WO2024094026A1 - Heat dissipation system, and electronic device using heat dissipation system - Google Patents

Abstract

A heat dissipation system and an electronic device. The heat dissipation system comprises: a mounting box (31), the mounting box (31) being used for accommodating a circuit board of a circuit board assembly; and a fan assembly (41), comprising: a first fan assembly (401), which first fan assembly (401) corresponds to the mounting box (31) and is used for dissipating heat of the circuit board accommodated in the mounting box (31), and a second fan assembly (402), which is adjacent to the first fan assembly (401). A first distance is provided between the circuit board and the first fan assembly (401). The first fan assembly (401) is correspondingly provided with a first backflow prevention device (601, 602, 604), wherein the first backflow prevention device (601, 602, 604) is connected to the mounting box (31) and the first backflow prevention device (601, 602, 604) has a first operating state in which same is in a closed state; and when the first backflow prevention device (601, 602, 604) is in the first operating state, the interior of the mounting box (31) is in gas communication with the second fan assembly (402).

Description

Heat dissipation system and electronic equipment using the same

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to a Chinese patent application filed with the Chinese Patent Office on October 31, 2022, with application number 202211351845.6 and invention name “A heat dissipation system and an electronic device using the same”, the entire contents of which are incorporated by reference into this application.

Technical Field

The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to a heat dissipation system and an electronic equipment using the heat dissipation system.

Background technique

With the rapid development of Ethernet technology, the port rate requirements for communication equipment (such as switches or routers) are getting higher and higher. The use of single-board components with orthogonal architecture in communication equipment is becoming a trend in the development of current communication equipment products. Orthogonal architecture refers to the one-to-one orthogonal connection of two sets of single boards by inserting one set of single boards horizontally and another set of single boards vertically. In the orthogonal architecture, since the service board and the switch board are directly connected, data can be directly transmitted from the service board to the switch board without data cables, thereby greatly reducing transmission losses and improving data exchange and transmission efficiency. At the same time, it also provides greater exchange capacity and processing expansion capabilities.

Summary of the invention

Each exemplary embodiment of the present application provides a heat dissipation system, which is used to dissipate heat for a circuit board assembly, including: a mounting box, which is used to accommodate a circuit board of the circuit board assembly; and a fan assembly, including: a first fan assembly, which corresponds to the mounting box and is used to dissipate heat for the circuit board accommodated in the mounting box; and a second fan assembly adjacent to the first fan assembly; wherein a first distance is set between the circuit board and the first fan assembly; the first fan assembly is correspondingly provided with a first backflow prevention device, which is connected to the mounting box; the first backflow prevention device has a first working state in a closed state; and when the first backflow prevention device is in the first working state, gas communication is established between the inside of the mounting box and the second fan assembly.

The heat dissipation system provided by the present application has the following advantages: (1) when the failed fan assembly is in place or not in place, because the anti-backflow device corresponding to the failed fan is in the first working state of the closed state, the heat dissipation system can achieve the purpose of dissipating heat for the circuit board corresponding to the failed fan assembly, and there will be no situation where the circuit board cannot dissipate heat or the air duct is short-circuited; and (2) the design of the heat dissipation system is relatively simple, and only an anti-backflow device needs to be set up, without the need to set up an additional complex mechanical structure, to achieve a good heat dissipation effect.

In a possible implementation manner, when the first fan assembly fails, the first backflow prevention device is in the first working state.

In a possible embodiment, the first installation box includes a first panel facing the first fan assembly, and a second panel and a third panel connected to the first panel and arranged parallel to the first circuit board; a first backflow prevention device is arranged on the first panel, and through holes are arranged on the second panel and the third panel.

In a possible implementation manner, the lengths of the second panel and the third panel are greater than the length of the first circuit board.

In a possible implementation manner, the first circuit board is in gas communication with the second fan assembly through through holes on the second panel and the third panel.

In a possible implementation, the first installation box includes a first panel facing the first fan assembly, and a second panel and a third panel connected to the first panel and arranged parallel to the first circuit board; and the first panel is provided with a through hole.

In a possible implementation manner, the first backflow prevention device is connected to the first panel through a first connecting member.

In a possible implementation manner, the first connecting member is a narrow strip.

In a possible implementation manner, a second distance is set between the first panel and the first fan assembly; and the first backflow prevention device is respectively connected to the second panel and the third panel through a first connecting member.

In a possible implementation manner, the first circuit board is in gas communication with the second fan assembly through a through hole provided on the first panel.

In a possible implementation manner, the first backflow prevention device further has a second working state of being in an open state.

In a possible implementation manner, the first backflow prevention device includes a frame and a backflow prevention sheet, and the backflow prevention sheet is rotatably connected to the frame.

In a possible implementation, the backflow prevention sheets are arranged in a vertical direction or in a horizontal direction.

According to a second aspect of the present application, a heat dissipation system is provided, which is used to dissipate heat from a circuit board assembly, comprising: an installation box, which is used to accommodate a circuit board of the circuit board assembly; and a fan assembly, which comprises: a first fan assembly, which corresponds to the installation box and is used to dissipate heat from the circuit board accommodated in the installation box; and a second fan assembly adjacent to the first fan assembly; wherein a first distance is set between the circuit board and the first fan assembly; the first fan assembly is correspondingly provided with a first anti-backflow device and a second anti-backflow device, and the second anti-backflow device is arranged on a side of the first anti-backflow device away from the installation box; the first anti-backflow device is detachably connected to the installation box; the first anti-backflow device has a first working state in which it is in a closed state; and when the first anti-backflow device is connected to the installation box and is in the first working state, gas communication is established between the inside of the installation box and the second fan assembly.

In a possible implementation, when the first fan assembly fails and is in place, the second backflow prevention device is in a closed state; and when the first fan assembly fails and is not in place, the first backflow prevention device is in the first working state.

In a possible implementation manner, the first backflow prevention device is a non-porous panel.

According to a third aspect of the present application, an electronic device is provided, wherein the electronic device comprises a heat dissipation system as described in any one of the above exemplary embodiments.

According to a fourth aspect of the present application, an electronic device is provided, wherein the electronic device comprises a first circuit board group and a second circuit board group, and a heat dissipation system as described in any of the above exemplary embodiments, and the circuit boards in the first circuit board group are arranged orthogonally to the circuit boards in the second circuit board group.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, drawings of other embodiments can be obtained based on these drawings without paying any creative work.

FIG. 1 is a schematic diagram of an orthogonal structure of an electronic device of the present application.

FIG. 2 is a three-dimensional schematic diagram of a partial structure of the electronic device of the present application.

Figures 3a to 3c are top views of an electronic device cooling system provided by conventional technology; Figure 3a is a schematic diagram of a fan assembly working normally; Figure 3b is a schematic diagram of a failed fan assembly in place; and Figure 3c is a schematic diagram of a failed fan assembly not in place.

Figures 4a to 4c are top views of another electronic device cooling system provided by conventional technology; Figure 4a is a schematic diagram of a fan assembly working normally; Figure 4b is a schematic diagram of a failed fan assembly in place; and Figure 4c is a schematic diagram of a failed fan assembly not in place.

Figures 5a to 5c are top views of a novel electronic device cooling system provided in one embodiment of the present application; Figure 5a is a schematic diagram of a fan assembly working normally; Figure 5b is a schematic diagram of a failed fan assembly in place; and Figure 5c is a schematic diagram of a failed fan assembly not in place.

Figures 6a to 6c are top views of another novel electronic device cooling system; Figure 6a is a schematic diagram of a fan assembly working normally; Figure 6b is a schematic diagram of a failed fan assembly in place; and Figure 6c is a schematic diagram of a failed fan assembly not in place.

Figures 7a to 7c are top views of another novel electronic device cooling system; Figure 7a is a schematic diagram of a fan assembly working normally; Figure 7b is a schematic diagram of a failed fan assembly in place; and Figure 7c is a schematic diagram of a failed fan assembly not in place.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present application.

It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

The term "and/or" in this article is used to describe the association relationship of associated objects, specifically indicating that there can be three relationships. For example, A and/or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

Unless otherwise defined in the context, the term "single board" in this article refers to an important module unit in a switch that processes various data messages. According to different functions, a single board can include a switch fabric unit (SFU), a main control board (MPU), an interface board (LPU), a monitoring board (CMU), etc.

Please refer to FIG. 1, which is a schematic diagram of an orthogonal structure of an electronic device in an embodiment of the present application. The electronic device includes a circuit board assembly of an orthogonal architecture, and the circuit board assembly includes a first circuit board group and a second circuit board group. The first circuit board group includes at least a first circuit board and a second circuit board. The first circuit board and the second circuit board can be switching modules (for example, switching module 1, switching module 2, switching module 3, switching module 4, switching module 5, or switching module 6), such as a switching network board. The second circuit board group includes at least a third circuit board and a fourth circuit board, and the third circuit board and the fourth circuit board can be service modules, such as line cards or main control boards. In FIG. 1, the circuit board in the first circuit board group is a switching module, and the circuit board in the second circuit board group is a service module, wherein the service module is a horizontally inserted single board, and the switching module is a vertically inserted single board, so that each service module can be electrically connected to each switching module through a connector to realize data exchange. As shown in the figure, a fan module is provided on the side of the switching module away from the service module. The fan module can be composed of a plurality of parallel fan assemblies. During the working process in the exhaust mode, the fan assembly drives the cold air to flow from the horizontally inserted service module to the vertically inserted switching module through exhaust, and is discharged to the electronic device through the fan assembly and brings the heat of the single board outside the electronic device, thereby achieving heat dissipation of each single board. Those skilled in the art should be aware of the heat dissipation working process in the blowing mode, which will not be described in detail herein.

However, in the related art, it is very difficult to design the air duct for communication equipment using an orthogonal architecture. Usually, multiple parallel fans are set on the rear side of the vertical plug-in board to cool the two groups of boards. When using this multi-fan parallel cooling method, there is a risk of failure of a single fan.

The fan air supply modes include blowing and exhausting. Taking the blowing mode as an example, once a single fan fails, the single board corresponding to the failed fan will not get enough cooling air, which will cause problems with its heat dissipation. In addition, since the air flow resistance in the area of the single board corresponding to the normally operating fan adjacent to the failed fan is large, while the air flow resistance in the area of the single board corresponding to the failed fan is small, after the failed fan stops, the air sent by the adjacent fan will flow back to the failed fan with smaller air flow resistance, thereby causing an air flow short circuit between the failed fan and its adjacent fan, further causing a reduction in the cooling air flow in the area of the single board corresponding to the normally operating fan, causing more serious heat dissipation problems.

FIG2 is a schematic three-dimensional diagram of a partial structure of the electronic device shown in FIG1 . The electronic device includes a chassis 10 , in which a first circuit board assembly area 11 , a second circuit board assembly area 12 and a fan assembly area 13 are arranged.

The first circuit board group area 11 is used to set a first circuit board group, such as a switching module. The second circuit board group area 12 is used to set a second circuit board group, such as a service module. Multiple service modules can be layered and inserted horizontally in the second circuit board group area 12, and multiple switching modules can be inserted vertically in the first circuit board group area 11. The fan assembly area 13 can be set on a side of the first circuit board group area 11 away from the second circuit board group area 12.

The fan assembly area 13 is used to set a fan assembly, such as a fan frame. A plurality of fan frames may be set in the fan assembly area 13, and each fan frame may include one or more fans.

In the working process, the flow direction of the cooling air is shown in Figure 2, as shown by the dotted line in Figure 2. The fan assembly drives cold air from the horizontally inserted service module toward the vertically inserted switching module through, for example, exhaust, and is discharged to the electronic equipment through the fan assembly and brings the heat of the single board outside the electronic equipment, thereby achieving heat dissipation for each single board.

3a, 3b and 3c are top views of a heat dissipation system for electronic equipment provided by conventional technology. The heat dissipation system for electronic equipment is used to dissipate heat from a circuit board assembly, wherein the circuit board assembly includes a first circuit board group 21 and a second circuit board group 22.

In Fig. 3, the first circuit board group 21 includes at least a first circuit board 201 and a second circuit board 202. The first circuit board 201 and the second circuit board 202 are switching modules. The second circuit board group 202 includes at least a third circuit board and a fourth circuit board. The third circuit board and the fourth circuit board are service modules.

The heat dissipation system includes a fan assembly and a mounting box 31 corresponding to each circuit board in the first circuit board group 21, and the mounting box is used to accommodate the circuit boards in the first circuit board group 21, wherein the first circuit board 201 corresponds to the first mounting box 301, and the second circuit board 202 corresponds to the second mounting box 302. Each mounting box 31 includes a first panel 311 arranged directly opposite the fan assembly, and a second panel 312 and a third panel 313 adjacent to the first panel and arranged in a direction parallel to the circuit boards in the mounting box. The first panel 311 is provided with a plurality of through holes 314, and the hot air generated by the circuit boards in the mounting box 31 can be discharged through the through holes 314.

In the following example, the heat dissipation system in FIG. 3 a to FIG. 3 c is described.

………In Figures 3a to 3c, each fan assembly in the fan assembly 41 includes a plurality of fans for dissipating heat from the circuit board. The fan assembly 41 in the electronic device is closely arranged with the corresponding mounting box 31, that is, there is no gap between the fan assembly 41 and the mounting box 31, and the fan assembly 41 is in contact with the mounting box 31 on one side facing the first circuit board group 21. Please refer to Figure 3a, when the fan assembly 41 is operating normally, the hot air generated by the circuit boards in the first circuit board group 21 and the second circuit board group 22 will be drawn away by the corresponding fan assembly, and the heat dissipation system is operating normally.

In Figures 3a to 3c, the first fan assembly 401 corresponds to the first installation box 301, and the second fan assembly 402 adjacent to the first fan assembly 401 corresponds to the second installation box 302. Please refer to Figure 3b, when the first fan assembly 401 located in the middle fails and the failed first fan assembly 401 is still in place, when the first circuit board 201 corresponding to the first fan assembly 401 is dissipating heat, the hot air generated by the first circuit board 201 can only flow to the connection between the first circuit board group 21 and the second circuit board group 22, and is drawn away through the second fan assembly 402 adjacent to the first fan assembly 401. At this time, the following problems will exist: (1) The heat dissipation path of the first circuit board 201 corresponding to the failed fan assembly 401 will become longer, and the hot air generated by it needs to flow back to the connection between the first circuit board group 21 and the second circuit board group 22 before it can be extracted, affecting the heat dissipation of the first circuit board 201; and because the hot air generated by the first circuit board 201 needs to be extracted through the second fan assembly 402 adjacent to the first fan assembly 401 corresponding to the first circuit board 201, the hot air generated by the first circuit board 201 will pass through the second circuit board 202 corresponding to the second fan assembly 402, and the hot air will flow to the second circuit board 202, causing the heat dissipation effect of the second circuit board 202 to deteriorate; (2) When the first fan assembly 401 fails and is still in place, the failed first fan assembly 401 will block the flow of hot air, and the flow resistance will become very large, further worsening the heat dissipation of the first circuit board 201.

As shown in FIGS. 3b and 3c, when the first fan assembly 401 in the middle fails but the first fan assembly 401 is not in place, similar to the situation in FIG. 3b where the first fan assembly 401 is in place, when the first circuit board 201 corresponding to the first fan assembly 401 is dissipating heat, the hot air generated by the first circuit board 201 can only flow to the connection between the first circuit board group 21 and the second circuit board group 22, and pass through the second fan assembly 402 adjacent to the first fan assembly 401. At this time, the heat dissipation path of the first circuit board 201 will become longer, affecting the heat dissipation of the first circuit board 201; and because the hot air generated by the first circuit board 201 needs to be extracted by the second fan assembly 402, the hot air will pass through the second circuit board 202 corresponding to the second fan assembly 402, and the hot air will flow to the second circuit board 202, causing the heat dissipation effect of the second circuit board 202 to deteriorate. Relatively speaking, because there is no obstruction of the failed fan assembly 401, its heat dissipation effect is slightly better than the case where the failed fan assembly 401 is in place, but overall, the heat dissipation effect is still very poor.

Figures 4a to 4c are top views of another electronic device heat dissipation system of conventional technology. Similar to Figures 3a to 3c, the electronic device heat dissipation system is used to dissipate heat from a circuit board assembly, wherein the circuit board assembly includes a first circuit board group 21 and a second circuit board group 22. The first circuit board group 21 includes at least a first circuit board 201 and a second circuit board 202, and the first circuit board 201 and the second circuit board 202 are switching modules; the second circuit board group 22 includes at least a third circuit board and a fourth circuit board, and the third circuit board and the fourth circuit board can be business modules.

The heat dissipation system includes a fan assembly 41 and a mounting box 31 corresponding to each circuit board in the first circuit board group 21. The mounting box 31 is used to accommodate the circuit boards in the first circuit board group 21, wherein the first circuit board 201 corresponds to the first mounting box 301, and the second circuit board 202 corresponds to the second mounting box 302. The mounting box 31 includes a first panel 311 arranged opposite to the fan assembly 41, and a second panel 312 and a third panel 313 adjacent to the first panel 311 and arranged in a direction parallel to the circuit boards in the mounting box. The first panel 311 is provided with a plurality of through holes 314, through which the hot air generated by the first circuit board 201 in the first mounting box 401 can be discharged.

Each fan assembly in the fan assembly 41 includes a plurality of fans for dissipating heat from the circuit board. In addition, each fan assembly 41 also includes a backflow prevention device 411. In FIG. 4 , the backflow prevention device 411 is disposed on a side of the fan assembly 41 away from the first circuit board group 21. Of course, in other solutions, the backflow prevention device 411 may also be disposed on a side of the fan assembly 41 close to the first circuit board group 21.

The backflow prevention device 411 is used to prevent the air duct from short-circuiting when the fan assembly 41 fails. When the fan assembly 41 works normally, the backflow prevention device 411 is in the first working state, that is, the backflow prevention device 411 is in the open state, and hot air can pass through the backflow prevention device 411 normally; when the first fan assembly 401 fails, the backflow prevention device 411 set on the first fan assembly 401 will be in the second working state, that is, the backflow prevention device 411 will be in the closed state, and hot air will not be able to pass through the backflow prevention device 411, and the second fan assembly 402 adjacent to the first fan assembly 401 will not be able to draw air from the failed first fan assembly 401, thereby not causing a short circuit in the air duct.

In the examples shown in Figures 4a to 4c, a certain gap is set between the fan assembly 41 in the electronic device and the corresponding installation box 31, and the gap can be used as a mixed flow chamber 51. The hot air in the mixed flow chamber 51 can be drawn away by any fan assembly. Please refer to Figure 4a, when all fan assemblies 41 are working normally, the anti-backflow devices 411 on the fan assemblies 41 are in the first working state, and the hot air generated by the circuit boards in the first circuit board group 21 and the second circuit board group 22 will be drawn away by the corresponding fan assemblies 41, and the heat dissipation system works normally.

As shown in FIG. 4b, the first fan assembly 401 corresponds to the first installation box 301, and the second fan assembly 402 adjacent to the first fan assembly 401 corresponds to the second installation box 302. When the first fan assembly 401 located in the middle fails and the first fan assembly 401 is still in place, the anti-backflow device 411 on the first fan assembly 401 is in the second working state. At this time, because there is a certain gap between the fan assembly 41 and the installation box 31 in the heat dissipation system, the hot air generated by the first circuit board 201 will pass through the mixed flow chamber 51 and be drawn away by the second fan assembly 402 adjacent to the first fan assembly 401. And because the first fan assembly 401 is still in place and the anti-backflow device 411 is in the second working state, the second fan assembly 402 will not draw air from the first fan assembly 401 due to the failure of the first fan assembly 401, so the heat dissipation system can still work normally.

Please refer to FIG. 4b and FIG. 4c. When the first fan assembly 401 in the middle fails and the first fan assembly 401 is not in place, the wind resistance of the second fan assembly 402 adjacent thereto to draw air from the original position of the first fan assembly 401 is small due to the absence of the first fan assembly 401. Therefore, the second fan assembly 402 will draw air from the vacant fan slot, and the hot air drawn from the corresponding second circuit board 202 will be reduced. In addition, since the first fan assembly 401 is not in place and there is a gap between the fan assembly 41 and the first circuit board group 21, the second fan assembly 402 cannot draw air from the first circuit board 201, there is no wind on the first circuit board 201, and the system will not be able to operate for a long time.

It can be seen from the cooling systems in Figures 3a to 3c and Figures 4a to 4c that the two cooling systems cannot meet the requirement in the orthogonal architecture that after a fan component fails, the corresponding switching module can be cooled regardless of whether the failed fan component is in place or not.

Each exemplary embodiment of the present application provides a heat dissipation system.

Please refer to Figures 5a to 5c, which are top views of a heat dissipation system of an electronic device provided in an embodiment of the present application. The heat dissipation system is used to dissipate heat from a circuit board assembly, wherein the circuit board assembly includes a first circuit board group 21 and a second circuit board group 22, the first circuit board group 21 includes at least a first circuit board 201 and a second circuit board 202, the first circuit board 201 and the second circuit board 202 are switching modules; the second circuit board group 22 includes at least a third circuit board and a fourth circuit board, the third circuit board and the fourth circuit board are business modules. The heat dissipation system includes a fan assembly 41 and an installation box 31 corresponding to each circuit board in the first circuit board group 21, the installation box 31 is used to accommodate the circuit boards in the first circuit board group 21, wherein the first circuit board 201 corresponds to the first installation box 301, and the second circuit board 202 corresponds to the second installation box 302. Each installation box 31 includes a first panel 311 arranged opposite to the fan assembly 41, and a second panel 312 and a third panel 313 adjacent to the first panel 311 and arranged in a direction parallel to the circuit board.

In other optional solutions, multiple adjacent circuit boards may be arranged in the same installation box 31, such as two adjacent switching templates may be arranged in the same installation box. The corresponding relationship between the installation box and the circuit boards is not limited in the present application.

As shown in the three-dimensional schematic diagram in Figure 2 and Figures 5a to 5c, a backflow prevention device 601 is provided on the first panel 311, and the backflow prevention device 601 includes a frame 612 and a plurality of backflow prevention sheets 611, and the plurality of backflow prevention sheets 611 are rotatably connected to the frame 612. The backflow prevention sheets 611 can be a shutter structure arranged in a vertical direction, or a blade structure arranged in a horizontal direction. It can be manually set to a first working state of an open state or a second working state of a closed state according to actual use. In addition, the backflow prevention device 601 can also be an electric structure, that is, a corresponding control circuit can also be designed to control the working state of the backflow prevention device. Of course, the backflow prevention device 601 can also be designed with a corresponding structure, and when the corresponding fan assembly 41 is working normally, the backflow prevention device 601 is in the first working state of opening; when the corresponding fan assembly 41 fails, the backflow prevention device 601 automatically turns into the second working state of closing. Those skilled in the art should be aware of the implementation methods for realizing the above-mentioned functions of the backflow prevention device. The present application does not limit the structural type and working mode of the backflow prevention device, as long as it can achieve the purpose of backflow prevention.

The second panel 312 and the third panel 313 of the installation box 31 are parallel to the first circuit board 201, and the length of the second panel 312 and the third panel 313 is greater than the circuit boards in the first circuit board group 21. When the circuit boards in the first circuit board group 21 are placed in the installation box 31, there is a gap between the circuit boards and the first panel 311, and the gap space can be used as a mixing chamber 52. By setting the gap space, the circuit boards of the first circuit board group 21 can be separated from other fan components. Achieve gas communication between them. Achieve gas communication between the circuit board or the installation box and other fan assemblies means that the airflow can flow from the circuit board to other fan assemblies or from other fan assemblies to the circuit board to take away the heat generated by the circuit board and achieve heat dissipation of the circuit board. Through holes 315 are provided in the second panel 312 and the third panel 313. When the first fan assembly 401 fails, the hot air generated on the first circuit board 201 corresponding to the first fan assembly 401 can pass through the through holes 315 on the second panel 312 and the third panel 313 of the first installation box 301, and discharge the hot air through the second fan assembly 402 adjacent to the first fan assembly 401. Of course, in some cases, such as when a fan assembly 41 corresponds to only one circuit board, a through hole 315 can also be set only on the panel closer to the circuit board, such as setting a through hole 315 only on the second panel 312 or the third panel 313, so as to achieve the purpose of discharging the hot air generated by the first circuit board 201 corresponding to the failed first fan assembly 401; in other cases, such as when a fan assembly 41 corresponds to two circuit boards, a through hole can be set only on the panel closer to the second fan assembly 402, so that the hot air generated by the circuit board can be discharged through the fan assembly closer. In this application, the number of panels with through holes is not limited, as long as the purpose of discharging the hot air generated by the circuit board corresponding to the failed fan assembly can be achieved when the fan assembly fails. When a through hole 315 is set on the second panel 312 or the third panel 313, the through hole 315 can be set only at the position of the gap between the circuit board and the first panel 311, or the through hole can be set near the front half of the first panel 311, or the through hole can be set on the entire panel. In this application, the position of the through hole is not limited, as long as the purpose of discharging the hot air generated by the circuit board in the first circuit board group can be achieved. In addition, the shape and size of the through hole 315 are not limited in the present application. The shape of the through hole 315 can be circular, square, rectangular, diamond-shaped, etc. The size of the through hole can be set as needed. In the three-dimensional diagram shown in Figure 2, the through hole 315 is a rectangular through hole. By setting a larger through hole 315, the ventilation area can be increased.

In the heat dissipation system, the fan assembly 41 and the installation box 31 are closely arranged without any gap, that is, the side of the fan assembly 41 facing the first circuit board group 21 is in contact with the installation box 31. If there is a gap between the fan assembly 41 and the installation box 31, when the first fan assembly 401 fails, the second fan assembly 402 adjacent thereto may directly draw air from the gap, affecting the heat dissipation performance. There is a gap between the fan assembly 41 and the circuit board in the installation box 31, such as the mixed flow cavity 52 shown in FIG5a. When one of the fan assemblies 401 fails, the other fan assemblies (such as the second fan assembly 402) adjacent to the failed fan assembly 401 can draw away the hot air generated by the circuit board corresponding to the failed fan assembly 401 through the gap between the circuit board and the fan assembly 41.

Please refer to Figure 5a, when all the fan assemblies 41 are working normally, the anti-backflow devices corresponding to the fan assemblies 41 are in the first working state, the hot air generated by the circuit boards in the first circuit board group 21 and the second circuit board group 22 will be drawn away by the corresponding fan assemblies 41, and the cooling system is working normally.

In Figures 5a to 5c, the first fan assembly 401 corresponds to the first installation box 301, and the second fan assembly 402 adjacent to the first fan assembly 401 corresponds to the second installation box 302. Referring to Figures 5b and 5c, when the first fan assembly 401 in the middle fails, no matter the first fan assembly 401 is in place or not, the first backflow prevention device 601 on the first installation box 301 corresponding to the first fan assembly 401 is in the second working state. At this time, because there is a certain gap between the first circuit board 201 and the first panel 311 in the heat dissipation system, that is, there is a certain gap between the first circuit board 201 and the first fan assembly 401, and through holes are provided on the second panel 312 and/or the third panel 313, a mixed flow chamber 52 is formed between the installation boxes 31 of the first circuit board group 21, and the first circuit board 201 in the first installation box 301 and other fan assemblies (such as the second fan assembly 402) can be gas-connected, and the hot air generated by the first circuit board 201 corresponding to the first fan assembly 401 will pass through the mixed flow chamber 52 and be drawn away by the second fan assembly 402 adjacent to the failed first fan assembly 401. And because the first fan assembly 401 corresponds to the first The backflow prevention device 601 is in the second working state, and the second fan assembly 402 will not draw air from the first fan assembly 401 due to the failure of the first fan assembly 401, so the heat dissipation system can still work normally.

In summary, the heat dissipation system in Figure 5 has the following advantages: (1) When the failed fan assembly 401 is in place or not in place, the purpose of cooling the circuit board 201 corresponding to the failed fan assembly 401 can be achieved, and there will be no situation where the circuit board 201 cannot dissipate heat or the air duct is short-circuited; (2) The design of the heat dissipation system is relatively simple, and only requires the provision of an anti-backflow device 601 on the panel 311 of the corresponding installation box 31 close to the fan assembly 41, and the provision of through holes 315 on the second panel 312 and the third panel 313 of the installation box 31 parallel to the first circuit board 201, without the need to add other additional structural components.

Please refer to Figures 6a to 6c, which are top views of another novel electronic device heat dissipation system provided in an embodiment of the present application. The heat dissipation system is used to dissipate heat from a circuit board assembly, wherein the circuit board assembly includes a first circuit board group 21 and a second circuit board group 22, wherein the first circuit board group 21 includes at least a first circuit board 201 and a second circuit board 202, wherein the first circuit board 201 and the second circuit board 202 are exchange modules; and the second circuit board group 22 includes at least a third circuit board and a fourth circuit board, wherein the third circuit board and the fourth circuit board are business modules. The heat dissipation system includes a fan assembly 41 and an installation box 31 corresponding to each circuit board in the first circuit board group 21, wherein the first circuit board 201 corresponds to the first installation box 301, and the second circuit board 202 corresponds to the second installation box 302. Each installation box 31 includes a first panel 311 disposed opposite to the fan assembly 41, and a second panel 312 and a third panel 313 adjacent to the first panel 311 and disposed in a direction parallel to the first circuit board 201.

It can be understood that the correspondence between the first circuit board group 21 and the fan assembly 41 is not particularly limited in this application. For example, each switching module can correspond to a fan assembly (for example, a fan frame), or the same fan assembly can correspond to multiple switching modules. The second panel 312 and the third panel 313 of the installation box 31 are parallel to the first circuit board 201, and the lengths of the second panel 312 and the third panel 313 are equal to the first circuit board 201, or slightly larger than the first circuit board 201. In the embodiment of the present application, the length direction is the direction extending from the business module to the switching module as shown in the figure, and the width direction is the extension direction of the vertical insertion of the switching module. The first circuit board 201 is placed in the first installation box 301, and there is no gap or the gap is very small between the first circuit board 201 and the first panel 311. A through hole 314 is provided on the first panel 311, and the hot air generated by the first circuit board 201 can be discharged through the through hole 314 on the first panel 311. The installation box 31 is provided with a first backflow prevention device 602, which is connected to the installation box 31 through a first connector 701, wherein the first connector 701 may be a hard strip with a buckle, and the material of the hard strip may be plastic or metal, which is not limited in the present application, and the hard strip may be used to fix the first backflow prevention device 602 to the first panel 311 of the installation box 31. The first connector 701 may also be a plurality of narrow strips, which may be connected to the second panel 312 and the third panel 313 of the installation box, and the width of the narrow strips is less than the width of the second panel 311 or the third panel 312, and the first backflow prevention device 602 is fixedly connected to the installation box 31 through the narrow strips, and the connection between the narrow strip and the first backflow prevention device 602 and the second panel 312 and the third panel 313 may be connected by screws and nuts, or by gluing, or by other connection methods, which is not limited in the present application. The narrow strip may be provided with a plurality of through holes 711 or without through holes, and both can achieve the purpose of enabling gas communication between the circuit board in the installation box 31 and other fan components. The first connecting member 701 can also be two panels arranged opposite to each other, whose width is the same as that of the second panel 312 or the third panel 313, and the panels are provided with through holes 711. When the first fan component 401 corresponding to the first installation box 301 fails, the hot air generated by the first circuit board 201 can pass through the through holes 711 and pass through the first fan component 401. The air is discharged from the second fan assembly 402 adjacent to the first connecting member 401. The shape and material of the first connecting member 701 are not limited in the present application, as long as the first installation box can be gas-connected with other fan assemblies after being connected through the first connecting member. Similarly, in this embodiment, the first anti-backflow device 602 can have a first working state of an open state or a second working state of a closed state. The present application does not limit the structural type and working mode of the first anti-backflow device, as long as it can achieve the purpose of preventing backflow.

In the heat dissipation system, the fan assembly 41 and the first anti-backflow device 602 are closely arranged without any gap, that is, the side of the fan assembly 41 facing the first circuit board group 21 is in contact with the first anti-backflow device 602. The fan assembly 41 and the first anti-backflow device 602 are closely arranged to avoid the situation that when the first fan assembly 401 fails, the second fan assembly 402 adjacent thereto directly draws air from the gap, thereby affecting the heat dissipation performance. There is a gap between the fan assembly 41 and the circuit board in the installation box 31, and the gap can form a mixed flow chamber 52 as shown in FIG. 6a. When one of the fan assemblies (such as the first fan assembly 401) fails, the other fan assemblies (such as the second fan assembly 402) adjacent to the failed fan assembly 401 can draw away the hot air generated by the circuit board corresponding to the failed fan assembly 401 through the mixed flow chamber 52 between the circuit board and the fan assembly 41.

Please refer to Figure 6a, when all the fan assemblies 41 are working normally, the anti-backflow devices 602 on the fan assemblies 41 are in the first working state of being turned on, and the hot air generated by the circuit boards in the first circuit board group 21 and the second circuit board group 22 will be drawn away by the corresponding fan assemblies 41, and the cooling system is working normally.

In Fig. 6a to Fig. 6c, the first fan assembly 401 corresponds to the first installation box 301, and the second fan assembly 402 adjacent to the first fan assembly 401 corresponds to the second installation box 302. Please refer to Fig. 6b and Fig. 6c, when the first fan assembly 401 located in the middle fails, no matter the first fan assembly 401 is in place or not, the first anti-backflow device 602 corresponding to the first installation box 301 is in the second working state of closing. At this time, because there is a certain gap between the first installation box 301 and the first anti-backflow device 602 in the heat dissipation system, and the first connecting member 701 enables the first installation box 301 to be gas-connected with other fan assemblies (such as the second fan assembly 402), therefore, the hot air generated by the first circuit board 201 will be drawn away by the adjacent second fan assembly 402. And because the first anti-backflow device 602 corresponding to the first installation box 301 is in the second working state, the second fan assembly 402 will not draw air from the first fan assembly 401 due to the failure of the first fan assembly 401, so the heat dissipation system can still work normally.

In summary, the cooling system in Figures 6a to 6c has the following advantages: (1) When the failed fan assembly (such as the first fan assembly 401 in Figures 6b and 6c) is in place or not in place, the purpose of cooling the circuit board corresponding to the failed fan assembly 401 can be achieved, and there will be no situation where the circuit board cannot dissipate heat or the air duct is short-circuited; (2) The design of the cooling system is relatively simple, the anti-backflow device 602 is separately arranged from the installation box and is connected through the first connecting member 701, and there is no need to add other structural components to ensure that the cooling system can work normally when the fan fails; and in this cooling system, when the anti-backflow device 602 fails, it can be directly replaced for easy maintenance.

Please refer to Figures 7a to 7c, which are top views of another electronic device heat dissipation system provided in an embodiment of the present application. The heat dissipation system is used to dissipate heat from a circuit board assembly, wherein the circuit board assembly includes a first circuit board group 21 and a second circuit board group 22, the first circuit board group 21 includes at least a first circuit board 201 and a second circuit board 202, the first circuit board 201 and the second circuit board 202 are switching modules; the second circuit board group 22 includes at least a third circuit board and a fourth circuit board, the third circuit board and the fourth circuit board are business modules. The heat dissipation system includes a fan assembly 41 and an installation box 31 corresponding to each circuit board in the first circuit board group 21, the installation box 31 is used to accommodate the circuit boards in the first circuit board group 21, wherein the first circuit board 201 corresponds to the first installation box 301, and the second circuit board 202 corresponds to the second installation box 302. Each installation box 31 includes a first surface arranged opposite to the fan assembly 41 The mounting box 31 comprises a panel 311, and a second panel 312 and a third panel 313 adjacent to the first panel 311 and arranged in a direction parallel to the circuit board. The second panel 312 and the third panel 313 of the mounting box 31 are parallel to the circuit board, and the lengths of the second panel 312 and the third panel 313 are equal to the circuit board, or slightly larger than the circuit board. The circuit board is placed in the mounting box 31, and there is no gap or a very small gap between the circuit board and the first panel 311. The first panel 311 is provided with a through hole 314, and the hot air generated by the first circuit board can be discharged through the through hole 314 on the first panel 311.

A gap is provided between the installation box 31 and the fan assembly 41, and the gap space can be used as a mixed flow chamber 52. When the first fan assembly 401 corresponding to the first installation box 301 fails, the first installation box 301 can be gas-connected with other fan assemblies (such as the second fan assembly 402). A second backflow prevention device 603 is provided on the fan assembly 41, and the second backflow prevention device 603 can have a first working state of an open state or a second working state of a closed state. The present application does not limit the structural type and working mode of the second backflow prevention device, as long as it can achieve the purpose of backflow prevention. In Figures 7a to 7c, the second backflow prevention device 603 is arranged on the first face of the fan assembly 41 parallel to the first panel 311 and away from the first panel 311, and this is not limited in the present application. The second backflow prevention device 603 can also be arranged on the second face of the fan assembly 41 parallel to the first panel 311 and close to the first panel 311, and both settings can meet the conditions.

Please refer to Figure 7a, when all the fan assemblies 41 are working normally, the second anti-backflow devices 603 on the fan assemblies 41 are in the first working state, and the hot air generated by the circuit boards in the first circuit board group 21 and the second circuit board group 22 will be drawn away by the corresponding fan assemblies 41, and the cooling system is working normally.

In FIG. 7a to FIG. 7c, the first fan assembly 401 corresponds to the first installation box 301, and the second fan assembly 402 adjacent to the first fan assembly 401 corresponds to the second installation box 302. Referring to FIG. 7b, when the first fan assembly 401 located in the middle fails and the first fan assembly 401 is still in place, the second backflow prevention device 603 on the first fan assembly 401 is in the second working state. At this time, because there is a certain gap between the first fan assembly 401 and the first installation box 301 in the heat dissipation system, the hot air generated by the first circuit board 201 will pass through the mixed flow chamber 52 and be drawn away by the second fan assembly 402 adjacent to the first fan assembly 401. Because the first fan assembly 401 is still in place and the second backflow prevention device 603 is in the second working state, the second fan assembly 402 will not draw air from the first fan assembly 401 due to the failure of the first fan assembly 401, so the heat dissipation system can still work normally.

Please refer to FIG. 7c, when the first fan assembly 401 located in the middle fails and the first fan assembly 401 is not in place, when the first fan assembly 401 is removed for maintenance, the first backflow prevention device 604 is connected to the first installation box 301. The first backflow prevention device includes a panel 611 and a second connector 701. Because the first backflow prevention device only needs to work when the fan assembly is not in place, the panel 611 on the second backflow prevention device can only include a second working state of the closed state, and the panel 611 can be a solid panel without holes, or a backflow prevention device set to the closed state, which is not limited in this application. The second connector 702 is used to fix the first backflow prevention device to the first installation box 301. Similar to the first connector 701, the second connector 702 can include a variety of shapes and materials, and the shape and material of the second connector 702 are not limited in this application, as long as the first installation box 301 can be connected with other fan assemblies (such as the second fan assembly 402) through the second connector 702. At this time, because there is a certain gap between the first installation box 301 and the first backflow prevention device 604 in the heat dissipation system, and the second connecting member 702 allows the first installation box 301 to be gas-connected with other fan assemblies (such as the second fan assembly 402), the hot air generated by the first circuit board 201 will be drawn away by the second fan assembly 402 adjacent to the first fan assembly 401. And because the second backflow prevention device 604 corresponding to the first fan assembly 401 is in the second working state, the second fan assembly 402 will not fail due to the failure of the first fan assembly 401. Air is drawn from the first fan assembly 401, so the heat dissipation system can still work normally.

Through the cooling system in Figures 5a to 5c, Figures 6a to 6c and Figures 7a to 7c, when the failed fan assembly is in place or not in place, the purpose of cooling the circuit board corresponding to the failed fan assembly can be achieved, and there will be no situation where the circuit board cannot dissipate heat or the air duct is short-circuited, so that the electronic equipment using the cooling system can work stably.

The embodiment of the present application also provides an electronic device, which can be a communication device, a server, a supercomputer, or a router, a switch, and the like. The electronic device includes a circuit board assembly and a heat dissipation system in any of the aforementioned embodiments, wherein the heat dissipation system can be used to dissipate heat from the circuit board assembly. Due to the heat dissipation system in the embodiment of the present application, when the failed fan assembly is in place or not in place, the circuit board corresponding to the failed fan assembly can be dissipated, so there will be no situation where the circuit board cannot dissipate heat or the air duct is short-circuited, so that the electronic device can work stably under any circumstances.

Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims (17)

A heat dissipation system, the heat dissipation system is used to dissipate heat from a circuit board assembly, comprising: A mounting box for accommodating a circuit board of the circuit board assembly; and Fan assembly, including: a first fan assembly, the first fan assembly corresponding to the installation box and used to dissipate heat from the circuit board accommodated in the installation box; and a second fan assembly adjacent to the first fan assembly; Wherein, a first distance is set between the circuit board and the first fan assembly; The first fan assembly is correspondingly provided with a first backflow prevention device, the first backflow prevention device is connected to the installation box; the first backflow prevention device has a first working state of being in a closed state; and When the first backflow prevention device is in the first working state, gas communication is established between the interior of the installation box and the second fan assembly. The heat dissipation device according to claim 1, wherein when the first fan assembly fails, the first backflow prevention device is in the first working state. The heat dissipation system according to claim 1, wherein the installation box comprises a first panel facing the first fan assembly, and a second panel and a third panel connected to the first panel and arranged parallel to the circuit board; The first panel is provided with a first backflow prevention device, and The second panel and the third panel are provided with through holes. The heat dissipation system according to claim 3, wherein the lengths of the second panel and the third panel are greater than the length of the circuit board. According to the heat dissipation system described in claim 3, when the first backflow prevention device is in the first working state, the circuit board is in gas communication with the second fan assembly through the through holes on the second panel and/or the third panel. The heat dissipation system according to claim 1, wherein the installation box comprises a first panel facing the first fan assembly, and a second panel and a third panel connected to the first panel and arranged parallel to the circuit board; and The first panel is provided with a through hole. The heat dissipation system according to claim 6, wherein the first backflow prevention device is connected to the first panel through a first connecting member. The heat dissipation system according to claim 7, wherein the first connecting member is a narrow strip. The heat dissipation system according to claim 6, wherein a second distance is set between the first panel and the first fan assembly; and The first backflow prevention device is connected to the second panel and the third panel respectively through the first connecting member. The heat dissipation system according to claim 6, wherein, when the first backflow prevention device is in the first working state, the first circuit board is in gas communication with the second fan assembly through a through hole provided on the first panel. The heat dissipation system according to any one of claims 1 to 10, wherein the first backflow prevention device further has a second working state of being in an open state. The heat dissipation system according to any one of claims 1 to 10, wherein the first backflow prevention device comprises The frame and the backflow prevention sheet, and the backflow prevention sheet is rotatably connected to the frame. The heat dissipation system according to claim 12 is characterized in that the anti-backflow sheets are arranged in a vertical direction or in a horizontal direction. A heat dissipation system, the heat dissipation system is used to dissipate heat from a circuit board assembly, comprising: A mounting box for accommodating a circuit board of the circuit board assembly; and Fan assembly, including: a first fan assembly, the first fan assembly corresponding to the installation box and used to dissipate heat from the circuit board accommodated in the installation box; and a second fan assembly adjacent to the first fan assembly; Wherein, a first distance is set between the circuit board and the first fan assembly; The first fan assembly is correspondingly provided with a first backflow prevention device and a second backflow prevention device, the second backflow prevention device is arranged on a side of the first backflow prevention device away from the installation box; the first backflow prevention device is detachably connected to the installation box; the first backflow prevention device has a first working state of being in a closed state; and When the first backflow prevention device is connected to the installation box and is in the first working state, gas communication is established between the interior of the installation box and the second fan assembly. The heat dissipation system according to claim 14, wherein: When the first fan assembly fails and is in place, the second backflow prevention device is in a closed state; and When the first fan assembly fails and is not in place, the first backflow prevention device is in the first working state. The heat dissipation system according to claim 14, wherein the first backflow prevention device is a non-porous panel. An electronic device comprising a heat dissipation system as claimed in any one of claims 1 to 16.