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WO2023219248A1 - Dispositif d'affichage à del comprenant des éléments micro-del empilés et son procédé de fabrication - Google Patents

Dispositif d'affichage à del comprenant des éléments micro-del empilés et son procédé de fabrication Download PDF

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WO2023219248A1
WO2023219248A1 PCT/KR2023/003375 KR2023003375W WO2023219248A1 WO 2023219248 A1 WO2023219248 A1 WO 2023219248A1 KR 2023003375 W KR2023003375 W KR 2023003375W WO 2023219248 A1 WO2023219248 A1 WO 2023219248A1
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micro led
electrode layer
led elements
electrode
substrate
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Korean (ko)
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진정근
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Advanced View Technology
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Advanced View Technology
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    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
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    • H10H29/30—Active-matrix LED displays
    • H10H29/32—Active-matrix LED displays characterised by the geometry or arrangement of elements within a subpixel, e.g. arrangement of the transistor within its RGB subpixel
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    • H10H20/80—Constructional details
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    • H10H29/851—Wavelength conversion means
    • H10H29/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H29/8512—Wavelength conversion materials

Definitions

  • the present invention relates to an LED display device with excellent brightness and resolution by stacking micro LED elements spaced apart from each other so that the longitudinal direction of the micro LED elements is parallel to the plane of the substrate, thereby integrating a large number of micro LED elements relative to the area, and to a method of manufacturing the same.
  • a display device can display a screen using a plurality of pixels that make up a panel. Each pixel is divided into subpixels that emit a single color of R (Red), G (Green), and B (Blue), and can emit all colors from true black to white depending on the intensity of each R, G, and B light. can be expressed.
  • one pixel requires at least one micro LED element capable of expressing each of R, G, and B.
  • Micro LED devices generally refer to LEDs with a side length of 100 ⁇ m or less. This corresponds to a size of about 1/10 or less compared to a general LED device.
  • Micro LED devices are known to have excellent durability because they are formed based on inorganic materials such as GaN and AlGaInP. Additionally, micro LED devices have the advantage of low heat generation and power consumption due to their small size.
  • micro LED elements can be arranged in a horizontal structure between electrodes on a substrate to form one pixel (PXL, light source). For example, when a driving current flows through one pixel, a micro LED element connected between electrodes may emit light.
  • PXL light source
  • the display device can display the screen as the micro LED element emits light.
  • the purpose of the present invention is to provide a method of manufacturing an LED display device that can improve brightness and resolution by integrating a large number of micro LED elements per unit area of the pixel.
  • Another object of the present invention is to provide a method of manufacturing an LED display device that can improve luminous efficiency without consuming more pixel area.
  • Another object of the present invention is to provide a method of manufacturing an LED display device that allows pixels to emit light even when defective pixels or transfer defects occur.
  • Another object of the present invention is to provide a method of manufacturing an LED display device that can minimize interference between pixels and increase the directivity of light in pixels.
  • Another object of the present invention is to provide a method of manufacturing an LED display device that can align one micro LED element per groove.
  • Another object of the present invention is to provide a method of manufacturing an LED display device that can form connection electrodes of as constant a shape as possible at once and has a simple process.
  • Another object of the present invention is to provide an LED display device manufactured according to the above manufacturing method, in which a plurality of micro LED elements are stacked with the longitudinal direction of the micro LED elements being parallel to the plane of the substrate.
  • the method of manufacturing an LED display device includes the steps of (a) forming a first insulating layer on a substrate where a first electrode layer and a second electrode layer are spaced apart from each other; (b) aligning the first micro LED elements on the first insulating layer corresponding to the area between the first electrode layer and the second electrode layer so that the longitudinal direction of the first micro LED elements is parallel to the plane of the substrate; (c) forming a second insulating layer on the substrate on which the first micro LED elements are aligned; (d) aligning the second micro LED elements on the second insulating layer corresponding to the area between the first electrode layer and the second electrode layer so that the longitudinal direction of the second micro LED elements is parallel to the plane of the substrate; and (e) after patterning the first insulating layer and the second insulating layer so that the first electrode layer and the second electrode layer are exposed, a first connection electrode is deposited on one end of the plurality of stacked micro LED devices, and a first connection electrode is deposited on the other end.
  • the step (b) includes (b1) forming one or more first grooves in a region between the first electrode layer and the second electrode layer of the first insulating layer; and (b2) aligning one first micro LED element in each first groove so that the longitudinal direction of the first micro LED element is parallel to the plane of the substrate.
  • the step (d) includes (d1) forming one or more second grooves in a region between the first and second electrode layers of the second insulating layer; and (d2) aligning one second micro LED element for each second groove so that the longitudinal direction of the second micro LED element is parallel to the plane of the substrate.
  • steps (d) and (e) forming an insulating layer, and forming an insulating layer in the longitudinal direction of the micro LED device on the insulating layer corresponding to the area between the first electrode layer and the second electrode layer, are aligned with the plane of the substrate.
  • the step of aligning the micro LED elements so that they are parallel can be performed one or more times.
  • Step (e) can be performed in one of two ways.
  • the first method includes (e1) applying a photoresist on a substrate on which the plurality of stacked micro LED elements are arranged, and then removing portions of the photoresist corresponding to both ends of the plurality of micro LED elements; (e2) removing portions corresponding to both ends of the plurality of micro LED elements among the first and second insulating layers so that the first and second electrode layers are exposed; (e3) A first connection electrode is deposited to extend from one end of the plurality of micro LED elements in the direction of the first electrode layer, and a second connection electrode is deposited to extend from the other end in the second electrode layer direction, so that the plurality of micro LED elements Connecting one end to a first electrode layer and connecting the other ends of the plurality of micro LED elements to a second electrode layer; and (e4) removing all of the first and second insulating layers and the photoresist.
  • the second method is (e1) applying a first photoresist on a substrate on which the plurality of stacked micro LED elements are arranged, and then removing a portion of the first photoresist corresponding to both ends of the plurality of micro LED elements. ; (e2) removing portions of the first and second insulating layers corresponding to both ends of the plurality of micro LED elements so that the first and second electrode layers are exposed, and then removing the first photoresist; (e3) depositing a connection electrode on the front surface of the substrate on which the plurality of micro LED elements are arranged, connecting one end of the plurality of micro LED elements to the first electrode layer and connecting the other end of the plurality of micro LED elements to the second electrode layer.
  • the LED display device includes a first electrode layer and a second electrode layer spaced apart from each other on a substrate; A plurality of micro LED elements are stacked on the first electrode layer and the second electrode layer in a longitudinal direction parallel to the plane of the substrate, and spaced apart from each other; and a first connection electrode coupled to both ends of the plurality of micro LED elements, extending from one end of the plurality of micro LED elements in the direction of the first electrode layer and connected to the first electrode layer, and a second electrode layer from the other end of the plurality of micro LED elements. It may include a second connection electrode extending in one direction and connected to the second electrode layer.
  • the micro LED device may be in the form of a nanowire.
  • the manufacturing method of the LED display device of the present invention there is an effect of improving luminance and resolution by integrating a large number of micro LED elements per unit area.
  • the manufacturing method there is an advantage in that the pixel can emit light even if a defective pixel or transfer failure occurs.
  • the manufacturing method has the effect of minimizing interference between pixels and increasing the directivity of light in pixels.
  • one micro LED element can be aligned per groove.
  • connection electrode of as constant shape as possible can be formed in a single process, and the process has the advantage of being simple.
  • the LED display device manufactured according to the manufacturing method of the present invention has a structure in which a plurality of micro LED elements are stacked with the longitudinal direction of the micro LED elements being parallel to the plane (bottom surface) of the substrate, thereby improving brightness and resolution. It has excellent effects.
  • FIG. 1 is a flowchart showing a method of manufacturing an LED display device including stacked micro LED elements according to the present invention.
  • Figure 2 shows the step (A) of aligning the first micro LED element on the first insulating layer without grooves and the step (B) of aligning the first micro LED element on the first insulating layer with grooves according to the present invention. This is a cross-sectional view for explanation.
  • Figure 3 is a plan view of Figure 2(B).
  • Figure 4 is a cross-sectional view illustrating the step (A) of forming a second insulating layer without grooves and the step (B) of forming a second insulating layer with grooves according to the present invention.
  • Figure 5 is a top view of Figure 4(B).
  • Figure 6 shows the step (A) of aligning the second micro LED element on the second insulating layer without grooves and the step (B) of aligning the second micro LED element on the second insulating layer with grooves according to the present invention. This is a cross-sectional view for explanation.
  • Figure 7 is a plan view of Figure 6.
  • Figures 8 and 9 are cross-sectional views viewed from the y-axis direction among the x, y, and z axes when there are two grooves according to the present invention.
  • Figure 10 is a cross-sectional view viewed from the y-axis direction among the x, y, and z axes when there are three grooves according to the present invention.
  • Figure 11 is a cross-sectional view viewed from the y-axis direction among the x, y, and z axes when there are four grooves according to the present invention.
  • Figure 12 is a cross-sectional view viewed from the y-axis direction among the x, y, and z axes when there are a plurality of grooves according to the present invention.
  • Figure 13 is a cross-sectional view for explaining the step of combining both ends of a plurality of micro LED devices according to the present invention to the first electrode layer and the second electrode layer in the first method.
  • Figure 14 is a cross-sectional view for explaining the step of combining both ends of a plurality of micro LED devices according to the present invention to the first electrode layer and the second electrode layer in the second method.
  • Figure 15 is a plan view of Figures 13 and 14.
  • Figure 16 is a cross-sectional view showing the luminous efficiency of the stacked micro LED device assembly according to the present invention.
  • Figure 17 is a cross-sectional view (A) and a plan view (B) showing the structure of the partition walls in the stacked micro LED device assembly according to the present invention.
  • Figure 18 is a cross-sectional view showing a structure in which a partition wall and a color conversion layer are arranged in a stacked micro LED device assembly according to the present invention.
  • top (or bottom) of a component or the arrangement of any component on the “top (or bottom)” of a component means that any component is placed in contact with the top (or bottom) of the component. Additionally, it may mean that other components may be interposed between the component and any component disposed on (or under) the component.
  • each component when a component is described as being “connected,” “coupled,” or “connected” to another component, the components may be directly connected or connected to each other, but the other component is “interposed” between each component. It should be understood that “or, each component may be “connected,” “combined,” or “connected” through other components.
  • a plurality of micro LED elements are aligned so that the longitudinal direction of the micro LED elements is parallel to the plane (bottom surface) of the substrate, and a plurality of micro LED elements are spaced apart and stacked in a direction perpendicular to the plane of the substrate.
  • FIG. 1 is a flowchart showing a method of manufacturing an LED display device including stacked micro LED elements according to the present invention.
  • the method of manufacturing the LED display device of the present invention includes forming a first insulating layer on a substrate where the first electrode layer and the second electrode layer are spaced apart from each other (S110), the first electrode layer and the second electrode layer Aligning the first micro LED elements on the first insulating layer corresponding to the area between them so that the longitudinal direction of the first micro LED elements is parallel to the plane of the substrate (S120), on the substrate where the first micro LED elements are aligned
  • the longitudinal direction of the second micro LED element is parallel to the plane of the substrate.
  • Aligning the LED elements (S140), patterning the first and second insulating layers so that the first and second electrode layers are exposed, and then depositing connection electrodes on both ends of the plurality of stacked micro LED elements. , It may include a step (S150) of connecting a plurality of stacked micro LED elements to the first electrode layer and the second electrode layer.
  • the first insulating layer 30 may be formed on the substrate 10 where the first electrode layer 20a and the second electrode layer 20b are spaced apart from each other.
  • the substrate may be a rigid substrate made of glass, a flexible substrate made of a thin film made of plastic or metal, or an active matrix backplane. Additionally, the substrate may be a transparent substrate, but is not limited thereto.
  • Transistors may be disposed on the substrate in each of a plurality of pixel areas defined by the intersection of data lines and gate lines.
  • the LED display device may have a structure in which micro LED elements are arranged on the same plane as the transistor, or the micro LED elements are arranged on the transistor.
  • the transistor may have a structure in which the first electrode layer and the second electrode layer are spaced apart from each other.
  • the circuit of a display device requires a lot of metal wiring because micro LED elements must be connected to electrodes. Accordingly, during the assembly process of micro LED devices using electric fields, parasitic electric fields may occur in unwanted places, so it is important to minimize this phenomenon.
  • a metal layer that acts as an electric field shielding layer and aligns the elements over the entire area to cover all elements of the circuit.
  • the metal layer may include one or more of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and Ti, and may include conductive oxides such as ITO, IZO, ZnO, and ITZO. Conductive polymers such as PEDOT may also be included.
  • first electrode layer 20a and the second electrode layer 20b on the substrate 10 it can be performed as follows.
  • region A corresponding to the position where the micro LED elements will be aligned is removed from the metal layer to form a first electrode layer and a second electrode layer spaced apart from each other.
  • area A may be in the form of a ditch with a short width and long length.
  • a photoresist can be applied on the metal layer, and area A of the metal layer can be removed using an etch mask and UV exposure.
  • Photoresist is a photoresist that is sensitive to light and contains organic solvents and polymer materials. After spin coating the photoresist, the organic solvent in the photoresist can be removed.
  • Photoresist (PR) can form patterns using light and is divided into negative PR and positive PR. Negative PR causes particles to clump together when exposed to light, so the part that does not receive light is removed when exposed to light. Positive PR breaks the polymer bonds when exposed to light, so only the portion that receives light is removed.
  • the thickness of the first electrode layer 20a and the second electrode layer 20b may be 10 to 200 nm, preferably 10 to 100 nm, but is not limited thereto.
  • the first insulating layer 30 may be formed on the substrate to cover both the first electrode layer 20a and the second electrode layer 20b.
  • a short circuit may occur as the micro LED elements are arranged between the first electrode layer and the second electrode layer.
  • the micro LED elements can be arranged even without the first insulating layer and the groove, there is a problem that the moment they are arranged, a high current flows and the micro LED elements are destroyed.
  • Figure 2 shows the step (A) of aligning the first micro LED element on the first insulating layer without grooves and the step (B) of aligning the first micro LED element on the first insulating layer with grooves according to the present invention.
  • This is a cross-sectional view for explanation
  • Figure 3 is a plan view of Figure 2(B).
  • the longitudinal direction of the first micro LED element 1ML can be aligned to be parallel to the plane of the substrate.
  • the first insulating layer 30 may have a flattened top surface without grooves as shown in FIG. 2(A), or may have a top surface with grooves as shown in FIG. 2(B).
  • the step of forming a first insulating layer with grooves involves forming one or more first grooves 32 in the area between the first electrode layer 20a and the second electrode layer 20b of the first insulating layer 30. It may include the step of aligning one first micro LED element (1ML) for each first groove (32) so that the longitudinal direction of the first micro LED element (1ML) is parallel to the plane of the substrate. there is.
  • the area between the first electrode layer and the second electrode layer is patterned to a certain thickness, thereby forming a first groove for inducing a strong electric field between the first electrode layer and the second electrode layer.
  • Patterning the first insulating layer does not mean removing all of the insulating material in the first groove, but leaving the lower part to a predetermined thickness and removing the upper part.
  • partial patterning can be performed by allowing more of the insulating material in the groove portion to be patterned.
  • Patterning may be performed using exposure and development, or may be performed using dry etching or wet etching.
  • the method of applying the insulator may be performed by plasma chemical vapor deposition (PECVD), physical vapor deposition (PVD), chemical vapor deposition (CVD), e-beam deposition, atomic layer deposition (ALD), or sputtering deposition, but is limited thereto. It doesn't work.
  • PECVD plasma chemical vapor deposition
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • ALD atomic layer deposition
  • sputtering deposition but is limited thereto. It doesn't work.
  • the grooves including the first groove 32 and the second groove 42 are A space where micro LED elements are aligned, It may be formed at regular intervals in the area between the first electrode layer and the second electrode layer.
  • the groove overlaps the area between the first electrode layer and the second electrode layer.
  • the first electrode layer and the second electrode layer located in the home area may be arranged to protrude toward each other.
  • This structure has the advantage of accurately aligning the micro LED elements because the electric field due to voltage application is formed more intensively in the protruding area.
  • the length (d 1 ) of the micro LED device is preferably greater than the width (d 2 ) of the area between the first electrode layer and the second electrode layer. It is preferable that the width (d 3 ) of the first groove is larger than the length (d 1 ) of the micro LED device and larger than the width (d 2 ) of the area between the first electrode layer and the second electrode layer.
  • the width (d 3 ) of the first groove may be the same or similar to the width of the second groove.
  • the thickness of the first insulating layer before patterning may be approximately 100 to 600 nm, preferably 100 to 400 nm, but is not limited thereto.
  • the thickness of the first insulating layer between the groove and the first electrode layer and the second electrode layer may be approximately 10 to 400 nm, preferably 10 to 200 nm, more preferably 10 to 100 nm, and 10 to 50 nm. It is not limited.
  • the step of aligning the first micro LED elements involves supplying a fluid containing the first micro LED elements (1ML) on the substrate 10 and sending an electrical signal to the first electrode layer 20a and the second electrode layer 20b. By applying and generating an electric field, one first micro LED element (1ML) can be aligned in each first groove (32).
  • the fluid when an electric signal is applied by an electric signal supply unit (not shown), the fluid may be a liquid with a lower dielectric constant than that of the first micro LED element.
  • the fluid may be a liquid containing one or more of isopropyl alcohol, acetone, toluene, ethanol, methanol, and distilled water.
  • the electric signal supply unit applies voltage to the first electrode layer and the second electrode layer to generate an electric field between the first electrode layer and the second electrode layer.
  • one of the plurality of micro LED elements included in the fluid may be arranged inside the first groove so that the longitudinal direction of the first micro LED element is parallel to the plane of the substrate due to the attractive force of the electric field.
  • the negatively charged end of the first micro LED element may be located in the first groove in the direction of the first electrode layer. Additionally, the other positively charged end of the first micro LED element may be located in the first groove in the direction of the second electrode layer.
  • the first electrode layer and the second electrode layer may serve to generate an electric field and at the same time serve as an electric field shielding layer for other circuits under the first electrode layer and the second electrode layer.
  • the electrical signal supply unit may supply a direct current signal, an alternating current signal, or a pulsed DC signal to the first electrode layer and the second electrode layer.
  • the electric signal supply unit may supply a pulse direct current signal to the first electrode layer and the second electrode layer so that the arrangement direction of the micro LED elements in each groove is constant.
  • a pulse direct current signal refers to a periodic electrical signal whose value changes but whose polarity remains constant.
  • the electrical signal supply unit may generate a pulse direct current signal by adding a bias direct current signal to the alternating current signal.
  • the first micro LED device (1ML), the second micro LED device (2ML),... , the nth micro LED device (nML) is an ultra-small light emitting material whose longest side is approximately 100 ⁇ m or less.
  • These micro LED devices are made of organic and/or inorganic materials dispersed in a fluid and have various sizes in 1D, 2D or 3D shapes.
  • Micro LED devices can be in the form of long nanowires, flat disks, or cubes with an aspect ratio of 1 to 2.
  • the micro LED device may be a device in the form of a nanowire with a high aspect ratio and a length of 1 to 100 ⁇ m, and preferably a device with a length of 1 to 80 ⁇ m.
  • the nanowire-shaped micro LED device may have an aspect ratio of approximately 1 to 10, preferably 1 to 5. Additionally, the micro LED device in the form of a nanowire may have a cross-sectional diameter of approximately 10 to 10,000 nm, preferably 10 to 1,000 nm.
  • Micro LED devices with a high aspect ratio have a large surface area, so they have the advantage of excellent energy transfer and performance, as well as high transparency.
  • the micro LED device of the present invention has the same configuration as a commonly used LED and may include an n-type semiconductor layer, a p-type semiconductor layer, and an active layer disposed between the n-type semiconductor layer and the p-type semiconductor layer.
  • the micro LED device may further dispose a transparent electrode for current dispersion on the side of the p-type semiconductor layer with relatively high resistance, but is limited to this. It doesn't work.
  • the transparent electrode is made of at least one type of metal such as Al, Cu, Cr, Ni, or/and transparent conductive oxide (TCO) material such as ITO (Indium Tin Oxide) and FTO (Fluorine-doped Tin Oxide). It can be included.
  • TCO transparent conductive oxide
  • micro LED device a detailed description of the micro LED device will be omitted.
  • high brightness and high resolution can be achieved by stacking a plurality of micro LED elements in a vertical direction with respect to the substrate plane and integrating a large number of micro LED elements relative to the area.
  • the step of forming an insulating layer and then aligning the micro LED elements may be performed repeatedly. Specifically, the following steps may be performed.
  • Figure 4 is a cross-sectional view illustrating the step (A) of forming a second insulating layer without grooves and the step (B) of forming a second insulating layer with grooves according to the present invention
  • Figure 5 is a cross-sectional view of Figure 4 (B). ) is a floor plan.
  • the second insulating layer 40 is disposed on the entire surface to cover the first insulating layer 30 and the first micro LED element (1ML), and the second insulating layer 40 is placed on the first insulating layer. It can be flattened.
  • the thickness of the second insulating layer 40 is shown to be thinner than the thickness of the first insulating layer 30 in the drawings of the present invention, this corresponds only to one embodiment and is not limited thereto.
  • the step of forming the second insulating layer may be the same or similar to the step of forming the first insulating layer.
  • the second insulating layer 40 may have a flat top surface without grooves, as shown in FIG. 4 (A), or may have a top surface with grooves, as in FIG. 4 (B).
  • the step of forming the second insulating layer with grooves involves forming one or more second grooves 42 in the area between the first electrode layer 20a and the second electrode layer 20b of the second insulating layer 40. It may include the step of aligning one second micro LED element (2ML) for each second groove 42 so that the longitudinal direction of the second micro LED element (2ML) is parallel to the plane of the substrate. there is.
  • the second groove 42 may be formed at various positions in the area between the first electrode layer and the second electrode layer. This means that the second micro LED element aligned in the second groove can be placed in various positions in the area between the first electrode layer and the second electrode layer.
  • Figure 6 shows the step (A) of aligning the second micro LED element on the second insulating layer without grooves and the step (B) of aligning the second micro LED element on the second insulating layer with grooves according to the present invention.
  • This is a cross-sectional view for explanation
  • Figure 7 is a plan view of Figure 6(B).
  • one second micro LED element 2ML is installed in each second groove 42 so that the longitudinal direction of the second micro LED element 2ML is parallel to the plane of the substrate. You can sort.
  • the step of aligning the second micro LED elements is by supplying a fluid containing the second micro LED elements on the substrate, applying an electric signal to the first electrode layer and the second electrode layer, and generating an electric field to form one groove for each second groove.
  • the second micro LED elements can be aligned.
  • the longitudinal direction of the second micro LED element aligned in the second groove may coincide with the longitudinal direction of the micro LED element aligned in the other groove.
  • At least one of the micro LED elements may be aligned in a diagonal direction, but is not limited thereto.
  • 8 to 12 are cross-sectional views showing various arrangement structures of the stacked micro LED device according to the present invention.
  • the first drawing in FIG. 8 shows the structure when viewed in the x-axis direction
  • the second drawing shows the structure when viewed in the y-axis direction.
  • one first micro LED element (1ML) and one second micro LED element (2ML) may have the same horizontal position and different vertical positions.
  • a second groove is formed in the diagonal direction of the first groove so that the first groove and the second groove do not overlap.
  • one first micro LED element (1ML) and one second micro LED element (2ML) have different positions in the horizontal direction and may also have different positions in the vertical direction.
  • one first micro LED element (1ML) and one second micro LED element (2ML) may be aligned to overlap in the upward and downward directions, and at the same time, another second micro LED element (2ML) may be aligned with the one above. It may be formed in the diagonal direction of the first micro LED element (1ML). Alternatively, in the overlapping aligned state, another first micro LED element 1ML may be formed in a diagonal direction of the one second micro LED element 2ML. In this case, this means that the three micro LED elements have different positions in the horizontal direction and may also have different positions in the vertical direction.
  • first grooves when there are four grooves, when viewed in the y-axis direction, a plurality of first grooves spaced apart from each other may be formed in the horizontal direction of the substrate, and a first groove may also be formed in the upper direction of the first groove. 2 grooves may be formed.
  • the first micro LED element (1ML) and the second micro LED element (2ML) have different positions in the horizontal direction and may also have different positions in the vertical direction.
  • a plurality of first grooves when viewed from the y-axis direction, a plurality of first grooves may be formed in the horizontal direction of the substrate, and other grooves may be formed in the upper direction and diagonal direction of the first groove. This can be formed. This means that multiple micro LED elements may have different positions in the horizontal and vertical directions.
  • micro LED elements in odd-numbered rows can overlap with each other, and micro LED elements in even-numbered rows can overlap with each other. there is. Additionally, micro LED elements in even rows may not overlap with micro LED elements in odd rows.
  • two or more grooves are formed in the area between the first electrode layer and the second electrode layer and at least one of the overlapping positions and the diagonal direction.
  • the number of grooves to be formed in the horizontal direction and the number of grooves to be formed in the vertical direction can be adjusted.
  • an LED display device including stacked micro LED elements, aligning the second micro LED elements (S160) and connecting the plurality of stacked micro LED elements to the first electrode layer and the second electrode layer. (S170), forming an insulating layer and aligning the micro LED elements on the insulating layer corresponding to the area between the first electrode layer and the second electrode layer so that the longitudinal direction of the micro LED elements is parallel to the plane of the substrate. Can be performed more than once.
  • the step of forming the insulating layer may further include forming a groove in the insulating layer.
  • first connection electrode 50 may be deposited and the second connection electrode 60 may be deposited on the other end.
  • An LED display device can be manufactured by connecting a plurality of stacked micro LED elements to the first electrode layer and the second electrode layer.
  • This step can be performed in one of two ways, the first way is shown in FIG. 13, and the second way is shown in FIG. 14.
  • the photoresist As shown in S210 of FIG. 13, after applying a photoresist (PR) on a substrate on which a plurality of stacked micro LED elements (1ML, 2ML) are arranged, the photoresist is applied to both ends of the plurality of micro LED elements. You can remove the part that does.
  • PR photoresist
  • the portions corresponding to both ends of the plurality of micro LED elements are formed using an etch mask and UV irradiation. That is, the photoresist can be patterned by removing the upper regions of the first electrode layer 20a and the second electrode layer 20b from the photoresist.
  • both ends of the plurality of micro LED elements among the first insulating layer 30 and the second insulating layer 40 are exposed so that the first electrode layer 20a and the second electrode layer 20b are exposed.
  • the first and second insulating layers can be patterned by removing the corresponding portion. Patterning can be performed using an etching mask and UV irradiation, and the removed portion is a space where the first connection electrode 50 and the second connection electrode 60 will be formed.
  • the first connection electrode 50 may be deposited to extend from one end of the plurality of stacked micro LED elements in the direction of the first electrode layer.
  • the second connection electrode 60 may be deposited to extend from the other end of the plurality of stacked micro LED elements in the direction of the second electrode layer. Accordingly, one end of the plurality of micro LED elements may be connected to the first electrode layer 20a and the other end may be connected to the second electrode layer 20b by the deposited connection electrodes 50 and 60.
  • the first connection electrode 50 may connect one end of a plurality of stacked micro LED elements to the first electrode layer 20a.
  • the second connection electrode may connect the other end of the plurality of stacked micro LED elements to the second electrode layer 20b. Since the first connection electrode 50 at one end and the second connection electrode 60 at the other end can be formed at once by depositing a conductive material on a plurality of micro LED elements arranged in the vertical or/and horizontal direction, lamination Micro LED elements can be stably arranged in each position, and a simple process has the effect of maximizing luminous efficiency.
  • connection electrodes are formed on both sides of the first micro LED element, and after placing the second micro LED element on the first micro LED element, they are connected to both sides of the second micro LED element.
  • connection electrodes are formed on both sides of the first micro LED element, and after placing the second micro LED element on the first micro LED element, they are connected to both sides of the second micro LED element.
  • connection electrode in order to connect a plurality of micro LED elements stacked as in the present invention to the first electrode layer and the second electrode layer, forming the connection electrode at once has the advantage of forming a connection electrode of as constant shape as possible through a simple process. there is.
  • Removing the insulating layer and photoresist may use a lift-off method, but is not limited thereto.
  • both ends of the plurality of micro LED elements from among the first photoresist can be removed.
  • both ends of the plurality of micro LED elements among the first insulating layer 30 and the second insulating layer 40 are exposed so that the first electrode layer 20a and the second electrode layer 20b are exposed.
  • the first photoresist 1PR can be removed.
  • connection electrodes 50 and 60 are deposited on the front surface of the substrate 10 on which a plurality of micro LED elements are arranged, and one end of the plurality of micro LED elements is connected to the first electrode layer 20a. The other ends of the plurality of micro LED elements can be connected to the second electrode layer 20b.
  • the connection electrode corresponds to the first connection electrode and the second connection electrode, and the connection electrode can be separated or patterned to form the first connection electrode and the second connection electrode.
  • the second photoresist (2PR) is applied on the substrate on which the connection electrodes 50 and 60 are deposited, and the second photoresist (2PR) is applied to the top and sides of the plurality of micro LED elements. ) can be applied.
  • the top and sides refer to the outer peripheral surface of a plurality of stacked micro LED devices and the part surrounding the stacked devices.
  • the second method can be said to be a process in which, in the process of forming the connection electrode, the connection electrode is deposited to cover the entire upper surface of the substrate, and then only the unnecessary parts are removed.
  • Figure 15 is a plan view of Figures 13 and 14. As shown in Figure 15, one end of the plurality of stacked micro LED elements overlaps the first electrode layer 20a and the first connection electrode 50, and the other end overlaps the second electrode layer 20b and the second connection electrode ( 60) and shows an overlap.
  • the method of forming the first electrode layer, the second electrode layer, the first connection electrode, and the second connection electrode includes plasma chemical vapor deposition (PECVD), physical vapor deposition (PVD), chemical vapor deposition (CVD), e-beam deposition, It may be performed by atomic layer deposition (ALD), sputtering deposition, or plating, but is not limited thereto.
  • PECVD plasma chemical vapor deposition
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • e-beam deposition e-beam deposition
  • ALD atomic layer deposition
  • sputtering deposition sputtering deposition
  • plating but is not limited thereto.
  • Each of the first connection electrode and the second connection electrode may include one or more of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and Ti, and ITO, IZO, ZnO, ITZO, and It may include the same conductive oxide and may also include a conductive polymer such as PEDOT, but is not limited thereto.
  • Figure 16 is a cross-sectional view showing the luminous efficiency of the stacked micro LED device assembly according to the present invention.
  • an LED display device is manufactured by stacking a plurality of micro LED elements in a vertical direction with respect to the substrate plane with the longitudinal direction of the plurality of micro LED elements being parallel to the substrate plane, so that a single existing LED element is manufactured.
  • a structure in which LEDs are stacked only in the horizontal direction more LED elements can be integrated in a relatively small area, which has the effect of further increasing luminance.
  • brightness can be increased without consuming more pixel area of the LED display device, resulting in the effect of using a large pixel area.
  • one light source that is, one pixel
  • one light source that is, one pixel
  • micro LED elements connected between the first and second electrode layers emit light.
  • a partition 70 may be formed at the edge of the pixel.
  • the present invention may further include, after connecting both ends of a plurality of micro LED elements to the first electrode layer and the second electrode layer, arranging a partition wall including a metal layer on the side of the stacked micro LED elements. You can.
  • partition walls 70 may be disposed on the sides of the plurality of stacked micro LED elements and on the sides of the first connection electrode and the second connection electrode.
  • the partition wall may include at least two or more to surround the first connection electrode, the second connection electrode, and the micro LED elements. Preferably, it may include four partition walls arranged on different sides, or it may include one partition wall sequentially arranged on four different sides to form a square shape.
  • the partition may be formed from the position of the micro LED element aligned at the bottom to the position of the micro LED element aligned at the top.
  • the height of the partition may be equal to or higher than the height of the micro LED element aligned at the top.
  • the partition wall may have a cross-sectional shape that slopes outward toward the bottom or a vertical cross-sectional shape, but is not limited thereto.
  • the partition wall may be formed of an insulating material containing an inorganic material or/and an organic material, and may be formed through a mask process, but is not limited thereto.
  • the partition wall may include a reflective metal layer on the inside including one or more of Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and Ti.
  • the reflective metal layer may include one or more of Al, Au, Ni, Ti, Ag, and Mg.
  • the light generated from the micro LED element is reflected by the reflective metal layer of the barrier wall, and the reflected light has the effect of proceeding further toward the front of the LED display device (toward the top of the substrate) without loss. there is.
  • a color conversion layer in which color conversion particles are dispersed is disposed on at least one of the upper, lower, and side surfaces of the plurality of stacked micro LED elements and between the plurality of stacked micro LED elements. Additional steps may be included.
  • Each of the plurality of pixels may display different colors. In some cases, adjacent pixels may display the same color.
  • the first pixel may emit light of the first color
  • the second pixel may emit light of the second color
  • the third pixel may emit light of the third color.
  • Each pixel may include a micro LED element that emits light of the same color and a color conversion layer that converts the light emitted from the micro LED element into light of different colors. By including a color conversion layer, each pixel can display a different color, and an LED display device with RGB full color pixels can be manufactured.
  • the color conversion layer may include at least one color conversion particle.
  • the color conversion particles 80a, 80b, and 80c may be disposed adjacent to at least one of the top, bottom, and sides of the plurality of stacked micro LED elements, and between the plurality of stacked micro LED elements, and the first electrode layer and may be arranged adjacent to the second electrode layer.
  • the color conversion layer may not be in direct physical contact with the plurality of stacked micro LED elements.
  • the color conversion particles 80a, 80b, and 80c can convert light in an arbitrary wavelength range emitted from the micro LED device and light in an arbitrary wavelength range reflected from the partition into light in a different wavelength range. For example, when a micro LED device emits blue light and enters the color conversion layer, the color conversion particles in the color conversion layer can convert the blue light into red or green light.
  • the light emitted from the color conversion layer can be converted into light of various colors.
  • Light converted in the color conversion layer can be displayed on an LED display device having each pixel.
  • Color conversion particles may include quantum dot materials.
  • the valence band (VB) electrons of the quantum dot material are excited to the conduction band (CB) level. And as the excited electrons transition back to the valence band, second light having a converted wavelength band can be emitted.
  • Quantum dot materials may have a spherical core-shell structure.
  • the core may be a semiconductor crystal material such as a silicon (Si)-based nanocrystal, a II-VI group compound nanocrystal, or a III-V group compound nanocrystal, but is not limited thereto.
  • color conversion particles may include materials that can convert incident light in a specific wavelength range into light in a different wavelength range, such as phosphor materials, plate-shaped materials, rod-shaped materials, and perovskite materials, but are not limited thereto. no.
  • the color conversion particles are dispersed adjacent to the micro LED element, and most of the light emitted from the micro LED element is incident on the color conversion particles, making it possible to display an LED display device with RGB full color pixels.
  • the color conversion layer containing these color conversion particles may be formed by selecting one of various processes such as inkjet injection method and photoresist method, or may be combined by attaching the color conversion layer to the micro LED device with an adhesive. , but is not limited to this.
  • the LED display device may include a substrate, a first electrode layer and a second electrode layer, stacked micro LED elements, and a first connection electrode and a second connection electrode coupled to both ends of the micro LED elements stacked spaced apart from each other. You can.
  • the LED display device includes a first electrode layer 20a and a second electrode layer 20b spaced apart from each other on a substrate 10, a plane of the substrate on the first electrode layer and the second electrode layer, and Micro LED elements (ML) in the form of nanowires that are stacked in parallel and spaced apart from each other in the longitudinal direction, and a first connection electrode that extends from one end of the plurality of micro LED devices stacked spaced apart from each other in the direction of the first electrode layer and is connected to the first electrode layer. It may include (50) and a second connection electrode 60 extending from the other end of the plurality of micro LED elements stacked apart from each other in the direction of the second electrode layer and connected to the second electrode layer.
  • ML Micro LED elements
  • the longest side of the micro LED element is parallel to the plane of the substrate, and the micro LED elements are stacked in a vertical direction with respect to the substrate, spaced apart from each other, thereby enabling a greater number of micro LED elements in a relatively small area. can be integrated, which has the effect of further increasing luminous efficiency.
  • micro LED elements that are stacked and spaced apart from each other are positioned vertically with respect to the substrate, but one micro LED element and the other micro LED element may be positioned diagonally. Accordingly, even if a micro LED element that does not emit light occurs in the pixel, the light emitting characteristics of the pixel can be maintained because the micro LED element located in at least one of the top and bottom emits light.
  • one end of the micro LED elements stacked spaced apart from each other may be electrically connected to the first electrode layer through a first connection electrode, and the other end may be electrically connected to the second electrode layer through a second connection electrode.
  • the stacked micro LED elements spaced apart from each other are electrically connected to the first electrode layer and the second electrode layer through the first connection electrode and the second connection electrode, so that the stacked micro LED elements emit light simultaneously, thereby further increasing the brightness. there is.
  • the LED display device has the effect of minimizing interference between pixels and further increasing the directivity of light by further arranging partition walls including a metal layer on the sides of the micro LED elements stacked apart from each other.
  • the LED display device further includes a color conversion layer in which color conversion particles are dispersed on at least one of the top, bottom, side, and spaced apart micro LED elements of the micro LED elements. By doing so, RGB full color can be displayed.
  • the substrate may include transistors arranged in each of a plurality of pixel areas defined by the intersection of data lines and gate lines.
  • Each pixel area displays an image and may include a pixel circuit part and a display element layer.
  • the pixel circuit unit may include at least one transistor and a driving voltage line (DVL).
  • the display element layer may include a first electrode layer electrically connected to the pixel circuit unit, a second electrode layer electrically spaced apart from the first electrode layer, and stacked micro LED elements coupled to the first electrode layer and the second electrode layer.
  • the first electrode layer may be connected to the source electrode or drain electrode of the transistor disposed in the pixel circuit unit.
  • the second electrode layer may be connected to the power supply voltage line (V DD ) or the base voltage line (Vss).
  • the second electrode layer may be connected to the driving voltage line (DVL) through a contact electrode, but is not limited thereto.
  • one pixel may include transistors (DT, ST) formed on a substrate, one capacitor, and stacked micro LED elements.
  • each of the first and second electrodes may be either a source electrode or a drain electrode.
  • the present invention will be described assuming that the first electrode is a source electrode and the second electrode is a drain electrode.
  • the gate electrode of the switching transistor (ST) may be connected to the gate line (GL), and the source electrode of the switching transistor (ST) may be connected to the data line (DL).
  • the drain electrode of the switching transistor (ST) may be connected to the gate electrode of the driving transistor (DT) and the first terminal of the storage capacitor (Cst).
  • the switching transistor (ST) connects the data line (DL) and the gate electrode of the driving transistor (DT) in response to a signal supplied through the gate line (GL).
  • the gate electrode of the driving transistor (DT) may be connected to the drain electrode of the switching transistor (ST) through the via (Via3).
  • the source electrode of the driving transistor DT may be connected to ground (GND) through via (Via1).
  • the drain electrode of the driving transistor DT may be connected to the micro LED device.
  • a gate insulating film is formed on the gate electrode of the driving transistor DT, and the gate insulating film is formed to surround the gate electrode.
  • An active layer is formed on the gate insulating film, and the active layer is formed in a partial area on the gate insulating film.
  • the driving transistor (DT) causes a current corresponding to the voltage charged in the storage capacitor (Cst) to flow from the power supply voltage line (VDD) to ground (GND) through the micro LED element.
  • the storage capacitor Cst may be connected between the gate electrode of the driving transistor DT and ground (GND).
  • the micro LED element can be connected between the drain electrode of the driving transistor (DT) and the power supply voltage line (VDD).
  • the micro LED element may be connected to a drain electrode and a power electrode.
  • the first end of the micro LED element may be connected to the drain electrode of the driving transistor (DT).
  • the second end of the micro LED device may be connected to the power supply voltage line (VDD).
  • the line supplying the power voltage line (VDD) may be formed on a different layer from the driving transistor (DT).
  • the power electrode and the power voltage line (VDD) may be connected through a via (Via2).

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Abstract

L'invention concerne un dispositif d'affichage à DEL ayant une excellente luminosité et une excellente résolution et son procédé de fabrication. Le procédé de fabrication d'un dispositif d'affichage à DEL selon la présente invention comprend les étapes consistant à : (a) former une première couche isolante sur un substrat sur lequel des première et seconde couches d'électrodes sont disposées de manière à être espacées l'une de l'autre ; (b) aligner un premier élément micro-DEL sur la première couche isolante correspondant à la zone entre les première et seconde couches d'électrodes de sorte que la direction longitudinale du premier élément micro-DEL soit parallèle au plan du substrat ; (c) former une seconde couche isolante sur le substrat sur lequel le premier élément micro-DEL est aligné ; (d) aligner un second élément micro-DEL sur la seconde couche isolante correspondant à la zone entre les première et seconde couches d'électrodes de sorte que la direction longitudinale du second élément micro-DEL soit parallèle au plan du substrat ; et (e) former des motifs sur les première et seconde couches isolantes de sorte que les première et seconde couches d'électrodes soient exposées, puis déposer une première électrode de connexion sur une extrémité de la pluralité d'éléments micro-DEL empilés et déposer une seconde électrode de connexion sur l'autre extrémité afin de connecter la pluralité d'éléments micro-DEL empilés aux première et seconde couches d'électrodes.
PCT/KR2023/003375 2022-05-09 2023-03-13 Dispositif d'affichage à del comprenant des éléments micro-del empilés et son procédé de fabrication Ceased WO2023219248A1 (fr)

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KR1020220056800A KR20230157157A (ko) 2022-05-09 2022-05-09 적층형 마이크로 led 소자를 포함하는 led 디스플레이 장치 및 그 제조 방법

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JP2014123583A (ja) * 2011-04-11 2014-07-03 Sharp Corp 発光装置、発光装置の製造方法、照明装置、バックライトおよび表示装置
KR20170091805A (ko) * 2016-01-14 2017-08-10 피에스아이 주식회사 초소형 led 전극어셈블리 및 이의 제조방법
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KR20220044060A (ko) * 2020-09-29 2022-04-06 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법

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