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WO2023108248A1 - Composition de matériau nanocomposite à base de précurseurs carboniques dispersés dans des matrices polymères, procédé d'obtention du matériau et son utilisation - Google Patents

Composition de matériau nanocomposite à base de précurseurs carboniques dispersés dans des matrices polymères, procédé d'obtention du matériau et son utilisation Download PDF

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Publication number
WO2023108248A1
WO2023108248A1 PCT/BR2022/050509 BR2022050509W WO2023108248A1 WO 2023108248 A1 WO2023108248 A1 WO 2023108248A1 BR 2022050509 W BR2022050509 W BR 2022050509W WO 2023108248 A1 WO2023108248 A1 WO 2023108248A1
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Prior art keywords
graphite
resins
acrylic
phase
range
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Ceased
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PCT/BR2022/050509
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English (en)
Portuguese (pt)
Inventor
Sílvia Vaz Guerra NISTA
Larissa Giorgetti MENDES
Stanislav MOSHKALEV
Raluca SAVU
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Andere E Souza Fibras Plasticas Eireli
Universidade Estadual de Campinas UNICAMP
Original Assignee
Andere E Souza Fibras Plasticas Eireli
Universidade Estadual de Campinas UNICAMP
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Priority claimed from BR102021025585-4A external-priority patent/BR102021025585A2/pt
Application filed by Andere E Souza Fibras Plasticas Eireli, Universidade Estadual de Campinas UNICAMP filed Critical Andere E Souza Fibras Plasticas Eireli
Publication of WO2023108248A1 publication Critical patent/WO2023108248A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L43/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and containing boron, silicon, phosphorus, selenium, tellurium or a metal; Compositions of derivatives of such polymers
    • C08L43/04—Homopolymers or copolymers of monomers containing silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/04—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of carbon-silicon compounds, carbon or silicon

Definitions

  • the present invention relates to a composition of composite material, specifically nanocomposite material based on carbonic precursors and polymeric matrices, more specifically nanocomposite material in the form of presentation of slurry, paste and film.
  • the application area of the present invention is mainly in obtaining thermal interfaces, specifically for LEDs, electronic devices and devices that require efficient heat sinks.
  • the materials used as a thermal interface are basically rigid graphite or oxide films, which do not allow perfect coupling to the devices, leaving air gaps at the interfaces, which impair thermal conduction.
  • the ideal thermal interface material is a material with good heat dissipation performance, mainly used to conform to uneven surfaces, expelling air in the contact areas, in order to improve the thermal conductivity of the interface.
  • the advantages in the production of carbon-based composites, using polymeric matrices, in relation to pure graphitic films are the ease of handling and preparation of the material, high mechanical resistance, greater flexibility and durability, with consequent reduction of production cost. However, they present as a challenge, the loss of performance in terms of electrical/thermal conductivity, due to the high resistance presented by the polymer matrices.
  • High thermal conductivity is one of the most important characteristics of carbon-based material and various types of fillers are available for thermal interface applications. These incorporated in state-of-the-art polymers, present excellent performance as thermal interface materials based on their ability to fill gaps and microscopic grooves in the mating surfaces, strongly reducing the thermal contact resistance.
  • the patent document BR102019026731 establishes a process for obtaining a composite material that conducts temperature and electricity based on calendering, which comprises 10 to 40% of expanded graphite or graphene , 30 to 50% resin (thickener, rheological agent or polyelectrolyte and/or hydrocolloid) and a suitable solvent.
  • calendering which comprises 10 to 40% of expanded graphite or graphene , 30 to 50% resin (thickener, rheological agent or polyelectrolyte and/or hydrocolloid) and a suitable solvent.
  • the material of the technology of the said document is initially in the form of a conductive paste, which can be used in the preparation of flexible heating films for application in insoles.
  • BR102019026731 it is necessary to apply the paste produced on a permanent substrate to provide mechanical resistance to the material , such as , for example , on a metallic film or polymeric film .
  • the BR102019026731 material is not mechanically supported by itself due to a high mechanical resistance to traction and flexion.
  • this permanent substrate for film formation. Only a temporary support is used, which is later detached, as the material is self-sustaining and has high mechanical resistance to traction and flexion.
  • Patent document US2015266739 discloses a process for producing a graphitic film , comprising the steps of : ( a ) mixing graphene platelets with a carbon precursor polymer and a liquid to form a paste and form a paste into a film wet under the influence of an orientation-inducing stress field to align graphene platelets on a solid substrate; (b) removing the liquid to form a precursor polymer composite film, (c) carbonizing the precursor polymer composite film to obtain a carbonized composite film; and (d) thermally treating the carbonized composite film to obtain the graphitic film.
  • said document uses a process of aligning the graphite platelets during the drying of the material, uses a carbonization process at 2000°C, roller pressing and graphitization at 2500°C, so that the polymer in this case it is just the precursor to obtaining the film, not being part of the final composition.
  • said process has a low carbon yield at the end of approximately 50%.
  • Patent document CN109369873 describes the preparation of a precursor bicomponent paste for the preparation of conductive polyurethane, comprising 0.1 to 80% of component A and 20 to 99.99% of component B, with component A including a or more of graphene, graphene oxide, natural graphite, artificial graphite, graphite oxide, expanded graphite, carbon nanotube, aluminum oxide, aluminum nitride, magnesia, magnesium nitride, silicon, silica, silicon carbide, boron, boron oxide, boron nitride, boron carbide, calcium carbonate, mica powder, wollastonite, talcum powder;
  • Component B includes one or more of polyether polyol, polyester polyol, hydroxyl telecyclic polyester, hydroxyl-end polyether, polyesteramide, polycarbonate polyol, polyester ether polyol, polycaprolactone, polyether-modified organic silicon, the hydroxyl polyacetals, polyamines, polytetrahydro
  • Patent document US2016168037 describes a method for manufacturing a thermal interface material that includes a thermally conductive filler (charge particle), a polymeric matrix with an elastic force and an insulating coating layer applied on one of the faces, whereby the formation of a film takes place through the extrusion process using molten polymer, based on thermoplastic elastomeric polyamide, polyester or TPE.
  • a thermally conductive filler charge particle
  • a polymeric matrix with an elastic force and an insulating coating layer applied on one of the faces
  • the process of preparing the film by hot extrusion limits its application because it uses specific and high-value equipment, in addition to a methodology that reduces the possibility of dispersion of the filler in the polymeric matrix, unlike the solvent method used in the present invention.
  • Patent document US20200024496 discloses a thermal interface material for heat transfer comprising a graphite film and a fluid substance, wherein the graphite film has a thickness of 100 nm to 15 pm and a fluid substance weight ratio for graphite film it is from 0.08 to 25.
  • the flowable substance can be an epoxy resin, a silicone polymer or an acrylic polymer.
  • the thermal interface proposed in that document is composed of two layers.
  • One of them is a very thin graphite film (low mechanical resistance due to its own characteristics) produced from an aromatic polymer film, preferably polyimides, carbonized and graphitized at high temperatures, producing a practically pure carbon film.
  • the second layer is composed of a fluid substance (low thermal conduction) which can be a gel, a grease, a wax, or a polymer (acrylic, epoxy and silicone), solid at a temperature of 20°C and fluid under low pressure.
  • the thermal interface is applied by placing the graphite film between two layers of fluid substance to reduce the formation of air gaps between the interface and the application material.
  • the thermal interface production process is completely different from the present invention .
  • the role of filling air gaps by improving substrate interface interaction is performed by the heat-conducting material itself (interface paste, slurry).
  • the proposed material is composed of a single phase, facilitating its application to the substrate, providing a better reduction of air gaps in the application due to the possibility of applying it in the form of paste or slurry directly on the substrate, without the need to apply an additional phase.
  • the present invention relates to a composition of composite material, specifically nanocomposite material based on carbon precursors and polymeric matrices, more specifically nanocomposite material in the form of presentation of slurry, paste and film.
  • said composition was developed comprising a carbonic precursor, filler particles, a polymeric base, and optionally additives.
  • the process of obtaining the material comprises specific stages that differ in order to obtain the different forms of presentation of the material, justifying its use in the preparation of thermal interfaces in LEDs, electronic devices, heat sinks and heat pipes.
  • FIG. 1 shows the general flowchart of the process of the present invention.
  • Acrylic Resins refers to Acrylic Resin Type A, which corresponds to a styrenated Acrylic Resin, acrylic copolymer in aqueous emulsion, 52% content of solids, elastic and flexible finish indicated for general use and Acrylic Resin Type B corresponds to a styrenated Acrylic Resin, anionic acrylic copolymer in aqueous emulsion, 44% solids content, use indicated for stamping;
  • High Silicone Resin temperature refers to Silicone Resin Type C which corresponds to silicone resin resistant to high temperature up to 250°C, with 60% solids and low molecular weight, with a medium hardness finish and Silicone Resin Type D which corresponds to silicone resin high temperature resistant up to 650°C with a soft, flexible finish with 50% solids; Silicone Rubber which refers to Type E Silicone Rubber corresponds to two-component silicone rubber (1RS) and Silicone Rubber.
  • Silicone Type F corresponds to one component silicone rubber (1GS).
  • Figure 3 shows the preferred formulations obtained from Acrylic Resin Type A with water base: a) 3A - 65% graphite and 35% acrylic resin; 3B - 35% graphite and 65% acrylic resin; 3C - 65% graphite and 35% acrylic resin + additive (coalescent).
  • Figure 4 shows the preferred formulations obtained from Acrylic Resin, including additives to improve thermal properties, for application at medium temperature: a) 4A - 65% graphite and 35% Acrylic Resin Type B; b) 4B - 65% graphite and 35% Acrylic Resin Type A with inclusion of 1% additive (coalescent).
  • Figure 5 shows the preferred formulations obtained from Silicone Resin Type C suitable for high temperature, and with solvent base: a) 5A - 28% of graphite and 73% of resin; 5B - 24% graphite and 76% resin; 5C - 21% graphite and 79% resin.
  • Figure 6 shows the preferred formulations obtained from Silicone Resin Type D suitable for high temperature, and solvent-based: a) 6A - 18% graphite and 82% resin; 6B - 27% graphite and 73% resin).
  • Figure 7 shows the best formulations of the composition based on Type E Silicone Rubber for solvent-based: a) 7A - 10% graphite and 90% resin; 7B - 15% graphite and 85% resin; 7C - 20% graphite and 80% resin.
  • Figure 8 shows the best formulations of the composition based on Type F Silicone Rubber, with solvent base: a) 8A - 10% graphite and 90% resin; 8B - 15% graphite and 85% resin; 8C - 20% graphite and 80% resin.
  • Figure 9 shows the best formulation based on acrylic resin (Thermo CCS1), comprising 35% graphite, 65% resin and 1% coalescent.
  • Figure 11 shows the preferred formulations obtained by Type D Silicone Resins with solvent base: a) 12A - 27% graphite and 73% resin; b) 12B - 25% graphite and 75% resin; c) 12C - 21% graphite and 79% resin.
  • Figure 12 shows the best formulations of the composition based on Silicone Rubber Type E: a) 13A - 10% graphite and 90% resin; b) 13B - 15% graphite and 85% resin; C) 13C - 20% graphite and 80% resin.
  • resistivity is compared to the percentage of graphite in the formulations obtained with Acrylic Resin type A.
  • Figure 18 shows a graph of resistivity versus graphite content, highlighting the resistivity of Type C Silicone Resin with 21.15% graphite.
  • Figure 19 shows the variation in thermal conductivity in relation to the graphite:polymer ratio.
  • Figure 20 shows the relationship between thermal conductivity and density can be seen, presenting behavior very similar to the graphite : polymer ratio, since this relationship directly influences the density of the material.
  • Figure 21 shows the average values of thermal conductivity in relation to the percentage of graphite, in relation to density, and in relation to the graphite:polymer ratio.
  • Figure 22 shows the resistivity values of the acrylic material in relation to the percentage of graphite.
  • Figure 23 shows the resistivity values of the acrylic material in relation to density.
  • Figure 24 shows the resistivity values of the base paste material in relation to graphite (between 2% and 25%).
  • Figure 25 shows the thermal conductivity values of the base paste material in relation to the percentage of graphite (between 2% and 25).
  • Figure 26 shows a top view of the board with the power cables and sensor cables connected.
  • FIG. 27 shows the characteristic thermal curves (CTCs) obtained in the test carried out on the module.
  • FIG. 28 shows the characteristic thermal curves (CTCs) obtained in the tests carried out on the spot. Detailed description of the invention:
  • the present invention relates to a composition of composite material specifically of nanocomposite material based on carbonic precursors and polymeric matrices, more specifically to nanocomposite material in the form of presentation of slurry, paste and film comprising:
  • a carbon precursor selected from graphite, expanded graphite, graphene, multilayer graphene and carbon nanoribbons;
  • charge-conducting particles selected from metallic oxides, microstructured ceramics, nanostructured ceramics;
  • thermopolymerizable acrylic resins self-polymerizable acrylic resins, thermoactivated acrylic resins, photoactivated acrylic resins, microwave energy activated acrylic resins, styrene acrylic resins, silicone resins, hot vulcanized silicone rubber, cold vulcanized silicone rubber, liquid rubbers, high temperature resistant silicone resins, one component epoxy resins, two component epoxy resins, fluorinated resins, biopolymers, water soluble polymers , polymers soluble in organic solvents ;
  • additives selected from among rheological modifiers, dispersants, coalescing, antifoam, bactericidal, catalysts, corrosion inhibitor, organic and/or aqueous solvents.
  • Said additives are preferably in the proportion of:
  • Rheological modifiers in the range of 0 to 2%, preferably 0.5%.
  • Bactericidal in the range of 0 to 1%, preferably 0.3%.
  • Dispersant in the range of 0 to 1%, preferably
  • Surfactant in the range of 0 to 1%, preferably
  • Corrosion inhibitor in the range of 0 to 1%, preferably 0.1%.
  • Said preferred carbonic precursor is expanded graphite.
  • Said charge-conducting particles may be quartz, barite, zinc oxide and micronized clay, mica, talc, but are preferably made of zinc oxide.
  • Said polymer base is preferably selected from styrene acrylic resin (corresponding to Type A and B), silicone rubber (corresponding to Type E and F), silicone gel, high temperature resistant silicone resins (corresponding to Type C and D), acrylic resin, fluorinated resins.
  • the process for obtaining said material essentially comprises the steps of: a) Preparation of a first phase from the mixture of a rheological agent and a solvent; b) Preparation of a second phase from the mixture of a polymeric base, a solvent, filler particles and additives; c) Preparation of a third phase by dispersing the carbonic material in solvent or resin by mechanical agitation and/or sonication for at least 10 min, with rotation between 70rpm and 300rpm; d) Addition of the first phase to the second phase with the aid of mechanical agitation for at least 10 min, with rotation between 70rpm and 300 rpm; e) Addition of the third phase in the hybrid phase obtained by adding the first phase to the second phase, by mechanical agitation and/or sonication for at least 10 min, with rotation between 70rpm and 300rpm. f) Optionally addition of filler particles under mechanical agitation for at least 10 min, with rotation between 70 rpm and 300 rpm.
  • the hybrid mixture in the form of a slurry obtained in step (e) must be subjected to the following substeps: el) Application of the slurry on a non-stick substrate with thickness control in the application ; e.2) Drying and/or curing; e.3) Mechanical separation of the film from the substrate; e.4) Cut the material to the desired dimensions.
  • the rheological agent is preferably selected from hydroxymethylcellulose (HEC), carboxymethylcellulose (CMC), ethylcellulose (EC), organic derivative of hectorite clay, associative acrylic thickener (HASE), aqueous emulsion of acrylic copolymer.
  • HEC hydroxymethylcellulose
  • CMC carboxymethylcellulose
  • EC ethylcellulose
  • HPA associative acrylic thickener
  • aqueous emulsion of acrylic copolymer aqueous emulsion of acrylic copolymer.
  • step (b) the polymeric base and filler particles and additives are selected from among the alternatives mentioned in paragraph [056].
  • step (c) the carbonic precursor material is chosen from among the alternatives mentioned in paragraph [056].
  • the controlled thickness must be in the range of 0.1 to 5.0 mm, preferably 0.5 mm.
  • drying and/or curing can occur at room temperature, at 90°C, at room temperature followed by oven drying, at room temperature followed by muffle curing at 180°C and 200° C, in which drying times can vary from 30 min to 72 hours, depending on the resin used.
  • step e.3) the separation preferably occurs by peel-off at room temperature.
  • said material when in the form of a slurry, should preferably be stored in tubes made of polypropylene (PP). When in paste form, said material can be stored in pots or tubes also made of polypropylene (PP). In the case of films, they must first be packaged in silicone paper and then in polyethylene (PE) bags. Storage is carried out at room temperature in said closed packages.
  • PP polypropylene
  • PE polyethylene
  • the solvents used in all stages are selected from water, xylol, isopropyl alcohol, benzyl alcohol, turpentine, ethyl alcohol, acetic acid. Said solvents are preferably selected according to the characteristic of the desired thermal interface and the degree of solubility of the polymer to meet the desired application.
  • the present invention further comprises the use of said composition in the preparation of a thermal interface from the application of slurry with a viscosity of less than 100000000 cP on a surface.
  • the present invention further comprises the use of said composition in the preparation of a thermal interface from the application of paste with an average viscosity of 100,000 cP on a surface.
  • the present invention further comprises the use of said composition in the preparation of a thermal interface on a surface from the deposition and/or bonding of a film with a thickness of 0.1 to 5.0 mm, preferably 0.5 mm.
  • Acrylic polymeric base for application at medium temperature water base
  • Table 1 Results regarding the electrical resistivity and mechanical properties of the acrylic resin base film.
  • Table 4 Results regarding the electrical resistivity and mechanical properties of the material based on type D silicone resin with additives.
  • Figure 16 compares the resistivity in relation to the percentage of graphite in the formulations obtained with Acrylic Resin Type A.
  • sample 19 presented itself as the best formulation in a rapid temperature resistance test, which basically consists of applying the sample at low temperature for 7 consecutive days at 100 °C, maintaining its thermal conductivity around 11.94 W/mK, and with a mass loss of 1.36%.
  • Type C Silicone Resin with three different percentages of graphite, as shown in Table 12.
  • Figure 18 shows a graph of resistivity versus graphite content, highlighting the resistivity of Type C Silicone Resin with 21.2% graphite.
  • Silicone Resin Type C was made from commercial silicone resin and Silicone Resin Type D was made from commercial silicone resin.
  • Figure 19 shows the variation in thermal conductivity in relation to the ratio graphite: polymer, so that the ratios of 1:2.9 and 1:1.56 showed the highest conductivity values.
  • Figure 21 shows the average values of thermal conductivity in relation to the percentage of graphite, in relation to density, and in relation to the ratio graphite:polymer.
  • Figure 22 and Figure 23 show the resistivity values in relation to the percentage of graphite and the resistivity values in relation to the density, respectively, but with non-uniform behavior.
  • the Young's Modulus or Tensile Modulus (TE) in this case is the ratio between the nominal tensile stress and the corresponding strain, below the limit of proportionality of the material.
  • Young's modulus also called modulus of elasticity, can be related to the fragility of the material . It fundamentally depends on the interatomic bonding forces of the material, that is, it represents a measure of the bonding forces existing between atoms, ions and molecules in the material. The higher the modulus, the lower the elastic deformation, that is, the less flexible the material is in terms of mechanical traction, breaking faster when fractionated.
  • thermodynamic calibration consists of extracting the response of thermal transients from each layer of material that makes up the system (from the internal components of the LED, its solder, to the copper rails of the MCPCB, passing through the dielectric layer of the printed circuit and through the metal of the MCPCB itself, then through the thermal interface and reaching the environment through the heat sink) .
  • Calibration is done by recording the thermal parameters of the set, measured at intervals of 10°C, in a temperature range from 15°C to 65°C, with the heat sink partially submerged in a bathtub of recirculation, to obtain the thermal stabilization more quickly, the measurements in each temperature interval are only made when the complete set reaches the thermal stability.
  • Standard JESD51-51 Implementation of the Electrical Test Method for the Measurement of Real Thermal Resistance of Light-Emitting Diodes.
  • Transient tests are performed using customer supplied power parameters and it is during these tests that characteristic thermal curve data and junction temperatures are captured and stored for further processing.
  • the luminaires were positioned suspended with the heatsink fins facing upwards perpendicular to the gravitational acceleration (operating position) in a temperature-controlled environment, with the ambient air temperature fixed at 25°C.
  • Table 16 shows the temperature measured at the junction of the LEDs, in °C, after thermal stabilization of the set in condition of dissipation by free convection, being the controlled and fixed ambient temperature.
  • the thermal paste CCS PTV1 corresponds to the paste with expanded graphite, rheological agent, water and biopolymer.
  • the Freestanding CCS paste features expanded graphite film, rheological agent, water and biopolymer.
  • the moldable paste CCS corresponds to the paste with expanded graphite, paraffin and barite filler.
  • Thermo CCS1 PTV2 and Thermo CCS2 PTV3 pastes are fluid pastes with expanded graphite, styrene acrylic resin, water and rheological agent.
  • SV11 and SV12 represent a silicone rubber film comprising expanded graphite and xylene.
  • the "Public LED Luminaire” and the “LED Module” were not tested with the self-sustaining interface (Freestanding) and with the interface moldable due to the size of the board and lack of interface sample for that size.
  • the first thermal paste was called PTV1 (Thermal Paste Version 1), PTV2 the second, based on water and PTV3 the third, based on oil.
  • the "X" axis Rth represents the thermal resistance and the thermal capacitance Cth is represented on the "Y" axis as a function of time.
  • LED Chip junction
  • the photons are being generated and as a by-product waste heat must be quickly extracted and taken outside and away from the LED, in this layer we can identify that generally all materials have a low thermal resistance, as they are highly conductive materials and with very thin layer thicknesses.
  • the variable was the thermal interfaces, always maintaining the assembly of the luminaires and modules, in order to identify the temperature at the junction of the LEDs, considering that this is the most critical value to guarantee a long useful life for these semiconductors.
  • the desirable characteristics of an efficient thermal interface are: high thermal conductivity, low thermal resistance, easy processing and manipulation, integrity under high temperatures, ease of application. Undesirable characteristics are low adhesion, as this causes dryness of the interface and the fluid part can compromise the components and affect the optics, bleed-out or pump-out, toxicity.
  • Table 17 represents the comparison of the interfaces produced according to some properties measured by the test and according to some notes attributed to some important concepts for the application of interfaces: 5- Excellent; 4-Good; Regular-3; Bad-2 and Worse-1.

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  • Health & Medical Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

La présente invention concerne une composition de matériau composite, notamment de matériau nanocomposite à base de précurseurs carboniques et de matrices polymères, et plus particulièrement un matériau nanocomposite se présentant sous forme de pâte fluide, de pâte et de film. Afin de résoudre le problème de convergence entre conductivité thermique et résistance mécanique d'interfaces thermiques appliquées à des dispositifs électroniques, ladite composition a été élaborée de manière à comprendre un précurseur carbonique, des particules de charge, une base polymère et éventuellement des additifs. Le procédé d'obtention du matériau comprend des étapes spécifiques qui se différencient en vue d'obtenir les différentes formes de présentation du matériau, son utilisation étant indiquée dans la préparation d'interfaces thermiques dans des DEL, des dispositifs électroniques et des dispositifs requérant des dissipateurs de chaleur efficaces.
PCT/BR2022/050509 2021-12-17 2022-12-17 Composition de matériau nanocomposite à base de précurseurs carboniques dispersés dans des matrices polymères, procédé d'obtention du matériau et son utilisation Ceased WO2023108248A1 (fr)

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BR1020210255854 2021-12-17
BR102021025585-4A BR102021025585A2 (pt) 2021-12-17 Composição de material nanocompósito à base de precursores carbônicos dispersos em matrizes poliméricas, processo de obtenção do material e seu uso

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WO2014210584A1 (fr) * 2013-06-28 2014-12-31 Graphene 3D Lab Inc. Dispersions pour nanoplaquettes de matériau de type graphène
US20160299543A1 (en) * 2013-02-27 2016-10-13 Vorbeck Materials Corp. Thermal management device systems
US20180179056A1 (en) * 2014-05-02 2018-06-28 The Boeing Company Composite material containing graphene

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US20070053168A1 (en) * 2004-01-21 2007-03-08 General Electric Company Advanced heat sinks and thermal spreaders
US20120142832A1 (en) * 2009-04-03 2012-06-07 Vorbeck Materials Corp. Polymeric Compositions Containing Graphene Sheets and Graphite
WO2014055802A2 (fr) * 2012-10-02 2014-04-10 Vorbeck Materials Dispositifs de gestion thermique à base de graphène
US20160299543A1 (en) * 2013-02-27 2016-10-13 Vorbeck Materials Corp. Thermal management device systems
WO2014210584A1 (fr) * 2013-06-28 2014-12-31 Graphene 3D Lab Inc. Dispersions pour nanoplaquettes de matériau de type graphène
US20180179056A1 (en) * 2014-05-02 2018-06-28 The Boeing Company Composite material containing graphene

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