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WO2023100776A1 - Procédé de production de substrat de verre - Google Patents

Procédé de production de substrat de verre Download PDF

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Publication number
WO2023100776A1
WO2023100776A1 PCT/JP2022/043632 JP2022043632W WO2023100776A1 WO 2023100776 A1 WO2023100776 A1 WO 2023100776A1 JP 2022043632 W JP2022043632 W JP 2022043632W WO 2023100776 A1 WO2023100776 A1 WO 2023100776A1
Authority
WO
WIPO (PCT)
Prior art keywords
glass substrate
glass plate
manufacturing
glass
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/043632
Other languages
English (en)
Japanese (ja)
Inventor
卓磨 藤▲原▼
勲 齋藤
亮一 飯田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP2023564942A priority Critical patent/JPWO2023100776A1/ja
Priority to CN202280079484.6A priority patent/CN118354980A/zh
Publication of WO2023100776A1 publication Critical patent/WO2023100776A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/356—Working by laser beam, e.g. welding, cutting or boring for surface treatment by shock processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock

Definitions

  • the present invention relates to a method for manufacturing a glass substrate.
  • Patent Documents 1 and 2 include a glass plate processing method in which cracks are formed in a glass plate by irradiating it with a laser beam, stress is applied to the glass plate, and the glass plate is processed into a desired shape. disclosed.
  • Patent Document 3 discloses a method for processing a glass substrate that makes it easier to cut the glass plate by exposing it to an OH atmosphere after laser irradiation.
  • the present invention has been made in view of the above problems, and is a glass substrate that can control the dividing stress to a low level without causing unintended division and can form the surface to be divided with a desired cross-sectional shape and high quality.
  • the purpose is to provide a manufacturing method.
  • a method for manufacturing a glass substrate for obtaining a glass substrate having a desired shape from a glass plate comprising irradiating the glass plate with a first laser beam, A scribe line defining a contour line of the glass substrate having the desired shape is formed, and at least a part of the contour line formed by the scribe line is irradiated with a second laser beam under the condition that the glass plate is not divided. and applying stress to at least a part of the contour formed by the scribe line to divide the glass plate along the contour to obtain the desired shape.
  • a method for manufacturing a glass substrate that can control the dividing stress to a low level without causing unintended division and can form the surface to be divided into a desired cross-sectional shape with high quality.
  • 1A to 1E are cross-sectional views showing a method for manufacturing a glass substrate according to this embodiment.
  • 2A to 2C are schematic diagrams illustrating a method of forming a scribe line with the first laser beam according to this embodiment.
  • 3A to 3E are cross-sectional views showing a method of manufacturing a glass substrate according to an embodiment for forming a through-hole with a desired shape.
  • FIG. 4 is a cross-sectional view for explaining the process of chamfering the end face of the glass plate.
  • 5A-5E are cross-sectional views showing a method of manufacturing a glass substrate according to an embodiment using curved glass.
  • 6A to 6F are cross-sectional views showing a method for manufacturing a glass substrate according to an embodiment including bending the glass plate.
  • FIG. 7A is a plan view and a front view showing formation of a scribe line using the first laser beam in the evaluation test of this embodiment.
  • FIG. 7B is a plan view showing irradiation of the second laser beam in the evaluation test of this embodiment.
  • FIG. 7C is a front view explaining a flat four-point bending test in the evaluation test of this embodiment.
  • FIG. 8 is a diagram showing the results of the evaluation test of this embodiment.
  • 9A and 9B are schematic diagrams illustrating a method for manufacturing a glass substrate according to an embodiment in which a single glass plate is cut into a large number of glass substrates.
  • a method of cutting a glass plate by cutting a glass plate with a laser is known as a method of manufacturing a glass substrate to obtain a desired shape by cutting the glass plate. If the breaking stress required for this division is high, chipping is likely to occur. Therefore, it has been required to reduce the breaking stress.
  • Patent Document 3 a glass plate is cut by exposing it to an OH atmosphere after irradiating it with a laser.
  • an OH atmosphere it is difficult to control the breaking stress, and there are problems such as variations in the breaking stress range and unintentional division. For this reason, it has been difficult to form the divided surface with a desired cross-sectional shape and high quality.
  • the present inventors formed a scribe line on a glass plate, superimposed on the contour line formed by the scribe line, and irradiated the glass plate with a laser beam under the condition that the glass plate was not divided. Therefore, the present inventors have invented a method for manufacturing a glass substrate that can control the breaking stress to a low level without causing unintended breaking.
  • a glass plate 1 is prepared.
  • the material of the glass plate 1 is not limited, and alkali-free glass and alkali glass can be used without distinction.
  • the glass plate 1 is, for example, soda-lime glass, alkali-free glass, glass for chemical strengthening, or the like. Glass for chemical strengthening is used, for example, as a cover glass for a display after being chemically strengthened.
  • the glass plate 1 may be air-cooled tempered glass.
  • the glass plate 1 has a first main surface 1a on the front side and a second main surface 1b on the back side.
  • the first main surface 1a and the second main surface 1b are opposed to each other in the thickness direction of the glass plate 1 .
  • Primary surface refers to the surface having the largest area.
  • the glass plate 1 shown in FIG. 1A is flat glass, it is not limited to this.
  • each of the first main surface 1a and the second main surface 1b in plan view is, for example, a rectangular shape.
  • the shape of each of the first principal surface 1a and the second principal surface 1b in plan view may be a trapezoidal shape, a circular shape, an elliptical shape, or the like, and is not particularly limited.
  • the thickness of the glass plate 1 is not particularly limited, but when it is used as a cover glass for an in-vehicle display device such as a car navigation system, it is usually preferably 5 mm or less in order to effectively perform chemical strengthening treatment. , more preferably 3 mm or less, and from the viewpoint of strength, the thickness of the glass plate 1 is preferably 0.2 mm or more, more preferably 0.8 mm or more, and even more preferably 1 mm or more.
  • the dimensions of the glass plate 1 can be appropriately selected according to the application.
  • the length is, for example, 50 mm or more and 500 mm or less, preferably 100 mm or more and 300 mm or less
  • the long side length is, for example, 50 mm or more and 1500 mm or less, preferably 100 mm or more and 1200 mm or less.
  • a scribe line 4 is formed on the glass plate 1 by irradiation with the first laser beam L1.
  • the “scribe line” means a dotted or linear modified portion continuously formed in the thickness direction of the glass plate 1 by irradiating the glass plate 1 with the laser beam L1, or a minute modified portion. It's a crack.
  • the modified portion appears as a dotted line.
  • the modified portion is a glass with a changed density or a changed refractive index.
  • the glass plate 1 is not divided only by forming the scribe lines 4 .
  • the scribe line 4 is indicated by a dotted line. The same applies to other drawings.
  • the scribe line 4 shown in FIG. 1B may be formed on at least a part of the glass plate 1 in the thickness direction. It is sufficient that the scribe line 4 is formed with a length in the thickness direction of the glass plate 1 that can exhibit the effects of the present embodiment. Specifically, the scribe line 4 is preferably formed with a length of 50% or more, more preferably 70% or more, and more preferably 80% or more of the thickness of the glass plate 1. More preferably, it is formed with a length, and even more preferably with a length of 90% or more. In this embodiment, it is even more preferable that the scribe line 4 is formed over the entire thickness of the glass plate 1 .
  • the scribe line 4 has a length of 90% or more, preferably 95% or more, more preferably 98% or more of the thickness of the glass plate 1. , it can be assumed that the scribe line 4 is formed over the entire thickness of the glass plate 1 .
  • the scribe line 4 defines the outline 4a of the desired shape of the glass substrate.
  • a "contour line” is a shape line appearing on the main surfaces 1a, 1b forming a desired shape.
  • the glass plate 1 is divided into a plurality of regions by the scribe lines 4, and desired regions 6 having desired shapes and unnecessary regions 7 are obtained.
  • the desired area may be either inside or outside the contour 4a, and the contour 4a may be a closed line or a non-closed line.
  • the scribe lines 4 are formed in the vertical direction parallel to the thickness direction from the first main surface 1a to the second main surface 1b. , 1b in the thickness direction at an angle of less than 90°.
  • the "angle" is the angle formed by the normal line N of the first main surface 1a and the scribe line 4.
  • the scribe line 4 is parallel to the normal N, so the angle formed is 0°.
  • the formed angle is, for example, 0° to 45°, preferably greater than 0° to 45°, more preferably 1° to 45°, still more preferably 3° to 45°. °.
  • the scribe line 4 may be in a direction perpendicular to each principal surface 1a, 1b, that is, in a direction parallel to the thickness direction of the glass plate 1, as shown in FIG. , 1b may be tilted obliquely.
  • the type of the first laser beam L1 is not limited, for example, it is preferable to use a pulsed laser beam having a wavelength range of 250 nm to 3000 nm and a pulse width of 10 fs to 1000 ns. Since a laser beam with a wavelength range of 250 nm to 3000 nm is transmitted through the glass plate 1 to some extent, nonlinear absorption can be caused inside the glass plate 1, and a laser beam with a wavelength range of 250 nm to 3000 nm can be generated inside the glass plate 1 from the first main surface 1a to the second A scribe line 4 reaching the main surface 1b of 2 can be formed.
  • the wavelength range is preferably 260 nm to 2500 nm.
  • the pulse laser light has a pulse width of 1000 ns or less, the photon density can be easily increased, and nonlinear absorption can be caused inside the glass plate 1 .
  • the pulse width is preferably between 100 fs and 100 ns.
  • the first laser light L1 may output a group of pulses called bursts.
  • One pulse group includes, for example, 3 to 50 pulsed lights, and each pulsed light has a pulse width of less than 10 ns.
  • the energy of the pulsed light may gradually decrease.
  • the energy of one pulse or one pulse group is appropriately set so that dotted or linear modified portions or cracks continuously formed in the thickness direction of the glass plate 1 can be formed. For example, it is 10 to 5000 ⁇ J, preferably 20 to 3000 ⁇ J, more preferably 30 to 2000 ⁇ J.
  • the first laser beam L1 preferably has a linear power distribution in the optical axis direction.
  • a laser having a power distribution with at least one peak in the optical axis direction may be used as the first laser beam L1.
  • the scribe line 4 can be accurately formed in the thickness direction from the first main surface 1a to the second main surface 1b.
  • the second laser beam L2 is superimposed on the contour line 4a formed by the scribe line 4.
  • Light L2 is emitted.
  • the second laser beam L2 is preferably irradiated to a length of 50% or more of the entire length of the contour line 4a, and may be irradiated to a length of 70% or more of the contour line 4a.
  • the second laser beam L2 is irradiated to 90% or more of the length of the contour 4a, preferably 95% or more of the length of the contour 4a, more preferably 98% If the length of the contour line 4a is irradiated, it can be considered that the entire length of the scribe line 4 is irradiated with the second laser beam L2.
  • the irradiation of the second laser beam L2 is made under the condition that the glass plate 1 is not divided.
  • the energy irradiated with the second laser beam L2 is mainly absorbed in the vicinity of the first main surface 1a of the glass plate 1 and does not reach the entire thickness of the glass plate 1.
  • the kind of laser differs between the first laser beam L1 and the second laser beam L2.
  • the second laser light L2 preferably has a wavelength of 780 nm or more, more preferably 5000 nm or more.
  • the second laser light L2 is a laser having a wavelength of 20000 nm or less.
  • a semiconductor laser, a fiber laser, a CO laser, or a CO2 laser can be used, and more preferably a CO2 laser can be used.
  • the second laser light L2 preferably has a wavelength of 5000 nm or more and a beam diameter of 2 mm or more and 10 mm or less. Further, the beam diameter is more preferably 3 mm or more and 8 mm or less, and more preferably 5 mm or more and 7 mm or less. Moreover, it is preferable that the second laser light L2 is a laser having a wavelength of 5000 nm or more and a scanning speed of 10 mm/s or more and 500 mm/s or less. Further, the scanning speed is more preferably 30 mm/s or more and 400 mm/s or less, and still more preferably 50 mm/s or more and 300 mm/s or less.
  • the second laser light L2 is a laser having a wavelength of 5000 nm or more
  • the energy absorbed by the glass plate 1 is preferably 50 mJ/mm 2 or more and 150 mJ/mm 2 or less.
  • the energy is more preferably 55 mJ/mm 2 or more and 130 mJ/mm 2 or less, and even more preferably 55 mJ/mm 2 or more and 125 mJ/mm 2 or less. It is preferable to use a laser that satisfies all of the above beam diameter, scanning speed, and energy absorbed by the glass plate 1 .
  • a stress 9 is applied to the unnecessary region 7 of the first main surface 1a of the glass plate 1 on the side irradiated with the second laser beam L2.
  • a stress 9 is applied in the direction from the first main surface 1a of the unnecessary region 7 to the second main surface 1b.
  • the stress 9 is applied to the contour line 4a formed by the scribe line 4, and the glass plate 1 is divided along the contour line 4a.
  • Stress 9 is, for example, mechanical stress.
  • the method of applying mechanical stress is not particularly limited, examples include folding, pressing, and adsorption.
  • the stress 9 may be applied by a method of applying a thermal stress in addition to the mechanical stress. Melting can be exemplified as thermal stress.
  • the glass plate 1 can be separated from the scribe line 4 by fusing a position shifted from the scribe line 4 toward the unnecessary region 7 .
  • the position where the stress 9 is directly applied is, for example, in the example of FIG. 1D, a position on the first main surface 1a slightly shifted from the contour line 4a toward the unnecessary region 7 side.
  • this stress 9 is directed to the portion of the contour 4a where the compressive stress is generated, the stress is eventually applied to at least a portion of the contour 4a.
  • the position where the stress 9 is directly applied may be a position closer to the contour line 4a, and may be determined according to various conditions such as the material of the glass plate 1 and the irradiation mode of the laser beams L1 and L2.
  • the glass plate 1 is cut along the scribe lines 4 to obtain a glass substrate 10 having a desired shape as shown in FIG. 1E.
  • a divided surface 11 along the scribe line 4 is formed on the glass substrate 10 .
  • the scribe lines 4 that define the contour lines 4a are formed on the glass plate 1 . Then, at least a part of the contour line 4a formed by the scribe line 4 is irradiated with the laser beam L2 under the condition that the glass plate 1 is not divided.
  • the glass plate 1 is divided along the As a result, the breaking stress required for breaking the glass plate 1 can be controlled to be low without unintended breaking.
  • the surface to be divided can be formed in a desired cross-sectional shape with high quality.
  • the dotted modified portions and minute cracks forming the scribe line 4 near the first main surface 1a are connected to form a connected modified portion 4b or a connected crack.
  • Compressive stress occurs in the portion of the scribe line 4 near the first main surface 1a to which the thermal stress is applied.
  • Tensile stress is generated in the portion of the scribe line 4 away from the vicinity of the surface 1a.
  • the scribe lines 4 in the vicinity of the first main surface 1a form connected modified portions 4b or connected cracks.
  • most of the scribe line 4 is maintained as a point-like modified portion or a minute crack in the thickness direction of the glass plate 1, and the desired area 6 having the desired shape shown in FIG.
  • the region 7 may remain connected.
  • the connection between the unnecessary region 7 and the desired region 6 is cut off by the connected modified portion 4b or the crack, the unnecessary region 7 remains without falling off due to the friction between the unnecessary region 7 and the desired region 6. It may be in a state where In the present embodiment, any state is regarded as "not divided".
  • the irradiation of the second laser beam L2 causes compressive stress in the vicinity of the contour line 4a formed by the scribe line 4, and tensile stress in the portion of the scribe line 4 other than the contour line 4a. can be generated. Therefore, the breaking stress required when dividing the glass plate 1, that is, the stress 9 applied to the contour line 4a can be controlled to be low.
  • the breaking stress required for dividing the glass plate 1 can be 12 MPa or less.
  • the breaking stress can be 10 MPa or less, more preferably 8 MPa or less.
  • the breaking stress when dividing the glass plate 1 can be measured by a flat four-point bending test or the like. For example, Shimadzu Autograph AGS-X 10 kN can be applied as a measuring device.
  • FIGS. 2A to 2C A method of forming the scribe line 4 by the first laser beam L1 will be described with reference to FIGS. 2A to 2C.
  • the X direction shown in FIGS. 2A to 2C is one direction forming the planar direction of the glass plate 1, and the Y direction is one direction forming the planar direction orthogonal to the X direction.
  • the X direction and the Y direction are directions perpendicular to each other.
  • the X direction is the horizontal direction of the glass plate 1 and the Y direction is the depth direction of the glass plate 1 .
  • the Z direction is the thickness direction of the glass plate 1 orthogonal to the X direction and the Y direction.
  • the irradiation focus of the first laser beam L1 is shifted in a direction parallel to the Z direction, and the irradiation is performed in multiple stages.
  • the dotted modified portions D1 to D3 can be formed in the thickness direction of the glass plate 1 .
  • FIG. 2A only three modified portions D1 to D3 are illustrated, but by forming these modified portions over the entire thickness of the glass plate 1, the first main surface 1a to the second main surface 1b A scribe line 4 can be obtained.
  • the laser beam L1 is shifted not only in the Z direction but also in the parallel direction to form the scribe line 4 along the planar direction.
  • the irradiation focus of the laser beam L1 is shifted in the Y direction to form the modified portions D4 to D6.
  • the scribe line 4 that defines the contour line 4a of the glass substrate in a desired shape.
  • the desired shape include forming a scribe line 4 that defines an in-curve outline 4a that is concave inward from the outer peripheral edge of the glass plate 1, other complicated outer shapes, and glass plate 1.
  • This embodiment can be applied to any shape such as formation of through holes in the plane of .
  • the glass plate 1 is irradiated once to form a scribe line 4 in the entire thickness direction of the glass plate 1.
  • the scribe line 4 formed as shown in FIGS. 2A to 2C can exist in a state in which a plurality of modified portions extending linearly or dottedly in the thickness direction are formed in the planar direction.
  • Each modified portion is spaced apart in the plane direction, and the interval between the modified portions in the plane direction (hereinafter referred to as irradiation pitch, etc.) is, for example, 2 ⁇ m to 25 ⁇ m, preferably 3 ⁇ m to 20 ⁇ m. is. Within this range, it is easy to improve the quality of the cut surface after cutting in a later step.
  • the irradiation pitch may be changed in at least a part of the contour line 4a, which will be described later, and the irradiation pitch may be made smaller in some regions of the contour line 4a than in other regions.
  • the irradiation pitch in the curved portion may be smaller than that in the straight portion.
  • the division at the curved portion can be promoted, and the quality of the divided surface can be improved.
  • an area may be provided in which the irradiation pitch is 70% or less of that of other areas. By doing so, it is possible to create a starting point for starting division along the contour line, and to improve the quality of the divided surface.
  • the length of the outline means the length along the main surfaces 1a and 1b unless otherwise specified. Therefore, “at least part of the contour line 4a” is part of the length along the main surfaces 1a and 1b, and curved portions and straight portions exist along the length direction. Also, the "circumferential length of the contour line 4a" means the entire length along the main surfaces 1a and 1b.
  • a glass plate 1 is prepared.
  • the glass plate 1 is irradiated with the first laser beam L1 to form a scribe line 4 that defines the outline 4a of the through hole.
  • the second laser beam L2 under the condition that the glass plate 1 is not divided.
  • a stress 9 is applied along the contour line 4a of the through-hole, for example by applying a mechanical stress 9 to the unwanted area 7, thereby causing the glass sheet 1 to move along the contour line 4a of the through-hole. Divide. Thereby, the unnecessary region 7 can be removed, and the glass substrate 20 having the through holes 15 can be obtained.
  • the outline 4a of the desired shape can be formed by a closed curve, and as an example, the glass substrate 20 having the through holes 15 can be formed.
  • One or more closed curves may be formed.
  • the closed curve may be a circular shape or a free curve shape having a plurality of radii of curvature, such as an elliptical shape.
  • a step of chamfering the glass plate 1 cut by the manufacturing method of the glass substrate of the above-described embodiment can be further included.
  • the corner between the end surface 1c of the glass plate 1 and the first main surface 1a obtained by dividing the unnecessary region 7 from FIG. 2 are chamfered using a whetstone.
  • a whetstone for example, a ball grindstone 18 can be used for chamfering.
  • the chamfered surface 19 can be formed as a concave surface.
  • the corners between the inner wall surface of the through-hole 15 obtained by dividing the unnecessary region 7 from FIG. 3D and the main surfaces are chamfered as shown in FIG. can.
  • the flat glass plate 1 is cut, but the method is not limited to this, and can also be applied to cutting curved glass, for example, as described below.
  • the manufacturing method of the glass substrate of the embodiment shown in FIGS. 5A to 5E conforms to the manufacturing method of the glass substrate of the embodiment shown in FIGS. 1A to 1E.
  • curved glass 21 is used as shown in FIG. 5A.
  • the curved glass 21 has a first main surface 21a on the front side and a second main surface 21b on the back side.
  • the curved glass 21 is irradiated with the first laser beam L1 to form the scribe line 4 defining the contour line 4a of the desired shape.
  • the contour line 4a formed by the scribe line 4 is irradiated with the second laser beam L2 under the condition that the curved glass 41 is not divided.
  • a stress 9 is applied to the contour line 4a formed by the scribe line 4, whereby the curved glass 21 can be divided along the contour line 4a, resulting in a curved glass substrate 40 having a desired shape. can be obtained.
  • the flat plate shape refers to a shape with a radius of curvature greater than 10,000 mm
  • the curved shape refers to a shape with a radius of curvature of 10,000 mm or less.
  • the radius of curvature is preferably 50 mm or more, more preferably 100 mm or more, and even more preferably 200 mm or more.
  • the radius of curvature is, for example, 10000 mm or less, preferably 5000 mm or less, more preferably 3000 mm or less.
  • the curved glass may have a shape with a bending axis extending in one direction, may have a shape with a bending axis extending in a plurality of directions, and may not have a developable surface.
  • Figures 6A to 6E are the same steps as Figures 1A to 1E.
  • the glass sheet 1 is bent. Thereby, it is possible to obtain the glass substrate 30 having a desired bent shape.
  • the flat glass plate 1 is used in FIGS. 6A to 6E and is bent in the final step of FIG. 6F, but the bending step may be performed before FIG. 6F.
  • the steps after the step of FIG. 6B may be performed.
  • a step of tempering or coating the glass plate can be included. Thereby, the strength of the divided surface and the main surface of the glass substrate can be increased.
  • the outer peripheral shape of a glass substrate When used for processing the outer peripheral shape of a glass substrate, it may be used to obtain a plurality of glass substrates 10 having a desired shape from one large glass plate. For example, as shown in FIGS. 9A and 9B, after forming a plurality of contour lines 4a having a desired shape on a single glass plate 1, the plurality of formed contour lines 4a are sequentially irradiated with a laser beam L2. , the unnecessary region 7 may be divided by applying a stress 9 to obtain a plurality of glass substrates 10 having desired shapes. By collectively performing the respective steps on a plurality of desired regions 6 in this manner, glass substrates 10 having a plurality of desired shapes can be efficiently obtained.
  • the area of the unnecessary region 7 on the glass plate 1 can be reduced.
  • the irradiation conditions of the laser beams L1 and L2 are changed, or the glass substrate is slightly deformed to reduce the local stress of the glass substrate. You can change the conditions. By changing the conditions in this way, it is possible to optimize the conditions for the difference in rigidity of different glass substrates at different positions within one large glass plate, and to obtain a glass substrate 10 having a desired shape with high-quality end faces. I can.
  • the glass substrate of the present embodiment can be applied to, for example, automobile instrument panels, automobile windows, cover glass for touch panel displays of tablets, notebook PCs, smartphones, etc., and cover glass for PC monitors, etc. Since the glass substrate of the present embodiment is excellent in strength, it is particularly suitable for glass used in automobiles, particularly glass substrates for in-vehicle displays.
  • One aspect of the present embodiment is a method for manufacturing a glass substrate to obtain a glass substrate having a desired shape from a glass plate 1.
  • the glass substrate 1 is irradiated with a first laser beam L1 to obtain a glass substrate having a desired shape.
  • a scribe line 4 is formed that defines the contour line 4a of the .
  • at least part of the contour line 4a formed by the scribe line 4 is irradiated with the second laser beam L2 under the condition that the glass plate 1 is not divided.
  • a method for manufacturing a glass substrate in which a stress 9 is applied to at least a part of the contour line 4a formed by the scribe line 4, the glass plate 1 is divided along the contour line 4a, and a desired shape is obtained. .
  • the dividing stress can be controlled to be low without causing unintended division, and the surface to be divided can be formed with a desired cross-sectional shape and high quality.
  • the scribe line 4 it is preferable to form the scribe line 4 over the entire thickness of the glass plate 1 .
  • the surface to be divided can be formed in a desired cross-sectional shape with high quality.
  • the first laser beam L1 is preferably a pulse laser. Moreover, according to the method for manufacturing a glass substrate of the present embodiment, the first laser beam L1 preferably has a linear power distribution in the optical axis direction. Moreover, according to the method for manufacturing a glass substrate of the present embodiment, the first laser beam L1 preferably has a power distribution with at least one peak in the optical axis direction.
  • the surface to be divided can be formed in a desired cross-sectional shape with high quality, and is particularly suitable for complex shapes and through hole formation.
  • the second laser light L2 is preferably a laser with a wavelength of 780 nm or longer.
  • the surface to be divided can be formed in a desired cross-sectional shape with high quality.
  • the second laser beam L2 is a laser having a wavelength of 5000 nm or more and a beam diameter of 2 mm or more and 10 mm or less.
  • the second laser light L2 is preferably a laser having a wavelength of 5000 nm or more, and the scanning speed is preferably 10 mm/s or more and 500 mm/s or less.
  • the second laser beam L2 is a laser with a wavelength of 5000 nm or more, and the energy absorbed by the glass plate is 50 mJ/mm 2 or more and 150 mJ/mm 2 or less. is preferably Thereby, the breaking stress required for dividing the glass plate 1 can be effectively reduced.
  • the method for manufacturing a glass substrate of the present embodiment it is preferable to apply mechanical stress along the contour lines 4a formed by the scribe lines 4 to divide the glass plate 1. As a result, it is possible to accurately divide along the contour line 4a, and the surface to be divided can be formed in a desired cross-sectional shape with high quality.
  • the breaking stress when dividing the glass plate 1 is preferably 12 MPa or less.
  • the surface to be divided can be formed in a desired cross-sectional shape with high quality.
  • the contour line 4a of the desired shape may be formed by at least one closed curve. Thereby, a glass substrate having a desired shape consisting of a closed curve can be obtained.
  • the glass substrate may be curved glass having a curved surface with at least one curvature.
  • the surface to be divided can be formed in a desired cross-sectional shape with high quality.
  • a step of chamfering the end face using a whetstone may be included.
  • a chamfered surface can be formed using, for example, a ball grindstone 18 .
  • a step of bending the glass plate 1 may be included.
  • the step of bending may be performed after the glass plate 1 is divided or before it is divided.
  • a step of tempering the glass plate 1 can be included.
  • the process of coating the glass plate 1 can be included. Thereby, the strength of the glass substrate can be improved.
  • the glass substrate is for an in-vehicle display. Since the glass substrate of the present embodiment is excellent in strength, it is particularly suitable for glass used in automobiles, particularly glass substrates for in-vehicle displays.
  • a method for manufacturing a glass substrate for obtaining a glass substrate having a desired shape from a glass plate comprising: irradiating the glass plate with a first laser beam to form a scribe line for defining a contour line of the glass substrate of the desired shape; irradiating at least part of the contour line formed by the scribe line with a second laser beam under conditions that the glass plate is not divided; A method of manufacturing a glass substrate, wherein stress is applied to at least a part of the contour formed by the scribe line, and the glass plate is divided along the contour to obtain the desired shape.
  • FIG. 7A is a plan view and a front view showing formation of the scribe line 4 using the first laser beam in the evaluation test of this embodiment.
  • the top view of FIG. 7A is a plan view, and the bottom view is a front view.
  • a glass plate 1 of length 50 mm ⁇ width 50 mm ⁇ thickness 1.3 mm was subjected to an evaluation test.
  • the first laser beam was irradiated so as to traverse the center of the glass plate 1 .
  • a contour line 4a made up of scribe lines 4 was formed on the surface of the glass plate 1.
  • a scribe line 4 was formed over the entire thickness of the glass plate 1 .
  • a picosecond IR laser was used as the first laser beam L1 for forming the scribe line 4 .
  • the irradiation conditions were as follows.
  • Oscillator Rofin StarPico3
  • Optical system Coherent Smart Cleave Scanning speed: 187.5mm/s Number of bursts: 4 bursts
  • Pulse energy 523 ⁇ J
  • Light wavelength 1064nm
  • FIG. 7B is a plan view showing irradiation of the second laser light in the evaluation test of this embodiment.
  • the second laser beam L2 was irradiated from the irradiation point P of the second laser beam L2 along the outline 4a.
  • the contour line 4a and the second laser beam L2 are shown slightly shifted, but this is to make them easier to see. It overlaps with the line 4a.
  • the irradiation point P of the second laser beam L2 is defocused in FIG. 7B, the present invention is not limited to this. That is, the starting irradiation point P may be aligned on the glass plate 1 .
  • a CO 2 laser was used as the second laser beam L2.
  • the irradiation conditions were as follows.
  • Oscillator: Rofin SR15i Focusing lens focal length: f 340mm Objective lens entrance diameter: 11.58mm Light wavelength: 10600nm
  • FIG. 7C is a front view explaining a flat four-point bending test in the evaluation test of this embodiment.
  • the glass plate 1 shown in FIG. 7C was subjected to a flat four-point bending test, and the glass plate 1 was divided into two. That is, the glass plate 1 was placed on the lower bar 13, the upper bar 12 was lowered from above the glass plate 1, stress was applied to the surface of the glass plate 1, and the average breaking stress required for breaking was measured.
  • the measurement conditions for the flat four-point bending test were as follows. Measuring device: Shimadzu Autograph AGS-X 10kN Distance between upper bars 12: 10mm Distance between lower bars 13: 30mm Upper bar lowering speed: 1mm/min
  • the measurement conditions for the first laser beam L1 and the flat four-point bending test are unified, and the beam diameter of the second laser beam L2, the scanning speed of the second laser beam, and the energy absorbed by the glass plate are changed.
  • Each of Examples 1 to 11 was carried out using the same method, and the average breaking stress was measured. Each example was measured five times.
  • the measurement results are shown in Table 1 and FIG. In Table 1, the beam diameter is expressed as CO 2 beam diameter, and the energy absorbed by the glass plate 1 is expressed as energy density.
  • Example 1 the beam diameter of the second laser beam was ⁇ 6.58, the second laser scanning speed was 300 mm/s, and the energy absorbed by the glass plate was 58.10 mJ/mm 2 .
  • the average breaking stress was 6.35 Mpa.
  • Example 2 the beam diameter of the second laser beam was ⁇ 6.58, the scanning speed of the second laser beam was 300 mm/s, and the energy absorbed by the glass plate was 64.55 mJ/mm 2 .
  • the average breaking stress was 5.58 Mpa.
  • Example 3 the beam diameter of the second laser beam was ⁇ 6.58, the scanning speed of the second laser beam was 300 mm/s, and the energy absorbed by the glass plate was 66.39 mJ/mm 2 .
  • the average breaking stress was 5.06 Mpa.
  • Example 4 the beam diameter of the second laser beam was ⁇ 6.07, the scanning speed of the second laser beam was 300 mm/s, and the energy absorbed by the glass plate was 63.11 mJ/mm 2 .
  • the average breaking stress was 5.59 Mpa.
  • Example 5 the beam diameter of the second laser beam was ⁇ 6.07, the scanning speed of the second laser beam was 300 mm/s, and the energy absorbed by the glass plate was 64.92 mJ/mm 2 .
  • the average breaking stress was 5.58 Mpa.
  • Example 6 the beam diameter of the second laser beam was ⁇ 5.55, the scanning speed of the second laser beam was 300 mm/s, and the energy absorbed by the glass plate was 62.79 mJ/mm 2 .
  • the average breaking stress was 6.20 Mpa.
  • Example 7 the beam diameter of the second laser beam was ⁇ 5.55, the scanning speed of the second laser beam was 300 mm/s, and the energy absorbed by the glass plate was 63.75 mJ/mm 2 .
  • the average breaking stress was 5.52 Mpa.
  • Example 8 the beam diameter of the second laser beam was ⁇ 5.55, the scanning speed of the second laser beam was 300 mm/s, and the energy absorbed by the glass plate was 64.46 mJ/mm 2 .
  • the average breaking stress was 5.78 Mpa.
  • Example 9 the beam diameter of the second laser beam was ⁇ 5.55, the scanning speed of the second laser beam was 50 mm/s, and the energy absorbed by the glass plate was 110.49 mJ/mm 2 .
  • the average breaking stress was 7.61 Mpa.
  • Example 10 the beam diameter of the second laser beam was ⁇ 5.55, the scanning speed of the second laser beam was 50 mm/s, and the energy absorbed by the glass plate was 123.75 mJ/mm 2 .
  • the average breaking stress was 6.81 Mpa.
  • Example 11 was carried out without irradiation with the second laser beam.
  • the average breaking stress was 14.92 Mpa.
  • Examples 1 to 10 are working examples, and example 11 is a comparative example. From the comparison of Examples 1 to 10 and 11, it was found that the irradiation of the second laser beam L2 can reduce the breaking stress necessary for dividing the glass plate 1.
  • FIG. 1 is a diagrammatic representation of Examples 1 to 10 and 11.
  • the second laser light L2 is a laser with a wavelength of 5000 nm or more, and the beam diameter is preferably 2 mm or more and 10 mm or less. Further, it was found that the beam diameter is more preferably 3 mm or more and 8 mm or less, and more preferably 5 mm or more and 7 mm or less.
  • the second laser light L2 is a laser with a wavelength of 5000 nm or more, and the scanning speed is preferably 10 mm/s or more and 500 mm/s or less. Further, it was found that the scanning speed is more preferably 30 mm/s or more and 400 mm/s or less, and further preferably 50 mm/s or more and 300 mm/s or less.
  • the second laser beam L2 is a laser with a wavelength of 5000 nm or more, and the energy absorbed by the glass plate is preferably 50 mJ/mm 2 or more and 150 mJ/mm 2 or less. rice field. It was also found that the energy is more preferably 55 mJ/mm 2 or more and 130 mJ/mm 2 or less, and still more preferably 55 mJ/mm 2 or more and 125 mJ/mm 2 or less.
  • Example 11 as a comparative example had a breaking stress of 14 MPa or more.
  • the breaking stress could be controlled to a low value of 12 MPa or less.
  • the breaking stress could be 10 MPa or less, and more preferably 8 MPa or less.
  • Reference Signs List 1 Glass plates 1a, 21a: First main surfaces 1b, 21b: Second main surface 4: Scribe line 4a: Contour line 6: Desired area 7: Unnecessary area 9: Stress 10, 20, 30: Glass substrate 11 : Divided surface 12 : Upper bar 13 : Lower bar 15 : Through hole 15a : End surface 18 : Ball grindstone 19 : Chamfered surface 21 : Curved glass 4b, D1 to D6: Modified portion L1 : First laser beam L2 : Second 2 laser light N: normal line P: irradiation point

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Abstract

La présente invention concerne un procédé de production d'un substrat de verre qui permet d'obtenir, à partir d'une plaque de verre (1), un substrat de verre ayant une forme souhaitée. Le procédé comprend les étapes consistant à : irradier le substrat de verre (1) avec un premier faisceau laser (L1) pour former une ligne de découpe (4) afin de délimiter une ligne de contour (4a) du substrat de verre d'une forme souhaitée ; irradier au moins une partie de la ligne de contour (4a) formée par la ligne de découpe (4) avec un second faisceau laser (L2) dans une condition telle que le substrat de verre (1) n'est pas autorisé à être séparé ; appliquer une contrainte (9) à au moins une partie de la ligne de contour (4a) formée par la ligne de découpe (4) ; et séparer le substrat de verre (1) le long de la ligne de contour (4a) pour obtenir la forme souhaitée.
PCT/JP2022/043632 2021-11-30 2022-11-25 Procédé de production de substrat de verre Ceased WO2023100776A1 (fr)

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CN202280079484.6A CN118354980A (zh) 2021-11-30 2022-11-25 玻璃基板的制造方法

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012111661A (ja) * 2010-11-24 2012-06-14 Nippon Electric Glass Co Ltd ガラス基板およびその製造方法
JP2013503105A (ja) * 2009-08-28 2013-01-31 コーニング インコーポレイテッド 化学強化ガラス基板からガラス品をレーザ割断するための方法
WO2014157004A1 (fr) * 2013-03-26 2014-10-02 旭硝子株式会社 Procédé de production d'un produit de verre
WO2018043016A1 (fr) * 2016-09-01 2018-03-08 旭硝子株式会社 Procédé de fabrication de produit en verre et produit en verre

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013503105A (ja) * 2009-08-28 2013-01-31 コーニング インコーポレイテッド 化学強化ガラス基板からガラス品をレーザ割断するための方法
JP2012111661A (ja) * 2010-11-24 2012-06-14 Nippon Electric Glass Co Ltd ガラス基板およびその製造方法
WO2014157004A1 (fr) * 2013-03-26 2014-10-02 旭硝子株式会社 Procédé de production d'un produit de verre
WO2018043016A1 (fr) * 2016-09-01 2018-03-08 旭硝子株式会社 Procédé de fabrication de produit en verre et produit en verre

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