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WO2024241253A1 - Métrologie optique à haut débit - Google Patents

Métrologie optique à haut débit Download PDF

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Publication number
WO2024241253A1
WO2024241253A1 PCT/IB2024/054996 IB2024054996W WO2024241253A1 WO 2024241253 A1 WO2024241253 A1 WO 2024241253A1 IB 2024054996 W IB2024054996 W IB 2024054996W WO 2024241253 A1 WO2024241253 A1 WO 2024241253A1
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WO
WIPO (PCT)
Prior art keywords
sample
iiu
plane
unit
integrated system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/IB2024/054996
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English (en)
Inventor
Alex Shichtman
Gilad Barak
Doron AVRAHAM
Shmuel FELDMAN
Michael PANICH
Shimon Yalov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nova Ltd
Original Assignee
Nova Ltd
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Filing date
Publication date
Application filed by Nova Ltd filed Critical Nova Ltd
Publication of WO2024241253A1 publication Critical patent/WO2024241253A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J4/00—Measuring polarisation of light
    • G01J4/04—Polarimeters using electric detection means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Definitions

  • IM Integrated metrology
  • IM tools are small-footprint modules attached to a fabrication process tool, offering expedient feedback on the processed sample s.
  • characterization is offered by the IM, allowing accurate processing, corrective actions and refinement of the processing parameters for future sample s.
  • IM metrology is based on optical scatterometry, using broadband spectral reflection from the dedicated test sites on the sample , together with advanced interpretation algorithms, to deduce dimensional (and sometimes material) characteristics of the measured structure.
  • IM tools are strictly limited in footprint: an IM tool is placed in a standard-size opening of the processing tool, attached to one of few ports where sample s can be introduced ⁇ extracted.
  • the allowed dimensions are determined by the size of a standard Front-Opening Universal Pod (FOUP) - the container in which sample s are carried between tools in the semiconductor manufacturing factory (‘Fab’).
  • FOUP Front-Opening Universal Pod
  • Fab semiconductor manufacturing factory
  • FIG. 1 illustrates an example of a sample, an integrated system and a sample related system
  • FIGs. 2-4 illustrates examples of integrated systems and a sample
  • FIGs. 5-15 illustrates examples of parts of integrated systems
  • FIG. 16 illustrates an example of a method
  • FIGs. 17-21 illustrates examples of parts of integrated systems.
  • a compact integrated system that has inspection and metrology capabilities and is compact.
  • an integrated system that includes (i) an integrated imaging unit (IIU) configured to scan a sample while the sample is located at a first plane of a first height; (ii) an integrated metrology unit (IMU) configured to measure metrology sites of the sample while the sample is located at a second plane of a second height that differs from the first height; and (iii) a sample movement unit configured to move a sample, by following a path, between the first plane to the second plane; wherein the IIU is located between the first plane and the second plane.
  • IIU integrated imaging unit
  • IMU integrated metrology unit
  • additional measurement heads can be added, such as bright-field (BF) imaging, dark-field (DF) imaging, sample edge characterization, eddy-current measurement head for metal layer thickness, photoluminescence probe for organics residue detection etc.
  • BF bright-field
  • DF dark-field
  • sample edge characterization eddy-current measurement head for metal layer thickness
  • photoluminescence probe for organics residue detection etc.
  • the IMU includes an Optical Head (OH) (denoted 612 in figure 2) that is movable along one or more exes, and another portion 611 that may be static and is also referred to as an optical layer.
  • the OH is moved by OH movement unit (denoted 613 in figure 2).
  • the OH is placed above the sample, implementing one or more optical measurement such as scatterometry (using spectral reflectometry (SR), polarized SR, spectral ellipsometry, etc.
  • the OH is moved above the sample using a dedicated motion stage (OH movement unit).
  • Alternatives to this approach exist in which the optical head is static, and the sample is moved and rotated, or where both the optical head and sample are moved along different axes (x ⁇ y or r ⁇ 0). For simplicity, below we commonly assume the sample is static and the OH is moved unless specified otherwise.
  • An optical layer holds the illumination, optics, beam shaping, focus, collection path and detected components.
  • Figure 1 illustrates an example of the integrated system 600 that is attached to a sample related system 690 such as a sample processing system (for example a manufacturing system) or yet another sample evaluation system.
  • System 690 includes a robot 691 configured to convey the sample 620 from the integrated system to thew sample related system and to the integrated system,
  • Figure 2 also illustrates (a) first IIU movement unit 621 that is configured to position the IIU 622 away from the path, during a movement of the sample along the path, and (b) second IIU movement unit 623 that is configured to move the IIU during the scan of the sample.
  • the integrated system includes a first IIU movement unit 260- 1 that is configured to position the integrated imaging unit away from the path, during a movement of the sample along the path.
  • the integrated system includes a second IIU movement unit 620-2 that is configured to move the IIU during the scan of the sample.
  • the second IIU movement unit includes one or more rails and one or bearings for interfacing with the one or more rails during the movement of the IIU during the scan of the sample. The IIU moves from one side to another; the rails correspond to the movement.
  • the integrated imaging unit is configured to illuminate the sample, during the scan of the sample, by oblique illumination - see for example the top part of figure 10 that illustrates oblique illumination and oblique collection - which makes the beam splitter obsolete.
  • the oblique angle may be close to ninety degrees - for example may range between 80 and 89.5 degrees.
  • a dimension (for example width and depth) of the integrated system ranged between one to one and a half times a corresponding dimension of the sample.
  • the integrated system includes a contamination reduction window configured to reduce contamination within a portion of the integrated system.
  • the contamination reduction window is either static (see figure 4, window 628- 2) or movable (see figure 4, window 628-1) - and follows the movement of the IIU - and is configured to block contaminating particles from propagating towards the IIU and the IMU while allowing the IIU and the IMU to evaluate the sample.
  • a window may cover the entire sample and can be placed below the IIU.
  • the sample cannot be offset vertically to be placed closer to the OH for IM measurement. Instead, a large workingdistance solution is to be used for the OH, allowing it to measure the sample at the required offset to allow the IIU travel. Alternatively - the window is large enough to allow the stage pass through.
  • Figure 5 presents one implementation by which the IIU 625 is stored at a narrow volume (629) near the enclosure edge ( Figure 5 part (A)). The IIU is then rotated into place ( Figure 5 parts (A) and (C)) and scanned across the sample 620 ( Figure 5 part (D)). In this proposed implementation, the IIU is shorter than 300mm but longer than 150mm. Under such conditions, a single scan covers (at least) half of the sample area. To cover the second sample half, the sample is rotated by the stage in 180° ( Figure 5 part (E)) and another IIU scan takes place (Figure 5 part (F)). Figure 5 also illustrates OH 612 of the IMU.
  • One possible advantage of such implementation is obtained when the IIU offers multiple different measurement capabilities. Most notably, the ability to collect additional wavelengths for imaging, or measuring both bright field (BF) and dark field (DF) images, which (when using 300mm -coverage) can be collected at sequentially at both scans across the sample . In such cases, a full-length 300mm coverage could drastically improve throughput as it reduces the number of sweeps required.
  • BF bright field
  • DF dark field
  • Figure 11 illustrates a collection unit (including imaging optics 38 and detector 36) having an oblique optical axis, a brightfield illumination unit (including light source 30 and illumination optics 32 as well as optical diffuser 34) having an oblique optical axis, and a dark field illumination unit (including light source, illumination optics 42 and optical diffuser 44) having an oblique optical axis.
  • Another possible benefit requires a modification of the integration layout, by which the IIU module can be folded on both ends of the sweep sequence (see figure 6). Under such conditions, the throughput benefit can be significant as the number of required IIU movements above the sample is reduced
  • Figure 6 illustrates a long-IU folding-module integration.
  • Figure 6 part (A) illustrates a long IIU module that is stored at the enclosure edge.
  • Figure 6 part (B) and part (C) illustrate deployment by rotation.
  • Figure 6 part (C), (D) and (E) illustrate a scan of the sample.
  • the IIU is stored again by folding it the enclosure edge - see figure 6 part (F).
  • the integrated system includes motorization required for deployment and motion of the IIU.
  • the required motors impose both additional cost and volume requirements from the overall solution, which are both significantly limited.
  • One possible mitigation is based on using the OH, with its existing motorization, for either the deployment and ⁇ or translation of the IIU head.
  • Deployment may involve having the OH travel to the IIU edge, connects to it (mechanically, electrostatically, magnetically or by any other means) and rotates it to its deployed position.
  • x-axis rails denote 525 in figure 6 and y-axis rails denoted 626 in figure 6.
  • the x-axis rails may be spaced by a distance that exceeds the width of the sample and the y-axis rails may be movable outside the path of the sample).
  • the sample is not moved through a plane that includes the rails - and thus the rails may be closer to each other and/or not need to move away from the path of the sample.
  • Figure 7 illustrates additional weight-carrying axes (denoted 626) offering improved mechanical stability and rigidness.
  • Figure 7 part (A) illustrates the IIU module 629 being connected on both ends to lateral (‘y’) axes, through rotation-free bearings (marked by dark squares).
  • Figures 7 parts (B), (C) and (D) illustrate deployment and scanning the sample while both ends of the IIU remain connected to rails, maintaining its alignment.
  • the IIU module can cover half the sample area at a time. During its scan, the second sample half can be measured with the IM OH. After the sample is rotated - allowing the IIU to scan the second sample half, the IM OH can correspondingly complete its sample coverage.
  • the simplest implementation of full-sample imaging involves a static IIU placed above the sample , with sample rotation used to obtain full coverage.
  • sample rotation used to obtain full coverage.
  • Figure 8 One possibility for such implementation is presented in Figure 8, and involves a similar deployment of an IIU by rotation from its storage at the enclosure edge as discussed above. However, in this implementation, the IIU is rotated until it spans a radial range across the sample , from the sample edge to its center location. Next, the sample is rotated and IIU image acquisitions take place providing full sample coverage with no further motion of the IIU.
  • Figure 8 part (A) illustrates a small-footprint IIU module is folded to the side of the MU.
  • Figure 8 part (B) illustrates a deployment of the IIU by rotation until the IIU is placed above the sample, reaching the sample.
  • the IIU can be moved laterally and placed such that it covers a radial span across the sample - as shown in Figure 9 parts (A) and (B).
  • the IIU can be moved laterally and placed such that it covers a radial span across the sample - as shown in Figure 9 parts (A) and (B).
  • Another possibility involves introducing intentional polarization to the illumination and collection paths. Specifically, by imposing circular polarization, the dependence on sample orientation can be removed.
  • circular polarization can be used for illumination only.
  • a polarization-resolved imaging camera can be used. Such cameras provide full polarization information on the reflected light, including reflected intensity at each polarization and the ellipsometric phase. While in such configuration measurements would still depend on the sample orientation, it is straightforward to use the measured polarization information in order to remove this dependence. Another side-benefit of such an approach involves the acquisition of polarized imaging information, offering additional sensitivity to sample characteristics.
  • a rotating polarization control is added to the optical path.
  • Such an element rotates the polarization (at illumination and collection) in correspondence with the sample orientation, so that measurements at any sample azimuth are equivalent.
  • a liquid-crystal polarization control is uniquely suitable, allowing easy, cheap and lightweight integration.
  • the IIU is required to be lightweight, small and create minimal heating of its environment.
  • this module requires an illumination apparatus, imaging optical setup and detection - all integrated into the same volume.
  • An elegant mitigation involves separating the illumination apparatus from the IIU. This can involve moving the electronics, control and even light-creation device itself to a separated location in the IM tool (e.g. below or above the measurement unit). The electronic signal, light or both are then carried to the IIU using cables ⁇ optical fibers.
  • Another possibility offering similar benefits involves generating the illumination outside the MU enclosure and guiding the generated light into the MU using free-space optics. While such an approach is significantly more complicated to implement than using fiber optics, it solves the need to deal with moving optical fibers (which is a known source for light homogeneity instabilities) and could offer more flexible shaping of the light beam as required for illuminating the wide area required. Specifically, some implementations using free-space optics could solve the problem of spreading the illuminated light across the imaged region.
  • Figures 10-12 illustrates six examples (denoted example (A) - example (F) of IIUs.
  • Figure 13 illustrates optical components of the integrated circuit.
  • Figure 10 (part (A)) illustrates sample 620, and IIU that includes a collection unit (including imaging optics 18 and detector 16) having an oblique optical axis, and an illumination unit (including light source 10, illumination optics 12 and optical diffuser 14) having an oblique optical axis configured to receive reflected radiation from the sample.
  • a collection unit including imaging optics 18 and detector 16
  • an illumination unit including light source 10, illumination optics 12 and optical diffuser 14
  • Figure 10 (part (B)) illustrates sample 620, and an IIU that includes beam splitter 24, a collection unit (including imaging optics 28 and detector 26) having a normal optical axis, and an illumination unit (including light source 20 and illumination optics 22) having a horizontal optical axis that is converted, by the beam splitter to a normal optical axis.
  • Figure 11 illustrates an external light source 46 optically coupled by fiber 48 to an illumination unit (including fiber coupler 58, illumination optics 52 and optical diffuser 54) that has an oblique optical axis and belongs to an IIU that also includes a collection unit (including imaging optics 58 and detector 56) having an oblique optical axis.
  • an illumination unit including fiber coupler 58, illumination optics 52 and optical diffuser 54
  • a collection unit including imaging optics 58 and detector 56
  • Figure 12 illustrates an external light source 60 optically coupled (using fiber coupling 62) by fiber 64 to an illumination unit (including fiber coupling 66 and illumination optics 68) of an IIU and having an horizontal optical axis that is converted, by the beam splitter to a normal optical axis.
  • the IIU also includes beam splitter 70 and collection unit (including imaging optics 72 and detector 74) having a normal optical axis.
  • Figure 12 illustrates sample 620 and an IIU that includes a collection unit (including imaging optics 86 and detector 84) having an oblique optical axis, a brightfield illumination unit (including fiber coupling 78, illumination optics 32 and optical diffuser 82) having an oblique optical axis, and a dark field illumination unit (including fiber coupling 92, illumination optics 42 and optical diffuser 44) having an oblique optical axis.
  • the fiber couplings (78 and 92) are optically coupled (via fibers 78 and 88) to an external light source 76.
  • inventions include disjointed illumination and measurement unit and illumination optics directing the illuminated light in a predominantly parallel plane to the measured sample (see Figure 3).
  • the horizontal beam is referred to as ‘illumination sheet’.
  • Figure 3 illustrates IIU as including measurement unit (200, 208) including sensor and beam splitter) motion apparatus (201, 211) located below sample but having interfaces (202, 204, 210, 212) that move the measurement unit located above sample towards the illumination sheet generated by illumination unit (206, 214).
  • a measurement unit including a beam-splitter (BS), providing two separate functions (Figure 13 part (A)): (i) Optics redirecting light coming from the illumination unit towards the sample and (as needed) focusing the beam, and (ii) an optical collection path, receiving light reflected from the measured sample and imaging it onto a sensor.
  • BS beam-splitter
  • the measurement unit is required to be of very limited dimensions due to the associated integration considerations. Specifically, its width and height (see ‘W’ and ‘H’ at the bottom of figure 13) are limited to several cm or very few tens of cm at most. Conversely, the lateral dimension (‘D’ in figure 13) can have a larger length, up to fully covering the entire sample extent.
  • the illumination path responsible for creating a homogeneous, well-defined illumination sheet and coaxial illumination.
  • Imaging collection path imaging optics used to generate an image of the measured sample on a sensor.
  • the goal of the illumination unit is to generate the sheet of light directed towards the measurement unit in such a way so as to allow its focusing on the measured sample.
  • Figure 14 part (A) presents one possible implementation for the optical path.
  • the optical path includes cylindrical lens 306, aperture, and beam splitter including tilted facet 304 that faces an illumination source (downstream to the cylindrical lens) and has optical power, and focuses the incident beam on the sample.
  • this optical power can be situated at the beam splitter facet facing the sample.
  • the imaging optics at the detection path has to take this power into consideration.
  • Figure 14 part (A) illustrates two illumination beams 300 and 302.
  • An aperture is placed in such a location so as to guarantee telecentric (or approximately telecentric) illumination. This is of high importance in order to assure measurements are not position-dependent.
  • One challenge raised by such an implementation relates to the beam span at the illumination module position, when the measurement unit is far from its position. Under such conditions, beam divergence (arising from the finite extent of the illumination spot on the sample) can become significant, requiring large, complicated optics.
  • One mitigation to this challenge is reducing the span of the illuminated area, and acquiring images at high frequency during the measurement module motion. The narrow-sized images are then stitched algorithmically into a large-field image.
  • FIG. 14 part (B) Another possibility includes the addition of an optical relay (formed of lenses 316 and 314 that are located between cylindrical lens 318 and the aperture), which would significantly reduce the beam extent (figure 14 part (B)).
  • the relay lenses have to be moved in accordance with the measurement module.
  • the tilted facet of the beam splitter is denoted 312 and has optical power.
  • Figure 14 part (B) also illustrates two beams 308 and 310.
  • figure 14 part (A) a cylindrical lens is used to direct light from the light source (to its right, not shown in the sketch) and create the light sheet.
  • An aperture is used to create telecentric illumination, and focusing power is implemented on one facet of the BS.
  • Figure 14 part (B) illustrates a possible mitigation to the challenge of large beam extent is based on adding a pair of lenses creating an optical relay. As the measurement module is scanned across the sample, these lenses have to be correspondingly moved.
  • GRIN Graded Index
  • Figure 15 part (A) an implementation using a GRIN lens pair 402 between sensor 400 and beam splitter 404 that is downstream to sample 620.
  • Figure 15 part (B) illustrates an illumination that is coaxially combined into the optical path (using beam splitter) between the two GRIN lenses 410 and 408, using the second GRIN lens for focusing.
  • the two GRIN lenses are located between sensor 406 and the sample.
  • Figure 16 illustrates an example of method 900 for operating an integrated system.
  • method 600 includes steps 610, 620 and 630.
  • step 610 includes scanning, by an integrated imaging unit (IIU), a sample while the sample is located at a first plane of a first height.
  • IIU integrated imaging unit
  • step 630 includes measuring metrology sites of the sample, by an integrated metrology unit (IMU), while the sample is located at a second plane of a second height that differs from the first height.
  • IMU integrated metrology unit
  • the first plane is located below the second plane but the first plane may be located above the second plane.
  • step 620 includes moving the sample, by a sample movement unit, by following a path, between the first plane to the second plane; wherein the IIU is located between the first plane and the second plane.
  • step 610 is followed by step 620 that is followed by step 630.
  • step 630 may include reversing step 620 - and positioning the sample at the first plane.
  • the method includes mechanically coupling, by an interface, the integrated system to sample related system.
  • the method includes step 615 of positioning, by a first IIU movement unit, the IIU away from the path, during the moving of the sample along the path.
  • step 620 includes moving, by a second IIU movement unit, the IIU during the scan of the sample.
  • the second IIU movement unit includes one or more rails and one or bearings for interfacing with the one or more rails during the movement of the IIU during the scan of the sample.
  • the one or more rails are located outside the path.
  • the IIU includes a beam splitter that is shared between an illumination sub-unit of the IIU and a collection sub-unit of the IIU.
  • step 620 includes illuminating the sample, by the IIU, during the scan of the sample, by oblique illumination.
  • step 620 includes illuminating the sample, by the IIU, during the scan of the sample, by normal illumination.
  • a dimension of the integrated system ranges between one to one and a half times a corresponding dimension of the sample.
  • method 600 includes step 640 of reducing contamination within a portion of the integrated circuit, by using a contamination reduction window. Step 640 is optional.
  • FIG. 17-19 illustrates an example of an integrated system that includes IIU 720 configured to scan a sample 620 while the sample is located at a first plane 701 of a first height and an IMU 710 configured to measure metrology sites of the sample while the sample is located at a second plane 702 of a second height that differs from the first height; and (iii) a sample movement unit such as stage 730 configured to move a sample, by following a path, between the first plane to the second plane.
  • the IIU is located between the first plane and the second plane.
  • Figure 17 also illustrates the IIU 720 as including illumination head 722, collection head 721 (also referred to as measurement unit) that moves towards the illumination unit by second IMU movement unit 723 that includes rails, sliders and a motor.
  • illumination head 722 collection head 721 (also referred to as measurement unit) that moves towards the illumination unit by second IMU movement unit 723 that includes rails, sliders and a motor.
  • collection head 721 also referred to as measurement unit
  • second IMU movement unit 723 that includes rails, sliders and a motor.
  • Figure 18 illustrates the IIU 720, the sample 620 (positioned at a first plane) and the IMU 710.
  • Figure 19 illustrates the IIU 720, the sample 620 (positioned at a first plane) the IMU 710, and an internal enclosure 730 that surrounds the IIU 720, the IMU 710.
  • the integrated system has inputs for exchanging the sample between the integrated system and the sample related system, and for exchanging the sample with another unit or robot, and the like.
  • the integrated system also includes a man machine interface (for example a keyboard and a screen).
  • the oblique illumination configuration includes illumination unit 781 and collection unit 782 (including detector) - both having oblique angle optical axis.
  • Figure 21 illustrates a sensor 720 that is made of sensing elements 791(1) -791(K) arranges in two linear arrays that are proximate to each other - for example the angular deviation between light reaching the two linear arrays is in a magnitude of 0.05-0.15 milliradians. K may range between two and twenty - or more.
  • the linear arrays are parallel to each other and parallel to a longitudinal axis of the sensor. There is an overlap, along the longitudinal axis, between adjacent sensing elements of different linear arrays.
  • Any reference in the specification to a method should be applied mutatis mutandis to a system capable of executing the method and should be applied mutatis mutandis to a non-transitory computer readable medium that stores instructions that once executed by a computer result in the execution of the method.
  • Any reference in the specification to a system should be applied mutatis mutandis to a method that can be executed by the system and should be applied mutatis mutandis to a non-transitory computer readable medium that stores instructions that once executed by a computer result in the execution of the method.
  • the mentioned above text may refer to a sample .
  • a sample - especially a semiconductor sample - is merely an example of a sample.
  • LED light emitting diode
  • any reference to a wavelength may be applied mutatis mutandis to any other property of the illumination and/or collection - such as , polarization, angular content of illumination or / and collection beams , and the like.
  • Any reference to the term “comprising” or “having” should be interpreted also as referring to “consisting” of “essentially consisting of’.
  • a method that comprises certain steps can include additional steps, can be limited to the certain steps or may include additional steps that do not materially affect the basic and novel characteristics of the method - respectively.
  • any arrangement of components to achieve the same functionality is effectively “associated” such that the desired functionality is achieved.
  • any two components herein combined to achieve a particular functionality may be seen as “associated with” each other such that the desired functionality is achieved, irrespective of architectures or intermedial components.
  • any two components so associated can also be viewed as being “operably connected,” or “operably coupled,” to each other to achieve the desired functionality.
  • any reference signs placed between parentheses shall not be construed as limiting the claim.
  • the word ‘comprising’ does not exclude the presence of other elements or steps then those listed in a claim.
  • the terms “a” or “an,” as used herein, are defined as one or more than one.

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  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un système intégré qui comprend (i) une unité d'imagerie intégrée (IIU) configurée pour balayer un échantillon tandis que l'échantillon se trouve au niveau d'un premier plan d'une première hauteur ; (ii) une unité de métrologie intégrée (IMU) configurée pour mesurer des sites de métrologie de l'échantillon tandis que l'échantillon se trouve au niveau d'un second plan d'une seconde hauteur qui est différente de la première hauteur ; et (iii) une unité de mouvement d'échantillon configurée pour déplacer un échantillon, en suivant un trajet, entre le premier plan et le second plan ; l'IIU se trouvant entre le premier plan et le second plan.
PCT/IB2024/054996 2023-05-22 2024-05-22 Métrologie optique à haut débit Pending WO2024241253A1 (fr)

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US202363503710P 2023-05-22 2023-05-22
US63/503,710 2023-05-22
US202363469878P 2023-05-31 2023-05-31
US63/469,878 2023-05-31

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