WO2023105575A1 - ジョブの切替方法および実装ライン - Google Patents
ジョブの切替方法および実装ライン Download PDFInfo
- Publication number
- WO2023105575A1 WO2023105575A1 PCT/JP2021/044728 JP2021044728W WO2023105575A1 WO 2023105575 A1 WO2023105575 A1 WO 2023105575A1 JP 2021044728 W JP2021044728 W JP 2021044728W WO 2023105575 A1 WO2023105575 A1 WO 2023105575A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- board
- mounter
- type
- component
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
- H05K13/0857—Product-specific machine setup; Changeover of machines or assembly lines to new product type
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
Definitions
- This specification discloses a job switching method and an implementation line.
- Combination components can include, for example, an LED and a current limiting resistor to limit the current applied to the LED. Not all LEDs can emit light with a uniform amount of light, and variations in the amount of light emitted occur due to manufacturing factors and the like. Even in such a situation, the resistance value of the current limiting resistor is changed according to the class of the LED in order to make the amount of light of the illumination uniform.
- the main purpose of the present disclosure is to switch jobs as efficiently as possible, even if continuous setup changes cannot be performed in all of the mounting machines that make up the mounting line.
- the job switching method of the present disclosure is A job switching method in a mounting line in which a plurality of mounting machines for mounting components on a board are arranged in a board conveying direction, When switching from a job that produces a first type of board to a job that produces a second type of board, the job from the most upstream mounting machine to the downstream predetermined mounting machine among the plurality of mounting machines constituting the mounting line For the first group of mounters, all the mounters of the first group of mounters have finished mounting the components on the first type of board, and at least a specific mounter of the first group of mounters has After the completion of the setup change, a first job switching is performed to switch jobs so that production of the second type of board is started, and a second group of mounting machines located downstream of the predetermined mounting machine is subjected to the first job switching.
- the first job switching is performed for a first group of mounters from the most upstream mounter to a predetermined downstream mounter among the plurality of mounters constituting the mounting line.
- the second job switching is performed for the second group of mounters downstream of the predetermined mounter.
- the first job switching is performed after all the mounters of the first mounter group have finished mounting the components on the first type board, and after at least a specific mounter of the first mounter group has finished the setup change.
- the job is switched so that the production of the second type of substrate is started.
- the downstream mounters in the second mounter group mount the components on the first type board in parallel with the component mounting on the first type board in the second mounter group.
- the upstream mounting machine that has completed the mounting of 1 is caused to change the setup, and after the completion of the change of setup, the job is switched so that the production of the second type of board is started.
- the mounting line can be constructed by applying the second job switching to some of the mounting machines. It is possible to switch jobs more efficiently than when the first job switching is applied to all mounters that do.
- FIG. 1 is an external perspective view of a component mounting line;
- FIG. 1 is a schematic configuration diagram of a component mounter;
- FIG. 2 is a block diagram showing an electrical connection relationship of component mounting lines;
- FIG. 5 is an explanatory diagram showing an example of feeder holding information;
- 7 is a flowchart showing an example of switching mode setting processing;
- 7 is a flowchart illustrating an example of job switching processing;
- 6 is a flowchart showing an example of a setup change support process;
- FIG. 10 is an explanatory diagram showing an example of combination part information;
- 9A to 9C are explanatory diagrams showing how batch jobs are switched.
- 10A to 10C are explanatory diagrams showing how batch jobs are switched.
- 11A to 11C are explanatory diagrams showing how seamless job switching is performed.
- 12A to 12C are explanatory diagrams showing how the component mounters that perform batch job switching and the component mounters that perform seamless job switching are determined.
- FIG. 1 is an external perspective view of a component mounting line 1.
- FIG. FIG. 2 is a schematic configuration diagram of the component mounter 10.
- FIG. FIG. 3 is a block diagram showing electrical connections in the component mounting line 1.
- the horizontal direction is the X-axis direction
- the front-rear direction is the Y-axis direction
- the vertical direction is the Z-axis direction.
- the component mounting line 1 of the present embodiment produces a board S on which components are mounted. As shown in FIG. 10 (10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H) and a management device 50 that manages the entire line.
- a substrate supply device 2 for supplying the substrate S to the component mounter 10A is installed adjacently on the side opposite to the downstream component mounter 10B.
- a board ID for example, a barcode
- a reader 60 for example, a bar code reader
- Each component mounter 10 includes a feeder 30, a board transfer device 21, a head 22, and a head moving device 23, as shown in FIG.
- the feeder 30 is detachably attached to a feeder table installed in the front part of the component mounter 10.
- a plurality of slots into which the feeders 30 are inserted are provided on the feeder table, and the feeders 30 are arranged in the X-axis direction by being mounted in the plurality of slots.
- the feeder 30 includes, for example, a carrier tape in which components are accommodated in a plurality of cavities formed at predetermined intervals, a reel around which the carrier tape is wound, and a tape feeding device that unwinds and feeds the carrier tape from the reel. and a tape feeder.
- the board transfer device 21 carries in the board S from the board transfer device 21 of the component mounter 10 on the upstream side, and carries out the board S to the board transfer device 21 of the component mounter 10 on the downstream side.
- the substrate conveying device 21 is a belt conveyer device. 21a, and a belt driving device that circulates the conveyor belt 21a.
- One of the pair of conveyor belts 21a is movable toward and away from the other.
- the substrate conveying device 21 can convey a plurality of types of substrates S having different sizes by adjusting the distance between the pair of conveyor belts 21a.
- the head 22 includes a holder to which a suction nozzle (sampling member) is detachably attached, and an elevating device that elevates the holder.
- the suction nozzle is supplied with a negative pressure from a negative pressure source via an electromagnetic valve, and the suction nozzle is capable of sucking (collecting) a component by means of the negative pressure.
- the head moving device 23 moves the head 22 forward, backward, left and right (in the XY-axis direction).
- the head moving device 23 includes a Y-axis slider that moves back and forth (Y-axis direction) driven by a Y-axis motor, and an X-axis slider that moves left and right (X-axis direction) relative to the Y-axis slider driven by an X-axis motor. and a slider.
- the head 22 is attached to an X-axis slider, and is moved back and forth and left and right (XY-axis directions) by driving an X-axis motor and a Y-axis motor.
- the component mounter 10 also includes a mark camera 25, a parts camera 26, and a nozzle stocker 27.
- the mark camera 25 captures an image of a reference mark attached to the substrate S from above in order to detect the position of the substrate S.
- the parts camera 26 captures an image of the part sucked by the suction nozzle from below in order to detect pick-up errors and pick-up deviations.
- the nozzle stocker 27 stocks a plurality of types of suction nozzles that can be attached to the holder of the head 22 .
- the control device 40 is configured as a microprocessor with a CPU 41 at its center. Prepare.
- the control device 40 receives detection signals from position sensors provided in the head moving device 23 for detecting each position of the head 22 in the X-axis direction and the Y-axis direction, and also receives an image with the parts camera 26 and the mark camera 25. input the image signal that has been processed.
- the control device 40 also outputs control signals to the feeder 30, the substrate transfer device 21, the head moving device 23, the parts camera 26, the mark camera 25, and the like.
- the management device 50 is a general-purpose computer including a CPU 51, a ROM 52, a RAM 53, a storage device 54 (hard disk drive, solid state drive, etc.), etc., and is communicably connected to the control device 40 of each mounter 10.
- An input device 55 such as a mouse and a keyboard, a display device 56 for displaying various information, and a reader 60 are connected to the management device 50 .
- the storage device 54 stores feeder holding information, job information, status information, etc. as various information necessary for production. These pieces of information are managed for each mounter 10 .
- the production schedule defines which component is to be mounted on which board S in what order in each mounter 10, and how many boards S (products) mounted in such a manner are to be manufactured.
- the feeder holding information is information about the feeder 30 held by each mounter 10 . As shown in FIG. 4, the feeder holding information includes feeder information such as a feeder ID, part type, number of remaining parts, and the device (location) holding the feeder 30 (part) and the mounting position (slot number) of the feeder 30. ) and other location information.
- the job information is information on production jobs to be executed by each mounter 10 . This job information includes the types of printed circuit boards to be produced, the types of components to be mounted, the mounting position of each component, and the set position (component set information) of the components (feeder 30) to be set on each component mounter 10. .
- the component set information indicates the scheduled mounting position (scheduled slot) of the feeder 30 containing the component, and is managed for each component mounter 10 .
- the status information is information indicating the operating status of each mounter 10 . This status information includes during production, during changeover, during occurrence of an abnormality, and the like.
- the management device 50 is communicably connected to the control device 40 of each component mounter 10 by wire, and exchanges various information with each component mounter 10 .
- the management device 50 receives the operation status from each mounter 10 and updates the status information to the latest information.
- the management device 50 is communicably connected to the feeder 30 attached to the feeder table of each mounter 10 via the control device 40 .
- the management device 50 receives the attachment/detachment status from the corresponding component mounter 10 and updates the feeder holding information to the latest information. Update.
- the control device 40 of each component mounter 10 receives a production job from the management device 50 and performs a mounting process of mounting components on the board S according to the received production job. That is, in the mounting process, the CPU 41 first causes the head moving device 23 to move the head 22 above the component supply position of the feeder 30 . Subsequently, the CPU 41 lowers the suction nozzle by using the lifting device and causes the suction nozzle to suck the component. Next, the CPU 41 causes the head moving device 23 to move the component sucked by the suction nozzle above the parts camera 26 , and the parts camera 26 captures an image of the component.
- the CPU 41 processes the captured image of the component, measures the suction deviation amount of the component, and corrects the mounting position of the component on the board S. FIG. Then, the CPU 41 causes the head moving device 23 to move the component sucked by the suction nozzle above the corrected mounting position, and the lifting device lowers the suction nozzle to mount the component on the board S.
- FIG. 5 is a flowchart showing an example of job switching mode setting processing executed by the CPU 51 of the management device 50. As shown in FIG. This process is executed when the type of substrate S to be produced is changed. A change in the type of board S to be produced is recognized by the management device 50 when the operator reads the board ID attached to the board S to be produced next using the reader 60 .
- the CPU 51 of the management device 50 first determines whether or not there is a specific combination part among the parts to be mounted in the current production (S100), and whether or not there is a specific combination in the parts to be mounted in the next production. It is determined whether or not there are parts (S110, S120). When the CPU 51 determines that there is no specific combination part among the parts to be mounted in both the current production and the next production ("NO" in S100 and "NO” in S120), all the parts on the part mounting line 1 are mounted. The machine 10 sets the job switching mode to the seamless job switching mode (S130), and ends the job switching mode setting process.
- the CPU 51 determines that there is a specific combined component among the components to be mounted in the current production but that there is no specific combined component among the components to be mounted in the next production ("YES" in S100 and "NO” in S110).
- the job switching mode from the most upstream component mounter 10 of the component mounting line 1 to the most downstream component mounter 10 among the component mounters 10 on which combined components are set in the current production is set to the collective job switching mode. (S140).
- the CPU 51 sets the job switching mode of the remaining component mounters 10 of the component mounting line 1 to the seamless job switching mode (S170), and ends the job switching mode setting process.
- the CPU 51 determines that there is no specific combined component among the components to be mounted in the current production, but there is a specific combined component among the components to be mounted in the next production ("NO” in S100 and "YES” in S120).
- the job switching mode from the most upstream component mounter 10 of the component mounting line 1 to the most downstream component mounter 10 among the component mounters 10 on which combined components are set in the next production is set to the collective job switching mode ( S150).
- the CPU 51 sets the job switching mode of the remaining mounters 10 of the component mounting line 1 to the seamless job switching mode (S170), and ends the job switching mode setting process.
- the CPU 51 determines that there is a specific combined component among the components to be mounted in both the current production and the next production ("YES" in S100 and "YES” in S110), the CPU 51 selects the uppermost component on the component mounting line 1. Batch job switching of the job switching mode from the mounter 10 to the most downstream component mounter 10 among the component mounters 10 in which the combination parts are set in the current production and the component mounters 10 in which the combination parts are set in the next production. mode is set (S160). Then, the CPU 51 sets the job switching mode of the remaining mounters 10 of the component mounting line 1 to the seamless job switching mode (S170), and ends the job switching mode setting process.
- the collective job switching mode (first job switching) is performed when all component mounters 10 for which the collective job switching mode is set have finished mounting components on the board S currently produced (first type), In this mode, production of the substrate S for the next production (second type) is not started until the replacement is completed.
- the seamless job switching mode (second job switching)
- the component mounter 10 on the upstream side among the plurality of component mounters 10 set in the seamless job switching mode can mount components on the board S currently produced.
- the component mounter 10 on the downstream side mounts the components on the board S in current production, and at the same time, the setup is changed. In this mode, the production of the substrate S for the next production is started as soon as the replacement is completed.
- an LED and a current limiting resistor for limiting the current applied to the LED can be cited. Not all LEDs can emit light with a uniform amount of light, and variations in the amount of light emitted occur due to manufacturing factors and the like. Even in such a situation, in order to make the amount of light of the illumination uniform, in this embodiment, the resistance value of the current limiting resistor is changed according to the class of the LED.
- the other component current limiting resistor
- the other (setting of components) must be performed after the setup change (setting of one component) of the component mounters 10 on the downstream side, and from the upstream side to the plurality of component mounters 10 on which these combined components are set.
- the seamless job switching mode in which setup changes are performed in sequence, cannot be applied. Therefore, in the present embodiment, jobs are collectively switched from the most upstream component mounter 10A to the component mounter 10 in which a specific combined component is set. However, if all the mounters 10 switch jobs in batch job switching mode, the start of the next production will be greatly delayed.
- FIG. 6 is a flowchart showing an example of job switching processing executed by the control device 40.
- This processing is executed for each mounter 10 .
- the CPU 41 of the control device 40 first determines whether the flag F is 0 (S200). When it is determined that the flag F has a value of 0, it is determined whether or not the board type is changed from the currently produced board S to the next produced board S (S210). This determination is made by acquiring information indicating that the board type will be changed (board type change information) from the management device 50 when the board ID attached to the board S to be produced next is read by the reader 60. , based on the obtained information. When determining that the board type is changed, the CPU 41 sets the flag F to a value of 1, and sets the remaining board number count value N to the remaining board number Nm at board type change acquisition (S220).
- the board type change acquisition time board remaining number Nm is the remaining number of boards S to be produced in the current production until the board type is changed.
- the board type change acquisition time board remaining number Nm is different for each mounter 10, and is set by subtracting 1 from the order number counted downstream from the mounter 10A at the most upstream. For example, in the second component mounter 10B adjacent downstream of the most upstream component mounter 10A, the board remaining number is 1 when the board type change is acquired.
- the CPU 41 determines whether or not the board remaining number count value N is equal to or greater than 1, that is, whether or not there are boards S remaining to be produced in the current production (S230).
- the board S is carried in from the board supply device 2 or the component mounter 10 on the upstream side, components are mounted thereon, and then carried out downstream ( S240 to S260), the board remaining number count value N is decremented by 1 (S270), and the job switching process ends.
- the CPU 41 carries in the board S of current production, mounts the components on the carried-in board S, and decrements the remaining board count value N by one. repeat the process.
- the CPU 41 determines in S230 that the remaining component count value is less than 1, it performs a setup change (S280) and waits for the completion of the setup change (S290). For the changeover, the gap between the pair of conveyor belts 21a of the board transfer device 21 is adjusted so as to correspond to the width of the board S to be produced next. 30 is set on the corresponding feeder stand of the mounter 10, and the work of setting the suction nozzles to be used in the next production to the nozzle stocker 27 is included.
- the CPU 41 determines whether or not the job switching mode set in its own machine (the component mounter 10 executing this job switching process) is the collective job switching mode. (S300). This determination can be made by acquiring the job switching mode set by the switching mode setting process from the management device 50 through communication. When the CPU 41 determines that the job switching mode set in its own machine is not the batch job switching mode but the seamless job switching mode, the CPU 41 selects the substrate S to be produced next from the upstream side as soon as the setup change of its own machine is completed. At the same time as carrying in and starting production (S320), the flag F is set to 0 (S330), and the job switching process ends.
- the component mounters 10 In the seamless job switching mode, among the component mounters 10 (second mounter group) for which the seamless job switching mode is set, the component mounters 10 on the upstream side finish mounting components on the board S currently produced. After the substrate is transported to the component mounter 10 on the downstream side, the component mounter 10 on the downstream side mounts the components on the board S currently produced, and in parallel, the component mounter 10 on the upstream side performs a setup change. , as soon as the changeover is completed, the board S for the next production is brought in and the production is started.
- the CPU 41 determines that the job switching mode is the batch job switching mode
- the other machine the component mounter 10 other than the component mounter 10 executing this job switching process set to the batch job switching mode is set to the batch job switching mode.
- the CPU 41 determines that the setup change of the other machine set to the collective job switching mode is completed
- the CPU 41 carries in the board S to be produced next from the upstream side and starts production (S320). is set to 0 (S330), and the job switching process ends.
- the collective job switching mode in all the component mounters 10 (first group of mounters) set in the collective job switching mode, the mounting of components on the board S currently produced has been completed, and the setup has been changed. The production of the substrate S for the next production does not start until it is finished.
- FIG. 7 is a flowchart showing an example of a setup change support process executed by the management device 50. As shown in FIG. This processing is executed when a setup change occurs in any component mounter 10 on the component mounting line 1 .
- the CPU 51 of the management device 50 first displays a setup change guidance display on the display device 56 (S400).
- the guide display for setup includes information on the component mounter 10 to be changed, information on the component to be set in the component mounter 10, the position (slot number) at which the component (feeder 30) should be set, and the nozzle stocker 27. This includes information about the suction nozzles that should be set to .
- the CPU 51 determines whether or not the job switching mode of the component mounter 10 to be changed is the collective job switching mode (S410).
- the CPU 51 determines that the job switching mode of the component mounter 10 to be changed is the batch job switching mode, the CPU 51 determines that the components to be set on the component mounter 10 to be changed include a specific combined component. Then, wait until one combination part is set (S420). When the CPU 51 determines that one combination part has been set, it selects the type of the other combination part from a plurality of parts (S430). In this embodiment, one combination is an LED and the other combination is a current limiting resistor. In the process of S430, in order to make the light intensity of the illumination uniform even if the lot of the LED used changes, the current limiting resistor having the resistance value corresponding to the set LED is selected from a plurality of current limiting resistors having different resistance values.
- the selection of the current-limiting resistor is performed by obtaining in advance the relationship between the class of the LED and the resistance value of the current-limiting resistor and storing it as a table. This is done by deriving from An example of this table is shown in FIG. Then, the CPU 51 performs guidance display on the display device 56 to guide the setting of the other combination component (S440), and terminates the setup change support process.
- Figs. 9A to 9C and Figs. 10A to 10C are explanatory diagrams showing how batch jobs are switched.
- 11A to 11C are explanatory diagrams showing how seamless job switching is performed.
- the CPU 51 of the management device 50 recognizes that the board type is changed by reading the board ID given to the second type B board by the reader 60 during the production of the first type A board. (See Figure 9A).
- the CPU 51 recognizes the change of the board type, the CPU 51 selects from the most upstream component mounter 10A to the component mounters 10B and 10C in which specific combination components (LED-A and Resister-A) are set in the current production, and in the next production.
- the most downstream component mounter 10C is set to the collective job switching mode (see the dashed line in FIGS. 9B and 9C).
- the collective job switching mode is set in a plurality of component mounters 10A, 10B, and 10C
- all the component mounters 10A, 10B, and 10C for which the collective job switching mode has been set can switch to the last board S in current production.
- the production of the second type B boards is not started until the mounting of the components is completed and the changeover is completed.
- the setup change is performed by the operator, and the work by the operator is supported by the setup change support process.
- the CPU 51 first guides the component mounter 10A to set one of the combined components (LED). Then, when one combination component (LED-B) is set, the CPU 51 selects the other combination component (Resister-B), and selects the other combination component and mounter 10C to which this component is to be set. and When the other combined component (feeder 30) is set in the component mounter 10C and the changeover is completed in all the component mounters 10A, 10B, and 10C in batch job switching mode (see FIG. 10B), the second type B board is brought in and the next production is started (see FIG. 10C).
- the CPU 51 sets the component mounters 10D, 10E, 10F, 10G, and 10H that have not been set to the batch job switching mode to the seamless job switching mode (see the dashed line in FIG. 10C).
- the changeover of the mounters 10D, 10E, 10F, 10G, and 10H set in the seamless job switching mode is performed in order from the upstream mounter 10D when the mounting of the components on the last board of the first type A is completed. , immediately. Then, as soon as the changeover is completed, the substrate of the second type B is brought in and the next production is started (see FIGS. 11A to 11C).
- the component mounting on the first type A board before the changeover, the changeover, and the component mounting on the second type B board after the changeover are performed in parallel, thereby switching jobs. can be performed efficiently, and production efficiency can be improved.
- the other component (current limiting resistor) is set in the component mounter 10 upstream of the other component (LED).
- the job switching mode from the most upstream component mounter 10A to the component mounter 10 in which the combination component (one component) is set is set to the collective job switching mode.
- the other component current limiting resistor
- the combined component the other The job switching mode up to the component mounter 10 on which the component (parts of the above) is set may be set to the collective job switching mode.
- one component (LED) to be set first is set to the component mounter 10 on the upstream side, and the other component (current limiting resistor) to be set later is set to the component mounter on the downstream side. Since it is the machine 10, it is possible to perform setup changes in order from the upstream side. However, the production of the board S is not guaranteed until the other component is actually set in the component mounter 10 on the downstream side. should do. Even in the latter case, it is for this reason that the batch job switching mode is applied to a plurality of component mounters 10 on which combined components are set. However, when the other component (current limiting resistor) is set on the component mounter 10 downstream of the one component (LED), the job switching mode of all the component mounters 10 on the component mounting line 1 can be switched seamlessly. The job switching mode may be set.
- 12A to 12C are explanatory diagrams showing how the component mounters 10 that perform batch job switching and the component mounters 10 that perform seamless job switching are determined.
- component mounters 10B and 10C in which specific combination components used in the current production are set and specific combinations used in the next production are set from the most upstream component mounter 10A.
- component mounters 10D and 10G on which components are set up to the most downstream component mounter 10G is set.
- the job of the mounter 10 including a specific combined component can be appropriately switched, and the remaining jobs can be switched in the seamless job switching mode. By switching, it is possible to efficiently switch jobs.
- the component mounters 10A, 10B, 10C, 10D, 10E, 10F, 10G, and 10H of the present embodiment correspond to a plurality of mounters of the present disclosure
- the collective job switching mode corresponds to the first job switching
- seamless job switching corresponds to second job switching.
- the mounting of components on the last board S in the current production is completed, and the stage is completed. It is assumed that the production of the substrate S for the next production is started when the replacement is completed. However, if at least a specific combination component is set in the component mounter 10 to be set, the board S for the next production will be started as soon as the changeover is completed in order from the most upstream component mounter 10A. can be
- the CPU 51 sets the job switching mode from the most upstream component mounter 10A to the component mounter 10 in which a specific combination component is set as the component to be mounted in the current production or the next production. mode, and the job switching modes of the remaining mounters 10 are set to the seamless job switching modes.
- the CPU 51 may set one of the collective job switching mode and the seamless job switching mode for each mounter 10 based on another condition. Alternatively, the operator may select a job switching mode to be set in each mounter 10 .
- the operator sets the components (feeder 30) to be mounted on the board S to each component mounter 10 in the setup change. It may be set in the component mounter 10 .
- the first job switching is performed for the first group of mounters from the most upstream mounter to the predetermined downstream mounter.
- a second job switching is performed for a second group of mounting machines located downstream of the mounting machines.
- the first job switching is performed after all the mounters of the first mounter group have finished mounting the components on the first type board, and after at least a specific mounter of the first mounter group has finished the setup change.
- the job is switched so that the production of the second type of substrate is started.
- the downstream mounters in the second mounter group mount the components on the first type board in parallel with the component mounting on the first type board in the second mounter group.
- the upstream mounting machine that has completed the mounting of 1 is caused to change the setup, and after the completion of the change of setup, the job is switched so that the production of the second type of board is started.
- the mounting line can be constructed by applying the second job switching to some of the mounting machines. It is possible to switch jobs more efficiently than when the first job switching is applied to all mounters that do.
- the components to be mounted on the first type board or the second type board include specific combination components, and the predetermined mounter mounts the combination components. It may be the most downstream mounter among a plurality of mounters that respectively mount. In this way, even if one of the specific combined parts cannot be set in the mounter and the other part cannot be determined, it is possible to appropriately switch jobs by the first job switching. Also, by applying the second job switching to a mounting machine downstream of a predetermined mounting machine, it is possible to efficiently switch jobs. In this case, the first job switching is performed when all the mounters of the first mounter group finish mounting components on the first type board, and at least the first mounter group is selected as the specific mounter.
- the job may be switched so that the production of the second type of board is started after a changeover is completed in a plurality of mounting machines that respectively mount the combined parts of .
- both the components to be mounted on the first type board and the components to be mounted on the second type board include the combined component, and the predetermined mounter is mounted on the first type board. It may be a mounter positioned most downstream among a plurality of mounters for mounting combination parts on the substrate and a plurality of mounters for mounting combination parts on the second type board. Even when the components mounted on the first type board and the components mounted on the second type board both include specific combined components, the first job switching can appropriately switch jobs.
- the other mounter The type of the other part to be set may be guided. By doing so, it becomes easier to change the setup of the combined parts.
- the present disclosure is not limited to the form of the job switching method, and can also be the form of a mounting line in which a plurality of mounting machines are arranged in the substrate transport direction.
- the present disclosure can be used for manufacturing industries such as mounting lines.
- 1 component mounting line 2 board supply device, 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H component mounter, 21 board transfer device, 21a conveyor belt, 22 head, 23 head moving device, 25 mark Camera, 26 Parts camera, 27 Nozzle stocker, 30 Feeder, 40 Control device, 41 CPU, 42 ROM, 43 RAM, 44 Storage device, 50 Management device, 51 CPU, 52 ROM, 53 RAM, 54 Storage device, 55 Input device , 56 display device, 60 reader, S board.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
部品を基板に実装する複数の実装機が基板の搬送方向に並ぶ実装ラインにおけるジョブの切替方法であって、
第1種類の基板を生産するジョブから第2種類の基板を生産するジョブへと切り替える場合、前記実装ラインを構成する複数の実装機のうち最上流の実装機から下流の所定の実装機までの第1実装機群に対しては、前記第1実装機群の全ての実装機で前記第1種類の基板への部品の実装が終了し、少なくとも前記第1実装機群の特定の実装機で段取り替えが終了した後に、前記第2種類の基板の生産が開始されるようにジョブを切り替える第1ジョブ切替を行ない、前記所定の実装機よりも下流側にある第2実装機群に対しては、前記第2実装機群のうち下流の実装機が前記第1種類の基板に部品を実装するのと並行して前記第2実装機群のうち前記第1種類の基板への部品の実装が終了した上流の実装機で段取り替えを実行させ、当該段取り替えが終了した後、前記第2種類の基板の生産が開始されるようにジョブを切り替える第2ジョブ切替を行なう、
ことを要旨とする。
Claims (6)
- 部品を基板に実装する複数の実装機が基板の搬送方向に並ぶ実装ラインにおけるジョブの切替方法であって、
第1種類の基板を生産するジョブから第2種類の基板を生産するジョブへと切り替える場合、前記実装ラインを構成する複数の実装機のうち最上流の実装機から下流の所定の実装機までの第1実装機群に対しては、前記第1実装機群の全ての実装機で前記第1種類の基板への部品の実装が終了し、少なくとも前記第1実装機群の特定の実装機で段取り替えが終了した後に、前記第2種類の基板の生産が開始されるようにジョブを切り替える第1ジョブ切替を行ない、前記所定の実装機よりも下流側にある第2実装機群に対しては、前記第2実装機群のうち下流の実装機が前記第1種類の基板に部品を実装するのと並行して前記第2実装機群のうち前記第1種類の基板への部品の実装が終了した上流の実装機で段取り替えを実行させ、当該段取り替えが終了した後、前記第2種類の基板の生産が開始されるようにジョブを切り替える第2ジョブ切替を行なう、
ジョブの切替方法。 - 請求項1に記載のジョブの切替方法であって、
前記第1種類の基板または前記第2種類の基板にそれぞれ実装する部品には、特定の組み合わせ部品が含まれ、
前記所定の実装機は、前記組み合わせ部品をそれぞれ実装する複数の実装機のうち最も下流に位置する実装機である、
ジョブの切替方法。 - 請求項2に記載のジョブの切替方法であって、
前記第1ジョブ切替は、前記第1実装機群の全ての実装機で前記第1種類の基板への部品の実装が終了し、少なくとも前記特定の実装機として前記第1実装機群の前記組み合わせ部品をそれぞれ実装する複数の実装機で段取り替えが終了した後に、前記第2種類の基板の生産が開始されるようにジョブを切り替える、
ジョブの切替方法。 - 請求項2または3に記載のジョブの切替方法であって、
前記第1種類の基板に実装する部品と前記第2種類の基板に実装する部品のいずれにも前記組み合わせ部品が含まれ、
前記所定の実装機は、前記第1種類の基板に組み合わせ部品を実装する複数の実装機と前記第2種類の基板に組み合わせ部品を実装する複数の実装機とのうち最も下流に位置する実装機である、
ジョブの切替方法。 - 請求項2ないし4いずれか1項に記載のジョブの切替方法であって、
前記組み合わせ部品の段取り替えにおいて、前記組み合わせ部品のうち一方の部品が前記組み合わせ部品を実装する複数の実装機のうち一方の実装機にセットされると、他方の実装機にセットすべき他方の部品の種類を案内する、
ジョブの切替方法。 - 部品を基板に実装する複数の実装機が基板の搬送方向に並ぶ実装ラインであって、
第1種類の基板を生産するジョブから第2種類の基板を生産するジョブへと切り替える場合、前記実装ラインを構成する複数の実装機のうち最上流の実装機から下流の所定の実装機までの第1実装機群に対しては、前記第1実装機群の全ての実装機で前記第1種類の基板への部品の実装が終了し、少なくとも前記第1実装機群の特定の実装機で段取り替えが終了した後に、前記第2種類の基板の生産が開始されるようにジョブを切り替える第1ジョブ切替を行ない、前記所定の実装機よりも下流側にある第2実装機群に対しては、前記第2実装機群のうち下流の実装機が前記第1種類の基板に部品を実装するのと並行して前記第2実装機群のうち前記第1種類の基板への部品の実装が終了した上流の実装機で段取り替えを実行させ、当該段取り替えが終了した後、前記第2種類の基板の生産が開始されるようにジョブを切り替える第2ジョブ切替を行なう、
実装ライン。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/708,269 US20250016971A1 (en) | 2021-12-06 | 2021-12-06 | Job switching method and mounting line |
| PCT/JP2021/044728 WO2023105575A1 (ja) | 2021-12-06 | 2021-12-06 | ジョブの切替方法および実装ライン |
| CN202180104553.XA CN118318513A (zh) | 2021-12-06 | 2021-12-06 | 任务的切换方法以及安装线 |
| DE112021008497.6T DE112021008497T5 (de) | 2021-12-06 | 2021-12-06 | Jobwechselverfahren und Montagelinie |
| JP2023565683A JP7749697B2 (ja) | 2021-12-06 | 2021-12-06 | ジョブの切替方法および実装ライン |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/044728 WO2023105575A1 (ja) | 2021-12-06 | 2021-12-06 | ジョブの切替方法および実装ライン |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023105575A1 true WO2023105575A1 (ja) | 2023-06-15 |
Family
ID=86729774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/044728 Ceased WO2023105575A1 (ja) | 2021-12-06 | 2021-12-06 | ジョブの切替方法および実装ライン |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250016971A1 (ja) |
| JP (1) | JP7749697B2 (ja) |
| CN (1) | CN118318513A (ja) |
| DE (1) | DE112021008497T5 (ja) |
| WO (1) | WO2023105575A1 (ja) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111087A (ja) * | 2007-10-29 | 2009-05-21 | Fuji Mach Mfg Co Ltd | 装着ラインにおけるオペレータ介入作業実施方法および装着ライン |
| JP2012124341A (ja) * | 2010-12-08 | 2012-06-28 | Panasonic Corp | 部品実装方法、および、部品実装システム |
| WO2016035145A1 (ja) * | 2014-09-02 | 2016-03-10 | 富士機械製造株式会社 | 部品実装システム及び部品実装方法 |
-
2021
- 2021-12-06 JP JP2023565683A patent/JP7749697B2/ja active Active
- 2021-12-06 DE DE112021008497.6T patent/DE112021008497T5/de active Pending
- 2021-12-06 WO PCT/JP2021/044728 patent/WO2023105575A1/ja not_active Ceased
- 2021-12-06 US US18/708,269 patent/US20250016971A1/en active Pending
- 2021-12-06 CN CN202180104553.XA patent/CN118318513A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009111087A (ja) * | 2007-10-29 | 2009-05-21 | Fuji Mach Mfg Co Ltd | 装着ラインにおけるオペレータ介入作業実施方法および装着ライン |
| JP2012124341A (ja) * | 2010-12-08 | 2012-06-28 | Panasonic Corp | 部品実装方法、および、部品実装システム |
| WO2016035145A1 (ja) * | 2014-09-02 | 2016-03-10 | 富士機械製造株式会社 | 部品実装システム及び部品実装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE112021008497T5 (de) | 2024-09-19 |
| JP7749697B2 (ja) | 2025-10-06 |
| US20250016971A1 (en) | 2025-01-09 |
| CN118318513A (zh) | 2024-07-09 |
| JPWO2023105575A1 (ja) | 2023-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6738419B2 (ja) | 部品実装システムおよび管理装置 | |
| EP3833173B1 (en) | Component mounting system | |
| CN112166660B (zh) | 元件安装系统以及元件供给单元的配置指示方法 | |
| WO2020039495A1 (ja) | 部品実装システム | |
| JP7113075B2 (ja) | ユニット着脱装置 | |
| JP2025087861A (ja) | 実装システム | |
| CN113170605B (zh) | 安装系统 | |
| WO2023105575A1 (ja) | ジョブの切替方法および実装ライン | |
| CN112425278B (zh) | 元件安装系统 | |
| JP2025015668A (ja) | 部品実装システム | |
| WO2022097288A1 (ja) | 部品実装システム | |
| JP7216799B2 (ja) | 部品実装システムおよび部品交換方法 | |
| JP6947931B2 (ja) | 部品供給ユニットの配置決定方法および部品実装システム | |
| US20250065429A1 (en) | Mounting system and member replenishment guidance method | |
| CN107926151B (zh) | 要求精度设定装置 | |
| JP6545029B2 (ja) | 対基板作業システム | |
| CN113950874A (zh) | 元件安装机 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21967082 Country of ref document: EP Kind code of ref document: A1 |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 18708269 Country of ref document: US |
|
| ENP | Entry into the national phase |
Ref document number: 2023565683 Country of ref document: JP Kind code of ref document: A |
|
| WWE | Wipo information: entry into national phase |
Ref document number: 202180104553.X Country of ref document: CN |
|
| 122 | Ep: pct application non-entry in european phase |
Ref document number: 21967082 Country of ref document: EP Kind code of ref document: A1 |