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WO2023174005A1 - 显示面板以及显示装置 - Google Patents

显示面板以及显示装置 Download PDF

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Publication number
WO2023174005A1
WO2023174005A1 PCT/CN2023/077110 CN2023077110W WO2023174005A1 WO 2023174005 A1 WO2023174005 A1 WO 2023174005A1 CN 2023077110 W CN2023077110 W CN 2023077110W WO 2023174005 A1 WO2023174005 A1 WO 2023174005A1
Authority
WO
WIPO (PCT)
Prior art keywords
display panel
thermally conductive
conductive structure
light
control signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2023/077110
Other languages
English (en)
French (fr)
Inventor
庞笑天
王甲强
刘宪涛
王云杉
孟晨
王永辉
孙伟
徐思珩
胡大海
李子言
胡忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Optoelectronics Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to US18/292,939 priority Critical patent/US20250098507A1/en
Publication of WO2023174005A1 publication Critical patent/WO2023174005A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8794—Arrangements for heating and cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/70—Testing, e.g. accelerated lifetime tests

Definitions

  • the present disclosure belongs to the field of display technology, and specifically relates to a display panel and a display device.
  • OLED Organic Light Emitting Diodes
  • LCD liquid crystal displays
  • OLED displays have the advantages of fast response, high contrast, wide viewing angles, etc., and are easy to implement flexible displays. They are generally favored by the industry, and the industry unanimously believes that OLED displays It is very likely to become the mainstream product of the next generation of display technology.
  • the electrode material of the organic electroluminescent diode OLED adopts a material with high light transmittance, it can be prepared into a transparent display panel.
  • Transparent display panels can transmit light like glass and display images like a screen. They have a large market space in application fields such as architectural glass, vehicle glass, and exhibition displays.
  • the present invention aims to solve at least one of the technical problems existing in the prior art and provide a display panel and a display device.
  • the present disclosure provides a display panel, which at least includes a display area; the display panel includes a base substrate, a plurality of sub-pixels disposed on the base substrate, the sub-pixels at least include a light-emitting device, The light-emitting device is located in the display area; the light-emitting device includes a first electrode, a light-emitting layer, and a second electrode arranged sequentially in a direction away from the substrate; wherein the display panel also includes a thermal conductive structure, and the thermal conductive structure is provided On the side of the first electrode facing away from the light-emitting layer, the orthographic projection of the thermally conductive structure and the first electrode on the base substrate at least partially overlaps.
  • the thermal conductive structure and the light-emitting device are arranged in one-to-one correspondence.
  • the method further includes a heat dissipation structure disposed on a side of the thermal conductive structure facing away from the first electrode.
  • the thermally conductive structure includes a first thermally conductive sheet, a semiconductor layer and a second thermally conductive sheet arranged in order away from the light-emitting layer; the first thermally conductive sheet is connected to the first electrode of the light-emitting device, and the second thermally conductive sheet is connected to the first electrode of the light-emitting device.
  • the thermal conductive sheet is connected to the heat dissipation structure.
  • the thermally conductive structure includes a first thermally conductive sheet, a semiconductor layer and a second thermally conductive sheet arranged in sequence away from the light-emitting layer; an insulating thermally conductive sheet is provided between the first thermally conductive sheet and the first electrode of the light-emitting device. layer, the second thermal conductive sheet is connected to the heat dissipation structure.
  • the display panel is divided into a plurality of pixel units, each of the pixel units includes a plurality of sub-pixels; at least part of the corresponding thermal conductive structures in each of the pixel units is an integrated structure.
  • the thermal conductive structure and the heat dissipation structure are both disposed on a side of the base substrate close to the first electrode.
  • the thermal conductive structure is provided on a side of the base substrate close to the first electrode; and the heat dissipation structure is provided on a side of the base substrate away from the first electrode.
  • the material of the heat dissipation structure includes copper alloy.
  • the thermal conductive structure is disposed on a side away from the base substrate.
  • It also includes a plurality of first control signal lines and a plurality of second control signal lines; one thermally conductive structure is electrically connected to one of the first control signal lines and one of the second control signal lines.
  • the display panel further includes a plurality of first display signal lines, and the first control signal lines and the second control signal lines are respectively aligned with the orthogonal projections of the first display signal lines on the base substrate. overlap, and the orthographic projections of the first control signal line and the second control signal line on the base substrate do not overlap.
  • the thermally conductive structure includes a first thermally conductive sheet, a semiconductor layer and a second thermally conductive sheet arranged in sequence away from the light-emitting layer; the first control signal line and the second control signal line are respectively connected to the semiconductor layer. Electrically connected and arranged in the same layer as the semiconductor layer.
  • the thermally conductive structures are arranged in an array on a side of the base substrate close to the first electrode. cloth, the first control signal line and the second control signal line connecting the same thermal conductive structure are located on two opposite sides of the thermal conductive structure.
  • thermally conductive structure It includes a plurality of thermally conductive structures arranged sequentially along the column direction; the thermally conductive structures located in the same column are connected to the same first control signal line and the same second control signal line; the thermally conductive structures in each column are divided into It is a plurality of thermally conductive structure groups, and the thermally conductive structures in different thermally conductive structure groups are different;
  • the first control signal lines connected to each thermally conductive structure in one thermally conductive structure group are short-circuited, and the second control signal lines connected to each thermally conductive structure in one thermally conductive structure group are short-circuited. catch.
  • the thermally conductive structures in each column are divided into three thermally conductive structure groups, and the thermally conductive structures in different groups are different; the thermally conductive structures in every three columns are located in three different thermally conductive structure groups.
  • the thermally conductive structure is divided into multiple thermally conductive structure groups arranged in an array; the first control signal lines connected to each thermally conductive structure in one thermally conductive structure group are short-circuited, and one thermally conductive structure The second control signal lines connected to each of the thermal conductive structures in the group are short-circuited.
  • the method further includes: a first drive circuit; the first drive circuit is electrically connected to the thermally conductive structure; the first drive circuit is configured to provide the thermally conductive structure with the thermally conductive structure according to the temperature of the display panel.
  • First control signal; the thermally conductive structure is configured to export heat from the light-emitting device under the control of the first control signal.
  • the method further includes: a temperature sensing component and a first controller; the temperature sensing component is disposed on a side of the first electrode away from the light-emitting layer, and the temperature sensing component and the first electrode Orthographic projections on the substrate substrate at least partially overlap; the temperature sensing component is configured to generate a first sensing signal according to the temperature of the display panel; the first controller is configured to: The first sensing signal controls the operation of the thermally conductive structure.
  • It also includes at least one first sensing signal line and at least one second sensing signal line; the first sensing signal line and the second sensing signal line will be connected to the temperature sensing component respectively.
  • It also includes a plurality of second display signal lines; the first sensing signal line and the second sensing signal line;
  • the sensing signal lines respectively overlap with the orthographic projections of the second display signal lines on the base substrate, and the first sensing signal lines and the second sensing signal lines are on the base substrate.
  • Orthographic projection has no overlap.
  • the method further includes: a temperature conversion circuit; the temperature conversion circuit is configured to convert the first sensing signal into an electrical signal and transmit it to the first controller.
  • the temperature sensing component at least includes at least one of a thermistor or a thermocouple.
  • the display panel is a transparent display panel; the display panel further includes a transparent area; the orthographic projection of the thermal conductive structure and the transparent area on the substrate does not overlap.
  • the present disclosure also provides a display device, which includes the display panel as described above.
  • Figure 1 is a schematic diagram of an existing display panel.
  • Figure 2 is a cross-sectional view of a conventional display panel.
  • FIG. 3 is a schematic diagram of a pixel driving circuit in an existing display panel.
  • Figure 4 is a display panel according to an embodiment of the present disclosure.
  • Figure 5 is a thermal conductive structure according to an embodiment of the present disclosure.
  • Figure 6 shows another display panel according to an embodiment of the present disclosure.
  • FIG. 7 is a partial enlarged view of the display panel according to the embodiment of the present disclosure.
  • FIG. 8 is a partial cross-sectional view of the display panel shown in FIG. 7 .
  • FIG. 9 is another partial cross-sectional view of the display panel shown in FIG. 7 .
  • Figure 10 is another display panel according to an embodiment of the present disclosure.
  • FIG. 11 is another partial enlarged view of the display panel according to the embodiment of the present disclosure.
  • FIG. 12 is another schematic cross-sectional view of a display panel according to an embodiment of the present disclosure.
  • FIG. 13 is a schematic arrangement diagram of a thermal conductive structure according to an embodiment of the present disclosure.
  • FIG. 14 is another schematic diagram of the arrangement of the thermal conductive structure according to the embodiment of the present disclosure.
  • FIG. 15 is another schematic diagram of the arrangement of the thermal conductive structure according to the embodiment of the present disclosure.
  • FIG. 16 is another schematic diagram of the arrangement of the thermal conductive structure according to the embodiment of the present disclosure.
  • FIG. 17 is another schematic diagram of the arrangement of the thermal conductive structure according to the embodiment of the present disclosure.
  • FIG. 18 is a circuit schematic diagram of the first driving circuit according to an embodiment of the present disclosure.
  • FIG. 19 is another schematic diagram of a display panel according to an embodiment of the present disclosure.
  • FIG. 20 is another partial enlarged view of the display panel according to the embodiment of the present disclosure.
  • Figure 21 is a schematic diagram of the arrangement of a sensing component according to an embodiment of the present disclosure.
  • FIG. 22 is a schematic diagram of the arrangement of another sensing component according to an embodiment of the present disclosure.
  • FIG. 23 is a schematic diagram of a temperature conversion circuit according to an embodiment of the present disclosure.
  • FIG. 24 is another schematic diagram of a display panel according to an embodiment of the present disclosure.
  • Figure 1 is an exemplary display panel 0 that can be applied in a glass window.
  • the display panel 0 includes a display area DR and a transparent area TR.
  • the display area DR includes at least one sub-pixel d.
  • Each sub-pixel d is arranged in an array along the first direction X and the second direction Y on the substrate 1 respectively. arrangement.
  • the sub-pixel d includes at least one transparent light-emitting device 2 .
  • the display panel 0 since the The transparent area TR is provided, and the light-emitting device 2 in the display area DR is a transparent light-emitting device 2. Therefore, the display panel 0 has high transparency and can be applied in a glass window.
  • FIG. 2 is a schematic cross-sectional view of sub-pixel d shown in Figure 1, as shown in Figure 2.
  • the transparent light-emitting device 2 in the exemplary sub-pixel d is explained by taking a top-emission organic electroluminescent diode OLED as an example.
  • the transparent light-emitting device 2 at least includes a first electrode 201 , a light-emitting layer 202 and a second electrode 203 that are sequentially arranged in a direction away from the base substrate 1 .
  • the first electrode 201 may be a reflective anode
  • the second electrode 203 may be a transmissive cathode.
  • the reflective anode may be made of metal material, such as any one of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo).
  • metal material such as any one of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo).
  • metal material such as any one of magnesium (Mg), silver (Ag), copper (Cu), aluminum (Al), titanium (Ti), and molybdenum (Mo).
  • AlNd aluminum-neodymium alloy
  • MoNb molybdenum-niobium alloy
  • the transmission cathode can be made of any one or more of magnesium (Mg), silver (Ag), aluminum (Al), or an alloy made of any one or more of the above metals, or a transparent conductive material.
  • Mg magnesium
  • Ag silver
  • Al aluminum
  • ITO indium tin oxide
  • the luminescent layer 202 may include small molecule organic materials or polymer molecule organic materials, or may be fluorescent luminescent materials or phosphorescent luminescent materials.
  • the luminescent layer 202 may emit red light, green light, blue light, or white light, etc.; and, according to Depending on actual needs, in different examples, the light-emitting layer 202 may further include functional layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer.
  • subpixel d may further include a pixel driving circuit 28 .
  • the exemplary display panel 0 since the exemplary display panel 0 is a transparent display panel 0, in order to ensure the transparency of the transparent display panel 0, the orthographic projection of the anode on the base substrate 1 covers the pixel driving circuit 28 on the base substrate 1 1, the pixel driving circuit 28 and the anode are electrically connected through interlayer vias.
  • the pixel driving circuit 28 can also be disposed in the opaque region TR outside the sub-pixel d, and is electrically connected to the transparent light-emitting device 2 in the sub-pixel d through wiring.
  • the pixel driving circuit 28 may be disposed on the buffer layer 5 on the base substrate 1 .
  • the exemplary sub-pixel d further includes a pixel definition portion 3 , an interlayer insulating layer 29 disposed between the base substrate 1 and the anode, and an encapsulation layer 4 , wherein the encapsulation layer 4 includes a first sub-encapsulation layer. 401. Second son The encapsulation layer 402 and the third sub-encapsulation layer 403.
  • the pixel definition part 3 corresponds to one transparent light-emitting device 2 and defines a light-emitting area of one transparent light-emitting device 2 .
  • the interlayer insulating layer 29 and the encapsulation layer 4 can be made of highly transparent insulating materials.
  • FIG. 3 is a circuit diagram of the pixel driving circuit 28 in sub-pixel d shown in FIG. 2.
  • the pixel driving circuit 28 may include a 7T1C (ie, seven transistors and one capacitor) structure, such as a driving transistor T3 and a data writing transistor T4. , storage capacitor Cst, threshold compensation transistor T2, first reset transistor T1, second reset transistor T7, first light emission control transistor T5 and second light emission control transistor T6.
  • the source of the data writing transistor T4 is electrically connected to the source of the driving transistor T3.
  • the drain of the data writing transistor T4 is configured to be electrically connected to the data line Vd to receive the data signal.
  • the gate is configured to be electrically connected to the first scan signal line Ga1 to receive the scan signal; the first plate of the storage capacitor Cst is electrically connected to the first power supply voltage terminal VDD, and the second plate of the storage capacitor Cst is electrically connected to the drive transistor T3
  • the gate is electrically connected; the source of the threshold compensation transistor T2 is electrically connected to the drain of the driving transistor T3, the drain of the threshold compensation transistor T2 is electrically connected to the gate of the driving transistor T3, and the gate of the threshold compensation transistor T2 is configured to be connected with
  • the second scan signal line Ga2 is electrically connected to receive the compensation control signal; the source of the first reset transistor T1 is configured to be electrically connected to the first reset power terminal Vinit1 to receive the first reset signal, and the drain of the first reset transistor T1 is connected to the first reset power terminal Vinit1.
  • the gate of the driving transistor T3 is electrically connected, the gate of the first reset transistor T1 is configured to be electrically connected to the first reset control signal line Rst1 to receive the first sub-reset control signal; the source of the second reset transistor T7 is configured as The first reset power terminal Vinit1 is electrically connected to receive the first reset signal.
  • the drain of the second reset transistor T7 is electrically connected to the first electrode 201 of the light emitting device 2.
  • the gate of the second reset transistor T7 is configured to be connected to the second reset power terminal Vinit1.
  • the reset control signal line Rst2 is electrically connected to receive the second sub-reset control signal; the source of the first light-emitting control transistor T5 is electrically connected to the first power supply voltage terminal VDD, and the drain of the first light-emitting control transistor T5 is connected to the source of the driving transistor T3.
  • the gate of the first light-emitting control transistor T5 is electrically connected to the first light-emitting control signal line EM1 to receive the first light-emitting control signal; the source of the second light-emitting control transistor T6 and the drain of the driving transistor T3 Electrically connected, the drain of the second light-emitting control transistor T6 is electrically connected to the first electrode 201 of the light-emitting device 2, and the gate of the second light-emitting control transistor T6 is configured to be electrically connected to the second light-emitting control signal line EM2 to receive the second light-emitting control signal line EM2.
  • Light emitting control signal; the second circuit of the light emitting device 2 Pole 203 is electrically connected to the second supply voltage terminal VSS.
  • the exemplary transparent display panel 0 When the exemplary transparent display panel 0 is applied in vehicle glass, since the temperature inside the window is relatively high during operation of the vehicle, it is easy to affect the operation of the electronic components in the transparent display panel 0 , especially the electronic components in the transparent display panel 0 .
  • the temperature of the transparent light-emitting device 2 is more likely to increase under the influence of light, resulting in a poor display effect of the transparent display panel 0 .
  • the transparent display panel 0 will be permanently damaged.
  • the present disclosure provides a display panel 0 and a display device.
  • the present disclosure provides a display panel 0 that can be applied in glass windows.
  • the display panel 0 includes a base substrate 1 and a plurality of sub-pixels d arranged on the base substrate 1 .
  • the sub-pixel d at least includes a light-emitting device 2.
  • the light-emitting device 2 includes a first electrode 201, a light-emitting layer 202, and a second electrode 203 that are sequentially arranged in a direction away from the base substrate 1.
  • the display panel 0 further includes a thermally conductive structure 7 , which is disposed on a side of the first electrode 201 away from the light-emitting layer 202 , and the orthographic projections of the thermally conductive structure 7 and the first electrode 201 on the base substrate 1 at least partially overlap.
  • the display panel 0 includes a plurality of sub-pixels d arranged in an array on a substrate 1 , and each sub-pixel d includes at least one light-emitting device 2 .
  • the display panel 0 also includes a thermal conductive structure 7 for conducting heat from the light-emitting device 2 to the outside of the display panel 0 .
  • the thermal conductive structure 7 is disposed on the side of the first electrode 201 of the light-emitting device 2 away from the light-emitting layer 202 , and the orthographic projection of the thermal conductive structure 7 and the first electrode 201 on the substrate 1 at least partially overlaps. .
  • the thermal conductive structure 7 directly conducts the heat of the light-emitting device 2 to the outside of the display panel 0 , thus avoiding affecting the operation of the light-emitting device 2 or causing damage to the light-emitting device 2 when the temperature of the display panel 0 is high.
  • the thermally conductive structure 7 and the anode of the light-emitting device 2 are attached away from the luminescent layer 202. In this way, the light-emitting device 2 directly transfers heat to the thermally conductive structure 7, and due to the attachment, the light-emitting device emits light.
  • the contact area between the device 2 and the thermally conductive structure 7 is large, and the heat of the light-emitting device 2 is transferred to the thermally conductive structure 7 more effectively.
  • the orthographic projection of the thermally conductive structure 7 on the base substrate 1 covers the orthographic projection of the first electrode 201 of the light-emitting device 2 on the base substrate 1 .
  • the light-emitting device 2 may be an organic electroluminescent diode OLED.
  • the light-emitting device 2 may be a top-emitting OLED or a bottom-emitting OLED.
  • the light-emitting device 2 is only a top-emitting OLED.
  • OLED will be explained as an example.
  • the first electrode 201 may be an anode
  • the second electrode 203 may be a cathode.
  • the display panel 0 further includes a heat dissipation structure 6 disposed away from the heat conductive structure 7 .
  • the thermal conductive structure 7 is configured under the control of the first control signal to conduct the heat emitted by the light emitting device 2 through the heat dissipation structure 6 .
  • FIG. 5 is a schematic diagram of a thermal conductive structure 7 in an embodiment of the present disclosure.
  • the thermally conductive structure 7 includes a first thermally conductive sheet 12 , a second thermally conductive sheet 13 and a semiconductor layer disposed between the first thermally conductive sheet 12 and the second thermally conductive sheet 13 .
  • the semiconductor layer is provided on the same layer as the first control signal line 10 and the second control signal line 11 .
  • the semiconductor layer also includes a plurality of first semiconductors 14 and second semiconductors 15 .
  • the first semiconductors 14 and the second semiconductors 15 are arranged alternately.
  • a first semiconductor 14 and a second semiconductor 15 are connected in series through a conductive electrode 16 .
  • Both the first semiconductor 14 and the second semiconductor 15 are in direct contact with the first thermally conductive sheet 12 and the second thermally conductive sheet 13 .
  • the semiconductor layer transfers the heat on one side of the first thermally conductive sheet 12 to the second thermally conductive sheet 13 One side, so that the temperature of the first thermally conductive sheet 12 is lower than that of the second thermally conductive sheet 13 .
  • the first thermal conductive sheet 12 in the thermal conductive structure 7 faces the anode of the light-emitting device 2
  • the second thermal conductive sheet 13 in the thermal conductive structure 7 faces the heat dissipation structure 6 and is connected to the heat dissipation structure 6 . Therefore, the thermal conductive structure 7 can transfer the heat of the light-emitting device 2 from the first thermal conductive sheet 12 side of the thermal conductive structure 7 to the second thermal conductive sheet 13 side of the thermal conductive structure 7 under the control of the first control signal, and It is transmitted to the outside of the display panel 0 via the heat dissipation structure 6 connected to the second thermal conductive sheet 13 . In this way, the heat dissipation of the light-emitting device 2 in the display panel 0 is achieved.
  • the heat dissipation structure 6 may be made of copper alloy material, one side of which is connected to the hot end of the thermal conductive structure 7 , and the other side is connected to the high thermal conductivity material outside the display panel 0 .
  • the material of the heat dissipation structure 6 may be other high thermal conductivity thermal conductive materials, and the high thermal conductivity material outside the display panel 0 may be a metal structure outside the display panel 0, which is not limited in the embodiment of the present disclosure.
  • the first semiconductor 14 and the second semiconductor 15 The material may be a ternary solid solution alloy based on bismuth telluride.
  • the first semiconductor 14 may be Bi 2 Te 3 -Bi 2 Se 3
  • the material of the second semiconductor 15 may be Bi 2 Te 3 -Sb 2 Te 3 . It should be noted that the embodiment of the present disclosure is only explained by taking the material of the first semiconductor 14 and the material of the second semiconductor 15 as the above-mentioned materials.
  • FIG. 6 is another display panel 0 according to an embodiment of the present disclosure.
  • this display panel 0 may be a transparent display panel 0 .
  • the transparent display panel 0 includes a display area DR and a transparent area TR.
  • the display area DR includes at least one sub-pixel d, and the transparent area TR is a non-luminous area.
  • the sub-pixel d includes at least one light-emitting device 2, and the light-emitting device 2 may be the light-emitting device 2 as shown in Figures 1-3.
  • the light-emitting device 2 includes an anode facing away from the base substrate 1 , a light-emitting layer 202 and a cathode.
  • one light-emitting device 2 can display any color of red R, green G, blue B, or white W.
  • the area of the transparent region TR is greater than or equal to the area of the display region DR.
  • the orthographic projections of the thermal conductive structure 7 and the transparent region TR on the base substrate 1 do not overlap. In this way, the transparency of the transparent display panel 0 is further improved.
  • the display panel 0 shown in FIG. 6 is only an exemplary transparent display panel 0 according to the embodiment of the present disclosure, and transparent display panels 0 with other structures are also within the protection scope of the present disclosure.
  • the thermal conductive structure 7 is disposed on the side of the anode of the light-emitting device 2 away from the light-emitting layer 202 , and the orthographic projection of the thermal conductive structure 7 and the anode of the light-emitting device 2 on the substrate 1 is at least Partially overlapped, at the same time in the transparent display panel 0, the anode of the light emitting device 2 in the display area DR may be an opaque structure. Therefore, in this way, the thermally conductive structure 7 is disposed between the light-opaque structure in the display area DR and the base substrate 1 without occupying the area of the transparent area TR in the transparent display panel 0 .
  • the light transmittance of the transparent display panel 0 will not be affected, nor will the sub-pixel d in the display area DR be blocked from emitting light, thereby affecting the aperture ratio of the sub-pixel d.
  • the transparent display panel 0 is cooled down without affecting the display effect of the transparent display panel 0 .
  • FIG. 7 is a partially enlarged schematic diagram of the display panel 0 shown in FIG. 6 in an embodiment of the present disclosure.
  • the thermal conductive structure 7 and the light-emitting device 2 are arranged in one-to-one correspondence.
  • the first thermal conductive sheet 12 in the thermal conductive structure 7 is connected to the heat dissipation structure 6, and the second thermal conductive sheet 12 in the thermal conductive structure 7
  • the chip 13 is directly connected to the anode of the light emitting device 2.
  • the thermal conductive structure 7 is respectively In direct contact with the light-emitting device 2 and the heat dissipation structure 6, the heat dissipation effect is better.
  • FIG. 8 is a partial cross-sectional view of the display panel 0 shown in FIG. 7 . As shown in FIG.
  • the second heat sink 13 in the thermal conductive structure 7 is directly attached to the heat dissipation structure 6
  • the first heat sink 12 in the thermal conductive structure 7 is directly attached to the anode of the light emitting device 2 .
  • the light-emitting device 2 directly transfers heat to the thermally conductive structure 7, and due to the attachment method, the contact area between the light-emitting device 2 and the thermally conductive structure 7 is large, and the heat of the light-emitting device 2 is changed. Effectively transfer to the thermal conductive structure 7.
  • the orthographic projection of the thermally conductive structure 7 on the substrate 1 covers the orthographic projection of the anode of the light-emitting device 2 on the substrate 1, and the heat dissipation structure 6 is on the substrate 1.
  • the orthographic projection on the base substrate 1 covers the orthographic projection of the thermally conductive structure 7 on the base substrate 1 . In this way, the contact area is maximized, so that the heat conduction efficiency of the heat conduction structure 7 is further improved.
  • FIG. 9 is another partial cross-sectional view of the display panel 0 shown in FIG. 7 .
  • the second thermally conductive sheet 13 in the thermally conductive structure 7 is connected to the heat dissipation structure 6 , and an insulating thermally conductive layer 8 is provided directly between the first thermally conductive sheet 12 in the thermally conductive structure 7 and the anode of the light-emitting device 2 .
  • the second thermal conductive sheet 13 in the thermal conductive structure 7 is directly connected to the heat dissipation structure 6, the first thermal conductive sheet 12 in the thermal conductive structure 7 and the anode of the light-emitting device 2 are connected through an insulating thermal conductive layer 8 , therefore the thermal conductive structure 7 and the light-emitting device 2 only conduct heat transmission through an insulating thermal conductive layer 8, and the heat dissipation effect is better.
  • the second thermal conductive sheet 13 in the thermal conductive structure 7 and the heat dissipation structure 6 are directly attached to each other, and the first thermal conductive sheet 12 in the thermal conductive structure 7 is on one side of the insulating thermal conductive layer 8.
  • the other side of the insulating and thermally conductive layer 8 is directly attached to the anode of the light-emitting device 2 . Since they are connected through attachment, the contact area between the light-emitting device 2 and the thermally conductive structure 7 is large, and the heat from the light-emitting device 2 is transferred to the thermally conductive structure 7 more effectively.
  • the orthographic projection of the thermally conductive structure 7 on the substrate substrate 1 covers the orthographic projection of the anode of the light-emitting device 2 , and the orthographic projection of the heat dissipation structure 6 on the substrate substrate 1 The projection covers the orthographic projection of the thermally conductive structure 7 on the base substrate 1 . In this way, the contact area is maximized so that The heat conduction efficiency of the heat conduction structure 7 is further improved.
  • the insulating heat-conducting layer 8 can electrically insulate the anode of the light-emitting device 2 from the first heat-conducting sheet 12 in the heat-conducting structure 7 to prevent the heat-conducting structure 7 from affecting the electrical signal of the anode of the light-emitting device 2 .
  • one thermal conductive structure 7 can be set to correspond to multiple light-emitting devices 2, that is, one thermal conductive structure 7 can be used for multiple light-emitting devices 2. To dissipate heat. As shown in FIG.
  • the display panel 0 is divided into a plurality of pixel units D, each pixel unit D includes a plurality of sub-pixels d, and each pixel unit D corresponds to each of the thermal conductive structures 7 . At least part of it is an integral structure.
  • the display panel 0 includes a substrate substrate 1 and a plurality of pixel units D disposed on the display substrate.
  • Each pixel unit D includes at least one sub-pixel d, and each sub-pixel d includes at least a light-emitting device 2 .
  • Figure 11 is a partially enlarged view of the display panel 0 shown in Figure 10.
  • a pixel unit D includes four sub-pixels d, and each sub-pixel d displays red R, Green G, blue B and white W are taken as examples for explanation.
  • each pixel unit D The sub-pixels d in each pixel unit D are distributed in the display area DR of the display panel 0, and each sub-pixel d is arranged in an array along the first direction X and the second direction Y in the pixel unit D respectively. It should be noted that the sub-pixels d in the pixel unit D include sub-pixels d of other colors and the arrangement of the sub-pixels d in the pixel unit D in other arrangements are within the scope of the present disclosure.
  • one pixel unit D since one pixel unit D includes four sub-pixels d in the embodiment of the present disclosure, one pixel unit D corresponds to four thermally conductive structures 7 . Among them, as shown in FIG. 11 , the four thermally conductive structures 7 are combined into a first thermally conductive structure 9 of an integrated structure. That is, one pixel unit D actually corresponds to only two first thermally conductive structures 9 .
  • the second thermal conductive sheet 13 in the first thermal conductive structure 9 is connected to its corresponding heat dissipation structure 6, and the first thermal conductive sheet 12 in the first thermal conductive structure 9 is directly disposed between the anode of the light-emitting device 2 There is an insulating and thermally conductive layer 8.
  • the second thermal conductive sheet 13 in the first thermal conductive structure 9 is directly connected to the heat dissipation structure 6, a layer of insulation is used between the first thermal conductive sheet 13 in the first thermal conductive structure 9 and the anode of the light emitting device 2.
  • the thermal conductive layer 8 is connected, so the thermal conductive structure 7 and the light-emitting device 2 only transmit heat through one layer of insulating thermal conductive layer 8, and the heat dissipation effect is better. At the same time, due to the insulating thermal conductive layer 8 provided, the anodes of different light-emitting devices 2 corresponding to the same first thermal conductive structure 9 will not be electrically connected to each other through the first thermal conductive structure 9. Affects the display of display panel 0.
  • the second thermally conductive sheet 13 in the first thermally conductive structure 9 and its corresponding thermally conductive structure 7 are directly attached, and the first thermally conductive sheet 12 in the first thermally conductive structure 9 is on one side of the insulating thermally conductive layer 8 The other side of the insulating heat-conducting layer 8 is directly attached to the anode of the light-emitting device 2.
  • the light-emitting device 2 directly transfers heat to the first heat-conducting structure 9 through the insulating heat-conducting layer 8, and due to the Connected by attachment, the contact area between the light-emitting device 2 and the first thermal conductive structure 9 is large, and the heat of the light-emitting device 2 is transferred to the first thermal conductive structure 9 more effectively.
  • one pixel unit D in the embodiment of the present disclosure includes four sub-pixels d
  • the embodiment of the present disclosure only uses one pixel unit D to correspond to four thermal conductive structures 7.
  • the above four thermal conductive structures 7 are combined in pairs to form The first thermal conductive structure 9 is explained as an example. In some embodiments, three of the four thermal conductive structures 7 are combined into an integrated first thermal conductive structure 9; four of the four thermal conductive structures 7 are 7 and the first thermal conductive structure 9 combined into an integrated structure are also within the protection scope of the present disclosure.
  • the thermal conductive structure 7 and the heat dissipation structure 6 are both disposed on a side of the base substrate 1 close to the anode of the light emitting device 2 .
  • the thermal conductive structure 7 and the heat dissipation structure 6 can be provided in the film layer structure of the display panel 0. In this way, the integration of the display panel 0 with the thermal conductive structure 7 is achieved. Higher density facilitates thinner and lighter design of display panel 0.
  • the positional relationship between the thermally conductive structure 7 and the anode of the light-emitting device 2 can be made easier to set, that is, it is easier to make the orthographic projections of the thermally conductive structure 7 and the anode of the light-emitting device 2 on the substrate 1 at least partially overlap during preparation, To improve the yield rate of the transparent display panel 0.
  • the thermal conductive structure 7 can also be disposed on the side facing away from the base substrate 1 .
  • the first thermal conductive sheet 12 in the thermal conductive structure 7 is connected to the base substrate 1
  • the second thermal conductive sheet 13 in the thermal conductive structure 7 is connected to the heat dissipation structure 6 . In this way, the thermal conductive structure 7 is easy to install.
  • the first thermal conductive sheet 12 in the thermal conductive structure 7 can also be directly attached to the substrate 1 , and the second thermal conductive sheet 13 in the thermal conductive structure 7 can be directly attached to the heat dissipation structure 6 .
  • the transparent display panel 0 and the guide are connected through attachment, The contact area between the thermal structures 7 is large, and the heat of the light-emitting device 2 is transferred to the thermal conductive structure 7 more effectively.
  • the film including the thermal conductive structure 7 can be attached to the side away from the base substrate 1 by attachment, and the thermal conductive structure 7 and The orthographic projection of the anode of the light-emitting device 2 on the base substrate 1 at least partially overlaps. In this way, there is no need to adjust the preparation process of the display panel 0, and the temperature of the display panel 0 can be reduced without affecting the light transmittance of the display panel 0.
  • the transparent display panel 0 may also have a thermally conductive structure 7 disposed on a side of the substrate substrate 1 close to the anode of the light-emitting device 2 , and a heat dissipation structure 6 disposed on a side of the substrate substrate 1 away from the anode of the light-emitting device 2 .
  • the first thermal conductive sheet 12 in the thermal conductive structure 7 is connected to the anode of the light-emitting device 2
  • the second thermal conductive sheet 13 in the thermal conductive structure 7 is connected to the heat dissipation structure 6 .
  • the display panel 0 further includes a plurality of first display signal lines, and the first control signal lines 10 and the second control signal lines 11 respectively overlap with the orthographic projection of the first display signal lines on the base substrate 1, Moreover, the orthographic projections of the first control signal line 10 and the second control signal line 11 on the base substrate 1 do not overlap.
  • the first control signal line 10 and the second control signal line 11 for controlling the operation of the thermal conductive structure 7 can be designed as respectively overlap with the first display signal line on the display substrate in orthographic projection on the substrate substrate 1 to avoid adding the first control signal line 10 and the second control signal line 11 from affecting the light transmittance and pixel aperture ratio of the transparent display panel 0 .
  • the existing first control signal line 10 on the transparent display panel 0 may have an opaque structure. Therefore, in this way, the first control signal line 10 and the second control signal line are connected to each other.
  • the line 11 is arranged between the opaque structure of the display panel 0 and the base substrate 1 , and will not occupy a large area of the light-transmitting area in the transparent display panel 0 , and will neither affect the light transmittance of the transparent display panel 0 nor the light transmittance of the transparent display panel 0 . It will not block the emission of sub-pixel d in the display area DR and affect the pixel aperture ratio.
  • the first display signal line can be any signal line on the display panel 0 used to drive the sub-pixel d to display the picture, such as a gate signal line, a data signal line or a power signal line. In this embodiment of the present disclosure, Not limited.
  • FIG. 13 is an exemplary arrangement of the thermally conductive structures 7 in the display panel 0 .
  • the thermal conductive structure 7 is close to the base substrate 1
  • One side of the first electrode 201 is arranged in an array, and the first control signal line 10 and the second control signal line 11 connected to the same thermal conductive structure 7 are located on two opposite sides of the thermal conductive structure 7 .
  • the signal line wiring on the display panel 0 is relatively uniform, and at the same time, the first control signal line 10 and the second control signal line 11 are prevented from interfering with the signal lines on the display panel 0 .
  • FIG. 14 is another exemplary arrangement of the thermally conductive structure 7 in the display panel 0 . It includes a plurality of thermally conductive structures 7 arranged sequentially along the column direction. Thermal conductive structures 7 located in the same column are connected to the same first control signal line 10 and the same second control signal line 11 . As shown in Figures 15-17, each column of thermally conductive structures 7 is divided into multiple thermally conductive structure groups 24, and the thermally conductive structures 7 in different groups are different. The first control signal lines 10 connected to each thermal conductive structure 7 in a thermal conductive structure group 24 are short-circuited, and the second control signal lines 11 connected to each thermal conductive structure 7 in a thermal conductive structure group 24 are short-circuited.
  • the thermally conductive structures 7 are divided into multiple thermally conductive structure groups 24 according to their column direction, and the thermally conductive structures 7 in different groups are different. Each thermal conductive structure 7 in the same thermal conductive structure group 24 is connected to the same first control signal line 10 and the same second control signal line 11 . In this way, the thermally conductive structures 7 are driven in groups.
  • the settings required by the embodiment of the present disclosure are The number of the first control signal lines 10 and the second control signal lines 11 is greatly reduced, and at the same time, the driving circuit for driving the first control signal lines 10 and the second control signal lines 11 is greatly simplified.
  • different driving voltages can be given to different thermal conductive structure groups 24 so that the heat dissipation effect of the display panel 0 is better.
  • each row of thermally conductive structures 7 is divided into three thermally conductive structure groups 24 , and the thermally conductive structures 7 in different groups are different. Each three rows of thermally conductive structures 7 are located in three different thermally conductive structure groups 24 .
  • each column of thermally conductive structures 7 is divided into a first thermally conductive structure group 25 , a second thermally conductive structure group 26 and a third thermally conductive structure group 27 .
  • the display panel 0 includes N columns of thermally conductive structures 7 , and each column of thermally conductive structures 7 is sequentially arranged along the row direction.
  • thermal conductive structures 7 are located in three different thermal conductive structure groups 24, that is, the first thermal conductive structure group 25 includes the thermal conductive structures 7 of the 1st, 4th, 7...N-2 columns; the second thermal conductive structure group 26 includes Thermal junctions in columns 2, 5, 8...N-1 Structure 7; the third thermally conductive structure group 27 includes the thermally conductive structures 7 in the 3rd, 6th, 9th...N columns. Therefore, the thermally conductive structures 7 in the display panel 0 only need three first control signals to drive all the thermally conductive structures 7 on the display panel 0 . At the same time, the thermal conductive structure 7 with this group driving mode has better heat dissipation effect.
  • Figure 17 is another grouping method according to an embodiment of the present disclosure.
  • the thermally conductive structure 7 is divided into a plurality of thermally conductive structure groups 24 arranged in an array.
  • the first control signal lines 10 connected to each thermal conductive structure 7 in a thermal conductive structure group 24 are short-circuited, and the second control signal lines 11 connected to each thermal conductive structure 7 in a thermal conductive structure group 24 are short-circuited.
  • specific reference is made to FIG. 17 .
  • the first control signal line 10 and the second control signal line 11 required by the embodiment of the present disclosure are The number of the second control signal lines 11 is greatly reduced, and at the same time, the driving circuit for driving the first control signal line 10 and the second control signal line 11 is greatly simplified.
  • different driving voltages can be given to the thermal conductive structure groups 24 in different areas, so that the heat dissipation effect of the display panel 0 is better.
  • the display panel 0 further includes a first driving circuit 17 .
  • the first driving circuit 17 is configured to provide a first control signal to the thermal conductive structure 7 according to the temperature of the display panel 0 .
  • the first driving circuit 17 may be a switching power supply circuit or other DC driving circuit.
  • This embodiment of the present disclosure takes the first driving circuit 17 as a switching power supply circuit as an example for description.
  • Figure 18 is an exemplary switching power supply circuit, which includes: a first power control terminal K1, a second power control terminal K2, a signal output terminal Vout, a driving subcircuit, and a driving subcircuit. peripheral circuit.
  • the driving sub-circuit may be a switching power supply chip LM5145.
  • the first power control terminal K1 and the second power control terminal K2 are written with power control signals, and the switching power supply chip LM5145 According to the power control signal written into the first power control terminal K1 and the second power control terminal K2, a corresponding first control signal is output to the signal output terminal Vout.
  • the first power control terminal K1 and the second power control terminal K2 can be connected to the first controller 18 so that the first drive circuit 17 can respond to changes in the power control signal output by the first controller 18 , output the adjustable first control signal.
  • the adjustable first control signal can be written into the thermally conductive structure 7, that is, the thermal conductivity of the thermally conductive structure 7 can be adjusted according to the first control signal. changes as the signal changes. In this way, the thermal conductive structure 7 can adjust its thermal conductivity according to actual needs.
  • the driving sub-circuit is a switching power supply chip LM5145 as an example for explanation, and the use of driving sub-circuits of other chips is also within the scope of the present disclosure.
  • the first drive circuit 17 shown in FIG. 18 may also include multiple power control terminals and signal output terminals Vout.
  • the first drive circuit 17 only includes the first power control terminal K1 and the second power control terminal K2. Taking a signal output terminal Vout as an example, the first driving circuit 17 may also include multiple power control terminals and multiple signal output terminals Vout, which is also within the protection scope of this application.
  • the display panel 0 further includes a temperature sensing component 20 and a first controller 18 .
  • the temperature sensing component 20 is disposed on a side of the first electrode 201 away from the light-emitting layer 202 , and the orthographic projections of the temperature sensing component 20 and the first electrode 201 on the base substrate 1 at least partially overlap.
  • the temperature sensing component 20 is configured to generate a first sensing signal according to the temperature of the display panel 0 .
  • the first controller 18 is configured to control the thermally conductive structure 7 to operate according to the first sensing signal.
  • the temperature sensing component 20 is disposed on the side of the anode of the light-emitting device 2 away from the light-emitting layer 202, and the orthographic projection of the temperature sensing component 20 and the anode of the light-emitting device 2 on the substrate 1 is at least Partially overlapping.
  • the anode of the light-emitting device 2 can be an opaque structure, in this way, the heat dissipation component is arranged on the opaque side of the display panel 0 Between the structure and the base substrate 1, a large area of the light-transmitting area in the transparent display panel 0 will not be occupied, and it will neither affect the light transmittance of the transparent display panel 0 nor block the sub-pixels d in the display area DR. Emitting light affects the aperture ratio of sub-pixel d. It is realized that the thermal conductive structure 7 is controlled to cool down the display panel 0 by arranging the temperature sensing component 20 and the first controller 18 without affecting the display effect of the transparent display panel 0 .
  • the temperature sensing component 20 can generate a first sensing signal according to the temperature of the display panel 0 .
  • the first controller 18 may receive the first sensing signal through the analog-to-digital conversion subcircuit and process the first sensing signal. In some embodiments, when the first controller 18 determines that the temperature on the display panel 0 exceeds the preset value according to the first sensing signal, that is, when it determines that the temperature of the display panel 0 is too high, The first controller 18 outputs a first control signal to control the heat dissipation component on the display panel 0 to dissipate heat from the light-emitting device 2 on the display panel 0 to cool down the display panel 0 and avoid excessive temperature affecting its operation or causing its operation. damage.
  • the number of temperature sensing components 20 on the display panel 0 may be one or more. Specifically referring to FIG. 21 , when the number of temperature sensing components 20 is one, since the temperature in the central area of the display panel 0 is the highest, the temperature sensing component 20 is arranged in the central area of the display panel 0 to more accurately determine the display. Whether the light-emitting device 2 in the panel 0 needs to dissipate heat makes the temperature sensing of the display panel 0 more accurate. When the number of temperature sensing components 20 is multiple, as shown in FIG. 22 , the temperature sensing components 20 can be evenly arranged on the display panel 0 .
  • first controller 18 can process multiple first sensing signals through a preset temperature control algorithm to make the temperature sensing of the display panel 0 more accurate.
  • the display panel 0 further includes: a temperature conversion circuit 23 .
  • the temperature conversion circuit 23 is configured to convert the first sensing signal into an electrical signal and transmit it to the first controller 18 .
  • the temperature on the display panel 0 can be sensed by only arranging the temperature sensing component 20 with a relatively simple structure. This makes the structure of the display panel 0 simple and easy to implement, and facilitates lightweight and thin design.
  • Figure 23 is an exemplary temperature conversion circuit 23.
  • the temperature sensing component 20 includes at least one of a thermistor or a thermocouple.
  • the temperature conversion circuit 23 shown in FIGS. 21-23 is only explained by taking the temperature sensing component 20 as a heat-sensitive component as an example.
  • the thermistor is disposed on the display panel 0, and one end of a first sensing signal line 21 and one end of a second sensing signal line 22 are connected thereto respectively.
  • a first sensing signal line The other end of 21 and the other end of a second sensing signal line 22 are connected to the temperature conversion circuit 23 respectively.
  • the temperature conversion circuit 23 and the thermistor can be arranged inside the display panel 0 and outside the display panel 0 respectively, which helps to improve the transparency of the display panel 0 when the display panel 0 is a transparent display panel 0 .
  • the temperature conversion circuit 23 further includes a first operator circuit 231 , a second operator circuit 232 and a plurality of resistors. Among them, the resistance of the thermistor changes with temperature, so the electrical signal on the thermistor changes with the electrical The first operator circuit 231 and the second operator circuit 232 calculate and amplify the electrical signal on the thermistor, and output it to the first controller 18 through the output end of the temperature conversion circuit 23 .
  • first operator circuit and the second operator circuit in the embodiment of the present disclosure may be operational amplifiers.
  • the embodiment of the present disclosure only takes the temperature conversion circuit 23 shown in FIG. 23 as an example. Other circuits that perform temperature/voltage conversion through thermistors are within the scope of the present application.
  • the display panel 0 further includes a plurality of second display signal lines.
  • the first sensing signal lines 21 and the second sensing signal lines 22 are respectively orthogonal projections of the second display signal lines on the substrate 1 overlap, and the orthographic projections of the first sensing signal line 21 and the second sensing signal line 22 on the base substrate 1 do not overlap.
  • the first sensing signal line 21 and the second sensing signal line 22 connected to the thermistor can be designed to be connected to the display panel 0 respectively.
  • the second display signal lines on the transparent display panel 1 overlap in orthographic projection to prevent the addition of the first sensing signal line 21 and the second sensing signal line 22 from affecting the light transmittance and pixel aperture ratio of the transparent display panel 0 .
  • the existing first control signal line 10 on the transparent display panel 0 may have an opaque structure, in this way, the first sensing signal line 21 and the second sensing signal line 21 are connected to each other.
  • the measurement signal line 22 is disposed between the opaque structure of the display panel 0 and the base substrate 1 , and will not occupy a large area of the light-transmitting area in the transparent display panel 0 , nor will it affect the light transmittance of the transparent display panel 0 , and will not block the sub-pixel d in the display area DR from emitting light. It should be noted that, in some embodiments, the above-mentioned first display signal line and the second display signal line may be the same display signal line or the same type of display signal line, which is not limited in the embodiments of the present disclosure.
  • the first controller 18 may be disposed outside the display panel 0 . Especially when the display panel 0 is applied to a glass window, the first controller 18 can be set on the SOC (System on a Chip) board outside the display panel 0 . In this way, the area of the transparent region TR of the transparent display panel 0 can be further increased. At the same time, when the display panel 0 is applied to a glass window, the first controller 18 can also control the external refrigeration system of the display panel 0 to cool it down according to the temperature of the display panel 0 .
  • the external refrigeration system may be an air conditioning system or other cooling system.
  • the display panel 0 may further include: a second controller 19 .
  • the second controller 19 is configured to control the sub-pixel d in the display panel 0 to emit light according to the first sensing signal.
  • the second controller 19 controls each pixel to emit light according to the picture to be displayed. Since the first sensing signal generated by the temperature sensing component 20 according to the temperature of the display panel 0 can be converted into temperature information of the display panel 0, when the temperature of the display panel 0 is too high, the second controller 19 can operate according to the first sensing signal.
  • the first controller 18 and the second controller 19 may be integrated on the same SOC.
  • the present disclosure also provides a display device, which includes the display panel 0 provided in the previous embodiment.
  • the display device can be: a display panel 0, a flexible wearable device, a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, or any other product or component with a display function.
  • Other essential components of the display device are understood by those of ordinary skill in the art, and will not be described in detail here, nor should they be used to limit the present invention.

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Abstract

本公开提供一种显示面板以及显示装置，属于显示技术领域。本公开提供一种显示面板，其至少包括显示区。显示面板包括衬底基板和设置在衬底基板上的多个子像素，子像素至少包括发光器件，发光器件位于所述显示区。发光器件包括沿背离衬底基板方向依次设置的第一电极、发光层、第二电极。其中，显示面板还包括导热结构，导热结构设置在第一电极背离发光层的一侧，且导热结构和第一电极在衬底基板上的正投影至少部分重叠。

Description

显示面板以及显示装置 技术领域
本公开属于显示技术领域，具体涉及一种显示面板以及显示装置。
背景技术
有机电致发光二极管(Organic Light Emitting Diodes，OLED)属于一种新型电流型半导体发光器件，是通过控制该器件载流子的注入和复合激发有机材料发光显示，属于一种自主发光技术。与被动发光的液晶显示器(Liquid Crystal Display，LCD)相比，自主发光的OLED显示器具有响应速度快、对比度高、视角广等优点，并且容易实现柔性显示，被业内普遍看好，业界一致认为OLED显示器极有可能成为下一代显示技术的主流产品。
当有机电致发光二极管OLED的电极材料采用高透光率的材料时，可以将其制备成透明显示面板。透明显示面板既可以像玻璃一样透光，也可以像屏幕一样显示图像，在建筑玻璃、车载玻璃以及展览展示等应用领域具有较大的市场空间。
当OLED透明显示面板应用于车载玻璃上时，存在OLED显示面板温度较高，OLED显示面板在高温环境下劣化的问题。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一，提供一种显示面板以及显示装置。
第一方面，本公开提供一种显示面板，其至少包括显示区；所述显示面板包括衬底基板，设置在所述衬底基板上的多个子像素，所述子像素至少包括发光器件，所述发光器件位于所述显示区；所述发光器件包括沿背离衬底基板方向依次设置的第一电极、发光层、第二电极；其中，所述显示面板还包括导热结构，所述导热结构设置在所述第一电极背离所述发光层的一侧，且所述导热结构和所述第一电极在所述衬底基板上的正投影至少部分重叠。
其中，所述导热结构和所述发光器件一一对应设置。
其中，还包括设置在所述导热结构背离所述第一电极一侧的散热结构。
其中，所述导热结构包括背离所述发光层方向依次设置的第一导热片、半导体层以及第二导热片；所述第一导热片与所述发光器件的第一电极相连，所述第二导热片与所述散热结构相连。
其中，所述导热结构包括背离所述发光层方向依次设置的第一导热片、半导体层以及第二导热片；所述第一导热片与所述发光器件的第一电极之间设置有绝缘导热层，所述第二导热片与所述散热结构相连。
其中，所述显示面板划分为多个像素单元，每个所述像素单元包括多个所述子像素；每个所述像素单元中所对应的各所述导热结构中的至少部分为一体结构。
其中，所述导热结构和所述散热结构均设置在所述衬底基板靠近所述第一电极的一侧。
其中，所述导热结构设置在所述衬底基板靠近所述第一电极的一侧；所述散热结构设置在所述衬底基板背离所述第一电极的一侧。
其中，所述散热结构的材料包括铜合金。
其中，所述导热结构设置在背离所述衬底基板的一侧。
其中，还包括多条第一控制信号线和多条第二控制信号线；一个所述导热结构电连接一条所述第一控制信号线和一条所述第二控制信号线。
其中，所述显示面板还包括多条第一显示信号线，所述第一控制信号线和所述第二控制信号线分别与所述第一显示信号线在所述衬底基板上的正投影重叠，且所述第一控制信号线和所述第二控制信号线在所述衬底基板上的正投影无重叠。
其中，所述导热结构包括背离所述发光层方向依次设置的第一导热片、半导体层以及第二导热片；所述第一控制信号线和所述第二控制信号线分别与所述半导体层电连接，且与所述半导体层同层设置。
其中，所述导热结构在所述衬底基板靠近所述第一电极的一侧呈阵列排 布，连接同一所述导热结构的所述第一控制信号线和所述第二控制信号线位于所述导热结构的两相对侧。
其中，包括多个沿列方向依次排布的导热结构；位于同列的所述导热结构连接同一条所述第一控制信号线和同一条所述第二控制信号线；各列所述导热结构划分为多个导热结构组，不同所述导热结构组中的所述导热结构各不相同；
一个所述导热结构组内的各个所述导热结构所连接的所述第一控制信号线短接，一个所述导热结构组内的各个所述导热结构所连接的所述第二控制信号线短接。
其中，各列所述导热结构划分为三个所述导热结构组，不同组中的所述导热结构各不相同；每三列所述导热结构依次位于三个不同的所述导热结构组内。
其中，所述导热结构划分为呈阵列排布的多个导热结构组；一个所述导热结构组内的各个所述导热结构所连接的所述第一控制信号线短接，一个所述导热结构组内的各个所述导热结构所连接的所述第二控制信号线短接。
其中，还包括：第一驱动电路；所述第一驱动电路和所述导热结构电连接；所述第一驱动电路，被配置为根据所述显示面板的温度，向所述导热结构提供所述第一控制信号；所述导热结构，被配置为在所述第一控制信号的控制下，将所述发光器件的热量导出。
其中，还包括：温度感测组件和第一控制器；所述温度感测组件设置在所述第一电极背离所述发光层的一侧，且所述温度感测组件和所述第一电极在所述衬底基板上的正投影至少部分重叠；所述温度感测组件，被配置为根据所述显示面板的温度，生成第一感测信号；所述第一控制器被配置为，根据所述第一感测信号控制所述导热结构工作。
其中，还包括至少一条第一感测信号线和至少一条第二感测信号线；所述第一感测信号线和所述第二感测信号线将分别与所述温度感测组件相连。
其中，还包括多条第二显示信号线；所述第一感测信号线和所述第二感 测信号线分别与所述第二显示信号线在所述衬底基板上的正投影重叠，且所述第一感测信号线和所述第二感测信号线在所述衬底基板上的正投影无重叠。
其中，还包括：温度转换电路；所述温度转换电路被配置为将所述第一感测信号转换为电信号并传输给所述第一控制器。
其中，所述温度感测组件至少包括热敏电阻或热电偶中的至少一种。
其中，所述显示面板为透明显示面板；所述显示面板还包括透明区；所述导热结构和所述透明区在所述衬底基板上的正投影无重叠。
第二方面，本公开还提供了一种显示装置，其包括如上所述的显示面板。
附图说明
图1为现有的显示面板的示意图。
图2为现有的显示面板的一种截面图。
图3为现有的显示面板中的像素驱动电路的一种示意图。
图4为本公开实施例的一种显示面板。
图5为本公开实施例的一种导热结构。
图6为本公开实施例的另一种显示面板。
图7为本公开实施例的显示面板的一种局部放大图。
图8为图7所示的显示面板的一种局部截面图。
图9为图7所示的显示面板的另一种局部截面图。
图10为本公开实施例的另一种显示面板。
图11为本公开实施例的显示面板的另一种局部放大图。
图12为本公开实施例的显示面板的另一种截面示意图。
图13为本公开实施例的导热结构的一种排布示意图。
图14为本公开实施例的导热结构的另一种排布示意图。
图15为本公开实施例的导热结构的另一种排布示意图。
图16为本公开实施例的导热结构的另一种排布示意图。
图17为本公开实施例的导热结构的另一种排布示意图。
图18为本公开实施例的第一驱动电路的一种电路示意图。
图19为本公开实施例的显示面板的另一种示意图。
图20为本公开实施例的显示面板的另一种局部放大图。
图21为本公开实施例的一种感测组件的排布示意图。
图22为本公开实施例的另一种感测组件的排布示意图。
图23为本公开实施例的温度转换电路的示意图。
图24为本公开实施例的显示面板的另一种示意图。
具体实施方式
为使本领域技术人员更好地理解本公开的技术方案，下面结合附图和具体实施方式对本公开作进一步详细描述。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”、“一”或者“该”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
图1是一种示例性的显示面板0，其可应用在玻璃窗内。具体参照图1，显示面板0包括显示区DR和透明区TR，显示区DR至少包括一个子像素d，每个子像素d在衬底基板1上分别沿第一方向X和第二方向Y呈阵列排布。子像素d至少包括一个透明发光器件2。在示例性的显示面板0中，由于设 置有透明区TR，且显示区DR中的发光器件2为透明发光器件2，因此显示面板0的透明度高，可被应用在玻璃窗内。
图2是图1所示的子像素d的一种截面示意图，如图2所示。示例性的子像素d中的透明发光器件2以顶发射型有机电致发光二极管OLED为例进行说明。具体参照图2，透明发光器件2至少包括背离衬底基板1方向依次设置的第一电极201、发光层202以及第二电极203。在示例性的透明发光器件2中，第一电极201可以是反射阳极，第二电极203可以是透射阴极。在示例性的显示面板0中，反射阳极可以采用金属材料，如镁(Mg)、银(Ag)、铜(Cu)、铝(Al)、钛(Ti)和钼(Mo)中的任意一种或更多种，或上述金属的合金材料，如铝钕合金(AlNd)或钼铌合金(MoNb)，可以是单层结构，或者多层复合结构，如Ti/Al/Ti等，或者，是金属和透明导电材料形成的堆栈结构，如ITO/Ag/ITO、Mo/AlNd/ITO等反射型材料。透射阴极可以采用镁(Mg)、银(Ag)、铝(Al)中的任意一种或更多种，或采用上述金属中任意一种或多种制成的合金，或者采用透明导电材料，例如，氧化铟锡(ITO)，或者，金属与透明导电材料的多层复合结构。该发光层202可包括小分子有机材料或聚合物分子有机材料，也可以为荧光发光材料或磷光发光材料，发光层202可以发红光、绿光、蓝光，或可以发白光等；并且，根据实际不同需要，在不同的示例中，发光层202还可以进一步包括电子注入层、电子传输层、空穴注入层、空穴传输层等功能层。
继续参照图2，子像素d还可以包括像素驱动电路28。在示例性的显示面板0中，由于示例性显示面板0为透明显示面板0，因此为保障透明显示面板0的透明度，阳极在衬底基板1上的正投影覆盖像素驱动电路28在衬底基板1上的正投影，像素驱动电路28和阳极之间通过层间过孔电连接。在一些示例性的透明显示面板0中，像素驱动电路28还可以设置在子像素d外的不透明区TR域内，通过走线与子像素d中的透明发光器件2电连接。该像素驱动电路28可设置在衬底基板1上的缓冲层5上。继续参照图2，示例性的子像素d还包括像素定义部3、设置在衬底基板1和阳极之间的层间绝缘层29以及封装层4，其中，封装层4包括第一子封装层401、第二子 封装层402以及第三子封装层403。像素定义部3与一个透明发光器件2相对应，限定出一个透明发光器件2的发光区域。同时为保证透明显示面板0的透明度，层间绝缘层29和封装层4可以是高透明度的绝缘材料。
图3为图2所示的子像素d中的像素驱动电路28的电路图，该像素驱动电路28可以包括7T1C(即七个晶体管和一个电容)结构，例如包括驱动晶体管T3、数据写入晶体管T4、存储电容Cst、阈值补偿晶体管T2、第一复位晶体管T1、第二复位晶体管T7、第一发光控制晶体管T5以及第二发光控制晶体管T6。参照图3，数据写入晶体管T4源极的与驱动晶体管T3的源极电连接，数据写入晶体管T4的漏极被配置为与数据线Vd电连接以接收数据信号，数据写入晶体管T4的栅极被配置为与第一扫描信号线Ga1电连接以接收扫描信号；存储电容Cst的第一极板与第一电源电压端VDD电连接，存储电容Cst的第二极板与驱动晶体管T3的栅极电连接；阈值补偿晶体管T2的源极与驱动晶体管T3的漏极电连接，阈值补偿晶体管T2的漏极与驱动晶体管T3的栅极电连接，阈值补偿晶体管T2的栅极被配置为与第二扫描信号线Ga2电连接以接收补偿控制信号；第一复位晶体管T1的源极被配置为与第一复位电源端Vinit1电连接以接收第一复位信号，第一复位晶体管T1的漏极与驱动晶体管T3的栅极电连接，第一复位晶体管T1的栅极被配置为与第一复位控制信号线Rst1电连接以接收第一子复位控制信号；第二复位晶体管T7的源极被配置为与第一复位电源端Vinit1电连接以接收第一复位信号，第二复位晶体管T7的漏极与发光器件2的第一电极201电连接，第二复位晶体管T7的栅极被配置为与第二复位控制信号线Rst2电连接以接收第二子复位控制信号；第一发光控制晶体管T5的源极与第一电源电压端VDD电连接，第一发光控制晶体管T5的漏极与驱动晶体管T3的源极电连接，第一发光控制晶体管T5的栅极被配置为与第一发光控制信号线EM1电连接以接收第一发光控制信号；第二发光控制晶体管T6的源极与驱动晶体管T3的漏极电连接，第二发光控制晶体管T6的漏极与发光器件2的第一电极201电连接，第二发光控制晶体管T6的栅极被配置为与第二发光控制信号线EM2电连接以接收第二发光控制信号；发光器件2的第二电 极203与第二电源电压端VSS电连接。
当示例性的透明显示面板0被应用在车载玻璃内时，由于车辆在运行过程中，窗内温度较高，容易影响透明显示面板0内的电子元器件工作，尤其是透明显示面板0内的透明发光器件2受到光照影响温度更易变高，导致透明显示面板0的显示效果差。同时，若窗内的温度过高，将对透明显示面板0造成永久性损坏。
针对上述问题，本公开提供了一种显示面板0以及显示装置。
第一方面，如图4所示，本公开提供了一种显示面板0，其可应用于玻璃窗中。显示面板0包括：衬底基板1、设置在衬底基板1上的多个子像素d。子像素d至少包括发光器件2，发光器件2包括沿背离衬底基板1方向依次设置的第一电极201、发光层202、第二电极203。其中，显示面板0还包括导热结构7，导热结构7设置在第一电极201背离发光层202的一侧，且导热结构7和第一电极201在衬底基板1上的正投影至少部分重叠。
在本公开实施例中，如图4所示，该显示面板0包括多个设置在衬底基板1上呈阵列排布的子像素d，每个子像素d中至少包括一个发光器件2。显示面板0还包括导热结构7，用于将发光器件2的热量传导至显示面板0之外。具体的，如图4所示，导热结构7设置在发光器件2的第一电极201背离发光层202一侧，且导热结构7与第一电极201在衬底基板1上的正投影至少部分重叠。通过该种方式，导热结构7直接将发光器件2的热量传导至显示面板0之外，避免了显示面板0温度较高时，影响发光器件2的工作或对发光器件2造成损坏。在一些实施例中，导热结构7和发光器件2的阳极背离发光层202相贴附，通过该种方式，发光器件2直接将热量传递给导热结构7，且由于通过贴附的方式相连，发光器件2和导热结构7之间的接触面积大，发光器件2的热量被更有效的传递给导热结构7。在该种实施例中，为最大化导热结构7的导热效率，导热结构7在衬底基板1上的正投影覆盖发光器件2的第一电极201在衬底基板1上的正投影。需要说明的是，发光器件2可以是有机电致发光二极管OLED，此时发光器件2可以是顶发射型OLED或底发射型OLED，本公开实施例仅以发光器件2为顶发射型 OLED为例进行说明。在该种情况下，第一电极201可以是阳极，第二电极203可以是阴极。
在一些实施例中，显示面板0还包括背离导热结构7方向设置的散热结构6。在本公开实施例中，导热结构7被配置在第一控制信号的控制下，将发光器件2散发的热量通过散热结构6导出。具体参照图5，图5是本公开实施例中的一种导热结构7的示意图。如图5所述，导热结构7包括第一导热片12、第二导热片13以及设置在第一导热片12和第二导热片13之间的半导体层。其中，半导体层中的两个不同的导电电极16分别与第一控制信号线10和第二控制信号线11相连，且第一导热片12以及第二导热片13分别和第一控制信号线10以及第二控制信号线11绝缘设置。在本公开实施例中，半导体层与第一控制信号线10和第二控制信号线11同层设置。半导体层还包括多个第一半导体14和第二半导体15，第一半导体14和第二半导体15之间交替设置，一个第一半导体14和一个第二半导体15通过一个导电电极16串接。第一半导体14和第二半导体15均与第一导热片12和第二导热片13直接接触。在本公开实施例中，当第一控制信号线10和第二控制信号线11之间信号为第一控制信号时，半导体层将第一导热片12一侧的热量传输至第二导热片13一侧，以使得第一导热片12的温度小于第二导热片13。在本公开实施例中，导热结构7中的第一导热片12朝向发光器件2的阳极，导热结构7中的第二导热片13朝向散热结构6且与散热结构6相连。因此导热结构7在可以在第一控制信号的控制下，将发光器件2的热量从导热结构7中的第一导热片12一侧传递至导热结构7种的第二导热片13一侧，并经由与第二导热片13相连的散热结构6传输至显示面板0外。通过该种方式，实现对显示面板0中发光器件2的散热。
需要说明的是，在一些实施例中，散热结构6可以是铜合金材料，其一侧与导热结构7的热端相连，另一侧与显示面板0外的高热导率材料相连。在本公开实施例中，散热结构6的材料可以是其它高热导率的导热材料，显示面板0外的高热导率材料可以是显示面板0外的金属结构，本公开实施例对此不作限定。同样的，在一些实施例中，第一半导体14和第二半导体15 的材料可以是以碲化铋为基体的三元固溶体合金，例如第一半导体14可以是Bi2Te3-Bi2Se3，第二半导体15的材料可以是Bi2Te3-Sb2Te3。需要说明的是，本公开实施例仅以第一半导体14的材料和第二半导体15的材料为上述材料为例进行说明。
在一些实施例中，图6是本公开实施例的另一种显示面板0，如图6所示，该种显示面板0可以是透明显示面板0。其中，透明显示面板0包括显示区DR和透明区TR，显示区DR至少包括一个子像素d，透明区TR为非发光区域。子像素d至少包括一个发光器件2，发光器件2可以是如图1-3中所示的发光器件2。发光器件2包括背离衬底基板1方向的阳极、发光层202以及阴极。在本公开实施例中，一个发光器件2可以显示红色R、绿色G、蓝色B，或白色W中的任意一种颜色。在图6所示的透明显示面板0中，为保证透明显示面板0的透明度，透明区TR的面积大于等于显示区DR的面积。在一些实施例中，导热结构7和透明区TR在衬底基板1上的正投影无重叠，通过该种方式进一步的提高透明显示面板0的透明度。需要说明的是，图6所示的显示面板0仅为本公开实施例的一种示例性的透明显示面板0，具有其它结构的透明显示面板0也在本公开的保护范围内。
在本公开实施例中，继续参照图6，由于导热结构7设置在发光器件2的阳极背离发光层202一侧，且导热结构7与发光器件2的阳极在衬底基板1上的正投影至少部分重叠，同时在透明显示面板0中，显示区DR内的发光器件2的阳极可以是不透光结构。因此通过该种方式，将导热结构7设置在显示区DR内的不透光结构和衬底基板1之间，不会占用透明显示面板0中的透明区TR的面积。通过该种方式，既不会影响透明显示面板0的透光率，也不会遮挡显示区DR内的子像素d发光，影响子像素d的开口率。实现了在不影响透明显示面板0显示效果的前提下，对透明显示面板0进行降温。
在一些实施例中，图7为本公开实施例中图6所示的显示面板0的一种局部放大示意图。如图7所示，导热结构7和发光器件2一一对应设置。导热结构7中的第一导热片12和散热结构6相连，导热结构7中的第二导热 片13和发光器件2的阳极直接相连。在本公开实施例中，由于导热结构7中的第一导热片12直接与散热结构6相连，导热结构7中的第二导热片13直接和发光器件2的阳极直接相连，因此导热结构7分别和发光器件2以及散热结构6直接接触，散热效果较优。其中，具体参照图8，图8为图7所示的显示面板0的一种局部截面图。如图8所示，在本公开实施例中，导热结构7中的第二散热片13和散热结构6直接相贴附，导热结构7中的第一散热片12和发光器件2的阳极直接相贴附，通过该种方式，发光器件2直接将热量传递给导热结构7，且由于通过贴附的方式相连，发光器件2和导热结构7之间的接触面积大，发光器件2的热量被更有效的传递给导热结构7。在该种实施例中，为进一步提高导热结构7的导热效率，导热结构7在衬底基板1上的正投影覆盖发光器件2的阳极在衬底基板1上的正投影，散热结构6在衬底基板1上的正投影覆盖导热结构7在衬底基板1上的正投影。通过该种方式，最大化接触面积，以使得导热结构7的导热效率被进一步提高。
在一些实施例中，如图9所示，图9为图7所示的显示面板0的另一种局部截面图。导热结构7中的第二导热片13和散热结构6相连，导热结构7中的第一导热片12和发光器件2的阳极直接之间设置有绝缘导热层8。在本公开实施例中，由于导热结构7中的第二导热片13直接与散热结构6相连，导热结构7中的第一导热片12和发光器件2的阳极之间通过一绝缘导热层8相连，因此导热结构7与发光器件2仅通过一绝缘导热层8进行热量传输，散热效果较优。在本公开实施例中，如图9所示，导热结构7中的第二导热片13和散热结构6直接相贴附，导热结构7中的第一导热片12和绝缘导热层8的一侧相贴附，绝缘导热层8的另一侧与发光器件2的阳极直接相贴附。由于通过贴附的方式相连，发光器件2和导热结构7之间的接触面积大，发光器件2的热量被更有效的传递给导热结构7。在该种实施例中，为最大化导热结构7的导热效率，导热结构7在衬底基板1上的正投影覆盖发光器件2的阳极的正投影，散热结构6在衬底基板1上的正投影覆盖导热结构7在衬底基板1上的正投影。通过该种方式，最大化接触面积，以使得 导热结构7的导热效率被进一步提高。
同时绝缘导热层8可以将发光器件2的阳极和导热结构7中的第一导热片12电绝缘，避免了导热结构7影响发光器件2的阳极的电信号。在本公开实施例中，由于避免了导热结构7影响发光器件2的阳极的电信号，因此可以设置一个导热结构7与多个发光器件2相对应，即一个导热结构7为多个发光器件2进行散热。如图10所示，在一些实施例中，显示面板0被划分为多个像素单元D，每个像素单元D包括多个子像素d，每个像素单元D中所对应的各所述导热结构7中的至少部分为一体结构。
继续参照图10，显示面板0包括衬底基板1以及设置在显示基板上的多个像素单元D，每个像素单元D包括至少一个子像素d，每个子像素d至少包括发光器件2。具体参照图11，图11是图10所示的显示面板0的一种局部放大图，如图11所示，以一个像素单元D包括四个子像素d，且各个子像素d分别显示红色R、绿色G、蓝色B以及白色W为例进行说明。每个像素单元D中的子像素d分布在显示面板0的显示区DR内，各个子像素d在像素单元D内分别沿第一方向X和第二方向Y呈阵列排布。需要说明的是，像素单元D中的子像素d包括其它颜色的子像素d以及像素单元D内的各个子像素d以其它的排布方式进行排布都在本公开的保护范围内。
继续参照图11，由于本公开实施例中一个像素单元D包括四个子像素d，因此一个像素单元D对应四个导热结构7。其中，如图11所示，上述四个导热结构7分别两两结合成一体结构的第一导热结构9，即一个像素单元D实质上只对应两个第一导热结构9。在本公开实施例中，第一导热结构9中的第二导热片13和与其对应的散热结构6相连，第一导热结构9中的第一导热片12和发光器件2的阳极直接之间设置有绝缘导热层8。在本公开实施例中，由于第一导热结构9中的第二导热片13直接与散热结构6相连，第一导热结构9中的第一导热片和发光器件2的阳极之间通过一层绝缘导热层8相连，因此导热结构7与发光器件2仅通过一层绝缘导热层8进行热量传输，散热效果较优。同时，由于设置有绝缘导热层8，同一个第一导热结构9所对应的不同发光器件2的阳极不会通过第一导热结构9相互电连接， 影响显示面板0的显示。
在一些实施例中，第一导热结构9中的第二导热片13和与其对应的导热结构7直接相贴附，第一导热结构9中的第一导热片12和绝缘导热层8的一侧相贴附，绝缘导热层8的另一侧与发光器件2的阳极直接相贴附，通过该种方式，发光器件2通过绝缘导热层8直接将热量传递给第一导热结构9，且由于通过贴附的方式相连，发光器件2和第一导热结构9之间的接触面积大，发光器件2的热量被更有效的传递给第一导热结构9。同时需要说明的是，由于本公开实施例中一个像素单元D包括四个子像素d，因此本公开实施例仅以一个像素单元D对应四个导热结构7，上述四个导热结构7两两结合成第一导热结构9为例进行说明，在一些实施例中，上述四个导热结构7中三个导热结构7结合成一体结构的第一导热结构9；上述四个导热结构7中四个导热结构7结合成一体结构的第一导热结构9，也都在本公开的保护范围内。
在一些实施例中，在如图4-11所示的显示面板0中，导热结构7和散热结构6均设置在衬底基板1靠近发光器件2的阳极的一侧。在本公开实施例中，可以在制备显示面板0时，将导热结构7和散热结构6设置在显示面板0的膜层结构中，通过该种方式，使得具有导热结构7的显示面板0的集成度更高，便于显示面板0的轻薄化设计。同时可以使得导热结构7和发光器件2的阳极之间的位置关系更容易设置，即在制备时更容易使得导热结构7和发光器件2的阳极在衬底基板1上的正投影至少部分重叠，以提高透明显示面板0的良品率。
同样的，在一些实施例中，如图12所示，导热结构7还可以设置在背离衬底基板1的一侧。此时，如图12所示，导热结构7中的第一导热片12与衬底基板1相连，导热结构7中的第二导热片13与散热结构6相连。通过该种方式，易于导热结构7的安装。
同时，在本公开实施例中，导热结构7中的第一导热片12还可以与衬底基板1直接相贴附，导热结构7中的第二导热片13可以与散热结构6直接相贴附。通过该种方式，由于通过贴附的方式相连，透明显示面板0和导 热结构7之间的接触面积大，发光器件2的热量被更有效的传递给导热结构7。
在本公开实施例中，可以在具有发光器件2的显示基板制备完成后，通过贴附的方式，将包括导热结构7的薄膜贴附在背离衬底基板1一侧，且使导热结构7与发光器件2的阳极在衬底基板1上的正投影至少部分重叠。通过该种方式，不需要对显示面板0的制备工艺进行调整，即可实现在不影响显示面板0透光率的前提下，降低显示面板0的温度。
在一些实施例中，透明显示面板0还可以是导热结构7设置在衬底基板1靠近发光器件2的阳极的一侧，散热结构6设置在衬底基板1背离发光器件2的阳极的一侧。在本公开实施例中，导热结构7中的第一导热片12与发光器件2的阳极相连，导热结构7中的第二导热片13与散热结构6相连。
在一些实施例中，显示面板0还包括多条第一显示信号线，第一控制信号线10和第二控制信号线11分别与第一显示信号线在衬底基板1上的正投影重叠，且第一控制信号线10和第二控制信号线11在衬底基板1上的正投影无重叠。在本公开实施例中，当显示面板0为如图4-12所示的透明显示面板0时，可以将用于控制导热结构7工作第一控制信号线10和第二控制信号线11设计为分别和显示基板上的第一显示信号线在衬底基板1上正投影重叠，以避免增设第一控制信号线10和第二控制信号线11影响透明显示面板0的透光率和像素开口率。具体的，由于在透明显示面板0中，透明显示面板0上现有的第一控制信号线10可以是不透光结构，因此通过该种方式，将第一控制信号线10和第二控制信号线11设置在显示面板0的不透光结构和衬底基板1之间，不会大量占用透明显示面板0中的透光区域的面积，既不会影响透明显示面板0的透光率，也不会遮挡显示区DR内的子像素d发光，影响像素开口率。需要说明的是，第一显示信号线可以是显示面板0上任一种用于驱动子像素d显示画面的信号线，例如：栅信号线、数据信号线或电源信号线，本公开实施例对此不作限定。
在一些实施例中，如图13所示，图13是导热结构7在显示面板0中的一种示例性的排布方式。在本公开实施例中，导热结构7在衬底基板1靠近 第一电极201的一侧呈阵列排布，连接同一导热结构7的第一控制信号线10和第二控制信号线11位于导热结构7的两相对侧。通过该种方式，使得显示面板0上的信号线布线较为均一，同时避免第一控制信号线10和第二控制信号线11对显示面板0上的信号线产生干扰。
在一些实施例中，如图14所示，图14是导热结构7在显示面板0中的另一种示例性的排布方式。其中，包括多个沿列方向依次排布的导热结构7。位于同列的导热结构7连接同一条第一控制信号线10和同一条第二控制信号线11。如图15-17所示，各列导热结构7划分为多个导热结构组24，不同组中的导热结构7各不相同。一个导热结构组24内的各个导热结构7所连接的第一控制信号线10短接，一个导热结构组24内的各个导热结构7所连接的第二控制信号线11短接。
具体的，参照图15。在本公开实施例中，将导热结构7按照其列方向划分为多个导热结构组24，且不同组中的导热结构7各不相同。同一个导热结构组24内的各个导热结构7连接同一条第一控制信号线10和同一条第二控制信号线11。通过该种方式，将导热结构7分组驱动，一方面，相比于每个导热结构7各分别连接一条第一控制信号线10和第二控制信号线11，本公开实施例所需要的设置的第一控制信号线10和第二控制信号线11的数量大大减小，同时，驱动第一控制信号线10和第二控制信号线11的驱动电路被大大简化。另一方面，可以对不同的导热结构组24给予不同的驱动电压，以使得显示面板0的散热效果更优。
在一些实施例中，参照图16，图16是本公开实施例中另一种分组方式。其中，各列导热结构7划分为三个导热结构组24，不同组中的导热结构7各不相同，每三列导热结构7依次位于三个不同的导热结构组24内。具体的，在本公开实施例中，各列导热结构7被划分为第一导热结构组25、第二导热结构组26以及第三导热结构组27。其中，显示面板0包括N列导热结构7，且各列导热结构7沿行方向依次排布。由于每三列导热结构7依次位于三个不同的导热结构组24内，即第一导热结构组25包括第1，4，7…N-2列的导热结构7；第二导热结构组26包括第2，5，8…N-1列的导热结 构7；第三导热结构组27包括第3，6，9…N列的导热结构7。因此显示面板0中的导热结构7仅需三个第一控制信号，即可实现对显示面板0上的全部导热结构7进行驱动。同时，具有该种分组驱动方式的导热结构7的散热效果较优。
在一些实施例中，如图17所示，图17是本公开实施例的另一种分组方式。导热结构7划分为呈阵列排布的多个导热结构组24。一个导热结构组24内的各个导热结构7所连接的第一控制信号线10短接，一个导热结构组24内的各个导热结构7所连接的第二控制信号线11短接。在本公开实施例中，具体参照图17所示。通过该种方式，一方面，相比于每个导热结构7各分别连接一条第一控制信号线10和第二控制信号线11，本公开实施例所需要的设置的第一控制信号线10和第二控制信号线11的数量大大减小，同时，驱动第一控制信号线10和第二控制信号线11的驱动电路被大大简化。另一方面，可以对不同的区域内的导热结构组24给予不同的驱动电压，以使得显示面板0的散热效果更优。
在一些实施例中，显示面板0还包括第一驱动电路17。第一驱动电路17被配置为根据显示面板0的温度向导热结构7提供第一控制信号。在一些实施例中，第一驱动电路17可以是开关电源电路或其它直流驱动电路，本公开实施例以第一驱动电路17为开关电源电路为例进行说明。具体的，如图18所示，图18是一种示例性的开关电源电路，其包括：第一电源控制端K1、第二电源控制端K2、信号输出端Vout、驱动子电路以及驱动子电路的外围电路。在本公开实施例中，驱动子电路可以是开关电源芯片LM5145，当第一驱动电路17工作时，第一电源控制端K1和第二电源控制端K2被写入电源控制信号，开关电源芯片LM5145根据第一电源控制端K1和第二电源控制端K2被写入的电源控制信号，向信号输出端Vout输出相应的第一控制信号。在本公开实施例中，第一电源控制端K1和第二电源控制端K2可以与第一控制器18相连，以使得第一驱动电路17可以根据第一控制器18输出的电源控制信号的变化，输出可调的第一控制信号。以使得导热结构7可以被写入可调的第一控制信号，即导热结构7的导热能力可根据第一控制 信号的变化而变化。通过该种方式，使得导热结构7可以根据实际需要调节其导热能力。
需要说明的是，在本公开实施例中，仅以驱动子电路为开关电源芯片LM5145为例进行说明，使用其它芯片的驱动子电路也在本公开的保护范围内。同样的，图18所示的第一驱动电路17还可以包括多个电源控制端和信号输出端Vout，本公开仅以第一驱动电路17包括第一电源控制端K1、第二电源控制端K2以及一个信号输出端Vout为例进行说明，第一驱动电路17还可以包括多个电源控制端和多个信号输出端Vout，也在本申请的保护范围内。
在一些实施例中，如图19和图20所示，显示面板0还包括温度感测组件20和第一控制器18。温度感测组件20设置在第一电极201背离发光层202的一侧，且温度感测组件20和第一电极201在衬底基板1上的正投影至少部分重叠。温度感测组件20被配置为根据显示面板0的温度，生成第一感测信号。第一控制器18被配置为根据第一感测信号控制导热结构7工作。
在本公开实施例中，由于温度感测组件20设置在发光器件2的阳极背离发光层202的一侧，且温度感测组件20和发光器件2的阳极在衬底基板1上的正投影至少部分重叠。因此当显示面板0为透明显示面板0时，由于在透明显示面板0中，发光器件2的阳极可以是不透光结构，因此通过该种方式，将散热组件设置在显示面板0的不透光结构和衬底基板1之间，不会大量占用透明显示面板0中的透光区域的面积，既不会影响透明显示面板0的透光率，也不会遮挡显示区DR内的子像素d发光，影响子像素d的开口率。实现了在不影响透明显示面板0显示效果的前提下，通过设置温度感测组件20和第一控制器18，控制导热结构7对显示面板0进行降温。
具体的，温度感测组件20可以根据显示面板0的温度，生成第一感测信号。第一控制器18可以通过模数转换子电路接收第一感测信号，并对第一感测信号进行处理。在一些实施例中，当第一控制器18根据第一感测信号判断显示面板0上的温度超过预设值时，即判断显示面板0温度过高时， 第一控制器18输出第一控制信号，控制显示面板0上的散热组件对显示面板0上的发光器件2进行散热，以实现对显示面板0进行降温，避免温度过高影响其工作或导致其损坏。
在一些实施例中，显示面板0上的温度感测组件20的数量可以为一个或多个。具体参照图21，当温度感测组件20的数量为一个时，由于显示面板0的中心区域的温度最高，因此将温度感测组件20设置在显示面板0的中心区域，可以更加准确的判断显示面板0中的发光器件2是否需要散热，使得对显示面板0的温度感测更加准确。当温度感测组件20的数量为多个时，如图22所示，可以将温度感测组件20均匀布置在显示面板0上。通过该种方式，可以根据显示面板0不同区域的温度，生成多个第一感测信号。在该种实施例中，第一控制器18可以通过预设的温度控制算法处理多个第一感测信号，以使得对显示面板0的温度感测更加精准。
在一些实施例中，显示面板0还包括：温度转换电路23。温度转换电路23被配置为将所述第一感测信号转换为电信号并传输给所述第一控制器18。在本公开实施例中，通过该种方式，可以通过仅设置结构较为简单的温度感测组件20，来实现对显示面板0上的温度进行感测。以使得显示面板0结构简单易于实现，且便于轻薄化设计。
具体的如图23所示，图23是一种示例性的温度转换电路23。在一些实施例中，温度感测组件20至少包括热敏电阻或热电偶中的至少一种。图21-23所示的温度转换电路23仅以温度感测组件20为热敏组件为例进行说明。具体参照图21-23，热敏电阻设置在显示面板0上，且一条第一感测信号线21的一端和一条第二感测信号线22的一端分别与其相连，一条第一感测信号线21的另一端和一条第二感测信号线22的另一端分别与温度转换电路23相连。通过该种方式，可以将温度转换电路23和热敏电阻分别布置在显示面板0内和显示面板0外，当显示面板0为透明显示面板0时，有助于提高显示面板0的透明度。在本公开实施例中，继续参照图17，温度转换电路23还包括第一运算子电路231、第二运算子电路232以及多个电阻。其中，热敏电阻的电阻随温度变化而变化，因此热敏电阻上的电信号随着电 阻的变化而变化，第一运算子电路231和第二运算子电路232将热敏电阻上的电信号进行计算放大，并通过温度转换电路23的输出端输出至第一控制器18。需要说明的是，本公开实施例中的第一运算子电路和第二运算子电路可以是运算放大器。同时本公开实施例仅以图23所示的温度转换电路23为例进行说明，其它通过热敏电阻进行温度/电压转换的电路皆在本申请的保护范围内。
在一些实施例中，显示面板0还包括多条第二显示信号线，第一感测信号线21和第二感测信号线22分别与第二显示信号线在衬底基板1上的正投影重叠，且第一感测信号线21和第二感测信号线22在衬底基板1上的正投影无重叠。在本公开实施例中，当显示面板0为透明显示面板0时，可以将用于热敏电阻所连的第一感测信号线21和第二感测信号线22设计为分别和显示面板0上的第二显示信号线在衬底基板1上正投影重叠，以避免增设第一感测信号线21和第二感测信号线22影响透明显示面板0的透光率和像素开口率。具体的，由于在透明显示面板0中，透明显示面板0上现有的第一控制信号线10可以是不透光结构，因此通过该种方式，将第一感测信号线21和第二感测信号线22设置在显示面板0的不透光结构和衬底基板1之间，不会大量占用透明显示面板0中的透光区域的面积，既不会影响透明显示面板0的透光率，也不会遮挡显示区DR内的子像素d发光。需要说明的是，在一些实施例中，上述第一显示信号线和第二显示信号线可以是同一显示信号线或同一种显示信号线，本公开实施例对此不做限定。
在一些实施例中，第一控制器18可以设置在显示面板0外部。尤其是当显示面板0应用于玻璃窗上时，可以将第一控制器18设置在显示面板0外的SOC(单片系统，System on a Chip)板上。通过该种方式可以进一步提高透明显示面板0的透明区TR域的面积。同时当显示面板0应用于玻璃窗时，第一控制器18还可以根据显示面板0的温度，控制显示面板0外部制冷系统，对其进行降温。其中，外部制冷系统可以是空调系统或其它降温系统。
在一些实施例中，显示面板0还可以包括：第二控制器19。如图24所 示，第二控制器19被配置为根据第一感测信号，控制显示面板0中的子像素d发光。在本公开实施例中，第二控制器19根据待显示的画面，控制各个像素发光。由于温度感测组件20根据显示面板0的温度生成的第一感测信号可以被转换成显示面板0的温度信息，因此当显示面板0温度过高时，第二控制器19可以根据第一感测信号，降低显示面板0中的子像素d的功率，以降低子像素d所产生的热量；或者，还可以控制子像素d使其显示提示画面，提醒相关人员为显示面板0降温。需要说明的是，在一些实施例中，第一控制器18和第二控制器19可以集成在同一个SOC上。
第二方面，本公开还提供了一种显示装置，该显示装置包括前面实施例所提供的显示面板0。
本公开实施例所提供的显示装置可以为：显示面板0、柔性可穿戴设备、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。对于该显示装置的其它必不可少的组成部分均为本领域的普通技术人员应该理解具有的，在此不做赘述，也不应作为对本发明的限制。
可以理解的是，以上实施方式仅仅是为了说明本公开的原理而采用的示例性实施方式，然而本公开并不局限于此。对于本领域内的普通技术人员而言，在不脱离本公开的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本公开的保护范围。

Claims (25)

  1. 一种显示面板，其至少包括显示区；所述显示面板包括衬底基板，设置在所述衬底基板上的多个子像素，所述子像素至少包括发光器件，所述发光器件位于所述显示区；所述发光器件包括沿背离衬底基板方向依次设置的第一电极、发光层、第二电极；其中，所述显示面板还包括导热结构，所述导热结构设置在所述第一电极背离所述发光层的一侧，且所述导热结构和所述第一电极在所述衬底基板上的正投影至少部分重叠。
  2. 根据权利要求1所述的显示面板，其中，所述导热结构和所述发光器件一一对应设置。
  3. 根据权利要求1或2所述的显示面板，其中，还包括设置在所述导热结构背离所述第一电极一侧的散热结构。
  4. 根据权利要求3所述的显示面板，其中，所述导热结构包括背离所述发光层方向依次设置的第一导热片、半导体层以及第二导热片；所述第一导热片与所述发光器件的第一电极相连，所述第二导热片与所述散热结构相连。
  5. 根据权利要求3所述的显示面板，其中，所述导热结构包括背离所述发光层方向依次设置的第一导热片、半导体层以及第二导热片；所述第一导热片与所述发光器件的第一电极之间设置有绝缘导热层，所述第二导热片与所述散热结构相连。
  6. 根据权利要求5所述的显示面板，其中，所述显示面板划分为多个像素单元，每个所述像素单元包括多个所述子像素；每个所述像素单元中所对应的各所述导热结构中的至少部分为一体结构。
  7. 根据权利要求4-6中任一项所述的显示面板，其中，所述导热结构和所述散热结构均设置在所述衬底基板靠近所述第一电极的一侧。
  8. 根据权利要求4-6中任一项所述的显示面板，其中，所述导热结构设置在所述衬底基板靠近所述第一电极的一侧；所述散热结构设置在所述衬底基板背离所述第一电极的一侧。
  9. 根据权利要求3-8中任一项所述的显示面板，其中，所述散热结构的材料包括铜合金。
  10. 根据权利要求1所示的显示面板，其中，所述导热结构设置在背离所述衬底基板的一侧。
  11. 根据权利要求1所述的显示面板，其中，还包括多条第一控制信号线和多条第二控制信号线；一个所述导热结构电连接一条所述第一控制信号线和一条所述第二控制信号线。
  12. 根据权利要求11所述的显示面板，其中，所述显示面板还包括多条第一显示信号线，所述第一控制信号线和所述第二控制信号线分别与所述第一显示信号线在所述衬底基板上的正投影重叠，且所述第一控制信号线和所述第二控制信号线在所述衬底基板上的正投影无重叠。
  13. 根据权利要求11所述显示面板，其中，所述导热结构包括背离所述发光层方向依次设置的第一导热片、半导体层以及第二导热片；所述第一控制信号线和所述第二控制信号线分别与所述半导体层电连接，且与所述半导体层同层设置。
  14. 根据权利要求11所述的显示面板，其中，所述导热结构在所述衬底基板靠近所述第一电极的一侧呈阵列排布，连接同一所述导热结构的所述第一控制信号线和所述第二控制信号线位于所述导热结构的两相对侧。
  15. 根据权利要求11所述的显示面板，其中，包括多个沿列方向依次排布的导热结构；位于同列的所述导热结构连接同一条所述第一控制信号线和同一条所述第二控制信号线；各列所述导热结构划分为多个导热结构组，不同所述导热结构组中的所述导热结构各不相同；
    一个所述导热结构组内的各个所述导热结构所连接的所述第一控制信号线短接，一个所述导热结构组内的各个所述导热结构所连接的所述第二控制信号线短接。
  16. 根据权利要求15所述的显示面板，其中，各列所述导热结构划分为三个所述导热结构组，不同组中的所述导热结构各不相同；
    每三列所述导热结构依次位于三个不同的所述导热结构组内。
  17. 根据权利要求11所述的显示面板，其中，所述导热结构划分为呈阵列排布的多个导热结构组；
    一个所述导热结构组内的各个所述导热结构所连接的所述第一控制信号线短接，一个所述导热结构组内的各个所述导热结构所连接的所述第二控制信号线短接。
  18. 根据权利要求3所述的显示面板，其中，还包括：第一驱动电路；所述第一驱动电路和所述导热结构电连接；
    所述第一驱动电路，被配置为根据所述显示面板的温度，向所述导热结构提供所述第一控制信号；
    所述导热结构，被配置为在所述第一控制信号的控制下，将所述发光器件的热量导出。
  19. 根据权利要求1所述的显示面板，其中，还包括：温度感测组件和第一控制器；所述温度感测组件设置在所述第一电极背离所述发光层的一侧，且所述温度感测组件和所述第一电极在所述衬底基板上的正投影至少部分重叠；所述温度感测组件，被配置为根据所述显示面板的温度，生成第一感测信号；所述第一控制器被配置为，根据所述第一感测信号控制所述导热结构工作。
  20. 根据权利要求19所述的显示面板，其中，还包括至少一条第一感测信号线和至少一条第二感测信号线；所述第一感测信号线和所述第二感测信号线将分别与所述温度感测组件相连。
  21. 根据权利要求19所述的显示面板，其中，还包括多条第二显示信号线；所述第一感测信号线和所述第二感测信号线分别与所述第二显示信号线在所述衬底基板上的正投影重叠，且所述第一感测信号线和所述第二感测信号线在所述衬底基板上的正投影无重叠。
  22. 根据权利要求19所述的显示面板，其中，还包括：温度转换电路；所述温度转换电路被配置为将所述第一感测信号转换为电信号并传输给所 述第一控制器。
  23. 根据权利要求18-22中任一项所述的显示面板，其中，所述温度感测组件至少包括热敏电阻或热电偶中的至少一种。
  24. 根据权利要求1-23中任一项所述的显示面板，其中，所述显示面板为透明显示面板；所述显示面板还包括透明区；所述导热结构在所述衬底基板上的正投影与所述透明区无重叠。
  25. 一种显示装置，其包括如权利要求1-24中任一项所述的显示面板。
PCT/CN2023/077110 2022-03-14 2023-02-20 显示面板以及显示装置 Ceased WO2023174005A1 (zh)

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