[go: up one dir, main page]

WO2024158104A1 - Plasma treatment container, and treatment apparatus and method - Google Patents

Plasma treatment container, and treatment apparatus and method Download PDF

Info

Publication number
WO2024158104A1
WO2024158104A1 PCT/KR2023/016811 KR2023016811W WO2024158104A1 WO 2024158104 A1 WO2024158104 A1 WO 2024158104A1 KR 2023016811 W KR2023016811 W KR 2023016811W WO 2024158104 A1 WO2024158104 A1 WO 2024158104A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
floating electrode
treated
plasma processing
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2023/016811
Other languages
French (fr)
Korean (ko)
Inventor
임유봉
김준영
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plasmapp Co Ltd
Original Assignee
Plasmapp Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plasmapp Co Ltd filed Critical Plasmapp Co Ltd
Publication of WO2024158104A1 publication Critical patent/WO2024158104A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32458Vessel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32532Electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32431Constructional details of the reactor
    • H01J37/32798Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816Pressure
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/44Applying ionised fluids

Definitions

  • the present invention relates to a plasma processing container, a processing device, and a method, and more specifically, to a plasma processing container, a processing device, and a method capable of generating a uniform plasma discharge inside a processing container in which an object to be treated is accommodated. .
  • plasma processing is used for various purposes in several industries, including semiconductor, display, agriculture, and medical industries.
  • plasma surface treatment is used on biomaterials for human skin restoration (skin graft), which are used for replacement, restoration, and reconstruction of human tissues and organs such as skin (dermal, cutaneous) in the medical industry. This has the effect of improving biocompatibility and implantation characteristics.
  • Plasma surface treatment technology has developed from the perspective of structure and process operation for plasma discharge focused on the surface treatment object.
  • technologies for preventing filament discharge and glow discharge have been developed.
  • the technical problem to be achieved by the present invention is to provide a plasma treatment vessel capable of uniformly treating an object to be treated during plasma surface treatment, and a plasma treatment apparatus and treatment method including the same.
  • a plasma processing vessel used for plasma processing of an object to be treated contained therein comprising: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.
  • a plasma processing vessel in which an object to be treated is accommodated; a housing portion in which the plasma processing vessel can be placed; a pressure adjusting unit installed in the housing, connected to the plasma processing vessel to enable fluid flow, and adjusting the pressure of the internal space of the plasma processing vessel; and a processing unit that receives power from the outside and forms an electric field to generate a plasma discharge in the internal space of the plasma processing container, wherein the plasma processing container includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.
  • a plasma processing method for treating the surface of an object to be treated includes the steps of inserting a processing container containing the object to be treated into a housing portion; attaching the processing container to a processing unit installed in the housing unit; adjusting the pressure of the internal space of the processing vessel; Generating plasma in the internal space of the processing vessel by receiving power from the outside, wherein the processing vessel includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.
  • the plasma treatment vessel according to embodiments of the present invention is provided with a floating electrode, and can change the shape, distribution, and intensity of the electric field formed inside the treatment vessel, and through this, the surface of the object to be treated is uniformly plasma treated. There is an effect that can be done.
  • the electric field is uniformly formed in the inner space of the processing vessel by the floating electrode, plasma surface treatment of the object to be treated is possible even at a relatively low voltage, so the electric field is concentrated in a specific area, causing damage to the object to be treated. It has the effect of preventing this from happening.
  • FIG. 1 is a diagram schematically showing a plasma processing apparatus according to an embodiment of the present invention.
  • Figure 2 is a diagram showing a state in which the pressure of a plasma processing vessel is adjusted in a plasma processing apparatus according to an embodiment of the present invention.
  • Figure 3 is a diagram showing a state in which an object to be treated is plasma discharge treated in a plasma processing apparatus according to an embodiment of the present invention.
  • Figure 4 is a perspective view showing a plasma processing vessel according to the first embodiment of the present invention.
  • Figure 5 is an exploded view showing a plasma processing vessel according to the first embodiment of the present invention.
  • FIG. 6 is a cross-sectional view based on line II′ of FIG. 4.
  • FIG. 7 is a cross-sectional view based on line II-II′ of FIG. 4.
  • Figure 8 is a perspective view showing a plasma processing vessel according to a second embodiment of the present invention.
  • Figure 9 is an exploded view showing a plasma processing vessel according to a second embodiment of the present invention.
  • FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 8.
  • FIG. 11 is a cross-sectional view based on line IV-IV′ of FIG. 8.
  • Figure 12 is a perspective view showing a plasma processing vessel according to a third embodiment of the present invention.
  • Figure 13 is an exploded view showing a plasma processing vessel according to a third embodiment of the present invention.
  • FIG. 14 is a cross-sectional view based on line V-V′ of FIG. 12.
  • Figure 15 is an enlarged view of part A of Figure 14.
  • FIG. 16 is a cross-sectional view based on line VI-VI′ in FIG. 12.
  • 17 to 19 are diagrams schematically showing a plasma processing apparatus according to another embodiment of the present invention.
  • Figure 20 is a flowchart showing a plasma processing method according to embodiments of the present invention.
  • a plasma processing vessel used for plasma processing of an object to be treated contained therein comprising: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.
  • a film portion covering the floating electrode may be further included.
  • the thickness of the film portion may be the same as the thickness of the first body portion or may be formed to be relatively thin.
  • the floating electrode may be formed in a structure that supports the inner surface of the first body to prevent deformation of the first body.
  • the floating electrode supports the inner surface of the first body to prevent shape deformation of the first body even if a pressure difference occurs inside and outside the first body during the plasma treatment of the object to be processed. It can be formed into a structure that does.
  • the floating electrode may be disposed along the inner peripheral surface of the first main body and may be formed in a structure where the starting point and the ending point are connected.
  • the floating electrode may be formed in a closed curve shape along the inner peripheral surface of the first body portion.
  • the floating electrode may be located in the center of the first main body based on the plasma processing direction.
  • a plurality of floating electrodes are provided, and the plurality of floating electrodes may be spaced apart at a preset interval.
  • the floating electrode may be formed of a conductive material.
  • a second body portion is hollow on the inside and the first body portion can be inserted and placed; and a cap portion that covers the second body portion and has a communication hole communicating with the internal space of the first body portion.
  • it may further include a flow limiting portion that covers the communication hole formed in the cap portion and restricts the flow of fluid between the inner space and the outer space of the first body portion.
  • the flow restrictor may only allow the flow of gas.
  • the flow restriction portion may be disposed between the cap portion and the first body portion.
  • the flow restriction part is formed in a film manner and can be coupled to the first body part.
  • a plasma processing vessel in which an object to be treated is accommodated; a housing portion in which the plasma processing vessel can be placed; a pressure adjusting unit installed in the housing, connected to the plasma processing vessel to enable fluid flow, and adjusting the pressure of the internal space of the plasma processing vessel; and a processing unit that receives power from the outside and forms an electric field to generate a plasma discharge in the internal space of the plasma processing container, wherein the plasma processing container includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.
  • the processing unit includes a port portion disposed between the pressure adjusting unit and the processing container and capable of contacting the processing container; and an electrode portion disposed outside the processing container and receiving power to form an electric field.
  • a plurality of electrode units may be provided and may be respectively disposed on both sides of the plasma processing vessel.
  • a plasma processing method for treating the surface of an object to be treated includes the steps of inserting a processing container containing the object to be treated into a housing portion; attaching the processing container to a processing unit installed in the housing unit; adjusting the pressure of the internal space of the processing vessel; Generating plasma in the internal space of the processing vessel by receiving power from the outside, wherein the processing vessel includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.
  • units that processes at least one function or operation
  • a processor micro Processor (Micro Processer), Micro Controller, CPU (Central Processing Unit), GPU (Graphics Processing Unit), APU (Accelerate Processor Unit), DSP (Drive Signal Processor), ASIC (Application Specific Integrated Circuit), FPGA It may be implemented as hardware or software, such as a Field Programmable Gate Array, or a combination of hardware and software, and may also be implemented in a form combined with a memory that stores data necessary for processing at least one function or operation. .
  • each component is responsible for. That is, two or more components, which will be described below, may be combined into one component, or one component may be divided into two or more components for more detailed functions.
  • each of the components described below may additionally perform some or all of the functions handled by other components, and some of the main functions handled by each component may be performed by other components. Of course, it can also be carried out in full charge by .
  • FIG. 1 is a diagram schematically showing a plasma processing apparatus according to an embodiment of the present invention.
  • Figure 2 is a diagram showing a state in which the pressure of a plasma processing vessel is adjusted in a plasma processing apparatus according to an embodiment of the present invention.
  • Figure 3 is a diagram showing a state in which an object to be treated is plasma discharge treated in a plasma processing apparatus according to an embodiment of the present invention.
  • the plasma processing apparatus 1 includes a plasma processing vessel 10 (hereinafter referred to as 'processing vessel'), a housing unit 20, and a pressure adjustment unit. (30) and may include a processing unit (40).
  • the plasma processing apparatus 1 includes a processing vessel 10 in which an object to be treated (OB) is accommodated and a floating electrode 13 is provided. It can be used for plasma surface treatment of the object to be treated (OB).
  • OB object to be treated
  • the processing container 10 accommodates the object to be treated (OB), can be accommodated in the housing portion 20, and can be in close contact with and connected to the processing portion 40, which will be described later. .
  • the processing container 10 may refer to various types of devices or containers used to plasma surface treat the object OB.
  • the processing container 10 may be a storage container for plasma surface treatment of the object OB, or may be a connection jig for a plasma processing device.
  • the 'object to be treated (OB)' is a crown to cover a human tooth, etc., or bone that can be accommodated in an internal container such as a syringe or vial when an implant procedure is performed in a medical procedure or dentistry. It refers to biomaterials for human skin restoration (skin graft) used for replacement, restoration, and reconstruction of human tissues and organs, such as graft materials and skin (dermal, cutaneous).
  • FIGS. 1 to 3 the object to be treated (OB) is schematically shown in a square shape for convenience of explanation.
  • the treatment containers 10, 10', and 10' according to the first to third embodiments, which will be described later, are shown in FIGS.
  • the object to be plasma treated by ⁇ ) can be formed into various shapes to suit the purpose and placed inside the processing container 10, 10 ⁇ , 10 ⁇ .
  • a plasma discharge (PD) is generated by the plasma processing device 1 while the object to be treated according to embodiments of the present invention is accommodated inside the processing container 10, 10 ⁇ , 10 ⁇ , and the plasma causes It has the effect of enabling surface treatment of the object to be treated (OB).
  • the processing container 10 accommodates an object to be treated (OB) therein, and includes a first body portion 11, a floating electrode 13, It may include a film portion.
  • OB object to be treated
  • the processing container 10 may be placed inside the housing portion 20 and faces the processing portion 40, specifically the electrode portion 45. It can be placed by looking at it.
  • the electrode unit 45 may include a first electrode 45a and a second electrode 45b that face each other and are spaced apart, and the processing container 10 includes the first electrode 45a and the second electrode 45b. It can be placed in between.
  • the first body portion 11 is hollow on the inside to accommodate the object to be treated (OB), and a floating electrode 13 can be disposed, and the first body portion 11 )
  • a communication hole portion 11h may be formed that communicates the inner space and the outer space of the gas G and provides a flow path for the gas G.
  • 4 to 16 relate to processing containers (10, 10 ⁇ , 10 ⁇ ) according to the first to third embodiments of the present invention.
  • the housing unit 20, pressure adjustment unit 30, and processing unit 40 will be explained in detail later.
  • the communication hole portion 11h may be formed in a preset area on the outer peripheral surface of the first body portion 11.
  • the communication hole portion 11h may have a plurality of holes and may be formed to penetrate the outer peripheral surface of the first body portion 11 to communicate with the internal space in which the object OB is accommodated.
  • the communication hole portion 11h may be formed on one side (left side in FIG. 1) facing the processing portion 40, specifically the port portion 41, which will be described later.
  • the first body portion 11 may be accommodated in the housing portion 20 with the object to be treated (OB) accommodated therein. While accommodated in the housing unit 20, it can be subjected to plasma discharge (PD) treatment by the processing unit 40.
  • OB object to be treated
  • PD plasma discharge
  • the above-described processing container 10 describes common contents of the processing containers 10, 10 ⁇ , and 10 ⁇ according to the embodiments of the present invention, and is a processing container according to the first to third embodiments of the present invention.
  • the composition, operating principle, and effects of the treatment containers (10, 10 ⁇ , 10 ⁇ ) will be explained in detail later.
  • the housing portion 20 accommodates the processing container 10 and may be formed as a component of the plasma processing apparatus 1.
  • a processing container 10 in which an object to be treated (OB) is accommodated is disposed in the housing portion 20 according to an embodiment of the present invention, and the processing portion 40 may be partially or entirely disposed in the housing portion 20. .
  • the processing container 10 is stored in the housing portion 20, and the processing container 10 is fixedly placed in a preset position, thereby preventing the position of the processing container 10 from changing and stably processing plasma. It has the effect of making it possible.
  • the housing unit 20 may be formed to be movable along a preset direction by receiving power from a driving unit (not shown) such as a motor.
  • a driving unit such as a motor
  • the processing container 10 After the processing container 10 is placed in the housing unit 20, power is transmitted from the driving unit to the processing unit 40, specifically between the first electrode 45a and the second electrode 45b. 20) can be positioned.
  • the housing part 20 may be provided with a door part (not shown), and the inner space of the housing part 20 can be opened and closed by the door part, and the housing part 20 can be opened and closed in an open state.
  • the processing container 10 is placed inside, and the internal space of the housing unit 20 is closed with the door, thereby spatially blocking the internal space and external space of the housing unit 20.
  • the housing portion 20 may be arranged to be movable in a sliding manner.
  • the processing container 10 is placed in the first position formed in the housing portion 20, and power is transmitted from the outside to move the processing container 10 to the second position away from the first position, and then the processing unit 40 ), various modifications such as plasma treatment are possible.
  • the pressure adjusting unit 30 is connected to the processing container 10 to allow fluid to flow, and can adjust the internal pressure of the processing container 10. .
  • the pressure adjusting unit 30 may adjust the internal pressure of the processing container 10 by flowing fluid from the inside of the processing container 10 to the outside.
  • a fluid specifically a gas (G) such as air
  • LPA relatively low pressure atmosphere
  • the pressure adjusting unit 30 may be connected to a processing unit 40 that can be in close contact with the processing container 10, specifically the port unit 41, and the port unit Through (41), air (G) can be discharged to the outside from the internal space formed inside the processing container 10 and where the object to be treated (OB) is accommodated.
  • gas (G) such as air in the inner space of the processing container 10 is discharged to the outside, and the object to be treated (OB) is accommodated.
  • a low pressure environment (LPA) for plasma generation may be created inside the container 10, specifically the first main body 11, and a vacuum area may be formed.
  • the pressure adjusting unit 30 is formed by a pump method, and the air inside the processing container 10, specifically the first main body 11 ( G) is discharged to the outside, but is not limited to this, and various modifications are possible within the technical idea of forming the internal pressure of the processing vessel 10 into a low pressure state (LPA).
  • LPA low pressure state
  • the pressure adjusting unit 30 may include a valve unit and a filter.
  • the processing unit 40 forms an electric field to generate a plasma discharge (PD) inside the processing container 10, and the processing unit 40
  • the electric field formed by the electric field may change in intensity, spatial shape, or distribution by the floating electrode 13, and the changed electric field has spatially uniform intensity, distribution, or shape inside the processing vessel 10 in which the object to be treated is accommodated.
  • the processing unit 40 may be in close contact with the processing container 10, specifically the first main body 11.
  • the processing unit 40 can receive power from the outside and form an electric field to generate plasma discharge (PD) in the internal space of the first main body 11.
  • PD plasma discharge
  • the processing unit 40 may include a port unit 41, an electrode unit 45, and a power source unit 47.
  • the port portion 41 is disposed between the pressure adjustment unit 30 and the processing container 10 and is capable of contacting the processing container 10.
  • the port portion 41 according to an embodiment of the present invention is fixed in position on the housing portion 20 and is in close contact with one side (left side in FIG. 1) of the processing container 10. can be connected A communication hole 11h may be formed on one surface of the first main body 11 connected to the port 41.
  • the port portion 41 is connected to the pressure adjusting unit 30, and as the pressure adjusting unit 30 is driven, the air (G) accommodated in the internal space of the first body portion 11 is When discharging to the outside, a discharge path for air (G) can be provided.
  • the port portion 41 may include a port main body 411 and a port sealing portion 413.
  • the port body 411 is connected to the pressure adjusting unit 30 and can provide a path for air to flow from the internal space of the processing vessel 10 to the pressure adjusting unit 30.
  • the port sealing part 413 is coupled to the port main body 411, and has one end of the port main body 411 facing the processing container 10, specifically the first main body 11. Can be combined with wealth.
  • the port sealing portion 413 is disposed between the port main body 411 and the first main body 11, and one side may be in close contact with the first main body 11, and the other side opposite to the port main body 411 is disposed between the port main body 411 and the first main body 11. It can be in close contact with (411).
  • the port sealing portion 413 may be disposed in close contact with the first body portion 11 and the port body 411, respectively, along the circumference.
  • the port sealing portion 413 may be formed of a material capable of elastic deformation.
  • the port sealing unit 413 is formed of a material capable of elastic deformation, as the pressure adjusting unit 30 is driven, the pressure adjusting unit ( 30), the shape of the port sealing portion 413 is deformed (compressed) due to pressure changes, and the inner space formed by being surrounded by the port body 411 and the first body portion 11 is sealed. , confidentiality can be improved.
  • the port sealing part 413 is arranged in close contact with the port main body 411 and the first main body 11, respectively, foreign substances are prevented from flowing in from the outside of the first main body 11 and the port main body 411. can be blocked.
  • the internal space and external space surrounded by the first main body 11 and the port main body 411 are spatially separated, and the flow of gas G is blocked so that the pressure adjusting unit 30 efficiently adjusts the pressure. There is an effect that can be controlled.
  • the pressure adjusting unit 30 Due to the operation of the pressure adjusting unit 30, air may flow from the inner space of the processing container 10, specifically the first main body 11, to the pressure adjusting unit 30 through the inner space of the port portion 41. , Accordingly, the internal space of the first body portion 11 where the object to be treated (OB) is accommodated creates a low pressure environment in which plasma discharge (PD) for surface treatment of the object to be treated (OB) can be generated, By forming a vacuum area, there is an effect that plasma generation can be concentrated in the internal space where the object to be treated (OB) is accommodated.
  • PD plasma discharge
  • OB plasma discharge
  • the electrode unit 45 is disposed on the outside of the processing container 10 and may be disposed on the inside of the housing unit 20 .
  • the electrode unit 45 may receive power from the outside and form an electric field for generating plasma in the internal space of the first body unit 11 surrounding the object OB.
  • the processing unit 40 may generate plasma discharge (PD) in the internal space of the first main body 11, which is a sealed area, through dielectric barrier discharge (DBD). As an optional embodiment, the processing unit 40 may generate vacuum plasma using low-frequency alternating current power.
  • PD plasma discharge
  • DBD dielectric barrier discharge
  • the dielectric barrier may be formed by providing the plasma processing device 1 with a dielectric portion (not shown).
  • the dielectric barrier may be formed by providing at least a portion of the processing vessel 10 that accommodates the object OB with a dielectric material.
  • the electrode unit 45 may include a first electrode 45a and a second electrode 45b.
  • the first electrode 45a and the second electrode 45b are electrically connected to the power supply unit 47 and can receive power from the power supply unit 47.
  • the first electrode 45a may be formed as a high voltage electrode
  • the second electrode 45b may be a ground electrode to which no voltage is applied and may maintain ground (OV).
  • the first electrode 45a may be connected to the port portion 41, and the second electrode 45b may be fixed to the housing portion 20.
  • the electrode unit 45 may be disposed outside the processing container 10 in which the object to be treated (OB) is accommodated, and the electrode unit 45 may be connected to a high voltage power source from the power supply unit 47.
  • Plasma can be generated inside the processing container 10, specifically the first main body 11, by receiving and forming an electric field.
  • a floating electrode 13 may be disposed in contact with the inner surface of the first body portion 11 according to an embodiment of the present invention, and the floating electrode 13 may be connected to the power supply unit 47. It can be placed spaced apart from the electrode unit 45 without receiving power.
  • the intensity, spatial distribution, or shape of the electric field formed between the electrode portions 45 changes due to the floating electrode 13 located between the first electrode 45a and the second electrode 45b.
  • the electric field formed between the electrode portions 45 is concentrated inside the processing container 10 where the actual object to be treated is accommodated, and is formed uniformly.
  • the intensity, spatial distribution, or shape of the electric field formed between the electrode parts 45 can be changed and concentrated, so plasma discharge (PD) can be generated even at a relatively low voltage. , It has the effect of preventing damage to the object to be treated (OB).
  • a low pressure environment (LPA) and a vacuum area are formed and a plasma discharge (PD) is generated in the internal space of the first body portion 11 that accommodates the object to be processed (OB).
  • PD plasma discharge
  • OB object to be treated
  • the processing unit 40 may include a sensor unit, and the sensor unit may detect whether the port unit 41 and the processing container 10 are in contact or connected.
  • the sensor unit detects whether the entire area where the processing container 10 and the port portion 41 are in contact is properly contacted, so that the entire area where the port portion 41 and the processing container 10 are connected is in close contact with the pressure adjusting unit ( There is an effect of adjusting the pressure inside the processing vessel 10 by driving 30).
  • the electrode unit 45 can receive power from the power supply unit 47 so that an electric field is formed between the plurality of electrode units 45.
  • the electrode unit 45 when an electric field is formed by the electrode unit 45 according to an embodiment of the present invention, a low pressure environment and a vacuum area are formed and the first body unit 11 accommodating the object to be treated (OB) Plasma may be generated in the internal space of , plasma is generated in the internal space, and plasma surface treatment of the object OB disposed in the internal space of the first body portion 11 may be performed.
  • OB object to be treated
  • the electrode unit 45 to which high voltage power is applied is prevented from being exposed to the outside, and an electric field can be formed in a sealed state in the space formed by the port unit 41 and the internal space of the processing vessel 10. there is.
  • the power supply unit 47 is electrically connected to the electrode unit 45, and can generate power and transmit it to the electrode unit 45.
  • the first electrode 45a is disposed on the outside of the first body 11 where the object to be treated (OB) is accommodated by applying power from the power source 47 to the electrode part 45 according to an embodiment of the present invention. , an electric field may be formed between the second electrodes 45b.
  • a floating electrode 13 is coupled to the inner surface of the first body portion 11 disposed between a plurality of electrodes, specifically the first electrode 45a and the second electrode 45b.
  • the intensity, spatial distribution, or shape of the electric field formed between the first electrode 45a and the second electrode 45b may be changed due to the floating electrode 13.
  • the electric field is concentrated in the space formed between the plurality of electrode parts 45 and the floating electrode 13 due to the floating electrode 13, and the object to be treated is disposed in the inner space of the first main body 11.
  • plasma processing efficiency can be improved.
  • processing container 10 according to the first to third embodiments of the present invention will be described in detail.
  • Figure 4 is a perspective view showing a plasma processing vessel according to the first embodiment of the present invention.
  • Figure 5 is an exploded view showing a plasma processing vessel according to the first embodiment of the present invention.
  • FIG. 6 is a cross-sectional view based on line II′ of FIG. 4.
  • FIG. 7 is a cross-sectional view based on line II-II′ of FIG. 4.
  • the processing container 10 is used for plasma processing of the object to be treated (OB) accommodated therein, and includes a first body portion 11, a floating electrode 13, and a film portion. (15), a sealing part 17, and a flow restriction part (not shown) may be included.
  • the first body portion 11 is capable of accommodating an object to be treated (OB) and may include a first body 111, a cap portion 115, and a sealing portion 17. .
  • OB object to be treated
  • the object to be treated (OB) accommodated in the processing container 10 according to the first embodiment of the present invention can be formed as a full crown that can be installed and completely or partially covers the teeth of the human body. there is.
  • the object to be treated (OB) accommodated in the processing container 10 according to the first embodiment of the present invention may have a curved section formed in a 'U' shape, and the object to be treated may be inside the first body 111.
  • a crossing protrusion (reference numeral not set) may be formed to protrude so as to span the curved section of (OB).
  • the first body 111 has a hollow interior to accommodate the object to be treated (OB), and can be combined with the cap portion 115, which will be described later.
  • OB object to be treated
  • a communication hole 11h may be formed through one surface of the first body 111. There may be a plurality of communication hole portions 11h, and the communication hole portion 11h is formed so that air flows between the inner space surrounded by the first body 111 and the cap portion 115 and the outer space of the processing container 10. There is an effect that allows the flow of gas (G) as follows.
  • the communication hole portion 11h formed in the first body 111 may be disposed facing the processing portion 40, specifically the port portion 41, which will be described later, and the internal space of the first body portion 11.
  • Gas (G) may flow from the port portion 41 to the pressure adjusting portion 30.
  • the cap portion 115 covers the first body 111, and the object to be treated (OB) is accommodated in the internal space of the first body 111. ) can be combined with.
  • a cap protrusion 116 may be formed on one surface of the cap portion 115 facing the first body 111 to protrude toward the first body 111 .
  • a plurality of cap protrusions 116 may be provided and may be spaced apart along the circumference of the center of the cap portion 115 .
  • the first body 111 may have a preset depth so that the cap protrusion 116 spans, and the spanning groove 112 may be formed in the shape of a groove.
  • a protruding protrusion 116k may be formed to protrude inward at one end of the cap protrusion 116 (lower end in FIG. 6) facing the first body 111, and a straddling groove ( 112) It can be draped over a groove formed with a preset depth.
  • the floating electrode 13 is installed in the first body portion 11 and may be made of a metal material.
  • the floating electrode 13 may be connected to the first body 11, specifically the first body 111 and the cap portion 115.
  • the floating electrode 13 does not receive power from the power source 47 and is not grounded, so it is connected to the first body 11, specifically the first body 111, and the cap part ( 115).
  • the floating electrode 13 may be disposed between a plurality of electrode units 45 that form an electric field inside the processing vessel 10, A strong electric field can be formed in the internal space of the processing vessel 10, specifically the first main body 11, between the floating electrode 13 and the electrode unit 45.
  • the electric field can be uniformly formed in the outer area of the object OB by modifying the intensity, spatial distribution, or shape of the electric field. It has the effect of allowing you to do so.
  • the object to be processed located between the plurality of electrode parts 45 ( OB) has the effect of discharging a uniform plasma.
  • the floating electrode 13 may be connected to the first body 111 and the cap portion 115, respectively.
  • a floating electrode 13 extending along a preset direction is formed in the first body 111 and the cap portion 115 along the outer circumference of the object to be processed (OB) accommodated in the internal space of the first body 11.
  • a seating groove portion 111a may be formed on the inner surface of the first body 111 and the inner surface of the cap portion 115 so that the electrode can be placed along the inner surface of the cap portion 115, and the floating electrode 13 may be disposed in the seating groove portion 111a.
  • the floating electrode 13 may be arranged to contact the inner surfaces of the first body 111 and the cap portion 115. As a result, the floating electrode 13 is disposed in the area where the plasma discharge (PD) occurs in the internal space of the first main body 11, and as a result, the electric field is formed uniformly in the area surrounded by the floating electrode 13. The intensity and shape of the electric field are modified, and the effect of concentrating the electric field can be achieved.
  • PD plasma discharge
  • the floating electrode 13 may be formed in a structure that supports the inner surface of the first body 11 to prevent deformation of the first body 11.
  • the floating electrode 13 maintains the shape of the first body 11 even if a pressure difference occurs inside and outside the first body 11 during the plasma treatment of the object OB. It may be formed in a structure that supports the inner surface of the first body portion 11 to prevent deformation.
  • the pressure adjusting unit 30 is driven, and gas such as air is discharged from the internal space of the first main body 11. This has the effect of preventing the internal space of the unit 11 from being reduced or deformed.
  • the floating electrode 13 is not disposed on the cap protrusion 116 formed on the cap portion 115, but is not limited to this and the groove is also formed on the cap protrusion 116, and the floating electrode 13 is not disposed on the cap protrusion 116 formed on the cap portion 115.
  • Various modifications are possible, such as the electrode 13 being disposed.
  • the floating electrode 13 according to the first embodiment of the present invention may be electrically insulated. As a result, the floating electrode 13 may be blocked from receiving power from the power supply unit 47.
  • the floating electrode 13 may be formed in a ring shape and form a closed section.
  • the floating electrode 13 may be formed in a closed section, specifically a ring shape.
  • the floating electrode 13 includes an electrode unit 45, specifically a first electrode 45a and a second electrode 45b, which receive power from the power supply unit 47. When applied to form an electric field, it may be placed in the center of the first main body 11 based on the direction in which the electric field is formed (up and down direction based on FIG. 1).
  • the communication hole portion 11h formed in the first body portion 11 and the floating electrode 13 are disposed in an overlapping position, but this is for schematic illustration only, as shown in FIGS. 4 to 7.
  • Various modifications are possible, such as arranging the floating electrode 13 and the communication hole portion 11h to be spaced apart.
  • the processing container 10 may further include a film portion 15.
  • the film portion 15 covers the floating electrode 13 and is coupled to the first body portion 11, and may be formed of an insulating material.
  • the floating electrode 13 can be maintained in an electrically insulated state.
  • the film portion 15 covers the floating electrode 13, it prevents direct contact between the floating electrode 13 and the object OB, and prevents the object OB from being damaged during the plasma treatment process. It has the effect of preventing this.
  • the film portion 15 covers the floating electrode 13 disposed in contact with the inner surfaces of the first body 111 and the cap portion 115 and may be coupled to the first body 11.
  • the film portion surrounds the outer peripheral surface of the floating electrode 13 and may be disposed in the first body portion 11, specifically the first body 111 and the seating groove portion 111a formed in the cap portion 115. .
  • the film portion 15 is formed of an insulating material and covers the floating electrode 13, so that the floating electrode 13 does not receive power from the power supply portion 47 and the electric field formed between the plurality of electrode portions 45 is reduced. There is an effect of improving plasma discharge (PD) processing efficiency by concentrating it in a preset area.
  • PD plasma discharge
  • the floating electrode 13 is disposed so that the electric field can be concentrated in the area formed between the electrode portion 45, specifically the first electrode 45a, the second electrode 45b, and the floating electrode 13.
  • the electric field is concentrated around the object OB accommodated in the internal space of the first body 11, which has the effect of improving uniformity during plasma treatment of the surface of the object OB.
  • the thickness of the film portion 15 may be the same as that of the first body portion 11 or may be formed to be relatively thin. This has the effect of securing the insulation performance of the floating electrode 13.
  • the sealing part 17 is disposed between the first body 111 and the cap part 115, and may be formed of a material capable of elastic deformation. Referring to FIGS. 5 and 7 , the sealing portion 17 may be seated and disposed on the sealing groove portion 113 formed in the first body 111.
  • the sealing groove portion 113 is formed in the first body 111, but the sealing groove portion 113 is not limited to this and is formed in the cap portion 115, etc., and the sealing groove portion 17 is formed in the first body 111. (111), various modifications are possible within the technical idea of being in close contact with the cap portion 115 and improving airtightness.
  • the flow limiting portion covers the communication hole portion 11h and is coupled to the first body portion 11, which limits the flow of fluid between the inner space and the outer space of the first body portion 11. You can.
  • the flow restrictor may only allow the flow of gas.
  • G gas
  • foreign substances etc.
  • the flow restriction portion may be coupled to the outer surface of the first body portion 11.
  • the flow restriction portion is formed in a film manner and may be coupled to the outer or inner surface of the first body portion 11.
  • Figure 8 is a perspective view showing a plasma processing vessel according to a second embodiment of the present invention.
  • Figure 9 is an exploded view showing a plasma processing vessel according to a second embodiment of the present invention.
  • FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 8.
  • FIG. 11 is a cross-sectional view based on line IV-IV′ of FIG. 8.
  • the processing container 10' is used for plasma processing of the object to be processed contained therein, and includes a first body portion 11', a floating It may include an electrode 13′, a film portion 15′, and a first body cap 14′.
  • the first main body 11' is capable of receiving an object to be treated and includes a first main body 111' and a cap part 115'. can do.
  • the object to be treated accommodated in the treatment container 10' is a bone graft material, such as a syringe (OB1) or a vial (OB2). ) can be accommodated in an internal container such as
  • the object to be treated is accommodated in the inner space of the syringe DHK (OB1) and the vial (OB2) and can be plasma treated.
  • the object to be treated rather than placing the object to be treated, such as bone graft material, separately into the syringe (OB1) and vial (OB2) after plasma treatment, the object to be treated is accommodated in a container like the syringe (OB1) and vial (OB2). It has the effect of being immediately plasma treated.
  • the first body 111 ⁇ accommodates an internal container such as a syringe OB1 and a vial OB2 in which the object to be treated is accommodated, and one side (upper side in FIG. 9) has an opening. It can be.
  • the first body 111 ⁇ has a hollow interior so as to accommodate the object to be treated and the internal containers OB1 and OB2 in which the object to be treated are accommodated, and the cap portion 115 to be described later. ⁇ ) can be combined.
  • the first body 111' according to the second embodiment of the present invention has a preset depth so that the floating electrode 13' can be seated along the inner peripheral surface and has a seating groove ( 111 ⁇ a) may be formed in the shape of a groove.
  • the outer peripheral surface of the floating electrode 13' is located on the same plane as the inner peripheral surface of the first body 111', and the floating electrode 13' is prevented from being separated from the first body 111'. There is.
  • a crossing groove 112' may be formed at one end of the first body 111' (upper part based on Figure 9) with a preset depth, and the crossing groove 112' may be formed as described later.
  • the cap protrusion 116 ′ formed on the cap portion 115 ′ may be overlaid.
  • the cap protrusion 116' may be coupled to the spanning groove 112' in a fitting manner.
  • the first body 111' has an internal container in which the object to be treated is accommodated, specifically a first container that is formed as a hollow hole so that a syringe (OB1) and a vial (OB2) can be inserted.
  • a portion 113 ⁇ a and a second receiving portion 113 ⁇ b may be formed.
  • the first accommodating part 113 ⁇ a may have an inner circumferential surface formed to correspond to the shape of the syringe OB1
  • the second accommodating part 113 ⁇ b may have an inner circumferential surface formed to correspond to the shape of the vial OB2.
  • one surface of the first body 111 ⁇ (top surface in FIG. 9) has at least one fixing part 114 ⁇ on the outside based on the center of the first accommodating part 113 ⁇ a. may be formed to protrude in an outward direction.
  • the plurality of fixing parts 114 ⁇ may be arranged equiangularly along the circumferential direction based on the center of the first receiving part 113 ⁇ a.
  • the syringe OB1 is inserted into the first receiving part 113 ⁇ a, and one side of the syringe OB1 (based on FIG. 10) is disposed inside the plurality of fixing parts 114 ⁇ . , there is an effect of blocking the syringe OB1 from rotating clockwise or counterclockwise inside the first accommodating part 113 ⁇ a and fixing its position.
  • the cap portion 115' covers the first body 111', and the internal containers OB1 and OB2 in which the object to be treated are accommodated are inside the first body 111'. It can be combined with the first body 111' while accommodated in space.
  • a cap protrusion 116 ′ may be formed on one side of the cap portion 115 ′ facing the first body 111 ′ to protrude toward the first body 111 ′.
  • a plurality of cap protrusions 116 ′ may be provided and may be spaced apart along the circumference of the center of the cap portion 115 ′.
  • the first body 111 ′ has a preset depth so that the cap protrusion 116 ′ extends, and the spanning groove 112 ′ may be formed in the shape of a groove.
  • the processing container 10' has a communication hole portion 11' in the cap portion 115'. h) may be formed through.
  • the communication hole portion 11 ⁇ h may be provided with a plurality of hole portions, and the communication hole portion 11 ⁇ h is formed so that the object to be treated is accommodated and an inner container OB1 inserted into the first body 111 ⁇ is placed. This has the effect of allowing the flow of gas (G) such as air between the inner space of OB2) and the outer space of the processing container (10').
  • the communication hole portion 11′h formed in the cap portion 115′ may be disposed facing the processing portion 40, specifically the port portion 41, and is accommodated in the first body 111′ and is subject to processing.
  • a gas (G) such as air may flow from the internal space of the internal containers (OB1, OB2) containing water to the pressure adjusting unit (30) through the port unit (41).
  • the inner surface of the cap portion 115' according to the second embodiment of the present invention specifically, one surface facing the first body cap 14' is pressed in the direction toward the first body cap 14'.
  • the portion 117 ⁇ may be formed to protrude.
  • the pressing portion 117 ⁇ may contact and pressurize one surface (upper surface in FIG. 10) of the first body cap 14 ⁇ and may be formed to extend along the circumferential direction on the inner surface of the cap portion 115 ⁇ .
  • the pressing portion 117 ⁇ contacts and pressurizes one surface of the first body cap 14′, the inner region surrounded by the pressing portion 117 ⁇ can be spatially separated from the outer region of the pressing portion 117 ⁇ . There is an effect of improving the airtightness and sealing of the inner area.
  • the floating electrode 13' is installed in the first body 111' and may be made of a metal material.
  • the floating electrode 13' may be connected to the first body 111' without receiving power from the power source 47 or being grounded, and specifically, the first body 111'. It is placed in the seating groove portion 111 ⁇ a formed on the inner surface of and can be fixed in position.
  • the floating electrode 13' may be arranged to contact the inner surface of the first body 111'.
  • the floating electrode 13′ is disposed surrounding the area where the plasma discharge (PD) occurs in the internal space of the first body portion 111′, and the electric field is concentrated around the floating electrode 13′, An electric field may be formed uniformly throughout the first body 111 ⁇ .
  • the floating electrode 13' may be formed in a structure that supports the inner surface of the first body 11', specifically the first body 111', to prevent deformation of the first body 111'. .
  • the floating electrode 13 ′ maintains the pressure of the first body 111 ′ even if a pressure difference occurs inside and outside the first body 111 ′ during the plasma treatment of the object OB. It may be formed in a structure that supports the inner surface of the first body 111' to prevent shape deformation.
  • the floating electrode 13' secures rigidity and maintains its shape, so that when the pressure adjusting unit 30 is driven, gas such as air is discharged from the internal space of the first body 11'.
  • gas such as air is discharged from the internal space of the first body 11'.
  • the floating electrode 13' is an electrode portion 45 that forms an electric field inside the processing container 10', specifically a first electrode 45a and a second electrode 45b disposed facing each other. ) and may be located in the center of the first body 111' based on the plasma processing direction (up and down direction based on FIG. 8).
  • the processing container 10′ between the floating electrode 13′ and the electrode unit 45, specifically the syringe OB1 for receiving the object to be treated such as bone graft material in the first body 111′, and the vial A strong electric field can be formed in the internal space (IS1, IS2) of (OB2).
  • the floating electrode 13' surrounds the object to be treated and is disposed on the outside, it has the effect of allowing an electric field to be uniformly formed in the outer area of the object to be treated.
  • the floating electrode 13' may be electrically insulated. As a result, the floating electrode 13' may be blocked from receiving power from the power supply unit 47.
  • the floating electrode 13' may be formed in a ring shape and form a closed section.
  • the floating electrode 13' may be formed in a closed section, specifically a ring shape.
  • the first body cap 14 ⁇ covers the first accommodating portion 113 ⁇ a and the second accommodating portion 113 ⁇ b formed in the first body 111 ⁇ . It is coupled to the first body 111′ and may be disposed between the first body 111′ and the cap portion 115′.
  • a through-hole portion 14'h may be formed through the first body cap 14', and the through-hole portion 14'h may be a communication hole formed in the cap portion 115'. It can be connected to (11 ⁇ h).
  • the passage hole part 14 ⁇ h communicates with the communication hole part 11 ⁇ h on one side (upper side in FIG. 10), and on the other side opposite to it (lower side in FIG. 10), there is an inside such as a syringe or vial in which the object to be treated is accommodated. It may communicate with the internal space of the containers OB1 and OB2.
  • contact portions 141' and 142' may be formed to protrude outward on one surface of the first body cap 14' facing the first body 111'.
  • the contact portions 141 ⁇ and 142 ⁇ may have at least one curved section and may be formed to protrude.
  • the contact portions 141' and 142' may be formed of a material capable of elastic deformation. Referring to FIGS. 9 and 10, one contact portion 141′ may be disposed in close contact with the inner peripheral surface of the first body 111′, and the other contact portion 142′ may be an internal container such as a syringe ( It can be placed in close contact with the inner peripheral surface of OB1).
  • the flow restrictor covers the communication hole portion 11 ⁇ h and is coupled to the first body portion 11 ⁇ , which prevents the flow of fluid between the inner space and the outer space of the first body portion 11 ⁇ . Flow may be restricted.
  • the flow restrictor may only allow the flow of gas.
  • G gas
  • foreign substances etc.
  • the flow restriction portion may be coupled to the outer surface of the first body portion 11′, specifically the cap portion 115′.
  • the cap portion 115′ may be coupled to the inner surface of the cap portion 115′ within the technical idea of covering the communication hole portion 11′h and restricting the flow of fluid.
  • the flow restriction portion is formed in a film manner and may be coupled to the outer or inner surface of the first body portion 11 ⁇ .
  • the flow restricting portion covers the through hole portion 14′h formed in the first body cap 14′ disposed between the cap portion 115′ and the first body 111′ and covers the first body cap 115′. It can be combined with the outer or inner surface of (14 ⁇ ).
  • the processing container 10' according to the second embodiment of the present invention may further include a film portion 15'.
  • a film portion 15' since the structure and effect are the same as those of the film portion 15 of the processing container 10 according to the first embodiment, detailed description will be omitted to the extent of overlap.
  • Figure 12 is a perspective view showing a plasma processing vessel according to a third embodiment of the present invention.
  • Figure 13 is an exploded view showing a plasma processing vessel according to a third embodiment of the present invention.
  • FIG. 14 is a cross-sectional view based on line V-V′ of FIG. 12.
  • Figure 15 is an enlarged view of part A of Figure 14.
  • FIG. 16 is a cross-sectional view based on line VI-VI′ in FIG. 12.
  • the processing container 10 ⁇ is used for plasma processing of the object to be treated (OB) accommodated therein, and has a container body portion (drawing) symbol not set), a floating electrode (13 ⁇ ), a film part (not shown), and a flow restriction part.
  • the 'container body portion' in the processing container 10 ⁇ according to the third embodiment of the present invention corresponds to the first body portion 11 in the processing container 10 according to the first embodiment of the present invention. , the terminology was changed to distinguish it from the first main body 11 according to the first embodiment.
  • the container body portion can accommodate the object to be treated (OB), and includes a first body portion (111′′), a guide portion (112′′), and a first body cap (113′′). , a second main body (114 ⁇ ), and a cap part (115 ⁇ ).
  • OB object to be treated
  • the object to be treated (OB) accommodated in the processing container 10 ⁇ , specifically the first main body 111 ⁇ , according to the third embodiment of the present invention has a preset thickness and area, and the first main body 111 ⁇ has a preset thickness and area. It can be accepted in section (111 ⁇ ).
  • a plasma discharge (PD) is generated by the plasma processing device 1 while the object OB is accommodated inside the first body 111 ⁇ , and the surface of the object OB is generated due to the plasma. Processing is possible.
  • the object to be treated (OB) according to the third embodiment of the present invention is used in the medical industry and is used for human skin restoration, which is used for replacement, restoration, and reconstruction of human tissues and organs such as skin (dermal, cutaneous). It refers to biomaterial (skin graft).
  • the first body portion 111 ⁇ can accommodate the object to be treated OB and may have a hollow interior.
  • a floating electrode 13 ⁇ is connected to the first body 111 ⁇ , and the floating electrode 13 ⁇ may be disposed inside the first body 111 ⁇ .
  • a first body rib 111 ⁇ a may be formed to protrude from the inner surface of the first body portion 111 ⁇ along the longitudinal direction (up and down direction based on FIG. 14).
  • a plurality of first main body ribs 111 ⁇ a may be provided, and a plurality of first main body ribs 111 ⁇ a may be spaced apart from each other at a preset interval.
  • a plurality of first body ribs (111 ⁇ a) are spaced apart from each other at preset intervals along the inner peripheral surface of the first body portion (111 ⁇ ), so that they are located on the inside of the first body rib (111 ⁇ a). It is possible to prevent the disposed object OB from adhering to the inner surface of the first body portion 111 ⁇ .
  • the pressure adjusting unit 30 when the pressure adjusting unit 30 is driven through the space formed between the plurality of first main body ribs 111 ⁇ a, the communication hole part 115 ⁇ h is formed inside the first main body part 111 ⁇ . It is possible to provide a flow path for gas (G) such as air that is discharged to the outside.
  • gas (G) such as air
  • LPA low pressure environment
  • the first body rib 111 ⁇ a protruding from the inner surface of the first body part 111 ⁇ is a guide rib protruding from the inner surface of the guide part 112 ⁇ to be described later. It can be connected to (112 ⁇ a).
  • the space between the plurality of first body ribs 111 ⁇ a and the space between the plurality of guide ribs 112 ⁇ a can be communicated, and the processing container 10 ⁇ , specifically the first main body. It has the effect of providing a flow and discharge path for air (G) from the internal space of the unit 111 ⁇ to the external space.
  • a step portion 111 ⁇ b may be formed to protrude inward on the inner surface of the first main body 111 ⁇ according to the third embodiment of the present invention.
  • the step portion 111 ⁇ b protrudes inward so that the cross-sectional area of the first main body 111 ⁇ is formed differently along the longitudinal direction (up and down direction based on FIG. 14) of the first main body 111 ⁇ . It can be formed to a preset length.
  • a plurality of first body ribs 111 ⁇ a are formed in advance along the inner peripheral surface. They can be spaced apart at set intervals.
  • the first body rib 111 ⁇ a is protruded in the second area excluding the first area where the step part 111 ⁇ b is formed to protrude from the first body 111 ⁇ . It may not work.
  • a floating electrode 13 ⁇ and a guide part 112 ⁇ to be explained later may be inserted and placed in the second area.
  • the floating electrode 13 ⁇ and the guide part 112 ⁇ may be arranged in a stacked manner in the second area.
  • the guide part 112 ⁇ is inserted into the first body part 111 ⁇ , and can be opened on both sides (upper and lower sides in Figure 14) along the length direction.
  • a plurality of guide units 112 ⁇ may be provided and may be alternately arranged with a plurality of floating electrodes 13 ⁇ .
  • the guide part 112 ⁇ may be disposed on the upper side (based on FIG. 14) of the step part 111 ⁇ b protruding from the inner surface of the first body part 111 ⁇ .
  • a guide rib 112 ⁇ a may be formed to protrude from the inner surface of the guide part 112 ⁇ , and a plurality of guide ribs 112 ⁇ a may be provided.
  • a plurality of guide ribs (112 ⁇ a) may be connected to the first main body rib (111 ⁇ a) formed in the first body portion (111 ⁇ ), and the first main body rib (111 ⁇ a), the guide A flow path for air (G) may be provided along the ribs 112 ⁇ a from the inner space of the processing vessel 10 ⁇ , specifically the first main body 111 ⁇ , to the external space.
  • the first body cap (113 ⁇ ) covers the first body part (111 ⁇ ) and is coupled to the first body part (111 ⁇ ), and the cover body (113 ⁇ ) ⁇ a), and may include a cover sealing portion 113 ⁇ b.
  • the cover body 113 ⁇ a is formed with a plurality of passage hole parts 113 ⁇ h, and can communicate with the internal space of the first main body 111 ⁇ .
  • the cover sealing portion (113 ⁇ b) is coupled to the cover body (113 ⁇ a) and may be coupled along the outer peripheral surface of the cover body (113 ⁇ a).
  • the cover sealing part 113 ⁇ b may be formed of an elastically deformable material, and is disposed between the first body part 111 ⁇ and the cap part 115 ⁇ , which will be described later, and the first body part ( In the internal space of 111 ⁇ ), air passes through the through hole part 113 ⁇ h and the communication hole part 115 ⁇ h and is discharged to the external space, so that the first body part 111 ⁇ and the cap part 115 ⁇ ) can improve the airtightness and sealing between
  • a groove may be formed along the inner peripheral surface of the cover sealing portion (113 ⁇ b), and the cover body (113 ⁇ a) may be provided with a coupling protrusion (see drawing) so that it can be inserted into the groove along the outer peripheral surface. (sign not set) may be formed protrudingly.
  • the second body portion 114′′ is hollow on the inside, and the first body portion 111′′ can be inserted and placed therein.
  • the second body portion (114 ⁇ ) is combined with the cap part (115 ⁇ ), which will be explained later, and the first body part ( 111 ⁇ ), and the first body cap 113 ⁇ can be disposed.
  • a crossing groove 114 ⁇ a may be formed at one end (upper part based on FIG. 13) of the second main body 114 ⁇ , and has a preset depth, and the crossing groove 114 ⁇ a may be formed.
  • a cap protrusion (115 ⁇ a) formed on the cap part (115 ⁇ ) may span over (114 ⁇ a).
  • the cap protrusion (115 ⁇ a) may be coupled to the spanning groove part (114 ⁇ a) in a fitting manner.
  • a spaced portion 114 ⁇ b may be formed to protrude in an outward direction on the inner surface of the second main body 114 ⁇ , and a plurality of spaced parts 114 ⁇ b may be provided. 2 It may be spaced apart along the inner circumference of the main body (114 ⁇ ).
  • the plurality of spaced portions 114 ⁇ b are capable of contacting the outer peripheral surface of the first main body 111 ⁇ , and are located in the inner space of the second main body 114 ⁇ . The position can be guided, and a separation space is formed between the outer peripheral surface of the first body portion (111 ⁇ ) and the inner peripheral surface of the second main body portion (114 ⁇ ).
  • a low pressure environment is created by driving the pressure adjusting unit 30 only in the inner space of the first body 111 ⁇ , where the object to be treated (OB) is accommodated, and the first body 111 ⁇ ) has the effect of allowing plasma discharge processing to be concentrated only in the inner space of the device.
  • the cap portion 115 ⁇ covers the second body part 114 ⁇ , and is the first body in which the object to be treated OB is accommodated.
  • the main body 111 ⁇ can be coupled to the second main body 114 ⁇ while being accommodated in the internal space of the second main body 114 ⁇ .
  • a cap protrusion 115 ⁇ a is formed toward the second main body 114 ⁇ .
  • a protrusion may be formed.
  • a plurality of cap protrusions 115 ⁇ a may be provided and may be spaced apart along the circumference of the center of the cap part 115 ⁇ a.
  • the second body portion 114 ⁇ has a preset depth so that the cap protrusion 115 ⁇ a extends, and the spanning groove 114 ⁇ a is formed in the shape of a groove. It can be.
  • the processing container 10′′ according to the third embodiment of the present invention may have a communication hole 115′′h formed through the cap portion 115′′.
  • the communication hole part 115 ⁇ h is formed to form an internal space of the first body part 111 ⁇ where the object to be treated (OB) is accommodated, and This has the effect of allowing the flow of gas such as air between the external spaces of the processing container (10 ⁇ ).
  • the communication hole portion 115′′h formed in the cap portion 115′′ may be disposed facing the processing portion 40, specifically the port portion 41, and may be disposed to accommodate the object to be treated (OB).
  • a gas (G) such as air may flow to the pressure adjustment unit 30 through the port unit 41.
  • the inner surface of the cap portion 115′′ according to the third embodiment of the present invention specifically, the first body cap 113 ⁇ on one side facing the first body cap 113′′.
  • the pressing portion 115 ⁇ b may be formed to protrude in the lateral direction.
  • the pressing portion 115 ⁇ b can contact and pressurize one surface (upper surface in FIG. 15) of the first body cap 113 ⁇ , and extends along the circumferential direction on the inner surface of the cap part 115 ⁇ . It can be.
  • the inner area surrounded by the pressurizing part 115 ⁇ b is the outer side of the pressurizing part 115 ⁇ b. It can be spatially separated from the area, and has the effect of improving the airtightness and sealing of the inner area.
  • the floating electrode 13 ⁇ is connected to the first body 111 ⁇ , and may be electrically insulated from the outside of the first body 111 ⁇ .
  • the floating electrode 13 ⁇ may be formed of a metal material.
  • the floating electrode 13 ⁇ may be connected to the first body unit 111 ⁇ without receiving power from the power source 47 or being grounded, and the floating electrode 13 ⁇ ) may be formed as a structure that supports the inner surface of the first body portion 111 ⁇ to prevent deformation of the first body part 111 ⁇ .
  • the floating electrode 13 ⁇ maintains the first electrode 13 ⁇ even if a pressure difference occurs inside and outside the first body 111 ⁇ during the plasma treatment of the object OB. It may be formed in a structure that supports the inner surface of the first body portion 111 ⁇ to prevent shape deformation of the main body portion 111 ⁇ .
  • the floating electrode 13 ⁇ may be disposed along the inner peripheral surface of the first body 111 ⁇ and may be formed in a structure where the start point and the end point are connected.
  • the floating electrode 13 ⁇ may be formed in a closed curve shape along the inner peripheral surface of the first body 111 ⁇ .
  • the floating electrode 13′′ is an electrode portion 45, specifically the first electrode 45a, the first electrode 45a, which forms an electric field inside the processing container 10′′. It may be disposed between the two electrodes 45b, and may be located in the center of the first body portion 111′′ based on the plasma processing direction (up and down direction based on FIG. 13).
  • a uniform and strong electric field can be formed.
  • the floating electrode 13 ⁇ surrounds the object OB and is disposed on the outside, it has the effect of allowing an electric field to be uniformly formed in the outer area of the object OB.
  • the electrode unit 45 specifically the opposing electrode unit 45, is formed. There is an effect of discharging a uniform plasma to the object OB located between the first electrode 45a and the second electrode 45b.
  • the floating electrode 13 ⁇ may be electrically insulated. As a result, the floating electrode 13 ⁇ may be blocked from receiving power from the power supply unit 47.
  • the processing container 10 ⁇ according to the third embodiment of the present invention may further include a film portion.
  • the composition and effect are the same as those of the film portions 15, 15' of the processing containers 10, 10' according to the first and second embodiments, detailed description will be omitted to the extent of overlap.
  • the flow restricting part covers the communication hole part (115 ⁇ h) and is coupled to the container main part, specifically the cap part (115 ⁇ ), so that the fluid flows between the inner space of the container main part and the outer space. can be limited.
  • the flow restrictor may only allow the flow of gas.
  • G gas
  • foreign substances etc.
  • it may be coupled to the flow restriction portion, specifically the outer surface of the cap portion (115 ⁇ ).
  • the flow restriction portion specifically the outer surface of the cap portion (115 ⁇ ).
  • it is not limited to this, and various modifications are possible, such as being coupled to the inner surface of the cap part (115 ⁇ ) within the technical idea of covering the communication hole part (115 ⁇ h) and restricting the flow of fluid.
  • the flow restriction portion may be formed in a film manner and may be coupled to the container body portion.
  • the flow restriction portion is formed on the first body cap (113 ⁇ ) disposed between the cap part (115 ⁇ ) and the first body (111 ⁇ ), specifically the cover body (113 ⁇ a). It covers the through hole portion (113 ⁇ h) and can be coupled to the outer or inner surface of the cover body (113 ⁇ a).
  • the plasma processing system 2 includes a processing vessel 10 in which an object to be treated (OB) is accommodated and a floating electrode 13 is provided. It is used for storing and plasma processing the object to be treated (OB), and may include a housing unit 20, a pressure adjusting unit 30, and a processing unit 40.
  • the plasma processing system 2 since the plasma processing system 2 according to another embodiment of the present invention has a difference in the configuration of the processing unit 40 compared to the plasma processing device 1 according to an embodiment of the present invention, the differences will be described in detail below. Let me explain.
  • the processing unit 40 forms an electric field to form a plasma discharge (PD) inside the processing container 10, and includes a port unit 41, It may include a processing housing 43, an electrode unit 45, and a power supply unit 47.
  • PD plasma discharge
  • the port portion 41 is disposed between the pressure adjustment unit 30 and the processing vessel 10, and may be disposed outside the processing vessel 10. That is, the port portion 41 can be disposed in a non-contact manner with the processing container 10.
  • the port portion 41 may be installed in the processing housing 43 forming a closed space, and may communicate with the internal space of the processing housing 43 and the external space.
  • gas (G) such as air accommodated in the internal space of the processing vessel 10 is discharged into the internal space of the processing housing 43 through the communication hole portion 11h, and the port As it flows into the pressure adjusting unit 30 through the unit 41, the internal space of the processing vessel 10 and the processing housing 43 may be formed into a low pressure environment (LPA).
  • LPA low pressure environment
  • the processing housing 43 according to an embodiment of the present invention is disposed inside the housing portion 20 and can accommodate the processing container 10.
  • a port portion 41 and an electrode portion 45 may be installed in the processing housing 43.
  • the processing unit 40 may have a processing container 10 disposed inside the processing housing 43, and a port portion 41. ) may have a structure that does not directly contact the processing housing 43.
  • air (G) may be discharged from the internal space of the processing housing 43 and the processing container 10 due to the operation of the pressure adjusting unit 30.
  • the electrode unit 45 receives power from the power supply unit 47 to form an electric field, and generates a plasma discharge (PD) in the internal space of the processing housing 43 to generate a plasma discharge (PD) in the processing container 10.
  • Plasma treatment is possible on the surface of the object to be treated (OB) accommodated in the internal space of .
  • the processing unit 40 includes a processing housing 43, except that the port unit 41 and the processing container 10 do not directly contact each other.
  • Processing containers (10, 10 ⁇ , 10 ⁇ ) according to the first to third embodiments of the present invention may be provided, and a housing portion ( 20), Since the configuration, operating principle, and effect of the pressure adjustment unit 30 are the same, detailed description will be omitted to the extent of overlap.
  • Figure 20 is a flowchart showing a plasma processing method according to embodiments of the present invention.
  • the plasma processing method includes inserting a processing container containing an object to be treated into a housing unit (S10), attaching the processing container to the processing unit (S20), and adjusting the internal pressure of the processing container. (S30) and generating plasma in the internal space of the processing vessel (S40).
  • the plasma processing apparatus 1 includes a processing vessel 10, 10', and 10 provided with a floating electrode 13. ⁇ ) and is used for plasma treatment of the object to be treated (0B) accommodated inside the processing container (10, 10 ⁇ , 10 ⁇ ), including a housing portion (20) and a pressure adjusting portion (30). , may include a processing unit 40.
  • the processing container 10, 10 in the step (S10) of inserting the processing container into the housing portion 20, the processing container 10, 10 according to embodiments of the present invention in which the object to be treated (OB) is accommodated therein. ⁇ , 10 ⁇ ) can be placed in the housing portion 20 to fix the position.
  • the object to be treated (0B) is accommodated in the inner space of the processing container (10, 10 ⁇ , 10 ⁇ ), specifically the first body portion (11), and the floating electrode (13) is connected to the first body portion (11). It is connected and may be disposed outside the object to be treated (0B) accommodated in the internal space of the first main body 11.
  • the floating electrode 13 may be connected to the outer peripheral surface of the processing containers 10, 10', such as the processing containers 10, 10' according to the first and second embodiments of the present invention, and the third embodiment. Like the processing container 10 ⁇ , it may be disposed between the inner surface of the first main body 11 and the object to be treated 0B.
  • the step (S20) of bringing the processing container into close contact with the processing unit 40 involves bringing the processing container (10, 10 ⁇ , 10 ⁇ ) into contact with the processing unit 40, and The processing containers (10, 10, 10, 10 ⁇ , 10 ⁇ ) can be brought into close contact.
  • the processing containers (10, 10 ⁇ , 10 ⁇ ) disposed in the housing part 20 may be formed with communication hole parts (11h, 11 ⁇ h, 115 ⁇ h), and communication hole parts (11h, 11 ⁇ h, 115 ⁇ h) allows the flow of a fluid, specifically a gas (G) such as air, between the internal space and the external space of the processing vessel (10, 10 ⁇ , 10 ⁇ ).
  • a fluid specifically a gas (G) such as air
  • the processing container 10 is in contact with the port portion 41, and the processing container 10 and the port main body 411 are connected due to the port portion 41, specifically the port sealing portion 413. It can be closely adhered.
  • the processing vessel 10 is brought into close contact with the port portion 41, and then the pressure adjusting unit 30 receives power from the outside. It can be driven.
  • the pressure adjusting unit 30 is directly or indirectly connected to the processing vessel 10 and can adjust the internal pressure of the processing vessel 10.
  • gas G flows from the internal space of the processing container 10, specifically the first main body 11, to the external space of the first main body 11 through the communication hole 11h. may be emitted.
  • the discharged gas (G) may pass through the communication hole portion (11h) and flow to the pressure adjusting portion (30) through the port portion (41).
  • a gas (G) such as air is discharged from the internal space of the processing container 10 to the external space
  • a low pressure environment LPA may be created in the internal space where the object to be treated (0B) is accommodated.
  • step (S40) of generating plasma in the internal space of the processing vessel power is applied from the power source unit 47 to the electrode unit 45, and both sides of the processing vessel 10 (FIG. An electric field is formed between the electrode portions 45 (3 reference upper and lower sides), specifically the first electrode 45a and the second electrode 45b, and plasma discharge (PD) can be generated.
  • the floating electrode 13 between the first electrode 45a and the second electrode 45b does not receive power from the power supply unit 47, and the first electrode 45a and the second electrode 45b do not receive power from the power supply unit 47. Due to being spaced apart from the electrode 45b, the intensity or shape of the electric field formed between the floating electrode 13 and the first electrode 45a and between the floating electrode 13 and the second electrode 45b can be changed.
  • the intensity of the electric field can be increased by allowing the electric field to be concentrated between the floating electrode 13 and the first electrode 45a and the second electrode 45b.
  • Plasma discharge (PD) is generated and has the effect of improving plasma processing efficiency.
  • the plasma processing device 2 according to another embodiment of the present invention has a different configuration from the plasma processing device 1 according to one embodiment of the present invention and the processing housing 43.
  • the above-described plasma processing method can be applied.
  • a plasma processing vessel a processing device, and a method are provided. Additionally, embodiments of the present invention can be applied to techniques for accommodating an object to be treated, sterilizing the object to be treated using plasma, or treating the surface of the object to be treated, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)

Abstract

Provided is a plasma treatment container, and treatment apparatus and method comprising same, the plasma treatment container according to one embodiment of the present invention, used to accommodate therein an object to be treated for plasma treatment, comprising: a first main body that can accommodate an object to be treated; and a floating electrode connected to the first main body, wherein the floating electrode is electrically insulated from the exterior of the first main body.

Description

플라즈마 처리용기, 처리장치 및 방법Plasma processing vessel, processing device and method

본 발명은 플라즈마 처리용기, 처리장치 및 방법에 관한 것으로, 보다 상세하게는 피처리물이 수용되는 처리용기의 내부에 균일한 플라즈마 방전을 발생시킬 수 있는 플라즈마 처리용기, 처리장치 및 방법에 관한 것이다.The present invention relates to a plasma processing container, a processing device, and a method, and more specifically, to a plasma processing container, a processing device, and a method capable of generating a uniform plasma discharge inside a processing container in which an object to be treated is accommodated. .

일반적으로 플라즈마 처리는 반도체, 디스플레이, 농업 및 의료 산업 등 여러 산업에서 다양한 목적으로 사용된다. In general, plasma processing is used for various purposes in several industries, including semiconductor, display, agriculture, and medical industries.

특히, 의료 산업에서 피부(dermal, cutaneous) 등 인체 조직 및 기관의 대체, 수복, 재건(reconstruction)에 사용되는 인체 피부 수복용 생체재료(skin graft)에 플라즈마 표면 처리가 사용되고 있고, 플라즈마 표면 처리를 통해 생체 적합성 및 이식 특성을 향상시킬 수 있는 효과가 있다.In particular, plasma surface treatment is used on biomaterials for human skin restoration (skin graft), which are used for replacement, restoration, and reconstruction of human tissues and organs such as skin (dermal, cutaneous) in the medical industry. This has the effect of improving biocompatibility and implantation characteristics.

플라즈마 표면 처리 기술은 표면 처리 대상체에 집중된 플라즈마 방전을 위한 구조와 공정 운영을 위한 관점으로 발전하였다. 이러한 대상체의 표면 처리 목적에 맞춰 필라멘트 방전을 방지하고, 글로우 방전(glow discharge)을 위한 기술 등이 개발되었다.Plasma surface treatment technology has developed from the perspective of structure and process operation for plasma discharge focused on the surface treatment object. In accordance with the purpose of surface treatment of such objects, technologies for preventing filament discharge and glow discharge have been developed.

종래 글로우 방전 내지 대상체 표면 처리에 대한 플라즈마 방전을 위한 기술은 특정한 형상, 크기를 갖춘 대상체에 대해서만 유효한 한계를 가지며, 피처리물인 대상체가 수납된 용기의 내부 전체에 균일한 방전이 이뤄지지 않는 문제점이 있었다.Conventional technologies for glow discharge or plasma discharge for object surface treatment have limitations that are effective only for objects with a specific shape and size, and there is a problem in that uniform discharge is not achieved throughout the entire interior of the container in which the object to be treated is stored. .

본 발명이 이루고자 하는 기술적 과제는 플라즈마 표면 처리 시 피처리물에 대하여 균일한 처리가 가능한 플라즈마 처리용기, 이를 포함하는 플라즈마 처리장치 및 처리방법을 제공하는 것이다.The technical problem to be achieved by the present invention is to provide a plasma treatment vessel capable of uniformly treating an object to be treated during plasma surface treatment, and a plasma treatment apparatus and treatment method including the same.

본 발명의 일 실시예에 따르면, 내부에 수용되는 피처리물의 플라즈마 처리를 위해 사용되는 플라즈마 처리용기에 있어서, 상기 피처리물을 수용가능한 제1본체부; 및 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리용기를 제공한다.According to one embodiment of the present invention, a plasma processing vessel used for plasma processing of an object to be treated contained therein, comprising: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.

본 발명의 일 실시예에 따르면, 피처리물이 수용되는 플라즈마 처리용기; 상기 플라즈마 처리용기가 배치가능한 하우징부; 상기 하우징부에 설치되고, 상기 플라즈마 처리용기와 유체의 유동이 가능하게 연결되며, 상기 플라즈마 처리용기의 내부 공간의 압력을 조정하는 압력조정부; 및 외부로부터 전원을 공급받아 상기 플라즈마 처리용기의 내부 공간에 플라즈마 방전이 발생하도록 전기장을 형성하는 처리부;를 포함하고, 상기 플라즈마 처리용기는, 상기 피처리물을 수용가능한 제1본체부; 및 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리장치를 제공한다.According to one embodiment of the present invention, a plasma processing vessel in which an object to be treated is accommodated; a housing portion in which the plasma processing vessel can be placed; a pressure adjusting unit installed in the housing, connected to the plasma processing vessel to enable fluid flow, and adjusting the pressure of the internal space of the plasma processing vessel; and a processing unit that receives power from the outside and forms an electric field to generate a plasma discharge in the internal space of the plasma processing container, wherein the plasma processing container includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.

본 발명의 일 실시예에 따르면, 피처리물의 표면을 처리하는 플라즈마 처리 방법에 있어서, 상기 피처리물이 수용되는 처리용기를 하우징부에 삽입하는 단계; 상기 하우징부에 설치되는 처리부에 상기 처리용기를 밀착시키는 단계; 상기 처리용기의 내부 공간의 압력을 조정하는 단계; 외부로부터 전원을 공급받아 상기 처리용기의 내부 공간에 플라즈마를 발생시키는 단계;를 포함하는 것을 특징으로 하고, 상기 처리용기는, 상기 피처리물을 수용가능한 제1본체부와; 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리방법을 제공한다.According to an embodiment of the present invention, a plasma processing method for treating the surface of an object to be treated includes the steps of inserting a processing container containing the object to be treated into a housing portion; attaching the processing container to a processing unit installed in the housing unit; adjusting the pressure of the internal space of the processing vessel; Generating plasma in the internal space of the processing vessel by receiving power from the outside, wherein the processing vessel includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.

본 발명의 실시예들에 따른 플라즈마 처리용기는 플로팅 전극을 구비하여, 처리용기 내부에 형성되는 전기장의 형상, 분포, 세기 등에 변화를 줄 수 있고, 이를 통해, 피처리물의 표면을 균일하게 플라즈마 처리할 수 있는 효과가 있다.The plasma treatment vessel according to embodiments of the present invention is provided with a floating electrode, and can change the shape, distribution, and intensity of the electric field formed inside the treatment vessel, and through this, the surface of the object to be treated is uniformly plasma treated. There is an effect that can be done.

또한, 플로팅 전극에 의해 처리용기의 내부 공간에 전기장이 균일하게 형성됨으로 인하여 상대적으로 낮은 전압으로도 피처리물에 대한 플라즈마 표면 처리가 가능하므로, 특정 영역에 전기장이 집중됨으로 인해 피처리물에 손상이 발생하는 것을 방지할 수 있는 효과가 있다.In addition, because the electric field is uniformly formed in the inner space of the processing vessel by the floating electrode, plasma surface treatment of the object to be treated is possible even at a relatively low voltage, so the electric field is concentrated in a specific area, causing damage to the object to be treated. It has the effect of preventing this from happening.

도 1은 본 발명의 일 실시예에 따른 플라즈마 처리장치를 개략적으로 도시한 도면이다.1 is a diagram schematically showing a plasma processing apparatus according to an embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 플라즈마 처리장치에서 플라즈마 처리용기의 압력이 조정되는 상태를 도시한 도면이다.Figure 2 is a diagram showing a state in which the pressure of a plasma processing vessel is adjusted in a plasma processing apparatus according to an embodiment of the present invention.

도 3은 본 발명의 일 실시예에 따른 플라즈마 처리장치에서 피처리물이 플라즈마 방전 처리되는 상태를 도시한 도면이다.Figure 3 is a diagram showing a state in which an object to be treated is plasma discharge treated in a plasma processing apparatus according to an embodiment of the present invention.

도 4는 본 발명의 제1실시예에 따른 플라즈마 처리용기를 도시한 사시도이다.Figure 4 is a perspective view showing a plasma processing vessel according to the first embodiment of the present invention.

도 5는 본 발명의 제1실시예에 따른 플라즈마 처리용기를 도시한 분해도이다.Figure 5 is an exploded view showing a plasma processing vessel according to the first embodiment of the present invention.

도 6은 도 4의 I-I`선을 기준으로 하는 단면도이다.FIG. 6 is a cross-sectional view based on line II′ of FIG. 4.

도 7은 도 4의 II-II`선을 기준으로 하는 단면도이다.FIG. 7 is a cross-sectional view based on line II-II′ of FIG. 4.

도 8은 본 발명의 제2실시예에 따른 플라즈마 처리용기를 도시한 사시도이다.Figure 8 is a perspective view showing a plasma processing vessel according to a second embodiment of the present invention.

도 9는 본 발명의 제2실시예에 따른 플라즈마 처리용기를 도시한 분해도이다.Figure 9 is an exploded view showing a plasma processing vessel according to a second embodiment of the present invention.

도 10은 도 8의 III-III`선을 기준으로 하는 단면도이다.FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 8.

도 11은 도 8의 IV-IV`선을 기준으로 하는 단면도이다.FIG. 11 is a cross-sectional view based on line IV-IV′ of FIG. 8.

도 12는 본 발명의 제3실시예에 따른 플라즈마 처리용기를 도시한 사시도이다.Figure 12 is a perspective view showing a plasma processing vessel according to a third embodiment of the present invention.

도 13은 본 발명의 제3실시예에 따른 플라즈마 처리용기를 도시한 분해도이다.Figure 13 is an exploded view showing a plasma processing vessel according to a third embodiment of the present invention.

도 14는 도 12의 V-V`선을 기준으로 하는 단면도이다.FIG. 14 is a cross-sectional view based on line V-V′ of FIG. 12.

도 15는 도 14의 A부분을 확대한 도면이다.Figure 15 is an enlarged view of part A of Figure 14.

도 16은 도 12의 VI-VI`선을 기준으로 하는 단면도이다.FIG. 16 is a cross-sectional view based on line VI-VI′ in FIG. 12.

도 17 내지 도 19는 본 발명의 다른 실시예에 따른 플라즈마 처리장치를 개략적으로 도시한 도면이다.17 to 19 are diagrams schematically showing a plasma processing apparatus according to another embodiment of the present invention.

도 20은 본 발명의 실시예들에 따른 플라즈마 처리방법을 도시한 순서도이다.Figure 20 is a flowchart showing a plasma processing method according to embodiments of the present invention.

본 발명의 일 실시예에 따르면, 내부에 수용되는 피처리물의 플라즈마 처리를 위해 사용되는 플라즈마 처리용기에 있어서, 상기 피처리물을 수용가능한 제1본체부; 및 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리용기를 제공한다.According to one embodiment of the present invention, a plasma processing vessel used for plasma processing of an object to be treated contained therein, comprising: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.

본 발명에 있어서, 상기 플로팅 전극을 커버하는 필름부;를 더 포함할 수 있다.In the present invention, a film portion covering the floating electrode may be further included.

본 발명에 있어서, 상기 필름부의 두께는 상기 제1본체부의 두께와 같거나 상대적으로 얇게 형성될 수 있다.In the present invention, the thickness of the film portion may be the same as the thickness of the first body portion or may be formed to be relatively thin.

본 발명에 있어서, 상기 플로팅 전극은 상기 제1본체부의 변형을 방지할 수 있도록 상기 제1본체부의 내면을 지지하는 구조로 형성될 수 있다.In the present invention, the floating electrode may be formed in a structure that supports the inner surface of the first body to prevent deformation of the first body.

본 발명에 있어서, 상기 플로팅 전극은, 상기 피처리물의 플라즈마 처리 과정에서 상기 제1본체부의 내외의 압력 차이가 발생하더라도 상기 제1본체부의 형상 변형을 방지할 수 있도록 상기 제1본체부의 내면을 지지하는 구조로 형성될 수 있다.In the present invention, the floating electrode supports the inner surface of the first body to prevent shape deformation of the first body even if a pressure difference occurs inside and outside the first body during the plasma treatment of the object to be processed. It can be formed into a structure that does.

본 발명에 있어서, 상기 플로팅 전극은 상기 제1본체부의 내주면을 따라 배치되고, 시작점과 끝점이 연결된 구조로 형성될 수 있다.In the present invention, the floating electrode may be disposed along the inner peripheral surface of the first main body and may be formed in a structure where the starting point and the ending point are connected.

본 발명에 있어서, 상기 플로팅 전극은 상기 제1본체부의 내주면 둘레를 따라 폐곡선 형상으로 형성될 수 있다.In the present invention, the floating electrode may be formed in a closed curve shape along the inner peripheral surface of the first body portion.

본 발명에 있어서, 상기 플로팅 전극은 플라즈마 처리 방향을 기준으로 상기 제1본체부의 중앙부에 위치할 수 있다.In the present invention, the floating electrode may be located in the center of the first main body based on the plasma processing direction.

본 발명에 있어서, 상기 플로팅 전극은 복수 개가 구비되고, 복수 개의 상기 플로팅 전극은 미리 설정되는 간격으로 이격 배치될 수 있다.In the present invention, a plurality of floating electrodes are provided, and the plurality of floating electrodes may be spaced apart at a preset interval.

본 발명에 있어서, 상기 플로팅 전극은 전도성 재질로 형성될 수 있다.In the present invention, the floating electrode may be formed of a conductive material.

본 발명에 있어서, 내부가 중공이며, 상기 제1본체부가 삽입 배치가능한 제2본체부; 및 상기 제2본체부를 커버하며, 상기 제1본체부의 내부 공간과 연통되는 연통홀부가 형성되는 캡부;를 더 포함할 수 있다.In the present invention, a second body portion is hollow on the inside and the first body portion can be inserted and placed; and a cap portion that covers the second body portion and has a communication hole communicating with the internal space of the first body portion.

본 발명에 있어서, 상기 캡부에 형성되는 상기 연통홀부를 커버하며, 상기 제1본체부의 내부 공간과 외부 공간 사이의 유체의 유동을 제한하는 유동제한부;를 더 포함할 수 있다.In the present invention, it may further include a flow limiting portion that covers the communication hole formed in the cap portion and restricts the flow of fluid between the inner space and the outer space of the first body portion.

본 발명에 있어서, 상기 유동제한부는 기체의 유동만을 허용할 수 있다.In the present invention, the flow restrictor may only allow the flow of gas.

본 발명에 있어서, 상기 유동제한부는 상기 캡부와 상기 제1본체부의 사이에 배치될 수 있다.In the present invention, the flow restriction portion may be disposed between the cap portion and the first body portion.

본 발명에 있어서, 상기 유동제한부는 필름 방식으로 형성되며, 상기 제1본체부에 결합될 수 있다.In the present invention, the flow restriction part is formed in a film manner and can be coupled to the first body part.

본 발명의 일 실시예에 따르면, 피처리물이 수용되는 플라즈마 처리용기; 상기 플라즈마 처리용기가 배치가능한 하우징부; 상기 하우징부에 설치되고, 상기 플라즈마 처리용기와 유체의 유동이 가능하게 연결되며, 상기 플라즈마 처리용기의 내부 공간의 압력을 조정하는 압력조정부; 및 외부로부터 전원을 공급받아 상기 플라즈마 처리용기의 내부 공간에 플라즈마 방전이 발생하도록 전기장을 형성하는 처리부;를 포함하고, 상기 플라즈마 처리용기는, 상기 피처리물을 수용가능한 제1본체부; 및 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리장치를 제공한다.According to one embodiment of the present invention, a plasma processing vessel in which an object to be treated is accommodated; a housing portion in which the plasma processing vessel can be placed; a pressure adjusting unit installed in the housing, connected to the plasma processing vessel to enable fluid flow, and adjusting the pressure of the internal space of the plasma processing vessel; and a processing unit that receives power from the outside and forms an electric field to generate a plasma discharge in the internal space of the plasma processing container, wherein the plasma processing container includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.

본 발명에 있어서, 상기 처리부는, 상기 압력조정부와 상기 처리용기 사이에 배치되고, 상기 처리용기와 접촉이 가능한 포트부; 및 상기 처리용기의 외측에 배치되며, 전원을 인가받아 전기장을 형성하는 전극부;를 포함할 수 있다.In the present invention, the processing unit includes a port portion disposed between the pressure adjusting unit and the processing container and capable of contacting the processing container; and an electrode portion disposed outside the processing container and receiving power to form an electric field.

본 발명에 있어서, 상기 전극부는 복수 개가 구비되고, 상기 플라즈마 처리용기의 양측에 각각 배치될 수 있다.In the present invention, a plurality of electrode units may be provided and may be respectively disposed on both sides of the plasma processing vessel.

본 발명의 일 실시예에 따르면, 피처리물의 표면을 처리하는 플라즈마 처리 방법에 있어서, 상기 피처리물이 수용되는 처리용기를 하우징부에 삽입하는 단계; 상기 하우징부에 설치되는 처리부에 상기 처리용기를 밀착시키는 단계; 상기 처리용기의 내부 공간의 압력을 조정하는 단계; 외부로부터 전원을 공급받아 상기 처리용기의 내부 공간에 플라즈마를 발생시키는 단계;를 포함하는 것을 특징으로 하고, 상기 처리용기는, 상기 피처리물을 수용가능한 제1본체부와; 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리방법을 제공한다.According to an embodiment of the present invention, a plasma processing method for treating the surface of an object to be treated includes the steps of inserting a processing container containing the object to be treated into a housing portion; attaching the processing container to a processing unit installed in the housing unit; adjusting the pressure of the internal space of the processing vessel; Generating plasma in the internal space of the processing vessel by receiving power from the outside, wherein the processing vessel includes: a first body portion capable of accommodating the object to be treated; and a floating electrode connected to the first body, wherein the floating electrode is electrically insulated from the outside of the first body.

이하, 첨부된 도면을 참조하여 이하의 실시예들을 상세히 설명하기로 하며, 도면을 참조하여 설명할 때 동일하거나 대응하는 구성 요소는 동일한 도면부호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, the following embodiments will be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, identical or corresponding components will be assigned the same reference numerals and duplicate descriptions thereof will be omitted.

본 발명의 기술적 사상은 다양한 변경을 가할 수 있고 여러 가지 실시 예를 가질 수 있는 바, 특정 실시 예들을 도면에 예시하고 이를 상세히 설명하고자 한다. 그러나, 이는 본 발명의 기술적 사상을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 발명의 기술적 사상의 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다.Since the technical idea of the present invention can be subject to various changes and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail. However, this is not intended to limit the technical idea of the present invention to specific embodiments, and should be understood to include all changes, equivalents, and substitutes included in the scope of the technical idea of the present invention.

본 발명의 기술적 사상을 설명함에 있어서, 관련된 공지 기술에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우 그 상세한 설명을 생략한다. 또한, 본 명세서의 설명 과정에서 이용되는 숫자(예를 들어, 제1, 제2 등)는 하나의 구성요소를 다른 구성요소와 구분하기 위한 식별기호에 불과하다.In explaining the technical idea of the present invention, if it is determined that a detailed description of related known technology may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. In addition, numbers (eg, first, second, etc.) used in the description of this specification are merely identifiers to distinguish one component from another component.

또한, 본 명세서에서, 일 구성요소가 다른 구성요소와 "연결된다" 거나 "접속된다" 등으로 언급된 때에는, 상기 일 구성요소가 상기 다른 구성요소와 직접 연결되거나 또는 직접 접속될 수도 있지만, 특별히 반대되는 기재가 존재하지 않는 이상, 중간에 또 다른 구성요소를 매개하여 연결되거나 또는 접속될 수도 있다고 이해되어야 할 것이다.In addition, in this specification, when a component is referred to as "connected" or "connected" to another component, the component may be directly connected or directly connected to the other component, but specifically Unless there is a contrary description, it should be understood that it may be connected or connected through another component in the middle.

또한, 본 명세서에 기재된 "~부", "~기", "~자", "~모듈" 등의 용어는 적어도 하나의 기능이나 동작을 처리하는 단위를 의미하며, 이는 프로세서(Processor), 마이크로 프로세서(Micro Processer), 마이크로 컨트롤러(Micro Controller), CPU(Central Processing Unit), GPU(Graphics Processing Unit), APU(Accelerate Processor Unit), DSP(Drive Signal Processor), ASIC(Application Specific Integrated Circuit), FPGA(Field Programmable Gate Array) 등과 같은 하드웨어나 소프트웨어 또는 하드웨어 및 소프트웨어의 결합으로 구현될 수 있으며, 적어도 하나의 기능이나 동작의 처리에 필요한 데이터를 저장하는 메모리(memory)와 결합되는 형태로 구현될 수도 있다.In addition, terms such as “unit”, “unit”, “unit”, and “module” used in this specification refer to a unit that processes at least one function or operation, which refers to a processor, micro Processor (Micro Processer), Micro Controller, CPU (Central Processing Unit), GPU (Graphics Processing Unit), APU (Accelerate Processor Unit), DSP (Drive Signal Processor), ASIC (Application Specific Integrated Circuit), FPGA It may be implemented as hardware or software, such as a Field Programmable Gate Array, or a combination of hardware and software, and may also be implemented in a form combined with a memory that stores data necessary for processing at least one function or operation. .

그리고 본 명세서에서의 구성부들에 대한 구분은 각 구성부가 담당하는 주기능 별로 구분한 것에 불과함을 명확히 하고자 한다. 즉, 이하에서 설명할 2개 이상의 구성부가 하나의 구성부로 합쳐지거나 또는 하나의 구성부가 보다 세분화된 기능별로 2개 이상으로 분화되어 구비될 수도 있다. 그리고 이하에서 설명할 구성부 각각은 자신이 담당하는 주기능 이외에도 다른 구성부가 담당하는 기능 중 일부 또는 전부의 기능을 추가적으로 수행할 수도 있으며, 구성부 각각이 담당하는 주기능 중 일부 기능이 다른 구성부에 의해 전담되어 수행될 수도 있음은 물론이다.In addition, it is intended to be clear that the division of components in this specification is merely a division according to the main function each component is responsible for. That is, two or more components, which will be described below, may be combined into one component, or one component may be divided into two or more components for more detailed functions. In addition to the main functions it is responsible for, each of the components described below may additionally perform some or all of the functions handled by other components, and some of the main functions handled by each component may be performed by other components. Of course, it can also be carried out in full charge by .

도 1은 본 발명의 일 실시예에 따른 플라즈마 처리장치를 개략적으로 도시한 도면이다. 도 2는 본 발명의 일 실시예에 따른 플라즈마 처리장치에서 플라즈마 처리용기의 압력이 조정되는 상태를 도시한 도면이다. 도 3은 본 발명의 일 실시예에 따른 플라즈마 처리장치에서 피처리물이 플라즈마 방전 처리되는 상태를 도시한 도면이다.1 is a diagram schematically showing a plasma processing apparatus according to an embodiment of the present invention. Figure 2 is a diagram showing a state in which the pressure of a plasma processing vessel is adjusted in a plasma processing apparatus according to an embodiment of the present invention. Figure 3 is a diagram showing a state in which an object to be treated is plasma discharge treated in a plasma processing apparatus according to an embodiment of the present invention.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 플라즈마 처리장치(1)는 플라즈마 처리용기(10)(이하, '처리용기'라 함.), 하우징부(20), 압력조정부(30), 처리부(40)를 포함할 수 있다. 1 to 3, the plasma processing apparatus 1 according to an embodiment of the present invention includes a plasma processing vessel 10 (hereinafter referred to as 'processing vessel'), a housing unit 20, and a pressure adjustment unit. (30) and may include a processing unit (40).

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 플라즈마 처리장치(1)는 피처리물(OB)이 수용되며, 플로팅(floating) 전극(13)이 구비되는 처리용기(10)를 수납하여 피처리물(OB)의 플라즈마 표면 처리를 위해 사용될 수 있다.Referring to FIGS. 1 to 3, the plasma processing apparatus 1 according to an embodiment of the present invention includes a processing vessel 10 in which an object to be treated (OB) is accommodated and a floating electrode 13 is provided. It can be used for plasma surface treatment of the object to be treated (OB).

도 1 내지 도 3을 참조하면, 처리용기(10)는 피처리물(OB)을 수용하는 것으로, 하우징부(20)에 수용될 수 있고, 뒤에 설명할 처리부(40)와 밀착되며 연결될 수 있다.Referring to FIGS. 1 to 3, the processing container 10 accommodates the object to be treated (OB), can be accommodated in the housing portion 20, and can be in close contact with and connected to the processing portion 40, which will be described later. .

실시예에 따라, 처리용기(10)는 피처리물(OB)을 플라즈마 표면처리하기 위해 활용되는 다양한 형태의 장치 또는 용기를 의미할 수 있다. 처리용기(10)는 피처리물(OB)을 플라즈마 표면처리하기 위한 수납 용기일 수도 있고, 플라즈마 처리장치용 연결 지그(jig)일 수도 있다.Depending on the embodiment, the processing container 10 may refer to various types of devices or containers used to plasma surface treat the object OB. The processing container 10 may be a storage container for plasma surface treatment of the object OB, or may be a connection jig for a plasma processing device.

본 명세서에서 '피처리물(OB)'은 사람의 치아 등을 커버하기 위한 크라운(crown)이나, 의료 시술이나 치과에서 임플란트 시술이 이루어지는 경우, 주사기, 바이알(vial) 등 내부용기에 수용가능한 골이식재, 피부(dermal, cutaneous) 등 인체 조직 및 기관의 대체, 수복, 재건(reconstruction)에 사용되는 인체 피부 수복용 생체재료(skin graft)를 의미한다.In this specification, the 'object to be treated (OB)' is a crown to cover a human tooth, etc., or bone that can be accommodated in an internal container such as a syringe or vial when an implant procedure is performed in a medical procedure or dentistry. It refers to biomaterials for human skin restoration (skin graft) used for replacement, restoration, and reconstruction of human tissues and organs, such as graft materials and skin (dermal, cutaneous).

도 1 내지 도 3에서는 설명의 편의를 위하여 피처리물(OB)을 사각 형상으로 개략적으로 도시하였으나, 뒤에서 설명할 제1실시예 내지 제3실시예에 따른 처리용기(10, 10`, 10``)에 의해 플라즈마 처리되는 피처리물은 목적에 맞게 다양한 형상으로 형성되고, 처리용기(10, 10`, 10``)의 내부에 배치될 수 있다.In FIGS. 1 to 3, the object to be treated (OB) is schematically shown in a square shape for convenience of explanation. However, the treatment containers 10, 10', and 10' according to the first to third embodiments, which will be described later, are shown in FIGS. The object to be plasma treated by `) can be formed into various shapes to suit the purpose and placed inside the processing container 10, 10`, 10``.

본 발명의 실시예들에 따른 피처리물은 처리용기(10, 10`, 10``)의 내부에 수용된 상태에서 플라즈마 처리장치(1)에 의해 플라즈마 방전(PD)이 발생되고, 플라즈마로 인하여 피처리물(OB)의 표면 처리가 가능한 효과가 있다.A plasma discharge (PD) is generated by the plasma processing device 1 while the object to be treated according to embodiments of the present invention is accommodated inside the processing container 10, 10`, 10``, and the plasma causes It has the effect of enabling surface treatment of the object to be treated (OB).

도 1 내지 도 4를 참조하면, 본 발명의 실시예들에 따른 처리용기(10)는 내부에 피처리물(OB)을 수용하는 것으로, 제1본체부(11), 플로팅 전극(13), 필름부를 포함할 수 있다. Referring to FIGS. 1 to 4, the processing container 10 according to embodiments of the present invention accommodates an object to be treated (OB) therein, and includes a first body portion 11, a floating electrode 13, It may include a film portion.

도 1 내지 도 3를 참조하면, 본 발명의 실시예들에 따른 처리용기(10)는 하우징부(20)의 내부에 배치될 수 있고, 처리부(40), 구체적으로 전극부(45)와 마주보며 배치될 수 있다. 전극부(45)는 서로 마주보며 이격 배치되는 제1전극(45a), 제2전극(45b)를 포함할 수 있고, 처리용기(10)는 제1전극(45a), 제2전극(45b) 사이에 배치될 수 있다.Referring to Figures 1 to 3, the processing container 10 according to embodiments of the present invention may be placed inside the housing portion 20 and faces the processing portion 40, specifically the electrode portion 45. It can be placed by looking at it. The electrode unit 45 may include a first electrode 45a and a second electrode 45b that face each other and are spaced apart, and the processing container 10 includes the first electrode 45a and the second electrode 45b. It can be placed in between.

도 1 내지 도 3을 참조하면, 제1본체부(11)는 피처리물(OB)을 수용가능하도록 내부가 중공인 것으로, 플로팅 전극(13)이 배치될 수 있고, 제1본체부(11)의 내부 공간과 외부 공간을 연통하며, 기체(G)의 유동 경로를 제공하는 연통홀부(11h)가 형성될 수 있다. Referring to FIGS. 1 to 3, the first body portion 11 is hollow on the inside to accommodate the object to be treated (OB), and a floating electrode 13 can be disposed, and the first body portion 11 ) A communication hole portion 11h may be formed that communicates the inner space and the outer space of the gas G and provides a flow path for the gas G.

도 4 내지 도 16은 본 발명의 제1실시예 내지 제3실시예에 따른 처리용기(10, 10`, 10``)에 관한 것으로, 처리용기(10, 10`, 10``)에 대하여는 하우징부(20), 압력조정부(30), 처리부(40)에 관한 설명을 한 다음에 자세히 설명하도록 한다.4 to 16 relate to processing containers (10, 10`, 10``) according to the first to third embodiments of the present invention. The housing unit 20, pressure adjustment unit 30, and processing unit 40 will be explained in detail later.

도 1 내지 도 3을 참조하면, 처리용기(10), 구체적으로 제1본체부(11)에 연통홀부(11h)가 형성됨으로 인하여 제1본체부(11)의 내부 공간과 외부 공간 간 공기와 같은 기체(G)의 유동이 가능한 효과가 있다. Referring to FIGS. 1 to 3, due to the communication hole portion 11h being formed in the processing container 10, specifically the first body portion 11, air and This has the effect of enabling the flow of the same gas (G).

이에 더하여 기체(G)의 유동으로 인하여 제1본체부(11)의 내부 공간과 외부 공간 사이의 압력 차이가 발생하며, 상기와 같은 압력 차이 발생 후 상대적으로 저압 상태로 형성되는 처리용기(10)의 내부 공간에 배치되는 피처리물(OB)의 플라즈마 처리가 가능한 효과가 있다.In addition, due to the flow of gas G, a pressure difference occurs between the internal space and the external space of the first main body 11, and after the above pressure difference occurs, the processing vessel 10 is formed in a relatively low pressure state. There is an effect that plasma treatment of the object to be treated (OB) disposed in the internal space of is possible.

도 1을 참조하면, 연통홀부(11h)는 제1본체부(11)의 외주면 상에서 미리 설정되는 영역에 형성될 수 있다. 연통홀부(11h)는 복수 개의 홀(hole)을 구비할 수 있고, 피처리물(OB)이 수용되는 내부 공간과 연통되도록 제1본체부(11)의 외주면을 관통하며 형성될 수 있다.Referring to FIG. 1, the communication hole portion 11h may be formed in a preset area on the outer peripheral surface of the first body portion 11. The communication hole portion 11h may have a plurality of holes and may be formed to penetrate the outer peripheral surface of the first body portion 11 to communicate with the internal space in which the object OB is accommodated.

선택적 실시예로서, 연통홀부(11h)는 뒤에 설명할 처리부(40), 구체적으로 포트부(41)를 마주보는 일측(도 1 기준 좌측)에 형성될 수 있다.As an optional embodiment, the communication hole portion 11h may be formed on one side (left side in FIG. 1) facing the processing portion 40, specifically the port portion 41, which will be described later.

도 1 내지 도 3을 참조하면, 제1본체부(11)는 피처리물(OB)이 내부에 수용된 상태에서 하우징부(20)에 수납될 수 있다. 하우징부(20)에 수용된 상태에서 처리부(40)에 의해 플라즈마 방전(PD) 처리가 될 수 있다.Referring to FIGS. 1 to 3 , the first body portion 11 may be accommodated in the housing portion 20 with the object to be treated (OB) accommodated therein. While accommodated in the housing unit 20, it can be subjected to plasma discharge (PD) treatment by the processing unit 40.

상술한 처리용기(10)는 본 발명의 실시예들에 따른 처리용기(10, 10`, 10``)의 공통된 내용을 기술한 것으로, 본 발명의 제1실시예 내지 제3실시예에 따른 처리용기(10, 10`, 10``)의 구성, 작동원리, 효과는 뒤에서 자세히 설명하도록 한다.The above-described processing container 10 describes common contents of the processing containers 10, 10`, and 10`` according to the embodiments of the present invention, and is a processing container according to the first to third embodiments of the present invention. The composition, operating principle, and effects of the treatment containers (10, 10`, 10``) will be explained in detail later.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 하우징부(20)는 처리용기(10)를 수납하는 것으로, 플라즈마 처리장치(1)의 일 구성으로 형성될 수 있다.Referring to FIGS. 1 to 3 , the housing portion 20 according to an embodiment of the present invention accommodates the processing container 10 and may be formed as a component of the plasma processing apparatus 1.

본 발명의 일 실시예에 따른 하우징부(20)에는 피처리물(OB)이 수용되는 처리용기(10)가 배치되고, 하우징부(20)에는 처리부(40)가 부분적 또는 전체적으로 배치될 수 있다.A processing container 10 in which an object to be treated (OB) is accommodated is disposed in the housing portion 20 according to an embodiment of the present invention, and the processing portion 40 may be partially or entirely disposed in the housing portion 20. .

하우징부(20)에 처리용기(10)가 수납되며, 상기 처리용기(10)가 미리 설정되는 위치에 고정 배치됨으로써 처리용기(10)의 위치가 변경되는 것을 방지할 수 있고, 안정적으로 플라즈마 처리가 가능할 수 있도록 하는 효과가 있다.The processing container 10 is stored in the housing portion 20, and the processing container 10 is fixedly placed in a preset position, thereby preventing the position of the processing container 10 from changing and stably processing plasma. It has the effect of making it possible.

선택적 실시예로서, 하우징부(20)는 모터(motor) 등 구동부(도면 미도시)로부터 동력을 전달받아 미리 설정되는 방향을 따라 이동가능하게 형성될 수 있다.As an optional embodiment, the housing unit 20 may be formed to be movable along a preset direction by receiving power from a driving unit (not shown) such as a motor.

예를 들어, 하우징부(20)에 처리용기(10)가 배치된 후 구동부로부터 동력을 전달받아 처리부(40), 구체적으로 제1전극(45a), 제2전극(45b) 사이에 하우징부(20)가 위치될 수 있도록 할 수 있다.For example, after the processing container 10 is placed in the housing unit 20, power is transmitted from the driving unit to the processing unit 40, specifically between the first electrode 45a and the second electrode 45b. 20) can be positioned.

선택적 실시예로서, 하우징부(20)는 도어부(도면 미도시)를 구비할 수 있고, 도어부로 하우징부(20)의 내부 공간을 개폐할 수 있으며, 개방된 상태에서 하우징부(20)의 내부로 처리용기(10)를 투입하고, 도어부로 하우징부(20)의 내부 공간을 닫아 하우징부(20)의 내부 공간과 외부 공간을 공간적으로 차단시킬 수 있다.As an optional embodiment, the housing part 20 may be provided with a door part (not shown), and the inner space of the housing part 20 can be opened and closed by the door part, and the housing part 20 can be opened and closed in an open state. The processing container 10 is placed inside, and the internal space of the housing unit 20 is closed with the door, thereby spatially blocking the internal space and external space of the housing unit 20.

선택적 실시예로서, 하우징부(20)는 슬라이딩 방식으로 이동이 가능하게 배치될 수 있다. As an optional embodiment, the housing portion 20 may be arranged to be movable in a sliding manner.

이로 인하여 하우징부(20)에 형성되는 제1위치에 처리용기(10)를 위치시키고, 외부로부터 동력을 전달받아 처리용기(10)를 제1위치에서 벗어나는 제2위치로 이동시킨 후 처리부(40)에 의해 플라즈마 처리되는 등 다양한 변형 실시가 가능하다.As a result, the processing container 10 is placed in the first position formed in the housing portion 20, and power is transmitted from the outside to move the processing container 10 to the second position away from the first position, and then the processing unit 40 ), various modifications such as plasma treatment are possible.

선택적 실시예로서, 하우징부(20)의 내측에 압력조정부(30), 전원부(47)가 배치될 수 있는 등 다양한 변형 실시가 가능하다.As an optional embodiment, various modifications are possible, such as the pressure adjustment unit 30 and the power supply unit 47 being disposed inside the housing unit 20.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 압력조정부(30)는 유체가 유동가능하도록 처리용기(10)와 연결되는 것으로, 처리용기(10)의 내부 압력을 조정할 수 있다.Referring to FIGS. 1 to 3, the pressure adjusting unit 30 according to an embodiment of the present invention is connected to the processing container 10 to allow fluid to flow, and can adjust the internal pressure of the processing container 10. .

도 2를 참조하면, 압력조정부(30)는 처리용기(10)의 내부에서 유체를 외부로 유동시켜 처리용기(10)의 내부 압력을 조정할 수 있다. Referring to FIG. 2, the pressure adjusting unit 30 may adjust the internal pressure of the processing container 10 by flowing fluid from the inside of the processing container 10 to the outside.

구체적으로 처리용기(10)의 내부에서 유체, 구체적으로 공기와 같은 기체(G)를 외부로 배출시킴으로써 처리용기(10)의 내부 공간을 상대적으로 저압 대기(low pressure atmosphere, LPA) 상태로 만들 수 있다. Specifically, by discharging a fluid, specifically a gas (G) such as air, from the inside of the processing vessel 10 to the outside, the internal space of the processing vessel 10 can be brought into a relatively low pressure atmosphere (LPA) state. there is.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 압력조정부(30)는 처리용기(10)와 밀착가능한 처리부(40), 구체적으로 포트부(41)와 연결될 수 있고, 포트부(41)를 통해 처리용기(10)의 내부에 형성되며 피처리물(OB)이 수용되는 내부 공간에서 공기(G)를 외부로 배출시킬 수 있다.Referring to Figures 1 to 3, the pressure adjusting unit 30 according to an embodiment of the present invention may be connected to a processing unit 40 that can be in close contact with the processing container 10, specifically the port unit 41, and the port unit Through (41), air (G) can be discharged to the outside from the internal space formed inside the processing container 10 and where the object to be treated (OB) is accommodated.

본 발명의 일 실시예에 따른 압력조정부(30)가 구동됨에 따라 처리용기(10)의 내부 공간에 있는 공기와 같은 기체(G)가 외부로 배출되고, 피처리물(OB)이 수용되는 처리용기(10), 구체적으로 제1본체부(11)의 내부에 플라즈마 생성을 위한 저압 환경(LPA)이 조성되고, 진공 영역이 형성될 수 있다. As the pressure adjusting unit 30 according to an embodiment of the present invention is driven, gas (G) such as air in the inner space of the processing container 10 is discharged to the outside, and the object to be treated (OB) is accommodated. A low pressure environment (LPA) for plasma generation may be created inside the container 10, specifically the first main body 11, and a vacuum area may be formed.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 압력조정부(30)는 펌프 방식으로 형성되며, 처리용기(10), 구체적으로 제1본체부(11)의 내부에 있는 공기(G)를 외부로 배출시키나, 이에 한정하는 것은 아니고, 처리용기(10)의 내부 압력을 저압 상태(LPA)로 형성할 수 있는 기술적 사상 안에서 다양한 변형 실시가 가능하다.Referring to Figures 1 to 3, the pressure adjusting unit 30 according to an embodiment of the present invention is formed by a pump method, and the air inside the processing container 10, specifically the first main body 11 ( G) is discharged to the outside, but is not limited to this, and various modifications are possible within the technical idea of forming the internal pressure of the processing vessel 10 into a low pressure state (LPA).

도면에 도시하지는 않았지만, 압력조정부(30)는 밸브부, 필터(filter)를 포함할 수 있다. Although not shown in the drawing, the pressure adjusting unit 30 may include a valve unit and a filter.

도 1, 도 2를 참조하면, 본 발명의 일 실시예에 따른 처리부(40)는 처리용기(10)의 내부에 플라즈마 방전(PD)를 발생시키도록 전기장을 형성하는 것으로, 처리부(40)에 의해 형성되는 상기 전기장은 플로팅 전극(13)에 의해 세기, 공간적 형상 또는 분포가 변할 수 있으며, 변화된 전기장은 피처리물이 수용되는 처리용기(10) 내부에서 공간적으로 균일한 세기, 분포 또는 형상을 가질 수 있다Referring to Figures 1 and 2, the processing unit 40 according to an embodiment of the present invention forms an electric field to generate a plasma discharge (PD) inside the processing container 10, and the processing unit 40 The electric field formed by the electric field may change in intensity, spatial shape, or distribution by the floating electrode 13, and the changed electric field has spatially uniform intensity, distribution, or shape inside the processing vessel 10 in which the object to be treated is accommodated. can have

도 1, 도 2를 참조하면, 본 발명의 일 실시예에 따른 처리부(40)는 처리용기(10), 구체적으로 제1본체부(11)와 밀착될 수 있다. 처리부(40)는 외부로부터 전원을 공급받아 제1본체부(11)의 내부 공간에 플라즈마 방전(PD)이 발생하도록 전기장을 형성할 수 있다.Referring to Figures 1 and 2, the processing unit 40 according to an embodiment of the present invention may be in close contact with the processing container 10, specifically the first main body 11. The processing unit 40 can receive power from the outside and form an electric field to generate plasma discharge (PD) in the internal space of the first main body 11.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 처리부(40)는 포트부(41), 전극부(45), 전원부(47)를 포함할 수 있다. 포트부(41)는 압력조정부(30)와 처리용기(10) 사이에 배치되는 것으로, 처리용기(10)와 접촉이 가능하다.Referring to FIGS. 1 to 3 , the processing unit 40 according to an embodiment of the present invention may include a port unit 41, an electrode unit 45, and a power source unit 47. The port portion 41 is disposed between the pressure adjustment unit 30 and the processing container 10 and is capable of contacting the processing container 10.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 포트부(41)는 하우징부(20) 상에 위치 고정되며, 처리용기(10)의 일측(도 1 기준 좌측)에 밀착되며 연결될 수 있다. 포트부(41)와 연결되는 제1본체부(11)의 일면에는 연통홀부(11h)가 형성될 수 있다. Referring to FIGS. 1 to 3, the port portion 41 according to an embodiment of the present invention is fixed in position on the housing portion 20 and is in close contact with one side (left side in FIG. 1) of the processing container 10. can be connected A communication hole 11h may be formed on one surface of the first main body 11 connected to the port 41.

본 발명의 일 실시예에 따른 포트부(41)는 압력조정부(30)와 연결되며, 압력조정부(30)가 구동됨에 따라 제1본체부(11)의 내부 공간에 수용되는 공기(G)를 외부로 배출시킴에 있어 공기(G)의 배출 경로를 제공할 수 있다.The port portion 41 according to an embodiment of the present invention is connected to the pressure adjusting unit 30, and as the pressure adjusting unit 30 is driven, the air (G) accommodated in the internal space of the first body portion 11 is When discharging to the outside, a discharge path for air (G) can be provided.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 포트부(41)는 포트본체(411), 포트실링부(413)를 포함할 수 있다. 포트본체(411)는 압력조정부(30)와 연결되는 것으로, 처리용기(10)의 내부 공간에서 압력조정부(30)로 공기가 유동될 수 있도록 경로를 제공할 수 있다.Referring to Figures 1 to 3, the port portion 41 according to an embodiment of the present invention may include a port main body 411 and a port sealing portion 413. The port body 411 is connected to the pressure adjusting unit 30 and can provide a path for air to flow from the internal space of the processing vessel 10 to the pressure adjusting unit 30.

본 발명의 일 실시예에 따른 포트실링부(413)는 포트본체(411)와 결합되는 것으로, 처리용기(10), 구체적으로 제1본체부(11)를 마주보는 포트본체(411)의 일단부에 결합될 수 있다. The port sealing part 413 according to an embodiment of the present invention is coupled to the port main body 411, and has one end of the port main body 411 facing the processing container 10, specifically the first main body 11. Can be combined with wealth.

구체적으로 포트실링부(413)는 포트본체(411)와 제1본체부(11) 사이에 배치되는 것으로, 일측은 제1본체부(11)와 밀착될 수 있고, 이에 대향하는 타측은 포트본체(411)와 밀착될 수 있다.Specifically, the port sealing portion 413 is disposed between the port main body 411 and the first main body 11, and one side may be in close contact with the first main body 11, and the other side opposite to the port main body 411 is disposed between the port main body 411 and the first main body 11. It can be in close contact with (411).

본 발명의 일 실시예에 따른 포트실링부(413)는 둘레를 따라 제1본체부(11)와 포트본체(411)에 각각 밀착되며 배치될 수 있다. 포트실링부(413)는 탄성 변형이 가능한 재질로 형성될 수 있다.The port sealing portion 413 according to an embodiment of the present invention may be disposed in close contact with the first body portion 11 and the port body 411, respectively, along the circumference. The port sealing portion 413 may be formed of a material capable of elastic deformation.

포트실링부(413)가 탄성 변형이 가능한 재질로 형성됨으로 인하여, 압력조정부(30)가 구동됨에 따라 제1본체부(11)의 내부 공간에서 포트본체(411)의 내부 공간을 통해 압력조정부(30)로 공기가 유동됨에 있어, 압력 변화로 인해 포트실링부(413)가 형상이 변형(압축)되며, 포트본체(411)와 제1본체부(11)로 둘러싸이며 형성되는 내부 공간의 밀폐성, 기밀성을 향상시킬 수 있다.Since the port sealing unit 413 is formed of a material capable of elastic deformation, as the pressure adjusting unit 30 is driven, the pressure adjusting unit ( 30), the shape of the port sealing portion 413 is deformed (compressed) due to pressure changes, and the inner space formed by being surrounded by the port body 411 and the first body portion 11 is sealed. , confidentiality can be improved.

이에 더하여 포트실링부(413)가 포트본체(411)와 제1본체부(11)에 각각 밀착되며 배치됨으로 인하여, 제1본체부(11)와 포트본체(411)의 외부에서 이물질이 유입되는 것을 차단할 수 있다. In addition, since the port sealing part 413 is arranged in close contact with the port main body 411 and the first main body 11, respectively, foreign substances are prevented from flowing in from the outside of the first main body 11 and the port main body 411. can be blocked.

이에 더하여 제1본체부(11)와 포트본체(411)로 둘러싸이는 내부 공간과 외부 공간을 공간적으로 분리하고, 기체(G)의 유동을 차단하여 압력조정부(30)가 압력을 효율적으로 조정, 제어할 수 있는 효과가 있다.In addition, the internal space and external space surrounded by the first main body 11 and the port main body 411 are spatially separated, and the flow of gas G is blocked so that the pressure adjusting unit 30 efficiently adjusts the pressure. There is an effect that can be controlled.

압력조정부(30)의 구동으로 인하여 처리용기(10), 구체적으로 제1본체부(11)의 내부 공간에서 포트부(41)의 내부 공간을 통해 공기가 압력조정부(30) 측으로 유동될 수 있고, 이에 따라 피처리물(OB)이 수용되는 제1본체부(11)의 내부 공간은 피처리물(OB)의 표면 처리를 위한 플라즈마 방전(PD)이 발생될 수 있는 저압 환경을 조성하고, 진공 영역을 형성하여 피처리물(OB)이 수용되는 내부 공간에서 플라즈마 생성이 집중적으로 이루어질 수 있는 효과가 있다. Due to the operation of the pressure adjusting unit 30, air may flow from the inner space of the processing container 10, specifically the first main body 11, to the pressure adjusting unit 30 through the inner space of the port portion 41. , Accordingly, the internal space of the first body portion 11 where the object to be treated (OB) is accommodated creates a low pressure environment in which plasma discharge (PD) for surface treatment of the object to be treated (OB) can be generated, By forming a vacuum area, there is an effect that plasma generation can be concentrated in the internal space where the object to be treated (OB) is accommodated.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 전극부(45)는 처리용기(10)의 외측에 배치되는 것으로, 하우징부(20)의 내측에 배치될 수 있다. 전극부(45)는 외부로부터 전원을 인가받아 피처리물(OB)을 둘러싸는 제1본체부(11)의 내부 공간에 플라즈마 생성을 위한 전기장을 형성할 수 있다. Referring to FIGS. 1 to 3 , the electrode unit 45 according to an embodiment of the present invention is disposed on the outside of the processing container 10 and may be disposed on the inside of the housing unit 20 . The electrode unit 45 may receive power from the outside and form an electric field for generating plasma in the internal space of the first body unit 11 surrounding the object OB.

처리부(40)는 유전체 장벽 방전(Dielectric Barrier Discharge, DBD)을 통해 밀폐 영역인 제1본체부(11)의 내부 공간에 플라즈마 방전(PD)을 발생시킬 수 있다. 선택적 실시예로서, 처리부(40)는 low-frequency 교류 전원으로 진공 플라즈마를 발생시킬 수 있다.The processing unit 40 may generate plasma discharge (PD) in the internal space of the first main body 11, which is a sealed area, through dielectric barrier discharge (DBD). As an optional embodiment, the processing unit 40 may generate vacuum plasma using low-frequency alternating current power.

선택적 실시예로서, 유전체 장벽은 플라즈마 처리장치(1)에 유전체부(도면 미도시)를 구비하여 형성될 수 있다.As an alternative embodiment, the dielectric barrier may be formed by providing the plasma processing device 1 with a dielectric portion (not shown).

선택적 실시예로서, 유전체 장벽은 피처리물(OB)을 수납하는 처리용기(10)의 적어도 일부를 유전체 물질로 구비하여 형성될 수 있다.As an optional embodiment, the dielectric barrier may be formed by providing at least a portion of the processing vessel 10 that accommodates the object OB with a dielectric material.

도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 전극부(45)는 제1전극(45a), 제2전극(45b)을 포함할 수 있다. 제1전극(45a), 제2전극(45b)은 전원부(47)와 전기적으로 연결되며 전원부(47)로부터 전원을 인가받을 수 있다.Referring to Figures 1 to 3, the electrode unit 45 according to an embodiment of the present invention may include a first electrode 45a and a second electrode 45b. The first electrode 45a and the second electrode 45b are electrically connected to the power supply unit 47 and can receive power from the power supply unit 47.

전극부(45)에 전원이 인가되면 제1전극(45a)과 제2전극(45b)의 전압차에 의해 피처리물(OB)이 수용되는 제1본체부(11)의 내부 공간에 플라즈마를 형성할 수 있다. 제1전극(45a)은 고전압 전극으로 형성될 수 있고, 제2전극(45b)은 전압이 인가되지 않은 접지 전극으로, 접지(OV)를 유지할 수 있다.When power is applied to the electrode unit 45, plasma is generated in the internal space of the first body unit 11 where the object to be treated (OB) is accommodated by the voltage difference between the first electrode 45a and the second electrode 45b. can be formed. The first electrode 45a may be formed as a high voltage electrode, and the second electrode 45b may be a ground electrode to which no voltage is applied and may maintain ground (OV).

선택적 실시예로서, 제1전극(45a)은 포트부(41)에 연결될 수 있고, 제2전극(45b)은 하우징부(20)에 위치 고정될 수 있다.As an optional embodiment, the first electrode 45a may be connected to the port portion 41, and the second electrode 45b may be fixed to the housing portion 20.

본 발명의 일 실시예에 따른 전극부(45)는 피처리물(OB)이 수용되는 처리용기(10)의 외측에 배치될 수 있고, 전극부(45)가 전원부(47)로부터 고전압의 전원을 인가받아 전기장을 형성함으로써 처리용기(10), 구체적으로 제1본체부(11)의 내부에 플라즈마를 생성할 수 있다.The electrode unit 45 according to an embodiment of the present invention may be disposed outside the processing container 10 in which the object to be treated (OB) is accommodated, and the electrode unit 45 may be connected to a high voltage power source from the power supply unit 47. Plasma can be generated inside the processing container 10, specifically the first main body 11, by receiving and forming an electric field.

도 1, 도 2를 참조하면, 본 발명의 일 실시예에 따른 제1본체부(11)의 내면에는 플로팅 전극(13)이 접하며 배치될 수 있고, 플로팅 전극(13)이 전원부(47)로부터 전원을 인가받지 않고, 전극부(45)와 이격 배치될 수 있다.Referring to FIGS. 1 and 2, a floating electrode 13 may be disposed in contact with the inner surface of the first body portion 11 according to an embodiment of the present invention, and the floating electrode 13 may be connected to the power supply unit 47. It can be placed spaced apart from the electrode unit 45 without receiving power.

이로 인하여 전극부(45)에 의해 전기장이 형성되면, 플로팅 전극(13)의 외측, 구체적으로 플로팅 전극(13)과 제1전극(45a) 사이, 플로팅 전극(13)과 제2전극(45b) 사이에 (+) 또는 (-) 전하가 유도됨으로 인하여 플로팅 전극(13) 및 처리용기(10) 내부로 전기장이 집중되고 처리용기(10) 내부에 전체적으로 균일하게 형성되는 효과가 있다.As a result, when an electric field is formed by the electrode portion 45, the outside of the floating electrode 13, specifically between the floating electrode 13 and the first electrode 45a, the floating electrode 13 and the second electrode 45b Due to the induction of (+) or (-) charges therebetween, the electric field is concentrated inside the floating electrode 13 and the processing container 10 and has the effect of being uniformly formed throughout the processing container 10.

즉, 제1전극(45a), 제2전극(45b) 사이에 플로팅 전극(13)이 위치한 플로팅 전극(13)으로 인하여 전극부(45) 사이에 형성되는 전기장의 세기, 공간적 분포 또는 형상이 변하는데, 그 결과 전극부(45) 사이에 형성되는 전기장이 실제 피처리물이 수용된 처리용기(10)의 내부로 집중되고, 균일하게 형성된다. That is, the intensity, spatial distribution, or shape of the electric field formed between the electrode portions 45 changes due to the floating electrode 13 located between the first electrode 45a and the second electrode 45b. As a result, the electric field formed between the electrode portions 45 is concentrated inside the processing container 10 where the actual object to be treated is accommodated, and is formed uniformly.

따라서 피처리물(OB)을 수용하는 제1본체부(11)의 내부 공간에서 플라즈마 방전(PD)이 용이하게 발생할 수 있는 효과가 있다.Therefore, there is an effect that plasma discharge (PD) can easily occur in the internal space of the first body portion 11 that accommodates the object to be treated (OB).

이에 더하여 플로팅 전극(13)으로 인하여 전극부(45) 사이에 형성되는 전기장의 세기, 공간적 분포 또는 형상이 변하고, 집중될 수 있으므로, 상대적으로 낮은 전압으로도 플라즈마 방전(PD)을 발생시킬 수 있고, 피처리물(OB)이 손상되는 것을 방지할 수 있는 효과가 있다.In addition, due to the floating electrode 13, the intensity, spatial distribution, or shape of the electric field formed between the electrode parts 45 can be changed and concentrated, so plasma discharge (PD) can be generated even at a relatively low voltage. , It has the effect of preventing damage to the object to be treated (OB).

도 3을 참조하면, 본 발명에 의해 전기장이 형성되면, 저압 환경(LPA), 진공 영역이 형성되며 피처리물(OB)을 수용하는 제1본체부(11)의 내부 공간에 플라즈마 방전(PD)을 균일하게 발생시킬 수 있고, 상기 내부 공간에 플라즈마가 생성되며 피처리물(OB)의 플라즈마 표면 처리가 진행될 수 있다.Referring to FIG. 3, when an electric field is formed according to the present invention, a low pressure environment (LPA) and a vacuum area are formed and a plasma discharge (PD) is generated in the internal space of the first body portion 11 that accommodates the object to be processed (OB). ) can be generated uniformly, plasma is generated in the internal space, and plasma surface treatment of the object to be treated (OB) can be performed.

도면에 도시하지 않았지만, 처리부(40)는 센서부를 포함할 수 있고, 센서부는 포트부(41)와 처리용기(10)의 접촉, 연결 여부를 감지할 수 있다. Although not shown in the drawing, the processing unit 40 may include a sensor unit, and the sensor unit may detect whether the port unit 41 and the processing container 10 are in contact or connected.

센서부가 처리용기(10)와 포트부(41)가 접촉하는 전체 영역이 제대로 접촉되었는지를 감지함으로 인하여 포트부(41)와 처리용기(10)가 연결되는 전체 영역이 밀착된 상태에서 압력조정부(30)의 구동으로 처리용기(10)의 내부의 압력을 조정할 수 있는 효과가 있다.The sensor unit detects whether the entire area where the processing container 10 and the port portion 41 are in contact is properly contacted, so that the entire area where the port portion 41 and the processing container 10 are connected is in close contact with the pressure adjusting unit ( There is an effect of adjusting the pressure inside the processing vessel 10 by driving 30).

제1본체부(11)의 내부 압력을 조정한 다음에는 전극부(45)가 전원부(47)로부터 전원을 인가받아 복수 개의 전극부(45) 사이에서 전기장이 형성되도록 할 수 있다. After adjusting the internal pressure of the first body unit 11, the electrode unit 45 can receive power from the power supply unit 47 so that an electric field is formed between the plurality of electrode units 45.

도 3을 참조하면, 본 발명의 일 실시예에 따른 전극부(45)에 의해 전기장이 형성되면, 저압 환경, 진공 영역이 형성되며 피처리물(OB)을 수용하는 제1본체부(11)의 내부 공간에 플라즈마를 발생시킬 수 있고, 상기 내부 공간에 플라즈마가 생성되며 제1본체부(11)의 내부 공간에 배치되는 피처리물(OB)의 플라즈마 표면 처리가 진행될 수 있다. Referring to FIG. 3, when an electric field is formed by the electrode unit 45 according to an embodiment of the present invention, a low pressure environment and a vacuum area are formed and the first body unit 11 accommodating the object to be treated (OB) Plasma may be generated in the internal space of , plasma is generated in the internal space, and plasma surface treatment of the object OB disposed in the internal space of the first body portion 11 may be performed.

이로 인하여 고전압의 전원을 인가받은 전극부(45)가 외부에 노출되는 것을 방지하고, 포트부(41)와 처리용기(10)의 내부 공간으로 형성되는 공간이 밀폐된 상태에서 전기장이 형성될 수 있다.As a result, the electrode unit 45 to which high voltage power is applied is prevented from being exposed to the outside, and an electric field can be formed in a sealed state in the space formed by the port unit 41 and the internal space of the processing vessel 10. there is.

*101도 1 내지 도 3을 참조하면, 본 발명의 일 실시예에 따른 전원부(47)는 전극부(45)와 전기적으로 연결되는 것으로, 전원을 발생시켜 전극부(45)로 전달할 수 있다.*101 Referring to Figures 1 to 3, the power supply unit 47 according to an embodiment of the present invention is electrically connected to the electrode unit 45, and can generate power and transmit it to the electrode unit 45.

본 발명의 일 실시예에 따른 전원부(47)에서 전극부(45)로 전원을 인가함으로써 피처리물(OB)이 수용되는 제1본체부(11)의 외측에 배치되는 제1전극(45a), 제2전극(45b) 사이에 전기장이 형성될 수 있다. The first electrode 45a is disposed on the outside of the first body 11 where the object to be treated (OB) is accommodated by applying power from the power source 47 to the electrode part 45 according to an embodiment of the present invention. , an electric field may be formed between the second electrodes 45b.

도 1, 도 2를 참조하면, 복수 개의 전극, 구체적으로 제1전극(45a), 제2전극(45b) 사이에 배치되는 제1본체부(11)의 내면에는 플로팅 전극(13)이 결합될 수 있고, 플로팅 전극(13)으로 인하여 제1전극(45a), 제2전극(45b) 사이에 형성되는 전기장의 세기, 공간적 분포 또는 형상이 변형될 수 있다. Referring to FIGS. 1 and 2, a floating electrode 13 is coupled to the inner surface of the first body portion 11 disposed between a plurality of electrodes, specifically the first electrode 45a and the second electrode 45b. The intensity, spatial distribution, or shape of the electric field formed between the first electrode 45a and the second electrode 45b may be changed due to the floating electrode 13.

다시 말하여 플로팅 전극(13)으로 인하여 복수 개의 전극부(45)와 플로팅 전극(13) 사이에 형성되는 공간에 전기장이 집중되고, 제1본체부(11)의 내부 공간에 배치되는 피처리물(OB)의 표면을 처리함에 있어 플라즈마 처리 효율이 향상될 수 있는 효과가 있다.In other words, the electric field is concentrated in the space formed between the plurality of electrode parts 45 and the floating electrode 13 due to the floating electrode 13, and the object to be treated is disposed in the inner space of the first main body 11. When treating the surface of (OB), plasma processing efficiency can be improved.

이하, 본 발명의 제1실시예 내지 제3실시예에 따른 처리용기(10)에 관하여 자세히 설명하도록 한다.Hereinafter, the processing container 10 according to the first to third embodiments of the present invention will be described in detail.

<처리용기의 제1실시예><First embodiment of processing container>

도 4는 본 발명의 제1실시예에 따른 플라즈마 처리용기를 도시한 사시도이다. 도 5는 본 발명의 제1실시예에 따른 플라즈마 처리용기를 도시한 분해도이다. 도 6은 도 4의 I-I`선을 기준으로 하는 단면도이다. 도 7은 도 4의 II-II`선을 기준으로 하는 단면도이다.Figure 4 is a perspective view showing a plasma processing vessel according to the first embodiment of the present invention. Figure 5 is an exploded view showing a plasma processing vessel according to the first embodiment of the present invention. FIG. 6 is a cross-sectional view based on line II′ of FIG. 4. FIG. 7 is a cross-sectional view based on line II-II′ of FIG. 4.

도 4 내지 도 7을 참조하면, 처리용기(10)는 내부에 수용되는 피처리물(OB)의 플라즈마 처리를 위해 사용되는 것으로, 제1본체부(11), 플로팅 전극(13), 필름부(15), 실링부(17), 유동제한부(도면 미도시)를 포함할 수 있다.Referring to FIGS. 4 to 7, the processing container 10 is used for plasma processing of the object to be treated (OB) accommodated therein, and includes a first body portion 11, a floating electrode 13, and a film portion. (15), a sealing part 17, and a flow restriction part (not shown) may be included.

도 5 내지 도 7을 참조하면, 제1본체부(11)는 피처리물(OB)을 수용가능한 것으로, 제1본체(111), 캡부(115), 실링부(17)를 포함할 수 있다. Referring to FIGS. 5 to 7 , the first body portion 11 is capable of accommodating an object to be treated (OB) and may include a first body 111, a cap portion 115, and a sealing portion 17. .

본 발명의 제1실시예에 따른 처리용기(10)에 수용되는 피처리물(OB)은 인체의 치아를 전체적 또는 부분적으로 커버하며 장착될 수 있는 완전 덧댐 치아관(full crown)으로 형성될 수 있다. The object to be treated (OB) accommodated in the processing container 10 according to the first embodiment of the present invention can be formed as a full crown that can be installed and completely or partially covers the teeth of the human body. there is.

본 발명의 제1실시예에 따른 처리용기(10)에 수용되는 피처리물(OB)은 'U'자 형상으로 곡선 구간이 형성될 수 있고, 제1본체(111)의 내부에는 피처리물(OB)의 상기 곡선 구간이 걸쳐질 수 있도록 걸침돌기(도면부호 미설정)이 돌출 형성될 수 있다. The object to be treated (OB) accommodated in the processing container 10 according to the first embodiment of the present invention may have a curved section formed in a 'U' shape, and the object to be treated may be inside the first body 111. A crossing protrusion (reference numeral not set) may be formed to protrude so as to span the curved section of (OB).

도 4, 도 5를 참조하면, 제1본체(111)는 피처리물(OB)이 수용될 수 있도록 내부가 중공이고, 뒤에 설명할 캡부(115)와 결합될 수 있다. Referring to FIGS. 4 and 5, the first body 111 has a hollow interior to accommodate the object to be treated (OB), and can be combined with the cap portion 115, which will be described later.

도 4, 도 6을 참조하면, 제1본체(111)의 일면에는 연통홀부(11h)가 관통 형성될 수 있다. 연통홀부(11h)는 복수 개가 구비될 수 있고, 연통홀부(11h)가 형성됨으로 인하여 제1본체(111)와 캡부(115)로 둘러싸이는 내부 공간과 처리용기(10)의 외부 공간 사이에서 공기와 같은 기체(G)의 유동이 가능한 효과가 있다.Referring to FIGS. 4 and 6, a communication hole 11h may be formed through one surface of the first body 111. There may be a plurality of communication hole portions 11h, and the communication hole portion 11h is formed so that air flows between the inner space surrounded by the first body 111 and the cap portion 115 and the outer space of the processing container 10. There is an effect that allows the flow of gas (G) as follows.

구체적으로 제1본체(111)에 형성되는 연통홀부(11h)는 뒤에 설명할 처리부(40), 구체적으로 포트부(41)와 마주보며 배치될 수 있고, 제1본체부(11)의 내부 공간에서 포트부(41)를 거쳐 압력조정부(30)로 기체(G)가 유동될 수 있다. Specifically, the communication hole portion 11h formed in the first body 111 may be disposed facing the processing portion 40, specifically the port portion 41, which will be described later, and the internal space of the first body portion 11. Gas (G) may flow from the port portion 41 to the pressure adjusting portion 30.

도 4 내지 도 7을 참조하면, 캡부(115)는 제1본체(111)를 커버하는 것으로, 피처리물(OB)이 제1본체(111)의 내부 공간에 수용된 상태에서 제1본체(111)와 결합될 수 있다. 도 4, 도 5를 참조하면, 제1본체(111)를 마주보는 캡부(115)의 일면에는 제1본체(111)를 향해 캡돌출부(116)가 돌출 형성될 수 있다. Referring to FIGS. 4 to 7, the cap portion 115 covers the first body 111, and the object to be treated (OB) is accommodated in the internal space of the first body 111. ) can be combined with. Referring to FIGS. 4 and 5 , a cap protrusion 116 may be formed on one surface of the cap portion 115 facing the first body 111 to protrude toward the first body 111 .

도 5를 참조하면, 캡돌출부(116)는 복수 개가 구비될 수 있고, 캡부(115)의 중심을 기준으로 둘레를 따라 이격 배치될 수 있다. Referring to FIG. 5 , a plurality of cap protrusions 116 may be provided and may be spaced apart along the circumference of the center of the cap portion 115 .

도 4, 도 5를 참조하면, 제1본체(111)에는 캡돌출부(116)가 걸쳐지도록 미리 설정되는 깊이를 가지며 걸침홈부(112)가 홈부의 형상으로 형성될 수 있다.Referring to FIGS. 4 and 5, the first body 111 may have a preset depth so that the cap protrusion 116 spans, and the spanning groove 112 may be formed in the shape of a groove.

도 6, 도 7을 참조하면, 제1본체(111)를 향하는 캡돌출부(116)의 일단부(도 6 기준 하단부)에는 내측 방향으로 돌출턱부(116k)가 돌출 형성될 수 있고, 걸침홈부(112) 상에서 미리 설정되는 깊이를 가지며 형성되는 홈부에 걸쳐질 수 있다.Referring to FIGS. 6 and 7, a protruding protrusion 116k may be formed to protrude inward at one end of the cap protrusion 116 (lower end in FIG. 6) facing the first body 111, and a straddling groove ( 112) It can be draped over a groove formed with a preset depth.

이로 인하여 캡부(115)가 제1본체(111)에 결합된 상태에서 결합이 해제, 분리되는 것을 차단할 수 있다. As a result, it is possible to prevent the cap portion 115 from being disconnected or separated from the first body 111 while it is coupled to the first body 111.

도 4 내지 도 7을 참조하면, 플로팅 전극(13)은 제1본체부(11)에 설치되는 것으로, 금속 재질로 형성될 수 있다. 플로팅 전극(13)은 제1본체부(11), 구체적으로 제1본체(111), 캡부(115)에 연결될 수 있다. Referring to FIGS. 4 to 7 , the floating electrode 13 is installed in the first body portion 11 and may be made of a metal material. The floating electrode 13 may be connected to the first body 11, specifically the first body 111 and the cap portion 115.

플로팅 전극(13)은 뒤에 설명할 전극부(45)와 달리 전원부(47)로부터 전원을 인가받지 않고, 접지도 하지 않게 제1본체부(11), 구체적으로 제1본체(111), 캡부(115)에 연결될 수 있다. Unlike the electrode unit 45, which will be explained later, the floating electrode 13 does not receive power from the power source 47 and is not grounded, so it is connected to the first body 11, specifically the first body 111, and the cap part ( 115).

도 4 내지 도 7을 참조하면, 본 발명의 제1실시예에 따른 플로팅 전극(13)은 처리용기(10)의 내부에 전기장을 형성하는 복수 개의 전극부(45) 사이에 배치될 수 있고, 플로팅 전극(13)과 전극부(45) 사이에 있는 처리용기(10), 구체적으로 제1본체부(11)의 내부 공간에 강한 전기장을 형성할 수 있다. Referring to FIGS. 4 to 7, the floating electrode 13 according to the first embodiment of the present invention may be disposed between a plurality of electrode units 45 that form an electric field inside the processing vessel 10, A strong electric field can be formed in the internal space of the processing vessel 10, specifically the first main body 11, between the floating electrode 13 and the electrode unit 45.

즉, 전원부(47)로부터 전원을 인가받은 복수 개의 전극부(45)에 의해 형성되는 전기장을 피처리물(OB)이 수용되는 제1본체부(11)의 내부 공간에 집중시킬 수 있는 효과가 있다. That is, there is an effect of concentrating the electric field formed by the plurality of electrode units 45 that receive power from the power source unit 47 into the internal space of the first body unit 11 where the object to be treated (OB) is accommodated. there is.

이에 더하여 플로팅 전극(13)이 피처리물(OB)을 둘러싸며 외측에 배치됨으로 인하여, 전기장의 세기, 공간적 분포 또는 형상을 변형시켜 피처리물(OB)의 외측 영역에 전기장이 균일하게 형성될 수 있도록 하는 효과가 있다.In addition, since the floating electrode 13 surrounds the object OB and is disposed on the outside, the electric field can be uniformly formed in the outer area of the object OB by modifying the intensity, spatial distribution, or shape of the electric field. It has the effect of allowing you to do so.

이에 더하여 플로팅 전극(13)으로 인해 제1본체부(11)의 내부 공간 전체에 형성되는 전기장의 세기, 공간적 분포 또는 형상이 변형됨에 따라 복수 개의 전극부(45) 사이에 위치하는 피처리물(OB)에 대하여 균일한 플라즈마를 방전시킬 수 있는 효과가 있다.In addition, as the intensity, spatial distribution or shape of the electric field formed throughout the internal space of the first main body 11 is changed due to the floating electrode 13, the object to be processed located between the plurality of electrode parts 45 ( OB) has the effect of discharging a uniform plasma.

도 4 내지 도 7을 참조하면, 플로팅 전극(13)은 제1본체(111), 캡부(115)에 각각 연결될 수 있다. Referring to FIGS. 4 to 7 , the floating electrode 13 may be connected to the first body 111 and the cap portion 115, respectively.

제1본체(111), 캡부(115)에는 미리 설정되는 방향을 따라 연장 형성되는 플로팅 전극(13)이 제1본체부(11)의 내부 공간에 수용되는 피처리물(OB)의 외측 둘레를 따라 배치될 수 있도록 제1본체(111)의 내면, 캡부(115)의 내면에 안착홈부(111a)가 형성될 수 있고, 상기 안착홈부(111a)에 플로팅 전극(13)이 배치될 수 있다.A floating electrode 13 extending along a preset direction is formed in the first body 111 and the cap portion 115 along the outer circumference of the object to be processed (OB) accommodated in the internal space of the first body 11. A seating groove portion 111a may be formed on the inner surface of the first body 111 and the inner surface of the cap portion 115 so that the electrode can be placed along the inner surface of the cap portion 115, and the floating electrode 13 may be disposed in the seating groove portion 111a.

도 4 내지 도 7을 참조하면, 플로팅 전극(13)은 제1본체(111), 캡부(115)의 내면에 접하도록 배치될 수 있다. 이로 인하여 제1본체부(11)의 내부 공간에서 플라즈마 방전(PD)이 발생하는 영역에 플로팅 전극(13)이 배치되고, 그 결과 플로팅 전극(13)으로 둘러싸이는 영역에서 전기장이 균일하게 형성되도록 전기장의 세기, 형상 등이 변형되고, 전기장이 집중되는 효과를 달성할 수 있다.Referring to FIGS. 4 to 7 , the floating electrode 13 may be arranged to contact the inner surfaces of the first body 111 and the cap portion 115. As a result, the floating electrode 13 is disposed in the area where the plasma discharge (PD) occurs in the internal space of the first main body 11, and as a result, the electric field is formed uniformly in the area surrounded by the floating electrode 13. The intensity and shape of the electric field are modified, and the effect of concentrating the electric field can be achieved.

플로팅 전극(13)은 제1본체부(11)의 변형을 방지할 수 있도록 제1본체부(11)의 내면을 지지하는 구조로 형성될 수 있다. The floating electrode 13 may be formed in a structure that supports the inner surface of the first body 11 to prevent deformation of the first body 11.

도 5 내지 도 7을 참조하면, 플로팅 전극(13)은 피처리물(OB)의 플라즈마 처리 과정에서 제1본체부(11)의 내외의 압력 차이가 발생하더라도 제1본체부(11)의 형상 변형을 방지할 수 있도록 제1본체부(11)의 내면을 지지하는 구조로 형성될 수 있다. Referring to FIGS. 5 to 7, the floating electrode 13 maintains the shape of the first body 11 even if a pressure difference occurs inside and outside the first body 11 during the plasma treatment of the object OB. It may be formed in a structure that supports the inner surface of the first body portion 11 to prevent deformation.

즉, 플로팅 전극(13)이 강성을 확보하며 형상을 유지함으로써 압력조정부(30)가 구동됨에 따라 제1본체부(11)의 내부 공간에서 공기와 같은 기체(G)가 배출될 때 제1본체부(11)의 내부 공간이 축소, 변형되는 것을 방지할 수 있는 효과가 있다.That is, when the floating electrode 13 secures rigidity and maintains its shape, the pressure adjusting unit 30 is driven, and gas such as air is discharged from the internal space of the first main body 11. This has the effect of preventing the internal space of the unit 11 from being reduced or deformed.

도 4, 도 5를 참조하면, 플로팅 전극(13)은 캡부(115)에 형성되는 캡돌출부(116)에는 배치되지 않으나, 이에 한정하는 것은 아니고 캡돌출부(116)에도 상기 홈부가 형성되며, 플로팅 전극(13)이 배치될 수 있는 등 다양한 변형 실시가 가능하다.Referring to FIGS. 4 and 5, the floating electrode 13 is not disposed on the cap protrusion 116 formed on the cap portion 115, but is not limited to this and the groove is also formed on the cap protrusion 116, and the floating electrode 13 is not disposed on the cap protrusion 116 formed on the cap portion 115. Various modifications are possible, such as the electrode 13 being disposed.

본 발명의 제1실시예에 따른 플로팅 전극(13)은 전기적으로 절연될 수 있다. 이로 인하여 플로팅 전극(13)은 전원부(47)로부터 전원이 인가되는 것이 차단될 수 있다. The floating electrode 13 according to the first embodiment of the present invention may be electrically insulated. As a result, the floating electrode 13 may be blocked from receiving power from the power supply unit 47.

선택적 실시예로서, 플로팅 전극(13)은 링 형상으로 형성되며 폐구간을 형성할 수 있다.As an optional embodiment, the floating electrode 13 may be formed in a ring shape and form a closed section.

선택적 실시예로서, 플로팅 전극(13)은 폐구간, 구체적으로 링 형상으로 형성될 수 있다. As an optional embodiment, the floating electrode 13 may be formed in a closed section, specifically a ring shape.

도 1, 도 4를 참조하면 본 발명의 일 실시예에 따른 플로팅 전극(13)은 전극부(45), 구체적으로 제1전극(45a), 제2전극(45b)이 전원부(47)로부터 전원을 인가받아 전기장을 형성할 때, 전기장이 형성되는 방향(도 1 기준 상하 방향)을 기준으로 제1본체부(11)의 중앙에 배치될 수 있다.1 and 4, the floating electrode 13 according to an embodiment of the present invention includes an electrode unit 45, specifically a first electrode 45a and a second electrode 45b, which receive power from the power supply unit 47. When applied to form an electric field, it may be placed in the center of the first main body 11 based on the direction in which the electric field is formed (up and down direction based on FIG. 1).

도 1을 참조하면, 제1본체부(11)에 형성되는 연통홀부(11h)와 플로팅 전극(13)이 중첩되는 위치에 배치되나, 이는 개략적으로 도시하기 위함이고, 도 4 내지 도 7과 같이, 플로팅 전극(13)과 연통홀부(11h)가 이격되도록 배치되는 등 다양한 변형 실시가 가능하다.Referring to FIG. 1, the communication hole portion 11h formed in the first body portion 11 and the floating electrode 13 are disposed in an overlapping position, but this is for schematic illustration only, as shown in FIGS. 4 to 7. Various modifications are possible, such as arranging the floating electrode 13 and the communication hole portion 11h to be spaced apart.

도 5 내지 도 7을 참조하면, 본 발명의 제1실시예에 따른 처리용기(10)는 필름부(15)를 더 포함할 수 있다. 필름부(15)는 플로팅 전극(13)을 커버하며 제1본체부(11)에 결합되는 것으로, 절연 재질로 형성될 수 있다.Referring to FIGS. 5 to 7 , the processing container 10 according to the first embodiment of the present invention may further include a film portion 15. The film portion 15 covers the floating electrode 13 and is coupled to the first body portion 11, and may be formed of an insulating material.

필름부(15)가 절연 재질로 형성됨으로 인하여 플로팅 전극(13)이 전기적으로 절연될 상태를 유지할 수 있는 효과가 있다. Since the film portion 15 is made of an insulating material, the floating electrode 13 can be maintained in an electrically insulated state.

또한, 필름부(15)가 플로팅 전극(13)을 커버함으로 인하여 플로팅 전극(13)과 피처리물(OB)이 직접 접촉하는 것을 방지하고, 플라즈마 처리 과정에서 피처리물(OB)이 손상되는 것을 방지할 수 있는 효과가 있다.In addition, because the film portion 15 covers the floating electrode 13, it prevents direct contact between the floating electrode 13 and the object OB, and prevents the object OB from being damaged during the plasma treatment process. It has the effect of preventing this.

선택적 실시예로서, 필름부(15)는 제1본체(111), 캡부(115)의 내면에 접하게 배치되는 플로팅 전극(13)을 커버하며 제1본체부(11)에 결합될 수 있다. As an optional embodiment, the film portion 15 covers the floating electrode 13 disposed in contact with the inner surfaces of the first body 111 and the cap portion 115 and may be coupled to the first body 11.

선택적 실시예로서, 필름부는 플로팅 전극(13)의 외주면을 감싸며 제1본체부(11), 구체적으로 제1본체(111), 캡부(115)에 형성되는 안착홈부(111a)에 배치될 수 있다. As an optional embodiment, the film portion surrounds the outer peripheral surface of the floating electrode 13 and may be disposed in the first body portion 11, specifically the first body 111 and the seating groove portion 111a formed in the cap portion 115. .

필름부(15)가 절연 재질로 형성되며, 플로팅 전극(13)을 커버함으로써 플로팅 전극(13)이 전원부(47)로부터 전원을 인가받지 않고, 복수 개의 전극부(45) 사이에 형성되는 전기장이 미리 설정되는 영역에서 집중되도록 하여 플라즈마 방전(PD) 처리 효율을 향상시킬 수 있는 효과가 있다.The film portion 15 is formed of an insulating material and covers the floating electrode 13, so that the floating electrode 13 does not receive power from the power supply portion 47 and the electric field formed between the plurality of electrode portions 45 is reduced. There is an effect of improving plasma discharge (PD) processing efficiency by concentrating it in a preset area.

이에 더하여 전극부(45), 구체적으로 제1전극(45a), 제2전극(45b)과 플로팅 전극(13) 사이에 형성되는 영역에 전기장이 집중될 수 있도록 하여 플로팅 전극(13)이 배치되는 제1본체부(11)의 내부 공간에 수용되는 피처리물(OB)의 주변에 전기장이 집중되며, 피처리물(OB)의 표면에 대한 플라즈마 처리 시 균일도를 향상시킬 수 있는 효과가 있다.In addition, the floating electrode 13 is disposed so that the electric field can be concentrated in the area formed between the electrode portion 45, specifically the first electrode 45a, the second electrode 45b, and the floating electrode 13. The electric field is concentrated around the object OB accommodated in the internal space of the first body 11, which has the effect of improving uniformity during plasma treatment of the surface of the object OB.

필름부(15)의 두께는 제1본체부(11)의 두께와 같거나 상대적으로 얇게 형성될 수 있다. 이로 인하여 플로팅 전극(13)의 절연 성능을 확보할 수 있는 효과가 있다.The thickness of the film portion 15 may be the same as that of the first body portion 11 or may be formed to be relatively thin. This has the effect of securing the insulation performance of the floating electrode 13.

도 5 내지 도 7을 참조하면, 제1실시예에 따른 실링부(17)는 제1본체(111)와 캡부(115) 사이에 배치되는 것으로, 탄성 변형이 가능한 재질로 형성될 수 있다. 도 5, 도 7을 참조하면, 실링부(17)는 제1본체(111)에 형성되는 실링홈부(113) 상에 안착되며 배치될 수 있다. Referring to Figures 5 to 7, the sealing part 17 according to the first embodiment is disposed between the first body 111 and the cap part 115, and may be formed of a material capable of elastic deformation. Referring to FIGS. 5 and 7 , the sealing portion 17 may be seated and disposed on the sealing groove portion 113 formed in the first body 111.

실링부(17)가 실링홈부(113)에 안착된 상태에서 제1본체(111)와 캡부(115)가 결합되고, 실링부(17)가 탄성 변형되며 제1본체(111), 캡부(115)에 밀착됨으로 인하여, 제1본체(111), 캡부(115)로 둘러싸이는 제1본체부(11)의 내부 공간의 기밀성을 향상시킬 수 있는 효과가 있다.With the sealing portion 17 seated in the sealing groove portion 113, the first body 111 and the cap portion 115 are coupled, the sealing portion 17 is elastically deformed, and the first body 111 and the cap portion 115 are formed. ), there is an effect of improving the airtightness of the internal space of the first main body 11 surrounded by the first main body 111 and the cap part 115.

도 5 내지 도 7을 참조하면, 본 발명에서 실링홈부(113)는 제1본체(111)에 형성되나, 이에 한정하는 것은 아니고 캡부(115)에 형성되는 등 실링부(17)가 제1본체(111), 캡부(115)에 밀착되며 기밀성을 향상시킬 수 있는 기술적 사상 안에서 다양한 변형 실시가 가능하다.Referring to FIGS. 5 to 7, in the present invention, the sealing groove portion 113 is formed in the first body 111, but the sealing groove portion 113 is not limited to this and is formed in the cap portion 115, etc., and the sealing groove portion 17 is formed in the first body 111. (111), various modifications are possible within the technical idea of being in close contact with the cap portion 115 and improving airtightness.

도면에 도시하지는 않았지만, 유동제한부는 연통홀부(11h)를 커버하며 제1본체부(11)에 결합되는 것으로, 제1본체부(11)의 내부 공간과 외부 공간 사이의 유체의 유동을 제한할 수 있다. Although not shown in the drawing, the flow limiting portion covers the communication hole portion 11h and is coupled to the first body portion 11, which limits the flow of fluid between the inner space and the outer space of the first body portion 11. You can.

선택적 실시예로서, 유동제한부는 기체의 유동만을 허용할 수 있다. 이로 인하여 공기와 같은 기체(G)외의 유체, 이물질등이 피처리물(OB)이 수용되는 제1본체부(11)의 내부에 유입되는 것을 차단할 수 있다. As an alternative embodiment, the flow restrictor may only allow the flow of gas. As a result, it is possible to block fluids other than the gas (G) such as air, foreign substances, etc. from flowing into the first body portion 11 where the object to be treated (OB) is accommodated.

선택적 실시예로서, 유동제한부는 제1본체부(11)의 외면에 결합될 수 있다. 그러나 이에 한정하는 것은 아니고 연통홀부(11h)를 커버하며 유체의 유동을 제한하는 기술적 사상 안에서 제1본체부(11)의 내면에 결합되는 등 다양한 변형 실시가 가능하다. 유동제한부는 필름 방식으로 형성되며, 제1본체부(11)의 외면 또는 내면에 결합될 수 있다.As an optional embodiment, the flow restriction portion may be coupled to the outer surface of the first body portion 11. However, it is not limited to this, and various modifications are possible, such as being coupled to the inner surface of the first main body 11 within the technical idea of covering the communication hole 11h and restricting the flow of fluid. The flow restriction portion is formed in a film manner and may be coupled to the outer or inner surface of the first body portion 11.

<처리용기의 제2실시예><Second embodiment of processing container>

도 8은 본 발명의 제2실시예에 따른 플라즈마 처리용기를 도시한 사시도이다. 도 9는 본 발명의 제2실시예에 따른 플라즈마 처리용기를 도시한 분해도이다. 도 10은 도 8의 III-III`선을 기준으로 하는 단면도이다. 도 11은 도 8의 IV-IV`선을 기준으로 하는 단면도이다.Figure 8 is a perspective view showing a plasma processing vessel according to a second embodiment of the present invention. Figure 9 is an exploded view showing a plasma processing vessel according to a second embodiment of the present invention. FIG. 10 is a cross-sectional view taken along line III-III′ of FIG. 8. FIG. 11 is a cross-sectional view based on line IV-IV′ of FIG. 8.

도 8 내지 도 11을 참조하면, 본 발명의 제2실시예에 따른 처리용기(10`)는 내부에 수용되는 피처리물의 플라즈마 처리를 위해 사용되는 것으로, 제1본체부(11`), 플로팅 전극(13`), 필름부(15`), 제1본체캡(14`)을 포함할 수 있다.Referring to FIGS. 8 to 11, the processing container 10' according to the second embodiment of the present invention is used for plasma processing of the object to be processed contained therein, and includes a first body portion 11', a floating It may include an electrode 13′, a film portion 15′, and a first body cap 14′.

도 8 내지 도 11을 참조하면, 본 발명의 제2실시예에 따른 제1본체부(11`)는 피처리물을 수용가능한 것으로, 제1본체(111`), 캡부(115`)를 포함할 수 있다. Referring to FIGS. 8 to 11, the first main body 11' according to the second embodiment of the present invention is capable of receiving an object to be treated and includes a first main body 111' and a cap part 115'. can do.

본 발명의 제2실시예에 따른 처리용기(10`), 구체적으로 제1본체부(11`)에 수용되는 피처리물은 골이식재로서, 주사기(syringe, OB1)나, 바이알(vial, OB2)과 같은 내부용기에 수용될 수 있다. The object to be treated accommodated in the treatment container 10', specifically the first main body 11' according to the second embodiment of the present invention, is a bone graft material, such as a syringe (OB1) or a vial (OB2). ) can be accommodated in an internal container such as

피처리물은 주사기DHK (OB1), 바이알(OB2)의 내부 공간에 각각 수용되며, 플라즈마 처리될 수 있다. The object to be treated is accommodated in the inner space of the syringe DHK (OB1) and the vial (OB2) and can be plasma treated.

이로 인하여 골이식재와 같은 피처리물을 따로 플라즈마 처리 후 주사기(OB1), 바이알(OB2)의 내부에 넣는 것이 아니라, 피처리물이 주사기(OB1), 바이알(OB2)와 같이 용기 내에 수용된 상태에서 바로 플라즈마 처리될 수 있는 효과가 있다.Due to this, rather than placing the object to be treated, such as bone graft material, separately into the syringe (OB1) and vial (OB2) after plasma treatment, the object to be treated is accommodated in a container like the syringe (OB1) and vial (OB2). It has the effect of being immediately plasma treated.

도 8 내지 도 11을 참조하면, 제1본체(111`)는 피처리물이 수용되는 주사기(OB1), 바이알(OB2)과 같은 내부용기를 수용하는 것으로, 일측(도 9 기준 상측)이 개구될 수 있다. Referring to FIGS. 8 to 11, the first body 111 ` accommodates an internal container such as a syringe OB1 and a vial OB2 in which the object to be treated is accommodated, and one side (upper side in FIG. 9) has an opening. It can be.

도 9 내지 도 11을 참조하면, 제1본체(111`)는 피처리물 및 피처리물이 수용되는 내부용기(OB1, OB2)가 수용될 수 있도록 내부가 중공이고, 뒤에 설명할 캡부(115`)와 결합될 수 있다. Referring to FIGS. 9 to 11, the first body 111 ` has a hollow interior so as to accommodate the object to be treated and the internal containers OB1 and OB2 in which the object to be treated are accommodated, and the cap portion 115 to be described later. `) can be combined.

도 9 내지 도 11을 참조하면, 본 발명의 제2실시예에 따른 제1본체(111`)에는 내주면 둘레를 따라 플로팅 전극(13`)이 안착될 수 있도록 미리 설정되는 깊이를 가지며 안착홈부(111`a)가 홈부의 형상으로 형성될 수 있다.Referring to Figures 9 to 11, the first body 111' according to the second embodiment of the present invention has a preset depth so that the floating electrode 13' can be seated along the inner peripheral surface and has a seating groove ( 111`a) may be formed in the shape of a groove.

이로 인하여 플로팅 전극(13`)의 외주면이 제1본체(111`)의 내주면과 동일 평면 상에 위치하고, 플로팅 전극(13`)이 제1본체(111`)로부터 이탈하는 것을 방지할 수 있는 효과가 있다.As a result, the outer peripheral surface of the floating electrode 13' is located on the same plane as the inner peripheral surface of the first body 111', and the floating electrode 13' is prevented from being separated from the first body 111'. There is.

도 9를 참조하면, 제1본체(111`)의 일단부(도 9 기준 상단부)에는 미리 설정되는 깊이를 가지며 걸침홈부(112`)가 형성될 수 있고, 걸침홈부(112`)에는 뒤에 설명할 캡부(115`)에 형성되는 캡돌출부(116`)가 걸쳐질 수 있다. Referring to Figure 9, a crossing groove 112' may be formed at one end of the first body 111' (upper part based on Figure 9) with a preset depth, and the crossing groove 112' may be formed as described later. The cap protrusion 116 ′ formed on the cap portion 115 ′ may be overlaid.

선택적 실시예로서, 캡돌출부(116`)는 걸침홈부(112`)에 끼워맞춤 방식으로 결합될 수 있다. As an optional embodiment, the cap protrusion 116' may be coupled to the spanning groove 112' in a fitting manner.

도 9 내지 도 11을 참조하면, 제1본체(111`)에는 피처리물이 수용되는 내부용기, 구체적으로 주사기(OB1), 바이알(OB2)가 삽입될 수 있도록, 중공으로 형성되는 제1수용부(113`a), 제2수용부(113`b)가 형성될 수 있다.Referring to FIGS. 9 to 11, the first body 111' has an internal container in which the object to be treated is accommodated, specifically a first container that is formed as a hollow hole so that a syringe (OB1) and a vial (OB2) can be inserted. A portion 113`a and a second receiving portion 113`b may be formed.

제1수용부(113`a)는 주사기(OB1)의 형상에 대응되도록 내주면이 형성되고, 제2수용부(113`b)는 바이알(OB2)의 형상에 대응되도록 내주면이 형성될 수 있다. The first accommodating part 113`a may have an inner circumferential surface formed to correspond to the shape of the syringe OB1, and the second accommodating part 113`b may have an inner circumferential surface formed to correspond to the shape of the vial OB2.

도 9, 도 10을 참조하면, 제1본체(111`)의 일면(도 9 기준 상면)에는 제1수용부(113`a)의 중심을 기준으로 외측에 적어도 하나 이상의 고정부(114`)가 외측 방향으로 돌출 형성될 수 있다.Referring to FIGS. 9 and 10, one surface of the first body 111` (top surface in FIG. 9) has at least one fixing part 114` on the outside based on the center of the first accommodating part 113`a. may be formed to protrude in an outward direction.

복수 개의 고정부(114`)는 제1수용부(113`a)의 중심을 기준으로 둘레 방향을 따라 등각 배치될 수 있다. The plurality of fixing parts 114` may be arranged equiangularly along the circumferential direction based on the center of the first receiving part 113`a.

도 10을 참조하면, 제1수용부(113`a)에 주사기(OB1)가 삽입되고, 주사기(OB1)의 일면(도 10 기준)이 복수 개의 고정부(114`)의 내측에 배치됨으로 인하여, 주사기(OB1)가 제1수용부(113`a)의 내측에서 시계 방향 또는 반시계 방향으로 회전되는 것을 차단하고 위치 고정되는 효과가 있다.Referring to FIG. 10, the syringe OB1 is inserted into the first receiving part 113`a, and one side of the syringe OB1 (based on FIG. 10) is disposed inside the plurality of fixing parts 114`. , there is an effect of blocking the syringe OB1 from rotating clockwise or counterclockwise inside the first accommodating part 113`a and fixing its position.

도 8 내지 도 11을 참조하면, 캡부(115`)는 제1본체(111`)를 커버하는 것으로, 피처리물이 수용되는 내부용기(OB1, OB2)가 제1본체(111`)의 내부 공간에 수용된 상태에서 제1본체(111`)와 결합될 수 있다. Referring to Figures 8 to 11, the cap portion 115' covers the first body 111', and the internal containers OB1 and OB2 in which the object to be treated are accommodated are inside the first body 111'. It can be combined with the first body 111' while accommodated in space.

도 8 내지 도 10을 참조하면, 제1본체(111`)를 마주보는 캡부(115`)의 일면에는 제1본체(111`)를 향해 캡돌출부(116`)가 돌출 형성될 수 있다. Referring to FIGS. 8 to 10 , a cap protrusion 116 ′ may be formed on one side of the cap portion 115 ′ facing the first body 111 ′ to protrude toward the first body 111 ′.

도 10을 참조하면, 캡돌출부(116`)는 복수 개가 구비될 수 있고, 캡부(115`)의 중심을 기준으로 둘레를 따라 이격 배치될 수 있다. Referring to FIG. 10 , a plurality of cap protrusions 116 ′ may be provided and may be spaced apart along the circumference of the center of the cap portion 115 ′.

도 8 내지 도 10을 참조하면, 제1본체(111`)에는 캡돌출부(116`)가 걸쳐지도록 미리 설정되는 깊이를 가지며 걸침홈부(112`)가 홈부의 형상으로 형성될 수 있다.Referring to FIGS. 8 to 10 , the first body 111 ′ has a preset depth so that the cap protrusion 116 ′ extends, and the spanning groove 112 ′ may be formed in the shape of a groove.

이로 인하여 캡부(115`)가 제1본체(111`)에 결합된 상태에서 결합이 해제, 분리되는 것을 차단할 수 있다. As a result, it is possible to prevent the cap portion 115' from being uncoupled or separated from the first body 111' while it is coupled to the first body 111'.

도 8 내지 도 11을 참조하면, 본 발명의 제1실시예에 따른 처리용기(10)와 달리, 제2실시예에 따른 처리용기(10`)는 캡부(115`)에 연통홀부(11`h)가 관통 형성될 수 있다. 연통홀부(11`h)는 복수 개가 홀부가 구비될 수 있고, 연통홀부(11`h)가 형성됨으로 인하여 피처리물이 수용되며 제1본체(111`)에 삽입 배치되는 내부용기(OB1, OB2)의 내부 공간과 처리용기(10`)의 외부 공간 사이에서 공기와 같은 기체(G)의 유동이 가능한 효과가 있다.Referring to Figures 8 to 11, unlike the processing container 10 according to the first embodiment of the present invention, the processing container 10' according to the second embodiment has a communication hole portion 11' in the cap portion 115'. h) may be formed through. The communication hole portion 11`h may be provided with a plurality of hole portions, and the communication hole portion 11`h is formed so that the object to be treated is accommodated and an inner container OB1 inserted into the first body 111` is placed. This has the effect of allowing the flow of gas (G) such as air between the inner space of OB2) and the outer space of the processing container (10').

구체적으로 캡부(115`)에 형성되는 연통홀부(11`h)는 처리부(40), 구체적으로 포트부(41)와 마주보며 배치될 수 있고, 제1본체(111`)에 수용되며 피처리물을 수용하는 내부용기(OB1, OB2)의 내부 공간에서 포트부(41)를 거쳐 압력조정부(30)로 공기와 같은 기체(G)가 유동될 수 있다. Specifically, the communication hole portion 11′h formed in the cap portion 115′ may be disposed facing the processing portion 40, specifically the port portion 41, and is accommodated in the first body 111′ and is subject to processing. A gas (G) such as air may flow from the internal space of the internal containers (OB1, OB2) containing water to the pressure adjusting unit (30) through the port unit (41).

도 10을 참조하면, 본 발명의 제2실시예에 따른 캡부(115`)의 내면, 구체적으로 제1본체캡(14`)을 마주보는 일면에는 제1본체캡(14`) 측 방향으로 가압부(117`)가 돌출 형성될 수 있다. Referring to Figure 10, the inner surface of the cap portion 115' according to the second embodiment of the present invention, specifically, one surface facing the first body cap 14' is pressed in the direction toward the first body cap 14'. The portion 117` may be formed to protrude.

가압부(117`)는 제1본체캡(14`)의 일면(도 10 기준 상면)을 접촉 가압할 수 있고, 캡부(115`)의 상기 내면 상에 둘레 방향을 따라 연장 형성될 수 있다.The pressing portion 117` may contact and pressurize one surface (upper surface in FIG. 10) of the first body cap 14` and may be formed to extend along the circumferential direction on the inner surface of the cap portion 115`.

가압부(117`)가 제1본체캡(14`)의 일면을 접촉 가압함으로 인하여, 가압부(117`)로 둘러싸이는 내측 영역이 가압부(117`)의 외측 영역과 공간적으로 분리될 수 있으며, 상기 내측 영역의 기밀성, 밀폐성을 향상시킬 수 있는 효과가 있다.Because the pressing portion 117` contacts and pressurizes one surface of the first body cap 14′, the inner region surrounded by the pressing portion 117` can be spatially separated from the outer region of the pressing portion 117`. There is an effect of improving the airtightness and sealing of the inner area.

도 8 내지 도 11을 참조하면, 플로팅 전극(13`)은 제1본체(111`)에 설치되는 것으로, 금속 재질로 형성될 수 있다. Referring to Figures 8 to 11, the floating electrode 13' is installed in the first body 111' and may be made of a metal material.

플로팅 전극(13`)은 전극부(45)와 달리 전원부(47)로부터 전원을 인가받지 않고, 접지도 하지 않게 제1본체(111`)에 연결될 수 있고, 구체적으로 제1본체(111`)의 내면에 형성되는 안착홈부(111`a)에 배치되며 위치 고정될 수 있다. Unlike the electrode unit 45, the floating electrode 13' may be connected to the first body 111' without receiving power from the power source 47 or being grounded, and specifically, the first body 111'. It is placed in the seating groove portion 111`a formed on the inner surface of and can be fixed in position.

도 8 내지 도 11을 참조하면, 플로팅 전극(13`)은 제1본체(111`)의 내면에 접하도록 배치될 수 있다. 이로 인하여 제1본체부(111`)의 내부 공간에서 플라즈마 방전(PD)이 발생하는 영역을 둘러싸며 플로팅 전극(13`)이 배치되게 되고, 플로팅 전극(13`) 주변으로 전기장이 집중되어, 제1본체(111`)의 내부에 전체적으로 전기장이 균일하게 형성될 수 있다. Referring to Figures 8 to 11, the floating electrode 13' may be arranged to contact the inner surface of the first body 111'. As a result, the floating electrode 13′ is disposed surrounding the area where the plasma discharge (PD) occurs in the internal space of the first body portion 111′, and the electric field is concentrated around the floating electrode 13′, An electric field may be formed uniformly throughout the first body 111`.

플로팅 전극(13`)은 제1본체부(11`), 구체적으로 제1본체(111`)의 변형을 방지할 수 있도록 제1본체(111`)의 내면을 지지하는 구조로 형성될 수 있다. The floating electrode 13' may be formed in a structure that supports the inner surface of the first body 11', specifically the first body 111', to prevent deformation of the first body 111'. .

도 9 내지 도 11을 참조하면, 플로팅 전극(13`)은 피처리물(OB)의 플라즈마 처리 과정에서 제1본체(111`)의 내외의 압력 차이가 발생하더라도 제1본체(111`)의 형상 변형을 방지할 수 있도록 제1본체(111`)의 내면을 지지하는 구조로 형성될 수 있다. Referring to FIGS. 9 to 11 , the floating electrode 13 ′ maintains the pressure of the first body 111 ′ even if a pressure difference occurs inside and outside the first body 111 ′ during the plasma treatment of the object OB. It may be formed in a structure that supports the inner surface of the first body 111' to prevent shape deformation.

즉, 플로팅 전극(13`)이 강성을 확보하며 형상을 유지함으로써 압력조정부(30)가 구동됨에 따라 제1본체부(11`)의 내부 공간에서 공기와 같은 기체(G)가 배출될 때 제1본체부(11`), 구체적으로 제1본체(111`)의 내부 공간이 축소, 변형되는 것을 방지할 수 있는 효과가 있다.That is, the floating electrode 13' secures rigidity and maintains its shape, so that when the pressure adjusting unit 30 is driven, gas such as air is discharged from the internal space of the first body 11'. There is an effect of preventing the internal space of the first main body 11`, specifically the first main body 111`, from being reduced or deformed.

도 8을 참조하면, 플로팅 전극(13`)은 처리용기(10`)의 내부에 전기장을 형성하는 전극부(45), 구체적으로 마주보며 배치되는 제1전극(45a), 제2전극(45b) 사이에 배치될 수 있고, 플라즈마 처리 방향(도 8 기준 상하 방향)을 기준으로 제1본체(111`)의 중앙부에 위치할 수 있다.Referring to FIG. 8, the floating electrode 13' is an electrode portion 45 that forms an electric field inside the processing container 10', specifically a first electrode 45a and a second electrode 45b disposed facing each other. ) and may be located in the center of the first body 111' based on the plasma processing direction (up and down direction based on FIG. 8).

이로 인하여 플로팅 전극(13`)과 전극부(45) 사이에 있는 처리용기(10`), 구체적으로 제1본체(111`)에서 골이식재와 같은 피처리물을 수용하는 주사기(OB1), 바이알(OB2)의 내부 공간(IS1, IS2)에 강한 전기장을 형성할 수 있다. As a result, the processing container 10′ between the floating electrode 13′ and the electrode unit 45, specifically the syringe OB1 for receiving the object to be treated such as bone graft material in the first body 111′, and the vial A strong electric field can be formed in the internal space (IS1, IS2) of (OB2).

즉, 전원부(47)로부터 전원을 인가받은 전극부(45)에 의해 형성되는 전기장을 피처리물이 수용되는 내부용기(OB1, OB2)의 내부 공간에 집중시킬 수 있는 효과가 있다. In other words, there is an effect of concentrating the electric field formed by the electrode unit 45 receiving power from the power supply unit 47 into the internal space of the internal containers OB1 and OB2 where the object to be treated is accommodated.

이에 더하여 플로팅 전극(13`)이 피처리물을 둘러싸며 외측에 배치됨으로 인하여, 피처리물의 외측 영역에 전기장이 균일하게 형성될 수 있도록 하는 효과가 있다.In addition, since the floating electrode 13' surrounds the object to be treated and is disposed on the outside, it has the effect of allowing an electric field to be uniformly formed in the outer area of the object to be treated.

이에 더하여 플로팅 전극(13`)으로 인해 내부용기(OB1, OB2)의 내부 공간 전체에 형성되는 전기장의 세기, 공간적 분포 또는 형상이 변형됨에 따라 전극부(45), 구체적으로 마주보는 제1전극(45a), 제2전극(45b) 사이에 위치하는 피처리물에 대하여 균일한 플라즈마를 방전시킬 수 있는 효과가 있다.In addition, as the intensity, spatial distribution, or shape of the electric field formed throughout the internal space of the inner containers (OB1, OB2) is changed due to the floating electrode (13'), the electrode portion (45), specifically the facing first electrode ( 45a), there is an effect of uniformly discharging plasma to the object to be treated located between the second electrodes 45b.

플로팅 전극(13`)은 전기적으로 절연될 수 있다. 이로 인하여 플로팅 전극(13`)은 전원부(47)로부터 전원이 인가되는 것이 차단될 수 있다. The floating electrode 13' may be electrically insulated. As a result, the floating electrode 13' may be blocked from receiving power from the power supply unit 47.

선택적 실시예로서, 플로팅 전극(13`)은 링 형상으로 형성되며 폐구간을 형성할 수 있다.As an optional embodiment, the floating electrode 13' may be formed in a ring shape and form a closed section.

선택적 실시예로서, 플로팅 전극(13`)은 폐구간, 구체적으로 링 형상으로 형성될 수 있다. As an optional embodiment, the floating electrode 13' may be formed in a closed section, specifically a ring shape.

도 9 내지 도 11을 참조하면, 제1본체캡(14`)은 제1본체(111`)에 형성되는 제1수용부(113`a), 제2수용부(113`b)를 커버하며 제1본체(111`)에 결합되는 것으로, 제1본체(111`)와 캡부(115`) 사이에 배치될 수 있다.Referring to Figures 9 to 11, the first body cap 14` covers the first accommodating portion 113`a and the second accommodating portion 113`b formed in the first body 111`. It is coupled to the first body 111′ and may be disposed between the first body 111′ and the cap portion 115′.

도 9 내지 도 11을 참조하면, 제1본체캡(14`)에는 통과홀부(14`h)가 관통 형성될 수 있고, 통과홀부(14`h)는 캡부(115`)에 형성되는 연통홀부(11`h)와 연통될 수 있다. Referring to Figures 9 to 11, a through-hole portion 14'h may be formed through the first body cap 14', and the through-hole portion 14'h may be a communication hole formed in the cap portion 115'. It can be connected to (11`h).

통과홀부(14`h)는 일측(도 10 기준 상측)에서는 연통홀부(11`h)와 연통되며, 이에 대향하는 타측(도 10 기준 하측)에서는 피처리물이 수용되는 주사기, 바이알과 같은 내부용기(OB1, OB2)의 내부 공간과 연통될 수 있다.The passage hole part 14`h communicates with the communication hole part 11`h on one side (upper side in FIG. 10), and on the other side opposite to it (lower side in FIG. 10), there is an inside such as a syringe or vial in which the object to be treated is accommodated. It may communicate with the internal space of the containers OB1 and OB2.

이로 인하여 압력조정부(30)가 구동됨에 따라 내부용기(OB1, OB2)의 내부 공간에서 통과홀부(14`h), 연통홀부(11`h) 및 처리부(40), 구체적으로 포트부(41)를 거쳐 공기가 외부로 배출되며, 저압 환경(LPA)을 조성할 수 있다.As a result, as the pressure adjusting unit 30 is driven, the passage hole part 14'h, the communication hole part 11'h, and the processing part 40, specifically the port part 41, are removed from the inner space of the inner containers OB1 and OB2. The air is discharged to the outside, creating a low pressure environment (LPA).

도 9 내지 도 11을 참조하면, 제1본체(111`)와 마주보는 제1본체캡(14`)의 일면에는 외측 방향으로 접촉부(141`, 142`)가 돌출 형성될 수 있다. Referring to Figures 9 to 11, contact portions 141' and 142' may be formed to protrude outward on one surface of the first body cap 14' facing the first body 111'.

접촉부(141`, 142`)는 적어도 하나 이상의 곡면 구간을 구비하며 돌출 형성될 수 있다. 접촉부(141`, 142`)는 탄성 변형이 가능한 재질로 형성될 수 있다. 도 9, 도 10을 참조하면, 어느 하나의 접촉부(141`)는 제1본체(111`)의 내주면과 밀착되며 배치될 수 있고, 다른 하나의 접촉부(142`)는 주사기와 같은 내부용기(OB1)의 내주면과 밀착되며 배치될 수 있다. The contact portions 141` and 142` may have at least one curved section and may be formed to protrude. The contact portions 141' and 142' may be formed of a material capable of elastic deformation. Referring to FIGS. 9 and 10, one contact portion 141′ may be disposed in close contact with the inner peripheral surface of the first body 111′, and the other contact portion 142′ may be an internal container such as a syringe ( It can be placed in close contact with the inner peripheral surface of OB1).

이로 인하여 캡부(115`)에 형성되는 연통홀부(11`h), 제1본체캡(14`)에 형성되는 통과홀부(14`h) 및 이들과 연통가능한 내부용기(OB1, OB2)의 내부 공간의 밀폐성, 기밀성을 향상시킬 수 있는 효과가 있다.As a result, the communication hole portion 11`h formed in the cap portion 115`, the through hole portion 14`h formed in the first body cap 14`, and the interior of the internal containers OB1 and OB2 capable of communicating with them. It has the effect of improving the airtightness and airtightness of space.

도면에 도시하지는 않았지만, 유동제한부는 연통홀부(11`h)를 커버하며 제1본체부(11`)에 결합되는 것으로, 제1본체부(11`)의 내부 공간과 외부 공간 사이의 유체의 유동을 제한할 수 있다. Although not shown in the drawing, the flow restrictor covers the communication hole portion 11`h and is coupled to the first body portion 11`, which prevents the flow of fluid between the inner space and the outer space of the first body portion 11`. Flow may be restricted.

선택적 실시예로서, 유동제한부는 기체의 유동만을 허용할 수 있다. 이로 인하여 공기와 같은 기체(G)외의 유체, 이물질등이 피처리물(OB)이 수용되는 제1본체부(11`)의 내부에 유입되는 것을 차단할 수 있다. As an alternative embodiment, the flow restrictor may only allow the flow of gas. As a result, it is possible to block fluids other than the gas (G) such as air, foreign substances, etc. from flowing into the first body portion (11') where the object to be treated (OB) is accommodated.

선택적 실시예로서, 유동제한부는 제1본체부(11`), 구체적으로 캡부(115`)의 외면에 결합될 수 있다. 그러나 이에 한정하는 것은 아니고 연통홀부(11`h)를 커버하며 유체의 유동을 제한하는 기술적 사상 안에서 캡부(115`)의 내면에 결합되는 등 다양한 변형 실시가 가능하다.As an optional embodiment, the flow restriction portion may be coupled to the outer surface of the first body portion 11′, specifically the cap portion 115′. However, it is not limited to this, and various modifications are possible, such as being coupled to the inner surface of the cap portion 115′ within the technical idea of covering the communication hole portion 11′h and restricting the flow of fluid.

유동제한부는 필름 방식으로 형성되며, 제1본체부(11`)의 외면 또는 내면에 결합될 수 있다.The flow restriction portion is formed in a film manner and may be coupled to the outer or inner surface of the first body portion 11`.

선택적 실시예로서, 유동제한부는 캡부(115`)와 제1본체(111`) 사이에 배치되는 제1본체캡(14`)에 형성되는 통과홀부(14`h)를 커버하며 제1본체캡(14`)의 외면 또는 내면에 결합될 수 있다.As an optional embodiment, the flow restricting portion covers the through hole portion 14′h formed in the first body cap 14′ disposed between the cap portion 115′ and the first body 111′ and covers the first body cap 115′. It can be combined with the outer or inner surface of (14`).

본 발명의 제2실시예에 따른 처리용기(10`)는 필름부(15`)를 더 포함할 수 있다. 이와 관련하여는 제1실시예에 따른 처리용기(10)의 필름부(15)와 구성, 효과가 동일하므로 이와 중복되는 범위에서 자세한 설명은 생략한다.The processing container 10' according to the second embodiment of the present invention may further include a film portion 15'. In relation to this, since the structure and effect are the same as those of the film portion 15 of the processing container 10 according to the first embodiment, detailed description will be omitted to the extent of overlap.

<처리용기의 제3실시예><Third embodiment of processing container>

도 12는 본 발명의 제3실시예에 따른 플라즈마 처리용기를 도시한 사시도이다. 도 13은 본 발명의 제3실시예에 따른 플라즈마 처리용기를 도시한 분해도이다. 도 14는 도 12의 V-V`선을 기준으로 하는 단면도이다. 도 15는 도 14의 A부분을 확대한 도면이다. 도 16은 도 12의 VI-VI`선을 기준으로 하는 단면도이다.Figure 12 is a perspective view showing a plasma processing vessel according to a third embodiment of the present invention. Figure 13 is an exploded view showing a plasma processing vessel according to a third embodiment of the present invention. FIG. 14 is a cross-sectional view based on line V-V′ of FIG. 12. Figure 15 is an enlarged view of part A of Figure 14. FIG. 16 is a cross-sectional view based on line VI-VI′ in FIG. 12.

도 12 내지 도 16을 참조하면, 본 발명의 제3실시예에 따른 처리용기(10``)는 내부에 수용되는 피처리물(OB)의 플라즈마 처리를 위해 사용되는 것으로, 용기본체부(도면부호 미설정), 플로팅 전극(13``), 필름부(도면 미도시), 유동제한부를 포함할 수 있다.Referring to FIGS. 12 to 16, the processing container 10`` according to the third embodiment of the present invention is used for plasma processing of the object to be treated (OB) accommodated therein, and has a container body portion (drawing) symbol not set), a floating electrode (13``), a film part (not shown), and a flow restriction part.

본 발명의 제3실시예에 따른 처리용기(10``)에서 '용기본체부'는, 본 발명의 제1실시예에 따른 처리용기(10)에서 제1본체부(11)에 대응되는 것으로, 제1실시예에 따른 제1본체부(11)와 구분하기 위해 용어를 달리하였다.The 'container body portion' in the processing container 10`` according to the third embodiment of the present invention corresponds to the first body portion 11 in the processing container 10 according to the first embodiment of the present invention. , the terminology was changed to distinguish it from the first main body 11 according to the first embodiment.

도 12 내지 도 16을 참조하면, 용기본체부는 피처리물(OB)을 수용가능한 것으로, 제1본체부(111``), 가이드부(112``), 제1본체캡(113``), 제2본체부(114``), 캡부(115``)를 포함할 수 있다.Referring to FIGS. 12 to 16, the container body portion can accommodate the object to be treated (OB), and includes a first body portion (111″), a guide portion (112″), and a first body cap (113″). , a second main body (114``), and a cap part (115``).

본 발명의 제3실시예에 따른 처리용기(10``), 구체적으로 제1본체부(111``)에 수용되는 피처리물(OB)은 미리 설정되는 두께와 면적을 가지며, 제1본체부(111``)에 수용될 수 있다. The object to be treated (OB) accommodated in the processing container 10 ``, specifically the first main body 111 ``, according to the third embodiment of the present invention has a preset thickness and area, and the first main body 111 `` has a preset thickness and area. It can be accepted in section (111``).

피처리물(OB)은 제1본체부(111``)의 내부에 수용된 상태에서 플라즈마 처리장치(1)에 의해 플라즈마 방전(PD)이 발생되고, 플라즈마로 인하여 피처리물(OB)의 표면 처리가 가능하다.A plasma discharge (PD) is generated by the plasma processing device 1 while the object OB is accommodated inside the first body 111``, and the surface of the object OB is generated due to the plasma. Processing is possible.

본 발명의 제3실시예에 따른 피처리물(OB)은 의료 산업에서 사용되는 것으로, 피부(dermal, cutaneous) 등 인체 조직 및 기관의 대체, 수복, 재건(reconstruction)에 사용되는 인체 피부 수복용 생체재료(skin graft)를 의미한다. The object to be treated (OB) according to the third embodiment of the present invention is used in the medical industry and is used for human skin restoration, which is used for replacement, restoration, and reconstruction of human tissues and organs such as skin (dermal, cutaneous). It refers to biomaterial (skin graft).

도 13 내지 도 16을 참조하면, 제1본체부(111``)는, 피처리물(OB)을 수용가능한 것으로, 내부가 중공으로 형성될 수 있다. 제1본체부(111``)에는 플로팅 전극(13``)이 연결되며, 플로팅 전극(13``)이 제1본체부(111``)의 내측에 배치될 수 있다. Referring to FIGS. 13 to 16 , the first body portion 111 `` can accommodate the object to be treated OB and may have a hollow interior. A floating electrode 13`` is connected to the first body 111``, and the floating electrode 13`` may be disposed inside the first body 111``.

도 13, 도 14를 참조하면, 제1본체부(111``)의 내면에는 길이 방향(도 14 기준 상하 방향)을 따라 제1본체리브(111``a)가 돌출 형성될 수 있다. 제1본체리브(111``a)는 복수 개가 구비될 수 있으며, 복수 개의 제1본체리브(111``a)는 미리 설정되는 간격을 가지며 이격 배치될 수 있다. Referring to FIGS. 13 and 14, a first body rib 111``a may be formed to protrude from the inner surface of the first body portion 111``along the longitudinal direction (up and down direction based on FIG. 14). A plurality of first main body ribs 111``a may be provided, and a plurality of first main body ribs 111``a may be spaced apart from each other at a preset interval.

복수 개의 제1본체리브(111``a)가 제1본체부(111``)의 내주면 둘레를 따라 미리 설정되는 간격을 가지며 이격 배치됨으로 인하여 제1본체리브(111``a)의 내측에 배치되는 피처리물(OB)이 제1본체부(111``)의 내면에 접착되는 것을 방지할 수 있다.A plurality of first body ribs (111``a) are spaced apart from each other at preset intervals along the inner peripheral surface of the first body portion (111``), so that they are located on the inside of the first body rib (111``a). It is possible to prevent the disposed object OB from adhering to the inner surface of the first body portion 111``.

이에 더하여 복수 개의 제1본체리브(111``a) 사이에 형성되는 공간을 통해 압력조정부(30)의 구동 시 제1본체부(111``)의 내부에서 연통홀부(115``h)를 거쳐 외부로 배출되는 공기 등 기체(G)의 유동 경로를 제공할 수 있다. In addition, when the pressure adjusting unit 30 is driven through the space formed between the plurality of first main body ribs 111``a, the communication hole part 115``h is formed inside the first main body part 111``. It is possible to provide a flow path for gas (G) such as air that is discharged to the outside.

이에 더하여 복수 개의 제1본체리브(111``a) 사이에 형성되는 공간이 제1본체부(111``)의 내주면 둘레를 따라 균일하게 형성됨으로 인하여, 상기 공간에 저압 환경(LPA)이 조성되고, 플라즈마 방전(PD) 시에 피처리물(OB)에 대한 균일한 플라즈마 표면 처리가 가능한 효과가 있다.In addition, since the space formed between the plurality of first body ribs 111``a is formed uniformly along the inner peripheral surface of the first body portion 111``a, a low pressure environment (LPA) is created in the space. This has the effect of enabling uniform plasma surface treatment of the object to be treated (OB) during plasma discharge (PD).

도 14를 참조하면, 제1본체부(111``)의 내면에 돌출 형성되는 제1본체리브(111``a)는 뒤에 설명할 가이드부(112``)의 내면에 돌출 형성되는 가이드리브(112``a)와 연결될 수 있다. Referring to FIG. 14, the first body rib 111``a protruding from the inner surface of the first body part 111`` is a guide rib protruding from the inner surface of the guide part 112`` to be described later. It can be connected to (112``a).

이로 인하여 복수 개의 제1본체리브(111``a) 사이의 공간과 복수 개의 가이드리브(112``a) 사이의 공간이 연통될 수 있고, 처리용기(10``), 구체적으로 제1본체부(111``)의 내부 공간에서 외부 공간으로의 공기(G)의 유동, 배출 경로를 제공할 수 있는 효과가 있다.As a result, the space between the plurality of first body ribs 111``a and the space between the plurality of guide ribs 112``a can be communicated, and the processing container 10``, specifically the first main body. It has the effect of providing a flow and discharge path for air (G) from the internal space of the unit 111`` to the external space.

도 14를 참조하면, 본 발명의 제3실시예에 따른 제1본체부(111``)의 내면에는 내측 방향으로 단차부(111``b)가 돌출 형성될 수 있다. Referring to FIG. 14, a step portion 111``b may be formed to protrude inward on the inner surface of the first main body 111`` according to the third embodiment of the present invention.

단차부(111``b)는 제1본체부(111``)의 길이 방향(도 14 기준 상하 방향)을 따라 제1본체부(111``)의 횡단면적이 다르게 형성되도록 내측 방향으로 돌출 형성되는 것으로, 미리 설정되는 길이만큼 형성될 수 있다.The step portion 111``b protrudes inward so that the cross-sectional area of the first main body 111`` is formed differently along the longitudinal direction (up and down direction based on FIG. 14) of the first main body 111``. It can be formed to a preset length.

도 14를 참조하면, 제1본체부(111``)에서 단차부(111``b)가 돌출 형성되는 제1영역에서는 내주면 둘레를 따라 복수 개의 제1본체리브(111``a)가 미리 설정되는 간격으로 이격 배치될 수 있다.Referring to FIG. 14, in the first area where the step portion 111``b is formed to protrude from the first body part 111``, a plurality of first body ribs 111``a are formed in advance along the inner peripheral surface. They can be spaced apart at set intervals.

도 14를 참조하면, 제1본체부(111``)에서 단차부(111``b)가 돌출 형성되는 제1영역을 제외한 제2영역에서는 제1본체리브(111``a)가 돌출 형성되지 않을 수 있다. Referring to FIG. 14, the first body rib 111``a is protruded in the second area excluding the first area where the step part 111``b is formed to protrude from the first body 111``. It may not work.

도 14를 참조하면, 제2영역에는 플로팅 전극(13``)과 뒤에 설명할 가이드부(112``)가 삽입 배치될 수 있다. 구체적으로 제2영역에는 플로팅 전극(13``)과 가이드부(112``)가 적층 방식으로 배치될 수 있다.Referring to FIG. 14, a floating electrode 13`` and a guide part 112`` to be explained later may be inserted and placed in the second area. Specifically, the floating electrode 13`` and the guide part 112`` may be arranged in a stacked manner in the second area.

이로 인하여 플로팅 전극(13``)이 제1본체부(111``)의 내부에서 위치 고정될 수 있는 효과가 있다.This has the effect of allowing the floating electrode 13`` to be fixed in position within the first body 111``.

도 13 내지 도 16을 참조하면, 가이드부(112``)는 제1본체부(111``)에 삽입 배치되는 것으로, 길이 방향을 따라 양측(도 14 기준 상하측)이 개구될 수 있다. 가이드부(112``)는 복수 개가 구비될 수 있고, 복수 개의 플로팅 전극(13``)과 교번적으로 배치될 수 있다.Referring to Figures 13 to 16, the guide part 112`` is inserted into the first body part 111``, and can be opened on both sides (upper and lower sides in Figure 14) along the length direction. A plurality of guide units 112`` may be provided and may be alternately arranged with a plurality of floating electrodes 13``.

도 14를 참조하면, 가이드부(112``)는 제1본체부(111``)의 내면에 돌출 형성되는 단차부(111``b)의 상측(도 14 기준)에 배치될 수 있다.Referring to FIG. 14, the guide part 112`` may be disposed on the upper side (based on FIG. 14) of the step part 111``b protruding from the inner surface of the first body part 111``.

도 14 내지 도 16을 참조하면, 가이드부(112``)의 내면에는 가이드리브(112``a)가 돌출 형성될 수 있고, 가이드리브(112``a)는 복수 개가 구비될 수 있다.Referring to FIGS. 14 to 16, a guide rib 112``a may be formed to protrude from the inner surface of the guide part 112``, and a plurality of guide ribs 112``a may be provided.

복수 개의 가이드리브(112``a)는 제1본체부(111``)에 형성되는 제1본체리브(111``a)와 연결될 수 있고, 제1본체리브(111``a), 가이드리브(112``a)를 따라 처리용기(10``), 구체적으로 제1본체부(111``)의 내부 공간에서 외부 공간으로의 공기(G)의 유동 경로를 제공할 수 있다.A plurality of guide ribs (112``a) may be connected to the first main body rib (111``a) formed in the first body portion (111``), and the first main body rib (111``a), the guide A flow path for air (G) may be provided along the ribs 112``a from the inner space of the processing vessel 10``, specifically the first main body 111``, to the external space.

도 13 내지 도 15를 참조하면, 제1본체캡(113``)은 제1본체부(111``)를 커버하며, 제1본체부(111``)와 결합되는 것으로, 커버본체(113``a), 커버실링부(113``b)를 포함할 수 있다. Referring to Figures 13 to 15, the first body cap (113``) covers the first body part (111``) and is coupled to the first body part (111``), and the cover body (113``) ``a), and may include a cover sealing portion 113``b.

도 13을 참조하면, 커버본체(113``a)는 복수 개의 통과홀부(113``h)가 형성되는 것으로, 제1본체부(111``)의 내부 공간과 연통될 수 있다. 커버실링부(113``b)는 커버본체(113``a)와 결합되는 것으로, 커버본체(113``a)의 외주면 둘레를 따라 결합될 수 있다.Referring to FIG. 13, the cover body 113``a is formed with a plurality of passage hole parts 113``h, and can communicate with the internal space of the first main body 111``. The cover sealing portion (113``b) is coupled to the cover body (113``a) and may be coupled along the outer peripheral surface of the cover body (113``a).

커버실링부(113``b)는 탄성 변형이 가능한 재질로 형성될 수 있고, 제1본체부(111``)와 뒤에 설명할 캡부(115``) 사이에 배치되며, 제1본체부(111``)의 내부 공간에서, 통과홀부(113``h), 연통홀부(115``h)를 통과하여 외부 공간으로 공기가 배출됨에 있어 제1본체부(111``)와 캡부(115``) 사이의 기밀성, 밀폐성을 향상시킬 수 있다.The cover sealing part 113``b may be formed of an elastically deformable material, and is disposed between the first body part 111`` and the cap part 115``, which will be described later, and the first body part ( In the internal space of 111``), air passes through the through hole part 113``h and the communication hole part 115``h and is discharged to the external space, so that the first body part 111`` and the cap part 115 ``) can improve the airtightness and sealing between

커버실링부(113``b)에는 내주면 둘레를 따라 홈부(도면부호 미설정)가 형성될 수 있고, 커버본체(113``a)에는 외주면 둘레를 따라 상기 홈부에 삽입가능하도록 결합돌기(도면부호 미설정)이 돌출 형성될 수 있다. A groove (reference symbol not set) may be formed along the inner peripheral surface of the cover sealing portion (113``b), and the cover body (113``a) may be provided with a coupling protrusion (see drawing) so that it can be inserted into the groove along the outer peripheral surface. (sign not set) may be formed protrudingly.

이로 인하여 커버실링부(113``b)와 커버본체(113``a) 간의 결합력이 향상될 수 있다. As a result, the coupling force between the cover sealing portion (113``b) and the cover body (113``a) can be improved.

도 13 내지 도 16을 참조하면, 제2본체부(114``)는 내부가 중공인 것으로, 제1본체부(111``)가 삽입 배치가능하다. 제2본체부(114``)는 뒤에 설명할 캡부(115``)와 결합되는 것으로, 캡부(115``)와 제2본체부(114``)로 둘러싸이는 영역에 제1본체부(111``), 제1본체캡(113``)이 배치될 수 있다.Referring to FIGS. 13 to 16, the second body portion 114″ is hollow on the inside, and the first body portion 111″ can be inserted and placed therein. The second body portion (114``) is combined with the cap part (115``), which will be explained later, and the first body part ( 111``), and the first body cap 113`` can be disposed.

도 13 내지 도 15를 참조하면, 제2본체부(114``)의 일단부(도 13 기준 상단부)에는 미리 설정되는 깊이를 가지며 걸침홈부(114``a)가 형성될 수 있고, 걸침홈부(114``a)에는 캡부(115``)에 형성되는 캡돌출부(115``a)가 걸쳐질 수 있다.Referring to FIGS. 13 to 15, a crossing groove 114``a may be formed at one end (upper part based on FIG. 13) of the second main body 114``, and has a preset depth, and the crossing groove 114``a may be formed. A cap protrusion (115``a) formed on the cap part (115``) may span over (114``a).

선택적 실시예로서, 캡돌출부(115``a)는 걸침홈부(114``a)에 끼워맞춤 방식으로 결합될 수 있다. As an optional embodiment, the cap protrusion (115``a) may be coupled to the spanning groove part (114``a) in a fitting manner.

도 16을 참조하면, 제2본체부(114``)의 내면에는 외측 방향으로 이격부(114``b)가 돌출 형성될 수 있고, 이격부(114``b)는 복수 개가 구비되며 제2본체부(114``)의 내면 둘레를 따라 이격 배치될 수 있다.Referring to FIG. 16, a spaced portion 114``b may be formed to protrude in an outward direction on the inner surface of the second main body 114``, and a plurality of spaced parts 114``b may be provided. 2 It may be spaced apart along the inner circumference of the main body (114``).

복수 개의 이격부(114``b)는 제1본체부(111``)의 외주면과 접촉가능한 것으로, 제2본체부(114``)의 내부 공간에서 제1본체부(111``)의 위치를 가이드할 수 있고, 제1본체부(111``)의 외주면과 제2본체부(114``)의 내주면 사이에 이격 공간이 형성되도록 한다.The plurality of spaced portions 114``b are capable of contacting the outer peripheral surface of the first main body 111``, and are located in the inner space of the second main body 114``. The position can be guided, and a separation space is formed between the outer peripheral surface of the first body portion (111``) and the inner peripheral surface of the second main body portion (114``).

제1본체부(111``)의 외주면과 제2본체부(114``)의 내주면 사이에 형성되는 이격 공간에는 제1본체부(111``)의 내부 공간과 달리 외부로의 공기의 유동이 없다. In the separation space formed between the outer circumferential surface of the first body portion 111 `` and the inner circumferential surface of the second main body 114 ``, air flows to the outside, unlike the inner space of the first main body 111 ``. There is no

이로 인하여 피처리물(OB)이 수용되는 제1본체부(111``)의 내부 공간만 압력조정부(30)의 구동에 의해 저압 환경(LPA)이 조성되고, 제1본체부(111``)의 내부 공간에서만 플라즈마 방전 처리가 집중될 수 있는 효과가 있다.As a result, a low pressure environment (LPA) is created by driving the pressure adjusting unit 30 only in the inner space of the first body 111 ``, where the object to be treated (OB) is accommodated, and the first body 111 `` ) has the effect of allowing plasma discharge processing to be concentrated only in the inner space of the device.

도 13 내지 도 15를 참조하면, 본 발명의 제3실시예에 따른 캡부(115``)는 제2본체부(114``)를 커버하는 것으로, 피처리물(OB)이 수용되는 제1본체부(111``)가 제2본체부(114``)의 내부 공간에 수용된 상태에서 제2본체부(114``)와 결합될 수 있다.13 to 15, the cap portion 115`` according to the third embodiment of the present invention covers the second body part 114``, and is the first body in which the object to be treated OB is accommodated. The main body 111 `` can be coupled to the second main body 114 `` while being accommodated in the internal space of the second main body 114 ``.

도 13 내지 도 15를 참조하면, 제2본체부(114``)를 마주보는 캡부(115``)의 일면에는 제2본체부(114``)를 향해 캡돌출부(115``a)가 돌출 형성될 수 있다. 13 to 15, on one side of the cap portion 115`` facing the second main body 114``, a cap protrusion 115``a is formed toward the second main body 114``. A protrusion may be formed.

도 14를 참조하면, 캡돌출부(115``a)는 복수 개가 구비될 수 있고, 캡부(115``)의 중심을 기준으로 둘레를 따라 이격 배치될 수 있다. Referring to FIG. 14, a plurality of cap protrusions 115``a may be provided and may be spaced apart along the circumference of the center of the cap part 115``a.

도 13 내지 도 15를 참조하면, 제2본체부(114``)에는 캡돌출부(115``a)가 걸쳐지도록 미리 설정되는 깊이를 가지며 걸침홈부(114``a)가 홈부의 형상으로 형성될 수 있다.Referring to FIGS. 13 to 15, the second body portion 114`` has a preset depth so that the cap protrusion 115``a extends, and the spanning groove 114``a is formed in the shape of a groove. It can be.

이로 인하여 캡부(115``)가 제2본체부(114``)에 결합된 상태에서 결합이 해제, 분리되는 것을 차단할 수 있다. As a result, it is possible to prevent the cap portion 115 `` from being uncoupled or separated from the second body 114 `` while it is coupled to the second main body 114 ``.

도 13 내지 도 15를 참조하면, 본 발명의 제3실시예에 따른 처리용기(10``)는 캡부(115``)에 연통홀부(115``h)가 관통 형성될 수 있다. Referring to FIGS. 13 to 15, the processing container 10″ according to the third embodiment of the present invention may have a communication hole 115″h formed through the cap portion 115″.

연통홀부(115``h)는 복수 개가 구비될 수 있고, 연통홀부(115``h)가 형성됨으로 인하여 피처리물(OB)이 수용되는 제1본체부(111``)의 내부 공간과 처리용기(10``)의 외부 공간 사이에서 공기와 같은 기체의 유동이 가능한 효과가 있다.There may be a plurality of communication hole parts 115``h, and the communication hole part 115``h is formed to form an internal space of the first body part 111`` where the object to be treated (OB) is accommodated, and This has the effect of allowing the flow of gas such as air between the external spaces of the processing container (10``).

구체적으로 캡부(115``)에 형성되는 연통홀부(115``h)는 처리부(40), 구체적으로 포트부(41)와 마주보며 배치될 수 있고, 피처리물(OB)을 수용하는 제1본체부(111``)의 내부 공간에서 제1본체캡(113``)에 형성되는 통과홀부(113``h), 캡부(115``)에 형성되는 연통홀부(115``h) 및 포트부(41)를 거쳐 압력조정부(30)로 공기와 같은 기체(G)가 유동될 수 있다. Specifically, the communication hole portion 115″h formed in the cap portion 115″ may be disposed facing the processing portion 40, specifically the port portion 41, and may be disposed to accommodate the object to be treated (OB). A passage hole portion (113``h) formed in the first body cap (113``) in the internal space of the first body part (111``), and a communication hole part (115``h) formed in the cap part (115``). And a gas (G) such as air may flow to the pressure adjustment unit 30 through the port unit 41.

도 14, 도 15를 참조하면, 본 발명의 제3실시예에 따른 캡부(115``)의 내면, 구체적으로 제1본체캡(113``)을 마주보는 일면에는 제1본체캡(113``) 측 방향으로 가압부(115``b)가 돌출 형성될 수 있다. Referring to FIGS. 14 and 15, the inner surface of the cap portion 115″ according to the third embodiment of the present invention, specifically, the first body cap 113` on one side facing the first body cap 113″. `) The pressing portion 115``b may be formed to protrude in the lateral direction.

가압부(115``b)는 제1본체캡(113``)의 일면(도 15 기준 상면)을 접촉 가압할 수 있고, 캡부(115``)의 상기 내면 상에 둘레 방향을 따라 연장 형성될 수 있다.The pressing portion 115``b can contact and pressurize one surface (upper surface in FIG. 15) of the first body cap 113``, and extends along the circumferential direction on the inner surface of the cap part 115``. It can be.

가압부(115``b)가 제1본체캡(113``)의 일면을 접촉 가압함으로 인하여, 가압부(115``b)로 둘러싸이는 내측 영역이 가압부(115``b)의 외측 영역과 공간적으로 분리될 수 있으며, 상기 내측 영역의 기밀성, 밀폐성을 향상시킬 수 있는 효과가 있다.As the pressurizing part 115``b contacts and pressurizes one surface of the first body cap 113``, the inner area surrounded by the pressurizing part 115``b is the outer side of the pressurizing part 115``b. It can be spatially separated from the area, and has the effect of improving the airtightness and sealing of the inner area.

도 13 내지 도 16을 참조하면, 플로팅 전극(13``)은 제1본체부(111``)에 연결되는 것으로, 제1본체부(111``)의 외부와 전기적으로 절연될 수 있다. 플로팅 전극(13``)은 금속 재질로 형성될 수 있다. Referring to Figures 13 to 16, the floating electrode 13`` is connected to the first body 111``, and may be electrically insulated from the outside of the first body 111``. The floating electrode 13`` may be formed of a metal material.

플로팅 전극(13``)은 전극부(45)와 달리 전원부(47)로부터 전원을 인가받지 않고, 접지도 하지 않게 제1본체부(111``)에 연결될 수 있고, 플로팅 전극(13``)은 제1본체부(111``)의 변형을 방지할 수 있도록 제1본체부(111``)의 내면을 지지하는 구조로 형성될 수 있다. Unlike the electrode unit 45, the floating electrode 13`` may be connected to the first body unit 111`` without receiving power from the power source 47 or being grounded, and the floating electrode 13`` ) may be formed as a structure that supports the inner surface of the first body portion 111`` to prevent deformation of the first body part 111``.

도 13, 도 14, 도 16을 참조하면, 플로팅 전극(13``)은 피처리물(OB)의 플라즈마 처리 과정에서 제1본체부(111``)의 내외의 압력 차이가 발생하더라도 제1본체부(111``)의 형상 변형을 방지할 수 있도록 제1본체부(111``)의 내면을 지지하는 구조로 형성될 수 있다. Referring to FIGS. 13, 14, and 16, the floating electrode 13 `` maintains the first electrode 13 `` even if a pressure difference occurs inside and outside the first body 111 `` during the plasma treatment of the object OB. It may be formed in a structure that supports the inner surface of the first body portion 111`` to prevent shape deformation of the main body portion 111``.

도 13, 도 16을 참조하면, 플로팅 전극(13``)은 제1본체부(111``)의 내주면을 따라 배치되고, 시작점과 끝점이 연결된 구조로 형성될 수 있다. Referring to FIGS. 13 and 16 , the floating electrode 13 `` may be disposed along the inner peripheral surface of the first body 111 `` and may be formed in a structure where the start point and the end point are connected.

선택적 실시예로서, 플로팅 전극(13``)은 제1본체부(111``)의 내주면 둘레를 따라 폐곡선 형상으로 형성될 수 있다. As an optional embodiment, the floating electrode 13 `` may be formed in a closed curve shape along the inner peripheral surface of the first body 111 ``.

이로 인하여 피처리물(OB)이 수용되는 제1본체부(111``)의 내부 공간에서 외부 공간으로 공기가 배출되며 저압 환경(LPA)이 조성될 때 플로팅 전극(13``)이 미리 설정되는 강성을 확보하며 형상을 유지하고, 제1본체부(111``)의 내부 공간이 수축되는 것을 방지할 수 있는 효과가 있다. As a result, air is discharged from the internal space of the first body 111 ``, where the object to be treated (OB) is accommodated, to the external space, and when a low pressure environment (LPA) is created, the floating electrode 13 `` is set in advance. This has the effect of securing rigidity, maintaining the shape, and preventing the internal space of the first body portion 111`` from shrinking.

도 13, 도 14, 도 16을 참조하면, 플로팅 전극(13``)은 처리용기(10``)의 내부에 전기장을 형성하는 전극부(45), 구체적으로 제1전극(45a), 제2전극(45b) 사이에 배치될 수 있고, 플라즈마 처리 방향(도 13 기준 상하 방향)을 기준으로 제1본체부(111``)의 중앙부에 위치할 수 있다.Referring to FIGS. 13, 14, and 16, the floating electrode 13″ is an electrode portion 45, specifically the first electrode 45a, the first electrode 45a, which forms an electric field inside the processing container 10″. It may be disposed between the two electrodes 45b, and may be located in the center of the first body portion 111″ based on the plasma processing direction (up and down direction based on FIG. 13).

이로 인하여 플로팅 전극(13``)과 전극부(45) 사이에 있는 처리용기(10``), 구체적으로 피처리물(OB)이 수용되는 제1본체부(111``)의 내부 공간에 균일하고, 강한 전기장을 형성할 수 있다.As a result, the processing vessel (10``) between the floating electrode (13``) and the electrode unit (45), specifically, the internal space of the first body part (111``) in which the object to be treated (OB) is accommodated. A uniform and strong electric field can be formed.

즉, 전원부(47)로부터 전원을 인가받은 전극부(45)에 의해 형성되는 전기장을 피처리물(OB)이 수용되는 제1본체부(111``)의 내부 공간에 집중시킬 수 있는 효과가 있다. In other words, there is an effect of concentrating the electric field formed by the electrode unit 45 that receives power from the power supply unit 47 into the internal space of the first body unit 111`` where the object to be treated (OB) is accommodated. there is.

이에 더하여 플로팅 전극(13``)이 피처리물(OB)을 둘러싸며 외측에 배치됨으로 인하여, 피처리물(OB)의 외측 영역에 전기장이 균일하게 형성될 수 있도록 하는 효과가 있다.In addition, since the floating electrode 13`` surrounds the object OB and is disposed on the outside, it has the effect of allowing an electric field to be uniformly formed in the outer area of the object OB.

즉, 플로팅 전극(13``)으로 인해 제1본체부(111``)의 내부 공간 전체에 형성되는 전기장의 세기, 공간적 분포 또는 형상이 변형됨에 따라 전극부(45), 구체적으로 마주보는 제1전극(45a), 제2전극(45b) 사이에 위치하는 피처리물(OB)에 대하여 균일한 플라즈마를 방전시킬 수 있는 효과가 있다.That is, as the intensity, spatial distribution, or shape of the electric field formed throughout the internal space of the first body 111 `` is changed due to the floating electrode 13 ``, the electrode unit 45, specifically the opposing electrode unit 45, is formed. There is an effect of discharging a uniform plasma to the object OB located between the first electrode 45a and the second electrode 45b.

플로팅 전극(13``)은 전기적으로 절연될 수 있다. 이로 인하여 플로팅 전극(13``)은 전원부(47)로부터 전원이 인가되는 것이 차단될 수 있다. The floating electrode 13`` may be electrically insulated. As a result, the floating electrode 13`` may be blocked from receiving power from the power supply unit 47.

도면에 도시하지는 않았지만, 본 발명의 제3실시예에 따른 처리용기(10``)는 필름부를 더 포함할 수 있다. 이와 관련하여는 제1실시예, 제2실시예에 따른 처리용기(10, 10`)의 필름부(15, 15`)와 구성, 효과가 동일하므로 이와 중복되는 범위에서 자세한 설명은 생략한다.Although not shown in the drawings, the processing container 10`` according to the third embodiment of the present invention may further include a film portion. In relation to this, since the composition and effect are the same as those of the film portions 15, 15' of the processing containers 10, 10' according to the first and second embodiments, detailed description will be omitted to the extent of overlap.

도면에 도시하지는 않았지만, 유동제한부는 연통홀부(115``h)를 커버하며 용기본체부, 구체적으로 캡부(115``)에 결합되는 것으로, 용기본체부의 내부 공간과 외부 공간 사이의 유체의 유동을 제한할 수 있다. Although not shown in the drawing, the flow restricting part covers the communication hole part (115``h) and is coupled to the container main part, specifically the cap part (115``), so that the fluid flows between the inner space of the container main part and the outer space. can be limited.

선택적 실시예로서, 유동제한부는 기체의 유동만을 허용할 수 있다. 이로 인하여 공기와 같은 기체(G)외의 유체, 이물질등이 피처리물(OB)이 수용되는 용기본체부, 구체적으로 제1본체부(111``)의 내부에 유입되는 것을 차단할 수 있다. As an alternative embodiment, the flow restrictor may only allow the flow of gas. As a result, it is possible to block fluids other than the gas (G) such as air, foreign substances, etc. from flowing into the container body part where the object to be treated (OB) is accommodated, specifically the first main body part (111``).

선택적 실시예로서, 유동제한부, 구체적으로 캡부(115``)의 외면에 결합될 수 있다. 그러나 이에 한정하는 것은 아니고 연통홀부(115``h)를 커버하며 유체의 유동을 제한하는 기술적 사상 안에서 캡부(115``)의 내면에 결합되는 등 다양한 변형 실시가 가능하다.As an optional embodiment, it may be coupled to the flow restriction portion, specifically the outer surface of the cap portion (115``). However, it is not limited to this, and various modifications are possible, such as being coupled to the inner surface of the cap part (115``) within the technical idea of covering the communication hole part (115``h) and restricting the flow of fluid.

선택적 실시예로서, 유동제한부는 필름 방식으로 형성되며, 용기본체부에 결합될 수 있다. As an optional embodiment, the flow restriction portion may be formed in a film manner and may be coupled to the container body portion.

선택적 실시예로서, 유동제한부는 캡부(115``)와 제1본체(111``) 사이에 배치되는 제1본체캡(113``), 구체적으로 커버본체(113``a)에 형성되는 통과홀부(113``h)를 커버하며 커버본체(113``a)의 외면 또는 내면에 결합될 수 있다.As an optional embodiment, the flow restriction portion is formed on the first body cap (113``) disposed between the cap part (115``) and the first body (111``), specifically the cover body (113``a). It covers the through hole portion (113``h) and can be coupled to the outer or inner surface of the cover body (113``a).

이하, 본 발명의 다른 실시예에 따른 플라즈마 처리 시스템(2)의 구성, 작동원리 및 효과에 관하여 설명한다.Hereinafter, the configuration, operating principle, and effects of the plasma processing system 2 according to another embodiment of the present invention will be described.

도 17 내지 도 19를 참조하면, 본 발명의 다른 실시예에 따른 플라즈마 처리 시스템(2)은, 내부에 피처리물(OB)이 수용되며 플로팅 전극(13)이 구비되는 처리용기(10)를 수납하여 피처리물(OB)의 플라즈마 처리를 위해 사용되는 것으로, 하우징부(20), 압력조정부(30), 처리부(40)를 포함할 수 있다.Referring to FIGS. 17 to 19, the plasma processing system 2 according to another embodiment of the present invention includes a processing vessel 10 in which an object to be treated (OB) is accommodated and a floating electrode 13 is provided. It is used for storing and plasma processing the object to be treated (OB), and may include a housing unit 20, a pressure adjusting unit 30, and a processing unit 40.

본 발명의 다른 실시예에 따른 플라즈마 처리 시스템(2)은 본 발명의 일 실시예에 따른 플라즈마 처리장치(1)와 비교하여, 처리부(40)의 구성에 차이가 있으므로, 이하에서는 차이점에 관하여 자세히 설명하도록 한다.Since the plasma processing system 2 according to another embodiment of the present invention has a difference in the configuration of the processing unit 40 compared to the plasma processing device 1 according to an embodiment of the present invention, the differences will be described in detail below. Let me explain.

도 17 내지 도 19를 참조하면, 본 발명의 다른 실시예에 따른 처리부(40)는 처리용기(10)의 내부에 플라즈마 방전(PD)을 형성하도록 전기장을 형성하는 것으로, 포트부(41), 처리하우징(43), 전극부(45), 전원부(47)를 포함할 수 있다. 17 to 19, the processing unit 40 according to another embodiment of the present invention forms an electric field to form a plasma discharge (PD) inside the processing container 10, and includes a port unit 41, It may include a processing housing 43, an electrode unit 45, and a power supply unit 47.

도 17 내지 도 19를 참조하면, 포트부(41)는 압력조정부(30)와 처리용기(10) 사이에 배치되고, 처리용기(10)의 외측에 배치될 수 있다. 즉, 포트부(41)는 처리용기(10)와 비접촉 방식으로 배치될 수 있다.Referring to FIGS. 17 to 19, the port portion 41 is disposed between the pressure adjustment unit 30 and the processing vessel 10, and may be disposed outside the processing vessel 10. That is, the port portion 41 can be disposed in a non-contact manner with the processing container 10.

도 17을 참조하면, 포트부(41)는 밀폐 공간을 형성하는 처리하우징(43)에 설치될 수 있고, 처리하우징(43)의 내부 공간과 외부 공간을 연통시킬 수 있다. Referring to FIG. 17, the port portion 41 may be installed in the processing housing 43 forming a closed space, and may communicate with the internal space of the processing housing 43 and the external space.

이로 인하여 압력조정부(30)가 구동됨에 따라 처리용기(10)의 내부 공간에 수용되는 공기와 같은 기체(G)가 연통홀부(11h)를 통해 처리하우징(43)의 내부 공간으로 배출되고, 포트부(41)를 통해 압력조정부(30)로 유동됨에 따라 처리용기(10), 처리하우징(43)의 내부 공간이 저압 환경(LPA)으로 형성될 수 있다.As a result, as the pressure adjusting unit 30 is driven, gas (G) such as air accommodated in the internal space of the processing vessel 10 is discharged into the internal space of the processing housing 43 through the communication hole portion 11h, and the port As it flows into the pressure adjusting unit 30 through the unit 41, the internal space of the processing vessel 10 and the processing housing 43 may be formed into a low pressure environment (LPA).

도 17 내지 도 19를 참조하면, 본 발명의 일 실시예에 따른 처리하우징(43)은 하우징부(20)의 내측에 배치되는 것으로, 처리용기(10)를 수용할 수 있다. 처리하우징(43)에는 포트부(41), 전극부(45)가 설치될 수 있다. Referring to FIGS. 17 to 19, the processing housing 43 according to an embodiment of the present invention is disposed inside the housing portion 20 and can accommodate the processing container 10. A port portion 41 and an electrode portion 45 may be installed in the processing housing 43.

본 발명의 일 실시예에 따른 처리부(40)와 달리 본 발명의 다른 실시예에 따른 처리부(40)는 처리하우징(43)의 내부에 처리용기(10)가 배치될 수 있고, 포트부(41)가 처리하우징(43)과 직접 접촉되지 않는 구조를 가질 수 있다. Unlike the processing unit 40 according to one embodiment of the present invention, the processing unit 40 according to another embodiment of the present invention may have a processing container 10 disposed inside the processing housing 43, and a port portion 41. ) may have a structure that does not directly contact the processing housing 43.

이로 인하여 포트부(41)와 처리용기(10)가 직접 접촉하지 않고도, 압력조정부(30)의 구동으로 처리하우징(43) 및 처리용기(10)의 내부 공간에서 포트부(41)를 통해 공기와 같은 기체(G)를 외부로 배출할 수 있고, 처리용기(10)의 내부 공간을 저압 환경(LPA)으로 형성할 수 있다.As a result, without direct contact between the port portion 41 and the processing container 10, air is discharged from the inner space of the processing housing 43 and the processing container 10 through the port portion 41 by driving the pressure adjusting unit 30. The gas G can be discharged to the outside, and the internal space of the processing vessel 10 can be formed into a low pressure environment (LPA).

도 18을 참조하면, 압력조정부(30)의 구동으로 인하여 처리하우징(43), 처리용기(10)의 내부 공간에서 공기(G)가 배출될 수 있다.Referring to FIG. 18, air (G) may be discharged from the internal space of the processing housing 43 and the processing container 10 due to the operation of the pressure adjusting unit 30.

도 19를 참조하면, 전극부(45)가 전원부(47)로부터 전원을 인가받아 전기장을 형성할 수 있고, 처리하우징(43)의 내부 공간에 플라즈마 방전(PD)을 발생시켜 처리용기(10)의 내부 공간에 수용되는 피처리물(OB)의 표면에 플라즈마 처리가 가능하도록 한다.Referring to FIG. 19, the electrode unit 45 receives power from the power supply unit 47 to form an electric field, and generates a plasma discharge (PD) in the internal space of the processing housing 43 to generate a plasma discharge (PD) in the processing container 10. Plasma treatment is possible on the surface of the object to be treated (OB) accommodated in the internal space of .

본 발명의 다른 실시예에 따른 플라즈마 처리 시스템(2)은 처리부(40)가 처리하우징(43)을 포함하며, 포트부(41)와 처리용기(10)가 직접적으로 접촉하지 않는 것을 제외하고는 본 발명의 제1실시예 내지 제3실시예에 따른 처리용기(10, 10`, 10``)가 구비될 수 있고, 본 발명의 일 실시예에 따른 플라즈마 처리장치(1)에서 하우징부(20), 압력조정부(30)의 구성, 작동원리 및 효과가 동일하므로 이와 중복되는 범위에서 자세한 설명은 생략한다.In the plasma processing system 2 according to another embodiment of the present invention, the processing unit 40 includes a processing housing 43, except that the port unit 41 and the processing container 10 do not directly contact each other. Processing containers (10, 10`, 10``) according to the first to third embodiments of the present invention may be provided, and a housing portion ( 20), Since the configuration, operating principle, and effect of the pressure adjustment unit 30 are the same, detailed description will be omitted to the extent of overlap.

이하, 본 발명의 실시예들에 따른 플라즈마 처리방법에 대하여 설명한다. Hereinafter, a plasma processing method according to embodiments of the present invention will be described.

도 20은 본 발명의 실시예들에 따른 플라즈마 처리방법을 도시한 순서도이다. Figure 20 is a flowchart showing a plasma processing method according to embodiments of the present invention.

도 20을 참조하면, 플라즈마 처리방법은 피처리물이 수용되는 처리용기를 하우징부에 삽입하는 단계(S10), 처리부에 처리용기를 밀착시키는 단계(S20), 처리용기의 내부 압력을 조정하는 단계(S30), 처리용기의 내부 공간에 플라즈마를 발생시키는 단계(S40)을 포함할 수 있다. Referring to FIG. 20, the plasma processing method includes inserting a processing container containing an object to be treated into a housing unit (S10), attaching the processing container to the processing unit (S20), and adjusting the internal pressure of the processing container. (S30) and generating plasma in the internal space of the processing vessel (S40).

도 1 내지 도 3, 도 4, 도 13, 도 17을 참조하면, 본 발명의 실시예들에 따른 플라즈마 처리장치(1)는 플로팅 전극(13)이 구비되는 처리용기(10, 10`, 10``)를 수납하여, 처리용기(10, 10`, 10``)의 내부에 수용되는 피처리물(0B)의 플라즈마 처리를 위해 사용되는 것으로, 하우징부(20), 압력조정부(30), 처리부(40)를 포함할 수 있다.Referring to FIGS. 1 to 3, 4, 13, and 17, the plasma processing apparatus 1 according to embodiments of the present invention includes a processing vessel 10, 10', and 10 provided with a floating electrode 13. ``) and is used for plasma treatment of the object to be treated (0B) accommodated inside the processing container (10, 10`, 10``), including a housing portion (20) and a pressure adjusting portion (30). , may include a processing unit 40.

도 1, 도 20을 참조하면, 처리용기를 하우징부(20)에 삽입하는 단계(S10)에서는 피처리물(0B)이 내부에 수용되는 본 발명의 실시예들에 따른 처리용기(10, 10`, 10``)를 하우징부(20)에 배치하여 위치 고정시킬 수 있다.Referring to FIGS. 1 and 20, in the step (S10) of inserting the processing container into the housing portion 20, the processing container 10, 10 according to embodiments of the present invention in which the object to be treated (OB) is accommodated therein. `, 10``) can be placed in the housing portion 20 to fix the position.

처리용기(10, 10`, 10``), 구체적으로 제1본체부(11)의 내부 공간에 피처리물(0B)이 수용되며, 플로팅 전극(13)이 제1본체부(11)와 연결되며, 제1본체부(11)의 내부 공간에 수용되는 피처리물(0B)의 외측에 배치될 수 있다.The object to be treated (0B) is accommodated in the inner space of the processing container (10, 10`, 10``), specifically the first body portion (11), and the floating electrode (13) is connected to the first body portion (11). It is connected and may be disposed outside the object to be treated (0B) accommodated in the internal space of the first main body 11.

플로팅 전극(13)은 본 발명의 제1실시예, 제2실시예에 따른 처리용기(10, 10`)와 같이, 처리용기(10, 10`)의 외주면에 연결될 수 있고, 제3실시예에 따른 처리용기(10``)와 같이, 제1본체부(11)의 내면과 피처리물(0B) 사이에 배치될 수 있다.The floating electrode 13 may be connected to the outer peripheral surface of the processing containers 10, 10', such as the processing containers 10, 10' according to the first and second embodiments of the present invention, and the third embodiment. Like the processing container 10``, it may be disposed between the inner surface of the first main body 11 and the object to be treated 0B.

도 1, 도 17, 도 20을 참조하면, 처리부(40)에 처리용기를 밀착시키는 단계(S20)는, 처리용기(10, 10`, 10``)를 처리부(40)에 접촉시키며, 처리부(40)와 처리용기(10, 10`, 10``) 사이에 형성되는 내부 공간으로만 공기의 유동이 발생하고, 외부 공간과는 기밀성을 유지할 수 있도록 처리부(40)에 처리용기(10, 10`, 10``)를 밀착시킬 수 있다. Referring to FIGS. 1, 17, and 20, the step (S20) of bringing the processing container into close contact with the processing unit 40 involves bringing the processing container (10, 10`, 10``) into contact with the processing unit 40, and The processing containers (10, 10, 10, 10`, 10``) can be brought into close contact.

하우징부(20) 내에 배치되는 처리용기(10, 10`, 10``)는 연통홀부(11h, 11`h, 115``h)가 형성될 수 있고, 연통홀부(11h, 11`h, 115``h)를 통해 처리용기(10, 10`, 10``)의 내부 공간과 외부 공간 사이에 유체, 구체적으로 공기와 같은 기체(G)의 유동이 가능하도록 한다.The processing containers (10, 10`, 10``) disposed in the housing part 20 may be formed with communication hole parts (11h, 11`h, 115``h), and communication hole parts (11h, 11`h, 115``h) allows the flow of a fluid, specifically a gas (G) such as air, between the internal space and the external space of the processing vessel (10, 10`, 10``).

도 1을 참조하면, 처리용기(10)는 포트부(41)와 접촉가능하며, 포트부(41), 구체적으로 포트실링부(413)로 인하여 처리용기(10)와 포트본체(411)가 밀착될 수 있다. Referring to FIG. 1, the processing container 10 is in contact with the port portion 41, and the processing container 10 and the port main body 411 are connected due to the port portion 41, specifically the port sealing portion 413. It can be closely adhered.

도 2, 도 20을 참조하면, 처리용기의 내부 압력을 조정하는 단계(S30)에서는 처리용기(10)가 포트부(41)와 밀착이 된 후 압력조정부(30)가 외부로부터 전원을 공급받아 구동될 수 있다. Referring to FIGS. 2 and 20, in the step (S30) of adjusting the internal pressure of the processing vessel, the processing vessel 10 is brought into close contact with the port portion 41, and then the pressure adjusting unit 30 receives power from the outside. It can be driven.

압력조정부(30)는 처리용기(10)와 직접적 또는 간접적으로 연결되며, 처리용기(10)의 내부 압력을 조정할 수 있다. The pressure adjusting unit 30 is directly or indirectly connected to the processing vessel 10 and can adjust the internal pressure of the processing vessel 10.

압력조정부(30)가 구동됨에 따라 처리용기(10), 구체적으로 제1본체부(11)의 내부 공간에서 연통홀부(11h)를 통해 제1본체부(11)의 외부 공간으로 기체(G)가 배출될 수 있다. 배출된 기체(G)는 연통홀부(11h)를 통과하여 포트부(41)를 통해 압력조정부(30)로 유동될 수 있다.As the pressure adjusting unit 30 is driven, gas G flows from the internal space of the processing container 10, specifically the first main body 11, to the external space of the first main body 11 through the communication hole 11h. may be emitted. The discharged gas (G) may pass through the communication hole portion (11h) and flow to the pressure adjusting portion (30) through the port portion (41).

처리용기(10)의 내부 공간에서 외부 공간으로 공기와 같은 기체(G)가 배출됨에 따라 피처리물(0B)이 수용되는 내부 공간에 저압 환경(LPA)이 조성될 수 있다. As a gas (G) such as air is discharged from the internal space of the processing container 10 to the external space, a low pressure environment (LPA) may be created in the internal space where the object to be treated (0B) is accommodated.

도 3, 도 20을 참조하면, 처리용기의 내부 공간에 플라즈마를 발생시키는 단계(S40)에서는, 전원부(47)에서 전극부(45)로 전원을 인가하고, 처리용기(10)의 양측(도 3 기준 상하측)에 배치되는 전극부(45), 구체적으로 제1전극(45a), 제2전극(45b) 사이에 전기장이 형성되고, 플라즈마 방전(PD)을 발생시킬 수 있다. Referring to FIGS. 3 and 20, in the step (S40) of generating plasma in the internal space of the processing vessel, power is applied from the power source unit 47 to the electrode unit 45, and both sides of the processing vessel 10 (FIG. An electric field is formed between the electrode portions 45 (3 reference upper and lower sides), specifically the first electrode 45a and the second electrode 45b, and plasma discharge (PD) can be generated.

도 1 내지 도 3을 참조하면, 제1전극(45a), 제2전극(45b) 사이에 플로팅 전극(13)이 전원부(47)로부터 전원을 인가받지 않고, 제1전극(45a), 제2전극(45b)과 이격 배치됨으로 인하여 플로팅 전극(13)과 제1전극(45a) 사이, 플로팅 전극(13)과 제2전극(45b) 사이에 형성되는 전기장의 세기 또는 형상을 변형시킬 수 있다.1 to 3, the floating electrode 13 between the first electrode 45a and the second electrode 45b does not receive power from the power supply unit 47, and the first electrode 45a and the second electrode 45b do not receive power from the power supply unit 47. Due to being spaced apart from the electrode 45b, the intensity or shape of the electric field formed between the floating electrode 13 and the first electrode 45a and between the floating electrode 13 and the second electrode 45b can be changed.

즉, 플로팅 전극(13)과 제1전극(45a), 제2전극(45b) 사이에 전기장이 집중될 수 있도록 하여 전기장의 세기를 증가시킬 있다.That is, the intensity of the electric field can be increased by allowing the electric field to be concentrated between the floating electrode 13 and the first electrode 45a and the second electrode 45b.

이로 인하여 플로팅 전극(13)의 내측에 위치하는 피처리물(0B)의 표면을 플라즈마 처리함에 있어, 피처리물(0B)이 수용되는 제1본체부(11)의 내부 공간에서 전기장이 집중되며 플라즈마 방전(PD)이 발생하고, 플라즈마 처리 효율성을 향상시킬 있는 효과가 있다.As a result, when plasma treating the surface of the object 0B located inside the floating electrode 13, the electric field is concentrated in the inner space of the first body 11 where the object 0B is accommodated. Plasma discharge (PD) is generated and has the effect of improving plasma processing efficiency.

도 17 내지 도 19를 참조하면, 본 발명의 다른 실시예에 따른 플라즈마 처리장치(2)는 본 발명의 일 실시예에 따른 플라즈마 처리장치(1)와 처리하우징(43)의 구성에 차이가 있으므로, 상술한 플라즈마 처리방법이 적용될 수 있음은 물론이다.Referring to FIGS. 17 to 19, the plasma processing device 2 according to another embodiment of the present invention has a different configuration from the plasma processing device 1 according to one embodiment of the present invention and the processing housing 43. Of course, the above-described plasma processing method can be applied.

이상, 본 발명을 바람직한 실시 예를 들어 상세하게 설명하였으나, 본 발명은 상기 실시 예에 한정되지 않고, 본 발명의 기술적 사상 및 범위 내에서 당 분야에서 통상의 지식을 가진 자에 의하여 여러가지 변형 및 변경이 가능하다.Above, the present invention has been described in detail with preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications and changes can be made by those skilled in the art within the technical spirit and scope of the present invention. This is possible.

본 발명의 일 실시예에 의하면, 플라즈마 처리용기, 처리장치 및 방법을 제공한다. 또한, 피처리물을 수용하고, 플라즈마를 이용하여 피처리물을 살균 또는 피처리물의 표면을 처리하는 기술 등에 본 발명의 실시예들을 적용할 수 있다.According to one embodiment of the present invention, a plasma processing vessel, a processing device, and a method are provided. Additionally, embodiments of the present invention can be applied to techniques for accommodating an object to be treated, sterilizing the object to be treated using plasma, or treating the surface of the object to be treated, etc.

관련 국가연구개발사업Related national research and development projects

- 과제고유번호: 1415183008- Assignment identification number: 1415183008

- 과제번호: P0018200- Assignment number: P0018200

- 부처명: 산업통상자원부- Ministry name: Ministry of Trade, Industry and Energy

- 과제관리(전문)기관명: 한국산업기술진흥원- Project management (professional) organization name: Korea Institute for Advancement of Technology

- 연구사업명: 스케일업 기술사업화 프로그램(R&D)- Research project name: Scale-up technology commercialization program (R&D)

- 연구과제명: 의료용 임플란트의 플라즈마 멸균 및 표면 재생 활성화 기술- Research project title: Plasma sterilization and surface regeneration activation technology for medical implants

- 기여율: 1/1- Contribution rate: 1/1

- 과제수행기관명: 주식회사 플라즈맵- Name of project carrying out organization: Plasmap Co., Ltd.

- 연구기간: 2023.01.01 - 2023.12.31- Research period: 2023.01.01 - 2023.12.31

- 과제고유번호: 1425171650- Assignment identification number: 1425171650

- 과제번호: S3301671- Assignment number: S3301671

- 부처명: 중소벤처기업부- Ministry name: Ministry of SMEs and Startups

- 과제관리(전문)기관명: 중소기업기술정보진흥원- Project management (professional) organization name: Small and Medium Business Technology Information Promotion Agency

- 연구사업명: 구매조건부신제품개발사업(구매연계형)- Research project name: Purchase conditional new product development project (purchase linked type)

- 연구과제명: 플라즈마를 이용한 인체 피부조직의 재생활성 장치 개발- Research project name: Development of a device that activates the regeneration of human skin tissue using plasma

- 기여율: 1/1- Contribution rate: 1/1

- 과제수행기관명: 주식회사 플라즈맵- Name of project carrying out organization: Plasmap Co., Ltd.

- 연구기간: 2023.01.01 - 2023.12.31- Research period: 2023.01.01 - 2023.12.31

- 과제고유번호: 1425179511- Assignment identification number: 1425179511

- 과제번호: 00275019- Assignment number: 00275019

- 부처명: 중소벤처기업부- Ministry name: Ministry of SMEs and Startups

- 과제관리(전문)기관명: 중소기업기술정보진흥원- Project management (professional) organization name: Small and Medium Business Technology Information Promotion Agency

- 연구사업명: 중소기업기술혁신개발사업(수출지향형)- Research project name: Small and medium-sized enterprise technology innovation development project (export-oriented)

- 연구과제명: 플라즈마를 이용한 의료용 3차원 프린팅 제조 공정 의료기기 개발- Research project name: Medical 3D printing manufacturing process using plasma, development of medical devices

- 기여율: 1/1- Contribution rate: 1/1

- 과제수행기관명: 주식회사 플라즈맵- Name of project carrying out organization: Plasmap Co., Ltd.

- 연구기간: 2023.07.17 - 2023.12.31- Research period: 2023.07.17 - 2023.12.31

Claims (19)

내부에 수용되는 피처리물의 플라즈마 처리를 위해 사용되는 플라즈마 처리용기에 있어서,In a plasma treatment vessel used for plasma treatment of the object to be treated contained therein, 상기 피처리물을 수용가능한 제1본체부; 및 a first body portion capable of accommodating the object to be treated; and 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고,It includes a floating electrode connected to the first body part, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리용기.The floating electrode is electrically insulated from the outside of the first main body. 제1항에 있어서, According to paragraph 1, 상기 플로팅 전극을 커버하는 필름부;를 더 포함하는 것을 특징으로 하는 플라즈마 처리용기.A plasma processing vessel further comprising a film portion covering the floating electrode. 제2항에 있어서, According to paragraph 2, 상기 필름부의 두께는 상기 제1본체부의 두께와 같거나 상대적으로 얇은 것을 특징으로 하는 플라즈마 처리용기.A plasma processing vessel, characterized in that the thickness of the film portion is the same as or relatively thinner than the thickness of the first body portion. 제1항에 있어서, According to paragraph 1, 상기 플로팅 전극은 상기 제1본체부의 변형을 방지할 수 있도록 상기 제1본체부의 내면을 지지하는 구조로 형성되는 것을 특징으로 하는 플라즈마 처리용기.The floating electrode is a plasma processing vessel characterized in that it is formed in a structure that supports the inner surface of the first main body to prevent deformation of the first main body. 제4항에 있어서, According to paragraph 4, 상기 플로팅 전극은, 상기 피처리물의 플라즈마 처리 과정에서 상기 제1본체부의 내외의 압력 차이가 발생하더라도 상기 제1본체부의 형상 변형을 방지할 수 있도록 상기 제1본체부의 내면을 지지하는 구조로 형성되는 것을 특징으로 하는 플라즈마 처리용기.The floating electrode is formed in a structure that supports the inner surface of the first body to prevent shape deformation of the first body even if a pressure difference occurs inside and outside the first body during the plasma treatment of the object to be treated. A plasma processing vessel characterized in that. 제1항에 있어서, According to paragraph 1, 상기 플로팅 전극은 상기 제1본체부의 내주면을 따라 배치되고, 시작점과 끝점이 연결된 구조인 것을 특징으로 하는 플라즈마 처리용기.The floating electrode is disposed along the inner peripheral surface of the first main body and has a structure in which a start point and an end point are connected. 제6항에 있어서, According to clause 6, 상기 플로팅 전극은 상기 제1본체부의 내주면 둘레를 따라 폐곡선 형상으로 형성되는 것을 특징으로 하는 플라즈마 처리용기.The floating electrode is a plasma processing vessel characterized in that it is formed in a closed curve shape along the inner peripheral surface of the first main body. 제1항에 있어서, According to paragraph 1, 상기 플로팅 전극은 플라즈마 처리 방향을 기준으로 상기 제1본체부의 중앙부에 위치하는 것을 특징으로 하는 플라즈마 처리용기.The floating electrode is a plasma processing vessel, characterized in that located in the center of the first main body based on the plasma processing direction. 제8항에 있어서, According to clause 8, 상기 플로팅 전극은 복수 개가 구비되고, 복수 개의 상기 플로팅 전극은 미리 설정되는 간격으로 이격 배치되는 것을 특징으로 하는 플라즈마 처리용기.A plasma processing vessel characterized in that the plurality of floating electrodes are provided, and the plurality of floating electrodes are spaced apart from each other at a preset interval. 제1항에 있어서, According to paragraph 1, 상기 플로팅 전극은 전도성 재질로 형성되는 것을 특징으로 하는 플라즈마 처리용기.A plasma processing vessel, characterized in that the floating electrode is formed of a conductive material. 제1항에 있어서, According to paragraph 1, 내부가 중공이며, 상기 제1본체부가 삽입 배치가능한 제2본체부; 및a second body portion that is hollow on the inside and into which the first body portion can be inserted and placed; and 상기 제2본체부를 커버하며, 상기 제1본체부의 내부 공간과 연통되는 연통홀부가 형성되는 캡부;를 더 포함하는 것을 특징으로 하는 플라즈마 처리용기.A cap portion that covers the second body portion and has a communication hole communicating with the internal space of the first body portion. 제11항에 있어서, According to clause 11, 상기 캡부에 형성되는 상기 연통홀부를 커버하며, 상기 제1본체부의 내부 공간과 외부 공간 사이의 유체의 유동을 제한하는 유동제한부;를 더 포함하는 것을 특징으로 하는 플라즈마 처리용기.A plasma processing container further comprising a flow limiting portion that covers the communication hole formed in the cap portion and restricts the flow of fluid between the inner space and the outer space of the first body portion. 제12항에 있어서, According to clause 12, 상기 유동제한부는 기체의 유동만을 허용하는 것을 특징으로 하는 플라즈마 처리용기. A plasma processing vessel, characterized in that the flow restrictor allows only the flow of gas. 제12항에 있어서, According to clause 12, 상기 유동제한부는 상기 캡부와 상기 제1본체부의 사이에 배치되는 것을 특징으로 하는 플라즈마 처리용기.A plasma processing vessel, characterized in that the flow limiting part is disposed between the cap part and the first body part. 제12항에 있어서, According to clause 12, 상기 유동제한부는 필름 방식으로 형성되며, 상기 제1본체부에 결합되는 것을 특징으로 하는 플라즈마 처리용기.A plasma processing vessel, characterized in that the flow restriction portion is formed in a film manner and is coupled to the first body portion. 피처리물이 수용되는 플라즈마 처리용기;A plasma treatment vessel in which the object to be treated is accommodated; 상기 플라즈마 처리용기가 배치가능한 하우징부;a housing portion in which the plasma processing vessel can be placed; 상기 하우징부에 설치되고, 상기 플라즈마 처리용기와 유체의 유동이 가능하게 연결되며, 상기 플라즈마 처리용기의 내부 공간의 압력을 조정하는 압력조정부; 및a pressure adjusting unit installed in the housing, connected to the plasma processing vessel to enable fluid flow, and adjusting the pressure of the internal space of the plasma processing vessel; and 외부로부터 전원을 공급받아 상기 플라즈마 처리용기의 내부 공간에 플라즈마 방전이 발생하도록 전기장을 형성하는 처리부;를 포함하고,It includes a processing unit that receives power from the outside and forms an electric field to generate a plasma discharge in the internal space of the plasma processing vessel, 상기 플라즈마 처리용기는, The plasma processing vessel, 상기 피처리물을 수용가능한 제1본체부; 및 a first body portion capable of accommodating the object to be treated; and 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고,It includes a floating electrode connected to the first body part, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리장치. The floating electrode is electrically insulated from the outside of the first main body. 제16항에 있어서, According to clause 16, 상기 처리부는,The processing unit, 상기 압력조정부와 상기 처리용기 사이에 배치되고, 상기 처리용기와 접촉이 가능한 포트부; 및 a port portion disposed between the pressure adjustment unit and the processing container and capable of contacting the processing container; and 상기 처리용기의 외측에 배치되며, 전원을 인가받아 전기장을 형성하는 전극부;를 포함하는 것을 특징으로 하는 플라즈마 처리 시스템.A plasma processing system comprising: an electrode portion disposed outside the processing vessel and receiving power to form an electric field. 제17항에 있어서, According to clause 17, 상기 전극부는 복수 개가 구비되고, 상기 플라즈마 처리용기의 양측에 각각 배치되는 것을 특징으로 하는 플라즈마 처리장치.A plasma processing device, wherein a plurality of electrode units are provided, each disposed on both sides of the plasma processing vessel. 피처리물의 표면을 처리하는 플라즈마 처리 방법에 있어서,In a plasma treatment method for treating the surface of an object to be treated, 상기 피처리물이 수용되는 처리용기를 하우징부에 삽입하는 단계;Inserting a processing container containing the object to be treated into a housing portion; 상기 하우징부에 설치되는 처리부에 상기 처리용기를 밀착시키는 단계;attaching the processing container to a processing unit installed in the housing unit; 상기 처리용기의 내부 공간의 압력을 조정하는 단계;adjusting the pressure of the internal space of the processing vessel; 외부로부터 전원을 공급받아 상기 처리용기의 내부 공간에 플라즈마를 발생시키는 단계;를 포함하는 것을 특징으로 하고,Characterized by comprising: receiving power from the outside and generating plasma in the internal space of the processing vessel, 상기 처리용기는, 상기 피처리물을 수용가능한 제1본체부와; 상기 제1본체부에 연결되는 플로팅 전극;을 포함하고,The processing container includes a first body portion capable of receiving the object to be treated; It includes a floating electrode connected to the first body part, 상기 플로팅 전극은 상기 제1본체부의 외부와 전기적으로 절연되는 것을 특징으로 하는 플라즈마 처리방법.A plasma processing method, wherein the floating electrode is electrically insulated from the outside of the first main body.
PCT/KR2023/016811 2023-01-26 2023-10-27 Plasma treatment container, and treatment apparatus and method Ceased WO2024158104A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020230010252A KR20240117876A (en) 2023-01-26 2023-01-26 Plasma processing container, processing apparatus and method
KR10-2023-0010252 2023-01-26

Publications (1)

Publication Number Publication Date
WO2024158104A1 true WO2024158104A1 (en) 2024-08-02

Family

ID=91970838

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2023/016811 Ceased WO2024158104A1 (en) 2023-01-26 2023-10-27 Plasma treatment container, and treatment apparatus and method

Country Status (2)

Country Link
KR (1) KR20240117876A (en)
WO (1) WO2024158104A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002538896A (en) * 1999-03-16 2002-11-19 アブシス Sterilization process and device by plasma
JP2008515616A (en) * 2004-10-12 2008-05-15 ヨット・エー・プラズマコンサルト・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Device for processing articles by electric discharge
KR20090084445A (en) * 2008-02-01 2009-08-05 (주)유이온 Atmospheric Plasma Contact Lens Processor with Surface Modification and Sterilization
JP2018519873A (en) * 2015-05-11 2018-07-26 ノバ プラズマ リミテッド Apparatus and method for manipulating an implant
KR20210148801A (en) * 2020-06-01 2021-12-08 주식회사 플라즈맵 Storage for Plasma processing, Apparatus for the same And Method using the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002538896A (en) * 1999-03-16 2002-11-19 アブシス Sterilization process and device by plasma
JP2008515616A (en) * 2004-10-12 2008-05-15 ヨット・エー・プラズマコンサルト・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング Device for processing articles by electric discharge
KR20090084445A (en) * 2008-02-01 2009-08-05 (주)유이온 Atmospheric Plasma Contact Lens Processor with Surface Modification and Sterilization
JP2018519873A (en) * 2015-05-11 2018-07-26 ノバ プラズマ リミテッド Apparatus and method for manipulating an implant
KR20210148801A (en) * 2020-06-01 2021-12-08 주식회사 플라즈맵 Storage for Plasma processing, Apparatus for the same And Method using the same

Also Published As

Publication number Publication date
KR20240117876A (en) 2024-08-02

Similar Documents

Publication Publication Date Title
WO2018110856A1 (en) Rotation device
WO2016018016A1 (en) Display assembly and display apparatus using the same background
WO2010137921A2 (en) Led driver
WO2018026025A1 (en) Plasma treatment device
WO2021177582A1 (en) High intensity focused ultrasonic device for generating ultrasonic waves by sensing skin contact
WO2021177577A1 (en) Cartridge equipped with sealing member, and high intensity focused ultrasonic device with cartridge coupled thereto
WO2020013529A1 (en) Sterilization module, and sterilization apparatus and ultraviolet irradiation device comprising same
WO2021177527A1 (en) Implant storage container
WO2011142632A2 (en) Laser irradiator
WO2024158104A1 (en) Plasma treatment container, and treatment apparatus and method
WO2023121428A1 (en) Packaging container, plasma processing apparatus and processing method
WO2021177576A1 (en) High intensity focused ultrasonic device having plurality of ultrasonic generation modes
WO2021246727A1 (en) Plasma treatment apparatus and method using same
WO2022181986A1 (en) Arc chute and load switch comprising same
WO2020159022A1 (en) Endoscope coupling device
WO2024210330A1 (en) Implant plasma treatment apparatus
WO2022181985A1 (en) Load break switch
WO2021242009A1 (en) Automatic mattress sterilization device
WO2024063256A1 (en) Food waste disposer
WO2021177580A1 (en) Cartridge coupled to high intensity focused ultrasonic device and having built-in driving device, and high intensity focused ultrasonic device coupled to cartridge
WO2024043561A1 (en) Ultrasonic handpiece
WO2020153587A1 (en) Sterilization system comprising independent type pump module and sterilization method thereof
WO2025005403A1 (en) Far ultraviolet ray-emitting device
WO2025095180A1 (en) Smart glasses device
WO2018194236A1 (en) Environment purifying device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 23918739

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE