WO2024161490A1 - Laser machining device, laser machining method, and program - Google Patents
Laser machining device, laser machining method, and program Download PDFInfo
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- WO2024161490A1 WO2024161490A1 PCT/JP2023/002995 JP2023002995W WO2024161490A1 WO 2024161490 A1 WO2024161490 A1 WO 2024161490A1 JP 2023002995 W JP2023002995 W JP 2023002995W WO 2024161490 A1 WO2024161490 A1 WO 2024161490A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
Definitions
- the present invention relates to a laser processing device that performs processing using a laser.
- Patent Document 1 a technology has been proposed in which a cylindrical irradiation area extending in the direction of the laser's optical axis is displaced in a direction intersecting the optical axis to form a machined surface on the surface side of the workpiece through which the irradiation area passes.
- This processing method is superior to mechanical processing methods in that it reduces mechanical damage and forms a smooth machined surface.
- This type of processing method is also used in applications such as regenerating corners in workpieces that have corners formed by two adjacent end faces, such as cutting tools that have corners formed by the rake face and flank face.
- a laser is irradiated so that the optical axis extends along the direction in which the rake face or flank face widens, and a new rake face or flank face can be formed at the corner by displacing the laser.
- a ball end mill is used to cut a truncated cone around its axis at a certain angle, forming a corner between the truncated cone surface and the base. At this corner, one of the surfaces (the relief surface) forms a complex curved shape that follows the truncated cone surface.
- the present disclosure has been made to solve these problems, and its purpose is to make it possible to perform laser processing even on surfaces with complex curved shapes while minimizing the complexity of the device configuration and control.
- the first aspect of the present invention comprises a light guiding section that guides a laser irradiated from a light source to a processing surface of a workpiece, a light path displacement section that displaces the light path of the laser guided to the light guiding section about the axis of a virtual cone whose optical axis serves as a generating line and whose apex is a position on the optical axis that overlaps with the processing surface, and a control section that controls the displacement by the object displacement section that displaces the workpiece along an object plane that intersects with the axis of the virtual cone, and in the case where a cone frustum surface having a shape obtained by cutting a virtual truncated cone whose bottom surface extends along the object plane by a predetermined angle range about its axis, the control section displaces the virtual truncated cone surface from an object start position on the object plane where one end of an object arc formed by the processing surface around the bottom surface of the virtual t
- control unit causes the optical path displacement unit to displace the optical path of the laser such that a position on the optical axis that overlaps with a boundary ridge between a truncated cone surface and a top surface of the virtual truncated cone becomes the apex of the virtual cone.
- the light guiding unit includes a pair of wedge plates arranged coaxially with the axis of a cylindrical region through which a laser irradiated from a light source passes and spaced apart in the axial direction, a lens arranged coaxially with the axis of the cylindrical region downstream of the wedge plates in the optical path of the laser and refracting the laser after passing through the wedge plate toward the processing surface, and a rotation mechanism rotating the wedge plate around the axis of the cylindrical region to scan the laser after passing through the wedge plate in a circumferential direction, and the optical path displacement unit displaces the optical path of the laser guided to the light guiding unit along the conical surface of the virtual cone by rotating the wedge plate with the rotation mechanism.
- the optical path of the laser is displaced along the conical surface of the imaginary cone, while the workpiece is displaced along the circumference of the imaginary circle.
- the laser is relatively displaced around the axis on the frustum surface of the imaginary frustum of the cone in the workpiece, while being aligned with the generatrix of the imaginary frustum of the cone, so that a machined surface that follows the frustum surface of the imaginary frustum is formed on the workpiece.
- the end face of a complex curved shape such as a frustum surface of a cone can be formed as the machined surface.
- the relative displacement of the laser with respect to the workpiece can be achieved by two-axis control of the optical path displacement section and the object displacement section, so even when the workpiece surface has a complex curved shape, laser processing can be achieved without requiring more multi-axis and complex control.
- FIG. 1 is a block diagram showing a configuration of a laser processing apparatus according to an embodiment of the present disclosure.
- FIG. 1 is a front view showing a tip shape of an object to be processed in an embodiment of the present disclosure
- FIG. 1 is a cross-sectional view showing a configuration of a light guide unit according to an embodiment of the present disclosure
- 1A and 1B are a front view and a right side view, respectively, illustrating a state in which an object to be processed and a laser optical path are displaced in an embodiment of the present disclosure
- FIG. 1 is a front view illustrating a state in which the optical path of the laser and the workpiece are displaced in an embodiment of the present disclosure;
- the laser processing device 1 includes a light source 10 that outputs a laser, a holding unit 20 that holds the workpiece 100, a light guiding unit 30 that guides the laser irradiated from the light source 10 to the processing surface 111 of the workpiece 100, an optical path displacement unit 40 that displaces the optical path of the laser guided to the light guiding unit 30, an object displacement unit 50 that displaces the workpiece 100, and a control unit 60 that controls the operation of the entire laser processing device 1.
- the workpiece 100 is a ball end mill with multiple corners 110 formed on the tip side (the lower end side in this embodiment) of a rod-like member, as shown in Figure 2.
- Each corner 110 is a blade made up of a truncated cone surface and a bottom surface in a shape obtained by cutting a virtual truncated cone around the axis by a predetermined angle range (specifically, a range of 90 degrees), and one surface (the relief surface) has a curved shape that follows the truncated cone surface.
- the light source 10 is equipped with a laser oscillator that outputs a pulsed laser, a vibration regulator that adjusts the order of the laser's vibration frequency, an attenuator that adjusts the laser output, a beam expander that adjusts the diameter of the laser, and other components, and is configured so that the laser that has passed through these components is output via an optical lens.
- a laser oscillator that outputs a pulsed laser
- a vibration regulator that adjusts the order of the laser's vibration frequency
- an attenuator that adjusts the laser output
- a beam expander that adjusts the diameter of the laser
- other components and is configured so that the laser that has passed through these components is output via an optical lens.
- an Nd:YAG pulsed laser is used for the laser oscillator.
- the holding part 20 holds the workpiece 100 with its tip positioned downward and the other surface (scooping surface) at the corner oriented along the target plane described below.
- the light guide 30 includes a cylindrical main body 31 that surrounds a cylindrical region through which the laser irradiated from the light source 10 passes, a pair of wedge plates 35 and 37 that are arranged coaxially with the axis 33 of the main body 31 within the cylindrical region and spaced apart in the direction of the axis 33, and a lens 39 that is arranged further downstream in the optical path than the wedge plate 37 on the downstream side of the optical path.
- the wedge plates 35 and 37 are configured so that the wedge plate 37 on the downstream side of the optical path can be displaced to any position along the axis 33 (see the arrow in the figure), and this allows the spacing between the pair of wedge plates 35 and 37 to be changed as desired.
- the wider the spacing between the pair of wedge plates 35 and 37 the farther radially from the axis 33 the position where the laser passes through becomes.
- the lens 39 is an optical lens that is arranged coaxially with the axis 33 of the main body 31 and refracts the laser that has passed through the wedge plates 35 and 37 toward the processing surface 111 of the workpiece 100.
- the optical path displacement unit 40 is an actuator that rotates the main body unit 31 around the axis 33 upon receiving a command from the control unit 60, and in conjunction with this rotation, it rotates the wedge plates 35 and 37 arranged within the main body unit 31 around the axis 33.
- rotating the wedge plates 35, 37 means that the laser that has passed through the wedge plates 35, 37 is scanned in the circumferential direction on a plane that intersects with the optical axis. In this way, the laser that has passed through the wedge plates 35, 37 passes further through the lens 39, where it is refracted at an angle that corresponds to the radial position relative to the axis 33 of the optical axis.
- the laser is displaced around its axis 230 along the conical surface 220 of a virtual cone 200 whose generating line is the optical axis and whose apex 210 is a position on the optical axis where it overlaps with the processing surface 111 (see arrow a in the same figure).
- the object displacement unit 50 is an actuator that displaces the holding unit 20 along an object plane (see FIG. 4(a)) perpendicular to the axis 230 of the virtual cone 200, and displaces the workpiece 100 held by the holding unit 20.
- one surface (flank) forming a corner 110 of the workpiece 100 i.e., a curved shape that follows the frustum surface of the imaginary frustum of a cone, is formed as the machining surface 111.
- the workpiece 100 is positioned at the target start position 100s (s110).
- the target start position 100s is a position on the target plane that intersects with the axis 230 of the virtual cone 200, where one end 113 of the target arc that the processing surface 111 forms around the bottom surface of the virtual truncated cone is the apex 210 of the virtual cone 200.
- the position where the optical axis of the laser overlaps with the boundary ridge between the truncated cone surface and the top surface of the virtual truncated cone is set as the apex 210 of the virtual cone 200 (see FIG. 3(b)), and subsequent processing is performed based on this setting.
- object control to displace the workpiece 100 and optical path control to displace the optical path of the laser are started simultaneously (s120).
- the target control is a control for displacing the workpiece 100 from the target start position 100s until it reaches the target end position 100e, and is performed by a command to the target displacement unit 50.
- the target end position 100e is the position on the target plane where the other end 115 of the target arc overlaps with the apex 210 of the virtual cone 200.
- the target displacement unit 50 is controlled so that the target start position 100s and the target end position 100e are displaced at a predetermined target angular velocity along the circumference of a virtual circle 120 that is drawn with the same radius as the target arc and centered on the apex 210 of the virtual cone 200 (see arrow b in the figure).
- optical path control is a control for displacing the optical path of the laser from the optical path start position 300s until it reaches the optical path end position 300e, and is performed by a command to the optical path displacement unit 40.
- the optical path start position 300s is a position where the optical axis of the laser is along the extension direction of the line segment connecting the center 117 of the target arc at the target start position 100s and the apex 210 of the virtual cone 200, as shown in FIG. 6.
- the optical path end position 300e is a position where the optical axis of the laser is along the extension direction of the line segment connecting the center 117 of the target arc at the target end position 100e and the apex 210 of the virtual cone 200.
- the optical path displacement unit 40 is controlled so that the optical path is displaced around the axis 230 of the virtual cone 200 at the same optical path angular velocity as the target angular velocity between the optical path start position 300s and the optical path end position 300e.
- the system waits until these controls are completed (s130: NO), and when they are completed (s130: YES), the processing process ends.
- the processing surface 111 is formed on the workpiece 100 by the laser.
- the light guide unit 30 is configured by a pair of wedge plates 35, 37 and a lens 39.
- the light guide unit 30 is not limited to the above configuration as long as it can displace the optical path of the laser around the axis 230 along the conical surface 220 of the virtual cone 200.
- the laser processing device 1 is equipped with each of the components, but the laser processing device 1 may also be realized by, for example, mounting the light source 10, the light guide unit 30, and the control unit 60 (or a program for causing the control unit of the machine tool to execute the processing) on a general-purpose machine tool equipped with the holding unit 20 and actuators corresponding to the light path displacement unit 40 and the target displacement unit 50.
- the position where the optical axis of the laser overlaps with the boundary ridge between the truncated cone surface and the top surface of the virtual truncated cone is set as the apex 210 of the virtual cone 200.
- the apex 210 of the virtual cone 200 may be set at another position (for example, the upstream end of the optical path) in the range from the upstream end of the optical path to the downstream end of the optical path on the processing surface 111.
- the optical path of the laser is displaced along the conical surface 220 of the virtual cone 200, while displacing the workpiece 100 along the circumference of the virtual circle 120.
- the laser is relatively displaced around the axis on the frustum surface of the virtual frustum of the workpiece 100 while being aligned along the generatrix of the virtual frustum of the cone, so that a processing surface 111 along the frustum surface of the virtual frustum of the cone is formed on the workpiece 100.
- an end face of a complex curved shape such as a frustum surface of a cone can be formed as the processing surface 111.
- the relative displacement of the laser with respect to the workpiece 100 can be achieved by two-axis control of the optical path displacement unit 40 and the object displacement unit 50, so even if the workpiece surface 111 has a complex curved shape, laser processing can be achieved without requiring further multi-axis control.
- the laser after passing through the wedge plates 35, 37 is refracted by the lens 39 toward the processing surface 111, so that the laser from the light source 10 can be scanned in the circumferential direction by rotating the wedge plates 35, 37, thereby displacing the optical path of the laser around the axis 230 along the conical surface 220 of the virtual cone 200.
- the laser processing device 1 is realized by mounting the light source 10, the light guide unit 30, and the control unit 60 on a general-purpose machine tool, the laser processing device 1 of the above embodiment can be realized at low cost by simply mounting some of the components on the general-purpose machine tool.
- the laser processing device disclosed herein can perform laser processing even on surfaces with complex curved shapes while minimizing the complexity of the device configuration and control.
- 1...laser processing device 10...light source, 20...holding section, 30...light guide section, 31...main body section, 33...axis, 35...wedge plate, 37...wedge plate, 39...lens, 40...light path displacement section, 50...target displacement section, 60...control section, 61...built-in memory, 100...processing target, 100e...target end position, 100s...target start position, 110...corner, 111...processing surface, 113...one end, 115...other end, 117...center, 120...virtual circle, 200...virtual cone, 210...apex, 220...cone surface, 230...axis, 300e...light path end position, 300s...light path start position.
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Abstract
Description
本発明は、レーザによる加工を行うレーザ加工装置に関する。 The present invention relates to a laser processing device that performs processing using a laser.
近年、レーザの光軸方向に延びる円筒状の照射領域を、その光軸と交差する方向へ変位させることにより、この照射領域が通過する加工対象物の表面側に加工面を形成する技術が提案されている(特許文献1)。この加工方法は、機械的な加工方法に比べて機械的損傷を減らし滑らかに加工面を形成できるという点で優れた加工方法である。 In recent years, a technology has been proposed in which a cylindrical irradiation area extending in the direction of the laser's optical axis is displaced in a direction intersecting the optical axis to form a machined surface on the surface side of the workpiece through which the irradiation area passes (Patent Document 1). This processing method is superior to mechanical processing methods in that it reduces mechanical damage and forms a smooth machined surface.
この種の加工方法は、例えば、すくい面および逃げ面で形成された角部を有する切削工具のように、それぞれ隣接する2つの端面で形成された角部を有する加工対象物における角部の再生、といった用途でも用いられている。具体的には、すくい面または逃げ面の拡がる方向に沿って光軸が延びるようにレーザを照射させ、このレーザを変位させることによって、角部に新たなすくい面または逃げ面を形成することができる。 This type of processing method is also used in applications such as regenerating corners in workpieces that have corners formed by two adjacent end faces, such as cutting tools that have corners formed by the rake face and flank face. Specifically, a laser is irradiated so that the optical axis extends along the direction in which the rake face or flank face widens, and a new rake face or flank face can be formed at the corner by displacing the laser.
ただ、このレーザによる加工が必ずしも現実的とはいえない加工対象物も存在する。例えば、ボールエンドミルのように、円錐台を軸線周りに所定の角度範囲だけ切り取った形状における円錐台面および底面のなす角部が形成されたものである。この角部では、一方の面(逃げ面)が円錐台面に沿った複雑な曲面形状をなしている。 However, there are some workpieces for which laser processing is not necessarily practical. For example, a ball end mill is used to cut a truncated cone around its axis at a certain angle, forming a corner between the truncated cone surface and the base. At this corner, one of the surfaces (the relief surface) forms a complex curved shape that follows the truncated cone surface.
このように、角部が複雑な曲面形状の面を有していると、レーザの光軸や加工対象物を複雑に変位させなければ適切に加工面を形成できず、そのために多軸化が必要になるなど装置構成や制御が著しく複雑になってしまう。このようなことから、複雑な曲面形状の加工面に対しては、レーザによる加工が必ずしも現実的ではないという課題があった。 In this way, when the corners have surfaces with complex curved shapes, the optical axis of the laser and the workpiece cannot be displaced in a complex manner to form a suitable machined surface, which requires multi-axis machining, making the device configuration and control significantly more complex. For these reasons, there has been an issue that laser machining is not necessarily practical for machined surfaces with complex curved shapes.
本開示はこのような課題を解決するためになされたものであり、その目的は、複雑な曲面形状の加工面であっても、装置構成や制御の複雑化を抑えつつ、レーザによる加工を実現できるようにすることである。 The present disclosure has been made to solve these problems, and its purpose is to make it possible to perform laser processing even on surfaces with complex curved shapes while minimizing the complexity of the device configuration and control.
上記課題を解決するため第1局面は、光源から照射されるレーザを加工対象物の加工面へと導く導光部と、前記導光部に導かれるレーザの光路を、その光軸が母線となり、かつ、前記加工面と重なる光軸上の位置を頂点とする仮想円錐の円錐面に沿って、その軸線周りに変位させる光路変位部、および、前記加工対象物を、前記仮想円錐の軸線と交差する対象平面に沿って変位させる対象変位部、による変位をそれぞれ制御する制御部と、を備え、前記対象平面に沿って底面が拡がる仮想円錐台をその軸線周りに所定の角度範囲だけ切り取った形状における円錐台面を、前記加工面として形成する場合において、前記制御部は、前記対象平面上で、前記加工面が前記仮想円錐台の底面周りになす対象円弧の一端が前記仮想円錐の頂点となる対象開始位置から、前記仮想円錐の頂点を中心に前記対象円弧と同じ半径で描かれる仮想円の円周に沿って、前記対象円弧の他端側が前記仮想円錐の頂点と重なる対象終了位置に到達するまで、前記対象変位部に前記加工対象物を所定の対象角速度で変位させる対象制御と、前記対象平面視で、レーザの光軸が、前記対象開始位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路開始位置から、前記仮想円錐の軸線周りに、前記対象終了位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路終了位置に到達するまで、前記光路変位部にレーザの光路を前記対象角速度と同じ光路角速度で変位させる光路制御と、を同時に実施することで前記加工対象物にレーザによる前記加工面を形成する、レーザ加工装置である。 In order to solve the above problem, the first aspect of the present invention comprises a light guiding section that guides a laser irradiated from a light source to a processing surface of a workpiece, a light path displacement section that displaces the light path of the laser guided to the light guiding section about the axis of a virtual cone whose optical axis serves as a generating line and whose apex is a position on the optical axis that overlaps with the processing surface, and a control section that controls the displacement by the object displacement section that displaces the workpiece along an object plane that intersects with the axis of the virtual cone, and in the case where a cone frustum surface having a shape obtained by cutting a virtual truncated cone whose bottom surface extends along the object plane by a predetermined angle range about its axis, the control section displaces the virtual truncated cone surface from an object start position on the object plane where one end of an object arc formed by the processing surface around the bottom surface of the virtual truncated cone is the apex of the virtual cone, This laser processing device simultaneously performs object control, which causes the object displacement section to displace the object to be processed at a predetermined object angular velocity along the circumference of a virtual circle drawn with the same radius as the object arc, centered on the apex of the imaginary cone, until the other end of the object arc reaches an object end position where it overlaps with the apex of the virtual cone, and optical path control, which causes the optical path displacement section to displace the optical path of the laser at the same optical path angular velocity as the object angular velocity, from an optical path start position along the direction of extension of a line segment connecting the center of the object arc at the object start position and the apex of the virtual cone, around the axis of the virtual cone, until it reaches an optical path end position along the direction of extension of a line segment connecting the center of the object arc at the object end position and the apex of the virtual cone, in the object plan view, to form the processed surface by laser on the object to be processed.
また、この局面においては、以下に示す第2局面のようにしてもよい。
第2局面において、前記制御部は、前記仮想円錐台における円錐台面と天面との境界稜線と重なる光軸上の位置を前記仮想円錐の頂点として、前記光路変位部にレーザの光路を変位させる。
In addition, in this aspect, the second aspect described below may be adopted.
In a second aspect, the control unit causes the optical path displacement unit to displace the optical path of the laser such that a position on the optical axis that overlaps with a boundary ridge between a truncated cone surface and a top surface of the virtual truncated cone becomes the apex of the virtual cone.
また、上記各局面においては、以下に示す第3局面のようにしてもよい。
第3局面において、前記導光部は、光源から照射されるレーザが透過する筒状領域内で、該筒状領域の軸線と同軸かつ軸線方向に間隔を空けて配置された一対のウェッジプレートと、前記ウェッジプレートよりもレーザの光路下流側で、前記筒状領域の軸線と同軸に配置され、前記ウェッジプレート透過後のレーザを前記加工面に向けて屈折させるレンズと、前記ウェッジプレートを前記筒状領域の軸線周りに回転させることで、前記ウェッジプレート透過後のレーザを周方向に走査させる回転機構と、を備え、前記光路変位部は、前記回転機構に前記ウェッジプレートを回転させることにより、前記導光部に導かれるレーザの光路を、前記仮想円錐の円錐面に沿って変位させる。
In addition, in each of the above aspects, the third aspect described below may be adopted.
In a third aspect, the light guiding unit includes a pair of wedge plates arranged coaxially with the axis of a cylindrical region through which a laser irradiated from a light source passes and spaced apart in the axial direction, a lens arranged coaxially with the axis of the cylindrical region downstream of the wedge plates in the optical path of the laser and refracting the laser after passing through the wedge plate toward the processing surface, and a rotation mechanism rotating the wedge plate around the axis of the cylindrical region to scan the laser after passing through the wedge plate in a circumferential direction, and the optical path displacement unit displaces the optical path of the laser guided to the light guiding unit along the conical surface of the virtual cone by rotating the wedge plate with the rotation mechanism.
上記局面のレーザ加工装置では、レーザの光路を仮想円錐の円錐面に沿って変位させつつ、加工対象物を仮想円の円周に沿って変位させる。これによって、レーザは、加工対象物における仮想円錐台の母線に沿った状態で、その円錐台面上を軸線周りに相対変位するため、仮想円錐台の円錐台面に沿った加工面が加工対象物に形成される。こうして、円錐台面のような複雑な曲面形状の端面を加工面として形成することができる。 In the laser processing device of the above aspect, the optical path of the laser is displaced along the conical surface of the imaginary cone, while the workpiece is displaced along the circumference of the imaginary circle. As a result, the laser is relatively displaced around the axis on the frustum surface of the imaginary frustum of the cone in the workpiece, while being aligned with the generatrix of the imaginary frustum of the cone, so that a machined surface that follows the frustum surface of the imaginary frustum is formed on the workpiece. In this way, the end face of a complex curved shape such as a frustum surface of a cone can be formed as the machined surface.
ここで、加工対象物に対するレーザの相対変位は、光路変位部および対象変位部に対する2軸制御によって実現できるため、複雑な曲面形状の加工面であっても、それ以上の多軸化および複雑な制御を要することなく、レーザによる加工を実現することができる。 Here, the relative displacement of the laser with respect to the workpiece can be achieved by two-axis control of the optical path displacement section and the object displacement section, so even when the workpiece surface has a complex curved shape, laser processing can be achieved without requiring more multi-axis and complex control.
以下に本発明を実施するための形態を、図面を参照して詳細に説明する。
(1)全体構成
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in
(1) Overall structure
レーザ加工装置1は、図1に示すように、レーザを出力する光源10と、加工対象物100を保持する保持部20と、光源10から照射されるレーザを加工対象物100の加工面111へと導く導光部30と、導光部30に導かれるレーザの光路を変位させる光路変位部40と、加工対象物100を変位させる対象変位部50、レーザ加工装置1全体の動作を制御する制御部60と、を備える。
As shown in FIG. 1, the laser processing device 1 includes a
本実施形態において、加工対象物100は、図2に示すように、棒状に延びる部材の先端側(本実施形態では下端側)に複数の角部110が形成されたボールエンドミルである。角部110は、それぞれが仮想円錐台を軸線周りに所定の角度範囲(具体的には90度の範囲)だけ切り取った形状における円錐台面および底面で構成された刃であり、一方の面(逃げ面)が円錐台面に沿った曲面形状をなしている。
In this embodiment, the
光源10は、パルスレーザを出力するレーザ発振器、レーザの振動数の次数を調整する振動調整器、レーザの出力を調整するアッテネータ、レーザの径を調整するためのビームエキスパンダーなどを備え、これらを経たレーザが光学レンズ経由で出力されるように構成されている。これらのうち、レーザ発振器にはNd:YAGパルスレーザが用いられている。
The
保持部20は、加工対象物100を、その先端が下方に位置し、角部における他方の面(すくい面)が後述する対象平面に沿う向きで保持する。
The
導光部30は、図3に示すように、光源10から照射されるレーザが透過する筒状領域を包囲する筒状の本体部31、筒状領域内で本体部31の軸線33と同軸かつ軸線33方向に間隔を空けて配置された一対のウェッジプレート35、37、光路下流側のウェッジプレート37よりもさらに光路下流側に配置されたレンズ39を備える。
As shown in FIG. 3, the
これらのうち、ウェッジプレート35、37は、光路下流側のウェッジプレート37を軸線33方向に沿った任意の位置に変位可能に構成されており(同図矢印参照)、これにより、一対のウェッジプレート35、37の間隔を任意に変更することができる。本実施形態では、一対のウェッジプレート35、37の間隔が広くなるほど、レーザの透過する位置が軸線33から径方向に遠くなる。
Of these, the
また、レンズ39は、本体部31の軸線33と同軸に配置され、ウェッジプレート35、37透過後のレーザを加工対象物100の加工面111に向けて屈折させる光学レンズである。
The
光路変位部40は、制御部60からの指令を受けて本体部31を軸線33周りに回転させるアクチュエータであり、この回転に伴って本体部31内に配置されたウェッジプレート35、37を軸線33周りに回転させる。
The optical
ここで、ウェッジプレート35、37を回転させることは、ウェッジプレート35、37透過後のレーザをその光軸と交差する平面上で周方向に走査させることを意味する。こうして、ウェッジプレート35、37を透過したレーザは、さらにレンズ39を透過することで、光軸の軸線33に対する径方向の位置に応じた角度で屈折する。
Here, rotating the
これによって、レーザは、図4に示すように、その光軸を母線としかつ加工面111と重なる光軸上の位置を頂点210とする仮想円錐200の円錐面220に沿って、その軸線230周りに変位する(同図矢印a参照)。
As a result, as shown in FIG. 4, the laser is displaced around its
対象変位部50は、保持部20を仮想円錐200の軸線230と直交する対象平面(図4(a)参照)に沿って変位させるアクチュエータであり、この保持部20を介してこれに保持される加工対象物100を変位させる。
The
(2)制御部60による加工処理
続いて、制御部60が内蔵メモリ61に格納されたプログラムにより実行する加工処理を図5に基づいて説明する。この加工処理は、図示されないインタフェース(操作装置または通信装置) からの起動指令を受けた際に起動される。
(2) Processing by the
なお、本実施形態では、図2に示すように、加工対象物100の角部110をなす一方の面(逃げ面)、つまり、仮想円錐台の円錐台面に沿った曲面形状を加工面111として形成する場合を例示する。
In this embodiment, as shown in FIG. 2, one surface (flank) forming a
この加工処理が起動されると、まず、加工対象物100が対象開始位置100sに位置決めされる(s110)。対象開始位置100sは、図6に示すように、仮想円錐200の軸線230と交差する対象平面上で、加工面111が仮想円錐台の底面周りになす対象円弧の一端113が仮想円錐200の頂点210となる位置である。ここでは、レーザの光軸が仮想円錐台における円錐台面と天面との境界稜線と重なる位置が、仮想円錐200の頂点210として設定されており(図3(b)参照)、この設定に基づいて以降の処理が実行される。
When this processing is started, first, the
次に、加工対象物100を変位させる対象制御と、レーザの光路を変位させる光路制御と、が同時に開始される(s120)。
Next, object control to displace the
対象制御とは、図6に示すように、加工対象物100を対象開始位置100sから対象終了位置100eに到達するまで変位させるための制御であり、対象変位部50への指令により実施される。ここで、対象終了位置100eは、対象平面上で対象円弧の他端115が仮想円錐200の頂点210と重なる位置である。
As shown in FIG. 6, the target control is a control for displacing the
そして、対象開始位置100sと対象終了位置100eとの間は、仮想円錐200の頂点210を中心に対象円弧と同じ半径で描かれる仮想円120の円周に沿って所定の対象角速度で変位するように、対象変位部50が制御される(同図矢印b参照)。
Then, the
他方、光路制御は、レーザの光路を光路開始位置300sから光路終了位置300eに到達するまで変位させるための制御であり、光路変位部40への指令により実施される。ここで、光路開始位置300sは、図6に示すように、レーザの光軸が、対象開始位置100sにある対象円弧の中心117と仮想円錐200の頂点210とをつなぐ線分の延びる方向に沿う位置である。また、光路終了位置300eは、対象終了位置100eにある対象円弧の中心117と仮想円錐200の頂点210とをつなぐ線分の延びる方向に沿う位置である。
On the other hand, optical path control is a control for displacing the optical path of the laser from the optical
そして、光路開始位置300sと光路終了位置300eとの間は、仮想円錐200の軸線230周りに対象角速度と同じ光路角速度で変位するように、光路変位部40が制御される。
Then, the optical
こうして、対象制御および光路制御が開始された以降、これら制御が終了するまで待機状態となり(s130:NO)、終了したら(s130:YES)、本加工処理が終了する。こうして対象制御と光路制御とを同時に実行することによって加工対象物100へのレーザによる加工面111の形成が実現される。
After the object control and light path control are started, the system waits until these controls are completed (s130: NO), and when they are completed (s130: YES), the processing process ends. By simultaneously executing the object control and light path control in this way, the
(3)変形例
以上、本発明の実施の形態について説明したが、本発明は、上記実施形態に何ら限定されることはなく、本発明の技術的範囲に属する限り種々の形態をとり得ることはいうまでもない。
(3) Modifications Although the embodiments of the present invention have been described above, it goes without saying that the present invention is in no way limited to the above-described embodiments, and various modifications can be made as long as they fall within the technical scope of the present invention.
例えば、上記実施形態では、導光部30が、一対のウェッジプレート35、37およびレンズ39により構成されたものを例示した。しかし、この導光部30としては、レーザの光路を仮想円錐200の円錐面220に沿ってその軸線230周りに変位させることができるものであれば上記構成に限られない。
For example, in the above embodiment, the
また、上記実施形態では、各構成要素を備えたものをレーザ加工装置1としているが、例えば、保持部20と、光路変位部40および対象変位部50に相当するアクチュエータとを備える汎用的な工作機械に対し、光源10、導光部30および制御部60(または当該工作機械の備える制御部に加工処理を実行させるためのプログラム)を搭載することによって、レーザ加工装置1を実現してもよい。
In addition, in the above embodiment, the laser processing device 1 is equipped with each of the components, but the laser processing device 1 may also be realized by, for example, mounting the
また、上記実施形態では、レーザの光軸が仮想円錐台における円錐台面と天面との境界稜線と重なる位置が、仮想円錐200の頂点210として設定される構成を例示した。しかし、仮想円錐200の頂点210としては、加工面111において光路上流側の端部から下流側の端部に至る範囲における別の位置(例えば、光路上流側の端部)が設定される構成としてもよい。
In the above embodiment, the position where the optical axis of the laser overlaps with the boundary ridge between the truncated cone surface and the top surface of the virtual truncated cone is set as the
(4)作用効果
上記実施形態に係るレーザ加工装置1では、レーザの光路を仮想円錐200の円錐面220に沿って変位させつつ、加工対象物100を仮想円120の円周に沿って変位させる。これによって、レーザは、加工対象物100における仮想円錐台の母線に沿った状態で、その円錐台面上を軸線周りに相対変位するため、仮想円錐台の円錐台面に沿った加工面111が加工対象物100に形成される。こうして、円錐台面のような複雑な曲面形状の端面を加工面111として形成することができる。
(4) Effects In the laser processing device 1 according to the above embodiment, the optical path of the laser is displaced along the
ここで、加工対象物100に対するレーザの相対変位は、光路変位部40および対象変位部50の2軸制御によって実現することができるため、複雑な曲面形状の加工面111であっても、それ以上の多軸化および制御を要することなく、レーザによる加工を実現することができる。
Here, the relative displacement of the laser with respect to the
また、上記実施形態のレーザ加工装置1では、ウェッジプレート35、37透過後のレーザがレンズ39により加工面111に向けて屈折するため、光源10からのレーザをウェッジプレート35、37の回転により周方向に走査させることで、レーザの光路を仮想円錐200の円錐面220に沿ってその軸線230周りに変位させることができる。
In addition, in the laser processing device 1 of the above embodiment, the laser after passing through the
また、上記実施形態において、汎用的な工作機械に光源10、導光部30および制御部60を搭載することでレーザ加工装置1を実現した場合には、汎用的な工作機械に一部構成要素を搭載するだけで、上記実施形態のレーザ加工装置1を低コストで実現することができる。
In addition, in the above embodiment, if the laser processing device 1 is realized by mounting the
本開示のレーザ加工装置は、複雑な曲面形状の加工面であっても、装置構成や制御の複雑化を抑えつつ、レーザによる加工を実現できる。 The laser processing device disclosed herein can perform laser processing even on surfaces with complex curved shapes while minimizing the complexity of the device configuration and control.
1…レーザ加工装置、10…光源、20…保持部、30…導光部、31…本体部、33…軸線、35…ウェッジプレート、37…ウェッジプレート、39…レンズ、40…光路変位部、50…対象変位部、60…制御部、61…内蔵メモリ、100…加工対象物、100e…対象終了位置、100s…対象開始位置、110…角部、111…加工面、113…一端、115…他端、117…中心、120…仮想円、200…仮想円錐、210…頂点、220…円錐面、230…軸線、300e…光路終了位置、300s…光路開始位置。 1...laser processing device, 10...light source, 20...holding section, 30...light guide section, 31...main body section, 33...axis, 35...wedge plate, 37...wedge plate, 39...lens, 40...light path displacement section, 50...target displacement section, 60...control section, 61...built-in memory, 100...processing target, 100e...target end position, 100s...target start position, 110...corner, 111...processing surface, 113...one end, 115...other end, 117...center, 120...virtual circle, 200...virtual cone, 210...apex, 220...cone surface, 230...axis, 300e...light path end position, 300s...light path start position.
Claims (5)
前記導光部に導かれるレーザの光路を、その光軸が母線となり、かつ、前記加工面と重なる光軸上の位置を頂点とする仮想円錐の円錐面に沿って、その軸線周りに変位させる光路変位部、および、前記加工対象物を、前記仮想円錐の軸線と交差する対象平面に沿って変位させる対象変位部、による変位をそれぞれ制御する制御部と、を備え、
前記対象平面に沿って底面が拡がる仮想円錐台をその軸線周りに所定の角度範囲だけ切り取った形状における円錐台面を、前記加工面として形成する場合において、
前記制御部は、
前記対象平面上で、前記加工面が前記仮想円錐台の底面周りになす対象円弧の一端が前記仮想円錐の頂点となる対象開始位置から、前記仮想円錐の頂点を中心に前記対象円弧と同じ半径で描かれる仮想円の円周に沿って、前記対象円弧の他端側が前記仮想円錐の頂点と重なる対象終了位置に到達するまで、前記対象変位部に前記加工対象物を所定の対象角速度で変位させる対象制御と、
前記対象平面視で、レーザの光軸が、前記対象開始位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路開始位置から、前記仮想円錐の軸線周りに、前記対象終了位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路終了位置に到達するまで、前記光路変位部にレーザの光路を前記対象角速度と同じ光路角速度で変位させる光路制御と、
を同時に実施することで前記加工対象物にレーザによる前記加工面を形成する、
レーザ加工装置。 a light guide unit that guides a laser irradiated from a light source to a processing surface of an object to be processed;
a control unit that controls the displacement by a light path displacement unit that displaces the light path of the laser guided to the light guiding unit around the axis of a virtual cone surface having an optical axis as a generating line and an apex at a position on the optical axis that overlaps with the processing surface, and an object displacement unit that displaces the processing object along an object plane that intersects with the axis of the virtual cone,
In the case where a frustum surface having a shape obtained by cutting a virtual frustum of a cone whose bottom surface spreads along the target plane by a predetermined angle range around its axis is formed as the processed surface,
The control unit is
a target control that displaces the object to be machined at a predetermined target angular velocity by the target displacement section on the target plane from a target start position where one end of the target arc formed by the machining surface around the bottom surface of the virtual truncated cone becomes the apex of the virtual cone along a circumference of a virtual circle drawn with the same radius as the target arc and centered on the apex of the virtual cone, until the other end of the target arc overlaps with the apex of the virtual cone;
an optical path control that causes the optical path displacement unit to displace the optical path of the laser at an optical path angular velocity equal to the target angular velocity, from an optical path start position along an extension direction of a line segment connecting the center of the target arc at the target start position and the apex of the virtual cone, around an axis of the virtual cone, until the optical axis of the laser reaches an optical path end position along an extension direction of a line segment connecting the center of the target arc at the target end position and the apex of the virtual cone, in the target planar view;
and forming the laser processed surface on the workpiece by simultaneously carrying out the steps.
Laser processing equipment.
請求項1に記載のレーザ加工装置。 the control unit causes the optical path displacement unit to displace the optical path of the laser, with a position on the optical axis that overlaps with a boundary ridge between a truncated cone surface and a top surface of the virtual truncated cone being set as a vertex of the virtual cone.
The laser processing device according to claim 1.
前記光路変位部は、前記回転機構に前記ウェッジプレートを回転させることにより、前記導光部に導かれるレーザの光路を、前記仮想円錐の円錐面に沿って変位させる、
請求項1に記載のレーザ加工装置。 The light guide unit includes a pair of wedge plates arranged coaxially with the axis of the cylindrical region and spaced apart in the axial direction within a cylindrical region through which a laser irradiated from a light source passes, a lens arranged coaxially with the axis of the cylindrical region downstream of the wedge plates in the optical path of the laser, and refracting the laser after passing through the wedge plate toward the processing surface, and a rotation mechanism that rotates the wedge plate around the axis of the cylindrical region to scan the laser after passing through the wedge plate in a circumferential direction,
The optical path displacement unit displaces an optical path of the laser guided to the light guiding unit along a conical surface of the virtual cone by rotating the wedge plate with the rotation mechanism.
The laser processing device according to claim 1.
前記導光部に導かれるレーザの光路を、その光軸が母線となり、かつ、前記加工面と重なる光軸上の位置を頂点とする仮想円錐の円錐面に沿って、その軸線周りに変位させる光路変位部と、
前記加工対象物を、前記仮想円錐の軸線と交差する対象平面に沿って変位させる対象変位部と、
を備えるレーザ加工装置によって、前記加工対象物に前記加工面を形成させるためのレーザ加工方法であって、
前記対象平面に沿って底面が拡がる仮想円錐台をその軸線周りに所定の角度範囲にわたって切り取った形状における円錐台面を、前記加工面として形成する場合において、
前記対象平面上で、前記加工面が前記仮想円錐台の底面周りになす対象円弧の一端が前記仮想円錐の頂点となる対象開始位置から、前記仮想円錐の頂点を中心に前記対象円弧と同じ半径で描かれる仮想円の円周に沿って、前記対象円弧の他端側が前記仮想円錐の頂点と重なる対象終了位置に到達するまで、前記対象変位部に前記加工対象物を所定の対象角速度で変位させる対象制御と、
前記対象平面視で、レーザの光軸が、前記対象開始位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路開始位置から、前記仮想円錐の軸線周りに、前記対象終了位置にある前記対象円弧の中心と前記仮想円錐の頂点とをつなぐ線分の延びる方向に沿う光路終了位置に到達するまで、前記光路変位部にレーザの光路を前記対象角速度と同じ光路角速度で変位させる光路制御と、を同時に実施する、
レーザ加工方法。 a light guide unit that guides a laser irradiated from a light source to a processing surface of an object to be processed;
an optical path displacement unit that displaces the optical path of the laser guided to the light guide unit about its axis along a conical surface of a virtual cone whose apex is a position on the optical axis that overlaps with the processing surface, the virtual cone having an optical axis as a generating line;
an object displacement unit that displaces the object along an object plane that intersects with an axis of the virtual cone;
A laser processing method for forming the processed surface on the object to be processed by a laser processing apparatus comprising:
In the case where a frustum surface having a shape obtained by cutting a virtual frustum of a cone whose bottom surface spreads along the target plane over a predetermined angle range around its axis line is formed as the processed surface,
a target control that displaces the object to be machined at a predetermined target angular velocity by the target displacement section on the target plane from a target start position where one end of the target arc formed by the machining surface around the bottom surface of the virtual truncated cone becomes the apex of the virtual cone along a circumference of a virtual circle drawn with the same radius as the target arc and centered on the apex of the virtual cone, until the other end of the target arc overlaps with the apex of the virtual cone;
and simultaneously performing an optical path control in which the optical path displacement unit displaces the optical path of the laser at an optical path angular velocity equal to the target angular velocity, from an optical path start position along the extension direction of a line segment connecting the center of the target arc at the target start position and the apex of the virtual cone, around the axis of the virtual cone, until the optical axis of the laser reaches an optical path end position along the extension direction of a line segment connecting the center of the target arc at the target end position and the apex of the virtual cone, in the target planar view.
Laser processing method.
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| PCT/JP2023/002995 Ceased WO2024161490A1 (en) | 2023-01-31 | 2023-01-31 | Laser machining device, laser machining method, and program |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7274807B1 (en) |
| WO (1) | WO2024161490A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012006135A (en) * | 2010-06-28 | 2012-01-12 | Mitsubishi Materials Corp | End mill and manufacturing method therefor |
| WO2013190977A1 (en) * | 2012-06-21 | 2013-12-27 | 住友電工ハードメタル株式会社 | Cutting tool |
| JP2014083567A (en) * | 2012-10-24 | 2014-05-12 | Mitsubishi Materials Corp | Manufacturing method and manufacturing device of cutting tool |
| JP2017030124A (en) * | 2015-08-05 | 2017-02-09 | 株式会社山崎 | Spherical surface engraving device |
| JP2019126816A (en) * | 2018-01-23 | 2019-08-01 | 株式会社ソフトサービス | Laser beam machine |
| JP2020104167A (en) * | 2018-12-28 | 2020-07-09 | 三星ダイヤモンド工業株式会社 | Laser processing device and beam rotator unit |
-
2023
- 2023-01-31 WO PCT/JP2023/002995 patent/WO2024161490A1/en not_active Ceased
- 2023-01-31 JP JP2023507390A patent/JP7274807B1/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012006135A (en) * | 2010-06-28 | 2012-01-12 | Mitsubishi Materials Corp | End mill and manufacturing method therefor |
| WO2013190977A1 (en) * | 2012-06-21 | 2013-12-27 | 住友電工ハードメタル株式会社 | Cutting tool |
| JP2014083567A (en) * | 2012-10-24 | 2014-05-12 | Mitsubishi Materials Corp | Manufacturing method and manufacturing device of cutting tool |
| JP2017030124A (en) * | 2015-08-05 | 2017-02-09 | 株式会社山崎 | Spherical surface engraving device |
| JP2019126816A (en) * | 2018-01-23 | 2019-08-01 | 株式会社ソフトサービス | Laser beam machine |
| JP2020104167A (en) * | 2018-12-28 | 2020-07-09 | 三星ダイヤモンド工業株式会社 | Laser processing device and beam rotator unit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024161490A1 (en) | 2024-08-08 |
| JP7274807B1 (en) | 2023-05-17 |
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