WO2024062574A1 - Electronic control device - Google Patents

Abstract

The present disclosure provides an electronic control device capable of both improving heat dissipation properties of an electronic component and achieving a reduced weight of a housing. An electronic control device 100 according to the present disclosure comprises a heat transfer protruding section 123 that protrudes from the outer surface of a first wall 121 of a housing 120 and extends from a heat-receiving region HTR of the first wall 121 of the housing 120 to a heat-dissipating region LTR of a second wall 122 of the housing 120. The heat transfer protruding section 123 transfers heat of the heat-receiving region HTR of the first wall 121 of the housing 120 to the heat-dissipating region LTR of the second wall 122 of the housing 120.

Description

electronic control unit

The present disclosure relates to an electronic control device.

Inventions related to electronic control devices have been known for some time. For example, the electronic control device described in Patent Document 1 below includes a heat radiation section, a substrate, an electronic component, a first heat transfer section, and a second heat transfer section. The substrate is placed on one side of the heat dissipation section. The electronic components are mounted on a side of the substrate opposite to one side of the heat dissipation section. The first heat transfer section is provided between the electronic component and the heat radiation section, and is thermally coupled to the electronic component.

The second heat transfer section has an intervening section provided between the first heat transfer section and a region of the electronic component that is not thermally coupled to the first heat transfer section. (Patent Document 1, paragraph 0005, claim 1, abstract, etc.). According to this conventional electronic control device, the heat dissipation of the area that is not thermally coupled to the first heat transfer part of the electronic component is improved, and therefore the heat dissipation of the entire electronic component can be improved ( (ibid., paragraph 0006).

JP2020-202329A

The above-mentioned conventional electronic control device has a casing consisting of an upper casing and a lower casing. A plurality of plate-shaped heat dissipation fins that protrude upward are provided on the upper surface of the upper housing. These plurality of heat dissipation fins are formed on most of the upper surface of the upper casing, excluding the flat portion provided on the front side of the upper surface of the upper casing, at the same height as the flat portion (Patent Document 1, paragraphs 0009-0011, Figures 1-2, etc.).

The conventional electronic control device described above uses a plurality of heat dissipation fins formed on the upper surface of the upper housing to pass the heat transfer material (first heat transfer material) and heat transfer member (second heat transfer material) to the upper part of the electronic control device. Heat dissipation of electronic components thermally connected to the housing can be improved. On the other hand, since the plurality of radiation fins are formed on substantially the entire upper surface of the upper housing by die casting or the like, they occupy a large amount of weight in the housing.

The present disclosure provides an electronic control device that can both improve the heat dissipation of electronic components and reduce the weight of the casing.

One aspect of the present disclosure includes a housing including a circuit board on which electronic components are mounted, a first wall that covers the circuit board, and a second wall that surrounds the circuit board, the first wall of the housing and the a heat transfer material that is disposed between the electronic component and conducts the heat of the electronic component to a heat receiving area of the first wall facing the electronic component; A heat transfer convex portion extending from the heat receiving region to a heat dissipating region of the second wall of the casing and transmitting heat in the heat receiving region of the first wall to the heat dissipating region of the second wall. This is a distinctive electronic control device.

According to the above aspect of the present disclosure, it is possible to provide an electronic control device that can both improve the heat dissipation of electronic components and reduce the weight of the casing.

1 is a perspective view showing Embodiment 1 of an electronic control device according to the present disclosure. FIG. 2 is a schematic cross-sectional view taken along line II-II of the electronic control device in FIG. 1. FIG. 2 is a perspective view showing an example of temperature distribution in the casing of the electronic control device shown in FIG. 1; FIG. 2 is a front view of the electronic control device shown in FIG. 1; FIG. 2 is a bottom view of the electronic control device in FIG. 1; FIG. 2 is a perspective view showing air convection around a heat transfer convex portion of the electronic control device in FIG. 1; FIG. 7 is a front view showing Embodiment 2 of the electronic control device according to the present disclosure. 8 is an enlarged view showing a modification of the heat transfer convex portion of the electronic control device shown in FIG. 7. FIG. FIG. 9 is a perspective view showing air convection around the heat transfer convex portion of the electronic control device in FIG. 8; FIG. 3 is a perspective view showing a third embodiment of an electronic control device according to the present disclosure. FIG. 4 is a side view showing Embodiment 4 of an electronic control device according to the present disclosure. FIG. 7 is a perspective view showing Embodiment 5 of an electronic control device according to the present disclosure.

Hereinafter, embodiments of an electronic control device according to the present disclosure will be described with reference to the drawings.

[Embodiment 1]
FIG. 1 is a perspective view showing Embodiment 1 of an electronic control device according to the present disclosure. FIG. 2 is a schematic cross-sectional view of the electronic control device 100 of FIG. 1 taken along line II-II. FIG. 3 is a perspective view showing an example of the temperature distribution of the casing 120 of the electronic control device 100 in FIG. 1. FIG. 4 is a front view of the electronic control device 100 of FIG. 1. FIG. 5 is a bottom view of the electronic control device 100 of FIG. 1.

The electronic control device 100 of this embodiment is, for example, an in-vehicle electronic control unit (ECU) mounted on a vehicle such as an automobile. Electronic control device 100 is used as, for example, a hybrid control ECU, a gateway ECU, an engine control ECU, a transmission ECU, or a charging control ECU. The electronic control device 100 includes, for example, a circuit board 110 and a housing 120.

The circuit board 110 is configured with a plurality of electronic components including a central processing unit (CPU), an integrated circuit (IC), or a power semiconductor, an electronic component 111 that generates heat when energized, and a memory, to form an electronic circuit. It is a printed circuit board (PCW). Furthermore, a connector 112 is mounted on the circuit board 110, for example. The electronic control device 100 is connected to an external device by, for example, connecting a connector cable connected to the external device to a connector 112 mounted on the circuit board 110.

The housing 120 has, for example, a flat rectangular parallelepiped shape with chamfered corners, and is composed of a case 120a that houses and holds the circuit board 110, and a cover 120b that covers the circuit board 110 housed in the case 120a. The housing 120 has a first wall 121 that covers the circuit board 110, and a second wall 122 that surrounds the housing 120. The first wall 121 of the housing 120 is, for example, the bottom wall of the case 120a, and the second wall 122 of the housing 120 is, for example, the side wall of the case 120a. The first wall 121 and the second wall 122 are made of, for example, a metal such as aluminum that has excellent thermal conductivity.

The circuit board 110 and the first wall 121 of the housing 120 are arranged along the vertical direction Dv, for example. Each figure shows an orthogonal coordinate system having an X axis parallel to the width direction of the housing 120, a Y axis parallel to the thickness direction of the housing 120, and a Z axis parallel to the height direction of the housing 120. There is. For example, in the electronic control device 100, when the vehicle is horizontal, the height direction (Z-axis direction) of the casing 120 is generally parallel to the vertical direction Dv, and the width direction (X-axis direction) of the casing 120 is in the horizontal direction. It is mounted on the vehicle so as to be approximately parallel to Dh.

As shown in FIG. 2, the electronic control device 100 includes a heat transfer material 101 disposed between the first wall 121 of the casing 120 and the electronic component 111. As the heat transfer material 101, for example, a general heat radiation measure member (TIM) such as thermal conductive grease, thermally conductive adhesive, thermally conductive putty, or thermally conductive sheet can be used. For example, the heat transfer material 101 is in contact with the heat radiation surface 111a of the electronic component 111 and the top surface of the heat receiving convex portion 125 provided on the first wall 121 of the housing 120, and transfers the heat of the electronic component 111 to the electronic component 111. The heat is conducted to the heat receiving region HTR (see FIG. 3) of the first wall 121 of the opposing casing 120.

The heat receiving region HTR includes, for example, a region or a portion of the first wall 121 of the casing 120 covering the circuit board 110 that faces the heat dissipating surface 111a of the electronic component 111. Further, the heat receiving region HTR includes, for example, a region or a portion of the first wall 121 that is in contact with the heat transfer material 101. Further, the heat receiving region HTR includes, for example, a region or a portion of the first wall 121 where the heat receiving convex portion 125 is provided.

The heat receiving convex portion 125 is, for example, provided on the inner surface of the first wall 121 facing the circuit board 110 at a position facing the electronic component 111 and protrudes from the inner surface of the first wall 121 toward the circuit board 110. . The area of the top surface of the heat-receiving protrusion 125 is, for example, larger than the area of the heat-radiating surface 111a of the electronic component 111, and the outer edge of the heat-receiving protrusion 125 is located outside the outer edge of the electronic component 111.

Further, the electronic control device 100 has a heat transfer convex portion 123 protruding from the outer surface of the first wall 121 of the housing 120. As shown in FIG. 3, the heat transfer convex portion 123 extends linearly from the heat receiving region HTR of the first wall 121 of the casing 120 to the heat dissipating region LTR of the second wall 122 of the casing 120. Heat in the heat receiving region HTR is conducted to the heat radiating region LTR of the second wall 122.

The heat radiation region LTR of the casing 120 is, for example, a stationary region of the electronic control device 100 where heat conduction occurs from the electronic component 111 to the heat receiving region HTR of the casing 120 via the heat transfer material 101, as shown in FIGS. 2 and 3. In this state, the temperature is lower than that of the heat receiving region HTR. In the steady state of the electronic control device 100 shown in FIG. 3, the heat receiving region HTR has the highest temperature, the intermediate region MTR has a lower temperature than the heat receiving region HTR, and the heat radiation region LTR has the lowest temperature.

More specifically, as shown in FIG. 3, in the steady state of the electronic control device 100, heat conduction occurs from the electronic component 111 to the heat receiving region HTR of the first wall 121 of the housing 120 via the heat transfer material 101. The temperature of the heat receiving region HTR is, for example, 1.2 times or more the temperature of the heat radiating region LTR. Further, in the steady state of the electronic control device 100 shown in FIG. 3, the temperature of the heat radiation region LTR may be, for example, 0.8 times or less than the temperature of the heat receiving region HTR.

The heat transfer convex portion 123 extends linearly, for example, from the heat receiving region HTR of the first wall 121 of the housing 120 toward the heat dissipating region LTR of the second wall 122 closest to the heat receiving region HTR. More specifically, for example, the only heat transfer convex portion 123 provided in the casing 120 transfers heat from the heat receiving region HTR of the first wall 121 of the casing 120 to the second wall 122 closest to the heat receiving region HTR. It extends along the shortest route toward region LTR. Further, the heat transfer convex portion 123 extends obliquely upward, for example, from the heat radiation region LTR of the second wall 122 of the housing 120 toward the heat receiving region HTR of the first wall 121 of the housing 120.

The housing 120 has, for example, a bulge 124 at the lower end of the first wall 121. The bulging portion 124 is provided, for example, so as to cover the connector 112 mounted on the lower end of the circuit board 110. The connector 112 has a height, for example, in the protruding direction of the heat transfer convex portion 123, that is, in the thickness direction (Y-axis direction) of the housing 120. Therefore, as shown in FIG. 2, the bulging portion 124 has a height h in the protruding direction of the heat transfer convex portion 123 from the outer surface of the first wall 121 of the casing 120 in which the heat transfer convex portion 123 is provided. have.

For example, as shown in FIG. 4, the bulging portion 124 extends along the lower edge of the housing 120 with a distance d in the horizontal direction Dh from the second wall 122 of the housing 120. As a result, the bulging portion 124 forms an air passage AP that vertically communicates with the lower end of the heat transfer convex portion 123 adjacent to the second wall 122 . With such a configuration, in the electronic control device 100, as shown in FIG. 5, the end portion of the heat transfer convex portion 123 adjacent to the second wall 122 can be visually observed from the lower side in the vertical direction Dv.

The operation of the electronic control device 100 of this embodiment is explained below.

For example, as in-vehicle electronic control devices become smaller and more sophisticated, improvements in heat dissipation and weight reduction of electronic components have become issues. The conventional electronic control device described in the above-mentioned Patent Document 1 has a heat transfer material (first heat transfer material) and a heat transfer member (second It is possible to improve the heat dissipation of electronic components thermally connected to the upper casing via the heat transfer material (heat transfer material). On the other hand, since the plurality of radiation fins are formed on substantially the entire upper surface of the upper casing by die casting or the like, it is difficult to reduce the weight of the casing.

On the other hand, as described above, the electronic control device 100 of the present embodiment includes a circuit board 110 on which an electronic component 111 is mounted, a first wall 121 that covers the circuit board 110, and a second wall that surrounds the circuit board 110. 122. Further, the electronic control device 100 is disposed between the first wall 121 of the housing 120 and the electronic component 111, and conducts the heat of the electronic component 111 to the heat receiving region HTR of the first wall 121 facing the electronic component 111. A heat transfer material 101 is provided. Furthermore, the electronic control device 100 protrudes from the outer surface of the first wall 121 of the housing 120 and extends from the heat receiving region HTR of the first wall 121 to the heat dissipating region LTR of the second wall 122. A heat transfer convex portion 123 is provided that conducts the heat of the HTR to the heat radiation region LTR of the second wall 122.

With such a configuration, the electronic control device 100 of the present embodiment can transfer heat from the electronic component 111 to the heat receiving region HTR of the first wall 121 of the casing 120 by the heat transfer material 101 in a steady state where the electronic component 111 is energized. can be efficiently conducted and heat can be radiated from the electronic component 111. Furthermore, the heat conducted from the electronic component 111 to the heat receiving region HTR of the first wall 121 of the casing 120 is transferred by the heat transfer convex portion 123 extending from the heat receiving region HTR to the heat radiating region LTR of the second wall 122 of the casing 120. The heat can be conducted to the heat radiating region LTR of the second wall 122, and the heat can be radiated from the heat receiving region HTR.

Further, in the steady state of the electronic control device 100, the heat radiation region LTR of the second wall 122 surrounding the circuit board 110 is the heat receiving region HTR of the first wall 121, where heat is conducted from the electronic component 111 via the heat transfer material 101. The temperature is lower than that of Therefore, by dissipating heat from the heat receiving region HTR of the housing 120 to the heat dissipating region LTR via the heat transfer convex portion 123, it is possible to suppress the temperature rise in the heat receiving region HTR and improve the heat dissipation performance of the electronic component 111.

Furthermore, unlike the plurality of heat dissipation fins of the conventional electronic control device, the heat transfer convex portion 123 extends from the heat receiving region HTR of the first wall 121 of the casing 120 facing the electronic component 111 to the second wall surrounding the circuit board 110. It is provided mainly for the purpose of dissipating heat to the heat dissipation region LTR of 122. Therefore, unlike the plurality of heat dissipation fins of the conventional electronic control device described above, if at least one heat transfer convex portion 123 is provided on the outer surface of the first wall 121, the heat dissipation performance of the electronic component 111 can be improved. Can be done. Therefore, in the electronic control device 100 of this embodiment, the weight of the casing 120 can be reduced compared to the above-mentioned conventional electronic control device.

Furthermore, in the electronic control device 100 of the present embodiment, as shown in FIG. It extends linearly along the shortest route toward the heat radiation region LTR of the second wall 122 of the casing 120 that is closest to the heat reception region HTR. With such a configuration, not only can the heat dissipation of the electronic component 111 by heat conduction of the heat transfer convex portion 123 be further improved, but also the volume of the heat transfer convex portion 123 can be reduced to further reduce the weight of the casing 120. It becomes possible.

Note that the electronic control device 100 may further include one or more heat transfer convex portions 123 that extend toward the second wall 122 farther from the heat radiation region LTR than the second wall 122 closest to the heat radiation region LTR. . Further, the electronic control device 100 may further include one or more heat transfer convex portions 123 extending along a path other than the shortest path on the second wall 122 closest to the heat radiation region LTR. That is, the electronic control device 100 can include a plurality of heat transfer convex portions 123 within a range where the weight of the casing 120 can be reduced.

FIG. 6 is a perspective view showing convection of air A around the heat transfer convex portion 123 of the electronic control device 100 of FIG. 1. In the electronic control device 100 of this embodiment, as shown in FIGS. 1 and 2, the circuit board 110 and the first wall 121 of the housing 120 are arranged along the vertical direction Dv. As shown in FIG. 3, the heat transfer convex portion 123 extends obliquely upward from the heat radiation region LTR of the second wall 122 of the housing 120 toward the heat receiving region HTR of the first wall 121 of the housing 120. .

With such a configuration, the electronic control device 100 of this embodiment can improve the air cooling effect of the heat transfer convex portion 123. More specifically, as shown in FIGS. 1 to 4, around the thin rectangular parallelepiped-shaped electronic control device 100 disposed along the vertical direction Dv, from below to above, for example, about 0.5 m/s Natural convection of air A occurs at a wind speed of approximately Therefore, as shown in FIG. 6, air A flowing from below to upward in the vicinity of the heat transfer convex portion 123 extending obliquely upward first hits the end of the heat transfer convex portion 123 adjacent to the second wall 122, and this end Cool the parts.

Further, the air A hitting the end of the heat transfer convex portion 123 adjacent to the second wall 122 flows along the heat transfer convex portion 123 extending diagonally upward, and is transmitted over the entire length of the heat transfer convex portion 123. The thermal convex portion 123 is cooled. Therefore, according to the electronic control device 100 of the present embodiment, the air cooling effect of the heat transfer convex portion 123 is improved, and the heat transfer convexity from the heat receiving region HTR of the first wall 121 to the heat dissipating region LTR of the second wall 122 described above is improved. The heat dissipation effect due to heat conduction through the portion 123 can be further improved.

Furthermore, in the electronic control device 100 of the present embodiment, the housing 120 has a bulging portion 124 that is mounted on the lower end of the circuit board 110 and covers the connector 112 that has a height in the direction in which the heat transfer convex portion 123 projects. are doing. This bulging portion 124 has a height h in the protruding direction of the heat transfer convex portion 123 from the outer surface of the first wall 121 on which the heat transfer convex portion 123 is provided, and has a height h from the outer surface of the first wall 121 on which the heat transfer convex portion 123 is provided. It extends along the lower edge of the first wall 121 with a horizontal spacing d therebetween. Thereby, the bulging portion 124 forms an air passage AP communicating vertically below the end of the heat transfer convex portion 123 adjacent to the second wall 122 .

With this configuration, as shown in FIG. 6, air A flowing upward by natural convection from below the electronic control device 100 is directed to the bulge of the housing 120 in the width direction (X-axis direction) of the electronic control device 100. 124 and the second wall 122 , and hits the end of the heat transfer convex portion 123 adjacent to the second wall 122 . Thereby, it becomes possible to further improve the air cooling effect of the heat transfer convex portion 123 described above.

Further, in the electronic control device 100 of the present embodiment, in a steady state where heat conduction occurs from the electronic component 111 to the heat receiving region HTR of the first wall 121 of the housing 120 via the heat transfer material 101, the temperature of the heat receiving region HTR is The temperature is 1.2 times or more the temperature of the heat radiation region LTR of the second wall 122. In other words, in the electronic control device 100 of this embodiment, the temperature of the heat radiation region LTR is 0.8 times or less than the temperature of the heat reception region HTR in the steady state. With such a configuration, the electronic control device 100 of the present embodiment promotes heat conduction from the heat receiving region HTR of the first wall 121 to the heat dissipating region LTR of the second wall 122 by the heat transfer convex portion 123, and the electronic component 111 can improve heat dissipation.

As described above, according to the present embodiment, it is possible to provide the electronic control device 100 that can both improve the heat dissipation of the electronic component 111 and reduce the weight of the casing 120.

[Embodiment 2]
Embodiment 2 of the electronic control device according to the present disclosure will be described below with reference to FIGS. 7 to 9. FIG. 7 is a front view showing Embodiment 2 of the electronic control device according to the present disclosure. FIG. 8 is an enlarged view showing a modification of the heat transfer convex portion 123 of the electronic control device 100 shown in FIG. FIG. 9 is a perspective view showing convection of air A around the heat transfer convex portion 123 of the electronic control device 100 of FIG. 8. FIG.

The electronic control device 100 of this embodiment further includes an extension portion 126 connected to the heat transfer convex portion 123, and the air passage AP is not formed at the end of the bulge portion 124 in the horizontal direction Dh. , is different from the electronic control device 100 of the first embodiment described above. The other parts of the electronic control device 100 of this embodiment are the same as the electronic control device 100 of the above-described first embodiment, so the same parts are given the same reference numerals and the explanation will be omitted.

In the electronic control device 100 of this embodiment, the heat transfer protrusion 123 protruding from the first wall 121 is formed, for example, in a plate shape having a thickness in the protruding direction of the heat transfer protrusion 123 perpendicular to the first wall 121, and a width perpendicular to the longitudinal direction of the heat transfer protrusion 123 extending from the heat receiving region HTR of the first wall 121 to the heat dissipation region LTR of the second wall 122. The electronic control device 100 of this embodiment further includes an extension portion 126 connected to the end of the heat transfer protrusion 123 adjacent to the second wall 122 and protruding from the outer surface of the second wall 122.

The extending portion 126 may extend in the longitudinal direction of the heat transfer convex portion 123 as shown in FIG. 7, but as shown in FIG. 2 may protrude from the outer surface of the wall 122 along the horizontal direction Dh. Further, the bulging portion 124 extends from one second wall 122 of the housing 120 to the other second wall 122 of the housing 120 in the width direction (X-axis direction) of the housing 120 along the horizontal direction Dh. The bulging portion 124 has, for example, an inclined surface 124a at the lower end of the end in the width direction of the housing 120. For example, the inclined surface 124a is inclined diagonally upward from the center side in the width direction of the housing 120 toward the ends.

With the above configuration, air A flowing upward by natural convection from below the electronic control device 100 of the present embodiment hits the inclined surface 124a of the bulging portion 124 and flows into the second portion of the housing 120, as shown in FIG. It flows along the wall 122. As a result, the air cooling effect of the heat radiation region LTR of the second wall 122 is improved and the temperature is lowered, and the heat radiation effect by the heat transfer convex portion 123 from the heat receiving region HTR of the first wall 121 to the heat radiation region LTR of the second wall 122 is improved. will improve. Note that the bulging portion 124 does not need to have the inclined surface 124a.

Furthermore, the air A flowing along the second wall 122 of the housing 120 hits the extension 126 that is connected to the end of the heat transfer protrusion 123 adjacent to the second wall 122 and protrudes from the outer surface of the second wall 122. This allows the air A to hit the extension 126 without reducing the flow rate of the air A. As a result, the extension 126 is efficiently cooled by the air A, promoting heat dissipation from the heat transfer protrusion 123 to the extension 126, and improving the heat dissipation effect of the heat transfer protrusion 123 from the heat receiving region HTR of the first wall 121 to the heat dissipation region LTR of the second wall 122.

Further, in the electronic control device 100 of the present embodiment, when the extending portion 126 protrudes from the outer surface of the second wall 122 of the housing 120 along the horizontal direction Dh, as shown in FIG. The air A that has hit 126 flows easily along the heat transfer convex portion 123. Thereby, the air cooling effect of the heat transfer convex portion 123 is improved, and the heat dissipation effect of the heat transfer convex portion 123 from the heat receiving region HTR of the first wall 121 to the heat dissipating region LTR of the second wall 122 is improved.

As described above, the present embodiment provides an electronic control device 100 that can simultaneously improve the heat dissipation of the electronic component 111 and reduce the weight of the casing 120, similar to the first embodiment described above. be able to.

[Embodiment 3]
Embodiment 3 of the electronic control device according to the present disclosure will be described below with reference to FIG. FIG. 10 is a perspective view showing Embodiment 3 of the electronic control device according to the present disclosure. The electronic control device 100 of this embodiment differs from the electronic control device 100 of the above-described second embodiment in the configuration of the stretching section 126. The other parts of the electronic control device 100 of this embodiment are the same as the electronic control device 100 of the above-described second embodiment, so the same parts are given the same reference numerals and the explanation will be omitted.

For example, the extending portion 126 of the electronic control device 100 of the present embodiment extends from one end of the second wall 122 separated from the first wall 121 of the housing 120 in the thickness direction (Y-axis direction) of the housing 120. It extends obliquely upward along the second wall 122 toward the other end of the second wall 122 adjacent to the first wall 121 . With this configuration, air A flowing upward by natural convection from below the electronic control device 100 of this embodiment flows along the second wall 122 of the housing 120 and diagonally upward along the second wall 122. This corresponds to the extending portion 126.

As a result, the extension portion 126, which has a large surface area, is cooled by the air A, improving the air-cooling effect of the extension portion 126. In addition, the air A flows obliquely upward along the extension portion 126 and the second wall 122, and the extension portion 126 extending obliquely upward is cooled by the air A over its entire length. As a result, the temperature of the extension portion 126 is reduced, promoting heat dissipation from the heat transfer protrusions 123 to the extension portion 126, and improving the heat dissipation effect of the heat transfer protrusions 123 from the heat receiving region HTR of the first wall 121 to the heat dissipation region LTR of the second wall 122. Furthermore, the air A that flows obliquely upward along the extension portion 126 and the second wall 122 flows along the heat transfer protrusions 123. As a result, the air-cooling effect of the heat transfer protrusions 123 is improved, and the heat dissipation effect of the heat transfer protrusions 123 from the heat receiving region HTR of the first wall 121 to the heat dissipation region LTR of the second wall 122 is improved.

As explained above, according to the present embodiment, similar to the first and second embodiments described above, the electronic control device can improve the heat dissipation of the electronic component 111 and reduce the weight of the casing 120. 100 can be provided.

[Embodiment 4]
Embodiment 4 of the electronic control device according to the present disclosure will be described below with reference to FIG. 11. FIG. 11 is a side view showing Embodiment 4 of the electronic control device according to the present disclosure. The electronic control device 100 of this embodiment is different from the electronic control device 100 of the first embodiment described above in the configuration of a housing 120. The other parts of the electronic control device 100 of this embodiment are the same as the electronic control device 100 of the above-described first embodiment, so the same parts are given the same reference numerals and the explanation will be omitted.

In the electronic control device 100 of this embodiment, the housing 120 has, for example, an inclined wall 127 provided in the air passage AP. For example, the inclined wall 127 is adjacent to the first wall 121 from one end of the second wall 122 of the housing 120 that is spaced apart from the first wall 121 of the housing 120 in the thickness direction (Y-axis direction) of the housing 120. The second wall 122 is inclined obliquely upward toward the other end.

With such a configuration, according to the electronic control device 100 of the present embodiment, air A flowing upward by natural convection from below the electronic control device 100 can be efficiently taken into the air passage AP by the inclined wall 127. As a result, more air A comes to hit the heat transfer convex part 123, the air cooling effect of the heat transfer convex part 123 is improved, and the heat receiving area HTR of the first wall 121 due to the heat transfer convex part 123 is transferred to the second wall 123. The heat radiation effect to the heat radiation region LTR is improved.

As described above, according to the present embodiment, similar to the first to third embodiments described above, the electronic control device can improve the heat dissipation of the electronic component 111 and reduce the weight of the casing 120. 100 can be provided.

[Embodiment 5]
Embodiment 5 of the electronic control device according to the present disclosure will be described below with reference to FIG. 12. FIG. 12 is a perspective view showing Embodiment 5 of the electronic control device according to the present disclosure. The electronic control device 100 of this embodiment differs from the electronic control device 100 of the above-described first embodiment in that it further includes a rectifying convex portion 128. The other parts of the electronic control device 100 of this embodiment are the same as the electronic control device 100 of the above-described first embodiment, so the same parts are given the same reference numerals and the explanation will be omitted.

The electronic control device 100 of the present embodiment has a space between the lower end of the heat transfer convex portion 123 that protrudes from the outer surface of the first wall 121 of the housing 120 and is located in the heat receiving region HTR and the second wall 122. It further includes a rectifying convex portion 128 extending along the heat transfer convex portion 123 to a position where the heat transfer convex portion 123 has a rectifying convex portion 128 . With such a configuration, air A flowing upward by natural convection from below the electronic control device 100 of the present embodiment and passing through the air passage AP flows through the heat transfer convex portion 123 adjacent to the second wall 122 of the casing 120. , and flows between the heat transfer convex portion 123 and the rectification convex portion 128.

As a result, the flow of air A along the heat transfer convex portion 123 is rectified by the rectifying convex portion 128, the air cooling effect of the heat transfer convex portion 123 is improved, and the heat receiving area HTR of the first wall 121 due to the heat transfer convex portion 123 is rectified. The heat radiation effect of the second wall 122 to the heat radiation region LTR is improved. In addition, since the rectifying convex portion 128 is cooled by the air A flowing between the heat transfer convex portion 123 and the rectifying convex portion 128, the temperature of the heat receiving region HTR of the first wall 121 of the casing 120 can be lowered. . Thereby, heat radiation from the electronic component 111 to the heat receiving region HTR can be promoted, and the heat radiation performance of the electronic component 111 can be further improved.

As explained above, according to the present embodiment, similar to the above-described first to fourth embodiments, the electronic control device can improve the heat dissipation of the electronic component 111 and reduce the weight of the casing 120. 100 can be provided.

Although the embodiment of the electronic control device according to the present disclosure has been described above in detail using the drawings, the specific configuration is not limited to this embodiment, and design changes may be made within the scope of the gist of the present disclosure. etc., they are included in the present disclosure.

100 Electronic control device 101 Heat transfer material 110 Circuit board 111 Electronic component 112 Connector 120 Housing 121 First wall 122 Second wall 123 Heat transfer convex portion 124 Swelling portion 126 Extension portion 127 Inclined wall 128 Rectifying convex portion AP Air passage d Distance Dv Vertical direction Dh Horizontal direction h Height HTR Heat receiving area LTR Heat dissipating area

Claims (11)

A circuit board with electronic components mounted on it,
a casing having a first wall that covers the circuit board and a second wall that surrounds the circuit board;
a heat transfer material disposed between the first wall of the housing and the electronic component to conduct heat of the electronic component to a heat receiving region of the first wall facing the electronic component;
It protrudes from the outer surface of the first wall of the casing and extends from the heat receiving area to the heat radiating area of the second wall of the casing, and transfers the heat of the heat receiving area of the first wall to the heat radiating area of the second wall. a heat transfer convex portion that conducts to the region;
An electronic control device comprising: The only heat transfer convex portion extends in a straight line along the shortest path from the heat receiving region of the first wall of the casing toward the heat radiating region of the second wall of the casing closest to the heat receiving region. The electronic control device according to claim 1, characterized in that: The circuit board and the first wall of the housing are arranged along a vertical direction,
The electronic control device according to claim 1, wherein the heat transfer convex portion extends diagonally upward from the heat radiation area of the second wall toward the heat receiving area of the first wall. The casing has a bulge that covers a connector that is mounted on the lower end of the circuit board and has a height in the direction in which the heat transfer convex portion projects;
The bulging portion has a height from the outer surface of the first wall where the heat transfer convex portion is provided in the protruding direction of the heat transfer convex portion, and has a horizontal distance between it and the second wall. and extending along the lower edge of the first wall to form an air passage communicating vertically on the lower side of the end of the heat transfer convex portion adjacent to the second wall. The electronic control device according to claim 3. The electronic device according to claim 3 or 4, further comprising an extension portion connected to an end portion of the heat transfer convex portion adjacent to the second wall and protruding from an outer surface of the second wall. Control device. The electronic control device according to claim 5, wherein the extending portion protrudes from the outer surface of the second wall in the horizontal direction. The extending portion extends obliquely upward along the second wall from one end of the second wall spaced apart from the first wall toward the other end of the second wall adjacent to the first wall. The electronic control device according to claim 6, characterized in that: The casing has an inclined wall provided in the air passage,
The slanted wall is slanted obliquely upward from one end of the second wall spaced apart from the first wall toward the other end of the second wall adjacent to the first wall. 4. The electronic control device according to 4. The electronic control device according to claim 4, further comprising a straightening protrusion protruding from the outer surface of the first wall of the housing and extending along the heat transfer protrusion from below the end of the heat transfer protrusion located in the heat receiving area to a position spaced from the second wall. Claim 1, wherein in a steady state where heat conduction occurs from the electronic component to the heat receiving area via the heat transfer material, the temperature of the heat receiving area is 1.2 times or more the temperature of the heat radiating area. The electronic control device described in . Claim 1, wherein in a steady state where heat conduction occurs from the electronic component to the heat receiving area via the heat transfer material, the temperature of the heat radiating area is 0.8 times or less the temperature of the heat receiving area. The electronic control device described in .

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