abutting component 220 is coated with a heat dissipation silicone layer, and the thickness of the heat dissipation silicone layer on the abutting piece 223 of each elastic abutting component 220 is uniform, so that the heat dissipation silicone layer does not change the original shape of each abutting piece 223. The abutting piece 223 of each elastic abutting component 220 abuts against the inner wall of the embedded large hole 1011 and the inner wall of the embedded small hole 1012 through the corresponding heat dissipation silicone layer. In this embodiment, when the heat dissipation mechanism 200 is installed, the heat dissipation silicone layer directly contacts the burrs when the heat dissipation mechanism 200 is installed. Since the heat dissipation silicone layer is an elastic structure, when the heat dissipation silicone layer contacts the burrs flexibly, the heat dissipation silicone layer is avoided from tearing the burrs, thereby avoiding the problem of bursting holes and internal resin cracks caused by the burrs. In addition, the heat dissipation silicone layer has a high heat dissipation performance. The heat dissipation silicone layer directly contacts the inner wall of the buried copper groove 101, thereby improving the heat dissipation effect of the heat dissipation mechanism 200.

The present application also provides a high-frequency copper-embedded circuit board, which is prepared by the copper embedding method of the high-frequency copper-embedded circuit board described in any of the above embodiments.

Compared with the prior art, the present invention has at least the following advantages:

During the process of embedding the heat dissipation mechanism 200 into the buried copper groove 101, the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 abuts against the edge of the buried copper groove 101, so that the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 elastically deforms and shrinks, so as to avoid the elastic abutting component 220 hindering the heat dissipation copper block 210 from entering the buried copper groove 101; as the heat dissipation mechanism 200 continues to be embedded into the buried copper groove 101, the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 is deformed and contracted. The heat dissipation mechanism 200 is completely embedded in the buried copper groove 101, and the portion of each elastic abutting component 220 protruding from the heat dissipation copper block 210 abuts against the inner circumferential wall of the buried through groove, so that the heat dissipation mechanism 200 is embedded in the buried copper groove 101; because one end of each elastic abutting component 220 protrudes from the outside of the heat dissipation copper block 210 and elastically abuts against the inner circumferential wall of the buried copper groove 101, the size of the heat dissipation copper block 210 is smaller than that of the buried copper groove 101, that is, the heat dissipation copper block 210 is smaller than that of the buried copper groove 101. After the block 210 is embedded in the buried copper groove 101, there is a gap between the block 210 and the groove wall of the buried copper groove 101; and because each elastic abutment component 220 will elastically deform and shrink during the process of the heat dissipation mechanism 200 being embedded in the buried copper groove 101, the effect of the size of the heat dissipation copper block 210 on embedding in the buried copper groove can be ignored, thereby eliminating the step of manually screening the heat dissipation copper block 210 and improving the efficiency of embedding the heat dissipation copper block 210.

The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several elastic deformations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims (10)

A copper embedding method for a high-frequency copper embedded circuit board, characterized by comprising: Providing a multi-layer laminated board, wherein a buried copper groove is formed on the surface of the multi-layer laminated board; Embedding the heat dissipation mechanism in the buried copper groove; Performing tin spraying operation on the multi-layer laminate; Among them, the heat dissipation mechanism includes a heat dissipation copper block and a plurality of elastic abutment components, the plurality of elastic abutment components are all connected to the heat dissipation copper block, the plurality of elastic abutment components are evenly spaced along the circumference of the heat dissipation copper block, one end of each of the elastic abutment components protrudes from the outside of the heat dissipation copper block and elastically abuts against the inner circumferential wall of the buried copper groove, so that the heat dissipation copper block is embedded in the buried copper groove. The copper embedding method of a high-frequency copper embedded circuit board according to claim 1 is characterized in that a plurality of mounting holes are provided on the outer side of the heat dissipation copper block, and the plurality of mounting holes are arranged in a one-to-one correspondence with the plurality of elastic abutment components, and each of the elastic abutment components comprises: A mounting sleeve, fixedly connected to the corresponding mounting hole, the mounting sleeve being formed with a receiving groove; An elastic member, located in the corresponding receiving groove; An abutment member is located in the corresponding receiving groove, and two ends of the elastic member of each elastic abutment assembly abut against the groove wall of the corresponding receiving groove and the corresponding abutment member respectively; and A limiting sleeve is fixedly sleeved on one end of the corresponding mounting sleeve and is arranged corresponding to the opening of the corresponding receiving groove. The limiting sleeve of each elastic abutment assembly is provided with an extension hole connected to the corresponding receiving groove. The abutment piece of each elastic abutment assembly abuts against the corresponding limiting sleeve and is passed through the corresponding extension hole, so that the abutment piece of each elastic abutment assembly is also located outside the heat dissipating copper block and is used to abut against the inner circumferential wall of the buried copper groove. The copper embedding method of a high-frequency copper embedded circuit board according to claim 2 is characterized in that the elastic member of each of the elastic abutment components is a spring. The copper embedding method of the high-frequency copper embedded circuit board according to claim 2 is characterized in that a driving hole is opened on the upper side of the heat dissipation copper block, and the driving hole is connected to each of the mounting holes; The heat dissipation mechanism also includes a pressing component, which is located in the driving hole and is slidably sleeved with the heat dissipation copper block. The pressing component and the heat dissipation copper block are interference fit, and a first end of the pressing component is formed with a plurality of push inclined surfaces connected in sequence, and the mounting sleeves of each of the elastic abutment components are separated from each other. A force-bearing inclined surface is formed at one end of the limiting sleeve, and the multiple pushing inclined surfaces correspond one by one to the force-bearing inclined surfaces of the mounting sleeves of the multiple elastic abutment components. When the pressing component is pressed, each pushing inclined surface pushes the corresponding mounting sleeve to move toward the outside of the heat dissipation copper block. According to the copper embedding method of the high-frequency copper embedded circuit board according to claim 4, it is characterized in that the pressing assembly includes a pushing rod and a pressing portion, the pushing rod is located in the driving hole and is slidably sleeved with the heat dissipation copper block, the pushing rod and the heat dissipation copper block are interference fit, a plurality of the pushing inclined surfaces are arranged on the first end of the pushing rod, the pressing portion protrudes and is fixedly connected to the second end of the pushing rod, and the pressing portion abuts against the heat dissipation copper block when the abutting pieces of each of the elastic abutting assemblies abut against the inner wall of the copper embedding groove. According to the copper embedding method of the high-frequency copper embedded circuit board according to claim 5, it is characterized in that a sinking groove is opened on the upper side of the heat dissipation copper block, the driving hole is formed on the inner wall of the sinking groove; and the pressing part is accommodated in the sinking groove. The copper embedding method of a high-frequency copper embedded circuit board according to claim 6 is characterized in that the thickness of the pressing portion is less than the depth of the sinking groove. The copper embedding method of a high-frequency copper embedded circuit board according to claim 4 is characterized in that the mounting sleeve of each of the elastic abutment components is transitionally matched with the heat dissipation copper block. The copper embedding method of a high-frequency copper embedded circuit board according to claim 1 is characterized in that the step of performing tin spraying operation on the multi-layer laminate comprises: Performing a tin spraying process on the multi-layer laminate; The multi-layer laminate is subjected to secondary tin spraying treatment. A high-frequency copper embedded circuit board, characterized in that it is prepared by the copper embedding method for a high-frequency copper embedded circuit board according to any one of claims 1 to 9.