WO2023236698A1 - Heat dissipator and air conditioner outdoor unit - Google Patents

Abstract

The present invention belongs to the technical field of heat dissipation, and particularly provides a heat dissipator and an air conditioner outdoor unit. The heat dissipator of the present invention comprises a uniform-temperature heat conduction device and a heat dissipation component which are thermally connected together; a mounting structure is provided on the uniform-temperature heat conduction device, so that the heat dissipator is mounted on an object to be cooled by means of the mounting structure; a condenser channel, a liquid return channel, a liquid supplementing channel and at least one evaporation channel are defined in the uniform-temperature heat conduction device; the evaporation channel, the condenser channel, the liquid return channel and the liquid supplementing channel are sequentially and fluidly connected end to end; a flow area of the liquid supplementing channel is not greater than a flow area of the at least one evaporation channel, so that a phase change medium in the uniform-temperature heat conduction device forms a pressure difference when the uniform-temperature heat conduction device absorbs heat of the object, and thus the phase change medium circularly flows in the order of the evaporation channel, the condenser channel, the liquid return channel and the liquid supplementing channel.

Description

Radiator and air conditioner outdoor unit Technical field

The invention belongs to the technical field of heat dissipation, and specifically provides a radiator and an air conditioner outdoor unit.

Background technique

The variable frequency power module is an important component of the variable frequency air conditioner. Due to the multiple power chips integrated inside it, the heat flow density of the variable frequency power module is high and the heat generation is serious when the variable frequency power module is working. Moreover, the greater the cooling capacity of the air conditioner and the higher the weather temperature, the greater the heat generated by the variable frequency power module. In order to ensure that the variable frequency power module can work normally and safely, the compressor frequency must be reduced by about 50%, but this also leads to "the hotter the weather, the less effective the air conditioner is in cooling."

Multi-line inverter air conditioners (outdoor units) mostly adopt a top-exhaust structure. The electric control board (inverter power module) and radiator are arranged in the electric control box. The fins of the radiator extend out of the electric control box and are sucked by the axial flow fan at the top. Under the action of wind, it is cooled by airflow.

Current radiators are generally aluminum extruded radiators, but their thermal conductivity is limited by the properties of the material itself. For variable frequency power modules that are small in size and generate concentrated heat, the heat cannot be effectively and evenly dispersed on the base plate of the aluminum extruded radiator. On the other hand, the substrate cannot perform uniform temperature heat transfer, resulting in "hot spots" on the substrate, and the heat flow density is too high, making it impossible to dissipate heat efficiently. As a result, the aluminum extruded radiator has insufficient heat dissipation capacity for the variable frequency power module under high temperature conditions, which in turn results in a large frequency reduction of the air conditioner, making the variable frequency air conditioner less effective in cooling in high temperature weather environments.

Contents of the invention

One object of the present invention is to solve the problem of poor heat dissipation capacity of existing radiators due to poor thermal conductivity of their substrates.

Another object of the present invention is to solve the problem of poor cooling effect of existing variable frequency air conditioners in high temperature weather environments.

In order to achieve the above object, the present invention provides a radiator in a first aspect, including a uniform temperature heat conduction device and a heat dissipation member that are thermally connected together. The temperature uniformity heat conduction device is provided with a mounting structure so that the radiator Installed on the object to be heat dissipated through the installation structure, the uniform temperature heat conduction device defines a condensation channel, a liquid return channel, a liquid replenishment channel and at least one evaporation channel. The evaporation channel, the condensation channel, the liquid return channel The channel and the fluid replenishment channel are sequentially fluidly connected end to end; the flow area of the fluid replenishment channel is not greater than the flow area of the at least one evaporation channel, so that the uniform temperature heat conduction device absorbs the heat of the object to be dissipated. The phase change medium therein forms a pressure difference, and therefore causes the phase change medium to flow sequentially in a circular manner along the evaporation channel, the condensation channel, the liquid return channel and the liquid replenishment channel.

Optionally, the evaporation channel includes a first evaporation section close to the rehydration channel and a second evaporation section close to the condensation channel, and there is an included angle between the first evaporation section and the second evaporation section, So that the evaporation channel forms a V-shaped structure, so that the second evaporation section stores the liquid phase change medium.

Optionally, the flow area of the first evaporation section is smaller than the flow area of the second evaporation section to prevent the liquid phase change medium stored in the second evaporation section from flowing back to the rehydration channel.

Optionally, a heat source area mark is provided on the uniform temperature heat conduction device, and the heat source area mark covers a portion of the second evaporation section close to the first evaporation section.

Optionally, at least two evaporation channels are defined in the uniform temperature heat conduction device, and the at least two evaporation channels are distributed along the up and down direction of the uniform temperature heat conduction device; the liquid return channel is located in the at least two evaporation channels. Below the channel, when the radiator does not absorb heat, the liquid level of the liquid phase change medium in the rehydration channel is located below part of the evaporation channel.

Optionally, the condensation channel is inclined toward the evaporation channel in a direction close to the liquid return channel; and/or, the liquid return channel is inclined from one end of the liquid return channel close to the condensation channel to an end close to the liquid replenishment channel. One end slopes downward.

Optionally, the uniform temperature heat conduction device includes a base plate, a first side plate and a second side plate. The base plate is surrounded by the at least one evaporation channel, the condensation channel, the liquid return channel and the liquid return channel along its thickness direction. The replenishing channel runs through; the first side plate and the second side plate clamp the substrate in the middle, and therefore seal the at least one evaporation channel, the condensation channel, The liquid return channel and the liquid replenishment channel; one of the first side plate and the second side plate is thermally connected to the heat dissipation member, and one of the first side plate and the second side plate is The other one is in contact with the object to be heat dissipated.

Optionally, at least one of the base plate, the first side plate and the second side plate is provided with a filling port to provide water to the at least one evaporation channel and the condensation channel through the filling port. , the liquid return channel or the liquid replenishment channel is perfused with phase change medium.

Optionally, the mounting structure is a fixing hole penetrating the base plate, the first side plate and the second side plate; and/or the heat dissipation component includes a plurality of heat dissipation fins.

In a second aspect, the present invention provides an air-conditioning outdoor unit, including the radiator described in any one of the first aspects.

Based on the foregoing description, those skilled in the art can understand that in the foregoing technical solution of the present invention, a condensation channel, a liquid return channel, a liquid replenishment channel and at least one evaporation channel are defined in the uniform temperature heat transfer device, and the evaporation channel is The channel, the condensation channel, the liquid return channel and the liquid replenishment channel are fluidly connected from end to end in order, and the flow area of the liquid replenishment channel is not larger than the flow area of at least one evaporation channel, so that the uniform temperature heat conduction device absorbs the heat of the object to be dissipated. The phase change medium forms a pressure difference, and therefore causes the phase change medium to flow sequentially in a circular manner along the evaporation channel, condensation channel, liquid return channel and liquid replenishment channel. Therefore, the uniform temperature heat conduction device of the present invention can evenly transfer the heat absorbed by it to the entire uniform temperature heat conduction device with the help of the phase change medium circulating inside it, and then the radiator is connected to the heat sink through the heat dissipation component thermally connected to the uniform temperature heat conduction device. The absorbed heat is dissipated into the air, thereby improving the heat dissipation efficiency of the radiator.

Furthermore, by forming the evaporation channel into a V-shaped structure, the second evaporation section can store the liquid phase change medium.

Furthermore, when the radiator of the present invention is applied to an outdoor unit of an air conditioner, it can effectively overcome the problem of poor cooling effect of existing variable frequency air conditioners in high temperature weather environments. Moreover, the radiator of the present invention can be installed on the side of the heat source (such as the electric control box or the frequency conversion power module) in the outdoor unit of the air conditioner, thereby avoiding the lack of sufficient installation space above the heat source in the outdoor unit of the air conditioner, resulting in the installed radiator having a relatively high heat dissipation power. It is too small and cannot effectively dissipate the heat source in the outdoor unit of the air conditioner.

From the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will further understand the above and other objects, advantages and features of the present invention.

Description of the drawings

In order to explain the technical solutions of the present invention more clearly, some embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood by those skilled in the art that components or parts labeled with the same reference numerals in different drawings are the same or similar; the drawings of the present invention are not necessarily drawn to scale with each other. In the attached picture:

Figure 1 is an upper front isometric view of a radiator in some embodiments of the present invention;

Figure 2 is an upper rear isometric view of a radiator in some embodiments of the present invention;

Figure 3 is an exploded view of the structure of a uniform temperature heat conduction device in some embodiments of the present invention;

Figure 4 is a schematic plan view of a substrate in some embodiments of the present invention;

Figure 5 is a schematic diagram of the flow path of the phase change medium in some embodiments of the present invention;

Figure 6 is a schematic structural diagram of an air conditioner outdoor unit in other embodiments of the present invention.

Detailed ways

Those skilled in the art should understand that the embodiments described below are only some of the embodiments of the present invention, rather than all the embodiments of the present invention. These partial embodiments are intended to explain the technical principles of the present invention and are not intended to be used for To limit the scope of protection of the present invention. Based on the embodiments provided by the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts should still fall within the protection scope of the present invention.

It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "top", "bottom", "left", "right", "vertical", "horizontal", " Terms indicating directions or positional relationships, such as "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings. This is only for convenience of description and does not indicate or imply that the device or element must have a specific orientation. Specific orientations of construction and operation are therefore not to be construed as limitations of the invention. Furthermore, the terms “first”, “second” and “third” are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that in the description of the present invention, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a fixed connection. It is a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or an internal connection between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Finally, it should be noted that in the description of the present invention, the "phase change medium" is a gas-liquid two-phase phase change medium. That is, in the description of the present invention, the working state of the "phase change medium" does not exist in a solid state, but only in a gaseous state, a liquid state, and a gas-liquid mixed state.

As shown in FIGS. 1 and 2 , in some embodiments of the present invention, the heat sink 100 includes a temperature equalizing heat conduction device 110 and a heat dissipation member 120 that are thermally connected together. The heat sink 100 is fixed with the object to be heat-dissipated through the uniform-temperature heat-conducting device 110, so that the uniform-temperature heat-conducting device 110 receives the heat of the object to be heat-dissipated and transfers the heat to the heat-dissipating member 120, so that the heat-dissipating member 120 dissipates heat to the air. (air flowing upward as shown by the arrow in Figure 2).

The object to be heat dissipated can be any feasible component, such as an electrical control box, a circuit board, a chip, etc.

As shown in FIGS. 1 and 2 , in some embodiments of the present invention, the heat sink 100 includes a plurality of heat dissipation fins, and the heat dissipation fins may be any feasible fins. For example, a protruding structure that enhances heat transfer is provided on the heat dissipation fins, and the heat dissipation fins are configured as folded fins, shovel-tooth fins, corrugated fins, or window fins.

As shown in Figure 3, in some embodiments of the present invention, the uniform temperature heat conduction device 110 also includes at least one evaporation channel 1101, a condensation channel 1102, a liquid return channel 1103, a liquid replenishment channel 1104 and an optional filling port 1105. Among them, the evaporation channel 1101, the condensation channel 1102, the liquid return channel 1103 and the liquid replenishment channel 1104 are connected end to end in order, and the flow area of the liquid replenishment channel 1104 is not larger than the flow area of at least one evaporation channel 1101, so that the uniform temperature heat transfer device 110 When absorbing the heat of the object to be dissipated, the phase change medium in the object can form a pressure difference, and therefore the phase change medium circulates along the following path: evaporation channel 1101 → condensation channel 1102 → liquid return channel 1103 → liquid replenishment channel 1104 → evaporation Channel 1101.

Continuing to refer to FIG. 3 , the filling port 1105 is connected with the condensation channel 1102 so that the phase change medium poured from the filling port 1105 flows to the liquid return channel 1103 through the condensation channel 1102 .

In addition, in other embodiments of the present invention, those skilled in the art can also connect the filling port 1105 to at least one of the evaporation channel 1101, the liquid return channel 1103, and the liquid replenishment channel 1104 as needed.

As shown in Figures 1 to 3, in some embodiments of the present invention, the uniform temperature heat conduction device 110 also includes a base plate 111, a first side plate 112, a second side plate 113, a fixing hole 114 as a mounting structure, and a valve plug. 115.

As can be seen from FIG. 3 , the substrate 111 is penetrated by an evaporation channel 1101 , a condensation channel 1102 , a liquid return channel 1103 , a liquid replenishment channel 1104 and a filling port 1105 along its thickness direction. The first side plate 112 and the second side plate 113 sandwich the substrate 111 in the middle, and therefore close the evaporation channel 1101, the condensation channel 1102, the liquid return channel 1103, the liquid replenishment channel 1104 and the filling port 1105 in the thickness direction of the substrate 111.

The first side plate 112 and the second side plate 113 can be connected to the base plate 111 in any feasible manner, such as welding, riveting, screw connection, etc. Furthermore, the second side plate 113 is thermally connected to the heat dissipation member 120, such as welding, snapping, bonding, etc.

As shown in FIGS. 1 to 3 , in some embodiments of the present invention, the fixing hole 114 penetrates the base plate 111 , the first side plate 112 and the second side plate 113 to fix the uniform temperature heat conduction device 110 through the fixing hole 114 onto the object to be cooled. For example, screws or bolts are passed through the fixing holes 114 and tightened onto the object to be heat dissipated.

In addition, those skilled in the art can also form the fixing holes 114 on only one or both of the base plate 111 , the first side plate 112 and the second side plate 113 as needed. For example, the size of the base plate 111 in the extension direction is larger than the first side plate 112 and the second side plate 113 so that part of the structure at the edge of the base plate 111 is exposed outside the first side plate 112 and the second side plate 113 . Then fixing holes 114 are opened in this part of the structure.

In other embodiments of the present invention, those skilled in the art can also configure the fixing holes 114 as any other feasible installation structure, such as buckles, as needed.

As shown in Figures 1 to 4, in some embodiments of the present invention, the valve plug 115 is used to close the filling port 1105.

As can be seen from Figure 4, in some embodiments of the present invention, the evaporation channels 1101 are preferably multiple, such as three, four, five, etc.

As shown in Figure 4, in some embodiments of the present invention, the evaporation channel 1101 includes a first evaporation section 11011 close to the rehydration channel 1104 and a second evaporation section 11012 close to the condensation channel 1102. The first evaporation section 11011 and the second evaporation section 11012 There is an included angle between the sections 11012 so that the evaporation channel 1101 forms a V-shaped structure, so that the second evaporation section 11012 stores the liquid phase change medium. Preferably, the inclination angle of the first evaporation section 11011 is greater than the inclination angle of the second evaporation section 11012.

As can be seen from Figure 4, in some embodiments of the present invention, the flow area of the first evaporation section 11011 is smaller than the flow area of the second evaporation section 11012 to prevent the liquid phase change medium stored in the second evaporation section 11012 from Return to fluid replenishment channel 1104.

In some embodiments of the present invention, the flow area of the first evaporation section 11011 is equal to the flow area of the fluid replacement channel 1104 .

In an example of the present invention, the diameter of the flow surface of the first evaporation section 11011 and the flow diameter of the replenishing channel 1104 are both 4 mm, and the diameter of the flow surface of the second evaporation section 11012 is 6 mm.

In addition, in other embodiments of the present invention, those skilled in the art can also make the flow area of the first evaporation section 11011 larger than the flow area of the fluid replenishing channel 1104 as needed.

Although not explicitly shown in the figure, in some embodiments of the present invention, the condensation channel 1102 is inclined toward the evaporation channel 1101 in a direction close to the liquid return channel 1103 to prevent the liquid phase change medium at the top of the condensation channel 1102 from flowing to the condensation channel. The bottom of the channel 1102 corresponds to the evaporation channel 1101.

As shown in FIG. 4 , in some embodiments of the present invention, multiple evaporation channels 1101 are distributed along the up and down direction of the uniform temperature heat conduction device 110 . The liquid return channel 1103 is located below the plurality of evaporation channels 1101 . When the radiator 100 does not absorb heat, the liquid level of the liquid phase change medium in the rehydration channel 1104 is located below the partial evaporation channel 1101 to prevent the partial evaporation channel 1101 from having too much liquid phase change medium to cause phase change. The medium evaporates and loses its evaporation function. Preferably, the liquid level of the liquid phase change medium in the fluid replenishment channel 1104 is located in the liquid return channel 1103 .

Furthermore, the liquid return channel 1103 preferably slopes downward from its end close to the condensation channel 1102 to its end close to the liquid replenishment channel 1104, so that the liquid phase change medium in the liquid return channel 1103 can flow to the liquid replenishment channel under the action of its own gravity. 1104. Supplement the fluid replenishment channel 1104 with the required liquid phase change medium.

As shown in FIG. 5 , in some embodiments of the present invention, on the uniform temperature heat conduction device 110 , the portion of the second evaporation section 11012 close to the first evaporation section 11011 is the heat source area 116 . When the heat sink 100 is used, the heat source area 116 is aligned with the object to be heat dissipated, so that the heat source area 116 on the uniform temperature heat conduction device 110 is heated first and heats the phase change medium in its corresponding second evaporation section 11012.

The flow principle of the phase change medium in the uniform temperature heat transfer device 110 will be described in detail below with reference to FIG. 5 .

As shown in FIG. 5 , when the heat source area 116 is heated, the liquid phase change medium in the second evaporation section 11012 at this part is heated and becomes gaseous, thus causing the air pressure in the second evaporation section 11012 to increase. Since the liquid phase change medium exists in the part of the second evaporation section 11012 close to the first evaporation section 1101, and the flow area of the first evaporation section 11011 is smaller than the flow area of the second evaporation section 11012, the phase change medium moves along the second evaporation section 11012. The resistance of the segment 11012 moving to the condensation channel 1102 is less than the resistance of the phase change medium flowing along the first evaporation segment 11011 to the rehydration channel 1104, so that the gaseous phase change medium moves along the second evaporation segment 11012 toward the condensation channel 1102.

Most of the gaseous phase change medium moving in the second evaporation section 11012 moves to the condensation channel 1102, and is condensed into a liquid state in the condensation channel 1102. A small part of the gaseous phase change medium moving in the second evaporation section 11012 is condensed in the second evaporation section 11012 and flows back to the root of the second evaporation section 11012 .

The liquid phase change medium in the condensation channel 1102 flows to the part of the liquid return channel 1103 close to the replenishing channel 1104 under the action of pressure difference and gravity. Due to the presence of high-pressure gas in the second evaporation section 11012 and the condensation channel 1102, the liquid phase change medium in the rehydration channel 1104 moves upward under the action of the pressure, and enters the evaporation channel 1101 through the first evaporation section 11011.

Those skilled in the art can understand that the higher the temperature of the heat source area 116, the more the phase change medium in the second evaporation section 11012 is vaporized, and the higher the air pressure on the right side of the liquid return channel 1103 in Figure 5, thus allowing liquid replenishment. The greater the power obtained by the liquid phase change medium in the channel 1104, the higher the height of the spurt, so that each evaporation channel 1101 can receive the phase change medium from the rehydration channel 1104. Therefore, in some embodiments of the present invention, the temperature equalization performance of the temperature equalizing heat conduction device 110 increases as the temperature of the heat source area 116 increases.

In addition, in other embodiments of the present invention, in order to align the heat source area 116 with the object to be heat dissipated, those skilled in the art may also set a heat source area mark on the side of the uniform temperature heat conduction device 110 away from the heat dissipation component 120 as needed. And the heat source area mark covers the part of the second evaporation section 11012 close to the first evaporation section 1101. The heat source area identification can be any feasible pattern or text, such as a rectangle.

Based on the foregoing description, those skilled in the art can understand that the present invention defines a condensation channel 1102, a liquid return channel 1103, a liquid replenishing channel 1104 and at least one evaporation channel 1101 in the uniform temperature heat conduction device 110, and makes the evaporation channel 1101 , the condensation channel 1102, the liquid return channel 1103 and the liquid replenishment channel 1104 are fluidly connected in sequence, and the flow area of the liquid replenishment channel 1104 is not larger than the flow area of at least one evaporation channel 1101, so that the uniform temperature heat transfer device 110 absorbs the object to be heat dissipated The phase change medium in the heat exchanger forms a pressure difference, thereby causing the phase change medium to circulate sequentially along the evaporation channel 1101, the condensation channel 1102, the liquid return channel 1103, and the liquid replenishment channel 1104. Therefore, the uniform temperature heat conduction device 110 of the present invention can evenly transfer the heat absorbed by it to the entire uniform temperature heat conduction device 110 with the help of the phase change medium circulating inside it, and then through the heat dissipation component thermally connected to the uniform temperature heat conduction device 110 120 dissipates the heat absorbed by the radiator 100 into the air, thereby improving the heat dissipation efficiency of the radiator 100.

Based on the foregoing description, those skilled in the art can also understand that the main technical means for achieving the uniform temperature performance of the uniform temperature heat conduction device 110 of the present invention are the evaporation channel 1101, the condensation channel 1102, the liquid return channel 1103 and the liquid replenishment channel that are fluidly connected from end to end. Channel 1104. Therefore, when the uniform temperature heat conduction device 110 can define the evaporation channel 1101, the condensation channel 1102, the liquid return channel 1103 and the liquid replenishment channel 1104, those skilled in the art can also set the uniform temperature heat conduction device 110 as needed for other personnel. structures, such as inflatable panels.

Furthermore, the present invention also provides an air conditioning outdoor unit 200.

As shown in FIG. 6 , in other embodiments of the present invention, the air-conditioning outdoor unit 200 includes an electric control box 210 and the radiator 100 described in any of the previous embodiments. Among them, the electric control box 210 is installed with a variable frequency power module (not shown in the figure), and the radiator 100 is thermally connected to the variable frequency power module. For example, the radiator 100 is installed on the variable frequency power module through its temperature equalizing heat conduction device 110 and is in contact with the variable frequency power module, and at least a part of the heat dissipation member 120 is exposed outside the electric control box 210 . Alternatively, those skilled in the art can also install the radiator 100 on the electric control box 210 through its uniform temperature heat conduction device 110 and contact the electric control box 210 as needed.

Those skilled in the art can understand that the radiator 100 of the present invention can be installed on the air-conditioning outdoor unit 200 in a horizontal attitude in addition to the vertical attitude shown in FIGS. 1 and 2 . superior.

So far, the technical solutions of the present invention have been described in conjunction with the foregoing embodiments. However, those skilled in the art can easily understand that the protection scope of the present invention is not limited to these specific embodiments. Without departing from the technical principles of the present invention, those skilled in the art can split and combine the technical solutions in the above embodiments, and can also make equivalent changes or replacements to the relevant technical features. Any changes, equivalent substitutions, improvements, etc. made within the concept and/or technical principles will fall within the protection scope of the present invention.

Claims (10)

A radiator includes a uniform temperature heat conduction device and a heat dissipation component that are thermally connected together, The temperature uniformity heat conduction device is provided with a mounting structure so that the radiator can be mounted on the object to be heat dissipated through the mounting structure, The uniform temperature heat conduction device is defined with a condensation channel, a liquid return channel, a liquid replenishment channel and at least one evaporation channel, and the evaporation channel, the condensation channel, the liquid return channel and the liquid replenishment channel are fluidly connected in sequence; The flow area of the replenishing channel is not larger than the flow area of the at least one evaporation channel, so that the phase change medium in the uniform temperature heat conduction device forms a pressure difference when absorbing the heat of the object to be dissipated, and Therefore, the phase change medium is caused to flow sequentially in a circular manner along the evaporation channel, the condensation channel, the liquid return channel, and the liquid replenishment channel. The radiator according to claim 1, wherein The evaporation channel includes a first evaporation section close to the rehydration channel and a second evaporation section close to the condensation channel, and there is an included angle between the first evaporation section and the second evaporation section so that the The evaporation channel forms a V-shaped structure, so that the second evaporation section stores the liquid phase change medium. The radiator according to claim 2, wherein: The flow area of the first evaporation section is smaller than the flow area of the second evaporation section to prevent the liquid phase change medium stored in the second evaporation section from flowing back to the replenishing channel. The radiator according to claim 2 or 3, wherein, A heat source area mark is provided on the uniform temperature heat conduction device, and the heat source area mark covers a portion of the second evaporation section close to the first evaporation section. The radiator according to claim 2 or 3, wherein, At least two evaporation channels are defined in the uniform temperature heat conduction device, and at least two of the evaporation channels are distributed along the up and down direction of the uniform temperature heat conduction device; The liquid return channel is located below the at least two evaporation channels, When the radiator does not absorb heat, the liquid level of the liquid phase change medium in the rehydration channel is located below part of the evaporation channel. The radiator according to claim 5, wherein The condensation channel is inclined toward the evaporation channel in a direction close to the liquid return channel; and/or, The liquid return channel slopes downward from one end close to the condensation channel to an end close to the liquid replenishing channel. The radiator according to any one of claims 1 to 3 and 6, wherein, The uniform temperature heat conduction device includes a base plate, a first side plate and a second side plate. The base plate is penetrated along its thickness direction by the at least one evaporation channel, the condensation channel, the liquid return channel and the liquid replenishment channel. ; The first side plate and the second side plate sandwich the substrate in the middle, and therefore seal the at least one evaporation channel, the condensation channel, and the liquid return channel in the thickness direction of the substrate. and the rehydration channel; One of the first side plate and the second side plate is thermally connected to the heat dissipation member, and the other of the first side plate and the second side plate is in contact with the object to be heat dissipated. The radiator according to claim 7, wherein At least one of the base plate, the first side plate and the second side plate is provided with a filling port to provide water to the at least one evaporation channel, the condensation channel, and the return channel through the filling port. The fluid channel or the fluid replenishing channel is perfused with phase change medium. The radiator according to claim 7, wherein The mounting structure is a fixing hole penetrating the base plate, the first side plate and the second side plate; and/or, The heat dissipation member includes a plurality of heat dissipation fins. An air conditioner outdoor unit includes the radiator according to any one of claims 1 to 9.