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WO2023239378A1 - Dispositifs microfluidiques numériques à régulation de pression - Google Patents

Dispositifs microfluidiques numériques à régulation de pression Download PDF

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Publication number
WO2023239378A1
WO2023239378A1 PCT/US2022/033134 US2022033134W WO2023239378A1 WO 2023239378 A1 WO2023239378 A1 WO 2023239378A1 US 2022033134 W US2022033134 W US 2022033134W WO 2023239378 A1 WO2023239378 A1 WO 2023239378A1
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WO
WIPO (PCT)
Prior art keywords
fluid
pressure
carrier fluid
reaction
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2022/033134
Other languages
English (en)
Inventor
Michael W. Cumbie
Chien-Hua Chen
Viktor Shkolnikov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hewlett Packard Development Co LP
Original Assignee
Hewlett Packard Development Co LP
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co LP filed Critical Hewlett Packard Development Co LP
Priority to PCT/US2022/033134 priority Critical patent/WO2023239378A1/fr
Publication of WO2023239378A1 publication Critical patent/WO2023239378A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/50273—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the means or forces applied to move the fluids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502769—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements
    • B01L3/502784—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements specially adapted for droplet or plug flow, e.g. digital microfluidics
    • B01L3/502792—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by multiphase flow arrangements specially adapted for droplet or plug flow, e.g. digital microfluidics for moving individual droplets on a plate, e.g. by locally altering surface tension
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0861—Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0867—Multiple inlets and one sample wells, e.g. mixing, dilution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/14—Means for pressure control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
    • B01L2400/0427—Electrowetting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0475—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure
    • B01L2400/0487—Moving fluids with specific forces or mechanical means specific mechanical means and fluid pressure fluid pressure, pneumatics

Definitions

  • FIG. 2 illustrates another example DMF device, in accordance with examples of the present disclosure.
  • FIG. 6 illustrates an example method for generating fluid droplets of reaction fluids in a DMF device, in accordance with examples of the present disclosure.
  • the addressed electrode provides an electric field within the DMF device and/or onto the reaction fluid, and due to a charge of the reaction fluid, a fluid droplet of the reaction fluid is directed along a microfluidic path.
  • respective ones of the plurality of electrodes may be sequentially actuated to draw the fluid droplet of the reaction fluid along a respective microfluidic path.
  • the movement of the fluids within the DMF device may be used to move, mix, and/or split fluid droplets of reaction fluids into two respective smaller fluid droplets, among other uses, and to drive a chemical processing operation thereon.
  • Electrodes of the array may be disposed proximal to the reaction fluid well to move the reaction fluids along the reaction fluid well to the interconnected chamber. As the reaction fluids are moved into the interconnected chamber, individual fluid droplets of the reaction fluids may be separated from each other, with the carrier fluid being interposed between and/or generally surrounding the fluid droplets of the reaction fluids. Interior surfaces of the DMF device associated with fluid flow may be coated with a hydrophobic coating to assist with the fluid flow.
  • the selective actuation of electrodes may not result in a fluid droplet of the reaction fluid separating and flowing into the interconnected chamber due to back pressure of the carrier fluid within the reaction fluid wells.
  • the reaction fluid may need to overcome the back pressure of the carrier fluid to advance to the interconnected chamber.
  • the fluid droplets of reaction fluids may be generated with back pressure present by adding surfactants to the reaction fluids to assist with movement or by adjusting the design of the DMF device, such as the roll off angle of the hydrophobic coating on interior surfaces of the DMF device.
  • adding surfactants may impact the chemical processing or analysis performed and the design may be adjusted for each specific use, which may increase time and cost in manufacturing the DMF devices.
  • Examples of the disclosure are directed to a DMF device which includes a pressure regulator to adjust a pressure of the carrier fluid and thereby reduce the driving force for moving fluid droplets of reaction fluids from the reaction fluid wells into the interconnected chamber for chemical processing.
  • the adjusted pressure of the carrier fluid may be timed with selective actuation of electrodes associated with the reaction fluid wells to synchronize the adjusted pressure with the fluid droplet formation.
  • the pressure regulator may return the pressure of the carrier fluid back to the normal state, which may be associated with a higher pressure than the adjusted pressure.
  • a normal state of the DMF device or normal pressure includes a state of the DMF device associated with and/or including the pressure of the carrier fluid being non-adjusted or actuated by the pressure regulator.
  • the selective and timed adjustment of the pressure of the carrier fluid is sometimes herein referred to as “pressure pulsing.”
  • pressure pulsing By performing pressure pulsing, fluid droplets of the reaction fluids may be generated and moved into the interconnected chamber using lower driving force applied by the select electrodes as compared to keeping the pressure of the carrier fluid at normal state (e.g., first pressure). For example, the lower the back pressure of the carrier fluid, the lower a driving force applied in order to advance the fluid droplets of the reaction fluids.
  • the fluid droplets of the reaction fluids may be generated using the variable carrier fluid pressure without modifying the reaction fluid with surfactant additives, or adjusting other DMF features, such as adjusting the hydrophobic coating quality, or well or electrode design.
  • the DMF device further includes circuitry communicatively coupled to the two-dimensional array of electrodes and the pressure regulator to selectively actuate select electrodes of the two- dimensional array and the pressure regulator to cause movement of fluidic droplets of the plurality of reaction fluids into the interconnected chamber from the plurality of reaction fluid wells.
  • the circuitry is to actuate the pressure regulator such that the pressure regulator moves a component of the pressure regulator to adjust pressure of the carrier fluid within the plurality of reaction fluid wells between a first state of the DMF device at a first pressure and a second state of the DMF device at a second pressure below the first pressure.
  • the first state may include a normal state associated with a first pressure and the second state may be associated with the second pressure that is lower than the first pressure.
  • the circuitry is to selectively actuate the electrodes of the two-dimensional array of electrodes to form the fluid droplets of the plurality of reaction fluids as surrounded by the carrier fluid, and actuate the pressure regulator to adjust the pressure of the carrier fluid within the plurality of reaction fluid wells and to drive the movement of the fluid droplets of the plurality of reaction fluids into the interconnected chamber.
  • the circuitry is to actuate the pressure regulator to adjust the pressure of the carrier fluid between a first pressure and a second pressure, wherein the pressure regulator is a mechanical mechanism coupled to or disposed within the carrier fluid reservoir.
  • the pressure regulator is a mechanical mechanism coupled to or disposed within the carrier fluid reservoir.
  • An example method comprises selectively actuating respective electrodes of a two-dimensional array of electrodes of a DMF device to form fluid droplets of a plurality of reaction fluids disposed in a plurality of reaction fluid wells of the DMF device, wherein the fluid droplets of the plurality of reaction fluids are surrounded by a carrier fluid, and selectively actuating a pressure regulator coupled to a carrier fluid reservoir of the DMF device, thereby causing a pressure of the carrier fluid within the plurality of reaction fluid wells to adjust from a first pressure to a second pressure.
  • the method further includes, in response to the selective actuation of the respective electrodes and the pressure regulator, causing the fluid droplets of the plurality of reaction fluids to move into an interconnected chamber of the DMF device from the plurality of reaction fluid wells.
  • the method further includes synchronizing the selective actuating of the respective electrodes with the selective actuating of the pressure regulator, such that the pressure of the carrier fluid adjusts to the second pressure in response to or concurrently with the formation of the fluid droplets of the plurality of reaction fluids.
  • the method further includes causing the pressure of the carrier fluid to adjust back toward the first pressure in response to the fluid droplets of the plurality of reaction fluids moving into the interconnected chamber of the DMF device.
  • a chamber refers to or includes an enclosed and/or semienclosed region of the DMF device, which may be formed of an etched or micromachined portion (e.g., negative space forming a conduit in a substrate or substrates) and which may be used to perform chemical processing on fluids therein.
  • An interconnected chamber refers to or includes a chamber that is couplable to an array of electrodes to define a plurality of microfluidic paths which may kept discrete or may overlap via the selective actuation of the electrodes.
  • the fluid droplet of a reaction fluid may include a volume of about 1 microliter (pL) or less, such as a volume of between about 0.1 pL and about 1 pL, about 0.25 pL and about 1 pL, about 0.5 pL and about 1 pL, about 0.5 pL and about 0.75 pL, about 0.25 pL and about 0.75 pL, or about 0.1 pL and about 0.5 pL, among other ranges.
  • the fluid droplet may be larger, such as on a nanoliter (nL) scale or between about 0.1 nL and about 0.5 nL.
  • a channel refers to or includes a path through which a fluid or semi-fluid may pass, which may allow for transport of volumes of fluid on the order of pL, nanoliters, picoliters, or femtoliters.
  • a well such as a reaction fluid well, refers to or includes a column capable of storing a volume of fluid.
  • the well may store a volume of fluid that includes more than one droplet of fluid, such as at least two fluid droplets of a reaction fluid.
  • a well may store a volume of fluid in a range between about 1 pL and about several milliliters (mL) of fluid.
  • a reaction fluid refers to or includes fluid containing substances, molecules, mixtures, and/or other components used to drive a biochemical reaction.
  • a fluid droplet of a reaction fluid refers to or includes a discrete portion of fluid (e.g., a liquid), which may be surrounded by a carrier fluid.
  • a carrier fluid refers to or includes fluid that flows through portions of the DMF device and which carries solid and/or fluid particles, such as fluid droplets of the reaction fluids.
  • an immiscible fluid such as an aqueous solution, is surrounded by an oil phase.
  • Fluid droplets of reaction fluids may be formed from a fluid packet of the reaction fluid.
  • a fluid packet of the reaction fluid refers to or includes a volume of fluid that is larger than a fluid droplet of the reaction fluid.
  • FIGs. 1 A-1 E illustrate example DMF devices, in accordance with examples of the present disclosure.
  • an example DMF device 100 comprises a housing 102 including an interconnected chamber 104 and with a two-dimensional (2D) array of electrodes 106 couplable to the interconnected chamber 104.
  • the housing 102 may include substrates, with the interconnected chamber 104, among other components, formed by and/or between the substrates as etched or micromachined portions.
  • the etched or micromachined portions forming the interconnected chamber 104, and optionally additional chambers, wells, reservoirs, and/or channels may be a height in the range of about 10 micrometer (pm) to about 2 millimeter (mm).
  • the interconnected chamber 104 may be formed of a plurality of different materials which are in layers, as further described herein.
  • the interconnected chamber 104, and optionally other chambers, wells, reservoirs, and channels may be formed by etching or micromachining processes in a substrate to form the various etched or micromachined portions.
  • the chamber(s), wells, reservoirs and/or channels may be defined by surfaces fabricated in the substrate(s) of the DMF device 100.
  • the 2D array of electrodes 106 are coupled to the housing 102, as further described herein.
  • Proximal refers to or includes being disposed in line with a portion of the DMF device 100, such as being positioned along, above, below, and/or exposed to the portion of the DMF device 100.
  • electrodes of the 2D array of electrodes 106 are to actuate to selectively move a plurality of reaction fluids along respective microfluidic paths within the interconnected chamber 104.
  • Example electrodes include transparent electrodes, ring electrodes, linear electrodes, almost continuous electrodes, ground electrodes, and/or actuating electrodes, among others.
  • the electrodes of the 2D array of electrodes 106 may be the same size or different sizes.
  • the electrodes may be formed of a conductive material, such as metal, conductive polymers, indium tin oxide (ITO), transparent conductive oxides, carbon nanotube, among other material.
  • a ground electrode refers to or includes an electrode that provides or establishes a connection to ground.
  • An actuating electrode refers to or includes an electrode that is actuated (e.g., a voltage is applied thereto by coupled circuitry), and in response, generates an electric field based on a differential between the actuating electrode (e.g., the applied voltage) and ground.
  • ground may be provided by a ground electrode, and in other examples, ground is provided by fluid within the DMF device 100.
  • Use of a ground electrode may provide greater control of fluid flow and/or formation of a fluid droplet of the reaction fluids as compared to use of fluid within the interconnected chamber 104 as ground. Using fluid as ground may reduce manufacturing costs.
  • the DMF device 100 further includes a plurality of reaction fluid wells 108 fluidically coupled to the interconnected chamber 104 and to contain a plurality of reaction fluids.
  • the plurality of reaction fluid wells 108 may be disposed within the housing 102, such as between the substrates (e.g., between the top substrate 102-2 and the base substrate 102-1 illustrated by FIG. 1 B).
  • a user may insert the plurality of reaction fluids into the plurality of reaction fluid wells 108 via fluidic inlets, such as fluidic inlets 111 -1 , 111 -2, 111 -3, 111 -4, 111 -5, 111 -6, 111 -7, 111 -8 as illustrated by FIG. 1 C.
  • the DMF device 100 includes a carrier fluid reservoir 110 and a pressure regulator 112.
  • the carrier fluid reservoir 110 is fluidically coupled to the interconnected chamber 104 and the plurality of reaction fluid wells 108.
  • the carrier fluid reservoir 110 contains a carrier fluid used as a carrier to move fluid droplets of the reaction fluids through the DMF device 100.
  • the carrier fluid may be inserted to the carrier fluid reservoir 110, in some examples, via a fluidic inlet, such as one of fluidic inlets 111 -1 , 111 -2, 111 -3, 111 -4, 111 -5, 111 -6, 111 -7, 111 -8 illustrated by FIG. 1 C.
  • the pressure regulator 112 is coupled to the carrier fluid reservoir 110.
  • the pressure regulator 112 may be used to provide a variable carrier fluid pressure.
  • a pressure regulator refers to or includes circuitry and/or a physical structure that causes adjustment in pressure of the carrier fluid, such as when the carrier fluid is contain within the interconnected chamber 104, the plurality of reaction fluid wells 108, and the carrier fluid reservoir 110.
  • Example pressure regulators include a linear actuator, such as a lift or stage, a robotic arm, a gantry, and/or a pulley system that moves the carrier fluid reservoir 110 or a portion thereof in a vertical axis, a piston disposed in the carrier fluid reservoir 110, and a membrane and an electromagnetic coil or piezo-electric component disposed within the carrier fluid reservoir 110, among other regulators.
  • Example pressure regulators are further illustrated by FIGs. 4A-4C.
  • the carrier fluid reservoir 1 10 and the pressure regulator 112 are illustrated by FIG. 1 A as being disposed in the housing 102 of DMF device 100, examples are not so limited.
  • the carrier fluid reservoir 1 10 and the pressure regulator 112 are disposed outside the housing 102 and are coupled thereto.
  • the carrier fluid reservoir 1 10 may include a first portion disposed within the housing 102 and a second portion disposed outside the housing 102, such as illustrated by FIGs. 4A-4C.
  • the DMF device 100 illustrated by FIG. 1 A may include variations, some of which are illustrated by FIGs. 1 B-1 E.
  • Example variations include, but are not limited to, top and base substrates forming the interconnected chamber, electrodes disposed on the top and/or base substrates of the interconnected chamber, and electrodes disposed on an additional substrate couplable to the housing, among other variations.
  • Each DMF device of FIGs. 1 B-1 E includes an implementation of the DMF device 100 of FIG. 1 A, including at least some of the same features and components, as illustrated by the common numbering. The common features and components are not repeated for ease of reference.
  • FIGs. 1 B-1 E illustrate an example implementation of the DMF device 100 of FIG. 1 A.
  • FIG. 1 B is a cross-sectional view of the interconnected chamber 104 of the example implementation of the DMF device 100 (from line A of FIG. 1 C).
  • FIG. 1 C is a top view of the example implementation
  • FIG. 1 D is another cross-sectional view of the example implementation (from line B of FIG. 1 C).
  • the housing 102-1 , 102-2 of the DMF device 100 includes a base substrate 102-1 and a top substrate 102-2.
  • the top substrate 102-2 may form or include a lid of the DMF device 100.
  • the top substrate 102-2, or a portion thereof, may be transparent.
  • the top substrate 102-2 may be transparent, and, in other examples, both the top and base substrates 102-1 , 102-2 are transparent.
  • a transparent substrate(s) (and optionally electrodes) may allow for optical monitoring of fluid flow and/or chemical operations within the DMF device 100 by a user, which may be used to visually verify the DMF device 100 is functioning properly.
  • the interconnected chamber 104 includes a bottom surface 109 defined by the base substrate 102-1 and a top surface 107 defined by the top substrate 102-2.
  • a bottom surface of the interconnected chamber refers to or includes a floor or lower surface of the chamber with respect to gravity.
  • a top surface of the interconnected chamber refers to or includes a ceiling or overhead surface of the chamber with respect to gravity.
  • the carrier fluid 114 may be contained within the interconnected chamber 104, the plurality of reaction fluid wells (e.g., well 108-1 ), and the carrier fluid reservoir (e.g., carrier fluid reservoir 110 illustrated by FIG. 1 D).
  • the plurality of electrodes 106-1 , 106-2, 106-3, 106-4, 106-5 of the DMF device 100 may be arranged in a 2D array (herein generally referred to as “the 2D array of electrodes 106” for ease of reference) and are coupleable to the base substrate 102-1 .
  • the 2D array of electrodes 106 are disposed on or within the base substrate 102-1 .
  • the 2D array of the plurality of electrodes 106 may extend level with or extrude above the bottom surface 109 of the chamber 104 as defined by the base substrate 102-1 , such that the electrodes may be in contact with fluids 114, 115-1 , 115-2 contained in the interconnected chamber 104.
  • the 2D array of electrodes 106 may be disposed within the base substrate 102-1 and may not be exposed to fluids in the interconnected chamber 104, or may include a coating disposed on the 2D array of electrodes 106 and/or may be disposed in another substrate, such as substrate 121 illustrated by FIG. 1 E.
  • the electrodes of the 2D array of electrodes 106 include actuating electrodes 106-1 , 106-2, 106-3, 106-4 and a ground electrode 106-5.
  • the actuating electrodes 106-1 , 106-2, 106-3, 106-4 may be disposed on or within the base substrate 102-1 and the ground electrode 106-5 may be disposed on or within the top substrate 102-2.
  • Use of a ground electrode 106-5 with plurality of actuating electrodes 106-1 , 106-2, 106- 3, 106-4 may allow for greater control of fluid flow and/or formation of fluid droplets of the reaction fluids as compared to using fluid control without the ground electrode 106-5.
  • FIG. 1 B illustrates a side view of the DMF device 100, from the perspective of cross-sectional A as illustrated by FIG. 1 C.
  • the DMF device 200 may include a plurality of fluidic inlets 211 -1 , 211 -2, 211 -3, 211 -4, 211 -5.
  • the plurality of fluidic inlets 211 -1 , 211 -2, 211 -3, 211 -4, 211 -5 may fluidically couple to the plurality of reaction fluid wells 208-1 , 208-2, 208-3, 208-4 and the carrier fluid reservoir 210.
  • the reaction fluids and the carrier fluid may be input into the reaction fluid wells 208-1 , 208-2, 208-3, 208-4 and the carrier fluid reservoir 210 via the fluidic inlets 211 -1 , 211 -2, 211 -3, 211 -4, 211 -5, such as by pipetting or other sources, e.g., robotics, coupled blister packs, among others.
  • a carrier fluid 114 may be contained between the bottom surface 109 and the top surface 107 of the chamber 104 of the DMF device 100.
  • the carrier fluid 114 may be used to flow the plurality of reaction fluids, as fluid droplets, through the interconnected chamber 104.
  • the plurality of reaction fluids as illustrated by the respective reaction fluid 115-1 , 115-2, may include aqueous fluids and the carrier fluid 114 may include an oil fluid.
  • the carrier fluid 114 may include an oil.
  • the carrier fluid 114 may include a silicon oil or fluorinated oil, such as FC-40 or FC-3283.
  • Non-limiting examples of the carrier fluid 114 include FC-40, FC-43, FC-77, fluorophoroheptane (FC-84), FC- 3283, perfluoro-n-octane, perfluorodecalin, perfluorophenanthrene, perfluorohexyloctane, octofluoropropane, decafluorobutane, perfluoropentane, perfluorohexane, perfluorooctane, decafluoropentane, perfluoro(2-methyl-3- pentaone), perfluoro-15-crown-5-ether, bis-(perfluorobutyl) ethane, perfluorobutyl tetrahydrofuran, bi-perfluorohexyl ethane, perfluoro-n-hexane, perfluorooctyl bromide, perfluorotributylamine, perfluorotripent
  • the reaction fluids may include a variety of types of fluids used to drive biochemical processes.
  • Example reaction fluids include a sample fluid, buffer fluids, and other reagents in fluids.
  • Buffer fluids refer to or include fluids which assist in maintaining a pH within the fluids, such as mitigating or resting pH changes and/or maintaining the pH within a range.
  • Example buffer fluids include a solution with a weak base or acid, such as a solution containing citrate, acetate, or phosphate salts.
  • the sample fluid may include an aqueous solution or fluid containing a sample, in solid or fluid form, and/or reagents.
  • a sample fluid, as used herein, refers to or includes any material, collected from a subject, such as biologic material and carried in a fluid. Examples are not so limited and may include a variety of fluids which contain reagents.
  • the DMF device 100 may further include or be coupled to circuitry 103.
  • the circuitry 103 may be communicatively coupled to the 2D array of electrodes 106 and the pressure regulator 112 to selectively actuate electrodes of the 2D array of electrodes 106 and the pressure regulator 112 to cause movement of fluidic droplets of the plurality of reaction fluids into the interconnected chamber 104 from the plurality of reaction fluid wells.
  • the circuitry 103 may be supported by the housing 102-1 , 102- 2.
  • the circuitry 103 may be supported by another device and is couplable to the DMF device 100.
  • the circuitry 103 may be external to the housing 102-1 , 102-2 and/or the DMF device 100.
  • Example circuitry includes a processor and memory, as further described below.
  • the circuitry 103 includes an anisotropic conductive layer (e.g., an anisotropically decoupling layer 103-1 and the 2D array of electrodes 106 illustrated by FIG. 1 E) of the DMF device 100 which may conduct electricity in one direction and is coupled to the 2D array of electrodes 106 and is couplable to external circuitry, such as an external processor and/or memory.
  • Using a conductive layer on the DMF device 100 may reduce costs of the DMF device 100, which may be disposable.
  • Use of processor and/or memory may allow for greater control of fluid flow as compared to use of external processor and/or memory.
  • FIG. 1 D illustrates another side view of the DMF device 100, from the perspective of cross-sectional B as illustrated by FIG. 1 C, and which shows the carrier fluid reservoir 110.
  • the DMF device 100 includes the top substrate 102-2 coupled to the base substrate 102-1 .
  • the top substrate 102-2 has gaps for fluid manipulation which form the interconnected chamber (e.g., 104 illustrated by FIG. 1 B), the reaction fluid wells (e.g., 108-1 illustrated by FIG. 1 B), and the carrier fluid reservoir 110 which is coupled to the pressure regulator 112.
  • the carrier fluid may be inserted into a fluidic inlet 111 -8 that is coupled to the carrier fluid reservoir 110 for fluidic processing.
  • the circuitry 103 may be communicatively coupled to the 2D array of electrodes 106 to selectively actuate electrodes of the 2D array of electrodes 106 and the pressure regulator 112, and in response, to cause application of electrowetting forces on the plurality of reaction fluids to form fluid droplets of the plurality of reaction fluids and to drive the selective fluid flow of the fluid droplets of the reaction fluids within the interconnected chamber 104.
  • fluid droplets of the plurality of reaction fluids may be formed by drawing fluid from the reaction fluid wells into the interconnected chamber 104.
  • the actuation of the pressure regulator 112 may cause a pressure of the carrier fluid 114 within or on the reaction fluid wells to adjust from a first pressure to a second pressure that is below the first pressure.
  • the pressure adjustment may be synchronized with the actuation of select electrodes to reduce a driving force to generate and drive movement of the fluid droplets of the reaction fluids into the interconnected chamber 104 as compared to a driving force used when the carrier fluid 114 is the first (higher) pressure.
  • the carrier fluid 114 may apply back pressure on the reaction fluid wells, which may be overcome by the driving force of the electrodes to drive the fluid droplets of the reaction fluids into the interconnected chamber 104.
  • the second pressure may be associated with a second state of the DMF device 100 in which the DMF device 100 is operating at an adjusted pressure due to the actuation of the pressure regulator 112.
  • the back pressure of the carrier fluid 114 is removed or reduced as compared to the first state, such that the driving force of the electrodes to drive the fluid droplets of the reaction fluids into the interconnected chamber 104 may be reduced as compared to the first state.
  • Respective electrodes 106-1 , 106-2, 106-5 of the 2D array of electrodes 106 may be located in the reaction fluid well 108-1 and used to form the fluid droplet 115-2 of the respective reaction fluid 115-1 ,115-2 from the fluid packet 115-1.
  • the reaction fluids may be inserted to the reaction fluid wells via a pipette or other object containing a volume of the reaction fluid and via the plurality of fluidic inlets.
  • the reaction fluid 115-1 , 115-2 is inserted into the fluidic inlet 111 -1 and, in response, the fluid packet 115-1 of the reaction fluid 115-1 , 115-2 forms in the reaction fluid well 108-1 .
  • the fluid droplet 115-2 of the reaction fluid 115-1 , 115-2 is broken off from the fluid packet 115-1 of the reaction fluid 115-1 , 115-2.
  • the pressure of the carrier fluid 114 is adjusted (e.g., reduced) via actuation of the pressure regulator 112 to reduce the amount of electrowetting forces used to split the fluid packet 115-1 , as described above.
  • the following provides a specific example of forming fluid droplets from the respective reaction fluid 115-1 , 115-2 illustrated by FIG. 1 B.
  • the reaction fluid 115-1 , 115-2, as a fluid packet 115-1 may be pulled into a shape that contains a neck 117 via electrowetting forces, and then pulled further by the electrowetting forces and as synchronized with the adjustment of the pressure of the carrier fluid 114, with the neck 117 breaking off to form a fluid droplet 115- 2 of the reaction fluid 115-1 , 115-2.
  • the pressure of the carrier fluid 114 is reduced from a first pressure to a second pressure.
  • the DMF device 100 may include a pressure sensor 118 disposed with the carrier fluid reservoir 110.
  • the pressure sensor 118 may be used to monitor the pressure of the carrier fluid and adjust the pressure.
  • the feedback from the pressure sensor 118 may include a sensor signal used to control or adjust the pressure of the carrier fluid.
  • the sensor signal may indicate a position of the pressure regulator 112 and is used to adjust the position of the pressure regulator 112 to mitigate or reduce errors in the actuation of pressure control.
  • the sensor signal may indicate a position of the linear actuator and an amount of (e.g., additional) movement to position the carrier fluid reservoir 110 to achieve the second pressure.
  • the 2D array of electrodes 106 may not be disposed on the base substrate 102-1 of the DMF device 100.
  • FIG. 1 E illustrates an example implementation of any of the DMF devices 100 of FIGs. 1 A-D. More particularly, FIG. 1 E is a partial view of the interconnected chamber 104 of the DMF device 100 and does not illustrate all components of the DMF device 100.
  • the electrodes 106-1 , 106-2, 106-3 of the 2D array of electrodes 106 are disposed on or within another substrate 121 which is couplable to the base substrate 102-1 .
  • the other substrate 121 may form part of another device 127 which includes the circuitry 103-2.
  • the other device 127 may include a driving instrument that the DMF device 100 is inserted into and which couples the 2D array of electrodes 106 and the circuitry 103-2 to the DMF device 100 via circuitry 103-1 of the DMF device 100.
  • the DMF device 100 may be a consumable device which may be used once and then discarded. Having the 2D array of electrodes 106 and (external) circuitry 103-2 separate from and couplable to the DMF device 100 may reduce manufacturing costs. As shown by FIG.
  • the circuitry 103-1 of the DMF device 100 includes an anisotropically decoupling layer which couples the 2D array of electrodes 106 and external circuitry 103-2 (e.g., a processor and/or memory) to the DMF device 100 to move fluid droplets of the reaction fluids along microfluidic paths of the DMF device 100.
  • external circuitry 103-2 e.g., a processor and/or memory
  • FIG. 2 illustrates another example DMF device, in accordance with examples of the present disclosure.
  • the DMF device 200 of FIG. 2 may comprise at least some of substantially the same features and components as DMF device 100 as illustrated by any of FIGs. 1 A-1 E, as shown by the similar numbering.
  • the DMF device 200 includes a housing 202, an interconnected chamber 204, a plurality of fluidic inlet 21 1 -1 , 21 1 -2, 21 1 -3, 211 - 4, 21 1 -5 (herein generally referred to as the “fluidic inlets 21 1 ” for ease of reference), a plurality of reaction fluid wells 208-1 , 208-2, 208-3, 208-4 (herein generally referred to as “the reaction fluid wells”), a carrier fluid reservoir 210, and a pressure regulator 212.
  • the housing 202 of the DMF device 200 may include a lid and the fluidic inlets 21 1 are disposed in and through the lid. The common features and components are not repeated for ease of reference.
  • the DMF device 200 includes reaction fluid wells 208 and a carrier fluid reservoir 210 which fluidically couple to the fluidic inlets 21 1 and to the interconnected chamber 204.
  • the reaction fluid wells 208 contain or store the plurality of reaction fluids 220-1 , 220-2, 220-3, 220-4 (herein generally referred to as “the reaction fluids”).
  • the carrier fluid reservoir 210 contains or stores the carrier fluid 214.
  • Each of the fluidic inlets 21 1 may fluidically couple to a different reaction fluid well 208 or to the carrier fluid reservoir 210, with each of the reaction fluid wells 208 and the carrier fluid reservoir 210 being fluidically coupled to the interconnected chamber 204.
  • Respective fluids are inserted into the reaction fluid wells 208 and carrier fluid reservoir 210 via the fluidic inlets 21 1 , for example, via pipette or other sources.
  • a plurality of electrodes may be arranged in a 2D array, which may be used to provide localized resolution of the electric field to provide fluid droplet formation, thermal zones, and/or selective control of fluid flow of fluid droplets of the reaction fluids.
  • the 2D array of electrodes 206 are arranged in an array that includes rows and columns of electrodes forming a rectangular shape.
  • examples are not so limited and other shaped arrays may be formed that include electrodes in two dimensions.
  • the 2D array of electrodes 206 may have a variety of different arrangements and sizes and may include more or less electrodes than illustrated.
  • FIG. 3 illustrates an example apparatus including a DMF device and coupled circuitry, in accordance with examples of the present disclosure.
  • the apparatus 330 comprises a DMF device 200, a 2D array of electrodes 206, and circuitry 203.
  • the DMF device 200 may include the DMF device illustrated by FIG. 2, and may comprise an example implementation of, or comprise at least some of substantially the same features and components as any one of the examples DMF devices 100, 200 as described in association with any of FIGs. 1 A-2.
  • the DMF device 200 includes a housing 202 that defines an interconnected chamber 204, reaction fluid wells 208 fluidically coupled to the interconnected chamber 204 and to contain reaction fluids 220, a carrier fluid reservoir 210 fluidically coupled to the interconnected chamber 204 and the reaction fluid wells 208, the carrier fluid reservoir 210 to contain a carrier fluid 214, and a pressure regulator 212 coupled to the carrier fluid reservoir 210 to adjust a pressure of the carrier fluid 214 within the reaction fluid wells 208.
  • the details of the common features and components are not repeated for ease of reference.
  • the apparatus 330 further includes a 2D array of electrodes 206.
  • the 2D array of electrodes 206 are coupled to and disposed along the interconnected chamber 204.
  • the 2D array of electrodes 206 are disposed within or on a substrate of the housing 202.
  • the 2D array of electrodes 206 may form part of another device, such as a driving instrument containing the 2D array of electrodes 206 and circuitry 203, that the DMF device 200 is inserted into.
  • the apparatus 330 further includes circuitry 203.
  • the circuitry 203 may be coupled to or forms part of the DMF device 200, and may track and/or control operation of the plurality of electrodes 206 and the pressure regulator 112.
  • the circuitry 203 forms part of a driving instrument.
  • the operations may comprise activation or actuation, deactivation, and other settings, e.g., setting to ground or floating and timings associated with the same.
  • the circuitry 203 may coordinate operations of the DMF device 200 including the flow of fluid and/or electrowetting-caused manipulation of fluid droplets of the reaction fluids 220 within the DMF device 200, such as moving, merging, and/or splitting, respectively.
  • Such manipulation may include causing fluid droplets of the reaction fluids 220 to into and move along the interconnected chamber 204 within the DMF device 200.
  • the various examples operations of the circuitry 203 may be operated interdependently and/or in coordination with each other, in at least some examples.
  • the circuitry 203 may be communicatively coupled to the 2D array of electrodes 206 and the pressure regulator 212 to selectively actuate electrodes of the 2D array of electrodes 206 and the pressure regulator 212 to adjust a pressure of the carrier fluid 214 within the reaction fluid wells 208 and to drive movement of fluid droplets of the plurality of reaction fluids 220 into the interconnected chamber 204 from the reaction fluid wells 208.
  • the interconnected chamber 204 and the reaction fluid wells 208 may contain the carrier fluid 214, and the circuitry 203 is to selectively actuate electrodes of the 2D array of electrodes 206 as synchronized with the actuation of the pressure regulator 212 to form the fluid droplets of the reaction fluids 220 as surrounded by the carrier fluid 214.
  • the circuitry 203 may actuate the pressure regulator 212 to adjust the pressure of the carrier fluid 214 within the reaction fluid wells 208 and to drive the movement of the fluid droplets of the reaction fluids 220 into the interconnected chamber 204.
  • the driving instrument 337 may include movable or switchable magnets, thermal zones (e.g., heated or cooled zones), and/or optical sensing components, such as micro imaging optics and/or fluorimetery optics, such as a fluorescence detector.
  • Example DMF devices and/or apparatuses may include variations from that illustrated by FIGs. 1A-3. As noted above, such variations may include, but are not limited to, the number of fluidic inlets and/or fluidic inlets, the number of electrodes, and/or arrangement of electrodes, among others.
  • FIGs. 4A-4C illustrate different example pressure regulators of a DMF device, in accordance with examples of the present disclosure.
  • Any of the example pressure regulators 412-A, 412-B, 412-C of FIGs. 4A-4C may be implemented in any of the DMF devices 100, 200 or apparatus 330 illustrated by FIGs. 1 A-3. More particularly, FIGs. 4A-4C illustrate parts of example DMF devices which include the pressure regulators 412-A, 412-B, 412-C.
  • the DMF device 400 illustrated by any of FIGs. 4A-4C may comprise an example implementation of, or comprise at least some of substantially the same features and components as any one of the examples DMF device described in association with any of FIGs. 1 A-3, as shown by the common numbering.
  • the carrier fluid reservoir or a portion thereof may be disposed outside the housing 402-1 , 402-2 of the DMF device 400 and fluidically coupled to a fluidic inlet 411 -8 and to the interconnected chamber (not illustrated by FIGs. 4A-4C).
  • the carrier fluid reservoir may include a first carrier fluid reservoir portion 410-1 that is disposed outside the housing 402-1 , 402-1 and a second carrier fluid reservoir portion 410-2 that is disposed within the housing 402-1 , 402-2.
  • the first carrier fluid reservoir portion 410-1 may be coupled to the second carrier fluid reservoir portion 410-2 via channel 434, such as tubing.
  • the first carrier fluid reservoir portion 410-1 may include a container and the second carrier fluid reservoir portion 410-2 may include a well or reservoir located in the housing 402-1 , 402-2.
  • FIG. 4A shows an example pressure regulator 412-A which includes a linear actuator 433.
  • the linear actuator 433 may change an elevation of the carrier fluid reservoir, e.g., the first carrier fluid reservoir portion 410-1 , to adjust a back pressure of the carrier fluid 414.
  • Example linear actuators include a lift or stage, a robotic arm, a gantry, and/or a pulley system, among other actuators, that move the carrier fluid reservoir, e.g., the first carrier fluid reservoir portion 410-1 , in a vertical axis or direction.
  • the linear actuator 433 includes a motor driven screw coupled to a stage or lift that holds the first carrier fluid reservoir portion 410-1 .
  • FIG. 4A shows the DMF device 400 in a first state in which the pressure of the carrier fluid 414 is at a first pressure.
  • the first pressure may include a non-adjusted or normal pressure, and which may result in back pressure applied to the reaction fluid wells by the carrier fluid 414.
  • FIG. 4A shows the DMF device 400 in a second state in which the pressure of the carrier fluid 414 is at a second pressure.
  • the second pressure may include a lower pressure than the first pressure.
  • the second pressure of the carrier fluid 414 may be generated by actuating the pressure regulator 412- A, which in response moves from a first position P1 associated with the first state of the DMF device 400, as illustrated at 430, to a second position P2 associated with the second state of the DMF device 400, as illustrated at 432.
  • the first position P1 may include the carrier fluid reservoir, e.g., the first carrier fluid reservoir portion 410-1 , being at a first elevation as illustrated by H1 .
  • the second position P2 may include the carrier fluid reservoir, e.g., the first carrier fluid reservoir portion 410-1 , being at a second elevation illustrated by H2, which is lower than H1 .
  • FIG. 4B shows the DMF device 400 in a first state in which the pressure of the carrier fluid 414 is at a first pressure.
  • the first pressure may include a non-adjusted or normal pressure, and which may result in back pressure applied to the reaction fluid wells by the carrier fluid 414.
  • FIG. 4B shows the DMF device 400 in a second state in which the pressure of the carrier fluid 414 is at a second pressure.
  • the second pressure may include a lower pressure than the first pressure.
  • the membrane 444 may change positions to adjust a back pressure of the carrier fluid 414.
  • the electromagnetic coil or piezo-electric component 442 may be coupled to the membrane 444 to move the membrane 444 between a first position P1 and a second position P2 within the carrier fluid reservoir, e.g., in the first carrier fluid reservoir portion 410-1 , and, in response, to adjust a back pressure of the carrier fluid 414.
  • the membrane 444 may be formed of a flexible material and may flex in response mechanical or electrical pushing or pulling forces provided by coil or the piezo-electric component 442.
  • FIGs. 4A-4C illustrate pressure regulator 412-A, 412-B, 412-C being disposed outside the housing 402-1 , 402-2 of the DMF device 400
  • the piston 437 of FIG. 4B may be disposed within the second carrier fluid reservoir portion 410-2, with the DMF device 400 not including the first carrier fluid reservoir portion 410-1 .
  • membrane 444 and coil or piezo-electric component 442 of the FIG. 4C may be disposed within the second carrier fluid reservoir portion 410-2, with the DMF device 400 not including the first carrier fluid reservoir portion 410-1 .
  • FIG. 5 illustrates an example operation of a DMF device, in accordance with examples of the present disclosure. More particularly, FIG.
  • FIG. 5 illustrates a close-up view of a reaction fluid well 508-1 of a DMF device and respective electrodes 551 of a 2D array of electrodes which are arranged proximal to the reaction fluid well 508-1 .
  • the DMF device is filled with the carrier fluid 514, such that the carrier fluid 514 fills the reaction fluid well 508-1 .
  • the reaction fluid is dispensed into the reaction fluid well 508-1 via the fluidic inlet 511 -1 , and the reaction fluid forms into a fluid packet 515-1 .
  • the first electrode 506-1 is actuated followed by actuation of the second electrode 506-2 and the third electrode 506-3 to draw the fluid packet 515-1 of the reaction fluid toward the interconnected chamber 504.
  • the pressure regulator is actuated to reduce the back pressure of the carrier fluid 514 as synchronized with actuation of the fourth electrode 506-4 followed by the fifth electrode 506-5, which results in the fluid packet 515-1 being pulled into a shape that contains a neck 517-1 via electrowetting forces.
  • the method 680 includes selectively actuating respective electrodes of a 2D array of electrodes of a DMF device to form fluid droplets of a plurality of reaction fluids disposed in a plurality of reaction fluid wells of the DMF device, wherein the fluid droplets of the plurality of reaction fluids are surrounded by a carrier fluid.
  • the method 680 includes selectively actuating a pressure regulator coupled to a carrier fluid reservoir of the DMF device, thereby causing a pressure of the carrier fluid within the plurality of reaction fluid wells to adjust from a first pressure to a second pressure.
  • the improvement of fluid droplet formation and advancement may be achieved without use of a surfactant to reduce surface tension, with reduced driving force, and with use of simplified well and electrode design, and/or reduced demand on hydrophobicity as compared to the steady pressure state.
  • the second pressure is lower than the first pressure, associated with the normal state of the DMF device, and may be a negative pressure in some examples.
  • a housing may formed of a plurality of different materials which are in layers, e.g., layers of substrates, in a stack.
  • the different material layers may include a top (transparent) substrate material layer and/or a base substrate material layer, with etched or micromachined portions between that form the reaction fluid wells, the carrier fluid reservoir and the interconnected chamber, among other components.
  • at least one of the substrate layers may have electrodes formed thereof.
  • the top (transparent) substrate material and/or the base substrate layer may have a low energy coating (e.g., a polytetrafluoroethylene (PTFE), such as TeflonTM, fluorosilane, a polyamide, such as Kapton® FN, fluoroalkylsilane, 1 H,1 H,2H,2H- Perfluorodecyltriethoxysilane, trichloro(1 H,1 H,2H,2H-perfluorooctyl)silane)) proximal to and/or in contact with the chambers, wells, reservoirs and/or channels of the DMF device and the electrodes, and/or a dielectric coating (e.g., a polyimide, such as Kapton®, Ethylene tetrafluoroethylene (ETFE), paralyne, alumina, silica, silicon nitride, aluminum nitride, aluminum oxide)
  • a low energy coating
  • the low energy coating is formed of PTFE.
  • the dielectric coating may be formed of a polyimide (e.g., Kapton®) for ease of deposition.
  • the dielectric coating may be formed of silicon nitride.
  • the planarization layer may be formed of the same material as the dielectric coating, such as a polyimide, and which may reduce the number of fabrication steps.
  • the stack may include a low energy coating formed of PTFE, a dielectric coating formed of a polyimide (e.g., Kapton®), and a planarization layer formed of the polyimide (e.g., Kapton®).
  • the control the flow of fluid within the wells and/or the interconnected chamber of any of the described DMF devices may be provided via ion emitters of the DMF device, instead of and/or by the electrodes.
  • a charge applicator may be brought into charging relation to a plate of the DMF device, whereby the charge applicator is to apply (e.g., deposit) charges onto the plate to cause an electric field which induces electrowetting movement of fluid within and through the DMF device.
  • any of the above described device and/or substrates may include an anisotropic decoupling layer (e.g., 103-1 of FIG. 1 E).
  • the anisotropic decoupling layer may decouple the working areas of the DMF device (e.g., the chamber) from electronics of the DMF device, such as the plurality of electrodes and/or the pressure regulator.
  • the anisotropic decoupling layer and the electrodes may be referred to as an anisotropic conductive layer, which facilitates migration of charges across the base substrate by providing lower resistivity across or through the base substrate and a higher lateral resistivity along the plane through which the base substrate extends.
  • the decoupling may allow for the working areas of the of the DMF device, which contain fluids, to be inexpensive and consumable.
  • the anisotropic decoupling layer may be formed of metal microparticles or nanoparticles aligned to form chains in one direction and encased in a polymer matrix (e.g., polymethylacrylate).
  • Circuitry such as the circuitry 103, 203 of FIGs. 1 B and 2, may include a processor and a memory. Circuitry may comprise a processor and associated memories, and optionally communication circuitry. Example circuitry includes a processor electrically coupled to, and in communication with, memory to generate control signals to direct operation of a DMF device, as well as the particular portions, components, operations, instructions, and/or methods, as described herein. Example control signals include instructions stored in memory to direct and manage microfluidic operations.
  • the circuitry may be referred to as being programmed to perform the above-identified actions, functions, etc.
  • the circuitry 103, 203 may include an anisotropic conductive layer, such as the above-described anisotropic decoupling layer and a plurality of electrodes which are used to provide a plurality of microfluidic paths, which couples to electrodes of an external device.
  • the circuitry In response to or based on commands received and/or via machine readable instructions, the circuitry generates control signals as described above.
  • the circuitry may be embodied in a general purpose computing device and/or incorporated into or associated with at least some of the example DMF devices, as well as the particular portions, components, electrodes, fluid actuators, operations, instructions, and/or methods, etc. as described herein.
  • Processor refers to or includes a presently developed or future developed processor that executes machine readable instructions contained in a memory or that includes circuitry to perform computations. Execution of the machine readable instructions, such as those provided via memory of the circuitry, may cause the processor to perform the above-identified actions, such as circuitry to implement operations via the various examples.
  • the machine readable instructions may be loaded in a random access memory (RAM) for execution by the processor from their stored location in a read only memory (ROM), a mass storage device, or some other persistent storage (e.g., non- transitory tangible medium or non-volatile tangible medium), as represented by memory.
  • the machine readable instructions may include a sequence of instructions, a processor-executable machine learning model, or the like.
  • memory comprises a computer readable tangible medium providing non-volatile storage of the machine readable instructions executable by a processor of circuitry.
  • the machine readable tangible medium may be referred to as, and/or comprise at least a portion of, a computer program product.
  • hard wired circuitry may be used in place of or in combination with machine readable instructions to implement the functions described.
  • circuitry may be embodied as part of at least one application-specific integrated circuit (ASIC), at least one field- programmable gate array (FPGA), and/or the like.
  • ASIC application-specific integrated circuit
  • FPGA field- programmable gate array
  • the circuitry not limited to any specific combination of hardware circuitry and machine readable instructions, nor limited to any particular source for the machine readable instructions executed by the circuitry.
  • the circuitry may be implemented within or by a stand-alone device, such as a microprocessor.
  • the circuitry may be partially implemented in interface devices and partially implemented in a computing resource separate from, and independent of, the example interface devices but in communication with the example interface devices.
  • the circuitry may be implemented via a server accessible via the cloud and/or other network pathways.
  • the circuitry may be distributed or apportioned among multiple devices or resources.

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Abstract

Un exemple d'un dispositif microfluidique numérique (DMF) comprend un boîtier comprenant une chambre interconnectée et un réseau bidimensionnel d'électrodes pouvant être couplées à la chambre interconnectée, une pluralité de puits de fluides de réaction couplés fluidiquement à la chambre interconnectée et pour contenir une pluralité de fluides de réaction, un réservoir de fluide porteur couplé fluidiquement à la chambre interconnectée et à la pluralité de puits de fluides de réaction, le réservoir de fluide porteur étant destiné à contenir un fluide porteur, et un régulateur de pression couplé au réservoir de fluide porteur.
PCT/US2022/033134 2022-06-10 2022-06-10 Dispositifs microfluidiques numériques à régulation de pression Ceased WO2023239378A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014165559A2 (fr) * 2013-04-02 2014-10-09 Raindance Technologies, Inc. Systèmes et procédés de manipulation de gouttelettes microfluidiques
US20200141886A1 (en) * 2017-05-22 2020-05-07 Arizona Board Of Regents On Behalf Of Arizona State University Metal electrode based 3d printed device for tuning microfluidic droplet generation frequency and synchronizing phase for serial femtosecond crystallography
WO2020176816A1 (fr) * 2019-02-28 2020-09-03 Miroculus Inc. Dispositifs micro-fluidiques numériques et leurs procédés d'utilisation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014165559A2 (fr) * 2013-04-02 2014-10-09 Raindance Technologies, Inc. Systèmes et procédés de manipulation de gouttelettes microfluidiques
US20200141886A1 (en) * 2017-05-22 2020-05-07 Arizona Board Of Regents On Behalf Of Arizona State University Metal electrode based 3d printed device for tuning microfluidic droplet generation frequency and synchronizing phase for serial femtosecond crystallography
WO2020176816A1 (fr) * 2019-02-28 2020-09-03 Miroculus Inc. Dispositifs micro-fluidiques numériques et leurs procédés d'utilisation

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