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WO2024094534A1 - Élément abrasif, moyen abrasif et procédé pour produire l'élément abrasif et/ou le moyen abrasif - Google Patents

Élément abrasif, moyen abrasif et procédé pour produire l'élément abrasif et/ou le moyen abrasif Download PDF

Info

Publication number
WO2024094534A1
WO2024094534A1 PCT/EP2023/079874 EP2023079874W WO2024094534A1 WO 2024094534 A1 WO2024094534 A1 WO 2024094534A1 EP 2023079874 W EP2023079874 W EP 2023079874W WO 2024094534 A1 WO2024094534 A1 WO 2024094534A1
Authority
WO
WIPO (PCT)
Prior art keywords
grinding
base
abrasive
binder
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2023/079874
Other languages
German (de)
English (en)
Inventor
Johannes Huber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to CN202380076855.XA priority Critical patent/CN120239642A/zh
Publication of WO2024094534A1 publication Critical patent/WO2024094534A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0072—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for using adhesives for bonding abrasive particles or grinding elements to a support, e.g. by gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se

Definitions

  • the invention relates to a grinding element, an abrasive and/or a method for producing the grinding element or the abrasive according to the preamble of claim 1.
  • the invention is based on the object of improving a grinding element, an abrasive and/or a manufacturing process for the same by means of simple constructive measures.
  • a grinding element for an abrasive in particular a flexible abrasive, preferably a grinding wheel, for grinding a workpiece with a base grinding element.
  • the grinding element has an adhesive element arranged on the base grinding element, which is designed in particular as an adhesion promoter.
  • the adhesive element can be designed as an adhesion promoter.
  • the adhesion promoter can, for example, strengthen adhesion between two elements that adhere less well to one another.
  • the adhesion promoter can be arranged between the two elements.
  • the adhesion promoter can increase adhesion of the base grinding element to a binder element, such as a base binder element and/or a cover binder element.
  • the adhesive element can form an adhesion promoter for better bonding of the base grinding element to the binder, in particular base binder element and/or a cover binder element, of the abrasive.
  • the adhesion promoter can in particular be an element which provides a physical and/or chemical bond in an adjacent area of elements that are less easily bondable or unbondable to improve adhesion of these elements.
  • the adhesive element can be designed as a coating.
  • the adhesive element can surround the base grinding element, in particular completely.
  • the adhesive element can be arranged in sections on the base grinding element.
  • the base grinding element can be intended for grinding a workpiece.
  • the base grinding element can have a deforming and/or abrasive effect on a workpiece to be machined.
  • the base grinding element can be designed as an abrasive body.
  • the base grinding element is known to a person skilled in the art as abrasive grain, among other things.
  • a "base grinding element" is to be understood as an element that contacts a workpiece to be machined in a processing state, in particular directly, and that leads to an abrasive removal of material from the workpiece to be machined in a processing state.
  • the base grinding element can be designed as a broken or as a shaped base grinding element.
  • the differences are known to a person skilled in the art. In particular, when using broken It is usually not possible to ensure that the base grinding elements have approximately the same dimensions, in particular longitudinal extensions. This can result in the base grinding elements protruding to different distances on the abrasive and can lead to an uneven grinding pattern or removal. Due to the uneven longitudinal extension and/or shape of the base grinding elements, the base grinding element can tend to break out of the grain, whereby the base grinding element breaks out of a bond to the abrasive. This can result in a grinding element with, for example, one or more planar surfaces and/or a generally stubborn shape, in particular due to a weak chemical bond, breaking out of the abrasive.
  • the base grinding element is not limited to a specific base grinding element.
  • the base grinding element can be, for example, corundum (in various variants, in particular white corundum, semi-precious corundum, blue corundum, zirconium corundum, ceramic corundum and/or brown corundum), silicon carbide, cubic boron nitride, diamond or mixtures thereof.
  • the grinding element may have a support element arranged on the base grinding element for supporting the base grinding element.
  • the support element can be designed as a filling element.
  • the support element can be designed as a support grain. It is understood that a single or a plurality of support elements can be arranged on the base grinding element. In particular, the support elements can be distributed, in particular evenly, over the, in particular entire, outside, in particular outer surface or surface, of the base grinding element.
  • the support element can be arranged directly or indirectly on the base grinding element and in particular contact the base grinding element.
  • the support element can be formed, for example, from white corundum, zirconium corundum or the like.
  • the support element can be made of the same material or the same
  • the support element can be made smaller than the grinding element.
  • the support element can be made from a broken grain.
  • the support element can be made from the remains of grinding elements. In this case, residues of the grinding element can be used which are not suitable for use as a grinding element due to their size, shape and the like, such as rejects from the production of a broken grinding element. This makes it possible to achieve a particularly reliable support effect.
  • the adhesive element may be designed as a coating surrounding the base grinding element.
  • the adhesive element can surround the base grinding element, in particular completely.
  • the adhesive element can surround the support element, in particular completely.
  • the adhesive element can be designed as a connecting element between the base grinding element and the binder element, in particular the base binder element and/or the cover binder element, of the abrasive.
  • the adhesive element may surround the base grinding element and/or the support element, in particular completely.
  • the adhesive element can be arranged between the base grinding element and the support element.
  • the adhesive element can envelop the base grinding element and the support element. This can provide a particularly strong connection.
  • the adhesive element may hold a plurality of support elements on the base grinding element.
  • the support elements can be arranged on an outer region of the base grinding element.
  • the support elements can be arranged distributed over the entire outer region of the base grinding element.
  • the support elements can be arranged in sections on the base grinding element, for example in a section which is not intended for machining a workpiece.
  • the support elements can be arranged substantially spaced apart from one another.
  • the support elements can be arranged from the The support elements can be arranged on the base grinding element and/or in particular surrounded by the adhesive element in such a way that a large number of uneven surfaces of the grinding element result. This can increase the anchoring of the grinding element to the abrasive.
  • the base grinding element may be made of a natural and/or synthetic diamond.
  • the base grinding element may also be made of other carbon modifications that appear appropriate to a person skilled in the art and are suitable for the purpose of a base grinding element.
  • the base grinding element may also be made of other materials that appear appropriate to a person skilled in the art.
  • the base grinding element may be made of a mineral and/or ceramic material, for example corundum, silicon carbide, boron nitride or the like.
  • the base grinding element may be made of aluminum oxide particles with a particle size of between 7 pm and 300 pm.
  • the base grinding element may have any geometric configuration that appears appropriate to a person skilled in the art.
  • the base grinding element may be a so-called shaped base grinding element or a broken base grinding element.
  • a base grinding element causes friction and temperature development on the object to be processed, which has a deforming and/or abrasive effect on or in the object to be processed.
  • the base grinding element which is made in particular from a diamond, can have a low chemical bond to the phenolic resin due to a typically blocky shape or surface and a large number of flat surfaces (no structured surfaces), which can lead to cracks in the abrasive or between the base grinding element and phenolic resin during a machining process. Small gaps between the base grinding element and the binder element can quickly lead to the grinding element breaking out of the abrasive due to the lack of structured surfaces.
  • the adhesive element may be made of a polyurethane, in particular a two-component polyurethane. This achieves good adhesion to a diamond surface, for example, and in particular better adhesion than to a grinding element coated with phenolic resin.
  • a poor chemical bond between the base grinding element and the binder element (base binder element, cover binder element) of an abrasive can be compensated for or improved by the adhesive element.
  • the adhesive element can serve as an adhesion promoter between the base grinding element made of diamond and the binder element of the abrasive made of phenolic resin.
  • the adhesive element can absorb shocks due to its tough-elastic properties, which can prevent or reduce the breakage of grinding elements. This allows the base grinding element to be better held to the abrasive.
  • one, in particular each, extension of the base grinding element may be at least 100%, in particular at least 200%, preferably at least 250%, preferably at least 300%, particularly preferably at least 350%, larger than one, in particular each, extension of the support element.
  • One, in particular each, volume of the base grinding element may be at least 100%, in particular at least 200%, preferably at least 250%, preferably at least 300%, particularly preferably at least 350%, larger than one, in particular each, volume of the support element.
  • an extension is to be understood in particular as an average extension of a plurality of elements and a volume as an average volume of a plurality of elements. This makes it possible to achieve a particularly reliable support effect. It may be expedient for the average size of the support elements to be smaller than the average size of the grinding element or the base grinding element. This allows the support elements to evenly cover both the surfaces of the base grinding element and the gaps between them.
  • the ratio of the average diameter of the base grinding elements to the average diameter of the base grinding elements can be smaller, in particular smaller than 10, in particular smaller than 5, preferably smaller than 3 and more preferably smaller than 2.
  • the support element can be arranged directly or indirectly on the base grinding element.
  • the support element can be arranged adjacent to the base grinding element.
  • the support element can be provided to support the base grinding element in a state of use.
  • the support element can be provided to increase a strength, a heat resistance and a toughness of the abrasive.
  • the support element can be provided for admixture with the base grinding element.
  • the support element can be arranged between two base grinding elements.
  • the support element can be provided to increase a surface or an outer surface of the base grinding element in order to prevent the base grinding element from breaking out.
  • the support element can be provided to reduce or prevent a deflection of the base grinding element, in particular in a state of use, in order to achieve a better grinding effect.
  • the support element can have a high mechanical strength.
  • the support element can be provided as an admixture with the base grinding element.
  • An invention further relates to an abrasive, in particular a flexible abrasive, preferably a grinding wheel, for grinding a workpiece with a grinding element.
  • the abrasive may have a longitudinal extension or - in the case of a disc - a diameter of up to 500 mm, in particular up to 400 mm, preferably up to 300 mm, more preferably up to 200 mm, particularly preferably up to 170 mm, such as 150 mm or even less.
  • the abrasive can have a thickness of up to 5 mm, in particular up to 3 mm, preferably up to 2 mm, preferably up to 1 mm, particularly preferably up to 0.5 mm, such as 0.4 mm or even less.
  • the abrasive can be designed to be flexible.
  • the term “flexible” is understood to mean in particular being made from a flexible material or containing this material.
  • the abrasive may be expedient for the abrasive to have a, in particular flexible, carrier element for arranging the abrasive element, in particular by means of a binder element.
  • the abrasive can be particularly suitable for hard and abrasive workpieces, such as concrete floors.
  • the grinding element can be largely incorporated or embedded in the binder element, in particular the cover binder element.
  • the binder element can wear out during the machining process to expose the base grinding elements. Further wear of the binding element, in particular the cover binder element, can be prevented by the exposed base grinding elements.
  • support elements that are located on the exposed surface of the base grinding element can also be removed, while the other support elements that are located on the side facing away from the workpiece are not affected.
  • the abrasive can have a plurality of abrasive elements on one side, in particular a surface, of the carrier element.
  • the abrasive elements can protrude from the carrier element and/or limit the abrasive.
  • the abrasive is used for grinding or abrasive processing of a workpiece, in which material of the workpiece is mechanically removed from the surface of the workpiece in the form of chips.
  • the abrasive can be a coated abrasive or a composite abrasive comprising foam and a face material or a foam abrasive.
  • alternative abrasives are also conceivable, such as bonded abrasives, which are in particular typically resin-bonded cutting and grinding discs.
  • the abrasive can be designed as sandpaper.
  • the abrasive can be coated (C, coated abrasive) or uncoated.
  • the abrasive can be available in different forms, for example as a grinding disc or as a grinding belt, as a sheet, roll, strip or even as abrasive article web (e.g. in production).
  • the abrasive article can be manufactured for use with grinding machines such as eccentric sanders or by hand sanding.
  • the abrasive article can be realized as a hand sanding sheet, as a grinding belt or as a grinding disc covered with velour.
  • the binder element can have a base binder element and/or a cover binder element.
  • the base binder element can be provided to cover the carrier element and/or the grinding element.
  • the cover binder element can be provided to cover the carrier element, the base binder element and/or the grinding element.
  • the base binder element and/or the cover binder element can be formed as layers on the carrier element.
  • a “base and/or cover binder element” is to be understood as a material or mixture of materials that is arranged in a particularly flat, extended manner and that is arranged in the normal direction of a main extension surface of a carrier element of the abrasive, in particular directly, between a surface of the carrier element of the abrasive and the grinding element(s).
  • the base and/or cover binder element can be used to form a material-locking Connection of the grinding element(s) and the carrier element of the abrasive can be provided. This makes it possible to achieve a preferably good and reliable adhesion and material-locking connection of the base and/or cover binder element on the at least one surface of the at least one base body of the grinding unit.
  • the carrier element of the abrasive can have any base that is common in the abrasive industry, in particular a flexible base.
  • the carrier element can be made, for example, of a textile, a fabric, a knitted fabric, a knitted fabric, a braid, a paper, a cardboard, a film, a vulcanized fiber, etc. or a combination thereof.
  • the carrier element can be formed from one or more layers.
  • the carrier element can preferably be formed from at least one paper material and/or from one fabric material and/or from one film material.
  • paper is to be understood in particular as a material that is at least partially made from fibers, in particular from plant fibers, preferably at least partially by felting and gluing, and is at least partially pressed into a layer, in particular a thin and smooth layer.
  • fabric material is to be understood in particular as a material that is at least partially woven and consists of intersecting fibers, in particular threads.
  • a “film material” is to be understood in particular as a material which consists at least partially of at least one metal, of at least one metal alloy and/or of at least one plastic and which is at least partially produced in, in particular very thin, webs.
  • the carrier element can serve as a carrier layer and give the abrasive specific properties in terms of adhesion, elongation, tear and tensile strength, flexibility and stability.
  • the abrasive elements can be applied to and fixed on the carrier layer.
  • the abrasive elements can be arranged and/or bonded to the carrier element by means of a base binder element known per se.
  • a base binder element known per se.
  • the base binder element can be used to pre-fix the abrasive grains in the desired position and distribution on the carrier element.
  • suitable base binder elements for attaching grinding elements to the carrier element is well aware of suitable base binder elements for attaching grinding elements to the carrier element.
  • the abrasive can contain one or more cover binder elements, in particular layers of cover binder elements.
  • the lower cover binder element is usually referred to as "cover binder 1" or “size coat” and the upper cover binder element as “cover binder 2" or “supersize coat”.
  • the uppermost cover binder element can be unhardened, i.e. the cover binder element that forms the outermost layer and faces away from the carrier element of the abrasive.
  • the cover binder element(s) can be applied in particular in layers to the base binder element and the grinding elements.
  • the cover binder element(s) firmly connects the grinding elements to one another and firmly to the carrier element.
  • the abrasive can have a first side, in particular a holding side, and a second side facing away from the first side, in particular a grinding side.
  • the abrasive can be delimited on the holding side by a holding surface.
  • the abrasive can be delimited on the grinding side by a grinding surface.
  • the holding side can have a fastening means.
  • the fastening means can be provided for arranging the abrasive on a machine tool, in particular a grinding disc of a machine tool.
  • the fastening means can have a mechanical connecting element such as a Velcro fastening element, a screw fastening element or a clamp fastening element.
  • the fastening means can have an adhesive connecting element such as an adhesive fastening element.
  • the base binder element and/or the cover binder element may be made of a synthetic resin, in particular a phenolic resin. Synthetic resins such as phenolic resin, epoxy resin, Urea resin, melamine resin, polyester resin, or the like.
  • the base binder element and the top binder element can also contain other conventional active ingredients and/or fillers.
  • An invention further relates to a method for producing a grinding element for an abrasive, in particular a flexible abrasive, comprising the following steps:
  • the base grinding elements and the support elements can be provided in suitable numbers and quantities.
  • the base grinding elements and the support elements can be in bulk form.
  • the adhesive element, which in particular creates the material bond, can be in liquid, viscous, pasty or similar forms.
  • a mixing device can be used to create a material-locking connection between the support element and the base grinding element. Suitable mixing devices are known to a person skilled in the art.
  • the mixing device can have a receiving unit for receiving the mixed material, in particular the base grinding element, the support element and the adhesive element.
  • the receiving unit can be in a receiving state in which the receiving unit is open to receive mixed material.
  • the receiving unit can be in a closed state in which the receiving unit seals the mixed material and in particular avoids or prevents the mixed material from accidentally escaping from the receiving unit.
  • the receiving unit can be designed as a receiving drum.
  • the mixing device can have a mixing unit for mixing the mixture.
  • the mixing unit can have a mixing element.
  • the mixing element can be designed as a screw mixer, a paddle mixer or the like.
  • the mixing element can be arranged, in particular completely, in the receiving unit.
  • the mixing element can be mounted so that it is movable or immovable relative to the receiving unit.
  • the mixing element can come into contact with the material to be mixed directly or indirectly.
  • the mixing device can have a drive unit.
  • the drive unit can drive the receiving unit and/or the mixing unit, in particular the mixing element, and move them relative to one another.
  • the mixing unit can transfer a suitable mixing movement of the receiving unit and/or the mixing unit to the material to be mixed in order to mix the material to be mixed. It goes without saying that other mixing principles that appear sensible to a person skilled in the art can also be used.
  • the coating of the grinding elements with the support elements can be carried out by mixing the grinding element with the support element and the adhesive element to be used at room temperature.
  • the adhesive element, in particular together with the support element can be distributed on the grinding element, in particular relatively homogeneously, due to the surface tension.
  • the grinding element can be made from, in particular, 30 g of diamond, in particular 6 g of white corundum, in particular 1.5 g of adhesive element (Huntsmann ABR8910).
  • the grinding element can be made from, in particular, 30 g of diamond, in particular 4 g of white corundum, in particular 1 g of adhesive element (Huntsmann ABR8910).
  • the mixture can be cured using a curing unit. Suitable curing principles and curing units are known to a person skilled in the art.
  • the mixture can be cured during the mixing process or after the mixing process.
  • the mixed material can be cured in a heating unit, in particular in an oven unit, at a temperature of more than 50 °C, in particular more than 100 °C, preferably at more than 130 °C, such as 140 °C.
  • the mixed material can be cured for more than 5 minutes, in particular for more than 8 minutes, such as 10 minutes, using the heating unit.
  • the base grinding elements coated with the adhesive element can be bonded to other base grinding elements.
  • an electrically conductive material could be applied to the coated base grinding element or the grinding elements.
  • the electrically conductive material can be in the form of an organic compound.
  • the organic compound can be in the form of at least one ionic liquid and/or a conductive polymer. It is conceivable that the organic compound is either applied to the abrasive grain in pure form and/or as a solution dissolved in a solvent, for example water.
  • abrasive grain is disclosed in patent application DE102017204605A1. In this regard, reference is made to application DE102017204605A1, the content of which is hereby incorporated into this application. This can increase the bounce of the coated base grinding elements or the grinding elements.
  • the grinding elements can be individually connected, in particular due to the adhesive element.
  • the connected grinding elements can be broken and separated using a separating unit, in particular with low force.
  • the separating unit can have a separating element for separating the bonded mixed material.
  • the separating element can be designed as a separating ball.
  • the separating ball can apply a mechanical force, in particular a light one, to the mixed material in order to break or separate the bonded base grinding elements or grinding elements from one another.
  • the separation element can be added to the receiving unit after the curing step in order to be able to carry out the separation process.
  • the mixed material can be rotated in the heating unit, in particular the oven unit, during the curing process, for example in the or another receiving unit, in particular designed as a receiving drum. This could reduce or prevent the mixed material or the coated base grinding elements or the grinding elements from sticking together.
  • the non-separated grinding elements can be separated from the separated grinding elements using a sieve unit.
  • the non-separated grinding elements (sieve residue) can be fed to the separating unit.
  • An invention further relates to an abrasive, in particular a flexible abrasive, preferably a grinding wheel, for grinding a workpiece with a, in particular flexible, carrier element for arranging a grinding element.
  • abrasive in particular a flexible abrasive, preferably a grinding wheel, for grinding a workpiece with a, in particular flexible, carrier element for arranging a grinding element.
  • the abrasive has a through-recess for receiving a grinding element.
  • the through-recess can extend through the entire carrier element.
  • the through-recess can extend from one side of the carrier element to a side of the carrier element facing away from the one side.
  • the through-hole can be provided for receiving a grinding element.
  • the through-hole can be designed as a receiving opening for receiving a grinding element.
  • the through-hole can limit an arrangement of a grinding element on the abrasive.
  • the through-hole can align the grinding elements.
  • the through-hole can support the grinding element laterally.
  • the through-hole can be designed such that the grinding element is held directly or indirectly in the through-hole.
  • the grinding element can be more strongly bonded to the separating element, which can reduce or prevent the breakout of grinding elements (grain breakout).
  • the grinding element can be arranged "deeper" in a binder element, in particular surrounded by it. In particular, this allows a thinner layer of a binder element to be achieved. This allows the abrasive to be more flexible.
  • the through-holes can be arranged at a distance of at least 1 mm, in particular at least 2 mm, from one another.
  • the through-hole, in particular each through-hole can have a hole diameter of at least 0.1, in particular of at least 0.3 mm, preferably of at least 0.5 mm.
  • the carrier element can have a material thickness of at least 1 mm, in particular at least 2 mm, preferably at least 5 mm.
  • the hole diameter of the through-hole and the material thickness of the carrier element can be adapted to the grinding element, in particular a size of the grinding element (grain size). This allows a desired Amount of abrasive elements (grain quantity) can be applied. This means that the quantity of abrasive elements can be very constant and independent of the duration of a spreading process of abrasive elements.
  • the through-hole can be introduced into the carrier element by means of a punching process, a laser process, a piercing process (for example needle roller) or the like.
  • a bead can be created in the carrier element.
  • the bead can surround the through-hole.
  • the bead can be arranged on the back or on the holding side of the abrasive or the carrier element 31.
  • the bead can be designed as a raised area arranged around the through-hole and/or delimiting the through-hole.
  • the bead can form a depression on a grinding side, in particular associated with the bead.
  • the bead, in particular the depression of the bead can align the grinding elements optimally.
  • the grinding element arranged in the through-hole can be aligned particularly advantageously by means of the bead.
  • the abrasive may be expedient for the abrasive to have a base binder element for arranging the grinding element on the carrier element, in particular in the through-hole of the carrier element.
  • the base binder element can be provided for holding the grinding element in the through-hole.
  • the base binder element can fix the grinding element in the through-hole. This can prevent the grinding element from breaking off (grain breakage).
  • the base binder element may be arranged in the through-hole.
  • the base binder element can fill the through-hole, in particular completely.
  • the base binder element can limit the through-hole.
  • the base binder element can limit an extension of the through-hole through the support element.
  • the base binder element can be arranged in the area of a side of the carrier element facing away from the grinding side. This allows a grinding element to be held particularly advantageously in the through-hole.
  • the base binder element may be arranged on the through-hole.
  • the base binder element can be arranged on a side facing away from the grinding side.
  • the base binder element can delimit the through-hole, in particular on a side facing away from the grinding side.
  • the through-hole element can cover the through-hole, in particular completely.
  • the base binder element can be designed as a film element, in particular an adhesive film element, which is arranged on the side of the carrier element facing away from the grinding side.
  • the base binder element can be connected to the carrier element over its entire surface.
  • the grinding elements arranged in the through-hole mean that support elements are not required. This is particularly true because the grinding elements can be supported by the carrier element that delimits the through-hole. In particular, a chip space for grinding dust can be enlarged, which can prevent susceptibility to clogging. In addition, the grinding element or elements can be better aligned.
  • the carrier element may have a coating, in particular an electrically conductive coating, for aligning the grinding element, in particular in an electrostatic field.
  • the coating can be arranged on a side of the carrier element facing away from the grinding side.
  • Such coated carrier elements are available, for example, from the company Ahlstrom-Munksjö.
  • an electrostatic force can have a stronger effect in the breakthrough recess than in adjacent areas, whereby the grinding element is preferably attracted into the breakthrough recess.
  • the base binder element may be arranged in solid form and/or in the form of a film on a side of the carrier element facing away from the grinding side.
  • An invention further relates to a method for producing an abrasive, in particular a flexible abrasive, in particular according to one of the preceding claims, comprising the following steps:
  • a base binder element may be arranged in one step on a side of the carrier element and/or the through-hole facing away from the grinding side.
  • the base binder element should not be applied as usual on the grinding side of the carrier element, but on a side of the carrier element facing away from the grinding side or on the holding side of the carrier element.
  • the base binder element can be applied to the carrier element and/or to the through-hole using a doctor blade method.
  • the base binder element can be applied to the carrier element in a liquid, particularly viscous, preferably pasty, state.
  • the base binder element can get stuck in the through-hole due to its state and surface tension.
  • the base binder element can be applied to the entire surface of the carrier element.
  • the base binder element can coat the entire surface of the carrier element.
  • a layer or film of the base binder element can remain on the carrier element.
  • another layer can be applied to the base binder element, such as a velour, a cover paper, an anti-slip coating can be applied or laminated.
  • the base binder element can be designed as a film element, in particular an adhesive film element.
  • the film element can be arranged or glued to the carrier element on the side of the carrier element facing away from the grinding side. This allows the carrier element to be designed to be essentially "tight" so that residues of a binder element on a side facing away from the grinding side can be avoided. These residues can contaminate production rollers and complicate the production process. This means that curing/drying/deactivation of the base binder element arranged on the side facing away from the grinding side can be saved. Furthermore, the use of a liquid base binder element can be avoided.
  • a manufactured abrasive When using a binder element designed as a film element, a manufactured abrasive can be rolled up and stored without a protective film element, such as wax paper, since the base binder element, such as a self-adhesive, can be held in the through-hole.
  • a protective film element such as wax paper
  • a hot melt layer can be applied to the back of the perforated paper. This can either be sprinkled on from the opposite side immediately while still hot, or heated up again before the sprinkling process, e.g. with an IR radiator. The layer can also be used at the same time to apply a velour.
  • an open fabric e.g. 50g/m2
  • an adhesive film is applied on the back.
  • the grains then remain stuck in the fabric during the scattering process.
  • the process has the advantage that a "net” is incorporated and the abrasive thus acts as a «Net abrasive» could be marketed.
  • an adhesive film, hot melt coating or liquid coating can also be used as the adhesive layer (note: the advantage of the high final flexibility of the abrasive is lost with this variant).
  • the carrier element may be sprinkled with a plurality of abrasive elements in one step, in particular by means of electrostatics or compressed air.
  • the grinding elements can be electrostatically scattered onto the carrier element.
  • the grinding elements are electrostatically charged in an external electric field through electrostatic interaction with this external electric field and accelerated onto the carrier element.
  • Grinding elements that are aligned essentially parallel to the abrasive, in particular to the grinding surface, can be rejected by the grinding elements discharging themselves on the carrier element and falling back. This can result in particularly advantageous bundles of grinding elements that are bonded together using the binder element arranged in or behind the opening.
  • the curing of the base binder element and the application of the cover binder element can be carried out in the traditional way, i.e. thermally, 2K, UV, etc., and are known to a person skilled in the art.
  • the quantity of grinding elements can be determined by the hole diameter of the breakthrough recess and the quantity of base binder elements arranged on the carrier element.
  • the grinding elements can be scattered onto the carrier element pneumatically, in particular using compressed air.
  • the grinding elements are then flowed around and around by compressed air and accelerated onto the carrier element.
  • the grinding elements can thus be blown into the opening recess using compressed air.
  • the base binder element can be dispensed with and the grinding elements can be sucked into the opening recesses from the holding side of the carrier element.
  • compressed air pulses on the grinding side of the carrier element can be used to prevent build-up of grinding elements - similar to a filter that is deliberately clogged with abrasive grain.
  • the grinding elements can be scattered onto the carrier element mechanically or gravimetrically.
  • Mechanical scattering is understood to mean in particular that the grinding elements are scattered onto the carrier element by mechanical acceleration. This can be done, for example, using a rotating centrifugal accelerator, i.e. similar to a rotating disk in which the grinding elements are accelerated radially outwards.
  • gravimetric scattering can be achieved using a “slide”.
  • Grammetric scattering is understood to mean that the grinding elements are scattered onto the carrier element under the influence of gravity.
  • the sieve is made of metal and is operated as a high-voltage electrode during electrostatic scattering.
  • a counter electrode for electrostatic scattering of the grinding elements can be arranged, for example, behind the carrier element, in particular behind a carrier element web, or through the carrier element, in particular through the carrier element web, itself. can be implemented, provided that it is electrically conductive or has an electrically conductive (e.g. aqueous or carbon black-filled) binder element. In this way, a particularly effective electrostatic scattering of the grinding elements can take place, whereby the risk of agglomeration of, for example, previously deagglomerated grinding elements can be largely avoided.
  • An invention further relates to an abrasive, in particular a flexible abrasive, preferably a grinding wheel, for grinding a workpiece with a, in particular flexible, carrier element for arranging a grinding element by means of a base binder element.
  • abrasive in particular a flexible abrasive, preferably a grinding wheel, for grinding a workpiece with a, in particular flexible, carrier element for arranging a grinding element by means of a base binder element.
  • the abrasive has an adhesion limiting element arranged on the carrier element for limiting an arrangement of the base binder element on the carrier element.
  • the adhesion limiting element can reduce or prevent an arrangement of the base binder element on the carrier element.
  • the adhesion limiting element can reduce or prevent an arrangement of an abrasive element on the carrier element.
  • the adhesion limiting element can be provided to displace or repel a base binder element arranged on the carrier element, in particular so that the adhesion limiting element does not come into contact with the base binder element.
  • the adhesion limiting element can be designed as a type of “anti-adhesion element” or “adhesive stop element”.
  • the adhesion limiting element can be arranged partially on the carrier element and cover part of the carrier element.
  • the adhesion limiting element can be arranged directly or indirectly on the carrier element.
  • the adhesion limiting element can extend along one, in particular the entire extent, of the abrasive. It may be expedient for the abrasive to have a grinding area and a free area adjacent to the grinding area.
  • the grinding area can be formed or delimited by the free area.
  • the grinding area can be formed by a base binder element delimiting the grinding area.
  • the base binder element in particular each base binder element, can form or delimit the grinding area.
  • the grinding area can be formed from a plurality of base binder elements, in particular arranged at a distance from one another.
  • the base binder elements can be designed as base binder element points.
  • the base binder elements can be designed in the form of islands, in particular base binder islands.
  • the base binder elements can have an extension or a diameter of less than 3 mm, in particular less than 2 mm, preferably less than 1 mm, such as 0.7 mm.
  • the base binder element can be formed from or consist of a phenolic resin, urea resin, polyurethane resin, polyester resin, optionally also UV-curing, etc.
  • the base binder element can be cured in a material-specific manner or depending on the base binder element used.
  • the grinding area can be formed from a base binder element and/or from a plurality of base binder elements.
  • the grinding area can be formed from several base binder elements spaced apart from one another.
  • the base binder elements in the grinding area can be arranged in a close order or in a group.
  • the base binder elements can accommodate a plurality of grinding elements and hold them, in particular bundled, on the carrier element.
  • areas or channels can be provided in the grinding area between the base binder elements which are free of a base binder element or grinding elements. These areas or channels can be provided for optimal dust transport.
  • the grinding area may be surrounded by the free area.
  • the grinding area and the free area can have different visual properties.
  • the free area can be designed free of the, in particular any, basic binder element.
  • the grinding area and the free area, in particular their boundaries to one another, can form a contrast.
  • the contrast can form the information pattern. This makes it possible to provide information to the user in a particularly simple manner.
  • the adhesion limiting element can be arranged on the, in particular on all, free areas of the carrier element.
  • the adhesion limiting element can form the free areas.
  • the adhesion limiting element can be printed on the carrier element.
  • the base binder element can be applied to the carrier element in particular over the entire surface, preferably over the entire surface, in particular rolled on using a roller.
  • the area, in particular the free area, of the carrier element that is not intended to receive a base binder element can be printed using the adhesion limiting element.
  • the base binder element arranged on the adhesion limiting element (free area) can retract to an area, in particular a grinding area, of the carrier element that is not coated by the adhesion limiting element.
  • the abrasive element adheres to the area of the carrier element on which the base binder element is arranged.
  • a cover binder element can also be applied, in particular over the entire surface, preferably over the entire surface, to the carrier element, in particular rolled on using a roller.
  • the area, in particular the free area, of the carrier element which is not intended to receive a cover binder element can be printed using the adhesion limiting element.
  • the cover binder element arranged on the adhesion limiting element (free area) can retract to an area, in particular a grinding area, of the carrier element which is not coated by the adhesion limiting element.
  • the Cover binder element back to the grinding areas (with grinding elements), where the cover binder element is additionally attracted by the capillary forces between the grinding elements.
  • microscopically small droplets (not visible to the naked eye) of a binder element, in particular a base binder element, can be detected on the adhesion limiting element, in particular on which no abrasive element is arranged.
  • a surface tension can be measured in the areas of the adhesion limiting element.
  • adhesion limiting element may have a viscosity adapted to the base binder element.
  • the abrasive can have an opening, in particular a suction opening, for suctioning off grinding dust, the suction recess being delimited by the adhesion limiting element.
  • the opening can be arranged in the free area.
  • the opening can be spaced from the grinding area.
  • the opening can extend through the carrier element, in particular through the entire abrasive.
  • the opening can be designed as an opening.
  • an "opening" is to be understood in particular as a continuous hole, in particular through the entire material thickness of the abrasive.
  • the opening can be designed as a round hole.
  • the opening can have a diameter of up to 10 mm, in particular up to 7 mm, preferably up to 5 mm, preferably up to 4 mm, particularly preferably up to 3 mm, such as 2.4 mm or even less.
  • the opening and the grinding area can delimit the free area.
  • the opening can be surrounded by the free area, in particular completely, preferably in a plane by 360°.
  • the opening can be limited by the free area.
  • the opening can have an extension and the free area can have an extension, wherein the, in particular each, extension of the opening is smaller than the, in particular each, extension of the free area. This makes it particularly advantageous to punch an opening into the free area, provided that the extension of the free area is larger than the opening to be provided.
  • the base binder element may be formed from more than 40% by weight, in particular more than 50% by weight, preferably more than 55% by weight, and/or less than 80% by weight, in particular less than 70% by weight, preferably less than 65% by weight.
  • a further embodiment of the invention comprises a method for producing an abrasive, in particular a flexible abrasive, comprising the following steps: - providing a carrier element for arranging an abrasive element on the carrier element and
  • the base binder element may be attached to the carrier element, in particular over its entire surface, in one step, in particular by means of a rolling process.
  • the carrier element may be sprinkled with a plurality of abrasive elements in one step, in particular by means of electrostatics or compressed air.
  • An invention further relates to a method for producing an abrasive, in particular a flexible abrasive, comprising the following steps: - providing a carrier element for arranging an abrasive element on the carrier element and - providing a pad printing element and/or a silicone roller element for arranging a base binder element on the carrier element.
  • the pad printing element and/or the silicone roller element can be provided for receiving the base binder element.
  • the pad printing element and/or the silicone roller element can be provided for holding the base binder element.
  • the pad printing element and/or the silicone roller element can be provided for arranging or releasing the base binder element on the carrier element.
  • the pad printing element and/or the silicone roller element can be formed from a material, in particular an elastic material, in particular a silicone material, preferably a silicone rubber.
  • the base binder element can be arranged on the carrier element using a pad stamp element by means of a pad printing process or using a silicone roller element by means of a silicone rolling process.
  • the pad printing process can be carried out as an indirect deep-drawing process.
  • the base binder element can be transferred to the carrier element by pressing it with varying degrees of contact force.
  • the base binder element can be transferred to the carrier element by means of a contact pressure of the pad printing element and/or the silicone roller element, in particular by means of a contact pressure force.
  • the base binder element which is applied to the carrier element in particular by means of the pad printing process and/or the pad rolling process, can have an edge region at which the base binder element is flat which usually indicates the use of such a procedure.
  • the base binder element can also be used on non-flat, particularly complex-shaped, surfaces of a carrier element.
  • a carrier element can be made of, for example, plastic, rubber, glass, ceramic, paper, wood, metal and many other materials.
  • a common alternative could be a silicone tampon element in a silicone roller
  • the rollers are driven by worm gear motors.
  • the rollers are operated using a double foot switch for forward and reverse motion in inching mode.
  • rope pull switches are used, which are located directly in front of the feed points and, when triggered, result in the immediate stop of the drive and the pneumatic opening of the roller gap (>120mm).
  • a printing plate element for imaging a printing form, in particular a negative printing form.
  • the printing plate element can have a printing recess for receiving the base binder element.
  • the printing plate element can be made of a metal, in particular a steel, or a plastic.
  • the printing plate element can be referred to as a cliché.
  • the printing plate element can be limited by the printing recess.
  • the printing recess can be limited by 360° in a plane by the printing plate element.
  • the printing plate element can be adapted to the carrier element. in particular one adapted to the shape, preferably to the surface, of the carrier element.
  • the pressure recess can be formed on the pressure plate element, for example, by means of a milling process.
  • the printing plate element in particular the printing recess, can form a printed image, in particular a negative printed image.
  • the printed image can be transferred to the carrier element by means of the pad stamp element.
  • a raking element in particular a box raking element, is provided for arranging the base binder element on the printing plate element, in particular the printing recess of the printing plate element.
  • the doctor element can be provided to arrange the base binder element on the printing plate element, in particular in the printing recess.
  • the doctor element can be provided to receive the base binder element.
  • the doctor element can be provided to strip a viscous element, in particular a base binder element.
  • the power supply requires 3x400V/50Hz supply voltage and compressed air (6 bar).
  • cover binder element may be provided, wherein the cover binder element is arranged on the carrier element, in particular completely, in particular by means of a rolling process.
  • An invention further relates to an abrasive, in particular flexible abrasive, preferably grinding wheel, for grinding a workpiece with a, in particular flexible, carrier element for arranging a grinding element by means of a base binder element and with a Cover binder element for covering the grinding element and/or the base binder element.
  • the abrasive may be expedient for the abrasive to have a first recess, in particular a first slot recess, which is arranged in the base binder element and/or the cover binder element.
  • the recess can be designed as a type of predetermined breaking point.
  • the recess can delimit the cover binder element.
  • the recess can delimit the base binder element.
  • the recess can separate the base binder element and/or the cover binder element from one another.
  • the recess can define a bending edge of the abrasive.
  • the recess can be delimited by the carrier element.
  • the recess can extend relative to a thickness of the abrasive by at least 20%, in particular by at least 30%, preferably by at least 40%, preferably by at least 50%, particularly preferably by at least 60%, and/or by at most 90%, in particular by at most 80%, preferably by at most 70%, preferably by at most 60%.
  • the recess can be arranged in particular in one, in particular in every, area which is free of one, in particular every, grinding element.
  • the recess can be arranged at a distance from one, in particular every, grinding element.
  • the abrasive is usually deflected.
  • the deflection takes place around a radius, for example by means of a type of roller, in particular a rubber roller.
  • a type of roller in particular a rubber roller.
  • the cover binder element is deflected in such a way that cracks form in the cover binder element, thereby achieving increased flexibility of the entire abrasive.
  • These cracks are usually referred to as flex cracks.
  • flex cracks are disadvantageous because the flex cracks preferably occur at the weakest points of the abrasive and therefore directly on the grinding elements, which can promote breakage of the grinding elements (grain breakage).
  • the thickness of the abrasive can be reduced by means of the recess.
  • the thickness of the abrasive can be reduced to the thickness of the carrier element.
  • abrasives particularly thicker ones, which are made from a fabric, a composite, a fiber material, etc.
  • the removal rate of the abrasive can be increased - even when using "hard” binder element preparations.
  • the grinding elements can grind more effectively and fewer grinding elements can be used.
  • the chip space for accommodating grinding particles is increased, which means that the abrasive becomes less clogged.
  • the abrasive is very flexible.
  • the base binder element can be made of, in particular, 60g of aqueous phenolic resin (75%), in particular 40g of chalk and, in particular 30g of water.
  • the viscosity of the preparation can be sufficiently low.
  • the preparation can be highly filled with fillers, in particular despite a low viscosity. This prevents the abrasive element from tipping over after spreading.
  • non-aqueous 2K systems e.g. polyurethane
  • polyurethane e.g. polyurethane
  • first recess may extend, in particular in a straight line, from a first end of the abrasive to a second end of the abrasive facing away from the first end.
  • the abrasive may be expedient for the abrasive to have a second recess, in particular a second slot recess, which is arranged in the base binder element and/or the cover binder element.
  • the abrasive may be expedient for the abrasive to have a third recess, in particular a third slot recess, which is arranged in the base binder element and/or the cover binder element.
  • first recess may be arranged transversely, in particular orthogonally, to the second recess.
  • the abrasive may be expedient for the abrasive to have a first group of grinding elements and a second group of grinding elements and/or a third group of grinding elements, wherein the recess is arranged between the two groups, in particular separating them.
  • An invention further relates to a method for producing an abrasive, in particular a flexible abrasive, in particular according to one of the preceding claims, comprising the following steps: - providing a carrier element for arranging an abrasive element on the carrier element; providing a base binder element for holding the abrasive element on the carrier element; providing a cover binder element for covering the abrasive element and/or the base binder element; forming a recess in the abrasive, in particular the base binder element and/or the cover binder element, by means of a laser cutting process.
  • the entire abrasive in particular the base binder element, the cover binder element and/or the carrier element, can be completely cut through by means of the laser.
  • the recess can extend from one side of the abrasive to a side of the abrasive facing away from the one side.
  • the abrasive may be deflected in one step by means of a rolling element, in particular a flexible one.
  • the rolling element can be arranged on the grinding area of the abrasive.
  • the rolling element can deflect the abrasive along the grinding area of the abrasive.
  • the rolling element can be arranged on an area of the abrasive facing away from the grinding area, a holding area, and/or deflect the abrasive along the area.
  • the abrasive can be pulled over an edge or pressed into the rolling element by means of a rod element, in particular a metal rod element, with a small radius.
  • the binder elements can be made more flexible, for example by means of a polymer dispersion.
  • the flexible cracks should be introduced into the base binder element or the cover binder element at the "predetermined breaking points" formed by the recess.
  • the carrier element may be sprinkled with a plurality of abrasive elements in one step, in particular by means of electrostatics or compressed air.
  • the base binder element may be heated in one step, in particular after an arrangement of the base binder element, in particular for a short time, preferably by means of an IR radiator.
  • An invention further relates to a method for producing an abrasive, in particular a flexible abrasive, in particular according to one of the preceding claims, comprising the following steps: - providing a carrier element for arranging a plurality of abrasive elements on the carrier element; providing a base binder element for holding the abrasive elements on the carrier element and; arranging the abrasive elements in such a way that the abrasive elements, in particular all of them, protrude from the base binder element.
  • the method is intended to enable grinding elements to be placed in a targeted manner.
  • a number of grinding elements to be placed per surface can be defined.
  • all grinding elements can be placed in such a way that the, in particular all, grinding elements protrude from the base binder element.
  • grinding elements of different sizes can occur with broken and/or grown grinding elements, such as diamond.
  • the grinding elements can be aligned in different directions due to a scattering process, such as electrostatic scattering, and therefore protrude at different heights. As a result, only those abrasive grains that happen to protrude the highest come into contact with the workpiece during grinding.
  • the grinding elements may be aligned depending on a grinding plane of the abrasive.
  • the grinding elements can be aligned at a predetermined distance from the carrier element.
  • the grinding elements may be arranged with a first end facing the carrier element and a second end facing away from the carrier element.
  • the second end can be arranged at a predetermined distance from the carrier element, in particular a side or surface of the carrier element facing away from the grinding element.
  • the, in particular all, grinding elements can form a grinding plane which has a predetermined distance from the carrier element, in particular a side or surface of the carrier element facing away from the grinding elements. This allows deviations in a, in particular local, thickness of the carrier element and the base binder element to be compensated. This allows a uniform grinding pattern and a longer service life can be achieved (through a higher number of grinding elements grinding simultaneously).
  • a receiving unit for receiving, in particular electrostatically, the grinding element.
  • the receiving unit can have a plurality of receiving recesses.
  • the receiving recesses can be provided for receiving grinding elements.
  • a single receiving recess can be provided for a single grinding element.
  • the receiving recesses can be spaced apart from one another.
  • the receiving recesses can be designed as through-holes or as blind holes. To better accommodate and stabilize grinding elements, the receiving recesses can be designed in a funnel shape.
  • the receiving unit can be sprinkled with a large number of grinding elements using electrostatics or compressed air.
  • the receiving unit can hold the grinding elements on an outside.
  • the grinding elements can be aligned upright on the receiving unit using electrostatic scattering.
  • the grinding elements can be actively rejected by recharging (discharging) when the receiving unit comes into contact, provided the grinding elements do not hit a receiving recess.
  • the receiving unit can hold the grinding elements on the receiving unit by means of a vacuum.
  • the grinding elements can be held by the receiving unit as long as the grinding elements are in the correct “places” above the receiving recesses. Multiple grinding elements above a single receiving recess (competition for a receiving recess) cause leakage and thus a loss of vacuum. As a result, the holding force for holding the grinding elements can be too low to hold the grinding elements on the receiving unit. As a result, The grinding elements can be electrostatically discharged and, in particular, actively repelled.
  • a delivery unit for, in particular, placing the grinding elements on the abrasive, in particular the base binder element.
  • the grinding elements can be placed or pressed into the base binder element to different extents depending on the size or extent of the grinding elements. This allows the grinding elements, in particular the grinding tips of the grinding elements, to be arranged at a height or on the grinding plane.
  • the grinding element is not discharged by the discharge unit.
  • the base binder element can have a predetermined yield point, which is formed in particular by a pasty state. This can be achieved using fillers such as brown corundum.
  • the adhesive force of the base binder element can be greater than the holding force, particularly due to the negative pressure, on the receiving unit.
  • the negative pressure of the receiving unit can be regulated to finely adjust the holding force.
  • the dispensing unit may be spaced from the carrier element, in particular from a side or surface of the carrier element facing the grinding elements, by a distance that is greater than the thickness of the base binder element. This can ensure that the base binder element does not come into contact with the dispensing unit.
  • the receiving unit and/or the dispensing unit may be designed as a roller unit, in particular as a perforated roller unit.
  • the receiving unit and the dispensing unit can be designed to be electrically conductive.
  • the receiving unit and/or the dispensing unit can be designed as a plate unit, in particular a perforated plate unit.
  • the receiving unit may be useful for the receiving unit to have a non-stick coating.
  • This can prevent soiling and adhesion of a base binder element to areas not covered with grinding elements.
  • the non-stick coating has an electrical conductivity, particularly one that is so low, that it discharges incorrectly placed grinding elements and allows them to fall back. This can be particularly advantageous for fine grinding elements in particular.
  • FIG. 1a to 1e different views of a grinding element
  • Fig. 2 a section through an abrasive
  • FIG. 3a to 3d different views for the production of an abrasive
  • FIG. 4a to 4I different views for the production of an abrasive
  • FIG. 5a to 5h different views for the production of an abrasive
  • FIG. 6a to 6c different views for the production of an abrasive
  • Fig. 7a to 7e different views for the production of an abrasive.
  • Figures 1 b, 1 d to 1 e show a grinding element 11 for a flexible abrasive 15 designed as a grinding wheel (Fig. 2) for grinding a workpiece with a base grinding element 13.
  • the grinding element 11 has an adhesive element 17 arranged on the base grinding element 13, which is designed as an adhesion promoter 17.
  • the adhesive element 17 is arranged between a binder element and a base grinding element in order to increase the adhesion of the base grinding element 13 to a binder element 21, 23, 25. Accordingly, the adhesive element 17 forms an adhesion promoter 17 for a binder element 21, 23, 25.
  • the binder element 21, 23, 25 has a base binder element 23 and a cover binder element 25.
  • the base binder element 23 is provided for covering the carrier element 31 and the grinding element 11.
  • the cover binder element 25 is provided for covering the carrier element 31, the base binder element 23 and the grinding element 11.
  • the base binder element 23 and the cover binder element 25 are formed as layers on the carrier element 31.
  • the adhesive element 17 is designed as a coating.
  • the adhesive element 17 completely surrounds the base grinding element 13, but can also be arranged in sections on the base grinding element 13.
  • the grinding element 11 has a plurality of support elements 29 arranged on the base grinding element 13 for supporting the base grinding element 13 (Fig. 1 d).
  • the support elements 29 are evenly distributed over the entire outer surface or surface of the base grinding element 13.
  • the support element 29 is arranged directly on the base grinding element 13 and contacts it.
  • the adhesive element 17 completely surrounds the base grinding element 13 and the support element 29.
  • the adhesive element 17 is arranged between the base grinding element 13 and the support element 29 and completely envelops the base grinding element 13 and the support element 29.
  • the adhesive element 17 holds a plurality of support elements 29 on the base grinding element 13.
  • the support elements 29 are arranged on an outer region of the base grinding element 13 and are distributed over the entire outer region of the base grinding element 13.
  • the support elements 29 are encased by the adhesive element 17 and are arranged on the base grinding element 13 and surrounded by the adhesive element 17 in such a way that a plurality of uneven surface sections of the grinding element 11 are produced (Fig. 1 d).
  • the base grinding element 13 is intended for grinding a workpiece and has a deforming and/or abrasive effect on a workpiece to be machined.
  • the base grinding element 13 is designed as an abrasive body and is known, among other things, as abrasive grain.
  • the base grinding element 13 can be designed as a broken or as a shaped base grinding element 13. In particular when using broken base grinding elements 13, it cannot usually be ensured that the base grinding elements 13 have approximately the same longitudinal extents (Fig. 2), as a result of which the base grinding elements 13 protrude to different distances on the abrasive 15 and can lead to an uneven grinding pattern or removal.
  • the base grinding element 13 is not limited to a specific base grinding element 13.
  • the base grinding element 13 can be, for example, corundum (in various variants, in particular white corundum, semi-precious corundum, blue corundum, zirconium corundum, ceramic corundum and/or brown corundum), silicon carbide, cubic boron nitride, diamond or mixtures thereof.
  • the base grinding element 13 (Fig. 1a to 1e) is made of a diamond and therefore has a low chemical bond to the phenolic resin due to a typically blocky shape or surface and a large number of flat surfaces (no structured surfaces), which can lead to cracks in the abrasive 15 or between the base grinding element 13 and phenolic resin during a machining process.
  • the adhesive element 17 is made of a two-component polyurethane, which ensures good adhesion to a diamond surface, for example.
  • the adhesive element 17 serves as an adhesion promoter 17 between the base grinding element 13 made of diamond and the binder element 21, 23, 25 of the abrasive 15 made of phenolic resin.
  • each extension of the base grinding element 13 is at least 100% larger than each extension of the support element 29.
  • each volume of the base grinding element 13 is at least 100% larger than each volume of the support element 29.
  • an extension should be understood in particular as an average extension of a plurality of elements and a volume as an average volume of a plurality of elements.
  • the support element 29 is arranged directly on the base grinding element 13.
  • the support element 29 is intended to support the base grinding element 13 in a state of use.
  • the support element 29 is intended to increase the strength, heat resistance and toughness of the abrasive 15.
  • the support element 29 is intended to be mixed with the base grinding element 13.
  • the support element 29 is arranged between two base grinding elements 13 and is intended to space the two base grinding elements apart from one another.
  • the support element 29 is intended to increase a surface or an outer surface of the base grinding element 13 in order to prevent the base grinding element 13 from breaking out.
  • the support element 29 is intended to reduce or prevent deflection of the base grinding element 13, in particular in a state of use, in order to achieve a better grinding effect.
  • the support element 29 has a high mechanical strength and is intended as an additive to the base grinding element 13.
  • the abrasive 15 has a longitudinal extension or - in the case of a disk - a diameter of up to 500 mm.
  • the abrasive 15 has a thickness of up to 5 mm.
  • the abrasive 15 has a flexible carrier element 31 for arranging the abrasive element 11 by means of a binder element.
  • the grinding element 11 is largely incorporated or embedded in the base binder element 21, 23 during the manufacture of the abrasive 15.
  • the cover binder element can wear out during the machining process and expose the base grinding elements 13. Further wear of the cover binder element 25 can be prevented by the exposed base grinding elements 13.
  • support elements 29 which are located on the exposed surface of the base grinding element 13 can also be removed, while the other support elements 29 which are located on the side facing away from the workpiece are not affected.
  • the abrasive means 15 has a plurality of abrasive elements 11 on a surface of the carrier element 31, which protrude from the carrier element 31 and delimit the abrasive means 15.
  • the abrasive 15 is designed as a circular grinding wheel and is used for grinding or abrasive processing of a workpiece, in which material of the workpiece is mechanically removed from the surface of the workpiece in the form of chips.
  • the abrasive 15 is a coated abrasive 15 (Fig. 2).
  • the base and/or cover binder elements 23, 25 are provided for a material-locking connection of the grinding elements 11 and the carrier element 31 of the abrasive 15.
  • the carrier element 31 of the abrasive 15 can have any flexible base commonly used in the abrasive industry.
  • the carrier element 31 is preferably made of a textile, paper or film material.
  • the carrier element 31 is made of several layers.
  • the grinding elements 11 can be applied to the carrier layer and fixed by means of the base binder element 23.
  • the abrasive grains can be pre-fixed in the desired position and distribution on the carrier element 31 by means of the base binder element 23.
  • the abrasive 15 can contain one or more cover binder elements 25, in particular layers of cover binder elements 25.
  • the lower cover binder element 25 is usually referred to as "cover binder 1" or “size coat” and the upper cover binder element 25 as “cover binder 2" or “supersize coat”.
  • the uppermost cover binder element 25 can be unhardened, i.e. the cover binder element 25 that forms the outermost layer and faces away from the carrier element 31 of the abrasive 15.
  • the cover binder element(s) 25 can be applied in particular in layers to the base binder element 23 and the grinding elements 11.
  • the cover binder element(s) 25 firmly connects the grinding elements 11 to one another and firmly to the carrier element 31.
  • the abrasive 15 can have a holding side 35 and a grinding side 33 facing away from the holding side. The abrasive 15 is limited on the holding side 35 by a holding surface and on the grinding side 33 by a grinding surface.
  • the holding side 35 has a fastening means (not shown in detail) which is provided for arranging the abrasive 15 on a grinding plate of a machine tool.
  • the fastening means can have a mechanical connecting element such as a Velcro fastening element, a screw fastening element or a clamp fastening element or an adhesive connecting element such as an adhesive fastening element.
  • the base binder element 23 and the cover binder element 25 are made of a phenolic resin.
  • the base binder element 23 and the cover binder element 25 can also contain other conventional active ingredients and/or fillers.
  • a manufacturing method for producing the grinding element 11 comprising the step of providing the base grinding element 13 and the support element 29. In a further step, a material-locking connection of the support element 29 and the base grinding element 13 is created by means of an adhesive element 17.
  • the adhesive element 17 that creates the material-locking connection can be in liquid, viscous or pasty form.
  • a mixing device can be used, by means of which the adhesive element 17 can be distributed around the support elements and the base grinding element.
  • the mixing device can have a receiving unit for receiving the mixed material or the base grinding element 13, the support element 29 and the adhesive element 17. In a receiving state, the receiving unit is open to receive the mixed material and in a closed state, the receiving unit is closed to avoid or prevent the mixed material from accidentally escaping.
  • the receiving unit is designed as a receiving drum.
  • the mixing device has a mixing unit with a mixing element, which is designed as a screw mixer, a paddle mixer or the like.
  • the mixing element is arranged completely in the receiving unit and is mounted so that it can move or remain stationary relative to the receiving unit.
  • the mixing unit transmits a suitable mixing movement of the receiving unit and/or the mixing unit to the material to be mixed in order to mix the material to be mixed.
  • the mixing element contacts the material to be mixed directly or indirectly.
  • the mixing device has a drive unit which drives the receiving unit and/or the mixing element and moves them relative to each other.
  • the coating of the grinding elements 11 with the support elements 29 is carried out by mixing the grinding element 11 with the support element 29 and the adhesive element 17 to be used, for example at room temperature.
  • the adhesive element 17, in particular together with the support element 29, can be distributed on the grinding element 11, in particular relatively homogeneously, due to the surface tension.
  • the mixture is cured using a curing unit.
  • the mixture can be cured during the mixing process or after the mixing process.
  • the mixed material can be cured in a heating unit designed as an oven unit at a temperature of more than 50 °C. Typically, the mixed material can be cured for more than 5 minutes using the heating unit.
  • the base grinding elements 13 coated with the adhesive element 17 can be bonded to other base grinding elements 13 (Fig. 1 d).
  • an electrically conductive material can be applied to the coated base grinding element 13 or the grinding elements 11.
  • the electrically conductive material is designed as an organic compound which is designed as at least one ionic liquid and/or a conductive polymer.
  • the organic compound can be applied to the abrasive grain either in pure form and/or as a solution dissolved in a solvent, for example in water.
  • Such an organic compound for a grinding element 11 (hereinafter abrasive grain) is known from the patent application DE102017204605A1. In this respect, reference is made to the application DE102017204605A1, the content of which is hereby incorporated into this application.
  • the grinding elements 11 can be individually connected due to the adhesive element 17. As a result, the connected grinding elements 11 can be broken and separated in a further step by means of a separating unit.
  • the separating unit has a separating element for separating the bonded mixed material, which is designed as a separating ball and applies a mechanical force to the mixed material in order to separate the bonded base grinding elements 13 or grinding elements 11 from one another.
  • the mixed material in the heating unit can be rotated, for example in the receiving unit, during the curing process.
  • the non-separated grinding elements 11 can be separated from the separated grinding elements 11 by means of a sieve unit and fed to the separating unit.
  • the carrier element 31 has a through-hole 37 for receiving a grinding element 11 (Fig. 3a to 3d), which extends through the entire carrier element 31. It is understood that a plurality of through-holes are provided in the carrier element.
  • the through-holes 37 extend from the grinding side of the carrier element 31 to a holding side of the carrier element 31 facing away from the one grinding side.
  • the through-holes 37 are designed as a receiving opening for receiving grinding element 11.
  • the through-holes 37 limit an arrangement of grinding elements 11 on the abrasive 15.
  • the through-holes 37 align the grinding elements 11.
  • the through-holes 37 support the grinding elements 11 laterally.
  • the through-holes 37 are designed in such a way that designed such that the grinding element 11 is held directly or indirectly in the through-recesses 37.
  • Grinding elements 11 arranged in the through-recesses 37 can be surrounded by the carrier element.
  • the through-holes 37 can be arranged at a distance of at least 1 mm from one another. Each through-hole 37 can have a hole diameter of at least 0.1 mm.
  • the carrier element 31 can have a material thickness of at least 1 mm.
  • the hole diameter of the through-hole 37 and the material thickness of the carrier element 31 can be adapted to the grinding element 11, in particular a size of the grinding element 11 (grain size). This allows a desired amount of grinding elements 11 (grain quantity) to be applied.
  • the through-holes 37 can be introduced into the carrier element 31 by means of a punching process, a laser process, a piercing process (for example needle roller) or the like.
  • a bead (not shown) can be created in the carrier element 31.
  • the bead can surround the through-hole.
  • the bead can be arranged on the back or on the holding side of the abrasive or the carrier element 31.
  • the bead can be designed as a raised area arranged around the through-hole and delimiting the through-hole.
  • the bead can form a depression on a grinding side, in particular associated with the bead.
  • the bead, in particular the depression of the bead can optimally align the grinding elements.
  • the base binder element 23 is arranged on and in the through-hole 37 and completely fills the through-hole 37.
  • the base binder element 23 limits the through-hole 37, thereby limiting an extension of the through-hole 37 through the carrier element 31.
  • the base binder element 23 is in the area of a 33 facing away from the carrier element 31 (Fig. 3a to 3d).
  • the base binder element 23 delimits the through-hole 37 on a side facing away from the grinding side 33.
  • the through-hole element completely covers the through-hole 37.
  • the base binder element 23 can be designed as a film element (not shown), in particular an adhesive film element, which is arranged on the side of the carrier element 31 facing away from the grinding side 33.
  • the base binder element 23 can be connected to the carrier element 31 over its entire surface.
  • the base binder element 23 can be arranged in solid form and/or in the form of a film on a side of the carrier element 31 facing away from the grinding side 33.
  • the carrier element 31 can have an electrically conductive coating for aligning the grinding elements 11 by means of an electrostatic field.
  • the coating is arranged on a side of the carrier element 31 facing away from the grinding side 33.
  • a manufacturing method for producing a flexible abrasive 15 comprising the step of providing a carrier element 31 for arranging a grinding element 11 on the carrier element 31 and providing a through-recess 37 extending through the entire carrier element 31 for receiving grinding elements 11.
  • a base binder element 23 is arranged on a side of the carrier element 31 and/or the through-hole 37 facing away from the grinding side 33.
  • the base binder element 23 is not applied as usual on the grinding side 33 of the carrier element 31, but on a side of the carrier element 31 facing away from the grinding side 33 or on the holding side 35 of the carrier element 31.
  • the base binder element 23 can be applied to the entire surface of the carrier element 31 and in or over the through-hole 37 using a doctor blade method.
  • the base binder element 23 is applied to the carrier element 31 in a liquid, in particular viscous, preferably pasty, state.
  • the base binder element 23 remains in the through-hole 37 due to the state and the surface tension.
  • the base binder element 23 can be applied to the entire surface of the carrier element 31 in order to coat the entire surface of the carrier element 31.
  • a layer or film of the base binder element 23 can remain on the carrier element 31.
  • a further layer such as a velour, a cover paper, an anti-slip coating can be applied or laminated onto the base binder element 23.
  • the base binder element 23 can be designed as a film element, in particular an adhesive film element.
  • the film element can be arranged or glued to the carrier element 31 on the side of the carrier element 31 facing away from the grinding side 33.
  • the carrier element 31 can be designed to be essentially “tight”, so that residues of a binder element on a side facing away from the grinding side 33 can be avoided. These residues can contaminate production rollers and complicate the production process.
  • curing/drying/deactivation of the base binder element 23 arranged on the side facing away from the grinding side 33 can be saved.
  • the use of a liquid base binder element 23 can be avoided.
  • a manufactured abrasive 15 can be rolled up and stored without a protective foil element, such as wax paper, since the Basic binder element 23, such as a self-adhesive, can be held in the through recess 37.
  • a hot melt layer can be applied to the back of the perforated paper. This can either be sprinkled on from the opposite side immediately while still hot, or heated up again before the sprinkling process, e.g. with an IR radiator. The layer can also be used at the same time to apply a velour.
  • an open fabric particularly a textile (e.g. 50g/m2) can be used, to which an adhesive film is applied on the back.
  • the grains then remain stuck in the fabric during the scattering process.
  • the process has the advantage that a "net” is incorporated and the abrasive 15 could therefore be marketed as a "net abrasive”.
  • An adhesive film, hot melt application or liquid coating can also be used as the adhesive layer here.
  • a grinding side of the carrier element 31 can be sprinkled with a plurality of grinding elements 11 by means of electrostatics or compressed air.
  • the grinding elements 11 can be electrostatically scattered onto the carrier element 31.
  • the grinding elements 11 are electrostatically charged in an external electric field by electrostatic interaction with this external electric field and accelerated onto the carrier element 31.
  • those grinding elements 11 which are aligned essentially perpendicular to the grinding surface in relation to the grinding means 15 during the scattering process can get stuck in the through-hole 47. If the grinding element 11 hits the through-hole essentially perpendicular to the grinding means 15, it is pulled by the surface tension of the base binder into the breakthrough recess, whereby the grinding element 11 continues to rise in a vertical direction.
  • Grinding elements 11 aligned essentially parallel to the abrasive 15, in particular to the grinding surface, can be rejected by the grinding elements 11 discharging themselves on the carrier element 31 and falling back. This can result in particularly advantageous bundles of grinding elements 11, which are bonded by means of the binder element arranged in or behind the opening recess.
  • the curing of the base binder element 23 and the application of the cover binder element 25 can be carried out in the conventional way, i.e. thermally, 2K, UV, etc. and are known to a person skilled in the art.
  • the quantity of grinding elements 11 can be determined by the hole diameter of the breakthrough recess and the quantity of base binder elements 23 arranged on the carrier element 31.
  • the sieve is made of metal and is operated as a high-voltage electrode during electrostatic scattering.
  • a counter electrode for electrostatic scattering of the grinding elements 11 can be arranged, for example, behind the carrier element 31, in particular behind a carrier element web, or can be realized by the carrier element 31, in particular by the carrier element 31 web itself, provided that it is electrically conductive or has an electrically conductive (e.g. aqueous or soot-filled) binder element 21, 23, 25.
  • an electrically conductive e.g. aqueous or soot-filled
  • a further bonding of an abrasive 15 is shown, which has an adhesion limiting element 41 arranged on the carrier element 31 for limiting an arrangement of the base binder element 23 on the carrier element 31.
  • the carrier element 31 according to Fig. 4a to 4I can also have through-holes 37 according to Fig. 3a to 3d.
  • the adhesion limiting element 41 can be arranged around the through-hole 37 and in particular completely surround it.
  • the adhesion limiting element 41 can be arranged on the grinding side in order to ensure that the binder element, in particular the base binder element, is arranged in the through-hole 37.
  • the adhesion limiting element 41 reduces or prevents an arrangement of the base binder element 23 and the grinding element 11 on the carrier element 31.
  • the adhesion limiting element 41 is intended to displace or repel a base binder element 23 arranged on the carrier element 31, in particular so that the adhesion limiting element 41 does not come into contact with the base binder element 23.
  • the adhesion limiting element 41 is designed as a type of “anti-adhesion element” or “adhesive stop element” and is partially arranged on the carrier element 31 in order to cover a part of the carrier element 31.
  • the adhesion limiting element 41 is arranged directly on the carrier element 31 and extends along an entire extent of the abrasive 15.
  • the abrasive 15 has a grinding area 43 and a free area 45 adjacent to the grinding area 43.
  • the grinding area 43 is formed by the free area 45 and delimits it.
  • the grinding area 43 is formed by a base binder element 23 delimiting the grinding area 43.
  • The, in particular each, base binder element 23 can form or delimit the grinding area 43.
  • the grinding area 43 is formed from a plurality of base binder elements 23 arranged at a distance from one another.
  • the base binder elements 23 are designed as base binder element points 23.
  • the base binder elements 23 are designed in the form of islands or base binder islands.
  • the base binder elements 23 have a Extension or a diameter of less than 3 mm, in particular less than 2 mm, preferably less than 1 mm, such as 0.7 mm.
  • the base binder element 23 is made of a phenolic resin, urea resin, polyurethane resin, polyester resin, optionally also UV-curing, etc.
  • the base binder element 23 can be cured in a material-specific manner or depending on the base binder element 23 used.
  • the grinding region 43 is made of a large number of base binder elements 23 spaced apart from one another in a short order or in groups. The base binder elements 23 accommodate a large number of grinding elements 11 and hold them in a bundle on the carrier element 31.
  • the grinding area 43 is surrounded by the free area 45 and the grinding area 43 surrounds the free area 45.
  • the free area 45 is essentially delimited by a plurality of base binder elements 23 of the grinding area 43.
  • the free area 45 can be designed free of the, in particular each, base binder element 23.
  • the adhesion limiting element 41 is arranged on the, in particular on all, free areas 45 of the carrier element 31 or forms the free areas 45.
  • the adhesion limiting element 41 can be printed on the carrier element 31.
  • the base binder element 23 can be applied to the entire surface of the carrier element 31 by means of a roller.
  • a cover binder element 25 can be rolled over the entire surface of the carrier element 31 by means of a roller.
  • the abrasive 15 can have an opening 47 designed as a suction opening for sucking out grinding dust, the suction recess being limited at least in sections by the adhesion limiting element 41 (Fig. 4I).
  • the opening 47 is arranged in the free area 45 and spaced from the grinding area 43.
  • the opening 47 extends through the carrier element 31 through the entire abrasive 15.
  • the opening 47 is designed as an opening extending through the entire material thickness of the abrasive 15.
  • the opening 47 is designed as a round hole.
  • the Opening 47 and the grinding area 43 delimit the free area 45 in sections.
  • the opening 47 is completely surrounded by the free area 45 in one plane by 360°.
  • the opening 47 is delimited by the free area 45.
  • the base binder element 23 is formed from more than 40 wt%, in particular more than 50 wt%, preferably more than 55 wt%, and/or less than 80 wt%, in particular less than 70 wt%, preferably less than 65 wt%.
  • a manufacturing method for producing a flexible abrasive 15 comprising the steps of providing a carrier element 31 for arranging an abrasive element 11 on the carrier element 31 and providing an adhesion limiting element for limiting an arrangement of the base binder element 23 on the carrier element 31.
  • the base binder element 23 is attached to the carrier element 31 over its entire surface by means of a rolling process.
  • the carrier element 31 is sprinkled with a plurality of grinding elements 11 by means of electrostatics or compressed air.
  • the deck binder element 25 is attached to the carrier element 31 over its entire surface by means of a rolling process.
  • a manufacturing method for producing a flexible abrasive 15 comprising the steps of providing a carrier element 31 for arranging an abrasive element 11 on the carrier element 31 and providing a pad printing element 51 and/or a silicone roller element for arranging a base binder element 23 on the carrier element 31 (Figs. 5a to 5h).
  • the pad printing element 51 is provided for receiving and holding the base binder element 23.
  • the pad printing element 51 is provided for arranging or dispensing the base binder element 23 on the Carrier element 31 is provided.
  • the pad printing element 51 is made of an elastic material, in particular a silicone material, preferably a silicone rubber.
  • the base binder element 23 is arranged on the carrier element 31 using a pad printing element 51 by means of a pad printing process.
  • the pad printing element 51 is designed as a pad stamp element.
  • the pad printing process is carried out as an indirect deep-drawing process.
  • the base binder element 23 is transferred to the carrier element 31 by pressing it with different levels of contact force.
  • the base binder element 23 is transferred to the carrier element 31 by pressing the pad printing element 51 with a contact force.
  • a printing plate element 53 is provided for imaging a negative printing form.
  • the printing plate element 53 has a printing recess 55 for receiving the base binder element 23.
  • the printing plate element 53 can be made of a metal, in particular a steel, or a plastic.
  • the printing plate element 53 is delimited by the printing recess 55, which is delimited by the printing plate element 53 in a plane by 360°.
  • the printing plate element is adapted to the shape or surface of the carrier element 31.
  • the printing recess 55 is formed on the printing plate element 53, for example, by means of a milling process.
  • the printing recess 55 forms a negative printing image, which can be transferred to the carrier element 31 by means of the pad printing element 55.
  • a rake element 57 designed as a box rake element is provided for arranging the base binder element 23 on the printing recess 55 of the printing plate element.
  • the doctor element is provided for arranging the base binder element 23 in the pressure recess 55.
  • the doctor element is provided for receiving the base binder element 23 and for stripping a base binder element 23.
  • the deck binder element 25 is provided, wherein the deck binder element 25 is completely arranged on the carrier element 31 by means of a rolling process.
  • Fig. 6a to 6c show an abrasive 15 with a first
  • Recess 61 which is arranged in the base binder element 23 and the cover binder element 25.
  • the recess 61 is designed as a slotted recess 61.
  • the recess 61 is designed as a type of predetermined breaking point.
  • the recess 61 delimits the cover binder element 25 and the base binder element 23 and essentially separates the two elements from one another.
  • the recess 61 defines a bending edge of the abrasive 15 and is delimited by the carrier element 31.
  • the recess 61 extends relative to a thickness of the abrasive 15 by at least 20% and by at most 90%.
  • the recess 61 is arranged in each area which is free of a grinding element 11.
  • the recess 61 is arranged at a distance from one, in particular each, grinding element 11.
  • the base binder element 23 is formed from, in particular, 60g of aqueous phenolic resin (75%), in particular 40g of chalk and, in particular, 30g of water.
  • the first recess 61 extends in a straight line from a first end of the abrasive 15 to a second end of the abrasive 15 facing away from the first end.
  • the abrasive means 15 has a second and a third recess 61 formed as a slot recess, which are arranged in the base binder element 23 and the cover binder element 25.
  • the first recess 61 is arranged transversely to the second and third recess 61.
  • the abrasive means 15 has a first group of grinding elements 11, a second group of grinding elements 11, wherein the recess is arranged between the two groups and separates them.
  • the first group of grinding elements 11 is essentially limited by the first recess 61, the second recess 61 and the third recess 61.
  • a manufacturing method for producing a flexible abrasive 15 comprising the steps of providing a carrier element 31 for arranging a grinding element 11 on the carrier element 31, providing a base binder element 23 for holding the grinding element 11 on the carrier element 31 and providing a cover binder element 25 for covering the grinding element 11 and/or the base binder element 23 and forming a recess 61 in the base binder element 23 and the cover binder element 25 by means of a laser cutting process.
  • the base binder element 23, the cover binder element 25 and the carrier element 31 are completely severed by means of the laser.
  • the recess 61 can extend from a grinding side of the abrasive 15 to a holding side of the abrasive 15 facing away from the grinding side.
  • the abrasive 15 is deflected by means of a flexible rolling element.
  • the rolling element is arranged on the grinding area 43 of the abrasive 15 and deflects the abrasive 15 along the grinding area 43 of the abrasive 15.
  • the rolling element can be arranged on an area of the abrasive 15 facing away from the grinding area 43, the holding area, and/or deflect the abrasive 15 along the area.
  • the abrasive 15 is pulled over an edge or pressed into the rolling element by means of a rod element, in particular a metal rod element, with a small radius.
  • the binder elements 21, 23, 25 can be made more flexible, for example by means of a polymer dispersion.
  • the carrier element 31 is sprinkled with a plurality of grinding elements 11 by means of electrostatics or compressed air.
  • the base binder element 23 is briefly heated by means of an IR radiator after the base binder element 23 has been arranged.
  • a manufacturing method for producing a flexible abrasive 15 comprising the steps of providing a carrier element 31 for arranging a plurality of abrasive elements 11 on the carrier element 31 and providing a base binder element 23 for holding the abrasive elements 11 on the carrier element 31 and arranging the abrasive elements 11 such that all the abrasive elements 11 protrude from the base binder element 23 (Figs. 7a to 7e).
  • the grinding elements 11 are aligned depending on a grinding plane of the abrasive 15 and at a predetermined distance from the carrier element 31.
  • the grinding elements 11 are each arranged with a first end facing the carrier element 31 and a second end facing away from the carrier element 31.
  • the second end is arranged at a predetermined distance from the carrier element 31 on a side or surface of the carrier element 31 facing away from the grinding elements 11.
  • the grinding tips of the grinding elements 11 form a grinding plane which has a predetermined distance from a side or surface of the carrier element 31 facing away from the grinding elements 11.
  • a receiving unit is provided for electrostatically receiving the grinding element 11.
  • the receiving unit has a plurality of receiving recesses which are provided for receiving grinding elements 11.
  • a single receiving recess can be provided for a single grinding element 11.
  • the receiving recesses are spaced apart from one another.
  • the receiving recesses are designed as through-openings 47 or as blind holes.
  • the receiving recesses can be funnel-shaped.
  • the receiving unit is sprinkled with a plurality of grinding elements 11 by means of electrostatics or compressed air and receives the grinding elements 11 on an outer side.
  • the grinding elements 11 are aligned upright on the receiving unit by means of electrostatic scattering and can be actively rejected by a charge reversal (discharge) when the receiving unit is touched, provided the grinding elements 11 do not hit a receiving recess.
  • the receiving unit can hold the grinding elements 11 on the receiving unit by means of a vacuum.
  • the grinding elements 11 can be held by the receiving unit when the grinding elements 11 are located in the receiving recesses. Multiple grinding elements 11 above a single receiving recess (competition for a receiving recess) can cause leakage and thus a loss of vacuum.
  • a delivery unit is provided for the placement of the grinding elements 11 onto the base binder element 23.
  • the grinding elements 11 can be placed or pressed into the base binder element 23 to different extents depending on the size or extension of the grinding elements 11.
  • the grinding element 11 is not delivered to the carrier element 31 by the delivery unit.
  • the adhesive force of the base binder element 23 is greater than the holding force due to the negative pressure on the receiving unit.
  • the negative pressure of the receiving unit is regulated to finely adjust the holding force.
  • the delivery unit has a distance from a side or surface of the carrier element 31 facing the grinding elements 11, which distance is greater than a thickness of the base binder element 23.
  • the receiving unit and the delivery unit are designed as a perforated roller unit and are electrically conductive.
  • the receiving unit has a non-stick coating. This can prevent soiling and adhesion of a base binder element 23 to areas not occupied by grinding elements 11.
  • the non-stick coating has an electrical conductivity, in particular such a low one, in order to discharge incorrectly placed grinding elements 11 and prevent

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  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
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  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

L'invention concerne un élément abrasif conçu pour un moyen abrasif (15), en particulier un moyen abrasif souple (15), de préférence un disque abrasif, pour meuler une pièce à usiner avec un élément abrasif de base (13). Selon l'invention, l'élément abrasif comprend un élément adhésif (17) disposé sur l'élément abrasif de base (13), lequel est notamment conçu sous la forme d'un agent adhésif (17).
PCT/EP2023/079874 2022-10-31 2023-10-26 Élément abrasif, moyen abrasif et procédé pour produire l'élément abrasif et/ou le moyen abrasif Ceased WO2024094534A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202380076855.XA CN120239642A (zh) 2022-10-31 2023-10-26 磨削元件、磨削器件和用于制造磨削元件和/或磨削器件的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102022211520.1A DE102022211520A1 (de) 2022-10-31 2022-10-31 Schleifelement, Schleifmittel und Verfahren zur Herstellung des Schleifelements und/oder des Schleifmittels
DE102022211520.1 2022-10-31

Publications (1)

Publication Number Publication Date
WO2024094534A1 true WO2024094534A1 (fr) 2024-05-10

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Application Number Title Priority Date Filing Date
PCT/EP2023/079874 Ceased WO2024094534A1 (fr) 2022-10-31 2023-10-26 Élément abrasif, moyen abrasif et procédé pour produire l'élément abrasif et/ou le moyen abrasif

Country Status (3)

Country Link
CN (1) CN120239642A (fr)
DE (1) DE102022211520A1 (fr)
WO (1) WO2024094534A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
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EP0444824A2 (fr) * 1990-03-02 1991-09-04 Minnesota Mining And Manufacturing Company Granules abrasives
EP2105256A1 (fr) * 2008-03-28 2009-09-30 Cedric Sheridan Procédé et appareil pour former des grains abrasifs agrégés pour la production d'outils abrasifs ou coupants
DE102017204605A1 (de) 2017-03-20 2018-09-20 Robert Bosch Gmbh Verfahren zu einem elektrostatischen Streuen eines Schleifkorns

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Publication number Priority date Publication date Assignee Title
US5885311A (en) 1997-06-05 1999-03-23 Norton Company Abrasive products
NZ564192A (en) 2005-06-29 2011-02-25 Saint Gobain Abrasives Inc High performance resin for abrasive products
DE102019126288A1 (de) 2019-09-30 2021-04-01 Vsm Vereinigte Schmirgel- Und Maschinen-Fabriken Ag Verfahren und Beschichtungsvorrichtung zum Beschichten eines Trägerbandes

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Publication number Priority date Publication date Assignee Title
EP0444824A2 (fr) * 1990-03-02 1991-09-04 Minnesota Mining And Manufacturing Company Granules abrasives
EP2105256A1 (fr) * 2008-03-28 2009-09-30 Cedric Sheridan Procédé et appareil pour former des grains abrasifs agrégés pour la production d'outils abrasifs ou coupants
DE102017204605A1 (de) 2017-03-20 2018-09-20 Robert Bosch Gmbh Verfahren zu einem elektrostatischen Streuen eines Schleifkorns

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