WO2023124433A1 - Optical device, optical module, and optical switching system - Google Patents
Optical device, optical module, and optical switching system Download PDFInfo
- Publication number
- WO2023124433A1 WO2023124433A1 PCT/CN2022/126167 CN2022126167W WO2023124433A1 WO 2023124433 A1 WO2023124433 A1 WO 2023124433A1 CN 2022126167 W CN2022126167 W CN 2022126167W WO 2023124433 A1 WO2023124433 A1 WO 2023124433A1
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- WIPO (PCT)
- Prior art keywords
- structural member
- optical
- optical device
- coating
- support
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4215—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical elements being wavelength selective optical elements, e.g. variable wavelength optical modules or wavelength lockers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
Definitions
- the present application relates to the technical field of optical modules, and in particular to an optical device, an optical module and an optical switching system.
- Optical devices in the field of optical communications need to be sealed during use to ensure that the optical path components in the optical device work in an environment with relatively stable water vapor and gas densities.
- the commonly used packaging method is to connect the metal shell and the metal base through high-precision welding. To ensure the airtightness of this connection method, the requirements for the metal are relatively high. cutting materials, leading to an increase in the overall cost of optical devices.
- the application provides an optical device, an optical module and an optical switching system, which can reduce the cost of the optical device on the premise of ensuring the airtightness of the optical device.
- the present application provides an optical device, which may include a first structural member, a second structural member, a connection structure and a film layer; the connection structure is disposed between the first structural member and the second structural member, And one end of the connecting structure is connected to the first structural member, the other end of the connecting structure is connected to the second structural member, the film layer covers the connection position between the first structural member and the second structural member, and the film layer is used to connect the first structure The connection between the component and the second structural component is sealed.
- the first structural member and the second structural member of the optical device are connected through a connection structure, and the connection between the first structural member and the second structural member is sealed by a thin film layer. Since the thin film layer can produce micro deformation, forming The stress is released to form a buffer area between the first structural member and the second structural member, which can not only ensure the sealing of the optical device, but also reduce the matching requirements of the expansion coefficients of the first structural member and the second structural member.
- the material requirements of the structural member and the second structural member are relatively low, so that the cost of the optical device can be reduced.
- the process flow of the first structural member and the second structural member connected by a connecting structure without sealing treatment is relatively simple, and the process flow can also be simplified by forming the optical device in the above-mentioned manner.
- the thin film layer can be Metal film layer or polymer material layer, wherein when the film layer is a metal film layer, the thickness of the metal film layer can be 0.1 ⁇ 1mm, and the material of the metal film layer can be, but not limited to, copper foil, the following implementation Example
- the thin film layer is a metal thin film layer as an example for illustration.
- the materials of the first structural member and the second structural member can be various, for example: the material of the first structural member can be any one of metal materials, metal-ceramic composite materials, ceramics or glass, The material of the second structural part can also be any one of metal material, metal-ceramic composite material, pottery or glass; The structural member and the second structural member are welded, and the film layer surrounds the first structural member and the second structural member, so as to ensure that the film layer can seal the joint between the first structural member and the second rigid member.
- the optical device may also include a first coating, wherein, due to the material of the second structural member The selection of the second structural member needs to be provided with a first coating on the surface of the second structural member, so that the thin film layer is connected to the second structural member, and the thin film layer is welded to the first coating layer and the first structural member, so that the first structural member and the second structural member The tightness of the connection between the two structural members.
- the optical device may also include a first coating, wherein, due to the The selection of materials requires a first coating on the surface of the first structural member, and the first coating can surround the first structural member, so that the first coating and the first structural member are sealed and connected to ensure that the thin film layer and the first structural member are sealed.
- the joint between the first structural member and the second structural member is airtight.
- the optical device may also include Two first coating layers, the two first coating layers are respectively arranged on the surface of the second structural member and the surface of the first structural member, wherein, when the two first coating layers are respectively arranged on the second structural member and the first structural member, it is necessary Ensure that the size of the connection between the two first coatings and the first structural member and the second structural member corresponds to ensure the sealing between the first structural member and the second structural member when the thin film layer is welded to the two first coatings sex.
- the first structural member and the second structural member when both the first structural member and the second structural member are made of metal materials, the first structural member and the second structural member can be connected through a connecting structure (first supporting member); when the first structural member
- the connecting structure may include the second plating layer and the first support member, and when the second structural member faces the first structural member
- One side of the first support is provided with a second coating, one end of the first support can be welded to the first structure, and the other end of the first support can be welded to the second coating
- the connecting structure when the material of the first structure is a cermet composite material, Any one of ceramics or glass
- the connecting structure when the material of the second structural member is metal, the connecting structure includes a second coating and a first support member, and the second coating is arranged on the side of the first structural member facing the second structural member, One end of the first support is connected to the second coating, and the other end of the first support is connected to the side of the second structure facing the
- the first structural member may be a base
- the second structural member may be a housing
- one end of the connecting structure is arranged on the mounting surface of the base
- the other end of the connecting structure is connected to the housing, so that the housing and An accommodating space is formed between the installation surfaces; the film layer is in sealing connection with the peripheral side of the base and the side wall of the housing away from the accommodating space.
- the optical device can also include a second support and an optical substrate, one end of the second support is arranged on the mounting surface of the base, and the other end of the second support is connected to the optical substrate, wherein the optical The substrate is used for installing optical path components.
- This kind of arrangement can prevent the deformation of the base of the metal material under plateau pressure, resulting in changes in the optical path elements arranged on the base, and a second support member and an optical substrate for installing the optical path elements can also be arranged in the accommodation space, wherein , there may be multiple second support members, one end of the second support member is connected to the installation surface, and the other end of the second support member is connected to the optical substrate.
- the material of the substrate is any one of metal-ceramic composite materials, ceramics or glass
- the amount of deformation of this kind of substrate is small under plateau pressure, so the optical path components can be arranged on the rigid substrate on the mounting surface. That is, the second supporting member and the optical substrate may not be provided in the optical device, so as to reduce the cost of the optical device.
- the second supporting member may be rubber material.
- a reinforcing member may be provided on the side wall of the housing away from the accommodation space.
- the reinforcing member may be a screw.
- connection manners of the optical devices in the above embodiments can also be applied to other packaging structures.
- the present application also provides an optical module
- the optical module may include the optical device in any technical solution of the first aspect, wherein the optical device can transmit and receive optical signals; the optical module may also include a circuit board, The optical device may be arranged on the circuit board, and since the optical device is the optical device in the first aspect, the cost of the optical module is relatively low.
- the optical module may specifically be a wavelength selective switch, and when the optical module is a wavelength selective switch, it may further include a casing, and the circuit board and the optical device may be stacked in the casing.
- the present application also provides an optical switching system, which includes at least two optical devices in the first aspect; at least two optical devices can be connected by optical fibers; because the cost of the optical devices is relatively Low, therefore, the cost of the optical switching system with this optical device is also relatively low.
- the optical switching system can specifically be a wavelength division optical switching system or a data center optical switching system; when the optical switching system is a wavelength division switching system, it can also include a multiplexer corresponding to the optical device, and the multiplexer
- the signal is integrated and sent to optics, which can receive and transmit the light signal. More specifically, there may be two or three optical devices in the wavelength division optical switching system, and at this time, there are at least two or three multiplexers in the wavelength division optical switching system.
- FIG. 1 is a schematic diagram of a partial structure of an optical device provided in an embodiment of the present application
- Fig. 2 is another partial structural schematic diagram of the optical device provided by the embodiment of the present application.
- Fig. 3 is another partial structural schematic diagram of the optical device provided by the embodiment of the present application.
- Fig. 4 is another partial structural schematic diagram of the optical device provided by the embodiment of the present application.
- FIG. 5 is a schematic structural diagram of an optical device provided in an embodiment of the present application.
- FIG. 6 is another schematic structural view of the optical device provided by the embodiment of the present application.
- Fig. 7 is another schematic structural diagram of the optical device provided by the embodiment of the present application.
- Fig. 8 is another schematic structural diagram of the optical device provided by the embodiment of the present application.
- FIG. 9 is a schematic structural diagram of an optical module provided in an embodiment of the present application.
- FIG. 10 is a schematic structural diagram of an optical switching system provided by an embodiment of the present application.
- 1, 1a, 1b, 1c-optical device 2-circuit board; 3-wave combiner; 4a, 4b, 4c-wave splitter; 10-first structure; 10a-first side; 11-base; 20 -Second structure; 20a-Second side; 21-Shell; 22-Reinforcing member; 30-Film layer; 31a-First coating; 31b-First coating; 40-Connection structure; 41-First support 42a-the second coating layer; 42b-the second coating layer; 50-accommodating space; 60-optical path components; 70-second supporting member; 80-optical substrate.
- the box body and the box cover are usually made of the same metal, and are welded at low temperature by parallel sealing welding, laser welding or placing a third metal between the box body and the box cover; if the box body and the box cover are selected
- Aluminum is generally laser welded, and the equipment cost is high. In the plateau and low pressure environment, the aluminum material is easily deformed and the height of the packaging structure exceeds the standard; The cost of equipment for parallel sealing welding and laser welding of Kovar materials is also relatively high.
- the embodiment of the present application provides an optical device, which can reduce the cost of the optical device while ensuring the airtightness of the optical device.
- references to "one embodiment” or “some embodiments” or the like in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
- appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically stated otherwise.
- the terms “including”, “comprising”, “having” and variations thereof mean “including but not limited to”, unless specifically stated otherwise.
- Fig. 1 is a schematic structural diagram of an optical device provided in the embodiment of the present application.
- the optical device may include a first structural member 10, a second structural member 20, a connection structure 40 and film layer 30; the connecting structure 40 is arranged between the first structural member 10 and the second structural member 20, the first structural member 10 and the second structural member 20 can be connected through the connecting structure 40, and when connecting, The connecting structure 40 may not provide a sealing function.
- the film layer 30 covers the position where the first structural member 10 and the second structural member 20 are connected, and the film layer 30 can The first structural member 10 and the second structural member 20 are connected to seal the joint of the first structural member 10 and the second structural member 20 .
- a buffer zone can be formed between the first structural member 10 and the second structural member 20, ensuring that the first structural member 10 and the second structural member Under the premise of the sealed connection of the first structural member 10 and the second structural member 20, the matching requirements for the coefficient of expansion of the first structural member 10 and the second structural member 20 are relatively low, so the material requirements for the first structural member 10 and the second structural member 20 can be reduced, and further Reduce the cost of optics.
- the materials of the first structural member 10 and the second structural member 20 may be the same or different.
- the material of the first structural member 10 may be a metal material, a metal-ceramic composite material, ceramics or glass.
- Any one of the materials of the second structural member 20 can also be any one of metal materials, metal-ceramic composite materials, ceramics or glass, and the thin film layer can be a metal thin film layer or a polymer material layer, wherein when the thin film layer When it is a metal thin film layer, the thickness of the metal thin film layer can be 0.1-1 mm, and the material of the metal thin film layer can be, but not limited to, copper foil.
- the thin film layer is used as an example for illustration. of.
- both the first structural member 10 and the second structural member 20 can be metal materials, and the connection structure 40 can only include the first support member 41, and the first support member 41 is connected to the second support member respectively.
- One end of a structural member 10 facing the second structural member 20, and one end of the second structural member 20 facing the first structural member 10 are welded, and the film layer 30 can be respectively connected to the first side 10a of the first structural member 10 and the second structural member
- the second side 20 a of the structure 20 is welded so as to securely connect the first structure member 10 and the second structure member 20 , and also to seal the first structure member 10 and the second structure member 20 .
- the first structural member 10 can be a metallic material
- the second structural member 20 can be any one of metal-ceramic composite material, ceramics or glass
- the connection structure 40 can include the first A support 41 and a second coating 42a, the second coating 42a is arranged on the side of the second structure 20 facing the first structure 10, the two ends of the first support are respectively connected to the second coating 42a and the first structure 10 Connect to connect the first structural member 10 and the second structural member 20
- the optical device can also include a first coating 31a, the first coating 31a can be arranged on the second side 20a of the second structural member 20, and the first coating 31a Set around the second side 20a of the second structure 20 to ensure the sealing between the first coating 31a and the second structure 20, the film layer 30 can be respectively connected to the first side 10a of the first structure 10 and the second A plating layer 31a is welded, thereby completing the sealing of the first structural member 10 and the second structural member 20 .
- the first structural member 10 can be any one of metal-ceramic composite material, ceramics or glass
- the second structural member 20 can be a metal material
- the optical device can also include the first A coating layer 31b
- the first coating layer 31b can be arranged on the first side 10a of the first structural member 10
- the first coating layer 31b is arranged around the first side 10a of the first structural member 10
- the thin film layer 30 can be respectively combined with the first coating layer 31b and the second side 20a of the second structural member 20 are welded to ensure the sealing of the first structural member 10 and the second structural member 20 .
- connection structure 40 may include a first support member 41 and a second plating layer 42b, wherein the second plating layer 42b is disposed on the side of the first structural member 10 facing the second structural member 20, and one end of the first support member 41 is disposed on On the second plating layer 42 b , the other end of the first support member 41 is connected to the second structural member 20 to ensure a stable connection between the first structural member 10 and the second structural member 20 .
- the first structural member 10 can be any one of metal-ceramic composite material, ceramics or glass
- the second structural member 20 can also be made of metal-ceramic composite material, ceramic or glass.
- Any one of the optical devices can also include two first coating layers, the two first coating layers are respectively the first coating layer 31a and the first coating layer 31b, and the first coating layer 31a and the first coating layer 31b can be respectively arranged on the second structural member
- the first coating 31a and the first coating 31b can surround the second side 20a of the second structure 20 and the first side of the first structure 10 respectively.
- the thin film layer 30 is sealed with the first coating layer 31a and the first coating layer 31b respectively connection, so as to ensure the sealing of the first structural member 10 and the second structural member 20.
- connection structure 40 may include a first support member 41 and two second plating layers, the two second plating layers are respectively a second plating layer 42a and a second plating layer 42b, wherein the second plating layer 42a is arranged on the direction of the second structural member 20
- the second coating layer 42b is arranged on the side of the first structural member 10 facing the second structural member 20
- one end of the first support member 41 is arranged on the second coating layer 42b, and the first support member The other end of 41 is connected to the second plating layer 42a to ensure a stable connection between the first structural member 10 and the second structural member 20 .
- the elastic modulus of the first structural member 10 and the second structural member 20 may be greater than or equal to 130GPa, and the coefficient of thermal expansion shall be less than or equal to Moreover, the sealing structure formed by the first structural member 10 and the second structural member 20 is less deformed under the influence of external factors.
- the above technical solution can also be applied to medium and large airtight product scenarios (the length, width, and height are all greater than 100mm), so as to achieve higher reliability and airtight functions at low cost. For example, it can be applied to scenarios such as semiconductor high-vacuum large-scale equipment lithography machines to overcome the limitations of multiple materials, temperature differences, and complex gas mixing in the prior art.
- first structural member 10 and the second structural member 20 can be electrical signal interfaces, optical signal interfaces, housings, and substrates, etc., and the first structural member 10 and the second structural member 20 can also be other structures , not listed here.
- the optical device may include the base 11, the housing 21, the film layer 30 and the connection structure 40, the base 11 has a mounting surface, and the mounting surface can be installed Optical path element 60.
- the casing 21 may include a cover body and a side wall connected to one side of the cover body, and the side wall may be disposed around a peripheral side of the cover body.
- One end of the connection structure 40 may be disposed on the installation surface, and the other end of the connection structure 40 is connected to the side wall of the housing 21 , so that an accommodation space 50 is formed between the housing 21 and the base 11 .
- One end of the film layer 30 is connected to the peripheral side of the base 11, and the other end is sealed to the side wall of the housing 21 away from the accommodating space 50, so as to seal the joint between the base 11 and the housing 21, so that the housing 21 and the base
- the accommodation space 50 formed between 11 is a sealed space.
- the housing 21 and the base 11 can be connected through the connection structure 40 first, and the housing 21 and the base 11 can not be sealed during the connection, so that the housing 21 and the base 11 can be sealed.
- the requirements for the material of the base 11 are low, which is beneficial to reduce the cost.
- a thin film layer 30 is arranged at the junction of the housing 21 and the base 11, and the accommodation space 50 formed between the housing 21 and the base 11 is sealed by the thin film layer 30, because the thin film
- the layer 30 can produce micro-deformation, form stress relief, and form a buffer zone between the substrate 11 and the housing 21, which can not only reduce the cost of the optical device, but also reduce the matching requirements of the expansion coefficients of the substrate 11 and the housing 21, and can also The airtightness of the optical device is ensured, so that the optical path element 60 arranged in the accommodation space 50 can work in a relatively stable environment sealed with water vapor and gas.
- the connecting structure 40 may include a first support 41, and the first support 41 may be welded to the base 11 and the casing 21 respectively. way to connect.
- the base 11 and the housing 21 may also be connected by a connecting piece (not shown in the figure), that is, by a mechanical connection.
- the film layer 30 can surround the peripheral side of the base 11 and the side wall of the housing 21 away from the accommodating space 50, and the film layer 30 can pass between the peripheral side of the base 11 and the side wall of the housing 21. The connection is sealed by welding.
- a second support 70 and an optical substrate 80 may be provided in the accommodation space 50, one end of the second support 70 is fixedly arranged on the mounting surface, the other end of the second support 70 is used to support the optical substrate 80, and the optical path element 60 is arranged on the side of the optical substrate 80 away from the second support member 70.
- a reinforcing member 22 may be provided on the side wall of the housing 21. The setting of the reinforcing member 22 can reduce the stress transmitted to the base 11 after the housing 21 is deformed by external stress, thereby reducing the impact on the optical path element 60. .
- FIG. 6 is a schematic structural diagram of an optical device provided by an embodiment of the present application.
- the base 11 can be made of metal material
- the shell 21 can be made of any one of metal-ceramic composite material, ceramic or glass.
- the base 11 and the housing 21 can be connected through a connection structure 40 , or can also be connected by a mechanical connection (not shown in the figure).
- connection structure 40 may include a second plating layer 42a and a first support member 41, the second plating layer 42a may be disposed on one end of the side wall of the housing 21 facing the base 11, the second A supporting member 41 can be fixed between the second plating layer 42 a and the mounting surface of the base 11 .
- the first supporting member 41 is a rigid member to ensure that the base 11 is connected with the housing 21 to form an optical device with a small volume change.
- the gold optical device may also include a first coating layer 31a, the first coating layer 31a is disposed on the side of the side wall of the housing 21 away from the accommodating space 50, and the first coating layer 31a is disposed around the side wall of the housing 21;
- a first coating layer 31a is disposed on the side of the side wall of the housing 21 away from the accommodating space 50, and the first coating layer 31a is disposed around the side wall of the housing 21;
- the sealing connection between the thin film layer 30 and the first coating layer 31a can be carried out by melting, or it can be sealed and connected by melting a low-temperature metal such as solder to form an intermetallic compound.
- a low-temperature metal such as solder to form an intermetallic compound.
- the thin film layer 30 and the first coating layer 31a It is also possible to seal the connection in other ways, which are not listed here.
- the base 11 is made of metal material, there is a risk of deformation under plateau air pressure.
- the metal base 11 is deformed, the optical path element 60 will not be affected, and a second support 70 and an optical substrate 80 can be arranged in the accommodation space 50, wherein the second support 70 can be made of a rigid material, and the second support 70 One end of the second support member 70 is fixedly arranged on the installation surface, and the other end of the second support member 70 is used to support the optical substrate 80.
- the optical path element 60 is arranged on the side of the optical substrate 80 away from the second support member 70.
- the arrangement of the two support members 70 and the optical substrate 80 can prevent the position of the optical path element 60 from changing, thereby improving the stability of the optical path element 60 .
- a reinforcing member 22 is provided on the side wall of the housing 21 . The setting of the reinforcing member 22 can reduce the stress transmitted to the base 11 after the housing 21 is deformed by external stress, thereby reducing the impact on the optical path element 60 .
- FIG. 7 is a schematic structural diagram of an optical device provided by an embodiment of the present application.
- the substrate 11 can be made of any one of metal-ceramic composite material, ceramic or glass, and the shell 21 can be made of metal material.
- the base 11 and the housing 21 are connected through a connection structure 40 , or may also be connected by a mechanical connection.
- the connection structure 40 may include a second coating 42b and a first support 41, the second coating 42b may be arranged on the mounting surface of the base 11, and the first support 41 may be One end of the side wall of the second coating 42b and the housing 21 facing the base 11 is arranged, and one end of the first support 41 can be connected to the second coating 42b, and the other end of the first support 41 can be connected to the side of the housing 21.
- One end of the wall facing the base 11 is connected so that the base 11 is fixedly connected with the housing 21 .
- the first supporting member 41 may be a rigid member to ensure that the base 11 is connected to the housing 21 to form an optical device with a small volume change.
- the optical device may include a first coating layer 31b, the first coating layer 31b is disposed on the peripheral side of the base, and the first coating layer 31b may be disposed around the peripheral side of the base 11; At this time, one end of the thin film layer 30 is welded to the first coating layer 31b, and the other end is welded to the side wall of the housing 21 away from the accommodating space, so as to seal the accommodating space formed between the housing 21 and the base 11.
- sealing connection between the thin film layer 30 and the first coating layer 31b can be carried out by melting, or the melting of low-temperature metals such as solder can be used to form an intermetallic compound for sealing connection.
- the thin film layer 30 and the first coating layer 31b It is also possible to seal the connection in other ways, which are not listed here.
- the base 11 When the material of the base 11 is any one of metal-ceramic composite material, ceramics or glass, the base 11 will not be deformed under plateau pressure, therefore, the optical path element 60 can be directly arranged on the mounting surface on the rigid substrate 10, An optical substrate may not be provided in the sealing structure formed in this way, so that the cost can be reduced.
- FIG. 8 is a schematic structural diagram of an optical device provided by an embodiment of the present application.
- the substrate 11 can be made of any one of metal-ceramic composite material, ceramic or glass
- the shell 21 can also be made of any one of metal-ceramic composite material, ceramic or glass.
- the base 11 and the housing 21 can be connected by using a connection structure 40 , or can also be connected by a mechanical connection.
- the connection structure 40 may include a first support member 41 and two second coating layers, the two second coating layers are respectively a second coating layer 42a and a second coating layer 42b, and the second coating layer
- the coating 42b may be disposed on the mounting surface of the base 11, the second coating 42a may be disposed on one end of the side wall of the housing 21 facing the base 11, the first support 41 is disposed between the second coating 42a and the second coating 42b, and One end of the first supporting member 41 is connected to the second plating layer 42b, and the other end of the first supporting member 41 is connected to the second plating layer 42a, so that the base 11 is fixedly connected to the housing 21 .
- the first supporting member 41 may be a rigid member, so as to ensure that the base 11 is connected with the housing 21 to form an optical device with a small volume change.
- first support members 41 there can be at least three first support members 41, and at least three second coating layers 42a can also be provided, and at least three second coating layers 42a are provided in one-to-one correspondence with at least three first support members 41.
- the support member 41 can also be a whole, and the second plating layer 42 a can cover the side of the housing 21 facing the base 11 .
- the optical device may include two first coating layers, the two first coating layers are respectively a first coating layer 31a and a first coating layer 31b, and the first coating layer 31a may be disposed on the side wall of the housing 21 away from the accommodating space 50, And the first coating layer 31a can be arranged around the side wall of the housing 21; the first coating layer 31b can be arranged on the peripheral side of the base 11, and the first coating layer 31b can be arranged around the peripheral side of the base 11; When the connection between the shells 21 is sealed, the two ends of the film layer 30 can be welded to the first coating layer 31 a and the first coating layer 31 b respectively, so as to seal the accommodation space formed between the housing 21 and the base 11 .
- the sealing connection between the thin film layer 30 and the first coating layer 31a and the first coating layer 31b can be carried out by melting, or it can be sealed and connected by melting a low-temperature metal such as solder to form an intermetallic compound.
- the thin film layer 30 The sealing connection with the first coating layer 31a and the first coating layer 31b can also be done in other ways, which are not listed here.
- the material of the substrate 11 is any one of metal-ceramic composite materials, ceramics or glass
- the deformation of the substrate under plateau pressure is small, so the optical path element 60 can be directly arranged on the mounting surface on the rigid substrate 10 , the sealing structure formed in this way may not be provided with an optical substrate, thereby reducing the cost.
- the present application also provides an optical module
- the optical module includes the optical device in any of the above technical solutions, and also includes a circuit board 2, the optical device 1 can be arranged on the circuit board 2, the optical device 1 can emit and Receive light signal. Since the optical device 1 is the optical device in the first aspect, the cost of the optical module is relatively low.
- the optical module may specifically be, but not limited to, a wavelength selective switch, and when the optical module is a wavelength selective switch, it may also include a casing, and the circuit board 2 and the optical device 1 may be stacked in the casing.
- the present application also provides an optical switching system
- the optical switching system may include at least two optical devices in any of the above-mentioned technical solutions, at least two optical devices may be connected by optical fibers, because the cost of optical devices The cost of the optical switching system with the optical device is also relatively low.
- the optical device can be plugged on the circuit board, or arranged on the circuit board, or the optical device is independently installed, and when the optical device is independently installed, the optical device can perform optical communication with the outside through the optical fiber.
- the optical switching system may specifically be, but not limited to, a wavelength division optical switching system or a data center optical switching system; when the optical switching system is a wavelength division switching system and includes multiple optical devices, it may include A plurality of wave splitters and a plurality of wave combiners 3, with three examples: wherein, the wave splitter 4a corresponding to the optical device 1a can divide the optical signal into two optical signals, and the two optical signals can be separated by the optical device 1b and the optical device 1c receive, similarly, the wave splitter 4b corresponding to the optical device 1b can divide the optical signal into two optical signals, and the two optical signals can be received by the optical device 1a and the optical device 1c respectively; The demultiplexer 4c corresponding to 1c can also divide the optical signal into two optical signals, and the two optical signals can
- optical signal may be transmitted through optical fiber.
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Abstract
Description
相关申请的交叉引用Cross References to Related Applications
本申请要求在2021年12月30日提交中国专利局、申请号为202111651160.9、申请名称为“光学器件、光模块及光交换系统”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims priority to a Chinese patent application filed with the China Patent Office on December 30, 2021, with application number 202111651160.9 and titled "Optical Device, Optical Module, and Optical Switching System", the entire contents of which are incorporated herein by reference. Applying.
本申请涉及光模块技术领域,尤其涉及到一种光学器件、光模块及光交换系统。The present application relates to the technical field of optical modules, and in particular to an optical device, an optical module and an optical switching system.
光通信领域中的光学器件在使用时需要进行密封,以保证光器件中的光路元件在水汽和气体密度相对稳定的环境中工作。目前常用的封装方式为将金属壳体与金属基底之间通过高精密的焊接方式连接,而要保证此种连接方式的密封性,则对金属的要求较高,一般需要使用成本较高的可伐材料,导致光器件的整体成本提升。Optical devices in the field of optical communications need to be sealed during use to ensure that the optical path components in the optical device work in an environment with relatively stable water vapor and gas densities. At present, the commonly used packaging method is to connect the metal shell and the metal base through high-precision welding. To ensure the airtightness of this connection method, the requirements for the metal are relatively high. cutting materials, leading to an increase in the overall cost of optical devices.
基于此,如何在保证光器件气密性的前提下,降低其生产成本,是目前亟待解决的技术问题。Based on this, how to reduce the production cost of the optical device on the premise of ensuring the airtightness of the optical device is an urgent technical problem to be solved at present.
发明内容Contents of the invention
本申请提供了一种光学器件、光模块及光交换系统,可以在保证光学器件的气密性的前提下,降低光学器件的成本。The application provides an optical device, an optical module and an optical switching system, which can reduce the cost of the optical device on the premise of ensuring the airtightness of the optical device.
第一方面,本申请提供了一种光学器件,该光学器件可以包括第一结构件、第二结构件、连接结构和薄膜层;连接结构设置在第一结构件和第二结构件之间,且连接结构的一端与第一结构件连接,连接结构的另一端与第二结构件连接,薄膜层覆盖第一结构件与第二结构件的连接位置,且薄膜层的用于将第一结构件和第二结构件的连接处密封。In a first aspect, the present application provides an optical device, which may include a first structural member, a second structural member, a connection structure and a film layer; the connection structure is disposed between the first structural member and the second structural member, And one end of the connecting structure is connected to the first structural member, the other end of the connecting structure is connected to the second structural member, the film layer covers the connection position between the first structural member and the second structural member, and the film layer is used to connect the first structure The connection between the component and the second structural component is sealed.
本申请中的光学器件第一结构件和第二结构件之间通过连接结构连接,并利用薄膜层将第一结构件和第二结构件的连接处密封,由于薄膜层可以产生微变形,形成应力释放,使第一结构件和第二结构件之间形成缓冲区域,这样既可以保证光学器件的密封性,又可以降低第一结构件和第二结构件膨胀系数的匹配要求,对第一结构件和第二结构件材质的要求相对较低,从而可以降低光学器件的成本。In the present application, the first structural member and the second structural member of the optical device are connected through a connection structure, and the connection between the first structural member and the second structural member is sealed by a thin film layer. Since the thin film layer can produce micro deformation, forming The stress is released to form a buffer area between the first structural member and the second structural member, which can not only ensure the sealing of the optical device, but also reduce the matching requirements of the expansion coefficients of the first structural member and the second structural member. The material requirements of the structural member and the second structural member are relatively low, so that the cost of the optical device can be reduced.
需要说明的是,第一结构件和第二结构件通过连接结构连接,且不进行密封处理的工艺流程相对简单,通过上述的方式形成光学器件,也可以简化工艺流程,另外,薄膜层可以为金属薄膜层或者是高分子材料层,其中当薄膜层为金属薄膜层时,金属薄膜层的厚度可以为0.1~1mm,且金属薄膜层的材料可以、但不限为铜箔,下述的实施例以薄膜层为金属薄膜层为例进行说明。It should be noted that the process flow of the first structural member and the second structural member connected by a connecting structure without sealing treatment is relatively simple, and the process flow can also be simplified by forming the optical device in the above-mentioned manner. In addition, the thin film layer can be Metal film layer or polymer material layer, wherein when the film layer is a metal film layer, the thickness of the metal film layer can be 0.1 ~ 1mm, and the material of the metal film layer can be, but not limited to, copper foil, the following implementation Example The thin film layer is a metal thin film layer as an example for illustration.
在上述的实施例中,第一结构件和第二结构件的材料可以为多种,例如:第一结构件的材料可以为金属材料、金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,第二结构件的材料也可以为金属材质、金属陶瓷复合材料、陶瓷或者玻璃中的任意一种;当第一结构件 和第二结构件的材料均为金属材质时,薄膜层可以与第一结构件和第二结构件焊接,且薄膜层环绕于第一结构件和第二结构件,以保证薄膜层能够将第一结构件和第二刚性的连接处密封。In the above-mentioned embodiments, the materials of the first structural member and the second structural member can be various, for example: the material of the first structural member can be any one of metal materials, metal-ceramic composite materials, ceramics or glass, The material of the second structural part can also be any one of metal material, metal-ceramic composite material, pottery or glass; The structural member and the second structural member are welded, and the film layer surrounds the first structural member and the second structural member, so as to ensure that the film layer can seal the joint between the first structural member and the second rigid member.
当第一结构件的材料为金属材质,第二结构件的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种时,光学器件还可以包括第一镀层,其中,由于第二结构件材料的选用,需要在第二结构件的表面上设置有第一镀层,以便于薄膜层与第二结构件连接,薄膜层与第一镀层和第一结构件进行焊接,使第一结构件和第二结构件之间的连接处密封性。When the material of the first structural member is metal, and the material of the second structural member is any one of metal-ceramic composite materials, ceramics or glass, the optical device may also include a first coating, wherein, due to the material of the second structural member The selection of the second structural member needs to be provided with a first coating on the surface of the second structural member, so that the thin film layer is connected to the second structural member, and the thin film layer is welded to the first coating layer and the first structural member, so that the first structural member and the second structural member The tightness of the connection between the two structural members.
当第一结构件的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,第二结构件的材料为金属材料时,光学器件还可以包括第一镀层,其中,由于第一结构件的材料的选用,需要在第一结构件的表面上设置有第一镀层,且第一镀层可以环绕于第一结构件,使第一镀层与第一结构件之间密封连接,以保证薄膜层与第二结构件以及第一镀层焊接时,第一结构件和第二结构件之间的连接处密封性。When the material of the first structural member is any one of metal-ceramic composite material, ceramics or glass, and the material of the second structural member is a metal material, the optical device may also include a first coating, wherein, due to the The selection of materials requires a first coating on the surface of the first structural member, and the first coating can surround the first structural member, so that the first coating and the first structural member are sealed and connected to ensure that the thin film layer and the first structural member are sealed. When the second structural member and the first plating layer are welded, the joint between the first structural member and the second structural member is airtight.
当第一结构件的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,第二结构件的材料也为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种时,光学器件还可以包括两个第一镀层,两个第一镀层分别设置于第二结构件的表面和第一结构件的表面,其中,两个第一镀层分别设置于第二结构件和第一结构件时,需要保证两个第一镀层与第一结构件和第二结构件的连接处的尺寸对应,以保使薄膜层与两个第一镀层焊接时,第一结构件和第二结构件之间的密封性。When the material of the first structural member is any one of metal-ceramic composite material, ceramics or glass, and the material of the second structural member is also any one of metal-ceramic composite material, ceramics or glass, the optical device may also include Two first coating layers, the two first coating layers are respectively arranged on the surface of the second structural member and the surface of the first structural member, wherein, when the two first coating layers are respectively arranged on the second structural member and the first structural member, it is necessary Ensure that the size of the connection between the two first coatings and the first structural member and the second structural member corresponds to ensure the sealing between the first structural member and the second structural member when the thin film layer is welded to the two first coatings sex.
在上述的实施例中,当第一结构件和第二结构件均采用金属材料时,第一结构件和第二结构件之间可以通过连接结构(第一支撑件)连接;当第一结构件为金属材料,第二结构件的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种时,连接结构可以包括第二镀层和第一支撑件,在第二结构件朝向第一结构件的一侧设置有第二镀层,第一支撑件的一端可以与第一结构件焊接,第一支撑件的另一端可以与第二镀层焊接;当第一结构件的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,第二结构件的材质为金属材质时,连接结构包括第二镀层和第一支撑件,第二镀层设置于第一结构件朝向第二结构件的一侧,第一支撑件的一端与第二镀层连接,第一支撑件的另一端与所述第二结构件朝向第一结构件的一侧连接;当第一结构件和第二结构件的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种时,连接结构可以包括第一支撑件和两个第二镀层,在第二结构件朝向第一结构件的一侧设置有一个第二镀层,在第一结构件上设置有与该第二镀层对应的另一个第二镀层,两个第二镀层之间可以通过第一支撑件或者连接件连接。In the above-mentioned embodiment, when both the first structural member and the second structural member are made of metal materials, the first structural member and the second structural member can be connected through a connecting structure (first supporting member); when the first structural member When the material of the second structural member is any one of metal-ceramic composite material, ceramics or glass, the connecting structure may include the second plating layer and the first support member, and when the second structural member faces the first structural member One side of the first support is provided with a second coating, one end of the first support can be welded to the first structure, and the other end of the first support can be welded to the second coating; when the material of the first structure is a cermet composite material, Any one of ceramics or glass, when the material of the second structural member is metal, the connecting structure includes a second coating and a first support member, and the second coating is arranged on the side of the first structural member facing the second structural member, One end of the first support is connected to the second coating, and the other end of the first support is connected to the side of the second structure facing the first structure; when the material of the first structure and the second structure is metal When any one of ceramic composite materials, ceramics or glass is used, the connection structure may include a first support member and two second coatings, and one second coating is provided on the side of the second structural member facing the first structural member, and Another second coating layer corresponding to the second coating layer is provided on the first structural member, and the two second coating layers can be connected by a first supporting piece or a connecting piece.
在上述的实施例中,第一结构件可以为基底,第二结构件可以为壳体,连接结构的一端设置在基底的安装面,连接结构的另一端与壳体连接,以使壳体与安装面之间形成容纳空间;薄膜层与基底的周侧,以及壳体的侧壁远离所述容纳空间的一侧密封连接。且当基底为金属材料时,光学器件还可以包括第二支撑件和光学基板,第二支撑件的一端设置在基底的安装面上,第二支撑件的另一端与光学基板连接,其中,光学基板用于安装光路元件。此种的设置方式,可以防止高原气压下,金属材料的基底变形,导致设置在基底上的光路元件产生变化,容纳空间内还可以设置第二支撑件和用于安装光路元件的光学基板,其中,第二支撑件可以为多个,第二支撑件的一端连接在安装面,第二支撑件的另一端与光学基板连接。In the above-mentioned embodiment, the first structural member may be a base, the second structural member may be a housing, one end of the connecting structure is arranged on the mounting surface of the base, and the other end of the connecting structure is connected to the housing, so that the housing and An accommodating space is formed between the installation surfaces; the film layer is in sealing connection with the peripheral side of the base and the side wall of the housing away from the accommodating space. And when the base is a metal material, the optical device can also include a second support and an optical substrate, one end of the second support is arranged on the mounting surface of the base, and the other end of the second support is connected to the optical substrate, wherein the optical The substrate is used for installing optical path components. This kind of arrangement can prevent the deformation of the base of the metal material under plateau pressure, resulting in changes in the optical path elements arranged on the base, and a second support member and an optical substrate for installing the optical path elements can also be arranged in the accommodation space, wherein , there may be multiple second support members, one end of the second support member is connected to the installation surface, and the other end of the second support member is connected to the optical substrate.
需要说明的是,当基底的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种时, 此种基底在高原气压下,产生的变形量较小,因此,光路元件可以设置于刚性基板上的安装面上。即光学器件中可以不设置第二支撑件以及光学基板,以降低光学器件的成本。其中,第二支撑件可以为橡胶材料。It should be noted that when the material of the substrate is any one of metal-ceramic composite materials, ceramics or glass, the amount of deformation of this kind of substrate is small under plateau pressure, so the optical path components can be arranged on the rigid substrate on the mounting surface. That is, the second supporting member and the optical substrate may not be provided in the optical device, so as to reduce the cost of the optical device. Wherein, the second supporting member may be rubber material.
在一种可能的实施例中,为了防止壳体受到外界应力变形后将应力传递到基底,导致光路元件受到影响,可以在壳体的侧壁远离容纳空间的一侧设置有加强件。In a possible embodiment, in order to prevent the housing from being deformed by external stress and transmitting the stress to the base, causing the optical path components to be affected, a reinforcing member may be provided on the side wall of the housing away from the accommodation space.
其中,加强件可以为螺丝。Wherein, the reinforcing member may be a screw.
在上述的实施例中,无论第一结构件和第二结构件选用哪种材质,都需要满足弹性模量大于等于130Gpa,热膨胀系数小于等于 另外,上述实施例中的光学器件的连接方式也可以应用于其他的封装结构中。 In the above-mentioned embodiment, no matter which material is selected for the first structural member and the second structural member, it is required to meet the requirement that the modulus of elasticity is greater than or equal to 130GPa, and the coefficient of thermal expansion is less than or equal to In addition, the connection manners of the optical devices in the above embodiments can also be applied to other packaging structures.
第二方面,本申请还提供了一种光模块,光模块可以包括第一方面的任一技术方案中的光学器件,其中,光学器件可以发射和接收光信号;光模块还可以包括电路板,光学器件可以设置在电路板上,由于,光学器件为第一方面中的光学器件,因此,光模块的成本较低。In the second aspect, the present application also provides an optical module, the optical module may include the optical device in any technical solution of the first aspect, wherein the optical device can transmit and receive optical signals; the optical module may also include a circuit board, The optical device may be arranged on the circuit board, and since the optical device is the optical device in the first aspect, the cost of the optical module is relatively low.
需要说明的是,光模块具体可以是波长选择开关,且当光模块为波长选择开关时,还可以包括外壳,电路板和光学器件可以叠层设置在外壳中。It should be noted that the optical module may specifically be a wavelength selective switch, and when the optical module is a wavelength selective switch, it may further include a casing, and the circuit board and the optical device may be stacked in the casing.
第三方面,本申请还提供了一种光交换系统,该光交换系统包括至少两个第一方面中的光学器件;至少两个光学器件之间可以通过光纤连接;由于,光学器件的成本比较低,因此,具有该光学器件的光交换系统的成本也比较低。In a third aspect, the present application also provides an optical switching system, which includes at least two optical devices in the first aspect; at least two optical devices can be connected by optical fibers; because the cost of the optical devices is relatively Low, therefore, the cost of the optical switching system with this optical device is also relatively low.
需要说明的是,光交换系统具体可以为波分光交换系统或数据中心光交换系统;当光交换系统为波分交换系统时,还可以包括与光学器件对应的合波器,合波器将光信号整合发送至光学器件,光学器件可以将该光信号接收并发送。更具体的,波分光交换系统中的光学器件可以为两个或者三个,此时,波分光交换系统中的合波器也至少为两个或者三个。It should be noted that the optical switching system can specifically be a wavelength division optical switching system or a data center optical switching system; when the optical switching system is a wavelength division switching system, it can also include a multiplexer corresponding to the optical device, and the multiplexer The signal is integrated and sent to optics, which can receive and transmit the light signal. More specifically, there may be two or three optical devices in the wavelength division optical switching system, and at this time, there are at least two or three multiplexers in the wavelength division optical switching system.
图1为本申请实施例提供的光学器件的一种局部结构示意图;FIG. 1 is a schematic diagram of a partial structure of an optical device provided in an embodiment of the present application;
图2为本申请实施例提供的光学器件的又一种局部结构示意图;Fig. 2 is another partial structural schematic diagram of the optical device provided by the embodiment of the present application;
图3为本申请实施例提供的光学器件的又一种局部结构示意图;Fig. 3 is another partial structural schematic diagram of the optical device provided by the embodiment of the present application;
图4为本申请实施例提供的光学器件的又一种局部结构示意图;Fig. 4 is another partial structural schematic diagram of the optical device provided by the embodiment of the present application;
图5为本申请实施例提供的光学器件的一种结构示意图;FIG. 5 is a schematic structural diagram of an optical device provided in an embodiment of the present application;
图6为本申请实施例提供的光学器件的又一种结构示意图;FIG. 6 is another schematic structural view of the optical device provided by the embodiment of the present application;
图7为本申请实施例提供的光学器件的又一种结构示意图;Fig. 7 is another schematic structural diagram of the optical device provided by the embodiment of the present application;
图8为本申请实施例提供的光学器件的又一种结构示意图;Fig. 8 is another schematic structural diagram of the optical device provided by the embodiment of the present application;
图9为本申请实施例提供的光模块的一种结构示意图;FIG. 9 is a schematic structural diagram of an optical module provided in an embodiment of the present application;
图10为本申请实施例提供的光交换系统的一种结构示意图。FIG. 10 is a schematic structural diagram of an optical switching system provided by an embodiment of the present application.
附图标记:Reference signs:
1、1a、1b、1c-光学器件;2-电路板;3-合波器;4a、4b、4c-分波器;10-第一结构件;10a-第一侧面;11-基底;20-第二结构件;20a-第二侧面;21-壳体;22-加强件;30-薄膜层;31a-第一镀层;31b-第一镀层;40-连接结构;41-第一支撑件;42a-第二镀层;42b-第二镀层;50-容纳空间;60-光路元件;70-第二支撑件;80-光学基板。1, 1a, 1b, 1c-optical device; 2-circuit board; 3-wave combiner; 4a, 4b, 4c-wave splitter; 10-first structure; 10a-first side; 11-base; 20 -Second structure; 20a-Second side; 21-Shell; 22-Reinforcing member; 30-Film layer; 31a-First coating; 31b-First coating; 40-Connection structure; 41-
为了使本申请的目的.技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.
传统的封装结构中,盒体与盒盖通常采用同种金属,通过平行封焊、激光焊接或在盒体和盒盖之间放置第三种金属进行低温焊接;如果将盒体和盒盖选择铝,一般采用激光焊接,设备成本较高,且在高原低气压环境中,铝材容易变形导致封装结构的高度超标;如果选择可伐材料,首先,可伐材料本身的成本较高,且对可伐材料进行平行封焊以及激光焊接的设备的成本也比较高。In the traditional packaging structure, the box body and the box cover are usually made of the same metal, and are welded at low temperature by parallel sealing welding, laser welding or placing a third metal between the box body and the box cover; if the box body and the box cover are selected Aluminum is generally laser welded, and the equipment cost is high. In the plateau and low pressure environment, the aluminum material is easily deformed and the height of the packaging structure exceeds the standard; The cost of equipment for parallel sealing welding and laser welding of Kovar materials is also relatively high.
为此,本申请实施例提供了一种光学器件,可以在保证光学器件气密性的同时,降低光学器件的成本。For this reason, the embodiment of the present application provides an optical device, which can reduce the cost of the optical device while ensuring the airtightness of the optical device.
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图和具体实施例对本申请提供的光学器件作进一步地详细描述。In order to make the purpose, technical solution and advantages of the application clearer, the optical device provided by the application will be further described in detail below in conjunction with the drawings and specific embodiments.
以下实施例中所使用的术语只是为了描述特定实施例的目的,而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样,单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式,除非其上下文中明确地有相反指示。The terms used in the following examples are for the purpose of describing particular examples only, and are not intended to limit the application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the" and "this" are intended to also Expressions such as "one or more" are included unless the context clearly dictates otherwise.
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此,在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例,而是意味着“一个或多个但不是所有的实施例”,除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”,除非是以其他方式另外特别强调。Reference to "one embodiment" or "some embodiments" or the like in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in other embodiments," etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean "one or more but not all embodiments" unless specifically stated otherwise. The terms "including", "comprising", "having" and variations thereof mean "including but not limited to", unless specifically stated otherwise.
图1为本申请实施例提供的光学器件的一种结构示意图,参照图1,在本申请提供的光学器件的实施例中,光学器件可以包括第一结构件10、第二结构件20、连接结构40和薄膜层30;连接结构40设置于第一结构件10与第二结构件20之间,第一结构件10和第二结构件20间可以通过连接结构40连接,而在连接时,连接结构40可以不提供密封的功能,待第一结构件10和第二结构件20连接完成后,薄膜层30覆盖第一结构件10与第二结构件20连接的位置,且薄膜层30可以将第一结构件10和第二结构件20的连接,以将第一结构件10和第二结构件20的连接处密封。此种设置方式中,由于薄膜层30可以产生微变形,形成应力释放,使第一结构件10和第二结构件20之间可以形成缓冲区域,在保证使第一结构件10与第二结构件20密封连接的前提下,对第一结构件10和第二结构件20膨胀系数的匹配要求相对较低,因此可以降低对第一结构件10和第二结构件20的材质要求,进而可以降低光学器件的成本。Fig. 1 is a schematic structural diagram of an optical device provided in the embodiment of the present application. Referring to Fig. 1, in the embodiment of the optical device provided in the present application, the optical device may include a first
上述的实施例中,第一结构件10和第二结构件20的材料可以相同,也可以不同,具体地,第一结构件10的材料可以为金属材料、金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,第二结构件20的材料也可以为金属材料、金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,薄膜层可以为金属薄膜层或者是高分子材料层,其中当薄膜层为金属薄膜层时,金属薄膜层的厚度可以为0.1~1mm,且金属薄膜层的材料可以、但不限为铜箔,下述的实施例中是以薄膜层为金属薄膜层为例进行说明的。In the above-mentioned embodiments, the materials of the first
继续参照图1,在一个具体的实施例中,第一结构件10和第二结构件20可均为金属 材料,连接结构40可以仅包括第一支撑件41,第一支撑件41分别与第一结构件10朝向第二结构件20的一端,以及第二结构件20朝向第一结构件10的一端焊接,薄膜层30可以分别与第一结构件10的第一侧面10a和第二结构件20的第二侧面20a焊接,以使第一结构件10和第二结构件20之间固定连接,且还可以使第一结构件10和第二结构件20之间密封。Continuing to refer to FIG. 1, in a specific embodiment, both the first
参照图2,在另一个具体实施例中,第一结构件10可以为金属材料,第二结构件20则可以为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,连接结构40可以包括第一支撑件41和第二镀层42a,第二镀层42a设置在第二结构件20朝向第一结构件10的一侧,第一支撑件的两端分别与第二镀层42a和第一结构件10连接,以将第一结构件10和第二结构件20连接;光学器件还可以包括第一镀层31a,第一镀层31a可以设置在第二结构件20的第二侧面20a,且第一镀层31a环绕于第二结构件20的第二侧面20a设置,以保证第一镀层31a与第二结构件20之间的密封性,薄膜层30可以分别与第一结构件10的第一侧面10a以及第一镀层31a焊接,进而完成对第一结构件10和第二结构件20的密封。Referring to Fig. 2, in another specific embodiment, the first
参照图3,在另一个具体实施例中,第一结构件10可以为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,第二结构件20则可以为金属材料,光学器件还可以包括第一镀层31b,第一镀层31b可以设置在第一结构件10的第一侧面10a,且第一镀层31b环绕于第一结构件10的第一侧面10a设置,薄膜层30可以分别与第一镀层31b以及第二结构件20的第二侧面20a焊接,以保证第一结构件10和第二结构件20的密封。另外,连接结构40可以包括第一支撑件41和第二镀层42b,其中,第二镀层42b设置在第一结构件10朝向第二结构件20的一侧,第一支撑件41的一端设置在第二镀层42b上,第一支撑件41的另一端与第二结构件20连接,以保证第一结构件10和第二结构件20之间稳定连接。Referring to Fig. 3, in another specific embodiment, the first
参照图4,在另一个具体实施例中,第一结构件10可以为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,第二结构件20也可以为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种,光学器件还可以包括两个第一镀层,两个第一镀层分别为第一镀层31a和第一镀层31b,第一镀层31a和第一镀层31b可以分别设置在第二结构件20的第二侧面20a和第一结构件10的第一侧面10a,且第一镀层31a和第一镀层31b可以分别环绕于第二结构件20的第二侧面20a和第一结构件10的第一侧面10a,以保证第一镀层31a与第二结构件20之间、以及第一镀层31b与第一结构件10之间密封连接,薄膜层30分别与第一镀层31a和第一镀层31b密封连接,从而保证第一结构件10和第二结构件20的密封。另外,连接结构40可以包括第一支撑件41和两个第二镀层,两个第二镀层分别为第二镀层42a和第二镀层42b,其中,第二镀层42a设置在第二结构件20朝向第一结构件10的第一侧,第二镀层42b设置在第一结构件10朝向第二结构件20的一侧,第一支撑件41的一端设置在第二镀层42b上,第一支撑件的41另一端与第二镀层42a连接,以保证第一结构件10和第二结构件20之间稳定连接。Referring to Fig. 4, in another specific embodiment, the first
需要说明的是,第一结构件10和第二结构件20的弹性模量可大于等于130Gpa,热膨胀系数小于等于
且第一结构件10和第二结构件20形成的密封结构在受外界因素影响下,形变较小。另外,上述的技术方案还可以应用于中大型气密产品场景(长、宽、高均大于100mm),以低成本实现更高的可靠性和气密的功能。例如可以应用在半导体高真空大型设备光刻机等场景,以克服现有技术中多种材料、温差以及复杂气体混合的限制。
It should be noted that the elastic modulus of the first
在上述的实施例中,第一结构件10和第二结构件20可以为电信号接口、光信号接口、 壳体以及基底等,第一结构件10和第二结构件20还以为其他的结构,此处不进行列举。In the above-mentioned embodiments, the first
下面以第一结构件10为基底11,第二结构件20为壳体21为例,进行详细的说明。The following takes the first
当第一结构件10为基底11,第二结构件20为壳体21时,光学器件可以包括基底11、壳体21、薄膜层30和连接结构40,基底11具有安装面,安装面可以安装光路元件60。壳体21可包括盖体以及连接于盖体一侧的侧壁,侧壁可围绕盖体的周侧设置。连接结构40的一端可以设置在安装面,连接结构40的另一端与壳体21的侧壁连接,以使壳体21和基底11之间形成容纳空间50。薄膜层30的一端与基底11的周侧连接,另一端与壳体21的侧壁远离容纳空间50的一侧密封连接,将基底11和壳体21的连接处密封,使壳体21和基底11之间形成的容纳空间50为密封空间。具体而言,形成上述的密封结构时,可以先将壳体21和基底11之间通过连接结构40连接,且在连接时可以不将壳体21和基底11进行密封,这样对壳体21和基底11的材质要求较低,从而有利于降低成本。当壳体21和基底11之间连接完成后,在壳体21和基底11的连接处设置薄膜层30,利用薄膜层30将壳体21和基底11之间形成的容纳空间50密封,由于薄膜层30可以产生微变形,形成应力释放,使基底11和壳体21之间形成缓冲区域,这样既可降低光学器件的成本,又可以降低基底11和壳体21膨胀系数的匹配要求,还可以保证光学器件的密封性,使设置在容纳空间50中的光路元件60能够在水汽和气体密封相对稳定的环境中工作。When the first
继续参照图5,当基底11为金属材料制备,壳体21也为金属材料制备时,连接结构40可以包括第一支撑件41,第一支撑件41可以分别与基底11和壳体21通过焊接的方式连接。或者,基底11与壳体21之间也可以使用连接件连接(图中未显示),即采用机械连接的方式连接。另外,薄膜层30可以环绕于基底11的周侧以及壳体21的侧壁远离容纳空间50的一侧,且薄膜层30可以与基底11的周侧,以及壳体21的侧壁之间通过焊接的方式密封连接。Continuing to refer to FIG. 5, when the
需要说明的是,由于基底11为金属材料制备,在高原气压下存在变形的风险,为了避免光路元件60受到金属基底11变形的影响,保证设置在容纳空间50中的光路元件60能够稳定的工作,可以在容纳空间50中设置有第二支撑件70和光学基板80,第二支撑件70的一端固定设置在安装面上,第二支撑件70的另一端用于支撑光学基板80,光路元件60设置在光学基板80背离第二支撑件70的一面,当基底11产生变形时,由于第二支撑件70以及光学基板80的设置,可以防止光路元件60的位置改变,从而提高光路元件60工作的稳定性。另外,在壳体21的侧壁上可设置有加强件22,加强件22的设置可以减小壳体21在受到外界应力变形后传递到基底11的应力,从而减小对光路元件60的影响。It should be noted that since the
图6为本申请实施例提供的光学器件的一种结构示意图。在图6所示的实施例中,基底11可以采用金属材料制备,壳体21可以采用金属陶瓷复合材料、陶瓷或者玻璃中的任意一种制备。参照图6,基底11与壳体21之间可以通过连接结构40连接,或者也可以采用机械连接的方式连接(图中未显示)。当基底11与壳体21通过连接结构40连接时,连接结构40可以包括第二镀层42a和第一支撑件41,第二镀层42a可以设置于壳体21的侧壁朝向基底11的一端,第一支撑件41则可固定于第二镀层42a与基底11的安装面之间。第一支撑件41为刚性件元件,以保证基底11与壳体21连接形成体积改变量较小的光学器件。另外,金光学器件还可以包括第一镀层31a,第一镀层31a设置在壳体21的侧壁远离容纳空间50的一侧,且第一镀层31a环绕于壳体21的侧壁设置;在将基底11与壳体21之间的连接处密封时,薄膜层30的一端与第一镀层31a焊接,另一端与及基底11的周侧 焊接,以将壳体21与基底11之间形成的容纳空间密封。FIG. 6 is a schematic structural diagram of an optical device provided by an embodiment of the present application. In the embodiment shown in FIG. 6 , the
需要说明的是,薄膜层30与第一镀层31a之间可以通过熔融的方式进行密封连接,也可以采用焊锡等低温度的金属融化形成金属间化合物进行密封连接,薄膜层30与第一镀层31a还可以通过其他的方式密封连接,此处不进行列举。It should be noted that the sealing connection between the
由于基底11为金属材料制备,在高原气压下存在变形的风险,为了避免光路元件60受到金属基底11变形的影响,保证设置在容纳空间50中的光路元件60能够稳定的工作,在高原气压下,金属基底11变形,光路元件60不会受到影响,可以在容纳空间50中设置有第二支撑件70和光学基板80,其中,第二支撑件70可以为刚性材料制备,第二支撑件70的一端固定设置在安装面上,第二支撑件70的另一端用于支撑光学基板80,光路元件60设置在光学基板80背离第二支撑件70的一面,当基底11产生变形时,由于第二支撑件70以及光学基板80的设置,可以防止设置于光路元件60的位置改变,从而提高光路元件60工作的稳定性。另外,在壳体21的侧壁上设置有加强件22,加强件22的设置可以减小壳体21在受到外界应力变形后传递到基底11的应力,从而减小对光路元件60的影响。Since the
图7为本申请实施例提供的光学器件的一种结构示意图。在图7所示的实施例中,基底11可以采用金属陶瓷复合材料、陶瓷或者玻璃中的任意一种制备,壳体21可以采用金属材质制备。参照图7,基底11与壳体21之间通过连接结构40连接,或者也可以采用机械连接的方式连接。当基底11与壳体21通过连接结构40连接时,连接结构40可以包括第二镀层42b和第一支撑件41,第二镀层42b可以设置在基底11的安装面,第一支撑件41则可设置于第二镀层42b与壳体21的侧壁朝向基底11的一端,且第一支撑件41的一端可以与第二镀层42b连接,第一支撑件41的另一端可以与壳体21的侧壁朝向基底11的一端连接,以使基底11与壳体21固定连接。具体实施时,第一支撑件41可以为刚性件元件,以保证基底11与壳体21连接形成体积改变量较小的光学器件。另外,光学器件可以包括第一镀层31b,第一镀层31b设置在基底的周侧,且第一镀层31b可环绕基底11的周侧设置;在将基底11与壳体21之间的连接处密封时,薄膜层30的一端与第一镀层31b焊接,另一端与壳体21的侧壁远离容纳空间的一侧焊接,以将壳体21与基底11之间形成的容纳空间密封。FIG. 7 is a schematic structural diagram of an optical device provided by an embodiment of the present application. In the embodiment shown in FIG. 7 , the
需要说明的是,薄膜层30与第一镀层31b之间可以通过熔融的方式进行密封连接,也可以采用焊锡等低温度的金属融化形成金属间化合物进行密封连接,薄膜层30与第一镀层31b还可以通过其他的方式密封连接,此处不进行列举。It should be noted that the sealing connection between the
当基底11的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种时,基底11在高原气压下不会产生变形,因此,光路元件60可以直接设置于刚性基板10上的安装面上,这样形成的密封结构中可以不设置光学基板,从而可以降低成本。When the material of the
图8为本申请实施例提供的光学器件的一种结构示意图。在图8所示的实施例中,基底11可以采用金属陶瓷复合材料、陶瓷或者玻璃中的任意一种制备,壳体21也可以采用金属陶瓷复合材料、陶瓷或者玻璃中的任意一种制备。参照图8,基底11与壳体21之间可以使用连接结构40连接,或也可以采用机械连接的方式连接。当基底11与壳体21通过连接结构40连接时,连接结构40可以包括第一支撑件41和两个第二镀层,两个第二镀层分别为第二镀层42a和第二镀层42b,第二镀层42b可以设置在基底11的安装面,第二镀层42a可以设置在壳体21的侧壁朝向基底11的一端,第一支撑件41设置在第二镀层 42a与第二镀层42b之间,且第一支撑件41的一端与第二镀层42b连接,第一支撑件41的另一端与第二镀层42a连接,以使基底11与壳体21固定连接。其中,第一支撑件41可以为刚性件元件,以保证基底11与壳体21连接形成体积改变量较小的光学器件。FIG. 8 is a schematic structural diagram of an optical device provided by an embodiment of the present application. In the embodiment shown in FIG. 8 , the
其中,第一支撑件41可以为至少三个,第二镀层42a也可以设置有至少三个,至少三个第二镀层42a与至少三个第一支撑件41一一对应设置,另外,第一支撑件41也可以为一个整体,第二镀层42a可以布满壳体21朝向基底11的一侧。Wherein, there can be at least three
另外,光学器件可以包括两个第一镀层,两个第一镀层分别为第一镀层31a和第一镀层31b,第一镀层31a可设置在壳体21的侧壁远离容纳空间50的一侧,且第一镀层31a可环绕于壳体21的侧壁设置;第一镀层31b可设置在基底11的周侧,且第一镀层31b可环绕基底11的周侧设置;在将基底11与壳体21之间的连接处密封时,薄膜层30的两端可分别与第一镀层31a和第一镀层31b焊接,以使壳体21与基底11之间形成的容纳空间密封。In addition, the optical device may include two first coating layers, the two first coating layers are respectively a
需要说明的是,薄膜层30与第一镀层31a和第一镀层31b之间可以通过熔融的方式进行密封连接,也可以采用焊锡等低温度的金属融化形成金属间化合物进行密封连接,薄膜层30与第一镀层31a和第一镀层31b还可以通过其他的方式密封连接,此处不进行列举。It should be noted that the sealing connection between the
当基底11的材料为金属陶瓷复合材料、陶瓷或者玻璃中的任意一种时,种基底在高原气压下产生的形变较小,因此,光路元件60可以直接设置于刚性基板10上的安装面上,这样形成的密封结构中可以不设置光学基板,从而可以降低成本。When the material of the
参照图9,本申请还提供了一种光模块,光模块包括上述任一技术方案中的光学器件,还包括电路板2,光学器件1可以设置在电路板2上,光学器件1可以发射和接收光信号。由于,光学器件1为第一方面中的光学器件,因此,光模块的成本较低。Referring to Figure 9, the present application also provides an optical module, the optical module includes the optical device in any of the above technical solutions, and also includes a
需要说明的是,光模块具体可以、但不限制是波长选择开关,且当光模块为波长选择开关时,还可以包括外壳,电路板2和光学器件1可以叠层设置在外壳中。It should be noted that the optical module may specifically be, but not limited to, a wavelength selective switch, and when the optical module is a wavelength selective switch, it may also include a casing, and the
参照图10,本申请还提供了一种光交换系统,光交换系统可以包括至少两个上述任一技术方案中的光学器件,至少两个光学器件之间可以通过光纤连接,因光学器件的成本比较低,具有该光学器件的光交换系统的成本也比较低。Referring to Figure 10, the present application also provides an optical switching system, the optical switching system may include at least two optical devices in any of the above-mentioned technical solutions, at least two optical devices may be connected by optical fibers, because the cost of optical devices The cost of the optical switching system with the optical device is also relatively low.
其中,光学器件可以插拔于电路板上,或者是设置于电路板,或者是光学器件独立设置,且当学器件独立设置时,光学器件可以通过光纤与外界进行光通信。另外,光交换系统具体可以、但不限制为波分光交换系统或数据中心光交换系统;当光交换系统为波分交换系统,且包括的光学器件为多个时,可以包括与光学器件对应的多个分波器和多个合波器3,以三个例:其中,与光学器件1a对应的分波器4a可以将光信号分为两个光信号,两个光信号可以分别被光学器件1b和光学器件1c接收,同理,与光学器件1b对应的分波器4b可以将光信号分为两个光信号,两个光信号可以分别被光学器件1a和光学器件1c接收;与光学器件1c对应的分波器4c也可以将光信号分为两个光信号,两个光信号可以分别被光学器件1a和光学器件1b接收,进而完成光交换。Wherein, the optical device can be plugged on the circuit board, or arranged on the circuit board, or the optical device is independently installed, and when the optical device is independently installed, the optical device can perform optical communication with the outside through the optical fiber. In addition, the optical switching system may specifically be, but not limited to, a wavelength division optical switching system or a data center optical switching system; when the optical switching system is a wavelength division switching system and includes multiple optical devices, it may include A plurality of wave splitters and a plurality of wave combiners 3, with three examples: wherein, the
需要说明的是,上述的光信号可以通过光纤传输。It should be noted that the above-mentioned optical signal may be transmitted through optical fiber.
以上,仅为本申请的具体实施方式,但本申请的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本申请揭露的技术范围内,可轻易想到变化或替换,都应涵盖在本申请的保护范围之内。因此,本申请的保护范围应以权利要求的保护范围为准。The above is only the specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the application, and should cover Within the protection scope of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
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| CN202111651160.9A CN116430526A (en) | 2021-12-30 | 2021-12-30 | Optical devices, optical modules and optical switching systems |
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