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WO2023123804A1 - Motif conducteur et son procédé de formation - Google Patents

Motif conducteur et son procédé de formation Download PDF

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Publication number
WO2023123804A1
WO2023123804A1 PCT/CN2022/091960 CN2022091960W WO2023123804A1 WO 2023123804 A1 WO2023123804 A1 WO 2023123804A1 CN 2022091960 W CN2022091960 W CN 2022091960W WO 2023123804 A1 WO2023123804 A1 WO 2023123804A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
layer
conductive pattern
base layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/091960
Other languages
English (en)
Chinese (zh)
Inventor
徐国良
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Dream Ink Technology Co Ltd
Original Assignee
Beijing Dream Ink Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Dream Ink Technology Co Ltd filed Critical Beijing Dream Ink Technology Co Ltd
Publication of WO2023123804A1 publication Critical patent/WO2023123804A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern

Definitions

  • Step S32 applying insulating ink on the entire surface of the base layer, obtaining a patterned insulating layer through selective photocuring technology, and removing uncured insulating ink;
  • the insulating layer 40 may be a solder resist layer formed of solder resist.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente demande se rapporte au domaine technique de la fabrication de circuits électroniques. Sont divulgués un motif conducteur et son procédé de formation. Le procédé de formation d'un motif conducteur comprend : la fourniture d'une couche de base ; la formation d'une couche de libération à motifs sur la couche de base, au moins une première région étant cohérente avec un motif conducteur cible étant présente dans une région de la couche de base qui n'est pas recouverte par la couche de libération ; et l'application d'un matériau conducteur sur la première région de la couche de base, de façon à former une ligne conductrice cohérente avec le motif conducteur cible. Dans la présente demande, une couche de libération à motifs est formée sur une couche de base, et en utilisant la caractéristique de faible adhérence de la couche de libération sur un matériau conducteur et en combinaison avec la caractéristique d'adhérence élevée de la couche de base sur le matériau conducteur, une interface d'adhérence sélective pour former des motifs sur le matériau conducteur est réalisée ; et à ce moment, le matériau conducteur peut être formé en un motif conducteur au moyen d'un processus de formation de non-formation de motifs. Par comparaison avec un procédé de gravure chimique classique, la présente demande présente les avantages d'un processus simple, d'une vitesse de formation élevée et de faibles coûts.
PCT/CN2022/091960 2021-12-30 2022-05-10 Motif conducteur et son procédé de formation Ceased WO2023123804A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111645152.3A CN116419495A (zh) 2021-12-30 2021-12-30 一种导电图案及其成型方法
CN202111645152.3 2021-12-30

Publications (1)

Publication Number Publication Date
WO2023123804A1 true WO2023123804A1 (fr) 2023-07-06

Family

ID=86997301

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/091960 Ceased WO2023123804A1 (fr) 2021-12-30 2022-05-10 Motif conducteur et son procédé de formation

Country Status (2)

Country Link
CN (1) CN116419495A (fr)
WO (1) WO2023123804A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002163945A (ja) * 2000-09-14 2002-06-07 Canon Inc 導電性膜及び画像形成装置の製造方法
CN108575056A (zh) * 2017-03-07 2018-09-25 宏启胜精密电子(秦皇岛)有限公司 柔性电路板制作方法
CN110612783A (zh) * 2017-05-16 2019-12-24 住友电工印刷电路株式会社 印刷配线板及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002163945A (ja) * 2000-09-14 2002-06-07 Canon Inc 導電性膜及び画像形成装置の製造方法
CN108575056A (zh) * 2017-03-07 2018-09-25 宏启胜精密电子(秦皇岛)有限公司 柔性电路板制作方法
CN110612783A (zh) * 2017-05-16 2019-12-24 住友电工印刷电路株式会社 印刷配线板及其制造方法

Also Published As

Publication number Publication date
CN116419495A (zh) 2023-07-11

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