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WO2024179027A1 - Procédé de fabrication d'un produit en verre, et produit en verre et dispositif électronique - Google Patents

Procédé de fabrication d'un produit en verre, et produit en verre et dispositif électronique Download PDF

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Publication number
WO2024179027A1
WO2024179027A1 PCT/CN2023/130053 CN2023130053W WO2024179027A1 WO 2024179027 A1 WO2024179027 A1 WO 2024179027A1 CN 2023130053 W CN2023130053 W CN 2023130053W WO 2024179027 A1 WO2024179027 A1 WO 2024179027A1
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WO
WIPO (PCT)
Prior art keywords
texture
glass
photoresist
product
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2023/130053
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English (en)
Chinese (zh)
Inventor
吴中正
陈松
陈志斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
Original Assignee
Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Oppo Mobile Telecommunications Corp Ltd filed Critical Guangdong Oppo Mobile Telecommunications Corp Ltd
Publication of WO2024179027A1 publication Critical patent/WO2024179027A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/001—General methods for coating; Devices therefor
    • C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the embodiments of the present application provide a method for manufacturing a glass product, a glass product, and an electronic device, which are at least used to solve the problem of a single effect of etching texture formation of the glass product.
  • the manufacturing method of the glass product of the embodiment of the present application includes: providing a glass substrate; forming an initial texture on the surface of the glass substrate; performing a wet etching process on the surface of the glass substrate and forming a first texture on the surface of the glass substrate to obtain an intermediate product; transferring the transfer texture on the surface of the intermediate product using a transfer mold to obtain a semi-finished product. And, performing a dry etching process on the surface of the semi-finished product to form a texture pattern to obtain the glass product.
  • the glass product of the embodiment of the present application includes a glass product made by the manufacturing method described in the above embodiment, and the surface of the glass product is formed with the texture pattern.
  • the manufacturing method of the glass product includes: providing a glass substrate; forming an initial texture on the surface of the glass substrate; wet etching the surface of the glass substrate and forming a first texture on the surface of the glass substrate to obtain an intermediate product; transferring the transfer texture on the surface of the intermediate product using a transfer mold to obtain a semi-finished product. And, dry etching the surface of the semi-finished product to form a texture pattern to obtain the glass product.
  • a texture pattern is formed on the surface of the glass product according to an embodiment of the present application.
  • the texture pattern includes a first texture and a second texture, and the size of the first texture is larger than the size of the second texture.
  • the electronic device includes a body and the glass product described in the above embodiment, wherein the glass product is combined with the body.
  • the present application first uses a wet etching process to produce a first texture on the surface of the glass substrate, and then uses a dry etching process to further process the surface of the glass with the first texture and produce a final texture pattern.
  • a complex texture pattern can be formed on the glass surface, improving the effect of the glass surface formation.
  • FIG. 1 is a flow chart of a method for manufacturing a glass product according to certain embodiments of the present application
  • FIG2 is a flow chart of a method for manufacturing a glass product according to certain embodiments of the present application.
  • FIG3 is a flow chart of a method for manufacturing a glass product according to certain embodiments of the present application.
  • FIG4 is a flow chart of a method for manufacturing a glass product according to certain embodiments of the present application.
  • FIG5 is a flow chart of a method for manufacturing a glass product according to certain embodiments of the present application.
  • FIG6 is a flow chart of a method for manufacturing a glass product according to certain embodiments of the present application.
  • FIG. 7 is a flow chart of a method for manufacturing a glass product according to certain embodiments of the present application.
  • FIG8 is a schematic diagram of the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • FIG9 is a schematic diagram of the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • FIG. 10 is a schematic diagram showing the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • FIG. 11 is a schematic diagram showing the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • FIG. 12 is a schematic diagram showing the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • FIG. 13 is a schematic diagram showing the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • FIG. 14 is a schematic diagram showing the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • FIG. 15 is a schematic diagram showing the principle of a process for producing a surface texture pattern of a glass product according to certain embodiments of the present application.
  • 16 to 22 are cross-sectional schematic diagrams of surface texture patterns of glass products according to certain embodiments of the present application.
  • FIG. 23 is a schematic diagram of the structure of an electronic device according to certain embodiments of the present application.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense. In an example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection, or they can communicate with each other; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements.
  • the method for manufacturing the glass product 60 according to the embodiment of the present application includes:
  • the glass substrate 100 is an unfinished product of a glass product 60 that can be used for etching to form a texture pattern 105. There are no special requirements for the thickness and size of the glass substrate 100, and those skilled in the art can flexibly select according to actual conditions.
  • the surface of the glass substrate 100 has a flexible layer, and the initial texture 101 is formed on the surface of the flexible layer.
  • the surface of the glass substrate 100 can be softened by heating or pressurizing to directly form the initial texture 101 by mechanical embossing or scratching.
  • the initial texture 101 can be directly formed on the surface of the hard glass substrate 100 by coating or spraying a printing agent.
  • the initial texture 101 is a texture directly formed on the surface of the glass substrate 100 and can be used as an etching template.
  • the texture can be a planar texture formed by inkjet printing or the like, or a three-dimensional texture formed by embossing or scratching or the like.
  • Etching is a process of selectively removing unwanted parts from the surface of an object by physical or chemical methods.
  • Wet etching is a technique of soaking the glass substrate 100 in an etching solution for etching. During the etching process, the surface of the glass substrate 100 without the initial texture 101 can be covered by comparing the initial texture 101.
  • the etching solution can chemically react with the position of the glass substrate 100 with the initial texture 101, and etch the surface of the glass to form a first texture 1051.
  • the first texture 1051 is a pattern formed on the surface of the glass after wet etching, and the shape of the first texture 1051 is the same as the shape of the initial texture 101.
  • the intermediate product 30 is an unfinished glass product with the first texture 1051 formed on the surface.
  • the first texture 1051 is concave relative to the surface of the intermediate product 30. In other embodiments, the first texture 1051 is convex relative to the surface of the intermediate product 30.
  • Transfer is a process of transferring the existing texture on the transfer mold to the surface of the glass substrate 100 to form a corresponding transfer texture 103 on the surface of the glass substrate 100.
  • the transfer texture 103 is a texture formed on the surface of the glass substrate 100 after the transfer operation, and the texture can be either a plane texture or a three-dimensional texture.
  • the semi-finished product 50 is an unfinished glass product having a first texture 1051 and a transfer texture 103 formed after the transfer process.
  • Dry etching is a technique for etching the intermediate product 30 using plasma.
  • the etching gas exists in the form of plasma, the chemical activity of the plasma is much stronger than that in the normal state. Therefore, the etching gas in the form of plasma can react with the material faster to achieve the purpose of etching removal.
  • the gas plasma can also be guided and accelerated by an electric field to give it a certain amount of energy. When it bombards the surface of the etched object, the atoms of the etched material will be knocked out, thereby achieving the purpose of etching by physical energy transfer and forming the required texture pattern 105 on the surface of the intermediate product 30.
  • the dry etching may include at least one of sputtering and ion beam etching, plasma etching, high pressure plasma etching, high density plasma etching, reactive ion etching and photolithography.
  • a glass substrate 100 comprising:
  • a first photoresist 13 is coated on the surface of the glass substrate 11 to obtain a glass matrix 100 .
  • the glass substrate 11 may be a single-component glass, such as quartz glass.
  • the glass substrate 11 may also be a multi-component glass, such as silicate glass, high-alumina silicate glass, borate glass or phosphate glass.
  • the processing raw materials that can be collected are mostly flat glass plates, and the size of the flat glass plates is large, which is not convenient for fine processing such as etching. Therefore, in some embodiments, a large-sized flat glass plate can be cut to obtain a glass substrate 11 of a predetermined size.
  • photoresist refers to a thin film material of an etch-resistant material whose solubility changes by irradiation or radiation of ultraviolet light, electron beam, ion beam or X-ray.
  • the photoresist can be applied to the surface of the glass substrate 11 by spin coating so that the photoresist is evenly distributed on the surface of the glass substrate 11 or the surface of the intermediate product 30.
  • the types of photoresists include, but are not limited to, photopolymerization photoresists, photodecomposition photoresists, photocrosslinking photoresists or chemical amplification photoresists.
  • Photopolymerization photoresists use olefin monomers to generate free radicals under the action of light, further initiate monomer polymerization, and finally generate polymers to form a solid retained on the glass surface.
  • Photodecomposition photoresists use materials containing diazoquinone compounds as photosensitizers, which undergo photodecomposition reactions after being exposed to light, and the products evaporate and leave the glass surface.
  • Photocrosslinking photoresists use polyvinyl laurate (POLY) and the like as photosensitive materials, and under the action of light, they form an insoluble network structure to play an anti-corrosion role.
  • POLY polyvinyl laurate
  • the main components of chemically amplified photoresist are polymer resin, photo acid generator (PAG) and corresponding additives and solvents.
  • 02: forming an initial texture 101 on the surface of a glass substrate 100 includes:
  • the glass substrate 100 is heated to form an initial texture 101 on the surface of the glass substrate 100 .
  • the mask 20 is a plate-like structure used to partially or completely hide a part of an object or element, and a mask texture is drawn on the mask 20.
  • the portions of the mask 20 that are not transparent to light together constitute the mask texture, and in this case, the first photoresist 13 is a positive photoresist that can be dissolved after exposure to light, such as a photodecomposition type photoresist or a chemical amplification type photoresist.
  • the portions of the mask 20 that are transparent to light together constitute the mask texture, and in this case, the first photoresist 13 is a negative photoresist that can be cured after exposure to light, such as a photopolymerization type photoresist or a photocross-linking type photoresist.
  • Exposure refers to the step of transferring the image on the original film to the photosensitive base plate (i.e., the first photoresist 13) through the action of a light source, at which point the photosensitive portion of the first photoresist 13 undergoes a chemical reaction to polymerize or decompose the photoresist.
  • Development refers to the process of removing the first photoresist 13 that has not undergone a photopolymerization reaction or removing the first photoresist 13 that has undergone a photodecomposition reaction through the action of a developer.
  • 03 wet etching the surface of the glass substrate 100 and forming a first texture 1051 on the surface of the glass substrate 100 to obtain an intermediate product 30, including:
  • the first photoresist 13 is removed to form a first texture 1051 on the surface of the glass substrate 100 .
  • the etching liquid is a chemical agent that can react chemically with the main component or all components in the glass.
  • the etching liquid is used to corrode the surface of the glass substrate 100 that is not covered by the first photoresist 13, so as to etch the first texture 1051 along the initial texture 101.
  • the etching liquid can be hydrofluoric acid.
  • Hydrofluoric acid is an aqueous solution of hydrogen fluoride (HF) gas, which is extremely corrosive and can strongly corrode metals, glass and silicon-containing objects, such as glass.
  • the residual first photoresist 13 attached to the glass surface can be removed by mechanical removal, light decomposition or heating dissolution, so as to facilitate the next etching operation, and form a texture pattern 105 with a complex structure and rich texture (shown in Figure 12).
  • the method for manufacturing the glass product 60 further includes:
  • the transfer mold has a mold texture corresponding to the position of the first texture 1051.
  • the mold texture corresponds to the transfer texture 103, that is, when the transfer mold is placed on the surface of the glass substrate 100 with the transfer texture 103, the protruding part of the mold texture can be fully matched with the concave part of the transfer texture 103, and the concave part of the mold texture can also be fully matched with the protruding part of the transfer texture 103.
  • the surface of the glass substrate 100 is additionally coated with a transfer material, such as photoresist or photosensitive adhesive.
  • the transfer mold can transfer the mold texture to the surface of the transfer material, and transfer the transfer texture 103 on the surface of the glass substrate 100 where the first texture 1051 has been formed.
  • the glass substrate 100 can be softened by heating or pressurizing, and the transfer mold can be placed on the surface of the glass substrate 100 and pressurized, so that the transfer texture 103 is directly transferred from the surface of the glass substrate 100 where the first texture 1051 has been formed.
  • a transfer mold comprising:
  • a master mold with microstructure texture is obtained by photolithography or ultra-precision CNC machine tool processing
  • a mold glue can be coated on the surface of the master mold with microstructure texture to form a transfer mold used in the transfer step.
  • the mold glue used to form the transfer mold includes but is not limited to: polydimethylsiloxane (Polydimethylsiloxane, PDMS) or mold silicone rubber (Room Temperature Vulcanization, RTV), etc.
  • 05 using a transfer mold to transfer a transfer texture 103 on the surface of the intermediate product 30 to obtain a semi-finished product 50, including:
  • the second photoresist 40 with traces is cured to form a transfer texture 103 .
  • the mold texture formed on the transfer mold corresponds to the microstructure texture formed on the master mold
  • the mold texture of the transfer mold corresponds to the transfer texture 103 on the surface of the glass substrate 100 that has formed the first texture 1051. Therefore, the microstructure texture of the master mold should be the same texture as the transfer.
  • the second photoresist 40 coated on the surface of the intermediate product 30 should be a negative photoresist that can be cured after exposure to light.
  • the second photoresist 40 includes but is not limited to photopolymerization photoresist, photocrosslinking photoresist or shadowless glue (UV glue), etc.
  • the second photoresist 40 is only coated in the first texture 1051 of the intermediate product 30.
  • the second photoresist 40 is coated on the entire area of the surface of the intermediate product 30 where the first texture 1051 is formed, including the internal area of the first texture 1051 and the external area of the first texture 1051.
  • the second photoresist 40 is a shadowless adhesive
  • the second photoresist 40 has fluidity before being exposed to light, so when the transfer mold is pressed on the second photoresist 40, the second photoresist 40 can fill the mold texture on the transfer mold and form a trace on the surface of the second photoresist 40.
  • the second photoresist 40 is irradiated with ultraviolet light to cure the fluid second photoresist 40.
  • the transfer mold is removed, and the transfer texture 103 is formed on the surface of the glass substrate 100, and the intermediate product 30 is made into a semi-finished product 50 for further etching.
  • the second photoresist 40 can also be subjected to other treatments to cure the second photoresist 40, such as high-temperature cross-linking curing or laser-induced curing.
  • the process of pressing the transfer mold is nanoimprinting.
  • Nanoimprinting can transfer the micro-nano structure on the transfer mold to the second photoresist 40 with the assistance of the second photoresist 40. Since the processing process of nanoimprinting technology does not use visible light or ultraviolet light to process the pattern, but uses mechanical means to transfer the pattern, this method can achieve a very high resolution.
  • the transfer mold used for imprinting can also be reused, which reduces the processing cost and reduces the processing time.
  • the transfer mold can transfer the mold texture to the surface of the second photoresist 40 and form the transfer texture 103.
  • the transfer texture 103 is composed of the surface of the intermediate product 30 not covered by the second photoresist 40.
  • the transfer texture 103 is only located in the first texture 1051, and the size of the transfer texture 103 is smaller than the size of the first texture 1051.
  • the transfer texture 103 can be located both in the first texture 1051 and outside the first texture 1051, so that a complex texture structure can be formed on the surface of the intermediate product 30.
  • the size of the transfer texture 103 located in the first texture 1051 and the size of the transfer texture 103 located outside the first texture 1051 are both smaller than the size of the first texture 1051.
  • dry etching is performed on the surface of the semi-finished product 50 to form a texture pattern 105 and obtain a glass product 60, including:
  • the etching device excites the etching gas to etch the surface of the semi-finished product 50 to form a second texture 1053 within the first texture 1051.
  • the first texture 1051 and the second texture 1053 together constitute a texture pattern 105.
  • the etching equipment is a device that can accommodate the semi-finished product 50 and etch the surface of the semi-finished product 50.
  • the etching method used by the etching equipment is dry etching.
  • the etching equipment mainly includes four parts: a pre-vacuum chamber, an etching chamber, a gas supply system and a vacuum system.
  • the pre-vacuum chamber is used to ensure that the etching chamber is maintained at a set vacuum degree, is not affected by the external environment (for example: dust and/or water vapor), and isolates the dangerous gases in the etching equipment.
  • the etching chamber is used to place the semi-finished product 50 for etching, and can excite the etching gas input into the etching chamber into plasma through coupled glow discharge, and drive the plasma to bombard the surface of the semi-finished product 50 to etch the semi-finished product 50.
  • the gas supply system is used to transport various etching gases to the etching chamber, and accurately control the flow rate and flow of the gas through a pressure controller (PC) and a mass flow controller (MFC).
  • PC pressure controller
  • MFC mass flow controller
  • the vacuum system is used to form a vacuum environment of the pre-vacuum chamber and exhaust the gas generated by the reaction in the etching chamber.
  • the components of the second photoresist 40 can react with the components of the etching gas, and the ionized etching gas can simultaneously etch the second photoresist 40 of the semi-finished product 50 and the surface of the glass not covered by the second photoresist 40, and remove the second photoresist 40 while forming the second texture 1053, and obtain the final glass product 60.
  • the second texture 1053 is concave relative to the surface of the semi-finished product 50.
  • the first texture 1051 is convex relative to the surface of the semi-finished product 50.
  • the etching speed of the second photoresist 40 is 1:1.
  • the etching depth of the second photoresist 40 i.e., the thickness of the photoresist
  • the etching depth of the glass i.e., the etching depth of the second texture 1053 of the etching equipment. Therefore, when the etching depth of the second texture 1053 of the etching equipment is consistent with the thickness of the photoresist, the second photoresist 40 can be removed while forming the texture pattern 105.
  • the present application can reduce the operating steps, thereby simplifying the process and saving production costs.
  • the composition of the second photoresist 40 used at this time, the composition of the etching gas, and the glass composition used in the intermediate product 30 are all relatively special.
  • the glass used in the semi-finished product 50 is a multi-component glass material, which comprises, by mass percentage, 2%-3% lithium oxide (Li 2 O), 9%-10% sodium oxide (Na 2 O), 0.01%-1% potassium oxide (K 2 O), 50%-60% silicon dioxide (SiO 2 ), 20%-30% aluminum oxide (Al 2 O 3 ), 0.005%-0.015% rubidium oxide (Rb 2 O), 0.01%-0.1% iron oxide (Fe 2 O 3 ), 0.005%-0.015% gallium oxide (Ga 2 O 3 ), 0.01%-0.1% calcium oxide (CaO), 0.01%-0.1% zirconium dioxide (ZrO 2 ) 0.005%-0.015%, zinc oxide (ZnO) 1%-2%, manganese monoxide (MnO) 0.005%-0.015%, phosphorus pentoxide (P 2 O 5 ) 5%-6%, boron oxide (B 2 O 3 ) 0.1%-0.5% and tin oxide (SnO
  • the second photoresist 40 includes, by mass percentage, 50%-55% photosensitive polymer material, 1%-5% initiator, 41%-48% solvent and 0.1%-0.5% auxiliary agent.
  • photosensitive polymer material refers to a type of functional polymer material that can produce chemical and physical changes within or between molecules after absorbing light energy.
  • the content of photosensitive polymer material can be: 50.0%, 50.5%, 51.7%, 51.9%, 52.4%, 52.6%, 53.3%, 53.8%, 54.5% or 55.0%, etc.
  • the photosensitivity of the second photoresist 40 decreases, affecting the performance of the second photoresist 40.
  • the etching speed of the second photoresist 40 is too fast, which may cause the second texture 1053 etched on the surface of the semi-finished product 50 to be incomplete.
  • the photosensitive polymer material within the above content range can make the second photoresist 40 have good photosensitivity, and the second photoresist 40 has good photosensitivity.
  • the etching speed of the resist 40 is 1:1 to the etching speed of the semi-finished product 50 , and the second texture 1053 obtained by etching is clear and complete.
  • the photosensitive polymer materials include tert-butyl acrylate (TBA), dipentaerythritol hexaacrylate (DPHA), cedryl methacrylat (CA) and acrylic resin modified by organosiloxan.
  • TSA tert-butyl acrylate
  • DPHA dipentaerythritol hexaacrylate
  • CA cedryl methacrylat
  • Siloxane-modified acrylic resin does not contain double bonds, has a low degree of cross-linking and curing, small volume shrinkage, weak internal stress, and less weakened adhesion to glass.
  • siloxane-modified acrylic resin contains siloxane groups.
  • the silanol groups formed after hydrolysis are easy to form silicon-oxygen covalent bonds (Si-O-Si bonds) with the silanol groups on the glass surface, and the adhesion is improved.
  • Si-O-Si bonds silicon-oxygen covalent bonds
  • the initiator is a compound that is easily decomposed into free radicals by heat.
  • the initiator can be used to initiate free radical polymerization and copolymerization reactions of olefinic and/or diene monomers, and can also be used for cross-linking and curing of unsaturated polyesters and cross-linking reactions of polymers.
  • the initiator is used to absorb light sources during exposure to generate free radicals and initiate photopolymerization reactions.
  • the initiator can promote the photocuring effect of the second photoresist 40; on the other hand, the content of the initiator can also affect the curing speed of the second photoresist 40.
  • the initiator includes photoinitiator OXE-01 and azodiisobutyronitrile (AIBN).
  • the solvent is used to dissolve organic solutes such as photosensitive polymer materials, initiators and additives.
  • the content of the solvent can be: 41%, 42%, 43%, 44%, 45%, 46%, 47% or 48%.
  • the content of the solvent is lower than 48%, other components in the second photoresist 40 are prone to precipitate crystals, affecting the formation of the transfer texture 103.
  • the content of the solvent is higher than 50%, the fluidity of the second photoresist 40 is too strong, and the transfer texture 103 cannot be formed on the surface of the second photoresist 40.
  • the solvent within the above content range can make the second photoresist 40 have a certain fluidity while dissolving all the solutes, so that the second photoresist 40 is easy to deform during the transfer process to transfer the transfer texture 103.
  • the auxiliary agent is a small amount of component that assists the molding of the second photoresist 40 and affects its performance.
  • the content of the auxiliary agent can be: 0.1%, 0.15%, 0.2%, 0.24%, 0.3%, 0.37%, 0.4%, 0.41%, 0.48% or 0.5%, etc.
  • the content of the auxiliary agent is lower than 0.1%, the properties of the second photoresist 40 are unstable and uneven after coating.
  • the content of the auxiliary agent is higher than 0.5%, the second photoresist 40 is easy to fall off from the surface of the semi-finished product 50.
  • the auxiliary agent within the above content range can maintain the stability of the properties of the second photoresist 40, and the second photoresist 40 has good adhesion and is not easy to fall off.
  • the etching gas includes boron trichloride (BCl 3 ), perfluorobutadiene (C 4 F 6 ) and oxygen (O 2 ), wherein C 4 F 6 is used to mainly attack the silicon dioxide (SiO 2 ) component, BCl 3 is used to attack the aluminum oxide (Al 2 O 3 ) component, and O 2 is used to attack other components and byproducts produced on the surface.
  • the volume ratio of boron trichloride:perfluorobutadiene:oxygen is 10:3:1.
  • the boiling point of aluminum fluoride is relatively high, so the product after etching is not easy to volatilize and dissipate, and it is difficult to remove it from the surface of the glass product 60, so BCl 3 is generally used to etch the Al 2 O 3 component.
  • the O 2 component After the O 2 component forms a plasma, it accelerates the bombardment of the surface of the semi-finished product 50, and generates physical bombardment etching and oxidation bombardment etching, which can effectively remove the etching products adsorbed on the surface, reduce the etching resistance, and can dissociate and volatilize the etching products in time.
  • the ionized etching gas can only etch the surface of the glass not covered by the second photoresist 40. After the second texture 1053 is formed on the surface of the glass, the second photoresist 40 needs to be removed by heating or light to obtain the final glass product 60.
  • the second texture 1053 is consistent with the shape of the transferred texture 103.
  • the second texture 1053 formed by etching is located in the first texture 1051.
  • the second texture 1053 formed by etching is located in the first texture 1051 and outside the first texture 1051.
  • the glass product 60 is a product with a texture pattern 105 etched on the surface.
  • the glass product 60 can be used as a container with decorative patterns, and can also be used for further processing and made into a partial structure of the electronic device 100, such as the back shell of the electronic device 100, the screen of an electronic display, or the protective structure outside the camera.
  • the first texture 1051 is formed by wet etching
  • the second texture 1053 is formed by dry etching
  • the second texture 1053 is engraved on the glass surface on which the first texture 1051 has been formed.
  • the second texture 1053 is protruding relative to the surface of the glass product 60 and/or the first texture 1051.
  • the second texture 1051 is recessed relative to the surface of the glass product 60 and/or the first texture 1051. Since the etching solution used in wet etching has isotropy during the chemical reaction with the glass, wet etching is more suitable for making a larger first texture on the glass surface.
  • Dry etching is a method in which ionized gas particles bombard the surface of the glass, so it is easier to control the bombardment depth and bombardment width, thereby making a smaller and finer second texture 1053 on the glass surface that has been etched to form a large texture.
  • a plurality of first textures 1051 and a plurality of second textures 1053 are arranged on the surface of the glass product 60, and there is a gap L between each of the first textures 1051.
  • the plurality of second textures 1053 are formed on the first textures 1051 and the gap L, and in other embodiments, the plurality of second textures 1053 are formed on one of the first textures 1051 or the gap L.
  • the outer contour shape of the longitudinal section of the second texture 1053 includes but is not limited to a rhombus, a triangle, a semicircle, a circle, or a fan.
  • the second texture 1053 is convex relative to the surface of the first texture 1051 or the surface of the gap L. In other embodiments, the second texture 1053 is concave relative to the surface of the first texture 1051 or the surface of the gap L.
  • the width range of the gap L between the plurality of first textures 1051 is [10 ⁇ m, 1000 ⁇ m].
  • the width of the gap L is less than 10 ⁇ m, the distance between two adjacent first textures 1051 is too small, and it is not easy to form the second texture 1053.
  • the width of the gap L is greater than 1000 ⁇ m, the distance between two adjacent first textures 1051 is too large, and the first texture 1051 has a more obvious feel, resulting in the second texture 1053 formed on the first texture 1051 not having an obvious feel. Therefore, when the width range of the gap L is [10 ⁇ m, 1000 ⁇ m], the second texture 1053 can be easily etched and formed on the surface of the glass product 60, and the pattern is clear and the feel is obvious.
  • the outer contour of the longitudinal section of the first texture 1051 is a triangle.
  • the maximum width A1 of the longitudinal section of the first texture 1051 is the base of the triangle, and the maximum depth H1 of the longitudinal section of the first texture 1051 is the height of the triangle.
  • the second texture 1053 can be disposed on any one of the sides or the gap L of the triangle, or on the sides and the gap L of the triangle.
  • the depth H1 of the first texture 1051 is in the range of [4 ⁇ m, 20 ⁇ m].
  • First Texture When the depth H1 of the first texture 1051 is less than 4 ⁇ m, the first texture 1051 is relatively blurred and easily worn. When the depth H1 of the first texture 1051 is greater than 20 ⁇ m, the glass product 60 is easily broken. Therefore, when the depth H1 of the first texture 1051 is in the range of [4 ⁇ m, 20 ⁇ m], the first texture 1051 is clear and complete, and is not likely to cause the glass product 60 to break or be damaged.
  • the width A1 of the first texture 1051 is in the range of [16 ⁇ m, 80 ⁇ m].
  • the width A1 of the first texture 1051 is less than 16 ⁇ m, the first texture 1051 is too small, the optical effect and feel are not good, and it is difficult to continue etching the second texture 1053 in the first texture 1051.
  • the width A1 of the first texture 1051 is greater than 80 ⁇ m, the first texture 1051 formed on the surface of the glass product 60 is too large, affecting the smoothness of the surface of the glass product 60.
  • the width A1 of the first texture 1051 is in the range of [16 ⁇ m, 80 ⁇ m], the first texture 1051 formed is of moderate size, more beautiful, and does not affect the feel of use.
  • the outer contour of the longitudinal section of the first texture 1051 is a trapezoid.
  • the width D0 of the upper surface of the longitudinal section of the first texture 1051 is the upper base of the trapezoid
  • the width D1 of the lower surface of the longitudinal section of the first texture 1051 is the lower base of the trapezoid
  • the depth H2 of the longitudinal section of the first texture 1051 is the height of the trapezoid.
  • the second texture 1053 may be disposed on at least one of the surface of the trapezoid and the gap L.
  • the second texture 1053 is disposed only on the side of the trapezoid or the upper surface of the trapezoid. In other embodiments, a plurality of second textures 1053 are disposed on the side of the trapezoid and the upper surface of the trapezoid, respectively.
  • the depth H2 of the first texture 1051 is in the range of [4 ⁇ m, 20 ⁇ m].
  • First Texture When the depth H2 of the first texture 1051 is less than 4 ⁇ m, the first texture 1051 is relatively blurred and easily worn. When the depth H2 of the first texture 1051 is greater than 20 ⁇ m, the glass product 60 is easily broken. Therefore, when the depth H2 of the first texture 1051 is in the range of [4 ⁇ m, 20 ⁇ m], the first texture 1051 is clear and complete, and is not likely to cause the glass product 60 to break or be damaged.
  • the width D0 of the upper surface of the longitudinal section of the first texture 1051 is in the range of [0.1 ⁇ m, 100 ⁇ m].
  • the width D0 of the upper surface of the longitudinal section of the first texture 1051 is less than 0.1 ⁇ m, the longitudinal section of the first texture 1051 cannot form a trapezoidal shape.
  • the width D0 of the upper surface of the longitudinal section of the first texture 1051 is greater than 100 ⁇ m, the first texture 1051 formed on the surface of the glass product 60 may cover the gaps between the first textures 1051, and the feel of the first texture 1051 is not obvious. Therefore, when the width D0 of the upper surface of the longitudinal section of the first texture 1051 is in the range of [0.1 ⁇ m, 100 ⁇ m], the first texture 1051 formed is of moderate size, more beautiful, and does not affect the feel of use.
  • the width D1 of the lower surface of the longitudinal section of the first texture 1051 is in the range of [16.1 ⁇ m, 180 ⁇ m].
  • the width D1 of the lower surface of the longitudinal section of the first texture 1051 is less than 16.1 ⁇ m, the first texture 1051 is too small, the optical effect and hand feel are not good, and it is difficult to continue etching the second texture 1053 in the first texture 1051.
  • the width D1 of the lower surface of the longitudinal section of the first texture 1051 is greater than 180 ⁇ m, the first texture 1051 formed on the surface of the glass product 60 is too large, affecting the smoothness of the surface of the glass product 60.
  • the width D1 of the lower surface of the longitudinal section of the first texture 1051 is in the range of [16.1 ⁇ m, 180 ⁇ m]
  • the first texture 1051 formed is of moderate size, more beautiful, and does not affect the hand feel during use.
  • the depth of the second texture 1053 formed on the surface of the glass product 60 is in the range of [0.1 ⁇ m, 10 ⁇ m].
  • the depth of the second texture 1053 is less than 0.1 ⁇ m, the second texture 1053 is relatively blurred and easily worn.
  • the depth of the second texture 1053 is greater than 10 ⁇ m, the glass product 60 is easily broken. Therefore, when the depth of the second texture 1053 is 0.1 ⁇ m-10 ⁇ m, the second texture 1053 is clear and complete, and is not likely to cause the glass product 60 to break or be damaged.
  • the length range of the second texture 1053 is [0.1 ⁇ m, 10 ⁇ m], and the width range of the second texture 1053 is also [0.1 ⁇ m, 10 ⁇ m].
  • the second texture 1053 is too small and difficult to distinguish.
  • the second texture 1053 formed on the surface of the glass product 60 is too large, and the second texture 1053 cannot be formed within the first texture 1051. Therefore, in the case where the length range and/or width range of the second texture 1053 is 0.1 ⁇ m-10 ⁇ m, the second texture 1053 formed is of moderate size, more beautiful, and does not affect the overall optical effect of the glass product 60.
  • the electronic device 100 of the embodiment of the present application includes a body and the glass product described in any of the above embodiments, the glass product can be used to be combined with the body, and the glass product can be used to form a part of the structure of the electronic device 100, for example: the back shell of the electronic device 100, the outer screen of the electronic display or the protective structure of the camera, etc.
  • the electronic device 100 includes but is not limited to a mobile phone, a computer display, a tablet computer or a smart wearable device, etc.
  • the present application first uses a wet etching process to produce a first texture 1053 on the surface of the glass substrate 100, and then uses a dry etching process to further process the surface of the glass having the first texture 1053 and produce a final texture pattern 105.
  • a complex texture pattern 105 can be formed on the glass surface, thereby improving the effect of the glass surface formation.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un produit en verre (60), et un produit en verre (60). Le procédé de fabrication d'un produit en verre (60) consiste : à fournir un substrat de verre (100) ; à former une texture initiale (101) sur la surface du substrat de verre (100) ; à effectuer un traitement de gravure humide sur la surface du substrat de verre (100), et à former une première texture (1051) sur la surface du substrat de verre (100), de façon à obtenir un produit intermédiaire (30) ; à utiliser un moule de transfert pour transférer une texture de transfert (103) sur la surface du produit intermédiaire (30), de façon à obtenir un produit semi-fini (50) ; et à effectuer un traitement de gravure sèche sur la surface du produit semi-fini (50) pour former un motif de texture (105), de façon à obtenir un produit en verre (60). Un procédé de gravure humide est tout d'abord utilisé pour obtenir une première texture (1051) sur la surface d'un substrat de verre (100), et un procédé de gravure sèche est ensuite utilisé pour effectuer un traitement supplémentaire sur la surface de verre ayant la première texture (1051) puis réaliser un motif de texture final (105).
PCT/CN2023/130053 2023-02-27 2023-11-07 Procédé de fabrication d'un produit en verre, et produit en verre et dispositif électronique Pending WO2024179027A1 (fr)

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CN105517964A (zh) * 2013-09-03 2016-04-20 旭硝子欧洲玻璃公司 具有直线特征的纹理化玻璃板
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