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WO2024173432A1 - Système de capteur modulaire électronique et optique, et procédés de détection associés - Google Patents

Système de capteur modulaire électronique et optique, et procédés de détection associés Download PDF

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Publication number
WO2024173432A1
WO2024173432A1 PCT/US2024/015644 US2024015644W WO2024173432A1 WO 2024173432 A1 WO2024173432 A1 WO 2024173432A1 US 2024015644 W US2024015644 W US 2024015644W WO 2024173432 A1 WO2024173432 A1 WO 2024173432A1
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WIPO (PCT)
Prior art keywords
optical
sensor
modular
module
sensor system
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PCT/US2024/015644
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English (en)
Inventor
Lawrence RENNA
Kyle BRUBAKER
Michael Turner
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Intelligent Optical Systems Inc
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Intelligent Optical Systems Inc
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Publication of WO2024173432A1 publication Critical patent/WO2024173432A1/fr
Anticipated expiration legal-status Critical
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N2021/7769—Measurement method of reaction-produced change in sensor
    • G01N2021/7783—Transmission, loss
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N2021/7769—Measurement method of reaction-produced change in sensor
    • G01N2021/7786—Fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N21/6408—Fluorescence; Phosphorescence with measurement of decay time, time resolved fluorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/75—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated
    • G01N21/77—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator
    • G01N21/7703—Systems in which material is subjected to a chemical reaction, the progress or the result of the reaction being investigated by observing the effect on a chemical indicator using reagent-clad optical fibres or optical waveguides
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/02—Mechanical
    • G01N2201/024—Modular construction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/18—Water
    • G01N33/1886—Water using probes, e.g. submersible probes, buoys

Definitions

  • the present disclosure relates to devices for optical sensing measurements and methods thereof, especially for the quantitative determination of an analyte concentration in gaseous, vaporous, or dissolved media.
  • Luminescence lifetime is generally invariant to parameters including illumination intensity and detector gain, and thus produces more stable measurements. In DLR-type measurements, luminescent lifetime is not determined, but a variable that depends on luminescent lifetime, and can be calibrated against a variable of interest.
  • U.S. Patent No. US 9,016,573 B2 discloses, in part, an optical sensor unit for determining at least one variable of a sample.
  • Methods of measurement are disclosed in U.S. Patent No. 6,602,716 which are either time-based or frequency -based and includes two luminescent states, one of which is sensitive to the variable of interest and the other that is insensitive and acts as a reference. Therein, they report that ratios of luminescence intensity measurements are collected during the luminescence response, and that, “A difficulty with these methods, however, is to implement the defined time intervals for the integration of the luminescence response with sufficient precision in the measurement apparatus. This involves a certain technical effort implying corresponding costs.”
  • a modular fiber optic fluorimeter comprised of interchangeable modules including an excitation source, a detector, a signal processor, frequency source, wavelength selector, and an optical interface.
  • the modularity of the invention allowed for customizable measurements.
  • modular sensor unit which may otherwise be referred to herein as a modular optoelectronic device
  • the modularity of the sensor unit allows it to be reconfigured as it may be comprised of cards for optical excitation, optical detection, electrical or electrochemical signal, and/or communications.
  • the modular sensor unit can be used in conjunction with optical sensors (e.g., thereby defining a “modular sensor system”), where the optical properties are dependent on at least one variable, for analyte concentration, with optical sensing mechanisms including luminescence (fluorescence, phosphorescence), absorbance, and/or transmission.
  • optical sensors e.g., thereby defining a “modular sensor system”
  • the optical properties are dependent on at least one variable, for analyte concentration
  • optical sensing mechanisms including luminescence (fluorescence, phosphorescence), absorbance, and/or transmission.
  • the term “system” may be used herein to refer to the combination of at least one modular sensor unit with at least one sensor (e.g., sensor material patch).
  • the unit, system and methods of this invention center around the innovation of providing a modular optoelectronic platform that can be configured in countless configurations for optical sensing as well as accepting signals from electronic and electrochemical sensors, and adding communication to export measurements via desired method or input signals including triggers.
  • the modular sensor unit, and the broader system may be comprised of components that allow for very low cost, size, weight, and power with still high resolution of optical measurements. Implementations of the modular sensor unit may preferably comprise universal slots that can accept cards for optical excitation, optical detection, electrical signals, and/or communications.
  • the optical excitation cards may be configured with excitation sources and optical filters having desired optical properties including but not limited to excitation wavelength(s), cut-off filter wavelength(s), excitation power, and excitation timing.
  • the optical detection cards can be individually configured likewise with desired properties including cut-off filter wavelength(s), sensitivity, gain. In preferred implementations of the modular sensor unit and the broader system, these cards can be swapped into the optoelectronic platform to configure the sensor device as desired for the target application.
  • the universal slots may also be adapted to accept cards for electrical or electrochemical signals, thereby facilitating the modular sensor unit’s, and corresponding system’s, expandability and customizability.
  • the modular sensor unit and its method of operation may comprise highly sensitive optical detectors and optical sensing methods that implement the defined time intervals for the integration of the optical response with sufficient precision using a crystal oscillator powered phase-locked loop (PLL), and the frequency stability for a crystal is 20 ppm, and an active sweep-out LED driver circuit.
  • PLL crystal oscillator powered phase-locked loop
  • the improvement is further implemented with low-cost and highly- sensitive components.
  • the improvement affords optical sensitivity that is especially advantageous for low-cost portable field devices and unmanned vehicle mounting.
  • optical interfaces in a preferred embodiment of the presently disclosed modular sensor units, systems and methods, may be entirely optical fiber (e.g., fiber optic cables).
  • Optical fibers reduce costs associated optical alignment and vibration isolation.
  • the multiplexing of sensors can be achieved through optical fiber bundles, which, when combined with the modularity of the optoelectronic device, increases the number of possible configurations of the sensor system.
  • FIG. 1 is a diagrammatic perspective view of one example modular sensor unit, wherein the modular sensor unit is an eight-channel unit with six sensor interface modules shown removably mounted to six of the eight available module mounting stations;
  • FIG. 2 is a further diagrammatic perspective view of the example modular sensor unit of FIG. 1;
  • FIG. 3 is a diagrammatic front view of the example modular sensor unit of FIG. 1;
  • FIG. 4 is a diagrammatic side view of the example modular sensor unit of FIG. 1;
  • FIG. 5 is a diagrammatic perspective view similar to that of FIG. 1, but wherein one of the sensor interface modules is shown dismounted from a corresponding module mounting station;
  • FIG. 6 is a further diagrammatic perspective view of the configuration shown in FIG. 5;
  • FIG. 7 is a diagrammatic perspective view of an example base circuit card assembly of the modular sensor unit of FIG. 1;
  • FIG. 8 is a further diagrammatic perspective view of the example base circuit card assembly of FIG. 7;
  • FIG. 9 is a diagrammatic perspective view of an example sensor probe with an optical sensor material patch disposed within a removable sensor cap;
  • FIG. 10 is diagrammatic cross-sectional view of the example sensor probe of FIG. 9.
  • FIG. 11 is diagrammatic cross-sectional view similar to that of FIG. 10, but wherein the sensor cap is shown threadedly removed from the probe body and the sensor material patch is shown having been removed from the sensor cap;
  • FIG. 12 is diagrammatic perspective view of an example modular sensor system being employed to detect the presence and concentration of one or more analytes within a target media;
  • FIG. 13 is block diagram of an example eight-channel modular sensor unit with custom bus 136 and four high dynamic range active sweepout LED peripheral cards and four adjustable output SiPM detector peripheral cards;
  • FIG. 14 is block diagram of an example eight-channel modular sensor unit similar to that of FIG. 13, but wherein the detection versions of the sensor interface modules comprise one optical detector SiPM card, two resistance temperature detector (RTD) cards, and one electrical conductivity (EC) card;
  • the detection versions of the sensor interface modules comprise one optical detector SiPM card, two resistance temperature detector (RTD) cards, and one electrical conductivity (EC) card;
  • FIG. 15 is a block diagram of an example modular sensor system comprising a modular sensor unit and a plurality of sensors, showing the use of four LEDs and four detectors to interrogate four sensors using four bifurcated optical fiber bundles;
  • FIG. 16 is a block diagram of a system comprising a modular sensor unit and a plurality of sensors, showing the use of four LEDs and one detector to interrogate four sensors using one quad-furcated optical fiber bundle;
  • FIG. 17 is an example fast output signal from an example active-sweepout LED driver circuit
  • FIG. 18 is a diagrammatic cross-sectional view of one example receptacle containing an LED and a spherical lens, terminated in an optical fiber SMA connector;
  • FIG. 19 is a computer simulation of one example LED light without a lens;
  • FIG. 20 is a computer simulation of the example LED light of FIG. 7A, but with a spherical lens, showing the resulting focusing of light;
  • FIG. 21 illustrates the average photodetector intensity of a single materials luminescence, with a long luminescence lifetime, under a square wave LED excitation
  • FIG. 22 illustrates the photodetector intensity of a single materials luminescence, with a long luminescence lifetime, under a square wave LED excitation before subtracting the background signal;
  • FIG. 23 illustrates the photodetector intensity of a single materials luminescence, with a long luminescence lifetime, under a square wave LED excitation after subtraction of the background signal;
  • FIG. 24 illustrates the photodetector intensity of a single materials luminescence at different distances between the end of the optical fiber and the sensor material
  • FIG. 25 illustrates the photodetector intensity of a single materials luminescence at different distances between the end of the optical fiber and the sensor material, but with normalization of the same data as in FIG. 10A;
  • FIG. 26 illustrates the minimal resolvable concentration of oxygen gas as a function of nominal partial pressure of oxygen at 2000 averaged samples
  • FIG. 27 illustrates the minimal resolvable concentration of oxygen gas as a function of nominal partial pressure of oxygen at 20000 averaged samples;
  • FIG. 28 illustrates the drift in ratio and integrated intensity as a function of time with corresponding linear regression;
  • FIG. 29 shows the photodetector intensity of two materials luminescence, with a short and long luminescence lifetime each, under a square wave LED excitation
  • FIG. 30 illustrates calibrated ratio values as a function of the concentration of carbon dioxide
  • FIG. 31 illustrates multi-dimensional calibration maps using radial basis function (RBF) interpolation
  • FIG. 32 illustrates multi-dimensional calibration maps using linear interpolation
  • FIG. 33 illustrates calibrated and nominal concentrations of carbon dioxide as a function of time
  • FIG. 34 illustrates an example of precisely timed measurements of the detected optical signal made with an ADC during excitation as a reference signal, immediately after excitation to measure the luminescence decay, and before the next excitation as a baseline.
  • FIG. 100 Various exemplary implementations of a module sensor unit in accordance with the present disclosure are shown generally at 100 in the several drawings presented herewith.
  • Various exemplary implementations of a module sensor system in accordance with the present disclosure are shown generally at 134 in the several drawings presented herewith.
  • a modular sensor system 134 may comprise a base circuit card assembly 102 and a multiplicity of sensor interface modules (for example, 106, 108, 116, 118).
  • the base circuit card assembly 102 may have a processor 110, a memory 111, and a plurality of module mounting stations 104.
  • the multiplicity of sensor interface modules may each be configured to be interchangeably removably mounted to any of the module mounting stations 104 (for example, by way of module mounting slot 122 being engaged by a respective module mounting plug) and thereby provide electrical connection between the mounted sensor interface module and the processor 110.
  • the memory 111 may preferably store one or more programs 114 configured to be executed by the processor 110.
  • the one or more programs 114 may include, for example, instructions for causing the processor 110 to detect the presence and concentration of one or more selected analytes in a target media 158 based upon sensor data received from one or more of the mounted sensor interface modules (for example, 106, 108, 116, 118).
  • the processor 110 may be comprised of one or more computer processor elements, such as one or more microcontrollers or CPUs.
  • At least one of the sensor interface modules may be an optical excitation module 106 configured to radiate a sensor material patch 126 with an optical excitation signal 168.
  • at least one of the sensor interface modules may be an optical detection module 108 configured to receive an optical response signal 170 from a sensor material patch 126 during or following radiation of that sensor material patch 126 by an optical excitation signal 168.
  • each optical excitation module 106 and each optical detection module 108 may terminate in an optical fiber connector (132a and 132b).
  • An optical fiber connector (1323a, 132b) may be, for example, an SMA connector or the like.
  • a sensor material patch 126 may preferably comprise an optically active sensor material which, when exposed to electromagnetic radiation (e.g., excitation signal), returns a measurable modulated optical response signal.
  • a sensor material patch 126 may take many shapes and forms. For example, it could be in the form of a component, such as a strip or puck of sensor material, or it may be in the form of a coating or other layer deposited or affixed on another underlying substrate or component.
  • each sensor material patch 126 may be configured to be placed in optical communication with the respective sensor interface module (106, 108) by way of respective optical fiber 112.
  • the one or more programs 114 include instructions for causing the processor 110 to control parameters of the optical excitation signal 168 of each mounted optical excitation module 106.
  • the parameters of the optical excitation signal 168 may be intensity, frequency, length, timing, some combination thereof, or the like.
  • At least one of the optical excitation modules 106 may include an LED 128 by which the optical excitation signal 168 is radiated, and a spherical lens 130 and a short pass filter or band pass filter 138 optically disposed between the LED 128 and the optical fiber connector 132a.
  • a first said sensor material patch 126 may be disposed in optical communication between a first mounted optical excitation module 106 and a first mounted optical detection module 108.
  • a first sensor material patch 126 may be disposed in optical communication between one mounted optical excitation module 106 and each of two or more mounted optical detection modules 108.
  • a first sensor material patch 126 may be disposed in optical communication between one mounted optical detection module 108 and each of two or more mounted optical excitation modules 106.
  • a first sensor material patch 126 may be disposed in optical communication between a first mounted optical excitation module 106 and a first mounted optical detection module 108; and (b) a second sensor material patch 126 may be disposed in optical communication between a second mounted optical excitation module 106 and the first mounted optical detection module 106.
  • a first sensor material patch 126 may be disposed in optical communication between a first mounted optical excitation module 106 and a first mounted optical detection module 108; and (b) a second sensor material patch 126 may be disposed in optical communication between the first mounted optical excitation module 106 and a second mounted optical detection module 108.
  • a first sensor material patch 126 may be disposed in optical communication between a first mounted optical excitation module 106 and a first mounted optical detection module 108
  • a second sensor material patch 126 may be disposed in optical communication between a second mounted optical excitation module 106 and a second mounted optical detection module 108.
  • a modular sensor system 134 may comprise a plurality of sensor material patches 126.
  • each of the sensor material patches 126 may be disposed in optical communication between a respective mounted optical excitation module 106 and a respective mounted optical detection module 108.
  • At least one of the sensor interface modules is a conduction sensor module 116 configured to measure the electrical conductivity of the target media 158 when mounted to one of the module mounting stations 104.
  • At least one of the sensor interface modules is a temperature sensor module 118 configured to measure the temperature of the target media 158 when mounted to one of the module mounting stations 104.
  • the one or more programs 114 may include instructions for causing the processor 110 to detect the presence and concentration of two or more selected analytes in the target media 158 based upon measurement data received from one or more of the mounted sensor interface modules (for example, 106, 108, 116, 118).
  • the sensor material patch 126 may be disposed within a sensor cap 144 of a sensor probe 142.
  • the sensor cap 144 may have an exposure aperture 152 by which the sensor material patch 126 is in communication with an ambient environment 172 external to the sensor probe 142.
  • the sensor probe 142 may have an elongated probe body 146 with a first end 148 and a second end 150.
  • the sensor cap 144 may preferably be configured to be threadedly attached to the first end 148.
  • a fiber optical bundle 154 (e g., part of optical interface 112) may extend through the probe body 146 from the second end 154 toward the first end 148, and into direct or indirect optical communication with the sensor material patch 126.
  • the interchangeable removable mounting of the sensor interface modules results in rigid attachment of the mounted sensor interface modules to the base circuit card assembly 102.
  • the entire modular sensor unit 100 with mounted sensor interface modules may form a unitarily rigid structure.
  • the base circuit card assembly 102 may include a multiplexer circuit, an EEPROM, power circuitry, a real-time clock a mini-B universal serial bus (USB) connector, a mini secure digital (SD) card slot, and an external power connector.
  • a multiplexer circuit an EEPROM, power circuitry, a real-time clock a mini-B universal serial bus (USB) connector, a mini secure digital (SD) card slot, and an external power connector.
  • USB universal serial bus
  • SD secure digital
  • a main card 102 may have a multiplicity of slots 122 respectively populated with optical excitation cards 106 and corresponding detection cards 108.
  • the term “card” is meant to be a short form of the term “circuit card assembly” or “CCA.”
  • the main card 102 may comprise eight slots 122 respectively populated with four optical excitation cards 106 and four detection cards 108 (such as optical detection cards 108), for the purposes of taking four measurements independently.
  • one or more exciter-detector elements 124 in the modular sensor unit 100 may be defined by the pairing of at least one excitation card 106 and a corresponding detection card 108.
  • a microcontroller 110 may be provided to control the timing between optical excitation and detection.
  • Optical connections 112 for each pair of optical excitation and optical detection cards may be made with bifurcated optical bundles that deliver light from the optical excitation cards 106 to a sensor 126 with optical sensor material, and return the light to the optical detection card 108 (see, for example, FIG. 15).
  • an eight-slot main card 102 may be populated with four optical excitation LED cards 106, one optical detector SiPM card 108, two resistance temperature detector (RTD) cards 118, and one electrical conductivity (EC) card 116.
  • Optical connections 112 may preferably be made with quadfurcated optical fiber bundles that deliver light from each of the four optical excitation cards 106 to four individual sensors 126 with optically active sensor materials, and then returns all of the optical responses from all four sensors 126 to the shared optical detection card 108 (see, for example, FIG. 16). Electrical connections may be made to two RTD probes and one EC probe.
  • an eight-slot main card 102 may be populated with seven optical excitation LED cards 106 and one optical detector SiPM card 108.
  • the microcontroller 110 may be programed and configured to control the timing between optical excitation for each card.
  • Optical connections 112 may be made with octafurcated optical fiber bundles that deliver light from each of the seven optical excitation cards 106 to seven individual optically active sensor materials 126 and then return all of the optical responses from all seven sensors 126 to the shared optical detection card 108.
  • one or more optical excitation cards 106 may be comprised of a narrow band light emitting diode (LED), an active sweep out circuit for precise timing, an electrically erasable programmable read-only memory (EEPROM) for storing card configuration.
  • FIG. 17 shows the speed of an example such LED sweepout circuit is 5.7 ns.
  • the optical excitation card 106 may possess a receptacle 140 for the LED 128 that terminates in, for example, a SubMiniature version A (SMA) optical fiber connector.
  • the receptacle 140 may also contain an optical short-pass filter 138 and a spherical lens 130, as in FIG. 18.
  • FIGS. 19 and 20 show the improvements in optical efficiency which may be achieved with the ball lens 130.
  • a least one optical excitation card 106 is comprised of a wide-band LED for broad excitation of an optical sensor.
  • an optical excitation card 106 comprises a laser diode and corresponding laser diode.
  • the unit 100 may have 8 channels, up to 7 of which may be a light source, including an LED and/or a laser diode
  • an optical detection card 108 may be comprised of a silicon photomultiplier (SiPM) photodetector, required power circuitry, and EEPROM for storing card configuration with associated signal amplification circuitry. Moreover, the optical detection card 108 may contain an analog-to-digital converter (ADC) for measuring detector signals at defined intervals.
  • the optical detection card 108 may possess a receptacle 140 for the detector that terminates in an optical fiber SMA connector 132.
  • the receptacle 140 may also contain an optical long-pass or bandpass filter 138 and a spherical lens 130 for focusing light from the optical fiber 112 into the detector 108.
  • an optical detection card 108 comprises a photodetector 156, which may be an avalanche photodiode photodetector.
  • an optical detection card 106 may comprise photodetector 156 which is a photodiode photodetector (e.g., instead of an SiPM photodetector).
  • the optical excitation and or the optical detection cards may have electronic detection circuitries to detect if fiber optic connections have been made with the on-card SMA connectors 132.
  • the detection scheme provides safety controls to ensure optical interfaces are connected before activating excitation or exposing detectors to excess light.
  • the main card 102 contains a microcontroller 110, a multiplexer circuit, an EEPROM, power circuitry, real-time clock, and eight universal connectors to receive, four on the top of the main card and four on the bottom.
  • the main card may contain a mini-B universal serial bus (USB) connector, a mini secure digital (SD) card slot, and an external power connector.
  • USB universal serial bus
  • SD secure digital
  • one of the universal slots of the main card may be populated with an ethernet communications card that can receive power over ethernet (POE), and send data over ethernet connection.
  • POE power over ethernet
  • one of the universal slots of the main card 102 may be populated with a wireless communications card to communicate data wirelessly.
  • the optically active sensor material 126 may be luminescent with a sufficiently long luminescence lifetime to be accurately measured, and its luminescence intensity and or lifetime is dependent on at least one external variable.
  • the sensor material 126 may be optically excited by an optical excitation card 106. As shown in FIG. 21, the excitation may be in the form of a square wave.
  • the luminesce from the sensor material 126 may be delivered to an optical detection card 108.
  • Precisely timed measurements of the detected optical signal may be made with the ADC during excitation as a reference signal, immediately after excitation to measure the luminescence decay, and before the next excitation as a baseline.
  • the background signal may then be subtracted from the measurement signal (see, for example, FIGS. 22 and 23, wherein FIG. 23 illustrates post-subtraction).
  • the measurement may be independent of position of the sensor material to the end of the optical fiber interface.
  • the timing between measurements is as follows: the delay between LED turning off and the falling decay ADC measurement is 2000 ns, the delay between the falling measurement and the baseline is 38 ps, all three measurements are 1 ps.
  • the baseline measurement is subtracted from the on measurement and the decay measurement.
  • the ratio of these normalized measurements is the system response, is averaged over several measurements (see, for example, FIGS. 26 and 27), and can be calibrated to the variable of interest.
  • the drift in the sensor response is 0.000414 ratio units/day and would afford 113 days at 1 Hz and 2000 samples to drift 1%, as shown for example in FIG. 28.
  • the optically active sensor material 126 may be luminescent with a relatively short luminescence lifetime, and its luminescence intensity and or lifetime may preferably be dependent on at least one external variable, and may preferably be combined with a reference luminophore that has a sufficiently long luminescence lifetime to be accurately measured, and its luminescence intensity and or lifetime may not dependent on the variable of interest (see, for example, FIG. 29).
  • the timing between measurements may be as follows: the delay between LED turning off and the falling decay ADC measurement is 2000 ns, the delay between the falling measurement and the baseline is 38 ps, all three measurements are 1 ps. The baseline measurement is subtracted from the on measurement and the decay measurement. The ratio of these normalized measurements is the system response, is averaged over several measurements, and can be calibrated to the variable of interest.
  • the modular sensor unit 100 and its associated system 134 and method of operation, several measurements may be taken immediately after excitation during luminescence decay.
  • the measurements may be fit with an analytical expression to determine the luminescence lifetime of the sensor material.
  • the luminescence lifetime can be calibrated to the variable of interest.
  • the optically active sensor material 126 may be configured to absorb light at specific wavelengths and transmits light at different wavelengths.
  • the sensor material may be exposed to light of wavelengths that it both transmits and absorbs, and transmitted light is returned to two optical detectors, bifurcated, and with optical cutoff filters to allow absorbed wavelengths and transmitted wavelengths.
  • the ratio of optical intensities of absorbed and transmitted wavelengths is averaged over several measurements, and can be calibrated to the variable of interest (see, for example, FIG. 30).
  • the sensor response may be measured at several known states of the variable of interest. These measurements are used to construct a calibration table. A linear interpolation and extrapolation function is used to convert a sensor response to a calibrated value. [0090] In another embodiment of the modular sensor unit 100, and its associated system 134 and method of operation, the sensor response may be measured at several known states of the variable of interest, and an analytical expression is fit to the data. This expression is then used to convert sensor response to calibrated values.
  • the optically active sensor material 126 may be sensitive to the variable of interest and at least one additional variable, such as temperature.
  • the sensor response may be measured at several known states of the variable of interest and several known states of the variable(s) not of interest. These measurements are used to construct a multiparameter calibration table. A multidimensional linear interpolation and extrapolation function is used to convert sensor responses to calibrated values, as shown for example in FIGS. 31-33.
  • the sensor material’s optical response may be dependent on more than one variable.
  • the sensor response may be measured at several known states of the variable of interest and several known states of the variable(s) not of interest.
  • a multidimensional analytical expression is fit to the measured data. This expression is then used to convert sensor response to calibrated values.
  • optically active sensor materials and the modular sensor system can be used to detect the following, but not limited to pO2, pCO2, pH, K + , Na + lactate, ethanol, nitrate, and/or ammonia in aqueous media.
  • optically active sensor materials and the modular sensor system can be used to detect the following, but not limited to pO2, pCO2, water activity/relative humidity, ethanol, nitrate, and ammonia in gaseous/vaporous media.
  • the sensing material 126 may be contained within a low-cost cap 144, as show for example in FIGS. 9-11, which may be easily and quickly removed and replaced from the end of a probe body 146 of a sensor probe 142.
  • the sensor system 100 may be used for parameter determination in one or more of the following applications, but not limited to: wastewater monitoring, environmental water monitoring, environmental gas monitoring, down well monitoring, unmanned aerial vehicle mounted monitoring, , unmanned aquatic vehicle mounted monitoring, respiration gas monitoring, aquaculture monitoring, blood parameter monitoring, interstitial fluid monitoring, saliva parameter monitoring, concrete parameter monitoring, cement parameter monitoring, well packer monitoring, carbon capture and/or storage monitoring.
  • Certain preferred embodiments of the modular sensor unit 100 may comprise a base card with more than two universal connectors to accept peripheral cards including: a peripheral optical excitation card; a peripheral optical detection card, a peripheral electrical/electrochemical sensor card, and/or a peripheral communications card.
  • combinations or peripheral cards may, for example, be configured to create a custom sensor system.
  • the cards may be removable, replicable, and configurable with a plurality of additional cards for optical excitation, optical detection, electronic/electrochemical signals, or communications signals.
  • the measured optical response may be (a) optical luminesce and luminesce lifetime, and/or (b) optical absorbance and transmission.
  • sensor multiplexing may be achieved via: (a) optoelectronic peripheral cards and electronic multiplexing; or (b) Optically through furcated optical fiber bundles.
  • optical interfaces may be made through fiber optic cables, and connected to optoelectronic components via SMA receptacles and contain any or all of: optical long pass filter, optical short pass filter, optical band pass filter, and/or a spherical lens.
  • a modular sensor unit 100 may comprise, involve or incorporate a sensor unit with highly sensitive optical detectors and optical sensing methods that implement the defined time intervals for the integration of the optical response with sufficient precision.
  • embodiments of a modular sensor unit 100 and associated systems 13 may comprise, implement, or embody one or more of (a) a time-dependent output signal of the modulated electromagnetic radiation; (b) a measurement of the time-dependent signal for quantitative detection of an analyte in a sample; (c) optoelectronic unit with high resolution of the modulated electromagnetic radiation; (d) an optoelectronic unit with low physical volume less than 1000 cm3; (e) an optoelectronic unit with low weight less than 1000 g; (f) an optoelectronic unit with continuous power consumption less than 1 W; (g) an optoelectronic unit wherein the electromagnetic radiation source that is a light emitting diode; and/or (h) an optoelectronic unit wherein the electromagnetic radiation detection component is a silicon photomultiplier.
  • optical response may be calibrated: (a) with multi-dimensional linear interpolation and extrapolation of known variable states; and/or (b) with multi-dimensional analytical equation of known variable states.
  • the sensitive material 126 may be contained within a cap 144 that is easily removed and replaced from the end of a sensor probe 142
  • the optically sensitive material may be dependent on at least one of the following variables: Dissolved oxygen in an aqueous solution, dissolved carbon dioxide in an aqueous solution, protons/hydronium ions (pH) in an aqueous solution, nitrate ions in an aqueous solution, potassium ions in an aqueous solution, sodium ions in an aqueous solution, ammonia in an aqueous solution, gaseous oxygen, gaseous carbon dioxide, gaseous humidity, and/or gaseous ammonia.
  • a modular sensor unit 100 may be mounted (or mountable) on: an unmanned aerial vehicle, an unmanned terrestrial vehicle, and/or an unmanned aquatic vehicle
  • modular sensor unit i.e., modular unit, modular optoelectronic device, modular optoelectronic platform
  • base circuit card assembly i.e., main card, base card
  • module mounting station e.g., universal connector, module mounting location
  • optical excitation module (a type of sensor interface module; e.g., optical excitation card, peripheral optical excitation card, optical excitation LED card)
  • optical detection module (a type of sensor interface module; e g., detection card, optical sensor, electrical/electrochemical sensor, electrical conductivity (EC), resistance temperature detector (RTD))
  • processor i.e., microcontroller
  • optical interfaces e.g., optical connections, e.g., fiber optic cables, e.g., fiber optic bundles
  • conduction sensor module e.g., peripheral electrical/electrochemical sensor card, electrical conductivity (EC) card
  • temperature sensor module e.g., resistance temperature detector (RTD) card
  • exciter-detector element e.g., defined by an excitation card matched with a corresponding detector card
  • 126 sensor e.g., comprising an optical sensor material; e.g., sensor, sensor material patch or puck, optically active sensor material
  • optical fiber connector e.g., output signal connector, optical fiber SMA connector
  • optical fiber connector e.g., input signal connector, optical fiber SMA connector
  • optical filter e.g., short pass filter or band pass filter
  • photodetector e.g., SiPM, photodiode or avalanche photodiode photodetector

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

L'invention concerne un système de capteur modulaire comprenant un ensemble carte à circuits de base et de multiples modules d'interface de capteur. L'ensemble carte à circuits de base comprend un processeur, et une pluralité de stations de montage de module sur lesquelles les modules d'interface de capteur peuvent être montés amovibles de manière interchangeable. Le processeur est programmé pour détecter la présence et la concentration d'un ou de plusieurs analytes sélectionnés dans un milieu sur la base de données de capteur reçues en provenance des modules d'interface de capteur montés. Des modules d'interface de capteur peuvent être des modules d'excitation optique, des modules de détection optique, des modules de capteur électrochimique et des modules de capteur de température. Les modules optiques peuvent se terminer dans des connecteurs de fibres optiques permettant de communiquer de manière sélective avec des capteurs optiques respectifs au moyen d'un faisceau de fibres optiques. Le montage des modules d'interface de capteur sur l'ensemble carte à circuits de base définit de préférence une unité de capteur modulaire unitaire et structurellement rigide. Le processeur peut être programmé pour s'adapter à de multiples configurations de connexion optique pour la même configuration de module d'interface montée.
PCT/US2024/015644 2023-02-13 2024-02-13 Système de capteur modulaire électronique et optique, et procédés de détection associés Ceased WO2024173432A1 (fr)

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US63/445,275 2023-02-13

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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551841B1 (en) * 1992-05-01 2003-04-22 The Trustees Of The University Of Pennsylvania Device and method for the detection of an analyte utilizing mesoscale flow systems
US20040106211A1 (en) * 2000-02-18 2004-06-03 Trustees Of Tufts College Intelligent electro-optical sensor array and method for analyte detection
US6837095B2 (en) * 1999-03-03 2005-01-04 Smiths Detection - Pasadena, Inc. Apparatus, systems and methods for detecting and transmitting sensory data over a computer network
US20050113658A1 (en) * 2003-11-26 2005-05-26 Becton, Dickinson And Company Fiber optic device for sensing analytes and method of making same
US20060171845A1 (en) * 2005-01-31 2006-08-03 Dakota Technologies, Inc. Sensors for measuring analytes
US20100267049A1 (en) * 2009-04-15 2010-10-21 Rutter William J Diagnostic devices and related methods
US20100315644A1 (en) * 2009-04-07 2010-12-16 Nexus Dx, Inc. Hand-held scanner systems and methods for reading point of care test results
US20180177443A1 (en) * 2016-12-22 2018-06-28 Profusa, Inc. System and single-channel biosensor for and method of determining analyte value
US20210151182A1 (en) * 2007-06-21 2021-05-20 Abbott Diabetes Care Inc. Health Management Devices and Methods
US20220134338A1 (en) * 2020-10-30 2022-05-05 Cepheid Diagnostic assay system with replaceable processing modules and remote monitoring

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6551841B1 (en) * 1992-05-01 2003-04-22 The Trustees Of The University Of Pennsylvania Device and method for the detection of an analyte utilizing mesoscale flow systems
US6837095B2 (en) * 1999-03-03 2005-01-04 Smiths Detection - Pasadena, Inc. Apparatus, systems and methods for detecting and transmitting sensory data over a computer network
US20040106211A1 (en) * 2000-02-18 2004-06-03 Trustees Of Tufts College Intelligent electro-optical sensor array and method for analyte detection
US20050113658A1 (en) * 2003-11-26 2005-05-26 Becton, Dickinson And Company Fiber optic device for sensing analytes and method of making same
US20060171845A1 (en) * 2005-01-31 2006-08-03 Dakota Technologies, Inc. Sensors for measuring analytes
US20210151182A1 (en) * 2007-06-21 2021-05-20 Abbott Diabetes Care Inc. Health Management Devices and Methods
US20100315644A1 (en) * 2009-04-07 2010-12-16 Nexus Dx, Inc. Hand-held scanner systems and methods for reading point of care test results
US20100267049A1 (en) * 2009-04-15 2010-10-21 Rutter William J Diagnostic devices and related methods
US20180177443A1 (en) * 2016-12-22 2018-06-28 Profusa, Inc. System and single-channel biosensor for and method of determining analyte value
US20220134338A1 (en) * 2020-10-30 2022-05-05 Cepheid Diagnostic assay system with replaceable processing modules and remote monitoring

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