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WO2024049132A1 - Batterie et dispositif électronique la comprenant - Google Patents

Batterie et dispositif électronique la comprenant Download PDF

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Publication number
WO2024049132A1
WO2024049132A1 PCT/KR2023/012705 KR2023012705W WO2024049132A1 WO 2024049132 A1 WO2024049132 A1 WO 2024049132A1 KR 2023012705 W KR2023012705 W KR 2023012705W WO 2024049132 A1 WO2024049132 A1 WO 2024049132A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
disposed
anode
coating layer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2023/012705
Other languages
English (en)
Korean (ko)
Inventor
서정욱
김구연
최웅철
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220119725A external-priority patent/KR20240032589A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2024049132A1 publication Critical patent/WO2024049132A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/052—Li-accumulators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/05—Accumulators with non-aqueous electrolyte
    • H01M10/058—Construction or manufacture
    • H01M10/0587—Construction or manufacture of accumulators having only wound construction elements, i.e. wound positive electrodes, wound negative electrodes and wound separators
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H01M4/131—Electrodes based on mixed oxides or hydroxides, or on mixtures of oxides or hydroxides, e.g. LiCoOx
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H01M4/136—Electrodes based on inorganic compounds other than oxides or hydroxides, e.g. sulfides, selenides, tellurides, halogenides or LiCoFy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/10—Primary casings; Jackets or wrappings
    • H01M50/102—Primary casings; Jackets or wrappings characterised by their shape or physical structure
    • H01M50/105—Pouches or flexible bags
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/50—Current conducting connections for cells or batteries
    • H01M50/531—Electrode connections inside a battery casing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • Various embodiments of the present invention relate to batteries and electronic devices including the batteries.
  • the electronic device may include a battery to supply power to at least one component disposed therein.
  • the battery is a rechargeable secondary battery and can be used, for example, to supply power to components such as a processor, memory, and/or sensor module of an electronic device.
  • a battery included in an electronic device is formed by wrapping an electrode assembly formed by placing a positive electrode plate, a negative electrode plate, and a separator between the positive electrode plate and the negative plate, in the form of a jelly roll, and containing it in a pouch or can-type case. It can be.
  • the positive and negative plates may come into contact.
  • the conductive layer eg, aluminum layer
  • Various embodiments of the present invention can provide a battery that can prevent the conductor layer (eg, positive electrode current collector) of the positive plate from being exposed to the outside, and an electronic device including the battery.
  • the conductor layer eg, positive electrode current collector
  • An electronic device may include a battery.
  • the battery is contained in a pouch and within the pouch, and includes a positive electrode plate disposed on the outermost side, a first separator disposed inside the positive electrode plate, a negative electrode plate disposed inside the first separator, and an inside of the negative plate.
  • the second separator disposed may include a laminated and wound electrode assembly.
  • the positive electrode plate includes a resistive layer, a first conductor layer disposed in a first direction of the resistive layer, and a region disposed in a second direction of the resistive layer and a portion of which is not formed.
  • a second conductor layer disposed in the first direction of the first conductor layer, a first anode coating layer including a first region in which a portion is not formed, disposed in the second direction of the second conductor layer, It may include a second anode coating layer including a partially unformed first region, and a first anode tab disposed on the first conductor layer exposed through the first region of the first anode coating layer.
  • the second anode coating layer may include a second area in which a part of the second anode coating layer is not formed, at a position corresponding to an area in which a part of the second conductor layer is not formed.
  • a portion of the resistance layer may be exposed to the outside through a region where a portion of the second conductor layer is not formed and a second region where a portion of the second anode coating layer is not formed.
  • An electronic device may include a battery.
  • the battery is contained in a pouch and within the pouch, and includes a positive electrode plate disposed on the outermost side, a first separator disposed inside the positive electrode plate, a negative electrode plate disposed inside the first separator, and an inside of the negative plate.
  • the second separator disposed may include a laminated and wound electrode assembly.
  • the positive electrode plate includes a resistive layer, a first conductor layer disposed in a first direction of the resistive layer and including a first region, a portion of which is unformed, and a first conductor layer disposed in a second direction of the resistive layer, a portion of which is unformed.
  • a second conductor layer including a region, a first anode coating layer disposed in the first direction of the first conductor layer and including a first region in which a portion is unformed, and the first anode coating layer of the second conductor layer. It may include a second anode coating layer disposed in two directions and including a portion of an unformed area. The first region where a portion of the first conductor layer is not formed and the first region where a portion of the first anode coating layer is not formed may be formed at corresponding positions. The first portion of the resistance layer may be exposed through the first region where a portion of the first conductor layer is not formed and the first region where a portion of the first anode coating layer is not formed.
  • the conductor layer (e.g., positive electrode current collector) of the positive plate is configured so that it is not exposed to the outside, so that even if the battery is damaged by external impact, the positive and negative plates are prevented from coming into contact. This can prevent damage and ensure the stability of the battery.
  • FIG. 1A is a block diagram of an electronic device in a network environment according to various embodiments of the present invention.
  • FIG. 1B is a block diagram of a power management module and a battery according to various embodiments of the present invention.
  • FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present invention.
  • FIG. 2B is a perspective view of the rear of an electronic device according to various embodiments of the present invention.
  • FIG 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.
  • FIG. 4A is a view of a battery disposed inside an electronic device according to an embodiment of the present invention as seen from one direction (e.g., the front).
  • FIG. 4B is a perspective view of the electrode assembly shown in FIG. 4A rotated to the right and viewed from above according to an embodiment of the present invention.
  • FIG. 4C is a view of the electrode assembly shown in FIG. 4B according to an embodiment of the present invention as viewed from one direction (eg, from the bottom).
  • FIG. 5 is a diagram schematically showing an embodiment of a portion of a positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention.
  • FIG. 6 is a diagram schematically showing various embodiments of a positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention.
  • FIG. 7 is a diagram schematically showing the configuration of an electrode assembly including the positive electrode plate shown in FIG. 6 according to various embodiments of the present invention.
  • FIG. 8 is a diagram schematically showing an embodiment in which a positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention includes at least one exposed surface.
  • FIG. 9 is a diagram schematically showing the configuration of an electrode assembly including the positive electrode plate shown in FIG. 8 according to various embodiments of the present invention.
  • FIG. 10 is a diagram schematically showing various embodiments in which the positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention includes at least one positive electrode tab.
  • FIG. 11 is a diagram schematically showing the configuration of an electrode assembly including the positive electrode plate shown in FIG. 10 according to various embodiments of the present invention.
  • FIG. 1A is a block diagram of an electronic device 101 in a network environment 100, according to various embodiments of the present invention.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with at least one of the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added to the electronic device 101.
  • some of these components e.g., sensor module 176, camera module 180, or antenna module 197) are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g., a central processing unit or an application processor
  • an auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector, and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit signals or power to or receive signals or power from the outside (e.g., an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected. Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • a mmWave antenna module includes: a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., mmWave band); And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a first side e.g., bottom side
  • a designated high frequency band e.g., mmWave band
  • a plurality of antennas e.g., array antennas
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • 1B is a block diagram 111 of the power management module 188 and battery 189 according to various embodiments of the present invention.
  • the power management module 188 may include a charging circuit 113, a power regulator 115, and/or a power gauge 117.
  • the charging circuit 113 may charge the battery 189 using power supplied from an external power source for the electronic device 101.
  • the charging circuit 113 is configured to determine the type of external power source (e.g., power adapter, USB, or wireless charging), the size of power that can be supplied from the external power source (e.g., about 20 watts or more), or the battery (189). ), a charging method (e.g., normal charging or fast charging) can be selected based on at least some of the properties of ), and the battery 189 can be charged using the selected charging method.
  • the external power source may be connected to the electronic device 101 by wire, for example, through the connection terminal 178, or wirelessly through the antenna module 197.
  • the power regulator 115 may generate a plurality of powers having different voltages or different current levels by, for example, adjusting the voltage level or current level of power supplied from an external power source or the battery 189.
  • the power regulator 115 may adjust the power of the external power source or battery 189 to a voltage or current level suitable for each of some of the components included in the electronic device 101.
  • the power regulator 115 may be implemented in the form of a low drop out (LDO) regulator or a switching regulator.
  • the power gauge 117 may measure usage status information about the battery 189 (e.g., capacity, charge/discharge count, voltage, or temperature) of the battery 189.
  • the power management module 188 uses the charging circuit 113, the voltage regulator 115, or the power gauge 117 to control the battery 189 based at least in part on the measured usage state information.
  • Charge state information related to charging e.g., life, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheating, short circuit, or swelling
  • the power management module 188 may determine whether the battery 189 is normal or abnormal based at least in part on the determined charging state information. If the state of the battery 189 is determined to be abnormal, the power management module 188 may adjust charging of the battery 189 (eg, reduce charging current or voltage, or stop charging). According to one embodiment, at least some of the functions of the power management module 188 may be performed by an external control device (eg, processor 120).
  • the battery 189 may include a battery protection circuit (protection circuit module (PCM)) 187.
  • the battery protection circuit 187 may perform one or more of various functions (eg, a pre-blocking function) to prevent performance degradation or burnout of the battery 189.
  • the battery protection circuit 187 is, additionally or alternatively, a battery management system (battery management system) that can perform various functions including cell balancing, battery capacity measurement, charge/discharge count measurement, temperature measurement, or voltage measurement. It may be configured as at least a part of BMS)).
  • At least part of the usage state information or the charging state information of the battery 189 is a corresponding sensor (e.g., temperature sensor), power gauge 117, or power management module among the sensor module 176. It can be measured using (188).
  • the corresponding sensor e.g., temperature sensor
  • the corresponding sensor among the sensor modules 176 is included as part of the battery protection circuit 187, or is disposed near the battery 189 as a separate device. You can.
  • Electronic devices may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as logic, logic block, component, or circuit, for example. It can be used as A module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • 2A is a perspective view of the front of an electronic device according to various embodiments of the present invention.
  • 2B is a perspective view of the rear of an electronic device according to various embodiments of the present invention.
  • the electronic device 200 includes a first side (or front) 210A, a second side (or back) 210B, and a first side 210A. and a housing 210 including a side surface 210C surrounding the space between the second surfaces 210B.
  • housing may refer to a structure that forms some of the first side 210A, second side 210B, and side surface 210C of FIGS. 2A and 2B.
  • the first surface 210A may be formed at least in part by a substantially transparent front plate 202 (eg, a glass plate including various coating layers, or a polymer plate).
  • the second surface 210B may be formed by a substantially opaque rear plate 211.
  • the back plate 211 is formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. It can be.
  • the side 210C joins the front plate 202 and the back plate 211 and may be formed by a side bezel structure 218 (or “side member”) comprising metal and/or polymer.
  • back plate 211 and side bezel structure 218 may be formed as a single piece and include the same material (eg, a metallic material such as aluminum).
  • the front plate 202 has a first region 210D that extends seamlessly by bending from the first surface 210A toward the rear plate, along the long edge of the front plate. edge) can be included at both ends.
  • the rear plate 211 includes second regions 210E at both ends of long edges that are curved and seamlessly extended from the second surface 210B toward the front plate. can do.
  • the front plate 202 or the rear plate 211 may include only one of the first area 210D or the second area 210E.
  • the front plate 202 may not include the first area and the second area, but may only include a flat plane disposed parallel to the second surface 210B.
  • the side bezel structure 218 when viewed from the side of the electronic device 200, has a first area on the side that does not include the first area 210D or the second area 210E. It may have a thickness (or width) of 1, and may have a second thickness thinner than the first thickness on the side including the first or second area.
  • the electronic device 200 (e.g., the electronic device 101 of FIG. 1) includes a display 201, an input module 203 (e.g., the input module 150 of FIG. 1), and an audio output.
  • Modules 207 and 214 e.g., audio output module 155 in FIG. 1), sensor modules 204 and 219, camera modules 205, 212, and 213 (e.g., camera module 180 in FIG. 1), It may include at least one of a key input device 217, an indicator (not shown), and a connector 208.
  • the electronic device 200 may omit at least one of the components (eg, the key input device 217 or an indicator) or may additionally include another component.
  • Display 201 may be exposed, for example, through a significant portion of front plate 202 .
  • at least a portion of the display 201 may be exposed through the front plate 202 that forms the first surface 210A and the first area 210D of the side surface 210C.
  • the display 201 may be combined with or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the strength (pressure) of touch, and/or a digitizer that detects a magnetic field-type stylus pen.
  • at least a portion of the sensor modules 204, 219, and/or at least a portion of the key input device 217 are located in the first area 210D and/or the second area 210E. can be placed.
  • the input module 203 may include a microphone. In some embodiments, the input module 203 may include a plurality of microphones 203 arranged to detect the direction of sound.
  • the sound output modules 207 and 214 may include speakers 207 and 214.
  • the speakers 207 and 214 may include an external speaker 207 and a receiver 214 for a call.
  • the microphone 203, speakers 207, 214, and connector 208 are disposed in the space of the electronic device 200 and exposed to the external environment through at least one hole formed in the housing 210. It can be. In some embodiments, the hole formed in the housing 210 may be commonly used for the microphone 203 and speakers 207 and 214.
  • the sound output modules 207 and 214 may include speakers (eg, piezo speakers) that operate without the holes formed in the housing 210.
  • the sensor modules 204 and 219 may generate electrical signals or data values corresponding to the internal operating state of the electronic device 200 or the external environmental state.
  • the sensor modules 204, 219 may include, for example, a first sensor module 204 (e.g., a proximity sensor) and/or a second sensor module (not shown) disposed on the first side 210A of the housing 210. ) (eg, fingerprint sensor), and/or a third sensor module 219 (eg, HRM sensor) disposed on the second surface 210B of the housing 210.
  • the fingerprint sensor may be disposed on the first side 210A (e.g., the display 201) as well as the second side 210B of the housing 210.
  • the electronic device 200 includes a sensor module, not shown, e.g.
  • a gesture sensor For example, at least one of a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 204. It can be included.
  • the camera modules 205, 212, and 213 include a first camera module 205 disposed on the first side 210A of the electronic device 200, and a second camera module 212 disposed on the second side 210B. ), and/or a flash 213.
  • the camera modules 205 and 212 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle lens, ultra-wide-angle lens, or telephoto lens) and image sensors may be placed on one side of the electronic device 200.
  • the key input device 217 may be disposed on the side 210C of the housing 210.
  • the electronic device 200 may not include some or all of the above-mentioned key input devices 217 and the key input devices 217 not included may include soft keys, etc. on the display 201. It can be implemented in different forms.
  • the key input device 217 may be implemented using a pressure sensor included in the display 201.
  • the key input device may include a sensor module disposed on the second side 210B of the housing 210.
  • the indicator may be placed, for example, on the first side 210A of the housing 210.
  • the indicator may provide status information of the electronic device 200 in the form of light.
  • the light emitting device may provide, for example, a light source linked to the operation of the camera module 205.
  • Indicators may include, for example, LEDs, IR LEDs, and xenon lamps.
  • the connector hole 208 is a first connector hole 208 that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an audio connector with an external electronic device. It may include a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving signals.
  • a connector e.g., a USB connector
  • earphone jack a connector for transmitting and receiving signals.
  • Some camera modules 205 among the camera modules 205 and 212, some sensor modules 204 among the sensor modules 204 and 219, or indicators may be arranged to be exposed through the display 201.
  • the camera module 205, sensor module 204, or indicator can be in contact with the external environment through a through hole drilled up to the front plate 202 of the display 201 in the internal space of the electronic device 200. can be placed.
  • some sensor modules 204 may be arranged to perform their functions in the internal space of the electronic device without being visually exposed through the front plate 202. For example, in this case, the area facing the sensor module of the display 201 may not require a through hole.
  • FIG 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.
  • the electronic device 300 of FIG. 3 may be at least partially similar to the electronic device 101 of FIG. 1 and the electronic device 200 of FIGS. 2A and/or 2B, or may include other embodiments of the electronic device.
  • the electronic device 300 (e.g., the electronic device 101 of FIG. 1, the electronic device 200 of FIG. 2a and/or 2b) has a side member 310 (e.g., the electronic device 101 of FIG. 1 and the electronic device 200 of FIG. 2a and/or 2b). /or housing 210 or side bezel structure 218 in FIG. 2B ), first support member 311 (e.g., bracket or support structure), front plate 320 (e.g., front cover), display 330 , a printed circuit board 340, a battery 350, a second support member 360 (eg, a rear case), an antenna 370, and a rear plate 380 (eg, a rear cover).
  • first support member 311 e.g., bracket or support structure
  • front plate 320 e.g., front cover
  • display 330 e.g., a printed circuit board 340
  • a battery 350 e.g., a battery 350
  • a second support member 360 eg, a rear case
  • the electronic device 300 may omit at least one of the components (e.g., the first support member 311 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 300 may be the same as, or similar to, the electronic device 101 of FIG. 1 or at least one of the components of the electronic device 200 of FIGS. 2A and/or 2B. It is possible, and overlapping descriptions are omitted below.
  • the first support member 311 may be disposed inside the electronic device 300 and connected to the side member 310 (e.g., the housing 210 in FIGS. 2A and/or 2B), or may be connected to the side member 310. It can be formed integrally.
  • the first support member 311 may be formed of, for example, a metallic material and/or a non-metallic (eg, polymer) material.
  • the first support member 311 may have a display 330 (eg, display 201 of FIG. 2A) coupled to one side and a printed circuit board 340 to the other side.
  • the processor 120, memory 130, and/or interface 177 shown in FIG. 1 may be mounted on the printed circuit board 340.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the printed circuit board 340 may include a first PCB (340a) and/or a second PCB (340b).
  • the first PCB 340a and the second PCB 340b may be arranged to be spaced apart from each other and may be electrically connected using a connecting member 345 (eg, a coaxial cable and/or FPCB).
  • the printed circuit board 340 may include a structure in which a plurality of printed circuit boards (PCBs) are stacked.
  • the printed circuit board 340 may include an interposer structure.
  • the printed circuit board 340 may be implemented in the form of a flexible printed circuit board (FPCB) and/or a rigid printed circuit board (PCB).
  • side member 310 e.g., housing
  • side member 310 may include at least one segment (e.g., slit).
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device and may include a USB connector, SD card/MMC connector, or audio connector.
  • the battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 350 may be disposed, for example, on substantially the same plane as the printed circuit board 340 . The battery 350 may be placed integrally within the electronic device 300. In another embodiment, the battery 350 may be disposed to be detachable from the electronic device 300.
  • the antenna 370 may be disposed between the rear plate 380 and the battery 350.
  • the antenna 370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • NFC near field communication
  • MST magnetic secure transmission
  • the antenna 370 may perform short-distance communication with an external device or wirelessly transmit and receive power required for charging.
  • an antenna structure may be formed by a portion or a combination of the side member 310 and/or the first support member 311.
  • FIG. 4A is a view of a battery disposed inside an electronic device according to an embodiment of the present invention as viewed from one direction (e.g., front, z-axis direction).
  • FIG. 4B is a perspective view of the electrode assembly shown in FIG. 4A viewed from above after being rotated to the right (eg, about 45°) according to an embodiment of the present invention.
  • FIG. 4C is a view of the electrode assembly shown in FIG. 4B viewed from one direction (eg, the -y-axis direction) according to an embodiment of the present invention.
  • the battery 350 shown in FIGS. 4A to 4C may include embodiments described in the battery 189 shown in FIGS. 1A and 1B and/or the battery 350 shown in FIG. 3 .
  • overlapping descriptions of the functions and configurations of the battery 189 shown in FIGS. 1A and 1B and/or the battery 350 shown in FIG. 3 may be omitted. there is.
  • the battery 350 may include a pouch 401 and an electrode assembly 405.
  • the battery 350 is, for example, a processor 120, a memory 130, an input module 150, an audio output module 155 of the electronic device 101 shown in FIG. 1A. Power may be supplied to the audio module 170, sensor module 176, haptic module 179, and/or camera module 180.
  • Battery 350 may include, for example, a lithium ion battery.
  • the pouch 401 may include an electrode assembly 405.
  • the pouch 401 may be a case (eg, a can) in which an internal space containing the electrode assembly 405 is formed.
  • the pouch 401 may include a material capable of responding to volume changes of the electrode assembly 405 (e.g., a jelly roll-shaped secondary battery) corresponding to charging and discharging of the battery 350. You can.
  • the pouch 401 includes the electrode assembly 405 and can be sealed from the outside.
  • pouch 401 may be formed of a metal such as aluminum or aluminum alloy.
  • the pouch 401 may be formed by lamination of nylon, aluminum, and polypropylene layers.
  • the electrode assembly 405 includes a positive electrode plate 411 (e.g., a first electrode plate), a first separator 413, a negative electrode plate 415 (e.g., a second electrode plate), and a second electrode plate. It may include a separator 417, an anode tab 421, and/or a cathode tab 425.
  • the electrode assembly 405 may be included inside the pouch 401.
  • the electrode assembly 405 may be placed in the inner space of the pouch 401 and placed together with the electrolyte through a process in which the electrolyte is injected and then sealed.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 may be stacked and wound.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 may be overlapped and wound.
  • the anode plate 411, the first separator 413, the cathode plate 415, and the second separator 417 may be wound to form a jelly roll.
  • the positive electrode plate 411 may be disposed on the outermost side of the electrode assembly 405 when formed in a jelly roll shape.
  • the first separator 413 may be disposed inside the positive electrode plate 411 so that it is closer to the center 400 than the positive electrode plate 411.
  • the cathode plate 415 may be disposed inside the first separator 413 so that it is closer to the center 400 than the first separator 413 .
  • the second separator 417 may be disposed inside the cathode plate 415 so that it is closer to the center 400 than the cathode plate 415.
  • the anode plate 411 and the cathode plate 415 may be insulated through the first separator 413.
  • the electrode assembly 405 of the battery 350 may convert the chemical energy of the positive electrode plate 411 and the negative electrode plate 415 into electrical energy.
  • the electrode assembly 405 may be disposed with the positive electrode tab 421 and the negative electrode tab 425 spaced apart from each other in the center 400 (e.g., jelly roll-shaped core).
  • the positive electrode tab 421 may be connected to a portion of the positive electrode plate 411.
  • the negative electrode tab 425 may be connected to a portion of the negative electrode plate 415.
  • Power may be supplied to, for example, the power management module 188 shown in FIGS. 1A and 1B through the positive electrode tab 421 and the negative electrode tab 425.
  • the anode tab 421 and the cathode tab 425 may not be disposed at the center 400 of the electrode assembly 405, but may be disposed at various other locations of the electrode assembly 405.
  • the anode plate 411 may be an electrode through which electrons flow. Since a chemical reaction of losing electrons occurs in the anode plate 411, it may be an electrode in which an oxidation reaction occurs. At least one surface of the positive electrode plate 411 may be coated with a positive electrode active material for positive electrode activity. An anode coating layer may be formed on at least one side of the anode plate 411.
  • the cathode plate 415 may be an electrode through which electrons flow. Since a chemical reaction to obtain electrons occurs in the cathode plate 415, it may be an electrode in which a reduction reaction occurs. At least one surface of the negative electrode plate 415 may be coated with a negative electrode active material for negative electrode activity. The anode plate 411 and the cathode plate 415 may generate current through a redox reaction with the first separator 413 interposed therebetween.
  • the positive electrode plate 411 may include a plate or layer (eg, aluminum foil) containing a metal such as aluminum.
  • the cathode plate 415 may include a plate or layer (eg, copper foil) containing a metal such as copper.
  • the first separator 413 may be disposed between the anode plate 411 and the cathode plate 415.
  • the first separator 413 may be a separator that prevents the anode plate 411 and the cathode plate 415 from contacting each other.
  • the first separator 413 may insulate the positive electrode plate 411 and the negative electrode plate 415.
  • the first separator 413 can prevent the anode plate 411 and the cathode plate 415 from being shorted.
  • the first separator 413 and the second separator 417 may be formed of a porous polymer membrane such as polyethylene (PE) or polypropylene (PP).
  • PE polyethylene
  • PP polypropylene
  • the electrode assembly 405 may have a first outer surface 411a and a second outer surface 411b formed by the anode plate 411 disposed on the outermost side.
  • the electrode assembly 405 may have a first inner surface 400a and a second inner surface 400b formed by the second separator 417 disposed on the innermost side.
  • the electrode assembly 405 may be understood as the first outer surface 411a, which is a portion of the positive electrode plate 411 viewed from one direction (eg, z-axis direction).
  • the electrode assembly 405 may be understood as a second outer surface 411b, which is a portion of the positive electrode plate 411 viewed from a direction (e.g., -z-axis direction) opposite to the one direction (e.g., z-axis direction).
  • the end of the electrode assembly 405 in the upper direction (eg, y-axis direction) may be understood as the upper end 431.
  • the electrode assembly 405 may be understood as having an end in the upper direction (e.g., y-axis direction) and the opposite direction (e.g., -y-axis direction, lower direction) as the lower end 441.
  • the electrode assembly 405 is configured so that the portion closest to the center 400 of the second separator 417 located between the center 400 (e.g., jelly roll-shaped core) and the first outer surface 411a is inside the first separator. It can be understood as the side 400a.
  • the first inner surface 400a may be part of the second separator 417.
  • the portion closest to the center 400 of the second separator 417 located between the center 400 and the second outer surface 411b may be understood as the second inner surface 400b.
  • the second inner surface 400b may be part of the second separator 417.
  • the upper direction (e.g., y-axis direction) is a portion of the direction in which the positive electrode tab 421 and the negative electrode tab 425 are located in the electrode assembly 405, and the lower direction (e.g., -y-axis direction) can be understood as a part in the opposite direction to the upper direction.
  • FIG. 5 is a diagram schematically showing an embodiment of a portion of a positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention.
  • FIG. 5 may be an enlarged view of portion A of the electrode assembly 405 according to an embodiment of the present invention disclosed in FIG. 4C.
  • the anode plate 411 includes a resistance layer 510, a first conductor layer 521, a second conductor layer 522, and a first anode coating layer ( 531) and/or a second anode coating layer 532.
  • the resistance layer 510 may be disposed between the first conductor layer 521 and the second conductor layer 522.
  • the resistance layer 510 may include an adhesive sheet containing an adhesive component.
  • the resistance layer 510 may be a thin film sheet with adhesive force.
  • the resistance layer 510 may include a sheet containing at least one of an organic material (eg, polymer) or an inorganic material (eg, ceramic or metal). Even if the battery 350 is damaged by an external impact, the resistance layer 510 can prevent battery burnout by delaying the flow of current.
  • the first conductor layer 521 may be disposed in the first direction (1) of the resistance layer 510.
  • the first conductor layer 521 may be disposed between the resistance layer 510 and the first anode coating layer 531.
  • the first conductor layer 521 may include one of an aluminum foil layer or a metal layer.
  • the first conductor layer 521 may include an aluminum thin film sheet.
  • the second conductor layer 522 may be disposed in the second direction (2) of the resistance layer 510.
  • the second direction may be opposite to the first direction.
  • the second conductor layer 522 may be disposed between the resistance layer 510 and the second anode coating layer 532.
  • the second conductor layer 522 may include either an aluminum foil layer or a metal layer.
  • the second conductor layer 522 may include a thin aluminum sheet.
  • the first anode coating layer 531 may be disposed in the first direction of the first conductor layer 521.
  • the first anode coating layer 531 may be disposed on the surface of the first conductor layer 521 in the first direction (1).
  • the first positive electrode coating layer 531 may include a positive electrode active material containing lithium.
  • the positive electrode active material may include, for example, at least one of lithium cobalt oxide (LCO), nickel cobalt manganese (NCM), nickel cobalt aluminum (NCA), or lithium iron phosphate (LFP).
  • the second anode coating layer 532 may be disposed in the second direction of the second conductor layer 522.
  • the second anode coating layer 532 may be disposed on the surface of the second conductor layer 522 in the second direction (2).
  • the second positive electrode coating layer 532 may include a positive electrode active material containing lithium.
  • the positive electrode active material may include, for example, at least one of lithium cobalt oxide (LCO), nickel cobalt manganese (NCM), nickel cobalt aluminum (NCA), or lithium iron phosphate (LFP).
  • FIG. 6 is a diagram schematically showing various embodiments of a positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention.
  • FIG. 7 is a diagram schematically showing the configuration of an electrode assembly including the positive electrode plate shown in FIG. 6 according to various embodiments of the present invention.
  • the positive electrode plate 411 disclosed in FIGS. 6 and 7 may include the embodiments described in the positive electrode plate 411 of FIG. 5 above. Embodiments disclosed in the anode plate 411 of FIG. 5 may be applied to the anode plate 411 of FIGS. 6 and 7 .
  • components that are substantially the same as the embodiment of the anode plate 411 disclosed in FIG. 5 are assigned the same reference numerals, and duplicate descriptions thereof may be omitted.
  • the positive electrode plate 411 includes a resistance layer 510, a first conductive layer 521, a second conductive layer 522, and a first anode. It may include a coating layer 531, a second anode coating layer 532, a first anode tab 610, and/or a second anode tab 620. In one embodiment, the positive electrode plate 411 may include one or both of the first positive electrode tab 610 and the second positive electrode tab 620.
  • the resistance layer 510 may be disposed between the first conductor layer 521 and the second conductor layer 522.
  • the first conductor layer 521 may be disposed in the first direction of the resistance layer 510 .
  • the second conductor layer 522 may be disposed in the second direction of the resistance layer 510 .
  • the first anode coating layer 531 may be disposed in the first direction (1) of the first conductor layer 521.
  • the first conductor layer 521 may be positioned between the resistance layer 510 and the first anode coating layer 531.
  • the second anode coating layer 532 may be disposed in the second direction (2) of the second conductor layer 522.
  • the second conductor layer 522 may be positioned between the resistive layer 510 and the second anode coating layer 532.
  • a portion of the first anode coating layer 531 may not be formed in the first area 631 (eg, in the third direction (3)).
  • the first region 631 of the first anode coating layer 531 may not be formed when the anode plate 411 is manufactured.
  • the first region 631 of the first anode coating layer 531 may be a portion formed during manufacturing of the anode plate 411 and then removed by cutting.
  • the first anode coating layer 531 may not be disposed in the first area 631 (eg, the third direction) where a portion of the first anode coating layer 531 is not formed.
  • a portion of the first conductor layer 521 (eg, in the third direction 3) may be exposed through the first area 631 where a portion of the first anode coating layer 531 is not formed.
  • the first anode tab 610 may be disposed in the first area 631 where a portion of the first anode coating layer 531 is not formed.
  • the first anode tab 610 may be disposed in the first direction of the first conductor layer 521 exposed through the first area 631 in which a portion of the first anode coating layer 531 is not formed.
  • the first anode tab 610 may be connected to the first conductor layer 521 exposed through the first area 631 in which a portion of the first anode coating layer 531 is not formed.
  • a portion of the second anode coating layer 532 may not be formed in the first area 632 (eg, in the third direction (3)).
  • the first region 632 of the second anode coating layer 532 may not be formed when the anode plate 411 is manufactured.
  • the first region 632 of the second anode coating layer 532 may be a portion formed during manufacturing of the anode plate 411 and then removed by cutting.
  • the second anode coating layer 532 may not be disposed in the first area 632 (eg, the third direction) where a portion of the second anode coating layer 532 is not formed.
  • a portion of the second conductor layer 522 (eg, in the third direction (3)) may be exposed through the first region 632 where a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 620 may be disposed in the first area 632 where a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 620 may be disposed in the second direction of the second conductor layer 522 exposed through the first area 632 in which a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 620 may be connected to the second conductor layer 522 exposed through the first area 632 in which a portion of the second anode coating layer 532 is not formed.
  • the second anode coating layer 532 may not be formed in the second area 634 (eg, the fourth direction 4), which is opposite to the first area 632.
  • the second region 634 of the second anode coating layer 532 may not be formed when the anode plate 411 is manufactured.
  • the second region 634 of the second anode coating layer 532 may be a portion formed during manufacturing of the anode plate 411 and then removed by cutting.
  • the second anode coating layer 532 may not be disposed in the second area 634 (eg, the fourth direction (4)) where a portion of the second anode coating layer 532 is not formed.
  • one region 622 of the second conductor layer 522 may not be formed in the fourth direction 4.
  • one region 622 of the second conductor layer 522 may not be formed in the second direction 2 of the resistance layer 510.
  • one region 622 of the second conductor layer 522 may not be formed when manufacturing the positive electrode plate 411.
  • one region 622 of the second conductor layer 522 may be a portion formed during manufacturing of the positive electrode plate 411 and then removed by cutting.
  • the second conductor layer 522 may not be disposed in a region 622 where a portion of the second conductor layer 522 is not formed (eg, an end portion in the fourth direction (4)).
  • the region 622 in which a portion of the second conductor layer 522 is not formed and the second region 634 in which a portion of the second anode coating layer 532 is not formed may be formed at positions corresponding to each other. You can.
  • the resistance layer 510 is formed through the region 622 in which a portion of the second conductor layer 522 is not formed and the second region 634 in which a portion of the second anode coating layer 532 is not formed.
  • a portion 515 may be exposed to the outside.
  • a portion 515 of the resistance layer 510 may form an externally exposed surface of the resistance layer 510 .
  • an adhesive tape (not shown) may be attached to a portion 515 of the resistance layer 510 to prevent slipping.
  • the adhesive tape may include oriented polystyrene. The adhesive tape can prevent damage to the battery 350 even if an impact occurs on the battery 350 through its strong adhesive force.
  • the electrode assembly 405 of the battery 350 includes a positive electrode plate 411, a first separator 413, a negative electrode plate 415, a second separator 417, and a first positive electrode tab 610. ), and may include a second anode tab 620 and/or a cathode tab 425.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 are stacked and separated from the center 400. It can be wound at least once.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 may be overlapped and wound at least once.
  • the first separator 413 may be disposed inside the positive electrode plate 411 so that it is closer to the center 400 than the positive electrode plate 411.
  • the cathode plate 415 may be disposed inside the first separator 413 so that it is closer to the center 400 than the first separator 413 .
  • the second separator 417 may be disposed inside the cathode plate 415 so that it is closer to the center 400 than the cathode plate 415.
  • the anode plate 411 and the cathode plate 415 may be insulated through the first separator 413.
  • the electrode assembly 405 has a first anode tab 610, a second anode tab 620, and a cathode tab 425 spaced apart from each other in the center 400 (e.g., a jelly roll-shaped core). and can be placed.
  • the first anode tab 610 may be connected to a portion of the first conductor layer 521.
  • the second anode tab 620 may be connected to a portion of the second conductor layer 522.
  • the negative electrode tab 425 may be connected to a portion of the negative electrode plate 415.
  • Power may be supplied to, for example, the power management module 188 shown in FIGS. 1A and 1B through the first anode tab 610, the second anode tab 620, and the cathode tab 425.
  • the cathode plate 415 may be coated with a negative electrode active material for negative electrode activity.
  • the cathode plate 415 may include a plate or layer (eg, copper foil) containing a metal such as copper.
  • the first separator 413 may be disposed between the anode plate 411 and the cathode plate 415.
  • the first separator 413 can prevent the positive electrode plate 411 and the negative electrode plate 415 from contacting each other.
  • the first separator 413 may insulate the positive electrode plate 411 and the negative electrode plate 415.
  • the first separator 413 can prevent the anode plate 411 and the cathode plate 415 from being shorted.
  • the anode plate 411 of the battery 350 included in the electronic devices 101, 200, and 300 includes a partial region 622 of the second conductor layer 522 and a second anode coating layer ( The second region 634 of 532 is not formed, and a portion 515 of the resistive layer 510 is configured to form the outermost surface of the electrode assembly 405, so that the first conductor layer 521 and By constructing the second conductor layer 522 so that it is not exposed, even if the battery 350 is damaged by an external impact, the positive electrode plate 411 and the negative electrode plate 415 can be prevented from directly contacting each other. .
  • FIG. 8 is a diagram schematically showing an embodiment in which a positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention includes at least one exposed surface.
  • FIG. 9 is a diagram schematically showing the configuration of an electrode assembly including the positive electrode plate shown in FIG. 8 according to various embodiments of the present invention.
  • the positive electrode plate 411 disclosed in FIGS. 8 and 9 may include the embodiments described with respect to the positive electrode plate 411 of FIGS. 5 to 7 .
  • Embodiments disclosed in the anode plate 411 of FIGS. 5 to 7 may be applied to the anode plate 411 of FIGS. 8 and 9 .
  • the same reference numerals are assigned to components that are substantially the same as the embodiment of the positive electrode plate 411 disclosed in FIGS. 5 to 7, and duplicate descriptions thereof may be omitted. there is.
  • the anode plate 411 includes a resistance layer 510, a first conductor layer 521, a second conductor layer 522, and a first anode. It may include a coating layer 531, a second anode coating layer 532, a first anode tab 810, and/or a second anode tab 820. In one embodiment, the positive electrode plate 411 may include one or both of the first positive electrode tab 810 and the second positive electrode tab 820.
  • the resistance layer 510 may be disposed between the first conductor layer 521 and the second conductor layer 522.
  • the first conductor layer 521 may be disposed in the first direction (1) of the resistance layer 510.
  • the second conductor layer 522 may be disposed in the second direction (2) of the resistance layer 510 .
  • the first anode coating layer 531 may be disposed in the first direction (1) of the first conductor layer 521.
  • the first conductor layer 521 may be positioned between the resistance layer 510 and the first anode coating layer 531.
  • the second anode coating layer 532 may be disposed in the second direction (2) of the second conductor layer 522.
  • the second conductor layer 522 may be positioned between the resistive layer 510 and the second anode coating layer 532.
  • a portion of the first conductor layer 521 may not be formed in the first area 821 (eg, the third direction).
  • the first area 821 of the first conductor layer 521 may be a portion in which the first conductor layer 521 is not formed.
  • the first conductor layer 521 may not be disposed in the first area 821 of the first conductor layer 521.
  • a portion of the first anode coating layer 531 may not be formed in the first area 831 (eg, the third direction 3).
  • the first area 831 of the first anode coating layer 531 may be a portion where the first anode coating layer 531 is not formed.
  • the first anode coating layer 531 may not be disposed in the first area 831 of the first anode coating layer 531.
  • the first region 821 where a portion of the first conductor layer 521 is not formed and the first region 831 where a portion of the first anode coating layer 531 is not formed are located at corresponding positions. can be formed.
  • the resistance layer 510 is formed through the first region 821 in which a portion of the first conductor layer 521 is not formed and the first region 831 in which a portion of the first anode coating layer 531 is not formed. ) (e.g., the distal end in the third direction (3)) may be exposed to the outside.
  • the first portion 812 of the resistance layer 510 may form a first exposed surface where the resistance layer 510 is exposed to the outside.
  • a portion of the first anode coating layer 531 may not be formed in the second area 832 (eg, the fourth direction).
  • the second area 832 of the first anode coating layer 531 may be a portion where the first anode coating layer 531 is not formed.
  • the first anode coating layer 531 may not be disposed in the second area 832 (eg, the fourth direction) where a portion of the first anode coating layer 531 is not formed.
  • a portion of the first conductor layer 521 may be exposed through the second region 832 where a portion of the first anode coating layer 531 is not formed.
  • the first anode tab 810 may be disposed in the second area 832 (e.g., the end portion in the fourth direction 4) where a portion of the first anode coating layer 531 is not formed. there is.
  • the first anode tab 810 is disposed in the first direction (1) of the first conductor layer 521 exposed through the second region 832 in which a portion of the first anode coating layer 531 is not formed. can be placed in The first anode tab 810 may be connected to the first conductor layer 521 exposed through the second region 832 in which a portion of the first anode coating layer 531 is not formed.
  • a portion of the second conductor layer 522 may not be formed in one area 822 in the fourth direction (4).
  • One region 822 of the second conductor layer 522 may be a portion in which the second conductor layer 522 is not formed.
  • the second conductor layer 522 may not be disposed in a region 822 (eg, an end portion in the fourth direction) where a portion of the second conductor layer 522 is not formed.
  • a portion of the second anode coating layer 532 may not be formed in one area 836 (eg, the fourth direction).
  • One area 836 of the second anode coating layer 532 may be a portion in which the second anode coating layer 532 is not formed.
  • the second anode coating layer 532 may not be disposed in the area 836 where a portion of the second anode coating layer 532 is not formed.
  • a portion of the second conductor layer 522 may be exposed to the outside through a region 836 (e.g., an end portion in the fourth direction 4) in which a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 820 may be disposed in an area 836 (eg, the fourth direction 4) where a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 820 is a portion of the second conductor layer 522 exposed through a region 836 (e.g., fourth direction 4) in which a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 820 may be connected to the second conductor layer 522 exposed through a region 836 where a portion of the second anode coating layer 532 is not formed.
  • the resistance layer 510 is formed through a region 822 in which a portion of the second conductor layer 522 is not formed and a region 836 in which a portion of the second anode coating layer 532 is not formed.
  • the second part 814 may be exposed to the outside.
  • the second portion 814 of the resistance layer 510 may form a second exposed surface where the resistance layer 510 is exposed to the outside.
  • the electrode assembly 405 of the battery 350 includes a positive electrode plate 411, a first separator 413, a negative electrode plate 415, a second separator 417, and a first positive electrode tab 810. ), and may include a second anode tab 820 and/or a cathode tab 425.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 are stacked and separated from the center 400. It can be wound at least once.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 may be overlapped and wound at least once.
  • the first separator 413 may be disposed inside the positive electrode plate 411 so that it is closer to the center 400 than the positive electrode plate 411.
  • the cathode plate 415 may be disposed inside the first separator 413 so that it is closer to the center 400 than the first separator 413 .
  • the second separator 417 may be disposed inside the cathode plate 415 so that it is closer to the center 400 than the cathode plate 415.
  • the anode plate 411 and the cathode plate 415 may be insulated through the first separator 413.
  • the first positive electrode tab 810, the second positive electrode tab 820, and the negative electrode tab 425 of the electrode assembly 405 are not in the center 400 (e.g., a jelly roll-shaped core). , may be spaced apart and placed adjacent to the inside of a portion of the positive electrode plate 411 disposed on the outermost side of the electrode assembly 405.
  • the first anode tab 810 may be connected to a portion of the first conductor layer 521.
  • the second anode tab 820 may be connected to a portion of the second conductor layer 522.
  • the negative electrode tab 425 may be connected to a portion of the negative electrode plate 415. Power may be supplied to, for example, the power management module 188 shown in FIGS. 1A and 1B through the first anode tab 810, the second anode tab 820, and the cathode tab 425.
  • the first separator 413 may be disposed between the anode plate 411 and the cathode plate 415.
  • the first separator 413 can prevent the positive electrode plate 411 and the negative electrode plate 415 from contacting each other.
  • the first separator 413 may insulate the positive electrode plate 411 and the negative electrode plate 415.
  • the first separator 413 can prevent the anode plate 411 and the cathode plate 415 from being shorted.
  • FIG. 10 is a diagram schematically showing various embodiments in which the positive plate of a battery disposed inside an electronic device according to an embodiment of the present invention includes at least one positive electrode tab.
  • FIG. 11 is a diagram schematically showing the configuration of an electrode assembly including the positive electrode plate shown in FIG. 10 according to various embodiments of the present invention.
  • the positive electrode plate 411 disclosed in FIGS. 10 and 11 may include the embodiments described with respect to the positive electrode plate 411 of FIGS. 5 to 9 above. Embodiments disclosed in the anode plate 411 of FIGS. 5 to 9 may be applied to the anode plate 411 of FIGS. 10 and 11 .
  • the same reference numbers are assigned to components that are substantially the same as the embodiment of the positive electrode plate 411 disclosed in FIGS. 5 to 9, and duplicate descriptions thereof may be omitted. there is.
  • the positive electrode plate 411 includes a resistance layer 510, a first conductive layer 521, a second conductive layer 522, and a first anode. It may include a coating layer 531, a second anode coating layer 532, a first anode tab 1010, a second anode tab 1020, a third anode tab 1030, and/or a fourth anode tab 1040. there is.
  • the positive electrode plate 411 may include any or all of a first positive electrode tab 1010, a second positive electrode tab 1020, a third positive electrode tab 1030, or a fourth positive electrode tab 1040. You can.
  • the resistance layer 510 may be disposed between the first conductor layer 521 and the second conductor layer 522.
  • the first conductor layer 521 may be disposed in the first direction (1) of the resistance layer 510.
  • the second conductor layer 522 may be disposed in the second direction (2) of the resistance layer 510 .
  • the first anode coating layer 531 may be disposed in the first direction (1) of the first conductor layer 521.
  • the first conductor layer 521 may be positioned between the resistance layer 510 and the first anode coating layer 531.
  • the second anode coating layer 532 may be disposed in the second direction (2) of the second conductor layer 522.
  • the second conductor layer 522 may be positioned between the resistive layer 510 and the second anode coating layer 532.
  • a portion of the first anode coating layer 531 may not be formed in the first area 1031 (eg, in the third direction (3)).
  • the first area 1031 of the first anode coating layer 531 may be a portion where the first anode coating layer 531 is not formed.
  • the first anode coating layer 531 may not be disposed in the first area 1031 where a portion of the first anode coating layer 531 is not formed.
  • a portion of the first conductor layer 521 may be exposed through the first area 1031 where a portion of the first anode coating layer 531 is not formed.
  • the first anode tab 1010 may be disposed in the first area 1031 (e.g., the end portion in the third direction 3) where a portion of the first anode coating layer 531 is not formed. there is.
  • the first anode tab 1010 is disposed in the first direction (1) of the first conductor layer 521 exposed through the first region 1031 where a portion of the first anode coating layer 531 is not formed. can be placed in The first anode tab 1010 may be connected to a portion of the first conductor layer 521 exposed through the first area 1031 in which a portion of the first anode coating layer 531 is not formed.
  • a portion of the first anode coating layer 531 may not be formed in the second area 1033 (eg, the fourth direction (4)).
  • the second area 1033 of the first anode coating layer 531 may be a portion where the first anode coating layer 531 is not formed.
  • the first anode coating layer 531 may not be disposed in the second area 1033 (e.g., the fourth direction (4)) where a portion of the first anode coating layer 531 is not formed.
  • a portion of the first conductor layer 521 may be exposed through the second region 1033 where a portion of the first anode coating layer 531 is not formed.
  • the third anode tab 1030 may be disposed in the second area 1033 where a portion of the first anode coating layer 531 is not formed.
  • the third anode tab 1030 is positioned in the first direction (1) of the first conductor layer 521 exposed through the second region 1033 where a portion of the first anode coating layer 531 is not formed. can be placed in The third anode tab 1030 may be connected to a portion of the first conductor layer 521 exposed through the second region 1033 in which a portion of the first anode coating layer 531 is not formed.
  • a portion of the second anode coating layer 532 may not be formed in the first area 1032 (eg, in the third direction (3)).
  • the first area 1032 of the second anode coating layer 532 may be a portion where the second anode coating layer 532 is not formed.
  • the second anode coating layer 532 may not be disposed in the first area 1032 where a portion of the second anode coating layer 532 is not formed.
  • a portion of the second conductor layer 522 may be exposed through the first region 1032 where a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 1020 may be disposed in the first area 1032 where a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 1020 is disposed in the second direction (2) of the second conductor layer 522 exposed through the first region 1032 in which a portion of the second anode coating layer 532 is not formed.
  • the second anode tab 1020 may be connected to a portion of the second conductor layer 522 exposed through the first region 1032 in which a portion of the second anode coating layer 532 is not formed.
  • a portion of the second conductor layer 522 may not be formed in one area 1022 in the fourth direction (4).
  • One region 1022 of the second conductor layer 522 may be a portion in which the second conductor layer 522 is not formed.
  • the second conductor layer 522 may not be disposed in the area 1022 where a portion of the second conductor layer 522 is not formed (e.g., the end portion in the fourth direction 4).
  • a portion of the second anode coating layer 532 may not be formed in the second area 1036 (eg, the fourth direction).
  • the second area 1036 of the second anode coating layer 532 may be a portion where the second anode coating layer 532 is not formed.
  • the second anode coating layer 532 may not be disposed in the second area 1036 where a portion of the second anode coating layer 532 is not formed.
  • a portion of the second conductor layer 522 may be exposed through the second region 1036 where a portion of the second anode coating layer 532 is not formed.
  • the fourth anode tab 1040 may be disposed in the second area 1036 (eg, the fourth direction) where a portion of the second anode coating layer 532 is not formed.
  • the fourth anode tab 1040 may be disposed in the second direction of the second conductor layer 522 exposed through the second region 1036 where a portion of the second anode coating layer 532 is not formed. You can.
  • the fourth anode tab 1040 may be connected to a portion of the second conductor layer 522 exposed through the second region 1036 in which a portion of the second anode coating layer 532 is not formed.
  • a region 1022 in which a portion of the second conductor layer 522 is not formed (e.g., the fourth direction (4)) and a second region in which a portion of the second anode coating layer 532 is not formed
  • a portion 1014 (e.g., fourth direction (4)) of the resistance layer 510 may be exposed to the outside through (1036) (e.g., fourth direction (4)).
  • a portion 1014 of the resistance layer 510 may form an exposed surface where the resistance layer 510 is exposed to the outside.
  • the electrode assembly 405 of the battery 350 includes a positive electrode plate 411, a first separator 413, a negative electrode plate 415, a second separator 417, and a first positive electrode tab 1010. ), a second anode tab 1020, a third anode tab 1030, a fourth anode tab 1040, a first cathode tab 425, and/or a second cathode tab 1125.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 are stacked and separated from the center 400. It can be wound at least once.
  • the positive electrode plate 411, the first separator 413, the negative electrode plate 415, and the second separator 417 included in the electrode assembly 405 may be overlapped and wound at least once.
  • the first separator 413 may be disposed inside the positive electrode plate 411 so that it is closer to the center 400 than the positive electrode plate 411.
  • the cathode plate 415 may be disposed inside the first separator 413 so that it is closer to the center 400 than the first separator 413 .
  • the second separator 417 may be disposed inside the cathode plate 415 so that it is closer to the center 400 than the cathode plate 415.
  • the anode plate 411 and the cathode plate 415 may be insulated through the first separator 413.
  • the first positive electrode tab 1010, the second positive electrode tab 1020, and the first negative electrode tab 425 are located at the center 400 of the electrode assembly 405 (e.g., a jelly roll-shaped core). It can be placed spaced apart.
  • the third anode tab 1030, the fourth anode tab 1040, and the second cathode tab 1125 are anode plates disposed on the outermost side of the electrode assembly 405, not in the center 400 of the electrode assembly 405. It may be arranged to be spaced apart in a position adjacent to the inside of a portion of (411).
  • the first anode tab 1010 is connected to a portion of the first conductor layer 521 exposed in the first direction (1) and the third direction (3), and the third anode tab (1030) ) may be connected to a portion of the first conductor layer 521 exposed in the first direction (1) and the fourth direction (4).
  • the second anode tab 1020 is connected to a portion of the second conductor layer 522 exposed in the second direction (2) and the third direction (3), and the fourth anode tab 1040 is connected to the portion of the second conductor layer 522 exposed in the second direction (3). It may be connected to a portion of the second conductor layer 522 exposed in 2) and the fourth direction 4.
  • the first cathode tab 425 and the second cathode tab 1125 may be connected to the cathode plate 415 .
  • power may be supplied to, for example, the power management module 188 disclosed in FIGS. 1A and 1B.
  • the negative electrode plate 415 may be coated with a negative electrode active material for negative electrode activity on at least one surface.
  • the cathode plate 415 may include a plate or layer (eg, copper foil) containing a metal such as copper.
  • the first separator 413 may be disposed between the anode plate 411 and the cathode plate 415.
  • the first separator 413 can prevent the positive electrode plate 411 and the negative electrode plate 415 from contacting each other.
  • the first separator 413 may insulate the positive electrode plate 411 and the negative electrode plate 415.
  • the first separator 413 can prevent the anode plate 411 and the cathode plate 415 from being shorted.
  • Electronic devices 101, 200, and 300 may include a battery 350.
  • the battery 350 is included in a pouch 401, a positive electrode plate 411 disposed on the outermost side, and a first separator 413 disposed inside the positive electrode plate 411.
  • It may include an electrode assembly 405 in which a cathode plate 415 disposed inside the first separator 413 and a second separator 417 disposed inside the cathode plate 415 are laminated and wound. there is.
  • the anode plate 411 includes a resistance layer 510, a first conductor layer 521 disposed in a first direction of the resistance layer 510, and a second direction of the resistance layer 520, a second conductive layer 522 including a partially unformed region 622, disposed in the first direction of the first conductive layer 521, and including a partially unformed first region 631 a first anode coating layer 531, a second anode coating layer 532 disposed in the second direction of the second conductor layer 522 and including a first region 632 in which a portion is not formed, and It may include a first anode tab 610 disposed on the first conductor layer 521 exposed through the first region 631 of the first anode coating layer 531.
  • the second anode coating layer 532 is formed in a position corresponding to the area 622 in which a part of the second conductor layer 522 is not formed, and a second region in which a part of the second anode coating layer 532 is not formed ( 634) may be included.
  • a portion 515 of the resistance layer 510 includes a region 622 in which a portion of the second conductor layer 522 is not formed and a second region in which a portion of the second anode coating layer 532 is not formed ( 634).
  • the anode plate 411 includes a second anode tab disposed on the second conductor layer 522 exposed through the first region 632 of the second anode coating layer 532. 620) may be further included.
  • the resistance layer 510 may be an adhesive sheet containing an adhesive component.
  • the resistance layer 510 may include at least one of polymer, ceramic, or metal.
  • the first anode coating layer 531 or the second anode coating layer 532 is lithium cobalt oxide (LCO), nickel cobalt manganese (NCM), nickel cobalt aluminum (NCA), or lithium iron phosphate, respectively.
  • LCO lithium cobalt oxide
  • NCM nickel cobalt manganese
  • NCA nickel cobalt aluminum
  • LFP lithium iron phosphate
  • an adhesive tape may be attached to a portion 515 of the resistance layer 510.
  • the negative plate 415 may be connected to the negative electrode tab 425.
  • Electronic devices 101, 200, and 300 may include a battery 350.
  • the battery 350 is included in a pouch 401, a positive electrode plate 411 disposed on the outermost side, and a first separator 413 disposed inside the positive electrode plate 411.
  • It may include an electrode assembly 405 in which a cathode plate 415 disposed inside the first separator 413 and a second separator 417 disposed inside the cathode plate 415 are laminated and wound. there is.
  • the anode plate 411 includes a resistance layer 510, a first conductor layer 521 disposed in a first direction of the resistance layer 510 and including a first region 821 in which a portion is not formed, A second conductive layer 522 is disposed in the second direction of the resistance layer 520 and includes a partially unformed region 822, and is disposed in the first direction of the first conductor layer 521.
  • a first anode coating layer 531 including a first region 831 that is partially unformed, and a region 836 that is partially unformed and is disposed in the second direction of the second conductor layer 522. It may include a second anode coating layer 532 including.
  • the first region 821 in which a portion of the first conductor layer 521 is not formed and the first region 831 in which a portion of the first anode coating layer 531 is not formed may be formed at corresponding positions. there is.
  • the first portion 812 of the resistance layer 510 is the first region 821 where a portion of the first conductor layer 521 is not formed and a portion of the first anode coating layer 531 is not formed. It may be configured to be exposed through the first area 831).
  • the first anode coating layer 531 may include a second region 832 that is partially unformed in a direction opposite to the first region 831. A portion of the first conductor layer 521 in a direction opposite to the first region 821 may be exposed through the second region 832 of the first anode coating layer 531. A first anode tab 810 may be disposed on a portion of the first conductor layer 521 where the second region 832 of the first anode coating layer 531 is exposed.
  • the resistive layer is formed through the region 822 where a portion of the second conductor layer 522 is not formed and the region 836 where a portion of the second anode coating layer 532 is not formed.
  • the second portion 814 of 510 may be exposed.
  • a portion of the second conductor layer 522 is exposed through a region 836 in which a portion of the second anode coating layer 532 is not formed, and the portion of the second anode coating layer 532 is exposed through an unformed area 836.
  • a second anode tab 820 may be disposed on a portion of the second conductor layer 522 exposed through the area 836.
  • the resistance layer 510 may be an adhesive sheet containing at least one of polymer, ceramic, or metal.
  • the first anode coating layer 531 or the second anode coating layer 532 is lithium cobalt oxide (LCO), nickel cobalt manganese (NCM), nickel cobalt aluminum (NCA), or lithium iron phosphate, respectively.
  • LCO lithium cobalt oxide
  • NCM nickel cobalt manganese
  • NCA nickel cobalt aluminum
  • LFP lithium iron phosphate

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Abstract

Un dispositif électronique selon divers modes de réalisation de la présente invention peut comprendre une batterie. La batterie peut comprendre : une poche ; et un ensemble électrode inclus dans la poche et formé par empilement et enroulement d'une plaque d'électrode positive disposée sur un côté le plus à l'extérieur, d'un premier séparateur disposé à l'intérieur de la plaque d'électrode positive, d'une plaque d'électrode négative disposée à l'intérieur du premier séparateur, et d'un second séparateur disposé à l'intérieur de la plaque d'électrode négative. La plaque d'électrode positive peut comprendre : une couche résistive ; une première couche conductrice disposée dans une première direction de la couche résistive ; une seconde couche conductrice disposée dans une seconde direction de la couche résistive, et comprenant une région dans laquelle une partie de la seconde couche conductrice est non formée ; une première couche de revêtement d'électrode positive disposée dans la première direction de la première couche conductrice, et comprenant une première région dans laquelle une partie de la première couche de revêtement d'électrode positive est non formée ; une seconde couche de revêtement d'électrode positive disposée dans la seconde direction de la seconde couche conductrice, et comprenant une première région dans laquelle une partie de la seconde couche de revêtement d'électrode positive est non formée ; et une première languette d'électrode positive disposée sur la première couche conductrice mise à nu à travers la première région de la première couche de revêtement d'électrode positive. La seconde couche de revêtement d'électrode positive comprend une seconde région, dans laquelle une partie de la seconde couche de revêtement d'électrode positive est non formée, à un emplacement correspondant à la région dans laquelle une partie de la seconde couche conductrice est non formée. Une partie de la couche résistive peut être configurée pour être mise à nu vers l'extérieur à travers la région où une partie de la seconde couche conductrice est non formée et une seconde région où une partie de la seconde couche de revêtement d'électrode positive est non formée. Divers autres modes de réalisation sont possibles.
PCT/KR2023/012705 2022-09-02 2023-08-28 Batterie et dispositif électronique la comprenant Ceased WO2024049132A1 (fr)

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KR20220111500 2022-09-02
KR10-2022-0111500 2022-09-02
KR1020220119725A KR20240032589A (ko) 2022-09-02 2022-09-22 배터리 및 상기 배터리를 포함하는 전자 장치
KR10-2022-0119725 2022-09-22

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JP2022002216A (ja) * 2020-12-14 2022-01-06 東莞新能安科技有限公司Dongguan Poweramp Technology Limited 電気化学装置及び電子装置

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US20150221919A1 (en) * 2011-11-10 2015-08-06 Tomoyoshi Ueki Battery
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KR20190138451A (ko) * 2018-06-05 2019-12-13 삼성전자주식회사 배터리 및 이를 포함하는 전자 장치
KR20200090471A (ko) * 2019-01-21 2020-07-29 삼성전자주식회사 전극 조립체의 분리막의 연장된 영역에 형성된 접착층을 포함하는 배터리 및 이를 포함하는 전자 장치
JP2022002216A (ja) * 2020-12-14 2022-01-06 東莞新能安科技有限公司Dongguan Poweramp Technology Limited 電気化学装置及び電子装置

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