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WO2024075839A1 - Système de robot de transport de substrat et procédé de correction d'une position de placement d'un substrat et/ou d'une position de retrait d'un substrat par un robot de transport de substrat - Google Patents

Système de robot de transport de substrat et procédé de correction d'une position de placement d'un substrat et/ou d'une position de retrait d'un substrat par un robot de transport de substrat Download PDF

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Publication number
WO2024075839A1
WO2024075839A1 PCT/JP2023/036553 JP2023036553W WO2024075839A1 WO 2024075839 A1 WO2024075839 A1 WO 2024075839A1 JP 2023036553 W JP2023036553 W JP 2023036553W WO 2024075839 A1 WO2024075839 A1 WO 2024075839A1
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WO
WIPO (PCT)
Prior art keywords
target member
substrate
horizontal plane
horizontal
hand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2023/036553
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English (en)
Japanese (ja)
Inventor
武士 芝田
知 橋崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kawasaki Heavy Industries Ltd
Kawasaki Motors Ltd
Original Assignee
Kawasaki Heavy Industries Ltd
Kawasaki Jukogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kawasaki Heavy Industries Ltd, Kawasaki Jukogyo KK filed Critical Kawasaki Heavy Industries Ltd
Priority to CN202380070730.6A priority Critical patent/CN120092317A/zh
Priority to KR1020257010148A priority patent/KR20250058030A/ko
Publication of WO2024075839A1 publication Critical patent/WO2024075839A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J13/00—Controls for manipulators
    • B25J13/08—Controls for manipulators by means of sensing devices, e.g. viewing or touching devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/02—Sensing devices
    • B25J19/021—Optical sensing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/16—Programme controls
    • B25J9/1679—Programme controls characterised by the tasks executed
    • B25J9/1692—Calibration of manipulator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • This disclosure relates to a substrate transport robot system and a method for correcting at least one of the placement and pick-up positions of a substrate by a substrate transport robot.
  • Substrate transport robots that correct the placement position of a substrate in a horizontal plane are known.
  • Japanese Patent Publication No. 6637494 discloses a substrate transport robot that corrects the placement position of a substrate in a horizontal plane based on the identified center position of a target in the horizontal plane and the relative positional relationship in the horizontal plane between the center position of the target and the placement location of the substrate that has been acquired in advance.
  • the target is placed at a predetermined position relative to the placement location of the substrate in order to correct the placement position of the substrate in the horizontal plane.
  • the substrate transport robot disclosed in Patent Publication No. 6637494 locates the central position of a target in a horizontal plane as follows: First, a hand attached to the end of the robot arm is brought closer to the target until the target begins to be detected by the sensor. The hand is then swung. The hand offset amount is calculated based on the change in the sensor detection signal caused by swung the hand. The hand position is shifted based on the calculated offset amount. Then, the hand swing, calculation of the hand offset amount, shifting of the hand position, etc. are repeated until the central position of the target in the horizontal plane is identified.
  • This disclosure has been made to solve the problems described above, and one objective of this disclosure is to provide a substrate transport robot system that can shorten the time required to correct at least one of the placement position and pick-up position of a substrate in a horizontal plane, and a method for correcting at least one of the placement position and pick-up position of a substrate by a substrate transport robot.
  • a substrate transport robot system includes a substrate transport robot that transports a substrate, a horizontal target member that has a circular shape when viewed from above and below and is used to correct at least one of the placement position and pick-up position of the substrate in a horizontal plane, and a control unit.
  • the substrate transport robot includes a robot arm, a hand attached to the tip of the robot arm, and a detection unit that is disposed on the hand and detects the outer periphery of the horizontal target member.
  • the control unit detects the horizontal target member obtained using the detection unit by bringing the hand close to the horizontal target member from a first direction in the horizontal plane.
  • the center position of the horizontal target member in the horizontal plane is obtained, and at least one of the placement position and removal position of the substrate in the horizontal plane is corrected based on the obtained center position of the horizontal target member in the horizontal plane and the relative positional relationship in the horizontal plane between the center position of the horizontal target member and the placement location of the substrate that has been obtained in advance.
  • the control unit obtains the center position of the horizontal target member in the horizontal plane based on a first tangent corresponding to the outer periphery of the horizontal target member obtained by approaching the hand to the horizontal target member from a first direction in the horizontal plane and using the detection unit, and a second tangent corresponding to the outer periphery of the horizontal target member obtained by approaching the hand to the horizontal target member from a second direction in the horizontal plane different from the first direction and using the detection unit.
  • the center position of the horizontal target member in the horizontal plane can be obtained quickly compared to the case where the hand is swung, the amount of the hand offset is calculated, the position of the hand is shifted, etc. are repeatedly performed to identify the center position of the target member in the horizontal plane.
  • at least one of the placement position and the pick-up position of the substrate in the horizontal plane can be quickly corrected.
  • the time required to correct at least one of the placement and removal positions of the substrate in the horizontal plane can be reduced.
  • a method for correcting at least one of the placement position and pick-up position of a substrate by a substrate transport robot comprises a robot arm, a hand attached to the tip of the robot arm, and a detection unit that detects a horizontal target member having a circular shape when viewed from the top-bottom direction and for correcting at least one of the placement position and pick-up position of a substrate in a horizontal plane
  • the method for correcting at least one of the placement position and pick-up position of a substrate by a substrate transport robot that transports a substrate comprises: a robot arm; a hand attached to the tip of the robot arm; and a detection unit that detects a horizontal target member having a circular shape when viewed from the top-bottom direction and for correcting at least one of the placement position and pick-up position of a substrate in a horizontal plane, the method comprising: bringing the hand close to the horizontal target member from a first direction in the horizontal plane; using the hand to obtain
  • the hand is brought close to the horizontal target member from a first direction in a horizontal plane, and a first tangent to the outer periphery of the horizontal target member is obtained using the detection unit. Also, the hand is brought close to the horizontal target member from a second direction in the horizontal plane different from the first direction, and a second tangent to the outer periphery of the horizontal target member is obtained using the detection unit. Also, the center position of the horizontal target member is obtained based on the obtained first tangent and the obtained second tangent.
  • the center position of the horizontal target member can be obtained immediately based on the first tangent and the second tangent.
  • the time required to correct at least one of the placement position and pick-up position of the substrate in the horizontal plane can be shortened.
  • a substrate transport robot system that can shorten the time required to correct at least one of the placement position and pick-up position of a substrate in a horizontal plane, and a method for correcting at least one of the placement position and pick-up position of a substrate by a substrate transport robot.
  • 1 is a plan view showing an overall configuration of a substrate transport robot system according to an embodiment of the present disclosure.
  • 1 is a perspective view showing a substrate transport robot according to an embodiment of the present disclosure;
  • 11A and 11B are diagrams for explaining acquisition of a first tangent in a substrate transport robot system according to an embodiment of the present disclosure.
  • 13A and 13B are diagrams for explaining acquisition of a second tangent in the substrate transport robot system according to the embodiment of the present disclosure.
  • 11A and 11B are diagrams for explaining acquisition of the center position of a target member in a substrate transport robot system according to an embodiment of the present disclosure.
  • 11A and 11B are diagrams for explaining acquisition of the position of a target member in the up-down direction in a substrate transport robot system according to an embodiment of the present disclosure.
  • 13A and 13B are diagrams for explaining acquisition of the inclination of the coordinate system of a substrate placement location relative to the coordinate system of a robot arm in a substrate transport robot system according to an embodiment of the present disclosure.
  • 13A and 13B are diagrams illustrating a state in which a direction in which a hand approaches a target member is not perpendicular to the direction of detection light in the substrate transport robot system according to the embodiment of the present disclosure.
  • 13A and 13B are diagrams for explaining acquisition of the inclination in a direction perpendicular to the direction of the detection light with respect to the direction in which the hand approaches the target member in the substrate transport robot system according to the embodiment of the present disclosure.
  • FIG. 11 is a diagram illustrating a state in which a direction in which a hand approaches a target member is perpendicular to the direction of detection light in the substrate transport robot system according to the embodiment of the present disclosure.
  • FIG. 11 is a flow chart showing a correction flow for a substrate placement position in a substrate transport robot system according to an embodiment of the present disclosure.
  • the substrate transport robot system 100 includes a substrate transport robot 10 and a target member 20.
  • the target member 20 is an example of a horizontal target member, a first horizontal target member, and an upper and lower target member.
  • the substrate transport robot 10 is a robot that transports substrates W to a storage location 200 for substrates W.
  • the storage location 200 for substrates W is, for example, a FOUP (Front Opening Unify Pod).
  • the target member 20 is a member for correcting the placement position PP of the substrate W in the horizontal plane and in the vertical direction by the substrate transport robot 10. That is, the target member 20 is a member for correcting the placement position PP of the substrate W to match the placement site 200 for the substrate W.
  • the target member 20 is placed at a predetermined position relative to the placement site 200 for the substrate W. That is, the relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the placement site 200 for the substrate W does not change.
  • the target member 20 has a circular shape when viewed from the vertical direction.
  • the substrate transport robot 10 includes a robot arm 11, a hand 12, and a control unit 13.
  • the robot arm 11 is a horizontal multi-joint type robot arm.
  • the robot arm 11 is controlled by the control unit 13 to operate multiple joints.
  • the control unit 13 controls the operation of the robot arm 11, the operation of the hand 12, etc.
  • the control unit 13 includes a processor such as a CPU (Central Processing Unit) and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).
  • a processor such as a CPU (Central Processing Unit) and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).
  • ROM Read Only Memory
  • RAM Random Access Memory
  • the hand 12 is attached to the tip of the robot arm 11.
  • the hand 12 holds the substrate W.
  • the hand 12 includes a first tip 12a and a second tip 12b that are bifurcated.
  • the robot arm 11 includes a detection unit 14.
  • the detection unit 14 is a mapping sensor that detects the presence or absence of a substrate W in the substrate W storage area 200.
  • the detection unit 14 is disposed on the hand 12.
  • the detection unit 14 is a transmission sensor that detects the target member 20 based on whether or not the detection light DL passing through the space S between the first tip 12a and the second tip 12b is blocked. Note that while FIG. 3 shows an example in which the detection light DL travels from the second tip 12b side to the first tip 12a side, the detection light DL may travel from the first tip 12a side to the second tip 12b side.
  • the control unit 13 causes the hand 12 to approach the target member 20 from a first direction in a horizontal plane, and obtains a first tangent TL1 (see Fig. 5) corresponding to the outer periphery 20b of the target member 20 using the detection unit 14. Specifically, the control unit 13 controls the operation of the robot arm 11 so that the hand 12 approaches the target member 20 from the first direction in a horizontal plane until the outer periphery 20b of the target member 20 is detected by the detection unit 14.
  • control unit 13 obtains, as the first tangent TL1, a straight line along the direction of the detection light DL at the position of the hand 12 where the outer periphery 20b of the target member 20 is detected by the detection unit 14.
  • the direction in which the hand 12 approaches the target member 20 is parallel to the Y direction of the coordinate system C1 of the robot arm 11.
  • the control unit 13 causes the hand 12 to approach the target member 20 from a second direction in the horizontal plane different from the first direction, and acquires a second tangent TL2 (see FIG. 5) corresponding to the outer periphery 20b of the target member 20 using the detection unit 14.
  • the control unit 13 controls the operation of the robot arm 11 so as to cause the hand 12 to approach the target member 20 from the second direction in the horizontal plane until the detection unit 14 detects the outer periphery 20b of the target member 20.
  • the control unit 13 acquires, as the second tangent TL2, a straight line along the direction of the detection light DL at the position of the hand 12 where the detection unit 14 detects the outer periphery 20b of the target member 20.
  • the control unit 13 obtains the center position 20a of the target member 20 in the horizontal plane based on the first tangent TL1 and the second tangent TL2. Specifically, the control unit 13 obtains the intersection of the perpendicular line PL1 of the first tangent TL1 and the perpendicular line PL2 of the second tangent TL2 as the center position 20a of the target member 20.
  • control unit 13 may use, for example, the radius R of the target member 20 in addition to the first tangent TL1 and the second tangent TL2 when obtaining the center position 20a of the target member 20 in the horizontal plane.
  • the control unit 13 corrects the placement position PP of the substrate W in the horizontal plane based on the acquired center position 20a of the target member 20 in the horizontal plane and the previously acquired relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the placement site 200 of the substrate W. Specifically, the control unit 13 corrects the placement position PP of the substrate W in the horizontal plane based on the acquired center position 20a of the target member 20 in the horizontal plane and the previously acquired relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the center position 200a of the placement site 200 of the substrate W. Note that the control unit 13 previously acquires the relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the center position 200a of the placement site 200 of the substrate W before correcting the placement position PP of the substrate W in the horizontal direction.
  • the control unit 13 acquires the position 20c of the target member 20 in the vertical direction based on the timing at which the detection unit 14 switches between a state in which the target member 20 is detected in the vertical direction and a state in which the target member 20 is not detected in the vertical direction, which is acquired by moving the hand 12 in the vertical direction relative to the target member 20. Specifically, the control unit 13 moves the hand 12 in the vertical direction relative to the target member 20 from a state in which the detection unit 14 detects the outer circumferential edge portion 20b of the target member 20 until a state in which the detection unit 14 does not detect the outer circumferential edge portion 20b of the target member 20.
  • control unit 13 acquires the position 20c of the target member 20 in the vertical direction based on the position of the hand 12 in the vertical direction at the timing at which the detection unit 14 switches between a state in which the outer circumferential edge portion 20b of the target member 20 is detected and a state in which the detection unit 14 does not detect the outer circumferential edge portion 20b of the target member 20.
  • the control unit 13 corrects the placement position PP of the substrate W in the vertical direction based on the acquired position 20c of the target member 20 in the vertical direction and the previously acquired relative positional relationship in the vertical direction between the position 20c of the target member 20 and the placement site 200 for the substrate W. Note that the control unit 13 acquires the relative positional relationship in the vertical direction between the position 20c of the target member 20 and the placement site 200 for the substrate W in advance before correcting the placement position PP of the substrate W in the vertical direction.
  • the coordinate system C2 of the substrate W placement site 200 may be inclined relative to the coordinate system C1 of the robot arm 11 in the horizontal plane.
  • the accuracy of correcting the placement position PP of the substrate W in the horizontal plane decreases. Therefore, when correcting the placement position PP of the substrate W in the horizontal plane, it is preferable for the substrate transport robot 10 to recognize the inclination ⁇ of the coordinate system C2 of the substrate W placement site 200 relative to the coordinate system C1 of the robot arm 11 in the horizontal plane.
  • the substrate transport robot 10 acquires the inclination ⁇ of the coordinate system C2 of the substrate W placement site 200 relative to the coordinate system C1 of the robot arm 11 in the horizontal plane as follows.
  • the substrate transport robot system 100 includes a target member 21. Similar to the target member 20, the target member 21 is a member for correcting the placement position PP of the substrate W in the horizontal plane and in the vertical direction by the substrate transport robot 10.
  • the target member 21 is disposed at a different position from the target member 20 in the horizontal plane. Specifically, the target member 21 is disposed on the opposite side of the target member 20.
  • the target member 21 is also disposed in the horizontal plane such that the straight line connecting the center position 20a of the target member 20 and the center position 21a of the target member 21 is parallel to the X direction of the coordinate system C2 of the substrate W placement site 200.
  • the target member 21 is an example of a second horizontal target member and a vertical target member.
  • control unit 13 obtains the center position 20a of the target member 20 in the horizontal plane and the center position 21a of the target member 21 in the horizontal plane using the method described above.
  • the control unit 13 acquires the tilt ⁇ of the coordinate system C2 of the substrate W placement site 200 relative to the coordinate system C1 of the robot arm 11 in the horizontal plane based on the center position 20a of the target member 20 in the horizontal plane, the center position 21a of the target member 21 in the horizontal plane, and the previously acquired relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the center position 21a of the target member 21.
  • the control unit 13 acquires the angle in the X direction of the coordinate system C2 of the substrate W placement site 200 relative to the X direction of the coordinate system C1 of the robot arm 11 in the horizontal plane as the tilt ⁇ of the coordinate system C2 of the substrate W placement site 200 relative to the coordinate system C1 of the robot arm 11.
  • the control unit 13 acquires the relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the center position 21a of the target member 21 before correcting the placement position PP of the substrate W in the horizontal direction.
  • the robot arm's coordinate system is calibrated so that the direction in which the hand approaches the target part is perpendicular to the direction of the detection light.
  • the detection unit 14 when the detection unit 14 is attached to the hand 12 so as to be shifted from the design position, the direction in which the hand 12 approaches the target member 20 and the direction of the detection light DL may not be orthogonal. In this case, the accuracy of correcting the placement position PP of the substrate W in the horizontal plane decreases. Therefore, when correcting the placement position PP of the substrate W in the horizontal plane, it is preferable for the substrate transport robot 10 to make the direction in which the hand 12 approaches the target member 20 and the direction of the detection light DL orthogonal.
  • the substrate transport robot 10 calibrates the coordinate system C1 of the robot arm 11 as follows so that the direction in which the hand 12 approaches the target member 20 and the direction of the detection light DL are orthogonal to each other.
  • the control unit 13 obtains the direction of the detection light DL with respect to the hand 12 based on the multiple positions of the hand 12 where the detection light DL is blocked by bringing the hand 12 closer to the target member 20 while changing the position where the detection light DL is blocked. Specifically, the control unit 13 brings the hand 12 closer to the target member 20 and obtains a first position P1 of the hand 12 where the detection light DL is blocked. Then, the control unit 13 brings the hand 12 closer to the target member 20 while moving it in the X direction and obtains a second position P2 of the hand 12 where the detection light DL is blocked and different from the first position P1.
  • control unit 13 obtains the direction of the straight line connecting the first position P1 and the second position P2 of the hand 12 with respect to the X direction of the coordinate system C1 of the robot arm 11 as the inclination ⁇ of the detection light DL with respect to the direction perpendicular to the approaching direction of the hand 12. Note that, in order to obtain the direction of the detection light DL with respect to the hand 12, three or more positions where the detection light DL is blocked may be obtained.
  • the control unit 13 calibrates the coordinate system C1 of the robot arm 11 based on the acquired direction of the detection light DL so that the direction in which the hand 12 approaches the target member 20 is perpendicular to the direction of the detection light DL. Specifically, the control unit 13 converts the coordinate system C1 of the robot arm 11 (see FIG.
  • step S1 the hand 12 approaches the target member 20 from a first direction in a horizontal plane, and the detection unit 14 is used to obtain a first tangent line TL1 corresponding to the outer peripheral edge portion 20b of the target member 20.
  • step S2 the hand 12 is brought closer to the target member 20 from a second direction in the horizontal plane different from the first direction, and the detection unit 14 is used to obtain a second tangent line TL2 corresponding to the outer peripheral edge portion 20b of the target member 20.
  • step S3 the center position 20a of the target member 20 is obtained based on the obtained first tangent line TL1 and the obtained second tangent line TL2.
  • step S4 the placement position PP of the substrate W in the horizontal plane is corrected based on the acquired central position 20a of the target member 20 in the horizontal plane and the previously acquired relative positional relationship in the horizontal plane between the central position 20a of the target member 20 and the placement site 200 for the substrate W.
  • the control unit 13 obtains the center position 20a of the target member 20 in the horizontal plane based on a first tangent TL1 corresponding to the outer peripheral edge 20b of the target member 20 obtained by using the detection unit 14 when the hand 12 approaches the target member 20 from a first direction in the horizontal plane, and a second tangent TL2 corresponding to the outer peripheral edge 20b of the target member 20 obtained by using the detection unit 14 when the hand 12 approaches the target member 20 from a second direction in the horizontal plane different from the first direction.
  • the center position 20a of the target member 20 can be obtained immediately based on the first tangent TL1 and the second tangent TL2.
  • the center position 20a of the target member 20 in the horizontal plane can be obtained quickly compared to a case in which the hand 12 is swung, the offset amount of the hand 12 is calculated, the position of the hand 12 is shifted, and the like are repeatedly performed to specify the center position 20a of the target member 20 in the horizontal plane. This allows the placement position PP of the substrate W in the horizontal plane to be quickly corrected, thereby shortening the time required to correct the placement position PP of the substrate W in the horizontal plane.
  • the detection unit 14 detects the position 20c of the target member 20 for correcting the placement position PP of the substrate W in the vertical direction.
  • the control unit 13 then obtains the position 20c of the target member 20 in the vertical direction based on the timing at which the detection unit 14 switches between a state in which the target member 20 is detected in the vertical direction and a state in which it is not detected in the vertical direction, which is obtained by moving the hand 12 in the vertical direction relative to the target member 20.
  • the control unit 13 also corrects the placement position PP of the substrate W in the vertical direction based on the obtained position 20c of the target member 20 in the vertical direction and the relative positional relationship in the vertical direction between the position 20c of the target member 20 and the placement site 200 of the substrate W, which has been obtained in advance. This allows correction of the placement position PP of the substrate W in the vertical direction in addition to correction of the placement position PP of the substrate W in the horizontal plane.
  • the target member 20 is a member for correcting the placement position PP of the substrate W in the horizontal plane and in the vertical direction. This allows the correction of the placement position PP of the substrate W in the horizontal plane and the placement position PP of the substrate W in the vertical direction to be performed using a common target member 20. This allows the configuration to be simplified without adding a member for correcting the placement position PP of the substrate W in the vertical direction, even when correcting the placement position PP of the substrate W in the horizontal plane as well as the placement position PP of the substrate W in the vertical direction.
  • the substrate transport robot system 100 includes, in addition to the target member 20, a target member 21 arranged at a position different from the target member 20 in the horizontal plane.
  • the control unit 13 acquires the inclination ⁇ of the coordinate system C2 of the substrate W storage site 200 relative to the coordinate system C1 of the robot arm 11 in the horizontal plane based on the center position 20a of the target member 20 in the horizontal plane, the center position 21a of the target member 21 in the horizontal plane, and the relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the center position 21a of the target member 21 that has been acquired in advance.
  • the center position 20a of the target member 20 in the horizontal plane and the center position 21a of the target member 21 in the horizontal plane can be obtained more quickly than when the hand 12 is swung, the offset amount of the hand 12 is calculated, the position of the hand 12 is shifted, and so on, as described above. That is, even if the inclination ⁇ of the coordinate system C2 of the substrate W placement site 200 relative to the coordinate system C1 of the robot arm 11 in the horizontal plane is obtained, the time required to correct the placement position PP of the substrate W in the horizontal plane can be shortened.
  • the hand 12 includes a first tip 12a and a second tip 12b that are bifurcated.
  • the detection unit 14 is a transmission sensor that detects the target member 20 based on whether the detection light DL passing through the space S between the first tip 12a and the second tip 12b is blocked.
  • the control unit 13 then approaches the hand 12 to the target member 20 while changing the position where the detection light DL is blocked, and acquires the direction of the detection light DL relative to the hand 12 based on the multiple positions of the hand 12 where the detection light DL is blocked. Based on the acquired direction of the detection light DL, the control unit 13 calibrates the coordinate system C1 of the robot arm 11 so that the direction in which the hand 12 approaches the target member 20 and the direction of the detection light DL are orthogonal.
  • the hand 12 is brought close to the target member 20 from a first direction in a horizontal plane, and the first tangent TL1 of the outer periphery 20b of the target member 20 is obtained using the detection unit 14.
  • the hand 12 is brought close to the target member 20 from a second direction in the horizontal plane different from the first direction, and the second tangent TL2 of the outer periphery 20b of the target member 20 is obtained using the detection unit 14.
  • the center position 20a of the target member 20 is obtained based on the obtained first tangent TL1 and the obtained second tangent TL2.
  • the center position 20a of the target member 20 can be obtained immediately based on the first tangent TL1 and the second tangent TL2.
  • the time required to correct the placement position PP of the substrate W in the horizontal plane can be shortened.
  • control unit 13 calibrates the coordinate system C1 of the robot arm 11 based on the acquired direction of the detection light DL so that the direction in which the hand 12 approaches the target member 20 is perpendicular to the direction of the detection light DL, but the present disclosure is not limited to this.
  • the control unit does not need to calibrate the coordinate system of the robot arm based on the acquired direction of the detection light so that the direction in which the hand approaches the target member is perpendicular to the direction of the detection light.
  • the detection unit is disposed with respect to the hand so that the direction in which the hand approaches the target member is perpendicular to the direction of the detection light.
  • the detection unit 14 is a transmission type sensor that detects the target member 20 based on whether or not the detection light DL passing through the space S between the first tip 12a and the second tip 12b is blocked, but the present disclosure is not limited to this.
  • the detection unit may be a reflective sensor.
  • the detection unit may be a sensor that does not use detection light. In that case, the hand does not need to be bifurcated.
  • the control unit 13 acquires the tilt ⁇ of the coordinate system C2 of the substrate W placement site 200 relative to the coordinate system C1 of the robot arm 11 in the horizontal plane based on the center position 20a of the target member 20 in the horizontal plane, the center position 21a of the target member 21 in the horizontal plane, and the relative positional relationship in the horizontal plane between the center position 20a of the target member 20 and the center position 21a of the target member 21 that has been acquired in advance, but the present disclosure is not limited to this.
  • the control unit may acquire the tilt of the coordinate system of the substrate placement site relative to the coordinate system of the robot arm in the horizontal plane by a method other than the above method.
  • control unit does not need to acquire the tilt of the coordinate system of the substrate placement site relative to the coordinate system of the robot arm in the horizontal plane.
  • the robot arm and the substrate placement site are arranged so that the coordinate system of the substrate placement site is not tilted relative to the coordinate system of the robot arm in the horizontal plane.
  • the substrate transport robot system 100 includes, in addition to the target member 20, a target member 21 that is positioned in a different position from the target member 20 in the horizontal plane, but the present disclosure is not limited to this.
  • the substrate transport robot system may include only one target member.
  • the target member 20 is a member for correcting the placement position PP of the substrate W in the horizontal plane and in the vertical direction, but the present disclosure is not limited to this.
  • the target member for correcting the placement position of the substrate in the horizontal plane and the target member for correcting the placement position of the substrate in the vertical direction may be separate members.
  • the substrate transport robot 10 corrects the placement position PP of the substrate W in the horizontal plane as well as the placement position PP of the substrate W in the vertical direction, but the present disclosure is not limited to this. In the present disclosure, the substrate transport robot may only correct the placement position of the substrate in the horizontal plane without correcting the placement position of the substrate in the vertical direction.
  • control unit 13 which is provided in the substrate transport robot 10 and controls the operation of the robot arm 11, acquires the center position 20a of the target member 20 in the horizontal plane and corrects the placement position PP of the substrate W in the horizontal plane
  • control unit that controls the operation of the robot arm and the control unit that acquires the center position of the target member in the horizontal plane and corrects the acquired center position of the target member in the horizontal plane and the placement position of the substrate in the horizontal plane may be separate control units.
  • the substrate transport robot does not need to be provided with a control unit that acquires the center position of the target member in the horizontal plane and corrects the acquired center position of the target member in the horizontal plane and the placement position of the substrate in the horizontal plane.
  • the placement position PP of the substrate W was corrected, but the present disclosure is not limited to this.
  • the take-up position of the substrate may be corrected, or both the placement position and take-up position of the substrate may be corrected.
  • the target member is a member for making a correction to match the take-up position of the substrate with the placement location of the substrate.
  • circuits or processing circuits including general purpose processors, special purpose processors, integrated circuits, ASICs (Application Specific Integrated Circuits), conventional circuits, and/or combinations thereof, configured or programmed to perform the disclosed functions.
  • Processors are considered processing circuits or circuits because they include transistors and other circuits.
  • a circuit, unit, or means is hardware that performs the recited functions or hardware that is programmed to perform the recited functions.
  • the hardware may be hardware disclosed herein or other known hardware that is programmed or configured to perform the recited functions. Where the hardware is a processor, which is considered a type of circuit, the circuit, means, or unit is a combination of hardware and software, and the software is used to configure the hardware and/or the processor.
  • the substrate transport robot includes: A robot arm; A hand attached to the tip of the robot arm; a detection unit disposed in the hand and detecting an outer periphery of the horizontal target member;
  • the control unit is a center position of the horizontal target member in a horizontal plane is obtained based on a first tangent corresponding to the outer periphery of the horizontal target member obtained using the detection unit by bringing the hand closer to the horizontal target member from a first direction in a horizontal plane, and a second tangent corresponding to the outer periphery of the horizontal target member obtained using the detection unit by bringing the hand closer to the horizontal target member from a second direction in the horizontal plane different from the first direction;
  • a substrate transport robot system which corrects at least one of the placement position and the removal position of the substrate in a horizontal
  • a vertical target member is provided for correcting at least one of the placement position and the removal position of the substrate in a vertical direction
  • the detection unit detects the position of the upper and lower target members
  • the control unit is a position of the vertical target member in the vertical direction is acquired based on a timing at which the detection unit switches between a state in which the vertical target member is detected and a state in which the vertical target member is not detected in the vertical direction, the timing being acquired by moving the hand in the vertical direction relative to the vertical target member; and 2.
  • the horizontal target members include a first horizontal target member and a second horizontal target member disposed at a position different from that of the first horizontal target member in a horizontal plane
  • the control unit obtains the inclination of the coordinate system of the substrate placement location relative to the coordinate system of the robot arm in the horizontal plane based on the central position of the first horizontal target member in the horizontal plane, the central position of the second horizontal target member in the horizontal plane, and a previously obtained relative positional relationship in the horizontal plane between the central position of the first horizontal target member and the central position of the second horizontal target member.
  • a substrate transport robot system as described in any one of items 1 to 3.
  • the hand includes a first tip portion and a second tip portion that are bifurcated into two parts, the detection unit is a transmission sensor that detects the horizontal target member based on whether detection light passing through a space between the first tip portion and the second tip portion is blocked, The control unit is The hand is moved closer to the horizontal target member while changing the position where the detection light is blocked, and the direction of the detection light with respect to the hand is acquired based on a plurality of positions of the hand where the detection light is blocked; and 5.
  • the substrate transport robot system according to claim 1, further comprising: a coordinate system of the robot arm that is calibrated based on the acquired direction of the detection light so that the direction in which the hand approaches the horizontal target member is perpendicular to the direction of the detection light.
  • a method for correcting at least one of a placement position and a pick-up position of a substrate by a substrate transport robot comprising: a robot arm; a hand attached to a tip of the robot arm; and a detection unit having a circular shape when viewed from above and below, the detection unit detecting a horizontal target member for correcting at least one of a placement position and a pick-up position of a substrate in a horizontal plane, the method comprising: Bringing the hand close to the horizontal target member from a first direction in a horizontal plane, and acquiring a first tangent corresponding to an outer periphery of the horizontal target member using the detection unit; bringing the hand close to the horizontal target member from a second direction in a horizontal plane different from the first direction, and acquiring a second tangent corresponding to the outer periphery of the horizontal target member using the detection unit; Obtaining a center position of the horizontal target member based on the obtained first tangent line and the obtained second tangent line

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Dans le système de robot de transport de substrat (100) d'après la présente invention, une unité de commande (13) acquiert une position centrale (20a) d'un élément cible (20) dans un plan horizontal sur la base : d'une première tangente (TL1) correspondant à une section de bord circonférentiel externe (20b) de l'élément cible (20), la première tangente (TL1) étant acquise à l'aide d'une unité de détection (14) et amenant une main (12) à s'approcher de l'élément cible (20) à partir d'une première direction dans le plan horizontal ; et d'une seconde tangente (TL2) correspondant à la section de bord circonférentiel externe (20b) de l'élément cible (20), la seconde tangente (TL2) étant acquise à l'aide de l'unité de détection (14) et amenant la main (12) à s'approcher de l'élément cible (20) à partir d'une seconde direction dans le plan horizontal, la seconde direction étant différente de la première.
PCT/JP2023/036553 2022-10-07 2023-10-06 Système de robot de transport de substrat et procédé de correction d'une position de placement d'un substrat et/ou d'une position de retrait d'un substrat par un robot de transport de substrat Ceased WO2024075839A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202380070730.6A CN120092317A (zh) 2022-10-07 2023-10-06 基板搬运用机器人系统、和基板搬运用机器人对基板的载置位置及拾取位置中的至少任意一个的修正方法
KR1020257010148A KR20250058030A (ko) 2022-10-07 2023-10-06 기판 반송용 로봇 시스템, 및, 기판 반송용 로봇에 의한 기판의 재치 위치 및 제거 위치 중 적어도 어느 하나의 보정 방법

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JP2022162694A JP2024055616A (ja) 2022-10-07 2022-10-07 基板搬送用ロボットシステム、および、基板搬送用ロボットによる基板の置き位置および取り位置の少なくともいずれかの補正方法
JP2022-162694 2022-10-07

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WO2024075839A1 true WO2024075839A1 (fr) 2024-04-11

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JP (1) JP2024055616A (fr)
KR (1) KR20250058030A (fr)
CN (1) CN120092317A (fr)
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Citations (3)

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WO2016178300A1 (fr) * 2015-05-01 2016-11-10 川崎重工業株式会社 Procédé d'apprentissage pour robot, et robot
WO2020137799A1 (fr) * 2018-12-27 2020-07-02 川崎重工業株式会社 Procédé de correction de position de robot, et robot
JP2022518980A (ja) * 2019-04-11 2022-03-17 アプライド マテリアルズ インコーポレイテッド ロボットの関節座標教示精度を向上させるための装置、システム、及び方法

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Publication number Priority date Publication date Assignee Title
JP6199199B2 (ja) * 2014-02-20 2017-09-20 東京エレクトロン株式会社 基板処理装置、位置ずれ補正方法及び記憶媒体
US10381257B2 (en) * 2015-08-31 2019-08-13 Kawasaki Jukogyo Kabushiki Kaisha Substrate conveying robot and substrate processing system with pair of blade members arranged in position out of vertical direction
JP6718352B2 (ja) * 2016-09-28 2020-07-08 川崎重工業株式会社 基板搬送ハンドの診断システム
US11669019B2 (en) * 2019-05-21 2023-06-06 Asml Netherlands B.V. Method for determining stochastic variation associated with desired pattern

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Publication number Priority date Publication date Assignee Title
WO2016178300A1 (fr) * 2015-05-01 2016-11-10 川崎重工業株式会社 Procédé d'apprentissage pour robot, et robot
WO2020137799A1 (fr) * 2018-12-27 2020-07-02 川崎重工業株式会社 Procédé de correction de position de robot, et robot
JP2022518980A (ja) * 2019-04-11 2022-03-17 アプライド マテリアルズ インコーポレイテッド ロボットの関節座標教示精度を向上させるための装置、システム、及び方法

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JP2024055616A (ja) 2024-04-18

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