WO2024106117A1 - Conductive substrate - Google Patents

Abstract

A conductive substrate (1) comprises a first electrode (6) and a substrate (2) having a flat surface (2a). The first electrode (6) is composed of a plurality of conductive wires (7) that each comprise a conductive metal embedded in the side of the substrate (2) where the flat surface (2a) is located. The surface of each conductive wire (7) is configured to be substantially flush with the flat surface (2a) of the substrate (2).

Description

Conductive Substrate

This disclosure relates to conductive substrates.

　Conductive substrates that are applied to solar cells, OLEDs, light control devices, etc. are known. For example, a conductive substrate that is applied to solar cells is shown in Patent Document 1.

Patent Document 1 discloses an organic thin-film solar cell that uses a transparent resin film. For example, the organic thin-film solar cell shown in FIG. 7 of Patent Document 1 includes a transparent substrate made of a transparent resin film, a mesh electrode formed on the transparent substrate, a transparent electrode formed on the transparent substrate, a hole extraction layer formed on the transparent electrode, a photoelectric conversion layer formed on the hole extraction layer, an electron extraction layer formed on the photoelectric conversion layer, and a counter electrode formed on the electron extraction layer.

JP 2010-157681 A

In the organic thin-film solar cell, the mesh electrode is configured to protrude from the top surface of the transparent substrate toward the side where the counter electrode is located. In this configuration, if the transparent electrode, hole extraction layer, photoelectric conversion layer, and electron extraction layer are each formed thin, each layer may be divided in the longitudinal direction of the convex shape at the corners of each mesh electrode. In this case, the function of each layer is impaired. Furthermore, if each layer is divided, all layers from the transparent electrode located around each mesh electrode to the counter electrode may slip down toward the transparent substrate, and the counter electrode formed on the electron extraction layer may become closer to the corners of each mesh electrode. In this case, the counter electrode may come into contact with the corners of each mesh electrode, which may cause an electrical short circuit.

As such, the configuration shown in Patent Document 1 could result in the original functionality of the device to which the conductive substrate is applied being impaired.

This disclosure has been made in light of these points, and its purpose is to prevent the inherent functionality of devices to which a conductive substrate is applied from being impaired.

In order to achieve the above object, one embodiment of the present disclosure is a conductive substrate used to attach a functional layer and a second electrode, the conductive substrate comprising a substrate having a flat surface and a first electrode formed on the substrate. The first electrode is composed of a plurality of conductive wires, each made of a conductive metal, embedded on the side of the substrate where the flat surface is located. The flat surface of the substrate is configured to allow the functional layer and the second electrode to be disposed thereon. The surface of each of the plurality of conductive wires is configured to be substantially flush with the flat surface.

According to this disclosure, it is possible to prevent the inherent functionality of a device to which a conductive substrate is applied from being impaired.

FIG. 1 is a partially enlarged plan view that illustrates a schematic enlargement of a portion of a conductor pattern in a conductive member including a conductive substrate according to an embodiment of the present disclosure. FIG. 2 is a cross-sectional view taken along line II-II of FIG. FIG. 3 is a partially enlarged cross-sectional view showing a portion III in FIG. 2 , and is also a diagram showing a schematic diagram of a carrier path when a conductive member having a conductive substrate is applied to a solar cell. FIG. 4 is an enlarged schematic diagram showing a state in which the flat surface of the substrate and the surfaces of the conductive lines are flush with each other. FIG. 5 is a diagram corresponding to FIG. 3 and illustrating, as a first modified example of the embodiment, a carrier path when a conductive member having a conductive substrate is applied to an OLED. FIG. 6 is a diagram corresponding to FIG. 3 and illustrating, as a second modified example of the embodiment, a carrier path when a conductive member having a conductive substrate is applied to a light-adjusting device. FIG. 7 is an enlarged schematic diagram showing a state in which the surface of the conductive line is recessed below the flat surface of the substrate as a third modified example of the embodiment. FIG. 8 is a view corresponding to FIG. 1, which shows an enlarged schematic view of a part of a conductor pattern different from the conductor pattern shown in FIG. 1, as a fourth modified example of the embodiment. FIG. 9 is a view corresponding to FIG. 3 that illustrates a schematic cross-sectional structure of a conductive member having a conductive substrate on which a first electrode is provided and a conductive substrate on which a second electrode is provided, as a fifth modified example of an embodiment.

Below, embodiments of the present disclosure will be described in detail with reference to the drawings. The following description of the embodiments is merely exemplary in nature and is not intended to limit the present disclosure, its applications, or its uses.

The embodiment of the present disclosure is a conductive substrate 1 (see FIG. 2) used to attach a functional layer 10a and a second electrode 14. As shown in FIG. 2, the conductive substrate 1 includes a substrate 2 and a first electrode 6. The conductive substrate 1 is disposed below the functional layer 10a (below, on the bottom side of a hole transport layer 11a).

FIG. 1 shows a schematic diagram of a portion of the conductive member 100. As shown in FIG. 2, the conductive member 100 includes a conductive substrate 1, a functional layer 10a, and a second electrode 14. The conductive member 100 can be applied to solar cells, OLEDs (organic light-emitting diodes), dimming devices, and the like. This embodiment illustrates an example in which the conductive member 100 is applied to a solar cell.

Here, in FIG. 1, the direction from the left side to the right side of the paper in FIG. 1 is defined as the "X direction," while the direction from the bottom to the top of the paper in FIG. 1 is defined as the "Y direction."

In the following description, the side on which the second electrode 14, described later, is located in the thickness direction of the conductive member 100 shown in FIG. 2 is defined as the "upper side" of the conductive member 100, and the opposite side (the side on which the film substrate 3, described later, is located) is defined as the "lower side" of the conductive member 100, and the positional relationship of each element constituting the conductive member 100 is defined. Note that this positional relationship is unrelated to the actual direction in the device in which the conductive member 100 is incorporated.

(substrate)
2, the substrate 2 has transparency and light transmittance. The substrate 2 has a flat surface 2a. In this embodiment, the flat surface 2a corresponds to the upper surface of a resin layer 4, which will be described later.

The substrate 2 includes a film substrate 3. The film substrate 3 is made of a resin material that is flexible, transparent, and light-transmitting. The thickness of the film substrate 3 is, for example, 20 μm to 200 μm.

Examples of the resin material include PET (polyethylene terephthalate), polycarbonate, COP (cycloolefin polymer), and COC (cycloolefin copolymer).

The substrate 2 includes a resin layer 4. The resin layer 4 is made of a resin material that is insulating and optically transparent. The thickness of the resin layer 4 is, for example, 1 μm to 10 μm.

The resin layer 4 is laminated on the upper side of the film substrate 3. The upper surface of the resin layer 4 (i.e., the flat surface 2a) is formed to be substantially flat, except for the recessed portion 5 described below.

As shown in Figures 3 and 4, the resin layer 4 has a plurality of bottomed recesses 5 that are recessed downward from the upper surface of the resin layer 4. The recesses 5 extend linearly on the upper surface (flat surface 2a) of the resin layer 4 to form a predetermined pattern, which will be described later. The recesses 5 are formed on the upper surface of the resin layer 4 by, for example, a thermal embossing method, a photolithographic etching method, laser processing, or the like.

(First Electrode)
1 and 2 , the first electrode 6 is made of a conductor pattern formed on the flat surface 2a side (the upper surface side of the resin layer 4) of the substrate 2. The conductor pattern is made up of a plurality of conductive wires 7. The plurality of conductive wires 7 are arranged on the flat surface 2a side of the substrate 2.

The conductor pattern is arranged in a predetermined pattern on the flat surface 2a of the substrate 2. Figure 1 shows a mesh pattern in which multiple conductive wires 7 are arranged in a mesh shape as an example of the predetermined pattern.

The mesh pattern is configured such that a plurality of conductive lines 7 extending in the X direction and a plurality of conductive lines 7 extending in the Y direction intersect with each other. The plurality of conductive lines 7 extending in the X direction are arranged at equal intervals from each other. The plurality of conductive lines 7 extending in the Y direction are arranged at equal intervals from each other. In this embodiment, one cell constituted by two conductive lines 7, 7 extending in the X direction and adjacent to each other, and two conductive lines 7, 7 extending in the Y direction and adjacent to each other, is formed in a square shape.

Each conductive wire 7 is thinned. The width of each conductive wire 7 is configured to be, for example, 10 μm or less.

As shown in Figures 2 to 4, each conductive wire 7 is made of a conductive metal embedded in each recess 5 of the substrate 2. Suitable conductive metals include, for example, copper (Cu), silver (Ag), gold (Au), aluminum (Al), nickel (Ni), or an alloy containing at least one of these metals.

As a characteristic configuration of the embodiment of the present disclosure, the surface of each conductive wire 7 is configured to be substantially flush with the flat surface 2a of the substrate 2 when exposed from the flat surface 2a of the substrate 2. As shown in FIG. 4, this embodiment illustrates a state in which the flat surface 2a of the substrate 2 and the surface of each conductive wire 7 are completely flush with each other. Note that, for convenience of illustration, the hole transport layer 11a is omitted in FIG. 4.

(Functional layer)
As shown in Figures 2 and 3, the functional layer 10a is composed of three layers. Specifically, the functional layer 10a is composed of a hole transport layer 11a, a charge generation layer 12a, and an electron transport layer 13a. The hole transport layer 11a, the charge generation layer 12a, and the electron transport layer 13a are laminated in this order on the flat surface 2a (the upper surface of the resin layer 4) of the substrate 2. The functional layer 10a is configured to have a thickness of 3.0 μm or less. Preferably, the thickness of the functional layer 10a is 1.0 μm or less.

The charge generation layer 12a has an electron donating function. Specifically, the charge generation layer 12a is configured to generate charge separation by utilizing a pn junction formed within the charge generation layer 12a.

The charge generating layer 12a contains an electron donating material. There are no particular limitations on the electron donating material as long as it functions as an electron donor. Preferably, the electron donating material is a material that can be formed into a film by a wet coating method. In particular, an electron donating conductive polymer material is suitable as the electron donating material.

Examples of electron-donating conductive polymer materials include polyphenylene, polyphenylenevinylene, polysilane, polythiophene, polycarbazole, polyvinylcarbazole, porphyrin, polyacetylene, polypyrrole, polyaniline, polyfluorene, polyvinylpyrene, polyvinylanthracene, and derivatives thereof, as well as copolymers thereof, or phthalocyanine-containing polymers, carbazole-containing polymers, organometallic polymers, etc.

More preferably, the electron-donating conductive polymer material is a thiophene-fluorene copolymer, a polyalkylthiophene, a phenyleneethynylene-phenylenevinylene copolymer, a phenyleneethynylene-thiophene copolymer, a phenyleneethynylene-fluorene copolymer, a fluorene-phenylenevinylene copolymer, a thiophene-phenylenevinylene copolymer, or the like.

The hole transport layer 11a has the function of transporting the holes generated by the charge generation layer 12a toward each conductive line 7. The hole transport layer 11a increases the transport efficiency of the holes generated by the charge generation layer 12a. As a result, the efficiency of photoelectric conversion in the conductive member 100 applied as a solar cell is improved.

Suitable materials for the hole transport layer 11a include, for example, conductive organic compounds such as doped polyaniline, polyphenylene vinylene, polythiophene, polypyrrole, polyparaphenylene, polyacetylene, and triphenyldiamine (TPD), or organic materials that form charge transfer complexes consisting of electron donor compounds such as tetrathiofulvalene and tetramethylphenylenediamine and electron acceptor compounds such as tetracyanoquinodimethane and tetracyanoethylene.

The hole transport layer 11a may be a thin film made of a metal material such as Au, In, Ag, or Pd. This thin film may be made of a metal material such as Au, In, Ag, or Pd alone, or may be a combination of these metal materials and the organic materials described above.

The electron transport layer 13a has the function of transporting electrons generated by the charge generation layer 12a toward the second electrode 14 described below. The electron transport layer 13a increases the transport efficiency of the electrons generated by the charge generation layer 12a. As a result, the efficiency of photoelectric conversion in the conductive member 100 applied as a solar cell is improved.

Examples of materials for the electron transport layer 13a include conductive organic compounds such as doped polyaniline, polyphenylene vinylene, polythiophene, polypyrrole, polyparaphenylene, polyacetylene, and triphenyldiamine (TPD), or organic materials that form charge transfer complexes consisting of electron donor compounds such as tetrathiofulvalene and tetramethylphenylenediamine and electron acceptor compounds such as tetracyanoquinodimethane and tetracyanoethylene.

Also, a metal-doped layer with an alkali metal or an alkaline earth metal can be used as the material for the electron transport layer 13a. Examples of the metal-doped layer include bathocuproine (BCP) or bathophenanthrone (Bphen) and Li, Cs, Ba, Sr, etc.

(Second electrode)
2 and 3, the second electrode 14 is disposed on the upper surface of the functional layer 10a (the upper surface of the electron transport layer 13a) by lamination. That is, the second electrode 14 faces the first electrode 6 in the thickness direction of the substrate 2 with the functional layer 10a sandwiched therebetween.

In this embodiment, the second electrode 14 is made of a conductive metal material. This metal material may include Li, In, Al, Ca, Mg, Sm, Tb, Yb, Zr, LiF, Au, Ag, etc. The second electrode 14 may also be made of a metal oxide such as indium tin oxide (ITO) or indium zinc oxide (IZO), or a transparent conductive polymer such as PEDOT/PSS.

In this embodiment, the second electrode 14 is exemplified as a metal layer composed of a single layer (see Figures 2 and 3). The second electrode 14 is formed, for example, by a vacuum deposition method or a pattern deposition method using a metal mask. The second electrode 14 may be a laminated arrangement of multiple layers each made of a different metal material. The second electrode 14 may also be a solid electrode formed on the entire top surface of the charge generating layer 12a, or may be configured with thin metal wires formed in a predetermined pattern.

(Career Path)
With reference to Fig. 3, a carrier path when the conductive member 100 is applied to a solar cell will be roughly described. The charge generation layer 12a generates carriers (electrons and holes) by light energy. The electrons (e1 to e4 shown in Fig. 3) generated by the charge generation layer 12a are transported toward the second electrode 14 via the electron transport layer 13a. The holes (h1 to h4 shown in Fig. 3) generated by the charge generation layer 12a are transported to the first electrode 6 via the hole transport layer 11a.

[Effects of the embodiment]
In the conductive substrate 1 according to the embodiment of the present disclosure, the surface of each conductive line 7 is configured to be substantially flush with the flat surface 2a. That is, each conductive line 7 is configured not to protrude from the flat surface 2a of the substrate 2. According to this configuration, even if the functional layer 10a is formed relatively thin, each conductive line 7 is not convex, and therefore, unlike the configuration of the prior art, each functional layer 10a is not divided in the thickness direction of the substrate 2. Furthermore, since there is no risk of the functional layer 10a being divided, each conductive line 7 does not come into contact with the second electrode 14, and no electrical short circuit occurs. Therefore, it is possible to prevent the original function of the device to which the conductive member 100 is applied (a solar cell in this embodiment) from being impaired.

[First Modification of the Embodiment]
In the above embodiment, the conductive member 100 is applied to a solar cell, but the present invention is not limited to this. For example, the conductive member 100 may be applied to an OLED (organic light-emitting diode) as in Modification 1 shown in FIG.

In the conductive member 100 according to the first modified example, the functional layer 10a is replaced with a functional layer 10b. As shown in FIG. 5, the functional layer 10b is composed of a hole transport layer 11b, a light emitting layer 12b, and an electron transport layer 13b. The hole transport layer 11b, the light emitting layer 12b, and the electron transport layer 13b are layered in this order on the flat surface 2a (the upper surface of the resin layer 4) of the substrate 2. The second electrode 14 is layered on the upper side of the electron transport layer 13b. The functional layer 10b is configured to have a thickness of 3.0 μm or less. Preferably, the thickness of the functional layer 10b is 1.0 μm or less.

In the first modification, the electron transport layer 13b has a function of transporting electrons (e1 to e3 shown in FIG. 5) supplied from the second electrode 14 toward the light-emitting layer 12b. The hole transport layer 11b has a function of transporting holes (h1 to h4 shown in FIG. 5) supplied from the first electrode 6 toward the light-emitting layer 12b. In the light-emitting layer 12b, the electrons supplied from the electron transport layer 13b and the holes supplied from the hole transport layer 11b recombine. The light-emitting layer 12b has a function of emitting light when the molecules constituting the light-emitting layer 12b are excited by the energy generated by the recombination of the electrons and holes.

Even in this modified example, as in the above embodiment, the original functions of the device to which the conductive film 1 is applied (OLED in this modified example) can be prevented from being impaired.

[Modification 2 of the embodiment]
Also, the conductive member 100 may be applied to a light control device, as in the modified example 2 shown in FIG. 6. In the conductive member 100 according to the modified example 2, the functional layer 10a is replaced with a functional layer 10c. As shown in FIG. 6, in the modified example 2, the functional layer 10c is composed of an electrochromic layer 21, an electrolyte layer 22, and a counter electrode material layer 23. The electrochromic layer 21, the electrolyte layer 22, and the counter electrode material layer 23 are laminated in this order on the flat surface 2a (the upper surface of the resin layer 4) of the substrate 2. The functional layer 10c is configured to have a thickness of 3.0 μm or less. Preferably, the functional layer 10c has a thickness of 1.0 μm or less.

In the second modification, the second electrode 14 is laminated on the upper side of the counter electrode material layer 23. The second electrode 14 in the second modification is made of a transparent material. Examples of materials for the second electrode 14 in the second modification include metal oxide, transparent conductive polymer, transparent conductive ink, and conductive metal.

Examples of the metal oxide include indium tin oxide (ITO) and indium zinc oxide (IZO). In addition, the metal oxide may be zinc oxide, indium oxide, antimony-doped tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, potassium-doped zinc oxide, silicon-doped zinc oxide, or metal oxides such as zinc oxide-tin oxide, indium oxide-tin oxide, and zinc oxide-indium oxide-magnesium oxide, or a composite material of two or more of these metal oxides.

The transparent conductive polymer may be, for example, PEDOT/PSS (poly-3,4-ethylenedioxythiophene/polysulfonic acid). The transparent conductive ink may be, for example, one that contains carbon nanotubes or silver nanofibers in a binder. The conductive metal may be, for example, copper, silver, gold, or an alloy containing at least one of these metals.

The electrochromic layer 21 has a function of being colored by an oxidation reaction induced by holes (reference symbols h1 to h4 in FIG. 6) supplied from the first electrode 6 and electrons (reference symbols e1 to e3 in FIG. 6) supplied from the second electrode 14. The counter electrode layer 23 has a function of undergoing a reduction reaction in response to the oxidation reaction of the electrochromic layer 21 in order to stabilize the device. The electrolyte layer 22 has a function of blocking the electrons supplied from the second electrode 14 from escaping toward the second electrode 14 side (i.e., the counter electrode side of the first electrode 6).

Even in this modified example, as in the above embodiment, the original functions of the device to which the conductive film 1 is applied (OLED in this modified example) can be prevented from being impaired.

[Modification 3 of the embodiment]
In the above embodiment, the configuration in which the surface of each conductive wire 7 and the flat surface 2a of the substrate 2 (the upper surface of the resin layer 4) are completely flush with each other (see FIG. 4) has been illustrated, but the present invention is not limited to this configuration. That is, as in Modification 3 shown in FIG. 7, the flat surface 2a of the substrate 2 and the surface of each conductive wire 7 do not have to be completely flush with each other. Note that, for convenience of illustration, the hole transport layer 11a is omitted in FIG. 7.

As shown in FIG. 7, the conductive wires 7 may be formed so that their surfaces are recessed downward (toward the bottom side of the recess 5) below the flat surface 2a of the substrate 2. Specifically, in the conductive member 100 according to variant example 3, the distance between the flat surface 2a of the substrate 2 and the deepest part of the surface of each conductive wire 7 (corresponding to the dimension d shown in FIG. 7) is preferably set to be greater than or equal to -1.0 μm and less than or equal to 1.0 μm. More preferably, the dimension d is greater than or equal to -0.1 μm and less than or equal to 0.0 μm.

By setting the dimension d in this manner, the flat surface 2a of the substrate 2 and the surface of each conductive wire 7 can be considered to be substantially flush with each other, as in the above embodiment. Therefore, it is possible to prevent the original function of a device to which the conductive member 100 of the third modified example is applied from being impaired.

[Fourth Modification of the Embodiment]
In the above embodiment, in the first electrode 6, one cell formed by two conductive lines 7 extending in the X direction and adjacent to each other and two conductive lines 7 extending in the Y direction and adjacent to each other is formed in a square shape, but this is not limited to the above. For example, as in Modification 4 shown in Fig. 8, a plurality of conductive lines 7 may extend in a diagonal direction with respect to both the X direction and the Y direction, and one cell formed by four conductive lines 7 may be formed in a diamond shape.

[Fifth Modification of the Embodiment]
In the above embodiment, the second electrode 14 is formed of a single metal layer, but the present invention is not limited to this embodiment. For example, instead of the second electrode 14 (see Figs. 2 and 3) shown in the above embodiment, a conductive substrate 31 including a second electrode 36 may be provided as in Modification 5 shown in Fig. 9. That is, the conductive member 100 shown in Modification 5 includes a conductive substrate 1 including a first electrode 6 and a conductive substrate 31 including a second electrode 36.

As shown in FIG. 9, the conductive substrate 31 includes a substrate 32 and a second electrode 36. The substrate 32 includes a film base material 33 and a resin layer 34. The substrate 32 has a flat surface 32a. The flat surface 32a corresponds to the lower surface of the resin layer 34. The resin layer 34 has a plurality of recesses 35.

The film substrate 33, the resin layer 34, and each of the recesses 35 have substantially the same structure as the film substrate 3, the resin layer 4, and each of the recesses 5 described in the above embodiment. Therefore, detailed descriptions of the film substrate 33, the resin layer 34, and each of the recesses 35 will be omitted.

The second electrode 36 is made of a conductor pattern made up of a plurality of conductive wires 37. The plurality of conductive wires 37 are arranged on the side of the substrate 32 where the flat surface 32a is located. Each conductive wire 37 is made of a conductive metal embedded in each recess 35 of the resin layer 34. The conductive metal that makes up the conductive wires 37 is made of the same material as the conductive metal that makes up the conductive wires 7 described in the above embodiment. The surface of each conductive wire 37 is configured to be approximately flush with the flat surface 32a when exposed from the flat surface 32a of the substrate 32.

Although not shown, the conductive wires 37 may be formed so that their surfaces are recessed upward (towards the bottom of the recess 35) from the flat surface 32a. In this case, the distance between the flat surface 32a and the deepest part of the surface of each conductive wire 37 is -1.0 μm or more and 1.0 μm or less. More preferably, the distance is -0.1 μm or more and 0.0 μm or less.

As described above, in the fifth modification, the conductive substrate 31 having the same structure as the conductive substrate 1 of the above embodiment is provided on the upper side of the functional layer 10a, and therefore the same effect as the conductive substrate 1 of the above embodiment can be achieved. Therefore, it is possible to prevent the original function of the device to which the conductive member 100 of the fifth modification is applied from being impaired.

Although not shown, as a further modification of modification 5, the conductive substrate 1 may be disposed on the upper side of the functional layer 10a (on the upper surface side of the electron transport layer 13a) while the conductive substrate 31 may be disposed on the lower side of the functional layer 10a (on the lower surface side of the hole transport layer 11a).

[Other embodiments]
In the above embodiment and the above modified examples 1 and 2, the conductive substrate 1 having the first electrode 6 is disposed below the functional layer 10a, while the second electrode 14 is disposed above the functional layer 10a, but the present invention is not limited to this embodiment. That is, although not shown, the conductive substrate 1 having the first electrode 6 may be disposed above the functional layer 10a (above the electron transport layer 13a in the above embodiment), while the second electrode 14 may be disposed below the functional layer 10a (above the hole transport layer 11a in the above embodiment).

This disclosure can be used industrially as a conductive substrate that can be applied to devices such as solar cells, OLEDs, and light control devices.

1, 31: Conductive substrate 2, 32: Substrate 2a, 32a: Flat surface 3, 33: Film substrate 4, 34: Resin layer 5, 35: Recess 6: First electrode 7, 37: Conductive wire 11a, 11b: Hole transport layer 12a: Charge generation layer 12b: Light-emitting layer 13a, 13b: Electron transport layer 14, 36: Second electrode 21: Electrochromic layer 22: Electrolyte layer 23: Counter electrode material layer 100: Conductive member

Claims (4)

A conductive substrate used to attach the functional layer and the second electrode,
A substrate having a flat surface;
a first electrode formed on the substrate;
the first electrode is composed of a plurality of conductive lines each made of a conductive metal embedded in the side of the substrate where the flat surface is located;
the flat surface of the substrate is configured so that the functional layer and the second electrode can be disposed thereon;
A conductive substrate, wherein a surface of each of the plurality of conductive lines is configured to be substantially flush with the flat surface. 2. The conductive substrate according to claim 1,
A conductive substrate, wherein the distance between the flat surface of the substrate and the deepest part of the surface of each of the plurality of conductive lines is not less than −1.0 μm and not more than 0.0 μm. A conductive substrate used to attach the functional layer and the first electrode,
A substrate having a flat surface;
a second electrode formed on the substrate;
the second electrode is composed of a plurality of conductive lines each embedded in the side of the substrate where the flat surface is located;
the flat surface of the substrate is configured so that the functional layer and the first electrode can be disposed thereon;
A conductive substrate, wherein a surface of each of the plurality of conductive lines is configured to be substantially flush with the flat surface. The conductive substrate according to claim 3,
A conductive substrate, wherein the distance between the flat surface of the substrate and the deepest part of the surface of each of the plurality of conductive lines is not less than −1.0 μm and not more than 0.0 μm.