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WO2023227720A1 - Substrat ayant des propriétés antireflet - Google Patents

Substrat ayant des propriétés antireflet Download PDF

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Publication number
WO2023227720A1
WO2023227720A1 PCT/EP2023/064063 EP2023064063W WO2023227720A1 WO 2023227720 A1 WO2023227720 A1 WO 2023227720A1 EP 2023064063 W EP2023064063 W EP 2023064063W WO 2023227720 A1 WO2023227720 A1 WO 2023227720A1
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WO
WIPO (PCT)
Prior art keywords
interference
substrate
pixel
laser
pixels
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2023/064063
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German (de)
English (en)
Inventor
Tim Kunze
Sabri Alamri
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fusion Bionic GmbH
Original Assignee
Fusion Bionic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fusion Bionic GmbH filed Critical Fusion Bionic GmbH
Publication of WO2023227720A1 publication Critical patent/WO2023227720A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/118—Anti-reflection coatings having sub-optical wavelength surface structures designed to provide an enhanced transmittance, e.g. moth-eye structures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B2207/00—Coding scheme for general features or characteristics of optical elements and systems of subclass G02B, but not including elements and systems which would be classified in G02B6/00 and subgroups
    • G02B2207/101—Nanooptics

Definitions

  • the present invention relates to the area of structuring substrates, in particular a structured substrate - examples here are flat substrates, in particular so-called anti-reflection glazing - with anti-glare properties, which comprises a periodic or non-periodic dot structure.
  • the present invention relates to a device and a method for structuring surfaces and the interior of a substrate, in particular a transparent substrate, using laser interference structuring.
  • surfaces of transparent substrates Due to their smooth surface and the differences in refractive indices compared to air, surfaces of transparent substrates, such as glass, reflect part of the incident light in a directed manner.
  • matting treatment anti-glare treatment
  • a relatively simple solution for creating a matted surface is to increase the surface roughness of such transparent substrates, as this can reduce the directional reflection of the incident light due to scattering.
  • the surface of glass is usually roughened by etching with hydrofluoric acid (HF) or leaching the surface in basic solutions. This causes the network of the glass to be superficially destroyed or at least modified. Handling with hydrofluoric acid or alkaline solutions not only has the disadvantage of causing damage to human skin, bones, eyes and respiratory tract, but also ecological problems. In addition, these processes are severely limited by low yields, difficult process operation controls and low production capacities. Last but not least, defective products cannot be reworked, which further increases production costs.
  • HF hydrofluoric acid
  • Surfaces can be sandblasted or shot blasted.
  • the roughening of the surface with sand or other particles has the disadvantage that residues of the material can remain on the substrate to be structured or even if post-treatment takes place, these material residues may not be completely removed.
  • a second operation to remove material residue is time-consuming and costly. Precautions must also be taken to collect the material abrasion and the blasting material used.
  • WO 2016/086079 A1 discloses a method for forming a glare-free coating on a substrate, wherein a heated substrate must be provided to which a film-forming composition made of a silane, a mineral acid and a solvent is applied and the substrate coated in this way must be thermally treated over a longer period of time.
  • a heated substrate must be provided to which a film-forming composition made of a silane, a mineral acid and a solvent is applied and the substrate coated in this way must be thermally treated over a longer period of time.
  • sol-gel processes have the disadvantage that they are time-consuming and are only limited to use for special materials, namely primarily temperature-resistant materials.
  • relatively thick layers must be applied to the substrate surface in order, on the one hand, to provide sufficient roughness for scattering in the pm range and, on the other hand, to provide sufficiently robust and crack-free coatings.
  • US 2006/0092495 A1 the application of a polymer coating with a silane to the surface of a transparent substrate.
  • the cured polymer coating has a surface roughness (Ra) of no more than 120 nm.
  • WO 2015/002042 discloses transparent substrates for use in a solar cell module, wherein the transparent substrate has an anti-glare coating with at least a first and a second layer, in which first layer transparent spherical inorganic particles with a particle size of 0.1 to 5.0 pm are arranged in an inorganic binder.
  • a method is known from EP 2 431 120 A in which material is applied to the surface.
  • the process creates periodic structures using laser interference, whereby a film is applied to a substrate, which evaporates in the maxima of the interference patterns due to the laser intensity.
  • the remaining material then forms a periodic structure.
  • the material of the film is a metal or a generally conductive material such as indium tin oxide (ITO) which is deposited on glass. It is used to produce spectral filters and thin-film electronics.
  • ITO indium tin oxide
  • the method presented is used to structure substrates for optoelectronic components, i.e. for both light-emitting and light-absorbing components, in particular organic components.
  • the structuring is created here by superimposed laser beams using laser interference.
  • the resulting structures can be generated in a line shape by superimposing two partial laser beams or as two-dimensional structures, in particular point-shaped, by superimposing three or four partial laser beams.
  • the aim of this surface structuring is to improve the efficiency of the optoelectronic components through optimized optical properties, i.e. optimized light input or output depending on the application.
  • the disadvantage is that the resulting patterns always have a strong periodicity.
  • the technical task is to provide a structured substrate with anti-glare properties that can be produced using a simple process.
  • the structuring of flat substrates should be possible within a short time.
  • a further object of the invention is to provide a method for structuring by means of laser interference, which is independent of the intensity of the laser radiation source.
  • the method should be set up in such a way that no damage to the optical elements occurs even at high intensities on the substrate to be structured.
  • the present invention thus provides a structured substrate which has a (global) dot structure in the micro- or sub-micrometer range, preferably a dot structure in the micro- or sub-micrometer range, which is arranged within a plane of the substrate, the (global) dot structure consisting of inverse Cones are formed, the (global) point structure consisting of the (non-congruent) superposition of at least a first interference pixel with a first interference period (pi) and a second interference pixel with a second interference period (p 2 ) within a plane on a surface or in the volume of the Substrate is formed, wherein the first interference pixel and the second interference pixel each independently have a periodic grid of at least three inverse cones with a first interference period (pi) or a second interference period (p 2 ), the ratio of the first interference period (pi) to the second interference period (p 2 ) in the range from 20:1 to 1:20, preferably in the range from 10:1 to 1:10,
  • the interference period of the point structure of at least one type of interference pixel for example the interference period of the first interference pixel, the second interference pixel and/or a further, for example third interference pixel, are identical.
  • the parameters of the laser interference structuring device for applying the interference pixels to the plane of the substrate can be kept constant, which minimizes the (technical) effort when applying the interference pixel and the formation of defective structures.
  • An anti-glare structure scatters incident electromagnetic radiation, for example light, on a plane of the substrate, in particular the surface of the substrate, so that reflection of this electromagnetic radiation can be significantly reduced.
  • the structure can be applied/produced directly (i.e. without the need to apply the structure indirectly via a further layer) to a wide number of different substrates, for example glass, plastics or metal, preferably flat and/or transparent substrates, in particular transparent materials become. Since the structuring does not depend on the refractive index or the adhesion of certain coating materials to the substrate, this structure can be used more flexibly than conventional chemical structuring.
  • the stability of the point structures produced in this way should be mentioned, which are more stable compared to conventional coatings because they are applied directly to the surface of a substrate and/or into the substrate and do not change over time and the use-related material stress, in particular mechanical material stress can be detached from the substrate to be coated.
  • the structures are chemical resistant to solvents and glass cleaners. If the structuring is carried out in the volume, ie in the interior of the substrate, preferably flat and/or transparent substrate, in particular in the transparent material, the resulting structuring (ie the point structure of the structured substrate) is less sensitive to impacts and abrasion than conventional coatings.
  • structuring also referred to herein as texturing
  • the texturing inside the material is interesting for other areas of application, such as product protection, optical data storage, decoration, etc.
  • a further advantage of the structured substrate or the application method defined herein is that only certain sections/parts can be created without much effort. Areas of a plane of a substrate can be structured specifically and/or partially. For example, the complex preparation and arrangement of a mask for attachment to a substrate, which, for example, shields/protects certain areas of the substrate before treatment, can be dispensed with.
  • the structural parameters e.g. the interference period, the structure depth, the diameter, the shape and the size of the inverse cones
  • the associated properties can be adjusted in a targeted and tailor-made manner.
  • the structured substrates defined herein, in particular the surfaces obtained preferably have a low gloss value in the range from 1 to 120 GU, preferably 10 to 40 GU, particularly preferably in the range from 15 to 35 GU (gloss units). particularly preferably less than 30 GU, such as less than 29 GU, 28 GU, 27 GU, 26 GU, 25 GU, 24 GU, 23 GU, 22 GU, determined with a gloss meter at 60° in accordance with DIN EN ISO 2813:2015 -02. Gloss is understood to be the ratio between the incident light and the light reflected from the surface at the angle of the specular reflection.
  • a substrate has anti-glare properties if it has an anti-reflective, non-glossy, Glare-protected or glare-free level, in particular a surface.
  • a reduction in the directed reflection is achieved by scattering processes occurring on structures which were inserted on or within the plane of the substrate, in particular on one of its surfaces.
  • a substrate has anti-glare properties if the surface of the substrate is designed in such a way that glare effects are reduced by avoiding directed reflection.
  • the surface has a certain roughness.
  • depressions and/or elevations are arranged on the surface, which are preferably distributed inhomogeneously on the surface.
  • the resulting scattering centers lead to a changed optical reflectivity of the surface. Directed reflections on the surface are greatly reduced, so that the differences in the reflection of the surface hardly depend on the direction, in particular on the direction of the reflected light.
  • a surface which has anti-glare properties is characterized in that the intensity of the light reflected in one direction from the surface is not greater than a maximum of 100 times, preferably 10 times, particularly preferably twice the intensity of the reflected light in the other directions.
  • the intensity is considered in a range of 60°, preferably 75°, around the normal to the surface and the intensity is preferably determined in a surface angle range of 1° x 1°.
  • a structured substrate has such an arrangement of point structures, preferably superimposed with structures in the submicrometer range, in particular column and / or line structures in the submicrometer range, that the reflection of the surface of the substrate in different directions, i.e. the intensity of the reflected Light in different directions, with constant lighting, varies by a maximum of a factor of 100.
  • a gloss meter is used to determine the anti-glare properties.
  • this is understood to mean an instrument which is suitable for measuring the gloss of a surface through specular reflection.
  • Gloss is determined by projecting a beam of light at a specific intensity and angle onto a surface and measuring the amount of reflected light at an equal but opposite angle. Angles of 30° to 45° to the normal of the surface are preferably used for this, particularly preferably of 30° to the normal or 60° to the surface.
  • the ratio of reflected to incident light for the sample compared to the ratio for the gloss standard is recorded as gloss units (GU).
  • a structured substrate has a gloss unit of less than 120, preferably less than 60, particularly preferably less than 20.
  • the term substrate refers to a substrate whose surface extends in several spatial directions.
  • a substrate preferably a flat and/or transparent substrate, can be a planar substrate or a curved substrate, for example a parabolic substrate.
  • flat is also to be understood as meaning that the extent of a substrate, preferably a flat and/or transparent substrate, for example a planar substrate in the x and y directions, or the extent of a curved substrate along its radius of curvature is greater than the extent of the Area in which the at least three partial beams interfere with each other.
  • the substrate is a substrate whose extent in the x and y directions, or whose extent along a radius of curvature, is less than or equal to the extent of the region in which the at least three partial beams interfere with one another.
  • a homogeneous structuring of the substrate is possible in one processing step (during a laser pulse).
  • the substrate is a flat substrate whose extent in the x and y directions, or whose extent along a radius of curvature, is greater than the extent of the region in which the at least three partial beams interfere with one another.
  • the term substrate includes a solid material with, for example, a reflective surface.
  • the substrate reflects electromagnetic radiation in the wavelength range from 100 nm to 1 m, for example visible light in the wavelength range from 380 nm to 780 nm, infrared radiation in the wavelength range from 780 nm to 50 pm or microwave radiation, in particular Radar beams in the wavelength range from 1 mm to 10 m.
  • the structuring of the substrate defined here allows a reduction in the directed reflection of the substrate, with the introduction of the structures causing scattering processes to occur on these structures, which are on or within the plane of the substrate, in particular on a its surfaces.
  • the present invention offers a wide selection of transparent and translucent but also non-transparent materials.
  • the substrate is preferably a flat and/or transparent substrate.
  • the substrate can be designed as a flexible and/or pliable substrate, such as (artificial) leather, a metal foil, a thin sheet or a plastic film, such as for use in a solar film or in displays.
  • a flexible and/or pliable substrate such as (artificial) leather, a metal foil, a thin sheet or a plastic film, such as for use in a solar film or in displays.
  • the flat substrate comprises a transparent material, preferably the substrate consists of a transparent material.
  • a material or substrate is transparent in the sense of the present invention if it is designed to allow at least part of an electromagnetic wave to pass through.
  • the transparent material has a high transmittance for visible light (by definition in the wavelength range from 380 nm to 780 nm), although this varies depending on the application.
  • the transmittance of the transparent material is preferably at least 50%, preferably not less than 70%, preferably not less than 80%, more preferably not less than 90%, without deviation in the spectrum in the region of electromagnetic radiation (as defined herein), in particular visible light, infrared radiation and/or microwave radiation, particularly preferably visible light.
  • the light transmission of a transparent material also offers the advantage that laser interference processing of a plane in the volume/interior of the substrate is possible.
  • a transparent material includes transparent
  • Materials especially glass (e.g. borosilicate glasses, quartz glasses, alkali-alkaline-earth)
  • glass e.g. borosilicate glasses, quartz glasses, alkali-alkaline-earth
  • Silicate glasses e.g. soda-lime glass
  • aluminosilicate glasses metallic glasses
  • solid ones Polymers
  • polycarbonates such as Makrolon® and Apec®
  • polycarbonate blends such as Makroblend® and Bayblen®
  • polymethyl methacrylate such as Plexiglas®
  • polyester polyethylene terephthalate, polypropylene, polyethylene
  • transparent ceramics e.g. spinel ceramics, such as Mg-Al- Spinel, aluminum oxynitride (ALON), aluminum oxide, yttrium aluminum garnet, yttrium oxide or zirconium oxide
  • Polycarbonates are homopolycarbonates, copolycarbonates and thermoplastic polyester carbonates.
  • the transparent material consists of a glass (as defined herein) or a solid polymer (as defined herein).
  • the silicate framework of glass preferably provides a transmission window for wavelengths in the range between 170 nm and 5,000 nm, i.e. wavelength range that includes visible light in the range from 380 nm to 780 nm and includes infrared radiation.
  • the substrate preferably a flat and/or transparent substrate
  • a dot structure in the micrometer or submicrometer range, as defined herein is created on the surface of the non-transparent material.
  • a structure with anti-glare properties can be created on a non-transparent material, with the original roughness of the surface of the non-transparent substrate (ie before applying the structuring according to the invention) remaining unchanged or almost unchanged in the macroscopic range, thereby effectively reducing the directed reflection of an otherwise reflective surface of an intransparent material, for example a metal surface, is induced.
  • Metals e.g. silicon, aluminum, copper, gold
  • metallic alloys e.g.
  • a substrate structured in this way is suitable as a negative mold for indirectly applying or producing structures on another substrate.
  • a substrate structured in this way “absorbs” since the structuring of the substrate allows a reduction in the directed reflection of the substrate, since scattering processes occur on these structures which were inserted on or within the plane of the substrate, in particular on one of its surfaces. Point-like structure/interference patterns
  • the term inverse pin refers to structures with a circular, elliptical, triangular or essentially rectangular base area, in particular with a circular base area, which taper conically into the substrate in the vertical direction and have a rounded cone tip at their saddle point.
  • the inverse pegs are formed during the structuring process, i.e. when a laser pulse strikes as a result of an area of high intensity hitting the substrate to be structured, the areas between the inverse pegs on or within the substrate ideally having a zero intensity due to destructive interference Remain essentially unstructured. Consequently, by focusing the laser (partial) beams on or within the substrate, the negative of what determines the intensity distribution is formed.
  • the shape of the inverse cones described refers to point structures which are arranged on the surface of the substrate.
  • An arrangement of the point structures in one or along a plane within the volume leads to a shape that is more symmetrical.
  • the point structures generated within a volume using laser interference structuring are also referred to as inverse cones.
  • Cones with an elliptical base can be produced, for example, by tilting the substrate in relation to the angle of incidence of the (partial) focused laser beam(s).
  • the period of the structure is referred to as A for the purposes of the invention. It generally depends on the wavelength of the interfering laser beams, the angle of incidence of the interfering laser beams and the number of interfering laser beams.
  • the term interference pixel refers to a (local) periodic pattern or grid of at least three inverse cones, preferably of at least seven inverse cones, most preferably at least 19 inverse ones Cones on the surface of a substrate, which form within a pixel of an interference pixel (see Fig. 9).
  • the periodic pattern or grid is created by superimposing at least two, particularly preferably at least three, very particularly preferably at least four laser (partial) beams as a result of focusing (bundling) these laser (partial) beams the surface or into the interior of the substrate, whereby the partial beams interfere constructively and destructively on the surface or within the substrate.
  • the periodic point structures i.e. the inverse cones within a type of interference pixel
  • have a coefficient of variation a value resulting from dividing the standard deviation by the average value
  • This also allows better detectability of the substrate structured according to the invention compared to conventional methods for structuring/coating substrates (e.g. etching, particle blasting, polymer coating).
  • the (local) point structures generated in this way within an interference pixel are designed in the form of periodically arranged, inverse cones, whereby to produce a structure, in particular on a surface or in a plane in the volume of the substrate, which has anti-glare properties Structural period (i.e. the distance between the vertices of two adjacent cones - i.e. their height centers or centers of the depressions) based on cones that are formed by an interference pixel, on a statistical average in the range from 1 pm to 50 pm, preferably in the range from 5 pm to 50 pm, more preferably in the range from 10 pm to 30 pm.
  • the structure period is also called the interference period.
  • a flat, optionally homogeneous and periodic, dot structure can be created on the surface or in the interior of a substrate, preferably flat and/or transparent substrate.
  • the focusing point can also be guided over the sample or substrate (e.g. using scanner-based methods).
  • a displacement of the substrate to be structured, preferably a flat and/or transparent substrate, in the laser beam can be comparatively complex and slow due to the relatively large masses moved. It is therefore advantageous to provide the substrate, preferably flat and/or transparent substrate, in a stationary manner during processing and to realize the flat structuring of the substrate by focusing the partial beams on the surface or the volume of the substrate Manipulation of the partial laser beams with optical elements (focusing mirror or galvo mirror (laser scanner)) is effected in the beam direction. Since the masses moved are relatively small, this can be done with much less effort and much faster.
  • the substrate is preferably arranged in a stationary manner during the process.
  • the individual pixels of a type of interference pixel for example a first interference pixel, a second interference pixel and/or a further interference pixel, which are arranged adjacently and repetitively offset from one another, can be globally (ie over the extent of the plane to be structured) either periodic or one form a non-periodic point structure.
  • a fully periodic point structure is created or exists when the preceding pixel and the following pixel of a type of interference pixel are each shifted in a spatial direction relative to one another by a whole multiple (e.g. 2, 3, 4, 5) of the interference period (p n ). . This results in a fully periodic pattern across the extent of the level to be structured, the period of which corresponds to the interference period (p n ).
  • a quasi-periodic point structure is created or exists when the preceding pixel and the following pixel of a type of interference pixel are each increased by an equal multiple that deviates from a whole multiple (e.g. 0.5; 1.3; 2.6 ) of the interference period (p n ) are shifted to one another in a spatial direction.
  • a non-periodic dot structure is created or exists when the interference period of the subsequent pixel is varied to the neighboring, preceding pixel and/or adjacent pixels arranged repetitively offset from one another are twisted, for example applied alternately or successively twisted.
  • the dot structure which is formed by adjacent, repetitively offset pixels of a type of interference pixel, is a fully periodic dot structure or a quasi-periodic dot structure (each as defined above).
  • structure depth i.e., the depth of the inverse pegs measured from their saddle point of the recess to the apex
  • anti-glare properties as defined herein.
  • the inverse cones of an interference pixel have an average structure depth or profile depth in the statistical average d 5 o in the range from 5 nm to 20 pm, particularly preferably in the range from 50 nm to 1 pm, entirely particularly preferably from 100 nm to 2 pm.
  • the structure depth of the inverse cones of an interference pixel is generally described by the average structure depth (dso), which defines the proportions of the cones within an interference pixel with a specific structure depth smaller or larger than the specified value for the structure depth.
  • the proportion of the surface structured in this way (degree of coverage of pegs per unit area, which is determined by the number and diameter of the inverse pegs), i.e. the proportion on the structured substrate is preferably 3% to 99%, particularly preferably 5% to 80%, very particularly preferably 7% to 70%, especially 10 to 50%.
  • This not only allows better detectability compared to conventional methods for structuring/coating substrates, but also has the advantage over them that fewer defects or more susceptible structures are introduced into the plane of a substrate, in particular into the surface, in order to achieve the properties defined herein .
  • a structured substrate with anti-glare properties also describes such a substrate which comprises a dot structure, wherein the dot structure consists of superimposed structures, wherein at least one structure has dimensions in the submicrometer range, and wherein at least one structure consists of inverse cones (as defined herein), which can be generated in particular by interfering laser beams.
  • a point structure in particular the point structure made up of superimposed structures, can be optimally adapted to the requirements of the respective application by appropriately designing the parameters (selection of the laser radiation source, arrangement of the optical elements).
  • the structured substrate not only comprises a single interference pixel of one type, for example a first interference pixel, a second interference pixel and/or a third interference pixel, but rather there are several interference pixels of one type, for example several first interference pixels and/or or a plurality of second interference pixels, each independently of one another within a plane in at least one spatial direction (x and/or y orientation), particularly preferably in two spatial directions (planar), arranged adjacently and repetitively offset from one another.
  • x and/or y orientation particularly preferably in two spatial directions (planar)
  • first interference pixels (10) are applied within a plane in at least one spatial direction adjacent to one another, repetitively offset from one another, on a plane on a surface or in the volume of the substrate to be structured (see, for example, Fig. 6) and in a second step, several second interference pixels (11) are applied adjacent to these several first interference pixels (10) within a plane in at least the same spatial direction, repeatedly offset from one another.
  • these several first interference pixels (10) and several second interference pixels (11) are applied to the plane alternately, i.e. alternately - that is, a first interference pixel, then a second interference pixel and again from the front.
  • this advantageously increases the area in which the directed reflection is reduced. Furthermore, an arrangement in which a large number of interference pixels are arranged adjacent to one another and repeatedly offset at least in one spatial direction opens up a series of adjustable degrees of freedom.
  • properties in particular an anti-glare effect, can be achieved in a targeted manner over a large area, in particular flat on a plane of the substrate, which is spanned by a surface of the substrate, or within of the volume of the substrate can be achieved/applied.
  • Such structuring with a plurality of first interference pixels (10) and a plurality of second interference pixels (11) can be achieved, for example, by scanning the substrate with a polygon scanner.
  • the superimposed interference pixels of different types can either form a periodic or a non-periodic point structure globally (ie over the extent of the plane to be structured).
  • a fully periodic point structure is created or exists when the pixels of an interference pixel of a first type and the superimposed pixels of an interference pixel of a different type are each separated by a whole multiple (e.g. 2, 3, 4, 5) of the interference period (p n ) are shifted in a spatial direction relative to each other. This results in a fully periodic pattern across the extent of the level to be structured, the period of which corresponds to the interference period (p n ).
  • a quasi-periodic dot structure is created or exists when the pixels of a first type and the superimposed pixels of an interference pixel of a different type are each by the same amount, of a whole Multiples of different multiples (e.g. 0.5; 1.3; 2.6) of the interference period (p n ) are shifted in a spatial direction relative to one another.
  • a non-periodic dot structure is generated by the pixels of a first type and the pixels of an interference pixel of a different type superimposed thereon or is present when the superimposed first interference pixels and the superimposed second interference pixels have different interference periods and/or the adjacent ones are repetitively offset Pixels arranged in relation to each other of at least one type of interference pixel are twisted, for example applied alternately or successively twisted.
  • the point structures comprising at least a plurality of first interference pixels of at least a first interference period (pi) and a plurality of second interference pixels of at least a second interference period (p 2 ), are quasi-periodic or non-periodic, particularly preferably not -periodically formed, such a point structure preferably being formed from the superimposition of at least a first interference pixel and a second interference pixel, each of which is arranged adjacent to one another in at least one spatial direction in a repetitively offset manner and each of which is a periodic or quasi-periodic point structure form.
  • first interference pixels (10) and/or second interference pixels (11) arranged adjacent to one another have varying structural parameters, selected from the group comprising the interference period of the interference pixel, the structural depth of the inverse cones, the diameter of the inverse cones, the Shape of the inverse cones and the size of the inverse cones.
  • a high degree of disorder i.e. non-periodic structures, can advantageously be generated locally, whereby undesirable or disturbing optical effects, such as moiré effects or color effects that arise from diffraction of applied microstructures, are minimized or prevented.
  • the interference period of the point structure of at least each additional interference pixel of a type for example each interference pixel of a first interference pixel, each interference pixel of a second interference pixel and/or each interference pixel of a third interference pixel, are essentially identical, i.e. differ by a maximum of 0 % to 2.0%, particularly preferably a maximum of 0 to 1.0%.
  • the interference periods are particularly preferably identical.
  • the interference pixels of one type which are arranged adjacently and repetitively offset from one another, for example the first interference pixel, the second interference pixel and/or the third interference pixel, become the previous interference pixel of this one type by an arrangement within the interference pixel (preferably around a centric one ) Axis of rotation (i.e. a normal to the plane) rotated, for example alternately or successively rotated in relation to the previous one.
  • Axis of rotation i.e. a normal to the plane
  • the subsequent interference pixel is the interference pixel of a type in the range of 1° to 90°, further in the range of 3° to 85°, particularly preferably of 5° to 80°, very particularly preferably of 10° to 75 °, especially twisted in the range of 15° to 60°.
  • a high degree of disorder i.e. non-periodic structures, is generated globally across a plane of the substrate, which is spanned by a surface of the substrate or within the volume of the substrate, which also results in undesirable or disturbing optical effects, such as moiré effects or color effects , which arise from diffraction on applied microstructures, can be minimized or prevented.
  • the subsequent interference pixel is in the range of 0.0001 ° to 5 °, further in the range of 0.001 ° to 1 °, particularly preferably around 0.001 °, in relation to the previous interference pixel of the interference pixel of a type twisted to 0.1, for example twisted alternately or successively.
  • the aim is to generate a point structure with broken periodicity, i.e. without resulting periodicity, through the specific selection of the structural parameters of the first and second interference pixels and any other type of interference pixel.
  • the point structures produced are therefore preferably arranged non-periodically, with the interference periods of the first and second interference pixels or each other type of interference pixel preferably being different (not identical) to one another. Periodic effects that disrupt the resulting image can thus be advantageously avoided.
  • a superposition of first and second interference pixels, which have identical interference periods, can result in periodic point structures in which the undesirable moiré effect occurs.
  • a disadvantageous change in color behavior, such as can occur due to diffraction effects on the introduced structures, is also avoided by a high degree of disorder.
  • the existing point structure leads to a scattering behavior of the incident light, which involves a large number of minimal deflection processes of the photons at the point structures introduced.
  • An existing periodicity of the point structures can lead to an increase in deflections of the photons, i.e. the light, in certain directions, which would create a spangle or glitter effect. While this effect is desirable for certain applications, it should be avoided for many other applications.
  • the generation of non-periodic structures advantageously leads to a reduction or avoidance of these glittering effects.
  • the offset between the interference pixel of a first type and the interference pixel of a second type, for example the second interference pixel and the first interference pixel is in the range of 5% ⁇ x ⁇ 50%, preferably in the range of 10% ⁇ x ⁇ 50%, in particular in the range of 20% ⁇ x ⁇ 50%, particularly preferably in the range of 25% ⁇ x ⁇ 45% of the interference period.
  • the periodic point structure is designed in such a way that an interference pixel of a further type is provided, at least a third interference pixel, this is arranged superimposed on the interference pixel of the previous type in such a way that the offset between the interference pixel of the further type, for example the third interference pixel and the second interference pixel in the range of 5% ⁇ x ⁇ 50%, preferably in the range of 10% ⁇ x ⁇ 50%, in particular in the range of 20% ⁇ x ⁇ 50%, particularly preferably in the range of 25% ⁇ x ⁇ 45 % of the interference period.
  • An offset that is below the interference period leads to an increase in the structure density or density of the point structure, which results in an increased scattering cross section and advantageously a larger scattering effect or a greater reduction in directed reflection.
  • At least 10 interference pixels are arranged on the surface of the substrate.
  • the offset between the different interference pixels is preferably not identical.
  • At least 30 interference pixels made up of at least three inverse cones are arranged in a plane, preferably on the surface, of the substrate.
  • the offset and, in a variant in which the offset is large, also the distance between the neighboring interference pixels has at least five, preferably at least ten, different values.
  • Such an inhomogeneous one Distribution of the interference pixels reduces periodic effects and prevents or reduces the occurrence of undesirable side effects, such as the occurrence of the undesirable moiré effect.
  • the structured substrate in particular the dot structure applied to the surface of the substrate, has at least one further type of interference pixel with a further interference period (p n ), for example a third interference pixel (12) with a third interference period (p 3 ), wherein the further, for example the third interference pixel (12) is arranged superimposed on the first interference pixel (10) and second interference pixel (11) in accordance with the aforementioned claims.
  • p n further interference period
  • p 3 third interference period
  • further defects ie point structures in the micro- and sub-micrometer range
  • a higher number of inverse cones increases the number of scattering centers and reduces directional reflection.
  • a glitter effect a display pixel only illuminates part of the surface feature, creating scattering effects that are perceived macroscopically as a periodic pattern.
  • the point structure defined here is an antiperiodic point structure made of inverse cones with average dimensions in the micrometer range, the structure of an interference pixel in particular having an average distance based on the respective saddle point or height center of two adjacent cones of an interference pixel of 1 pm to 50 pm , particularly preferably 5 pm to 50 pm, very particularly preferably from 10 pm to 30 pm.
  • a further structure in the nanometer range can be superimposed on this preferably antiperiodic point structure in the micrometer range, the average dimension of the superimposed structure preferably having dimensions in the range of the laser wavelength A or A/2, in particular from 100 nm to 1,000 nm, particularly preferably from 200 nm to 500 nm.
  • such a structure is also referred to as a hierarchical structure.
  • a hierarchical structuring refers to a structure in which a first structure with dimensions in the micrometer or submicrometer range, in particular in the Micrometer range, which corresponds to an interference pattern, is overlaid by a further structure which has dimensions that are below the dimensions of the first structure and which is formed, for example, by a self-organization process.
  • the dimensions of the further structure, the structure in the nanometer range superimposing the dot structure in the micrometer range, which is formed, for example, by a self-organization process are preferably in the range from 1% to 30%, particularly preferably in the range from 1% to 10% of the dimensions of the first Structure that corresponds to an interference pattern.
  • the structure overlying the dot structure in the micrometer range has a periodic wave structure in the nanometer range, preferably a fully periodic wave structure, wherein the material on the surface of the substrate in the area of the superimposed structure has a sequence of wave crests and troughs, the periodicity of which is preferably in the submicrometer range is in the range from 100 nm to 1,000 nm, particularly preferably from 200 nm to 500 nm.
  • additional anti-reflection properties can advantageously be introduced in the structured plane, in particular on the surface of the substrate.
  • the structures in the nanometer range ensure that light that hits the substrate is reflected less or is reflected at such a flat angle that it does not appear “disturbing” when the material surface is viewed normally.
  • an overlaying structure described herein in the nanometer range or in the submicrometer range preferably a column or wave structure in the submicrometer range or in the nanometer range, is arranged exclusively in the inverse pegs.
  • Such a column structure preferably has a periodicity in the submicrometer range, which is preferably in the range from 50 nm to 1,000 nm, preferably from 100 to 1,000 nm, particularly preferably from 200 nm to 500 nm. In this way, additional anti-reflection properties can advantageously be introduced in the structured plane, in particular on the surface of the substrate.
  • the structures in the submicrometer or nanometer range ensure that light that hits the substrate is reflected less or is reflected at such a flat angle that it does not appear “disturbing” when the material surface is viewed normally. In particular, such small structures have the effect of reducing reflection.
  • a substrate can thus be produced which has both anti-glare properties and anti-reflection properties.
  • the superimposed structure in the submicrometer range or in the nanometer range only occurs in the point structure, which is generated with a larger interference period.
  • Such a structure has the advantage that it can be created efficiently, especially by exploiting self-organization processes. This means that structuring can advantageously be implemented more economically.
  • the periodic dot structure in the nanometer range is preferably designed in such a way that the structured substrate receives electromagnetic radiation with a wavelength of more than 550 nm with a periodic dot structure of less than 1,000 nm, preferably more than with a periodic dot structure of less than 750 nm 500 nm, most preferably with a periodic dot structure of less than 600 nm transmitted by more than 450 nm.
  • wavelengths in the red and/or yellow light spectrum, in the green light spectrum and even in the blue light spectrum can therefore transmit into the substrate.
  • anti-reflection properties refer to the increased transmission or diffraction of incident electromagnetic radiation with wavelengths in the range of visible light, in particular with wavelengths in the range from 400 nm to 780 nm, as well as in the range of infrared radiation, or
  • the substrate is characterized in that the periodic dot structure it comprises preferably has dimensions in the submicrometer range, particularly preferably in the nanometer range.
  • the dimensions of the periodic point structure are particularly preferred in the range of the wavelength of electromagnetic radiation in the range of visible light.
  • the dimensions of the periodic dot structure are preferably in the range of 630 nm to 700 nm for transmitting or diffracting red light, in the range of 590 nm to 630 nm for transmitting or diffracting red and orange light, in the range of 560 nm to 590 nm for transmitting or diffracting red, orange and yellow light, in the range from 500 nm to 560 nm for transmitting or diffracting red, orange, yellow and green light, in the range from 475 nm to 500 nm for transmitting or bending red, orange, yellow, green and turquoise light, in the range of 450 nm to 475 nm for transmitting or bending red, orange, yellow, green, turquoise and blue light, in the range of 425 nm to 450 nm for transmitting or bending red, orange, yellow, green, turquoise, blue and indigo light, in the range from 400 nm to 425 nm for transmitting or bending red, orange, yellow, green, turquoise,
  • the method disclosed herein and the device disclosed herein are suitable for producing a substrate which comprises a periodic dot structure in the nanometer range, which was generated, for example, by means of laser interference structuring, and which is characterized by anti-reflection properties.
  • anti-reflection properties also refer to the increased transmission or diffraction of incident electromagnetic radiation with wavelengths in the range of invisible light, in particular in the range of ultraviolet radiation (UV radiation), in particular with wavelengths in the range from 100 nm to 380 nm.
  • the substrate is characterized in that the periodic point structure it comprises preferably has dimensions in the nanometer range. A substrate structured in this way can advantageously be used in areas where protection from UV radiation is necessary.
  • the average structure depth of this structure in the nanometer range, which superimposes the dot structure in the micrometer range, is preferably in the range from 10 to 500 nm.
  • the wave structure which superimposes the periodic point structure of inverse cones with average dimensions in the micrometer range, can be formed during the structuring process, ie when a laser pulse hits the substrate to be structured as a result of the appearance of a high intensity region, the structuring being carried out by a self-organization process , which is excited by the at least partial melting of the substrate material by means of a laser pulse in a region of high intensity.
  • the wave structure is generated using laser-induced periodic surface structures (Laser-induced Periodic Surface Structures - LIPSS), whereby the appearance of these surface structures is coupled to the generation of the point structures using interfering laser beams.
  • the wave structure which superimposes the point structure according to the invention made of inverse cones with average dimensions in the micrometer range, can also be achieved by subsequently applying a further interference pixel to the surface of the (pre-structured) substrate, the structures generated with the further interference pixel being related to a structure period the cones, which are formed by the further interference pixel, have a statistical average in the range from 100 nm to 1,000 nm, preferably in the range from 200 nm to 500 nm.
  • Hierarchical structures there are numerous technical areas of application for hierarchical structures, such as in the area of producing substrates with hydrophobic or superhydrophobic as well as hydrophilic or superhydrophilic surfaces and substrates with anti-icing or anti-fogging properties in addition to the substrates with anti-glare properties mentioned above .
  • a flat structuring of a substrate for example with anti-glare properties through interfering laser beams and using laser-induced periodic surface structures, is therefore advantageously possible without having to accept a long processing time or a large number of process steps that can be carried out successively.
  • the invention thus enables simultaneous creation of hierarchical structures, which can be used in the technical field both in the field of substrates with anti-reflection properties and in the field of self-cleaning, hydrophobic or superhydrophobic, as well as hydrophilic or superhydrophilic substrates with anti-reflection properties and / or anti-fogging properties .
  • the substrate structured according to the invention is suitable for further processing, for example chemical and/or physical treatment.
  • Chemical spray coatings and/or sol-gel processes are particularly suitable for increasing the properties defined herein that are obtained with the structuring according to the invention or for improving the properties of the structured substrate by applying other layers (e.g. anti-reflection properties and/or hydrophobic ones or superhydrophobic and/or hydrophilic or superhydrophilic properties).
  • the structured substrates are subsequently modified by etching with acids (e.g. hydrofluoric acid) or by leaching the surface in basic solutions.
  • acids e.g. hydrofluoric acid
  • a selective etching take place. Acids or bases attack preferentially in the structural valleys created in the Z minima, i.e. in the inverse cones.
  • the degree of etching or the etching speed can be adjusted via the density of the microstructures (degree of coverage of pins per unit area, which is determined by the number and diameter of the inverse pins).
  • the interference maxima or high-intensity regions of the interference image are converted from several superimposed laser (partial) beams into three-dimensional point structures in the form of inverse cones on a surface of the substrate or in a plane within the volume of the substrate.
  • the physical/chemical effects for producing the point structures only occur from a certain energy threshold, i.e. from a certain intensity threshold.
  • This energy threshold limits the size of the interference pixel, since the intensity of the maxima decreases towards the edges of the superimposed laser (partial) beams. If the intensity at the edges is too weak, there will be no structuring in these areas in the sense of the invention.
  • the interference pattern depends on the properties of the superimposed laser (partial) beams.
  • the structure depth can be influenced by the energy input, i.e. also by the wavelength of the laser (partial) beam.
  • the properties of the resulting point structure when irradiated with a certain pulse length, i.e. the properties of the individual interference pixels, also depend on the properties of the substrate dependent.
  • an interference pixel for example a first, a second and/or a third interference pixel, is applied to the surface of a substrate by means of laser interference structuring by irradiating the substrate with several laser (partial) beams at an angle to Surface of the substrate from 45° to 90° (vertical), preferably at an angle of 60° to 90°, particularly preferably at an angle of 75° to 90°, for example in each case in an angular range from/to 76°, 77° , 78°, 79°, 80°, 81°, 82°, 83°, 84°, 85°, 86°, 87°, 88°, 99°, 90°.
  • an interference pixel is applied to the surface of a substrate essentially perpendicularly along a normal to the surface, i.e. at an angle of 90° ⁇ 1°.
  • the invention also relates to a display having a controllable, light-emitting layer and a front glass.
  • the front glass has a structured substrate according to the invention or is formed by such a substrate structured according to the invention.
  • Such a display can, for example, be designed or used as a large screen or as a computer screen or as a tablet or as an analog or electronic watch, in particular a wristwatch.
  • Such a display can advantageously be structured efficiently.
  • Good anti-glare properties, preferably in conjunction with advantageous anti-reflection properties, of the substrate can be advantageously achieved.
  • the device according to the invention consists of a laser radiation source (1) which emits a laser beam.
  • the radiation profile of the emitted laser beam corresponds either to a Gaussian profile or a top hat profile, particularly preferably a top hat profile.
  • the top hat profile is helpful in order to structure or cover a surface of a substrate to be structured more homogeneously and, if necessary, to enable a faster structuring speed.
  • the laser radiation source (1) is a source that generates a pulsed laser beam.
  • the pulse width of the pulsed laser radiation source is, for example, in the range from 10 femtoseconds to 1 nanosecond, in particular 50 femtoseconds to 1 nanosecond, very particularly preferably 50 femtoseconds to less than 100 picoseconds, even more preferably 10 picoseconds to 100 picoseconds.
  • laser beam, laser (partial) beam or partial beam does not mean an idealized beam of geometric optics, but rather a real light beam, such as a laser beam, which does not have an infinitesimally small beam cross-section, but rather an extensive beam cross-section (Gaussian distribution profile or an intrinsic TopHat beam).
  • top hat profile or top hat intensity distribution is meant an intensity distribution that can be essentially described, at least with regard to one direction, by a rectangular function (rect (x)).
  • Real intensity distributions that have deviations from a rectangular function in the percentage range or inclined edges are also referred to as top hat distribution or top hat profile.
  • Procedure and Devices for generating a top hat profile are well known to those skilled in the art and are described, for example, in EP 2 663 892.
  • Optical elements for transforming the intensity profile of a laser beam are also already known.
  • laser beams with a Gaussian intensity profile can be transformed into laser beams which have a top hat-shaped intensity profile in one or more defined planes, such as a Gauss-to-Top Hat Focus Beam Shaper from the company TOPAG Lasertechnik GmbH, see e.g. DE102010005774A1.
  • Such laser beams with top-hat-shaped intensity profiles are particularly attractive for laser material processing, especially when using laser pulses that are shorter than 50 ps, since particularly good and reproducible processing results can be achieved with the essentially constant energy or power density .
  • the laser radiation source (1) contained in the device according to the invention can have an intensity of 0.01 to 5 J/cm 2 , particularly preferably 0.1 to 2 J/cm 2 , very particularly preferably 0.1 to 0.5 J/cm 2 .
  • the device according to the invention allows the intensity of the laser radiation source to be flexibly selected in a range.
  • the beam diameter plays no role in generating the interference pattern on the substrate, preferably a flat and/or transparent substrate. Due to the preferred arrangement of the optical elements in the beam path of the laser, no unit for controlling the intensity of the laser beam is necessary.
  • the laser radiation source is preferably set up to emit wavelengths in the range from 200 nm to 15 pm (e.g. CO2 laser in the range from 10.6 pm), most preferably in the range from 266 nm to 1,064 nm.
  • Suitable laser radiation sources include, for example, UV laser beam sources, laser beam sources (155 to 355 nm) that emit green light (532 nm), diode lasers (typically 800 to 1,000 nm) or laser beam sources that emit radiation in the near infrared (typically 1,064 nm), in particular with a wavelength in the range of 200 to 650 nm wavelength.
  • Lasers suitable for microprocessing are known to those skilled in the art and include, for example, HeNe lasers, HeAg lasers (approx.
  • NeCu lasers (approx. 249 nm), Nd:YAG lasers (approx. 355 nm), YAG lasers (approx. 532 nm), InGaN laser (approx. 532 nm).
  • Optical elements
  • the structuring can be realized by arranging a large number of optical elements. These elements are primarily prisms and lenses.
  • These lenses can be refractive or diffractive.
  • Spherical, aspherical or cylindrical lenses can be used.
  • cylindrical lenses are used. This makes it possible to compress the overlap areas of the partial beams (herein also referred to as interference pixels) in one spatial direction and stretch them in another. If the lenses are not spherical/aspherical but cylindrical, this has the advantage that the beams can be deformed at the same time. This allows the processing spot (i.e., the interference pattern created on the substrate) to be deformed from a point to a line containing the interference pattern. With sufficient energy from the laser, this line can be in the range of 10-15 mm long (and approximately 100 pm thick).
  • SLM Spatial Light Modulators
  • SLMs can also be used to shape the beam.
  • SLMs to spatially modulate the phase or intensity or the phase and intensity of an incident light beam is known to those skilled in the art.
  • LOC-SLM Liquid Crystal on Silicon
  • SLMs can also be used to focus the partial beams on the substrate.
  • Such an SLM can be controlled optically, electronically or acoustically.
  • the beam path of the laser refers to the course of both the laser beam emitted by the laser radiation source and the course of the partial beams split by a beam splitter element.
  • the optical axis of the beam path (3) is understood to be the optical axis of the laser beam emitted by the laser radiation source (1).
  • all optical elements are arranged perpendicular to the optical axis of the beam path (3).
  • a beam splitter element (2) is preferably located in the beam path (3) of the laser, behind the laser radiation source (1).
  • the beam splitter element (2) can be a diffractive or a refractive beam splitter element.
  • Diffractive beam splitter elements are also only used briefly referred to as a diffractive optical element (DOE).
  • DOE diffractive optical element
  • a diffractive beam splitter element refers to an optical element which contains micro- or nanostructures, preferably microstructures.
  • a refractive beam splitter element refers to a transparent optical element, such as. B. a prism.
  • the beam splitter element (2) is preferably a refractive beam splitter element.
  • the beam splitter element (2) divides the emitted laser beam into at least 2, preferably at least 3, particularly preferably at least 3, in particular 4 to 10, i.e. 4, 5, 6, 7, 8, 9 or 10 partial beams.
  • the beam splitter element (2) is freely movable along its optical axis, in particular in the beam path of the laser beam emitted by the laser radiation source. That is, it can be moved toward or away from the laser radiation source along its optical axis.
  • the movement of the beam splitter element (2) changes the expansion of the at least 3 partial beams, so that they impinge on a focusing element at different distances from one another.
  • the beam splitter element is designed as a rotating element. This advantageously allows the polarization of the partial beams to be modified.
  • the angle 9 at which the partial beams impinge on the substrate (5), preferably a flat and/or transparent substrate, is 0.1° to 90°.
  • the angle 9 is also dependent on the distances between the optical elements, in particular on the distance between the optical elements and the beam splitter element, and especially on the distance between the focusing element and the beam splitter element.
  • the position of the beam splitter element can be adjusted or can be calculated so that the desired structure period can be set.
  • the position of the optical elements comprised by the device, in particular the position of the focusing element in relation to the beam splitter element, is taken into account in such a way that if the distance between the optical elements is greater or smaller, the position of the beam splitter element can be adjusted accordingly.
  • a distance from the beam splitter element (2) to the deflection element (7) is set to 10 to 50 mm.
  • the device also comprises a measuring device, in particular a measuring device that works by means of a laser or an optical sensor, which is used to measure the position of the beam splitter element and, if necessary, the distance of the beam splitter element to the other optical elements, in particular to the position of the Focusing element is set up.
  • a measuring device in particular a measuring device that works by means of a laser or an optical sensor, which is used to measure the position of the beam splitter element and, if necessary, the distance of the beam splitter element to the other optical elements, in particular to the position of the Focusing element is set up.
  • the device according to the invention can comprise a control device which is connected in terms of signals to the measuring device and which is in particular connected to a computing unit in such a way that the measured position of the beam splitter element is comparable to a first predetermined comparison value, the control device being set up in terms of programming in such a way that, if the If the distance of the beam splitter element to the further optical elements, in particular to the position of the focusing element and/or the deflection element (7), is greater than the first predetermined comparison value, then a control signal is generated via the control device, with which at least one position of an optical element, in particular of the beam splitter element (2) is changed in such a way, in particular of the beam splitter element (2) in relation to the deflection element (7), that the desired structure period is generated on the substrate.
  • the method for producing a substrate with a dot structure in the micrometer or submicrometer range can also include the following steps:
  • the laser beam can be divided in the beam splitter element (2) both by a partially reflective beam splitter element, for example a semi-transparent mirror, and by a transmissive beam splitter element, for example a dichroic prism.
  • a partially reflective beam splitter element for example a semi-transparent mirror
  • a transmissive beam splitter element for example a dichroic prism.
  • further beam splitter elements are arranged downstream of the beam splitter element (2) in the beam path of the laser. These beam splitter elements are arranged in such a way that they divide each of the at least three partial beams into at least two further partial beams. This allows a higher number of partial beams to be generated, which are directed onto the substrate, preferably a flat and/or transparent substrate, so that they interfere on the surface or inside the substrate. This allows the structure period of the interference pattern to be adjusted.
  • a focusing element (4) is arranged downstream of the beam splitter element (2), which is set up in such a way that the partial beams pass through it in such a way that the partial beams are on the surface or inside a substrate to be structured (5 ) interfere in an interference area.
  • the focusing element (4) focuses the at least three partial beams in a spatial direction without focusing the at least three partial beams in the spatial direction perpendicular thereto.
  • the focusing element (4) can be a focusing optical lens.
  • focusing is understood to mean bundling the at least three partial beams on the surface or inside a substrate, preferably a flat and/or transparent substrate.
  • the focusing element (4) can be freely movable in the beam path (3). According to a preferred embodiment of the present invention, the focusing element (4) is fixed in the beam path or along the optical axis. It is understood that the optical elements defined herein can be arranged in a common housing, for example for beam splitting and for aligning the partial beams in the direction of a substrate to be structured accordingly.
  • the focusing element (4) is a spherical lens.
  • the spherical lens is set up in such a way that the incident at least three partial beams pass through it in such a way that they interfere in an interference region on the surface or in the interior of the substrate (5) to be structured, preferably a flat and/or transparent substrate.
  • the width of the interference range is preferably 1 to 600 pm, particularly preferably 10 to 400 pm, very particularly preferably 20 to 200 pm. In this way, a high structuring rate, for example as defined herein, can be set at the same time.
  • the focusing element (4) is a cylindrical lens.
  • the cylindrical lens is set up in such a way that the area in which the at least three partial beams overlap on the surface or in the interior of the substrate (5), preferably flat and/or transparent substrate, is stretched in a spatial direction.
  • the area of the substrate on which the interference pattern can be generated takes on an elliptical shape.
  • the semimajor axis of this ellipse can reach a length of 20 pm to 15 mm. This increases the area that can be structured during irradiation.
  • a deflection element (7) which is preferably arranged in the beam path (3) of the laser, is located in front of the focusing element (4) and after the beam splitter element (2).
  • This deflection element (7) is used to expand the distances between the at least three partial beams and can therefore also change the angle at which the partial beams impinge on the substrate (5), preferably a flat and/or transparent substrate. It is set up in such a way that it increases the divergence of the at least three partial beams and thus moves the area in which the at least three partial beams interfere along the optical axis of the beam path (3) away from the laser radiation source (1).
  • expanding the distances between the at least three partial beams means that the angle of the respective partial beams to the optical axis of the laser beam emitted by the laser radiation source (1) increases.
  • the expansion and the resulting deflection of the partial beams has the advantage that the partial beams can be focused more strongly by the focusing element (4). This results in a higher intensity in the area in which the at least three partial beams interfere on the surface or in the interior of the substrate (5), preferably a flat and/or transparent substrate.
  • a unit for controlling the intensity of the laser beam can be dispensed with.
  • a deflection element (7) is used which, by expanding the at least three partial beams, allows the at least three partial beams to be focused on the substrate (5) by means of a focusing element (4), the intensity of the interference points on the surface or inside the substrate, preferably flat and/or transparent substrate, can be achieved without additional adjustment of the intensity of the laser radiation source (1).
  • laser radiation sources with low intensity (power per area) can also be used to structure the substrate to create the point structure, whereby the optical elements are protected from wear.
  • a further deflection element (6) is arranged in the beam path (3) of the laser radiation source (1) downstream of the beam splitter element (3), which deflects the partial beams in such a way that after they emerge from the further deflection element (6).
  • the device can be set up in such a way that the processing point, i.e. the point at which the at least three partial beams on the surface or in the interior of the substrate, preferably flat and/or transparent substrate, interfere, when the beam splitter element is displaced along the beam path of the laser optical axis remains constant.
  • the term “essentially parallel” is intended to mean an angular offset of between +15° and -15°, in particular only between +10° and -10°, most preferably between +5° and -5° between the two partial beams, but in particular of course no angular offset, i.e. 0°, can be understood.
  • the further deflection element (6) can be a conventional, refractive lens.
  • the further deflection element (6) can also be designed as a diffractive lens (e.g. Fresnel lens). Diffractive lenses have the advantage of being significantly thinner and lighter, which simplifies miniaturization of the device disclosed herein.
  • the distances between optical elements and substrate, as well as the structure period A can be adjusted.
  • All optical elements with the exception of the beam splitter element (2) can preferably be fixed within the beam path (3) of the laser.
  • This particularly preferred embodiment therefore offers the advantage that only one element, namely the beam splitter element (2), has to be moved to adapt the interference range or the interference angle. This saves steps when setting up the device, such as calibrating the device to the desired structure period.
  • a fixed setting i.e. preferably all optical elements are fixed within the beam path (3) of the laser, prevents the optical elements from wearing out.
  • a polarization element (8) is preferably arranged in the beam path in front of the beam splitter (2). This allows the polarization of the beam to be advantageously modified.
  • a circular polarization element is arranged in the beam path in front of the beam splitter. Using circularly polarized light, special self-organization processes can be stimulated, through which column structures can be created. These column structures are quasi-periodic and preferably have a structure period of 50 nm to 1000 nm, preferably 100 nm to 500 nm.
  • such column structures require ultra-short pulses with pulse durations of less than 5 ps.
  • the corresponding threshold values for the occurrence of the self-organization processes to generate the columnar structure in the maxima can be generated more easily. This means that fewer demands are placed on the lasers, so that longer laser pulses of 10 to 100 ps can be used.
  • such column structures can be generated particularly quickly and efficiently. Anti-glare properties and anti-reflection properties can therefore be efficiently generated on surfaces or in the volume of substrates.
  • interference structuring such as rapid structuring of surfaces
  • advantages of structures in the submicrometer or nanometer range that lead to anti-reflection in particular the column structures or line structures in the nanometer range. This can advantageously be used to produce structured substrates with anti-glare properties as well as anti-reflection properties.
  • such a circular polarization element can be rotated dynamically, so that the resulting structures on or in the substrate are dynamically modified with the rotation.
  • a polarization element is arranged in at least one of the at least 2, preferably at least three, partial beams.
  • a polarization element can be dynamically rotated, so that the resulting structures are dynamically modified with the rotation on or in the substrate.
  • the arrangement and also the strength of the minima and maxima within the interference pattern can be dynamically adjusted.
  • the resulting global structures have less homogeneity. In this way, structures can advantageously be produced which have a less pronounced periodicity, thereby improving the anti-glare properties and reducing undesirable effects, such as the moiré effect.
  • the deflection element particularly preferably in a structure with two deflection elements (6), (7) is located behind the further deflection element (6), and in front of the focusing element (4) in at least one of the beam paths of the at least 2 partial beams Polarization element (8).
  • the polarization elements can modify the polarization of the partial beams relative to one another. This allows the resulting interference pattern, which the at least 2 partial beams image on the surface or in the volume of a substrate, preferably a flat and/or transparent substrate, to be modified.
  • the polarization plane can advantageously be at least a partial beam rotated in the beam path and thus “disturbed” the pattern of an interference pixel in the plane of the substrate.
  • the interfering partial beams can therefore be non-polarized, linearly polarized, circularly polarized, elliptically polarized, radially polarized or azimuthally polarized.
  • a particularly advantageous embodiment provides that both a circular polarization element is arranged in front of the beam splitter and also at least one polarization element is arranged in at least one partial beam.
  • only one circular polarization element is arranged in front of the beam splitter and no further polarization element is provided in the partial beams.
  • the laser radiation source (1) has a radiation profile that corresponds to a Gaussian profile, as described above.
  • a further optical element for beam shaping can be located behind the laser radiation source (1) and in front of the beam splitter element (2). This element serves to adapt the radiation profile of the laser radiation source to a top hat profile.
  • An optical element with a concave, parabolic or planar reflecting surface can also be provided in the device according to the invention, the optical element being designed, for example, to be rotatable about at least one axis or displaceable along the beam path (3).
  • laser beams or partial laser beams can be directed through this optical element onto the surface of the focusing element (4) or a further focusing optical element before the beams reach the substrate to be structured to form structural elements.
  • At least one optical element can be provided with a concave parabolic or planar reflecting surface, which is designed to be rotatable about at least one axis or displaceable along the beam path (3), for example, this optical element being the first deflection element (7) and the further Deflection element (6) is positioned downstream in the beam path.
  • the partial beams can be deflected in the beam path (deflection mirror) or be focused in the beam path in such a way that the substrate to be structured can be positioned in a fixed position during processing (so-called focusing mirror or galvo mirror (laser scanner) (9)).
  • At least one optical element comprises a periodically rotating prism, preferably a periodically rotating mirror prism, in particular a polygonal mirror or polygonal wheel, and a focusing element (4) arranged downstream of the periodically rotating prism in the beam path.
  • the focusing element is set up in such a way that the partial beams pass through it in such a way that the partial beams interfere in an interference region on the surface or inside a substrate (5) to be structured.
  • the optical element further comprises at least another deflecting element, for example a reflecting deflecting element for deflecting the partial beams in the beam path.
  • the at least one further deflection element can be arranged upstream and/or downstream of the periodically rotating prism in the beam path.
  • the at least one further deflection element is arranged upstream of the focusing element in the beam path.
  • Such a structure advantageously allows the rapid scanning of a surface of a substrate, so that a high structuring rate of up to 3 m 2 /min, in particular in the range from 0.05 to 2 m 2 /min, particularly preferably in the range from 0.1 to 1 m 2 /min, very particularly preferably in the range from 0.1 to 0.9 m 2 /min can be achieved.
  • the exact structuring rate depends in particular on the available laser power. With future technologies that have higher laser power, even higher structuring rates can be achieved.
  • the substrate (5) preferably a flat and/or transparent substrate
  • the substrate (5) is movable in the xy plane.
  • the substrate (5) preferably a flat and/or transparent substrate
  • flat processing using laser interference structuring can be ensured.
  • a so-called interference pixel is generated, which has a size D depending on the angle of incidence and the intensity distribution of the laser beam, as well as the focusing properties of the optical elements.
  • the distance between the different interference pixels, the pixel density Pd is determined by the repetition rate of the laser radiation source (1). Is the If the pixel density Pd is smaller than the size of the interference pixels D, flat, homogeneous processing is possible.
  • the present invention also relates to a method for producing a structured substrate (as defined herein), in particular a substrate with anti-glare properties.
  • the method for producing a structured substrate comprises the following steps: a) providing a substrate (5), preferably comprising a transparent material, b) applying at least a first interference pixel (10) with a first interference period (pi) on a plane of the substrate (5), in particular by means of laser ablation, c) applying at least a second interference pixel (11) with a second interference period (p 2 ) to the plane of the substrate ( 5), in particular by means of laser ablation, wherein the first and second interference pixels each independently have a periodic grid of at least three inverse cones with a first interference period (pi) or a second interference period (p 2 ), characterized in that the point structure is characterized by superimposed application of the second interference pixel (11) with the first interference pixel (
  • the method described here by applying periodic basic structures, in particular by means of laser ablation has the advantage that complex pre- and post-processing processes (such as etching or particle beams) can be dispensed with. Because the process parameters can be set precisely, the application of identical local and global structures (e.g. by storing a defined flow chart for structuring) is also easily repeatable or easily transferable to other samples (of the same or different substrate material). In addition, the degree of structuring and thus the properties associated with the structure can be easily adjusted using the structure parameters.
  • the interference pixels are applied in such a way that the period of the dot structure of the first interference pixel and the period of the dot structure of the second interference pixel are identical.
  • the method according to step c) comprises applying at least one further type of interference pixel with a further interference period (p n ), for example a third interference pixel (12) with a third interference period (p 3 ) to the plane of the substrate, in particular the surface of the substrate (5), in particular by means of laser ablation, the further, for example the third interference pixel (12) being arranged superimposed on the first interference pixel (10) and second interference pixel (11) in accordance with the features defined herein.
  • p n further interference period
  • p 3 third interference period
  • the ratio of the further interference period (p n ) to the other interference periods is preferably in the range from 20:1 to 1:20, preferably in the range from 10:1 to 1:10, particularly preferably in the range from 5:1 to 1 :5, in particular 3:1 to 1:3, whereby the properties defined herein, in particular the anti-glare properties of the substrate, can be optimized.
  • the method according to step c) thus comprises at least the application of at least eight further interference pixels (12) with further interference periods (p n ).
  • the ratio of the further interference period (p n ) to the other interference periods is preferably in the range from 20:1 to 1:20, preferably in the range from 10:1 to 1:10, particularly preferably in the range from 5:1 to 1 :5, especially 3:1 to 1:3, which means the Properties defined herein, in particular the anti-glare properties of the substrate, can be optimized.
  • a value from a random generator is multiplied or correlated with a predetermined offset.
  • inhomogeneous patterns with a local periodicity within the interference pixels but with a global inhomogeneity can be generated. This advantageously improves the anti-glare properties of the structured substrate and advantageously leads to a reduction in undesirable effects, such as the moiré effect.
  • a possible variant provides that the offset is selected when applying at least 10, preferably at least 30 interference pixels, so that at least five different values of the offset occur between adjacent interference pixels.
  • the resulting inhomogeneity of the structure further improves the anti-glare properties of the structured substrate and advantageously leads to a reduction in undesirable effects, such as the moiré effect.
  • the inventors have also found that a modification of the structural parameters selected from the group comprising the interference period of the interference pixel, the structural depth of the inverse cones, the diameter of the inverse cones, the shape of the inverse cones and the size of the inverse cones results in an asymmetry preferred herein ( Non-periodicity) within the global point structure and thus contributes to a desired asymmetry of the roughened structure. It can thus be provided that the aforementioned structural parameters of individual pixels of a type of interference pixel arranged adjacently and repetitively offset from one another, for example the pixels of the first interference pixel, are modified alternately or successively, for example gradually.
  • each subsequent pixel has a varying, for example gradually increasing, pulse energy (in the range as defined herein) and/or a gradually increasing pulse duration or pulse width (as defined herein) on the surface of the substrate or in the volume of the substrate is applied.
  • the rotation of a subsequent pixel to the neighboring, previous pixel cannot occur successively (i.e. uniformly), but rather occur alternately within the angular range defined herein, for example first in one direction and then in another or the same direction, each with the same or a different angular displacement.
  • At least a partial beam i.e. such a part of the laser beam, which emerges from the laser beam source as a result of the laser beam passing through , formed by the beam splitter element, to modify, “disturb” its beam path and/or rotate its polarization plane.
  • a diffuser (17) can be provided which is arranged in at least one beam path of a partial beam, preferably not in every beam path of the partial beams, preferably in a beam path up to (n-1) beam paths, where n is the number of partial beams generated in the application process is.
  • rotation diffusers are suitable for this.
  • the use of a diffuser in at least one beam path of a partial laser beam has the advantage that the interference pattern of the interference pixel is easily disturbed or broken up. However, the interference pattern of the interference pixel is still periodic. This is a path length-dependent effect that influences the interference pattern of the interference pixel more pronounced the further away the diffuser is from the substrate to be structured.
  • the diffuser is arranged in the beam path of at least one partial beam in an area after the beam splitter element and immediately after the focusing element, preferably immediately before the focusing element or immediately after the focusing element.
  • the diffuser is particularly preferably arranged directly in front of the focusing element.
  • a polarization-rotating element can be provided in the beam path after the beam splitter element.
  • Polarization rotating elements are known to those skilled in the art and are, for example, selected from the group comprising a rotating lambda half plate, a stationary adjustable lambda half plate, a rotating lambda quarter plate, radial polarizers, cone polarizers, birefringent plates, polarization beam splitters.
  • the polarization rotating element is a rotating lambda half plate, a stationary adjustable lambda half plate, a rotating lambda quarter plate.
  • the polarization rotating element is in the beam path of at least one laser (partial) beam in the area after the beam splitter element and immediately after Focusing element, preferably arranged immediately before the focusing element or immediately after the focusing element.
  • the diffuser is particularly preferably arranged directly in front of the focusing element.
  • the structured substrate is post-treated according to the structuring process, for example thermally post-treated (annealed), in order to heal structural defects that can arise on the surface or in the volume of the substrate as a result of the laser structuring.
  • a structured glass substrate can be formed using the structuring process at a temperature between 100 ° C and 700 ° C, preferably between 150 ° and 450 ° C, but at a temperature below the glass transition temperature (T g ), preferably at temperatures from 50 ° C to 100 ° C below the glass transition temperature (lower cooling temperature of the transformation range).
  • the glass transition temperature for borosilicate glasses and soda-lime glasses is around 500°C, for lead glasses it is around 400°C and for aluminosilicate glasses (e.g. gorilla glass) it is around 800°C.
  • the specific values for the glass transition temperature of a substrate can be found in relevant tables or determined by methods known to those skilled in the art, such as dynamic mechanical analysis (DMA), dynamic differential calorimetry (DSC) or dielectric relaxation spectroscopy.
  • DMA dynamic mechanical analysis
  • DSC dynamic differential calorimetry
  • dielectric relaxation spectroscopy the thermal post-treatment can influence the molecular structure of the substrate in such a way that its hardness, particularly on the surface of the substrate, is higher than in its core layers. Such structural transformation processes, for example, lead to differences in the density of the glass between its inner and outer layers.
  • Such a thermal post-treatment to increase the hardness of the substrate also has the advantage that a substrate that is not initially post-treated and has a lower hardness than the post-treated substrate can be processed/structured more easily using a method for structuring it, for example lower energies and laser pulse durations are required than for a post-treated substrate.
  • a thermal aftertreatment is also suitable for polymers, for example polyvinyl chloride (temperature recommendation: 60°C), acrylonitrile, styrene or polymethyl methacrylate (80°C), polyvinylidene fluoride (150°C), polysulfone (165°C), polyphenylene sulfide (200°C). C), polyetheretherketone (200°C), especially examples such as acrylic glass/Plexiglass® (70-80°C).
  • T g glass transition temperature
  • the pixel density Pd i.e. the distance in the a
  • Pd the distance in the a
  • f the frequency of the laser radiation source (1)
  • v Interference pixels with the width D
  • p d V /f
  • the same interference pixels are irradiated several times. This makes it possible to increase the depth of the resulting microstructures and/or to adjust it precisely with lower energies without exposing the substrate to high energy densities.
  • Multiple irradiation of a substrate is particularly suitable for producing hierarchical structures.
  • Multiple irradiation of the same interference pixel causes at least partial melting of the substrate material, with a wave structure being formed during the structuring process, ie when a laser pulse hits it, as a result of the appearance of a region of high intensity.
  • the structuring in particular the wave structure, is formed through a self-organization process.
  • the wave structure superimposes a periodic point structure in the micrometer or submicrometer range, which can be generated using laser interference structuring.
  • a hierarchical structuring in a substrate can thus be created in one process step.
  • multiple irradiation preferably 2-fold to 400-fold, in particular 20-fold to 300-fold, particularly preferably 50-fold to 200-fold, is carried out on the same interference pixel on the substrate, whereby a wave structure (like defined herein), in particular a periodic point structure is formed from superimposed structures, with at least one structure having dimensions in the submicrometer range, in particular a quasi-periodic wave structure, and with at least one structure being formed from inverse cones.
  • a wave structure like defined herein
  • a periodic point structure is formed from superimposed structures, with at least one structure having dimensions in the submicrometer range, in particular a quasi-periodic wave structure, and with at least one structure being formed from inverse cones.
  • the time offset between the individual pulses is particularly preferred in the range of the pulse duration of the laser pulse, preferably in the range from 1 fs to 100 ns, particularly preferably in the range from 10 fs to 1 ns, very particularly preferably in the range from 10 fs to 15 ps.
  • Laser interference structuring device preferably in the range from 1 fs to 100 ns, particularly preferably in the range from 10 fs to 1 ns, very particularly preferably in the range from 10 fs to 15 ps.
  • the present invention also relates to a laser interference structuring device for direct laser interference structuring of a substrate, examples of which include flat and/or transparent substrates
  • a beam splitter element (2) which is arranged in the beam path (3) of the laser beam, in particular in the beam path (3) of the laser beam emitted by the laser radiation source (1),
  • the beam splitter (2) is freely movable along its optical axis in the beam path (3), and wherein the beam splitter (2) is designed to divide the incident laser beam, which is emitted by the laser radiation source (1), into at least 3, preferably at least 4 partial beams, in particular 4 to 8, i.e. 4, 5, 6, 7, or 8 partial beams.
  • the beam splitter (2) is particularly preferably set up in such a way that it divides the incident laser beam into an even multiple, i.e. 4, 6 or 8 partial beams, most preferably 4 partial beams.
  • a beam splitter (2) can be provided such that it comprises a first beam splitter and at least one further beam splitter arranged downstream of the first beam splitter, the first beam splitter dividing the incident laser beam into at least 2 partial beams and the further beam splitter into at least one Beam path of a partial beam is arranged and divides this partial beam into at least 2 partial beams as it passes through.
  • the laser beam emitted by the laser radiation source is divided by the beam splitter element (2) into at least 3, preferably at least 4 partial beams.
  • the beam splitter element (2) Only two-beam interference is known from the prior art (ie structuring by means of interference of two partial beams). However, such two-beam interference only creates line structures on the substrate.
  • the partial beams are then deflected by the focusing element (4) in such a way that they interfere in an interference region on the surface or inside of a substrate (5), preferably a flat and/or transparent substrate.
  • the advantage of the device defined herein is that this device and the method that can be implemented with its help in the structuring of substrates, in particular in the production of a structure with anti-reflection properties, makes it possible to dispense with the use of chemicals and their time-consuming disposal. In addition, the cleaning of the substrates can be dispensed with.
  • a wide number of substrates preferably flat and/or transparent substrates, in particular transparent materials, can be processed with the device. Since the process does not depend on the refractive index or the adhesion of certain coating materials to the substrate, this process is more flexible than conventional chemical processes.
  • the processing time according to this method is significantly shorter, since the periodicity of the structures is ensured by the interference of the incident, at least 3, preferably at least 4 partial beams in an interference region, and not comes about through more time-consuming self-organization processes.
  • Another advantage over conventional methods is that the shape (structural design; geometry) of the micro/nanostructures produced can be controlled.
  • the structures in the geometry can be controlled by the number of interfering (partial) beams, their polarization, and the setting of the process parameters, thereby specifically influencing the anti-reflection properties.
  • the stability of the dot structure created in this way should be mentioned, which is more durable compared to conventional coatings because it cannot detach from the substrate to be coated over time and the use-related stress on the material.
  • the resulting structuring i.e. the dot structure of the structured substrate
  • the resulting structuring is less sensitive to impacts and abrasion than conventional coatings.
  • the inventors have discovered that structuring (also referred to herein as texturing) inside the material (i.e. below the surface) does not necessarily produce anti-reflection properties.
  • the texturing inside the material is interesting for other areas of application, such as product protection, optical data storage, decoration, etc.
  • the structure of the device disclosed herein or the arrangement of the optical component enables substrates with very high structuring rates of up to 4.0 m 2 /min, in particular in the range from 0.01 to 4.0 m 2 / min, particularly preferably in the range from 0.05 to 3.5 m 2 /min, very particularly preferably in the range from 0.1 to 3.0 m 2 /min.
  • This is ensured by the fact that the area in which the at least three partial beams are superimposed can be expanded by a preferred selection of optical elements, whereby a large area can be irradiated in one processing step.
  • no strong focusing is necessary to produce high-resolution features.
  • the present invention also includes the use of the structured substrate as anti-glare glazing for monitors, screens and displays or in photovoltaic systems.
  • the structured substrate can also be, for example, a film that is used to subsequently apply a structure defined herein to existing systems.
  • structured substrate defined herein is intended to be used as a negative mold for indirectly applying or producing structures on another substrate.
  • Fig. 1 a cumulative structure of the point structure from a superposition of several interference pixels
  • Fig. 3 different patterns of a dot structure which are applied by adjacent, repetitively offset pixels of a type of interference pixel.
  • Fig. 4 a schematic perspective view of a device according to the invention.
  • Fig. 5 a schematic perspective view of a device according to the invention, which contains a deflection element (6) for parallelizing the partial beams.
  • Fig. 6 a schematic perspective view of a device according to the invention, which contains a deflection element (7) for widening the angle of the partial beams to the optical axis of the beam path (3).
  • a diffuser (17) is arranged in a beam path of a partial beam.
  • Fig. 7A a schematic perspective view of a device according to the invention, which contains optical elements (6) with a planar, reflecting surface that deflect the partial beams onto the focusing element (4).
  • Fig. 7B a schematic perspective view of a device according to the invention, which comprises a galvo mirror (9) as an optical element for beam shaping, which allows a stationary positioning of the substrate to be structured during the structuring process.
  • Fig. 8 a schematic perspective view of a device according to the invention, the device containing a polarization element (8), which shifts the phase profile of the partial beams relative to one another or modifies the beam before splitting into partial beams, where A) the beam splitter element (2) is positioned in the beam path (3) close to the laser radiation source (1).
  • the beam splitter element (2) is positioned in the beam path (3) close to the deflection element (7).
  • the polarization element (8) is positioned in front of the beam splitter element (2).
  • Fig. 9 a schematic view of the interference pixels resulting on the surface or inside the substrate with the width D, and the distribution of the individual interference pixels on the surface or inside the substrate, the interference pixels being shifted relative to one another with the pixel density Pd.
  • Fig. 10 a schematic perspective view of the structured substrate (5) with the generated periodic point structures, consisting of inverse cones, with dimensions in the micro- and sub-micrometer range, and symbolically the transmission of incident electromagnetic waves with wavelengths greater than the structure period of the generated structures , as well as the diffraction of incident electromagnetic waves with wavelengths in the range or smaller of the structures created.
  • Fig. 11 a schematic perspective view of a device according to the invention, which contains as an optical element a galvo mirror (9) with a planar, reflecting surface, which deflects the partial beams onto the focusing element (4), and a polygon wheel (9.1).
  • a galvo mirror 9 with a planar, reflecting surface, which deflects the partial beams onto the focusing element (4), and a polygon wheel (9.1).
  • Fig. 12 A graphical representation of the diffraction angle of incident light versus the wavelength of the incident light for structured substrates with three different feature widths.
  • Fig. 13 a schematic perspective view of the structured substrate (5) with the periodic point structures created, consisting of inverse cones, with dimensions in the micrometer range, on which a periodic wave structure in the submicrometer range is superimposed.
  • Fig. 1 visualizes the cumulative structure of the point structure from a superposition of several interference pixels (10, 11, 12, 13).
  • Each interference pixel (10, 11, 12, 13) consists of several inverse cones (14) introduced into the substrate using laser interference structuring.
  • Partial image (A) shows the first interference pixel (10), which has several inverse cones (14, 14.1).
  • Partial image (B) visualizes an overlay of the first Interference pixel (10) and the second interference pixel (11), this superposition consisting of inverse cones (14.1) of the first interference pixel (10) and inverse cones (14.2) of the second interference pixel (11).
  • Partial figure (C) visualizes an overlay in which a third interference pixel (12) is also superimposed on the first two interference pixels (10, 11).
  • the superimposed structure in partial image (C) thus has inverse pegs (14.1) of the first interference pixel (10), inverse pegs (14.2) of the second interference pixel (11) and inverse pegs (14.3) of the third interference pixel (12).
  • the third interference pixel (12) is shifted to the second interference pixel (11) in the same spatial direction along the x-axis as the second interference pixel (11) to the first interference pixel (10).
  • Partial image (D) shows an overlay in which a fourth interference pixel (13) is also superimposed, this being shifted in a different spatial direction along the y-axis compared to the third interference pixel (12).
  • the section in partial image (D) therefore has a dot structure consisting of an overlay of four interference pixels (10, 11, 12, 13).
  • the graphs which are arranged below the interference pixels (10, 11, 12, 13), serve to visualize the periodic structures within an interference pixel (10, 11, 12, 13). Due to the creation of the interference pixels (10, 11, 12, 13) via the process of laser interference structuring, i.e. according to the interference image of the laser (partial beams), each individual interference pixel (10, 11, 12, 13), which is within an illumination - or irradiation process within a selected pulse duration, a periodic arrangement of the inverse cones (14). The distance between the inverse cones (14.1) of the first interference pixel (10), which results from the distance between the intensity maxima of the interference image generating the first interference pixel (10), represents the interference period (pi).
  • the intensity corresponds to that for generating the inverse cones (14.1) necessary intensity in the interference pattern of the laser (partial) beams.
  • the distance between the intensity maxima of the interference image therefore corresponds to the interference period (pi).
  • the second interference pixel (11) has a second interference period (P2).
  • Fig. 2 shows a point structure (16), which is formed from the superposition of several first interference pixels (10) with a first interference period (pi) and several second interference pixels (11) with a second interference period (p 2 ).
  • the first interference pixels (10) have inverse cones (14.1), which are shown here with a vertical pattern filling.
  • the second interference pixels (11) have inverse cones (14.2), which are shown with a horizontal pattern filling.
  • the interference period (pi) of the first interference pixel (10) is smaller than the second interference period (p 2 ) of the second interference pixel (11).
  • the area of the interference pixels (10, 11) consequently varies, which is the case here the circles are visualized.
  • One of the first interference pixels (10) is shown schematically here by all inverse cones (14.1) with vertical pattern filling within the smaller circle.
  • One of the second interference pixels is in turn visualized within the larger circle by the inverse cones (14.2), which are shown with a horizontal pattern structure.
  • the plurality of first interference pixels (10) are arranged adjacent to one another in a repetitive manner and the plurality of first interference pixels (10) thereby form a pattern with the interference period (pi). Furthermore, the plurality of the second interference pixels (11) are arranged adjacently and repetitively offset from one another and the plurality of the second interference pixels (11) thus form a pattern with the second interference period (p 2 ) which differs from the first interference period (pi).
  • the graph arranged below the dot structure (16) visualizes the arrangement of the inverse cones (14.1, 14.2) along a line through the dot structure (16).
  • the intensity maxima correspond to the center of the inverse cones (14.1, 14.2).
  • this graph serves to illustrate the principle.
  • the intensity corresponds to the intensity in the interference pattern of the laser (partial) beams necessary to generate the inverse cones (14.1, 14.2).
  • Fig. 3 shows (independently) two different patterns of a dot structure which are applied to the surface of a substrate by pixels of a type of interference pixel (represented by a dashed circle) which are arranged adjacently and repetitively offset from one another and which form inverse cones (14.1) within this surface.
  • the top pattern shows a dot structure in which the interference period of each pixel increases distinguishes between the adjacent, preceding and the adjacent, subsequent pixels of a type of interference pixel.
  • the bottom pattern shows a dot structure in which each pixel is twisted to the preceding and adjacent subsequent pixels.
  • a laser radiation source (1) for emitting a laser beam.
  • a beam splitter element (2) Arranged in the beam path (3) of the laser beam behind the laser radiation source (1), there is a beam splitter element (2), which is movably arranged in the beam path (3).
  • a focusing element (4) is located in the beam path (3) of the laser beam behind the beam splitter element (2).
  • a holding device Arranged in the beam path (3) of the laser beam behind the focusing element (4) is a holding device on which a substrate (5), preferably a flat and/or transparent substrate, is mounted.
  • the laser radiation source (1) emits a pulsed laser beam.
  • the laser radiation source here is a UV laser with a wavelength of 355 nm and a pulse duration of 12 ps.
  • the radiation profile of the laser radiation source corresponds to a top hat profile in this embodiment.
  • the beam splitter element (2) corresponds to a diffractive beam splitter element.
  • a diffractive beam splitter element is a beam splitter element that contains micro- or nanostructures.
  • the beam splitter element (2) divides the laser beam into 4 partial beams.
  • the focusing element (4) corresponds to a refractive, spherical lens, which directs the partial beams, which run essentially parallel to one another, onto the substrate (5), preferably a flat and/or transparent substrate, in such a way that they interfere there in an interference region.
  • the interference angle 0 corresponds to 27.2°, which results in a structure period of 550 nm for the periodic point structure in the same polarization state.
  • the flat substrate is irradiated once, so that there is a processing time per structural unit, i.e. H. per interference pixel, of 12 ps.
  • the substrate (5) preferably a flat and/or transparent substrate, is a glass, especially a quartz glass, which is mounted on a holding device so that it is in the xy plane, perpendicular to the beam path of the laser radiation source ( 1) emitted laser beam is movable.
  • Fig. 5 visualizes the device as described in Fig. 4, additionally comprising a deflection element (6), which is located in the beam path (3) of the laser after the beam splitter element (2) and the focusing element (4).
  • the deflection element is a conventional, refractive, convex lens.
  • the partial beams impinge on the deflection element (6) in such a way that they run essentially parallel to one another after passing through the deflection element. This allows the point at which the partial beams interfere on the surface or inside the substrate to be adjusted.
  • this structure includes a further deflection element (7), which is arranged in the beam path (3) of the laser between the beam splitter element (2) and the deflection element (6).
  • the further deflection element (7) is a conventional, refractive, concave lens.
  • the partial beams hit the further deflection element in such a way that their angle to the optical axis of the beam path is widened. This makes it possible to change the interference angle with which the partial beams interfere on the surface or inside the substrate, preferably a flat and/or transparent substrate.
  • all optical elements apart from the beam splitter element (2) are fixed along the optical axis of the beam path (3).
  • the interference angle of the partial beams on the substrate is adjusted by moving the beam splitter element (2) along the optical axis of the beam path.
  • a diffuser (17) is arranged in a beam path of a partial beam.
  • the interference pattern of the interference pixel can be easily disturbed or broken up (which is shown in FIG. 6B in such a way that the upper partial beam is shown to be thicker than the lower partial beam after leaving the diffuser).
  • FIG. 7A shows, in a further exemplary embodiment, a device as in FIG. 6, comprising the optical elements (6) with a planar, reflecting surface, which are set up in such a way that they deflect the partial beams onto the focusing element (4).
  • the at least three partial beams are directed onto the substrate at a preferred angle by moving the optical elements (6).
  • a deflection element in the form of a lens reference number (6) in Fig. 6 can be dispensed with.
  • Fig. 8 visualizes a device as in Fig. 6, additionally comprising one polarization element (8) per partial beam, which are arranged in the beam path (3) of the laser beam between the deflection element (6) and the focusing element (4). a polarization element (8) in front of the beam splitter element (2).
  • the polarization element is arranged in FIGS. 8A and 8B in such a way that it changes the polarization of the individual partial beams relative to one another in such a way that a change in the interference pattern results.
  • Fig. 8A the beam splitter element (2) is positioned in the beam path (3) close to the laser radiation source (1).
  • Fig. 8B the beam splitter element (2) is positioned in the beam path (3) close to the deflection element (7). In this way, the interference pattern of the interfering partial beams on the surface of the substrate (5) can be adjusted continuously without the other optical elements in the structure or the substrate having to be moved.
  • FIG. 8C shows an embodiment in which a polarization element (8) is arranged in front of the beam splitter element (2), so that the beam is modified before it is split into partial beams (3).
  • a circular polarization element (8) is preferably used.
  • Self-organization processes can advantageously be initiated by means of the interference of circularly polarized light.
  • the arrangement could contain an additional optical element for beam shaping, which is arranged downstream of the laser radiation source (1) in the beam path (3) of the laser beam.
  • the radiation profile of the laser radiation source corresponds to a Gaussian profile.
  • the optical beam shaping element converts this profile into a top hat profile.
  • the pixel density P d is smaller than the width of an interference pixel, D.
  • Fig. 10 visualizes the structured substrate (5) produced by the method according to the invention with the periodic point structures produced, consisting of inverse cones, with dimensions in the micro and submicrometer range. It also symbolically illustrates the transmission of incident electromagnetic waves with wavelengths larger than the structural period of the generated structures, as well as the diffraction of incident electromagnetic waves with wavelengths in the range or smaller of the generated structures.
  • Fig. 11 shows a device as in Fig. 7B, comprising the optical element (9.1) with a planar, reflecting surface, which is a polygonal wheel which is set up in such a way that it rotates about an axis shown .
  • the incident partial beams are deflected in such a way that they hit a galvo mirror (9), which directs the beams onto the substrate via a focusing element (4).
  • the rotation of the polygon wheel causes the point at which the rays are focused on the substrate to move along a line during the exposure process.
  • the partial beams scan the substrate, which leads to increased process speed.
  • Fig. 12 shows a graphic representation of the transmission or diffraction ability of a structured substrate depending on the structure width.
  • the diffraction angle of light is shown depending on its wavelength for structures with three different structural widths. If the wavelength of the incident light is greater than the structure width, the light is completely transmitted. At wavelengths in the range of the structural width or smaller, diffraction occurs. The diffraction angles can be seen from the graphic.
  • Fig. 13 visualizes the structured substrate (5) produced by the method according to the invention with the periodic point structures produced, consisting of inverse cones, with dimensions in the micrometer range. Superimposed on this periodic point structure in the micrometer range is a periodic wave structure in the submicrometer range, which can also be generated in one production step by the method according to the invention described herein.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laminated Bodies (AREA)

Abstract

La présente invention concerne le domaine des substrats de formation de motifs avec des motifs de points dans la plage micrométrique ou submicrométrique, plus particulièrement un substrat à motifs ayant des propriétés antireflet, qui a un motif de points. La présente invention concerne également un dispositif et un procédé de formation de motifs de surfaces et l'intérieur d'un substrat transparent au moyen d'une formation de motifs d'interférence laser. La formation de motifs ainsi générée avec des motifs de points dans la plage micrométrique ou submicrométrique est caractérisée par des propriétés antireflet prononcées.
PCT/EP2023/064063 2022-05-25 2023-05-25 Substrat ayant des propriétés antireflet Ceased WO2023227720A1 (fr)

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LULU102956 2022-05-25

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060092495A1 (en) 2004-10-28 2006-05-04 Fuji Photo Film Co., Ltd. Anti-glare anti-reflection film, polarizing plate, and image display device
DE102010005774A1 (de) 2009-08-17 2011-03-03 Topag Lasertechnik Gmbh Vorrichtung zur Strahlformung eines Laserstrahls
EP2431120A1 (fr) 2010-09-16 2012-03-21 Valstybinis moksliniu tyrimu institutas Fiziniu ir technologijos mokslu centras Méthode de formation de structures périodiques dans des films minces utilisant des faisceaux laser interférants
DE102011101585A1 (de) 2011-05-12 2012-11-15 Technische Universität Dresden Verfahren zur Herstellung von Leuchtdioden oder photovoltaischen Elementen
EP2663892A2 (fr) 2011-01-10 2013-11-20 LIMO Patentverwaltung GmbH & Co. KG Dispositif de conversion du profil d'un faisceau laser en un faisceau laser à répartition d'intensité symétrique en rotation
WO2015002042A1 (fr) 2013-07-05 2015-01-08 株式会社カネカ Film antireflet pour module de piles photovoltaïques, module de piles photovoltaïques équipé du film antireflet et procédé de fabrication associé
WO2016086079A1 (fr) 2014-11-25 2016-06-02 Ppg Industries Ohio, Inc. Écrans tactiles antireflet et autres articles revêtus, et leurs procédés de formation
WO2019166836A1 (fr) 2018-02-28 2019-09-06 Foundation For Research And Technology Hellas Utilisation de lasers pour réduire la réflexion de solides transparents, revêtements et dispositifs utilisant des solides transparents

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060092495A1 (en) 2004-10-28 2006-05-04 Fuji Photo Film Co., Ltd. Anti-glare anti-reflection film, polarizing plate, and image display device
DE102010005774A1 (de) 2009-08-17 2011-03-03 Topag Lasertechnik Gmbh Vorrichtung zur Strahlformung eines Laserstrahls
EP2431120A1 (fr) 2010-09-16 2012-03-21 Valstybinis moksliniu tyrimu institutas Fiziniu ir technologijos mokslu centras Méthode de formation de structures périodiques dans des films minces utilisant des faisceaux laser interférants
EP2663892A2 (fr) 2011-01-10 2013-11-20 LIMO Patentverwaltung GmbH & Co. KG Dispositif de conversion du profil d'un faisceau laser en un faisceau laser à répartition d'intensité symétrique en rotation
DE102011101585A1 (de) 2011-05-12 2012-11-15 Technische Universität Dresden Verfahren zur Herstellung von Leuchtdioden oder photovoltaischen Elementen
WO2015002042A1 (fr) 2013-07-05 2015-01-08 株式会社カネカ Film antireflet pour module de piles photovoltaïques, module de piles photovoltaïques équipé du film antireflet et procédé de fabrication associé
WO2016086079A1 (fr) 2014-11-25 2016-06-02 Ppg Industries Ohio, Inc. Écrans tactiles antireflet et autres articles revêtus, et leurs procédés de formation
WO2019166836A1 (fr) 2018-02-28 2019-09-06 Foundation For Research And Technology Hellas Utilisation de lasers pour réduire la réflexion de solides transparents, revêtements et dispositifs utilisant des solides transparents

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