WO2024167363A1 - Semiconductor manufacturing silicone pad having pattern structure and method for manufacturing same - Google Patents
Semiconductor manufacturing silicone pad having pattern structure and method for manufacturing same Download PDFInfo
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- WO2024167363A1 WO2024167363A1 PCT/KR2024/001983 KR2024001983W WO2024167363A1 WO 2024167363 A1 WO2024167363 A1 WO 2024167363A1 KR 2024001983 W KR2024001983 W KR 2024001983W WO 2024167363 A1 WO2024167363 A1 WO 2024167363A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
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- the present invention relates to a silicon pad for semiconductor manufacturing having a pattern structure and a method for manufacturing the same, and more specifically, to a silicon pad for semiconductor manufacturing having a pattern structure capable of mounting electronic devices such as semiconductor chips by pressing them with excellent uniformity, and a method for manufacturing the same.
- the problem to be solved by the present invention is to provide a silicone resin pad having excellent uniformity and a method for manufacturing the same.
- the present invention provides a silicone resin pad having excellent uniformity, characterized in that a pattern is formed on the silicone pad.
- the pattern is rectangular and the length of the pattern is 0.20 to 0.21 mm.
- the width/height ratio of the pattern is 1.00 to 1.02, and the weight average molecular weight of the silicone pad is 20,000 to 70,000.
- the present invention also provides a method for manufacturing a silicone resin pad, comprising the steps of: injecting liquid silicone rubber (LSR) into a mold; and curing the injected liquid silicone rubber (LSR), wherein a corresponding pattern for obtaining the pattern is formed on a surface of the mold.
- LSR liquid silicone rubber
- the silicone pad according to the present invention has excellent uniformity when pressurized despite its large surface area through its pattern structure.
- FIG. 1 is a pattern photograph of a pad (example) according to one embodiment of the present invention
- FIG. 2 is a pattern photograph of a pad (comparative example 1) having different patterns in shape and number.
- Figure 3 is a table that organizes the dimensions of the patterns of the silicone pads of Figures 1 and 2 and the number of patterns per unit length in width and height.
- Figures 4 and 5 show the results of a pressure test according to Example 1 and Comparative Example 1.
- Figure 6 shows the results of measuring the uniformity of the silicone pads of Example 1 and Comparative Examples 2, 3, and 4, respectively, at a force of 9 kgf/cm2.
- Figure 7 is a step diagram of a method for manufacturing a silicone pad according to one embodiment of the present invention.
- a silicone pad according to one embodiment of the present invention provides a pad that prevents over-compression in a specific area when pressurized through a predetermined pattern and also discharges air bubbles and the like to the outside to obtain excellent uniformity.
- the predetermined pattern has a square shape, but its shape can be freely changed through a mold as described below.
- pattern means a curved structure having a certain repeatability and in which negative and positive patterns are formed on a surface.
- Fig. 1 is a pattern photograph of a pad (Example) according to one embodiment of the present invention
- Fig. 2 is a pattern photograph of a pad (Comparative Example 1) having different shapes and numbers of patterns
- Fig. 3 is a table that organizes the dimensions of the patterns of the silicone pads of Figs. 1 and 2 and the number of patterns per horizontal/vertical length per unit length.
- the square pattern has a uniform length-width ratio compared to Comparative Example 1, and is relatively smaller than Comparative Example 1.
- Figures 4 and 5 show the results of a pressure test according to Example 1 and Comparative Example 1.
- the silicone pad according to the present invention can prevent over-compression in a specific area when pressurized through a predetermined pattern, and can also discharge bubbles and the like to the outside to obtain excellent uniformity.
- the pattern is larger than 0.21 mm or has a difference in the width/height ratio, it can be seen that there is a problem in discharging bubbles and the like to the outside when pressurizing.
- the mold pattern can be transferred to the pad.
- the pad pattern can be obtained by bonding the mold itself or a separate layer having such a pattern shape to the mold.
- the present invention further focuses on the fact that the combination of the radius of curvature and molecular weight significantly affects the pressure uniformity of a large-area silicone pad.
- liquid silicone rubber (LSR) was cured at a temperature of 100 degrees Celsius to a size of 100 x 100 cm and a thickness of 20 mm based on the above embodiment.
- LSR liquid silicone rubber
- HCR High Constency Rubber, Shin-Etsu, Japan
- a commercialized silicone rubber resin was manufactured in the same pattern as Example 1.
- Example Comparative Example 2 Comparative Example 3 Comparative Example 4 Average molecular weight 1540 1520 1660 1341 Weight average molecular weight 51030 9123 1056 10490-
- Fig. 6 is the result of measuring the uniformity of the silicone pads of Example 1 and Comparative Examples 2, 3, and 4 with a force of 9 kgf/cm2. Referring to Fig. 6, it can be seen that even with the same pattern, the uniformity is greatly affected by the molecular weight, especially the weight average molecular weight.
- the weight average molecular weight rather than the number average molecular weight, is 20,000 to 70,000, more preferably 40,000 to 60,000, it affects the uniformity when pressurizing a large area (at least 50 cm) of the silicone pad.
- Figure 7 is a step diagram of a method for manufacturing a silicone pad according to one embodiment of the present invention.
- a method for manufacturing a silicone resin pad includes: a step of injecting liquid silicone rubber (LSR) into a mold; and a step of curing the injected liquid silicone rubber (LSR). At this time, a corresponding pattern for obtaining the above-described pattern is formed on the surface of the mold.
- LSR liquid silicone rubber
- the silicon pad according to the present invention can be used in a semiconductor packaging process, and therefore has industrial applicability.
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- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
본 발명은 패턴 구조를 갖는 반도체 제조용 실리콘 패드 및 그 제조방법에 관한 것으로, 보다 상세하게는 반도체 칩과 같은 전자소자 가압시 우수한 균일도로 가압하여 실장할 수 있는 패턴 구조를 갖는 반도체 제조용 실리콘 패드 및 그 제조방법에 관한 것이다. The present invention relates to a silicon pad for semiconductor manufacturing having a pattern structure and a method for manufacturing the same, and more specifically, to a silicon pad for semiconductor manufacturing having a pattern structure capable of mounting electronic devices such as semiconductor chips by pressing them with excellent uniformity, and a method for manufacturing the same.
반도체 선폭의 미세화에 따라 다양한 패키징 기술이 개발되고 있다. 하지만, 이러한 패키징 공정에서 칩을 복수층으로 적층하는 기술은 필수적이며, 이때 실리콘 수지 등과 같은 러버계열의 패드가 사용된다. As semiconductor line widths become smaller, various packaging technologies are being developed. However, in these packaging processes, technology for stacking chips in multiple layers is essential, and at this time, rubber-based pads such as silicone resin are used.
하지만, 이러한 실리콘 러버 패드는 대면적화됨에 따라 가압시 칩 등의 전자소자 실장을 위한 가압시, 전체 면적간 균일도가 떨어지는 문제가 있다. 따라서, 이러한 문제를 해결할 수 있는 새로운 실리콘 러버 패드의 개발이 필요하다. However, as these silicone rubber pads become larger in area, there is a problem that the uniformity across the entire area decreases when pressurized for mounting electronic components such as chips. Therefore, it is necessary to develop a new silicone rubber pad that can solve this problem.
따라서, 본 발명이 해결하고자 하는 과제는 우수한 균일도를 갖는 실리콘 수지 패드 및 그 제조방법을 제공하는 것이다. Therefore, the problem to be solved by the present invention is to provide a silicone resin pad having excellent uniformity and a method for manufacturing the same.
싱기 과제를 해결하기 위하여, 본 발명은 우수한 균일도를 갖는 실리콘 수지 패드로서, 상기 실리콘 패드에는 패턴이 형성된 것을 특징으로 하는 실리콘 수지 패드가 제공된다. In order to solve the above problem, the present invention provides a silicone resin pad having excellent uniformity, characterized in that a pattern is formed on the silicone pad.
본 발명의 일 실시예에서, 상기 패턴은 사각형이며, 상기 패턴의 길이는 0.20 내지 0.21mm이다. In one embodiment of the present invention, the pattern is rectangular and the length of the pattern is 0.20 to 0.21 mm.
또한, 상기 패턴의 가로/세로 길이 비율은 1.00 내지 1.02이며, 상기 실리콘 패드의 중량평균분자량은 20,000 내지 70,000이다. Additionally, the width/height ratio of the pattern is 1.00 to 1.02, and the weight average molecular weight of the silicone pad is 20,000 to 70,000.
본 발명은 또한 상술한 실리콘 수지 패드 제조방법으로, 액상 실리콘 러버(LSR)을 금형 내 주입하는 단계; 및 상기 주입된 액상 실리콘 러버(LSR)를 경화시키는 단계를 포함하는 실리콘 수지 패드 제조방법을 제공하며, 상기 금형 표면에는 상기 패턴을 얻기 위한 대응 패턴이 형성된다. The present invention also provides a method for manufacturing a silicone resin pad, comprising the steps of: injecting liquid silicone rubber (LSR) into a mold; and curing the injected liquid silicone rubber (LSR), wherein a corresponding pattern for obtaining the pattern is formed on a surface of the mold.
본 발명에 따른 실리콘 패드는 패턴 구조를 통하여 대면적에도 불구하고 가압시 매우 우수한 균일도를 갖는다.The silicone pad according to the present invention has excellent uniformity when pressurized despite its large surface area through its pattern structure.
도 1은 본 발명의 일 실시예에 따른 패드(실시예)의 패턴 사진이고, 도 2는 패턴의 형상 및 갯수를 달리한 패드(비교예 1)의 패턴 사진이다. FIG. 1 is a pattern photograph of a pad (example) according to one embodiment of the present invention, and FIG. 2 is a pattern photograph of a pad (comparative example 1) having different patterns in shape and number.
도 3은 도 1 및 2의 실리콘 패드의 패턴의 치수 및 단위 길이당의 가로/세로 길이별 패턴 갯수를 정리한 표이다.Figure 3 is a table that organizes the dimensions of the patterns of the silicone pads of Figures 1 and 2 and the number of patterns per unit length in width and height.
도 4 및 5는 실시예와 비교예 1에 따른 가압 테스트 결과이다. Figures 4 and 5 show the results of a pressure test according to Example 1 and Comparative Example 1.
도 6은 각각 실시예 1과 비교예 2, 3, 4의 실리콘 패드를 9kgf/cm2의 힘으로 측정한 패드의 균일도 측정결과이다. Figure 6 shows the results of measuring the uniformity of the silicone pads of Example 1 and Comparative Examples 2, 3, and 4, respectively, at a force of 9 kgf/cm2.
도 7은 본 발명의 일 실시예에 따른 실리콘 패드 제조방법의 단계도이다. Figure 7 is a step diagram of a method for manufacturing a silicone pad according to one embodiment of the present invention.
이하, 첨부한 도면을 참고로 하여 본 발명의 바람직한 실시예에 대하여 상세히 설명하면 다음과 같다.Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.
본 발명을 상세하게 설명하기 전에, 본 명세서에서 사용된 용어나 단어는 통상적이거나 사전적인 의미로 무조건 한정하여 해석되어서는 아니되며, 본 발명의 발명자가 자신의 발명을 가장 최선의 방법으로 설명하기 위해서 각종 용어의 개념을 적절하게 정의하여 사용할 수 있다.Before describing the present invention in detail, it should be noted that the terms or words used in this specification should not be interpreted as being unconditionally limited to their usual or dictionary meanings, and the inventor of the present invention may appropriately define and use the concepts of various terms in order to describe his or her invention in the best possible manner.
더 나아가 이들 용어나 단어는 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야 함을 알아야 한다.Furthermore, it should be noted that these terms and words should be interpreted with meanings and concepts consistent with the technical idea of the present invention.
즉, 본 명세서에서 사용된 용어는 본 발명의 바람직한 실시예를 설명하기 위해서 사용되는 것일 뿐이고, 본 발명의 내용을 구체적으로 한정하려는 의도로 사용된 것이 아니다.That is, the terms used in this specification are only used to describe preferred embodiments of the present invention, and are not intended to specifically limit the contents of the present invention.
이들 용어는 본 발명의 여러 가지 가능성을 고려하여 정의된 용어임을 알아야 한다.It should be noted that these terms are defined taking into account the various possibilities of the present invention.
또한, 본 명세서에 있어서, 단수의 표현은 문맥상 명확하게 다른 의미로 지시하지 않는 이상, 복수의 표현을 포함할 수 있다.Additionally, in this specification, a singular expression may include a plural expression unless the context clearly indicates a different meaning.
또한, 유사하게 복수로 표현되어 있다고 하더라도 단수의 의미를 포함할 수 있음을 알아야 한다.Also, it should be noted that even if similarly expressed in plural, it can contain singular meaning.
본 명세서의 전체에 걸쳐서 어떤 구성 요소가 다른 구성 요소를 "포함"한다고 기재하는 경우에는, 특별히 반대되는 의미의 기재가 없는 한 임의의 다른 구성 요소를 제외하는 것이 아니라 임의의 다른 구성 요소를 더 포함할 수도 있다는 것을 의미할 수 있다.Throughout this specification, whenever a component is described as "including" another component, this may mean that the component may further include any other component, rather than excluding any other component, unless otherwise specifically stated.
본 발명의 일 실시예에 따른 실리콘 패드는 소정 패턴을 통하여 가압시 특정 영역에서의 과압축을 방지하고, 또한 기포 등을 외부로 배출시켜 우수한 균일도를 얻을 수 있는 패드를 제공한다. 본 발명의 일 실시예에서 상기 소정 패턴은 사각 형상이나, 하기 설명되는 금형을 통하여 자유로이 그 형상을 변경할 수 있다.A silicone pad according to one embodiment of the present invention provides a pad that prevents over-compression in a specific area when pressurized through a predetermined pattern and also discharges air bubbles and the like to the outside to obtain excellent uniformity. In one embodiment of the present invention, the predetermined pattern has a square shape, but its shape can be freely changed through a mold as described below.
본 명세서에서 "패턴"은 일정한 반복성을 가지며, 음각-양각이 표면에 형성된 굴곡구조를 의미한다. In this specification, “pattern” means a curved structure having a certain repeatability and in which negative and positive patterns are formed on a surface.
도 1은 본 발명의 일 실시예에 따른 패드(실시예)의 패턴 사진이고, 도 2는 패턴의 형상 및 갯수를 달리한 패드(비교예 1)의 패턴 사진이다. 또한 도 3은 도 1 및 2의 실리콘 패드의 패턴의 치수 및 단위 길이당의 가로/세로 길이별 패턴 갯수를 정리한 표이다.Fig. 1 is a pattern photograph of a pad (Example) according to one embodiment of the present invention, and Fig. 2 is a pattern photograph of a pad (Comparative Example 1) having different shapes and numbers of patterns. In addition, Fig. 3 is a table that organizes the dimensions of the patterns of the silicone pads of Figs. 1 and 2 and the number of patterns per horizontal/vertical length per unit length.
상기 결과를 참조하면, 본 발명의 경우 사각 패턴이 비교예 1에 비하여 가로 세로의 비가 균일하고, 상대적으로 비교예 1보다 작은 것을 알 수 있다. Referring to the above results, it can be seen that in the case of the present invention, the square pattern has a uniform length-width ratio compared to Comparative Example 1, and is relatively smaller than Comparative Example 1.
특히 가로와 세로의 비율(C=A/B)가 1.01 수준인 본 발명은 C가 0.98 수준인 비교예 1과 비교하여 볼 때, 가로/세로 비율에서 크게 차이가 있는 것을 알 수 있다. 따라서, 패턴의 가로와 세로의 비율(C)는 1.00 내지 1.02가 바람직하다. In particular, the present invention, in which the width-to-height ratio (C=A/B) is at the level of 1.01, can be seen to have a large difference in the width-to-height ratio when compared to Comparative Example 1, in which C is at the level of 0.98. Therefore, the width-to-height ratio (C) of the pattern is preferably 1.00 to 1.02.
도 4 및 5는 실시예와 비교예 1에 따른 가압 테스트 결과이다. Figures 4 and 5 show the results of a pressure test according to Example 1 and Comparative Example 1.
도 4 및 5를 참조하면, 본 발명에 따른 실리콘 패드는 소정 패턴을 통하여 가압시 특정 영역에서의 과압축을 방지하고, 또한 기포 등을 외부로 배출시켜 우수한 균일도을 얻을 수 있음을 확인할 수 있다. 특히 패턴이 0.21mm 이상으로 크거나, 그 가로/세로 비율이 차이가 있는 경우, 가압시 기포 등을 외부로 배출시키는 데 있어서 문제가 있는 것을 알 수 있다. Referring to FIGS. 4 and 5, it can be confirmed that the silicone pad according to the present invention can prevent over-compression in a specific area when pressurized through a predetermined pattern, and can also discharge bubbles and the like to the outside to obtain excellent uniformity. In particular, when the pattern is larger than 0.21 mm or has a difference in the width/height ratio, it can be seen that there is a problem in discharging bubbles and the like to the outside when pressurizing.
본 발명에 따른 상기 패턴의 사출 방식으로 제조되는 패드 공정 중 금형에 이러한 패턴을 형성시킴으로써 상기 금형 패턴을 패드에 전사시킬 수 있다. 이 경우 금형 자체 또는 금형에 이러한 패턴 형상을 갖는 별도 층을 접합시켜 패드 패턴을 얻을 수 있다. By forming such a pattern in a mold during a pad process manufactured by the injection molding method according to the present invention, the mold pattern can be transferred to the pad. In this case, the pad pattern can be obtained by bonding the mold itself or a separate layer having such a pattern shape to the mold.
본 발명은 더 나아가 이러한 곡률반경과 분자량의 조합이 대면적 실리콘 패드의 압력균일도에 크게 영향을 주는 점에 주목하였다. The present invention further focuses on the fact that the combination of the radius of curvature and molecular weight significantly affects the pressure uniformity of a large-area silicone pad.
본 발명의 일 실시예에서, 상기 실시예를 기준으로 액상 실리콘 러버(LSR)을 섭씨 100도의 온도로 100 x 100cm 크기와 20mm의 두께로 경화시켰다. 비교예로서 상용화된 실리콘 러버 수지인 HCR(High Constency Rubber, 일본 신에츠사)을 실시예 1과 동일 패턴으로 제조하였다. In one embodiment of the present invention, liquid silicone rubber (LSR) was cured at a temperature of 100 degrees Celsius to a size of 100 x 100 cm and a thickness of 20 mm based on the above embodiment. As a comparative example, HCR (High Constency Rubber, Shin-Etsu, Japan), a commercialized silicone rubber resin, was manufactured in the same pattern as Example 1.
하기 표 1은 분자량 측정 결과이다.Table 1 below shows the molecular weight measurement results.
상기 분자량 측정은 GPC에 의한 방법으로, baseline이 0 에 근접한 부분 혹은 최저점을 끝점으로 설정하여 분자량 및 분포를 계산한 결과이다. 상기 결과를 참조하면, 특히 실시예와 비교예들간 수평균분자량에서 큰 차이가 있는 것을 알 수 있다.도 6은 각각 실시예 1과 비교예 2, 3, 4의 실리콘 패드를 9kgf/cm2의 힘으로 측정한 패드의 균일도 측정결과이다. 도 6을 참조하면, 동일 패턴이어도 분자량, 특히 중량평군 분자량에 의하여 균일도가 크게 영향을 받는 것을 알 수 있다. The above molecular weight measurement is a method by GPC, and the molecular weight and distribution are calculated by setting the baseline close to 0 or the lowest point as the end point. Referring to the above results, it can be seen that there is a large difference in the number average molecular weight especially between the examples and comparative examples. Fig. 6 is the result of measuring the uniformity of the silicone pads of Example 1 and Comparative Examples 2, 3, and 4 with a force of 9 kgf/cm2. Referring to Fig. 6, it can be seen that even with the same pattern, the uniformity is greatly affected by the molecular weight, especially the weight average molecular weight.
분자량 측면에서 수평균분자량이 아닌 중량평균 분자량이 20,000 내지 70,000, 보다 바람직하게는 40,000 내지 60,000을 갖는 경우, 실리콘 패드의 대면적(최소 50cm 이상) 가압시 균일도에 영향을 주는 점에 주목할만하다.It is noteworthy that when the weight average molecular weight, rather than the number average molecular weight, is 20,000 to 70,000, more preferably 40,000 to 60,000, it affects the uniformity when pressurizing a large area (at least 50 cm) of the silicone pad.
도 7은 본 발명의 일 실시예에 따른 실리콘 패드 제조방법의 단계도이다. Figure 7 is a step diagram of a method for manufacturing a silicone pad according to one embodiment of the present invention.
도 7을 참조하면, 본 발명의 일 실시예에 따른 실리콘 수지 패드 제조방법은. 액상 실리콘 러버(LSR)을 금형 내 주입하는 단계; 및 상기 주입된 액상 실리콘 러버(LSR)를 경화시키는 단계를 포함한다. 이때, 상기 금형 표면에는 상기 상술한 패턴을 얻기 위한 대응 패턴이 형성되어 있다. Referring to FIG. 7, a method for manufacturing a silicone resin pad according to one embodiment of the present invention includes: a step of injecting liquid silicone rubber (LSR) into a mold; and a step of curing the injected liquid silicone rubber (LSR). At this time, a corresponding pattern for obtaining the above-described pattern is formed on the surface of the mold.
본 발명에 따른 실리콘 패드는 반도체 패키징 공정시 사용될 수 있으므로, 산업상 이용가능성이 있다. The silicon pad according to the present invention can be used in a semiconductor packaging process, and therefore has industrial applicability.
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| KR10-2023-0017166 | 2023-02-09 | ||
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| KR10-2023-0017164 | 2023-02-09 | ||
| KR10-2024-0020131 | 2024-02-13 | ||
| KR1020240020131A KR20240124828A (en) | 2023-02-09 | 2024-02-13 | Silicone rubber pad with excellent uniformity and manufacturing method thereof |
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| KR19980067082A (en) * | 1997-01-31 | 1998-10-15 | 이대원 | Plating prevention silicon pad manufacturing equipment used for lead frame plating |
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| KR20160051623A (en) * | 2014-10-30 | 2016-05-11 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone resin, resin composition, resin film, semiconductor device, and making method |
| KR101797191B1 (en) * | 2017-05-16 | 2017-11-13 | 윤동열 | Surface modified silicone rubber stamp bladder for mount pressing of semiconductor wafer and the method of manufacturing the same |
| KR101859000B1 (en) * | 2017-01-09 | 2018-05-17 | 정상희 | Manufacture Method of OLED Bonding Silicone Sheet and OLED Bonding Silicone Sheet Manufactured by using the Same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980067082A (en) * | 1997-01-31 | 1998-10-15 | 이대원 | Plating prevention silicon pad manufacturing equipment used for lead frame plating |
| KR101006913B1 (en) * | 2010-04-27 | 2011-01-13 | 주식회사 우전앤한단 | Molding method of fine silicon protrusion using liquid silicone rubber |
| KR20160051623A (en) * | 2014-10-30 | 2016-05-11 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Silicone resin, resin composition, resin film, semiconductor device, and making method |
| KR101859000B1 (en) * | 2017-01-09 | 2018-05-17 | 정상희 | Manufacture Method of OLED Bonding Silicone Sheet and OLED Bonding Silicone Sheet Manufactured by using the Same |
| KR101797191B1 (en) * | 2017-05-16 | 2017-11-13 | 윤동열 | Surface modified silicone rubber stamp bladder for mount pressing of semiconductor wafer and the method of manufacturing the same |
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