WO2024149848A1 - Modular system for optical assembly and connection technology - Google Patents

Abstract

The invention relates to a micro-optomechanical system (10) and to a method for the production thereof. The micro-optomechanical system (10) comprises: at least two carrier elements (40, 50), wherein each of the carrier elements (40, 50) has at least one connection element (20, 30), wherein each connection element (20, 30) is provided with at least one self-cetring joining element (300, 310, 320, 330) or is in the form of a self-centring joining element (300, 310, 320, 330), wherein the joining elements (300, 310, 320, 330) correspond with one another in such a way that the carrier elements (40, 50) are mechanically connected to one another by the joining elements (300, 310, 320, 330); and at least two optical components (60, 70), wherein each of the optical components (60, 70) is secured to one of the carrier elements (40, 50), wherein each of the optical components (60, 70) has at least one optical coupling point (80, 90), wherein at least one of the optical coupling points (80, 90) has a beam-shaping element (100, 110) created by a three-dimensional structuring method, and wherein there is an optical connection of the optical components (60, 70) at at least one optical coupling point (80, 90). In the micro-optomechanical system (10), micro-optical components can be precisely positioned and/or adjusted with a high degree of design freedom within acceptable tolerances in the submicrometre range, in order to thereby provide individual functionality.

Description

Modular system for optical assembly and connection technology

Field of the invention

The present invention is located in the field of photonics and micro-optics and relates to a micro-optomechanical system and a method for its production. The micro-optomechanical system preferably serves as a modular system for optical assembly and connection technology.

State of the art

Opto-mechanical systems and methods for their manufacture are known from the state of the art. In the macroscopic size range, optical benches or optical tables are widely used in a wide variety of areas and offer a wide range of functionality due to a large number of optical components that can be used in different ways and easy adjustability.

However, this does not mean that simple and immediate scaling to the microscopic size range is possible. Due to their small dimensions, micro-optomechanical systems are usually only developed and manufactured for a single specific application. Readjustment is usually only possible with great effort. In the microscopic size range, there is currently no solution with which micro-optomechanical systems can be manufactured without lengthy development effort, comparable to the construction of an optical system on an optical table. The handling of the microscopic components plays a major role here, particularly since the functionality of micro-optomechanical systems is based on small tolerances and thus components on a microscopic scale are not easy to position or adjust within acceptable tolerances in the sub-micrometer range, so that converting an existing micro-optomechanical system for another use is generally not possible. Wallrabe, U.; Mohr, J. Modular Microoptical Systems for Sensors and Telecommunication. Sensors Update, 2003, 12th vol., No. 1, pp. 143-174 describe a coupling of microoptical fibers and a structure of components such as receivers or spectrometers.

Gerlach, A.; Ziegler, P.; Mohr, J. Assembly of hybrid integrated micro-optical modules using passive alignment with LIGA mounting elements and adhesive bonding techniques. Microsystem technologies, 2001, 7th vol., no. 1, pp. 27-31 describe an associated component as an example of a system designed for a single application, which cannot be easily converted or adapted to other requirements.

S. Schüle, U. Hollenbach, J. Mohr, J. Li, P. Vorreau, Modular integration of microactuators and micro-optical benches. In: Micro-Optics 2008. SPIE, 2008. P. 11-22 describe the construction of an interferometer using the LIGA process, for which various optical components are combined to form a system.

Kanty Rabenorosoa, Cedric Clevy, Sylwester Bargiel, Jean-Philippe Mascaro, Philippe Lutz, Christophe Gorecki, Modular and reconfigurable 3d micro-optical benches: concept, validation, and characterization. In: International Manufacturing Science and Engineering Conference. 2011. pp. 479-485 and S. Bargiel, K. Rabenorosoa, C. Clevy, C. Gorecki, P. Lutz, Towards micro-assembly of hybrid MOEMS components on a reconfigurable silicon free-space micro-optical bench. Journal of Micromechanics and Microengineering, 2010, 20, vol., no. 4, p. 045012 describe a holding system for adjustable micro-optical components with a mechanical guide that enables alignment along the optical axes.

Tobias N. Ackermann, Jordi Vila-Planas, Xavier Munoz-Berbel, Erica Alvarez-Conde, Daniel Kopp, Hans Zappe, Andreu Llobera, A toolbox for fast and simple assembly of a photonic lab on a chip. In: CLEO: Science and Innovations. Optica Publishing Group, 2016. S. SWIG. 3 describe how a microfluidic system can be modularly constructed and optically investigated.

Pentti Karioja, Kimmo Keränen, Mikko Karppinen, Kari Kautio, Veli Heikkinen, Markku Lahti, Jyrki Ollila, JukkaTapani, Mäkinen, Kari Kataja, Jarkko Tuominen, Tuomo Jaakola, Sang Hyun Park, Pentti Korhonen, Teemu Alajoki, Antti Tanskanen, Jaakko Lenkkeri, Juhani Heilala, LTCC toolbox for photonics integration. In: IMAPS/ACerS IntT Conf, and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT. 2006. Pages 25-27 describe a structure of a micro-optomechanical system made of different layers of coated glass-ceramic plates in which micro-optical components are integrated.

Norbert Keil, Crispin Zawadzki, Ziyang Zhang, Jin Wang, Nelson Mettbach, Norbert Grote, Martin Schell, Polymer PLC as an optical integration bench. In: Optical Fiber Communication Conference. Optica Publishing Group, 2011. P. 0WM1 describe a process for producing a micro-optomechanical system for beam splitting using thin-film elements and trenches for holding optical fibers. This process is expanded using thin-film technology by Moritz Kleinert, David de Felipe, Crispin Zawadzki, Walter Brinker, Jung Han Choi, Photonic integrated devices and functions on hybrid polymer platform. In: Physics and Simulation of Optoelectronic Devices XXV. SPIE, 2017. P. 220-230.

Yasuhiko Aoki, Toshio Kato, Rogerio Jun Mizuno, Kenichi Iga, Micro-optical bench for alignment-free optical coupling. Applied optics, 1999, 38th vol., no. 6, pp. 963-965 describe the possibility of coupling micro-optical components or systems.

Ulrich K. Gengenbach, Automatic assembly of micro-optical components. In: Microrobotics: Components and Applications. SPIE, 1996. Pp. 141-150 describes problems in the automatic centering of micro-optical components.

Carmelo Scarcella, Kamil Gradkowski , Lee Carroll, Jun-Su Lee, Matthieu Duperron, Daivid Fowler, Peter O’Brien, Pluggable single-mode fiber-array-to-PIC coupling using microlenses. IEEE Photonics Technology Letters, 2017, 29th vol., no. 22, pp. 1943-1946, the positioning accuracy of Lego bricks is used to optically couple two components.

DE 321 93 99 C2 discloses optical components which are aligned along an optical axis by means of rods. A rod system serves as a holder and guide, which cannot be used in the micrometer range in the form described.

DE 198 20 524 A1 discloses micro-optical components which are placed on a circuit board with a hole pattern using pins. For this purpose, individual micro-optical components are manufactured separately from the holder and attached to a plate with a hole pattern. Due to the hole pattern grid, positioning and adjustment are limited. In addition, the micro-optical components must be placed on the carrier plate by hand. US 2003/0231835 A1 discloses a possibility for fastening and aligning micro-optical components along an optical axis on a micro-optical bench. The basis is an elongated mounting base for holding the micro-optical components. In this case, curved outer surfaces of the mounting base are designed in such a way that they have the same outer contour as the optical components as a negative, so that the micro-optical components can be positioned by pairing on the mounting base.

DE 10 2005 050 274 A1 discloses a device for coupling beam guides of optical systems for unidirectional or bidirectional transmission of beams via a beam transition between the optical systems with a connecting device and mechanical centering means. A magnetic coupling is provided on the connecting device in a coupling area to effect a coupling connection. The centering means are designed and arranged on the opposite optical systems to be coupled in such a way that they cause self-centering of the beam guides when attracted by the magnetic forces.

WO 2013/010634 A1 discloses an optoelectronic module in which optoelectronic components, in particular chips, are applied to a two-dimensional carrier. Such chip-on-board modules correspond to electrical assemblies which comprise at least one carrier and at least one unhoused semiconductor component mounted on the carrier. For optical coupling, it is described here how lenses for coupling in and out light can be manufactured and attached there.

DE 10 2016 221 464 Al discloses a system with optical components and their positioning and fixation on a common base plate.

Object of the invention

Based on this, the object of the present invention is to provide a micro-optomechanical system and a method for its production, which at least partially overcome the listed disadvantages and limitations of the prior art.

In particular, the object of the present invention is to provide a method for producing a micro-optomechanical system with which micro-optical components can be produced with a high degree of design freedom within acceptable Tolerances in the submicrometer range can be positioned and/or adjusted as precisely as possible in order to provide a micro-optomechanical system with the most individual functionality possible. It would be desirable if individual components of the micro-optomechanical system could be reproduced using a three-dimensional structuring process, preferably in parallel in large quantities.

Disclosure of the invention

This object is achieved by a micro-optomechanical system and a method for its production with the features of the independent patent claims. Advantageous further developments, which can be implemented individually or in any combination, are presented in the dependent claims and in the following description.

In a first aspect, the present invention relates to a micro-optomechanical system comprising:

- at least two carrier elements, each of the carrier elements having at least one connecting element, each connecting element having at least one self-centering joining element or being designed as a self-centering joining element, the joining elements fitting together in such a way that the carrier elements are mechanically connected to one another by means of the joining elements; and

- at least two optical components, wherein each of the optical components is fastened to one of the carrier elements, wherein each of the optical components has at least one optical coupling point, wherein at least one of the optical coupling points comprises at least one beam-shaping element produced by means of a three-dimensional structuring process, and wherein an optical connection of the optical components is present at at least one optical coupling point.

According to the invention, at least two individual modules are connected to one another and thus form the present micro-optomechanical system as a group, which can be expanded as desired by connecting at least one further module. The term "module" refers to a smallest device that can no longer be broken down into a smaller device without losing the intended functionality with regard to a connection, in particular an attachment or stringing together, of at least two individual modules. Each module comprises a carrier element that has at least one connecting element. For this purpose, the carrier element can have exactly one connecting element or preferably two, four or even more connecting elements. The term "connecting element" refers to a micro-mechanical Element designed to establish a mechanical connection to another support element which is also equipped with a connecting element.

The term “joining element” refers to a micro-mechanical element included in the connecting element that enables the formation of the mechanical connection to the further module, thereby determining the location and relative position of the interconnected modules to one another. The joining elements are designed in such a way that they fit together in such a way that the carrier elements can be mechanically connected to one another by means of the joining elements. In a particularly preferred embodiment, the joining elements can be mechanically connected to one another in a form-fitting manner by means of a form-fitting connection achieved thereby. In particular, the connecting element can be designed for a planar arrangement and/or stacking of self-centering joining elements that fit together and are preferably identical to one another; however, another type of formation of the mechanical connection between two modules is conceivable. For this purpose, a joining element of the same type or a different type of joining element can be used. In particular, the joining elements can be designed to fit together in such a way that they can structurally interlock, in particular as identical pairs and/or as a plug and coupling.

According to the invention, the joining elements are designed as self-centering joining elements. The term "self-centering" refers to a geometric property of the joining element which is aimed at forming the mechanical connection from one module to another module along a provided mechanical axis. For this purpose, the self-centering joining element can be designed so that a further joining element attached to it is changed in its position and orientation, for example by pushing and/or turning, until the desired mechanical connection is formed by means of the joining element along the provided mechanical axis. In addition, tapered structures and/or undercuts present in the joining element can restrict movement in at least one undercut direction and thus fix the specified position and orientation of the modules connected to one another. This type of mechanical connection allows rotational and translational degrees of freedom to be restricted from a very large number of starting positions and starting orientations in such a way that a statically determined end position can preferably be obtained whose number of degrees of freedom is lower than the number of degrees of freedom of the starting position. In particular, in a statically determined end position, all degrees of freedom can be restricted in such a way that no translational and rotational movements are possible. However, other designs are possible, allowing selected rotational and/or translational degrees of freedom. In this way, the modular character of the present micro-optomechanical system can be enhanced. In particular, the same predetermined shape of the joining elements can clearly define at least one optical axis, in particular an optical axis that runs through an optical coupling point between modules of the same or different size and shape. Depending on the functionality of the modules involved, which depends in particular on the respective optical structure of the respective module, it can be advantageous to vary the shape and size of the modules involved, in particular the support elements and the joining elements they comprise, accordingly. A variation can relate in particular to the type, number, alignment and/or orientation of the optical components and the associated optical coupling points. Alternatively or additionally, the variation can relate to a design of at least one stop or marking, wherein preferably at least one vertical ramp or at least one step or at least one shared surface can serve as a stop, and wherein the marking can in particular comprise a surveying marker. Further details on the at least one stop or marking can be found in the following description.

In a particular embodiment, the micro-optomechanical system can further comprise at least one further carrier element to which none of the optical components is attached and which does not comprise any of the beam-forming elements. The at least one further carrier element can preferably serve as a placeholder in order to set a desired distance between at least two modules and/or at least two optical components, in particular in order to provide space for attaching at least one further component, preferably a further optical component, preferably on a surface extending beyond a base area of the at least one carrier element. A collimated light beam can preferably be used to bridge the distance. However, other embodiments of the at least one further carrier element are conceivable.

Due to the precise arrangement of the carrier elements in relation to one another, the modules can be provided with optical components in such a way that they are positioned and oriented in relation to one another in such a way that the individual modules can be optically coupled to one another by means of a transmission of light. The term "positioning" refers to the arrangement of an element at a point in three-dimensional space, while the term "orientation" refers to the alignment of the element at this point in three-dimensional space. Electromagnetic radiation, which for the sake of simplicity is usually referred to here only with the term "light", is not limited to wavelengths in the visible optical range, = 400 nm to 800 nm, but can include any type of electromagnetic radiation that can be guided in a waveguide. In addition to electromagnetic radiation in the visible optical range, electromagnetic radiation from the ultraviolet range, = 10 nm to 400 nm; the infrared range, = 800 nm to 1 mm; the terahertz or millimeter wave range, k = 30 pm to 3 mm or = 1 mm to 1 cm; and the microwave range, = 1 mm to 1 m, can also be suitable for this. Depending on the wavelength selected, the optical components can differ from one another in their structure and/or mode of operation, even if they have the same functionality. The numerical values given below, in particular for dimensions of structures or to describe performance parameters of a three-dimensional microstructuring process, in particular for resolution or accuracy, refer, unless otherwise stated, to arrangements that are set up for a vacuum operating wavelength k of approx. 1.5 pm. For a different operating wavelength, the given numerical values can be scaled proportionally to the wavelength, especially taking into account the refractive indices of the materials used.

The term "optical component" refers to a structure on an element or an independent component that is designed to emit, transport, receive, detect and/or manipulate light, while the term "optomechanical system" refers to an arrangement of at least two optical components on at least two carrier elements. Preferably, each optical component used in the context of the present invention is selected from the group comprising: optical glass fibers, in particular single-mode fibers or multi-mode fibers made of organic or inorganic materials; integrated optical chips, in particular photodiodes, linear or planar photodiode arrays, CCD arrays or image sensors, in particular based on semiconductors, preferably silicon or IILV compound semiconductors, or dielectric materials, preferably glasses, silicon dioxide, silicon nitride or polymers; bolometers; lasers, in particular vertical-cavity surface-emitting lasers (VCSEL) or edge-emitting lasers; superluminescence diodes; optical circuit boards; Elements for free-beam optics, in particular lenses, beam splitters, isolators, mirrors or diffraction gratings. Other optical components are conceivable. The optical components can preferably comprise optical waveguides with low index contrast, in particular glass-based optical waveguides, or with medium or high index contrast, in particular waveguides based on semiconductors or dielectric materials. Coupling or decoupling of light can preferably take place at an edge or on a surface of the optical component; in particular at an edge of an edge-emitting laser, at a chip edge, or at a facet of a waveguide-based system; alternatively at a surface of a surface- emitting laser or a surface-illuminated photodiode, or on the surface of a waveguide-based chip that has at least one optical coupling point, in particular comprising an optical grating coupler or an optical deflection element. However, other types of coupling or decoupling of light are possible.

The term "optical waveguide" refers to any arrangement that is designed to guide an electromagnetic wave, in particular in the wavelength range specified above. These preferably include individual optical waveguides, optical waveguides with branches, polarization filters, polarization beam splitters, polarization converters, tapers, directional couplers, couplers based on multi-mode interference (MMI), waveguide networks and waveguide-based components, also in combination with micro-optical elements such as lenses, mirrors or prisms. However, other types of optical waveguides are conceivable. The electromagnetic wave can be guided in the optical waveguide in particular by means of total reflection at an optical interface or by means of multiple reflection at periodically arranged elements, for example in the case of an optical waveguide based on a photonic band gap or on a photonic crystal. In more complex optical waveguides, such as in so-called “sub-wavelength grating waveguides”, or “SWG” for short, the waveguiding is based on an effectively increased refractive index in the region of the waveguide core. Waveguiding using optical waveguides is based on the fact that, in contrast to propagation of light in free space, the divergence of the light propagating in the optical waveguide in the lateral direction is prevented or, in the case of a tapering or widening optical waveguide, controlled by a continuous interaction of the light with dielectric interfaces. This makes it possible to guide light in an axial direction in an area elongated in the direction of propagation, wherein the ratio of the axial extension of the light-filled area is preferably more than 3, particularly preferably more than 5, and most particularly preferably more than 10 or 20. In addition to the at least one optical waveguide, the optical component can have further optical structures, in particular selected from at least one refractive, diffractive and/or reflective optical element, for example at least one lens or a mirror, which are designed to additionally change the propagation of the electromagnetic radiation in the optical component.

In a preferred embodiment, the optical waveguide can have a layer thickness for a vacuum operating wavelength of approximately 1.5 pm, preferably from 10 nm to 1000 nm, particularly preferably from 30 nm to 500 nm, in particular from 50 nm to 300 nm, applied to one of the optical components or to one of the carrier elements. This makes it possible in particular to produce the at least one optical waveguide with deviations of less than 1000 nm, particularly preferably less than 500 nm, in particular less than 100 nm. The resolution of a three-dimensional structuring process can preferably be better than 3 pm, particularly preferably better than 1 pm, in particular better than 500 nm. In particular with regard to a replication brought about by a three-dimensional structuring process, the resolution can deviate by less than 3%, particularly preferably less than 2%, in particular less than 1% from the original shape to be replicated, based on an inaccuracy and/or tolerance in production. The numerical values mentioned above refer to the production of an optical waveguide which is intended for a vacuum operating wavelength of approximately 1.5 pm. For other operating frequencies, the dimensions of the at least one optical waveguide and thus the requirements for accuracy and resolution of the three-dimensional structuring process used for production can be scaled accordingly, if necessary taking into account the refractive indices of the materials used.

Each module of the present micro-optomechanical system further comprises at least one optical component which is attached to an associated carrier element. For this purpose, the carrier element can have at least one receiving element for at least one component to be received, in particular an optical component and/or electronic component to be received. The term “receiving element” refers to a micro-mechanical element which is designed to establish a mechanical connection between an element and at least one component to be received thereby, in particular between at least one carrier element and the at least one optical component and/or electronic component, but also between at least one carrier element and at least one carrier plane, between at least two carrier planes, or between at least one carrier plane and at least one optical component and/or electronic component. The mechanical connection can in particular relate to a planar arrangement and/or stacking. In a preferred embodiment, at least one stop can be used for this purpose, whereby preferably at least one vertical ramp or at least one step or at least one shared surface can serve as a stop, in particular to establish a vertical position or a horizontal position between the element and the at least one component to be received thereby. Alternatively or additionally, the carrier element can comprise at least one component introduced into a volume of the carrier element and/or applied directly to a surface of the carrier element, which in particular can be used as beam-forming element and/or as a receiving element and/or as a positioning element. The term "electronic component" refers here to an independent component that is designed to transport and/or manipulate electricity. An electronic component selected from an electrical conductor track, an electronic chip, an integrated circuit, an electrical voltage source, an electrical resistor, an electrical capacitor, an electrical coil, an electrical diode, an electrical transistor or a sensor is particularly suitable for the present invention; however, the use of at least one other electronic component is possible.

In a preferred embodiment, the size and shape of the receiving elements can correspond to the same specifications as for the joining elements. The at least one receiving element can preferably be designed as a self-centering receiving element and in this case can be adapted in particular to the at least one component to be received, in particular the at least one optical component and/or electronic component to be received. The at least one receiving element can be detachably or permanently connected to the at least one component to be received after it has been received. The receiving can take place as a planar series and/or as a stack. In a special embodiment, the at least one receiving element can be equipped with at least one undercut, in particular in order to detachably or permanently connect the at least one component to be received to the receiving element. In a special embodiment, an optical component that is not attached to the associated carrier element by means of at least one receiving element can preferably be produced on and/or in the carrier element by means of a three-dimensional structuring process. Alternatively or additionally, an optical component that is not attached to the associated carrier element by means of at least one receiving element can be produced by means of a three-dimensional structuring process, preferably integrated into the volume of the carrier element in one step, together with the carrier element. In this embodiment, these elements can be designed as coherent three-dimensional structures, replicated in a shape memory material and/or produced by means of a three-dimensional structuring process. However, other methods for producing the elements are possible.

In a further, special embodiment, at least one optical component can be used as an insertable optical component, which can be positioned and/or oriented by means of a preferably tapered holder, which in particular can be used for rear- cuts, is arranged on or at the carrier element. In this case, the receiving element on the carrier element can be aligned with the at least one optical component in such a way that it connects the module in question along the optical axis with the further module to be connected, whereby the desired optical coupling occurs in this way.

In a further, special embodiment, in particular for use in medical technology or biosensor technology, the micro-optomechanical system, preferably at least one of the carrier elements, can comprise at least one fluid-carrying component, which can be equipped with a receiving element. The modules can be designed in such a way that at least one component, in particular an optical component and/or electronic component, can be inserted into the beam path and incident light can thereby be manipulated and/or guided, coupled into at least one component and/or examined for a change in transmission. Other applications, in particular in data transmission, are possible.

In a further, particular embodiment, the micro-optomechanical system, preferably at least one of the carrier elements, can comprise at least one thermoelectric component, in particular a heating element or a Peltier element.

In a preferred embodiment, the micro-optomechanical system can comprise at least one material that can be thermally stable or at least thermally resilient, preferably up to a temperature of 350°C, particularly preferably up to 200°C, in particular up to 100°C. The thermal expansion of materials with different expansion coefficients can be taken into account in the configuration of components of the micro-optomechanical system, in particular to compensate for thermally induced tolerance changes, preferably by means of at least one elastically adjustable receiving element and/or positioning element, which can preferably be in the form of a clamping element.

According to the invention, each of the optical components has at least one optical coupling point. The term “optical coupling point” refers to a spatial point at which a connection by means of light occurs between two optical components, which, depending on the beam path, can be referred to as a “light-emitting component” and a “light-receiving component”. The optical coupling point is thus designed to connect two optical components to one another via an optical axis generated by the at least two interconnected optical components in such a way that connect in such a way that an optical coupling of the modules takes place, each of which comprises one of the two interconnected optical components.

In the present micro-optomechanical system, at least one of the optical coupling points comprises a beam-forming element produced by means of a three-dimensional structuring process. The beam-forming element is designed to manipulate the light in such a way that it can be coupled from the optical structure of a first module into a second module. The terms "first", "second", etc. are considered here as a description of an element, without specifying an order, rating or chronological sequence and without excluding the possibility that other elements of the same element may be present. Furthermore, the term "three-dimensional structuring process" refers to a microlithographic process for producing microstructures in three-dimensional form. A three-dimensional structuring process selected from micro 3D printing, in particular stereolithography (SLA), two-photon polymerization (2PP or TPP), fused deposition modeling (FDM) or projection microstereolithography (PSL) is particularly suitable for the present invention; or a replication process, in particular hot stamping, micro-injection molding or a three-dimensional replication process using a shape memory effect; an etching process or a deposition process. The shape memory effect can be used during manufacture and/or in downstream process steps, in particular to restore the original shape and position despite small deformations or minor subsequent damage.

At least one further component or subcomponent can also be produced using at least one microlithographic process, in particular using the three-dimensional structuring process described here. A module can preferably be replicated in a polymer, very preferably in a shape memory polymer. When using thermoplastic shape memory polymers, easily connected three-dimensional structures with undercuts can be replicated. The same applies when using elastic molds in combination with liquid UV resists. For fabrication using a three-dimensional structuring process, a design that is replicable can preferably be selected. In order to reduce post-processes, assembly tolerances and joining tolerances and to shorten the manufacturing process, it can be advantageous to integrate as many functions and components of the optical structure as possible into a carrier element and to manufacture it together with the carrier element in a common process. In a particular embodiment, a residual carrier layer on which parts to be replicated are located can preferably be removed in a three-dimensional structuring process, in particular so that the carrier elements have the same height and thus an identical position of the optical axis. For this purpose, the residual carrier layer can preferably be removed by means of a method selected from a machining process, etching or dissolving, preferably in an overhead position in order to achieve better accessibility. Alternatively, a residual carrier layer with a defined height can remain, in particular so that the carrier elements and/or carrier planes have the same height and thus an identical position of the optical axis. In this case, it can be advantageous to remove the residual carrier layer on at least one edge of one of the carrier elements. Preferably, the carrier element and/or the carrier plane and/or the connecting element and/or the receiving element can be designed in such a way that it has an at least partially straight cutting edge, which can preferably also be as easily accessible as possible.

The optical components are placed on and/or at and/or in the at least two carrier elements in such a way that an optical connection of the optical components is present at at least one optical coupling point. For this purpose, in particular the at least one beam-forming element together with the at least one joining element of a carrier element of a first module can be optically coupled to the latter with at least one matching joining element, at least one optical element and an optionally present beam-forming element of a carrier element of a second module. The beam path of the optical connection can in particular have the following sections: i. a beam-expanding section, which is characterized in that the beam diameter increases in this section. The beam-expanding section can use the natural divergence of the light field emerging from the optical component and/or modify the light field by means of a partial element of the beam-forming element. The divergence can in particular be increased by means of concave lenses, convex mirrors or diffractive elements, which are produced by means of a three-dimensional structuring process. Another possibility for beam expansion can involve producing an optical waveguide which initially reduces the mode field diameter. Subsequent propagation of the beam outside the optical component in free space can result in a high divergence. The divergence of the light beam in the beam-expanding section and/or a fictitious continuation of the light beam in a far field can preferably be at most 6°, particularly preferably at most 15°. in particular a maximum of 30°, each defined as half the opening angle based on an intensity of 13.5% of the maximum intensity. ii. a collimated section, which is characterized in that the beam diameter changes only slightly in this section. In a transition region between the beam-expanding section and the collimated, expanded section, a collimating optical component can preferably be used, for example a concave mirror or a convex lens. In this case, for example, a beam waist can form. The "beam waist" can be located at a position of a Gaussian beam or a Gaussian-like beam at which a substantially flat phase front occurs. The size of the beam waist, i.e. the waist diameter, can preferably assume a value of 5 pm to 100 pm, particularly preferably 10 pm to 80 pm, in particular 15 pm to 50 pm at a wavelength of 1550 nm. The corresponding beam divergence in relation to half the opening angle is derived from relevant formulas for Gaussian beams and is preferably at most 12°, particularly preferably at most 6°, in particular at most 4°. For wavelengths above or below 1550 nm, these values can change accordingly. Preferably, the field distribution generated by the beam-forming element can correspond as closely as possible to the field distribution that is coupled into one of the optical components. iii. a beam-narrowing section, which is characterized by the fact that the beam diameter decreases again here. The design of the beam-narrowing section can be analogous to the measures described under point i. for the beam-expanding section.

In a special embodiment of the present micro-optomechanical system, at least one of the carrier elements, preferably all of the carrier elements involved, can be attached to at least one carrier plane, preferably to exactly one carrier plane. For this purpose, the at least one carrier plane can be set up in particular for further positioning and/or orientation of individual or interconnected modules, which are also referred to as a “module group”. For positioning and/or orientation, receiving elements, in particular tapered receiving elements, can be used, which can have at least one undercut, in particular for fixing. The receiving elements can be designed in such a way that they allow movement of the carrier elements on the carrier plane and/or the carrier plane on a further carrier plane, preferably a one-dimensional translational movement. The arrangement of adjacent modules and/or modules on the carrier plane can take place in a planar plane or vertically, rotated by 180° overhead. In this case, on the top side of the Modules and/or module groups and/or the at least one support level can be provided with positioning and receiving elements for arranging the modules. In this embodiment, the underside of the at least one support element, or in the case of overhead installation the top side of at least one inverted support element, and the top side of the at least one support level can preferably have the same height. This can make it possible to set a height level for the optical axis for connecting the modules. If, for example, a height offset of the optical axis occurs between support elements or support levels due to a further support level or due to a height difference in the optical structure, the height offset of the optical axis can be compensated by means of an adapted module height, an adapted height of the optical structure, by means of beam-forming elements, receiving elements, holders and/or plateaus arranged at different heights and/or by means of at least one further support level. Support levels can comprise predefined receiving elements for attaching at least one further support level, the functionality of which can preferably correspond to the joining elements. Furthermore, the positioning and/or receiving elements can also serve to protect and/or as spacers for the optical components.

In a special embodiment, at least one of the joining elements and/or the receiving elements can be designed as a positioning element and/or have at least one positioning element which, during production of the micro-optomechanical system, can be set up to bring the components to be assembled into their end position as directly as possible by specifying predefined positioning elements from which the end position can result from a rotary and/or translatory movement. From this, a very precise end position of each module in the micro-optomechanical system, precisely defined in three dimensions, can be set as precisely as possible to one another up to an accuracy of the desired positioning tolerance, in particular of 1 dB. The 1 dB positioning tolerance describes a threshold of coupling losses of 1 dB between two optical components, due to an alignment precision at the optical coupling point, in particular with regard to lateral deviations of a beam profile, lateral deviations with regard to the optical coupling point, angular deviations and/or collimation errors, absorption losses, reflection losses, scattering losses, in particular due to Rayleigh scattering. The alignment precision results from the sum of all tolerance-related individual deviations, typically comprising manufacturing tolerances, assembly tolerances and environmental tolerances, in particular due to vibrations or magnetism or due to temperature, humidity or air pressure of the environment. The smallest at the optical coupling point between two optical The beam diameter occurring at the optical coupling point between two optical components can preferably be twice, particularly preferably five times, in particular more than ten times the alignment precision. The beam diameter occurring at the optical coupling point between two optical components can preferably be 1 pm to 10 mm, particularly preferably 5 pm to 1 mm, more preferably 10 pm to 200 pm, in particular 15 pm to 100 pm. The term "beam diameter" refers here to a diameter of an area measured perpendicular to the direction of propagation of the light beam, in which the intensity of the light is more than 1/e ² , i.e. more than 13.5% of the maximum intensity typically occurring on the beam axis. Alternatively, the term "beam diameter" can refer to a full width at half maximum (FWHM) or a four-fold standard deviation of the intensity distribution (D4o width). As an example, with a beam diameter of 50 pm, the required alignment precision of the optical coupling point is at least 25 pm, particularly preferably at least 10 pm, in particular at least 5 pm. The use and/or application environment of the optical components can also be taken into account here, in particular thermal expansion when using materials with different thermal expansion coefficients. The mechanical positioning tolerance of the connecting elements results from the 1 dB positioning tolerance. The term "tolerance" refers to a deviation of an actual state from a target state, or an actual size from a target size. Shape and position deviations arise from manufacturing and assembly. The term "tolerance" here includes a tolerance chain up to the respective point in the product creation chain, which results from a sum of all temporally and spatially preceding manufacturing and assembly tolerances. These deviations result in differences between the actual position of optical axes and/or optical coupling points and the target position with the lowest possible transmission losses.

Preferably, a positioning element can be used for this purpose, the shape of which is produced together with the optical component and which is designed in such a way that a point, line and/or surface created on, at or in the optical component or already present for positioning in the form of a stop, the optical component is precisely positioned while maintaining the desired positioning tolerance, wherein the shape can be produced by means of a process selected from forming processes such as etching, deep etching or machining processes or from primary forming processes, wherein the point, line and/or surface are specified. The use of at least one other shaping production method is, however, possible. In this case, the design of the optical structure can be coordinated with the position and/or orientation of the component to be joined, in particular if preferred Orientations for positioning and/or orientation are available. In particular, components to be joined can be installed in a normal position or overhead.

The interconnected support elements, the support element with the at least one support level and/or the at least two support levels can be detachably connected to one another while maintaining the shape and functionality and can thus be used later for further use of the micro-optomechanical system. Alternatively, the interconnected support elements, the support element with the at least one support level and/or the at least two support levels, in particular depending on the structure and use of the micro-optomechanical system, can be permanently connected to one another while maintaining the shape and functionality in order to maintain the micro-optomechanical system in question in a particularly stable manner.

The functionality of a module or a group of modules can depend in particular on the respective optical structure. The size of a module, which is preferably adapted to this, can deviate from a preferred standard size of less than 100 cm ² , particularly preferably at most 20 cm ² , and very particularly preferably at most 5 cm ² , in particular at most 2 cm ² , as long as the optical axes of two modules joined together match. In a preferred embodiment, the outer edges can be rectangular; alternatively, however, they can have an angle other than 90° to one another. In a special embodiment, individual modules can deviate from a preferred rectangular shape, in which the longest flat edge length is preferably equal to or an integer multiple of the shortest flat edge length, in particular when two modules are connected at a fixed angle, which can preferably be carried out by a shape deviation of the base area of the support element in the form of a triangle, trapezoid, parallelogram or a combination thereof. Furthermore, the size of a module can be increased or reduced by an amount by which the module to be produced can grow or shrink during production, in particular when overexposure is used in a DLP printing process (Digital Light Processing), due to the voxel-related size of the smallest writing unit in a 2PP printing process, or due to shrinkage. The optical components are or will be placed on the carrier element by means of at least one receiving element in such a way that an optical coupling is achieved by combining the joining elements of the at least one carrier element of a first module with the matching joining elements and the at least one beam-forming element of a second module. The size of a module can thus also depend on the preferred Standard size, as long as the optical coupling point between two modules is clearly defined by the joining of the joining elements.

In a further embodiment, an individual module, a module group or an entire micro-optomechanical system can be filled with a solid, optically transparent medium, in particular to protect the micro-optomechanical system or a part thereof from external influences, against mechanical displacement of components aligned against one another or against deformation, to facilitate handling, to generate an index contrast, to form a further coupling point for mounting at least one further element, to increase transmission, or to avoid back reflections or unwanted coupling. The term "transparent" here refers to an optical property of a material that allows electromagnetic waves to pass through in such a way that the absorption by the material is as low as possible. The material absorption of the material is preferably below 10 dB/mm, particularly preferably below 5 dB/mm, and most particularly preferably below 2 dB/mm or 1 dB/mm.

In a further, special embodiment of the present micro-optomechanical system, at least one of the carrier elements and/or at least one carrier plane can preferably be provided with at least one metallic layer, which is designed as at least one electrical conductor track. The at least one electrical conductor track can in particular be designed for electrically contacting at least one optical component. The at least one electrical conductor track itself can for this purpose be connected to the at least one optical component, the at least one electronic component and/or to at least one external connection, which can preferably be designed as a contact pad and which can preferably be designed for supplying electrical energy and/or for deriving information, in particular in the form of at least one bond, preferably at least one wire bond. In particular, two carrier elements, two carrier planes, or a carrier element and a carrier plane can be connected to one another in the form of a bond, preferably a wire bond. However, other embodiments of the at least one electrical conductor track are possible. The conductor tracks can be produced using a mask. Preferably, an adhesive layer can be applied first, which preferably comprises a well-adhering metal, in particular chromium, and then a starting layer for subsequent electroplating, which preferably comprises a metal with good electrical conductivity, in particular gold. To carry out the electroplating, the conductor tracks can be applied in a galvanic bath to the desired layer thickness, which can depend in particular on the cross-section of the conductor tracks, the applied current and voltage. Alternatively or additionally Conductor tracks can be applied directly to a carrier element or a carrier plane using a micro-structuring process, preferably by means of micro-laser sintering.

In a further embodiment, at least one of the carrier elements and/or a carrier plane can have recesses and/or openings to enable access to the optical structure, optical components and/or electrical components. The recesses and/or openings can be designed in such a way that contactless assembly of the components to be joined is ensured and/or that the at least one carrier element and/or the carrier plane can only partially rest on it. This embodiment can also have a placement unit on the top of the at least one carrier element to enable components to be placed overhead and/or to provide accessibility from the bottom.

The present micro-optomechanical system differs from the disclosure in DE 10 2016 221 464 A1, in particular from the system shown in Figure 22, in that there the ambient medium primarily serves to reduce a refractive index contrast or to set a precise distance between the optical components. In Figure 22, two chips are provided with beam-forming elements which are embedded in an ambient medium, while the alignment structures shown there are located directly in the ambient medium which completely surrounds the optical components. In contrast, in the present micro-optomechanical system there is no need for an ambient medium. In the present micro-optomechanical system, each carrier element has a connecting element, which in turn has a self-centering joining element or is designed as a self-centering joining element. By combining connecting elements that fit together and are also designed as joining elements, it is possible to achieve an end position that is determined solely on the basis of the shape and is achieved solely by the joining process of two carrier elements. In contrast, the alignment structures shown as examples in DE 10 2016 221 464 A1 are not joining elements that simply hold the subsystems in position and result in a statically determined end position. Finally, in the present micro-optomechanical system, it is not necessary for the optical components to be fixed to a common base plate, since the position of the carrier elements is automatically determined by the joining process of the self-centering joining elements that sit on the carrier elements.

In a further aspect, the present invention relates to a method for producing a micro-optomechanical system, which comprises the following steps: a) providing at least two carrier elements, each of the carrier elements having at least one connecting element, each connecting element having at least one self-centering joining element, the joining elements fitting together in such a way that the carrier elements can be mechanically connected to one another by means of the joining elements; b) providing at least two optical components, each of the optical components having at least one optical coupling point; c) producing at least one beam-shaping element at at least one of the optical coupling points by means of a three-dimensional structuring process; d) fastening each optical component to one of the carrier elements; and e) producing an optical coupling of the optical components at at least one optical coupling point by means of a mechanical connection of the carrier elements by means of the fitting self-centering joining elements.

The steps a) to e) according to the invention can preferably be carried out in the order given, although a different order is also possible, in particular carrying out step d) before step c). In addition, steps can also be carried out at least partially simultaneously and/or further steps, regardless of whether they are described herein or not.

For details relating to the present method for producing a micro-optomechanical system, reference is made to the remaining description of the micro-optomechanical system. In particular, special embodiments described therein can also be produced using the present method.

The terms "have", "have", "comprise" or "include" or any grammatical variations thereof are used herein in a non-exclusive manner. Accordingly, these terms may refer both to situations in which, in addition to the features introduced by these terms, no further features are present, or to situations in which one or more further features are present. For example, the expression "A has B", "A has B", "A comprises B" or "A includes B" may refer both to the situation in which, apart from B, no further element is present in A (i.e., to a situation in which A consists exclusively of B), and to the situation in which, in addition to B, one or more further elements are present in A, for example element C, elements C and D, or even further elements. It should also be noted that the terms "at least one" and "one or more" and grammatical variations of these terms, when used in connection with one or more elements or features, are intended to express that the element or feature may be provided once or multiple times, and is usually used only once, for example when the feature or element is first introduced. When the feature or element is subsequently mentioned again, the corresponding term "at least one" or "one or more" is usually no longer used, without limiting the possibility that the feature or element may be provided once or multiple times.

Furthermore, the terms "preferably", "in particular", "for example" or similar terms are used herein in connection with optional features, without limiting alternative embodiments. Thus, features introduced by these terms are optional features, and these features are not intended to limit the scope of the claims and in particular the independent claims. Thus, as the person skilled in the art will recognize, the invention can also be carried out using other embodiments. Similarly, features introduced by "in an embodiment of the invention" or by "in an embodiment of the invention" are understood to be optional features, without limiting alternative embodiments or the scope of the independent claims. Furthermore, these introductory expressions are intended to leave untouched all possibilities of combining the features introduced by them with other features, be they optional or non-optional features.

Advantages of the invention

The micro-optomechanical system described herein relates to a modular arrangement of micro-optical components and micro-mechanical components, which can preferably be produced at least partially by a three-dimensional structuring process of simply connected three-dimensional structures. A "simply connected three-dimensional structure" is understood to mean a structure which, taking into account production-related deviations, does not comprise any closed hollow bodies, ring structures or tunnel structures, particularly in areas through which light passes.

Each module comprises two parts, on the one hand a carrier element, which is connected to at least one other carrier element via at least one connecting element and, on the other hand, an optical component which in particular has at least one optical waveguide and can comprise at least one receiving element for receiving, positioning and orienting at least one further optical component. The micro-optomechanical system can in particular be designed to transmit light between different optical components and to manipulate it. The functionality and efficiency of the at least two modules connected in the micro-optomechanical system depends significantly on a positioning tolerance of the carrier elements including the optical components attached to them, which together form the respective module.

In order to achieve the best possible functionality and high efficiency of a micro-optomechanical system that includes a large number of modules, sufficiently small individual tolerances in the individual modules are required due to a tolerance chain. The tolerance chain includes in particular production-related and assembly-related variations as the sum of all assumed uncertainties, especially manufacturing tolerances of the carrier elements including the joining elements included therein, joining tolerances of the connection between the carrier elements, manufacturing tolerances of the optical components and/or positioning tolerances of the optical components in relation to the respective carrier element to which they are attached.

The micro-optomechanical system according to the invention proposed here preferably serves as a modular system for optical assembly and connection technology and is preferably manufactured from pre-assembled modules which combine a positioning functionality of an optical table with the optical functionality of optical components arranged on it. This makes it possible to position and/or adjust the optical components on a microscopic scale within an acceptable tolerance field in the sub-micrometer range. For this purpose, the individual optical components are predetermined in their oriented position relative to one another and can preferably only be moved along the optical axis, particularly preferably unchangeable, for which a standardized basis with defined distances from one another, on which the optical components can be designed, is provided. Micro-optomechanical systems with different functionalities can be manufactured by means of various optical components which can be arranged in series. For this purpose, predefined joining elements are used which determine the position and orientation of the carrier elements and consequently the optical components attached to them. Furthermore, the use of a three-dimensional microstructuring process can produce functionally relevant structures with great precision in terms of their shape and functionality, while also offering a high degree of design freedom. Furthermore, in the case of simple coherent structures are preferably reproduced in parallel in large quantities using a three-dimensional structuring process.

There is no known micro-optomechanical system from the state of the art that offers mutual and universal functionality in terms of positioning and orientation, such as optical benches or optical tables in the macroscopic size range. Simple downscaling from the macroscopic range is not possible, especially since microscopic components are not easy to handle, place, orient and readjust. For this reason, micro-optomechanical systems have so far been developed, manufactured and constructed separately for each individual case.

In contrast to the present invention, DE 10 2016 221 464 A1 does not disclose any predefined optical coupling points or separate mechanical connections for the mutual positioning of optical components. Furthermore, it does not present any prefabricated units that are prefabricated and are designed in particular to complement each other when simply connected, in particular by lining up, clicking or plugging together. Likewise, it does not provide the option of producing predefined, positioning, in particular three-dimensional micro-optomechanical structures including the carrier elements in one process step. Furthermore, the beam-forming elements do not necessarily have to be connected directly to the optical components.

In contrast, the invention proposes to provide a platform that is as universal as possible with predefined mechanical and coordinated optical coupling points that perform a mutual centering and aligning function. To date, no standards for optical couplings between a wide variety of optical components are known. The invention presented here makes it possible to build a micro-optomechanical system by simply lining them up, clicking them together or plugging them together with the highest precision in the submicrometer range.

Furthermore, by selecting a shape memory material as the material, a "self-repairing" effect of the micro-optomechanical system or individual modules can be made possible. This selection of material in combination with a simple, connected structure also makes it possible to produce the modules in parallel in large quantities using three-dimensional structuring processes, in particular with the optical axis perpendicular to the demolding direction. Short description of the characters

Further details and features of the present invention emerge from the following description of preferred embodiments, in particular in conjunction with the dependent claims. The respective features can be implemented alone or in combination with one another. The invention is not limited to the embodiments. The embodiments are shown schematically in the following figures. The same reference numbers in the figures designate the same or functionally identical elements or elements that correspond to one another in terms of their functions. In detail:

Figure 1 is a schematic representation of an embodiment of a micro-optomechanical system according to the present invention in plan view (Figures 1a and 1b) and in side view (Figure 1c);

Figure 2 is a schematic representation of a possible optical structure as an embodiment of a module according to the present invention in perspective representation;

Figure 3 shows a preferred embodiment of a module in a schematic representation, comprising a self-centering receiving element designed to receive cylindrical objects in a perspective representation;

Figure 4 is a schematic representation of another embodiment of the micro-optomechanical system according to the present invention in plan view;

Figure 5 is a schematic representation of another embodiment of the micro-optomechanical system according to the present invention in plan view;

Figure 6 is a schematic representation of an embodiment for applying a module not yet equipped with an optical component to a carrier plane in a perspective view;

Figure 7 schematic perspective representations of embodiments of self-centering joining elements on the support elements on modules;

Figure 8 Detailed view of two joined elements in sectional view;

Figure 9 shows two schematic representations of further embodiments of a module according to the present invention in perspective view;

Figure 10 is a schematic representation of a detailed view of the embodiment from Figure 9a in perspective view;

Figure 11 shows two schematic representations of further embodiments of a module according to the present invention in perspective view;

Figure 12 four schematic representations of the modular principle with differently positioned optical axes; Figure 13 shows three schematic representations of further embodiments of a module according to the present invention in plan view (Figures 13a and 13b) and in perspective view (Figure 13c);

Figure 14 shows three schematic representations, on the one hand as an embodiment of a replicated module directly after a replication process (Figure 14a) and on the other hand a processing device for removing a residual carrier layer, in perspective (Figure 14b) and as a section (Figure 14c);

Figure 15 shows a schematic embodiment of a module having a carrier element adapted to receive three components;

Figure 16 shows a schematic design of a module for optically coupling two optical components;

Figure 17 shows a schematic embodiment of the micro-optomechanical system for coupling two chips (Figure 17a) and a schematic embodiment of the module shown in Figure 17a (Figure 17b), both in perspective view;

Figure 18 is a schematic representation of another embodiment of the micro-optomechanical system according to the present invention in plan view;

Figure 19 is a schematic representation of a section through an optical element positioned in a joining device;

Figure 20 shows a schematic embodiment of a micro-optical system in plan view, Figure 21 shows the micro-optical system shown schematically in Figure 13a, schematically extended by means of a spatially separated carrier unit and having a further beam-forming element;

Figure 22 schematic representations of an optical structure as an embodiment of a module in perspective representation; and

Figure 23 shows another schematic embodiment of a micro-optical system in different representations.

Description of the embodiments

Figure 1 shows a schematic representation of an embodiment of a micro-optomechanical system 10 according to the present invention in plan view (Figures 1a and 1b) and in side view (Figure 1c). In Figure 1b, two different modules 150, 160 are shown as separate units, which, as Figure 1a shows, can be combined to form the desired micro-optomechanical system 10. Each of the two modules 150, 160 has an optical component 60, 70, wherein each of the optical components 60, 70 is attached to one of the carrier elements 40, 50, wherein each of the optical components 60, 70 has an optical coupling point 80, 90. The optical Component 70 is mounted on a plateau 35, which compensates the height in such a way that the optical axis 140 coincides with the optical coupling points 80, 90. According to Figure 1a, the two modules 150, 160 can be optically coupled to one another via the optical coupling points 80, 90 between beam-forming elements 100, 110 via an optical axis 140 at an optical coupling point 604 between the two modules 150, 160, in this embodiment by means of a collimated light beam 120 which has a defined beam diameter 121.

According to the invention, the optical coupling 604 is automatically set up by lining up, clicking or plugging together the two modules 150, 160 along the optical axis 140, since each of the carrier elements 40, 50 has a connecting element 20, 30, wherein each connecting element 20, 30 has a self-centering joining element. The joining elements of each module 150, 160 fit together in such a way that the carrier elements 40, 50 can be mechanically connected to one another in a detachable or non-detachable manner by means of the joining elements. As shown schematically in Figures 1a and 1b, the joining elements structurally interlock. As Figure 1c shows, the modules 150, 160 of the present micro-optomechanical system 10 are also arranged on a common carrier plane 130.

Figure 2 shows a schematic representation of an optical structure as a possible embodiment of a module 166, 167, 168 in perspective. Shown is an optical coupling within the module 166, 167, 168, which optically couples a mounted single-mode fiber 61 to a second mounted single-mode fiber 71, each of which has a diameter of 125 pm. Between two self-centering receiving elements 161, 162 designed as clamping devices, in each of which a glass fiber 61, 71 is introduced as the optical component 60, 70, there is at least one beam-forming element, which is designed in Figure 2a as a single optical lens 101a, in Figure 2b as a lens system of two optical lenses 101b, 102b and in Figure 2c as a lens system of three optical lenses 101c, 102c, 103c. Both the optical lenses 101a, 101b, 101c, 102b, 102c, 103c shown and the receiving elements 161, 162 each form a three-dimensional, simply connected structure.

Figure 3 shows a schematic perspective view of a preferred embodiment of a module 150 which comprises the self-centering receiving element 161, which is designed in particular to receive cylindrical optical components 60, preferably a glass fiber 61. In contrast to Figure 2, the optical structure of the module 150, comprising a receiving device 161 and a glass fiber 61, is designed as a single Receiving device 161 for the glass fiber 61 and serves in the embodiment in Figure 3 only to accommodate a single-mode fiber 60, 61.

Figure 4 shows a schematic representation of a further embodiment of the micro-optomechanical system 10 according to the present invention in plan view. This embodiment comprises three carrier elements 170, 180, 190, to each of which at least one optical component 171, 181, 191 is applied, which have the beam-forming elements 172, 182, 192, wherein at the optical coupling points 170a, 170b, 180a, 190a there is an optical connection of two of the optical components 171, 181, 191. The carrier elements 180, 190 are each mechanically connected to the carrier element 170 by means of matching and identical connecting elements 20, 30. The carrier elements 170, 180, 190 also have further identical connecting elements 20, 30, with which further carrier elements can be coupled to one of the carrier elements 170, 180, 190. As can be seen from Figure 4, the carrier element 170 has a size that differs from the size and shape of the carrier elements 180, 190, which are each designed in a preferred standard size and standard shape. Alternatively or additionally, it is also possible to select different horizontal or vertical (not shown) geometries for the carrier elements 170, 180, 190, so that an angle can be set in a horizontal plane between preferred optical axes 140 of the modules 170, 190. Furthermore, the micro-optomechanical system 10 shown schematically in Figure 4 has the beam-forming elements 195a, 195b, which are designed here as an optical deflection element; as a deflecting element 195a inside the beam-forming element or as a deflecting element 195b outside the beam-forming element; however, other designs of the beam-forming elements 195a and 195 are possible. The optical component 171 is designed here such that it can be inserted into the beam path of the optical axis 140.

Figure 5 shows a schematic representation of a further embodiment of the micro-optomechanical system 10 according to the present invention in plan view, which comprises the two carrier elements 180, 196. While an edge-emitting laser chip (distributed feedback laser; DFB) 210 is applied to the carrier element 180 by means of a receiving element (not shown), there are two conductor tracks 200, 205 on the carrier element 196, which are designed to electrically contact the micro-optomechanical system 10. Alternatively (not shown), a surface-emitting laser chip can be used, which is arranged at an angle or couples out a beam parallel to the module surface by means of a lens. Between the conductor tracks 200, 205 and the carrier element 196, which are designed to electrically contact the laser chip 210, Contact pads 211, 212 are provided with electrical connections in the form of wire bonds 201, 202 as shown in Figure 4.

Figure 6 shows three schematic representations of an embodiment for applying a module 1202, which is not equipped with an optical component, to the carrier plane 130. The carrier plane 130 is set up by means of a self-centering receiving element 221, 222, 223, 224, 225 for attaching the module 1202 to the carrier plane 130, while the module 1202 has matching receiving elements 230 and 231. For this purpose, the receiving element shown schematically in Figure 6a comprises two elements 221 with receiving elements designed in one direction with one horizontal degree of freedom, in Figure 6b two elements 222 and 223 each with receiving elements designed in two directions for two one-dimensional degrees of freedom and in Figure 6c elements 224, 225 with receiving elements designed in one direction for a one-dimensional degree of freedom with a stop, which are suitable for positioning, orienting and fixing the module 1202 in relation to the support plane 130. The fixation can comprise a detachable or non-detachable fastening of the module 1202 on the support plane 130. In addition, the support plane 130 shown schematically in Figure 6 is equipped with connecting elements 250, 260 in order to attach further support planes to the support plane 130. Preferably, many modules can be accommodated on the support plane 130. The module 1202 attached to the support plane 130 can in turn have connecting elements to at least one further support plane (not shown).

Figure 7 shows schematic perspective representations of embodiments of self-centering joining elements 300, 310, 320, 330 on the support elements 40, 50 of modules. The joining elements 300, 310, 320, 330 shown in Figure 7 preferably appear in pairs in order to act as the element to be joined and the receptacle provided for it on one or both sides of a module. However, other designs (not shown) are conceivable, in particular a repeated design. Furthermore, a positioning slope 1108 in the form of an assembly ramp or step can also represent a design of a joining element.

Figure 7a shows the self-centering joining element 300, which is designed to be tapered in the vertical direction, in particular in order to take on both a vertical and horizontal positioning function, as well as to be easier to separate from the remaining carrier layer in a three-dimensional structuring process by means of a continuous edge produced on the underside, which represents a cutting edge for the defined cutting of the module from a remaining carrier layer. Furthermore, in the case of an inverse The receiving element designed to match the shape of the connecting element 300 defines a height stop through the undercut vertical direction, via which the height of the support elements to be joined can be adjusted.

Figure 7b shows the self-centering joining element 310, which has a so-called "2.5-dimensional" structure. The joining element 310 shown here comprises a one-sided paired arrangement of receiving elements 311, 312, which compensates for a horizontal angle error between two modules connected to one another and oriented to one another better than with one joining element. This number can be increased as required. In the 2.5-dimensional version, the base area can be used as a stop for defining the height.

Figure 7c shows the further self-centering joining element 320, which has additional undercut structures which, in conjunction with the joining elements 300 or 310, are designed to secure the support elements of the modules against deposition also in the vertical direction in combination with another suitable joining element.

Figure 7d shows another self-centering joining element 330, which has double undercut structures that are designed to secure the support elements of the modules both in the vertical direction against deposition and to secure two joined units against horizontal pulling apart. An inverse structure (not shown) can be open at the top in order to insert the receiving element into the connecting element from above.

Figure 8 shows a schematic detailed view of two joined elements in a sectional view, in particular for connecting two carrier elements 331, 332. Alternatively, Figure 8 can show the connection of an optical component and/or an electronic component to a carrier element and/or a carrier plane. Two different embodiments to the left and right of the center line are shown, separated by the center line. The positioning transverse to the joining direction is determined by structures 333 and 334 in the form of a plug and coupling. 333 is designed here as a pyramid or triangular structure, 334 as a cylinder structure; however, other shapes are possible. The positioning in the joining direction is defined by a layer of structural surfaces 339, which are mechanically pressed together. For this purpose, two undercut surface structures 336, 338 are used in the joining direction. The surface structures 336, 338 are preferably designed such that they stretch and/or extend and/or spread elastically and/or elastically plastically from the center line outwards during a joining process and engage in the undercut end position. The surface structure 336 is designed with a homogeneous transition and thus as a connection that is easier to release. The surface structure 337, on the other hand, has a sharp, undercut edge, which makes the bearing more stable but makes it more difficult to release the connection. The larger the angle 337 is set, the sharper the undercut structure surface 335 of the structure surface 339 is and thus the bearing is more stable and more difficult to release.

Figure 9 shows a design of a chip-integrating module 420, 430 in perspective. On a carrier element 421 there is an optical structure comprising a laser chip 401, receiving elements 402, hold-down device 503, and beam-forming elements 404a and 404b. During assembly, the laser chip 401 is positioned and inserted into a hold-down device 503 and the receiving elements 402, after which the laser chip 401 can be readjusted. For positioning, defined edges and surfaces are introduced on or in the surface of the laser chip 401, to which planar, coordinated stops are attached on the carrier element 421 for mechanical positioning, which precisely position the laser chip 401 in a translational and rotational manner. The surface pairing used to position the laser chip 401 is manufactured together with it and is designed in the form of deep etchings with vertically smooth edges. The joining elements 405, 406 of the carrier element 421 allow further modules, in particular carrier elements, to be connected in a precisely positioned manner by attaching them. This allows an optical axis to be defined for coupling between the two modules. In this exemplary embodiment, this is defined by the beam-forming element 404a, 404b and the optical coupling points formed thereby and aligned accordingly. The beam-forming element 404a, 404b manipulates the light so that it can be coupled into a further optical component on the attached module. Alternatively (not shown), at least one marking on the carrier element 421 can be used to position and align the laser chip 401. Outside the deep-etched area, the laser chip 401 has a rough, undefined saw edge 408, which cannot be used as a positioning surface due to insufficiently defined geometry in shape and planarity.

Figure 9a shows an embodiment of the module 420 on which a lens was produced on the laser chip 401 as the beam-shaping element 404a by means of a microlithographic structuring process.

Figure 9b shows an embodiment of the module 430 with a lens as the beam-forming element 404b in the form of a simply connected three-dimensional structure, which is produced by means of a three-dimensional structuring process, in particular by means of a Replication, together with the volume of the carrier element 421 as part of the optical structure. The lens is designed in such a way that it touches the coupling point of the optical output of an edge-emitting laser chip (distributed feedback laser; DFB). Alternatively (not shown), a surface-emitting laser chip can be used that is arranged at an angle or couples out a beam parallel to the module surface by means of a lens. It is also possible to fill the space between the laser chip 401 and the lens with another transparent material.

Figure 10 shows a section 440 from Figure 9a in perspective view with the receiving elements 402, the hold-down devices 503, the laser chip 401 and the beam-forming element 404a. The receiving elements 402 and the hold-down devices 503 have surfaces with the technical functionality of a receiving element in the form of a mechanical stop, which form a pair through contact and position the laser chip 401. A mating counter surface on the laser chip 401 in the form of deep etchings serves as a receiving element 403 in the form of a mechanical stop, is manufactured together with it and forms a defined surface. Outside the deep-etched area, the laser chip 401 has a rough, undefined saw edge 408, which cannot be used as a positioning surface due to insufficiently defined geometry in shape and planarity. The 407 hold-down devices 503, which are set at an angle, hold the laser chip 401 in position and press it vertically downwards into its position defined by the positioning elements and also prevent the laser chip 401 from loosening, tilting, twisting and moving.

Figure 11a shows, analogously to Figure 9b, an embodiment of a chip-integrating module 450 in a perspective view. The optical structure is located on the carrier element 421 and comprises a laser chip 501, receiving elements 504, hold-down device 506 and the beam-forming element 404b. In contrast to Figure 9a, the laser chip 501 is mounted upside down, aligned towards the top of the carrier element 421. Furthermore, the laser chip 501 is mounted on a plateau 505 in order to determine the height of the optical axis. Figure 11a shows a further embodiment analogous to Figure 9; the lens as the beam-forming element 404b can be produced together with the volume of the carrier element 421 and the optical structure and/or by a microlithographic process directly on the laser chip 501. Preferably, the laser chip 501 is constructed such that its contact points are located on the underside of the laser chip 501 and are accessible from above, in particular when stored overhead.

Figure 11b shows the carrier element 421 shown in Figure 11a with optical structure before mounting the laser chip 501 in a perspective view as a chip holding module 460 without a chip. The optical structure comprises the receiving elements 504, 509, the hold-down devices 506, the plateau 505 and the beam-forming element 404b. It can also be seen that the carrier element 421 and the plateau 505 have an opening 502 to make components accessible from the underside of the laser chip 501. Furthermore, the optical structure can have recesses 410 for the free steel line and to enable contactless assembly.

Figure 12 shows a schematic design of a micro-optomechanical system in plan view, with different sized individual modules 600a, 600b, 600c and a module group 600d with five individual modules joined together. The receiving elements 311, 312 of the carrier elements are repeated at the same distance from one another, which means that the micro-optomechanical system can be expanded by adding further modules, in particular further carrier elements. The 1 dB positioning tolerance mentioned above makes it possible to define optical axes 140 for the optical coupling 604 of individual modules and thereby to precisely match at least two modules to one another using the respective optical structure and to connect them to one another by joining them together. The position and orientation of the optical axes 140 depend on the respective optical structure of two modules to be matched to one another.

Figure 13a shows a schematic design of the micro-optical system 10 in plan view, comprising the carrier element 196 and a chip module 702a. On the carrier element 196, analogous to Figure 5, there are conductor tracks 200, 205 made of an electrically conductive material, which are electrically connected to the contact points 211, 212 of a laser chip 210 by means of wire bonds 201, 202. On the laser chip module 702a there is an edge-emitting laser chip in a holder (not shown) and a receiving element 161 for the optical fibers 60, 61. In this design, there is no need to add a separate module for receiving 150 a glass fiber 60, 61 and this is integrated directly into the carrier element 180. This eliminates the tolerance of the attachment, which can increase the positioning accuracy and thus the coupling efficiency. A beam-forming element 100 at the output of the laser chip 210 is printed directly on its surface and shaped in such a way that the light coupled out of the laser chip 210 is focused and coupled directly into the glass fiber 60, 61 as a non-collimated light beam 120b. This design can be supplemented and/or expanded by one or more additional lenses.

Figure 13b shows a further schematic embodiment of the micro-optical system 10 in plan view, comprising the carrier element 196 and the chip module 702b. In contrast to Figure 13a, the beam-forming element 710 is integrated into the volume of the chip module 702b and is replicated together with it.

Figure 13c shows a further schematic embodiment of the micro-optical system 10 in perspective, comprising the carrier element 196, a chip carrier module 180 and a fiber optic holder module 150. In contrast to Figure 13a, the fiber optic holder module 150 is designed separately and attached to the chip carrier module 180. Furthermore, the complete micro-optomechanical system 10 is filled with a material 709, which shields the micro-optomechanical system 10 from the outside, at the same time fixes the components and reduces losses in the beam path between the optical components and/or the beam-forming components. Furthermore, this filled form can be designed in such a way (not shown) that it enables easy connection to existing devices or systems.

Figure 14a shows a schematic perspective view of a preferred embodiment of a module 150 which comprises the self-centering receiving element 161, which is designed in particular to receive cylindrical optical components 60, preferably a glass fiber 61. The module 150 is applied to a residual carrier layer 801 which is created during a replication process and which must be removed in order to achieve a defined height of the module 150 so that the optical axes can coincide vertically while maintaining the 1 dB positioning tolerance.

Figure 14b shows a schematic representation of a holder 809 for removing the residual carrier layer 801 created during the replication process. To ensure efficient optical coupling, a constant module height is necessary with regard to the height of the optical axis and thus of the carrier elements with a height tolerance while maintaining the 1 dB positioning tolerance. To ensure this, the residual carrier layer 801 must be removed accordingly. For this purpose, the module including the residual carrier layer 801 can be placed upside down in a device 809 in which the residual carrier layer 801 is accessible from above and can be removed. When mounting the replicated module overhead, it must be ensured that the optical structures 805 are not damaged, which is why these areas are recessed by a recess 803 in the form of a trough, so that the module can only rest on its outer edge designed for this purpose. The module can be sucked in from below through openings 806 in the edge area of the holder and held in position so that the module cannot move during the machining process. A recess can be used as a distribution chamber 807 on the Underside of the holder 809 can be used. For even more precise positioning of the modules, positioning elements, in particular an inverse opening or a projection in the form of the receiving elements 808, can be incorporated into the holder 809. In the embodiment shown here, the top of the holder 809 is the height to be set, which simultaneously represents the underside of the module up to which the residual carrier layer 801 is removed. Hot stamping or micro injection molding can preferably be used as a three-dimensional structuring process. The holes for sucking in the module must meet a plannable surface on the top of the carrier elements so that the vacuum can be maintained. This results in an outer edge area on the carrier elements that cannot be provided with optomechanical structures. During micro injection molding or hot stamping, a so-called cut can remain due to the process, which can be removed, in particular in the form of a residual carrier layer 801, preferably using a machining, cutting or abrasive process. Alternatively, a residual carrier layer of a defined height (not shown) can be incorporated into the target shape and can thus form a plateau.

Figure 14c shows a schematic sectional view of the device 809 for reworking and removing the residual carrier layer 801. This shows a replicated module 804 on a residual carrier layer 801 with the optical structure 805 on the residual carrier layer 801, which lies in the recess 803 for the contactless storage of the optical structure 805. For stable storage during the processing process, the module is sucked in by negative pressure. This passes via the distribution chamber 807 through holes or openings 806 to the edge area of the module, where it is thereby firmly stored. The residual carrier layer 801 can then be removed to a defined height.

Figure 15 shows a schematic design of a module 910, which has a carrier element 900, which is designed to accommodate three components, preferably two optical waveguides in the form of glass fibers 60, 61, which are accommodated by the two receiving elements 161 and in whose optical axis a further component can be mounted in the receiving element 901, in particular a filter or a microfluid-carrying chip. The receiving element 901 can, due to its shape, perform an additional beam-forming or beam-manipulating function, preferably beam expansion and/or focusing and/or beam deflection. Furthermore, the module can also contain further beam-forming elements. All receiving elements can in turn have a positioning and fixing function. It is also possible to design the receiving element 901 with degrees of freedom, in particular limited or only in one direction, so that one or more assembled components can be moved.

Figure 16 shows a schematic design of a module 920 for optically coupling two optical components. The optical structure comprises a receiving element 161, optical components in the form of a lens system 1002 comprising two by two lenses and a further optical component 1004, which can only be partially manufactured together with the carrier element 1000 in one step. Due to the high aspect ratios of the lenses in the lens system 1002, these cannot be replicated and, due to their structure, also require further support structures 1003 between the lenses of the lens system 1002, which require a three-dimensional, not simply connected shape. This means that the carrier element 1000 is preferably manufactured together with the receiving element 161 and the receiving element of the optical component 1004 (not shown), and the lens system 1002 is subsequently produced using another microstructuring process. In this case, markings (not shown) can also be used on the surface of the carrier element 1000 for the orientation of the downstream microstructuring process, which are designed in particular as crosses.

Figure 17a shows a schematic embodiment of the micro-optomechanical system 10 for coupling two chips 1100 in perspective view. The optical structure of the module 1110 comprises holders 1101 for overhead storage of the system, pre-positioning elements 1102 for each chip 1100 in the form of a ramp with insertion bevels, which pre-positions each chip 1100 in the direction and rotation to its desired end position and over which each chip 1100 can be pushed into its final position, hold-down devices 1103 with an inclined receiving bevel 1104 for sliding in each chip 1100, receiving elements 1105 and measurement markers 1109. The receiving elements 1105 in the lower area of the optical structure form contact surfaces for positioning at the locations of deeply etched edges on each chip 1100 in order to position them horizontally and to press them into position or hold them there via the hold-down devices 1103. The optical structure is designed for the optical axes 140 of the two chips 1100 in such a way that the optical axes 140 are aligned. The lead-in slopes can be used in particular to achieve a position-finding movement with a defined end position or end positions. Connecting elements 311, 312 are also shown.

Figure 17b shows a schematic design of the module 1110 shown in Figure 17a in perspective. In contrast to Figure 17a, only the module 1110 is shown without the chip 1100. The optical structure comprises holders 1101 for a Overhead storage of the system, the pre-positioning elements 1102 for each chip 1100 in the form of a ramp with insertion bevels, which pre-position the chips 1100 in the direction and rotation to its desired end position and over which each chip 1100 can be pushed into its end position, hold-down device 1103 with an inclined receiving bevel 1104 for sliding in the chips 1100, receiving elements 1105 and measurement markers 1109. Each chip 110 to be mounted can slide and/or be mounted and/or pressed into its defined end position via the pre-positioning elements 1102 in the form of the ramp, preferably by means of receiving bevels. Furthermore, connecting elements to another module in the form of a positioning bevel 1108 and connecting elements 311, 312 are shown, as well as measurement markers 1109 in the form of lines. Furthermore, the module 1110 has an opening 1106 on the bottom to allow access to the chips 1100, for example for a passed-through fiber 1107.

Figure 18 shows a schematic representation of a further embodiment of the micro-optomechanical system 10 according to the present invention in plan view, which comprises the four carrier elements 190, 1201, 1204, 1205. While an edge-emitting laser chip 210 is applied to the carrier element 190 by means of a receiving element (not shown), there are no optical components on the carrier element 1201; this module serves as a placeholder or spacer. An optical element 1203 is arranged on the carrier element 1204. The beam-forming element 100 generated on the laser chip 210 collimates the beams along the optical axis 140 until they are focused by the beam-forming element 100 on module 1205 in such a way that they are coupled into an optical component applied to the module 1205, for example in the form of a photodiode 1208. The optical element 1203 comprises two beam-forming elements 1206, which are attached to a holder and can be configured to compensate for index differences to the optical component 1203, to obtain collimation or to serve as a filter.

Figure 19 shows a schematic section through a laser chip mounted on a carrier element 40, 50. The cross-section of the laser chip 401, 1100 serving as an optical component can be seen, which has a rough and undefined saw edge 1301 that cannot be used for positioning. Furthermore, smooth edges are shown that are produced with the chip itself, preferably by a deep etching process. As a result, the volume designated 1302 was removed and forms a receiving element 403 in the form of a defined edge or surface in the form of a mechanical stop, on which the laser chip 401, 1100 is positioned by abutting against the positioning elements 1105, 1310. Figure 20 shows a schematic design of the micro-optical system 10 in plan view, comprising the carrier elements 702a and 1405. On the laser chip module 702a, analogous to Figure 13a, there is an edge-emitting laser chip 210 in a holder (not shown) and a receiving element 161 with an inserted optical waveguide 60, 61. On the carrier element 1405 there is a receiving element 161 with an inserted optical waveguide 60, 61, a beam-forming element 710, which is introduced into the volume of the chip module 1405, and an optical component 1208. The light is focused and coupled from the laser chip 210 via the beam-forming element 100 as a non-collimated light beam 120b directly into the glass fiber 60, 61 and at its output via a beam-forming element 710 into the optical component 1208. coupled.

Figure 21 shows the micro-optical system 10 shown schematically in 13a with the schematic extension of a spatially separated carrier unit 1408 and the distinction of a further beam-forming element 710, which couples a collimated light beam into the optical component 60, 61 designed as an optical waveguide. The module 1408 comprises a receiving element 161 with an introduced optical waveguide 60, 61, on which a beam-forming element 1406 is arranged, which collimates light emerging from the optical component 60, 61 designed as an optical waveguide and couples it into the optical component 1208 via a further beam-forming element 100.

Figure 22a shows a schematic representation of an optical structure as an embodiment of a module 1510 in perspective representation. The carrier element comprises a beam splitter 1505, which splits the light beam 1502 into a horizontal component 1503 and a vertical component 1530, as well as an optical deflection element 1506, which deflects a vertical light beam in a horizontal direction 1504 in order to create a further plane of light guidance.

Figure 22b shows a further schematic representation of an optical structure as an embodiment of a module 1520 in perspective representation. In contrast to Figure 22b, here the light beam is coupled out of the optical deflection element 1506 in the second plane perpendicular 1511 to the incident light beam 1502.

Figure 23 shows a further schematic embodiment of a micro-optical system 10 in plan view (Figure 23a), in perspective view (Figure 23b), in side view (Figure 23c) and in front view (Figure 23d). The carrier units 1602, 1603, 1604 are stacked vertically and guide light via the vertical direction into different planes in order to to create a three-dimensional character of the micro-optical system. For this purpose, the carrier elements have connecting elements 1605, 1606 and joining elements 1610, which can be positioned vertically and/or stacked. The light, in particular a light beam 1611 shown as an example, can be distributed via beam splitters 1601 or other beam-forming elements, in particular optical deflection elements, and coupled into an optical waveguide (not shown) via receiving elements 161.

List of reference symbols

10 micro-optomechanical system

20, 30 connecting element

35, 505 Plateau

40, 50 support element

60, 70 optical component

61, 71 Fiber optic

80, 90 optical coupling point

100, 110 beam-forming element

101a, 101b, 101c, 102b, optical lens

102c, 103c

120 collimated light beam

120b Light beam

121 Diameter of a collimated coupling light beam

130 Carrier level

140 optical axis

150, 160, 173 Module

161, 162 receiving element

166 Module with fiber-to-fiber single-lens coupling

167 Module with fiber-to-fiber two-lens coupling

168 Module with fiber-to-fiber three-lens coupling

170, 180, 190, 196 support element

170a, 170b, 180a, 190a optical coupling point

171, 181 191 optical component

172, 182, 192, 195a, 195b beam-forming element

200, 205 Conductor track

201, 202 Wire Bond

210 Laser chip

211, 212 Contact pad , 222, 223, 224, 225 Connecting element between support element and support plane or support plane and support plane , 231 Connecting element between support element and support plane or

Support plane and support plane , 310, 320, 330 self-centering joining element , 312 connecting element , 332 joining element , 334 structures in the form of plug and coupling undercut structural surface

Design of an undercut joining device with transition Angle of an undercut surface without transition, as a non-detachable design

Execution of an undercut joining device with sharp

Crossing

Outer surface as a stop for positioning the end position

Laser chip

Recording element of the optical structure

receiving element in the form of a mechanical stop a lens printed on chip b, 710 lens replicated together with carrier element , 406 joining element

Optical structure hold-down device, 1301 uneven surface, in particular a saw edge

Mounting groove, 430, 450 Design of a chip holding module

Execution of a support element

Detail of a design of a chip holding module

Execution of a chip holding module Module without chip

Laser chip, overhead mounted

Opening in module/carrier element to the underside, 506 hold-down device optical structure, 509 positioning elements, here stops optical structurea, 600b, 600c single module d module group optical coupling points between modules a design of a module with chip and fiber integration on one module, lens printed on chip 702b Implementation of a module with chip and fiber integration on a

Module, lens with carrier element fabricated

709 Materials

710 beam-forming element

801 Remaining carrier layer

803 Recess for an optical structure

805 optical design

806 Opening (for vacuum)

807 (Vacuum) Distribution Chamber

808 receiving element

809 Bracket

804, 810 Replicated module on residual carrier layer

900 Carrier element for integration of a fluid chip

901 Component holder

910, 920 Versions of a module

1000 carrier element for fiber for fiber coupling

1002 lens system

1003 Support structure

1004 Optical component

1100 (laser) chip

1101 Bracket for overhead storage

1102 Pre-positioning element

1103 hold-down

1104 Lead-in slope

1105 receiving element

1106 Opening for accessibility from below

1107 (Glass) fiber for passive measurement

1108 Positioning bevel

1109 Survey Marker

1110 Execution of a (chip holding) module

1201 Carrier element without optical structure

1202 module without optical structure

1203 optical element

1204, 1205 Execution of a support element

1206 beam-forming element

1302 volume removed by deep etching

1310 Positioning element

1405,1408 Support element 1406 Beam-shaping element

1510, 1520 Execution of a module/optical structure

1505 optical component in the form of a beam splitter

1506 optical component in the form of an optical deflection element

1502, 1503, 1504 horizontal light beam

1511, 1530 vertical light beam 1601 beam splitter

1602, 1603 ,1604 carrier units

1605, 1606 connecting elements 1610 joining elements 1611 light beam

Claims

Patent claims 1. Micro-optomechanical system (10), comprising - at least two carrier elements (40, 50), each of the carrier elements (40, 50) having at least one connecting element (20, 30), each connecting element (20, 30) having at least one self-centering joining element (300, 310, 320, 330) or being designed as a self-centering joining element (300, 310, 320, 330), the joining elements (300, 310, 320, 330) fitting together in such a way that the carrier elements (40, 50) are mechanically connected to one another by means of the joining elements (300, 310, 320, 330); and - at least two optical components (60, 70), each of the optical Components (60, 70) is attached to one of the carrier elements (40, 50), wherein each of the optical components (60, 70) has at least one optical coupling point (80, 90, 604), wherein at least one of the optical coupling points (80, 90, 604) has at least one by means of a three-dimensional structuring process, and wherein an optical connection of the optical components (60, 70) is present at at least one optical coupling point (80, 90, 604). 2. Micro-optomechanical system (10) according to the preceding claim, wherein the at least one optical connection is present between at least two optical coupling points (80, 90, 604), wherein each of the at least two optical coupling points (80, 90, 604) comprises at least one of the beam-forming elements (100, 110) produced by means of the three-dimensional structuring method. 3. Micro-optomechanical system (10) according to one of the preceding claims, wherein - the joining elements (300, 310, 320, 330) of the carrier elements (40, 50) are mechanically connected to one another by means of a positive connection; and/or - the joining elements (300, 310, 320, 330) of the connecting elements (20, 30) are designed such that they can structurally interlock; and/or - the support elements (40, 50) are detachably or permanently connected to one another while maintaining their shape and functionality. 4. Micro-optomechanical system (10) according to one of the preceding claims, wherein at least two carrier elements (40, 50) are connected to one another such that the at least two optical components (60, 70) and the at least one beam-forming element (100, 110) lie on at least one common optical axis (140). 5. Micro-optomechanical system (10) according to one of the preceding claims, wherein at least one of the carrier elements (40, 50) is provided with at least one metallic layer as an electrical conductor track (200). 6. Micro-optomechanical system (10) according to the preceding claim, wherein - at least one of the support elements (40, 50) is attached to at least one support plane (130); and/or - the support elements (40, 50) are connected to the at least one support plane (130) or the at least two support planes (130) are connected to one another in a detachable or non-detachable manner while maintaining their shape and functionality; and/or - the at least one carrier plane (130) is provided with at least one metallic layer as an electrical conductor track (200). 7. Micro-optomechanical system (10) according to one of the preceding claims, wherein at least one of the carrier elements (40, 50), the at least one optical component (60, 70) attached thereto and the at least one beam-forming element (100, 110) is surrounded by an at least partially solid, optically transparent medium. 8. Micro-optomechanical system (10) according to one of the preceding claims, comprising at least a first carrier element (170), a second carrier element (180) and a third carrier element (190), wherein the first carrier element (170) is connected to the second carrier element (180) and to the third carrier element (190) by means of the connecting elements (20, 30), wherein the at least one optical component fastened to the first carrier element (170) has at least a first optical coupling point (170a) and a second optical coupling point (170b), wherein a first optical connection is present between the first optical coupling point (170a) and an optical coupling point (180a) of the at least one optical component (181) fastened to the second carrier element (180) and at the same time a second optical connection is present between the second optical coupling point (170b) and at least one optical coupling point (190a) of the at least one optical component (181) fastened to the third carrier element (190) attached at least one optical component (191). 9. Micro-optomechanical system (10) according to one of the preceding claims, wherein at least one of the carrier elements (40, 50) has at least one further beam-forming element which is arranged on the carrier element (40, 50) or on one of the optical components (60, 70) fastened to the carrier element (40, 50) or is introduced into the carrier element (40, 50) or into one of the optical components (60, 70) fastened to the carrier element (40, 50). 10. Micro-optomechanical system (10) according to one of the preceding claims, further comprising at least one positioning element which is arranged such that a position of at least one of the optical components (60, 70) on one of the carrier elements (40, 50) is determined by a partial structure, wherein the partial structure is manufactured by means of the same method as the at least one of the optical components (60, 70). 11. Micro-optomechanical system (10) according to one of the preceding claims, further comprising at least one further carrier element to which none of the optical components (60, 70) is attached and which does not comprise any of the beam-forming elements (100, 110). 12. Method for producing a micro-optomechanical system (10), comprising the following steps: a) providing at least two carrier elements (40, 50), each of the carrier elements (40, 50) having at least one connecting element (20, 30), each connecting element (20, 30) having at least one self-centering joining element (300, 310, 320, 330) or being designed as a self-centering joining element (300, 310, 320, 330), the joining elements (300, 310, 320, 330) fitting together in such a way that the carrier elements (40, 50) can be mechanically connected to one another by means of the joining elements (300, 310, 320, 330); b) providing at least two optical components (60, 70), each of the optical components (60, 70) having at least one optical coupling point (80, 90, 604); c) producing at least one beam-forming element (100, 110) at at least one of the optical coupling points (80, 90, 604) by means of a three-dimensional structuring process; d) fastening each optical component (60, 70) to one of the carrier elements (40, 50); and e) producing an optical coupling of the optical components (60, 70) at at least one optical coupling point (80, 90, 604) by means of a mechanical Connection of the support elements (40, 50) by means of the matching self-centering joining elements (300, 310, 320, 330). 13. Method according to the preceding claim, wherein the mechanical connection of the carrier elements (40, 50) takes place by means of a positive connection. 14. Method according to one of the preceding method claims, wherein at least one of the carrier elements (40, 50) and/or at least one of the optical components (60, 70) are produced by means of a three-dimensional structuring method. 15. Method according to one of the preceding method claims, wherein at each of the at least two optical coupling points (80, 90, 604) at least one beam-forming element (100, 110) is produced by means of the three-dimensional structuring method.